CN103762829A - Modularized multi-output power supply - Google Patents
Modularized multi-output power supply Download PDFInfo
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- CN103762829A CN103762829A CN201410000284.4A CN201410000284A CN103762829A CN 103762829 A CN103762829 A CN 103762829A CN 201410000284 A CN201410000284 A CN 201410000284A CN 103762829 A CN103762829 A CN 103762829A
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- component panel
- board
- equipment cabinets
- vertical component
- horizontal segment
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Abstract
The invention belongs to the technical field of development of aerospace electronic products and particularly relates to a modularized multi-output power supply. The technical scheme is that the modularized multi-output power supply comprises two or more output power modules (4) and a device chassis (5), wherein a printed circuit board of a power circuit is arranged on the inner surface of the panel of the vertical part of an installation board card (1) through a heat conductive pad (2), a circuit element of the power circuit is arranged on the inner surface of the panel of the horizontal part of the installation board card (1), and the printed circuit board is connected with the circuit element through a lead. The output power modules (4) are arranged in the device chassis (5), and positioning bosses (3) on the output power modules (4) are matched with rectangular bosses in the device chassis (5) and fixed through screws. The modularized multi-output power supply optimizes the structure of a circuit installation assembly, meets requirements of integration of the whole structure and achieves cooling of the power circuit and power elements.
Description
Technical field
The invention belongs to aerospace electron product development technical field, be specifically related to a kind of modularized multiple out-put supply.
Background technology
The development of avionics equipment is subject to the restriction of the environments for use such as vacuum environment, temperature environment, mechanics vibration environment, space radiation, when device structure designs, must contain the factor of each environment aspect; On the other hand, be subject to the restriction of weight and overall dimension, must strictly control again weight and overall dimension; Therefore must carry out rational layout and structural design to equipment cabinets inside, determine profile, version, internal circuit board component and the independent components and parts of installing of equipment, the connection of circuit etc.Space flight power-supply device is the basic guarantee of electronic device works on star, it is relatively simple for structure for simple single channel or double loop power supply, and the design of multiple power supplies product can be divided into whole design idea and modularized design thinking, wherein whole design idea circuit complexity, circuit connecting relation is many, adding many power components need to install on device structure casing, and integral layout is difficulty comparatively; Modular mentality of designing is conducive to the inheritance of product technology scheme, be convenient to manufacture, generally as preferred version, but how modular power circuit designs, and layout how to consider to take into account each designing requirement and environmental factor and Whole Equipment is very important.
Summary of the invention
The object of the invention is: under the prerequisite of the requirement of meeting spatial particular surroundings, take into full account manufacturing factor, optimized circuit installation component structure, meets the integrated needs of overall structure, meets the heat dissipation problem of power circuit and power component simultaneously.
Technical scheme of the present invention is: a kind of modularized multiple out-put supply, and it comprises: plural out-put supply module and equipment cabinets;
Out-put supply module comprises: power circuit, installation board and heat conductive pad, power circuit comprises: printed circuit board and circuit elements device, it is the vertical bending side plate structure of L-type that board is installed, the inner surface of its vertical component panel is the installed surface of printed circuit board, the inner surface of its horizontal component panel is the installed surface of circuit elements device, the outer surface of its vertical component panel is provided with positioning boss, positioning boss is divided into horizontal segment, vertically three sections of section and changeover portions, horizontal segment extends to the other end along one end level of vertical component panel, the lower surface of horizontal segment and the vertical component panel-shaped locating surface that meets at right angles, vertically section is positioned at one end of horizontal segment bearing of trend, vertically section is vertically extended downwards by the top margin of vertical component panel, vertically the bottom surface of section and the end face of vertical component panel are positioned at same plane, changeover portion is at horizontal segment with vertically between section, positioning boss is structure as a whole with installation clamp,
Equipment cabinets is rectangular box, its inner surface is along arranging on the length direction of casing equidistantly and the rectangular boss being parallel to each other, the length of rectangular boss is consistent with the positioning boss on installation board with segmentation, the horizontal segment of rectangular boss is positioned at the inner bottom surface of equipment cabinets, and vertically section and changeover portion are positioned at the medial surface of equipment cabinets;
Its annexation is: the printed circuit board of power circuit is installed on the inner surface of the vertical component panel that board is installed by heat conductive pad, and leave gap between the inner surface of horizontal component panel, the circuit elements device of power circuit is installed on the inner surface of the horizontal component panel that board is installed, and between printed circuit board and circuit elements device, by wire, is connected; Out-put supply module is installed in equipment cabinets, and the positioning boss on it matches with the rectangular boss in equipment cabinets by its right angle locating surface, and is fixed by screw.
