WO2016188453A1 - Signal connection apparatus for system mother board and module daughter board - Google Patents

Signal connection apparatus for system mother board and module daughter board Download PDF

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Publication number
WO2016188453A1
WO2016188453A1 PCT/CN2016/083517 CN2016083517W WO2016188453A1 WO 2016188453 A1 WO2016188453 A1 WO 2016188453A1 CN 2016083517 W CN2016083517 W CN 2016083517W WO 2016188453 A1 WO2016188453 A1 WO 2016188453A1
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WO
WIPO (PCT)
Prior art keywords
module
signal
board
voltage
pad
Prior art date
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PCT/CN2016/083517
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French (fr)
Chinese (zh)
Inventor
陈华
刘如民
程海林
许齐庆
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中兴通讯股份有限公司
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Publication of WO2016188453A1 publication Critical patent/WO2016188453A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/28—Clamped connections, spring connections
    • H01R4/30—Clamped connections, spring connections utilising a screw or nut clamping member
    • H01R4/34—Conductive members located under head of screw

Definitions

  • the present application relates to, but is not limited to, a signal transmission technology in the field of electronic communication, and more particularly to a signal connection device between a system motherboard and a module daughter board.
  • the -48V DC power supply is generally used, and the modules and devices on the board generally use a lower voltage such as 12V or 3.3V as the input voltage.
  • the common on-board power supply such as the conversion from -48V power supply to 12V, is generally designed separately.
  • tight device layout in order to improve the space usage of the board, it is usually designed as a power daughter card.
  • the signal connection manner between the system board and the power supply sub-card is generally connected by using a high-power connector specially used for power signal transmission, and the male end and the female end corresponding to the connector are connected, wherein both ends are connected.
  • the interior uses a metal reed structure, and other structures such as wire springs, crown springs, and multiple pieces are used to transmit large currents.
  • the high-power connector occupies a limited space and blocks the ventilation duct, which is not conducive to the overall ventilation and heat dissipation of the communication system.
  • This paper provides a signal connection device between the system motherboard and the module daughter board, which enables the system motherboard to be fixedly connected with the module daughter board and can transmit signals without a connector, saving layout space and facilitating the overall communication system. Ventilation and heat dissipation.
  • a signal connection device for a system motherboard and a module sub-board comprising: a system motherboard, a module sub-board, a metal combination screw and a metal stud;
  • the system motherboard includes a signal input end, and is provided with a plurality of first through holes and a first pad spaced apart from each other, and the first pad is connected to the signal input end;
  • the module sub-board includes a signal output end, and is provided with a second through hole and a second pad corresponding to the system motherboard, and the second pad is connected to the signal output end;
  • the system motherboard and the module daughter board are screwed by at least two metal combination screws and at least one metal stud, wherein a first metal combination screw is connected to the first pad and passes through the system mother a first through hole of the plate is screwed to the first end of the metal stud, configured to transmit the input signal, and a second metal combination screw is connected to the second pad, passing through the module daughter board
  • the second through hole is screwed and fixed to the second end of the metal stud, and is connected to the signal output end and configured to transmit the output signal.
  • the embodiment of the present invention includes a system motherboard, a module sub-board, a metal combination screw and a metal stud
  • the system motherboard includes a signal input end, and is provided with a plurality of first through holes spaced apart from each other and a first pad, the first pad is connected to the signal input end
  • the module sub-board includes a signal output end, and is provided with a second through hole and a second pad corresponding to the system motherboard, The second pad is connected to the signal output end
  • the system motherboard and the module daughter board are screwed by at least two metal combination screws and at least one metal stud, wherein the first metal combination screw and the The first pad is connected, and the first through hole of the system motherboard is screwed and fixed to the first end of the metal stud, and is configured to transmit the input signal
  • the second metal combination screw and the A second pad connection through which the second through hole of the module sub-board is screwed and fixed to the second end of the metal stud, is configured to transmit the output signal.
  • the metal motherboard includes
  • the metal combination screw includes a screw head and a screw threadedly fixed to a first pad of the system motherboard or a second pad of the module daughter board; the screw passes through the The first through hole of the system motherboard or the second through hole of the module daughter board is screwed and fixed to the metal stud.
  • the first pad and the second pad are star-moon hole pads, and the width of the first pad and the second pad is greater than that of the metal combination screw and the metal stud width.
  • the inner surfaces of the first through hole and the second through hole are plated with metal, the width of the first through hole is equal to the width of the second through hole, and the first through hole is located at the The center of the first pad Position, the second through hole is located at a center position of the second pad.
  • a first through hole is disposed around the system motherboard, and is configured to fix the system motherboard.
  • a second through hole is disposed around the module daughter board, and is configured to fix the module daughter board.
  • the module daughter board is a power daughter card.
  • the signal input end includes: a power supply power module, a power pre-processing module, and a motherboard power module;
  • the power supply module is configured to provide a first voltage signal required by the system motherboard and the module daughter board;
  • the power pre-processing module is configured to process the first voltage signal provided by the power supply module, and send the first voltage signal and the ground signal to the module daughter board;
  • the electrical module for the motherboard includes a second voltage power module and a third voltage power module, and the second voltage power module is configured to receive the second voltage signal sent by the second voltage conversion module of the signal output end and And grounding the signal, and sending a control signal to the module sub-board; the third voltage power module is configured to receive the third voltage signal and the ground signal sent by the third voltage conversion module of the signal output end.
  • the signal output end includes: a second voltage conversion module and a third voltage conversion module;
  • the second voltage conversion module is configured to receive a first voltage signal sent by the power pre-processing module, convert the first voltage signal into a second voltage signal, and send the second voltage signal and a ground signal to the a second voltage power module;
  • the third voltage conversion module is configured to receive a first voltage signal sent by the power pre-processing module, convert the first voltage signal into a third voltage signal, and send the third voltage signal and a ground signal to the
  • the third voltage is an electrical module.
  • FIG. 1 is a side view of a first embodiment of a signal connection device for a system motherboard and a module daughter board according to an embodiment of the present invention
  • FIG. 2 is a functional block diagram of a second embodiment of a signal connection device for a system motherboard and a module sub-board according to an embodiment of the present invention
  • FIG. 3 is a functional block diagram of a third embodiment of a signal connection device for a system motherboard and a module sub-board according to an embodiment of the present invention.
  • the device according to the embodiment of the present invention is to solve the technical problem that the high-power connector occupies a limited space and blocks the ventilation air passage, which is disadvantageous to the overall ventilation and heat dissipation of the communication system, in the related art.
  • the signal connection device between the system motherboard and the module daughter board includes: a system mother a board 10, a module sub-board 20, a metal combination screw 30 and a metal stud 40;
  • the system motherboard 10 includes a signal input terminal 100 and is provided with a plurality of first through holes 11 and a first pad 12 spaced apart from each other, and the first pad 12 is connected to the signal input end 100;
  • the module sub-board 20 includes a signal output terminal 200 and is provided with a second through hole 21 and a second pad 22 corresponding to the system motherboard 10, and the second pad is connected to the signal output terminal 200. ;
  • the system motherboard 10 and the module sub-board 20 are screwed and fixed by at least two metal combination screws 40 and at least one of the metal studs 30, wherein the first metal combination screw 410 and the first pad 12 Connecting, the first through hole 11 passing through the mother board of the system is screwed and fixed to the first end of the metal stud 30, and is configured to transmit the input signal, the second metal combination screw 420 and the second welding The disk 22 is connected, and the second through hole 21 passing through the module sub-board is screwed and fixed to the second end of the metal stud 30, and is arranged to transmit the output signal.
