WO2016182805A1 - Blindages contre les interférences électromagnétiques comprenant des parois formées en place et/ou imprimées en 3d - Google Patents

Blindages contre les interférences électromagnétiques comprenant des parois formées en place et/ou imprimées en 3d Download PDF

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Publication number
WO2016182805A1
WO2016182805A1 PCT/US2016/030662 US2016030662W WO2016182805A1 WO 2016182805 A1 WO2016182805 A1 WO 2016182805A1 US 2016030662 W US2016030662 W US 2016030662W WO 2016182805 A1 WO2016182805 A1 WO 2016182805A1
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WO
WIPO (PCT)
Prior art keywords
walls
substrate
soft
shielding
shielding assembly
Prior art date
Application number
PCT/US2016/030662
Other languages
English (en)
Inventor
Kuo Chun CHAO
Yi-Shen Lin
Liu Ming YUEH
Original Assignee
Laird Technologies, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Laird Technologies, Inc. filed Critical Laird Technologies, Inc.
Publication of WO2016182805A1 publication Critical patent/WO2016182805A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0037—Housings with compartments containing a PCB, e.g. partitioning walls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0031—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields combining different shielding materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0032—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids

Definitions

  • the present disclosure generally relates to EMI shields including form-in- place and/or 3D printed walls and related methods.
  • EMI electromagnetic interference
  • RFID radio frequency interference
  • a common solution to ameliorate the effects of EMI RFI is through the use of shields capable of absorbing and/or reflecting and/or redirecting EMI energy. These shields are typically employed to localize EMI/RFI within its source, and to insulate other devices proximal to the EMI/RFI source.
  • EMI electromagnetic emissions and radio frequency from external sources and internal sources
  • shielding broadly includes and refers to mitigating (or limiting) EMI and/or RFI, such as by absorbing, reflecting, blocking, and/or redirecting the energy or some combination thereof so that it no longer interferes, for example, for government compliance and/or for internal functionality of the electronic component system.
  • a shielding assembly generally includes one or more soft and/or flexible walls dispensed and formed on a substrate. Also disclosed are exemplary methods relating to providing shielding for one or more components on a substrate. In an exemplary embodiment, a method generally includes 3D printing material and/or dispensing a form-in-place material onto a substrate to thereby form one or more walls on the substrate that are disposed generally about the one or more components.
  • FIG. 1 is a perspective view of an EMI shield according to an exemplary embodiment
  • FIG. 2 is a perspective view of an EMI shield cover according to an exemplary embodiment
  • FIG. 3 is a perspective view of a form-in-place process of dispensing shielding material according to an exemplary embodiment
  • FIG. 4 is a perspective view of a 3D printing process of dispensing shielding material according to an exemplary embodiment.
  • exemplary embodiments of electromagnetic (EMI) shields, shielding apparatus or assemblies that include one or more form-in-place and/or 3D printed portions.
  • exemplary embodiments may include one or more sidewalls, internal walls, fences, frames, etc. (hereinafter referred to generally as walls) that are made of soft and/or flexible material that is formed in place and/or 3D printed onto a substrate, etc.
  • Some embodiments may also include a cover, top, lid, upper surface, etc. (hereinafter referred to generally as a cover).
  • an EMI shield includes one or more soft and/or flexible form-in-place (FIP) walls. Additionally or alternatively, an EMI shield may include one or more soft and/or flexible walls produced by 3D printing. Materials from which soft and/or flexible walls may be made include, but are not necessarily limited to, silicone, elastomer materials, plastic materials, electrically-conductive fillers (e.g., silver, nickel, copper, graphite, aluminum, etc.), combinations thereof, etc.
  • a cover may include materials such as metal foil, tin- containing polyimide (PI) film, other EMI shielding film, electrically-conductive fabric (e.g., metal plated cloth, etc.), etc.
  • the cover may be made from a solderable film (e.g., tin/copper-plated polyimide film, other metal plated films, other solderable electrically-conductive films, etc.).
  • a substrate upon which walls are dispensed may serve as a cover when the walls are installed onto a second substrate, e.g., onto a printed circuit board (PCB), etc.
  • PCB printed circuit board
  • FIG. 1 illustrates an exemplary embodiment of an EMI shielding assembly or apparatus 100 according to aspects of the present disclosure.
