WO2016145573A1 - 加热装置以及具有该加热装置的生化反应器 - Google Patents

加热装置以及具有该加热装置的生化反应器 Download PDF

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Publication number
WO2016145573A1
WO2016145573A1 PCT/CN2015/074208 CN2015074208W WO2016145573A1 WO 2016145573 A1 WO2016145573 A1 WO 2016145573A1 CN 2015074208 W CN2015074208 W CN 2015074208W WO 2016145573 A1 WO2016145573 A1 WO 2016145573A1
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WIPO (PCT)
Prior art keywords
hole
heating
conductive layer
plate
holes
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PCT/CN2015/074208
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English (en)
French (fr)
Inventor
郑文豪
林清格
周品兴
蔡汮龙
李珮瑜
苏城
张晓芬
Original Assignee
瑞基海洋生物科技股份有限公司
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Application filed by 瑞基海洋生物科技股份有限公司 filed Critical 瑞基海洋生物科技股份有限公司
Priority to CN201580008295.XA priority Critical patent/CN107530703B/zh
Priority to PCT/CN2015/074208 priority patent/WO2016145573A1/zh
Publication of WO2016145573A1 publication Critical patent/WO2016145573A1/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L7/00—Heating or cooling apparatus; Heat insulating devices
    • C—CHEMISTRY; METALLURGY
    • C12—BIOCHEMISTRY; BEER; SPIRITS; WINE; VINEGAR; MICROBIOLOGY; ENZYMOLOGY; MUTATION OR GENETIC ENGINEERING
    • C12M—APPARATUS FOR ENZYMOLOGY OR MICROBIOLOGY; APPARATUS FOR CULTURING MICROORGANISMS FOR PRODUCING BIOMASS, FOR GROWING CELLS OR FOR OBTAINING FERMENTATION OR METABOLIC PRODUCTS, i.e. BIOREACTORS OR FERMENTERS
    • C12M1/00—Apparatus for enzymology or microbiology
    • C12M1/36—Apparatus for enzymology or microbiology including condition or time responsive control, e.g. automatically controlled fermentors
    • C12M1/38—Temperature-responsive control

Definitions

  • the present invention relates to a temperature control device, and more particularly to a heating device and a biochemical reactor having the same.
  • the prior art heating device is mainly composed of a substrate, two conductive layers, and a heating member, the substrate having at least one perforation for And the at least one receiving hole is adjacent to the through hole for accommodating the heating member, the two conductive layers are partially disposed on the substrate and are not connected, and the upper and lower ends of the heating member are respectively soldered
  • the electrically conductive member is electrically connected to the two conductive layers, and the heating member converts electrical energy into heat energy to heat the test tube.
  • the solder connecting the heating member and the two conductive layers is often cracked due to the stress caused by repeated thermal expansion and contraction for a long period of time, which affects the life of the heating device; in addition, when the welding operation is performed, part of the molten solder may be due to soldering Capillary phenomenon or gravity infiltrates into the pore between the heating member and the accommodating hole, and when the heating member is welded at one end and the solder at the other end is still partially melted, the pore becomes a sealed space, and the substrate During the cooling process, the temperature of the air in the pores is reduced to cause a volume reduction, and a vacuum suction is formed in the pores to cause the molten portion of the solder to be sucked into the pores. If the solder at the two ends of the heating member are connected to each other in the pores, A short circuit occurs between the two conductive layers to lower the yield of the product.
  • the technical problem to be solved by the present invention is to provide a heating device which can improve the production yield and extend the service life.
  • Another object of the present invention is to provide a biochemical reactor which can improve the yield and extend the service life.
  • the present invention provides a heating device comprising an upper plate, a lower plate, a middle plate and an electric heating member;
  • the upper plate has an upper heating hole and at least one upper receiving portion located beside the upper heating hole a hole, and an upper conductive layer, the upper conductive layer has an upper surface covering an upper surface of the upper plate and surrounding the upper receiving hole, and a receiving tube portion covering the hole wall of the upper receiving hole and connecting Upper conductive layer
  • the lower plate has a lower heating hole, at least one lower receiving hole beside the lower heating hole, and a first lower conductive layer having a lower surface covering the lower surface of the lower plate and And surrounding the lower receiving hole and a receiving tube covering the lower wall of the lower receiving hole and connecting the lower portion of the first lower conductive layer;
  • the middle plate is disposed between the upper and lower plates, the middle plate
  • the utility model has a heating hole and at least one middle receiving hole located beside the heating hole, wherein the upper, middle and lower heating holes communicate with each other to form a heating through hole, and the upper,
  • the present invention also provides a biochemical reactor having the heating device for inserting a test tube and comprising a first body, a second body, and a heating The device is disposed between the first and second bodies, the first body has a first through hole, and the second body is located below the first body and has a second through hole, wherein the heated through hole and the The first and second through holes communicate with each other to form a test tube slot for the test tube to extend.
