WO2016119418A1 - Structure d'axe z d'un accéléromètre - Google Patents

Structure d'axe z d'un accéléromètre Download PDF

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Publication number
WO2016119418A1
WO2016119418A1 PCT/CN2015/084969 CN2015084969W WO2016119418A1 WO 2016119418 A1 WO2016119418 A1 WO 2016119418A1 CN 2015084969 W CN2015084969 W CN 2015084969W WO 2016119418 A1 WO2016119418 A1 WO 2016119418A1
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Prior art keywords
pole piece
electrode pole
axis
movable electrode
fixed electrode
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PCT/CN2015/084969
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English (en)
Chinese (zh)
Inventor
方华斌
宋青林
孙艳美
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歌尔声学股份有限公司
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Priority to US15/542,761 priority Critical patent/US20170363656A1/en
Publication of WO2016119418A1 publication Critical patent/WO2016119418A1/fr

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/125—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
    • G01P2015/0822—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass

Definitions

  • the invention belongs to the field of micro electromechanical (MEMS), and more particularly relates to a microelectromechanical inertial measurement module, in particular to a Z-axis structure in an accelerometer.
  • MEMS micro electromechanical
  • Z-axis accelerometers were all flat-plate capacitive, and the motion mode of the mass was a structure similar to a seesaw.
  • a first plate electrode 2 made of metal or polysilicon 2 on the substrate 4 below the mass 1, there are a first plate electrode 2 made of metal or polysilicon 2, a second plate electrode 3, and the mass 1 and the two electrodes respectively form two capacitors C1, C2.
  • the distance between the mass 1 and the first plate electrode 2 and the second plate electrode 3 is equal, and the values of C1 and C2 are equal at this time.
  • the mass 1 If there is acceleration input, the mass 1 is no longer balanced, and a flip similar to the seesaw occurs.
  • the mass 1 is side down and side up, at this time, between the mass 1 and the first plate electrode 2.
  • the distance from its distance to the second plate electrode 3 is no longer equal.
  • C1 decreases, and C2 increases, while the difference between C1 and C2 is proportional to the input acceleration, and the output is positive.
  • the negative sign reflects the direction of the input acceleration.
  • the Z-axis accelerometer of the above structure has the following drawbacks:
  • XY axial accelerometers are currently in-plane comb-tooth capacitance schemes, so for XY-axis accelerometers, it is not necessary to introduce a plate electrode on the substrate.
  • the scheme of the above Z-axis accelerometer is completely different, and it is necessary to have a plate electrode on the substrate. That is, in order to realize the design of the Z-axis accelerometer, an additional layer of plate electrodes is required to increase the complexity and cost of the process.
  • the plate electrode is on the substrate, so the parasitic capacitance of the Z-axis accelerometer is relatively large, which in turn affects the accuracy of the Z-axis accelerometer; while the XY-axis accelerometer, because the capacitor plate is suspended, the parasitic capacitance is generally better than the Z-axis. Accelerometers are less than half, so the accuracy of a typical XY-axis accelerometer is higher than the Z-axis.
  • the Z-axis accelerometer uses a flat-plate capacitor structure, which occupies a relatively large area. Generally, in a three-axis accelerometer, the Z-axis accelerometer occupies an area of more than 40%.
  • the present invention provides a Z-axis structure in an accelerometer.
  • a Z-axis structure in an accelerometer including a substrate, further comprising:
  • An elastic beam supported by the side wall supports a mass above the substrate, which is flattened in the Z-axis direction with respect to the substrate, wherein the sidewall of the mass is provided with a first movable electrode pole piece and a second Movable electrode pole piece;
  • first fixed electrode pole piece and a second fixed electrode pole piece disposed on the substrate, wherein the first fixed electrode pole piece and the second fixed electrode pole piece extend in a plane direction composed of an X axis and a Y axis;
  • the first movable electrode pole piece is opposite to the sidewall of the first fixed electrode pole piece to form a first Z-axis detecting capacitance;
  • the second movable electrode pole piece is opposite to the sidewall of the second fixed electrode pole piece, Forming a second Z-axis detection capacitor;
  • the end surface of one end of the first fixed electrode pole piece is lower than the end surface of the same end of the first movable electrode pole piece; and the end surface of the second fixed electrode pole piece at the same end as the first fixed electrode pole piece is higher than the first end An end surface of the second movable electrode pole piece that is at the same end as the first fixed electrode pole piece.
  • the mass is provided with a through hole, and the first movable electrode pole piece and the second movable electrode pole piece are disposed on the sidewall of the mass block through hole.
  • the upper end surface of the first fixed electrode pole piece is lower than the upper end surface of the first movable electrode pole piece; the upper end surface of the second fixed electrode pole piece is higher than the upper movable electrode pole piece End face.
  • the lower end surface of the first fixed electrode pole piece and the first movable electrode is flush; the lower end surface of the second fixed electrode pole piece is flush with the lower end surface of the second movable electrode pole piece.
  • the lower end faces of the first fixed electrode pole piece, the first movable electrode pole piece, the second fixed electrode pole piece, and the second movable electrode pole piece are all flush.
  • the lower end surface of the first fixed electrode pole piece is lower than the lower end surface of the first movable electrode pole piece; the lower end surface of the second fixed electrode pole piece is higher than the second movable electrode The lower end of the pole piece.
  • the first fixed electrode pole piece and the first movable electrode pole piece are provided in plurality, and the plurality of first movable electrode pole pieces are distributed along the sidewall of the mass; the plurality of first fixed electrode poles
  • the sheet and the first movable electrode pole piece constitute a comb-tooth capacitance structure.
  • the second fixed electrode pole piece and the second movable electrode pole piece respectively have a plurality of, and the plurality of second movable electrode pole pieces are distributed along the sidewall of the mass; the plurality of second fixed electrode poles
  • the sheet and the second movable electrode pole piece constitute a comb-tooth capacitance structure.
  • the first fixed electrode pole piece and the second fixed electrode pole piece are arranged in parallel on the substrate.
  • the first movable electrode pole piece and the second movable electrode pole piece are integrally formed with the mass.
  • the Z-axis accelerometer of the invention eliminates the structure of the lower plate, thereby eliminating the limitation of the lower plate to the Z-axis accelerometer, so that the motion mode of the mass is no longer a seesaw motion, but in the Z-axis direction.
  • the lower translation mode reduces the parasitic capacitance of the Z-axis accelerometer and improves the detection accuracy. Moreover, since the lower plate structure is discarded, the chip area occupied by the chip board is reduced, the complexity and cost of the manufacturing process are reduced, and the reliability of the chip is improved.
  • the Z-axis structure avoids the contact of the mass with the substrate and improves the reliability of the chip; since the mass and the fixed electrode are on the same layer, firstly, better consistency than the conventional Z-axis structure can be achieved, and Anchor points can be designed more concentrated, reducing the chip's sensitivity to temperature and stress changes.
  • Fig. 1 is a schematic view showing the structure of a Z-axis structure in the prior art.
  • Figure 2 shows a schematic view of the mass of Figure 1 when it is deflected.
  • Figure 3 shows a schematic view of the Z-axis structure of the present invention.
  • Figure 4a shows a schematic diagram of the motion modality of the mass of the invention in its initial state.
  • Figure 4b shows a schematic diagram of the motion pattern of the mass of the invention when subjected to acceleration in the negative direction of the Z-axis.
  • Figure 4c is a schematic illustration of the motion pattern of the mass of the present invention when subjected to a positive acceleration in the Z-axis.
  • FIGS 5a to 5c show schematic diagrams of the Z-axis detection capacitance of the present invention.
  • 6a to 6c are schematic views showing another embodiment of the Z-axis detecting capacitor of the present invention.
  • the accelerometer of the conventional structure adopts a translational mode in both the X-axis and the Y-axis direction, and the Z-axis adopts a seesaw-type deflection mode.
  • the present invention provides a Z in an accelerometer.
  • the shaft structure can be used to detect the Z-axis acceleration signal in the vertical direction.
  • a substrate 4 is included on which various functional components of the accelerometer, etc., can be arranged.
  • the mass 1 can be connected to the anchor point 6 on the substrate 4 by means of a spring beam 5, in particular the side wall of the mass 1 is connected to the anchor point 6 of the substrate 4 by means of a spring beam 5.
  • the anchor point 6 can also be raised by the spacer.
  • the mass 1 When the mass 1 is subjected to a corresponding force, it can move up and down with respect to the substrate 4, more precisely, when the mass 1 is subjected to acceleration in the Z-axis direction, the mass 1 can be moved in the Z-axis direction. Move up or down.
  • the upward direction is the positive direction of the Z axis
  • the downward direction is the negative direction of the Z axis.
  • the mass 1 is moved downward by the action of the elastic beam to perform the action of stretching the elastic beam downward, see Fig. 4b.
  • the mass 1 is moved upward by the action of the elastic beam to perform an action of stretching the elastic beam upward, with reference to Fig. 4c.
  • a plurality of elastic beams are provided for stable support, which will not be specifically described herein.
  • a first movable electrode pole piece 10, a second movable electrode pole piece 11, a first movable electrode pole piece 10, a second movable electrode pole piece 11 and a mass are disposed on a side wall of the mass 1
  • Block 1 is integral and is used as a common pole piece for differential sense capacitors.
  • the first movable electrode pad 10 and the second movable electrode pad 11 may be disposed at an edge of the mass 1.
  • the mass 1 is provided with a through hole, and the first movable electrode pad 10 is provided.
  • the second movable electrode pad 11 is disposed on the sidewall of the through hole of the mass 1.
  • a first fixed electrode 2 and a second fixed electrode 3 are further disposed on the substrate 4, and the first fixed
  • the edges of the electrode 2 and the second fixed electrode 3 are respectively provided with a first fixed electrode pole piece 20 and a second fixed electrode pole piece 30 extending outward.
  • the first fixed electrode 2 and the first fixed electrode pole piece 20 are integrally formed, and the second fixed electrode 3 and the second fixed electrode pole piece 30 are also integrally formed.
  • the first fixed electrode pole piece 20 and the second fixed electrode pole piece 30 are located in a plane direction formed by the X axis and the Y axis, that is, the first fixed electrode pole piece 20 and the second fixed electrode pole piece 30
  • the direction of extension is perpendicular to the direction of motion of the mass 1.
  • the first fixed electrode pole piece 20 may extend in the X-axis direction
  • the second fixed electrode pole piece 30 may also extend in the X-axis direction.
  • the first fixed electrode 2 is The second fixed electrodes 3 may be arranged in parallel on the substrate 4.
  • the second fixed electrode pole piece 30 may also extend in the Y-axis direction as long as it is substantially perpendicular to the moving direction of the mass block 1.
  • the first movable electrode pole piece 10 is opposite to the sidewall of the first fixed electrode pole piece 20 to constitute a first Z-axis detecting capacitance; that is, the sidewalls of the two pole pieces located in the XZ or YZ plane are opposite,
  • the first movable electrode pole piece 10 is displaced in the Z-axis direction as the mass 1 is displaced, the relative area and position between the two pole piece side walls are changed, so that the first Z-axis detecting capacitance changes.
  • the second movable electrode pole piece 11 is opposite to the side wall of the second fixed electrode pole piece 30 to constitute a second Z-axis detecting capacitance; that is, the two pole pieces are located in the XZ or YZ plane.
  • the side walls are opposite such that when the second movable electrode pole piece 11 is displaced in the Z-axis direction, the relative area and position between the two pole piece side walls are changed, so that the second Z-axis detection is performed.
  • the capacitance changes.
  • the end surface of one end of the first fixed electrode pole piece 20 is lower than the first movable electrode pole.
  • the end surface of the same end of the first fixed electrode pole piece 20 of the second fixed electrode pole piece 30 is higher than the end face of the second movable electrode pole piece 11 at the same end as the first fixed electrode pole piece 20.
  • the upper end surface of the first fixed electrode pole piece 20 is lower than the upper end surface of the first movable electrode pole piece 10; the upper end surface of the second fixed electrode pole piece 30 is higher than the second The upper end surface of the electrode electrode tab 11.
  • the thickness of the first movable electrode pad 10 and the like can be reduced by etching.
  • the lower end faces of the pole pieces may be flush or uneven. Now we will introduce each case separately.
  • the lower end surface of the first fixed electrode pole piece 20 is flush with the lower end surface of the first movable electrode pole piece 10; the lower end surface of the second fixed electrode pole piece 30 is the second end The lower end surface of the movable electrode pole piece 11 is flush. That is, in this embodiment, referring to FIG.
  • the upper end surface of the first fixed electrode pole piece 20 is lower than the upper end surface of the first movable electrode pole piece 10, and the lower end faces of the two pole pieces are flush;
  • the upper end surface of the second fixed electrode pole piece 30 is higher than the upper end surface of the second movable electrode pole piece 11, and the lower end faces of the two pole pieces are flush; in a preferred embodiment of the present invention, the first The lower end faces of the fixed electrode pole piece 20, the first movable electrode pole piece 10, the second fixed electrode pole piece 30, and the second movable electrode pole piece 11 are all flush.
  • the mass 1 When the mass 1 receives the acceleration in the negative direction of the Z-axis, referring to FIG. 4b and FIG. 5b, the tensile elastic beam of the mass 1 is displaced downward. At this time, the first movable electrode pole piece 10 and the second movable electrode pole The sheet 11 is displaced downward with the mass 1 . Since the area facing the second movable electrode pad 11 and the second fixed electrode pad 30 is reduced, the second Z-axis detecting capacitance C2 is decreased; and the first movable electrode pad 10 is generated downward.
  • the displacement is such that more electric field lines intersect between the lower end of the first fixed electrode pole piece 20 and the first movable electrode pole piece 10, so that the edge capacitance at the point increases, and finally the first movable electrode pole piece 10 is
  • the first Z-axis detection capacitor C1 composed of the first fixed electrode pad 20 is integrally increased.
  • a differential capacitance structure is formed between the first Z-axis detection capacitor C1 and the second Z-axis detection capacitor C2 for detecting an acceleration signal in the negative direction of the Z-axis.
  • the opposing area between the electrode pole pieces 20 is reduced, so that the first Z-axis detecting capacitance C1 is decreased; and since the second movable electrode pole piece 11 is displaced upward, the lower end of the second movable electrode pole piece 11 is There are more electric field lines intersecting between the second fixed electrode pole pieces 30, so that the edge capacitance at the place increases, and finally the second Z axis composed of the second movable electrode pole piece 11 and the second fixed electrode pole piece 30 is finally obtained.
  • the detection capacitor C2 is increased as a whole.
  • a differential capacitance structure is formed between the first Z-axis detection capacitor C1 and the second Z-axis detection capacitor C2 for detecting an acceleration signal in the positive direction of the Z-axis.
  • the Z-axis structure of the invention eliminates the structure of the lower plate, thereby getting rid of the limitation of the lower plate to the Z-axis accelerometer, so that the motion mode of the mass is no longer a seesaw motion, but in the Z-axis direction, Lower translation reduces the parasitic capacitance of the Z-axis accelerometer and improves the accuracy of detection. Moreover, since the lower plate structure is discarded, the chip area occupied by the chip is reduced, and the complexity and cost of the manufacturing process are reduced.
  • the Z-axis structure avoids the contact of the mass with the substrate and improves the reliability of the chip; since the mass and the fixed electrode are on the same layer, firstly, better consistency than the conventional Z-axis structure can be achieved, and Anchor points can be designed more concentrated, reducing the chip's sensitivity to temperature and stress changes.
  • the lower end faces of the first fixed electrode pad 20, the first movable electrode pad 10, the second fixed electrode pad 30, and the second movable electrode pad 11 are not flush. flat.
  • the lower end surface of the first fixed electrode pole piece 20 is lower than the lower end surface of the first movable electrode pole piece 10; the lower end surface of the second fixed electrode pole piece 30 is higher than the second movable electrode pole piece 11 The lower end face.
  • the upper end surface of the first fixed electrode pole piece 20 is lower than the upper end surface of the first movable electrode pole piece 10, and the lower end surface of the first fixed electrode pole piece 20 is lower than the first movable end a lower end surface of the electrode pole piece 10; an upper end surface of the second fixed electrode pole piece 30 is higher than an upper end surface of the second movable electrode pole piece 11, and a lower end surface of the second fixed electrode pole piece 30 is higher than the second movable electrode pole The lower end surface of the sheet 11.
  • the opposing area between the first movable electrode pad 10 and the first fixed electrode pad 20 is increased, so that the first Z-axis detecting capacitance C1 is increased; and the second movable electrode pad 11 and the second fixed electrode are The facing area between the sheets 30 is reduced, thereby The second Z-axis detection capacitor C2 is reduced, and finally a differential capacitance structure is formed between the first Z-axis detection capacitor C1 and the second Z-axis detection capacitor C2 for detecting an acceleration signal in the positive direction of the Z-axis.
  • the opposing area between the first movable electrode pad 10 and the first fixed electrode pad 20 is reduced, so that the first Z-axis detecting capacitance C1 is decreased; and the second movable electrode pad 11 is fixed to the second fixed
  • the facing area between the electrode pole pieces 30 is increased, so that the second Z-axis detecting capacitance C2 is increased, and finally the differential capacitance structure is formed between the first Z-axis detecting capacitor C1 and the second Z-axis detecting capacitor C2.
  • the first fixed electrode pole piece 20 and the first movable electrode pole piece 10 may have a plurality of respectively, respectively distributed along the sidewalls of the first fixed electrode 2 and the mass block 1;
  • the electrode pole piece 20 and the first movable electrode pole piece 10 form a comb-tooth capacitance structure, which improves the detection accuracy.
  • the second fixed electrode pole piece 30 and the second movable electrode pole piece 11 may also be respectively disposed, and distributed along the sidewalls of the second fixed electrode 3 and the mass block 1 respectively;
  • the second fixed electrode pole piece 30 and the second movable electrode pole piece 11 constitute a comb-toothed capacitor structure, which improves the accuracy of detection.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Pressure Sensors (AREA)

