WO2016116047A1 - 光信号的发送方法、光收发器以及光背板互连系统 - Google Patents

光信号的发送方法、光收发器以及光背板互连系统 Download PDF

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WO2016116047A1
WO2016116047A1 PCT/CN2016/071464 CN2016071464W WO2016116047A1 WO 2016116047 A1 WO2016116047 A1 WO 2016116047A1 CN 2016071464 W CN2016071464 W CN 2016071464W WO 2016116047 A1 WO2016116047 A1 WO 2016116047A1
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optical
optical transceiver
light source
single light
transceiver
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PCT/CN2016/071464
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English (en)
French (fr)
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孙玉洁
叶兵
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中兴通讯股份有限公司
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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04J—MULTIPLEX COMMUNICATION
    • H04J14/00—Optical multiplex systems

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  • the present invention relates to the field of communications, and in particular to a method for transmitting an optical signal, an optical transceiver, and an optical backplane interconnection system.
  • the optical backplane interconnection scheme mainly includes an optical transceiver (or optical module), an optical connector, and an optical backplane on the daughter board.
  • the transmitting part is usually directly modulated by a laser array
  • the receiving part is a receiver array, but after careful observation, it can be found.
  • the transmitting portion is directly modulated by the laser array, the cost of the optical transceiver is high, which is disadvantageous for large-scale commercial use.
  • an embodiment of the present invention provides a method for transmitting an optical signal, an optical transceiver, and an optical backplane interconnection system.
  • an optical transceiver comprising: a modulator array configured to receive light input by a single light source, modulate light input by the single light source, and transmit modulated processing Light signal.
  • the optical transceiver further includes: a beam splitter connected to the modulator array, configured to perform spectroscopic processing on the light input by the single light source, and send the optical signal after the splitting process to the Modulator array.
  • the optical transceiver further includes: an optical receiver array, and an associated circuit, wherein the related circuit is the optical transceiver except the modulator array, the optical splitter, and the Other functional circuits other than the optical receiver array.
  • the modulator array, the optical splitter, the optical receiver array, and the associated circuit are integrated on a silicon wafer using silicon light integration technology.
  • an optical backplane interconnection system including: the optical transceiver described above And a single light source coupled to the optical transceiver.
  • the single light source is arranged to input light to the modulator array or the beam splitter in the optical transceiver.
  • the single light source is detachably connected to the optical transceiver.
  • the single light source and the optical transceiver are connected by at least one of the following methods: an inverted welding method and a hybrid integrated manner.
  • a method for transmitting an optical signal comprising: receiving light input from a single light source external to the optical transceiver; and modulating light input to the single light source Processing, obtaining an optical signal; transmitting the optical signal.
  • the method before the modulating the light input by the single light source, the method further comprises: performing spectroscopic processing on the light input by the single light source; and modulating the light after the spectroscopic processing.
  • the technical means for converting the laser array of the optical transceiver in the related art into a modulator array is adopted, and the related method is adopted, and the cost of using the laser array in the transmitting portion of the optical transceiver is not conducive to large
  • the problem of scale usage further reduces the cost of the optical transceiver and facilitates expansion and utilization.
  • FIG. 1 is a schematic diagram of the principle of an optical transceiver commonly used in an optical backplane interconnection system in the related art
  • FIG. 2 is a block diagram showing the structure of an optical transceiver according to an embodiment of the present invention.
  • FIG. 3 is a block diagram showing still another structure of an optical transceiver according to an embodiment of the present invention.
  • FIG. 4 is a block diagram showing still another structure of an optical transceiver according to an embodiment of the present invention.
  • FIG. 5 is a structural block diagram of an optical backplane interconnection system according to an embodiment of the present invention.
  • FIG. 6 is a schematic structural view 1 of an optical backplane interconnection system according to a preferred embodiment of the present invention.
  • FIG. 7 is a second structural diagram of an optical backplane interconnection system according to a preferred embodiment of the present invention.
  • FIG. 8 is a third structural diagram of an optical backplane interconnection system according to a preferred embodiment of the present invention.
  • FIG. 9 is a flowchart of a method of transmitting an optical signal according to an embodiment of the present invention.
  • Figure 10 is a block diagram showing the overall structure of an optical transceiver in accordance with an embodiment of the present invention.
  • FIG. 2 is a structural block diagram of an optical transceiver according to an embodiment of the present invention. As shown in FIG. 2, the method includes:
  • the modulator array 20 is configured to receive light input by the single light source 22, modulate light input by the single light source 22, and transmit the modulated processed optical signal.
  • the above optical transceiver converts the laser array of the optical transceiver in the related art into a modulator array, and solves the cost caused by the laser array in the transmitting part of the optical transceiver in the related art.
  • the problem that is not conducive to large-scale use is that the function originally completed by the laser array is divided into a single light source and a modulator array, which reduces the cost of the optical transceiver and facilitates expansion and utilization.
  • the optical transceiver further includes a beam splitter 24 connected to the modulator array 20, configured to perform spectroscopic processing on the light input from the single light source 22, and transmit the spectrally processed optical signal to the modulator array 20.
  • the optical receiver array 26 and the associated circuit 28 that should also exist in the optical transceiver are And the modulator array 20 and the beam splitter 24 are integrated on a silicon chip by using silicon light integration technology, wherein the correlation circuit 28 is other than the modulator array 20, the beam splitter 24, and the light receiver array 26 in the optical transceiver. Functional circuit.
