WO2016110257A1 - 一种通信设备及用于该通信设备的单板 - Google Patents

一种通信设备及用于该通信设备的单板 Download PDF

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Publication number
WO2016110257A1
WO2016110257A1 PCT/CN2016/070301 CN2016070301W WO2016110257A1 WO 2016110257 A1 WO2016110257 A1 WO 2016110257A1 CN 2016070301 W CN2016070301 W CN 2016070301W WO 2016110257 A1 WO2016110257 A1 WO 2016110257A1
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WO
WIPO (PCT)
Prior art keywords
power
module
communication
boards
temperature adjustment
Prior art date
Application number
PCT/CN2016/070301
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English (en)
French (fr)
Inventor
刘长义
费旭东
姚希栋
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to EP16734917.4A priority Critical patent/EP3229101B1/en
Publication of WO2016110257A1 publication Critical patent/WO2016110257A1/zh
Priority to US15/643,235 priority patent/US10122411B2/en

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B3/00—Line transmission systems
    • H04B3/54—Systems for transmission via power distribution lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1438—Back panels or connecting means therefor; Terminals; Coding means to avoid wrong insertion
    • H05K7/1447—External wirings; Wiring ducts; Laying cables
    • H05K7/1451—External wirings; Wiring ducts; Laying cables with connections between circuit boards or units
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/206—Cooling means comprising thermal management
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L12/00—Data switching networks
    • H04L12/28—Data switching networks characterised by path configuration, e.g. LAN [Local Area Networks] or WAN [Wide Area Networks]
    • H04L12/40—Bus networks
    • H04L12/40006—Architecture of a communication node
    • H04L12/40039—Details regarding the setting of the power status of a node according to activity on the bus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1438—Back panels or connecting means therefor; Terminals; Coding means to avoid wrong insertion
    • H05K7/1457—Power distribution arrangements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1485—Servers; Data center rooms, e.g. 19-inch computer racks
    • H05K7/1488—Cabinets therefor, e.g. chassis or racks or mechanical interfaces between blades and support structures
    • H05K7/1492—Cabinets therefor, e.g. chassis or racks or mechanical interfaces between blades and support structures having electrical distribution arrangements, e.g. power supply or data communications
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20209—Thermal management, e.g. fan control
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops

Definitions

  • the present invention relates to the field of communications technologies, and in particular, to a communications device and a board for the communications device.
  • the communication device includes a cabinet in which at least one chassis can be placed, and each chassis includes a backplane.
  • each chassis includes a backplane.
  • each The back plate is integrated with the frame.
  • Multiple boards can be inserted into each chassis.
  • Multiple boards are connected to the power supply and fans through the backplane in the chassis.
  • the plurality of boards can be connected to the backplane by means of horizontal insertion and vertical insertion.
  • the power supply and the fan are also connected to the backplane.
  • the interaction signals between the boards and the signal lines exchanged between the multiple boards and the power supply and the fan are all set in the backplane, and communication is completed through the backplane.
  • the boards, power supplies, and fans are connected to the backplanes more and more, and the traces on the backplane are more and more complicated, resulting in the design of the backplane.
  • the complexity is getting higher and higher, which increases the design cost.
  • the embodiment of the present invention provides a communication device and a board for the communication device, specifically:
  • an embodiment of the present invention provides a communications device, including:
  • a container at least one power module, at least one temperature adjustment module, a plurality of veneers; wherein the container is for placing the at least one temperature adjustment module and the plurality of veneers;
  • the container is also used to place a power supply bus layer
  • the power bus layer is connected to the at least one power module, the at least one temperature adjustment module, and the plurality of boards;
  • the at least one power module is configured to supply power to the at least one temperature adjustment module and the plurality of boards through the power bus layer;
  • the plurality of boards, at least a portion of the communication between the at least one power module and the at least one temperature adjustment module is communicated by the power bus layer in a power line communication manner.
  • the plurality of boards, the at least one part of the communication between the at least one power module and the at least one temperature adjustment module comprises: board management communication for performing control management between the plurality of boards.
  • the service communication related to service transmission between the plurality of boards is performed through a data interface other than the power supply layer.
  • the data interface is one or more of a fiber interface and a high speed cable interface; the data interface is disposed on a front panel of the plurality of boards.