  • Figure 1 is a perspective view of a heating apparatus according to a first embodiment of the present invention
  • Figure 2 is an exploded view of the heating device of the first embodiment of the present invention
  • Figure 3 is a perspective view of a partial upper plate of the first embodiment of the present invention.
  • Figure 4 is a perspective view of a partial middle plate according to a first embodiment of the present invention.
  • Figure 5 is a perspective view of a partial lower plate of the first embodiment of the present invention.
  • Figure 6 is a cross-sectional view showing a heating apparatus according to a first embodiment of the present invention.
  • Figure 7 is a perspective view of a biochemical reactor according to a first embodiment of the present invention.
  • Figure 8 is a cross-sectional view showing a biochemical reactor according to a first embodiment of the present invention.
  • Figure 9 is a cross-sectional view showing a heating apparatus in accordance with a second embodiment of the present invention.
  • FIG. 1 to 6 show a heating device 1 according to a first embodiment of the present invention, which has an upper plate 10, a lower plate 20, an intermediate plate 30, and four electric heating members 40.
  • the upper plate 10 is made of a heat-conductive insulating material such as fiberglass resin, and has an upper surface 11, a lower surface 12, four upper heating holes 13, and four respectively located at The upper receiving hole 14 , the upper conductive layer 15 and the five upper through grooves 17 adjacent to the upper heating hole 13 , each of the upper heating holes 13 and the upper receiving hole 14 adjacent thereto form a hole group 18 , as shown in FIG. 2 .
  • the upper plate 10 of the present embodiment thus forms a four-hole group 18;
  • the upper conductive layer 15 can be made of a material having good electrical and thermal conductivity, such as copper, having an upper portion 151 overlying the upper surface 11 and surrounding
  • the upper receiving hole 14 and the upper heating hole 13 and the lower portion 152 are disposed on the lower surface 12 and surround the upper receiving hole 14 and the upper heating hole 13 and a receiving tube portion 153 covering the upper receiving hole.
  • the upper wall 151 and the lower portion 152 and a heating tube portion 154 cover the wall of the upper heating hole 13 and connect the upper portion 151 and the lower portion 152.
  • the upper portion 151 and the lower portion 152 are annular.
  • the upper plate 10 further has an upper through groove 19 connected to one end of each of the upper through grooves 17, in other words, each The three sides of the hole group 18 are surrounded by two upper through grooves 17 and the upper through grooves 19.
  • more than one upper receiving hole 14 may be provided beside an upper heating hole 13 without limitation.
  • the lower plate 20 is made of a heat-conductive insulating material such as fiberglass resin, and has an upper surface 21, a lower surface 22, four lower heating holes 23, and four respectively located under each of them.
  • the first lower conductive layer 25 may be made of a material having good electrical and thermal conductivity such as copper, and has an upper portion 251 covering the upper surface.
  • the second lower conductive layer 26 may be made of a material having good electrical and thermal conductivity, such as copper, having an upper portion 261 overlying the upper surface 21 and surrounding the lower heating hole 23 and the lower portion 262.
  • the upper portion 251 of the first lower conductive layer 25 also surrounds the upper portion 261 of the second lower conductive layer 26, and a gap G is formed between the upper portion 251 and the upper portion 261, in other words, the first conductive layer 25
  • the upper portion 251, the lower portion 252, the upper portion 261, and the lower portion 262 are substantially annular, and are not limited thereto; the five lower through grooves 27 are located one by one in each of the holes.
  • the two sides of the group 28 are arranged to separate the groups of holes 28, and the partitions 201 are defined between the two lower channels 27 so that the four holes 28 are respectively located in the four lower partitions 201, and the lower plate 20 has a lower
  • the groove 29 is connected to one end of each of the lower through grooves 27, in other words, the three sides of each of the hole groups 28 are surrounded by the two lower through grooves 27 and the lower through grooves 29.
  • more than one lower receiving hole 24 may be provided next to the lower heating hole 23 without limitation.
  • the intermediate plate 30 is made of a thermally conductive insulating material such as fiberglass resin and disposed between the upper plate 10 and the lower plate 20.
  • the intermediate plate 30 has an upper surface 31.
  • the lower surface 32, the fourth intermediate heating hole 33, and the fourth intermediate accommodating hole 34, the four middle conductive layer 35 and the three middle through groove 37 respectively located adjacent to the middle heating hole 33; the middle conductive layer 35 may be made of copper or the like.
  • the conductive and thermally conductive material has an upper portion 351 covering the upper surface 31 and surrounding the middle heating hole 33, the lower portion 352 covering the lower surface 32 and surrounding the heating hole 33, and a heating tube portion.
  • the upper wall 351 and the lower portion 352 are annularly connected, and the upper portion 351 and the lower portion 352 are annular.
  • the through groove 37 surrounds the middle heating holes 33 and the middle receiving holes 34 therein. In other embodiments, more than one middle receiving hole 34 may be disposed adjacent to the heating hole 33 without limitation, and the shape of the middle through groove 37 may be changed as needed.