  • the system motherboard 10 includes a signal input terminal 100, and the same number of first through holes 11 and first pads 12 can be disposed according to the number of signal groups to be transmitted, the first pads 12 and the signal input terminal 100
  • the first through hole 11 and the first pad 12 may be spaced apart by an equal distance, or may be set according to the position of the signal input end 100, but is not limited thereto.
  • the module sub-board 20 includes a signal output terminal 200 and is provided with a second through hole 21 and a second pad 22 corresponding to the system motherboard 10, the second pad and the signal output end. Connected.
  • the system motherboard 10 and the module daughter board 20 are screwed and fixed by at least two metal combination screws 40 and at least one of the metal studs 30.
  • the inner surface of the metal stud 30 is threaded for facilitating metal bonding.
  • the combination screw 40 is fixed, wherein the first metal combination screw 410 is connected to the first pad 12, passes through the first through hole 11 of the system motherboard 10 and the first end of the metal stud 30 Mounted and fixed to transmit the input signal, the second metal combination screw 420 is connected to the second pad 22, passes through the second through hole 21 of the module sub-board 20 and the metal stud 30
  • the two-end screw is fixed and arranged to transmit the output signal.
  • a combination of a plurality of sets of metal studs 30 and metal combination screws 40 is provided to ensure that the system motherboard 10 and the system are
  • the structure of the module sub-board 20 is fixed, and a set of signals can be defined for each combination of the metal stud 30 and the metal combination screw 40, so that multiple signals can be separately transmitted, depending on the actual number of signals to be transmitted. But not this .
  • the signal connection device of the system motherboard and the module sub-board provided by the embodiment of the invention includes: a system motherboard, a module sub-board, a metal combination screw and a metal stud,
  • the system motherboard includes a signal input end, and is provided with a plurality of a first via hole and a first pad spaced apart from each other, the first pad is connected to the signal input end
  • the module sub-board includes a signal output end, and is provided with a corresponding to the system motherboard a second via and a second pad, the second pad being connected to the signal output
  • the system motherboard and the module daughter board being screwed by at least two metal combination screws and at least one metal stud
  • the first metal combination screw is connected to the first pad, and the first through hole of the system motherboard is screwed and fixed to the first end of the metal stud, and is configured to transmit the input signal.
  • a second metal combination screw is connected to the second pad, and the second through hole of the module sub-board is screwed and fixed to the second end of the metal stud, and is configured to transmit the output signal.
  • the metal motherboard screws and metal studs are used to connect the system motherboard and the module daughter board and transmit multiple signals, which saves the high-power signal connector and saves some layout space, thus optimizing the overall communication system. Ventilation and heat dissipation.
  • the metal combination screw 40 includes a screw head 41 and a screw 42 that is screwed to the first pad 12 of the system motherboard 10 or the second pad 22 of the module daughter board 20
  • the screw 42 is screwed to the metal stud 30 through the first through hole 11 of the system motherboard 10 or the second through hole 21 of the module sub-board 20.
  • the metal combination screw 40 includes a screw head 41 and a screw 42.
  • the screw head 41 may be a cross or a zigzag pattern to facilitate the metal combination screw 40 and the first pad 12 or the module daughter board of the system motherboard 10.
  • the second pad 22 of the 20 is screwed and fastened, and the screw 42 passes through the first through hole 11 of the system motherboard 10 or the second through hole 21 of the module sub-board 20 and the metal stud 30 is screwed
  • the screw head 41, the screw 42 and the metal stud 30 are all made of metal copper.
  • the metal stud 30 can be hexagonal in cross section, the outer ring diameter is 6 mm, and the inner ring is directly 2.5 mm. The flow capacity of the system motherboard 10 and the module daughter board 20 is satisfied.
  • the first pad 12 and the second pad 22 are star-moon hole pads.
  • the first pad 12 and the second pad 22 are star-moon hole pads, and the width of the first pad 12 and the second pad 22 is greater than the metal combination screw 40 And the width of the metal stud 30, that is, the cross-sectional area of the screw head 41 and the cross-sectional area of the metal stud 30, so that the metal stud 30 can be better fixed, and the signal can be better transmitted.
  • the inner surfaces of the first through hole 11 and the second through hole 21 are plated with metal, and the width of the first through hole 11 is equal to the width of the second through hole 21, the first The through hole 11 is located at a center position of the first pad 12, and the second through hole 21 is located at a center position of the second pad 22.
  • the surface of the first pad 12 and the second pad 22 is plated with metal, and is configured to transmit a signal.
  • the metal may be made of gold or copper, and a metal that can reduce signal loss is used as much as possible.
  • the width of the first through hole 11 and the width of the second through hole 21 are equal, the first through hole 11 is located at a center position of the first pad 12, and the second The through hole 21 is located at the center of the second pad 22 for mounting of the metal stud.
  • FIG. 2 is a functional block diagram of a second embodiment of a signal connection device for a system motherboard and a module sub-board according to an embodiment of the present invention. As shown in FIG. 2, optionally, when the cross-sectional area of the module sub-board 20 is larger than When the system motherboard 10 is described, a first through hole 11 is provided around the system motherboard 10 to fix the system motherboard 10.
  • a first through hole 11 is disposed around the system motherboard 10.
  • the system motherboard can be Four first through holes 11 are provided at the four corners of 10, and if it is a circular system mother board 10, six or eight first through holes 11 may be provided on the circumference of the system mother board 10, through the metal studs 30 and the metal
  • the mounting screws 40 are fixed to the system motherboard 10, and the corresponding through hole positions and numbers may be set according to the size and shape of the system motherboard 10.
  • the present invention is not limited thereto.
  • a second through hole 21 is disposed around the module sub-board 20, and is configured to fix the module sub-board 20.
  • the second through-hole 21 is disposed around the module sub-board 20.
  • the module sub-board can be Four second through holes 21 are provided at the four corners of the 20, and if it is a circular module sub-board 20, six or eight second through holes 21 may be provided on the circumference of the module sub-board 20, through the metal studs 30 and the metal
  • the assembly screw 40 is fixed to the module sub-board 20, and the position and number of the corresponding through holes can be set according to the size and shape of the module sub-board 20, but not limited thereto.
  • the module daughter board 20 is a power daughter card.
  • the module daughter board 20 is a power daughter card configured to transmit and receive electrical signals.
  • the signal input terminal 100 includes: a power supply module 110, a power pre-processing module 120, and a motherboard power module 130;
  • the power supply module 110 is configured to provide a first voltage signal required by the system motherboard 10 and the module daughter board 20;
  • the power pre-processing module 120 is configured to process the first voltage signal provided by the power supply module 110, and send the first voltage signal and the ground signal to the module daughter board 20;
  • the motherboard power module 130 includes a second voltage power module 131 and a third voltage power module 132, and the second voltage power module 131 is configured to receive the second voltage signal sent by the second voltage conversion module 210 and Grounding a signal, and sending a control signal to the module sub-board 20; the third voltage power module 132 is configured to receive the third voltage signal and ground sent by the third voltage conversion module 220 signal.
  • the signal output terminal 200 includes: a second voltage conversion module 210 and a third voltage conversion module 220;
  • the second voltage conversion module 210 is configured to receive the first voltage signal sent by the power pre-processing module 120, convert the first voltage signal into a second voltage signal, and send the second voltage signal and the ground signal to The second voltage power module 131;
  • the third voltage conversion module 220 is configured to receive the first voltage signal sent by the power pre-processing module 120, convert the first voltage signal into a third voltage signal, and send the third voltage signal and the ground signal to The third voltage uses the electrical module 132.
