CN109462375A - Power amplifier - Google Patents

Power amplifier Download PDF

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Publication number
CN109462375A
CN109462375A CN201811142548.4A CN201811142548A CN109462375A CN 109462375 A CN109462375 A CN 109462375A CN 201811142548 A CN201811142548 A CN 201811142548A CN 109462375 A CN109462375 A CN 109462375A
Authority
CN
China
Prior art keywords
power
intermediate frequency
module
data
power amplifier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201811142548.4A
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Chinese (zh)
Inventor
李国华
谢兰芬
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guangzhou Kaixin Communication System Co Ltd
Original Assignee
Guangzhou Kaixin Communication System Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Guangzhou Kaixin Communication System Co Ltd filed Critical Guangzhou Kaixin Communication System Co Ltd
Priority to CN201811142548.4A priority Critical patent/CN109462375A/en
Publication of CN109462375A publication Critical patent/CN109462375A/en
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03FAMPLIFIERS
    • H03F1/00Details of amplifiers with only discharge tubes, only semiconductor devices or only unspecified devices as amplifying elements
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007Casings
    • H05K9/002Casings with localised screening
    • H05K9/0022Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024Shield cases mounted on a PCB, e.g. cans or caps or conformal shields

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Transmitters (AREA)
  • Amplifiers (AREA)

Abstract

The present invention relates to a kind of power amplifiers, including cover board;Intermediate frequency change-over panel, intermediate frequency change-over panel are equipped with intermediate frequency conversion circuit module, uplink power amplification module and descending power amplification module;Power board, power board are equipped with feed circuit module, power amplifier module and predistortion circuit module;First barricade, intermediate frequency change-over panel are set to the side of the first barricade;Secondary shielding plate, power board are set to the side of secondary shielding plate;And base plate.Intermediate frequency change-over panel is integrated with intermediate frequency conversion circuit module, uplink power amplification module and descending power amplification module, power board is integrated with feed circuit module, power amplifier module and predistortion circuit module, over all Integration degree is high, reduces occupied space, while avoiding generating failure;In addition, the setting of the first barricade and secondary shielding plate, the first barricade and secondary shielding plate are used to avoid the signal interference between intermediate frequency change-over panel and power board, the operating accuracy of power amplifier is improved, reduces maintenance cost.