  • the plurality of boards, at least a portion of the communication between the at least one power module and the at least one temperature adjustment module includes any one or a combination of the following:
  • At least one of the plurality of boards and at least one of the at least one power module performs power management communication for control management; and at least one of the plurality of boards and the at least one At least one of the temperature adjustment modules performs temperature control management communication for control management.
  • the plurality of boards, at least a portion of the communication between the at least one power module and the at least one temperature adjustment module specifically includes any one or a combination of the following:
  • At least one of the plurality of boards and the power management communication of all the power modules of the at least one power module; and at least one of the plurality of boards and the at least one All temperature adjustment modules in the temperature regulation module perform temperature management communication communication for control management.
  • the number of conductive layers of the power bus layer is the minimum number of conductive layers required to provide the plurality of single board power supplies.
  • the method further includes:
  • a plurality of power connectors made of a rigid material for connecting the plurality of boards, the at least one temperature regulating module, and the at least one power module to the power bus layer in a pluggable manner.
  • Each of the plurality of veneers, each of the at least one temperature adjustment module and each of the at least one power module includes one of the power connectors,
  • the power connector is connected to the power bus layer in a pluggable manner.
  • the power supply bus layer includes at least one elongated power supply bus bar having a plurality of toothed protrusions
  • the power connector is connected to the toothed protrusion on the power bus bar by a pluggable manner.
  • the power bus layer includes a plurality of elongated power bus bars, and the power bus layer further includes at least one conductive connection for conducting conductive layers of the same polarity on the plurality of power bus bars.
  • the power supply bus layer further includes at least one adapter connector, and the adapter connector is fixed on the power bus bar or the conductive connector for being used with the board or the power module or the The power connector in the temperature adjustment module is connected, so that the single board or the power module or the temperature adjustment module can be electrically connected to the power bus bar or the conductive connector.
  • the portion of the power bus layer connected to the power connector has a flat structure
  • the power connector includes two elastic pieces for clamping and electrically contacting upper and lower surfaces of the flat structure, thereby realizing a connection between the power connector and the power supply bus layer. Plug and unplug the connection.
  • the communication device does not substantially provide a conventional backplane.
  • All low-speed communication of the communication device communicates by means of the power line communication layer in a power line communication manner;
  • All high speed communications in the communication device communicate via a high speed interface that supports high speed communications.
  • At least one of the plurality of boards, at least one of the at least one power module or at least one of the at least one temperature adjustment module comprises: a slot ID module, the slot
  • the bit ID module includes a plurality of Boolean signal generating structures and a control circuit
  • the communication device further includes: an ID code structure member disposed in the container, the ID code structure member including a base body and a matching on the base body matching the Boolean signal generation structure member Defining a plurality of matching members of the encoding rule; the base is fixedly disposed in the container, the plurality of matching members are configured to match the plurality of Boolean signal generating structures to generate a plurality of Boolean signals, the controlling The circuit is configured to generate a slot ID according to the generated multiple Boolean signals.
  • the plurality of matching members are not fixed in position, and the encoding rule can be changed by adjusting the position of one or more of the plurality of matching members.
  • the plurality of boards, the at least one portion of the communication between the at least one power module and the at least one temperature adjustment module further includes any one or a combination of the following:
  • At least one of the plurality of boards and at least one of the at least one power module performs power management communication for control management; and at least one of the plurality of boards and the at least one At least one of the temperature adjustment modules performs temperature control management communication for control management.
  • an embodiment of the present invention provides a board for a communication device, where the communication device includes a container, at least one power module, at least one temperature adjustment module, and multiple orders including the single board. a plate; wherein the container is configured to place the at least one temperature adjustment module and the plurality of single plates, the container is further configured to place a power supply bus layer; the power supply bus layer and the at least one power module, The at least one temperature adjustment module is connected to the plurality of boards; the at least one power module is configured to supply power to the at least one temperature adjustment module and the plurality of boards through the power supply layer;
  • the board includes:
  • a power line communication module configured to communicate with another one of the plurality of boards, the at least one power module, and the at least one temperature adjustment module through the power supply layer to the power line Communication by means of communication;
  • the service processing module is configured to communicate with another one of the plurality of boards through a data interface other than the power communication layer.
  • the communication performed by the method includes: board management communication for control management with another one of the plurality of boards.
  • the data interface is one or more of a fiber interface and a high speed cable interface; the data interface is disposed on a front panel of the plurality of boards.
