WO2016111045A1

WO2016111045A1 - Piezoelectric vibration component and manufacturing method therefor

Info

Publication number: WO2016111045A1
Application number: PCT/JP2015/075322
Authority: WO
Inventors: 開田　弘明; 和幸能登; 上　慶一
Original assignee: 株式会社村田製作所
Priority date: 2015-01-08
Filing date: 2015-09-07
Publication date: 2016-07-14
Also published as: JPWO2016111045A1; JP6179681B2

Abstract

The present invention addresses the problem of increasing the adhesive force between an adhesive layer and a lid that hermetically seals a piezoelectric vibrator to a substrate. A piezoelectric vibration component (40) is provided with: a substrate (10) that has a main surface (11) on which a piezoelectric vibrator (20) is mounted; a lid (30) that has a crevice (31) opened so as to face the main surface (11), and, from the center of the opening of the crevice (31) to the edge of the opening, a flange (32) that protrudes from the edge of the opening; and an adhesive layer (53) that bonds the lid (30) to the substrate (10) such that the piezoelectric vibrator (20) is hermetically sealed in the space between the crevice (31) and the main surface (11). The adhesive layer (53) coats the tip and upper part of the flange (32).

Description

Piezoelectric vibration component and manufacturing method thereof

The present invention relates to a piezoelectric vibration component and a manufacturing method thereof.

Piezoelectric vibrators are widely used as oscillators and bandpass filters. As one aspect of a conventional piezoelectric vibrator, for example, Japanese Patent Application Laid-Open No. 2014-197615 describes a surface-mount crystal vibrator having a structure for sealing a crystal vibrator from outside air. The surface-mounted crystal resonator described in the publication includes a substrate on which the crystal resonator is mounted, and a lid that hermetically seals the crystal resonator with an adhesive (paragraph 0002).

JP 2014-197615 A

However, if the bonding strength between the lid and the adhesive is insufficient, the lid may peel from the substrate. For example, if the surface roughness of the lid in contact with the substrate is small, the wettability of the adhesive deteriorates, so that the bonding strength between the lid and the adhesive is likely to decrease. In particular, when the lid is bonded to the substrate using a thermosetting adhesive and the crystal unit is hermetically sealed, the pressure in the lid increases at a reflow heating temperature of about 260 ° C., and the lid peels off from the substrate. May end up.

This invention is made in view of such a situation, and makes it a subject to raise the adhesive force between the lid and the adhesive layer for sealingly sealing a piezoelectric vibrator to a board | substrate.

A piezoelectric vibration component according to one aspect of the present invention includes a substrate having a main surface on which a piezoelectric vibrator is mounted, a recess opened to face the main surface, and the opening center from the opening center toward the opening edge. A lid having a protruding flange portion; and an adhesive layer that joins the substrate and the lid so as to hermetically seal the piezoelectric vibrator in a space between the recess and the main surface. The adhesive layer covers the tip and top of the flange portion.

According to the present invention, it is possible to increase the adhesive force between the lid and the adhesive layer for hermetically sealing the piezoelectric vibrator to the substrate.

It is a disassembled perspective view of the piezoelectric vibration component which concerns on embodiment of this invention. It is sectional drawing of the manufacture process of the piezoelectric vibration component which concerns on embodiment of this invention. It is sectional drawing of the manufacture process of the piezoelectric vibration component which concerns on embodiment of this invention. It is sectional drawing of the manufacture process of the piezoelectric vibration component which concerns on embodiment of this invention.

Embodiments of the present invention will be described below with reference to the drawings.
FIG. 1 is an exploded perspective view of a piezoelectric vibration component 40 according to an embodiment of the present invention. As shown in the figure, the piezoelectric vibration component 40 mainly includes a piezoelectric vibrator 20, a substrate 10 having a main surface 11 on which the piezoelectric vibrator 20 is mounted, and a piezoelectric vibrator 20 for sealing the piezoelectric vibrator 20 from outside air. And a lid 30. The piezoelectric vibrator 20 is formed on a flat plate-shaped piezoelectric plate 21 having two surfaces facing in the thickness direction, an excitation electrode 22 formed on one surface of the piezoelectric plate 21, and the other surface of the piezoelectric plate 21. The excitation electrode 23 is provided. When an AC voltage is applied to the

excitation electrodes

22 and 23, the piezoelectric plate 21 vibrates in the thickness shear mode. The piezoelectric plate 21 is made of a piezoelectric material exhibiting piezoelectric characteristics (for example, a quartz plate or piezoelectric ceramic). The

excitation electrodes

22 and 23 are made of a conductive thin film such as gold, chromium, nickel, aluminum, and titanium.