The invention has the beneficial effects as follows: in (1) the present invention, single power module has adopted the structure of similar L-square both to solve the installation question of circuit board, power component, is convenient to debugging; By multi-plane structure, contact to increase contact area again simultaneously, solved the installation of power module after device interior is integrated and the problem of transmission of heat, be convenient to the high-density installation of product, reduced the volume and weight of equipment.
(2) the present invention utilizes the arrangement architecture of multiple power modules, and booster action has also been played in antagonism space radiation.
Accompanying drawing explanation
Fig. 1 is out-put supply module Facad structure schematic diagram in the present invention;
Fig. 2 is out-put supply module structure schematic diagram in the present invention
Fig. 3 is structural representation of the present invention;
Fig. 4 is the structural representation that in the present invention, mounting base contacts entirely with equipment cabinets base plate;
Wherein, 1-mounting base, 2-heat conductive pad, 3-positioning boss, 4-circuit elements device mounting board card, 5-equipment cabinets.
Embodiment
Referring to accompanying drawing 1, a kind of modularized multiple out-put supply, it comprises: out-put supply module 4 and equipment cabinets 5;
Referring to accompanying drawing 3,4, out-put supply module 4 comprises: power circuit, installation board 1 and heat conductive pad 2, power circuit comprises: printed circuit board and circuit elements device, it is the vertical bending side plate structure of L-type that board is installed, the inner surface of its vertical component panel is the installed surface of printed circuit board, the inner surface of its horizontal component panel is the installed surface of circuit elements device, the outer surface of its vertical component panel is provided with positioning boss 3, positioning boss 3 is divided into horizontal segment, vertically three sections of section and changeover portions, horizontal segment extends to the other end along one end level of vertical component panel, the lower surface of horizontal segment and the vertical component panel-shaped locating surface that meets at right angles, vertically section is positioned at one end of horizontal segment bearing of trend, vertically section is vertically extended downwards by the top margin of vertical component panel, vertically the bottom surface of section and the end face of vertical component panel are positioned at same plane, changeover portion is at horizontal segment with vertically between section, positioning boss 3 is structure as a whole with installation clamp 1,
Equipment cabinets 5 is rectangular box, its inner surface is along arranging on the length direction of casing equidistantly and the rectangular boss being parallel to each other, the length of rectangular boss is consistent with the positioning boss on installation board 1 with segmentation, the horizontal segment of rectangular boss is positioned at the inner bottom surface of equipment cabinets 5, and vertically section and changeover portion are positioned at the medial surface of equipment cabinets 5;
Its annexation is: the printed circuit board of power circuit is installed on the inner surface of the vertical component panel that board 1 is installed by heat conductive pad 2, and leave gap between the inner surface of horizontal component panel, the circuit elements device of power circuit is installed on the inner surface of the horizontal component panel that board 1 is installed, and between printed circuit board and circuit elements device, by wire, is connected.Conductor arrangement is in the printed circuit board of power circuit and the gap of horizontal component panel inner surface; Out-put supply module 4 is installed in equipment cabinets 5, and the positioning boss 3 on it matches with the rectangular boss in equipment cabinets 5 by its right angle locating surface, and is fixed by screw.
Lower-powered printed circuit board is transmitted to heat the vertical component panel of installing on board 1 by heat conductive pad 2, the rectifying tube that power consumption is larger, the heat of metal-oxide-semiconductor are directly by installing the horizontal component panel transmission heat radiation on board 1;
Referring to accompanying drawing 2, preferably, in order to increase the contact area of out-put supply module 4 and equipment cabinets 5 base plates, reduced thermal resistance, improved radiating efficiency, the horizontal plane of mounting base 1 can be designed to contact completely with the bottom surface of equipment cabinets 5, by contact-making surface, increased and better transmit heat radiation.
