WO2016182069A1 - Flexible base material, package member, and method for using pill management device - Google Patents

Flexible base material, package member, and method for using pill management device Download PDF

Info

Publication number
WO2016182069A1
WO2016182069A1 PCT/JP2016/064338 JP2016064338W WO2016182069A1 WO 2016182069 A1 WO2016182069 A1 WO 2016182069A1 JP 2016064338 W JP2016064338 W JP 2016064338W WO 2016182069 A1 WO2016182069 A1 WO 2016182069A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
terminal group
package body
circuit pattern
sheet
Prior art date
Application number
PCT/JP2016/064338
Other languages
French (fr)
Japanese (ja)
Inventor
寛子 高橋
佳代子 南條
毅彦 備前
Original Assignee
大日本印刷株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 大日本印刷株式会社 filed Critical 大日本印刷株式会社
Priority to JP2017518010A priority Critical patent/JP6274356B2/en
Publication of WO2016182069A1 publication Critical patent/WO2016182069A1/en

Links

Images

Classifications

    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61JCONTAINERS SPECIALLY ADAPTED FOR MEDICAL OR PHARMACEUTICAL PURPOSES; DEVICES OR METHODS SPECIALLY ADAPTED FOR BRINGING PHARMACEUTICAL PRODUCTS INTO PARTICULAR PHYSICAL OR ADMINISTERING FORMS; DEVICES FOR ADMINISTERING FOOD OR MEDICINES ORALLY; BABY COMFORTERS; DEVICES FOR RECEIVING SPITTLE
    • A61J1/00Containers specially adapted for medical or pharmaceutical purposes
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61JCONTAINERS SPECIALLY ADAPTED FOR MEDICAL OR PHARMACEUTICAL PURPOSES; DEVICES OR METHODS SPECIALLY ADAPTED FOR BRINGING PHARMACEUTICAL PRODUCTS INTO PARTICULAR PHYSICAL OR ADMINISTERING FORMS; DEVICES FOR ADMINISTERING FOOD OR MEDICINES ORALLY; BABY COMFORTERS; DEVICES FOR RECEIVING SPITTLE
    • A61J1/00Containers specially adapted for medical or pharmaceutical purposes
    • A61J1/03Containers specially adapted for medical or pharmaceutical purposes for pills or tablets
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61JCONTAINERS SPECIALLY ADAPTED FOR MEDICAL OR PHARMACEUTICAL PURPOSES; DEVICES OR METHODS SPECIALLY ADAPTED FOR BRINGING PHARMACEUTICAL PRODUCTS INTO PARTICULAR PHYSICAL OR ADMINISTERING FORMS; DEVICES FOR ADMINISTERING FOOD OR MEDICINES ORALLY; BABY COMFORTERS; DEVICES FOR RECEIVING SPITTLE
    • A61J7/00Devices for administering medicines orally, e.g. spoons; Pill counting devices; Arrangements for time indication or reminder for taking medicine
    • A61J7/02Pill counting devices
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits

Definitions

  • the present invention relates to a flexible substrate on which a conductive circuit pattern including a terminal group is formed, and more particularly to a flexible substrate and a package body having a function of protecting the terminal group. Moreover, this invention relates to the usage method of the tablet management apparatus using this flexible base material and package body.
  • a package with a module that stores a plurality of tablets and manages the usage status of the stored tablets is known (see Patent Document 1).
  • the package with a module shown in Patent Document 1 has a package body that accommodates a plurality of tablets, and a module body that accommodates electronic components is attached to the package body.
  • the removal information is detected by the conductive circuit pattern arranged on the package body, and sent from the conductive circuit pattern to the module body.
  • the package body described in Patent Document 1 is obtained by folding a flexible base material formed of a single sheet on which a conductive circuit pattern is formed into three parts in the longitudinal direction, and folding the folded flexible base material into tablets. It is obtained by sticking a molded sheet including a plurality of bulging portions for accommodating the bulge.
  • a package body obtained using such a flexible substrate can be efficiently produced in an industrial production process, and thus is expected to be widely spread.
  • the inventors of the present invention paid attention to the configuration in which the package body and the module body are separable.
  • the package body and the module body are configured to be separable, it is economical because only the package body can be exchanged and the module body can be used repeatedly.
  • the package body and the module body are configured to be separable, the package body and the module body are detachably connected between terminals, and a signal from the conductive circuit pattern arranged in the package body is stored in the module body. It is necessary to tell the parts. Therefore, the present inventors have come up with a configuration in which a terminal group exposed to the outside is formed on the conductive circuit pattern arranged in the package body, and the terminal group of the package body is connected to the terminal group of the module body. . However, if the terminal group disposed on the package body is exposed to the outside, the terminal group may be damaged or damaged by contact with other members during transportation or storage.
  • This invention is made in view of such a point, and it aims at providing the flexible base material which can protect the terminal group of an electroconductive circuit pattern. Moreover, this invention aims at providing the usage method of the tablet management apparatus using this flexible base material.
  • a first flexible base material includes a first substrate having a conductive circuit pattern including a terminal group formed on one surface thereof, and a second substrate connected to the first substrate via a bending assisting means.
  • a substrate, and The first substrate has an exposed area exposed from the second substrate in a folded state in which the first substrate is folded from the folding assisting unit and the second substrate is overlaid on the one surface.
  • the terminal group of the conductive circuit pattern is arranged in a region, A protective sheet configured separately from the first substrate and the second substrate covers the terminal group in the folded state.
  • the protective sheet may be detachably attached to the exposed region.
  • the protective sheet in the folded state, covers at least a part of a surface of the second substrate facing away from the first substrate and is on the surface. You may affix so that peeling is possible.
  • the protective sheet may include visual information regarding how to use the flexible base material.
  • a second flexible base material includes a first substrate having a conductive circuit pattern including a terminal group formed on one surface thereof, and a second substrate connected to the first substrate via a bending assisting means.
  • a substrate, and The first substrate has an exposed area exposed from the second substrate in a folded state in which the first substrate is folded from the folding assisting unit and the second substrate is overlaid on the one surface.
  • the terminal group of the conductive circuit pattern is arranged in a region, An extended protective piece capable of covering the terminal group in the folded state is connected to the first substrate.
  • the extension protection piece may be connected to the exposed region of the first substrate through a cutting assisting means.
  • a third flexible substrate includes a first substrate having a conductive circuit pattern including a terminal group formed on one surface thereof, and a second substrate connected to the first substrate via a bending assisting means.
  • a substrate, and The first substrate has an exposed region exposed from the second substrate in a state where the first substrate is folded from the folding assisting unit and the second substrate is overlaid on the one surface, and the exposed region is The terminal group of the conductive circuit pattern is disposed, An extended protective piece that covers the terminal group in the folded state is connected to the second substrate via a cutting assisting means.
  • the first substrate, the second substrate, and the extended protective piece may be obtained by partitioning a single sheet.
  • a cover sheet is provided that covers at least a part of a surface of the second substrate facing the side opposite to the first substrate in the folded state. May be.
  • the tablet management device includes a folded flexible base material having any one of the above characteristics, and a plurality of methods for joining tablets that are bonded to the flexible base material.
  • a module management unit, and a tablet management device comprising: Separating the protective sheet or the extended protective piece from the package body; The package body is held by sandwiching the region including the terminal group of the package body from which the protective sheet or the extended protection piece is separated between the first component and the second component of the module body. And connecting the terminal group of the package body to the module terminal group of the module body.
  • a package body includes a first substrate having a conductive circuit pattern including a terminal group formed on one surface thereof, and a second substrate connected to the first substrate via a bending assisting means,
  • the first substrate has an exposed region that is exposed from the second substrate in a folded state in which the first substrate is folded from the folding assisting unit and the second substrate is superimposed on the one surface.
  • the terminal group of the conductive circuit pattern is disposed in a region, and a protective sheet covers a flexible base material that covers the terminal group in the folded state, and the first substrate and the second substrate. And a molded sheet sandwiched therebetween.
  • a flexible base material according to the present invention is connected to the first substrate through a first folding assisting means and a first substrate on which one side of a conductive circuit pattern including a terminal group is formed.
  • the first substrate is folded from the first folding assisting means, the second substrate is superimposed on the one surface, and is folded from the second folding assisting means to be the first substrate or the second
  • the terminal group of the conductive circuit pattern is disposed in the exposed region, It is possible to cover the terminal group in the folded state. Extending the protection piece such that the first substrate and connected to the second substrate or the third substrate.
  • the package body according to the present invention is connected to the first substrate having a conductive circuit pattern including a terminal group formed on one surface thereof, and the first substrate via first folding assisting means, and is superimposed on the first substrate. And a second substrate connected to the first substrate or the second substrate via a second bending assisting means and a third substrate overlaid on the first substrate or the second substrate.
  • the third substrate In the folded state in which the third substrate is overlaid, at least the second group An extended protection piece having an exposed area exposed from the terminal area, wherein the terminal group of the conductive circuit pattern is disposed in the exposed area, and is capable of covering the terminal group in the folded state.
  • the first substrate, the second substrate, or the third substrate is connected.
  • the first substrate, the second substrate, the third substrate, and the extension protection piece are obtained by partitioning a single sheet.
  • a method for using a tablet management device includes the package body described above, and a first part and a second part that are pivotably connected, and the package is between the first part and the second part. And a module body that holds the body between the package body, the step of separating the extended protective piece from the package body, and the protective sheet or the extended protective piece. A region including the terminal group of the separated package body is sandwiched between the first component and the second component of the module body to hold the package body and to hold the terminal group of the package body. Connecting to the module terminal group of the module body.
  • the protective sheet or the extended protective piece covers the terminal group of the conductive circuit pattern in a state where the flexible substrate is folded.
  • the terminal group of a conductive circuit pattern can be protected, and the possibility that the terminal group will be damaged or damaged due to contact with other members during transportation or storage.
  • FIG. 1 is a perspective view showing a tablet management apparatus to which a flexible base material according to a first embodiment is applied.
  • FIG. 2 is a plan view of a package body constituting the tablet management apparatus shown in FIG.
  • FIG. 3 is a wiring diagram of the package body shown in FIG. 4 is a bottom view of the package body shown in FIG.
  • FIG. 5 is a perspective view showing a module body constituting the tablet management device shown in FIG. 1.
  • 6 is a plan view of the module body shown in FIG.
  • FIG. 7 is a cross-sectional view schematically showing a cross section of the module body along the line VII-VII shown in FIG. 5 in a state where the package body is arranged.
  • FIG. 8 is a block diagram for explaining an information processing device accommodated in a module body.
  • FIG. 9 is a bottom view showing a state where the protective sheet is peeled off from the package body shown in FIG.
  • FIG. 10 is a perspective view showing a state in which a new package body is mounted on a module body in the tablet management device shown in FIG.
  • FIG. 11 is a plan view from the front side in a state where the flexible base material constituting the package body shown in FIG. 2 is expanded.
  • 12 is a bottom view showing the flexible substrate shown in FIG.
  • FIG. 13 is a plan view showing a modification of the protective sheet constituting the flexible substrate shown in FIG.
  • FIG. 14 is a plan view for explaining visual information provided on the protective sheet shown in FIG. 13.
  • FIG. 15 is a plan view schematically showing a flexible base material according to the second embodiment.
  • 16 is a plan view showing the flexible base shown in FIG. 15 from the front side in an expanded state.
  • 17 is a bottom view showing the back side of the flexible base shown in FIG. 15 in an expanded state.
  • 18 is a plan view schematically showing a modification of the flexible substrate shown in FIG.
  • FIG. 19 is a plan view schematically showing another modification of the flexible substrate shown in FIG. 15.
  • FIG. 22 is a plan view showing the flexible base shown in FIG. 21 from the front side in a state where the flexible base is expanded.
  • FIG. 23 is a bottom view showing the flexible base material shown in FIG. 21 from the back side in an expanded state.
  • FIG. 24 is a plan view showing a package body constituting the tablet management device.
  • FIG. 25A is a development view showing the front side of the package body
  • FIG. 25B is a plan view showing a tablet sheet constituting the package body.
  • FIG. 26 is a developed view showing the back side of the package body.
  • FIG. 27 is a plan view showing a flexible base material composed of two substrates.
  • FIG. 1 is a perspective view showing the tablet management device 1 according to the first embodiment.
  • the tablet management device 1 shown in FIG. 1 is a package with a module that manages information related to the use of tablets.
  • the tablet management device 1 has a package body 2 that houses a plurality of tablets, and the package body 2 is mounted on a module body 5 that houses electronic components.
  • the removal information is detected by the conductive circuit pattern 15 (see FIG. 3) arranged on the package body 2 and sent from the conductive circuit pattern 15 to the module body 5. ing.
  • the package body 2 shown in FIG. 1 is detachably held by the module body 5.
  • the module body 5 can be used repeatedly by replacing the used package body 2 with a new package body 2, which is economical.
  • the package body 2 and the module body 5 are configured to be separable, the package body 2 and the module body 5 are connected to each other so as to be separable between terminals, and a signal from the conductive circuit pattern 15 arranged in the package body 2 is a module. It is necessary to convey to the electronic component housed in the body 5.
  • the conductive circuit pattern 15 disposed in the package body 2 includes the terminal group 17 exposed to the outside in order to connect to the terminal group 51 of the module body 5.
  • the terminal group 17 arranged on the package body 2 is exposed to the outside, the terminal group may be damaged or damaged by contact with other members during transportation or storage. Therefore, a protective sheet 45 (see FIG.
  • FIG. 2 is a plan view showing the package body 2.
  • the package body 2 includes a plurality of bulging portions 4a for accommodating tablets.
  • the plurality of bulging portions 4 a are two-dimensionally arranged in the package body 2.
  • two bulging portions 4a arranged in the width direction d1 of the package body 2 are arranged in five rows in the longitudinal direction d2 of the package body 2, and a total of ten bulging portions 4a are provided. ing.
  • Examples of the tablets accommodated in the bulging portion 4a include those used as pharmaceuticals and those used as health foods.
  • the tablet as a pharmaceutical is accommodated as a tablet.
  • a tablet is a concept including what can also be called a capsule or a tablet.
  • FIG. 2 is configured as a laminated structure. Specifically, it is formed by laminating a flexible base material 3 (see FIG. 1) on a molding base material 4 on which a plurality of bulging portions 4a are formed. By covering the bulging portion 4a with the flexible base material 3, an accommodation space 2a for accommodating the tablet is defined.
  • the flexible base material 3 is comprised by the folded single sheet
  • FIG. 3 shows a wiring diagram of the package body 2 shown in FIG.
  • the conductive circuit pattern 15 is arranged in the package body 2.
  • the conductive circuit pattern 15 is a circuit for detecting information obtained by taking out the tablet from the bulging portion 4a.
  • the wiring 16 forming the conductive circuit pattern 15 has a branch 16a that spans the portion of the package body 2 that covers each bulging portion 4a.
  • the branch 16a that spans the portion of the package body 2 that covers each bulging portion 4a is electrically connected to a terminal group 17 disposed in a region different from the region in which the plurality of bulging portions 4a are disposed. ing.
  • the terminal group 17 includes a plurality of terminals 17a arranged in the width direction d1 of the package body 2, and each terminal 17a is spanned over a portion of the package body 2 that covers the bulging portion 4a. It is connected to the branch 16a.
  • the portion of the branch 16a spanned over the portion of the flexible base material 3 covering the bulging portion 4a is broken.
  • the disconnected information is transmitted as an electrical signal to the terminal 17a corresponding to the wiring 16, so that the information that the tablet is taken out from the bulging portion 4a is detected.
  • FIG. 4 shows a bottom view of the terminal group 17 covered with the protective sheet 45.
  • the protective sheet 45 shown in FIG. 4 is attached to the package body 2 so as to cover the terminal group 17.
  • FIG. 5 shows a perspective view of the module body 5
  • FIG. 6 shows a plan view of the module body 5.
  • the module body 5 includes a first component 50 and a second component 60 that are pivotably connected.
  • an information processing device that processes information from the terminal group 17 is housed in the first component 50
  • the second component 60 is a cover that is pivotally supported by the first component 50. It is configured as a part.
  • the first component 50 is called a main body component
  • the second component 60 is called a cover component.
  • the cover part 60 is configured as a thin plate-like member, and is attached to the main body part 50 via the turning shaft 65.
  • a locking piece 61 is provided at the end of the cover component 60.
  • the module body 5 holds the package body 2 with the package body 2 sandwiched between the main body part 50 and the cover part 60 (see FIG. 1).
  • the package body 2 is sandwiched by operating the lock member 70 provided in the body component 50 in a state where the package body 2 is sandwiched between the body component 50 and the cover component 60. It has become.
  • the lock member 70 shown in FIG. 5 is pivotally attached to the end portion of the main body part 50 and includes a locking claw 71 at the tip thereof.
  • the cover part 60 can be locked to the main body part 50 by hooking (locking) the locking claw 71 of the lock member 70 on the locking piece 61 of the cover part 60.
  • the main body part 50 includes an inner surface 50a covered with a cover part 60 as shown in FIG.
  • a groove 50b extending in the first direction d3 is formed on the inner surface 50a of the main body component 50, and the module terminal group 51 is disposed in the groove 50b.
  • the module terminal group 51 is connected to the terminal group 17 in a state where the package body 2 is sandwiched between the module terminal group 51 and the cover component 60.
  • FIG. 7 is a cross-sectional view showing a state in which the module terminal group 51 is connected to the terminal group 17 of the package body 2.
  • the module terminal group 51 includes a plurality of terminals 51a arranged in a first direction d3 parallel to the longitudinal direction of the groove 50b, and each terminal 51a is connected to a corresponding terminal 17a of the package body 2.
  • the connection member 90 is connected. According to the connecting member 90, when the package body 2 is held by the module body 5 and pressed in the direction d4 in which the package body 2 and the main body component 50 face each other, the terminal group 17 and the module terminal group of the package body 2 51 can be made conductive. Due to the characteristics of the connection member 90, it is possible to compensate for positioning errors between the terminal group 17 and the module terminal group 51 of the package body 2 that may occur due to component accuracy and repeated use.
  • connection member 90 is an anisotropic conductive member.
  • anisotropic conductive member a type in which conductive particles are dispersed in an insulating resin layer made of an insulating resin material, or a type in which a plurality of carbon fibers are penetrated in the thickness direction of a silicone rubber sheet. And the like.
  • FIG. 8 is a block diagram showing the configuration of the information processing device 80 accommodated in the main body component 50.
  • the information processing device 80 is a thin-film device.
  • the information processing device 80 illustrated in FIG. 8 includes, for example, an ASIC (Application Specific Integrated Circuit) 81 mounted in the main body component 50, a crystal resonator 82, a button battery 83, and a speaker 84. .
  • ASIC Application Specific Integrated Circuit
  • the ASIC 81 is connected to the module terminal group 51 and receives the information that the tablet is taken out from the terminal group 17 of the package body 2 through the module terminal group 51.
  • the ASIC 81 stores the received information together with time information in time series, and performs wireless communication with a host computer (not shown) regarding the stored information. Examples of wireless communication performed by the ASIC 81 with the host computer include so-called NFC (Near Field Communication, proximity wireless communication) and Bluetooth (registered trademark) non-contact communication.
  • NFC Near Field Communication, proximity wireless communication
  • Bluetooth registered trademark
  • the information processing apparatus 80 since power can be transmitted and received in accordance with the standard, it is possible in principle to drive the information processing device 80 without a battery.
  • the information processing apparatus 80 according to the present embodiment also includes the speaker 84, and since the power consumption is relatively large, the button battery 83 is mounted.
  • the tablet management device 1 is used, for example, by a patient who is in the hospital. The user takes out and takes the tablets contained in the package body 2 after eating or at a fixed time. When the package body 2 is broken through to take out the tablet, the wiring 16 of the conductive circuit pattern 15 is disconnected, and the disconnected information is transmitted from the terminal group 17 as an electrical signal indicating the information that the tablet is taken out from the bulging portion 4a. It is transmitted to the module terminal group 51. Signals transmitted to the module terminal group 51 are processed by the information processing device 80.
  • FIG. 9 shows a state where the protective sheet 45 is peeled off from the package body 2
  • FIG. 10 shows a state where the package body 2 is mounted on the main body component 50.
  • the protective sheet 45 covering the terminal group 17 is peeled off from the package body 2 to expose the terminal group 17.
  • the terminal group 17 of the package body 2 is placed in the groove 50b in which the module terminal group 51 is disposed while the surface of the package body 2 on which the terminal group 17 is disposed is directed toward the main body component 50 side. Move closer.
  • the terminal group 17 contacts the connecting member 90 disposed in the groove 50b.
  • the connecting member 90 is pressed in the direction d4 in which the package body 2 and the main body part 50 face each other, and the terminal group 17 of the package body 2 and the module terminal The group 51 is electrically connected through the connection member 90.
  • FIG. 11 is a plan view from the front side in a state where the flexible base material 3 is expanded
  • FIG. 12 is a bottom view from the back side in a state where the flexible base material 3 is expanded.
  • the flexible substrate 3 shown in FIGS. 11 and 12 has a structure in which a single sheet 3a made of flexible paper or plastic is divided into three equal parts in the longitudinal direction.
  • the sheet 3a includes an upper substrate 30, a lower substrate 20, and a middle substrate 10 arranged in this order in the longitudinal direction ld of the sheet 3a.
  • the upper substrate 30 and the lower substrate 20 are connected via a bending auxiliary means 41, and the lower substrate 20 and the middle substrate 10 are connected via another bending auxiliary means 41.
  • 11 and 12 after folding the lower substrate 20 and the middle substrate 10 using the folding assisting means 41, the upper substrate 30 and the lower substrate 20 are folded using the folding assisting means 41.
  • the flexible substrate 3 is in the state shown in FIGS.
  • the upper substrate 30 forms a layer stacked on the uppermost side in the folded state C1 shown in FIG. As shown in FIG. 11, print information 31 as a cover of the package body 2 is printed on the front surface of the upper substrate 30. Further, the upper substrate 30 is provided with a plurality of drawing holes 32 for allowing the bulging portion 4a of the molding base 4 to pass therethrough.
  • the drawing holes 32 correspond to the arrangement of the bulging portions 4a, and two sets arranged in the longitudinal direction ld of the sheet 3a are arranged in five rows in the short direction sd perpendicular to the longitudinal direction ld of the sheet 3a, 10 are provided.
  • the middle substrate 10 as the first substrate is located between the lower substrate 20 and the upper substrate 30 in the folded state C1 shown in FIG.
  • a conductive circuit pattern 15 for detecting the information that the tablet is taken out from the bulging portion 4a is arranged on the inner surface 10b of the middle substrate 10 to be covered with the lower substrate 20 .
  • the conductive circuit pattern 15 arranged on the middle substrate 10 is covered with the lower substrate 20 that is overlaid, and is not observed by the user.
  • the middle substrate 10 is provided with a plurality of drawing cuts 18 having a connection corresponding to the shape of the bulging portion 4a.
  • the wiring 16 forming the conductive circuit pattern 15 includes a plurality of branches 16 a that traverse the region surrounded by the cutout 18 in the middle substrate 10. Accordingly, when the middle substrate 10 is pulled out along the pulling cut 18 to take out the tablet accommodated in the bulging portion 4a, the portion located in the pulling cut 18 in the branch 16a. Is to be broken.
  • the wiring 16 is electrically connected to the terminal group 17 disposed in a region different from the region where the plurality of cutouts 18 are disposed.
  • the terminal group 17 includes a plurality of terminals 17a arranged in the longitudinal direction ld of the sheet 3a, and the branches 16a of the wirings 16 spanned by the cutouts 18 for drawing out to the terminals 17a. Is connected.
  • the lower substrate 20 as the second substrate forms a layer stacked on the lowermost side in the folded state C1 shown in FIG.
  • the lower substrate 20 has a function of protecting the conductive circuit pattern 15 disposed on the middle substrate 10.
  • the lower substrate 20 is provided with a plurality of drawing cuts 21 having a connection corresponding to the shape of the bulging portion 4a.
  • the middle substrate 10 and the lower substrate 20 stacked on each other are heat-sealed, and the upper substrate 30 and the middle substrate 10 stacked on each other are heat-sealed. ing.
  • Each folding assist means 41 between the adjacent substrates 10, 20, 30 is a substrate at the position where the folding assist means 41 is provided when the two adjacent substrates 10, 20, 30 are bent. This is intended to promote that the substrates 10, 20, and 30 are folded and that the substrates 10, 20, and 30 are folded.
  • the bending assisting means 41 extends linearly along the short direction sd of the sheet 3a at a position that becomes a boundary between two adjacent substrates 10, 20, and 30.
  • the folding assist means 41 can be realized in a manner known per se.
  • the bending assisting means 41 may be a half-cut line composed of continuously formed grooves, or may be a broken line (perforation) formed intermittently.
  • the lengths of the three substrates 10, 20, and 30 along the longitudinal direction ld of the sheet 3a are set to be equal while the length along the short direction sd of the sheet 3a is set.
  • the length of the middle substrate 10 is longer than the lengths of the lower substrate 20 and the upper substrate 30 along the short direction sd of the sheet 3a.
  • the lower substrate 20 is folded from the folding assisting means 41 so as to cover the inner surface 10b (see FIG. 12) of the middle substrate 10 from the unfolded state shown in FIGS. Is folded from the folding assisting means 41 so as to cover the outer surface 10a (see FIG. 11) of the intermediate substrate 10, and the folded state C1 shown in FIG. 4 is obtained.
  • a portion protruding from the lower substrate 20 of the middle substrate 10 defines an exposed region 11 exposed from the lower substrate 20.
  • a terminal group 17 of the conductive circuit pattern 15 is arranged in the exposed region 11 protruding from the lower substrate 20 of the middle substrate 10.
  • a protective sheet 45 covering the exposed region 11 is attached to the exposed region 11.
  • the protective sheet 45 of the present embodiment covers the entire area of the exposed area 11, and the outline of the protective sheet 45 overlaps the outline of the exposed area 11.
  • the protective sheet 45 is detachably attached to the exposed region 11. In this case, when the protective sheet 45 is peeled from the exposed region 11, it is possible to suppress the adhesive component from being transferred to the exposed region 11.
  • the protective sheet 45 may be configured to be rejoinable to the exposed region 11 or may be configured to be non-rejoinable.
  • the material forming the protective sheet 45 is not particularly limited as long as the material has a function of protecting the terminal group 17 from damage.
  • Examples of the material forming the protective sheet 45 include thermoplastic resins such as polyethylene and polypropylene, and synthetic rubber such as silicon having excellent elasticity.
  • the protective sheet 45 has a thickness of about 60 ⁇ m to 200 ⁇ m.
  • the material forming the flexible substrate 3 is not particularly limited as long as it is a flexible material, but examples thereof include paper and resin.
  • the protection function by the protection sheet 45 is effectively exhibited by configuring the flexible substrate 3 and the protection sheet 45 with different materials.
  • the molded substrate 4 including a plurality of bulging portions 4a is attached to the flexible substrate 3 obtained from the single sheet 3a in this way.
  • the molding base 3 is sandwiched between the upper substrate 30 and the lower substrate 20, and the corresponding bulging portions 4 a of the molding base 4 protrude from the respective drawing holes 32 of the upper substrate 30. .
  • the package body 2 obtained in this way the package body 2 can be efficiently produced in an industrial production process.
  • the first substrate (middle substrate) 10 in which the conductive circuit pattern 15 including the terminal group 17 is formed on the one surface 10 b and the bending auxiliary means 41 are used to A second substrate (lower substrate) 20 connected to one substrate (middle substrate) 10, and the first substrate (middle substrate) 10 is folded from the folding assisting means 41 to be one surface (inner surface) 10 b.
  • the folded state C1 in which the second substrate (lower substrate) 20 is overlaid the exposed region 11 is exposed from the second substrate (lower substrate) 20, and the terminal of the conductive circuit pattern 15 is provided in the exposed region 11.
  • a protective sheet 45 made of a material different from that of the first substrate (middle substrate) 10 and the second substrate (lower substrate) 20 covers the terminal group 17 in the folded state C1. Yes. According to such a form, the terminal group 17 of the conductive circuit pattern 15 is protected, and the possibility that the terminal group 17 breaks or is damaged due to contact with other members during transportation or storage. be able to.
  • the protective sheet 45 is attached to the exposed region 11 in a peelable manner.
  • the protective sheet 45 when the protective sheet 45 is peeled from the exposed region 11, it is possible to suppress the adhesive component from being transferred to the exposed region 11. If the adhesive component is transferred to the exposed region 11, there is a possibility that the mounting failure of the package body 2 to the module body 5 may occur. Therefore, when the protective sheet 45 can be peeled off, the mounting failure of the package body 2 can be suppressed.
  • molding which is affixed on the flexible base material 3 of the folding state C1, and the flexible base material 3, and contains the several bulging part 4a for accommodating a tablet
  • a tablet management device comprising: How to use is provided.
  • FIG. 13 shows another example of the protective sheet 45.
  • the lower substrate 20 is folded from the folding assisting means 41 so as to cover the inner surface 10 b of the middle substrate 10.
  • a portion of the middle substrate 10 that is not covered by the lower substrate 20 defines an exposed region 11, and a protective sheet 45 is attached to the exposed region 11.
  • the protective sheet 45 covers at least a part of the surface 20 b of the lower substrate 20 facing the side opposite to the middle substrate 10.
  • the protective sheet 45 covers the entire surface 20 b facing the opposite side of the middle substrate 10 of the lower substrate 20.
  • the protective sheet 45 is detachably attached across the exposed region 11 of the middle substrate 10 and the surface 20b facing the opposite side of the middle substrate 10 of the lower substrate 20.
  • the lower substrate 20 is positioned between the middle substrate 10 and the protective sheet 45.
  • FIG. 14 is a plan view showing the protective sheet 45 shown in FIG. As shown in FIG. 14, the protective sheet 45 describes visual information 48 regarding how to use the flexible base material 3, that is, the tablet management device 1.
  • the visual information 48 shown in FIG. 14 displays information to be noted when the package body 2 is attached to the module body 5. According to such a form, it contributes to reducing mounting failure of the package body 2 to the module body 5.
  • the protective sheet 45 is placed on the opposite side of the second substrate (lower substrate) 20 from the first substrate (middle substrate) 10 in the folded state C1. It covers at least part of the facing surface 20b and is detachably attached to the surface 20b. According to such a form, the surface 20b of the second substrate (lower substrate) 20 facing the side opposite to the first substrate (middle substrate) 10 can be protected by the protective sheet 45.
  • the protective sheet 45 also covers the second substrate (lower substrate) 20, so that the second substrate It is possible to make it difficult to take out the tablet from the bulging portion 4a of the molding base 4 by breaking through the (lower substrate) 20.
  • making it difficult to take out the contents by the protective sheet 45 has a great advantage in that a child resistance function can be imparted to the flexible substrate 3.
  • the flexible base material 3 showed the example containing the three board
  • the flexible substrate 3 includes the first substrate 10 on which the conductive circuit pattern 15 including the terminal group 17 is formed, and the second substrate 20 connected to the first substrate 10 via the bending auxiliary means 41. As long as it is included, another substrate may be included as necessary, or two substrates 10 and 20 may be included as shown in FIG.
  • the flexible substrate 3 shown in FIG. 27 has a structure in which a single sheet 3a made of flexible paper or plastic is divided into two equal parts in the longitudinal direction.
  • the sheet 3a includes the lower substrate 20 and the middle substrate 10 arranged in this order in the longitudinal direction ld of the sheet 3a.
  • the lower substrate 20 and the middle substrate 10 are connected via a bending assist means 41.
  • the flexible base material 3 is in the state shown in FIGS.
  • a conductive circuit pattern 15 for detecting the information that the tablet is taken out from the bulging portion 4a is arranged on the inner surface 10b of the middle substrate 10 that is to be covered with the lower substrate 20 .
  • the conductive circuit pattern 15 arranged on the middle substrate 10 is covered with the lower substrate 20 that is overlaid, and is not observed by the user. Further, the middle substrate 10 is provided with a plurality of drawing cuts 18 having a connection corresponding to the shape of the bulging portion 4a.
  • the wiring 16 forming the conductive circuit pattern 15 includes a plurality of branches 16 a that traverse the region surrounded by the cutout 18 in the middle substrate 10. Accordingly, when the middle substrate 10 is pulled out along the pulling cut 18 to take out the tablet accommodated in the bulging portion 4a, the portion located in the pulling cut 18 in the branch 16a. Is to be broken.
  • the wiring 16 is electrically connected to the terminal group 17 disposed in a region different from the region where the plurality of cutouts 18 are disposed.
  • the terminal group 17 includes a plurality of terminals 17a arranged in the longitudinal direction ld of the sheet 3a, and the branch 16a of the wiring 16 spanned over the cutout 18 for each terminal 17a. Is connected.
  • the lower substrate 20 as the second substrate forms a layer stacked on the lowermost side in the folded state C1 shown in FIG.
  • the lower substrate 20 has a function of protecting the conductive circuit pattern 15 disposed on the middle substrate 10.
  • the lower substrate 20 is provided with an opening 21A corresponding to the shape of the bulging portion 4a.
  • the middle substrate 10 and the lower substrate 20 that are stacked on each other are heat-sealed.
  • Each folding auxiliary means 41 between the adjacent substrates 10 and 20 is arranged such that when the two adjacent substrates 10 and 20 are bent, the substrates 10 and 20 are located at the position where the bending auxiliary means 41 is provided. This is intended to facilitate folding and further folding the substrates 10 and 20.
  • the bending assisting means 41 extends linearly along the short direction sd of the sheet 3a at a position that is a boundary between two adjacent substrates 10 and 20.
  • the folding assist means 41 can be realized in a manner known per se.
  • the bending assisting means 41 may be a half-cut line composed of continuously formed grooves, or may be a broken line (perforation) formed intermittently.
  • the lengths of the two substrates 10 and 20 along the longitudinal direction ld of the sheet 3a are set equal, while the length of the middle substrate 10 along the lateral direction sd of the sheet 3a. This is longer than the length of the lower substrate 20 along the short direction sd of the sheet 3a.
  • the lower substrate 20 is folded from the folding assisting means 41 so as to cover the inner surface 10b (see FIG. 12) of the middle substrate 10 from the unfolded state shown in FIG. It will be in the folded state C1.
  • a portion protruding from the lower substrate 20 of the middle substrate 10 defines an exposed region 11 exposed from the lower substrate 20.
  • a terminal group 17 of the conductive circuit pattern 15 is arranged in the exposed region 11 protruding from the lower substrate 20 of the middle substrate 10.
  • a protective sheet 45 covering the exposed region 11 is attached to the exposed region 11.
  • the protective sheet 45 of the present embodiment covers the entire area of the exposed area 11, and the outline of the protective sheet 45 overlaps the outline of the exposed area 11.
  • the protective sheet 45 is detachably attached to the exposed region 11. In this case, when the protective sheet 45 is peeled from the exposed region 11, it is possible to suppress the adhesive component from being transferred to the exposed region 11.
  • the protective sheet 45 may be configured to be rejoinable to the exposed region 11 or may be configured to be non-rejoinable.
  • FIG. 15 is a plan view showing the flexible substrate 3 in the second embodiment
  • FIGS. 16 and 17 are plan views showing the flexible substrate 3 shown in FIG. 15 in an expanded state, respectively.
  • FIG. The second embodiment described with reference to FIGS. 15 to 17 is different in that an extended protection piece 46 is provided instead of the protection sheet 45, but the other configuration is the first embodiment. And it can comprise similarly to the modification.
  • the first embodiment described above and the parts thereof that can be configured in the same manner as the first embodiment described above and the modifications thereof are described.
  • the same reference numerals as those used for the corresponding parts in the modification are used, and redundant description is omitted.
  • the extended protective piece 46 is connected to the middle substrate 10.
  • the extension protection piece 46 is foldably connected to the exposed region 11 of the middle substrate 10. By folding the extension protection piece 46 with respect to the middle substrate 10, the terminal group 17 arranged in the exposed region 11 can be covered with the extension protection piece 46.
  • the extended protection piece 46 of the present embodiment covers the entire exposed area 11 so that the outline of the protective sheet 45 overlaps the outline of the exposed area 11.
  • the extension protection piece 46 is connected to the edge portion 10 c of the middle substrate 10 to which the lower substrate 20 is connected, and the short direction of the lower substrate 20 and the sheet 3 a. It is lined up in sd. However, the extension protection piece 46 is not connected to the lower substrate 20.
  • the extended protection piece 46 is connected to the middle substrate 10 via the cutting assisting means 42. That is, the extension protection piece 46 is connected so as to be separated from the middle substrate 10 along the cutting assisting means 42.
  • the cutting assisting means 42 extends linearly along the short direction sd of the sheet 3a at a position that becomes a boundary between the extended protection piece 46 and the middle substrate 10.
  • the cutting assisting means 42 is located at the position where the cutting assisting means 42 is provided when the extended protection piece 46 and the intermediate substrate 10 connected via the cutting assisting means 42 are separated from each other with the intention of cutting. This is to facilitate the separation of the extension protection piece 46 and the middle substrate 10.
  • This cutting assisting means 42 can be realized in a manner known per se.
  • the cutting assisting means 42 may be a perforation composed of cuts intermittently formed so as to penetrate the sheet 3a or a half cut line composed of grooves continuously formed in the sheet 3a. .
  • the extended protection piece 46 configured in this manner can be turned with respect to the exposed region 11 with the cutting assisting means 42 as a reference.
  • the extended protection piece 46 when the extended protection piece 46 is separated from the middle substrate 10 for the purpose of cutting, the extended protection piece 46 can be separated from the middle substrate 10 at the position where the cutting assisting means 42 is provided.
  • the extension protection piece 46 may be detachably joined to the exposed region 11 while covering the terminal group 17.
  • the middle substrate 10, the lower substrate 20, the upper substrate 30, and the extended protection piece 46 are obtained by partitioning a single sheet 3a. That is, the middle substrate 10, the lower substrate 20, the upper substrate 30, and the extended protection piece 46 are integrally formed.
  • the first substrate (middle substrate) 10 in which the conductive circuit pattern 15 including the terminal group 17 is formed on the one surface 10 b and the bending auxiliary means 41 are used to A second substrate (lower substrate) 20 connected to one substrate (middle substrate) 10, and the first substrate (middle substrate) 10 is folded from the folding assisting means 41 to be one surface (inner surface) 10 b.
  • the folded state C1 in which the second substrate (lower substrate) 20 is overlaid the exposed region 11 is exposed from the second substrate (lower substrate) 20, and the terminal of the conductive circuit pattern 15 is provided in the exposed region 11.
  • the group 17 is arranged, and the extended protection piece 46 capable of covering the terminal group 17 in the folded state C ⁇ b> 1 is connected to the first substrate (medium substrate) 10.
  • the second substrate (lower substrate) 20 is extended in a state where the second substrate (lower substrate) 20 is folded from the folding auxiliary means 41 so as to cover one surface (inner surface) 10 b of the first substrate (middle substrate) 10.
  • the protective piece 46 can cover the terminal group 17 of the conductive circuit pattern 15. Thereby, the terminal group 17 of the conductive circuit pattern 15 can be protected, and the possibility that the terminal group 17 may come into contact with other members during transportation or storage can be greatly reduced.
  • the extended protection piece 46 is connected to the exposed region 11 of the first substrate (medium substrate) 10 via the cutting assist means 42.
  • the extension protection piece 46 is separated from the first substrate (medium substrate) 10 along the cutting auxiliary means 42, so that the extension protection piece 46 interferes with the module body 5. Can be prevented. That is, from the viewpoint of workability for mounting the package body 2 to the module body 5, it is preferable that the extended protection piece 46 is connected to the exposed region 11 via the cutting assisting means 42.
  • the first substrate (middle substrate) 10, the second substrate (lower substrate) 20, and the extended protection piece 46 are obtained by partitioning a single sheet.
  • the flexible base material 3 can be efficiently produced in an industrial production process.
  • FIG. 18 shows an example in which a cover sheet 47 is further provided.
  • the lower substrate 20 is folded from the folding assisting means 41 so as to cover the inner surface 10 b of the middle substrate 10.
  • the cover sheet 47 covers at least a part of the surface 20b facing the side opposite to the middle substrate 10 of the lower substrate 20.
  • the lower substrate 20 is positioned between the middle substrate 10 and the protective sheet 45.
  • the cover sheet 47 covers the entire surface 20 b facing the side opposite to the middle substrate 10 of the lower substrate 20.
  • the cover sheet 47 is attached so as to be peelable across the exposed region 11 of the middle substrate 10 and the surface 20b facing the opposite side of the middle substrate 10 of the lower substrate 20.
  • cover sheet 47 shown in FIG. 18 can be configured using the same material as that of the protective sheet 45 described above.
  • the cover sheet 47 may include visual information 48 relating to the usage method of the flexible base material 3, that is, the tablet management device 1. According to such a form, it contributes to reducing mounting failure of the package body 2 to the module body 5.
  • the cover sheet 47 is placed on the opposite side of the second substrate (lower substrate) 20 from the first substrate (middle substrate) 10 in the folded state C1. It covers at least part of the facing surface 20b and is detachably attached to the surface 20b. According to such a form, the cover sheet 47 can protect the surface 20b of the second substrate (lower substrate) 20 facing the side opposite to the first substrate (middle substrate) 10.
  • the cover sheet 47 also covers the second substrate (lower substrate) 20, so that the second substrate It is possible to make it difficult to take out the tablet from the bulging portion 4a of the molding base 4 by breaking through the (lower substrate) 20.
  • making it difficult to take out the contents by the cover sheet 47 has a great advantage in that a child resistance function can be imparted to the flexible substrate 3.
  • a knob 49 may be further provided on the extended protection piece 46.
  • FIG. 19 shows an example in which a knob 49 is further provided on the extended protection piece 46.
  • a knob 49 is connected to the edge of the extended protection piece 46 opposite to the edge connected to the middle substrate 10. The knob 49 is exposed from the exposed region 11 in a state where the exposed region 11 is covered with the extended protection piece 46. For this reason, the extension protection piece 46 can be easily lifted from the exposure area 11 by picking and lifting the knob 49 in a state where the extension protection piece 46 covers the exposure area 11.
  • the cut 19 may be further provided in the exposed region 11 covered with the extended protection piece 46.
  • FIG. 20 shows an example in which a cut 19 is further provided in the exposed region 11.
  • a cut 19 is connected to the exposed region 11 of the middle substrate 10.
  • the cut 19 is covered with the extended protective piece 46 in a state where the exposed region 11 is covered with the extended protective piece 46.
  • the extension protection piece 46 can be easily lifted from the exposure area 11 by picking the extension protection piece 46 through the notch 19 in a state where the extension protection piece 46 covers the exposure area 11. .
  • FIGS. 16 and 17 the example in which the extension protection piece 46 is connected to the middle substrate 10 is shown.
  • the arrangement of the extension protection piece 46 is the example described above. It is not limited to.
  • FIG. 21 to FIG. 23 show other arrangement examples of the extended protection piece 46.
  • 21 is a plan view showing the flexible base material 3 in a folded state
  • FIGS. 22 and 23 are plan views showing the flexible base material 3 shown in FIG. 21 in an expanded state.
  • the extended protection piece 46 is connected to the lower substrate 20.
  • the extension protection piece 46 is foldably connected to the lower substrate 20 and is aligned with the exposed region 11 of the middle substrate 10 and the longitudinal direction ld of the sheet 3a.
  • the extended protection piece 46 is not connected to the middle substrate 10, and forms a gap between the middle protection substrate 10.
  • the extended protection piece 46 of the present embodiment covers the entire exposed region 11 in an expanded state, and the contour of the extended protective piece 46 can overlap the contour of the exposed region 11.
  • the extended protection piece 46 is connected to the lower substrate 20 via the cutting assisting means 42. That is, the extended protection piece 46 is connected so as to be able to be separated from the lower substrate 20 along the cutting assisting means 42.
  • the cutting assisting means 42 extends linearly along the longitudinal direction ld of the sheet 3 a at a position that becomes a boundary between the extended protection piece 46 and the lower substrate 20.
  • the extending protection piece 46 configured as described above can be swung with respect to the lower substrate 20 with the cutting assisting means 42 as a reference.
  • the extended protection piece 46 when the extended protection piece 46 is separated from the lower substrate 20 for the purpose of cutting, it can be separated from the lower substrate 20 at a position where the cutting assisting means 42 is provided.
  • the extension protection piece 46 may be detachably joined to the exposed region 11 while covering the terminal group 17.
  • the middle substrate 10, the lower substrate 20, the upper substrate 30, and the extended protection piece 46 are obtained by partitioning a single sheet 3a. That is, the middle substrate 10, the lower substrate 20, the upper substrate 30, and the extended protection piece 46 are integrally formed.
  • the first substrate (middle substrate) 10 in which the conductive circuit pattern 15 including the terminal group 17 is formed on the one surface 10 b and the bending auxiliary means 41 are used to A second substrate (lower substrate) 20 connected to one substrate (middle substrate) 10, and the first substrate (middle substrate) 10 is folded from the folding assisting means 41 and second on one surface 10 b.
  • the folded state C1 in which the substrate (lower substrate) 20 is overlaid the exposed region 11 is exposed from the second substrate (lower substrate) 20, and the terminal group 17 of the conductive circuit pattern 15 is provided in the exposed region 11.
  • An extended protection piece 46 that is disposed and can cover the terminal group 17 in the folded state C ⁇ b> 1 is connected to the second substrate (lower substrate) 20.
  • the extension protection piece 46 in the state where the second substrate (lower substrate) 20 is folded from the folding auxiliary means 41 so as to cover the one surface 10 b of the first substrate (middle substrate) 10, the extension protection piece 46.
  • the terminal group 17 of the conductive circuit pattern 15 can be covered.
  • the extension protection piece 46 is connected to the second substrate (lower substrate) 20 via the cutting assisting means 42. Before attaching the package body 2 to the module body 5, the extension protection piece 46 is separated from the second substrate (lower substrate) 20 along the cutting auxiliary means 42, so that the extension protection piece 46 interferes with the module body 5. Can be prevented. That is, from the viewpoint of workability for mounting the package body 2 to the module body 5, it is preferable that the extended protection piece 46 is connected to the exposed region 11 via the cutting assisting means 42.
  • the cover sheet 47 shown in FIG. 18 may be attached to the extended protection piece 46 shown in FIGS. That is, the cover sheet 47 covers at least a part of the surface 20b of the second substrate (lower substrate) 20 facing the side opposite to the first substrate (middle substrate) 10 in the folded state C1, and peels off the surface 20b. It may be pasted as possible. In this case, the cover sheet 47 can protect the surface 20b of the second substrate (lower substrate) 20 facing the side opposite to the first substrate (middle substrate) 10.
  • the cover sheet 47 also covers the second substrate (lower substrate) 20, so that the second substrate It is possible to make it difficult to take out the tablet from the bulging portion 4a of the molding base 4 by breaking through the (lower substrate) 20.
  • making it difficult to take out the contents by the cover sheet 47 has a great advantage in that a child resistance function can be imparted to the flexible substrate 3.
  • FIGS. 24 to 26 is different only in the configuration of the package body 2, and the other configurations are substantially the same as those of the embodiments shown in FIGS. 1 to 23.
  • FIG. 24 is a plan view showing the package body 2.
  • the package body 2 includes a flexible substrate 3 having a housing region 110 including a package circuit 113 and a mounting region 120 including a package terminal group 121 described later connected to the housing region 110.
  • Examples of the tablet M accommodated in the molded sheet 111A include those used as pharmaceuticals and those used as health foods.
  • the tablet M as a pharmaceutical is accommodated as a tablet.
  • a tablet is a concept including what can also be called a capsule or a tablet.
  • the flexible base 3 constituting the package body 2 is superimposed on the first substrate 106 on which the package terminal group 121 and the package circuit 113 connected to the package terminal group 121 are formed.
  • a laminated structure having a second substrate 107 and a third substrate 109 overlaid on the second substrate 107 (see FIGS. 25A and 25B and FIG. 26).
  • the first substrate 106 and the second substrate 107 are connected via the first folding assisting means 103A
  • the first substrate 106 and the third substrate 109 are connected via the second folding assisting means 103B.
  • the package terminal group 121 and the package circuit 113 constitute a conductive circuit pattern.
  • the first substrate 106 is formed with ten break regions 106b surrounded by the break line 106a and corresponding to the bulging portion 111, and the package circuit 113 has a plurality of branches 113a passing over the break region 106b.
  • the second substrate 107 is formed with ten fracture regions 107b surrounded by the fracture line 107a and corresponding to the bulging portion 111. Further, an extension protection piece 108 for protecting the package terminal group 121 formed on the first substrate 106 is attached to the second substrate 107.
  • the extension protection piece 108 functions as an extension protection piece for protecting the package terminal group 121, and is connected to the second substrate 107 via the cutting assisting means 103C. Further, knobs 108 a and 108 a used for peeling the extended protective piece 108 from the first substrate 106 are attached to both end edges of the extended protective piece 108.
  • ten openings 109 a are formed in the third substrate 109 corresponding to the bulging portions 111.
  • a molded sheet 111A (see FIG. 25 (b)) in which a bulging portion 111 for storing the tablet M is formed is inserted.
  • the second substrate 107 of the flexible base material 3 having such a configuration is superimposed on the first substrate 106, and the second substrate 107 is superimposed on the second substrate 107.
  • the package body 2 is obtained by placing the molded sheet 111A and then superimposing the third substrate 109 on the molded sheet 111A.
  • the package circuit 113 is disposed in the accommodation region 110 of the flexible base material 3.
  • the package circuit 113 is a circuit for detecting information that the tablet has been taken out from the bulging portion 111.
  • the package circuit 113 is connected to a package terminal group 121 arranged in the attachment region 120.
  • the package circuit 113 includes a plurality of branches 113a spanning the fracture region 106b of the first substrate 106 of the flexible base 3, and the package terminal group 121 is flexible. A plurality of terminals 121 a arranged in the width direction wd of the base material 3 are included. Each terminal 121 a of the package terminal group 121 is connected to a branch 113 a of the corresponding package circuit 113. In this case, when the fracture region 106b of the first substrate 106 is pierced to take out the tablet, the branch 113a that spans the portion of the first substrate 106 that covers the bulging portion 111 is disconnected.
  • the disconnected information is transmitted as an electrical signal to the corresponding terminal 121a of the package terminal group 121, so that the information that the tablet is taken out from the bulging portion 111 is detected.
  • the attachment region 120 of the flexible base material 3 is provided with a notch 122 that is shifted to the left from the center line L of the flexible base material 3.
  • Such a package body 2 is detachably mounted on the module body 5.
  • the flexible base material 3 with a notch 122 shifted to the left from the center line L, the orientation of the front and back of the package body 2 is correctly determined and inserted into the module body 5 (see FIG. 1). Can do.
  • the extended protection piece 108 is connected to the second substrate 107 through the cutting auxiliary means 103C. That is, the extended protection piece 108 is connected so as to be detachable from the second substrate 107 along the cutting assisting means 103C.
  • the cutting assisting means 103 ⁇ / b> C extends linearly at a position that becomes a boundary between the extended protection piece 108 and the second substrate 107.
  • the cutting assistance means 103C is located at the position where the cutting assistance means 103C is provided when the extension protection piece 108 and the second substrate 107 connected via the cutting assistance means 103C are separated from each other for the purpose of cutting. This is to facilitate the separation of the extended protection piece 108 and the second substrate 107.
  • This cutting assisting means 103C can be realized in a manner known per se.
  • the cutting assisting means 103C may be a perforation that is formed intermittently so as to penetrate the sheet 3a, or a half-cut line that is formed by a groove formed continuously in the sheet 3a. .
  • the extended protection piece 108 configured in this manner can be swung with respect to the exposed region 3A of the flexible base material 3 with reference to the cutting assisting means 103C.
  • the extended protection piece 108 is separated from the flexible base material 3 by picking the knob 108a with the intention of cutting, the extended protection piece 108 is removed at the position where the cutting auxiliary means 103C is provided. It can be separated from the two substrates 107.
  • the extension protection piece 108 may be detachably joined to the exposed region 3 ⁇ / b> A while covering the package terminal group 121.
  • the first substrate 106, the second substrate 107, the third substrate 109, and the extended protection piece 108 are obtained by partitioning a single sheet 3a. That is, the first substrate 106, the second substrate 107, the third substrate 109, and the extension protection piece 108 are integrally formed.
  • a flexible substrate 3 including a connected second substrate 107 and a third substrate 109 connected to the first substrate 106 via the second bending assisting means 103B is prepared.
  • the second substrate 107 is folded on the first substrate 106, the molded sheet 111 is placed on the second substrate 107, and then the third substrate 109 is folded on the second substrate 107 via the molded sheet 111.
  • a folded state C1 is formed.
  • the first substrate 106 of the flexible base 3 has an exposed region 3A exposed from the second substrate 107 and the third substrate 109, and a conductive circuit pattern package in the exposed region 3A.
  • a terminal group 121 is disposed, and an extended protective piece 108 that can cover the package terminal group 121 in the folded state C ⁇ b> 1 is connected to the second substrate 107.
  • the extended protection piece 108 can cover the package terminal group 121 of the conductive circuit pattern in a state where the first substrate 106, the second substrate 107, and the third substrate 109 are folded.
  • the package terminal group 121 of the conductive circuit pattern can be protected, and the possibility that the package terminal group 121 comes into contact with other members during transportation or storage can be greatly reduced.
  • the extended protection piece 108 is connected to the second substrate 107 via the cutting assisting means 103C.
  • the extension protection piece 108 is separated from the second substrate 107 along the cutting assisting means 103C to prevent the extension protection piece 108 from interfering with the module body 5. can do. That is, from the viewpoint of workability for mounting the package body 2 on the module body 5, it is preferable that the extended protection piece 108 is connected via the cutting assisting means 103C.
  • the first substrate 106, the second substrate 107, the third substrate 109, and the extended protection piece 108 are obtained by partitioning a single sheet.
  • the flexible base material 3 can be efficiently produced in an industrial production process.