  • the EMI shielding assembly 100 includes walls 108 extending from (e.g., attached to, integrally connected with, installed on, etc.) a substrate 112.
  • the substrate 112 may be, e.g., a printed circuit board (PCB) or other structure. Additionally or alternatively, the substrate 112 may be or include an electrically-conductive fabric and/or other material(s).
  • PCB printed circuit board
  • the shielding assembly 100 is configured for shielding one or more components that may be provided on the PCB substrate 112 within one or more interior or shielding enclosures cooperatively defined by the walls 108.
  • Components on the PCB substrate 112 may be positioned in different compartments such that the components are provided with EMI shielding by virtue of the EMI shielding compartments 116 inhibiting the ingress and/or egress of EMI into and/or out of each EMI shielding compartment 116.
  • the EMI shield may not include or may be free of interior walls, dividers, or partitions such that the sidewalls and cover of the EMI shield generally define a single interior space or compartment.
  • walls may be made from a form-in-place (FIP) material, such as silver/nickel filled silicone elastomer form-in-place material, nickel/graphite filled silicone elastomer form-in-place material, silver/aluminum filled silicone elastomer form-in-place material, silver/copper filled silicone elastomer form-in-place material, etc.
  • FEP form-in-place
  • the walls are made of silver/nickel filled silicone elastomer form-in-place (FIP) material.
  • the silver/nickel filled silicone elastomer FIP walls have the following physical properties: Shore A (ASTM D2240) hardness of about 60, a tensile elongation (ASTM D412) of about 110%, a tensile strength (ASTM D412) of about 192 pounds per square inch (psi), a compression set (ASTM D395) of about 15%, a compression deflection (with a bead size of about 0.62 mm height and about 0.7 mm width) at 20 percent compression of about 1.7 pounds per inch and at 40 percent compression of about 6.4 pounds per inch, an adhesion strength (Al) of about 180 Newtons per centimeter squared (N/cm ), an operating temperature range from about -50 degrees Celsius to about 125 degrees Celsius, and a UL rating of V0.
  • Shore A ASTM D2240
  • ASTM D412240 a tensile elongation
  • ASTM D412 tensile strength
  • psi pounds per square inch
  • the silver/nickel filled silicone elastomer FIP walls have a volume resistivity of about 0.005 ohm-centimeters and a shielding effectiveness of greater than 100 decibels (dB) for frequencies between 200 Megahertz (MHz) and 10 Gigahertz (GHz).
  • the curing conditions for the silver/nickel filled silicone elastomer FIP walls were 15 degrees Celsius to 40 degrees Celsius at 50% relative humidity. At 22 degrees Celsius and 50% relative humidity, the time before handling was about 1 hour and the time to a full or complete cure was about 24 hours.
  • Alternative embodiments may be configured differently, such that the FIP walls have different physical properties, electrical properties, and/or curing conditions than described above.
  • the walls are made of nickel/graphite filled silicone elastomer form-in-place (FIP) material.
  • the nickel/graphite filled silicone elastomer FIP walls have the following physical properties: Shore A (ASTM D2240) hardness of about 70, a compression set (ASTM D395) of about 15%, a compression deflection (with a bead size of about 0.6 mm height and about 0.7 mm width) at 20 percent compression of about 3.2 pounds per inch and at 40 percent compression of about 11.5 pounds per inch, an adhesion strength (Al) of greater than about 180 Newtons per centimeter squared (N/cm ), an operating temperature range from about -50 degrees Celsius to about 150 degrees Celsius, and a UL rating of V0.
  • the nickel/graphite filled silicone elastomer FIP walls have a volume resistivity of about 0.030 ohm-centimeters and a shielding effectiveness of greater than 90 decibels (dB) for frequencies between 200 Megahertz (MHz) and 10 Gigahertz (GHz).
  • the curing conditions for the nickel/graphite filled silicone elastomer FIP walls were a minimum temperature of 120 degrees Celsius and a 1 hour cure time at 125 degrees Celsius.
  • Alternative embodiments may be configured differently, such that the FIP walls have different physical properties, electrical properties, and/or curing conditions than described above.
  • the walls are made of silver/nickel filled silicone elastomer FIP material have the following physical properties: Shore A (ASTM D2240) hardness of about 65, a compression set (ASTM D395) of about 10%, an adhesion strength (Al) of about 200 Newtons per centimeter squared (N/cm ), an operating temperature range from about -50 degrees Celsius to about 125 degrees Celsius, and a UL rating of V0.
  • the silver/nickel filled silicone elastomer FIP walls have a volume resistivity of about 0.005 ohm-centimeters and a shielding effectiveness of greater than 100 decibels (dB) for frequencies between 200 Megahertz (MHz) and 10 Gigahertz (GHz).