  • One or more of the power line communication module and another one of the plurality of boards, the at least one power module, and the at least one temperature adjustment module are electrically connected by the power supply layer
  • the communication performed by the method includes any one or a combination of the following:
  • the power line communication module is configured to perform power management communication for controlling management of at least one of the at least one power module; and the power line communication module is configured to adjust temperature of at least one of the at least one temperature adjustment module The module performs temperature control management communication for control management.
  • One or more of the power line communication module and another one of the plurality of boards, the at least one power module, and the at least one temperature adjustment module are electrically connected by the power supply layer
  • the communication performed by the method specifically includes any one or a combination of the following:
  • the power line communication module is configured to perform power management communication for controlling management of all power modules of the at least one power module; and the power line communication module is configured to perform, for all temperature adjustment modules of the at least one temperature adjustment module Control management of temperature regulation management communication.
  • the board includes a power connector made of a rigid material, and the power connector is configured to be connected to the power bus layer in a pluggable manner; the power line communication module is connected to the power connector, specifically And communicating by the power connector to another one of the plurality of boards through the power bus layer in a power line communication manner.
  • a portion of the power supply bus layer connected to the power connector has a flat structure
  • the power connector includes two elastic pieces for clamping and electrically contacting upper and lower surfaces of the flat structure, thereby implementing pluggable between the power supply and the power supply bus layer. Pull the connection.
  • the seventh possible implementation manner further includes:
  • the slot ID module includes a plurality of Boolean signal generating structures and a control circuit
  • the communication device further includes: an ID code structure member disposed in the container, the ID code structure member including a base body and a matching on the base body matching the Boolean signal generation structure member Defining a plurality of matching members of the encoding rule; the base is fixedly disposed in the container, the plurality of matching members are configured to match the plurality of Boolean signal generating structures to generate a plurality of Boolean signals, the controlling The circuit is configured to generate a slot ID according to the generated multiple Boolean signals.
  • the communication performed by the method also includes any one or a combination of the following:
  • the power line communication module is configured to perform power management communication for controlling management of at least one of the at least one power module; and the power line communication module is configured to adjust temperature of at least one of the at least one temperature adjustment module The module performs temperature control management communication for control management.
  • a part of communication is performed in a power bus layer manner by means of power line communication, thereby reducing the complexity of the backplane and even canceling the backplane.
  • the structure of the power supply bus layer can be designed to be very easy to be plugged and unplugged with various components (single board, temperature adjustment module, power supply module) and has a low tolerance requirement (such as open-toothed power supply convergence).
  • the strip is connected to the power connector by means of a card connection, so that the convenience of use can also reduce the probability of equipment failure and save maintenance costs.
  • FIG. 1 is a schematic structural diagram of a communication device in the prior art
  • FIG. 2 is a schematic structural diagram of a communication device according to Embodiment 1 of the present invention.
  • FIG. 3 is a schematic structural diagram of a power supply bus layer according to Embodiment 2 of the present invention.
  • FIG. 4 is a schematic cross-sectional view of a power bus bar according to Embodiment 2 of the present invention.
  • FIG. 5 is a schematic structural diagram of a conductive connection member according to Embodiment 2 of the present invention.
  • FIG. 6 is a schematic structural diagram of an adapter connector according to Embodiment 2 of the present invention.
  • FIG. 7 is a schematic structural diagram of a power connector according to Embodiment 2 of the present invention.
  • FIG. 8 is a schematic diagram of connection of components and a power supply bus layer according to Embodiment 2 of the present invention.
  • FIG. 9 is a schematic diagram of cooperation between a slot ID module and an ID coding structure according to Embodiment 3 of the present invention.
  • FIG. 10A is a schematic diagram of cooperation between a slot ID module and an ID coding structure according to Embodiment 3 of the present invention.
  • FIG. 10B is a schematic diagram of another slot ID module and an ID coding structure according to Embodiment 3 of the present invention.
  • FIG. 11 is a schematic diagram of a single board according to Embodiment 4 of the present invention.
  • FIG. 12 is a schematic diagram of a single board and a power supply/fan module according to Embodiment 4 of the present invention.
  • FIG. 13 is a schematic structural diagram of a single board according to Embodiment 5 of the present invention.
  • an embodiment of the present invention provides a communications device 1 including:
  • the fan module 12 is generally used. If the volume is not limited, the air conditioner and the water-cooling heat dissipating device are not limited.
  • the fan module is used instead of the temperature adjustment module for description;
  • the at least one power module, the at least one fan module, and the plurality of boards are disposed;
  • the container is a carrying unit for placing components such as a single board, a fan module, or a power module, and may be A chassis or a cabinet commonly used in the prior art.