  • the proposed optical transceiver solution based on the silicon optical integration technology in the sub-board of the optical backplane interconnection system not only has high integration degree, but also has relative integration with the prior art.
  • the transmitting end of the optical transceiver adopts the direct modulation mode of the laser array. Because of the single light source, the cost is reduced and the processing difficulty is reduced.
  • an optical backplane interconnection system is further provided. As shown in FIG. 5, the optical transceiver 50 and the single light source 22 connected to the optical transceiver 50 are included.
  • the single light source 22 can also be used to input light to the modulator array or the optical splitter in the optical transceiver.
  • the single light source 22 and the optical transceiver 50 are detachably connected; the single light source 22 and the optical transceiver 50 pass the following to One of the less ways to connect: the reverse welding method, the hybrid integration method.
  • Preferred Embodiment 1 Corresponding to the detachable connection mentioned in the above embodiment
  • the optical transceiver 50 includes a single source 22 and the above-described integrated optical splitter 24, modulator array 20, receiver array 26, optical waveguide and associated circuitry 28 using silicon light integration techniques, excluding a single source 22
  • the optical transceiver portion 50 is comprised.
  • the single light source 22 and the optical transceiver 50 that does not include the single light source 22 are two completely separate individuals.
  • the optical transceiver 50 includes a single source 22 and the above-described integrated optical splitter 24, modulator array 20, receiver array 26, optical waveguide channel and associated circuitry 28 using silicon light integration techniques, excluding a single source 22
  • the optical transceiver portion 50 is comprised.
  • the single light source 22 and the optical transceiver 50 that does not include the single light source 22 are assembled together in an inverted soldering manner.
  • the optical transceiver 50 includes a single source 22 and the above-described integrated optical splitter 24, modulator array 20, receiver array 26, optical waveguide and associated circuitry 28 using silicon light integration technology, excluding single source 22
  • the optical transceiver portion 50 is comprised.
  • the single light source 22 is integrated with an optical transceiver 50 that does not include a light source by means of hybrid integration or the like.
  • embodiments of the present invention relate to a solution for an optical transceiver on a daughter board in an optical backplane interconnection system, particularly for a sub-board of an optical communication device employing an optical backplane interconnection scheme. .
  • the solution has the outstanding advantages of low cost and high integration.
  • a method for transmitting an optical signal is further provided, which is applied to an optical transceiver, as shown in FIG. 9, and includes the following steps:
  • Step S902 receiving light input by a single light source external to the optical transceiver;
  • Step S904 The light input to the single light source is subjected to modulation processing to obtain an optical signal
  • Step S906 transmitting the above optical signal.
  • the technical means for converting the laser array of the optical transceiver into the modulator array in the related art solves the related art, and the cost of using the laser array in the transmitting portion of the optical transceiver is not conducive to large
  • the function originally completed by the laser array is divided into a single light source and a modulator array, which reduces the cost of the optical transceiver and facilitates expansion and utilization.
  • step S904 the following process may further be performed: performing spectroscopic processing on the light input by the single light source; and modulating the light after the spectroscopic processing.
  • a single light source 22 is used, and in the transmitting portion of the optical transceiver portion 50 that does not include the light source, the light input by the single light source 22 is split.
  • the device 24 is divided into n ways, and the modulator array 20 consisting of n modulators respectively modulate the n channels of light to obtain n modulated modulated optical signals; and the receiver portion 26 of the receiver array consisting of n receivers
  • the received optical signal is detected and photoelectrically converted; the optical receiving channel at the front end of the optical splitter 24 and the n-way optical transmission channel of the back-end to the modem array 20 (also known as the modulator array) and the n-channel modulated at the rear end of the modulator array 20 are modulated.
  • the input channel of the optical signal and the input channel of the n-channel receiving optical signal at the front end of the optical receiver array 26 are optical waveguide channels.
  • the associated circuit portion 28 enables driving, control, and reading of portions of the modem, receiver array, and the like.
  • the components of the optical transceiver 50 are integrated on a silicon chip by using silicon light integration technology, which improves the integration of the optical transceiver, and the single light source solution also reduces product cost and processing difficulty.
  • the embodiments of the present invention achieve the following technical effects: reduced cost, and improved integration of a modulation array, a receiving array, an optical waveguide, and a control circuit onto a silicon wafer by using silicon light integration technology.
  • Product integration provides strong support for the design of high-capacity optical interconnect systems.
  • a storage medium is further provided, wherein the software includes the above-mentioned software, including but not limited to: an optical disk, a floppy disk, a hard disk, an erasable memory, and the like.
  • modules or steps of the present invention described above can be implemented by a general-purpose computing device that can be centralized on a single computing device or distributed across a network of multiple computing devices. Alternatively, they may be implemented by program code executable by the computing device such that they may be stored in the storage device by the computing device and, in some cases, may be different from the order herein.
  • the steps shown or described are performed, or they are separately fabricated into individual integrated circuit modules, or a plurality of modules or steps thereof are fabricated as a single integrated circuit module.
  • the invention is not limited to any specific combination of hardware and software.
  • the above technical solution of the embodiment of the present invention can be applied to the process of transmitting an optical signal, and adopts the technical means for converting the laser array of the optical transceiver in the related art into a modulator array, and solves the related art, the transmission of the optical transceiver
  • the high cost caused by the partial use of the laser array is not conducive to the problem of large-scale use, thereby reducing the cost of the optical transceiver.