  • the signal input terminal 100 includes: a power supply module 110, and a power supply pre-stage.
  • the processing module 120 and the motherboard power module 130 assume that the first voltage required by the power supply module 110 for the system motherboard 10 and the module daughter board 20 is -48V, and the power pre-processing module 120 will supply power modules.
  • the power supply provided by 110 is processed, such as anti-reverse connection, and the processed -48V, GND signal is sent to the module sub-board 20.
  • the motherboard power module 130 includes a second voltage power module 131 and a third voltage power module 132.
  • the second voltage power module 131 requires a second voltage of 3.3V to supply power, and the third voltage powers.
  • the module 132 requires a third voltage of 12V to supply power, thereby enabling multiple complex functions of the system motherboard 10.
  • the signal output terminal 200 includes: a second voltage conversion module 210 and a third voltage conversion module 220, wherein the second voltage conversion module 210 is configured to receive the The first voltage signal sent by the power pre-processing module 120 converts the first voltage signal into a second voltage signal, that is, converts the voltage of -48V into a voltage of 3.3V, and sends 3.3V and GND to the second voltage.
  • the third voltage conversion module 220 is configured to receive the first voltage signal sent by the power pre-processing module 120, convert the first voltage signal into a third voltage signal, and convert the voltage of -48V into 12V.
  • the control signal is an output enable signal of the third voltage conversion module 220, which mainly controls the output of the -48V to 12V step-down power module on the power daughter card, that is, 12VCTRL this one signal.
  • the signals between the system board and the power daughter card mentioned above, including -48V, -48VGND, 12V, 3.3V, GND, and 12VCTRL are all transmitted through the metal stud 30 and the metal combination screw 40.
  • Signal 1 to Signal n as illustrated in Figures 1 and 2 are defined.
  • Each set of metal studs 30 and metal combination screws 40 transmits a signal. If necessary, if there is a signal that needs to transmit through a larger current, such as 12V, GND, etc., you can define several sets of screw studs for larger current signal transmission.
  • the embodiment of the invention connects the system motherboard and the module sub-board through the metal combination screw and the metal stud and transmits a plurality of signals, thereby saving the high-power signal connector and saving some layout space, thereby optimizing the system.

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Abstract

Disclosed is a signal connection apparatus for a system mother board and a module daughter board. The signal connection apparatus comprises a system mother board, a module daughter board, metal combination screws, and metal bolts. The system mother board and the module daughter board are fixed in a bolted manner by means of at least two metal combination screws and at least one metal bolt. A first metal combination screw is connected to a first pad, passes through a first through hole of the system mother board, and is fixed to a first end of the metal bolt in a bolted manner, and is configured to transmit an input signal. A second metal combination screw is connected to a second pad, passes through a second through hole of the module daughter board, and is fixed to a second end of the metal bolt in a bolted manner, and is configured to transmit an output signal.

Description

系统母板与模块子板的信号连接装置Signal connection device between system motherboard and module daughter board 技术领域Technical field
本申请涉及但不限于电子通信领域信号传输技术，尤指一种系统母板与模块子板的信号连接装置。The present application relates to, but is not limited to, a signal transmission technology in the field of electronic communication, and more particularly to a signal connection device between a system motherboard and a module daughter board.
背景技术Background technique
随着通信系统功能越来越复杂，性能要求越来越高，导致系统板上器件众多，布局布线密集。在通信机房系统板一般常用的是-48V直流电源供电，而单板上的模块和器件普遍使用更低的电压比如12V或者3.3V等电压作为输入电压。从-48V供电电源转换到12V等常见的板内电源这部分一般都独立出来进行设计，在器件布局紧张的情况下为提高单板的空间使用，通常设计成电源子卡形式。As the functions of communication systems become more and more complex, performance requirements become higher and higher, resulting in numerous devices on the system board, and dense layout. In the communication room system board, the -48V DC power supply is generally used, and the modules and devices on the board generally use a lower voltage such as 12V or 3.3V as the input voltage. The common on-board power supply, such as the conversion from -48V power supply to 12V, is generally designed separately. In the case of tight device layout, in order to improve the space usage of the board, it is usually designed as a power daughter card.
相关技术中，系统板与电源子卡的信号连接方式常见的是使用专门用于电源信号传输的大功率连接器进行连接，通过这类连接器对应的公端和母端对接，其中，两端内部多采用金属簧片结构，还有线簧、冠簧、多片等其它结构来传递大电流。In the related art, the signal connection manner between the system board and the power supply sub-card is generally connected by using a high-power connector specially used for power signal transmission, and the male end and the female end corresponding to the connector are connected, wherein both ends are connected. The interior uses a metal reed structure, and other structures such as wire springs, crown springs, and multiple pieces are used to transmit large currents.
但是，采用相关技术，在布局布线密集的要求下，大功率连接器占用了有限的空间，遮挡了通风风道，不利于通信系统的整体通风散热。However, with the related technology, under the requirement of dense layout and wiring, the high-power connector occupies a limited space and blocks the ventilation duct, which is not conducive to the overall ventilation and heat dissipation of the communication system.
发明内容Summary of the invention
以下是对本文详细描述的主题的概述。本概述并非是为了限制权利要求的保护范围。The following is an overview of the topics detailed in this document. This Summary is not intended to limit the scope of the claims.
本文提供了一种系统母板与模块子板的信号连接装置，能够使得系统母板与模块子板固定连接且无需连接器就可以传输信号，节省了布局的空间，也有利于通信系统的整体通风散热。This paper provides a signal connection device between the system motherboard and the module daughter board, which enables the system motherboard to be fixedly connected with the module daughter board and can transmit signals without a connector, saving layout space and facilitating the overall communication system. Ventilation and heat dissipation.
一种系统母板与模块子板的信号连接装置，包括：系统母板、模块子板、金属组合螺钉和金属螺柱； A signal connection device for a system motherboard and a module sub-board, comprising: a system motherboard, a module sub-board, a metal combination screw and a metal stud;
所述系统母板包括信号输入端，并设置有多个间隔距离的第一通孔和第一焊盘，所述第一焊盘与所述信号输入端相连；The system motherboard includes a signal input end, and is provided with a plurality of first through holes and a first pad spaced apart from each other, and the first pad is connected to the signal input end;
所述模块子板包括信号输出端，并设置有与所述系统母板对应的第二通孔和第二焊盘，所述第二焊盘与所述信号输出端相连；The module sub-board includes a signal output end, and is provided with a second through hole and a second pad corresponding to the system motherboard, and the second pad is connected to the signal output end;
所述系统母板和所述模块子板通过至少两个金属组合螺钉和至少一个金属螺柱螺装固定，其中，第一金属组合螺钉与所述第一焊盘连接，穿过所述系统母板的第一通孔与所述金属螺柱的第一端螺装固定，设置为传输所述输入信号，第二金属组合螺钉与所述第二焊盘连接，穿过所述模块子板的第二通孔与所述金属螺柱的第二端螺装固定，与所述信号输出端连接，设置为传输所述输出信号。The system motherboard and the module daughter board are screwed by at least two metal combination screws and at least one metal stud, wherein a first metal combination screw is connected to the first pad and passes through the system mother a first through hole of the plate is screwed to the first end of the metal stud, configured to transmit the input signal, and a second metal combination screw is connected to the second pad, passing through the module daughter board The second through hole is screwed and fixed to the second end of the metal stud, and is connected to the signal output end and configured to transmit the output signal.