The substrate 10 has a flat plate shape having two surfaces facing each other in the thickness direction, and a surface on which the piezoelectric vibrator 20 is mounted is called a main surface 11 among the two surfaces. On the main surface 11, a wiring 13 that conducts to the excitation electrode 23 via the conductive adhesive 12 and a wiring 16 that conducts to the excitation electrode 22 via the conductive adhesive 15 are formed. The substrate 10 is made of a material having appropriate mechanical strength and electrical insulation (for example, insulating ceramics such as alumina, synthetic resin, a composite material in which the surface of a metal plate is covered with an insulating layer). The substrate 10 has

cutout portions

14 and 17 formed so as to cut out a part of the corner portion (corner portion) into a cylindrical curved surface, and the

wirings

13 and 16 have cutout portions, respectively. 14 and 17 can extend from the back surface of main surface 11 to be connected to an external circuit.

The lid 30 is a bottomed lid member for sealing the piezoelectric vibrator 20 from the outside air. As shown in FIG. 4, the lid 30 is formed from a recess 31 that is open to face the main surface 11, and an opening center of the recess 31. And a flange portion 32 protruding from the opening edge toward the opening edge. The concave portion 31 is a bottomed concave portion that sinks into the lid 30, and has an opening area and an opening depth that are necessary and sufficient for sealing the piezoelectric vibrator 20. The lid 30 may be made of a metal material, an insulating material, or a composite material (for example, a composite material obtained by coating the surface of an insulating member with a metal thin film). The

adhesive layers

51 and 52 join the substrate 10 and the lid 30 so as to hermetically seal the piezoelectric vibrator 20 in the space between the recess 31 and the main surface 11. The

adhesive layers

51 and 52 are not particularly limited as long as they are insulating adhesives. For example, a non-conductive adhesive that is cured by heat treatment and exhibits an adhesive action can be used. As such an adhesive, for example, an epoxy adhesive mainly composed of an epoxy resin can be used. Examples of the epoxy resin include bifunctional epoxy resins such as bisphenol A type epoxy resin and bisphenol F type epoxy resin, and novolac type epoxy resins such as phenol novolac type epoxy resin and cresol novolac type epoxy resin. Moreover, what is generally known, such as a polyfunctional epoxy resin, a glycidyl amine type epoxy resin, a heterocyclic ring-containing epoxy resin, or an alicyclic epoxy resin, can also be applied. The

adhesive layers

51 and 52 are not limited to epoxy adhesives, and may be, for example, low melting point glass adhesives. The low melting point glass adhesive may include lead-free vanadium glass that melts at a temperature of 300 ° C. or higher and 410 ° C. or lower. Vanadium-based glass exhibits an adhesive action when a binder and a solvent are added in a paste, melted and then solidified. In addition, this vanadium-based glass has high reliability such as airtightness at the time of bonding, water resistance and moisture resistance. Furthermore, the thermal expansion coefficient of the vanadium glass can be flexibly controlled by controlling the glass structure. The

adhesive layers

51 and 52 may be the same as or different from each other. The lid 30 can also be called a cap, a cover, or a package member.

Next, the manufacturing process of the piezoelectric vibration component 40 will be described with reference to FIGS. First, as shown in FIG. 1, a substrate 10 on which the piezoelectric vibrator 20 is mounted and a lid 30 for hermetically sealing the piezoelectric vibrator 20 to the substrate 10 are prepared. Next, as shown in FIG. 2, an adhesive layer 51 is formed at the tip of the flange portion 32. At this time, it is preferable to form the adhesive layer 51 along all or part of the periphery of the upper surface 35 when viewed from the direction perpendicular to the upper surface 35 of the flange portion 32. Here, the upper surface 35 means the back surface of the bonding surface 33 where the flange portion 32 is bonded to the main surface 11 via the adhesive layer 52. The front end surface 34 of the flange portion 32 connects the joint surface 33 and the upper surface 35. The tip surface 34 may be bent or flat. In addition, the front-end | tip of the flange part 32 is not limited to this, For example, a sharp shape may be sufficient. The step of forming the adhesive layer 51 may include a step of applying the liquid adhesive layer 51 to the tip of the flange portion 32 and a step of temporarily curing the applied adhesive layer 51. Preliminary curing means a state in which gelation is caused by heating but solidification is not performed. Specifically, it means a semi-cured state between a liquid state and a cured state. In order to temporarily cure the adhesive layer 51, for example, the curing reaction may be forcibly stopped halfway. By letting the adhesive layer 51 be in a pre-cured state in advance, dripping of the adhesive layer 51 can be suppressed.

