WO2016115744A1 - 一种抗tdd干扰移动通讯设备 - Google Patents

一种抗tdd干扰移动通讯设备 Download PDF

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Publication number
WO2016115744A1
WO2016115744A1 PCT/CN2015/071516 CN2015071516W WO2016115744A1 WO 2016115744 A1 WO2016115744 A1 WO 2016115744A1 CN 2015071516 W CN2015071516 W CN 2015071516W WO 2016115744 A1 WO2016115744 A1 WO 2016115744A1
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radio frequency
audio
frequency module
module
circuit board
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PCT/CN2015/071516
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English (en)
French (fr)
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云亚峰
冯磊
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深圳市鑫龙上通讯科技有限公司
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Priority to CN201590000008.6U priority Critical patent/CN205680781U/zh
Priority to PCT/CN2015/071516 priority patent/WO2016115744A1/zh
Publication of WO2016115744A1 publication Critical patent/WO2016115744A1/zh

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/19—Arrangements of transmitters, receivers, or complete sets to prevent eavesdropping, to attenuate local noise or to prevent undesired transmission; Mouthpieces or receivers specially adapted therefor

Definitions

  • the utility model relates to the technical field of communication, and more particularly to an anti-TDD interference mobile communication device.
  • GSM cellular phone uses TDMA (Time Division Multiple Access) time slot sharing technology to generate high-power radios of 900MHz or 1800MHz (Radio Frequency
  • the (RF) signal is repeated at a frequency of 217 Hz.
  • TDD current sound is mainly transmitted in two ways: conduction and radiation.
  • conduction mainly affects the audio circuit by means of power supply current ripple and ground ripple current.
  • Radiation is mainly through the antenna transmission to couple the RF signal to the audio system and the audio peripheral device, and the modulation of the audio device produces a 217 Hz audio envelope signal.
  • Conducted interference is the burst current of the RF module needs to be extracted from the battery, and the battery itself has a certain internal resistance, which will cause 217Hz ripple jitter on the power supply of the whole system. This jitter will also be transmitted to the power supply end of the audio amplifier.
  • RF The noise problem is related to the user's use experience. Solving such problems is the first step in the audio design of communication devices such as mobile phones.
  • the technical problem to be solved by the present invention is to provide an anti-TDD interference mobile communication device against the above-mentioned drawbacks of the prior art.
  • an anti-TDD interference mobile communication device comprising a PCB circuit board, wherein the PCB circuit board is provided with a baseband chip, an audio module, a radio frequency module, a USB port, an antenna and a battery connector, the audio module and the radio frequency module Separatingly disposed on two sides of the PCB circuit board, the baseband chip is disposed between the audio module and the radio frequency module; and the audio related circuit on the PCB circuit board is away from the radio frequency module and the battery An area between the connectors; a grounding leg of the USB port is connected to an audio ground of the baseband chip by a first ground line avoiding a ground return path of the radio frequency module; the battery connector is disposed at the radio frequency module Below the location of the USB port; the grounding pin of the battery connector is connected to an end of the radio frequency module remote from the baseband chip by a second ground.
  • the anti-TDD interference mobile communication device of the present invention wherein the first ground line width is greater than 0.5 mm.
  • the anti-TDD interference mobile communication device of the present invention wherein the second ground line has a width greater than 3 mm.
  • the anti-TDD interference mobile communication device of the present invention wherein the antenna is disposed at a top position on the PCB circuit board.
  • the anti-TDD interference mobile communication device of the present invention wherein the distance from the battery connector to the radio frequency module is less than the distance to the audio module.
  • the anti-TDD interference mobile communication device of the present invention wherein the PCB circuit board is provided with a horn.
  • the anti-TDD interference mobile communication device of the present invention wherein the speaker is disposed close to the audio module.
  • the utility model has the beneficial effects that: by rationally arranging the audio module, the radio frequency module and the baseband chip on the PCB circuit board, The audio module and the radio frequency module are respectively disposed on two sides of the PCB circuit board, and the baseband chip is disposed between the audio module and the radio frequency module to ensure that the audio module is away from the radio frequency module setting;