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  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Optical Communication System (AREA)
  • Optical Modulation, Optical Deflection, Nonlinear Optics, Optical Demodulation, Optical Logic Elements (AREA)

Abstract

一种光信号的发送方法、光收发器(50)以及光背板互连系统，所述光收发器(50)包括：调制器阵列(20)，设置为接收单光源(22)输入的光，并对所述单光源(22)输入的光进行调制处理，以及发送经调制处理后的光信号。解决了光收发器(50)的发送部分采用激光器阵列，而导致的成本较高不利于大规模使用的问题，进而减少了光收发器(50)的成本，便于扩展利用。

Description

光信号的发送方法、光收发器以及光背板互连系统 技术领域
本发明涉及通信领域，具体而言，涉及一种光信号的发送方法、光收发器以及光背板互连系统。
背景技术
随着计算机和通信技术的发展，现代社会对信息的需求量呈指数增长，对通信设备的交换容量提出了更高的要求。为增加设备交换容量，提高背板的传输速率已成为最终选择。由于传统的电互连面临寄生效应加剧、传输带宽受限等一系列瓶颈，电互连的背板已严重限制了通信设备交换容量的提升。然而近些年发展起来的光互连技术，因其具有带宽高和损耗小的优点，信号的完整性基本不受影响，并具备极好的电磁兼容性能，而且采用光互连的光背板系统速率升级更容易，因此将成为代替电互连的理想解决方案。光背板互联方案主要包括子板上的光收发器(或称为光模块)、光连接器和光背板。常用于现有的光背板互连系统的子板上的光收发器解决方案中，如图1所示，发送部分通常采用激光器阵列直接调制，接收部分采用接收器阵列，但是经过认真观察可以发现，相关技术中由于发送部分采用激光器阵列直接调制导致光收发器成本较高，不利于大规模商用。
针对相关技术中，光收发器的发送部分采用激光器阵列而导致的成本较高不利于大规模使用的问题，尚未提出有效的解决方案。
发明内容
为了解决上述技术问题，本发明实施例提供了一种光信号的发送方法、光收发器以及光背板互连系统。
根据本发明的一个实施例，提供了一种光收发器，包括：调制器阵列，设置为接收单光源输入的光，并对所述单光源输入的光进行调制处理，以及发送经调制处理后的光信号。
在本发明实施例中，光收发器还包括：分光器，与所述调制器阵列连接，设置为将所述单光源输入的光进行分光处理，并将分光处理后的光信号发送至所述调制器阵列。
在本发明实施例中，所述光收发器还包括：光接收器阵列、相关电路，其中，所述相关电路为所述光收发器中除所述调制器阵列、所述分光器、所述光接收器阵列之外的其他功能电路。
在本发明实施例中，所述调制器阵列、所述分光器、所述光接收器阵列以及所述相关电路采用硅光集成技术集成在一块硅片上。
根据本发明的另一个实施例，还提供了一种光背板互连系统，包括：以上所述的光收发 器和与所述光收发器连接的单光源。
在本发明实施例中，所述单光源，设置为向所述光收发器中的所述调制器阵列或所述分光器输入光。
在本发明实施例中，所述单光源与所述光收发器为可分离式连接。
在本发明实施例中，所述单光源与所述光收发器通过以下至少之一方式连接：倒焊接方式、混合集成方式。
根据本发明的另一个实施例，还提供了一种光信号的发送方法，应用于光收发器中，包括：接收光收发器外部单光源输入的光；对所述单光源输入的光经过调制处理，得到光信号；发送所述光信号。
在本发明实施例中，对所述单光源输入的光经过调制处理之前，还包括：将所述单光源输入的光进行分光处理；对所述分光处理后的光进行调制。
通过本发明实施例，采用将相关技术中光收发器的激光器阵列转化为调制器阵列的技术手段，解决了相关技术中，光收发器的发送部分采用激光器阵列而导致的成本较高不利于大规模使用的问题，进而减少了光收发器的成本，便于扩展利用。
附图说明
此处所说明的附图用来提供对本发明的进一步理解，构成本申请的一部分，本发明的示意性实施例及其说明用于解释本发明，并不构成对本发明的不当限定。在附图中：
图1是相关技术中的光背板互连系统中常用的光收发器的原理示意图；
图2是根据本发明实施例的光收发器的结构框图；
