WO2016138852A1 - 一种光模块与系统板的通信方法、装置及一种光模块 - Google Patents

一种光模块与系统板的通信方法、装置及一种光模块 Download PDF

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Publication number
WO2016138852A1
WO2016138852A1 PCT/CN2016/075241 CN2016075241W WO2016138852A1 WO 2016138852 A1 WO2016138852 A1 WO 2016138852A1 CN 2016075241 W CN2016075241 W CN 2016075241W WO 2016138852 A1 WO2016138852 A1 WO 2016138852A1
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Prior art keywords
bus
optical module
system board
type
communication
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PCT/CN2016/075241
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English (en)
French (fr)
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匡国华
陆建鑫
朱梅冬
陈雷
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中兴通讯股份有限公司
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Publication of WO2016138852A1 publication Critical patent/WO2016138852A1/zh

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
    • G06F13/38—Information transfer, e.g. on bus
    • G06F13/40—Bus structure
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • H04B10/25—Arrangements specific to fibre transmission

Definitions

  • the present invention relates to the field of communications, and in particular to a method and device for communicating an optical module and a system board, and an optical module.
  • optical module provides a wide range of auxiliary functions from the single-providing photoelectric conversion function to the intelligent development.
  • the data volume of the management interface of the optical module and the system is increased.
  • the Inter-Integrated Circuit (I2C) commonly used in optical modules is currently used.
  • the interface is limited by its own rate, and it is difficult to meet a large number of data communication scenarios. For example, the amount of communication data between the optical module and the system board of the optical time domain reflectometer (OTDR) is greatly increased.
  • optical modules are an important part of optical network equipment.
  • SFP Serial Form-Factor Pluggable
  • XFP Gigabit Small Form Factor Pluggable Module
  • the MSA multi-source protocol defines the bus as a two-wire I2C bus, optical module.
  • the serial data (Serial Data, SDA for short) and Serial Clock Line (SCL) lines are connected to the system board for information interaction.
  • Each optical module has a unique address identification, and the system addresses and communicates with the optical module slaves through the address.
  • the present invention provides a method and an apparatus for communicating an optical module and a system board, and an optical module to solve at least the problem of slow rate in the process of communicating between the optical module and the system board in the related art.
  • a method for communicating an optical module and a system board includes: the optical module receives a control signal of the system board; and the optical module is configured from the first type of bus according to the control signal.
  • the second type of bus selects a bus used for communication with the above system board, wherein the communication rate when the second type bus is used for communication is greater than the communication rate when the first type bus is used for communication.
  • the first type of bus is a two-wire bus
  • the second type of bus is a four-wire bus.
  • the first type of bus is an inter-integrated circuit I2C bus
  • the second type of bus is a serial peripheral interface SPI bus.
  • the optical module includes: Setting a predetermined pin of the optical module to be a low level or a high level; wherein, when the specified pin is set to a low level, the optical module communicates with the system board by using the first type bus; When the designated pin is set to a high level, the optical module communicates with the system board via the second type of bus.
  • the specified pin is a MOD0 pin.
  • the optical module before the selecting, by the optical module, the bus used for communicating with the system board from the first type bus and the second type bus according to the control signal, the optical module includes: the optical module is connected to the inverter connected to the specified pin. The analog switch is triggered to control the bus used for communication between the optical module and the system board.
  • the TxFault pin of the optical module is multiplexed, and the TxFault pin is used as a host input slave output MISO of the optical module.
  • a method for communicating an optical module and a system board is further provided, the system board sends a control signal to the optical module, where the control signal is used to indicate that the optical module is from the first type of bus and
  • the second type of bus selects a bus used for communication with the above system board, wherein the communication rate when the second type bus is used for communication is greater than the communication rate when the first type bus is used for communication.
  • control signal selects, by using the first type bus and the second type bus, a bus used for communicating with the system board by: controlling, by using the control signal, that a specified pin of the optical module is set to be low. The level is still high, wherein when the specified pin is set to a low level, the optical module communicates with the system board by using the first type bus, and when the designated pin is set to a high level, the above The optical module communicates with the above system board through the second type bus.
  • the system board controls an analog switch on the system board to generate the control signal.
  • the first type of bus is an inter-integrated circuit I2C bus
  • the second type of bus is a serial peripheral interface SPI bus.
  • an optical module includes: a first path that communicates with a system board by using a first type of bus; and a second path that communicates with a system board by using a second type of bus; Wherein, the communication rate when communicating by using the second path is greater than the communication rate when communicating by using the first path; and the analog switch is configured to select the first communication with the system board according to a control signal from the system board.
  • the method further includes: a designated pin configured to receive the control signal, and generate a trigger signal for triggering the analog switch to select the first path or the second path according to the control signal.
  • the specified pin is a MOD0 pin.
  • the trigger signal is set to a low level or a high level, wherein when the trigger signal is set to a low level, the optical module is controlled to communicate with the system board by using the first path, and the triggering is performed. When the signal is set to a high level, the optical module communicates with the system board through the second path.
  • the first type of bus is a two-wire bus
  • the second type of bus is a four-wire bus.
  • a communication device for an optical module and a system board is further provided.