Landscapes

  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Animal Behavior & Ethology (AREA)
  • General Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Veterinary Medicine (AREA)
  • Pharmacology & Pharmacy (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Packages (AREA)
  • Medical Preparation Storing Or Oral Administration Devices (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

A flexible base material is provided with: a first substrate, that is a middle substrate (10), on one surface (10b) of which an electrically conductive circuit pattern (15) including a terminal group (17) is formed; and a second substrate, that is a lower substrate (20), which is connected to the first substrate (10) by way of a bend assisting means (41). The first substrate (10) includes an exposed region (11) which is exposed from the second substrate (20) when the first substrate (10) has been folded at the bend assisting means (41) with the second substrate (20) overlaid on the one surface (10b), and the terminal group (17) of the conductive circuit pattern (15) is disposed in the exposed region (11). A protection sheet (45) covers the terminal group (17) when the second substrate (20) has been folded at the bending assist means (41).

Description

可撓性基材、パッケージ体および錠剤管理装置の使用方法Method for using flexible substrate, package body and tablet management device
 本発明は、端子群を含む導電回路パターンが形成された可撓性基材に係り、とりわけ、この端子群を保護する機能をもつ可撓性基材およびパッケージ体に関する。また、本発明は、この可撓性基材およびパッケージ体を利用した錠剤管理装置の使用方法に関する。 The present invention relates to a flexible substrate on which a conductive circuit pattern including a terminal group is formed, and more particularly to a flexible substrate and a package body having a function of protecting the terminal group. Moreover, this invention relates to the usage method of the tablet management apparatus using this flexible base material and package body.
 錠剤管理装置の一例として、複数の錠剤を収容し、収容した錠剤の利用状況を管理するモジュール付パッケージが知られている(特許文献1参照)。例えば、特許文献1に示すモジュール付パッケージでは、複数の錠剤を収容するパッケージ体を有し、このパッケージ体に、電子部品を収容するモジュール体が装着されている。パッケージ体から錠剤が取り出されると、この取り出しの情報がパッケージ体に配置された導電回路パターンにて検出され、導電回路パターンからモジュール体に送られるようになっている。錠剤の取り出しの情報を管理することにより、服用による治療効果を期待された通りに得ることに大きく貢献する。 As an example of a tablet management device, a package with a module that stores a plurality of tablets and manages the usage status of the stored tablets is known (see Patent Document 1). For example, the package with a module shown in Patent Document 1 has a package body that accommodates a plurality of tablets, and a module body that accommodates electronic components is attached to the package body. When the tablet is taken out from the package body, the removal information is detected by the conductive circuit pattern arranged on the package body, and sent from the conductive circuit pattern to the module body. By managing the information of taking out tablets, it greatly contributes to obtaining therapeutic effects as expected.
 特許文献1に記載のパッケージ体は、導電回路パターンが形成された単一のシートからなる可撓性基材を長手方向に三等分して折り畳み、折り畳まれた可撓性基材に、錠剤を収容するための複数の膨出部を含む成形シートを貼り付けることで得られる。このような可撓性基材を用いて得られるパッケージ体は、工業的な生産過程で効率よく作製することができるため、広く普及することが期待されている。 The package body described in Patent Document 1 is obtained by folding a flexible base material formed of a single sheet on which a conductive circuit pattern is formed into three parts in the longitudinal direction, and folding the folded flexible base material into tablets. It is obtained by sticking a molded sheet including a plurality of bulging portions for accommodating the bulge. A package body obtained using such a flexible substrate can be efficiently produced in an industrial production process, and thus is expected to be widely spread.
 しかしながら、特許文献1に示すモジュール付パッケージは、パッケージ体とモジュール体とが一体になっている。このため、錠剤がなくなるとモジュール体ごと廃棄せねばならなく、経済的ではない。 However, in the package with a module shown in Patent Document 1, the package body and the module body are integrated. For this reason, when there is no tablet, the entire module must be discarded, which is not economical.
特許第5074193号Patent No. 5074193
 そこで、本件発明者らは、パッケージ体とモジュール体とを分離可能に構成することに着目した。パッケージ体とモジュール体とを分離可能に構成した場合、パッケージ体のみを交換しモジュール体を繰り返し使用することができるため、経済的である。 Therefore, the inventors of the present invention paid attention to the configuration in which the package body and the module body are separable. When the package body and the module body are configured to be separable, it is economical because only the package body can be exchanged and the module body can be used repeatedly.
 パッケージ体とモジュール体とを分離可能に構成する場合、パッケージ体とモジュール体とを端子間で分離可能に接続し、パッケージ体に配置された導電回路パターンからの信号をモジュール体に収容された電子部品に伝える必要がある。そこで、本件発明者らは、パッケージ体に配置された導電回路パターンに外部に露出した端子群を形成し、このパッケージ体の端子群をモジュール体の端子群と接続させる構成を想到するに至った。しかしながら、パッケージ体に配置された端子群が外部に露出していると、輸送中や保管中に他の部材と接触して端子群が破損や損傷する可能性がある。 When the package body and the module body are configured to be separable, the package body and the module body are detachably connected between terminals, and a signal from the conductive circuit pattern arranged in the package body is stored in the module body. It is necessary to tell the parts. Therefore, the present inventors have come up with a configuration in which a terminal group exposed to the outside is formed on the conductive circuit pattern arranged in the package body, and the terminal group of the package body is connected to the terminal group of the module body. . However, if the terminal group disposed on the package body is exposed to the outside, the terminal group may be damaged or damaged by contact with other members during transportation or storage.
 本発明は、このような点に鑑みてなされたものであり、導電回路パターンの端子群を保護することが可能な可撓性基材を提供することを目的とする。また、本発明は、この可撓性基材を利用した錠剤管理装置の使用方法を提供することを目的とする。 This invention is made in view of such a point, and it aims at providing the flexible base material which can protect the terminal group of an electroconductive circuit pattern. Moreover, this invention aims at providing the usage method of the tablet management apparatus using this flexible base material.
 本発明による第1の可撓性基材は、端子群を含む導電回路パターンが一方の面に形成された第1基板と、折曲補助手段を介して前記第1基板に接続された第2基板と、を備え、
 前記第1基板は、前記折曲補助手段から折り畳まれて前記一方の面に前記第2基板を重ねられた折畳状態において、当該第2基板から露出する露出領域を有し、且つ、前記露出領域に前記導電回路パターンの前記端子群が配置されていて、
 前記第1基板及び前記第2基板とは別体に構成された保護シートが、前記折畳状態において前記端子群を覆っている。
A first flexible base material according to the present invention includes a first substrate having a conductive circuit pattern including a terminal group formed on one surface thereof, and a second substrate connected to the first substrate via a bending assisting means. A substrate, and
The first substrate has an exposed area exposed from the second substrate in a folded state in which the first substrate is folded from the folding assisting unit and the second substrate is overlaid on the one surface. The terminal group of the conductive circuit pattern is arranged in a region,
A protective sheet configured separately from the first substrate and the second substrate covers the terminal group in the folded state.
 本発明による第1の可撓性基材において、前記保護シートは、前記露出領域に剥離可能に貼り付けられていてもよい。 In the first flexible substrate according to the present invention, the protective sheet may be detachably attached to the exposed region.
 本発明による第1の可撓性基材において、前記保護シートは、前記折畳状態において、前記第2基板の前記第1基板とは反対側を向く面の少なくとも一部を覆い且つ当該面に剥離可能に貼り付けられていてもよい。 In the first flexible base material according to the present invention, in the folded state, the protective sheet covers at least a part of a surface of the second substrate facing away from the first substrate and is on the surface. You may affix so that peeling is possible.
 本発明による第1の可撓性基材において、前記保護シートに、当該可撓性基材の使用方法に関する視覚情報が記載されていてもよい。 In the first flexible base material according to the present invention, the protective sheet may include visual information regarding how to use the flexible base material.
 本発明による第2の可撓性基材は、端子群を含む導電回路パターンが一方の面に形成された第1基板と、折曲補助手段を介して前記第1基板に接続された第2基板と、を備え、
 前記第1基板は、前記折曲補助手段から折り畳まれて前記一方の面に前記第2基板を重ねられた折畳状態において、当該第2基板から露出する露出領域を有し、且つ、前記露出領域に前記導電回路パターンの前記端子群が配置されていて、
 前記折畳状態において前記端子群を覆うことが可能な延出保護片が、前記第1基板に接続されている。
A second flexible base material according to the present invention includes a first substrate having a conductive circuit pattern including a terminal group formed on one surface thereof, and a second substrate connected to the first substrate via a bending assisting means. A substrate, and
The first substrate has an exposed area exposed from the second substrate in a folded state in which the first substrate is folded from the folding assisting unit and the second substrate is overlaid on the one surface. The terminal group of the conductive circuit pattern is arranged in a region,
An extended protective piece capable of covering the terminal group in the folded state is connected to the first substrate.
 本発明による第2の可撓性基材において、前記延出保護片は、前記第1基板の前記露出領域に切断補助手段を介して接続されていてもよい。 In the second flexible base material according to the present invention, the extension protection piece may be connected to the exposed region of the first substrate through a cutting assisting means.
 本発明による第3の可撓性基材は、端子群を含む導電回路パターンが一方の面に形成された第1基板と、折曲補助手段を介して前記第1基板に接続された第2基板と、を備え、
 前記第1基板は、前記折曲補助手段から折り畳まれて前記一方の面に前記第2基板を重ねられた状態において、当該第2基板から露出する露出領域を有し、且つ、前記露出領域に前記導電回路パターンの前記端子群が配置されていて、
 前記折畳状態において前記端子群を覆う延出保護片が、前記第2基板に切断補助手段を介して接続されている。
A third flexible substrate according to the present invention includes a first substrate having a conductive circuit pattern including a terminal group formed on one surface thereof, and a second substrate connected to the first substrate via a bending assisting means. A substrate, and
The first substrate has an exposed region exposed from the second substrate in a state where the first substrate is folded from the folding assisting unit and the second substrate is overlaid on the one surface, and the exposed region is The terminal group of the conductive circuit pattern is disposed,
An extended protective piece that covers the terminal group in the folded state is connected to the second substrate via a cutting assisting means.
 本発明による第2または第3の可撓性基材において、前記第1基板、前記第2基板及び前記延出保護片は、単一のシートを区画することにより得られてもよい。 In the second or third flexible base material according to the present invention, the first substrate, the second substrate, and the extended protective piece may be obtained by partitioning a single sheet.
 本発明による第2または第3の可撓性基材において、前記折畳状態において前記第2基板の前記第1基板とは反対側を向く面の少なくとも一部を覆うカバーシートが、設けられていてもよい。 In the second or third flexible base material according to the present invention, a cover sheet is provided that covers at least a part of a surface of the second substrate facing the side opposite to the first substrate in the folded state. May be.
 また、本発明による錠剤管理装置の使用方法は、前記いずれかの特徴をもつ前記折畳状態の可撓性基材、及び、前記可撓性基材に接合され錠剤を収容するための複数の膨出部を含む成形シートと、を有するパッケージ体と、旋回可能に接続された第1部品及び第2部品を有し、前記第1部品と前記第2部品との間で前記パッケージ体を挟んで保持するモジュール体と、を備えた錠剤管理装置を使用する方法であって、
 前記パッケージ体から、前記保護シートまたは前記延出保護片を分離する工程と、
 前記保護シートまたは前記延出保護片を分離された前記パッケージ体の前記端子群を含む領域を、前記モジュール体の前記第1部品と前記第2部品との間で挟んで、前記パッケージ体を保持すると共に前記パッケージ体の前記端子群を前記モジュール体のモジュール端子群に接続する工程と、を備える。
In addition, the tablet management device according to the present invention includes a folded flexible base material having any one of the above characteristics, and a plurality of methods for joining tablets that are bonded to the flexible base material. A molded body including a bulging portion, and a first part and a second part that are pivotably connected, and the package body is sandwiched between the first part and the second part. A module management unit, and a tablet management device comprising:
Separating the protective sheet or the extended protective piece from the package body;
The package body is held by sandwiching the region including the terminal group of the package body from which the protective sheet or the extended protection piece is separated between the first component and the second component of the module body. And connecting the terminal group of the package body to the module terminal group of the module body.
 本発明によるパッケージ体は、端子群を含む導電回路パターンが一方の面に形成された第1基板と、折曲補助手段を介して前記第1基板に接続された第2基板と、を備え、前記第1基板は、前記折曲補助手段から折り畳まれて前記一方の面に前記第2基板が重ねられた折畳状態において、当該第2基板から露出する露出領域を有し、且つ、前記露出領域に前記導電回路パターンの前記端子群が配置されていて、保護シートが、前記折畳状態において前記端子群を覆っている可撓性基材と、前記第1基板と前記第2基板との間に挾まれた成形シートとを備える。 A package body according to the present invention includes a first substrate having a conductive circuit pattern including a terminal group formed on one surface thereof, and a second substrate connected to the first substrate via a bending assisting means, The first substrate has an exposed region that is exposed from the second substrate in a folded state in which the first substrate is folded from the folding assisting unit and the second substrate is superimposed on the one surface. The terminal group of the conductive circuit pattern is disposed in a region, and a protective sheet covers a flexible base material that covers the terminal group in the folded state, and the first substrate and the second substrate. And a molded sheet sandwiched therebetween.
 本発明による可撓性基材は、端子群を含む導電回路パターンが一方の面に形成された第1基板と、第1折曲補助手段を介して前記第1基板に接続され、第1基板上に重ねられる第2基板と、第2折曲補助手段を介して前記第1基板または前記第2基板に接続され、前記第1基板または第2基板上に重ねられる第3基板とを備え、前記第1基板は、前記第1折曲補助手段から折り畳まれて前記一方の面に前記第2基板が重ねられ、かつ前記第2折曲補助手段から折り畳まれて前記第1基板または前記第2基板上に前記第3基板が重ねられた折畳状態において、少なくとも前記第2基板から露出する露出領域を有し、且つ、前記露出領域に前記導電回路パターンの前記端子群が配置されていて、前記折畳状態において前記端子群を覆うことが可能な延出保護片が、前記第1基板、前記第2基板または前記第3基板に接続されている。 A flexible base material according to the present invention is connected to the first substrate through a first folding assisting means and a first substrate on which one side of a conductive circuit pattern including a terminal group is formed. A second substrate that is overlaid, and a third substrate that is connected to the first substrate or the second substrate via a second bending assisting unit and is superimposed on the first substrate or the second substrate, The first substrate is folded from the first folding assisting means, the second substrate is superimposed on the one surface, and is folded from the second folding assisting means to be the first substrate or the second In the folded state in which the third substrate is superimposed on the substrate, at least an exposed region exposed from the second substrate is provided, and the terminal group of the conductive circuit pattern is disposed in the exposed region, It is possible to cover the terminal group in the folded state. Extending the protection piece such that the first substrate and connected to the second substrate or the third substrate.
 本発明によるパッケージ体は、端子群を含む導電回路パターンが一方の面に形成された第1基板と、第1折曲補助手段を介して前記第1基板に接続され、第1基板上に重ねられる第2基板と、第2折曲補助手段を介して前記第1基板または前記第2基板に接続され、前記第1基板または前記第2基板上に重ねられる第3基板とを有する可撓性基材と、前記第1基板と前記第3基板との間、または前記第2基板と前記第3基板との間に挟まれた成形シートとを備え、前記第1基板は、前記第1折曲補助手段から折り畳まれて前記一方の面に前記第2基板が重ねられ、かつ前記第2折曲補助手段から折り畳まれて前記第1基板または前記第2基板上に前記成形シートを介して前記第3基板が重ねられた折畳状態において、少なくとも前記第2基板から露出する露出領域を有し、且つ、前記露出領域に前記導電回路パターンの前記端子群が配置されていて、前記折畳状態において前記端子群を覆うことが可能な延出保護片が、前記第1基板、前記第2基板または前記第3基板に接続されている。 The package body according to the present invention is connected to the first substrate having a conductive circuit pattern including a terminal group formed on one surface thereof, and the first substrate via first folding assisting means, and is superimposed on the first substrate. And a second substrate connected to the first substrate or the second substrate via a second bending assisting means and a third substrate overlaid on the first substrate or the second substrate. A base sheet and a molded sheet sandwiched between the first substrate and the third substrate or between the second substrate and the third substrate, the first substrate being the first fold Folded from the bending assisting means and the second substrate is superimposed on the one surface, and folded from the second folding assisting means and placed on the first substrate or the second substrate via the molded sheet In the folded state in which the third substrate is overlaid, at least the second group An extended protection piece having an exposed area exposed from the terminal area, wherein the terminal group of the conductive circuit pattern is disposed in the exposed area, and is capable of covering the terminal group in the folded state. The first substrate, the second substrate, or the third substrate is connected.
 本発明によるパッケージ体において、前記第1基板、前記第2基板、前記第3基板及び前記延出保護片は、単一のシートを区画することにより得られる。 In the package body according to the present invention, the first substrate, the second substrate, the third substrate, and the extension protection piece are obtained by partitioning a single sheet.
 本発明による錠剤管理装置の使用方法は、上記記載のパッケージ体と、旋回可能に接続された第1部品及び第2部品を有し、前記第1部品と前記第2部品との間で前記パッケージ体を挟んで保持するモジュール体と、を備えた錠剤管理装置を使用する方法であって、前記パッケージ体から、前記延出保護片を分離する工程と、前記保護シートまたは前記延出保護片を分離された前記パッケージ体の前記端子群を含む領域を、前記モジュール体の前記第1部品と前記第2部品との間で挟んで、前記パッケージ体を保持すると共に前記パッケージ体の前記端子群を前記モジュール体のモジュール端子群に接続する工程とを備える。 A method for using a tablet management device according to the present invention includes the package body described above, and a first part and a second part that are pivotably connected, and the package is between the first part and the second part. And a module body that holds the body between the package body, the step of separating the extended protective piece from the package body, and the protective sheet or the extended protective piece. A region including the terminal group of the separated package body is sandwiched between the first component and the second component of the module body to hold the package body and to hold the terminal group of the package body. Connecting to the module terminal group of the module body.
 本発明によれば、可撓性基材を折り畳んだ状態において、保護シートまたは延出保護片が、導電回路パターンの端子群を覆っている。これにより、導電回路パターンの端子群を保護し、当該端子群が輸送中や保管中に他の部材と接触して端子群が破損や損傷する可能性を低減できる。 According to the present invention, the protective sheet or the extended protective piece covers the terminal group of the conductive circuit pattern in a state where the flexible substrate is folded. Thereby, the terminal group of a conductive circuit pattern can be protected, and the possibility that the terminal group will be damaged or damaged due to contact with other members during transportation or storage.
図1は第1の実施の形態に係る可撓性基材を適用した錠剤管理装置を示す斜視図。FIG. 1 is a perspective view showing a tablet management apparatus to which a flexible base material according to a first embodiment is applied. 図2は図1に示す錠剤管理装置を構成するパッケージ体の平面図。FIG. 2 is a plan view of a package body constituting the tablet management apparatus shown in FIG. 図3は図2に示すパッケージ体の配線図。FIG. 3 is a wiring diagram of the package body shown in FIG. 図4は図2に示すパッケージ体の底面図。4 is a bottom view of the package body shown in FIG. 図5は図1に示す錠剤管理装置を構成するモジュール体を示す斜視図。FIG. 5 is a perspective view showing a module body constituting the tablet management device shown in FIG. 1. 図6は図5に示すモジュール体の平面図。6 is a plan view of the module body shown in FIG. 図7は図5に示す線VII-VIIに沿ったモジュール体の断面をパッケージ体を配置した状態で模式的に示す断面図。FIG. 7 is a cross-sectional view schematically showing a cross section of the module body along the line VII-VII shown in FIG. 5 in a state where the package body is arranged. 図8はモジュール体に収容される情報処理機器を説明するためのブロック図。FIG. 8 is a block diagram for explaining an information processing device accommodated in a module body. 図9は図4に示すパッケージ体から保護シートを剥がす様子を示す底面図。9 is a bottom view showing a state where the protective sheet is peeled off from the package body shown in FIG. 図10は図1に示す錠剤管理装置において、新たなパッケージ体をモジュール体に装着する様子を示す斜視図。FIG. 10 is a perspective view showing a state in which a new package body is mounted on a module body in the tablet management device shown in FIG. 図11は図2に示すパッケージ体を構成する可撓性基材を拡げた状態で表側から示す平面図。FIG. 11 is a plan view from the front side in a state where the flexible base material constituting the package body shown in FIG. 2 is expanded. 図12は図11に示す可撓性基材を拡げた状態で裏側から示す底面図。12 is a bottom view showing the flexible substrate shown in FIG. 図13は図4に示す可撓性基材を構成する保護シートの一変形例を示す平面図。FIG. 13 is a plan view showing a modification of the protective sheet constituting the flexible substrate shown in FIG. 図14は図13に示す保護シートに設けられた視覚情報を説明するための平面図。FIG. 14 is a plan view for explaining visual information provided on the protective sheet shown in FIG. 13. 図15は第2の実施の形態に係る可撓性基材を模式的に示す平面図。FIG. 15 is a plan view schematically showing a flexible base material according to the second embodiment. 図16は図15に示す可撓性基材を拡げた状態で表側から示す平面図。FIG. 16 is a plan view showing the flexible base shown in FIG. 15 from the front side in an expanded state. 図17は図15に示す可撓性基材を拡げた状態で裏側から示す底面図。17 is a bottom view showing the back side of the flexible base shown in FIG. 15 in an expanded state. 図18は図15に示す可撓性基材の一変形例を模式的に示す平面図。18 is a plan view schematically showing a modification of the flexible substrate shown in FIG. 図19は図15に示す可撓性基材の別の変形例を模式的に示す平面図。FIG. 19 is a plan view schematically showing another modification of the flexible substrate shown in FIG. 15. 図20は図15に示す可撓性基材のさらに別の変形例を模式的に示す平面図。20 is a plan view schematically showing still another modification of the flexible base material shown in FIG. 図21は図15に示す可撓性基材のさらに別の変形例を模式的に示す平面図。21 is a plan view schematically showing still another modification of the flexible base material shown in FIG. 図22は図21に示す可撓性基材を拡げた状態で表側から示す平面図。FIG. 22 is a plan view showing the flexible base shown in FIG. 21 from the front side in a state where the flexible base is expanded. 図23は図21に示す可撓性基材を拡げた状態で裏側から示す底面図。FIG. 23 is a bottom view showing the flexible base material shown in FIG. 21 from the back side in an expanded state. 図24は錠剤管理装置を構成するパッケージ体を示す平面図。FIG. 24 is a plan view showing a package body constituting the tablet management device. 図25(a)はパッケージ体の表側を示す展開図、図25(b)はパッケージ体を構成する錠剤シートを示す平面図。FIG. 25A is a development view showing the front side of the package body, and FIG. 25B is a plan view showing a tablet sheet constituting the package body. 図26はパッケージ体の裏側を示す展開図。FIG. 26 is a developed view showing the back side of the package body. 図27は2つの基板からなる可撓性基材を示す平面図。FIG. 27 is a plan view showing a flexible base material composed of two substrates.
≪第1の実施の形態≫
 以下、図面を参照して本発明の第1の実施の形態について説明する。なお、本件明細書に添付する図面においては、図示と理解のしやすさの便宜上、適宜縮尺および縦横の寸法比等を、実物のそれらから変更し誇張してある。図1乃至図14は、第1の実施の形態及びその変形例を説明するための図である。このうち、図1は、第1の実施形態に係る錠剤管理装置1を示す斜視図である。
<< First Embodiment >>
The first embodiment of the present invention will be described below with reference to the drawings. In the drawings attached to the present specification, for the sake of illustration and ease of understanding, the scale, the vertical / horizontal dimension ratio, and the like are appropriately changed and exaggerated from those of the actual product. 1 to 14 are diagrams for explaining the first embodiment and its modifications. Among these, FIG. 1 is a perspective view showing the tablet management device 1 according to the first embodiment.
 図1に示す錠剤管理装置1は、錠剤の利用に関する情報を管理するモジュール付パッケージである。錠剤管理装置1は、複数の錠剤を収容するパッケージ体2を有し、このパッケージ体2は、電子部品を収容したモジュール体5に装着されている。パッケージ体2から錠剤が取り出されると、この取り出しの情報がパッケージ体2に配置された導電回路パターン15(図3参照)にて検出され、導電回路パターン15からモジュール体5に送られるようになっている。 The tablet management device 1 shown in FIG. 1 is a package with a module that manages information related to the use of tablets. The tablet management device 1 has a package body 2 that houses a plurality of tablets, and the package body 2 is mounted on a module body 5 that houses electronic components. When the tablet is taken out from the package body 2, the removal information is detected by the conductive circuit pattern 15 (see FIG. 3) arranged on the package body 2 and sent from the conductive circuit pattern 15 to the module body 5. ing.
 とりわけ、図1に示すパッケージ体2は、モジュール体5に着脱可能に保持されている。この場合、パッケージ体2内の錠剤がなくなると、使用済みのパッケージ体2を新たなパッケージ体2と交換すればモジュール体5を繰り返し使用することができるため、経済的である。 In particular, the package body 2 shown in FIG. 1 is detachably held by the module body 5. In this case, when there are no tablets in the package body 2, the module body 5 can be used repeatedly by replacing the used package body 2 with a new package body 2, which is economical.
 パッケージ体2とモジュール体5とを分離可能に構成した場合、パッケージ体2とモジュール体5とを端子間で分離可能に接続し、パッケージ体2に配置された導電回路パターン15からの信号をモジュール体5に収容された電子部品に伝える必要がある。この点、本実施の形態によれば、パッケージ体2に配置された導電回路パターン15は、モジュール体5の端子群51と接続するために、外部に露出した端子群17を含んでいる。しかしながら、パッケージ体2に配置された端子群17が外部に露出していると、輸送中や保管中に他の部材と接触して端子群が破損や損傷する可能性がある。そこで、新たなパッケージ体2をモジュール体5に装着する前に、パッケージ体2に配置された端子群17を損傷から保護するべく、端子群17を保護する保護シート45(図4参照)が設けられている。以下の説明では、先ず、飲用物管理装置1の全体構成について説明し、その後、パッケージ体2を構成する可撓性基材3について説明していく。 When the package body 2 and the module body 5 are configured to be separable, the package body 2 and the module body 5 are connected to each other so as to be separable between terminals, and a signal from the conductive circuit pattern 15 arranged in the package body 2 is a module. It is necessary to convey to the electronic component housed in the body 5. In this regard, according to the present embodiment, the conductive circuit pattern 15 disposed in the package body 2 includes the terminal group 17 exposed to the outside in order to connect to the terminal group 51 of the module body 5. However, if the terminal group 17 arranged on the package body 2 is exposed to the outside, the terminal group may be damaged or damaged by contact with other members during transportation or storage. Therefore, a protective sheet 45 (see FIG. 4) for protecting the terminal group 17 is provided to protect the terminal group 17 disposed on the package body 2 from damage before the new package body 2 is mounted on the module body 5. It has been. In the following description, first, the overall configuration of the drink management device 1 will be described, and then the flexible base material 3 constituting the package body 2 will be described.
 先ず、図2を参照して、錠剤を収容するパッケージ体2の概略について説明する。図2は、パッケージ体2を示す平面図である。図2に示すように、パッケージ体2は、錠剤を収容するための複数の膨出部4aを含んでいる。複数の膨出部4aは、パッケージ体2内で二次元配列されている。図2に示す例では、パッケージ体2の幅方向d1に並んだ2つの膨出部4aが、パッケージ体2の長手方向d2に5列並べられ、合計で10個の膨出部4aが設けられている。 First, with reference to FIG. 2, the outline of the package body 2 for storing tablets will be described. FIG. 2 is a plan view showing the package body 2. As shown in FIG. 2, the package body 2 includes a plurality of bulging portions 4a for accommodating tablets. The plurality of bulging portions 4 a are two-dimensionally arranged in the package body 2. In the example shown in FIG. 2, two bulging portions 4a arranged in the width direction d1 of the package body 2 are arranged in five rows in the longitudinal direction d2 of the package body 2, and a total of ten bulging portions 4a are provided. ing.
 この膨出部4aに収容される錠剤としては、医薬品として用いられるものや健康食品として用いられるものが挙げられる。本実施の形態では、錠剤として、医薬品としての錠剤が収容されている。なお、錠剤とは、カプセルやタブレットとも呼ばれ得るものを含む概念である。 Examples of the tablets accommodated in the bulging portion 4a include those used as pharmaceuticals and those used as health foods. In this Embodiment, the tablet as a pharmaceutical is accommodated as a tablet. In addition, a tablet is a concept including what can also be called a capsule or a tablet.