  • the upper heating hole 13, the middle heating hole 33 and the lower heating hole 23 communicate with each other to form a heating through hole 50.
  • the receiving hole 14, the middle receiving hole 34 and the lower receiving hole 24 communicate with each other to form a receiving through hole 60.
  • the lower portion 352 of the middle conductive layer 35 is connected to the upper portion 261 of the second lower conductive layer 26.
  • the heat and electricity can be conducted, but not connected to the upper portion 251 of the first lower conductive layer 25, and the upper portion 351 of the middle conductive layer 35 is connected to the lower portion 152 of the upper conductive layer 15 to conduct heat and electricity;
  • the upper, middle and second lower conductive layers may be covered with a solder mask layer so that the conductive layers are not electrically conductive but can conduct heat.
  • the fourth heating element 40 is disposed in each of the receiving through holes 60, and is electrically connected to the upper conductive layer 15 and the first lower conductive layer 25 by two ends thereof.
  • the heating element is electrically connected.
  • 40 is a resistive electric heater, wherein the upper and lower ends are electrically connected to the upper conductive layer 15 and the first lower conductive layer 25 by soldering.
  • the type of the heating element 40 can be changed according to different requirements.
  • the present invention also provides a biochemical reactor 2 having the heating device 1 for inserting four test tubes 3, as shown in FIGS. 7 and 8, the biochemical reactor 2 further includes a first body 4 and a second body. 5, the heating device The first body 4 has four first through holes 401, and the second body 5 is located below the first body 4 and has four second passes.
  • the hole 501 wherein each of the heating through holes 50 communicates with the first through hole 401 above it and the second through hole 501 below thereof to form a test tube groove 6, so the biochemical reactor 2 has four test tube slots 6 for
  • the four test tubes 3 are inserted, and in other embodiments the number of the test tubes 3 may vary depending on the requirements.
  • the heating device 1 can use the heating element 40 to provide thermal energy and transmit the heat to the heating through hole 50, so as to maintain a portion of the test tube 3 substantially in a stable temperature range for biochemical reaction, for this purpose,
  • a power source (not shown) can use the upper conductive layer 15 and the first lower conductive layer 15 to supply power to the heating element 40.
  • the heating element 40 converts electrical energy into thermal energy and transmits thermal energy through the solder.
  • the air in the hole 60, the upper conductive layer 15, the middle conductive layer 35, the first lower conductive layer 25, the second lower conductive layer 26, and the upper plate 10, the middle plate 30 and the lower plate 20 themselves are transferred to the The through hole 50 is heated.
  • the lower portion 152 of the upper conductive layer 15 surrounding the upper receiving hole 14 is for further assisting the heat conduction of the upper plate 10, and may be omitted in other embodiments; the first lower conductive layer 25 may be omitted.
  • the upper portion 251 is for further assisting the heat conduction of the lower plate 20. In other embodiments, the upper portion 251 may only surround the lower receiving hole 24 without surrounding the lower heating hole 23, and even the upper portion 251 may be omitted. Thereby, the heated through-hole 50 can obtain a uniform heating temperature, thereby providing a portion of the test tube 3 to be substantially maintained in a stable temperature range for biochemical reaction.
  • the conductive layer of the remaining portion may be omitted.
  • the heat conduction effect of the omitted heating device is inevitably worse than the omitted front.
  • the upper through grooves 17 of the upper plate 10 make the upper partition plates 101 elastic, the stress during the thermal expansion and contraction of the electric heating member 40 can be absorbed, and the electric heating member 40 and the upper conductive layer 15 can be effectively reduced.
  • the solder joint generates a probability of cracking, thereby prolonging the service life of the heating device 1, and the upper through groove 19 can further increase the elastic deformation amount of the upper partition 10, but since the upper plate 10 itself has elasticity Absorbing the stress when the heating element 40 is inflated and contracted, the upper through groove 17 and the upper through groove 19 may be omitted as appropriate; on the other hand, the upper through grooves 17 divide each of the holes 18
  • the heat energy of the heating element 40 in each of the upper partitions 101 is not dissipated to the other upper partitions 101, so as to ensure that each of the upper heating holes 13 can obtain a uniform and stable heating effect.
  • the upper through groove 17 can also be omitted.
  • middle through grooves 37 surround the heating holes 33 and the middle receiving holes 34.
  • the heat generated by the heating element 40 is substantially retained in the middle partition 301 without being lost to other areas of the intermediate plate 30, so that the temperature between the heating holes 33 is maintained uniform, and the intermediate through grooves 37 may also be Omitted is not set.