  • the frame is a container smaller than the cabinet, and each has its own standards.
  • other known or unknown implementations for providing similar functions are not limited to use non-standard, or future new standards.
  • the multiple boards are the same as the boards in the prior art in the function type.
  • one or more switch boards 14 and multiple service boards 15 may be included, or may also include a monitoring board 13 for device management monitoring.
  • the topological connection relationship between the boards can also be based on various existing connection relationships, such as the star connection shown in FIG. 2, and the two switch boards are backed up to each other.
  • each of the single boards can also be inserted into the container by means of horizontal insertion, vertical insertion or the like as in the prior art.
  • the overall position of each board and multiple power modules and multiple fan modules can also be consistent with the prior art.
  • the board is located at the front side of the container, the power module and the fan module are located at the rear side of the container, and of course, another In the embodiment, some veneers are not limited to be inserted into the container in the form of a later insert.
  • the communication device further includes a power collecting layer 16; the power collecting layer 16 is located between the front side component (such as a plurality of single boards) and the rear side component (such as a power module, a fan or a rear board) in the container. Used to connect front and rear side parts.
  • the power collecting layer 16 is located between the front side component (such as a plurality of single boards) and the rear side component (such as a power module, a fan or a rear board) in the container. Used to connect front and rear side parts.
  • the power supply layer 16 is connected to at least one power module and at least one of the plurality of fan modules.
  • the power connectors 17 are disposed on each of the boards, the power modules, and the fan modules.
  • the power connector 17 is used to implement the connection with the power bus layer; of course, the embodiment of the present invention does not limit the scenario in which some components (such as two fan modules) share one power connector.
  • the specific structure of the power supply layer can be various. For details, refer to the description in the second embodiment.
  • the at least one power module is configured to supply power to the at least one fan module and the plurality of boards through the power distribution layer;
  • a part of the communication between the plurality of boards is performed by power line communication through the power bus layer, and another part of communication is performed by the communication channel not passing through the power bus layer.
  • a part of the communication between the multiple boards through the power communication layer in the form of power line communication includes: single board management communication between the plurality of boards for control management.
  • the communication between the boards refers to communication that conforms to a certain network topology relationship
  • the board management communication performed between multiple boards may specifically refer to a single board (such as a control function).
  • the board collects various status information (such as collecting board temperature) on each board, and performs control and management based on the collected status information (if the temperature is too high, the alarm is generated); the data generated by the board management communication
  • the amount is generally small, and the required transmission rate is also relatively low (such as several hundred Mbps), generally referred to as "low bandwidth communication” or "low speed communication.”
  • Communication by means of power line communication through the power supply layer can be achieved
  • the bandwidth and transmission rate can meet the requirements of such low-rate communication, so the board can manage communication to communicate by power line communication through the power confluence layer.
  • Another part of the communication between multiple boards through the communication channel that does not pass through the power bus layer includes: service communication between the boards through the high-speed interface for service transmission, for example, supporting high-speed communication through a fiber interface, a high-speed cable interface, or the like.
  • Service communication performed by the data interface compared with the single board management communication, the service communication will generate a large amount of data, and the required transmission rate is also relatively high (such as 1 Gbps or more), which is generally called “high bandwidth communication” or "high speed communication”.
  • the entire communication device is substantially not provided with a conventional backplane.
  • the "traditional backplane” refers to a backplane implemented by a PCB in the prior art for various signal exchanges; here "substantially not set” is Refers to the system optimization from the point of view that there is no need to set up, in some scenarios, for example, a remedial solution after an error occurs in design, or some inferior schemes used purely to avoid patent risks (such as eliciting a specific small Some of the signals are connected by a conventional backplane. Although a conventional backplane can also be provided, since it is not set from an optimization point of view, it is also a category of "substantially not set”.
  • communication between at least one of the plurality of boards and at least one of the at least one power module and at least one of the at least one fan module is converged by the power source.
  • the layer communicates by means of power line communication;
  • the communication between the at least one of the plurality of boards and the at least one of the at least one power module includes: at least one of the plurality of boards and at least one of the at least one power module Power management communication for control management, for example, controlling the power output of the power module according to the load condition of the system
  • the communication between the at least one of the plurality of boards and the at least one fan module of the at least one fan module includes: controlling at least one of the plurality of boards and at least one of the at least one fan module Managed fan management communication, for example, when monitoring the board to overheat, increase the fan speed.
  • the amount of data generated by the above power management communication and fan management communication is also small, and is also referred to as “low bandwidth communication” or “low speed communication”.
  • the communication between the various components does not all go through the backplane, but a part of the communication is communicated by the power supply bus layer in a power line communication manner, thereby reducing the complexity of the backplane design and reducing the design cost.
  • a preferred solution of the present invention can be completely without a backplane, and low-bandwidth communication is communicated by means of a power line communication layer by means of power line communication, and high-bandwidth communication is communicated through a high-speed communication interface, thereby greatly mitigating the prior art. There is a problem that the maintenance cost of the veneer is high.
  • the hardware implementation of the communication device is specifically introduced in the embodiment of the present invention.
  • the implementation of the power bus layer includes a plurality of implementations in the first embodiment.
  • the specific form of the power bus layer is introduced in the embodiment of the present invention.
  • the function of the power supply bus layer is the same as that in the first embodiment, and is used for transmitting a power signal and other signals carried on the power signal by means of power line communication. Since the power signal generally includes only the power source during physical transmission. Positive and negative signals, therefore, the power supply bus layer only needs to provide two conductive paths.
  • the number of conductive layers of the power supply bus layer is the minimum number of conductive layers required for providing a plurality of single-board power supplies.
  • the power supply only includes two positive and negative signals, so only two conductive layers need to be provided. Just fine.
  • the power supply bus layer may include a plurality of power bus bars 31.
  • FIG. 4 is a schematic cross-sectional view of a power bus bar according to an embodiment of the present invention, which mainly includes two upper and lower conductive layers and an insulating layer sandwiched therebetween, wherein the upper conductive layer can transmit a signal of the positive electrode of the power source, and correspondingly, the lower conductive layer can be used. In the transmission of the negative signal of the power supply.
  • various conductive materials such as copper and aluminum can be used for the conductive layer, and the material of the insulating layer is not limited, and only the upper and lower conductive layers can be electrically isolated. Techniques well known to those skilled in the art will not be described here.
  • an insulating coating can be applied to the surface of the two conductive layers to prevent electric shock.
  • planar shape of the power bus bar is not limited, and the "planar shape" herein refers to a shape formed by ignoring the thickness.
  • the planar shape may be a regular shape (such as a rectangle, an ellipse), or may be an irregular shape (such as a rectangle with various regular or irregular shape notches, etc.).
  • a rectangle-based shape may be selected for ease of manufacture.
  • the height, the length, the area, and the like of the structural components constituting each part of the power bus bar are not specifically limited, as long as the power bus bar can be connected to the components (board, power module, fan module) to be connected thereto. Just fine.
  • the power bus bar in order to facilitate the connection and fixing, and also to prevent interference between the various components connected to the power bus bar and to improve the safety during plugging and unplugging (such as reducing the arc during plugging and unplugging), the power bus bar can be set
  • the toothed structure that is, each of the places for connecting to the component, has a gap 32, so that the power bus bar exhibits a structure having a plurality of toothed protrusions, here referred to as a front side member (such as a single board).
  • the place of connection is the front tooth 33
  • the place where the rear side member is connected is the rear tooth 34.
  • the shape of the void may also be a rectangle, and of course, other shapes are not limited.
  • the number and location of the power bus bars are not limited, and may be determined according to the positions and the number of components to be connected. For example, after the components are inserted into the cabinet and the connectors are all on the same side, only one need to be set.
  • the power bus is connected to the power bus by means of front and rear plugging. If the components are inserted into the cabinet and are located on the left, right, and right sides of the cabinet, you can set three on the left, right, and right sides of the cabinet. Power bus bars.
  • the power supply bus layer of FIG. 5 may further include one or more conductive connectors 35 for conducting conductive layers of the same polarity on the plurality of power bus bars, that is, positive of the power signals in the respective power bus bars.
  • the negative poles are respectively connected to form a unified power transmission channel. Since only the power signals of the respective power bus bars need to be connected, the design requirements for the conductive connectors become very low, and the conductive connectors can be realized in various ways.
  • the conductive connection member can be a conductive metal (such as a copper strip), and then through a corresponding physical interface to a variety of existing connection methods such as snapping, screwing, bonding, plugging, soldering, etc.
  • One signal layer (such as a positive electrode) of each power bus bar is connected; in addition, it may be similar to the structure of the power bus layer, including two layers of mutually isolated conductive layers, and the two conductive layers are respectively connected to corresponding conductive wires in the respective power bus bars.
  • Floor The specific implementation methods of these connections are all known to those skilled in the art.
  • the connection can be made by means of screws as shown in FIG. 5 (Note: in FIG. 5, one of the power bus bars is located around the connection.
  • the conductive layer with different electrode properties and the intermediate insulator are hollowed out to facilitate screwing and not to turn positive and negative signals on).
  • the power bus layer further includes an adapter connector 36.
  • the adapter connector is relatively small compared to the power bus bar and can be connected to the power bus bar or the conductive connector in a fixed or detachable manner.
  • the power supply bus bar or the conductive connection is electrically connected, and other components (single board, fan module, and power supply module) can be connected to the power supply bus layer by connecting the adapter connection.
  • the advantage of using adapters is that they are more flexible. For example, when some components are inserted into the cabinet and the connectors of these components cannot be directly connected to the power bus, the indirect connection can be achieved by the adapter.
  • the fixing form of the adapter connector and the power bus bar or other structural members is not limited.
  • the screw can be connected in the manner of FIG. 6 (Note: the connection place also needs to be hollowed out to prevent the positive and negative signals from being turned on) .
  • the power supply bus layer is designed in the form of a plurality of power bus bars and conductive connectors, so that there is a large empty area in the power bus layer for the wind blown by the rear fan module to pass, and the flow to the front side
  • the area where the board is located increases the heat dissipation efficiency.
  • each component single board, power source, fan
  • the connection manner of each component is performed by means of the power connector 17.
  • a power connector is provided in each board, power module, and fan module, and is directly connected to the power bus through the power connector.
  • the power connector is a connector made of a rigid material, fixed to each component, and connected to the power busbar through the power connector when the corresponding component is inserted into the cabinet.
  • the rigid material herein refers to a relatively hard material that is not easily deformed by bending, such as a hard metal, a hard plastic, or the like.
  • a connector with a soft material may also be used.
  • the "connector with a soft material” refers to a connector that does not completely use a rigid material, for example, using a cable, and being flexible.
  • a relatively soft material such as a board.
  • the advantage of the connector made of rigid material is that it is easy to insert and remove. When inserting each component, the operator only needs to push the power supply layer side to push the component to the power busbar; otherwise, when pulling out With the force in the opposite direction, the entire part can be pulled out.
  • the physical connection between the power connector and the power supply layer can be connected by plugging, snapping, and the like.
  • the power connector in the embodiment of the present invention is preferably connected by means of a card connection, in accordance with the implementation of the power source bus layer.
  • the side of the power connector connected to the power bus layer includes two elastic sheets having electrical conductivity, respectively contacting the positive and negative poles of the power bus layer (eg, clamping diagram) 3, the left and right sides of the teeth in the power bus bar, and at the same time, the two elastic pieces respectively lead two pins through the signal wires (not shown) inside the power connector, and the single board Connected.
  • This part of the specific implementation is the prior art, and will not be described here.
  • the power connector designed by this method has a large tolerance capability, which reduces the requirements for the insertion and removal precision of components such as a single board, a power supply, and a fan, thereby improving system reliability and reducing maintenance costs; and the design is simple and easy to implement. low cost.
  • FIG. 8 is a schematic structural diagram of a specific power supply bus layer and various components connected according to an embodiment of the present invention.
  • the board 81 is inserted into the cabinet from the front side of the cabinet.
  • the power module 82 is inserted into the cabinet from the rear of the cabinet.
  • the fan module 83 is inserted into the cabinet from the rear of the cabinet.
  • three power bus bars can be set between the multiple boards and the power module (or fan module) and the height of the cabinet.
  • the power bus bars on both sides are used to connect the power supply on the rear side of the cabinet.
  • the single-wide board on the right side of the figure is connected to the right side of the power bus bar.
  • Power bus bar (if connected to the right or middle or left power bus bar in the figure).
  • one of the boards may be connected to the middle power bus bar, or one or more power bus bars may be connected for connecting one or more singles.
  • Board, fan Module or power module Those skilled in the art can design a specific design power supply bus layer according to the design requirements in combination with the above examples.
  • Each power bus bar has a toothed structure that can be either open on the front side or on the rear side. As shown in FIG. 8, front teeth are provided on the front side for connecting the veneers on the front side of the cabinet; rear sides are provided with rear teeth for connecting the fan modules.