Abstract

L'invention concerne une structure d'axe Z d'un accéléromètre, qui comprend un bloc de masse (1) mobile par rapport à un substrat (4) dans la direction de l'axe Z selon un mouvement de va-et-vient. Une première plaque d'électrode (10) mobile et une seconde plaque d'électrode (11) mobile sont placées sur une paroi latérale du bloc de masse (1). Une première plaque d'électrode (20) fixe et une seconde plaque d'électrode (30) fixe, qui s'étendent vers un plan constitué d'un axe X et d'un axe Y, sont également placées sur la paroi latérale du bloc de masse (1). Cet accéléromètre d'axe Z, qui est dépourvu d'une structure de plaque inférieure, permet d'éviter la limitation imposée par une plaque inférieure de l'accéléromètre d'axe Z ; le bloc de masse (1) peut se déplacer vers le haut et vers le bas dans la direction de l'axe Z, plutôt que dans un mode à bascule ; la capacité parasite de l'accéléromètre d'axe Z est réduite, et sa précision de détection est améliorée ; un contact entre le bloc de masse (1) mobile et le substrat (4) est évité, et la fiabilité de la puce est de ce fait améliorée ; le bloc de masse (1) et les électrodes fixes se situent sur la même couche, et permettent ainsi d'assurer une cohérence supérieure par rapport à celle d'une structure d'axe Z classique ; en outre, des points d'ancrage peuvent être conçus de manière centralisée afin de réduire la sensibilité d'une puce aux changements de température et de contrainte.
PCT/CN2015/084969 2015-01-30 2015-07-23 Structure d'axe z d'un accéléromètre WO2016119418A1 (fr)

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US15/542,761 US20170363656A1 (en) 2015-01-30 2015-07-23 Z-axis structure in accelerometer

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CN201510051755.9 2015-01-30
CN201510051755.9A CN104614553A (zh) 2015-01-30 2015-01-30 一种加速度计中的z轴结构

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CN104614553A (zh) * 2015-01-30 2015-05-13 歌尔声学股份有限公司 一种加速度计中的z轴结构
CN107782914B (zh) * 2016-08-27 2021-07-09 深迪半导体(绍兴)有限公司 一种三轴加速计
DE102017211080B3 (de) * 2017-06-29 2018-11-08 Infineon Technologies Dresden GmbH & Co. KG Mikromechanischer Sensor und Verfahren zum Herstellen eines mikromechanischen Sensors und eines mikromechanischen Sensorelements
US11255873B2 (en) * 2018-09-12 2022-02-22 Analog Devices, Inc. Increased sensitivity z-axis accelerometer
GB2579057A (en) * 2018-11-16 2020-06-10 Atlantic Inertial Systems Ltd Accelerometer
JP7134931B2 (ja) * 2019-08-28 2022-09-12 株式会社東芝 センサ
CN110879303B (zh) * 2019-10-23 2022-01-04 杭州士兰微电子股份有限公司 一种惯性传感器及其控制方法
CN114280331B (zh) * 2021-12-16 2024-05-17 绍兴圆方半导体有限公司 一种z轴加速度计
CN114609413A (zh) * 2022-05-11 2022-06-10 绍兴圆方半导体有限公司 三轴加速度计

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