  • the upper plate 10, the intermediate plate 30, and the lower plate 20 of the heating device 1 are manufactured by using the prior art printed circuit board process, which is not only fast in manufacturing but also lightweight in overall structure, and the upper plate 10, the intermediate plate 30 and the lower plate 20 are After the stacking is carried out, it can be locked together by a plurality of bolts, or bonded together by a glue layer such as double-sided tape, and the upper plate 10, the middle plate 30, and the lower plate 20 (hereinafter referred to as a group plate) are sequentially combined. In other embodiments, it may be provided in the biochemical reactor 2 in an upside down manner.
  • the receiving through holes 60 are not a closed space, so when the solder is cooled, the air in the through holes 60 is accommodated.
  • the vacuum suction is not generated due to the temperature decrease and the volume is reduced, and the solder that has not been solidified is sucked into the pores between the heating element 40 and the receiving through hole 60, so that the solder at the two ends of the heating element 40 can be prevented from being short-circuited.
  • the heating device 7 has an upper plate 70, a middle plate 90 and a lower plate. 80 is formed by coating an insulating layer 701 with a conductive material, such as aluminum or iron, so that it has high thermal conductivity at the same time; since each plate itself has better thermal conductivity than the insulating material, some conductive layers can be selected.
  • a conductive material such as aluminum or iron
  • the upper conductive layer 15 may omit the heating tube portion 154, a portion of the upper portion 151 surrounding the upper heating hole 13, or the lower portion 152
  • the second lower conductive layer 26 may omit the heating tube
  • the first lower conductive layer 25 may omit a portion of the lower portion 252 surrounding the second lower conductive layer 26, the upper portion 251, and the middle conductive layer 35 may omit the heating tube portion 353, the upper portion 351, or the lower portion 352, in this embodiment, even if the plates do not have the partial conductive layer, the heat energy generated by the heating element 40 can still be effectively transmitted to the heating through hole 50, but the heating device 7 still need to cover the conductive layer with conductive function
  • the upper conductive layer 15 disposed on the upper plate 70 includes an upper portion 151 and a receiving tube portion 153