  • the device is applied to a system board, and the device includes: a sending module, configured to send a control signal to the optical module, and the control signal And a bus used for instructing the optical module to select communication with the system board from the first type bus and the second type bus, wherein a communication rate when communicating by using the second type bus is greater than using the first type bus The communication rate at the time of communication.
  • the optical module receives the control signal of the system board, and the optical module selects, according to the control signal, the bus used for communication with the system board from the first type bus and the second type bus, wherein the second type is adopted.
  • the communication rate when the bus communicates is greater than the communication rate when the first type of bus is used for communication.
  • FIG. 1 is a flow chart of a method of communicating an optical module and a system board according to an embodiment of the present invention
  • FIG. 2 is a flow chart (1) of a method for communicating an optical module and a system board according to an embodiment of the present invention
  • FIG. 3 is a structural block diagram of an optical module according to an embodiment of the present invention.
  • FIG. 4 is a structural block diagram (1) of an optical module according to an embodiment of the present invention.
  • FIG. 5 is a structural block diagram of a communication device of an optical module and a system board according to an embodiment of the present invention
  • FIG. 6 is a block diagram of I2C and SPI bus multiplexing according to an embodiment of the present invention.
  • FIG. 7 is a functional diagram of I2C and SPI bus switching according to an embodiment of the present invention.
  • FIG. 8 is a schematic block diagram of communication multiplexing of an optical module according to an embodiment of the present invention.
  • FIG. 9 is a schematic external view of an optical module according to an embodiment of the present invention.
  • FIG. 10 is a schematic diagram of connection of an SFP optical module according to an embodiment of the invention.
  • FIG. 11 is a block diagram showing the connection principle of an optical module and a system board according to an embodiment of the present invention.
  • FIG. 12 is a block diagram and a connection diagram of a multiplexing principle of an XFP optical module according to an embodiment of the invention.
  • FIG. 1 is a flowchart of a method for communicating an optical module and a system board according to an embodiment of the present invention. As shown in FIG. 1, the process includes the following steps. :
  • Step S102 the optical module receives a control signal of the system board.
  • Step S104 the optical module selects, according to the control signal, a bus used for communication with the system board from the first type bus and the second type bus, wherein the communication rate when communicating with the second type bus is greater than that of using the first type bus The communication rate at the time of communication.
  • the optical module is controlled by the system board to select the first type bus or the second type bus to transmit data with the system board.
  • the optical module and the system board can only be implemented through two wires.
  • the communication solves the problem of slow rate in the process of communicating between the optical module and the system board in the related art, thereby improving the rate of data transmission between the optical module and the system board.
  • the first type of bus is a two-wire bus and the second type of bus is a four-wire bus. Therefore, the optical module can selectively communicate with the system board by using a two-wire bus or a four-wire bus.
  • the first type of bus is an inter-integrated circuit I2C bus and the second type of bus is a serial peripheral interface SPI bus.
  • the optical module After the optical module receives the control signal of the system board, in an optional embodiment, the optical module sets the designated pin of the optical module to a low level or a high level according to the control signal. Wherein, when the designated pin is set to a low level, the optical module communicates with the system board through the first type bus, and when the designated pin is set to a high level, the optical module and the system board pass through the second type bus. Communication.
  • the designated pin is a MOD0 pin.
  • the optical module Before the optical module selects a bus for communication with the system board from the first type of bus and the second type of bus according to the control signal, in an alternative embodiment, the optical module passes through an inverter connected to the designated pin. Trigger an analog switch to control the bus used to communicate between the optical module and the system board.
  • the TxFault pin of the optical module is multiplexed, and the TxFault pin is used as the host input slave output of the optical module. MISO.
  • FIG. 2 is a flowchart (1) of the communication method between the optical module and the system board according to the embodiment of the present invention, as shown in FIG.
  • the process includes the following steps:
  • Step S202 the system board sends a control signal to the optical module, where the control signal is used to instruct the optical module to select a bus used for communication with the system board from the first type bus and the second type bus, wherein the second type bus is used.
  • the communication rate at the time of communication is greater than the communication rate when the first type of bus is used for communication.
  • the optical module is controlled by the system board to select the first type bus or the second type bus to transmit data with the system board.
  • the optical module and the system board can only be implemented through two wires. Communication, solution
  • the problem that the optical module communicates with the system board is slow, and the rate of data transmission between the optical module and the system board is improved.
  • control signal selects a bus used to communicate with the system board from the first type bus and the second type bus by: controlling the specified pin of the optical module to be low by the control signal The level is still high.
  • the specified pin is set to low level
  • the optical module communicates with the system board through the first type bus.
  • the specified pin is set to high level
  • the optical module and the system board Communication takes place via the second type of bus.
  • the system board Before the system board sends the control signal to the optical module, in an alternative embodiment, the system board controls the analog switch on the system board to generate the control signal.
  • the first type of bus is an inter-integrated circuit I2C bus and the second type of bus is a serial peripheral interface SPI bus.
  • FIG. 3 is a structural block diagram of an optical module according to an embodiment of the present invention.
  • the optical module includes: a first path 32.
  • the first type of bus communicates with the system board;
  • the second path 34 communicates with the system board by using the second type of bus; wherein the communication rate when the second path is used for communication is greater than the communication when the first path is used for communication Rate;
  • analog switch 36 configured to select a first path or a second path in communication with the system board based on control signals from the system board.
