WO2016112780A1

WO2016112780A1 - Multi-chip packaging structure and electronic device

Info

Publication number: WO2016112780A1
Application number: PCT/CN2015/099532
Authority: WO
Inventors: 刘雪春
Original assignee: 深圳信炜科技有限公司
Priority date: 2015-01-13
Filing date: 2015-12-29
Publication date: 2016-07-21
Also published as: CN104538385A

Abstract

A multi-chip packaging structure and an electronic device comprising said multi-chip packaging structure. The multi-chip packaging structure (10) comprises a first chip (11) and a second chip (12), the first chip (11) comprising a ground end (11a), and the second chip (12) comprising a signal transmission end (T), the signal transmission end (T) being in communication with the ground end (11a); the signal transmission end (T) outputs a first signal to the ground end (11a), the first signal acting as a ground signal of the first chip (11), and the first signal being a varying signal. The electronic device (100) comprises the multi-chip packaging structure (10).

Description

Multi-chip package structure and electronic equipment

This application claims the priority of the Chinese Patent Application, filed on Jan. 13, 2015, which is hereby incorporated by reference.

Technical field

The invention relates to a multi-chip package structure and an electronic device.

Background technique

At present, electronic devices (such as mobile phones, tablet computers, etc.) are usually provided with a plurality of functional chips. However, each functional chip is generally packaged separately, resulting in occupying a large volume of the electronic device and causing high cost of the electronic device.

Summary of the invention

To solve the above technical problems, the present invention provides a multi-chip package structure and an electronic device having a multi-chip package structure.

To achieve the above object, the present invention provides the following technical solutions:

A multi-chip package structure comprising:

a first chip, including a ground terminal; and

a second chip, including a signal transmission end, the signal transmission end is connected to the ground end, the signal transmission end outputs a first signal to the ground end, and the first signal is used as a ground signal of the first chip Wherein the first signal is a varying signal.

Preferably, the voltage of the first chip varies with the change of the ground signal.

Preferably, the voltage of the first chip increases as the voltage of the ground signal increases, and decreases as the voltage of the ground signal decreases.

Preferably, the first chip further includes a power terminal, and the power terminal receives the second signal. At the same time, the voltage of the second signal is greater than the voltage of the first signal, and the second signal The voltage difference of the first signal is the operating voltage of the first chip.

Preferably, the power terminal is connected to the second chip, and the second chip provides a solution The second signal is a changed signal.

Preferably, the second chip further includes a ground end, the ground end of the second chip is connected to a device ground end of an electronic device, or the ground end of the second chip and the electronic device where the multi-chip package structure is located The device is grounded or a constant voltage is applied to the ground of the second chip.

Preferably, the multi-chip package structure further includes a signal electrode made of a conductive material, and the signal electrode is disposed at least around the first chip.

Preferably, the signal electrode is loaded with a third signal, the third signal being a varying signal.

Preferably, the third signal is the same as the first signal.

Preferably, the signal electrode is connected to a ground end of the first chip and a signal transmission end of the second chip.

Preferably, the third signal changes synchronously with the first signal, and the magnitude of the change and the direction of the change are the same.

Preferably, the third signal changes as the first signal changes.

Preferably, the third signal increases as the first signal increases and decreases as the first signal decreases.

Preferably, the magnitude of the amplitude change of the third signal is the same as the magnitude of the amplitude change of the first signal.

Preferably, the multi-chip package structure includes a heat sink, the heat sink is made of a conductive material, the heat sink is used for heat dissipation, and is also used as the signal electrode.

Preferably, the first chip and the second chip are both disposed on the heat sink, wherein a conductive layer is disposed between the first chip and the heat sink, and the second chip and the heat sink An insulating layer is provided between them.

Preferably, the heat sink is connected to the ground end of the first chip through the conductive layer

Preferably, the conductive layer is made of a conductive paste, and the insulating layer is made of an insulating paste.

Preferably, the multi-chip package structure further includes a substrate, the first chip and the second chip are disposed on the substrate, and the signal electrode is disposed on the substrate.

Preferably, the signal electrode surrounds the first chip.

Preferably, the signal electrode further surrounds the second chip.

Preferably, the signal electrode is an entire layer of electrodes disposed between the first chip and the substrate, and is stacked with the first chip and the substrate, and the edge of the signal electrode is beyond the vertical stacking direction The edge of the first chip.

Preferably, the first chip and the second chip are disposed on the same side or opposite sides of the substrate.

Preferably, the first chip is a sensing chip, and the second chip is a control chip.

Preferably, the first chip is a fingerprint sensing chip or a touch sensing chip.