  • conductive connectors In order to electrically conduct the respective power bus bars, four conductive connectors are provided in Fig. 8. Of course, other numbers of conductive connectors may be provided.
  • the power module shown in Figure 8 uses the power connector shown in Figure 7.
  • the position of the power connector on the power module is in a position where a horizontally arranged structural member is to be connected thereto.
  • the power bus bars are arranged vertically and cannot be connected to the power connector on the power module. Therefore, the solution in Figure 8 uses a connection scheme through the adapter to achieve indirect connection with the power bus.
  • the adapter connector is fixed to one side of the power bus bar by screw fixing, and is connected to the power module power connector.
  • the signal isolation signal path can be connected through various existing connection methods. For example, if there are three power signals, three rows of parallel conductive strips can be set, and each conductive strip needs to be connected to a socket, and the power connector can be set. In the form of a plug, the corresponding socket is connected by plugging, or other various connection methods may be used, which is not limited herein.
  • the communication channel between the board and the board that does not pass through the power bus layer can preferably be implemented by using a high-speed data interface, where the "high-speed data interface" refers to an interface that supports high-speed transmission, for example, supports a rate of 1 Gbps or more, for example, High-speed data interfaces such as fiber optic interfaces and high-speed cable interfaces (also called high-speed cable interfaces) are used, and high-speed communication is realized by using transmission media such as optical fibers and high-speed cables. These are all prior art and will not be described here.
  • each component in the communication device provided by the embodiment of the present invention further includes a slot ID module 91 for generating a slot ID.
  • the basic principle of the slot ID module is to generate 0, 1 signals through some simple structural members 911 (with some circuits), and generate different slot IDs by the control circuit 912 according to the generated 0, 1 encoding combination. These simple structural parts are referred to herein as "boolean signal generation.
  • the structural member 911 for example, an optocoupler module, or an electrical signal connector, corresponding thereto, the embodiment of the invention further includes an ID code structure member 92 disposed in the container, the ID code structure member including the base body 921 and the base body a plurality of matching members 922 matching the Boolean signal generating structure 911 and conforming to a predefined encoding rule; the base body is fixedly disposed in the container, and the plurality of matching members 922 are used for generating the structural member 911 with the plurality of Boolean signals.
  • the control circuit is configured to generate a slot ID according to the generated plurality of Boolean signals.
  • the slot ID module may include multiple optocoupler devices, and the number of optocoupler devices may be determined according to the number of bits required by the slot ID. For example, if four-digit ID coding is required, four slots may be used.
  • Optocoupler device As shown in FIG. 10A, the optocoupler device is a signal detecting device commonly used in the prior art, and mainly includes a light emitting unit (not shown), a photosensitive unit (not shown), and a control circuit when there is an object.
  • the control circuit When inserted into the recess of the optocoupler device, the channel between the light-emitting unit of the optocoupler unit and the photosensitive unit is blocked, and the control circuit can correspondingly generate a signal (such as "1"); otherwise, if no object blocks the optocoupler The channel between the component lighting unit and the photosensitive unit, the control circuit outputs another signal (such as "0").
  • a signal such as "1”
  • the control circuit outputs another signal (such as "0").
  • the slot ID module may also include a plurality of electrical signal connectors and corresponding control circuits, and the number of electrical signal connectors is also determined according to the number of bits required by the slot ID.
  • the electrical signal connector works like an optocoupler device, producing a signal when electrically conducting, and vice versa, producing another signal.
  • the communication device of the embodiment of the present invention further includes an ID code structure component, and the ID code structure component is provided with 0 slots matched with the slot ID module at a connection with the slot ID module of each component.
  • One or more mating pieces through the cooperation of the mating parts and the slot module, cause a change in the signal of the slot ID module, thereby outputting the slot ID.
  • the mating member can be any opaque object that blocks the passage of optical signals, such as opaque wood, metal, plastic, and the like.
  • the ID of a slot is "1101"
  • three matching components corresponding to the first, second, and fourth optocouplers may be provided.
  • the mating component may block. The light path causes a change in the electrical signal to produce a slot signal.
  • the mating member can be an electrical conductor, such as various electrically conductive metal sheets.
  • the slot ID of each slot may be fixed or flexible, and the ID code structure may be fixed or flexible.
  • the fixed way is that the ID code structure is fixed in the cabinet, and generally the position and shape are not changed, so that the slot ID of each slot is fixed.