  • FIG. 4 is a structural block diagram (1) of an optical module according to an embodiment of the present invention; as shown in FIG. 4, the optical module further includes: a designated pin 42 configured to receive the control signal, and generated according to the control signal The analog switch is triggered to select a trigger signal of the first path or the second path.
  • the specified pin is a MOD0 pin.
  • the trigger signal is set to a low level or a high level, wherein when the trigger signal is set to a low level, the optical module is controlled to communicate with the system board through the first path, and the trigger signal is set. When the level is high, the optical module communicates with the system board through the second path.
  • the first type of bus is a two-wire bus
  • the second type of bus is a four-wire bus.
  • a communication device between the optical module and the system board is further provided, and the device is used to implement the foregoing embodiments and preferred embodiments, and details are not described herein.
  • the term "module” may implement a combination of software and/or hardware of a predetermined function.
  • the apparatus described in the following embodiments is preferably implemented in software, hardware, or a combination of software and hardware, is also possible and contemplated.
  • FIG. 5 is a structural block diagram of a communication device of an optical module and a system board according to an embodiment of the present invention.
  • the device is applied to a system board.
  • the device includes: a sending module 52 configured to send a control signal to the optical module.
  • the control signal is used to instruct the optical module to select a bus used to communicate with the system board from the first type bus and the second type bus, wherein the communication rate when communicating with the second type bus is greater than the first type The communication rate when the bus is communicating.
  • each of the above modules may be implemented by software or hardware.
  • the foregoing may be implemented by, but not limited to, the foregoing modules are all located in the same processor; or, each of the above modules is respectively located.
  • the first processor, the second processor, and the third processor In the first processor, the second processor, and the third processor.
  • the optical module includes a Micro Control Unit (MCU), an extended function, and an I2C/SPI bus switching device.
  • the system board can select to communicate with the optical module through the I2C bus communication or the SPI bus through the illustrated switching device.
  • the SPI is a four-wire bus, which uses a similar master and slave addressing mode as the I2C two-wire bus.
  • the master and slave are addressed and communicated via CSB (chip select), MOSI (master output slave input), MISO (master input slave output), SCK (clock).
  • FIG. 7 is a schematic diagram of I2C and SPI bus switching functions according to an embodiment of the present invention.
  • FIG. 7 is a functional diagram of a two-wire I2C bus and a four-wire SPI bus switching function according to an alternative embodiment of the present invention, using an analog switch switching bus.
  • the system board When the I2C bus mode is selected, the system board is connected to the MCU chip I2C_1 and the extended function I2C_2 by enabling the SEN control analog switch to realize the two-wire bus mode communication, which is compatible with the SFP module multi-source protocol definition.
  • the system board is connected to the optical module MCU for information transfer via a serial data (SDA) line and a serial clock (SCL) line.
  • SDA serial data
  • SCL serial clock
  • FIG. 8 is a schematic block diagram of an optical module communication multiplexing according to an embodiment of the present invention.
  • a detailed functional block diagram of the optional embodiment the optional embodiment adopts the SFP optical module package shown in FIG. 9 .
  • Figure 8 is a block diagram of one of the implementation switching principles of the bus of Figure 6.
  • the analog switch adopts three sets of single-pole double-throw switches.
  • the MOD0 pin of the SFP optical module is used as an enabler to trigger the analog switch, and the chip select signal of the SPI bus is output by the system board, as in the embodiment FIG.
  • the programmable logic device Complex Programmable Logic Device, CPLD for short
  • the analog switch When MOD0 is low, the analog switch is switched to the two-wire I2C mode, 1A is connected to 1B1, 2A is connected to 2B1, and 3A is connected to 3B1.
  • the system board can be directly connected to the optical module MCU SDA_1SCL_2 or the extended function SDA_2SCL_2 to implement the I2C bus communication mode.
  • SPI is a high-speed, full-duplex communication bus that includes MOSI (master output slave input), MISO (master input slave output), SCK (clock), and CSB (chip select).
  • FIG. 10 is a schematic diagram of a SFP optical module connection according to an embodiment of the present invention
  • FIG. 1 is a schematic diagram of a hardware structure and connection definition of an SFP (Small Form-Factor Pluggable) optical module
  • FIG. 12 is an XFP optical module multiplexing according to an embodiment of the present invention.
  • the principle block diagram and the connection diagram are also a block diagram of the system board connection principle corresponding to the optical module of Table 1 in the preferred embodiment of the present invention. Implement I2C and SPI bus multiplexing.
  • the optional embodiment fully considers the compatibility mode of the related system and the module.
  • the default communication bus is I2C
  • the optical module that does not support the two-wire I2C and the four-wire SPI bus does not need any change, and can directly System board communication; for system boards that do not support I2C/SPI multiplexing, the SFP multi-source protocol defines MOD0 to be low level.
  • the invention patent uses MOD0 to connect the inverter output SEN to a high level to implement the default I2C bus mode.
  • FIG. 12 and FIG. 2 are connection definitions for implementing I2C and SPI multiplexing in a 10G EPON OLT optical module of an XFP (10Gigabit Small Form Factor Pluggable Module) according to another alternative embodiment of the present invention. Similar to the bus multiplexing method of FIG.
  • the optical module of the present invention which can be applied to the I2C communication mode, is extended to the I2C and SPI bus multiplexing modes.
