WO2016162460A1 - Module - Google Patents

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Publication number
WO2016162460A1
WO2016162460A1 PCT/EP2016/057704 EP2016057704W WO2016162460A1 WO 2016162460 A1 WO2016162460 A1 WO 2016162460A1 EP 2016057704 W EP2016057704 W EP 2016057704W WO 2016162460 A1 WO2016162460 A1 WO 2016162460A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
printed circuit
electrical
resistance element
assembly
Prior art date
Application number
PCT/EP2016/057704
Other languages
German (de)
English (en)
Inventor
Andreas HAMMA
Daniel MOOSMANN
Matthias Reckermann
Original Assignee
Marquardt Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Marquardt Gmbh filed Critical Marquardt Gmbh
Priority to EP16715516.7A priority Critical patent/EP3281499A1/fr
Publication of WO2016162460A1 publication Critical patent/WO2016162460A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/58—Electric connections to or between contacts; Terminals
    • H01H1/5805—Connections to printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H50/00—Details of electromagnetic relays
    • H01H50/02—Bases; Casings; Covers
    • H01H50/04—Mounting complete relay or separate parts of relay on a base or inside a case
    • H01H50/047—Details concerning mounting a relays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
    • H01H85/041—Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
    • H01H85/046—Fuses formed as printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H05K1/0265—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board characterized by the lay-out of or details of the printed conductors, e.g. reinforced conductors, redundant conductors, conductors having different cross-sections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09072—Hole or recess under component or special relationship between hole and component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09381—Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10022—Non-printed resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10053—Switch
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10962—Component not directly connected to the PCB

Definitions

  • the invention relates to an electrical assembly according to the preamble of
  • Such an electrical assembly can be in a battery or a
  • Accumulator can be used, especially in such a battery in which large currents occur and / or arises in the heat energy.
  • a circuit board can be contacted to the poles of the battery, wherein the circuit board can serve as a carrier for a switching element.
  • Such an assembly is particularly suitable for use in a motor vehicle.
  • Such an electrical assembly comprises a printed circuit board and an electrical
  • Resistance element wherein the resistance element may be configured in particular in the manner of a shunt for current measurement.
  • the resistance element is in communication with the circuit board. Due to the flowing current, heat is generated at the resistance element during operation of the assembly, which in turn can lead to impairment of the assembly.
  • the invention has for its object to design the electrical assembly such that the heat generated can be largely dissipated.
  • the resistance element is arranged with electrical and / or mechanical connection to the printed circuit board on the printed circuit board and / or in the printed circuit board.
  • an approximately U-shaped adapter element for electrical and / or mechanical connection of the resistance element with the
  • the adapter element can be fastened by means of soldering, in particular SMD soldering, to a contact point of the printed circuit board.
  • soldering in particular SMD soldering
  • mechanical stresses for example those which arise due to the effect of heat, can be absorbed in a reliable manner by the U-shaped adapter element.
  • an approximately L-shaped adapter element for electrical and / or mechanical connection of the resistive element to the printed circuit board can be arranged between the resistor element and the printed circuit board.
  • the resistance element and / or the adapter element can be equipped in a simple manufacturing technology by means of THT (Through Hole Technology) assembly and / or SMD (Surface Mounted Device) assembly on the printed circuit board in a functionally reliable manner, the adapter element by soldering to Any mechanical stresses which occur, for example those which arise as a result of the action of heat, can thereby be reliably absorbed by the L-shaped adapter element.
  • the printed circuit board may be a high-current printed circuit board.
  • a high-current circuit board with in the circuit board be embedded embedded massive copper elements to conduct a high current.
  • the large heat energy that otherwise occurs in such high-current circuit boards due to the high currents is dissipated in the assembly according to the invention in a safe and reliable manner, so that destruction of the assembly is effectively prevented.
  • the reliability of such, comprising a high-current circuit board assembly is considerably improved by means of the invention.
  • At least one heat sink may be arranged in thermally conductive connection to a conductor track and / or a contact point of the circuit board to the circuit board.
  • the heat sink can consist of a metal plate.
  • a typical shunt resistor has a value of about 300 ⁇ . so that a considerable power dissipation of for example
  • the idea of the invention is to dissipate the resulting heat energy well and / or reliably. This can best be achieved by mechanically integrating these resistors into the system without stress.
  • the shunt resistor can be equipped as an SMD (Surfache Mounted Device) component and accordingly more valid as well reliable processes are soldered to the circuit board.
  • the shunt resistor may be designed as well as THT (Through Hole Technology) device, however, be fitted in a "pin-in-paste * '-version as a SMD component and, accordingly, a valid and reliable processes are soldered to the printed circuit board.
  • THT Thine Technology
  • the alternative solution is to integrate this resistor directly into the PCB, which achieves best and most efficient thermal properties. These resistors can then be completely electrically isolated, whereby one for the arrangement of
  • Heat sinks has complete freedom. What is thus created is a high-resistance circuit board comprising a resistance element and / or a circuit board with improved thermal properties.
  • the manufacture of the PCB assembly can be done with standard processes.
  • the electrical connection technology has defined contact resistance
  • the thermal management can be implemented well and product-specifically.
  • FIG. 1 is an electrical assembly in side view and in plan view, 2 shows a detailed detail from FIG. 1 according to a first exemplary embodiment
  • FIG. 3 is a detail of FIG. 1 according to a second exemplary embodiment
  • Fig. 4 shows the electrical assembly in side view and in plan view in a further embodiment.
  • FIG. 1 shows an electrical subassembly 1 comprising a printed circuit board 2 and an electrical resistance element 3.
  • the electrical subassembly 1 comprising a printed circuit board 2 and an electrical resistance element 3.
  • Resistance element 3 provided in the manner of a shunt for current measurement.
  • Resistance element 3 is connected to the circuit board 2 in connection. Here it is
  • Resistance element 3 with electrical and / or mechanical connection to the printed circuit board 2 on the printed circuit board 2 and / or arranged integrated in the printed circuit board 2. Further, a component 6 is connected to the printed circuit board 2, wherein the component 6 is an electromechanical component, namely an electrical switching contact, for example in the manner of a relay.
  • an approximately U-shaped adapter element 4 for the electrical and / or mechanical connection of the resistance element 3 with the printed circuit board 2 is arranged between the resistance element 3 and the printed circuit board 2.
  • an adapter element 4 is arranged on both sides of the resistance element 3.
  • the resistance element 3 and / or the adapter element 4 can then be equipped by SMD (Surface Mounted Device) assembly on the printed circuit board 2.
  • SMD Surface Mounted Device
  • Adapter element 4 is attached to a pad 5 of the circuit board 2 by means of soldering, preferably SMD soldering.
  • soldering preferably SMD soldering.
  • the resistance element 3 is arranged with electrical and / or mechanical connection to the printed circuit board 2 in the printed circuit board 2 integrated.
  • an approximately L-shaped adapter element 4 ' is arranged between the resistance element 3 and the printed circuit board 2 for electrical and / or mechanical connection of the resistance element 3 to the printed circuit board 2, in each case on both sides of the resistance element 3.
  • Das Resistance element 3 and / or the adapter element 4 ' can be equipped on the printed circuit board 2 by means of THT (Through Hole Technology) assembly and / or SMD (Surface Mounted Device) assembly. Subsequently, the adapter element 4 'by means of soldering at a contact point 5 of the circuit board 2 can be fastened.
  • the printed circuit board 2 may be a high-current printed circuit board.
  • solid copper elements can be embedded in the printed circuit board 2 for conducting a high current. Due to the high current flowing creates a certain amount of heat in the switch contact 6 and the resistance element 3.
  • the heat flow 7 can, as can be seen in Fig. 1, at least in part on the circuit board 2 and from there for example via heat sink 8 in the manner of Wännesenken be derived.
  • the heat sink 8 consists for example of a metal plate.
  • the module 1 according to the invention can be used in the battery system of a motor vehicle.
  • the invention is not limited to the one described and illustrated
  • Embodiment limited. On the contrary, it also includes all experts

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Measuring Instrument Details And Bridges, And Automatic Balancing Devices (AREA)
  • Fuses (AREA)

Abstract

L'invention concerne un module électrique (1) comprenant une carte de circuit imprimé (2) et un élément à résistance électrique (3), réalisé en particulier à la manière d'un shunt pour la mesure de courant. L'élément résistif (3) est en liaison électrique et/ou mécanique avec la carte de circuit imprimé (2). Entre l'élément résistif (3) et la carte de circuit imprimé (2) est disposé un élément adaptateur (4) approximativement en U permettant la liaison électrique et/ou mécanique de l'élément résistif (3) avec la carte de circuit imprimé (2).De préférence, l'élément adaptateur (4) est brasé par brasage CMS avec un point de contact (5) de la carte de circuit imprimé (2). Selon un autre mode de réalisation, l'élément résistif (3) est intégré dans la carte de circuit imprimé (2).
PCT/EP2016/057704 2015-04-10 2016-04-08 Module WO2016162460A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP16715516.7A EP3281499A1 (fr) 2015-04-10 2016-04-08 Module

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE102015004377 2015-04-10
DE102015004375.7 2015-04-10
DE102015004377.3 2015-04-10
DE102015004375 2015-04-10

Publications (1)

Publication Number Publication Date
WO2016162460A1 true WO2016162460A1 (fr) 2016-10-13

Family

ID=55697214

Family Applications (2)

Application Number Title Priority Date Filing Date
PCT/EP2016/057703 WO2016162459A1 (fr) 2015-04-10 2016-04-08 Module composé d'une carte de circuit imprimé et d'un composant électrique
PCT/EP2016/057704 WO2016162460A1 (fr) 2015-04-10 2016-04-08 Module

Family Applications Before (1)

Application Number Title Priority Date Filing Date
PCT/EP2016/057703 WO2016162459A1 (fr) 2015-04-10 2016-04-08 Module composé d'une carte de circuit imprimé et d'un composant électrique

Country Status (3)

Country Link
EP (2) EP3281499A1 (fr)
DE (2) DE102016003988A1 (fr)
WO (2) WO2016162459A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102017208147B4 (de) 2017-05-15 2021-12-30 Schweizer Electronic Ag Elektronisches Bauteil und Leiterplatte mit diesem elektronischen Bauteil

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2720438A1 (de) * 1976-05-13 1977-11-24 Cit Alcatel Trageplatte mit anschlusslaschen fuer elektrische bauelemente
US5336990A (en) * 1993-01-13 1994-08-09 United Technologies Automotive, Inc. Electrical test shunt having dual contact point mating terminals
US5353621A (en) * 1990-09-14 1994-10-11 Motorola, Inc. Piezoelectric component mounting foil and foil-making method
US5839189A (en) * 1995-04-03 1998-11-24 Emerson Electric Co. Bracket for attaching pin-in-hole components to a surface mount board
US20060131068A1 (en) * 2004-12-16 2006-06-22 Rodriguez Edward T Surface mounted resistor with improved thermal resistance characteristics
DE102006001188A1 (de) * 2006-01-10 2007-07-12 Robert Bosch Gmbh Anordnung zur Kühlung von Leistungsbauelementen auf Leiterplatten und Verfahren zur Herstellung derselben
DE102006019895A1 (de) * 2006-04-28 2007-11-15 Siemens Ag Strommessvorrichtung mit speziell kontaktierter Leiterplatte und entsprechendes Herstellungsverfahren
DE102014106025A1 (de) * 2013-05-03 2014-11-06 Infineon Technologies Ag Integration einer Strommessung in eine Verdrahtungsstruktur einer elektronischen Schaltung

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008046188A1 (fr) * 2006-10-10 2008-04-24 Tir Technology Lp Carte de circuit imprimé avec flexibilité régionale
US20080136331A1 (en) * 2006-10-31 2008-06-12 Tir Technology Lp Light-Emitting Element Light Source and Temperature Management System Therefor
WO2010126410A1 (fr) * 2009-04-28 2010-11-04 Telefonaktiebolaget L M Ericsson (Publ) Assemblage pour réalisation de composants électroniques

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2720438A1 (de) * 1976-05-13 1977-11-24 Cit Alcatel Trageplatte mit anschlusslaschen fuer elektrische bauelemente
US5353621A (en) * 1990-09-14 1994-10-11 Motorola, Inc. Piezoelectric component mounting foil and foil-making method
US5336990A (en) * 1993-01-13 1994-08-09 United Technologies Automotive, Inc. Electrical test shunt having dual contact point mating terminals
US5839189A (en) * 1995-04-03 1998-11-24 Emerson Electric Co. Bracket for attaching pin-in-hole components to a surface mount board
US20060131068A1 (en) * 2004-12-16 2006-06-22 Rodriguez Edward T Surface mounted resistor with improved thermal resistance characteristics
DE102006001188A1 (de) * 2006-01-10 2007-07-12 Robert Bosch Gmbh Anordnung zur Kühlung von Leistungsbauelementen auf Leiterplatten und Verfahren zur Herstellung derselben
DE102006019895A1 (de) * 2006-04-28 2007-11-15 Siemens Ag Strommessvorrichtung mit speziell kontaktierter Leiterplatte und entsprechendes Herstellungsverfahren
DE102014106025A1 (de) * 2013-05-03 2014-11-06 Infineon Technologies Ag Integration einer Strommessung in eine Verdrahtungsstruktur einer elektronischen Schaltung

Also Published As

Publication number Publication date
DE102016003987A1 (de) 2016-10-13
DE102016003988A1 (de) 2016-10-13
EP3281497A1 (fr) 2018-02-14
EP3281499A1 (fr) 2018-02-14
WO2016162459A1 (fr) 2016-10-13

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