图3是根据本发明实施例的光收发器的再一结构框图；
图4是根据本发明实施例的光收发器的又一结构框图；
图5是根据本发明实施例的光背板互连系统的结构框图；
图6是根据本发明优选实施例的光背板互连系统的结构示意图一；
图7是根据本发明优选实施例的光背板互连系统的结构示意图二；
图8是根据本发明优选实施例的光背板互连系统的结构示意图三；
图9是根据本发明实施例的光信号的发送方法的流程图；
图10是根据本发明实施例的光收发器的整体结构框图。
具体实施方式
下文中将参考附图并结合实施例来详细说明本发明。需要说明的是，在不冲突的情况下，本申请中的实施例及实施例中的特征可以相互组合。
本发明的其它特征和优点将在随后的说明书中阐述，并且，部分地从说明书中变得显而易见，或者通过实施本发明而了解。本发明的目的和其他优点可通过在所写的说明书、权利要求书、以及附图中所特别指出的结构来实现和获得。
为了使本技术领域的人员更好地理解本发明方案，下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分的实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都应当属于本发明保护的范围。
为了解决上述技术问题，在本实施例中提供了一种光收发器，图2是根据本发明实施例的光收发器的结构框图，如图2所示，包括：
调制器阵列20，设置为接收单光源22输入的光，并对单光源22输入的光进行调制处理，以及发送经调制处理后的光信号。
通过本发明实施例提供的上述光收发器，将相关技术中光收发器的激光器阵列转化为调制器阵列的技术手段，解决了相关技术中，光收发器的发送部分采用激光器阵列而导致的成本较高不利于大规模使用的问题，将原来由激光器阵列完成的功能，分成单光源和调制器阵列来完成，减少了光收发器的成本，便于扩展利用。
当然，在具体实施过程中，调制器阵列发送的光信号应当为多个，那么仅从单光源发送的光就不能满足需要，因此，本发明实施例还提供了以下技术方案，如图3所示，光收发器还包括：分光器24，与调制器阵列20连接，设置为将单光源22输入的光进行分光处理，并将分光处理后的光信号发送至调制器阵列20。
为了提高本发明实施例提供的上述光收发器集成度，如图4所示，在本发明实施例的一个示例中，将光收发器中还应当存在的光接收器阵列26、相关电路28，以及调制器阵列20、分光器24采用硅光集成技术集成在一块硅片上，其中，相关电路28为光收发器中除调制器阵列20、分光器24、光接收器阵列26之外的其他功能电路。
采用本发明实施例提供的上述技术方案：提出的基于硅光集成技术用于光背板互连系统中子板上的光收发器解决方案，不但具有较高的集成度，且相对于现有技术中光收发器发送端采用激光器阵列直接调制的方式，因为采用单光源，不但降低了成本也降低了加工难度。
在本发明实施例中，还提供了一种光背板互连系统，如图5所示，包括：以上所述的光收发器50和与光收发器50连接的单光源22。
由于在实际使用过程中，光收发器50中还包括分光器24，因此，单光源22，还可以用于向上述光收发器中的上述调制器阵列或上述分光器输入光。
其中，单光源22与光收发器50为可分离式连接；单光源22与光收发器50通过以下至 少之一方式连接：倒焊接方式、混合集成方式。
为了更好的理解上述单光源22与光收发器50可能的连接方式，以下结合优选实施例进行说明：
优选实施例一：对应上述实施例中提到的可分离式连接
如图6所示，光收发器50由单光源22和上述采用硅光集成技术集成了分光器24、调制器阵列20、接收器阵列26、光波导通道及相关电路28的不包括单光源22的光收发器部分50组成。单光源22和不包括单光源22的光收发器50为两个完全分离的个体。
优选实施例二：对应上述实施例中提到的倒焊接式连接
如图7所示，光收发器50由单光源22和上述采用硅光集成技术集成了分光器24、调制器阵列20、接收器阵列26、光波导通道及相关电路28的不包括单光源22的光收发器部分50组成。单光源22和不包括单光源22的光收发器50为采用倒焊接式的方式组装在一起。
优选实施例三：对应上述实施例中提到的混合集成式连接
如图8所示，光收发器50由单光源22和上述采用硅光集成技术集成了分光器24、调制器阵列20、接收器阵列26、光波导通道及相关电路28的不包括单光源22的光收发器部分50组成。单光源22采用混合集成等方式和不包括光源的光收发器50集成在一起。