Description

Power amplifier
Technical field
The present invention relates to the integrated technology fields of power amplifier, more particularly to a kind of power amplifier.
Background technique
4G mobile communication technology (The fourth Generation Mobile Communication Technology) Continuous development, to reduce equipment investment and control operation cost propose requirements at the higher level, thus, also to the collection of power amplifier At changing, more stringent requirements are proposed with reduction in bulk.
The problems such as there are occupied spaces for conventional power amplifier greatly, high failure rate, installation and maintenance cost are high, Wu Faman The integrated demand for development with micromation of foot.
Summary of the invention
Based on this, it is necessary to provide a kind of power amplifier.The power amplifier, occupies little space, and failure rate is few, maintenance It is at low cost.
Its technical solution is as follows:
A kind of power amplifier, including cover board;Intermediate frequency change-over panel, intermediate frequency change-over panel are set to cover board, and intermediate frequency change-over panel is equipped with Intermediate frequency conversion circuit module, uplink power amplification module and descending power amplification module, intermediate frequency conversion circuit module and uplink function Rate amplification module is electrically connected with descending power amplification module;Power board, power board are equipped with feed circuit module, power amplifier Module and predistortion circuit module, power amplifier module and descending power amplification module are electrically connected, feed circuit module, power amplifier It is electrically connected two-by-two between circuit module and predistortion circuit module;First barricade, intermediate frequency change-over panel are set to the first barricade Side;Secondary shielding plate, power board are set to the side of secondary shielding plate, the other side of secondary shielding plate and the first barricade The other side is cooperatively connected;And base plate, the first barricade and secondary shielding plate are set to base plate.
Above-mentioned power amplifier, intermediate frequency change-over panel be integrated with intermediate frequency conversion circuit module, uplink power amplification module and under Row power amplifier module, power board are integrated with feed circuit module, power amplifier module and predistortion circuit module, over all Integration Degree is high, reduces occupied space, while avoiding generating failure;In addition, the setting of the first barricade and secondary shielding plate, the first shielding Plate and secondary shielding plate are used to avoid the signal interference between intermediate frequency change-over panel and power board, improve the work essence of power amplifier Degree reduces maintenance cost.
Technical solution is illustrated further below:
Power board is additionally provided with data monitoring module in one of the embodiments, and data monitoring module is for monitoring intermediate frequency The data of data, the generation of descending power amplification module that the data of conversion circuit module generation, uplink power amplification module generate, The data of data, the data that power amplifier module generates and the generation of predistortion circuit module that feed circuit module generates.
In one of the embodiments, the first barricade be the first shielding case, secondary shielding plate be secondary shielding cover, first Shielding case is equipped with the first docking section, and secondary shielding is covered with the second docking section, and the first docking section and the second docking section are correspondingly arranged.
Power amplifier further includes the Power Supply Assembly for power supply in one of the embodiments, during Power Supply Assembly is set to Frequency change-over panel or power board.
Intermediate frequency change-over panel is equipped with multiple Male head connectors in one of the embodiments,;Or intermediate frequency change-over panel is equipped with multiple Female connector.
Male head connector or female connector include uplink input interface, uplink in one of the embodiments, Road output interface, reference signal input interface, downlink local oscillator output interface, downlink input interface, downlink output connect Wherein at least one in mouth, feedback link input interface and feedback link output interface.
Power board is equipped with radiofrequency signal output interface in one of the embodiments,.
Intermediate frequency change-over panel is equipped with data and power connection in one of the embodiments, and power board is equipped with data and power supply Plug, data and power connection are correspondingly arranged with data and attaching plug.
Data and power connection are straight socket in one of the embodiments, and data and attaching plug are straight contact pin
Base plate includes aluminium alloy plate in one of the embodiments, and aluminium alloy plate is equipped with radiating groove or heat release hole.
Detailed description of the invention
Fig. 1 is the overall structure of the explosion figure of embodiment intermediate power amplifier;
Fig. 2 is the overall structure figure of Fig. 1 embodiment intermediate power amplifier;
Fig. 3 is the installation diagram of the cover board and intermediate frequency change-over panel in Fig. 1 embodiment;
Fig. 4 is the overall structure diagram of barricade in Fig. 1 embodiment;
Fig. 5 is the structural schematic diagram of secondary shielding cover in Fig. 4 embodiment;
Fig. 6 is the overall structure diagram of power board in Fig. 1 embodiment.
Attached drawing mark explanation:
100, cover board, 200, intermediate frequency change-over panel, 220, female connector, 230, data and power connection, 241, feedback link Road input interface, 242, feedback link output interface, 243, downlink input interface, 250, data and power interface, 300, Power board, 310, feed circuit module, 320, power amplifier module, 340, predistortion circuit module, 350, data and power supply are inserted Head, 361, downlink power amplifier output interface, 362, external power source interface, 363, radio frequency socket, the 410, first shielding case, 420, second Shielding case, 500, base plate.
Specific embodiment
The embodiment of the present invention is described in detail with reference to the accompanying drawing:
It should be noted that it can be directly in another element when alleged element is with another element " fixation " in text Above or there may also be elements placed in the middle.When an element is considered as with another element " connection ", it be can be directly It is connected to another element in succession or may be simultaneously present centering elements.On the contrary, when element is referred to as " directly existing " another element When "upper", intermediary element is not present.Term as used herein "vertical", "horizontal", "left" and "right" and similar table It states for illustrative purposes only, is not meant to be the only embodiment.