Preferably, the first chip includes a sensor board for capacitively coupling to a target object, the first chip performing a sensing operation by providing an excitation signal to the sensor board to drive the sensor board Obtaining predetermined information of the target object, wherein the excitation signal changes as the first signal changes.

Preferably, the excitation signal increases as the first signal increases, and decreases as the first signal decreases.

The invention further provides a multi-chip package structure, comprising:

a first chip comprising a ground end for loading a varying signal; and

The second chip includes a ground terminal for loading a constant signal.

Preferably, the second chip includes a signal transmission end, and the signal transmission end is connected to a ground end of the first chip for outputting the changed signal to a ground end of the first chip.

The present invention provides an electronic device comprising the multi-chip package structure of any of the above.

The invention further provides an electronic device comprising a multi-chip package structure and a device ground, the multi-chip package structure comprising:

a first chip comprising a ground end for loading a varying signal; and

The second chip includes a ground end connected to the ground end of the device.

Preferably, the second chip includes a signal transmission end, and the signal transmission end is connected to a ground end of the first chip, and is configured to output the changed signal to the first chip. Ground terminal.

Preferably, the electronic device comprises a power supply, the power supply comprises a positive pole and a negative pole, and the negative pole is a ground end of the device.

The multi-chip package structure of the electronic device of the present invention not only integrates the first chip and the second chip, but also the ground terminal of the first chip is loaded with a varying voltage, thereby improving the performance and usability of the electronic device including the multi-chip package structure.

DRAWINGS

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the description of the prior art will be briefly described below. Obviously, the drawings in the following description are only It is a certain embodiment of the present invention, and other drawings can be obtained from those skilled in the art without any creative work.

FIG. 1 is a schematic structural view of a preferred embodiment of an electronic device according to the present invention.

2 is a partial perspective structural view of a multi-chip package structure with a QFN package.

3 is a cross-sectional structural view of the multi-chip package structure shown in FIG. 2 taken along line III-III.

4 is a partial perspective structural view of a multi-chip package structure in a package mode of BGA.

FIG. 5 is a cross-sectional structural view of the multi-chip package structure shown in FIG. 4 taken along line V-V.

detailed description

It should be noted that the following "signal of change" means that the signal does not always maintain the same potential with the extension of time. In contrast, a "constant signal" means that the potential of the signal remains or remains substantially constant over time. Since the signal will always be more or less interfered by other signals, causing the signal to fluctuate, the constant signal is actually substantially constant.

The technical term "connected" includes various conditions including direct connection, indirect connection, coupling, and the like, and unless the invention specifically indicates one of the cases, it includes various cases.

The technical party in the embodiment of the present invention will be described below with reference to the accompanying drawings in the embodiments of the present invention. The present invention is clearly and completely described, and it is obvious that the described embodiments are only a part of the embodiments of the invention, and not all of the embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative efforts are within the scope of the present invention.

The invention provides a multi-chip package structure, which integrates two or more chips in one package, and can also integrate some other components, such as capacitors, thereby saving the volume of the electronic device and reducing the manufacturing cost of the electronic device. .

Further, the inventors have found through extensive research that a plurality of chips in a multi-chip package structure are generally common, and the ground voltage is a constant voltage, generally 0V. In some package structures, there is a ground plane where the chip ground can be connected. However, for some chips, the ground voltage remains the same, which will affect the performance or accuracy of the chip, and even limit the design of the chip. Taking the fingerprint sensing chip as an example, a parasitic capacitance is formed between the grounding end of the fingerprint sensing chip and the capacitive sensing plate. If the excitation signal of the capacitive sensing plate is changed, and the ground voltage of the grounding terminal remains unchanged, then The change in charge and discharge power of the parasitic capacitance affects the sensing accuracy of the fingerprint sensing chip. Therefore, from the above, it is known that it is necessary to provide a correspondingly varying ground voltage to some chips.

Please refer to FIG. 1. FIG. 1 is a schematic structural diagram of a preferred embodiment of an electronic device according to the present invention. The electronic device 100 is, for example, a mobile phone, a tablet computer, a GPS navigation system, a television, and the like. The electronic device 100 includes a multi-chip package structure 10 and a power supply 30. The power supply 30 includes a positive electrode a for loading a first voltage and a negative electrode b for loading a second voltage, wherein the first voltage is greater than the second voltage. The voltage difference between the first voltage and the second voltage is a power supply voltage at which the electronic device 100 operates normally. The second voltage is a constant voltage, preferably 0V. The negative electrode b is used as a device ground of the electronic device 100, and the second voltage is a ground voltage.

The multi-chip package structure 10 includes a first chip 11 and a second chip 12. The first chip 11 and the second chip 12 are integrated in the same package structure.