  • the curing conditions for the silver/nickel filled silicone elastomer FIP walls were a minimum temperature of 120 degrees Celsius and a 1.5 hour cure time at 125 degrees Celsius.
  • Alternative embodiments may be configured differently, such that the FIP walls have different physical properties, electrical properties, and/or curing conditions than described above.
  • the walls are made of nickel/graphite filled silicone elastomer form-in-place (FIP) material.
  • the nickel/graphite filled silicone elastomer FIP walls have the following physical properties: Shore A (ASTM D2240) hardness of about 70, a tensile elongation (ASTM D412) of about 50%, a tensile strength (ASTM D412) of about 180 pounds per square inch (psi), a compression set (ASTM D395) of about 15%, a compression deflection (with a bead size of about 0.62 mm height and about 0.7 mm width) at 20 percent compression of about 1.5 pounds per inch and at 40 percent compression of about 7.9 pounds per inch, an adhesion strength (Al) of about 150 Newtons per centimeter squared (N/cm ), an operating temperature range from about -50 degrees Celsius to about 125 degrees Celsius, and a UL rating of V0.
  • the nickel/graphite filled silicone elastomer FIP walls have a volume resistivity of about 0.030 ohm- centimeters and a shielding effectiveness of greater than 100 decibels (dB) for frequencies between 200 Megahertz (MHz) and 10 Gigahertz (GHz).
  • the curing conditions for the nickel/graphite filled silicone elastomer FIP walls were 15 degrees Celsius to 40 degrees Celsius at 50% relative humidity. At 22 degrees Celsius and 50% relative humidity, the time before handling was about 1 hour and the time to a full or complete cure was about 24 hours.
  • Alternative embodiments may be configured differently, such that the FIP walls have different physical properties, electrical properties, and/or curing conditions than described above.
  • the walls are made of silver/aluminum filled silicone elastomer form-in-place (FIP) material.
  • the silver/aluminum filled silicone elastomer FIP walls have the following physical properties: Shore A (ASTM D2240) hardness of about 70, a tensile strength (ASTM D412) of about 1600 kilopascals (kPa), a tensile elongation (ASTM D412) of about 100%, a compression set (ASTM D395) of about 10%, a compression deflection (with a bead size of about 0.6 mm height and about 0.7 mm width) at 20 percent compression of about 2.3 pounds per inch and at 40 percent compression of about 10.5 pounds per inch, an adhesion strength (Al) of about 200 Newtons per centimeter squared (N/cm ), an operating temperature range from about -50 degrees Celsius to about 125 degrees Celsius, and a UL rating of V0.
  • Shore A ASTM D2240
  • the silver/aluminum filled silicone elastomer FIP walls have a volume resistivity of about 0.005 ohm-centimeters and a shielding effectiveness of greater than 90 decibels (dB) for frequencies between 200 Megahertz (MHz) and 10 Gigahertz (GHz).
  • the cure conditions for the silver/aluminum filled silicone elastomer FIP walls were a minimum temperature of 120 degrees Celsius and a 1 hour cure time at 125 degrees Celsius.
  • Alternative embodiments may be configured differently, such that the FIP walls have different physical properties, electrical properties, and/or curing conditions than described above.
  • the walls are made of silver/aluminum filled silicone elastomer form-in-place (FIP) material.
  • the silver/aluminum filled silicone elastomer FIP walls have the following physical properties: Shore A (ASTM D2240) hardness of about 60, a tensile strength (ASTM D412) of about 850 kilopascals (kPa), a tensile elongation (ASTM D412) of about 140%, a compression set (ASTM D395) of about 10%, a compression deflection (with a bead size of about 0.6 mm height and about 0.75 mm width) at 20 percent compression of about 1.9 pounds per inch and at 40 percent compression of about 8.3 pounds per inch, an adhesion strength (Al) of about 140 Newtons per centimeter squared (N/cm ), an operating temperature range from about -50 degrees Celsius to about 125 degrees Celsius, and a UL rating of V0.
  • Shore A ASTM D2240
  • the silver/aluminum filled silicone elastomer FIP walls have a volume resistivity of about 0.003 ohm-centimeters and a shielding effectiveness of greater than 90 decibels (dB) for frequencies between 200 Megahertz (MHz) and 10 Gigahertz (GHz).
  • the curing conditions for the silver/aluminum filled silicone elastomer FIP walls were 15 degrees Celsius to 40 degrees Celsius at 50% relative humidity. At 22 degrees Celsius and 50% relative humidity, the time before handling was about 1 hour and the time to a full or complete cure was about 24 hours.
  • Alternative embodiments may be configured differently, such that the FIP walls have different physical properties, electrical properties, and/or curing conditions than described above.
  • the walls are made of silver/copper filled silicone elastomer form-in-place (FIP) material.
  • the silver/copper filled silicone elastomer FIP walls have the following physical properties: Shore A (ASTM D2240) hardness of about 55, a tensile strength (ASTM D412) of about 1300 kilopascals (kPa), a tensile elongation (ASTM D412) of about 300%, a compression set (ASTM D395) of about 10%, a compression deflection (with a bead size of about 0.6 mm height and about 0.7 mm width) at 20 percent compression of about 1.2 pounds per inch and at 40 percent compression of about 5.2 pounds per inch, an adhesion strength (Al) of about 200 Newtons per centimeter squared (N/cm ), an operating temperature range from about -50 degrees Celsius to about 125 degrees Celsius, and a UL rating of V0.
  • Shore A ASTM D2240
  • a tensile strength AS
  • the silver/copper filled silicone elastomer FIP walls have a volume resistivity of about 0.002 ohm-centimeters and a shielding effectiveness of greater than 90 decibels (dB) for frequencies between 200 Megahertz (MHz) and 10 Gigahertz (GHz).
  • the curing conditions for the silver/copper filled silicone elastomer FIP walls were 15 degrees Celsius to 40 degrees Celsius at 50% relative humidity. At 22 degrees Celsius and 50% relative humidity, the time before handling was about 1 hour and the time to a full or complete cure was about 24 hours.
  • Alternative embodiments may be configured differently, such that the FIP walls have different physical properties, electrical properties, and/or curing conditions than described above.
  • wall(s) may be dispensed directly onto a substrate by three-dimensional printing, and one or more form-in-place gaskets may be dispensed onto the top surfaces of the wall(s).
  • a wall may have a thickness of 0.6 millimeters or less (e.g. , 0.5 millimeters, 0.4 millimeters, 0.3 millimeters, less than 0.3 millimeters, etc.).
  • a soft and/or flexible shield may be provided on a soft and/or flexible PCB.
  • FIG. 2 shows an example embodiment of a cover 120 that may be attached over the walls 108.
  • the cover 120 may be made of metal foil, electrically-conductive fabric (e.g. , metal plated cloth, etc.), solderable film, tin-containing polyimide (PI) film (e.g. , tin/copper- plated polyimide film, etc.), other EMI shielding films, other metal plated films, etc.
  • the cover 120 adheres directly to the walls 108.
  • the walls 108 are made of material that is sticky or adherent until cured, the wall material itself may be used as an adhesive for attaching the cover to the walls 108. In other embodiments, another or an additional adhesive may be used for attaching the cover to the walls 108.
  • the substrate 112 is made of an electrically-conductive fabric and/or other material(s) appropriate for providing a cover
  • the substrate 112 and attached walls 108 may be turned over and installed as a shield onto a second substrate (not shown), which may be a PCB.
  • the substrate 112 serves as a cover for the shielding assembly 100.
  • FIG. 1 illustrates the shielding assembly 100 having a particular shape
  • other exemplary embodiments may include shields and shielding assemblies having different configurations (e.g. , rectangular, circular, curved, triangular, irregular, other non- rectangular shapes, etc.).
  • the external overall height of the shielding assembly 100, cover 120, and walls 108 is less than one millimeter (mm) tall, although other sizes are possible in other embodiments.
  • the dimensions provided in this paragraph and elsewhere in this application are for the purpose of illustration only as other exemplary embodiments may have a different configuration, such as a different size (e.g. , larger or smaller) and/or a different shape (e.g. , non-rectangular, etc.), etc.
  • a method generally includes dispensing a form-in-place and/or 3D printing material onto a substrate to form walls configured to accommodate one or more components on or under the substrate.
  • Form-in-place dispensing is illustrated in FIG. 3, and dispensing by 3D printing is illustrated in FIG. 4.
  • the method includes dispensing the walls using one or more materials such as silicone, elastomer materials, plastic materials, electrically-conductive fillers (e.g., silver, nickel, copper, graphite, aluminum, etc.), etc.
  • the method includes dispensing walls on a PCB or other structure serving as a substrate.
  • Such a method also includes configuring the walls to accommodate one or more components on the substrate. After the walls have been dispensed, a cover may be attached directly to and over the walls. Such a method includes, e.g., attaching the cover while the material forming the walls is still curing. In other implementations, another or an additional adhesive may be used to attach the cover to the walls.
  • the method includes dispensing walls on a material that may be used as a cover for a shield.
  • walls may be dispensed onto metal foil, electrically-conductive fabric (e.g., metal plated cloth, etc.), solderable film, tin-containing polyimide (PI) film (e.g., tin/copper-plated polyimide film, etc.), other EMI shielding films, other metal plated films, etc.