与相关技术相比，本发明实施例包括系统母板、模块子板、金属组合螺钉和金属螺柱，所述系统母板包括信号输入端，并设置有多个间隔距离的第一通孔和第一焊盘，所述第一焊盘与所述信号输入端相连，所述模块子板包括信号输出端，并设置有与所述系统母板对应的第二通孔和第二焊盘，所述第二焊盘与所述信号输出端相连，所述系统母板和所述模块子板通过至少两个金属组合螺钉和至少一个金属螺柱螺装固定，其中，第一金属组合螺钉与所述第一焊盘连接，穿过所述系统母板的第一通孔与所述金属螺柱的第一端螺装固定，设置为传输所述输入信号，第二金属组合螺钉与所述第二焊盘连接，穿过所述模块子板的第二通孔与所述金属螺柱的第二端螺装固定，设置为传输所述输出信号。通过金属组合螺钉和金属螺柱来连接系统母板和模块子板并进行多个信号的传输，而从节省了大功率信号连接器，也节省了一些布局布线空间，从而优化了通信系统的整体通风散热。Compared with the related art, the embodiment of the present invention includes a system motherboard, a module sub-board, a metal combination screw and a metal stud, the system motherboard includes a signal input end, and is provided with a plurality of first through holes spaced apart from each other and a first pad, the first pad is connected to the signal input end, the module sub-board includes a signal output end, and is provided with a second through hole and a second pad corresponding to the system motherboard, The second pad is connected to the signal output end, and the system motherboard and the module daughter board are screwed by at least two metal combination screws and at least one metal stud, wherein the first metal combination screw and the The first pad is connected, and the first through hole of the system motherboard is screwed and fixed to the first end of the metal stud, and is configured to transmit the input signal, the second metal combination screw and the A second pad connection, through which the second through hole of the module sub-board is screwed and fixed to the second end of the metal stud, is configured to transmit the output signal. The metal motherboard screws and metal studs are used to connect the system motherboard and the module daughter board and transmit multiple signals, which saves the high-power signal connector and saves some layout space, thus optimizing the overall communication system. Ventilation and heat dissipation.
可选地，所述金属组合螺钉包括螺头和螺杆，所述螺头与所述系统母板的第一焊盘或模块子板的第二焊盘螺装固定；所述螺杆穿过所述系统母板的第一通孔或模块子板的第二通孔与所述金属螺柱螺装固定。Optionally, the metal combination screw includes a screw head and a screw threadedly fixed to a first pad of the system motherboard or a second pad of the module daughter board; the screw passes through the The first through hole of the system motherboard or the second through hole of the module daughter board is screwed and fixed to the metal stud.
可选地，所述第一焊盘和所述第二焊盘为星月孔焊盘，所述第一焊盘和所述第二焊盘的宽度大于所述金属组合螺钉和金属螺柱的宽度。Optionally, the first pad and the second pad are star-moon hole pads, and the width of the first pad and the second pad is greater than that of the metal combination screw and the metal stud width.
可选地，所述第一通孔和所述第二通孔的内表面镀有金属，所述第一通孔的宽度等于所述第二通孔的宽度，所述第一通孔位于所述第一焊盘的中心 位置，所述第二通孔位于所述第二焊盘的中心位置。Optionally, the inner surfaces of the first through hole and the second through hole are plated with metal, the width of the first through hole is equal to the width of the second through hole, and the first through hole is located at the The center of the first pad Position, the second through hole is located at a center position of the second pad.
可选地，当所述模块子板的截面积大于所述系统母板时，则在所述系统母板的四周设置第一通孔，设置为固定所述系统母板。Optionally, when the cross-sectional area of the module daughter board is greater than the system motherboard, a first through hole is disposed around the system motherboard, and is configured to fix the system motherboard.
可选地，当所述模块子板的截面积小于所述系统母板时，则在所述模块子板的四周设置第二通孔，设置为固定所述模块子板。Optionally, when the cross-sectional area of the module daughter board is smaller than the system motherboard, a second through hole is disposed around the module daughter board, and is configured to fix the module daughter board.
可选地，所述模块子板为电源子卡。Optionally, the module daughter board is a power daughter card.
可选地，所述信号输入端包括：供电电源模块、电源前级处理模块和母板用电模块；Optionally, the signal input end includes: a power supply power module, a power pre-processing module, and a motherboard power module;
所述供电电源模块设置为提供所述系统母板和模块子板所需要的第一电压信号；The power supply module is configured to provide a first voltage signal required by the system motherboard and the module daughter board;
所述电源前级处理模块设置为处理供电电源模块提供的第一电压信号，发送第一电压信号和接地信号给所述模块子板；The power pre-processing module is configured to process the first voltage signal provided by the power supply module, and send the first voltage signal and the ground signal to the module daughter board;
所述母板用电模块包括第二电压用电模块和第三电压用电模块，所述第二电压用电模块设置为接收所述信号输出端的第二电压转换模块发送的第二电压信号和接地信号，并发送控制信号给所述模块子板；所述第三电压用电模块设置为接收所述信号输出端的第三电压转换模块发送的第三电压信号和接地信号。The electrical module for the motherboard includes a second voltage power module and a third voltage power module, and the second voltage power module is configured to receive the second voltage signal sent by the second voltage conversion module of the signal output end and And grounding the signal, and sending a control signal to the module sub-board; the third voltage power module is configured to receive the third voltage signal and the ground signal sent by the third voltage conversion module of the signal output end.
可选地，所述信号输出端包括：第二电压转换模块和第三电压转换模块；Optionally, the signal output end includes: a second voltage conversion module and a third voltage conversion module;
所述第二电压转换模块，设置为接收所述电源前级处理模块发送的第一电压信号，转换第一电压信号为第二电压信号，并发送所述第二电压信号和接地信号给所述第二电压用电模块；The second voltage conversion module is configured to receive a first voltage signal sent by the power pre-processing module, convert the first voltage signal into a second voltage signal, and send the second voltage signal and a ground signal to the a second voltage power module;
所述第三电压转换模块，设置为接收所述电源前级处理模块发送的第一电压信号，转换第一电压信号为第三电压信号，并发送所述第三电压信号和接地信号给所述第三电压用电模块。The third voltage conversion module is configured to receive a first voltage signal sent by the power pre-processing module, convert the first voltage signal into a third voltage signal, and send the third voltage signal and a ground signal to the The third voltage is an electrical module.
在阅读并理解了附图和详细描述后，可以明白其他方面。Other aspects will be apparent upon reading and understanding the drawings and detailed description.
附图概述 BRIEF abstract
图1为本发明实施例提供的系统母板与模块子板的信号连接装置实施例一的侧视图；1 is a side view of a first embodiment of a signal connection device for a system motherboard and a module daughter board according to an embodiment of the present invention;
图2为本发明实施例提供的系统母板与模块子板的信号连接装置实施例二的功能模块图；2 is a functional block diagram of a second embodiment of a signal connection device for a system motherboard and a module sub-board according to an embodiment of the present invention;
图3为本发明实施例提供的系统母板与模块子板的信号连接装置实施例三的功能模块图。FIG. 3 is a functional block diagram of a third embodiment of a signal connection device for a system motherboard and a module sub-board according to an embodiment of the present invention.
本发明的实施方式Embodiments of the invention
下文中将结合附图对本发明的实施方式进行说明。需要说明的是，在不冲突的情况下，本申请中的实施例及实施例中的特征可以相互任意组合。Embodiments of the present invention will be described hereinafter with reference to the accompanying drawings. It should be noted that, in the case of no conflict, the features in the embodiments and the embodiments in the present application may be arbitrarily combined with each other.