 図2に示すパッケージ体2は、積層構造体として構成されている。具体的には、複数の膨出部4aが形成された成形基材4に、可撓性基材3(図1参照)を積層することにより形成されている。膨出部4aを可撓性基材3で覆うことにより、錠剤を収容する収容空間2aが規定される。なお、可撓性基材3は、折り畳まれた単一のシートにて構成されているが、この点については図11及び図12を参照して後述する。 2 is configured as a laminated structure. Specifically, it is formed by laminating a flexible base material 3 (see FIG. 1) on a molding base material 4 on which a plurality of bulging portions 4a are formed. By covering the bulging portion 4a with the flexible base material 3, an accommodation space 2a for accommodating the tablet is defined. In addition, although the flexible base material 3 is comprised by the folded single sheet | seat, this point is later mentioned with reference to FIG.11 and FIG.12.
 図3に、図2に示すパッケージ体2の配線図を示す。図3に示すように、パッケージ体2には、導電回路パターン15が配置されている。導電回路パターン15は、膨出部4aから錠剤が取り出された情報を検出するための回路である。導電回路パターン15をなす配線16は、各膨出部4aを覆うパッケージ体2の部分に掛け渡された分枝16aを有している。 FIG. 3 shows a wiring diagram of the package body 2 shown in FIG. As shown in FIG. 3, the conductive circuit pattern 15 is arranged in the package body 2. The conductive circuit pattern 15 is a circuit for detecting information obtained by taking out the tablet from the bulging portion 4a. The wiring 16 forming the conductive circuit pattern 15 has a branch 16a that spans the portion of the package body 2 that covers each bulging portion 4a.
 各膨出部4aを覆うパッケージ体2の部分に掛け渡された分枝16aは、複数の膨出部4aが配置された領域とは異なる領域に配置された端子群17に電気的に接続されている。 The branch 16a that spans the portion of the package body 2 that covers each bulging portion 4a is electrically connected to a terminal group 17 disposed in a region different from the region in which the plurality of bulging portions 4a are disposed. ing.
 本実施の形態では、端子群17は、パッケージ体2の幅方向d1に並べられた複数の端子17aを含み、各端子17aは、膨出部4aを覆うパッケージ体2の部分に掛け渡された分枝16aに接続されている。この場合、錠剤を取り出すべくパッケージ体2が突き破られると、膨出部4aを覆う可撓性基材3の部分に掛け渡された分枝16aの部分が断線する。この断線した情報が、当該配線16に対応する端子17aに電気信号として伝わることにより、膨出部4aから錠剤が取り出された情報を検出するようになっている。 In the present embodiment, the terminal group 17 includes a plurality of terminals 17a arranged in the width direction d1 of the package body 2, and each terminal 17a is spanned over a portion of the package body 2 that covers the bulging portion 4a. It is connected to the branch 16a. In this case, when the package body 2 is pierced so as to take out the tablet, the portion of the branch 16a spanned over the portion of the flexible base material 3 covering the bulging portion 4a is broken. The disconnected information is transmitted as an electrical signal to the terminal 17a corresponding to the wiring 16, so that the information that the tablet is taken out from the bulging portion 4a is detected.
 ただし、上述のように、パッケージ体2に配置された端子群17が外部に露出していると、輸送中や保管中に他の部材と接触して端子群17が破損や損傷する可能性がある。そこで、パッケージ体2がモジュール体5に装着される前の状態においては、パッケージ体2に配置された端子群17が損傷することを防ぐために、端子群17を保護する保護シート45が設けられている。図4に、端子群17が保護シート45で覆われた状態が底面図として示されている。図4に示す保護シート45は、端子群17を覆うようにしてパッケージ体2に貼り付けられている。 However, as described above, if the terminal group 17 arranged on the package body 2 is exposed to the outside, there is a possibility that the terminal group 17 may be damaged or damaged by contact with other members during transportation or storage. is there. Therefore, in a state before the package body 2 is attached to the module body 5, a protective sheet 45 for protecting the terminal group 17 is provided in order to prevent the terminal group 17 arranged on the package body 2 from being damaged. Yes. FIG. 4 shows a bottom view of the terminal group 17 covered with the protective sheet 45. The protective sheet 45 shown in FIG. 4 is attached to the package body 2 so as to cover the terminal group 17.
 このようなパッケージ体2は、モジュール体5に取り外し可能に装着される。図5にモジュール体5の斜視図を示し、図6にモジュール体5の平面図を示す。図5及び図6に示すように、モジュール体5は、旋回可能に接続された第1部品50及び第2部品60を有している。図5及び図6に示す例では、第1部品50に、端子群17からの情報を処理する情報処理機器が収容され、第2部品60は、第1部品50に旋回可能に支持されたカバー部品として構成されている。以下の説明では、第1部品50を本体部品と呼び、第2部品60をカバー部品と呼ぶ。 Such a package body 2 is detachably mounted on the module body 5. FIG. 5 shows a perspective view of the module body 5, and FIG. 6 shows a plan view of the module body 5. As shown in FIGS. 5 and 6, the module body 5 includes a first component 50 and a second component 60 that are pivotably connected. In the example shown in FIGS. 5 and 6, an information processing device that processes information from the terminal group 17 is housed in the first component 50, and the second component 60 is a cover that is pivotally supported by the first component 50. It is configured as a part. In the following description, the first component 50 is called a main body component, and the second component 60 is called a cover component.
 このうち、カバー部品60は、薄板状の部材として構成され、旋回軸65を介して本体部品50に取り付けられている。カバー部品60の端部には、係止片61が設けられている。 Among these, the cover part 60 is configured as a thin plate-like member, and is attached to the main body part 50 via the turning shaft 65. A locking piece 61 is provided at the end of the cover component 60.
 モジュール体5は、本体部品50とカバー部品60との間でパッケージ体2を挟んで当該パッケージ体2を保持する(図1参照)。本実施の形態では、本体部品50とカバー部品60との間でパッケージ体2を挟んだ状態で、本体部品50に設けられたロック部材70を作動させることにより、パッケージ体2を挟持するようになっている。とりわけ、図5に示すロック部材70は、本体部品50の端部に旋回可能に取り付けられており、その先端に係止爪71を含んでいる。ロック部材70の係止爪71をカバー部品60の係止片61に引っ掛ける(係止させる)ことにより、カバー部品60を本体部品50にロックすることが可能となる。 The module body 5 holds the package body 2 with the package body 2 sandwiched between the main body part 50 and the cover part 60 (see FIG. 1). In the present embodiment, the package body 2 is sandwiched by operating the lock member 70 provided in the body component 50 in a state where the package body 2 is sandwiched between the body component 50 and the cover component 60. It has become. In particular, the lock member 70 shown in FIG. 5 is pivotally attached to the end portion of the main body part 50 and includes a locking claw 71 at the tip thereof. The cover part 60 can be locked to the main body part 50 by hooking (locking) the locking claw 71 of the lock member 70 on the locking piece 61 of the cover part 60.
 本体部品50は、図5に示すように、カバー部品60に覆われる内面50aを含んでいる。本体部品50の内面50aに、第1方向d3に延びる溝50bが形成されていて、この溝50b内にモジュール端子群51が配置されている。モジュール端子群51は、カバー部品60との間でパッケージ体2を挟んだ状態において端子群17と接続される。 The main body part 50 includes an inner surface 50a covered with a cover part 60 as shown in FIG. A groove 50b extending in the first direction d3 is formed on the inner surface 50a of the main body component 50, and the module terminal group 51 is disposed in the groove 50b. The module terminal group 51 is connected to the terminal group 17 in a state where the package body 2 is sandwiched between the module terminal group 51 and the cover component 60.
 図7は、モジュール端子群51が、パッケージ体2の端子群17と接続された状態を示す断面図である。図7に示すように、モジュール端子群51は、溝50bの長手方向に平行な第1方向d3に並べられた複数の端子51aを含み、各端子51aは、パッケージ体2の対応する端子17aに接続部材90を介して接続されるようになっている。接続部材90によれば、パッケージ体2がモジュール体5に保持された状態でパッケージ体2と本体部品50とが向き合う方向d4に押圧されたときに、パッケージ体2の端子群17とモジュール端子群51との間を導通させることができる。かかる接続部材90の特性により、部品精度や繰り返し使用に伴い生じ得る、パッケージ体2の端子群17とモジュール端子群51との位置決め誤差を補償することができる。 FIG. 7 is a cross-sectional view showing a state in which the module terminal group 51 is connected to the terminal group 17 of the package body 2. As shown in FIG. 7, the module terminal group 51 includes a plurality of terminals 51a arranged in a first direction d3 parallel to the longitudinal direction of the groove 50b, and each terminal 51a is connected to a corresponding terminal 17a of the package body 2. The connection member 90 is connected. According to the connecting member 90, when the package body 2 is held by the module body 5 and pressed in the direction d4 in which the package body 2 and the main body component 50 face each other, the terminal group 17 and the module terminal group of the package body 2 51 can be made conductive. Due to the characteristics of the connection member 90, it is possible to compensate for positioning errors between the terminal group 17 and the module terminal group 51 of the package body 2 that may occur due to component accuracy and repeated use.
 このような接続部材90の一例として、異方導電性部材が挙げられる。異方導電性部材の一例として、絶縁性の樹脂材料からなる絶縁樹脂層内に導電性粒子を分散させたタイプのものや、シリコーンゴムシートの厚み方向に複数の炭素繊維を貫通させたタイプのもの等が挙げられる。後者の一例として、信越ポリマー社製、製品名インターコネクタSタイプが挙げられる。 An example of such a connection member 90 is an anisotropic conductive member. As an example of the anisotropic conductive member, a type in which conductive particles are dispersed in an insulating resin layer made of an insulating resin material, or a type in which a plurality of carbon fibers are penetrated in the thickness direction of a silicone rubber sheet. And the like. As an example of the latter, there is a product name interconnector S type manufactured by Shin-Etsu Polymer Co., Ltd.
 このように、パッケージ体2の導電回路パターン15にて検出された錠剤の取り出しに関する情報は、パッケージ体2の端子群17からモジュール端子群51に伝わる。モジュール端子群51に伝わった情報は、本体部品50内に収容された情報処理機器によって処理される。図8に、本体部品50に収容される情報処理機器80の構成をブロック図として示す。 As described above, the information related to taking out the tablet detected by the conductive circuit pattern 15 of the package body 2 is transmitted from the terminal group 17 of the package body 2 to the module terminal group 51. Information transmitted to the module terminal group 51 is processed by an information processing device accommodated in the main body component 50. FIG. 8 is a block diagram showing the configuration of the information processing device 80 accommodated in the main body component 50.
 情報処理機器80は、薄膜状の機器である。図8に示す情報処理機器80は、例えば、本体部品50内に実装されるASIC(Application Specific Integrated Circuit)81と、水晶振動子82と、ボタン電池83と、スピーカ84と、を有している。 The information processing device 80 is a thin-film device. The information processing device 80 illustrated in FIG. 8 includes, for example, an ASIC (Application Specific Integrated Circuit) 81 mounted in the main body component 50, a crystal resonator 82, a button battery 83, and a speaker 84. .
 ASIC81は、モジュール端子群51に接続され、パッケージ体2の端子群17からモジュール端子群51を介して錠剤を取り出した情報を受け取る。ASIC81は、この受け取った情報を時刻情報とともに時系列で記憶し、記憶した情報に関して不図示のホストコンピュータとの間で無線通信を行う。ASIC81がホストコンピュータとの間で行う無線通信として、例えば、いわゆるNFC(Near Field Communication、近接無線通信)やBluetooth(登録商標)の非接触通信が挙げられる。ASIC81がホストコンピュータとの間で無線通信を行うことにより、利用者の健康に関する情報をホストコンピュータ側で把握し一元的に管理することができる。 The ASIC 81 is connected to the module terminal group 51 and receives the information that the tablet is taken out from the terminal group 17 of the package body 2 through the module terminal group 51. The ASIC 81 stores the received information together with time information in time series, and performs wireless communication with a host computer (not shown) regarding the stored information. Examples of wireless communication performed by the ASIC 81 with the host computer include so-called NFC (Near Field Communication, proximity wireless communication) and Bluetooth (registered trademark) non-contact communication. When the ASIC 81 performs wireless communication with the host computer, it is possible to grasp information about the health of the user on the host computer side and manage it centrally.
 NFCでは、規格上電力の送受もできるため、電池なしで情報処理機器80を駆動することも原理的には可能である。ただし、本実施形態の情報処理機器80は、スピーカ84も備えており、電力の消費量が比較的大きいため、ボタン電池83を搭載している。 In NFC, since power can be transmitted and received in accordance with the standard, it is possible in principle to drive the information processing device 80 without a battery. However, the information processing apparatus 80 according to the present embodiment also includes the speaker 84, and since the power consumption is relatively large, the button battery 83 is mounted.
 次に、このような構成からなる錠剤管理装置1の利用方法の一例について説明する。 Next, an example of a method of using the tablet management device 1 having such a configuration will be described.
 錠剤管理装置1は、例えば通院中の患者によって利用される。利用者は、食後や決まった時間帯にパッケージ体2に収容された錠剤を取り出して服用する。錠剤を取り出すべくパッケージ体2が突き破られると、導電回路パターン15の配線16が断線し、この断線した情報が、膨出部4aから錠剤が取り出された情報を示す電気信号として端子群17からモジュール端子群51に伝わる。モジュール端子群51に伝わった信号は、情報処理機器80で処理される。 The tablet management device 1 is used, for example, by a patient who is in the hospital. The user takes out and takes the tablets contained in the package body 2 after eating or at a fixed time. When the package body 2 is broken through to take out the tablet, the wiring 16 of the conductive circuit pattern 15 is disconnected, and the disconnected information is transmitted from the terminal group 17 as an electrical signal indicating the information that the tablet is taken out from the bulging portion 4a. It is transmitted to the module terminal group 51. Signals transmitted to the module terminal group 51 are processed by the information processing device 80.
 服用を繰り返し、パッケージ体2内の錠剤がなくなると、使用済みのパッケージ体2を新たなパッケージ体2に交換する必要が生じる。新たなパッケージ体2に交換する際には、先ず、図1に示す状態からロック部材70によるロックを解除し、カバー部品60を開ける。その後、使用済みのパッケージ体2を本体部品50から取り外す。 When the tablet is not used in the package body 2 after repeated doses, it is necessary to replace the used package body 2 with a new package body 2. When replacing the package body 2 with a new one, first, the lock by the lock member 70 is released from the state shown in FIG. Thereafter, the used package body 2 is removed from the main body part 50.
 図9に、パッケージ体2から保護シート45を剥がす様子を示し、図10に、本体部品50にパッケージ体2を装着する様子を示す。図9に示すように、本体部品50にパッケージ体2を装着するには、端子群17を覆う保護シート45をパッケージ体2から剥がして、端子群17を露出させる。次に、図10に示すように、端子群17が配置されたパッケージ体2の面を本体部品50側に向けながら、パッケージ体2の端子群17をモジュール端子群51が配置された溝50bに近づけていく。 9 shows a state where the protective sheet 45 is peeled off from the package body 2, and FIG. 10 shows a state where the package body 2 is mounted on the main body component 50. As shown in FIG. 9, in order to mount the package body 2 on the main body component 50, the protective sheet 45 covering the terminal group 17 is peeled off from the package body 2 to expose the terminal group 17. Next, as shown in FIG. 10, the terminal group 17 of the package body 2 is placed in the groove 50b in which the module terminal group 51 is disposed while the surface of the package body 2 on which the terminal group 17 is disposed is directed toward the main body component 50 side. Move closer.
 その後、端子群17が溝50b内に配置された接続部材90に接触する。この状態で、ロック部材70でカバー部品60を本体部品50にロックすると、接続部材90がパッケージ体2と本体部品50とが向き合う方向d4に押圧されて、パッケージ体2の端子群17とモジュール端子群51とが接続部材90を介して電気的に接続される。 Thereafter, the terminal group 17 contacts the connecting member 90 disposed in the groove 50b. In this state, when the cover part 60 is locked to the main body part 50 by the lock member 70, the connecting member 90 is pressed in the direction d4 in which the package body 2 and the main body part 50 face each other, and the terminal group 17 of the package body 2 and the module terminal The group 51 is electrically connected through the connection member 90.
 次に、パッケージ体2を成形基材4と共に構成する可撓性基材3について図11及び図12を参照して説明する。図11は、可撓性基材3を拡げた状態で表側から示す平面図であり、図12は、可撓性基材3を拡げた状態で裏側から示す底面図である。 Next, the flexible substrate 3 that constitutes the package body 2 together with the molded substrate 4 will be described with reference to FIGS. FIG. 11 is a plan view from the front side in a state where the flexible base material 3 is expanded, and FIG. 12 is a bottom view from the back side in a state where the flexible base material 3 is expanded.
 図11及び図12に示す可撓性基材3は、可撓性をもつ紙またはプラスチックからなる単一のシート3aを、長手方向に三等分して折り畳んだ構造になっている。 The flexible substrate 3 shown in FIGS. 11 and 12 has a structure in which a single sheet 3a made of flexible paper or plastic is divided into three equal parts in the longitudinal direction.
 図11及び図12に示すように、シート3aは、シート3aの長手方向ldにこの順で並べられた上基板30、下基板20及び中基板10を含んでいる。上基板30と下基板20とは、折曲補助手段41を介して接続され、下基板20と中基板10とは、別の折曲補助手段41を介して接続されている。図11及び図12に示す展開状態から、下基板20と中基板10とを折曲補助手段41を利用して折り畳んだ後に、上基板30と下基板20とを折曲補助手段41を利用して折り畳むと、可撓性基材3は、図2乃至図4に示す状態となる。 11 and 12, the sheet 3a includes an upper substrate 30, a lower substrate 20, and a middle substrate 10 arranged in this order in the longitudinal direction ld of the sheet 3a. The upper substrate 30 and the lower substrate 20 are connected via a bending auxiliary means 41, and the lower substrate 20 and the middle substrate 10 are connected via another bending auxiliary means 41. 11 and 12, after folding the lower substrate 20 and the middle substrate 10 using the folding assisting means 41, the upper substrate 30 and the lower substrate 20 are folded using the folding assisting means 41. When folded, the flexible substrate 3 is in the state shown in FIGS.
 上基板30は、図4に示す折畳状態C1において、最も上側に重ねられた層をなす。図11に示すように、上基板30の表側となる面には、パッケージ体2の表紙としての印刷情報31が印刷されている。また、上基板30には、成形基材4の膨出部4aを通過させるための複数の繰抜孔32が設けられている。繰抜孔32は、膨出部4aの配列に対応して、シート3aの長手方向ldに並んだ2つの組が、シート3aの長手方向ldに直交する短手方向sdに5列並べられ、合計で10個設けられている。 The upper substrate 30 forms a layer stacked on the uppermost side in the folded state C1 shown in FIG. As shown in FIG. 11, print information 31 as a cover of the package body 2 is printed on the front surface of the upper substrate 30. Further, the upper substrate 30 is provided with a plurality of drawing holes 32 for allowing the bulging portion 4a of the molding base 4 to pass therethrough. The drawing holes 32 correspond to the arrangement of the bulging portions 4a, and two sets arranged in the longitudinal direction ld of the sheet 3a are arranged in five rows in the short direction sd perpendicular to the longitudinal direction ld of the sheet 3a, 10 are provided.
 第1基板としての中基板10は、図4に示す折畳状態C1において、下基板20と上基板30との間に位置する。図12に示すように、下基板20に覆われるようになる中基板10の内面10bには、膨出部4aから錠剤が取り出された情報を検出するための導電回路パターン15が配置されている。中基板10に配置された導電回路パターン15は、重ねられた下基板20に覆われ、利用者から観察されないようになっている。また、中基板10には、膨出部4aの形状に対応したつなぎを有する複数の繰抜用切れ目18が設けられている。 The middle substrate 10 as the first substrate is located between the lower substrate 20 and the upper substrate 30 in the folded state C1 shown in FIG. As shown in FIG. 12, on the inner surface 10b of the middle substrate 10 to be covered with the lower substrate 20, a conductive circuit pattern 15 for detecting the information that the tablet is taken out from the bulging portion 4a is arranged. . The conductive circuit pattern 15 arranged on the middle substrate 10 is covered with the lower substrate 20 that is overlaid, and is not observed by the user. Further, the middle substrate 10 is provided with a plurality of drawing cuts 18 having a connection corresponding to the shape of the bulging portion 4a.
 とりわけ、導電回路パターン15をなす配線16は、中基板10のうちの繰抜用切れ目18に囲まれる領域内を横断した複数の分枝16aを含んでいる。このことにより、膨出部4aに収容された錠剤を取り出すべく、繰抜用切れ目18に沿って中基板10が繰り抜かれると、分枝16aのうちの繰抜用切れ目18内に位置する部分が破断されるようになっている。 In particular, the wiring 16 forming the conductive circuit pattern 15 includes a plurality of branches 16 a that traverse the region surrounded by the cutout 18 in the middle substrate 10. Accordingly, when the middle substrate 10 is pulled out along the pulling cut 18 to take out the tablet accommodated in the bulging portion 4a, the portion located in the pulling cut 18 in the branch 16a. Is to be broken.
 また、配線16は、複数の繰抜用切れ目18が配置された領域とは異なる領域に配置された端子群17に電気的に接続されている。図12に示す例では、端子群17は、シート3aの長手方向ldに並べられた複数の端子17aを含み、各端子17aに、繰抜用切れ目18に掛け渡された配線16の分枝16aが接続されている。 Further, the wiring 16 is electrically connected to the terminal group 17 disposed in a region different from the region where the plurality of cutouts 18 are disposed. In the example shown in FIG. 12, the terminal group 17 includes a plurality of terminals 17a arranged in the longitudinal direction ld of the sheet 3a, and the branches 16a of the wirings 16 spanned by the cutouts 18 for drawing out to the terminals 17a. Is connected.
 第2基板としての下基板20は、図4に示す折畳状態C1において、最も下側に重ねられた層をなす。下基板20は、中基板10に配置された導電回路パターン15を保護する機能をもつ。下基板20には、膨出部4aの形状に対応したつなぎを有する複数の繰抜用切込み21が設けられている。 The lower substrate 20 as the second substrate forms a layer stacked on the lowermost side in the folded state C1 shown in FIG. The lower substrate 20 has a function of protecting the conductive circuit pattern 15 disposed on the middle substrate 10. The lower substrate 20 is provided with a plurality of drawing cuts 21 having a connection corresponding to the shape of the bulging portion 4a.
 図11及び図12に示すパッケージ体2においては、互いに重ねられた中基板10と下基板20とがヒートシールされ、互いに重ねられた上基板30と中基板10とがヒートシールされるようになっている。 In the package body 2 shown in FIG. 11 and FIG. 12, the middle substrate 10 and the lower substrate 20 stacked on each other are heat-sealed, and the upper substrate 30 and the middle substrate 10 stacked on each other are heat-sealed. ing.
 隣り合う基板10、20、30の間の各折曲補助手段41は、当該隣り合う2つの基板10、20、30を折り曲げた際に、当該折曲補助手段41を設けられた位置にて基板10、20、30が折り曲げられること、さらには基板10、20、30が折り畳まれることを促進するためのものである。折曲補助手段41は、隣り合う2つの基板10、20、30の境界となる位置で、シート3aの短手方向sdに沿って直線状に延びている。 Each folding assist means 41 between the adjacent substrates 10, 20, 30 is a substrate at the position where the folding assist means 41 is provided when the two adjacent substrates 10, 20, 30 are bent. This is intended to promote that the substrates 10, 20, and 30 are folded and that the substrates 10, 20, and 30 are folded. The bending assisting means 41 extends linearly along the short direction sd of the sheet 3a at a position that becomes a boundary between two adjacent substrates 10, 20, and 30.
 折曲補助手段41は、それ自体既知の態様で実現され得る。例えば、折曲補助手段41は、連続的に形成された溝からなるハーフカットラインであってもよいし、断続的に形成された破線(ミシン目)であってもよい。 The folding assist means 41 can be realized in a manner known per se. For example, the bending assisting means 41 may be a half-cut line composed of continuously formed grooves, or may be a broken line (perforation) formed intermittently.
 図11及び図12に示す例では、シート3aの長手方向ldに沿った3つの基板10、20、30の長さは、等しく設定されている一方で、シート3aの短手方向sdに沿った中基板10の長さは、シート3aの短手方向sdに沿った下基板20及び上基板30の長さよりも長くなっている。 In the example shown in FIGS. 11 and 12, the lengths of the three substrates 10, 20, and 30 along the longitudinal direction ld of the sheet 3a are set to be equal while the length along the short direction sd of the sheet 3a is set. The length of the middle substrate 10 is longer than the lengths of the lower substrate 20 and the upper substrate 30 along the short direction sd of the sheet 3a.
 このようなシート3aによれば、図11及び図12に示す展開状態から、下基板20を中基板10の内面10b(図12参照)を覆うように折曲補助手段41から折り畳み、上基板30を中基板10の外面10a(図11参照)を覆うように折曲補助手段41から折り畳むことで、図4に示す折畳状態C1となる。図4に示す状態において、中基板10の下基板20よりも突き出た部分は、当該下基板20から露出した露出領域11を規定している。そして、この中基板10のうちの下基板20よりも突き出た露出領域11に、導電回路パターン15の端子群17が配置されている。端子群17を下基板20から露出した露出領域11に配置することにより、モジュール体5のモジュール端子群51への接続を容易にする。 According to such a sheet 3a, the lower substrate 20 is folded from the folding assisting means 41 so as to cover the inner surface 10b (see FIG. 12) of the middle substrate 10 from the unfolded state shown in FIGS. Is folded from the folding assisting means 41 so as to cover the outer surface 10a (see FIG. 11) of the intermediate substrate 10, and the folded state C1 shown in FIG. 4 is obtained. In the state shown in FIG. 4, a portion protruding from the lower substrate 20 of the middle substrate 10 defines an exposed region 11 exposed from the lower substrate 20. A terminal group 17 of the conductive circuit pattern 15 is arranged in the exposed region 11 protruding from the lower substrate 20 of the middle substrate 10. By arranging the terminal group 17 in the exposed region 11 exposed from the lower substrate 20, the module body 5 can be easily connected to the module terminal group 51.
 ただし、上述のように、導電回路パターン15の端子群17が外部に露出していると、輸送中や保管中に他の部材と接触して端子群が破損や損傷する可能性がある。そこで、図4に示すように、露出領域11を覆う保護シート45が、当該露出領域11に貼り付けられている。本実施の形態の保護シート45は、露出領域11の全域を覆い、保護シート45の輪郭は、当該露出領域11の輪郭と重なっている。 However, as described above, if the terminal group 17 of the conductive circuit pattern 15 is exposed to the outside, the terminal group may be damaged or damaged due to contact with other members during transportation or storage. Therefore, as shown in FIG. 4, a protective sheet 45 covering the exposed region 11 is attached to the exposed region 11. The protective sheet 45 of the present embodiment covers the entire area of the exposed area 11, and the outline of the protective sheet 45 overlaps the outline of the exposed area 11.
 本実施の形態において、保護シート45は、露出領域11に剥離可能に貼り付けられている。この場合、保護シート45を露出領域11から剥離したときに、粘着成分が露出領域11に転移することを抑えることができる。なお、保護シート45は、露出領域11に再接合可能に構成されていてもよいし、再接合不能に構成されていてもよい。 In this embodiment, the protective sheet 45 is detachably attached to the exposed region 11. In this case, when the protective sheet 45 is peeled from the exposed region 11, it is possible to suppress the adhesive component from being transferred to the exposed region 11. The protective sheet 45 may be configured to be rejoinable to the exposed region 11 or may be configured to be non-rejoinable.
 また、保護シート45をなす材料は、端子群17を損傷から保護する機能がある材料であれば特に限定されない。保護シート45をなす材料の一例として、ポリエチレンやポリプロピレンのような熱可塑性樹脂や弾性に優れたシリコンのような合成ゴムが挙げられる。また、一例として、保護シート45の厚みは、60μm~200μm程度のものが用いられる。 The material forming the protective sheet 45 is not particularly limited as long as the material has a function of protecting the terminal group 17 from damage. Examples of the material forming the protective sheet 45 include thermoplastic resins such as polyethylene and polypropylene, and synthetic rubber such as silicon having excellent elasticity. As an example, the protective sheet 45 has a thickness of about 60 μm to 200 μm.
 一方、可撓性基材3をなす材料は、可撓性をもつ材料であれば特に限定されないが、一例として、紙や樹脂が挙げられる。本実施の形態では、可撓性基材3と保護シート45とを異なる材料にて構成することにより、保護シート45による保護機能を有効に発揮させるようになっている。 On the other hand, the material forming the flexible substrate 3 is not particularly limited as long as it is a flexible material, but examples thereof include paper and resin. In the present embodiment, the protection function by the protection sheet 45 is effectively exhibited by configuring the flexible substrate 3 and the protection sheet 45 with different materials.
 このようにして単一のシート3aから得られる可撓性基材3に、複数の膨出部4aを含む成形基材4が貼り付けられる。本実施の形態では、上基板30と下基板20との間に成形基材3が挟み込まれ、上基板30の各繰抜孔32から、成形基材4の対応する膨出部4aが突き出ている。このようにして得られるパッケージ体2によれば、工業的な生産過程でパッケージ体2を効率よく作成することができる。 The molded substrate 4 including a plurality of bulging portions 4a is attached to the flexible substrate 3 obtained from the single sheet 3a in this way. In the present embodiment, the molding base 3 is sandwiched between the upper substrate 30 and the lower substrate 20, and the corresponding bulging portions 4 a of the molding base 4 protrude from the respective drawing holes 32 of the upper substrate 30. . According to the package body 2 obtained in this way, the package body 2 can be efficiently produced in an industrial production process.
 以上のように、本実施の形態によれば、端子群17を含む導電回路パターン15が一方の面10bに形成された第1基板(中基板)10と、折曲補助手段41を介して第1基板(中基板)10に接続された第2基板(下基板)20と、を備え、第1基板(中基板)10は、折曲補助手段41から折り畳まれて一方の面(内面)10bに第2基板(下基板)20を重ねられた折畳状態C1において、当該第2基板(下基板)20から露出する露出領域11を有し、且つ、露出領域11に導電回路パターン15の端子群17が配置されていて、第1基板(中基板)10及び第2基板(下基板)20とは異なる材料から構成された保護シート45が、前記折畳状態C1において端子群17を覆っている。このような形態によれば、導電回路パターン15の端子群17を保護し、当該端子群17が輸送中や保管中に他の部材と接触して端子群が破損や損傷する可能性を低減することができる。 As described above, according to the present embodiment, the first substrate (middle substrate) 10 in which the conductive circuit pattern 15 including the terminal group 17 is formed on the one surface 10 b and the bending auxiliary means 41 are used to A second substrate (lower substrate) 20 connected to one substrate (middle substrate) 10, and the first substrate (middle substrate) 10 is folded from the folding assisting means 41 to be one surface (inner surface) 10 b. In the folded state C1 in which the second substrate (lower substrate) 20 is overlaid, the exposed region 11 is exposed from the second substrate (lower substrate) 20, and the terminal of the conductive circuit pattern 15 is provided in the exposed region 11. A protective sheet 45 made of a material different from that of the first substrate (middle substrate) 10 and the second substrate (lower substrate) 20 covers the terminal group 17 in the folded state C1. Yes. According to such a form, the terminal group 17 of the conductive circuit pattern 15 is protected, and the possibility that the terminal group 17 breaks or is damaged due to contact with other members during transportation or storage. be able to.
 また、本実施の形態によれば、保護シート45は、露出領域11に剥離可能に貼り付けられている。この場合、保護シート45を露出領域11から剥離したときに、粘着成分が露出領域11に転移することを抑えることができる。粘着成分が露出領域11に転移すると、パッケージ体2のモジュール体5への装着不良を起こすおそれがあることから、保護シート45が剥離可能な場合、パッケージ体2の装着不良を抑えることができる。 Further, according to the present embodiment, the protective sheet 45 is attached to the exposed region 11 in a peelable manner. In this case, when the protective sheet 45 is peeled from the exposed region 11, it is possible to suppress the adhesive component from being transferred to the exposed region 11. If the adhesive component is transferred to the exposed region 11, there is a possibility that the mounting failure of the package body 2 to the module body 5 may occur. Therefore, when the protective sheet 45 can be peeled off, the mounting failure of the package body 2 can be suppressed.
 また、本実施の形態によれば、折畳状態C1の可撓性基材3、及び、可撓性基材3に貼り付けられ、錠剤を収容するための複数の膨出部4aを含む成形基材4と、を有するパッケージ体2と、旋回可能に接続された第1部品50及び第2部品60を有し、第1部品50と第2部品60との間でパッケージ体2を挟んで保持するモジュール体5と、を備えた錠剤管理装置1を使用する方法であって、パッケージ体2から、保護シート45を分離する工程と、保護シート45を分離されたパッケージ体2の端子群17を含む領域をモジュール体5の第1部品50と第2部品60との間で挟んで、パッケージ体2を保持すると共にパッケージ体2の端子群17をモジュール体5のモジュール端子群51に接続する工程と、を備える、錠剤管理装置1の使用方法が提供される。 Moreover, according to this Embodiment, the shaping | molding which is affixed on the flexible base material 3 of the folding state C1, and the flexible base material 3, and contains the several bulging part 4a for accommodating a tablet A package body 2 having a base material 4, a first component 50 and a second component 60 that are pivotably connected, and the package body 2 is sandwiched between the first component 50 and the second component 60. A method of using a tablet management device 1 having a module body 5 to hold, a step of separating the protective sheet 45 from the package body 2, and a terminal group 17 of the package body 2 from which the protective sheet 45 is separated. Is held between the first component 50 and the second component 60 of the module body 5 to hold the package body 2 and connect the terminal group 17 of the package body 2 to the module terminal group 51 of the module body 5. A tablet management device comprising: How to use is provided.
≪第1の実施の形態の変形例≫
 なお、上述した第1の実施の形態に対して様々な変更を加えることが可能である。以下、図面を参照しながら、変形の一例について説明する。以下の説明および以下の説明で用いる図面では、上述した実施の形態と同様に構成され得る部分について、上述の実施の形態における対応する部分に対して用いた符号と同一の符号を用いることとし、重複する説明を省略する。
<< Modification of First Embodiment >>
Various modifications can be made to the above-described first embodiment. Hereinafter, an example of modification will be described with reference to the drawings. In the following description and the drawings used in the following description, the same reference numerals as those used for the corresponding parts in the above embodiment are used for the parts that can be configured in the same manner as in the above embodiment. A duplicate description is omitted.
 上述した実施の形態では、図4に示すように、保護シート45の輪郭が露出領域11の輪郭と重なっている例を示したが、保護シート45の大きさは、上述した例に限定されない。図13に、保護シート45の他の例を示す。図13に示す例では、下基板20が中基板10の内面10bを覆うように折曲補助手段41から折り畳まれている。中基板10のうちの下基板20に覆われなかった部分は、露出領域11を規定し、この露出領域11に保護シート45が貼り付けられている。さらに、保護シート45は、下基板20の、中基板10とは反対側を向く面20bの少なくとも一部を覆っている。 In the above-described embodiment, as illustrated in FIG. 4, the example in which the contour of the protective sheet 45 overlaps the contour of the exposed region 11 is shown, but the size of the protective sheet 45 is not limited to the above-described example. FIG. 13 shows another example of the protective sheet 45. In the example shown in FIG. 13, the lower substrate 20 is folded from the folding assisting means 41 so as to cover the inner surface 10 b of the middle substrate 10. A portion of the middle substrate 10 that is not covered by the lower substrate 20 defines an exposed region 11, and a protective sheet 45 is attached to the exposed region 11. Further, the protective sheet 45 covers at least a part of the surface 20 b of the lower substrate 20 facing the side opposite to the middle substrate 10.
 図13に示す例では、保護シート45は、下基板20の中基板10とは反対側を向く面20bの全域を覆っている。そして、保護シート45は、中基板10の露出領域11と、下基板20の中基板10とは反対側を向く面20bと、に渡って剥離可能に貼り付けられている。この場合、下基板20は、中基板10と保護シート45との間に位置することになる。 In the example shown in FIG. 13, the protective sheet 45 covers the entire surface 20 b facing the opposite side of the middle substrate 10 of the lower substrate 20. The protective sheet 45 is detachably attached across the exposed region 11 of the middle substrate 10 and the surface 20b facing the opposite side of the middle substrate 10 of the lower substrate 20. In this case, the lower substrate 20 is positioned between the middle substrate 10 and the protective sheet 45.
 図14は、図13に示す保護シート45を示す平面図である。図14に示すように、保護シート45には、可撓性基材3つまり錠剤管理装置1の使用方法に関する視覚情報48が記載されている。図14に示す視覚情報48は、パッケージ体2をモジュール体5に装着する際に注意すべき情報を表示している。このような形態によれば、パッケージ体2のモジュール体5への装着不良を低減することに寄与する。 FIG. 14 is a plan view showing the protective sheet 45 shown in FIG. As shown in FIG. 14, the protective sheet 45 describes visual information 48 regarding how to use the flexible base material 3, that is, the tablet management device 1. The visual information 48 shown in FIG. 14 displays information to be noted when the package body 2 is attached to the module body 5. According to such a form, it contributes to reducing mounting failure of the package body 2 to the module body 5.
 しかして、図13に示す可撓性基材3によれば、保護シート45は、折畳状態C1において、第2基板(下基板)20の第1基板(中基板)10とは反対側を向く面20bの少なくとも一部を覆い且つ当該面20bに剥離可能に貼り付けられている。このような形態によれば、保護シート45によって、第2基板(下基板)20の第1基板(中基板)10とは反対側を向く面20bを保護することができる。とりわけ、可撓性基材3に複数の膨出部4aを含む成形基材4が貼り付けられている場合、保護シート45が第2基板(下基板)20をも覆うことから、第2基板(下基板)20を突き破って成形基材4の膨出部4aから錠剤を取り出し難くすることができる。このように、保護シート45によって内容物を取り出し難くすることは、可撓性基材3にチャイルドレジスタンス機能を付与することができる点で、大きな利点をもつ。 Thus, according to the flexible base 3 shown in FIG. 13, the protective sheet 45 is placed on the opposite side of the second substrate (lower substrate) 20 from the first substrate (middle substrate) 10 in the folded state C1. It covers at least part of the facing surface 20b and is detachably attached to the surface 20b. According to such a form, the surface 20b of the second substrate (lower substrate) 20 facing the side opposite to the first substrate (middle substrate) 10 can be protected by the protective sheet 45. In particular, when the molding base 4 including the plurality of bulging portions 4a is attached to the flexible base 3, the protective sheet 45 also covers the second substrate (lower substrate) 20, so that the second substrate It is possible to make it difficult to take out the tablet from the bulging portion 4a of the molding base 4 by breaking through the (lower substrate) 20. Thus, making it difficult to take out the contents by the protective sheet 45 has a great advantage in that a child resistance function can be imparted to the flexible substrate 3.
 また、上述した実施の形態では、図11及び図12に示すように、可撓性基材3が3つの基板10、20、30を含む例を示したが、可撓性基材3の構成は、上述した例に限定されない。可撓性基材3は、端子群17を含む導電回路パターン15が形成された第1基板10と、折曲補助手段41を介して第1基板10に接続された第2基板20と、を含む限り、必要に応じて、さらに別の基板を含んでもよいし、図27に示すように、2つの基板10、20からなってもよい。 Moreover, in embodiment mentioned above, as shown in FIG.11 and FIG.12, although the flexible base material 3 showed the example containing the three board | substrates 10, 20, and 30, the structure of the flexible base material 3 was shown. Is not limited to the example described above. The flexible substrate 3 includes the first substrate 10 on which the conductive circuit pattern 15 including the terminal group 17 is formed, and the second substrate 20 connected to the first substrate 10 via the bending auxiliary means 41. As long as it is included, another substrate may be included as necessary, or two substrates 10 and 20 may be included as shown in FIG.
 すなわち、図27に示す可撓性基材3は、可撓性をもつ紙またはプラスチックからなる単一のシート3aを、長手方向に二等分して折り畳んだ構造になっている。 That is, the flexible substrate 3 shown in FIG. 27 has a structure in which a single sheet 3a made of flexible paper or plastic is divided into two equal parts in the longitudinal direction.
 図27に示すように、シート3aは、シート3aの長手方向ldにこの順で並べられた下基板20及び中基板10を含んでいる。下基板20と中基板10とは、折曲補助手段41を介して接続されている。図27に示す展開状態から、下基板20と中基板10とを折曲補助手段41を利用して折り畳むと、可撓性基材3は、図2乃至図4に示す状態となる。 27, the sheet 3a includes the lower substrate 20 and the middle substrate 10 arranged in this order in the longitudinal direction ld of the sheet 3a. The lower substrate 20 and the middle substrate 10 are connected via a bending assist means 41. When the lower substrate 20 and the middle substrate 10 are folded using the folding assisting means 41 from the developed state shown in FIG. 27, the flexible base material 3 is in the state shown in FIGS.
 図27に示すように、下基板20に覆われるようになる中基板10の内面10bには、膨出部4aから錠剤が取り出された情報を検出するための導電回路パターン15が配置されている。中基板10に配置された導電回路パターン15は、重ねられた下基板20に覆われ、利用者から観察されないようになっている。また、中基板10には、膨出部4aの形状に対応したつなぎを有する複数の繰抜用切れ目18が設けられている。 As shown in FIG. 27, on the inner surface 10b of the middle substrate 10 that is to be covered with the lower substrate 20, a conductive circuit pattern 15 for detecting the information that the tablet is taken out from the bulging portion 4a is arranged. . The conductive circuit pattern 15 arranged on the middle substrate 10 is covered with the lower substrate 20 that is overlaid, and is not observed by the user. Further, the middle substrate 10 is provided with a plurality of drawing cuts 18 having a connection corresponding to the shape of the bulging portion 4a.
 とりわけ、導電回路パターン15をなす配線16は、中基板10のうちの繰抜用切れ目18に囲まれる領域内を横断した複数の分枝16aを含んでいる。このことにより、膨出部4aに収容された錠剤を取り出すべく、繰抜用切れ目18に沿って中基板10が繰り抜かれると、分枝16aのうちの繰抜用切れ目18内に位置する部分が破断されるようになっている。 In particular, the wiring 16 forming the conductive circuit pattern 15 includes a plurality of branches 16 a that traverse the region surrounded by the cutout 18 in the middle substrate 10. Accordingly, when the middle substrate 10 is pulled out along the pulling cut 18 to take out the tablet accommodated in the bulging portion 4a, the portion located in the pulling cut 18 in the branch 16a. Is to be broken.
 また、配線16は、複数の繰抜用切れ目18が配置された領域とは異なる領域に配置された端子群17に電気的に接続されている。図27に示す例では、端子群17は、シート3aの長手方向ldに並べられた複数の端子17aを含み、各端子17aに、繰抜用切れ目18に掛け渡された配線16の分枝16aが接続されている。 Further, the wiring 16 is electrically connected to the terminal group 17 disposed in a region different from the region where the plurality of cutouts 18 are disposed. In the example shown in FIG. 27, the terminal group 17 includes a plurality of terminals 17a arranged in the longitudinal direction ld of the sheet 3a, and the branch 16a of the wiring 16 spanned over the cutout 18 for each terminal 17a. Is connected.
 第2基板としての下基板20は、図4に示す折畳状態C1において、最も下側に重ねられた層をなす。下基板20は、中基板10に配置された導電回路パターン15を保護する機能をもつ。下基板20には、膨出部4aの形状に対応した開口部21Aが設けられている。 The lower substrate 20 as the second substrate forms a layer stacked on the lowermost side in the folded state C1 shown in FIG. The lower substrate 20 has a function of protecting the conductive circuit pattern 15 disposed on the middle substrate 10. The lower substrate 20 is provided with an opening 21A corresponding to the shape of the bulging portion 4a.
 図27に示すパッケージ体2においては、互いに重ねられた中基板10と下基板20とがヒートシールされるようになっている。 In the package body 2 shown in FIG. 27, the middle substrate 10 and the lower substrate 20 that are stacked on each other are heat-sealed.
 隣り合う基板10、20の間の各折曲補助手段41は、当該隣り合う2つの基板10、20を折り曲げた際に、当該折曲補助手段41を設けられた位置にて基板10、20が折り曲げられること、さらには基板10、20が折り畳まれることを促進するためのものである。折曲補助手段41は、隣り合う2つの基板10、20の境界となる位置で、シート3aの短手方向sdに沿って直線状に延びている。 Each folding auxiliary means 41 between the adjacent substrates 10 and 20 is arranged such that when the two adjacent substrates 10 and 20 are bent, the substrates 10 and 20 are located at the position where the bending auxiliary means 41 is provided. This is intended to facilitate folding and further folding the substrates 10 and 20. The bending assisting means 41 extends linearly along the short direction sd of the sheet 3a at a position that is a boundary between two adjacent substrates 10 and 20.
 折曲補助手段41は、それ自体既知の態様で実現され得る。例えば、折曲補助手段41は、連続的に形成された溝からなるハーフカットラインであってもよいし、断続的に形成された破線(ミシン目)であってもよい。 The folding assist means 41 can be realized in a manner known per se. For example, the bending assisting means 41 may be a half-cut line composed of continuously formed grooves, or may be a broken line (perforation) formed intermittently.
 図27に示す例では、シート3aの長手方向ldに沿った2つの基板10、20の長さは、等しく設定されている一方で、シート3aの短手方向sdに沿った中基板10の長さは、シート3aの短手方向sdに沿った下基板20の長さよりも長くなっている。 In the example shown in FIG. 27, the lengths of the two substrates 10 and 20 along the longitudinal direction ld of the sheet 3a are set equal, while the length of the middle substrate 10 along the lateral direction sd of the sheet 3a. This is longer than the length of the lower substrate 20 along the short direction sd of the sheet 3a.
 このようなシート3aによれば、図27に示す展開状態から、下基板20を中基板10の内面10b(図12参照)を覆うように折曲補助手段41から折り畳むことで、図4に示す折畳状態C1となる。図4に示す状態において、中基板10の下基板20よりも突き出た部分は、当該下基板20から露出した露出領域11を規定している。そして、この中基板10のうちの下基板20よりも突き出た露出領域11に、導電回路パターン15の端子群17が配置されている。端子群17を下基板20から露出した露出領域11に配置することにより、モジュール体5のモジュール端子群51への接続を容易にする。 According to such a sheet 3a, the lower substrate 20 is folded from the folding assisting means 41 so as to cover the inner surface 10b (see FIG. 12) of the middle substrate 10 from the unfolded state shown in FIG. It will be in the folded state C1. In the state shown in FIG. 4, a portion protruding from the lower substrate 20 of the middle substrate 10 defines an exposed region 11 exposed from the lower substrate 20. A terminal group 17 of the conductive circuit pattern 15 is arranged in the exposed region 11 protruding from the lower substrate 20 of the middle substrate 10. By arranging the terminal group 17 in the exposed region 11 exposed from the lower substrate 20, the module body 5 can be easily connected to the module terminal group 51.
 ただし、上述のように、導電回路パターン15の端子群17が外部に露出していると、輸送中や保管中に他の部材と接触して端子群が破損や損傷する可能性がある。そこで、図4に示すように、露出領域11を覆う保護シート45が、当該露出領域11に貼り付けられている。本実施の形態の保護シート45は、露出領域11の全域を覆い、保護シート45の輪郭は、当該露出領域11の輪郭と重なっている。 However, as described above, if the terminal group 17 of the conductive circuit pattern 15 is exposed to the outside, the terminal group may be damaged or damaged due to contact with other members during transportation or storage. Therefore, as shown in FIG. 4, a protective sheet 45 covering the exposed region 11 is attached to the exposed region 11. The protective sheet 45 of the present embodiment covers the entire area of the exposed area 11, and the outline of the protective sheet 45 overlaps the outline of the exposed area 11.
 本実施の形態において、保護シート45は、露出領域11に剥離可能に貼り付けられている。この場合、保護シート45を露出領域11から剥離したときに、粘着成分が露出領域11に転移することを抑えることができる。なお、保護シート45は、露出領域11に再接合可能に構成されていてもよいし、再接合不能に構成されていてもよい。 In this embodiment, the protective sheet 45 is detachably attached to the exposed region 11. In this case, when the protective sheet 45 is peeled from the exposed region 11, it is possible to suppress the adhesive component from being transferred to the exposed region 11. The protective sheet 45 may be configured to be rejoinable to the exposed region 11 or may be configured to be non-rejoinable.
≪第2の実施の形態≫
 次に、図15乃至図17を参照して、第2の実施の形態について説明する。図15は、第2の実施の形態における可撓性基材3を示す平面図あり、図16及び図17は、それぞれ、図15に示す可撓性基材3を拡げた状態で示す平面図及び底面図である。図15乃至図17を参照して説明する第2の実施の形態は、保護シート45の代わりに延出保護片46が設けられている点で異なるが、その他の構成は、第1の実施形態およびその変形例と同様に構成することができる。第2の実施の形態に関する以下の説明および以下の説明で用いる図面では、上述した第1の実施の形態およびその変形例と同様に構成され得る部分について、上述の第1の実施の形態およびその変形例における対応する部分に対して用いた符号と同一の符号を用いることとし、重複する説明を省略する。
<< Second Embodiment >>
Next, a second embodiment will be described with reference to FIGS. 15 to 17. FIG. 15 is a plan view showing the flexible substrate 3 in the second embodiment, and FIGS. 16 and 17 are plan views showing the flexible substrate 3 shown in FIG. 15 in an expanded state, respectively. FIG. The second embodiment described with reference to FIGS. 15 to 17 is different in that an extended protection piece 46 is provided instead of the protection sheet 45, but the other configuration is the first embodiment. And it can comprise similarly to the modification. In the following description of the second embodiment and the drawings used in the following description, the first embodiment described above and the parts thereof that can be configured in the same manner as the first embodiment described above and the modifications thereof are described. The same reference numerals as those used for the corresponding parts in the modification are used, and redundant description is omitted.
 図15乃至図17に示すように、中基板10に延出保護片46が接続されている。延出保護片46は、中基板10の露出領域11に折り曲げ可能に接続されている。延出保護片46を中基板10に対して折り畳むことによって、露出領域11に配置された端子群17を延出保護片46で覆うことができる。 As shown in FIGS. 15 to 17, the extended protective piece 46 is connected to the middle substrate 10. The extension protection piece 46 is foldably connected to the exposed region 11 of the middle substrate 10. By folding the extension protection piece 46 with respect to the middle substrate 10, the terminal group 17 arranged in the exposed region 11 can be covered with the extension protection piece 46.
 本実施の形態の延出保護片46は、折り畳んだ状態において、露出領域11の全域を覆い、保護シート45の輪郭が、露出領域11の輪郭と重なるようになっている。 In the folded state, the extended protection piece 46 of the present embodiment covers the entire exposed area 11 so that the outline of the protective sheet 45 overlaps the outline of the exposed area 11.
 とりわけ、図16及び図17に示すように、延出保護片46は、中基板10のうちの、下基板20が接続された縁部10cに接続され、下基板20とシート3aの短手方向sdに並んでいる。ただし、延出保護片46は、下基板20とは接続されていない。 In particular, as shown in FIGS. 16 and 17, the extension protection piece 46 is connected to the edge portion 10 c of the middle substrate 10 to which the lower substrate 20 is connected, and the short direction of the lower substrate 20 and the sheet 3 a. It is lined up in sd. However, the extension protection piece 46 is not connected to the lower substrate 20.
 また、図15乃至図17に示す例では、延出保護片46は、切断補助手段42を介して中基板10に接続されている。すなわち、延出保護片46は、中基板10から切断補助手段42に沿って切り離し可能となるように接続されている。切断補助手段42は、延出保護片46と中基板10との境界となる位置で、シート3aの短手方向sdに沿って直線状に延びている。 Further, in the example shown in FIGS. 15 to 17, the extended protection piece 46 is connected to the middle substrate 10 via the cutting assisting means 42. That is, the extension protection piece 46 is connected so as to be separated from the middle substrate 10 along the cutting assisting means 42. The cutting assisting means 42 extends linearly along the short direction sd of the sheet 3a at a position that becomes a boundary between the extended protection piece 46 and the middle substrate 10.
 切断補助手段42は、当該切断補助手段42を介して接続された延出保護片46と中基板10とを切断を意図して引き離した際に、当該切断補助手段42を設けられた位置にて延出保護片46と中基板10とが切り離されることを促進するためのものである。この切断補助手段42は、それ自体既知の態様で実現され得る。一例として、切断補助手段42は、シート3aを貫通するようにして断続的に形成された切れ目からなるミシン目や、シート3aに連続的に形成された溝からなるハーフカットラインであってもよい。 The cutting assisting means 42 is located at the position where the cutting assisting means 42 is provided when the extended protection piece 46 and the intermediate substrate 10 connected via the cutting assisting means 42 are separated from each other with the intention of cutting. This is to facilitate the separation of the extension protection piece 46 and the middle substrate 10. This cutting assisting means 42 can be realized in a manner known per se. As an example, the cutting assisting means 42 may be a perforation composed of cuts intermittently formed so as to penetrate the sheet 3a or a half cut line composed of grooves continuously formed in the sheet 3a. .
 このように構成された延出保護片46は、切断補助手段42を基準として露出領域11に対して旋回することができる。その一方で、延出保護片46は、中基板10と切断を意図して引き離されると、当該切断補助手段42を設けられた位置にて中基板10と切り離され得る。なお、延出保護片46は、端子群17を覆った状態で、露出領域11に剥離可能に接合されていてもよい。 The extended protection piece 46 configured in this manner can be turned with respect to the exposed region 11 with the cutting assisting means 42 as a reference. On the other hand, when the extended protection piece 46 is separated from the middle substrate 10 for the purpose of cutting, the extended protection piece 46 can be separated from the middle substrate 10 at the position where the cutting assisting means 42 is provided. In addition, the extension protection piece 46 may be detachably joined to the exposed region 11 while covering the terminal group 17.
 本実施の形態の可撓性基材3において、中基板10、下基板20、上基板30及び延出保護片46は、単一のシート3aを区画することにより得られる。すなわち、中基板10、下基板20、上基板30及び延出保護片46は、一体に成形されている。 In the flexible base material 3 of the present embodiment, the middle substrate 10, the lower substrate 20, the upper substrate 30, and the extended protection piece 46 are obtained by partitioning a single sheet 3a. That is, the middle substrate 10, the lower substrate 20, the upper substrate 30, and the extended protection piece 46 are integrally formed.
 以上のように、本実施の形態によれば、端子群17を含む導電回路パターン15が一方の面10bに形成された第1基板(中基板)10と、折曲補助手段41を介して第1基板(中基板)10に接続された第2基板(下基板)20と、を備え、第1基板(中基板)10は、折曲補助手段41から折り畳まれて一方の面(内面)10bに第2基板(下基板)20を重ねられた折畳状態C1において、当該第2基板(下基板)20から露出する露出領域11を有し、且つ、露出領域11に導電回路パターン15の端子群17が配置されていて、前記折畳状態C1において端子群17を覆うことが可能な延出保護片46が、第1基板(中基板)10に接続されている。このような形態によれば、第2基板(下基板)20を第1基板(中基板)10の一方の面(内面)10bを覆うように折曲補助手段41から折り畳んだ状態において、延出保護片46が、導電回路パターン15の端子群17を覆うことができる。これにより、導電回路パターン15の端子群17を保護し、当該端子群17が輸送中や保管中に他の部材と接触して剥がれてしまうおそれを大きく低減することができる。 As described above, according to the present embodiment, the first substrate (middle substrate) 10 in which the conductive circuit pattern 15 including the terminal group 17 is formed on the one surface 10 b and the bending auxiliary means 41 are used to A second substrate (lower substrate) 20 connected to one substrate (middle substrate) 10, and the first substrate (middle substrate) 10 is folded from the folding assisting means 41 to be one surface (inner surface) 10 b. In the folded state C1 in which the second substrate (lower substrate) 20 is overlaid, the exposed region 11 is exposed from the second substrate (lower substrate) 20, and the terminal of the conductive circuit pattern 15 is provided in the exposed region 11. The group 17 is arranged, and the extended protection piece 46 capable of covering the terminal group 17 in the folded state C <b> 1 is connected to the first substrate (medium substrate) 10. According to such a configuration, the second substrate (lower substrate) 20 is extended in a state where the second substrate (lower substrate) 20 is folded from the folding auxiliary means 41 so as to cover one surface (inner surface) 10 b of the first substrate (middle substrate) 10. The protective piece 46 can cover the terminal group 17 of the conductive circuit pattern 15. Thereby, the terminal group 17 of the conductive circuit pattern 15 can be protected, and the possibility that the terminal group 17 may come into contact with other members during transportation or storage can be greatly reduced.
 また、本実施の形態によれば、延出保護片46は、第1基板(中基板)10の露出領域11に切断補助手段42を介して接続されている。パッケージ体2をモジュール体5に装着する前に、延出保護片46を切断補助手段42に沿って第1基板(中基板)10から切り離すことで、延出保護片46がモジュール体5と干渉することを防止することができる。すなわち、パッケージ体2をモジュール体5に装着する作業性の観点から、延出保護片46が露出領域11に切断補助手段42を介して接続されていることが好ましい。 Further, according to the present embodiment, the extended protection piece 46 is connected to the exposed region 11 of the first substrate (medium substrate) 10 via the cutting assist means 42. Before attaching the package body 2 to the module body 5, the extension protection piece 46 is separated from the first substrate (medium substrate) 10 along the cutting auxiliary means 42, so that the extension protection piece 46 interferes with the module body 5. Can be prevented. That is, from the viewpoint of workability for mounting the package body 2 to the module body 5, it is preferable that the extended protection piece 46 is connected to the exposed region 11 via the cutting assisting means 42.
 また、本実施の形態によれば、第1基板(中基板)10、第2基板(下基板)20及び延出保護片46は、単一のシートを区画することにより得られる。この場合、工業的な生産過程で可撓性基材3を効率よく作製することができる。 Further, according to the present embodiment, the first substrate (middle substrate) 10, the second substrate (lower substrate) 20, and the extended protection piece 46 are obtained by partitioning a single sheet. In this case, the flexible base material 3 can be efficiently produced in an industrial production process.
≪第2の実施の形態の変形例≫
 なお、上述した第2の実施の形態に対して様々な変更を加えることが可能である。例えば、上述した実施の形態において、カバーシート47がさらに設けられていてもよい。図18に、カバーシート47がさらに設けられたれた例を示す。図18に示す例では、下基板20が中基板10の内面10bを覆うように折曲補助手段41から折り畳まれている。
<< Modification of Second Embodiment >>
Various modifications can be made to the above-described second embodiment. For example, in the embodiment described above, the cover sheet 47 may be further provided. FIG. 18 shows an example in which a cover sheet 47 is further provided. In the example shown in FIG. 18, the lower substrate 20 is folded from the folding assisting means 41 so as to cover the inner surface 10 b of the middle substrate 10.
 この状態で、カバーシート47が、下基板20の中基板10とは反対側を向く面20bの少なくとも一部を覆っている。この場合、下基板20は、中基板10と保護シート45との間に位置することになる。 In this state, the cover sheet 47 covers at least a part of the surface 20b facing the side opposite to the middle substrate 10 of the lower substrate 20. In this case, the lower substrate 20 is positioned between the middle substrate 10 and the protective sheet 45.
 図18に示す例では、カバーシート47は、下基板20の中基板10とは反対側を向く面20bの全域を覆っている。そして、カバーシート47は、中基板10の露出領域11と、下基板20の中基板10とは反対側を向く面20bと、に渡って剥離可能に貼り付けられている。 In the example shown in FIG. 18, the cover sheet 47 covers the entire surface 20 b facing the side opposite to the middle substrate 10 of the lower substrate 20. The cover sheet 47 is attached so as to be peelable across the exposed region 11 of the middle substrate 10 and the surface 20b facing the opposite side of the middle substrate 10 of the lower substrate 20.
 なお、図18に示すカバーシート47は、上述の保護シート45と同様な材料を用いて構成することができる。また、図14に示す保護シート45と同様に、カバーシート47に、可撓性基材3つまり錠剤管理装置1の使用方法に関する視覚情報48が記載されていてもよい。このような形態によれば、パッケージ体2のモジュール体5への装着不良を低減することに寄与する。 Note that the cover sheet 47 shown in FIG. 18 can be configured using the same material as that of the protective sheet 45 described above. Similarly to the protective sheet 45 shown in FIG. 14, the cover sheet 47 may include visual information 48 relating to the usage method of the flexible base material 3, that is, the tablet management device 1. According to such a form, it contributes to reducing mounting failure of the package body 2 to the module body 5.
 しかして、図18に示す可撓性基材3によれば、カバーシート47が、折畳状態C1において、第2基板(下基板)20の第1基板(中基板)10とは反対側を向く面20bの少なくとも一部を覆い且つ当該面20bに剥離可能に貼り付けられている。このような形態によれば、カバーシート47によって、第2基板(下基板)20の第1基板(中基板)10とは反対側を向く面20bを保護することができる。とりわけ、可撓性基材3に複数の膨出部4aを含む成形基材4が貼り付けられている場合、カバーシート47が第2基板(下基板)20をも覆うことから、第2基板(下基板)20を突き破って成形基材4の膨出部4aから錠剤を取り出し難くすることができる。このように、カバーシート47によって内容物を取り出し難くすることは、可撓性基材3にチャイルドレジスタンス機能を付与することができる点で、大きな利点をもつ。 Thus, according to the flexible base material 3 shown in FIG. 18, the cover sheet 47 is placed on the opposite side of the second substrate (lower substrate) 20 from the first substrate (middle substrate) 10 in the folded state C1. It covers at least part of the facing surface 20b and is detachably attached to the surface 20b. According to such a form, the cover sheet 47 can protect the surface 20b of the second substrate (lower substrate) 20 facing the side opposite to the first substrate (middle substrate) 10. In particular, when the molding substrate 4 including the plurality of bulging portions 4a is attached to the flexible substrate 3, the cover sheet 47 also covers the second substrate (lower substrate) 20, so that the second substrate It is possible to make it difficult to take out the tablet from the bulging portion 4a of the molding base 4 by breaking through the (lower substrate) 20. Thus, making it difficult to take out the contents by the cover sheet 47 has a great advantage in that a child resistance function can be imparted to the flexible substrate 3.
 また、上述した実施の形態において、延出保護片46に摘まみ49がさらに設けられていてもよい。図19に、延出保護片46に摘まみ49がさらに設けられた例を示す。図19に示す例では、延出保護片46のうちの、中基板10に接続された縁部とは反対側の縁部に、摘まみ49が接続されている。摘まみ49は、延出保護片46で露出領域11を覆った状態において当該露出領域11から露出している。このため、延出保護片46で露出領域11を覆った状態において摘まみ49を摘まんで持ち上げることにより、延出保護片46を露出領域11から容易に捲り上げることができる。 Further, in the above-described embodiment, a knob 49 may be further provided on the extended protection piece 46. FIG. 19 shows an example in which a knob 49 is further provided on the extended protection piece 46. In the example shown in FIG. 19, a knob 49 is connected to the edge of the extended protection piece 46 opposite to the edge connected to the middle substrate 10. The knob 49 is exposed from the exposed region 11 in a state where the exposed region 11 is covered with the extended protection piece 46. For this reason, the extension protection piece 46 can be easily lifted from the exposure area 11 by picking and lifting the knob 49 in a state where the extension protection piece 46 covers the exposure area 11.
 また、上述した実施の形態において、延出保護片46に覆われる露出領域11に切込み19がさらに設けられていてもよい。図20に、露出領域11に切込み19がさらに設けられた例を示す。図20に示す例では、中基板10の露出領域11に切込み19が接続されている。切込み19は、延出保護片46で露出領域11を覆った状態において当該延出保護片46に覆われる。このため、延出保護片46で露出領域11を覆った状態において切込み19を介して延出保護片46を摘まむことにより、延出保護片46を露出領域11から容易に捲り上げることができる。 Further, in the above-described embodiment, the cut 19 may be further provided in the exposed region 11 covered with the extended protection piece 46. FIG. 20 shows an example in which a cut 19 is further provided in the exposed region 11. In the example shown in FIG. 20, a cut 19 is connected to the exposed region 11 of the middle substrate 10. The cut 19 is covered with the extended protective piece 46 in a state where the exposed region 11 is covered with the extended protective piece 46. For this reason, the extension protection piece 46 can be easily lifted from the exposure area 11 by picking the extension protection piece 46 through the notch 19 in a state where the extension protection piece 46 covers the exposure area 11. .
 また、上述した実施の形態では、図16及び図17に示すように、延出保護片46が中基板10に接続された例を示したが、延出保護片46の配置は、上述した例に限定されない。図21乃至図23に、延出保護片46の他の配置例を示す。このうち、図21は、可撓性基材3を折り畳んだ状態で示す平面図あり、図22及び図23は、それぞれ、図21に示す可撓性基材3を拡げた状態で示す平面図及び底面図である。 Further, in the above-described embodiment, as shown in FIGS. 16 and 17, the example in which the extension protection piece 46 is connected to the middle substrate 10 is shown. However, the arrangement of the extension protection piece 46 is the example described above. It is not limited to. FIG. 21 to FIG. 23 show other arrangement examples of the extended protection piece 46. 21 is a plan view showing the flexible base material 3 in a folded state, and FIGS. 22 and 23 are plan views showing the flexible base material 3 shown in FIG. 21 in an expanded state. FIG.
 図21乃至図23に示す例では、下基板20に延出保護片46が接続されている。延出保護片46は、下基板20に折り曲げ可能に接続され、中基板10の露出領域11とシート3aの長手方向ldに並んでいる。ただし、延出保護片46は、中基板10とは接続されておらず、当該中基板10との間に隙間を形成している。 In the example shown in FIG. 21 to FIG. 23, the extended protection piece 46 is connected to the lower substrate 20. The extension protection piece 46 is foldably connected to the lower substrate 20 and is aligned with the exposed region 11 of the middle substrate 10 and the longitudinal direction ld of the sheet 3a. However, the extended protection piece 46 is not connected to the middle substrate 10, and forms a gap between the middle protection substrate 10.
 本実施の形態の延出保護片46は、拡げた状態において、露出領域11の全域を覆い、延出保護片46の輪郭が、露出領域11の輪郭と重なることができるようになっている。 The extended protection piece 46 of the present embodiment covers the entire exposed region 11 in an expanded state, and the contour of the extended protective piece 46 can overlap the contour of the exposed region 11.
 とりわけ、図21乃至図23に示す例では、延出保護片46は、切断補助手段42を介して下基板20に接続されている。すなわち、延出保護片46は、下基板20から切断補助手段42に沿って切り離し可能となるように接続されている。切断補助手段42は、延出保護片46と下基板20との境界となる位置で、シート3aの長手方向ldに沿って直線状に延びている。 In particular, in the example shown in FIGS. 21 to 23, the extended protection piece 46 is connected to the lower substrate 20 via the cutting assisting means 42. That is, the extended protection piece 46 is connected so as to be able to be separated from the lower substrate 20 along the cutting assisting means 42. The cutting assisting means 42 extends linearly along the longitudinal direction ld of the sheet 3 a at a position that becomes a boundary between the extended protection piece 46 and the lower substrate 20.
 また、このように構成された延出保護片46は、切断補助手段42を基準として下基板20に対して旋回することができる。その一方で、延出保護片46は、下基板20と切断を意図して引き離されると、当該切断補助手段42を設けられた位置にて下基板20と切り離され得る。なお、延出保護片46は、端子群17を覆った状態で、露出領域11に剥離可能に接合されていてもよい。 Further, the extending protection piece 46 configured as described above can be swung with respect to the lower substrate 20 with the cutting assisting means 42 as a reference. On the other hand, when the extended protection piece 46 is separated from the lower substrate 20 for the purpose of cutting, it can be separated from the lower substrate 20 at a position where the cutting assisting means 42 is provided. In addition, the extension protection piece 46 may be detachably joined to the exposed region 11 while covering the terminal group 17.
 本実施の形態の可撓性基材3において、中基板10、下基板20、上基板30及び延出保護片46は、単一のシート3aを区画することにより得られる。すなわち、中基板10、下基板20、上基板30及び延出保護片46は、一体に成形されている。 In the flexible base material 3 of the present embodiment, the middle substrate 10, the lower substrate 20, the upper substrate 30, and the extended protection piece 46 are obtained by partitioning a single sheet 3a. That is, the middle substrate 10, the lower substrate 20, the upper substrate 30, and the extended protection piece 46 are integrally formed.
 以上のように、本実施の形態によれば、端子群17を含む導電回路パターン15が一方の面10bに形成された第1基板(中基板)10と、折曲補助手段41を介して第1基板(中基板)10に接続された第2基板(下基板)20と、を備え、第1基板(中基板)10は、折曲補助手段41から折り畳まれて一方の面10bに第2基板(下基板)20を重ねられた折畳状態C1において、当該第2基板(下基板)20から露出する露出領域11を有し、且つ、露出領域11に導電回路パターン15の端子群17が配置されていて、前記折畳状態C1において端子群17を覆うことが可能な延出保護片46が、第2基板(下基板)20に接続されている。このような形態によれば、第2基板(下基板)20を第1基板(中基板)10の一方の面10bを覆うように折曲補助手段41から折り畳んだ状態において、延出保護片46が、導電回路パターン15の端子群17を覆うことができる。 As described above, according to the present embodiment, the first substrate (middle substrate) 10 in which the conductive circuit pattern 15 including the terminal group 17 is formed on the one surface 10 b and the bending auxiliary means 41 are used to A second substrate (lower substrate) 20 connected to one substrate (middle substrate) 10, and the first substrate (middle substrate) 10 is folded from the folding assisting means 41 and second on one surface 10 b. In the folded state C1 in which the substrate (lower substrate) 20 is overlaid, the exposed region 11 is exposed from the second substrate (lower substrate) 20, and the terminal group 17 of the conductive circuit pattern 15 is provided in the exposed region 11. An extended protection piece 46 that is disposed and can cover the terminal group 17 in the folded state C <b> 1 is connected to the second substrate (lower substrate) 20. According to such a form, in the state where the second substrate (lower substrate) 20 is folded from the folding auxiliary means 41 so as to cover the one surface 10 b of the first substrate (middle substrate) 10, the extension protection piece 46. However, the terminal group 17 of the conductive circuit pattern 15 can be covered.
 これにより、導電回路パターン15の端子群17を保護し、当該端子群17が輸送中や保管中に他の部材と接触して端子群が破損や損傷する可能性を低減することができる。 Thereby, it is possible to protect the terminal group 17 of the conductive circuit pattern 15 and reduce the possibility that the terminal group 17 comes into contact with other members during transportation or storage and the terminal group is damaged or damaged.
 また、本実施の形態によれば、延出保護片46は、第2基板(下基板)20に切断補助手段42を介して接続されている。パッケージ体2をモジュール体5に装着する前に、延出保護片46を切断補助手段42に沿って第2基板(下基板)20から切り離すことで、延出保護片46がモジュール体5と干渉することを防止することができる。すなわち、パッケージ体2をモジュール体5に装着する作業性の観点から、延出保護片46が露出領域11に切断補助手段42を介して接続されていることが好ましい。 Further, according to the present embodiment, the extension protection piece 46 is connected to the second substrate (lower substrate) 20 via the cutting assisting means 42. Before attaching the package body 2 to the module body 5, the extension protection piece 46 is separated from the second substrate (lower substrate) 20 along the cutting auxiliary means 42, so that the extension protection piece 46 interferes with the module body 5. Can be prevented. That is, from the viewpoint of workability for mounting the package body 2 to the module body 5, it is preferable that the extended protection piece 46 is connected to the exposed region 11 via the cutting assisting means 42.
 なお、以上において上述した実施の形態に対するいくつかの変形例を説明してきたが、当然に、複数の変形例を適宜組み合わせて適用することも可能である。 In addition, although the some modification with respect to embodiment mentioned above was demonstrated above, naturally, it is also possible to apply combining several modifications suitably.
 例えば、図21乃至図23に示す延出保護片46に、図18に示すカバーシート47が貼り付けられていてもよい。すなわち、カバーシート47が、折畳状態C1において、第2基板(下基板)20の第1基板(中基板)10とは反対側を向く面20bの少なくとも一部を覆い且つ当該面20bに剥離可能に貼り付けられてもよい。この場合、カバーシート47によって、第2基板(下基板)20の第1基板(中基板)10とは反対側を向く面20bを保護することができる。とりわけ、可撓性基材3に複数の膨出部4aを含む成形基材4が貼り付けられている場合、カバーシート47が第2基板(下基板)20をも覆うことから、第2基板(下基板)20を突き破って成形基材4の膨出部4aから錠剤を取り出し難くすることができる。このように、カバーシート47によって内容物を取り出し難くすることは、可撓性基材3にチャイルドレジスタンス機能を付与することができる点で、大きな利点をもつ。 For example, the cover sheet 47 shown in FIG. 18 may be attached to the extended protection piece 46 shown in FIGS. That is, the cover sheet 47 covers at least a part of the surface 20b of the second substrate (lower substrate) 20 facing the side opposite to the first substrate (middle substrate) 10 in the folded state C1, and peels off the surface 20b. It may be pasted as possible. In this case, the cover sheet 47 can protect the surface 20b of the second substrate (lower substrate) 20 facing the side opposite to the first substrate (middle substrate) 10. In particular, when the molding substrate 4 including the plurality of bulging portions 4a is attached to the flexible substrate 3, the cover sheet 47 also covers the second substrate (lower substrate) 20, so that the second substrate It is possible to make it difficult to take out the tablet from the bulging portion 4a of the molding base 4 by breaking through the (lower substrate) 20. Thus, making it difficult to take out the contents by the cover sheet 47 has a great advantage in that a child resistance function can be imparted to the flexible substrate 3.
《第3の実施の形態》
 次に図24乃至図26を参照して本発明の第3の実施の形態について説明する。 
 図24乃至図26に示す第3の実施の形態は、パッケージ体2の構成が異なるのみであり、他の構成は図1乃至図23に示す各実施の形態と略同一である。
<< Third Embodiment >>
Next, a third embodiment of the present invention will be described with reference to FIGS.
The third embodiment shown in FIGS. 24 to 26 is different only in the configuration of the package body 2, and the other configurations are substantially the same as those of the embodiments shown in FIGS. 1 to 23.
 先ず、図24、図25(a)(b)および図26を参照して、錠剤を収容するパッケージ体2について説明する。図24は、パッケージ体2を示す平面図である。図24に示すように、パッケージ体2は、パッケージ回路113を含む収容領域110と、収容領域110に接続された後述するパッケージ端子群121を含む取付領域120を有する可撓性基材3と、可撓性基材3の収容領域110内に配置され錠剤Mを収納するための複数、例えば10個の膨出部111を含む成形シート(成形基材)111Aとを備えている。成形シート111Aに収容される錠剤Mとしては、医薬品として用いられるものや健康食品として用いられるものが挙げられる。本実施の形態では、錠剤として、医薬品としての錠剤Mが収容されている。なお、錠剤とは、カプセルやタブレットとも呼ばれ得るものを含む概念である。 First, with reference to FIG. 24, FIG. 25 (a) (b), and FIG. 26, the package body 2 which accommodates a tablet is demonstrated. FIG. 24 is a plan view showing the package body 2. As shown in FIG. 24, the package body 2 includes a flexible substrate 3 having a housing region 110 including a package circuit 113 and a mounting region 120 including a package terminal group 121 described later connected to the housing region 110. A plurality of, for example, 10 shaped bulging portions 111 (molded base material) 111 </ b> A for accommodating the tablet M, which are arranged in the accommodation area 110 of the flexible base material 3, are provided. Examples of the tablet M accommodated in the molded sheet 111A include those used as pharmaceuticals and those used as health foods. In this Embodiment, the tablet M as a pharmaceutical is accommodated as a tablet. In addition, a tablet is a concept including what can also be called a capsule or a tablet.
 パッケージ体2を構成する可撓性基材3は、パッケージ端子群121と、このパッケージ端子群121に接続されたパッケージ回路113が形成された第1基板106と、第1基板106上に重ね合わされる第2基板107と、第2基板107上に重ね合わされる第3基板109とを有する積層構造となっている(図25(a)(b)および図26参照)。このうち、第1基板106と第2基板107は第1折曲補助手段103Aを介して接続され、第1基板106と第3基板109は第2折曲補助手段103Bを介して接続されている。またパッケージ端子群121とパッケージ回路113とにより導電回路パターンが構成されている。 The flexible base 3 constituting the package body 2 is superimposed on the first substrate 106 on which the package terminal group 121 and the package circuit 113 connected to the package terminal group 121 are formed. A laminated structure having a second substrate 107 and a third substrate 109 overlaid on the second substrate 107 (see FIGS. 25A and 25B and FIG. 26). Among these, the first substrate 106 and the second substrate 107 are connected via the first folding assisting means 103A, and the first substrate 106 and the third substrate 109 are connected via the second folding assisting means 103B. . The package terminal group 121 and the package circuit 113 constitute a conductive circuit pattern.
 第1基板106には、破断線106aにより囲まれるとともに膨出部111に対応する10個の破断領域106bが形成され、パッケージ回路113は破断領域106b上を通る複数の分岐113aを有する。 The first substrate 106 is formed with ten break regions 106b surrounded by the break line 106a and corresponding to the bulging portion 111, and the package circuit 113 has a plurality of branches 113a passing over the break region 106b.
 また第2基板107には、破断線107aにより囲まれるとともに膨出部111に対応する10個の破断領域107bが形成されている。また第2基板107には、第1基板106に形成されたパッケージ端子群121を保護する延出保護片108が取付けられている。延出保護片108はパッケージ端子群121を保護する延出保護片として機能し、第2基板107に切断補助手段103Cを介して接続されている。また延出保護片108の両端縁には、延出保護片108を第1基板106から剥離する際に利用する摘み108a、108aが取付けられている。 The second substrate 107 is formed with ten fracture regions 107b surrounded by the fracture line 107a and corresponding to the bulging portion 111. Further, an extension protection piece 108 for protecting the package terminal group 121 formed on the first substrate 106 is attached to the second substrate 107. The extension protection piece 108 functions as an extension protection piece for protecting the package terminal group 121, and is connected to the second substrate 107 via the cutting assisting means 103C. Further, knobs 108 a and 108 a used for peeling the extended protective piece 108 from the first substrate 106 are attached to both end edges of the extended protective piece 108.
 さらに第3基板109には膨出部111に対応して、10個の開口109aが形成されている。 Further, ten openings 109 a are formed in the third substrate 109 corresponding to the bulging portions 111.
 また、第2基板107と第3基板109との間に、錠剤Mを収納する膨出部111が形成された成形シート111A(図25(b)参照)が挿着される。 Also, between the second substrate 107 and the third substrate 109, a molded sheet 111A (see FIG. 25 (b)) in which a bulging portion 111 for storing the tablet M is formed is inserted.
 図25(a)(b)および図26に示すように、このような構成からなる可撓性基材3の、第1基板106上に第2基板107を重ね合わせ、第2基板107上に成形シート111Aを載せ、次に成形シート111A上に第3基板109を重ね合わせることによりパッケージ体2が得られる。 As shown in FIGS. 25A and 25B and FIG. 26, the second substrate 107 of the flexible base material 3 having such a configuration is superimposed on the first substrate 106, and the second substrate 107 is superimposed on the second substrate 107. The package body 2 is obtained by placing the molded sheet 111A and then superimposing the third substrate 109 on the molded sheet 111A.
 上述のように、可撓性基材3の収容領域110には、パッケージ回路113が配置されている。パッケージ回路113は、膨出部111から錠剤が取り出された情報を検出するための回路である。パッケージ回路113は、取付領域120に配置されたパッケージ端子群121に接続されている。 As described above, the package circuit 113 is disposed in the accommodation region 110 of the flexible base material 3. The package circuit 113 is a circuit for detecting information that the tablet has been taken out from the bulging portion 111. The package circuit 113 is connected to a package terminal group 121 arranged in the attachment region 120.
 本実施の形態では、パッケージ回路113は、可撓性基材3の第1基板106のうち、破断領域106bに掛け渡された複数の分枝113aを含み、パッケージ端子群121は、可撓性基材3の幅方向wdに並べられた複数の端子121aを含んでいる。パッケージ端子群121の各端子121aは、対応するパッケージ回路113の分枝113aに接続される。この場合、錠剤を取り出すべく第1基板106の破断領域106bが突き破られると、膨出部111を覆う第1基板106の部分に掛け渡された分枝113aが断線する。この断線した情報が、パッケージ端子群121の対応する端子121aに電気信号として伝わることにより、膨出部111から錠剤が取り出された情報を検出するようになっている。また可撓性基材3の取付領域120には、可撓性基材3の中心線Lから左方にずれて切欠122が設けられている。 In the present embodiment, the package circuit 113 includes a plurality of branches 113a spanning the fracture region 106b of the first substrate 106 of the flexible base 3, and the package terminal group 121 is flexible. A plurality of terminals 121 a arranged in the width direction wd of the base material 3 are included. Each terminal 121 a of the package terminal group 121 is connected to a branch 113 a of the corresponding package circuit 113. In this case, when the fracture region 106b of the first substrate 106 is pierced to take out the tablet, the branch 113a that spans the portion of the first substrate 106 that covers the bulging portion 111 is disconnected. The disconnected information is transmitted as an electrical signal to the corresponding terminal 121a of the package terminal group 121, so that the information that the tablet is taken out from the bulging portion 111 is detected. The attachment region 120 of the flexible base material 3 is provided with a notch 122 that is shifted to the left from the center line L of the flexible base material 3.
 このようなパッケージ体2は、モジュール体5に取り外し可能に装着される。この場合、可撓性基材3に中心線Lから左方にずれた切欠122を設けることにより、モジュール体5(図1参照)内にパッケージ体2の表裏の向きを正しく定めて挿入することができる。 Such a package body 2 is detachably mounted on the module body 5. In this case, by providing the flexible base material 3 with a notch 122 shifted to the left from the center line L, the orientation of the front and back of the package body 2 is correctly determined and inserted into the module body 5 (see FIG. 1). Can do.
 図24乃至図25において、延出保護片108は、切断補助手段103Cを介して第2基板107に接続されている。すなわち、延出保護片108は、第2基板107から切断補助手段103Cに沿って切り離し可能となるように接続されている。切断補助手段103Cは、延出保護片108と第2基板107との境界となる位置で、直線状に延びている。 24 to 25, the extended protection piece 108 is connected to the second substrate 107 through the cutting auxiliary means 103C. That is, the extended protection piece 108 is connected so as to be detachable from the second substrate 107 along the cutting assisting means 103C. The cutting assisting means 103 </ b> C extends linearly at a position that becomes a boundary between the extended protection piece 108 and the second substrate 107.
 切断補助手段103Cは、当該切断補助手段103Cを介して接続された延出保護片108と第2基板107とを切断を意図して引き離した際に、当該切断補助手段103Cがを設けられた位置にて延出保護片108と第2基板107とが切り離されることを促進するためのものである。この切断補助手段103Cは、それ自体既知の態様で実現され得る。一例として、切断補助手段103Cは、シート3aを貫通するようにして断続的に形成された切れ目からなるミシン目や、シート3aに連続的に形成された溝からなるハーフカットラインであってもよい。 The cutting assistance means 103C is located at the position where the cutting assistance means 103C is provided when the extension protection piece 108 and the second substrate 107 connected via the cutting assistance means 103C are separated from each other for the purpose of cutting. This is to facilitate the separation of the extended protection piece 108 and the second substrate 107. This cutting assisting means 103C can be realized in a manner known per se. As an example, the cutting assisting means 103C may be a perforation that is formed intermittently so as to penetrate the sheet 3a, or a half-cut line that is formed by a groove formed continuously in the sheet 3a. .
 このように構成された延出保護片108は、切断補助手段103Cを基準として可撓性基材3の露出領域3Aに対して旋回することができる。その一方で、延出保護片108は、第2基板107と切断を意図して可撓性基材3から摘み108aを摘んで引き離されると、当該切断補助手段103Cを設けられた位置にて第2基板107と切り離され得る。なお、延出保護片108は、パッケージ端子群121を覆った状態で、露出領域3Aに剥離可能に接合されていてもよい。 The extended protection piece 108 configured in this manner can be swung with respect to the exposed region 3A of the flexible base material 3 with reference to the cutting assisting means 103C. On the other hand, when the extended protection piece 108 is separated from the flexible base material 3 by picking the knob 108a with the intention of cutting, the extended protection piece 108 is removed at the position where the cutting auxiliary means 103C is provided. It can be separated from the two substrates 107. In addition, the extension protection piece 108 may be detachably joined to the exposed region 3 </ b> A while covering the package terminal group 121.
 本実施の形態の可撓性基材3において、第1基板106、第2基板107、第3基板109及び延出保護片108は、単一のシート3aを区画することにより得られる。すなわち、第1基板106、第2基板107、第3基板109及び延出保護片108は、一体に成形されている。 In the flexible base material 3 of the present embodiment, the first substrate 106, the second substrate 107, the third substrate 109, and the extended protection piece 108 are obtained by partitioning a single sheet 3a. That is, the first substrate 106, the second substrate 107, the third substrate 109, and the extension protection piece 108 are integrally formed.
 以上のように、本実施の形態において、まずパッケージ端子群121を含む導電回路パターンが一方の面に形成された第1基板106と、第1折曲補助手段103Aを介して第1基板106に接続された第2基板107と、第2折曲補助手段103Bを介して第1基板106に接続された第3基板109とを備えた可撓性基材3を準備する。次に第1基板106上に第2基板107が折り畳まれ、第2基板107上に成形シート111を載置した後第2基板107上に第3基板109が成形シート111を介して折り畳まれて折畳み状態C1を形成する。 As described above, in the present embodiment, first, the first substrate 106 on which the conductive circuit pattern including the package terminal group 121 is formed on one surface and the first substrate 106 via the first folding assisting means 103A. A flexible substrate 3 including a connected second substrate 107 and a third substrate 109 connected to the first substrate 106 via the second bending assisting means 103B is prepared. Next, the second substrate 107 is folded on the first substrate 106, the molded sheet 111 is placed on the second substrate 107, and then the third substrate 109 is folded on the second substrate 107 via the molded sheet 111. A folded state C1 is formed.
 この折畳状態C1において、可撓性基材3の第1基板106は、第2基板107および第3基板109から露出する露出領域3Aを有し、且つ、露出領域3Aに導電回路パターンのパッケージ端子群121が配置されていて、前記折畳状態C1においてパッケージ端子群121を覆うことが可能な延出保護片108が、第2基板107に接続されている。このような形態によれば、第1基板106と第2基板107と第3基板109とを折り畳んだ状態において、延出保護片108が、導電回路パターンのパッケージ端子群121を覆うことができる。これにより、導電回路パターンのパッケージ端子群121を保護し、当該パッケージ端子群121が輸送中や保管中に他の部材と接触して剥がれてしまうおそれを大きく低減することができる。 In this folded state C1, the first substrate 106 of the flexible base 3 has an exposed region 3A exposed from the second substrate 107 and the third substrate 109, and a conductive circuit pattern package in the exposed region 3A. A terminal group 121 is disposed, and an extended protective piece 108 that can cover the package terminal group 121 in the folded state C <b> 1 is connected to the second substrate 107. According to such a configuration, the extended protection piece 108 can cover the package terminal group 121 of the conductive circuit pattern in a state where the first substrate 106, the second substrate 107, and the third substrate 109 are folded. As a result, the package terminal group 121 of the conductive circuit pattern can be protected, and the possibility that the package terminal group 121 comes into contact with other members during transportation or storage can be greatly reduced.
 また、本実施の形態によれば、延出保護片108は、第2基板107に切断補助手段103Cを介して接続されている。パッケージ体2をモジュール体5に装着する前に、延出保護片108を切断補助手段103Cに沿って第2基板107から切り離すことで、延出保護片108がモジュール体5と干渉することを防止することができる。すなわち、パッケージ体2をモジュール体5に装着する作業性の観点から、延出保護片108が切断補助手段103Cを介して接続されていることが好ましい。 Also, according to the present embodiment, the extended protection piece 108 is connected to the second substrate 107 via the cutting assisting means 103C. Before the package body 2 is attached to the module body 5, the extension protection piece 108 is separated from the second substrate 107 along the cutting assisting means 103C to prevent the extension protection piece 108 from interfering with the module body 5. can do. That is, from the viewpoint of workability for mounting the package body 2 on the module body 5, it is preferable that the extended protection piece 108 is connected via the cutting assisting means 103C.
 また、本実施の形態によれば、第1基板106、第2基板107、第3基板109及び延出保護片108は、単一のシートを区画することにより得られる。この場合、工業的な生産過程で可撓性基材3を効率よく作製することができる。 Further, according to the present embodiment, the first substrate 106, the second substrate 107, the third substrate 109, and the extended protection piece 108 are obtained by partitioning a single sheet. In this case, the flexible base material 3 can be efficiently produced in an industrial production process.
1  錠剤管理装置
2  パッケージ体
3  可撓性基材
3a シート
4  成形基材
4a 膨出部
5  モジュール体
10 中基板
10b 内面
11 露出領域
15 導電回路パターン
16 配線
17 端子群
20 下基板
20b 面
30 上基板
41 折曲補助手段
42 切断補助手段
45 保護シート
46 延出保護片
47 カバーシート
48 視覚情報
50 第一部品(本体部品)
51 モジュール端子群
60 第二部品(カバー部品)
103A 第1折曲補助手段
103B 第2折曲補助手段
103C 切断補助手段
106 第1基板
107 第2基板
108 延出保護片
108a 摘み
109 第3基板
111 膨出部
111A 成形シート
113 パッケージ回路
121 パッケージ端子群
DESCRIPTION OF SYMBOLS 1 Tablet management apparatus 2 Package body 3 Flexible base material 3a Sheet 4 Molding base material 4a Swelling part 5 Module body 10 Middle substrate 10b Inner surface 11 Exposed area 15 Conductive circuit pattern 16 Wiring 17 Terminal group 20 Lower substrate 20b Surface 30 Top Substrate 41 Bending auxiliary means 42 Cutting auxiliary means 45 Protective sheet 46 Extension protective piece 47 Cover sheet 48 Visual information 50 First part (main part)
51 Module terminal group 60 Second part (cover part)
103A First folding assisting means 103B Second folding assisting means 103C Cutting assisting means 106 First substrate 107 Second substrate 108 Extended protection piece 108a Knob 109 Third substrate 111 Swelling portion 111A Molded sheet 113 Package circuit 121 Package terminal group