  • the present invention provides a technology compatible with an I2C and an SPI bus.
  • the communication between the optical module and the system board can be performed by using a two-wire I2C bus or a four-wire SPI bus, thereby implementing compatible optical modules.
  • the multi-source protocol supports the two-wire I2C bus. It also supports a higher-speed four-wire SPI bus. It supports smooth upgrade of optical modules and supports smooth upgrade and interworking of existing network systems.
  • a storage medium is further provided, wherein the software includes the above-mentioned software, including but not limited to: an optical disk, a floppy disk, a hard disk, an erasable memory, and the like.
  • modules or steps of the present invention described above can be implemented by a general-purpose computing device that can be centralized on a single computing device or distributed across a network of multiple computing devices. Alternatively, they may be implemented by program code executable by the computing device such that they may be stored in the storage device by the computing device and, in some cases, may be different from the order herein.
  • the steps shown or described are performed, or they are separately fabricated into individual integrated circuit modules, or a plurality of modules or steps thereof are fabricated as a single integrated circuit module.
  • the invention is not limited to any specific combination of hardware and software.
  • the optical module receives the control signal of the system board, and the optical module selects, according to the control signal, the bus used for communication with the system board from the first type bus and the second type bus, wherein the second The communication rate when the type bus communicates is greater than the communication rate when the first type bus is used for communication.

Abstract

本发明公开了一种光模块与系统板的通信方法、装置及一种光模块，其中，该方法包括：光模块接收系统板的控制信号；光模块根据该控制信号从第一类型总线和第二类型总线中选择与系统板进行通信所采用的总线，其中，采用第二类型总线进行通信时的通信速率大于采用第一类型总线进行通信时的通信速率。通过本发明解决了相关技术中光模块与系统板进行通信的过程中速率较慢的问题，进而提升了光模块与系统板之间传输数据的速率。

Description

一种光模块与系统板的通信方法、装置及一种光模块 技术领域
本发明涉及通信领域，具体而言，涉及一种光模块与系统板的通信方法、装置及一种光模块。
背景技术
随着互联网业务及各种增值业务的不断增加，推动了光纤网络的迅猛发展。从核心网、承载网到接入网使用光纤网络已经成为基本共识。光模块从单一提供光电转换功能向智能化发展，提供丰富的辅助功能，光模块与系统的管理接口数据量增大，目前光模块普遍采用的集成电路间(Inter－Integrated Circuit，简称为I2C)接口则受到本身速率限制，难以满足大量数据通信的场景，例如增加了光时域反射仪(Optical Time Domain Reflectometer，简称为OTDR)的光模块与系统板的通信数据量大增。