The first chip 11 includes a ground terminal 11a for loading a varying voltage signal.

The second chip 12 includes a ground end 12a for loading a constant Voltage signal. Preferably, the ground terminal 12a is connected to the ground end of the device, and receives a ground voltage of the device ground, that is, a second voltage.

The second chip 12 further includes a signal transmission terminal T. Preferably, the signal transmitting end T is connected to the grounding end 11a, and the signal transmitting end T outputs a first signal to the grounding end 11a, and the first signal is used as a ground signal of the first chip 11, Wherein the first signal is a changed signal. Preferably, the first signal is a square wave signal. More preferably, the first signal is a periodically varying square wave signal. However, the present invention is not limited thereto, and the first signal may also be other suitable signals, such as a sine wave signal.

The voltage of the first chip 11 varies with the change of the first signal. Wherein, the voltage of the first chip 11 increases with the increase of the voltage of the ground signal, and decreases with the decrease of the voltage of the ground signal.

The first chip 11 further includes a power terminal 11b, and the power terminal 11b receives a second signal. At the same time, the voltage of the second signal is greater than the voltage of the first signal, and the second signal is The voltage difference of the first signal is the power supply voltage at which the first chip 11 operates normally.

The power terminal 11b is connected to the second chip 12, and the second chip 12 provides the second signal, and the second signal is a changed signal. The power terminal 11b can also be introduced from the outside of the package. In addition, a communication interface (not labeled) is further disposed between the first chip 11 and the second chip 12 for information communication.

Preferably, the multi-chip package structure 10 further includes a signal electrode made of a conductive material, and the signal electrode is disposed at least around the first chip 11. Preferably, the signal electrode is used to load an electrical signal and does not output a signal to other components, and is not used for signal detection.

The signal electrode is loaded with a third signal, which is a varying signal.

In an embodiment, the third signal is the same as the first signal. Preferably, the signal electrode is connected to the ground end 11a of the first chip 11 and the signal transmission end T of the second chip 12.

In another embodiment, the third signal changes synchronously with the first signal, and the magnitude changes direction is the same. Preferably, the magnitude of the amplitude change of the third signal is different from the first The magnitude of the amplitude change of a signal corresponds to the same.

In still another embodiment, the third signal is a signal that varies with the change of the first signal. Wherein the third signal increases as the first signal increases, and decreases as the first signal decreases. For example, the signal electrode is connected to the second chip 12, and the second chip 12 supplies the third signal to the signal electrode. The third signal is different from the first signal but remains unchanged relative to the first signal. Preferably, the magnitude of the amplitude change of the third signal is the same as the magnitude of the amplitude change of the first signal.

Depending on the package method of the chip, the following packages are described as a Quad Flat No-lead Package (QFN) and a Ball Grid Array Package (BGA). However, the package of the chip is not limited to these two packages, and may be other package methods. It should be noted that the multi-chip package structure 10 may not be filled with a material, may be filled with an epoxy resin material, or may be filled with other materials.

Package method QFN

Please refer to FIG. 2 and FIG. 3 together. FIG. 2 is a partial perspective structural view of a multi-chip package structure with a QFN package. 3 is a cross-sectional structural view of the multi-chip package structure shown in FIG. 2 taken along line III-III. The multi-chip package structure 10 further includes a heat sink 13, a lead 14, and a lead 15. The first chip 11 and the second chip 12 are respectively connected to the leads 14 through the leads 15 . The pin 14 is disposed on the periphery of the heat sink 13. The heat sink 13 is made of a conductive material for heat dissipation and is also used as the signal electrode. Thereby, material saving and volume saving.

The first chip 11 and the second chip 12 are disposed on the heat sink 13 , wherein a conductive layer 16 is disposed between the first chip 11 and the heat sink 13 , and the second chip 12 is disposed. An insulating layer 17 is disposed between the heat sink 13. In an embodiment, the heat sink 13 is connected to the ground end 11a of the first chip 11 through the conductive layer 16. The substrate of the first chip 11 is preferably a silicon substrate, and the ground terminal 11a is electrically connected to the heat sink 13 through a silicon substrate. Preferably, the conductive layer 16 is made of a conductive paste, and the insulating layer 17 is made of an insulating paste.

In order to improve the electrical conductivity of the ground end 11a of the first chip 11 and the heat sink 13 In another embodiment, the grounding end 11a can further pass through a wire 18 and the heat sink 13.