  • the audio-related circuit on the circuit board is away from the regional setting between the RF module and the battery connector, preventing the RF module from interfering with the audio module, resulting in the audio signal not being fidelity, and avoiding the TDD current sound passing. Conducted propagation of interference problems with audio signals.
  • FIG. 1 is a schematic diagram showing the layout structure of a PCB circuit board of an anti-TDD interference mobile communication device according to a preferred embodiment of the present invention.
  • the anti-TDD interference mobile communication device of the preferred embodiment of the present invention comprises a PCB circuit board, wherein the layout structure of the PCB circuit board is as shown in FIG. 1 , and the base circuit chip 2 , the audio module 3 , and the radio frequency module 4 are disposed on the PCB circuit board 1 .
  • the audio module 3 and the radio frequency module 4 are respectively disposed on both sides of the PCB circuit board 1, and the baseband chip 2 is disposed between the audio module 3 and the radio frequency module 4;
  • the audio-related circuit on the board 1 is away from the regional setting between the RF module 4 and the battery connector 6;
  • the grounding pin of the USB port 7 is connected to the audio of the baseband chip 2 through the first ground 8 to avoid the ground return path of the RF module 4.
  • the battery connector 6 is disposed at a position below the RF module 4 near the USB port 7; the grounding pin of the battery connector 6 is connected to the end of the RF module 4 remote from the baseband chip 2 through the second ground 9 .
  • the audio module 3, the radio frequency module 4, and the baseband chip 2 are arranged on the PCB circuit board 1 to ensure that the audio module 3 is disposed away from the radio frequency module 4, thereby preventing the radio frequency module 4 from interfering with the audio module 3, thereby causing the audio signal not to be caused.
  • Fidelity avoids the interference caused by the TDD current sound to the audio signal through conduction.
  • the antenna 5 In the actual design, the antenna 5 must be designed on the top to facilitate the customer to use the alloy back cover, while meeting the different needs of the customer to achieve the speaker size and battery capacity on the same PCB. Therefore, the battery connector 6 can only be disposed under the RF module 4 near the USB port 7, while ensuring that the audio signal is not close to the RF module 4, and avoiding the audio signal crossing the ground return path of the RF module 4, which can be effective. Avoid TDD current sounds. However, it cannot be done in actual design, which requires the following special processing requirements for the trace.
  • the grounding pin of the USB port 7 is connected to the audio ground of the baseband chip 2 through the ground return path of the radio frequency module 4 through the first ground line 8.
  • the grounding leg of the battery connector 6 is connected to the end of the radio frequency module 4 away from the baseband chip 2 through the second ground 9 to ensure that the power circuit of the PCB circuit board 1 must pass through the RF module 4 The grounding point is returned to the battery connector 6.
  • the first ground line 8 has a width greater than 0.5 mm; and the second ground line 9 has a width greater than 3 mm.
  • an antenna 5 is further disposed on the PCB circuit board 1, and the antenna 5 is disposed at a top position on the PCB circuit board 1.
  • the distance from the battery connector 6 to the radio frequency module 4 is smaller than the distance to the audio module 3.
  • the PCB circuit board 1 is provided with a speaker 11 disposed near the audio module 3 to ensure that the audio-related circuit is away from the RF module 4 and the battery connector 6. regional settings.
  • the utility model rationally arranges the audio module 3, the radio frequency module 4, and the baseband chip 2 on the PCB circuit board 1, that is, the audio module 3 and the radio frequency module 4 are respectively disposed on both sides of the PCB circuit board 1, and the baseband chip 2 It is disposed between the audio module 3 and the radio frequency module 4; the audio-related circuit on the PCB circuit board 1 is away from the regional setting between the radio frequency module 4 and the battery connector 6, preventing the radio frequency module 4 from interfering with the audio module 3 and causing an audio signal. It is not fidelity, avoiding the interference caused by the TDD current sound to the audio signal through conduction.

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  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Transceivers (AREA)
  • Noise Elimination (AREA)

Abstract

本实用新型涉及一种抗TDD干扰移动通讯设备，包括PCB线路板，PCB线路板上设置有基带芯片、音频模块、射频模块、USB端口、天线和电池连接器；其中，音频模块和射频模块分设于PCB线路板上的两侧，基带芯片设置于音频模块和射频模块之间；PCB线路板上与音频相关的电路远离射频模块与电池连接器之间区域设置；USB端口的接地脚通过第一地线避开射频模块的地回流路径连接至基带芯片的音频地；电池连接器设置于射频模块下方靠近USB端口的位置；电池连接器的接地脚通过第二地线连接至射频模块上远离基带芯片的一端。采用本实用新型方案可以避免TDD电流声通过传导方式传播对音频信号带来的干扰问题。

Description

一种抗TDD干扰移动通讯设备 技术领域
本实用新型涉及通信技术领域，更具体地说，涉及一种抗TDD干扰移动通讯设备。
背景技术
GSM蜂窝电话采用TDMA(时分多址)时隙分享技术，产生900MHz或者1800MHz的高功率射频（Radio Frequency ，RF）信号，以217Hz的频率重复出现，在一个周期内（4.6ms）分有8个间隙，其中只有1个间隙（0.58ms）的时间在发射RF功率，瞬时的burst电流可以超过1A。如果这种周期性的间歇电流脉冲耦合至音频电路中，就会产生音频范围内的217Hz“嘀嘟”电流声，其中包括了217Hz及它的谐波分量。
TDD电流声主要通过两种方式传播：传导和辐射。其中，传导主要是通过电源电流纹波和地线纹波电流的方式影响到音频电路。辐射则主要是通过天线发射将RF信号耦合到音频系统及音频周边器件，经过音频器件的调制产生217Hz的音频包络信号。传导干扰是射频模块的burst大电流需要从电池抽取，而电池本身具有一定内阻，从而导致整个系统的电源上会有217Hz的纹波抖动，这种抖动同样会传递到音频功放的电源端。RF 噪声问题关系到用户的使用感受，解决此类问题是手机等通讯设备音频设计的第一步。
 技术问题
本实用新型要解决的技术问题在于，针对现有技术的上述缺陷，提供一种抗TDD干扰移动通讯设备。
技术解决方案
本实用新型解决其技术问题所采用的技术方案是：
构造一种抗TDD干扰移动通讯设备，包括PCB线路板，所述PCB线路板上设置有基带芯片、音频模块、射频模块、USB端口、天线和电池连接器，所述音频模块和所述射频模块分设于所述PCB线路板上的两侧，所述基带芯片设置于所述音频模块和所述射频模块之间；所述PCB线路板上与音频相关的电路远离所述射频模块与所述电池连接器之间区域设置；所述USB端口的接地脚通过第一地线避开所述射频模块的地回流路径连接至所述基带芯片的音频地；所述电池连接器设置于所述射频模块下方靠近所述USB端口的位置；所述电池连接器的接地脚通过第二地线连接至所述射频模块上远离所述基带芯片的一端。
本实用新型所述的抗TDD干扰移动通讯设备，其中，所述第一地线宽度大于0.5毫米。
本实用新型所述的抗TDD干扰移动通讯设备，其中，第二地线宽度大于3毫米。
本实用新型所述的抗TDD干扰移动通讯设备，其中，所述天线设置于所述PCB线路板上的顶部位置。
本实用新型所述的抗TDD干扰移动通讯设备，其中，所述电池连接器到所述射频模块的距离小于到所述音频模块的距离。
本实用新型所述的抗TDD干扰移动通讯设备，其中，所述PCB线路板上设置有喇叭。
本实用新型所述的抗TDD干扰移动通讯设备，其中，所述喇叭靠近所述音频模块设置。
 有益效果
本实用新型的有益效果在于：通过将音频模块、射频模块、基带芯片在PCB线路板上合理布局，即将 音频模块和射频模块分设于PCB线路板上的两侧，基带芯片设置于音频模块和射频模块之间 ， 保证音频模块远离射频模块设置； PCB 线路板上与音频相关的电路远离射频模块与电池连接器之间区域设置，防止射频模块对音频模块造成干扰而导致音频信号不保真，避免了TDD电流声通过 传导方式传播对音频信号带来的干扰问题。
附图说明
下面将结合附图及实施例对本实用新型作进一步说明，附图中：
图1是本实用新型较佳实施例的抗TDD干扰移动通讯设备PCB线路板布局结构示意图。
 本发明的实施方式
本实用新型较佳实施例的抗TDD干扰移动通讯设备包括PCB线路板，其中PCB线路板部分布局结构如图1所示，PCB线路板1上设置有基带芯片2、音频模块3、射频模块4、USB端口7、天线5和电池连接器6；其中，音频模块3和射频模块4分设于PCB线路板1上的两侧，基带芯片2设置于音频模块3和射频模块4之间；PCB线路板1上与音频相关的电路远离射频模块4与电池连接器6之间区域设置；USB端口7的接地脚通过第一地线8避开射频模块4的地回流路径连接至基带芯片2的音频地；电池连接器6设置于射频模块4下方靠近USB端口7的位置；电池连接器6的接地脚通过第二地线9连接至射频模块4上远离基带芯片2的一端。本实施例通过将音频模块3、射频模块4、基带芯片2在PCB线路板1上合理布局，保证音频模块3远离射频模块4设置，防止射频模块4对音频模块3造成干扰而导致音频信号不保真，避免了TDD电流声通过传导方式传播对音频信号带来的干扰问题。
由于在实际的设计中，必须将天线5设计在上方便于客户使用合金后盖，同时满足客户能在同一个PCB实现对喇叭尺寸和电池容量的不同需求。因此，只能将电池连接器6设置于射频模块4下方靠近USB端口7的位置，同时确保音频信号不靠近射频模块4，并避免音频信号与射频模块4的地回流路径交叉，就能有效的避免TDD电流声出现。但在实际设计时无法做到，这就需要对于走线就有以下特殊处理要求。
优选地，如图1所示，将USB端口7的接地脚通过第一地线8避开射频模块4的地回流路径连接至基带芯片2的音频地。
优选地，如图1所示，将电池连接器6的接地脚通过第二地线9连接至射频模块4上远离基带芯片2的一端，保证PCB线路板1的电源回路必须通过射频模块4旁的接地点回到电池连接器6。
优选地，如图1所示，第一地线8宽度大于0.5毫米；第二地线9宽度大于3毫米。
优选地，上述实施例中，如图1所示，在PCB线路板1上还设置有天线5，天线5设置于PCB线路板1上的顶部位置。
优选地，上述实施例中，如图1所示，电池连接器6到射频模块4的距离小于到音频模块3的距离。
优选地，上述实施例中，如图1所示，PCB线路板1上设置有喇叭11，喇叭11靠近音频模块3设置，以保证与音频相关的电路远离射频模块4与电池连接器6之间区域设置。
综上，本实用新型通过将音频模块3、射频模块4、基带芯片2在PCB线路板1上合理布局，即将音频模块3和射频模块4分设于PCB线路板1上的两侧，基带芯片2设置于音频模块3和射频模块4之间；PCB线路板1上与音频相关的电路远离射频模块4与电池连接器6之间区域设置，防止射频模块4对音频模块3造成干扰而导致音频信号不保真，避免了TDD电流声通过传导方式传播对音频信号带来的干扰问题。
应当理解的是，对本领域普通技术人员来说，可以根据上述说明加以改进或变换，而所有这些改进和变换都应属于本实用新型所附权利要求的保护范围。