综上所述，本发明实施例涉及一种在光背板互连系统中用于子板上的光收发器的解决方案，尤其是用于采用光背板互连方案的光通信设备的子板上。该方案和现有常规技术相比，具有成本低、集成度高的突出优点。
为了解决上述技术问题，在本发明实施例中，还提供了一种光信号的发送方法，应用于光收发器中，如图9所示，包括以下步骤：
步骤S902：接收光收发器外部单光源输入的光；
步骤S904：对上述单光源输入的光经过调制处理，得到光信号；
步骤S906：发送上述光信号。
通过本发明上述各个步骤，将相关技术中光收发器的激光器阵列转化为调制器阵列的技术手段，解决了相关技术中，光收发器的发送部分采用激光器阵列而导致的成本较高不利于大规模使用的问题，将原来由激光器阵列完成的功能，分成单光源和调制器阵列来完成，减少了光收发器的成本，便于扩展利用。
可选地，在步骤S904之前，还可以执行以下过程：将上述单光源输入的光进行分光处理；对上述分光处理后的光进行调制。
需要说明的是，对于前述的各方法实施例，为了简单描述，故将其都表述为一系列的动作组合，但是本领域技术人员应该知悉，本发明并不受所描述的动作顺序的限制，因为依据 本发明，某些步骤可以采用其他顺序或者同时进行。其次，本领域技术人员也应该知悉，说明书中所描述的实施例均属于优选实施例，所涉及的动作和模块并不一定是本发明所必需的。
总的来说，如图10所示，本发明实施上述提供的技术方案可以总结为：采用单光源22，在不包括光源的光收发器部分50的发送部分，单光源22输入的光经分光器24分成n路，由n路调制器组成的调制器阵列20对n路光分别进行调制，得到n路经调制后的发送光信号；接收部分由n个接收器组成的接收器阵列26对接收的光信号进行探测和光电转换；分光器24前端的光接收通道和后端到调制解调器阵列20(又称调制器阵列)的n路光的发送通道、调制器阵列20后端的n路经调制的光信号的输入通道以及光接收器阵列26前端的n路接收光信号的输入通道为光波导通道。相关电路部分28实现对调制解调器、接收器阵列等部分的驱动、控制和读取。而将上述光收发器50的部件采用硅光集成技术集成在一个硅片上，提高了光收发器的集成度，且采用单光源的方案也降低产品成本和加工难度。
综上所述，本发明实施例达到了以下技术效果：降低了成本，同时由于利用硅光集成技术将调制阵列、接收阵列、光波导及控制电路等部分集成到一片硅片上，从而提高了产品的集成度，为大容量光互连系统的设计提供了有力的支持。
在另外一个实施例中，还提供了一种软件，该软件用于执行上述实施例及优选实施方式中描述的技术方案。
在另外一个实施例中，还提供了一种存储介质，该存储介质中存储有上述软件，该存储介质包括但不限于：光盘、软盘、硬盘、可擦写存储器等。
需要说明的是，本发明的说明书和权利要求书及上述附图中的术语“第一”、“第二”等是用于区别类似的对象，而不必用于描述特定的顺序或先后次序。应该理解这样使用的对象在适当情况下可以互换，以便这里描述的本发明的实施例能够以除了在这里图示或描述的那些以外的顺序实施。此外，术语“包括”和“具有”以及他们的任何变形，意图在于覆盖不排他的包含，例如，包含了一系列步骤或单元的过程、方法、系统、产品或设备不必限于清楚地列出的那些步骤或单元，而是可包括没有清楚地列出的或对于这些过程、方法、产品或设备固有的其它步骤或单元。
显然，本领域的技术人员应该明白，上述的本发明的各模块或各步骤可以用通用的计算装置来实现，它们可以集中在单个的计算装置上，或者分布在多个计算装置所组成的网络上，可选地，它们可以用计算装置可执行的程序代码来实现，从而，可以将它们存储在存储装置中由计算装置来执行，并且在某些情况下，可以以不同于此处的顺序执行所示出或描述的步骤，或者将它们分别制作成各个集成电路模块，或者将它们中的多个模块或步骤制作成单个集成电路模块来实现。这样，本发明不限制于任何特定的硬件和软件结合。
以上所述仅为本发明的优选实施例而已，并不用于限制本发明，对于本领域的技术人员来说，本发明可以有各种更改和变化。凡在本发明的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本发明的保护范围之内。
工业实用性
本发明实施例的上述技术方案，可以应用于光信号的发送过程中，采用将相关技术中光收发器的激光器阵列转化为调制器阵列的技术手段，解决了相关技术中，光收发器的发送部分采用激光器阵列而导致的成本较高不利于大规模使用的问题，进而减少了光收发器的成本。