Next, as shown in FIG. 3, an adhesive layer 52 is formed on the main surface 11 in a substantially frame shape so as to surround the piezoelectric vibrator 20 in accordance with the position where the peripheral edge of the flange portion 32 should be joined to the main surface 11. To do. At this time, it is preferable to apply the adhesive layer 52 with a uniform film thickness so that the adhesive layer 52 is uniformly applied to the main surface 11 and spreads. Next, as shown in FIG. 4, by pressing the lid 30 and the substrate 10 relatively, the adhesive layer 53 formed by bonding the

adhesive layers

51 and 52 forms the tip of the flange portion 32 with a substantially U-shaped cross section. Encourage them to coat while bending. At this time, between the lid 30 and the substrate 10, the adhesive layer 52 is urged to be pushed out in a fillet shape from between the flange portion 32 and the main surface 11 toward the opening edge from the opening center of the recess 31. In addition to the pressing force acting on the adhesive layer 52, the pressing force from the extruded adhesive layer 52 causes the adhesive layer 51 to ride on the step formed between the main surface 11 and the flange portion 32, and from the front end surface 34 of the flange portion 32. It is preferable to cover the upper surface 35 so as to be bent. Since the adhesive layer 51 is formed in advance along all or a part of the periphery of the upper surface 35 when viewed from the direction perpendicular to the upper surface 35 of the flange portion 32, a step generated between the main surface 11 and the flange portion 32 is generated. It is easy to get on and cover the upper surface 35 near the tip of the flange portion 32. In this step, heat is applied after (or while pressing) the lid 30 and the substrate 10 relatively, thereby promoting bonding (crosslinking) between the molecules constituting the

adhesive layers

51 and 52. The adhesive layers 51 and 52 are both shifted to a cured state. Thus, the adhesive layer 53 formed by integrally bonding the

adhesive layers

51 and 52 is formed, and the piezoelectric vibrator 20 can be hermetically sealed in the space between the recess 31 and the main surface 11. The adhesive layer 53 covers the bonding surface 33, the distal end surface 34, and the upper surface 35 while being bent so as to surround all or part of the periphery of the upper surface 35 when viewed from the direction perpendicular to the upper surface 35. Separation of the adhesive interface between the lid 30 and the adhesive layer 53 can be suppressed, and the adhesive force between the lid 30 and the adhesive layer 53 can be increased.

The surface roughness of the bonding surface 33 is preferably rougher than the surface roughness of the recess 31. In general, it is known that the contact angle of a droplet is sensitive to surface roughness. Here, the surface roughness can be defined as the area ratio of the rough surface to the flat surface. For example, as the surface roughness increases, the contact angle of the droplet decreases on the lyophilic surface (wetting increases), whereas the contact angle of the droplet increases on the lyophobic surface ( Wettability decreases). Based on such knowledge, the material of the lid 30 is selected so as to be lyophilic with respect to the adhesive layer 53, and the surface roughness of the bonding surface 33 is made rougher than the surface roughness of the recess 31, thereby The contact angle of the adhesive layer 53 with respect to 33 can be reduced, and it can be made easy to spread uniformly. According to such a structure, since the adhesive layer 53 enters the gap between the minute irregularities of the joint surface 33, the anchoring effect, van der Waals force, etc. act in a composite manner, and the gap between the lid 30 and the adhesive layer 53. Adhesion can be increased. Further, when the lid 30 and the substrate 10 are relatively pressed through the adhesive layer 52, the adhesive layer 52 is easily pushed out in a fillet shape from between the flange portion 32 and the main surface 11, and thus pushed out. The adhesive layer 51 can be pushed up to the upper surface 35 beyond the step formed between the main surface 11 and the flange portion 32 by the pressing force from the adhesive layer 52. Further, by making the surface roughness of the bonding surface 33 larger than the surface roughness of the recess 31, the intrusion of the adhesive layer 51 into the recess 31 can be suppressed. When the adhesive layer 51 enters the recess 31, for example, the gas released from the adhesive layer 51 is adsorbed to the

excitation electrodes

22 and 23 constituting the vibration region of the piezoelectric vibrator 20, and the oscillation frequency of the piezoelectric vibrator 20 varies. For this reason, it is preferable that the adhesive layer 51 does not enter the recess 31.