在光纤通信中，光模块是光网络设备的一个重要组成部分。有完善的协议进行规范通信总线模式，例如SFP(Small Form-Factor Pluggable)、XFP(10Gigabit Small Form Factor Pluggable Module)等封装的光模块MSA多源协议中定义总线为两线式I2C总线，光模块通过串行数据(Serial Data，简称为SDA)线和串行时钟(Serial Clock Line，简称为SCL)线连接到系统板进行信息交互。每个光模块都有一个唯一的地址识别，系统通过地址对光模块从机寻址并通信。
针对相关技术中，光模块与系统板进行通信的过程中速率较慢的问题，还未提出有效的解决方案。
发明内容
本发明提供了一种光模块与系统板的通信方法、装置及一种光模块，以至少解决相关技术中光模块与系统板进行通信的过程中速率较慢的问题。
根据本发明实施例的一个方面，提供了一种光模块与系统板的通信方法，其特征在于，包括：光模块接收系统板的控制信号；上述光模块根据上述控制信号从第一类型总线和第二类型总线中选择与上述系统板进行通信所采用的总线，其中，采用上述第二类型总线进行通信时的通信速率大于采用上述第一类型总线进行通信时的通信速率。
可选地，上述第一类型总线为两线制总线，上述第二类型总线为四线制总线。
可选地，上述第一类型总线为集成电路间I2C总线，上述第二类型总线为串行外设接口SPI总线。
可选地，上述光模块接收上述系统板的上述控制信号之后包括：上述光模块根据上述控 制信号设置上述光模块的指定管脚为低电平或高电平；其中，在上述指定管脚设置为低电平时，上述光模块与上述系统板之间通过上述第一类型总线进行通信；在上述指定管脚设置为高电平时，上述光模块与上述系统板之间通过上述第二类总线进行通信。
可选地，上述指定管脚为MOD0管脚。
可选地，上述光模块根据上述控制信号从第一类型总线和第二类型总线中选择与上述系统板进行通信所采用的总线之前包括：上述光模块通过与上述指定管脚连接的反相器触发模拟开关，控制上述光模块与上述系统板之间进行通信所采用的总线。
可选地，在上述光模块采用四线制SPI总线与上述系统板进行通信时，对上述光模块的TxFault管脚进行复用，将上述TxFault管脚作为上述光模块的主机输入从机输出MISO。
根据本发明实施例的另一个方面，还提供了一种光模块与系统板的通信方法，包括：系统板向光模块发送控制信号，上述控制信号用于指示上述光模块从第一类型总线和第二类型总线中选择与上述系统板进行通信所采用的总线，其中，采用上述第二类型总线进行通信时的通信速率大于采用上述第一类型总线进行通信时的通信速率。
可选地，上述控制信号通过以下方式从上述第一类型总线和上述第二类型总线中选择与上述系统板进行通信所采用的总线：通过上述控制信号控制上述光模块的指定管脚设置为低电平还是高电平，其中，在上述指定管脚设置为低电平时，上述光模块与上述系统板之间通过上述第一类型总线进行通信，在上述指定管脚设置为高电平时，上述光模块与上述系统板之间通过上述第二类型总线进行通信。
可选地，上述系统板向上述光模块发送上述控制信号之前包括：上述系统板控制上述系统板上的模拟开关产生上述控制信号。
可选地，上述第一类型总线为集成电路间I2C总线，上述第二类型总线为串行外设接口SPI总线。
根据本发明实施例的另一个方面，还提供了一种光模块，包括：第一通路，采用第一类型总线与系统板进行通信；第二通路，采用第二类型总线与系统板进行通信；其中，采用上述第二通路进行通信时的通信速率大于采用上述第一通路进行通信时的通信速率；模拟开关，设置为根据来自上述系统板的控制信号选择与上述系统板进行通信的上述第一通路或上述第二通路。
可选地，还包括：指定管脚，设置为接收上述控制信号，并根据上述控制信号产生用于触发上述模拟开关选择上述第一通路或上述第二通路的触发信号。
可选地，上述指定管脚为MOD0管脚。
可选地，上述触发信号设置为低电平或者高电平，其中，在上述触发信号设置为低电平时，控制上述光模块与上述系统板之间通过上述第一通路进行通信，在上述触发信号设置为高电平时，上述光模块与上述系统板之间通过上述第二通路进行通信。
可选地，上述第一类型总线为两线制总线，上述第二类型总线为四线制总线。
根据本发明实施例的另一个方面，还提供了一种光模块与系统板的通信装置，上述装置应用于系统板，上述装置包括：发送模块，设置为向光模块发送控制信号，上述控制信号用于指示上述光模块从第一类型总线和第二类型总线中选择与上述系统板进行通信所采用的总线，其中，采用上述第二类型总线进行通信时的通信速率大于采用上述第一类型总线进行通信时的通信速率。
通过本发明实施例，采用光模块接收系统板的控制信号；光模块根据该控制信号从第一类型总线和第二类型总线中选择与系统板进行通信所采用的总线，其中，采用第二类型总线进行通信时的通信速率大于采用第一类型总线进行通信时的通信速率。解决了相关技术中光模块与系统板进行通信的过程中速率较慢的问题，进而提升了光模块与系统板之间传输数据的速率。
附图说明
此处所说明的附图用来提供对本发明的进一步理解，构成本申请的一部分，本发明的示意性实施例及其说明用于解释本发明，并不构成对本发明的不当限定。在附图中：
图1是根据本发明实施例的光模块与系统板的通信方法的流程图；
图2是根据本发明实施例的光模块与系统板的通信方法的流程图(一)；
图3是根据本发明实施例的光模块的结构框图；
图4是根据本发明实施例的光模块的结构框图(一)；
图5是根据本发明实施例的光模块与系统板的通信装置的结构框图；
图6是根据本发明实施例的I2C与SPI总线复用框图；
图7是根据本发明实施例的I2C与SPI总线切换功能图；
图8是根据本发明实施例的光模块通信复用的原理框图；
图9是根据本发明实施例的光模块外形示意图；
图10是根据本发明实施例的SFP光模块连接示意图；
图11是根据本发明实施例的光模块与系统板连接原理框图；
图12是根据本发明实施例的XFP光模块复用原理框图及连接示意图。
具体实施方式
下文中将参考附图并结合实施例来详细说明本发明。需要说明的是，在不冲突的情况下， 本申请中的实施例及实施例中的特征可以相互组合。