Claims (2)
1. a modularized multiple out-put supply, is characterized in that, it comprises: plural out-put supply module (4) and equipment cabinets (5);
Out-put supply module (4) comprising: power circuit, installation board (1) and heat conductive pad (2), power circuit comprises: printed circuit board and circuit elements device, it is the vertical bending side plate structure of L-type that board is installed, the inner surface of its vertical component panel is the installed surface of printed circuit board, the inner surface of its horizontal component panel is the installed surface of circuit elements device, the outer surface of its vertical component panel is provided with positioning boss (3), positioning boss (3) is divided into horizontal segment, vertically three sections of section and changeover portions, horizontal segment extends to the other end along one end level of vertical component panel, the lower surface of horizontal segment and the vertical component panel-shaped locating surface that meets at right angles, vertically section is positioned at one end of horizontal segment bearing of trend, vertically section is vertically extended downwards by the top margin of vertical component panel, vertically the bottom surface of section and the end face of vertical component panel are positioned at same plane, changeover portion is at horizontal segment with vertically between section, positioning boss (3) is structure as a whole with installation clamp (1),
Equipment cabinets (5) is rectangular box, its inner surface is along arranging on the length direction of casing equidistantly and the rectangular boss being parallel to each other, the length of rectangular boss is consistent with the positioning boss on installation board (1) with segmentation, the horizontal segment of rectangular boss is positioned at the inner bottom surface of equipment cabinets (5), and vertically section and changeover portion are positioned at the medial surface of equipment cabinets (5);
Its annexation is: the printed circuit board of power circuit is installed on the inner surface of the vertical component panel that board (1) is installed by heat conductive pad (2), and leave gap between the inner surface of horizontal component panel, the circuit elements device of power circuit is installed on the inner surface of the horizontal component panel that board (1) is installed, and between printed circuit board and circuit elements device, by wire, is connected; Out-put supply module (4) is installed in equipment cabinets (5), and the positioning boss (3) on it matches with the rectangular boss in equipment cabinets (5) by its right angle locating surface, and is fixed by screw.
2. a kind of modularized multiple out-put supply as claimed in claim 1, is characterized in that, the outer surface of described installation board (1) horizontal component panel contacts completely with the bottom surface of described equipment cabinets (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410000284.4A CN103762829B (en) | 2014-01-02 | 2014-01-02 | A kind of modularized multiple out-put supply |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410000284.4A CN103762829B (en) | 2014-01-02 | 2014-01-02 | A kind of modularized multiple out-put supply |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103762829A true CN103762829A (en) | 2014-04-30 |
| CN103762829B CN103762829B (en) | 2016-05-04 |
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| CN201410000284.4A Active CN103762829B (en) | 2014-01-02 | 2014-01-02 | A kind of modularized multiple out-put supply |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105764310A (en) * | 2016-04-29 | 2016-07-13 | 许继集团有限公司 | Relay protection device and functional plug-in thereof |
| CN107222990A (en) * | 2017-06-26 | 2017-09-29 | 上海空间电源研究所 | A kind of space battery management system unit |
| CN108366506A (en) * | 2018-01-31 | 2018-08-03 | 上海航天控制技术研究所 | A kind of modularization standalone architecture for spacecraft |
| CN114980504A (en) * | 2022-07-27 | 2022-08-30 | 之江实验室 | High-density power supply device for wafer-level processor |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102011085870A1 (en) * | 2011-11-07 | 2013-05-08 | Lenze Automation Gmbh | frequency converter |
| CN202550899U (en) * | 2012-05-09 | 2012-11-21 | 中国西电电气股份有限公司 | Inverter module and frequency converter speed regulation device provided with inverter module |
-
2014
- 2014-01-02 CN CN201410000284.4A patent/CN103762829B/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105764310A (en) * | 2016-04-29 | 2016-07-13 | 许继集团有限公司 | Relay protection device and functional plug-in thereof |
| CN107222990A (en) * | 2017-06-26 | 2017-09-29 | 上海空间电源研究所 | A kind of space battery management system unit |
| CN108366506A (en) * | 2018-01-31 | 2018-08-03 | 上海航天控制技术研究所 | A kind of modularization standalone architecture for spacecraft |
| CN108366506B (en) * | 2018-01-31 | 2020-11-20 | 上海航天控制技术研究所 | Modularized single machine structure for spacecraft |
| CN114980504A (en) * | 2022-07-27 | 2022-08-30 | 之江实验室 | High-density power supply device for wafer-level processor |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103762829B (en) | 2016-05-04 |
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