  • the first lower conductive layer 25 disposed on the lower plate 80 includes a lower portion 252 and a receiving portion
  • the heating device and the biochemical reactor having the heating device can maintain the test tube locally in a stable temperature range for biochemical reaction, which not only improves the production yield but also prolongs the service life.

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Abstract

一种加热装置（1）以及具有该加热装置（1）的生化反应器（2）。该加热装置（1）包含上板（10）、下板（20）、中板（30）与电热件（40）。所述上板（10）、下板（20）和中板（30）上分别设有加热孔（13，23，33）和容置孔（14，24，34），所述上、下、中加热孔（13，23，33）互相连通形成一加热贯孔（50），所述上、下、中容置孔（14，24，34）互相连通形成一容置贯孔（60）。所述电热件（40）设于该容置贯孔（60）中且以其二端连接于上板（10）的上传导层（15）以及下板（20）的第一下传导层（25）。所述生化反应器包括第一本体（4）、第二本体（5）以及设于该第一、二本体（4，5）之间的所述加热装置（1），该第一、二本体（4，5）上设有通孔（401，501），该通孔（401，501）与前述加热贯孔（50）互相连通形成试管槽，供试管伸入。

Description

加热装置以及具有该加热装置的生化反应器 技术领域
本发明涉及一种温控装置，特别是一种加热装置以及具有该加热装置的生化反应器。
背景技术
许多生化反应器具有加热装置，使生化反应得以于特定的温度下在试管中进行，现有技术加热装置主要由一基板、二导电层、以及一加热件组成，该基板具有至少一穿孔用以供试管伸入，以及至少一容置孔邻近该穿孔用以容置该加热件，该二导电层则覆设于该基板的局部且未连通，该加热件的上下二端可通过焊锡而分别与该二导电层电性连接，通电后该加热件可将电能转为热能，进而加热该试管。
但连接该加热件与该二导电层的焊锡往往因为长期反复热胀冷缩产生的应力而产生裂损，影响该加热装置的寿命；此外，进行焊接作业时，部分呈熔融状态的焊锡可能因为毛细现象或重力作用而渗入加热件与容置孔之间的孔隙，且当该加热件一端焊接完成而另一端的焊锡仍呈部分融熔状态时，由于该孔隙成为一密闭空间，且该基板在冷却过程中，孔隙内的空气温度降低会造成体积缩小，孔隙内便形成一真空吸力使该部分呈熔融状态的焊锡被吸入孔隙，若该加热件二端的焊锡于孔隙中相互连结在一起，该二导电层之间便会发生短路，使产品的合格率降低。
发明公开
本发明所要解决的技术问题是提供一种加热装置，其可提升产制合格率且可延长使用寿命。本发明的另一目的在于提供一种生化反应器，其可提升产制合格率且可延长使用寿命。
为了实现上述目的，本发明提供了一种加热装置包含一上板、一下板、一中板以及一电热件；该上板具有一上加热孔、至少一位于该上加热孔旁的上容置孔，以及一上传导层，该上传导层具有一上部覆于该上板的一上表面且围绕该上容置孔、以及一容置管部覆于该上容置孔的孔壁且连接该上传导层的上 部；该下板具有一下加热孔、至少一位于该下加热孔旁的下容置孔、以及一第一下传导层，该第一下传导层具有一下部覆于该下板的一下表面且围绕该下容置孔、以及一容置管部覆于该下容置孔的孔壁且连接该第一下传导层的下部；该中板设于该上、下板之间，该中板具有一中加热孔、以及至少一位于该中加热孔旁的中容置孔，其中该上、中、下加热孔互相连通形成一加热贯孔，该上、中、下容置孔互相连通形成一容置贯孔；该电热件设于该容置贯孔中且以其二端分别电性连接于该上传导层以及该第一下传导层。
为了更好地实现上述目的，本发明还提供了一种具有该加热装置的生化反应器，该生化反应器用以供一试管插置且包含了一第一本体、一第二本体、以及一加热装置设于该第一、第二本体之间，该第一本体具有一第一通孔，该第二本体位于该第一本体下方且具有一第二通孔，其中，该加热贯孔与该第一、第二通孔互相连通形成一试管槽，用以供该试管伸入。
以下结合附图和具体实施例对本发明进行详细描述，但不作为对本发明的限定。
附图简要说明
图1为本发明第一实施例加热装置的立体图；
图2为本发明第一实施例加热装置的分解图；
图3为本发明第一实施例局部上板的透视图；
图4为本发明第一实施例局部中板的透视图；
图5为本发明第一实施例局部下板的透视图；
图6为本发明第一实施例加热装置的剖面图；
图7为本发明第一实施例生化反应器的立体图；
图8为本发明第一实施例生化反应器的剖面图；
图9为本发明第二实施例加热装置的剖面图。
其中，附图标记
1  加热装置           27  下通槽
10  上板              28  孔组
101  隔板             29  下贯槽
11  上表面            3 试管
12   下表面           30    中板
13   上加热孔         301    中隔板
14   上容置孔         31    上表面
15   上传导层         32    下表面
151   上部            33    中加热孔
152   下部            34    中容置孔
153   容置管部        35    中传导层
154   加热管部        351    上部
17   上通槽           352    下部
18   孔组             353    加热管部
19   上贯槽           37    中通槽
2   生化反应器        4    第一本体
20   下板             40    电热件
201   下隔板          401    第一通孔
21   上表面           5    第二本体
22   下表面           50    加热贯孔
23   下加热孔         501    第二通孔
24   下容置孔         6    试管槽
25   第一下传导层     60    容置贯孔
251   上部            7    加热装置
252   下部            70    上板
253   容置管部        701    绝缘层
26   第二下传导层     71    上表面
261   上部            80    下板
262   下部            81    下表面
263   加热管部        90    中板
G   间隙
实现本发明的最佳方式
下面结合附图对本发明的结构原理和工作原理作具体的描述：
图1至6为本发明第一实施例所提供的加热装置1，其具有一上板10、一下板20、一中板30以及四电热件40。
首先，请先参考图2、3、6，该上板10为由可导热的绝缘材质如玻璃纤维树脂制成，其具有一上表面11、一下表面12、四上加热孔13、四分别位于各该上加热孔13旁的上容置孔14、四上传导层15以及五上通槽17，各该上加热孔13与其旁边的该上容置孔14形成一孔组18，如图2所示，因此本实施例的上板10共形成四孔组18；该上传导层15可由铜等具良好导电与导热性质的材料制成，其具有一上部151覆于该上表面11且围绕该上容置孔14及该上加热孔13、一下部152覆于该下表面12且围绕该上容置孔14及该上加热孔13、一容置管部153覆于该上容置孔14的孔壁且连接该上部151与该下部152、以及一加热管部154覆于该上加热孔13的孔壁且连接该上部151及该下部152，该上部151及该下部152概呈环形然并不以此为限；该五上通槽17逐一位于各该孔组18的二侧以分隔该等孔组18，每二上通槽17之间定义一上隔板101，使该四孔组18分别位于该四上隔板101，该上板10还具有一上贯槽19与各该上通槽17的一端连接在一起，换言之，各该孔组18的三侧为由二上通槽17及该上贯槽19所围绕。于其他实施例中，一上加热孔13旁可设有一个以上的上容置孔14而不加以限制。
请参考图2、5、6，该下板20为由可导热的绝缘材质如玻璃纤维树脂制成，其具有一上表面21、一下表面22、四下加热孔23、四分别位于各该下加热孔23旁的下容置孔24、四第一下传导层25、四第二下传导层26以及五下通槽27，各该下加热孔23与其旁边的该下容置孔24形成一孔组28，因此本实施例的下板20共形成四孔组28；该第一下传导层25可由铜等具良好导电与导热性质的材料制成，其具有一上部251覆于该上表面21且围绕该下容置孔24、一下部252覆于该下表面22且围绕该下容置孔24、以及一容置管部253覆于该下容置孔24的孔壁且连接该上部251以及该下部252；该第二下传导层26可由铜等具良好导电与导热性质的材料制成，其具有一上部261覆于该上表面21且围绕该下加热孔23、一下部262覆于该下表面22且围绕该下加热孔23、以及一加热管部263覆于该下加热孔23的孔壁且连接该上部261以及该下部262，其中，该第一下传导层25的下部252还围绕该第二下传导层26的下部262，且该下部252与该下部262之间具有一间隙G，该第一下传导层25的上部251还围绕该第二下传导层26的上部261，且该上部251与该上部261之间具有一间隙G，换言之，该第一传导层25 与该第二传导层26之间并未连通，该上部251、该下部252、该上部261及该下部262概呈环形然并不以此为限；该五下通槽27逐一位于各该孔组28的二侧以分隔该等孔组28，每二下通槽27之间定义一下隔板201，使该四孔组28分别位于该四下隔板201，该下板20还具有一下贯槽29与各该下通槽27的一端连接在一起，换言之，各该孔组28的三侧为由二下通槽27及该下贯槽29所围绕。于其他实施例中，一下加热孔23旁可设有一个以上的下容置孔24而不加以限制。
请参考图2、4、6，该中板30为由可导热的绝缘材质如玻璃纤维树脂制成并设于该上板10及该下板20之间，该中板30具有一上表面31、一下表面32、四中加热孔33、四分别位于各该中加热孔33旁的中容置孔34、四中传导层35以及三中通槽37；该中传导层35可由铜等具良好导电与导热性质的材料制成，其具有一上部351覆于该上表面31且围绕该中加热孔33、一下部352覆于该下表面32且围绕该中加热孔33、以及一加热管部353覆于该中加热孔33的孔壁且连接该上部351以及该下部352，该上部351及该下部352概呈环形然并不以此为限；其中一中通槽37呈长条形且位置大致对应该上贯槽19与该下贯槽29，另二中通槽37则概呈L型，且与该长条形中通槽37共同围构出一中隔板301，该些中通槽37将该些中加热孔33及该些中容置孔34包围在其中。于其他实施例中，一中加热孔33旁可设有一个以上的中容置孔34而不加以限制，且该些中通槽37的形状可视需求变化。当该上板10、中板30以及下板20依序迭合在一起时，该上加热孔13、该中加热孔33以及该下加热孔23互相连通形成一加热贯孔50，该上容置孔14、该中容置孔34以及该下容置孔24互相连通形成一容置贯孔60，此时，该中传导层35的下部352与该第二下传导层26的上部261连接而可传导热与电，但不与该第一下传导层25的上部251连接，且该中传导层35的上部351与该上传导层15的下部152连接而可传导热与电；然于其他实施例中，该上、中、第二下传导层表面可覆有一防焊层，使各传导层之间虽无法导电但能导热。
该四电热件40分别设于各该容置贯孔60中，且以其二端分别电性连接于该上传导层15以及该第一下传导层25，于本实施例中，该电热件40为一电阻式电热器，其上下二端以焊锡与该上传导层15及该第一下传导层25电性连接，于其他实施例中，该电热件40的类型可随不同需求改变。
本发明还提供一具有该加热装置1的生化反应器2用以供四试管3插置，如图7、8所示，该生化反应器2还包含了一第一本体4与一第二本体5，该加热装 置1则设于该第一本体4与该第二本体5之间，该第一本体4具有四第一通孔401，该第二本体5位于该第一本体4下方且具有四第二通孔501，其中，每一个加热贯孔50分别与其上方的第一通孔401及其下方的第二通孔501互相连通形成一试管槽6，因此该生化反应器2具有四试管槽6用以供该四试管3伸入，于其他实施例中该些试管3数量可视需求改变。
藉此，该加热装置1可利用该电热件40提供热能并传至该加热贯孔50，用以让试管3的局部大致维持在一稳定的温度范围内以进行生化反应，为达此目的，一电源(图未示)可利用该上传导层15与该第一下传导层15对该电热件40供电，该电热件40将电能转为热能，并将热能透过焊锡、该容置贯孔60内的空气、该上传导层15、该中传导层35、第一下传导层25、第二下传导层26以及该上板10、该中板30与该下板20本身传递至该加热贯孔50。其中，围绕于该上容置孔14周围的该上传导层15的下部152是为了进一步辅助该上板10导热，于其他实施例中可视情况省略不设；该第一下传导层25的上部251是为了进一步辅助该下板20导热，于其他实施例中，该上部251可视情况仅围绕该下容置孔24而未围绕该下加热孔23，甚至，该上部251可省略不设；藉此，该加热贯孔50可得一均匀的加热温度，进而提供该些试管3的局部大致维持在一稳定的温度范围内以进行生化反应。事实上，传导层除了前述上传导层15的上部151与容置管部153、该第一下传导层25的容置管部253与下部252以外，其余部位的传导层可省略不设，然省略后的加热装置的导热效果必然较省略前差。
由于该上板10的该些上通槽17使该些上隔板101具有弹性，可吸收该电热件40热胀冷缩时的应力，可有效降低该电热件40与该上传导层15的焊接接点产生裂损的机率，从而延长该加热装置1的使用寿命，而该上贯槽19则可进一步增加该上隔板10的弹性变形量，然由于该上板10本身即具有弹性而可吸收该电热件40热胀冷缩时的应力，故该些上通槽17与该上贯槽19均可视情况省略；另一方面，由于该些上通槽17将各该孔组18分隔开来，因此位于各该上隔板101中电热件40的热能不会逸散到其他上隔板101，以确保各该上加热孔13都可得一均匀稳定的加热效果，然该些上通槽17亦可省略不设。同样地，该下板20的该些下通槽27、该下贯槽29与该些下隔板201亦具有如上述的功效，故在此不再重复说明。
此外，该些中通槽37包围该等中加热孔33与该等中容置孔34的设计可使各 该电热件40产生的热能大致保留在该中隔板301而不散失到该中板30的其他区域，使各该中加热孔33之间的温度维持均一，然该些中通槽37亦可省略不设。
该加热装置1的上板10、中板30、下板20为利用现有技术印刷电路板工艺制造，不仅制造快速且整体结构轻巧，该上板10、该中板30与该下板20依序叠合后可藉多数螺栓锁合在一起，或是利用双面胶等胶合层粘合在一起，依序结合后的上板10、中板30、下板20(下称组板)于其他实施例中亦可以上下颠倒的方式设于该生化反应器2中。由于各板之间仍存有缝隙，当各该电热件40二端进行焊接作业时，该容置贯孔60并非一密闭空间，故当焊锡冷却过程中，该容置贯孔60内的空气不会因温度降低、体积缩小而产生真空吸力将尚未凝固的焊锡吸入该电热件40与该容置贯孔60之间的孔隙中，可避免该电热件40二端的焊锡相互连接而发生短路，即便呈熔融状态的焊锡因毛细现象或重力作用而渗入该孔隙中，由于焊锡仅与传导层具有附着力而中容置孔34孔壁并无传导层，因此焊锡至多仅会渗入覆有上传导层15的上容置孔14以及覆有第一下传导层25的下容置孔24，而不会再继续往该中容置孔34渗入，可进一步避免该电热件40二端的焊锡连结在一起，避免发生电性短路，藉此，可有效提高产品合格率。
该上板10、该中板30以及该下板20的材质可以有其他变化，如图9所示为本发明第二实施例提供的加热装置7，其上板70、中板90以及下板80为均由导电材质外包覆一绝缘层701而形成，该导电材质如铝或铁，故同时兼具高导热性；由于各板本身导热能力较绝缘材质为佳，故部分传导层可选择性地省略以简化工艺，例如该上传导层15可省略该加热管部154、围绕于该上加热孔13的部分上部151、或该下部152，该第二下传导层26可省略该加热管部263、该上部261或该下部262，该第一下传导层25可省略围绕于该第二下传导层26的部分下部252、该上部251，该中传导层35则可省略该加热管部353、该上部351、或该下部352，于本实施例中，即使各板不具有上述部分传导层，该电热件40产生的热能依旧可有效地传递至该加热贯孔50，但该加热装置7仍须覆设具有导电功能的传导层藉焊锡与该电热件40电性连接，故设于上板70的上传导层15包含上部151以及容置管部153，而设于下板80的第一下传导层25则包含下部252以及容置管部253。
当然，本发明还可有其它多种实施例，在不背离本发明精神及其实质的情况下，熟悉本领域的技术人员当可根据本发明作出各种相应的改变和变形，但 这些相应的改变和变形都应属于本发明所附的权利要求的保护范围。
工业应用性
该加热装置以及具有该加热装置的生化反应器可让试管局部维持在一稳定的温度范围内以进行生化反应，不仅可提升产制合格率且可延长使用寿命。

Claims (9)

  1. 一种加热装置，其特征在于，包含有：
    一上板，具有一上加热孔、至少一位于该上加热孔旁的上容置孔，以及一上传导层，该上传导层具有一上部覆于该上板的一上表面且围绕该上容置孔、以及一容置管部覆于该上容置孔的孔壁且连接该上传导层的上部；
    一下板，具有一下加热孔、至少一位于该下加热孔旁的下容置孔、以及一第一下传导层，该第一下传导层具有一下部覆于该下板的一下表面且围绕该下容置孔、以及一容置管部覆于该下容置孔的孔壁且连接该第一下传导层的下部；
    一中板，设于该上、下板之间，该中板具有一中加热孔、以及至少一位于该中加热孔旁的中容置孔；其中该上、中、下加热孔互相连通形成一加热贯孔，该上、中、下容置孔互相连通形成一容置贯孔；以及