In addition, as a method for roughening the surface of the bonding surface 33, for example, plasma treatment or sandblasting can be used. Sand blasting is a process of processing a roughened surface by, for example, spraying fine particles (for example, abrasive particles such as alumina and diamond) toward the surface to be processed together with compressed air. When manufacturing a plurality of piezoelectric vibration components 40 by cutting out a plurality of lids 30 from a single mother board, the mother board may be subjected to sandblasting after masking so that the portions of the bonding surfaces 33 are exposed. .

Each embodiment described above is for facilitating understanding of the present invention, and is not intended to limit the present invention. The present invention can be changed / improved without departing from the spirit thereof, and the present invention includes equivalents thereof. In other words, those obtained by appropriately modifying the design of each embodiment by those skilled in the art are also included in the scope of the present invention as long as they include the features of the present invention. For example, each element included in each embodiment and its arrangement, material, condition, shape, size, and the like are not limited to those illustrated, and can be changed as appropriate. In addition, each element included in each embodiment can be combined as much as technically possible, and combinations thereof are included in the scope of the present invention as long as they include the features of the present invention.

DESCRIPTION OF SYMBOLS 10 ... Board | substrate 11 ... Main surface 12 ... Conductive adhesive 13 ... Wiring 14 ... Notch part 15 ... Conductive adhesive 16 ... Wiring 17 ... Notch part 20 ... Piezoelectric vibrator 21 ... Piezoelectric plate 22 ... Excitation electrode 23 ... Excitation electrode 30 ... Lid 31 ... Recess 32 ... Flange 33 ... Joining surface 34 ... End face 35 ... Top surface 40 ... Piezoelectric vibration component 51 ... Adhesive layer 52 ... Adhesive layer 53

Claims

A substrate having a main surface on which the piezoelectric vibrator is mounted;
A lid having a concave portion opened to face the main surface and a flange portion projecting from the opening edge toward the opening edge from the opening center of the concave portion;
An adhesive layer that joins the substrate and the lid so as to hermetically seal the piezoelectric vibrator in a space between the concave portion and the main surface;
The adhesive layer is a piezoelectric vibration component that covers a tip and an upper portion of the flange portion.
The piezoelectric vibration component according to claim 1,
The said flange part is a piezoelectric vibration component which has a joint surface joined to the said main surface through the said contact bonding layer.
The piezoelectric vibration component according to claim 2,
The piezoelectric vibration component in which the surface roughness of the joint surface is rougher than the surface roughness of the recess.
The piezoelectric vibration component according to claim 2 or 3,
The upper portion of the flange portion is an upper surface that is the back surface of the joint surface;
The front end of the flange portion is a front end surface connecting the joining surface and the upper surface,
The adhesive layer is a piezoelectric vibration component that covers a front end of the flange portion while being bent so as to surround the joining surface, the front end surface, and the upper surface.
The piezoelectric vibration component according to any one of claims 1 to 4,
The lid is a piezoelectric vibration component made of a metal material.
The piezoelectric vibration component according to any one of claims 1 to 5,
The piezoelectric vibration component, wherein the adhesive layer is a low-melting glass adhesive.
The piezoelectric vibration component according to any one of claims 1 to 5,
The adhesive layer is a piezoelectric vibration component that is an epoxy adhesive.
Preparing a substrate having a main surface on which the piezoelectric vibrator is mounted;
Preparing a lid having a concave portion opened to face the main surface and a flange portion projecting from the opening edge toward the opening edge from the opening center of the concave portion;
Forming a first adhesive layer at the tip of the flange portion;
Forming a second adhesive layer on the main surface in a substantially frame shape in accordance with a position where the periphery of the flange portion is to be bonded to the main surface;
By pressing the lid and the substrate relatively, the adhesive layer formed by combining the first and second adhesive layers is urged to cover the front end and the upper portion of the flange portion, and the piezoelectric vibration Sealing the child in the space between the recess and the main surface;
A method for manufacturing a piezoelectric vibration component comprising: