WO2016173240A1 - 扬声器模组 - Google Patents

扬声器模组 Download PDF

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Publication number
WO2016173240A1
WO2016173240A1 PCT/CN2015/094676 CN2015094676W WO2016173240A1 WO 2016173240 A1 WO2016173240 A1 WO 2016173240A1 CN 2015094676 W CN2015094676 W CN 2015094676W WO 2016173240 A1 WO2016173240 A1 WO 2016173240A1
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WIPO (PCT)
Prior art keywords
sound
housing
speaker
speaker module
cavity
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Ceased
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PCT/CN2015/094676
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English (en)
French (fr)
Inventor
周树芝
张军
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Goertek Inc
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Goertek Inc
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Priority to US15/570,288 priority Critical patent/US10306354B2/en
Publication of WO2016173240A1 publication Critical patent/WO2016173240A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • H04R1/2869—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself
    • H04R1/2884—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself by means of the enclosure structure, i.e. strengthening or shape of the enclosure
    • H04R1/2888—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself by means of the enclosure structure, i.e. strengthening or shape of the enclosure for loudspeaker transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • H04R1/2807—Enclosures comprising vibrating or resonating arrangements
    • H04R1/2811—Enclosures comprising vibrating or resonating arrangements for loudspeaker transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • H04R1/2869—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself
    • H04R1/2876—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself by means of damping material, e.g. as cladding
    • H04R1/288—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself by means of damping material, e.g. as cladding for loudspeaker transducers

Definitions

  • the invention relates to the field of electroacoustics, and in particular to a speaker module with good acoustic performance.
  • speaker modules are paying more and more attention to distortion performance, and the lower the full frequency band of the speaker module is required to be audible.
  • the volume of the rear cavity of the speaker module is preferentially ensured, and then the size of the sound channel of the front cavity is determined, which may result in a narrow sound hole of the sound channel near the single speaker position. Therefore, the sound path is narrow, the sound is not smooth, the high frequency distortion is increased, and the acoustic performance of the speaker module is lowered.
  • the technical problem to be solved by the present invention is to provide a speaker module with good acoustic performance.
  • a speaker module includes a housing and a speaker unit, and a cavity for housing the speaker unit is disposed in the housing, and the speaker unit separates the cavity into a front sound chamber and a rear sound chamber.
  • An sound hole is disposed on the housing, the sound hole is connected to the front sound chamber through an sound channel, and: the speaker unit has a square structure; and the sound channel includes a speaker unit An inner end and an outer end in communication with the sound hole; the inner end has a width greater than three-fifths of a length of the shaft of the speaker unit corresponding to the inner end.
  • the sound hole is disposed on the side wall of the casing.
  • an air filter is disposed on the outer side of the housing corresponding to the sound hole position.
  • the housing is provided with a damping hole corresponding to the position of the rear cavity, and the position of the damping hole is provided with a damping mesh.
  • the housing is provided with a steel sheet corresponding to the speaker unit mounting position.
  • the speaker unit is provided with an electrical connector
  • the speaker module further includes a flexible circuit board, and the single electrical connector is electrically coupled to the flexible circuit board.
  • the housing includes a first housing and a second housing, and the sound hole is formed by the first housing and the second housing.
  • the sound hole is arranged on the casing, and the front cavity communicates with the sound hole through the sound passage
  • the speaker unit has a square structure, and the width of the sound channel near the inner end of the speaker unit is larger than the speaker unit. It corresponds to three-fifths of the length of the inner side of the shaft.
  • the speaker module of the invention defines the width of the end of the sound channel and the speaker unit, and the width is proportional to the length of the shaft edge corresponding to the speaker unit, which can ensure smooth sound and effectively reduce the high frequency of the speaker module. distortion.
  • the structure design of the speaker module of the invention satisfactorily solves the problem of high frequency distortion of the speaker module, effectively improves the sound quality of the speaker module, and reduces the airflow sound generated by the sounding airflow impacting the sound channel, so that the speaker The sound from the module is clearer, purer and more intimate. Therefore, the speaker module of the present invention has the advantage of good acoustic performance.
  • FIG. 1 is a bottom view of a specific embodiment of a speaker module of the present invention.
  • Figure 2 is an exploded view of the speaker module shown in Figure 1;
  • Figure 3 is a cross-sectional view of the speaker module of Figure 1;
  • FIG. 4 is a schematic view showing the internal structure of the speaker module shown in FIG. 1.
  • the speaker module of the present invention includes a housing, and the housing includes a first housing 11 and a second housing 12.
  • the first housing 11 and the second housing 12 cooperate to receive the fixed speaker unit 2
  • the speaker unit 2 divides the cavity formed by the first casing 11 and the second casing 12 into a front sound chamber and a rear sound chamber (not shown), and the front sound chamber communicates with the sound hole of the speaker unit 2.
  • the speaker module housing of the present invention is provided with a sound hole 7 , and the sound hole 7 communicates with the front sound chamber.
  • the speaker module of the present invention the sound emitted by the speaker unit 2 passes through the sound of the speaker unit 2 The hole enters the front sound cavity and is then transmitted to the outside of the speaker module through the sound hole 7 of the module.
  • the sound hole 7 communicates with the front sound chamber through the sounding passage 6, as shown in FIG. 2 and FIG. 4, the speaker unit 2 has a square structure, as shown in FIG.
  • the sounding passage 6 includes an inner end 6a adjacent to the speaker unit 2 and an outer end 6b communicating with the sound hole.
  • the length of the shaft side of the speaker unit 2 near the inner end 6a is L, and the width of the inner end 6a is W, the width W of the inner end 6a is greater than three-fifths of the length L of the shaft edge.
  • the width of the inner end 6a is greater than three-fifths of the length of the axial side of the corresponding inner end 6a of the speaker unit 2, which can ensure the sound of the speaker module is smooth, effectively reduce the high-frequency distortion of the speaker module, and improve the acoustic performance of the speaker module. Moreover, the airflow sound generated by the sounding airflow striking the sound channel is reduced, so that the sound emitted by the speaker module is clearer, purer and more intimate. Therefore, the speaker module of the present invention has the advantage of good acoustic performance.
  • the sound hole 7 is disposed on the side wall of the housing of the speaker module, and the sound hole is disposed on the side wall, which can reduce the thickness of the speaker module, and is beneficial to the speaker module. Miniaturized design.
  • an air filter 3 is disposed on the outer side of the module housing corresponding to the sound hole.
  • the dustproof net 3 can prevent external debris from entering the speaker module and improve the reliability of the speaker module.
  • a damping hole 12 a is disposed on the speaker module housing corresponding to the rear cavity position, and the damping hole 12 a is provided with a damping mesh cloth 5 , and the damping hole 12 a can ensure the front of the speaker module
  • the balance of the rear sound chamber pressure ensures the normal vibration of the diaphragm of the speaker unit 2 and improves the acoustic performance of the speaker module.
  • a steel sheet 11a is disposed on the first housing 11 corresponding to the speaker unit 2, and the steel sheet 11a can reduce the thickness of the housing under the premise of ensuring the rigidity of the housing. Increasing the internal space of the speaker module, increasing the volume of the speaker unit 2, improving the sounding effect of the speaker unit 2, thereby improving the acoustic performance of the speaker module.
  • the speaker module of this embodiment further includes a flexible circuit board 4, the speaker unit is provided with an electrical connector 2a, the electrical connector 2a is electrically coupled with the flexible circuit board 4, and the speaker unit 2 is passed through the flexible circuit board. 4 Electrically connected to an external circuit.
  • the sound hole is formed by the cooperation of the first housing 11 and the second housing 12, which simplifies the design difficulty of the housing and improves the production efficiency of the housing.
  • the speaker module of the invention has an sound hole disposed on the casing, and the front cavity communicates with the sound hole through the sound channel, the speaker unit has a square structure, and the width of the sound channel close to the inner end of the speaker unit is larger than the speaker pair. It should be three-fifths of the length of the inner side of the shaft.
  • the speaker module of the invention defines the width of the end of the sound channel and the speaker unit, and the width is proportional to the length of the shaft edge corresponding to the speaker unit, which can ensure smooth sound and effectively reduce the high frequency of the speaker module. distortion.
  • the structure design of the speaker module of the invention satisfactorily solves the problem of high frequency distortion of the speaker module, effectively improves the sound quality of the speaker module, and reduces the airflow sound generated by the sounding airflow impacting the sound channel, so that the speaker The sound from the module is clearer, purer and more intimate.

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  • Health & Medical Sciences (AREA)
  • Otolaryngology (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)
  • Obtaining Desirable Characteristics In Audible-Bandwidth Transducers (AREA)

Abstract

本发明公开了一种扬声器模组，包括壳体以及扬声器单体，所述壳体内设置有收容固定所述扬声器单体的腔体，所述扬声器单体将所述腔体分隔成为前声腔和后声腔，所述壳体上设置有出声孔，所述出声孔通过出声通道与所述前声腔连接，并且：所述扬声器单体为方形结构；所述出声通道包括靠近所述扬声器单体的内端以及与所述出声孔连通的外端；所述内端的宽度大于所述扬声器单体对应所述内端的轴边长度的五分之三。本发明扬声器模组结构设计，降低了扬声器模组的高频失真，有效改善了扬声器模组的音质，减小了发声气流冲击出声通道而产生的气流音，使扬声器模组发出的声音更加清晰，纯净，亲切；本发明扬声器模组具有声学性能好的优点。

Description

扬声器模组 技术领域
本发明涉及电声领域，尤其是涉及一种声学性能好的扬声器模组。
背景技术
目前扬声器模组越来越重视失真性能，要求扬声器模组发声失真的全频段越低越好。现有技术的扬声器模组结构设计中都是优先保证扬声器模组后腔体积，后再确定前腔出声通道的大小，这样就可能导致出声通道靠近扬声器单体位置的内出声孔窄，从而使出声通道狭窄，出声不顺畅，高频失真升高，降低扬声器模组的声学性能。
因此，有必要提出一种改进，以克服现有技术扬声器模组的缺陷。
发明内容
本发明所要解决的技术问题是提供一种声学性能好的扬声器模组。
为了实现上述目的，本发明采用以下技术方案：
一种扬声器模组，包括壳体以及扬声器单体，所述壳体内设置有收容固定所述扬声器单体的腔体，所述扬声器单体将所述腔体分隔成为前声腔和后声腔，所述壳体上设置有出声孔，所述出声孔通过出声通道与所述前声腔连接，并且：所述扬声器单体为方形结构；所述出声通道包括靠近所述扬声器单体的内端以及与所述出声孔连通的外端；所述内端的宽度大于所述扬声器单体对应所述内端的轴边长度的五分之三。
作为一种优选的技术方案，所述出声孔设置于所述壳体侧壁。
作为一种优选的技术方案，所述壳体外侧对应所述出声孔位置设置有防尘网。
作为一种优选的技术方案，所述壳体对应所述后腔位置设置阻尼孔，所述阻尼孔位置设置有阻尼网布。
作为一种优选的技术方案，所述壳体对应所述扬声器单体安装位置设置有钢片。
作为一种优选的技术方案，所述扬声器单体设置有电连接件，所述扬声器模组还包括柔性线路板，所述单体电连接件与所述柔性线路板电结合。
作为一种优选的技术方案，所述壳体包括第一壳体及第二壳体，所述出声孔由所示第一壳体及所述第二壳体共同形成。
本发明的扬声器模组，壳体上设置有出声孔，前腔通过出声通道与出声孔连通，扬声器单体为方形结构，出声通道靠近扬声器单体的内端的宽度大于扬声器单体对应该内端的轴边的长度的五分之三。本发明扬声器模组，限定了出声通道与扬声器单体靠近的一端的宽度，该宽度与扬声器单体对应的轴边长度呈一定比例，可以保证出声顺畅，有效降低扬声器模组的高频失真。本发明扬声器模组结构设计，很好地解决了扬声器模组高频失真偏高的问题，有效改善了扬声器模组的音质，减小了发声气流冲击出声通道而产生的气流音，使扬声器模组发出的声音更加清晰，纯净，亲切。因此，本发明扬声器模组具有声学性能好的优点。
附图说明
图1为本发明扬声器模组具体实施方式仰视图；
图2为图1所示扬声器模组分解图；
图3为图1所示扬声器模组剖视图；
图4为图1所示扬声器模组内部结构示意图。
具体实施方式
下面结合附图，详细说明本发明内容：
如图2所示，本发明的扬声器模组，包括壳体，壳体包括第一壳体11和第二壳体12，第一壳体11和第二壳体12配合收容固定扬声器单体2，扬声器单体2将第一壳体11和第二壳体12形成的空腔分隔成为前声腔和后声腔(图中未标示)，前声腔与扬声器单体2的出声孔连通。如图1所示，本发明扬声器模组壳体设置有出声孔7，出声孔7与前声腔连通，本发明扬声器模组，扬声器单体2发出的声音通过扬声器单体2的出声孔进入到前声腔，后经过模组的出声孔7传递到扬声器模组外部。
如图3及图4所示，本发明的扬声器模组，出声孔7通过出声通道6与前声腔连通，如图2及图4所示，扬声器单体2为方形结构，如图4所示，出声通道6包括靠近扬声器单体2的内端6a以及与出声孔连通的外端6b，扬声器单体2靠近内端6a的轴边的长度为L，内端6a的宽度为W，内端6a的宽度W大于轴边长度L的五分之三。内端6a的宽度大于扬声器单体2对应内端6a的轴边长度的五分之三，可以保证扬声器模组的出声顺畅，有效降低扬声器模组高频失真，改善扬声器模组声学性能，并且减小了发声气流冲击出声通道而产生的气流音，使扬声器模组发出的声音更加清晰，纯净，亲切。因此，本发明扬声器模组具有声学性能好的优点。
如图1所示，本实施例的扬声器模组，出声孔7设置于扬声器模组的壳体的侧壁，出声孔设置于侧壁，可以降低扬声器模组厚度，有利于扬声器模组的小型化设计。
如图3所示，模组壳体外侧对应出声孔位置设置有防尘网3，防尘网3可以避免外界杂物进入到扬声器模组内部，提高扬声器模组可靠性。
如图1所示，扬声器模组壳体上对应后腔位置设置有阻尼孔12a，阻尼孔12a内设置有阻尼网布5，阻尼孔12a可以保证扬声器模组前 后声腔气压平衡，保证扬声器单体2的振膜正常振动，提高扬声器模组声学性能。
如图3所示，本实施例的扬声器模组，第一壳体11上对应扬声器单体2位置设置有钢片11a，钢片11a可以在保证壳体刚性的前提下降低壳体厚度，从而增大扬声器模组内部空间，增大扬声器单体2体积，提高扬声器单体2的出声效果，从而提高扬声器模组声学性能。
如图4所示，本实施例的扬声器模组还包括柔性线路板4，扬声器单体设置有电连接件2a，电连接件2a与柔性线路板4电结合，扬声器单体2通过柔性线路板4与外部电路电连接。
如图3所示，本实施例的扬声器模组，出声孔由第一壳体11和第二壳体12配合形成，简化壳体设计难度，提高壳体生产效率。
本发明扬声器模组，壳体上设置有出声孔，前腔通过出声通道与出声孔连通，扬声器单体为方形结构，出声通道靠近扬声器单体的内端的宽度大于扬声器单体对应该内端的轴边的长度的五分之三。本发明扬声器模组，限定了出声通道与扬声器单体靠近的一端的宽度，该宽度与扬声器单体对应的轴边长度呈一定比例，可以保证出声顺畅，有效降低扬声器模组的高频失真。本发明扬声器模组结构设计，很好地解决了扬声器模组高频失真偏高的问题，有效改善了扬声器模组的音质，减小了发声气流冲击出声通道而产生的气流音，使扬声器模组发出的声音更加清晰，纯净，亲切。
以上仅为本发明实施案例而已，并不用于限制本发明，但凡本领域普通技术人员根据本发明所揭示内容所作的等效修饰或变化，皆应纳入权利要求书中记载的保护范围内。