在本实施例中提供了一种光模块与系统板的通信方法，图1是根据本发明实施例的光模块与系统板的通信方法的流程图，如图1所示，该流程包括如下步骤：
步骤S102，光模块接收系统板的控制信号；
步骤S104，光模块根据该控制信号从第一类型总线和第二类型总线中选择与系统板进行通信所采用的总线，其中，采用第二类型总线进行通信时的通信速率大于采用第一类型总线进行通信时的通信速率。
通过上述步骤，由系统板控制光模块选择采用第一类型总线或者第二类型总线与系统板进行数据的传输，相比于相关技术中，光模块与系统板之间只能通过两线制进行通信，解决了相关技术中光模块与系统板进行通信的过程中速率较慢的问题，进而提升了光模块与系统板之间传输数据的速率。
在一个可选实施例中，上述第一类型总线为两线制总线，上述第二类型总线为四线制总线。从而，光模块可以选择采用两线制总线或者四线制总线与系统板进行通信。
在一个可选实施例中，第一类型总线为集成电路间I2C总线，第二类型总线为串行外设接口SPI总线。
光模块接收系统板的该控制信号之后，在一个可选实施例中，光模块根据该控制信号设置光模块的指定管脚为低电平或高电平。其中，在指定管脚设置为低电平时，光模块与系统板之间通过第一类型总线进行通信，在指定管脚设置为高电平时，光模块与系统板之间通过第二类总线进行通信。
在一个可选实施例中，上述指定管脚为MOD0管脚。
在光模块根据该控制信号从第一类型总线和第二类型总线中选择与系统板进行通信所采用的总线之前，在一个可选实施例中，光模块通过与指定管脚连接的反相器触发模拟开关，控制该光模块与系统板之间进行通信所采用的总线。
在一个可选实施例中，在光模块采用四线制SPI总线与该系统板进行通信时，对光模块的TxFault管脚进行复用，将TxFault管脚作为该光模块的主机输入从机输出MISO。
在本实施例中还提供了另一种光模块与系统板的通信方法，图2是根据本发明实施例的光模块与系统板的通信方法的流程图(一)，如图2所示，该流程包括如下步骤：
步骤S202，系统板向光模块发送控制信号，该控制信号用于指示光模块从第一类型总线和第二类型总线中选择与系统板进行通信所采用的总线，其中，采用第二类型总线进行通信时的通信速率大于采用该第一类型总线进行通信时的通信速率。
通过上述步骤，由系统板控制光模块选择采用第一类型总线或者第二类型总线与系统板进行数据的传输，相比于相关技术中，光模块与系统板之间只能通过两线制进行通信，解决 了相关技术中光模块与系统板进行通信的过程中速率较慢的问题，进而提升了光模块与系统板之间传输数据的速率。
在一个可选实施例中，控制信号通过以下方式从第一类型总线和第二类型总线中选择与系统板进行通信所采用的总线：通过该控制信号控制该光模块的指定管脚设置为低电平还是高电平，其中，在指定管脚设置为低电平时，光模块与该系统板之间通过第一类型总线进行通信，在指定管脚设置为高电平时，光模块与系统板之间通过该第二类型总线进行通信。
在系统板向光模块发送该控制信号之前，在一个可选实施例中，系统板控制该系统板上的模拟开关产生该控制信号。
在一个可选实施例中，第一类型总线为集成电路间I2C总线，第二类型总线为串行外设接口SPI总线。
根据本发明的另一个可选实施例中，还提供了一种光模块，图3是根据本发明实施例的光模块的结构框图，如图3所示，该光模块包括：第一通路32，采用第一类型总线与系统板进行通信；第二通路34，采用第二类型总线与系统板进行通信；其中，采用第二通路进行通信时的通信速率大于采用第一通路进行通信时的通信速率；模拟开关36，设置为根据来自系统板的控制信号选择与系统板进行通信的第一通路或第二通路。
图4是根据本发明实施例的光模块的结构框图(一)；如图4所示，该光模块还包括：指定管脚42，设置为接收该控制信号，并根据该控制信号产生用于触发该模拟开关选择第一通路或第二通路的触发信号。
可选地，上述指定管脚为MOD0管脚。
可选地，触发信号设置为低电平或者高电平，其中，在该触发信号设置为低电平时，控制该光模块与该系统板之间通过该第一通路进行通信，在触发信号设置为高电平时，该光模块与该系统板之间通过该第二通路进行通信。
可选地，上述第一类型总线为两线制总线，上述第二类型总线为四线制总线。
在本实施例中还提供了一种光模块与系统板的通信装置，该装置用于实现上述实施例及优选实施方式，已经进行过说明的不再赘述。如以下所使用的，术语“模块”可以实现预定功能的软件和/或硬件的组合。尽管以下实施例所描述的装置较佳地以软件来实现，但是硬件，或者软件和硬件的组合的实现也是可能并被构想的。
图5是根据本发明实施例的光模块与系统板的通信装置的结构框图，该装置应用于系统板，如图5所示，该装置包括：发送模块52，设置为向光模块发送控制信号，该控制信号用于指示光模块从第一类型总线和第二类型总线中选择与该系统板进行通信所采用的总线，其中，采用第二类型总线进行通信时的通信速率大于采用第一类型总线进行通信时的通信速率。
需要说明的是，上述各个模块是可以通过软件或硬件来实现的，对于后者，可以通过以下方式实现，但不限于此：上述各个模块均位于同一处理器中；或者，上述各个模块分别位 于第一处理器、第二处理器和第三处理器…中。
针对相关技术中存在的上述问题，下面结合可选实施例进行说明，在本可选实施例中结合了上述可选实施例及其可选实施方式。
图6是根据本发明实施例的I2C与SPI总线复用框图，如图6所示，光模块内部包括微控制单元(Micro Control Unit，简称为MCU)、扩展功能以及I2C/SPI总线切换装置。系统板可以通过图示切换装置选择与光模块通过I2C总线通信或SPI总线通信。SPI是四线制总线，与I2C两线制总线采用类似的主机、从机寻址方式。主机与从机通过CSB(片选)、MOSI(主机输出从机输入)、MISO(主机输入从机输出)、SCK(时钟)寻址并通信。
图7是根据本发明实施例的I2C与SPI总线切换功能图，如图7所示，是本发明可选实施例两线制I2C总线与四线制SPI总线切换功能图，采用模拟开关切换总线，选择I2C总线模式，则系统板通过使能SEN控制模拟开关，与MCU芯片I2C_1和扩展功能I2C_2连接，实现两线制总线方式通信，兼容SFP模块多源协议相关定义。系统板通过串行数据(SDA)线和串行时钟(SCL)线在连接到光模块MCU进行信息传递。每个光模块内部MCU和扩展功能都有一个唯一地址，用于识别光模块；模拟开关通过使能SEN可切换到SPI模式，建立通信。
图8是根据本发明实施例的光模块通信复用的原理框图，如图8所示，本可选实施例的详细原理框图，本可选实施例采用了图9所示的SFP光模块封装类型，兼容SFP MSA多源协议，图8是图6的总线的其中一种实施切换原理框图。模拟开关采用三组单刀双掷开关，由SFP光模块的MOD0管脚通过反相器作为使能来触发模拟开关，同时作为SPI总线的片选信号由系统板输出，如实施例图11中复杂可编程逻辑器件(Complex Programmable Logic Device，简称为CPLD)输出至光模块第6管脚信号。当MOD0为低电平时，模拟开关切换为两线制I2C方式，1A与1B1连接，2A与2B1连接，3A与3B1连接。系统板可直接与光模块MCU SDA_1SCL_2，或扩展功能SDA_2SCL_2连接，实现I2C总线通信方式。
当MOD0为高电平，模拟开关切换到四线制SPI方式，1A与1B2连接，2A与2B2连接，3A与3B2连接，其中SFP光模块中TxFault管脚被复用为SPI的MISO。实现系统板与光模块中扩展功能SPI总线通信方式。SPI是是一种高速、全双工通信总线，分别包括MOSI(主机输出从机输入)、MISO(主机输入从机输出)、SCK(时钟)、CSB(片选)。
图10是根据本发明实施例的SFP光模块连接示意图，与表1是基于SFP(Small Form-Factor Pluggable)光模块硬件示意图及连接定义，图12是根据本发明实施例的XFP光模块复用原理框图及连接示意图，也是本发明优选实施例与图10表1光模块对应的系统板连接原理框图。实现I2C与SPI总线复用功能。
表1：
Figure PCTCN2016075241-appb-000001
本可选实施例充分考虑相关系统和模块的兼容模式，可选实施例默认通信总线为I2C，对于不支持两线制I2C与四线制SPI总线复用的光模块无需任何改变，可直接与系统板通信；对于不支持I2C/SPI复用的系统板，SFP多源协议定义MOD0为低电平，本发明专利通过MOD0连接反向器输出SEN为高电平，实现默认了I2C总线模式。
图12与表2是本发明另一可选实施例应用于XFP(10Gigabit Small Form Factor Pluggable Module)10G EPON OLT光模块内实现I2C与SPI复用的连接定义。与图7总线复用方法类似。本可选实施例可应用于I2C通信方式的光模块扩展为I2C与SPI总线复用方式。
表2：
pin Symbol Description
1 GND Module Ground
2 TX_1G_P Transmit Non-inverted 1.25Gps data input
3 TX_1G_N Transmit inverted 1.25Gps data input
4 GND Module Ground
5 TX_DIS 10G/1G transmit disable
6 Vcc5 5V power supply
7 GND Module Ground
8 Vcc3_TX 3.3V power supply for transmit
9 Vcc3_RX 3.3V power supply for receiver
10 SCL/SCK I2C Clock/SPI Clock
11 SDA/MOSI I2C Serial Data/SPI Master Out Slave In
12 MOD_ABS/CSB Module presentation status/SPI Chip Select
13 NC Not Implemented
14 RX_LOS Receiver loss of signal
15 GND Module
16 GND Module
17 RD_10G_N Receive burst inverted 10.3125G data output
18 RD_10G_P Receive burst Non-inverted 10.3125G data output
19 GND Module Ground
20 RD_1G_N Receive burst inverted 1.25G data output
21 RD_1G_P Receive burst Non-inverted 1.25G data output
22 MISO SPI Master In Slave Out
23 RX_RSSI_TRIG RSSI trigger signal input from the host
24 NC Not Implemented
25 NC Not Implemented
26 NC Not Implemented
27 GND Module Ground
28 TX_10G_N Transmit Inverted 10.3125Gbps Data Input
29 TX_10G_P Transmit Non-Inverted 10.3125Gbps Data Input
30 GND Module Ground
综上所述，本发明提供一种I2C与SPI总线兼容的技术，光模块与系统板的通信既可以使用两线制I2C总线，也可以切换为四线制SPI总线，实现了兼容相关光模块多源协议，支持两线制I2C总线，同时也支持更高速的四线制SPI总线，支持光模块平滑升级，支持现网系统平滑升级和互通。
在另外一个实施例中，还提供了一种软件，该软件用于执行上述实施例及优选实施方式中描述的技术方案。
在另外一个实施例中，还提供了一种存储介质，该存储介质中存储有上述软件，该存储介质包括但不限于：光盘、软盘、硬盘、可擦写存储器等。
