WO2016201080A1 - Conception modulaire d'échangeur de chaleur - Google Patents

Conception modulaire d'échangeur de chaleur Download PDF

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Publication number
WO2016201080A1
WO2016201080A1 PCT/US2016/036654 US2016036654W WO2016201080A1 WO 2016201080 A1 WO2016201080 A1 WO 2016201080A1 US 2016036654 W US2016036654 W US 2016036654W WO 2016201080 A1 WO2016201080 A1 WO 2016201080A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat exchanger
cold plate
friction
plate assembly
cover
Prior art date
Application number
PCT/US2016/036654
Other languages
English (en)
Inventor
Eric Karlen
John Horowy
Mark Hamilton Severson
Mark W. Metzler
Eric A. Carter
John Huss
Debabrata Pal
Original Assignee
Hamilton Sunstrand Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hamilton Sunstrand Corporation filed Critical Hamilton Sunstrand Corporation
Priority to EP16738577.2A priority Critical patent/EP3308095A1/fr
Publication of WO2016201080A1 publication Critical patent/WO2016201080A1/fr

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/08—Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning
    • F28F3/10—Arrangements for sealing the margins
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/12—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating the heat being generated by friction; Friction welding
    • B23K20/122—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating the heat being generated by friction; Friction welding using a non-consumable tool, e.g. friction stir welding
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/025—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being corrugated, plate-like elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/025—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being corrugated, plate-like elements
    • F28F3/027—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being corrugated, plate-like elements with openings, e.g. louvered corrugated fins; Assemblies of corrugated strips
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4882—Assembly of heatsink parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2275/00—Fastening; Joining
    • F28F2275/06—Fastening; Joining by welding
    • F28F2275/062—Fastening; Joining by welding by impact pressure or friction welding