Claims (15)

  1.  端子群を含む導電回路パターンが一方の面に形成された第1基板と、
     折曲補助手段を介して前記第1基板に接続された第2基板と、
    を備え、
     前記第1基板は、前記折曲補助手段から折り畳まれて前記一方の面に前記第2基板が重ねられた折畳状態において、当該第2基板から露出する露出領域を有し、且つ、前記露出領域に前記導電回路パターンの前記端子群が配置されていて、
     前記第1基板及び前記第2基板とは別体に構成された保護シートが、前記折畳状態において前記端子群を覆っている、可撓性基材。
    A first substrate having a conductive circuit pattern including a terminal group formed on one surface;
    A second substrate connected to the first substrate via a bending assisting means;
    With
    The first substrate has an exposed region that is exposed from the second substrate in a folded state in which the first substrate is folded from the folding assisting unit and the second substrate is superimposed on the one surface. The terminal group of the conductive circuit pattern is arranged in a region,
    The flexible base material in which the protective sheet comprised separately from the said 1st board | substrate and the said 2nd board | substrate has covered the said terminal group in the said folded state.
  2.  前記保護シートは、前記露出領域に剥離可能に貼り付けられている、請求項1に記載の可撓性基材。 The flexible substrate according to claim 1, wherein the protective sheet is detachably attached to the exposed region.
  3.  前記保護シートは、前記折畳状態において、前記第2基板の前記第1基板とは反対側を向く面の少なくとも一部を覆い且つ当該面に剥離可能に貼り付けられている、請求項2に記載の可撓性基材。 The protection sheet covers at least a part of a surface of the second substrate facing the side opposite to the first substrate in the folded state and is detachably attached to the surface. The flexible substrate as described.
  4.  前記保護シートに、当該可撓性基材の使用方法に関する視覚情報が記載されている、請求項3に記載の可撓性基材。 The flexible base material according to claim 3, wherein visual information regarding a method of using the flexible base material is described on the protective sheet.
  5.  端子群を含む導電回路パターンが一方の面に形成された第1基板と、
     折曲補助手段を介して前記第1基板に接続された第2基板と、
    を備え、
     前記第1基板は、前記折曲補助手段から折り畳まれて前記一方の面に前記第2基板が重ねられた折畳状態において、当該第2基板から露出する露出領域を有し、且つ、前記露出領域に前記導電回路パターンの前記端子群が配置されていて、
     前記折畳状態において前記端子群を覆うことが可能な延出保護片が、前記第1基板に接続されている、可撓性基材。
    A first substrate having a conductive circuit pattern including a terminal group formed on one surface;
    A second substrate connected to the first substrate via a bending assisting means;
    With
    The first substrate has an exposed region that is exposed from the second substrate in a folded state in which the first substrate is folded from the folding assisting unit and the second substrate is superimposed on the one surface. The terminal group of the conductive circuit pattern is arranged in a region,
    A flexible base material, wherein an extended protective piece capable of covering the terminal group in the folded state is connected to the first substrate.
  6.  前記延出保護片は、前記第1基板の前記露出領域に切断補助手段を介して接続されている、請求項5に記載の可撓性基材。 The flexible base material according to claim 5, wherein the extension protection piece is connected to the exposed region of the first substrate through a cutting assisting means.
  7.  端子群を含む導電回路パターンが一方の面に形成された第1基板と、
     折曲補助手段を介して前記第1基板に接続された第2基板と、
    を備え、
     前記第1基板は、前記折曲補助手段から折り畳まれて前記一方の面に前記第2基板が重ねられた状態において、当該第2基板から露出する露出領域を有し、且つ、前記露出領域に前記導電回路パターンの前記端子群が配置されていて、
     前記折畳状態において前記端子群を覆う延出保護片が、前記第2基板に切断補助手段を介して接続されている、可撓性基材。
    A first substrate having a conductive circuit pattern including a terminal group formed on one surface;
    A second substrate connected to the first substrate via a bending assisting means;
    With
    The first substrate has an exposed region exposed from the second substrate in a state where the first substrate is folded from the folding assisting unit and the second substrate is overlaid on the one surface. The terminal group of the conductive circuit pattern is disposed,
    A flexible base material, wherein an extended protective piece covering the terminal group in the folded state is connected to the second substrate via a cutting assisting means.
  8.  前記第1基板、前記第2基板及び前記延出保護片は、単一のシートを区画することにより得られる、請求項5乃至7のいずれか一項に記載の可撓性基材。 The flexible substrate according to any one of claims 5 to 7, wherein the first substrate, the second substrate, and the extended protection piece are obtained by partitioning a single sheet.
  9.  前記折畳状態において前記第2基板の前記第1基板とは反対側を向く面の少なくとも一部を覆うカバーシートが、設けられている、請求項5乃至8のいずれか一項に記載の可撓性基材。 The cover sheet according to any one of claims 5 to 8, further comprising a cover sheet that covers at least a part of a surface of the second substrate facing away from the first substrate in the folded state. Flexible substrate.
  10.  請求項1乃至9のいずれか一項に記載の、前記折畳状態の可撓性基材、及び、前記可撓性基材に接合され錠剤を収容するための複数の膨出部を含む成形シートと、を有するパッケージ体と、旋回可能に接続された第1部品及び第2部品を有し、前記第1部品と前記第2部品との間で前記パッケージ体を挟んで保持するモジュール体と、を備えた錠剤管理装置を使用する方法であって、
     前記パッケージ体から、前記保護シートまたは前記延出保護片を分離する工程と、
     前記保護シートまたは前記延出保護片を分離された前記パッケージ体の前記端子群を含む領域を、前記モジュール体の前記第1部品と前記第2部品との間で挟んで、前記パッケージ体を保持すると共に前記パッケージ体の前記端子群を前記モジュール体のモジュール端子群に接続する工程と、を備える、錠剤管理装置の使用方法。
    10. Molding comprising the folded flexible base material according to any one of claims 1 to 9, and a plurality of bulges bonded to the flexible base material for accommodating tablets. A module body having a sheet, and a module body having a first part and a second part connected so as to be pivotable and sandwiching the package body between the first part and the second part. Using a tablet management device comprising:
    Separating the protective sheet or the extended protective piece from the package body;
    The package body is held by sandwiching the region including the terminal group of the package body from which the protective sheet or the extended protection piece is separated between the first component and the second component of the module body. And a step of connecting the terminal group of the package body to the module terminal group of the module body.
  11.  端子群を含む導電回路パターンが一方の面に形成された第1基板と、
     折曲補助手段を介して前記第1基板に接続された第2基板と、
    を備え、
     前記第1基板は、前記折曲補助手段から折り畳まれて前記一方の面に前記第2基板が重ねられた折畳状態において、当該第2基板から露出する露出領域を有し、且つ、前記露出領域に前記導電回路パターンの前記端子群が配置されていて、
     保護シートが、前記折畳状態において前記端子群を覆っている可撓性基材と、
     前記第1基板と前記第2基板との間に挾まれた成形シートとを備えたことを特徴とするパッケージ体。
    A first substrate having a conductive circuit pattern including a terminal group formed on one surface;
    A second substrate connected to the first substrate via a bending assisting means;
    With
    The first substrate has an exposed region that is exposed from the second substrate in a folded state in which the first substrate is folded from the folding assisting unit and the second substrate is superimposed on the one surface. The terminal group of the conductive circuit pattern is arranged in a region,
    A protective sheet, a flexible substrate covering the terminal group in the folded state;
    A package body comprising a molded sheet sandwiched between the first substrate and the second substrate.
  12. 端子群を含む導電回路パターンが一方の面に形成された第1基板と、第1折曲補助手段を介して前記第1基板に接続され、第1基板上に重ねられる第2基板と、第2折曲補助手段を介して前記第1基板または前記第2基板に接続され、前記第1基板または第2基板上に重ねられる第3基板とを備え、
     前記第1基板は、前記第1折曲補助手段から折り畳まれて前記一方の面に第2基板が重ねられ、かつ第2折曲補助手段から折り畳まれて前記第1基板または前記第2基板上に前記第3基板が重ねられた折畳状態において、少なくとも前記第2基板から露出する露出領域を有し、且つ、前記露出領域に前記導電回路パターンの前記端子群が配置されていて、
     前記折畳状態において前記端子群を覆うことが可能な延出保護片が、前記第1基板、前記第2基板または前記第3基板に接続されていることを特徴とする可撓性基材。
    A first substrate having a conductive circuit pattern including a terminal group formed on one surface thereof; a second substrate connected to the first substrate via a first folding assisting means; and superimposed on the first substrate; A third substrate connected to the first substrate or the second substrate via two folding assisting means and overlaid on the first substrate or the second substrate;
    The first substrate is folded from the first folding assisting means, the second substrate is overlaid on the one surface, and is folded from the second folding assisting means to be on the first substrate or the second substrate. In the folded state in which the third substrate is overlaid, at least an exposed region exposed from the second substrate is provided, and the terminal group of the conductive circuit pattern is disposed in the exposed region,
    An extended protective piece capable of covering the terminal group in the folded state is connected to the first substrate, the second substrate, or the third substrate.
  13.  端子群を含む導電回路パターンが一方の面に形成された第1基板と、第1折曲補助手段を介して前記第1基板に接続され、第1基板上に重ねられる第2基板と、第2折曲補助手段を介して前記第1基板または前記第2基板に接続され、前記第1基板または前記第2基板上に重ねられる第3基板とを有する可撓性基材と、
     前記第1基板と前記第3基板との間、または前記第2基板と前記第3基板との間に挟まれた成形シートとを備え、
     前記第1基板は、前記第1折曲補助手段から折り畳まれて前記一方の面に前記第2基板が重ねられ、かつ前記第2折曲補助手段から折り畳まれて前記第1基板または前記第2基板上に前記成形シートを介して前記第3基板が重ねられた折畳状態において、少なくとも前記第2基板から露出する露出領域を有し、且つ、前記露出領域に前記導電回路パターンの前記端子群が配置されていて、
     前記折畳状態において前記端子群を覆うことが可能な延出保護片が、前記第1基板、前記第2基板または前記第3基板に接続されていることを特徴とするパッケージ体。
    A first substrate having a conductive circuit pattern including a terminal group formed on one surface thereof; a second substrate connected to the first substrate via a first folding assisting means; and superimposed on the first substrate; A flexible base material having a third substrate connected to the first substrate or the second substrate via two folding assisting means and overlaid on the first substrate or the second substrate;
    A molded sheet sandwiched between the first substrate and the third substrate or between the second substrate and the third substrate;
    The first substrate is folded from the first folding assisting means, the second substrate is superimposed on the one surface, and is folded from the second folding assisting means to be the first substrate or the second In the folded state in which the third substrate is superimposed on the substrate via the molded sheet, the terminal group of the conductive circuit pattern has at least an exposed region exposed from the second substrate. Is placed,
    An extended protection piece capable of covering the terminal group in the folded state is connected to the first substrate, the second substrate, or the third substrate.
  14.  前記第1基板、前記第2基板、前記第3基板及び前記延出保護片は、単一のシートを区画することにより得られる請求項13に記載のパッケージ体。 The package body according to claim 13, wherein the first substrate, the second substrate, the third substrate, and the extension protection piece are obtained by partitioning a single sheet.
  15.  請求項13または14のいずれか一項に記載のパッケージ体と、旋回可能に接続された第1部品及び第2部品を有し、前記第1部品と前記第2部品との間で前記パッケージ体を挟んで保持するモジュール体と、を備えた錠剤管理装置を使用する方法であって、
     前記パッケージ体から、前記延出保護片を分離する工程と、
     前記保護シートまたは前記延出保護片を分離された前記パッケージ体の前記端子群を含む領域を、前記モジュール体の前記第1部品と前記第2部品との間で挟んで、前記パッケージ体を保持すると共に前記パッケージ体の前記端子群を前記モジュール体のモジュール端子群に接続する工程と、を備える、錠剤管理装置の使用方法。
    A package body according to any one of claims 13 and 14, a first part and a second part that are pivotally connected, and the package body between the first part and the second part. A module body that holds and sandwiches the module body,
    Separating the extended protection piece from the package body;
    The package body is held by sandwiching the region including the terminal group of the package body from which the protective sheet or the extended protection piece is separated between the first component and the second component of the module body. And a step of connecting the terminal group of the package body to the module terminal group of the module body.
PCT/JP2016/064338 2015-05-14 2016-05-13 Flexible base material, package member, and method for using pill management device WO2016182069A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2017518010A JP6274356B2 (en) 2015-05-14 2016-05-13 Method for using flexible substrate, package body and tablet management device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015099282 2015-05-14
JP2015-099282 2015-05-14

Publications (1)

Publication Number Publication Date
WO2016182069A1 true WO2016182069A1 (en) 2016-11-17

Family

ID=57249010

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2016/064338 WO2016182069A1 (en) 2015-05-14 2016-05-13 Flexible base material, package member, and method for using pill management device

Country Status (2)

Country Link
JP (1) JP6274356B2 (en)
WO (1) WO2016182069A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7406716B2 (en) 2019-12-24 2023-12-28 大日本印刷株式会社 information recording device

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004503271A (en) * 2000-07-07 2004-02-05 ディーディーエムエス ホールディングス エル エル シー Drug delivery management system
DE102005046725A1 (en) * 2005-09-29 2007-04-05 Simon, Udo Blister pack arrangement connecting device, has securing part with locking blades, which rear-grip recess, when securing part is used in recess, in such a manner that locking hooks are not movable from locking position into opening position
US20070246396A1 (en) * 2005-12-12 2007-10-25 Brollier Brian W Momentary switch integrated in packaging of an article
JP2011514294A (en) * 2008-02-04 2011-05-06 ミードウエストベコ・コーポレーション Unit dose packaging system with reusable electronic components
JP2015070938A (en) * 2013-10-03 2015-04-16 第一三共エスファ株式会社 Package for ptp sheet
JP2015083108A (en) * 2013-09-20 2015-04-30 株式会社カナエ Detection tool

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004503271A (en) * 2000-07-07 2004-02-05 ディーディーエムエス ホールディングス エル エル シー Drug delivery management system
DE102005046725A1 (en) * 2005-09-29 2007-04-05 Simon, Udo Blister pack arrangement connecting device, has securing part with locking blades, which rear-grip recess, when securing part is used in recess, in such a manner that locking hooks are not movable from locking position into opening position
US20070246396A1 (en) * 2005-12-12 2007-10-25 Brollier Brian W Momentary switch integrated in packaging of an article
JP2011514294A (en) * 2008-02-04 2011-05-06 ミードウエストベコ・コーポレーション Unit dose packaging system with reusable electronic components
JP2015083108A (en) * 2013-09-20 2015-04-30 株式会社カナエ Detection tool
JP2015070938A (en) * 2013-10-03 2015-04-16 第一三共エスファ株式会社 Package for ptp sheet

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7406716B2 (en) 2019-12-24 2023-12-28 大日本印刷株式会社 information recording device

Also Published As

Publication number Publication date
JPWO2016182069A1 (en) 2017-07-13
JP6274356B2 (en) 2018-02-07

Similar Documents

Publication Publication Date Title
CN103249653B (en) A disposable content use monitoring package with a removable reusable electronic circuit board
JP5555801B1 (en) Detector
EP3101712B1 (en) Battery operated device and battery removal method
JP6274356B2 (en) Method for using flexible substrate, package body and tablet management device
JP2011184067A (en) Blister pack and manufacturing method of the same
JP6278672B2 (en) Package for PTP sheet
JP7406716B2 (en) information recording device
JP6146651B2 (en) Tablet storage device and tablet management device
JP6443776B2 (en) Tablet management device
JP2016214294A (en) Tablet management device
JP6614480B2 (en) Tablet management container
JP6660578B2 (en) Tablet management device
WO2022260067A1 (en) Protective sheet and press-through package
JP6781962B2 (en) Tablet management device
JP7275516B2 (en) Wiring board, wiring device, information recording device, and usage thereof
JP6965955B2 (en) Information gathering device
JP6972841B2 (en) Molded sheet storage board, circuit equipment and information recording equipment
JP6737001B2 (en) Tablet management device
JP2017035515A (en) Tablet storage device and tablet management device
JP2020035796A (en) Wiring board, wiring device, and information recording device
JP2005141378A (en) Palatal plate sensor
JP2014076528A (en) Manufacturing method of electronic part
JP2020057669A (en) Wiring substrate, wiring device, and information recording device
JP2019157075A (en) Sheet laminate
JP2007215828A (en) Adhesive sheet with release sheet

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 16792793

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2017518010

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 16792793

Country of ref document: EP

Kind code of ref document: A1