Package method BGA

Please refer to FIG. 4 and FIG. 5 together. FIG. 4 is a partial perspective structural view of a multi-chip package structure with a BGA package. FIG. 5 is a cross-sectional structural view of the multi-chip package structure shown in FIG. 4 taken along line V-V. The multi-chip package structure 10 further includes a substrate 19, a lead 14, a lead 15, the lead 14, the first chip 11 and the second chip 12 are disposed on the substrate 19, The above signal electrodes are provided on the substrate 19. The first chip 11 and the second chip 12 are disposed to be connected to the leads 14 through leads 15. Preferably, the substrate 19 is an insulating substrate. Preferably, the first chip 11 and the second chip 12 are respectively disposed on the substrate 19 through an insulating paste 17.

Here, for the sake of clarity, the signal electrodes are indicated by the reference numeral "20" in FIGS. 4 and 5. Preferably, the signal electrode 20 surrounds the first chip 11.

In another embodiment, the signal electrode 20 further surrounds the second chip 12.

In still another embodiment, the signal electrode 20 is a whole layer of electrodes disposed between the first chip 11 and the substrate 19 and stacked on the second chip 11 and the substrate 19. The edge of the signal electrode 20 extends beyond the edge of the first chip 11 in the vertical stacking direction.

In this embodiment, the signal electrode 20 is connected to the signal transmission end T and the ground end 11a, respectively, and receives the first signal.

Further, the first chip 11 and the second chip 12 are disposed on the same side or opposite sides of the substrate 19. When the first chip 11 and the second chip 12 are disposed on opposite sides of the substrate 19, the first chip 11 and the second chip 12 are preferably stacked and arranged by the lining The bottom 19 is spaced. Wherein, the substrate 19 is an insulating substrate.

In each of the above embodiments, preferably, the first chip 11 is a sensing chip, and the second chip 12 is a control chip. However, the comparison of the present invention is not limited. The first chip 11 and the second chip 12 may also be other functional chips. For those skilled in the art, the technical content of the present invention may be easily made according to the teachings of the present invention. Reasonably applicable For other functional chips.

Further, the sensing chip is, for example, a fingerprint sensing chip or a touch sensing chip. Specifically, the fingerprint sensing chip or the touch sensing chip preferably adopts a capacitive sensing technology, and more preferably, a self-capacitance sensing technology.

Taking a fingerprint sensing chip as an example, the fingerprint sensing chip includes a sensor board, and the sensor board includes a plurality of capacitive sensing plates for capacitively coupling to a target object, the fingerprint sensing The chip performs a sensing operation by providing an excitation signal to the sensor board to drive the sensor board to obtain predetermined information of the target object. The fingerprint sensing chip obtains predetermined information of the target object by measuring a change in capacitance between the sensor board and the target object. Wherein, the target object is a finger. The predetermined information is, for example, fingerprint information.

The excitation signal changes with the change of the first signal of the ground terminal 11a to reduce the charge and discharge power between the ground terminal 11a and the sensor board. Preferably, the excitation signal increases as the first signal increases, and decreases as the first signal decreases. Thereby, the influence of the parasitic capacitance between the ground terminal 11a of the fingerprint sensing chip and the capacitive sensing plate on the sensing accuracy is reduced.

Further, the signal electrode is used to generate an electric field with the target object, so that the electric field line between the capacitive sensing plate located at the edge and the target object is relatively uniform, thereby obtaining more realistic predetermined information.

In the multi-chip package structure 10 of the present invention, only the first chip 11 and the second chip 12 are taken as an example for description. However, the present invention does not limit the number of chips. The multi-chip package structure 10 may further include other chips such as a third chip and a fourth chip. In addition, the signal electrodes can also be connected to other chips to receive third signals from other chips.

It can be seen from the above that the multi-chip package structure 10 of the electronic device 100 of the present invention not only integrates a plurality of chips, but also selects the grounding terminal 11a to load a varying voltage according to the structural characteristics of the chip itself, thereby improving the performance and usability of the multi-chip package structure 10. .

The above description of the disclosed embodiments enables those skilled in the art to make or use the invention. Numerous modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be without departing from the invention. In the case of spirit or scope, it is implemented in other embodiments. Therefore, the present invention is not to be limited to the embodiments shown herein, but the scope of the invention is to be accorded