  • the method also may include installing the walls and cover onto a second substrate, e.g., a PCB that supports the components under the cover.
  • a method generally includes dispensing a form- in-place and/or 3D printing material onto a substrate to form walls configured to accommodate one or more components on or under the substrate.
  • a soft and/or flexible electrically-conductive material may be 3D printed directly onto an electrically-conductive fabric to thereby form walls in place on the electrically-conductive fabric.
  • a soft and/or flexible electrically-conductive form-in-place material may be dispensed directly onto an electrically-conductive fabric to thereby form walls in place on the electrically-conductive fabric.
  • the electrically-conductive fabric with the form-in-place or 3D printed walls dispensed thereon may be used for providing EMI shielding to one or more components on a PCB or other substrate.
  • a method generally includes installing a shield to a substrate such that one or more components are disposed under the shield, where the shield includes one or more soft and/or flexible walls made of form-in-place material and/or 3D printing material. Installing the shield may include attaching a cover to the walls. In some other embodiments, the shield has a cover from which the walls depend and are configured for installation generally about the components on the substrate.
  • the EMI shield includes a cover, top, or upper surface and one or more walls.
  • the one or more walls may comprise a single wall, may comprise a plurality of walls that are separate or discrete from one other, and/or may comprise a plurality of walls that are connected with one another, etc.
  • Exemplary embodiments disclosed herein may provide one or more (but not necessarily any or all) of the following advantages over some existing board level EMI shields.
  • exemplary embodiments disclosed herein may be flexible and/or soft compared to conventional shielding made of rigid materials such as metal. Some example embodiments may provide similar or greater component clearance under the shield compared with standard fabricated shields. Example embodiments may weigh less and have lower heights than traditional shielding. Example embodiments may be provided at lower tooling costs compared to the costs of providing conventional board-level shielding. Various implementations make it possible to easily create complex wall configurations having heights less than one millimeter. Depending on materials used, exemplary embodiments of shielding walls disclosed herein may also be waterproof and/or humidity resistant.
  • EMI shields may provide features and/or allow scale and economy to match high volume electronics manufacturing.
  • Exemplary embodiments may have shielding effectiveness performance about the same as a conventional metal board level shield (BLS).
  • Exemplary embodiments may be able to withstand or pass solder reflow conditions.
  • Example embodiments are provided so that this disclosure will be thorough, and will fully convey the scope to those who are skilled in the art. Numerous specific details are set forth such as examples of specific components, devices, and methods, to provide a thorough understanding of embodiments of the present disclosure. It will be apparent to those skilled in the art that specific details need not be employed, that example embodiments may be embodied in many different forms, and that neither should be construed to limit the scope of the disclosure. In some example embodiments, well-known processes, well-known device structures, and well- known technologies are not described in detail.
  • parameter X may have a range of values from about A to about Z.
  • disclosure of two or more ranges of values for a parameter subsume all possible combination of ranges for the value that might be claimed using endpoints of the disclosed ranges.
  • parameter X is exemplified herein to have values in the range of 1 - 10, or 2 - 9, or 3 - 8, it is also envisioned that Parameter X may have other ranges of values including 1 - 9, 1 - 8, 1 - 3, 1 - 2, 2 - 10, 2 - 8, 2 - 3, 3 - 10, and 3 - 9.
  • first, second, third, etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. These terms may be only used to distinguish one element, component, region, layer or section from another region, layer or section. Terms such as “first,” “second,” and other numerical terms when used herein do not imply a sequence or order unless clearly indicated by the context. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the example embodiments.
  • Spatially relative terms such as “inner,” “outer,” “beneath”, “below”, “lower”, “above”, “upper” and the like, may be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. Spatially relative terms may be intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as “below” or “beneath” other elements or features would then be oriented “above” the other elements or features. Thus, the example term “below” can encompass both an orientation of above and below. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