Definitions

  • the subject matter disclosed herein generally relates to heat exchangers and, more particularly, to heat exchangers and processes for forming the same.
  • Cold plate heat exchangers may be used to cool electronic components that are mounted thereto.
  • the heat exchangers and thermal flow paths may be built into a structure that allows mounting of the electronics to be cooled.
  • Current manufacturing processes for the cold plate style heat exchanger structures may involve multiple processes.
  • the operations and processes of current manufacturing techniques may include machining, brazing, etc. along with multiple additional components, including fasteners, washers, etc.
  • a cold plate assembly having a base defining a cooling channel and a heat exchanger friction- stir welded to the base, wherein the heat exchanger is located within a portion of the cooling channel, and the friction-stir welding between the heat exchanger and the base forms a fluid seal.
  • a cold plate assembly is provided as shown and described herein.
  • a method of manufacturing a cold plate assembly is provided as shown and described herein.
  • a cold plate assembly as formed as shown and described herein is provided.
  • a cold plate assembly includes a baseplate defining a cooling channel and a heat exchanger friction-stir welded to the baseplate, wherein the heat exchanger is located within a portion of the cooling channel, and the friction-stir welding between the heat exchanger and the baseplate forms a fluid seal.
  • further embodiments of the cold plate assembly may include a cover, the cover configured to attach to the baseplate.
  • further embodiments of the cold plate assembly may include that the cover forms a lid over the cooling channel where the heat exchanger is not located.
  • further embodiments of the cold plate assembly may include that the cover is friction-stir welded to a portion of the heat exchanger.
  • further embodiments of the cold plate assembly may include that the cover is friction-stir welded to the baseplate.
  • further embodiments of the cold plate assembly may include that the heat exchanger is integral with a component to be cooled by the heat exchanger.
  • further embodiments of the cold plate assembly may include that the heat exchanger comprises a plurality of fins defining a plurality of fluid channels between the plurality of fins.
  • further embodiments of the cold plate assembly may include that the cooling channel of the baseplate includes a plurality of cooling fins and the heat exchanger includes a plurality of cooling fins configured to interleave with the cooling fins of the baseplate.
  • further embodiments of the cold plate assembly may include that the baseplate includes a second cooling channel, the assembly further comprising a top cold plate friction stir welded on the baseplate over the second cooling channel.
  • a method of manufacturing a cold plate assembly includes friction stir welding a heat exchanger to a baseplate, the baseplate defining a cooling channel, the heat exchanger located within a portion of the cooling channel, and the friction-stir welding between the heat exchanger and the baseplate forms a fluid seal.
  • further embodiments of the method may include attaching a cover to the baseplate. [0019] In addition to one or more of the features described above, or as an alternative, further embodiments of the method may include that the cover forms a lid over the cooling channel where the heat exchanger is not located.
  • further embodiments of the method may include friction- stir welding the cover to a portion of the heat exchanger.
  • further embodiments of the method may include friction-stir welding the cover to the baseplate.
  • further embodiments of the method may include that the heat exchanger is integral with a component to be cooled by the heat exchanger.
  • further embodiments of the method may include that the heat exchanger comprises a plurality of fins defining a plurality of fluid channels between the plurality of fins.
  • further embodiments of the method may include that the cooling channel of the baseplate includes a plurality of cooling fins and the heat exchanger includes a plurality of cooling fins, the method comprising interleaving the cooling fins of the baseplate with the cooling fins of the heat exchanger.
  • further embodiments of the method may include that the baseplate includes a second cooling channel, the method comprising friction stir welding a top cold plate on the baseplate over the second cooling channel.
  • FIG. 1A is an isometric view of a fin core used in cold plate assemblies
  • FIG. IB is a side view schematic of a prior configuration of a cold plate assembly
  • FIG. 1C is a thermal flow progression of thermal energy through a cold plate assembly, indicating where a component may be installed;
  • FIG. 2 is an isometric view of a cold plate assembly as formed by prior techniques
  • FIG. 3 is an isometric view of a cold plate assembly as formed by a technique described herein;
  • FIG. 4 is a schematic illustration of a friction-stir welding process as used by embodiments described herein;
  • FIG. 5 is a schematic illustration of a heat exchanger and installation in a cold plate assembly in accordance with an example embodiment
  • FIG. 6 is an illustration of a heat exchanger attached to a structure in accordance with an example embodiment
  • FIG. 7 is a schematic illustration of a cold plate assembly in accordance with an embodiment of the present disclosure.
  • FIG. 8 is a schematic illustration of a cold plate assembly in accordance with another embodiment of the present disclosure.
  • FIG. 1A is an isometric view of fin core 102 of a heat exchanger 100.
  • the fin core 102 includes a plurality of fins 104 that form channels therebetween. Fluid may be passed through the channels between the fins 104 to enable thermal cooling to a component or device.
  • the heat exchanger 100 is housed within a cold plate 104.
  • Mounted on the cold plate 104 may be one or more components 106.
  • the component 106 may be an electrical component that includes inductors, diodes, capacitors, etc., and in some embodiments the component 106 may be a power distribution system.
  • the combination of the heat exchanger 100 and the cold plate 104 form a cold plate heat exchanger that may be used to cool electronics or other thermal energy generating devices.
  • thermal interface 108 Formed between the component 106 and the cold plate 104 may be a thermal interface 108.
  • the thermal interface 108 is a joined surface between the component 106 and the cold plate 104 and enables the heat exchanger 100 to provide thermal cooling to the component 106.
  • working or operating fluid may pass through the heat exchanger 100 (and through the fin core 102 thereof) and heat or thermal energy may be passed from the component 106, through the thermal interface 108, and into the operating fluid that is passing through the channels formed by the fins 104 of the fin core 102.
  • the heat exchanger 100 and cold plate 104 may be part of a cold plate assembly.
  • FIG. 1C shows a thermal gradient or flow path of a cooling fluid or operating fluid that may be used to work with the fin core 100 to cool a component, such as component 106, as the fluid flows through a cold plate assembly 110.
  • a component such as component 106
  • the component 106 may be mounted on the cold plate assembly 110 along a flow path 112.
  • An operating fluid may enter the flow path 112 at an inlet 114, flow counter-clockwise in FIG. 1C, and exit the flow path 112 at outlet 116.
  • the component 106 is located along the flow path 112 and thus may be cooled by the operating fluid passing below the component 106.
  • the heat exchanger 100 shown in FIGS.
  • the heat exchanger 100 may be part of the flow path 112, and an operating fluid may pass through the heat exchanger 100 to enable cooling of the component 106.
  • the flow path 112 may be one or more cooling channels that are formed in or on the cold plate assembly 110.
  • the heat exchanger 100 is placed into and brazed as part of the flow path 112 and within a cooling channel in a cold plate assembly.
  • the heat exchanger 100 may be vacuum brazed with an integrated lanced offset fin section that is then placed into the cooling channels of the cold plate assembly 110. After placement, the heat exchanger 100 may be brazed in place.
  • the heat exchanger 100 in some configurations, may further be bolted into place and be surrounded by an O-ring or other type of seal that is configured to provide a fluid seal to keep the operating fluid within the fin core 100. That is, additional hardware may be required to provide a proper connection and fluid seal between the heat exchanger and the cold plate assembly.
  • Cold plate assembly 210 is formed from a base 218 and a cover or lid 220.
  • the base 218 and the cover 220 may be machined into a proper configuration with a flow path or fluid channel formed between the base 218 and the cover 220.
  • Also housed between the base 218 and the cover 220 at portion 222 may be a heat exchanger such as described above.
  • the heat exchanger, housed at portion 222 may be provided with an operating fluid that passes through the cold plate assembly 210 along a flow path beneath the cover 220.
  • the flow path may provide the operating fluid at an inlet side of the portion 222 at an inlet 224 and may exit the portion 222 at an outlet 226.
  • FIG. 2 shows a prior configuration wherein machining is used to form both the base 218 and the cover 220 together, with the flow path or fluid channel formed in a surface of the base 218 between the base 218 and the cover 220.
  • the cover 220 is formed with substantially the same shape as the base 218, as shown in FIG. 2.
  • a structure of a cold plate assembly 310 is shown in accordance with an embodiment of the present disclosure.
  • a base 318 of the cold plate assembly 310 has a similar structure and configuration as the base 218 of FIG. 2.
  • the cover 320 may not be machined at the same time as the base 218 or formed in the same shape or geometry thereof.
  • the cover 320 of embodiments disclosed herein may be modular and prefabricated, and in some embodiments may be formed from one or more parts or sections.
  • the cover 320 may sit or rest on a shoulder of the base 318 such that when the cover 320 is attached to the base 318, a fluid channel is formed and sealed between the base 318 and the cover 320.
  • the portion 322 of the cover 320 is separate or distinct from the rest of the cover 320. That is, the portion 322, where a heat exchanger may be installed, may be separate from the cover 320 that is used to form parts of the fluid channel in the cold plate assembly 310. That is, in the embodiment shown in FIG. 3, the portion 322 may be a base or surface of a heat exchanger, and in some embodiments may be a base that supports a fin core that is attached directly to a surface of the base 318.
  • a component may then be attached or connected to the heat exchanger at portion 322.
  • the portion 322 may represent the component itself. That is, in some embodiments, the fins of the heat exchanger may be formed integral with or attached directly to a component which may then be directly attached to the case 318.
  • the portions of the cover may be friction-stir welded directly to the base 318. That is, cold plate machining may be used to create cooling channels within the base 318 into which pre-fabricated heat exchanger elements or sections (e.g., portion 322) may be placed. Once placed, the heat exchanger element may be friction-stir welded into or onto the base 318 of the cold plate assembly 310.
  • the other portions of the cover 320 such as a lid or multiple lids, may be placed over channels formed in the base 318 of the cold plate assembly 310 and may also be friction-stir welded into place to create the internal cooling channels of the cold plate assembly 310.
  • FIG. 4 an example of friction-stir welding is shown.
  • a tool 430 is provided that rotates as shown by tool rotation arrows 432.
  • a contact force 434 is applied downward on the tool 430 such that a portion of the tool 430, such as a shoulder 440 and a probe 438, may contact a joint line 436.
  • the joint line 436 may be a joint line between a surface of a cover or lid 420 and a surface of a base 418.
  • a probe 438 is used to contact the surface at the joint line 436 and a shoulder 440 of the tool 430 enables a smooth finish to be formed at a trailing edge 442.
  • friction-stir welding is a solid-state joining process wherein materials of two elements to be joined are not melted. Friction-stir welding uses a third body tool (e.g., tool 430) to join two facing surfaces (e.g., a cover 420 and a base 418 of a cold plate assembly). Heat is generated between the tool 430 and the materials of the base 418 and the cover 420, which leads to a very soft region near the tool 430.
  • a third body tool e.g., tool 430
  • the tool 430 then mechanically intermixes the materials of the cover 420 and the base 418 at the place of the joint line 436.
  • the softened material can then be joined, welded, or fused using mechanical pressure (which is applied by the tool 430, e.g., contact force 434).
  • FIG. 5 a schematic of a heat exchanger 550 and in indication of the heat exchanger 550 as friction-stir welded into a fluid channel of a cold plate assembly is shown.
  • a schematic of a modular heat exchanger 550 On the left side of FIG. 5 is a schematic of a modular heat exchanger 550.
  • the modular heat exchanger 550 is formed from a base 552, a fin core 554, and a top 556.
  • the modular heat exchanger 550 may be a pre-fabricated module that may be dropped into or installed within a manufactured or machined part.
  • the modular heat exchanger 550 may form or be installed into portion 322.
  • the heat exchanger 550 may have a similar fin core to that shown and described above.
  • modular heat exchanger 550 is shown with a rectangular or square geometry with a top and a bottom, other configurations of modular heat exchangers may be used without departing from the scope of the present disclosure. That is, any geometry, shape, size, etc. may be used for the heat exchanger, and further, the top and/or bottom may be omitted based on the configuration and needs of a particular design.
  • FIG. 5, and the other figures, are merely provided as examples and are not to be taken as limiting.
  • FIG. 5 Shown on the right-hand side of FIG. 5, a schematic of the heat exchanger 550 as installed is shown. As shown, the heat exchanger 550 may be friction-stir welded into place as indicated by the edge or welding 558. Also shown on the right-hand side of FIG. 5 are two sections of a cover 520. The cover 520 may be substantially similar to the covers and lids described above and may also be friction-stir welded to a base. As shown, the friction-stir welding 558 may be continuous about the sections of the cover 520 and about the heat exchanger 550. Thus, a fluid seal may be provided to prevent leaking of the operating fluid.
  • the heat exchanger 550 and the covers 520 may form a continuous surface. That is, the top 556 of the heat exchanger 550 may be mixed with the covers 520 during the friction-stir welding process, as described above.
  • FIG. 6 shows an image of a heat exchanger 650 as attached to a structure 660 in accordance with embodiments described herein.
  • FIG. 7 is a schematic illustration of a power module 701 as installed on a power module baseplate 703.
  • the power module 701, through the power module baseplate 703, is mounted to a cold plate 705.
  • the power module baseplate 703 includes integral fins 707, which can, for example, be formed by machining or brazed fins.
  • the power module baseplate 703 is brazed by friction stir welding in a window cut out of the cold plate 705.
  • the power module baseplate fins 707 are placed in the space between the cold plate fins 709 forming an interleaved fin structure, as shown. Such configuration allows for high heat dissipating components located on both sides of the cold plate 705 (e.g., above or below the cold plate 705 in FIG. 7).
  • FIG. 8 a schematic illustration of a cold plate 821 having interleaved fins 823 and a cooling channel 825 is shown.
  • a component configuration with such fin structure (e.g., fins 823) and cooling channel (e.g., cooling channel 825) is created by placing the power module baseplate 827 over the fins 823 of the cold plate 821 and friction stir welding the two components together.
  • modified fin densities can be employed.
  • high density fin arrangements can be manufactured such that individual plates have relatively low fin density but have the plates opposing each other with interleaved fins to obtain higher effective fin density.
  • embodiments described herein provide a cold plate assembly that is friction-stir welded.
  • embodiments disclosed herein may enabled modular components, including modular heat exchanger components, without added expense, costs, manufacturing times, or other impacts.
  • that may be significant lead-time reductions as compared to traditional cold plate assembly manufacturing processes.
  • there may be significant cost savings, by reducing the number of parts, components, operations, processes, etc.
  • the friction- stir welding process may enable joining of covers/heat exchangers with a base without the need for fillers, fasteners, etc.
  • the heat exchanger may be formed integral or attached with the component to which it is designed to cool, and thus enable optimized thermal transfer. Further, the entire component (component with attached or integral heat exchanger) may be friction- stir welded into the cold plate to thus form an inseparable assembly.
  • a friction-stir welded cold plate assembly as described herein may enable a strong metallurgic bond to be formed between the friction-stir welded components, thus provided a fluid seal. Accordingly, advantageously, O-rings and other seals and/or bonding or fastening elements may be eliminated during the manufacturing process.
  • various embodiments provided herein can allow the elimination of thermal interface between power modules and cold plates. Removal of the thermal interface may enable temperature reductions of the power module. Accordingly, power modules as prepared in accordance with the present disclosure may have increased reliability. In addition, advantageously, embodiments provided herein can eliminate vacuum brazing and potentially reduce cold plate cost.
  • the heat exchanger may be formed as attached to or integral with the component that is configured to be cooled.
  • the unitary component-heat exchanger may then be installed into an appropriate portion of a fluid channel and then friction-stir welded into place to form a sealed, secure assembly.

Abstract

Cette invention concerne un ensemble plaque froide, comprenant une base définissant un canal de refroidissement et un échangeur de chaleur soudé par friction-malaxage à la base, l'échangeur de chaleur étant disposé à l'intérieur d'une partie du canal de refroidissement, et la soudure par friction-malaxage entre l'échangeur de chaleur et la base formant un joint d'étanchéité.
PCT/US2016/036654 2015-06-09 2016-06-09 Conception modulaire d'échangeur de chaleur WO2016201080A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP16738577.2A EP3308095A1 (fr) 2015-06-09 2016-06-09 Conception modulaire d'échangeur de chaleur

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201562173119P 2015-06-09 2015-06-09
US62/173,119 2015-06-09
US15/177,559 US20160363390A1 (en) 2015-06-09 2016-06-09 Modular heat exchanger design
US15/177,559 2016-06-09

Publications (1)

Publication Number Publication Date
WO2016201080A1 true WO2016201080A1 (fr) 2016-12-15

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US (1) US20160363390A1 (fr)
WO (1) WO2016201080A1 (fr)

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