Claims

A multi-chip package structure comprising:

a first chip, including a ground terminal; and

a second chip, including a signal transmission end, the signal transmission end is connected to the ground end, the signal transmission end outputs a first signal to the ground end, and the first signal is used as a ground signal of the first chip Wherein the first signal is a varying signal.
The multi-chip package structure according to claim 1, wherein the voltage of the first chip changes according to a change of the ground signal.
The multi-chip package structure according to claim 2, wherein the voltage of the first chip increases as the voltage of the ground signal increases, and decreases as the voltage of the ground signal decreases.
The multi-chip package structure according to claim 1, wherein the first chip further comprises a power terminal, and the power terminal receives the second signal, and at the same time, the voltage of the second signal is greater than the The voltage of the first signal, the voltage difference between the second signal and the first signal is the operating voltage of the first chip.
The multi-chip package structure according to claim 4, wherein the power terminal is connected to the second chip, the second chip provides the second signal, and the second signal is a changed signal.
The multi-chip package structure according to claim 1, wherein the second chip further comprises a ground end, the ground end of the second chip is connected to a device ground of an electronic device, or the second chip The ground terminal is connected to the device ground of the electronic device where the multi-chip package structure is located, or a constant voltage is applied to the ground terminal of the second chip.
The multi-chip package structure according to claim 1, wherein the multi-chip package structure further comprises a signal electrode, the signal electrode is made of a conductive material, and the signal electrode is disposed at least around the first chip .
The multi-chip package structure according to claim 7, wherein the signal electrode is loaded with a third signal, and the third signal is a changed signal.
The multi-chip package structure according to claim 8, wherein said third The signal is the same as the first signal.
The multi-chip package structure according to claim 9, wherein the signal electrode is connected to a ground end of the first chip and a signal transmission end of the second chip.
The multi-chip package structure according to claim 8, wherein the third signal changes synchronously with the first signal, and the magnitude of the change and the direction of the change are the same.
The multi-chip package structure of claim 8 wherein said third signal varies as said first signal changes.
The multi-chip package structure according to claim 12, wherein said third signal rises as said first signal rises and decreases as said first signal decreases.
The multi-chip package structure according to claim 11 or 13, wherein the magnitude of the amplitude change of the third signal is the same as the magnitude of the amplitude change of the first signal.
The multi-chip package structure according to claim 8, wherein the multi-chip package structure comprises a heat sink, the heat sink is made of a conductive material, the heat sink is used for heat dissipation, and is also used as the Signal electrode.
The multi-chip package structure according to claim 15, wherein the first chip and the second chip are both disposed on the heat sink, wherein a setting between the first chip and the heat sink is The conductive layer is provided with an insulating layer between the second chip and the heat sink.
The multi-chip package structure according to claim 16, wherein the heat sink is connected to a ground end of the first chip through the conductive layer.
The multi-chip package structure according to claim 8, wherein the multi-chip package structure further comprises a substrate, the first chip and the second chip are disposed on the substrate, the substrate The signal electrode is disposed on the upper side.
The multi-chip package structure according to claim 18, wherein the signal electrode surrounds the first chip.
The multi-chip package structure according to claim 19, wherein the signal electrode further surrounds the second chip.
The multi-chip package structure according to claim 18, wherein the signal electrode is a whole layer electrode disposed between the first chip and the substrate, and is stacked with the first chip and the substrate The edge of the signal electrode extends beyond the edge of the first chip in a vertical stacking direction.
The multi-chip package structure according to claim 18, wherein the first chip and the second chip are disposed on the same side or opposite sides of the substrate.
The multi-chip package structure according to claim 1, wherein the first chip is a sensing chip, and the second chip is a control chip.
The multi-chip package structure according to claim 23, wherein the first chip is a fingerprint sensing chip or a touch sensing chip.
The multi-chip package structure according to claim 1, wherein said first chip comprises a sensor board for capacitively coupling to a target object, said first chip providing an excitation signal to said The sensor board drives the sensor board to perform a sensing operation to obtain predetermined information of the target object, wherein the excitation signal changes as the first signal changes.
The multi-chip package structure according to claim 25, wherein said excitation signal rises as said first signal rises and decreases as said first signal decreases.
A multi-chip package structure comprising:

a first chip comprising a ground end for loading a varying signal; and

The second chip includes a ground terminal for loading a constant signal.
The multi-chip package structure according to claim 27, wherein the second chip comprises a signal transmission end, and the signal transmission end is connected to a ground end of the first chip for outputting the changed signal Giving the ground of the first chip.
An electronic device comprising the multi-chip package structure of any one of claims 1-28.
An electronic device includes a multi-chip package structure and a device ground, the multi-chip package structure including:

a first chip comprising a ground end for loading a varying signal; and

The second chip includes a ground end connected to the ground end of the device.
The electronic device according to claim 30, wherein the second chip comprises a signal transmission end, and the signal transmission end is connected to a ground end of the first chip for outputting the changed signal to the The ground terminal of the first chip.
The electronic device according to claim 30, wherein the electronic device comprises a power supply, the power supply comprises a positive pole and a negative pole, and the negative pole is a ground end of the equipment.