Claims (10)

  1. 一种光收发器，包括：
    调制器阵列，设置为接收单光源输入的光，并对所述单光源输入的光进行调制处理，以及发送经调制处理后的光信号。
  2. 根据权利要求1所述的光收发器，其中，还包括：
    分光器，与所述调制器阵列连接，设置为将所述单光源输入的光进行分光处理，并将分光处理后的光信号发送至所述调制器阵列。
  3. 根据权利要求2所述的光收发器，其中，所述光收发器还包括：光接收器阵列、相关电路，其中，所述相关电路为所述光收发器中除所述调制器阵列、所述分光器、所述光接收器阵列之外的其他功能电路。
  4. 根据权利要求3所述的光收发器，其中，所述调制器阵列、所述分光器、所述光接收器阵列以及所述相关电路采用硅光集成技术集成在一块硅片上。
  5. 一种光背板互连系统，包括：权利要求1至4任一项所述的光收发器和与所述光收发器连接的单光源。
  6. 根据权利要求5所述的光背板互连系统，其中，所述单光源，设置为向所述光收发器中的所述调制器阵列或所述分光器输入光。
  7. 根据权利要求6所述的光背板互连系统，其中，所述单光源与所述光收发器为可分离式连接。
  8. 根据权利要求6所述的光背板互连系统，其中，所述单光源与所述光收发器通过以下至少之一方式连接：
    倒焊接方式、混合集成方式。
  9. 一种光信号的发送方法，应用于光收发器中，包括：
    接收光收发器外部单光源输入的光；
    对所述单光源输入的光经过调制处理，得到光信号；
    发送所述光信号。
  10. 根据权利要求9所述的方法，其中，对所述单光源输入的光经过调制处理之前，还包括：
    将所述单光源输入的光进行分光处理；
    对所述分光处理后的光进行调制。
PCT/CN2016/071464 2015-01-20 2016-01-20 光信号的发送方法、光收发器以及光背板互连系统 WO2016116047A1 (zh)

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