    一电热件，设于该容置贯孔中且以其二端分别电性连接于该上传导层以及该第一下传导层。
  2. 根据权利要求1的加热装置，其特征在于，该上传导层的上部还围绕该上加热孔，该上传导层还具有一下部覆于该上板的一下表面且围绕该上加热孔、以及一加热管部覆于该上加热孔的孔壁且连接该上传导层的上、下部；该下板还具有一第二下传导层，该第二下传导层具有一下部覆于该下板的下表面且围绕该下加热孔、一上部覆于该下板的一上表面且围绕该下加热孔、以及一加热管部覆于该下加热孔的孔壁且连接该第二下传导层的上、下部，该第一下传导层的下部还围绕该第二下传导层的下部，且该第一下传导层的下部与该第二下传导层的下部之间具有一间隙；该中板还具有一中传导层，该中传导层具有一上部覆于该中板的一上表面且围绕该中加热孔、一下部覆于该中板的一下表面且围绕该中加热孔、以及一加热管部覆于该中加热孔的孔壁且连接该中传导层的上、下部。
  3. 根据权利要求2的加热装置，其特征在于，该上传导层的下部还围绕该上容置孔且连接该上传导层的容置管部。
  4. 根据权利要求2的加热装置，其特征在于，该第一下传导层还具有一上部覆于该下板的上表面且围绕该下容置孔，该上部并连接该第一下传导层的 容置管部，该第一下传导层的上部还围绕该第二下传导层的上部，且该第一下传导层的上部与该第二下传导层的上部之间具有一间隙。
  5. 根据权利要求1的加热装置，其特征在于，该上板具有多数该上加热孔，每一该上加热孔旁具有至少一该上容置孔，各该上加热孔与其旁边的该上容置孔形成一孔组，该上板还具有多数上通槽分隔该等孔组。
  6. 根据权利要求1的加热装置，其特征在于，该下板具有多数该下加热孔，每一该下加热孔旁具有至少一该下容置孔，各该下加热孔与其旁边的该下容置孔形成一孔组，该下板还具有多数下通槽分隔该等孔组。
  7. 根据权利要求1的加热装置，其特征在于，该中板具有多数该中加热孔，每一该中加热孔旁具有至少一该中容置孔，该中板还具有多数中通槽包围该中加热孔与该中容置孔。
  8. 根据权利要求1的加热装置，其特征在于，该上、中、下板为由绝缘材质制成，或者由导电材质外包覆一绝缘层而形成。
  9. 一种生化反应器，用以供一试管插置，其特征在于，该生化反应器包含有：
    一第一本体，具有一第一通孔；
    一第二本体，位于该第一本体下方且具有一第二通孔；
    一如权利要求1至8中任一项所述的加热装置，设于该第一、二本体之间；
    其中，该加热贯孔与该第一、二通孔互相连通形成一试管槽，用以供该试管伸入。
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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003055973A1 (fr) * 2001-12-26 2003-07-10 Olympus Corporation Recipient a reaction et mecanisme de retenue de recipient a reaction
CN200960457Y (zh) * 2006-10-26 2007-10-17 深圳迈瑞生物医疗电子股份有限公司 固体直热反应盘结构
KR20090110161A (ko) * 2008-04-17 2009-10-21 이상수 전기 향로
CN104293662A (zh) * 2014-09-10 2015-01-21 瑞基海洋生物科技股份有限公司 生化反应器

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5940458B2 (ja) * 2010-01-12 2016-06-29 アーラム バイオシステムズ インコーポレイテッド ３段熱対流装置及びその使用法
JP5867668B2 (ja) * 2010-12-01 2016-02-24 セイコーエプソン株式会社 熱サイクル装置及び熱サイクル方法
JP6216494B2 (ja) * 2012-03-30 2017-10-18 セイコーエプソン株式会社 熱サイクル装置及び熱サイクル装置の制御方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003055973A1 (fr) * 2001-12-26 2003-07-10 Olympus Corporation Recipient a reaction et mecanisme de retenue de recipient a reaction
CN200960457Y (zh) * 2006-10-26 2007-10-17 深圳迈瑞生物医疗电子股份有限公司 固体直热反应盘结构
KR20090110161A (ko) * 2008-04-17 2009-10-21 이상수 전기 향로
CN104293662A (zh) * 2014-09-10 2015-01-21 瑞基海洋生物科技股份有限公司 生化反应器

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019056168A1 (zh) * 2017-09-19 2019-03-28 瑞基海洋生物科技股份有限公司 生化反应装置的加热机构
CN110651033A (zh) * 2017-09-19 2020-01-03 瑞基海洋生物科技股份有限公司 生化反应装置的加热机构
US11351553B2 (en) 2017-09-19 2022-06-07 Genereach Biotechnology Corp. Heating mechanism for biochemical reaction device
CN110651033B (zh) * 2017-09-19 2022-11-01 瑞基海洋生物科技股份有限公司 生化反应装置的加热机构

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