本发明实施例涉及的装置，旨在解决相关技术中在布局布线密集的要求下，大功率连接器占用了有限的空间，遮挡了通风风道，不利于通信系统的整体通风散热的技术问题。The device according to the embodiment of the present invention is to solve the technical problem that the high-power connector occupies a limited space and blocks the ventilation air passage, which is disadvantageous to the overall ventilation and heat dissipation of the communication system, in the related art.
下面以实施例对本申请的技术方案进行详细说明。下面这几个实施例可以相互结合，对于相同或相似的概念或过程可能在某些实施例不再赘述。The technical solutions of the present application are described in detail below by way of examples. The following embodiments may be combined with each other, and the same or similar concepts or processes may not be described in some embodiments.
图1为本发明实施例提供的系统母板与模块子板的信号连接装置实施例一的侧视图，如图1所示，所述系统母板与模块子板的信号连接装置包括：系统母板10、模块子板20、金属组合螺钉30和金属螺柱40；1 is a side view of a first embodiment of a signal connection device for a system motherboard and a module daughter board according to an embodiment of the present invention. As shown in FIG. 1, the signal connection device between the system motherboard and the module daughter board includes: a system mother a board 10, a module sub-board 20, a metal combination screw 30 and a metal stud 40;
所述系统母板10包括信号输入端100，并设置有多个间隔距离的第一通孔11和第一焊盘12，所述第一焊盘12与所述信号输入端100相连；The system motherboard 10 includes a signal input terminal 100 and is provided with a plurality of first through holes 11 and a first pad 12 spaced apart from each other, and the first pad 12 is connected to the signal input end 100;
所述模块子板20包括信号输出端200，并设置有与所述系统母板10对应的第二通孔21和第二焊盘22，所述第二焊盘与所述信号输出端200相连；The module sub-board 20 includes a signal output terminal 200 and is provided with a second through hole 21 and a second pad 22 corresponding to the system motherboard 10, and the second pad is connected to the signal output terminal 200. ;
所述系统母板10与所述模块子板20通过至少两个金属组合螺钉40和至少一个所述金属螺柱30螺装固定，其中，第一金属组合螺钉410与所述第一焊盘12连接，穿过所述系统母板的第一通孔11与所述金属螺柱30的第一端螺装固定，设置为传输所述输入信号，第二金属组合螺钉420与所述第二焊盘22连接，穿过所述模块子板的第二通孔21与所述金属螺柱30的第二端螺装固定，设置为传输所述输出信号。 The system motherboard 10 and the module sub-board 20 are screwed and fixed by at least two metal combination screws 40 and at least one of the metal studs 30, wherein the first metal combination screw 410 and the first pad 12 Connecting, the first through hole 11 passing through the mother board of the system is screwed and fixed to the first end of the metal stud 30, and is configured to transmit the input signal, the second metal combination screw 420 and the second welding The disk 22 is connected, and the second through hole 21 passing through the module sub-board is screwed and fixed to the second end of the metal stud 30, and is arranged to transmit the output signal.
所述系统母板10包括信号输入端100，可以根据需要传递的信号组数设置相同数量的第一通孔11和第一焊盘12，所述第一焊盘12与所述信号输入端100相连，所述第一通孔11和所述第一焊盘12可以间隔相等距离，也可以根据信号输入端100的位置来进行设置，但并不限于此。The system motherboard 10 includes a signal input terminal 100, and the same number of first through holes 11 and first pads 12 can be disposed according to the number of signal groups to be transmitted, the first pads 12 and the signal input terminal 100 The first through hole 11 and the first pad 12 may be spaced apart by an equal distance, or may be set according to the position of the signal input end 100, but is not limited thereto.
所述模块子板20包括信号输出端200，并设置有与所述系统母板10一一对应的第二通孔21和第二焊盘22，所述第二焊盘与所述信号输出端相连。The module sub-board 20 includes a signal output terminal 200 and is provided with a second through hole 21 and a second pad 22 corresponding to the system motherboard 10, the second pad and the signal output end. Connected.
所述系统母板10与所述模块子板20通过至少两个金属组合螺钉40和至少一个所述金属螺柱30螺装固定，所述金属螺柱30的内表面带有螺纹，便于与金属组合螺钉40进行固定，其中，第一金属组合螺钉410与所述第一焊盘12连接，穿过所述系统母板10的第一通孔11与所述金属螺柱30的第一端螺装固定，设置为传输所述输入信号，第二金属组合螺钉420与所述第二焊盘22连接，穿过所述模块子板20的第二通孔21与所述金属螺柱30的第二端螺装固定，设置为传输所述输出信号，同时，还可以根据模块子板20的安装要求，设置多组金属螺柱30和金属组合螺钉40的组合保证所述系统母板10与所述模块子板20的结构固定，同时还可以给每一个金属螺柱30和金属组合螺钉40的组合定义一组信号，从而可以分别传输的多个信号，根据实际需要传输的信号数量的情况而定，但并不以此为限。The system motherboard 10 and the module daughter board 20 are screwed and fixed by at least two metal combination screws 40 and at least one of the metal studs 30. The inner surface of the metal stud 30 is threaded for facilitating metal bonding. The combination screw 40 is fixed, wherein the first metal combination screw 410 is connected to the first pad 12, passes through the first through hole 11 of the system motherboard 10 and the first end of the metal stud 30 Mounted and fixed to transmit the input signal, the second metal combination screw 420 is connected to the second pad 22, passes through the second through hole 21 of the module sub-board 20 and the metal stud 30 The two-end screw is fixed and arranged to transmit the output signal. At the same time, according to the installation requirements of the module sub-board 20, a combination of a plurality of sets of metal studs 30 and metal combination screws 40 is provided to ensure that the system motherboard 10 and the system are The structure of the module sub-board 20 is fixed, and a set of signals can be defined for each combination of the metal stud 30 and the metal combination screw 40, so that multiple signals can be separately transmitted, depending on the actual number of signals to be transmitted. But not this .
本发明实施例提供的系统母板与模块子板的信号连接装置，包括：系统母板、模块子板、金属组合螺钉和金属螺柱，所述系统母板包括信号输入端，并设置有多个间隔距离的第一通孔和第一焊盘，所述第一焊盘与所述信号输入端相连，所述模块子板包括信号输出端，并设置有与所述系统母板对应的第二通孔和第二焊盘，所述第二焊盘与所述信号输出端相连，所述系统母板和所述模块子板通过至少两个金属组合螺钉和至少一个金属螺柱螺装固定，其中，第一金属组合螺钉与所述第一焊盘连接，穿过所述系统母板的第一通孔与所述金属螺柱的第一端螺装固定，设置为传输所述输入信号，第二金属组合螺钉与所述第二焊盘连接，穿过所述模块子板的第二通孔与所述金属螺柱的第二端螺装固定，设置为传输所述输出信号。通过金属组合螺钉和金属螺柱来连接系统母板和模块子板并进行多个信号的传输，而从节省了大功率信号连接器，也节省了一些布局布线空间，从而优化了通信系统的整体 通风散热。The signal connection device of the system motherboard and the module sub-board provided by the embodiment of the invention includes: a system motherboard, a module sub-board, a metal combination screw and a metal stud, the system motherboard includes a signal input end, and is provided with a plurality of a first via hole and a first pad spaced apart from each other, the first pad is connected to the signal input end, the module sub-board includes a signal output end, and is provided with a corresponding to the system motherboard a second via and a second pad, the second pad being connected to the signal output, the system motherboard and the module daughter board being screwed by at least two metal combination screws and at least one metal stud The first metal combination screw is connected to the first pad, and the first through hole of the system motherboard is screwed and fixed to the first end of the metal stud, and is configured to transmit the input signal. And a second metal combination screw is connected to the second pad, and the second through hole of the module sub-board is screwed and fixed to the second end of the metal stud, and is configured to transmit the output signal. The metal motherboard screws and metal studs are used to connect the system motherboard and the module daughter board and transmit multiple signals, which saves the high-power signal connector and saves some layout space, thus optimizing the overall communication system. Ventilation and heat dissipation.
可选地，所述金属组合螺钉40包括螺头41和螺杆42，所述螺头41与所述系统母板10的第一焊盘12或模块子板20的第二焊盘22螺装固定；所述螺杆42穿过所述系统母板10的第一通孔11或模块子板20的第二通孔21与所述金属螺柱30螺装固定。Optionally, the metal combination screw 40 includes a screw head 41 and a screw 42 that is screwed to the first pad 12 of the system motherboard 10 or the second pad 22 of the module daughter board 20 The screw 42 is screwed to the metal stud 30 through the first through hole 11 of the system motherboard 10 or the second through hole 21 of the module sub-board 20.
所述金属组合螺钉40包括螺头41和螺杆42，所述螺头41可以是十字纹或者一字纹，方便金属组合螺钉40与所述系统母板10的第一焊盘12或模块子板20的第二焊盘22螺装紧固，所述螺杆42穿过所述系统母板10的第一通孔11或模块子板20的第二通孔21与所述金属螺柱30螺装固定，所述螺头41、螺杆42和所述金属螺柱30均采用金属铜制作，所述金属螺柱30可以采用截面六角形，外圈直径为6mm，内圈直接2.5mm的螺纹，以满足系统母板10和模块子板20的通流能力。The metal combination screw 40 includes a screw head 41 and a screw 42. The screw head 41 may be a cross or a zigzag pattern to facilitate the metal combination screw 40 and the first pad 12 or the module daughter board of the system motherboard 10. The second pad 22 of the 20 is screwed and fastened, and the screw 42 passes through the first through hole 11 of the system motherboard 10 or the second through hole 21 of the module sub-board 20 and the metal stud 30 is screwed The screw head 41, the screw 42 and the metal stud 30 are all made of metal copper. The metal stud 30 can be hexagonal in cross section, the outer ring diameter is 6 mm, and the inner ring is directly 2.5 mm. The flow capacity of the system motherboard 10 and the module daughter board 20 is satisfied.
可选地，所述第一焊盘12和所述第二焊盘22为星月孔焊盘。Optionally, the first pad 12 and the second pad 22 are star-moon hole pads.
可选地，所述第一焊盘12和所述第二焊盘22为星月孔焊盘，所述第一焊盘12和所述第二焊盘22的宽度大于所述金属组合螺钉40和所述金属螺柱30的宽度，即大于螺头41的截面积和金属螺柱30的截面积，这样可以更好的固定所述金属螺柱30，也可以更好传输信号。Optionally, the first pad 12 and the second pad 22 are star-moon hole pads, and the width of the first pad 12 and the second pad 22 is greater than the metal combination screw 40 And the width of the metal stud 30, that is, the cross-sectional area of the screw head 41 and the cross-sectional area of the metal stud 30, so that the metal stud 30 can be better fixed, and the signal can be better transmitted.
可选地，所述第一通孔11和所述第二通孔21的内表面镀有金属，所述第一通孔11的宽度等于所述第二通孔21的宽度，所述第一通孔11位于所述第一焊盘12的中心位置，所述第二通孔21位于所述第二焊盘22的中心位置。Optionally, the inner surfaces of the first through hole 11 and the second through hole 21 are plated with metal, and the width of the first through hole 11 is equal to the width of the second through hole 21, the first The through hole 11 is located at a center position of the first pad 12, and the second through hole 21 is located at a center position of the second pad 22.
可选地，所述第一焊盘12和第二焊盘22的表面星月孔镀有金属，设置为传输信号，该金属可以是金、铜制成，尽量采用可以减少信号损失的金属，但并不以此为限，所述第一通孔11的宽度和第二通孔21的宽度相等，所述第一通孔11位于所述第一焊盘12的中心位置，所述第二通孔21位于所述第二焊盘22的中心位置，以便金属螺柱的安装。Optionally, the surface of the first pad 12 and the second pad 22 is plated with metal, and is configured to transmit a signal. The metal may be made of gold or copper, and a metal that can reduce signal loss is used as much as possible. However, not limited thereto, the width of the first through hole 11 and the width of the second through hole 21 are equal, the first through hole 11 is located at a center position of the first pad 12, and the second The through hole 21 is located at the center of the second pad 22 for mounting of the metal stud.
图2为本发明实施例提供的系统母板与模块子板的信号连接装置实施例二的功能模块图，如图2所示，可选地，当所述模块子板20的截面积大于所 述系统母板10时，则在所述系统母板10的四周设置第一通孔11，设置为固定所述系统母板10。2 is a functional block diagram of a second embodiment of a signal connection device for a system motherboard and a module sub-board according to an embodiment of the present invention. As shown in FIG. 2, optionally, when the cross-sectional area of the module sub-board 20 is larger than When the system motherboard 10 is described, a first through hole 11 is provided around the system motherboard 10 to fix the system motherboard 10.
所述模块子板20的截面积大于所述系统母板10时，则在所述系统母板10的四周设置第一通孔11，如果是方形的系统母板10，可以在该系统母板10的四角设置四个第一通孔11，如果是圆形的系统母板10，可以在该系统母板10的圆周设置六个或者八个第一通孔11，通过金属螺柱30和金属组合螺钉40对所述系统母板10的安装固定，可以根据系统母板10的大小和形状的不同，设置相应的通孔位置和数量，但并不以此为限。When the cross-sectional area of the module daughter board 20 is larger than that of the system motherboard 10, a first through hole 11 is disposed around the system motherboard 10. If the square system motherboard 10 is used, the system motherboard can be Four first through holes 11 are provided at the four corners of 10, and if it is a circular system mother board 10, six or eight first through holes 11 may be provided on the circumference of the system mother board 10, through the metal studs 30 and the metal The mounting screws 40 are fixed to the system motherboard 10, and the corresponding through hole positions and numbers may be set according to the size and shape of the system motherboard 10. However, the present invention is not limited thereto.
可选地，当所述模块子板20的截面积小于所述系统母板10时，则在所述模块子板20的四周设置第二通孔21，设置为固定所述模块子板20。Optionally, when the cross-sectional area of the module sub-board 20 is smaller than the system motherboard 10, a second through hole 21 is disposed around the module sub-board 20, and is configured to fix the module sub-board 20.
所述模块子板20的截面积小于所述系统母板10时，则在所述模块子板20的四周设置第二通孔21，如果是方形的模块子板20，可以在该模块子板20的四角设置四个第二通孔21，如果是圆形的模块子板20，可以在该模块子板20的圆周设置六个或者八个第二通孔21，通过金属螺柱30和金属组合螺钉40对所述模块子板20的安装固定，可以根据模块子板20的大小和形状的不同，设置相应的通孔位置和数量，但并不以此为限。When the cross-sectional area of the module sub-board 20 is smaller than that of the system motherboard 10, the second through-hole 21 is disposed around the module sub-board 20. If it is a square module sub-board 20, the module sub-board can be Four second through holes 21 are provided at the four corners of the 20, and if it is a circular module sub-board 20, six or eight second through holes 21 may be provided on the circumference of the module sub-board 20, through the metal studs 30 and the metal The assembly screw 40 is fixed to the module sub-board 20, and the position and number of the corresponding through holes can be set according to the size and shape of the module sub-board 20, but not limited thereto.