Claims (7)

  1. 一种扬声器模组，包括壳体以及扬声器单体，所述壳体内设置有收容固定所述扬声器单体的腔体，所述扬声器单体将所述腔体分隔成为前声腔和后声腔，所述壳体上设置有出声孔，所述出声孔通过出声通道与所述前声腔连接，其特征在于：所述扬声器单体为方形结构；所述出声通道包括靠近所述扬声器单体的内端以及与所述出声孔连通的外端；所述内端的宽度大于所述扬声器单体对应所述内端的轴边长度的五分之三。
  2. 根据权利要求1所述的扬声器模组，其特征在于：所述出声孔设置于所述壳体侧壁。
  3. 根据权利要求2所述的扬声器模组，其特征在于：所述壳体外侧对应所述出声孔位置设置有防尘网。
  4. 根据权利要求1所述的扬声器模组，其特征在于：所述壳体对应所述后腔位置设置阻尼孔，所述阻尼孔位置设置有阻尼网布。
  5. 根据权利要求1所述的扬声器模组，其特征在于：所述壳体对应所述扬声器单体安装位置设置有钢片。
  6. 根据权利要求1所述的扬声器模组，其特征在于：所述扬声器单体设置有电连接件，所述扬声器模组还包括柔性线路板，所述单体电连接件与所述柔性线路板电结合。
  7. 根据权利要求1至6任一权利要求所述的扬声器模组，其特征在于：所述壳体包括第一壳体及第二壳体，所述出声孔由所示第一壳体及所述第二壳体共同形成。
PCT/CN2015/094676 2015-04-29 2015-11-16 扬声器模组 Ceased WO2016173240A1 (zh)

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Application Number Priority Date Filing Date Title
US15/570,288 US10306354B2 (en) 2015-04-29 2015-11-16 Loudspeaker module

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CN201510210290.7 2015-04-29
CN201510210290.7A CN104811856A (zh) 2015-04-29 2015-04-29 扬声器模组

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