Unless otherwise defined, all technical and scientific terms used herein and belong to technical field of the invention The normally understood meaning of technical staff is identical.Term as used herein in the specification of the present invention is intended merely to description tool The purpose of the embodiment of body, it is not intended that in the limitation present invention.Term " and or " used herein includes one or more Any and all combinations of relevant listed item.
Embodiment as shown in Figures 1 to 6 provides a kind of power amplifier, including cover board 100;Intermediate frequency change-over panel 200, intermediate frequency change-over panel 200 be set to cover board 100, intermediate frequency change-over panel 200 be equipped with intermediate frequency conversion circuit module (not shown), on Row power amplifier module (not shown) and descending power amplification module (not shown), intermediate frequency conversion circuit module and upper Row power amplifier module is electrically connected with descending power amplification module;Power board 300, power board 300 are equipped with feed circuit mould Block 310, power amplifier module 320 and predistortion circuit module 340, power amplifier module 320 and descending power amplification module electricity Property connection, be electrically connected two-by-two between feed circuit module 310, power amplifier module 320 and predistortion circuit module 340;The One barricade, intermediate frequency change-over panel 200 are set to the side of the first barricade;Secondary shielding plate, power board 300 are set to secondary shielding plate Side, the other side of the other side of secondary shielding plate and the first barricade is cooperatively connected;And base plate 500, the first barricade Base plate is set to secondary shielding plate.
Intermediate frequency change-over panel 200 is integrated with intermediate frequency conversion circuit module, uplink power amplification module and descending power amplification mould Block, power board 300 are integrated with feed circuit module 310, power amplifier module 320 and predistortion circuit module 340, over all Integration Degree is high, reduces occupied space, while avoiding generating failure;In addition, the setting of the first barricade and secondary shielding plate, the first shielding Plate and secondary shielding plate are used to avoid the signal interference between intermediate frequency change-over panel 200 and power board 300, improve power amplifier Operating accuracy reduces maintenance cost.
Power amplifier unit circuit and monitoring unit, are electrically connected to by conventional power amplifier using external terminal and cable Together, this kind of mode due to terminal and cable it is more, be unfavorable for complete machine layout and reduce overall structure occupied space;Meanwhile also The problems such as being easy to appear incorrect link, cable knotting, is easy to increase failure rate, installs and safeguard also bothering;In addition, module Function is less.
The present embodiment is by collecting intermediate frequency conversion circuit module, uplink power amplification module and descending power amplification module At on intermediate frequency change-over panel 200, feed circuit module 310, power amplifier module 320 and predistortion circuit module are integrated in On power board 300, integrally-built occupied space is thus greatly reduced;It is arranged between intermediate frequency change-over panel 200 and power board 300 First barricade and secondary shielding plate avoid generating signal interference between intermediate frequency change-over panel 200 and power board 300, improve power The working performance of amplifier;And it is tested by -40 DEG C to+60 DEG C of environment temperature, and power amplifier operational excellence;Cover board 100, intermediate frequency change-over panel 200, power board 300, the first barricade, secondary shielding plate and base plate 500 are in integrated setting, are catered to Communication equipment miniaturization, integrated demand for development.
The setting of predistortion circuit module 340 is mentioned to make the signal in power amplifier input or export linearly The precision of data processing in high power amplifier, and then improve the service performance of entire power amplifier.
The setting of first barricade and secondary shielding plate forms double-layer shielding structure, makes power board 300 and intermediate frequency change-over panel Signal between 200, which will not generate, to be interfered with each other, and the overall operation precision of power amplifier is greatly improved, and improves product matter Amount.
It should be understood that those skilled in the art can according to actual needs, in intermediate frequency change-over panel 200 or power board 300 Upper integrally disposed other multiclass modules, to meet actual needs, which is not described herein again.
And it is as needed, between feed circuit module 310, power amplifier module 320 and predistortion circuit module 340 two-by-two Electric connection, which refers to, can carry out any connection between three, to meet actual needs, which is not described herein again.
Specifically, integrally disposed to have RF transmit-receive circuit module, intermediate frequency conversion circuit module, 310 and of feed circuit module Power amplifier module 320;Meanwhile being also compatible with digital pre-distortion technology (i.e. DPD:Digital Predistortion).
Embodiment as depicted in figs. 1 and 2, the side of intermediate frequency change-over panel 200 are installed on cover board 100, intermediate frequency change-over panel 200 other side is installed in the upside of the first barricade;
The downside of first barricade and the upside of secondary shielding plate are buckled to connection, and the upside of power board 300 is installed in second The downside of barricade;
The downside of power board 300 is installed on base plate 500, and the downside of secondary shielding plate is also fixed by connecting portion On base plate 500.
Certainly, cover board 100, intermediate frequency change-over panel 200, power board 300, the first barricade, secondary shielding plate and base plate 500 Between be coupled, those skilled in the art can be specifically arranged according to actual needs, such as be set as threaded hole and screw The form being coupled for another example is set as the form etc. of back-off clamping, and which is not described herein again.
In one embodiment, power board 300 is additionally provided with data monitoring module, and data monitoring module turns for monitoring intermediate frequency Change data that the data of circuit module generation, the data that uplink power amplification module generates, descending power amplification module generate, anti- The data of data, the data that power amplifier module 320 generates and the generation of predistortion circuit module that current feed circuit module 310 generates.
Data monitoring module is the needs of monitoring, with intermediate frequency conversion circuit module, uplink power amplification module, descending power Amplification module, feed circuit module 310, power amplifier module 320 and predistortion circuit module are electrically connected, data monitoring mould Block can be set as needed on intermediate frequency change-over panel 200 or power board 300, or being located at cover board 100 or base plate 500 can be with.
The effect of data monitoring module is whether the data in the entire power amplifier of monitoring are normal.