Claims (7)

  1. 一种抗TDD干扰移动通讯设备，包括PCB线路板（1），所述PCB线路板（1）上设置有基带芯片（2）、音频模块（3）、射频模块（4）、USB端口（7）、天线（5）和电池连接器（6）；其特征在于，所述音频模块（3）和所述射频模块（4）分设于所述PCB线路板（1）上的两侧，所述基带芯片（2）设置于所述音频模块（3）和所述射频模块（4）之间；所述PCB线路板（1）上与音频相关的电路远离所述射频模块（4）与所述电池连接器（6）之间区域设置；所述USB端口（7）的接地脚通过第一地线（8）避开所述射频模块（4）的地回流路径连接至所述基带芯片（2）的音频地；所述电池连接器（6）设置于所述射频模块（4）下方靠近所述USB端口（7）的位置；所述电池连接器（6）的接地脚通过第二地线（9）连接至所述射频模块（4）上远离所述基带芯片（2）的一端。
  2. 根据权利要求1所述的抗TDD干扰移动通讯设备，其特征在于，所述第一地线（8）宽度大于0.5毫米。
  3. 根据权利要求1所述的抗TDD干扰移动通讯设备，其特征在于，第二地线（9）宽度大于3毫米。
  4. 根据权利要求1所述的抗TDD干扰移动通讯设备，其特征在于，所述天线（5）设置于所述PCB线路板（1）上的顶部位置。
  5. 根据权利要求1所述的抗TDD干扰移动通讯设备，其特征在于，所述电池连接器（6）到所述射频模块（4）的距离小于到所述音频模块（3）的距离。
  6. 根据权利要求1所述的抗TDD干扰移动通讯设备，其特征在于，所述PCB线路板（1）上设置有喇叭（11）。
  7. 根据权利要求6所述的抗TDD干扰移动通讯设备，其特征在于，所述喇叭（11）靠近所述音频模块（3）设置。
PCT/CN2015/071516 2015-01-24 2015-01-24 一种抗tdd干扰移动通讯设备 WO2016115744A1 (zh)

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