显然，本领域的技术人员应该明白，上述的本发明的各模块或各步骤可以用通用的计算装置来实现，它们可以集中在单个的计算装置上，或者分布在多个计算装置所组成的网络上，可选地，它们可以用计算装置可执行的程序代码来实现，从而，可以将它们存储在存储装置中由计算装置来执行，并且在某些情况下，可以以不同于此处的顺序执行所示出或描述的步骤，或者将它们分别制作成各个集成电路模块，或者将它们中的多个模块或步骤制作成单个集成电路模块来实现。这样，本发明不限制于任何特定的硬件和软件结合。
以上所述仅为本发明的优选实施例而已，并不用于限制本发明，对于本领域的技术人员来说，本发明可以有各种更改和变化。凡在本发明的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本发明的保护范围之内。
工业实用性
在本发明实施例中，采用光模块接收系统板的控制信号；光模块根据该控制信号从第一类型总线和第二类型总线中选择与系统板进行通信所采用的总线，其中，采用第二类型总线进行通信时的通信速率大于采用第一类型总线进行通信时的通信速率。解决了相关技术中光模块与系统板进行通信的过程中速率较慢的问题，进而提升了光模块与系统板之间传输数据的速率。

Claims (17)

  1. 一种光模块与系统板的通信方法，包括：
    光模块接收系统板的控制信号；
    所述光模块根据所述控制信号从第一类型总线和第二类型总线中选择与所述系统板进行通信所采用的总线，其中，采用所述第二类型总线进行通信时的通信速率大于采用所述第一类型总线进行通信时的通信速率。
  2. 根据权利要求1所述的方法，其中，所述第一类型总线为两线制总线，所述第二类型总线为四线制总线。
  3. 根据权利要求2所述的方法，其中，所述第一类型总线为集成电路间I2C总线，所述第二类型总线为串行外设接口SPI总线。
  4. 根据权利要求1所述的方法，其中，所述光模块接收所述系统板的所述控制信号之后包括：
    所述光模块根据所述控制信号设置所述光模块的指定管脚为低电平或高电平；其中，在所述指定管脚设置为低电平时，所述光模块与所述系统板之间通过所述第一类型总线进行通信；在所述指定管脚设置为高电平时，所述光模块与所述系统板之间通过所述第二类总线进行通信。
  5. 根据权利要求4所述的方法，其中，所述指定管脚为MOD0管脚。
  6. 根据权利要求4所述的方法，其中，所述光模块根据所述控制信号从第一类型总线和第二类型总线中选择与所述系统板进行通信所采用的总线之前包括：
    所述光模块通过与所述指定管脚连接的反相器触发模拟开关，控制所述光模块与所述系统板之间进行通信所采用的总线。
  7. 根据权利要求2所述的方法，其中，还包括：在所述光模块采用四线制SPI总线与所述系统板进行通信时，对所述光模块的TxFault管脚进行复用，将所述TxFault管脚作为所述光模块的主机输入从机输出MISO。
  8. 一种光模块与系统板的通信方法，包括：
    系统板向光模块发送控制信号，所述控制信号用于指示所述光模块从第一类型总线和第二类型总线中选择与所述系统板进行通信所采用的总线，其中，采用所述第二类型总线进行通信时的通信速率大于采用所述第一类型总线进行通信时的通信速率。
  9. 根据权利要求8所述的方法，其中，所述控制信号通过以下方式从所述第一类型总线和所述第二类型总线中选择与所述系统板进行通信所采用的总线：
    通过所述控制信号控制所述光模块的指定管脚设置为低电平还是高电平，其中，在所述指定管脚设置为低电平时，所述光模块与所述系统板之间通过所述第一类型总线进 行通信，在所述指定管脚设置为高电平时，所述光模块与所述系统板之间通过所述第二类型总线进行通信。
  10. 根据权利要求8所述的方法，其中，所述系统板向所述光模块发送所述控制信号之前包括：
    所述系统板控制所述系统板上的模拟开关产生所述控制信号。
  11. 根据权利要求8所述的方法，其中，所述第一类型总线为集成电路间I2C总线，所述第二类型总线为串行外设接口SPI总线。
  12. 一种光模块，包括：
    第一通路，采用第一类型总线与系统板进行通信；
    第二通路，采用第二类型总线与系统板进行通信；其中，采用所述第二通路进行通信时的通信速率大于采用所述第一通路进行通信时的通信速率；
    模拟开关，设置为根据来自所述系统板的控制信号选择与所述系统板进行通信的所述第一通路或所述第二通路。
  13. 根据权利要求12所述的光模块，其中，还包括：
    指定管脚，设置为接收所述控制信号，并根据所述控制信号产生用于触发所述模拟开关选择所述第一通路或所述第二通路的触发信号。
  14. 根据权利要求13所述的光模块，其中，所述指定管脚为MOD0管脚。
  15. 根据权利要求13所述的光模块，其中，所述触发信号设置为低电平或者高电平，其中，在所述触发信号设置为低电平时，控制所述光模块与所述系统板之间通过所述第一通路进行通信，在所述触发信号设置为高电平时，所述光模块与所述系统板之间通过所述第二通路进行通信。
  16. 根据权利要求12所述的光模块，其中，所述第一类型总线为两线制总线，所述第二类型总线为四线制总线。
  17. 一种光模块与系统板的通信装置，所述装置应用于系统板，所述装置包括：
    发送模块，设置为向光模块发送控制信号，所述控制信号用于指示所述光模块从第一类型总线和第二类型总线中选择与所述系统板进行通信所采用的总线，其中，采用所述第二类型总线进行通信时的通信速率大于采用所述第一类型总线进行通信时的通信速率。
PCT/CN2016/075241 2015-03-05 2016-03-01 一种光模块与系统板的通信方法、装置及一种光模块 WO2016138852A1 (zh)

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