Embodiment as shown in Figure 1, Figure 4 and Figure 5, the first barricade are the first shielding case 410, and secondary shielding plate is second Shielding case 420, the first shielding case 410 are equipped with the first docking section, and secondary shielding cover 420 is equipped with the second docking section, the first docking section It is correspondingly connected with the second docking section.
As shown in Figure 4 and Figure 5, the back of the first shielding case 410 and the back of secondary shielding cover 420 link together, from And it is connect intermediate frequency change-over panel 200 and the housing side of the first shielding case 410, make the cover of power board 300 Yu secondary shielding cover 420 Shell side connects, and the space in housing is conducive to the heat dissipation of intermediate frequency change-over panel 200 and power board 300;At the same time it can also turn for intermediate frequency The electronic device changed on plate 200 or power board 300 provides installation space, not only guarantees to radiate, but also saves occupied space.
Further, multiple housing lists are equipped in the housing of the first shielding case 410 and in the housing of secondary shielding cover 420 The setting of member, these housing units not only increases radiating efficiency;And can correspond to according to actual needs intermediate frequency change-over panel 200 or Some specific electronic device on power board 300 meets actual needs, further mentions to provide corresponding fixing clearance Space-efficient, structure is more compact, meets the needs of miniaturization.
First shielding case 410 and secondary shielding cover 420 are all made of aluminum alloy material and are made, due to the first shielding case 410 and the setting of secondary shielding cover 420 play shielding, isolation and fixed intermediate frequency change-over panel so as to form double-layer shielding structure 200 and power board 300 effect.
In one embodiment, power amplifier further includes the Power Supply Assembly for power supply, and Power Supply Assembly turns set on intermediate frequency Change plate 200 or power board 300.
Power Supply Assembly is used to supply the electricity consumption of entire power amplifier.
Further, Power Supply Assembly can be self-powered, is also possible to external power supply, is had according to the actual needs Body setting, those skilled in the art, which can be used, can satisfy the prior art of requirement and is specifically arranged, and which is not described herein again.
It should be noted that power supply can be shared between intermediate frequency change-over panel 200 and power board 300, intermediate frequency change-over panel 200 Setting connects the power supply line of common electricity consumption between power board 300.
Such as Fig. 1 to Fig. 3, embodiment shown in fig. 6, intermediate frequency change-over panel 200 is equipped with multiple Male head connectors;Or intermediate frequency conversion Plate 200 is equipped with multiple female connectors 220.
The mode that Male head connector or female connector 220 or Male head connector and female connector 220 are respectively provided with, meets The setting that difference requires needs, and those skilled in the art can be configured as needed, and which is not described herein again.
Such as Fig. 1 to Fig. 3, embodiment shown in fig. 6, Male head connector or female connector 220 are inputted including uplink Interface, uplink output interface, reference signal input interface, downlink local oscillator output interface, downlink input interface 243, Wherein at least one in downlink output interface, feedback link input interface 241 and feedback link output interface 242.
As shown in Figure 1, intermediate frequency change-over panel 200 be equipped with feedback link output interface 242, downlink input interface 243, Feedback link input interface 241 and data and power interface 250 (provided herein be external data and power supply dual-purpose interface or Compound interface);Intermediate frequency change-over panel 200 is equipped with downlink power amplifier output interface 361 (namely radiofrequency signal output interface) and external Power interface 362 (provided herein is individual power interface).
Those skilled in the art can carry out specific each interface setting as needed, and which is not described herein again.
Embodiment as shown in FIG. 6, power board 300 are equipped with radiofrequency signal output interface.
The radiofrequency signal output interface namely downlink power amplifier output interface 361, those skilled in the art can set as needed Specific position is set, to meet the needs of radiofrequency signal docking and output.
Embodiment as shown in Figure 3 and Figure 6, intermediate frequency change-over panel 200 are equipped with data and power connection 230, and power board 300 is set There are data and attaching plug 350, data and power connection 230 are correspondingly arranged with data and attaching plug 350.
Data and power connection 230 and data and attaching plug 350 are correspondingly connected with, to meet data transmission and power supply simultaneously Demand further reduced structure occupied space compared to the mode that data connector and power connection is separately provided, meet miniature Change the demand of integrated development.
Further, data and power connection 230 are straight socket, and data and attaching plug 350 are straight contact pin.Docking It is convenient, can by between intermediate frequency change-over panel 200 and power board 300 data and power supply dock, meet actual function need It wants.
Further, data and power connection 230 are double straight socket, and data and attaching plug 350 are double straight Formula contact pin.
Certainly, it can be specifically arranged as needed here, be such as also possible to: the independent external power supply of intermediate frequency change-over panel 200, The also independent external power supply of power board 300, without the power supply between setting intermediate frequency change-over panel 200 and power board 300 to binding The data docking structure between intermediate frequency change-over panel 200 and power board 300 need to be only arranged in structure.
In one embodiment, base plate 500 includes aluminium alloy plate, and aluminium alloy plate is equipped with radiating groove or heat release hole.
The perfect heat-dissipating of aluminium alloy plate, radiating groove and heat release hole further improve heat-sinking capability, extend power amplification The service life of device.
Embodiment as shown in FIG. 6, power board 300 are additionally provided with radio frequency socket 363, to connect under intermediate frequency change-over panel 200 Line link output interface and feedback link input interface 241.
Further, there are two radio frequency socket 363 is set, radio frequency socket 363 is MCX radio frequency socket 363.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited In contradiction, all should be considered as described in this specification.
The embodiments described above only express several embodiments of the present invention, and the description thereof is more specific and detailed, but simultaneously It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to protection of the invention Range.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.