Selon divers aspects, l'invention concerne des modes de réalisation donnés à titre d'exemple de blindages contre les interférences électromagnétiques (EMI), des ensembles de blindage et des procédés connexes. Dans un mode de réalisation donné à titre d'exemple, un ensemble de blindage comprend généralement une ou plusieurs parois souples et/ou flexibles distribuées et formées sur un substrat. L'invention concerne également des procédés donnés à titre d'exemple concernant la fourniture d'un blindage pour un ou plusieurs composants sur un substrat. Dans un mode de réalisation donné à titre d'exemple, un procédé comprend généralement un matériau d'impression en 3D et/ou la distribution d'un matériau formé en place sur un substrat pour ainsi former une ou plusieurs parois sur le substrat qui sont disposées généralement autour du ou des composants.
PCT/US2016/030662 2015-05-08 2016-05-04 Blindages contre les interférences électromagnétiques comprenant des parois formées en place et/ou imprimées en 3d WO2016182805A1 (fr)

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Cited By (1)

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Publication number Priority date Publication date Assignee Title
US11634599B2 (en) 2014-11-24 2023-04-25 Ppg Industries Ohio, Inc. Coreactive materials and methods for three-dimensional printing

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US20010028558A1 (en) * 2000-02-28 2001-10-11 Rapp Martin L. Method and apparatus for EMI shielding
US20020039658A1 (en) * 1995-01-20 2002-04-04 Bunyan Michael H. Form-in-place EMI gaskets
US20030173100A1 (en) * 2002-03-15 2003-09-18 Flaherty Brian F. Combination EMI shielding and environmental seal gasket construction
US20040020674A1 (en) * 2002-06-14 2004-02-05 Laird Technologies, Inc. Composite EMI shield
US20060260839A1 (en) * 2005-04-15 2006-11-23 Krohto Eric G Board level shielding module

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Publication number Priority date Publication date Assignee Title
US20020039658A1 (en) * 1995-01-20 2002-04-04 Bunyan Michael H. Form-in-place EMI gaskets
US20010028558A1 (en) * 2000-02-28 2001-10-11 Rapp Martin L. Method and apparatus for EMI shielding
US20030173100A1 (en) * 2002-03-15 2003-09-18 Flaherty Brian F. Combination EMI shielding and environmental seal gasket construction
US20040020674A1 (en) * 2002-06-14 2004-02-05 Laird Technologies, Inc. Composite EMI shield
US20060260839A1 (en) * 2005-04-15 2006-11-23 Krohto Eric G Board level shielding module

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11634599B2 (en) 2014-11-24 2023-04-25 Ppg Industries Ohio, Inc. Coreactive materials and methods for three-dimensional printing
US11920046B2 (en) 2014-11-24 2024-03-05 Ppg Industries Ohio, Inc. Coreactive materials and methods for three-dimensional printing

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TW201640999A (zh) 2016-11-16

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