可选地，所述模块子板20为电源子卡。Optionally, the module daughter board 20 is a power daughter card.
所述模块子板20为电源子卡，设置为发送和接收电信号。The module daughter board 20 is a power daughter card configured to transmit and receive electrical signals.
可选地，如图3所示，所述信号输入端100包括：供电电源模块110、电源前级处理模块120和母板用电模块130；Optionally, as shown in FIG. 3, the signal input terminal 100 includes: a power supply module 110, a power pre-processing module 120, and a motherboard power module 130;
所述供电电源模块110设置为提供所述系统母板10和模块子板20所需要的第一电压信号；The power supply module 110 is configured to provide a first voltage signal required by the system motherboard 10 and the module daughter board 20;
所述电源前级处理模块120设置为处理供电电源模块110提供的第一电压信号，发送第一电压信号和接地信号给所述模块子板20；The power pre-processing module 120 is configured to process the first voltage signal provided by the power supply module 110, and send the first voltage signal and the ground signal to the module daughter board 20;
所述母板用电模块130包括第二电压用电模块131和第三电压用电模块132，所述第二电压用电模块131设置为接收第二电压转换模块210发送的第二电压信号和接地信号，并发送控制信号给所述模块子板20；所述第三电压用电模块132设置为接收第三电压转换模块220发送的第三电压信号和接地 信号。The motherboard power module 130 includes a second voltage power module 131 and a third voltage power module 132, and the second voltage power module 131 is configured to receive the second voltage signal sent by the second voltage conversion module 210 and Grounding a signal, and sending a control signal to the module sub-board 20; the third voltage power module 132 is configured to receive the third voltage signal and ground sent by the third voltage conversion module 220 signal.
可选地，所述信号输出端200包括：第二电压转换模块210和第三电压转换模块220；Optionally, the signal output terminal 200 includes: a second voltage conversion module 210 and a third voltage conversion module 220;
所述第二电压转换模块210，设置为接收所述电源前级处理模块120发送的第一电压信号，转换第一电压信号为第二电压信号，并发送所述第二电压信号和接地信号给所述第二电压用电模块131；The second voltage conversion module 210 is configured to receive the first voltage signal sent by the power pre-processing module 120, convert the first voltage signal into a second voltage signal, and send the second voltage signal and the ground signal to The second voltage power module 131;
所述第三电压转换模块220，设置为接收所述电源前级处理模块120发送的第一电压信号，转换第一电压信号为第三电压信号，并发送所述第三电压信号和接地信号给所述第三电压用电模块132。The third voltage conversion module 220 is configured to receive the first voltage signal sent by the power pre-processing module 120, convert the first voltage signal into a third voltage signal, and send the third voltage signal and the ground signal to The third voltage uses the electrical module 132.
图3为本发明实施例提供的系统母板与模块子板的信号连接装置实施例三的功能模块图，如图3所示，所述信号输入端100包括：供电电源模块110、电源前级处理模块120和母板用电模块130，假设供电电源模块110提供给所述系统母板10和模块子板20所需要的第一电压为-48V，电源前级处理模块120会对供电电源模块110提供的电源进行处理，如防反接等，经过处理后的-48V、GND信号发送给模块子板20。所述母板用电模块130包括第二电压用电模块131和第三电压用电模块132，其中，第二电压用电模块131需要第二电压3.3V的电源进行供电，第三电压用电模块132需要第三电压12V的电源进行供电，从而可以实现系统母板10的多项复杂功能。3 is a functional block diagram of a third embodiment of a signal connection device between a system motherboard and a module sub-board according to an embodiment of the present invention. As shown in FIG. 3, the signal input terminal 100 includes: a power supply module 110, and a power supply pre-stage. The processing module 120 and the motherboard power module 130 assume that the first voltage required by the power supply module 110 for the system motherboard 10 and the module daughter board 20 is -48V, and the power pre-processing module 120 will supply power modules. The power supply provided by 110 is processed, such as anti-reverse connection, and the processed -48V, GND signal is sent to the module sub-board 20. The motherboard power module 130 includes a second voltage power module 131 and a third voltage power module 132. The second voltage power module 131 requires a second voltage of 3.3V to supply power, and the third voltage powers. The module 132 requires a third voltage of 12V to supply power, thereby enabling multiple complex functions of the system motherboard 10.
可选地，在上述实施例的基础上，所述信号输出端200包括：第二电压转换模块210和第三电压转换模块220，其中，所述第二电压转换模块210，设置为接收所述电源前级处理模块120发送的第一电压信号，转换第一电压信号为第二电压信号，即将-48V的电压转换成3.3V的电压，并发送3.3V和GND给所述第二电压用电模块131；所述第三电压转换模块220，设置为接收所述电源前级处理模块120发送的第一电压信号，转换第一电压信号为第三电压信号，即将-48V的电压转换成12V的电压，并发送12V和GND给所述第三电压用电模块132；所述第二电压用电模块131接收第二电压转换模块210发送的3.3V和GND，所述第三电压用电模块132接收所述第三电压转换模块220发送的12V和GND。而控制信号为第三电压转换模块220的输出使能信号，其主要控制电源子卡上-48V转12V降压电源模块的输出，即 12VCTRL这一个信号。Optionally, on the basis of the foregoing embodiment, the signal output terminal 200 includes: a second voltage conversion module 210 and a third voltage conversion module 220, wherein the second voltage conversion module 210 is configured to receive the The first voltage signal sent by the power pre-processing module 120 converts the first voltage signal into a second voltage signal, that is, converts the voltage of -48V into a voltage of 3.3V, and sends 3.3V and GND to the second voltage. The third voltage conversion module 220 is configured to receive the first voltage signal sent by the power pre-processing module 120, convert the first voltage signal into a third voltage signal, and convert the voltage of -48V into 12V. Voltage, and send 12V and GND to the third voltage power module 132; the second voltage power module 131 receives 3.3V and GND sent by the second voltage conversion module 210, the third voltage power module 132 Receiving 12V and GND sent by the third voltage conversion module 220. The control signal is an output enable signal of the third voltage conversion module 220, which mainly controls the output of the -48V to 12V step-down power module on the power daughter card, that is, 12VCTRL this one signal.
上面提到的系统板母板和电源子卡之间的信号，包括-48V、-48VGND、12V、3.3V、GND、12VCTRL这些都通过金属螺柱30和金属组合螺钉40安装固定件进行信号传输，定义到图1和图2中示意的信号1到信号n。每一组金属螺柱30和金属组合螺钉40传输一种信号。在有需要的情况下，如果有信号需要通过更大的电流传输，如12V、GND等信号，可以相应地多定义几组螺钉螺柱进行更大电流的信号传输。The signals between the system board and the power daughter card mentioned above, including -48V, -48VGND, 12V, 3.3V, GND, and 12VCTRL are all transmitted through the metal stud 30 and the metal combination screw 40. , Signal 1 to Signal n as illustrated in Figures 1 and 2 are defined. Each set of metal studs 30 and metal combination screws 40 transmits a signal. If necessary, if there is a signal that needs to transmit through a larger current, such as 12V, GND, etc., you can define several sets of screw studs for larger current signal transmission.
虽然本申请所揭露的实施方式如上，但所述的内容仅为便于理解本申请而采用的实施方式，并非用以限定本申请。任何本申请所属领域内的技术人员，在不脱离本申请所揭露的精神和范围的前提下，可以在实施的形式及细节上进行任何的修改与变化，但本申请的专利保护范围，仍须以所附的权利要求书所界定的范围为准。The embodiments disclosed in the present application are as described above, but the description is only for the purpose of understanding the present application, and is not intended to limit the present application. Any modifications and changes in the form and details of the embodiments may be made by those skilled in the art without departing from the spirit and scope of the disclosure. The scope defined by the appended claims shall prevail.
工业实用性Industrial applicability
本发明实施例通过金属组合螺钉和金属螺柱来连接系统母板和模块子板并进行多个信号的传输，而从节省了大功率信号连接器，也节省了一些布局布线空间，从而优化了通信系统的整体通风散热。 The embodiment of the invention connects the system motherboard and the module sub-board through the metal combination screw and the metal stud and transmits a plurality of signals, thereby saving the high-power signal connector and saving some layout space, thereby optimizing the system. The overall ventilation and cooling of the communication system.

Claims (9)

  1. 一种系统母板与模块子板的信号连接装置，包括：系统母板、模块子板、金属组合螺钉和金属螺柱；A signal connection device for a system motherboard and a module sub-board, comprising: a system motherboard, a module sub-board, a metal combination screw and a metal stud;
    所述系统母板包括信号输入端，并设置有多个间隔距离的第一通孔和第一焊盘，所述第一焊盘与所述信号输入端相连；The system motherboard includes a signal input end, and is provided with a plurality of first through holes and a first pad spaced apart from each other, and the first pad is connected to the signal input end;
    所述模块子板包括信号输出端，并设置有与所述系统母板对应的第二通孔和第二焊盘，所述第二焊盘与所述信号输出端相连；The module sub-board includes a signal output end, and is provided with a second through hole and a second pad corresponding to the system motherboard, and the second pad is connected to the signal output end;
    所述系统母板和所述模块子板通过至少两个金属组合螺钉和至少一个金属螺柱螺装固定，其中，第一金属组合螺钉与所述第一焊盘连接，穿过所述系统母板的第一通孔与所述金属螺柱的第一端螺装固定，设置为传输所述输入信号，第二金属组合螺钉与所述第二焊盘连接，穿过所述模块子板的第二通孔与所述金属螺柱的第二端螺装固定，设置为传输所述输出信号。The system motherboard and the module daughter board are screwed by at least two metal combination screws and at least one metal stud, wherein a first metal combination screw is connected to the first pad and passes through the system mother a first through hole of the plate is screwed to the first end of the metal stud, configured to transmit the input signal, and a second metal combination screw is connected to the second pad, passing through the module daughter board The second through hole is screwed to the second end of the metal stud and arranged to transmit the output signal.
  2. 根据权利要求1所述的装置，其中，所述金属组合螺钉包括螺头和螺杆，所述螺头与所述系统母板的第一焊盘或模块子板的第二焊盘螺装固定；所述螺杆穿过所述系统母板的第一通孔或模块子板的第二通孔与所述金属螺柱螺装固定。The apparatus according to claim 1, wherein said metal combination screw comprises a screw head and a screw thread, and said screw head is screwed to a first pad of said system motherboard or a second pad of said module daughter board; The screw is threadedly fixed to the metal stud through a first through hole of the system motherboard or a second through hole of the module sub-board.
  3. 根据权利要求1所述的装置，其中，所述第一焊盘和所述第二焊盘为星月孔焊盘，所述第一焊盘和所述第二焊盘的宽度大于所述金属组合螺钉和金属螺柱的宽度。The device of claim 1, wherein the first pad and the second pad are star-moon hole pads, and the first pad and the second pad have a width greater than the metal Combine the width of the screw and metal stud.
  4. 根据权利要求1所述的装置，其中，所述第一通孔和所述第二通孔的内表面镀有金属，所述第一通孔的宽度等于所述第二通孔的宽度，所述第一通孔位于所述第一焊盘的中心位置，所述第二通孔位于所述第二焊盘的中心位置。The device according to claim 1, wherein inner surfaces of the first through hole and the second through hole are plated with metal, and a width of the first through hole is equal to a width of the second through hole, The first via hole is located at a center position of the first pad, and the second via hole is located at a center position of the second pad.
  5. 根据权利要求4所述的装置，其中，当所述模块子板的截面积大于所述系统母板时，则在所述系统母板的四周设置第一通孔，设置为固定所述系统母板。The device according to claim 4, wherein when the sectional area of the module daughter board is larger than that of the system motherboard, a first through hole is disposed around the system motherboard, and is configured to fix the system mother board.
  6. 根据权利要求4所述的装置，其中，当所述模块子板的截面积小于所述系统母板时，则在所述模块子板的四周设置第二通孔，设置为固定所述 模块子板。The device according to claim 4, wherein when the sectional area of the module sub-board is smaller than the system motherboard, a second through hole is disposed around the module sub-board, and is configured to fix the Module daughter board.
  7. 根据权利要求1-6所述的任一项装置，其中，所述模块子板为电源子卡。A device according to any of claims 1-6, wherein the module daughter board is a power daughter card.
  8. 根据权利要求7所述的装置，其中，所述信号输入端包括：供电电源模块、电源前级处理模块和母板用电模块；The device according to claim 7, wherein the signal input terminal comprises: a power supply power module, a power pre-processing module, and a motherboard power module;
    所述供电电源模块设置为提供所述系统母板和模块子板所需要的第一电压信号；The power supply module is configured to provide a first voltage signal required by the system motherboard and the module daughter board;
    所述电源前级处理模块设置为处理供电电源模块提供的第一电压信号，发送第一电压信号和接地信号给所述模块子板；The power pre-processing module is configured to process the first voltage signal provided by the power supply module, and send the first voltage signal and the ground signal to the module daughter board;
    所述母板用电模块包括第二电压用电模块和第三电压用电模块，所述第二电压用电模块设置为接收所述信号输出端的第二电压转换模块发送的第二电压信号和接地信号，并发送控制信号给所述模块子板；所述第三电压用电模块设置为接收所述信号输出端的第三电压转换模块发送的第三电压信号和接地信号。The electrical module for the motherboard includes a second voltage power module and a third voltage power module, and the second voltage power module is configured to receive the second voltage signal sent by the second voltage conversion module of the signal output end and And grounding the signal, and sending a control signal to the module sub-board; the third voltage power module is configured to receive the third voltage signal and the ground signal sent by the third voltage conversion module of the signal output end.
  9. 根据权利要求8所述的装置，其中，所述信号输出端包括：第二电压转换模块和第三电压转换模块；The device according to claim 8, wherein the signal output terminal comprises: a second voltage conversion module and a third voltage conversion module;
    所述第二电压转换模块，设置为接收所述电源前级处理模块发送的第一电压信号，转换第一电压信号为第二电压信号，并发送所述第二电压信号和接地信号给所述第二电压用电模块；The second voltage conversion module is configured to receive a first voltage signal sent by the power pre-processing module, convert the first voltage signal into a second voltage signal, and send the second voltage signal and a ground signal to the a second voltage power module;
    所述第三电压转换模块，设置为接收所述电源前级处理模块发送的第一电压信号，转换第一电压信号为第三电压信号，并发送所述第三电压信号和接地信号给所述第三电压用电模块。 The third voltage conversion module is configured to receive a first voltage signal sent by the power pre-processing module, convert the first voltage signal into a third voltage signal, and send the third voltage signal and a ground signal to the The third voltage is an electrical module.
PCT/CN2016/083517 2015-10-20 2016-05-26 Signal connection apparatus for system mother board and module daughter board WO2016188453A1 (en)

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CN102509913A (en) * 2011-10-24 2012-06-20 聚信科技有限公司 Board to board connecting device and telecommunication equipment
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