Claims (10)

1. a kind of power amplifier characterized by comprising
Cover board;
Intermediate frequency change-over panel, the intermediate frequency change-over panel be set to the cover board, the intermediate frequency change-over panel be equipped with intermediate frequency conversion circuit module, Uplink power amplification module and descending power amplification module, the intermediate frequency conversion circuit module and the uplink power amplification module It is electrically connected with the descending power amplification module;
Power board, the power board are equipped with feed circuit module, power amplifier module and predistortion circuit module, the power amplifier electricity Road module and the descending power amplification module are electrically connected, the feed circuit module, the power amplifier module and described It is electrically connected two-by-two between predistortion circuit module;
First barricade, the intermediate frequency change-over panel are set to the side of first barricade;
Secondary shielding plate, the power board are set to the side of the secondary shielding plate, the other side of the secondary shielding plate and institute The other side for stating the first barricade is cooperatively connected;And
Base plate, first barricade and the secondary shielding plate are set to the base plate.
2. power amplifier according to claim 1, which is characterized in that the power board is additionally provided with data monitoring module, The data monitoring module is used to monitor data, the uplink power amplification module production that the intermediate frequency conversion circuit module generates Data that data that raw data, the descending power amplification module generate, the feed circuit module generate, power amplifier electricity The data that the data and the predistortion circuit module that road module generates generate.
3. power amplifier according to claim 1, which is characterized in that first barricade is the first shielding case, institute Stating secondary shielding plate is secondary shielding cover, and first shielding case is equipped with the first docking section, and the secondary shielding is covered with second Docking section, first docking section and second docking section are correspondingly arranged.
4. power amplifier according to claim 3, which is characterized in that it further include the Power Supply Assembly for power supply, it is described Power Supply Assembly is set to the intermediate frequency change-over panel or the power board.
5. power amplifier according to claim 1, which is characterized in that the intermediate frequency change-over panel is connected equipped with multiple male connectors Device;Or the intermediate frequency change-over panel is equipped with multiple female connectors.
6. power amplifier according to claim 5, which is characterized in that the Male head connector or the female connector Including uplink input interface, uplink output interface, reference signal input interface, downlink local oscillator output interface, downlink In link input interface, downlink output interface, feedback link input interface and feedback link output interface wherein at least One.
7. power amplifier according to claim 1, which is characterized in that the power board is equipped with radiofrequency signal output and connects Mouthful.
8. power amplifier according to claim 1, which is characterized in that the intermediate frequency change-over panel is equipped with data and power supply connects Head, the power board are equipped with data and attaching plug, data and power connection is corresponding with the data and attaching plug sets It sets.
9. power amplifier according to claim 8, which is characterized in that the data and power connection are straight socket, The data and attaching plug are straight contact pin.
10. -9 described in any item power amplifiers according to claim 1, which is characterized in that the base plate includes aluminium alloy Plate, the aluminium alloy plate are equipped with radiating groove or heat release hole.
CN201811142548.4A 2018-09-28 2018-09-28 Power amplifier Pending CN109462375A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201811142548.4A CN109462375A (en) 2018-09-28 2018-09-28 Power amplifier

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201811142548.4A CN109462375A (en) 2018-09-28 2018-09-28 Power amplifier

Publications (1)

Publication Number Publication Date
CN109462375A true CN109462375A (en) 2019-03-12

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111567153A (en) * 2019-07-18 2020-08-21 深圳市大疆创新科技有限公司 Electronic equipment and manufacturing method thereof, unmanned aerial vehicle, remote controller and mobile terminal
TWI847457B (en) * 2022-10-13 2024-07-01 財團法人工業技術研究院 Combined power module

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101247108A (en) * 2008-03-24 2008-08-20 京信通信系统(中国)有限公司 Integrated digital predistortion power amplifier
CN201571056U (en) * 2009-12-25 2010-09-01 深圳市虹远通信有限责任公司 Radio frequency module for mobile communication
CN202121553U (en) * 2011-06-15 2012-01-18 京信通信系统(中国)有限公司 Integration signal amplification module
CN102570996A (en) * 2010-12-29 2012-07-11 佳律通信设备(上海)有限公司 Integrated power amplifier
CN204928761U (en) * 2015-08-17 2015-12-30 四川九洲电器集团有限责任公司 Power amplification subassembly and TR subassembly

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101247108A (en) * 2008-03-24 2008-08-20 京信通信系统(中国)有限公司 Integrated digital predistortion power amplifier
CN201571056U (en) * 2009-12-25 2010-09-01 深圳市虹远通信有限责任公司 Radio frequency module for mobile communication
CN102570996A (en) * 2010-12-29 2012-07-11 佳律通信设备(上海)有限公司 Integrated power amplifier
CN202121553U (en) * 2011-06-15 2012-01-18 京信通信系统(中国)有限公司 Integration signal amplification module
CN204928761U (en) * 2015-08-17 2015-12-30 四川九洲电器集团有限责任公司 Power amplification subassembly and TR subassembly

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111567153A (en) * 2019-07-18 2020-08-21 深圳市大疆创新科技有限公司 Electronic equipment and manufacturing method thereof, unmanned aerial vehicle, remote controller and mobile terminal
CN111567153B (en) * 2019-07-18 2021-12-28 深圳市大疆创新科技有限公司 Electronic equipment and manufacturing method thereof, unmanned aerial vehicle, remote controller and mobile terminal
TWI847457B (en) * 2022-10-13 2024-07-01 財團法人工業技術研究院 Combined power module

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Application publication date: 20190312

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