  • the specific fixed manner is for those skilled in the art.
  • Known techniques for example, can be fixed in existing ways (such as power bus bars) or some other structural components of a new design, and the ID coded structural members can be fixed or split into several parts. Fixed separately, etc., will not be described here.
  • the advantage of using the fixed method is that it is more convenient for the operator to install and maintain on site.
  • the operator does not need to configure the slot ID on the site. Only the relevant components need to be inserted into the cabinet to obtain the slot ID. Convenience.
  • the flexible and configurable method means that the ID coded structure is not fixed at a certain position in the cabinet, and the volume is relatively small (only need to be able to be configured with the slot ID module and produce an effect), and between the slot ID module Connect by pluggable.
  • the matching component in the ID code structure can be fixed or adjustable (such as by pushing back and forth, or flipping up and down to hide and display the matching component).
  • the specific one is selected.
  • the ID code structure of the model or the ID code structure is adjusted to the format corresponding to the slot ID, and inserted into the ID coding module to obtain the slot ID.
  • the advantage of the flexible and configurable mode is that the slot ID is not fixed. You can set the ID of one or more slots to a specific slot ID according to actual needs.
  • the two methods are not limited.
  • the ID code structure is fixed in the cabinet, and the matching members in the ID code structure are adjustable (for example, by pushing back and forth, or up and down Flip to hide and show the matching pieces).
  • These matching components can be adjusted to a specific slot ID code according to the encoding requirements in advance, and this encoding rule is used by default. In this case, the operator does not need to manually install these ID encoding structures, only need to The slot number can be obtained by inserting the component into the cabinet. If the requirements of the coding rules are changed, you can change the ID of each slot by displaying or hiding the corresponding matching component. After the change is complete, you can easily obtain the slot ID by simple operation of the plug-in component.
  • the specific implementation of the above method is a technology well known to those skilled in the art, and details are not described herein again.
  • the embodiments of the present invention introduce various components in the communication device.
  • the component may be a single board, or a fan module, or a power module.
  • each component 40 needs to have a PLC module 41 for transmitting data signals that need to be transmitted outside the components and then transmitting them through the power supply layer, or from outside the component.
  • the transmitted power signal is demodulated to obtain a data signal carried in the power signal.
  • component 40 also includes an in-board power processing unit 42, which is coupled to in-board power processing unit 42 and interacts with the power sink signal via an in-board power processing unit.
  • the in-board power processing unit includes an in-board power module 421 and a front-end processing module 422.
  • the front-end processing module 422 is a pair of discrete components (such as resistors, capacitors, inductors, etc.) that are connected to the power supply front end (referring to the power supply confluence layer closest to the power supply).
  • One end of the analog circuit for processing the signal including but not limited to one or more of the following circuits: a filter circuit, a slow-up circuit, a lightning protection circuit, and an EMC protection circuit.
  • the in-board power module 421 is used for power conversion, and converts the input power source (such as 45V) into the power required by each device in the board (such as 12V, 5V).
  • the power modules in the board are generally relatively independent, and one package is separately A physically separate module, of course, the embodiment of the invention does not limit the in-board power module manufactured by other means.
  • the PLC module 41 When the PLC module 41 is connected to the in-board power processing unit 42, it can be specifically connected between the front-end processing module and the PLC module, and receives a power signal from the front-end processing module when receiving the power signal, and passes the front-end processing module when transmitting the power signal. Send a power signal.
  • PLC module for example, how to implement the modulation and demodulation of the signal
  • PLC module for example, how to implement the modulation and demodulation of the signal
  • the board on the left side of FIG. 12 may be a service board or a switch board, and each service may be used.
  • the board or the switch board includes a processing module for service processing, and is used for monitoring and management of the monitoring management.
  • the processing module processes the high-speed service through the high-speed interface module, and the monitoring management module is used to collect the slot ID module, the high-speed interface module, and the processing module.
  • One or more output signals, and finally output monitoring and management signals which are output to the specially-designed monitoring management board in the cabinet through the power supply bus bar through the PLC or the board power supply board, or output to a monitoring board in a service board or switch board.
  • Module is
  • the power/fan module on the right side of FIG. 12 may also include a monitoring management module for collecting some management information (such as slot ID) in the board, and passing related information through the power strip of the PLC module board through the power bus. It is output to the monitoring board specially set in the cabinet or output to the monitoring management module in a service board or switch board.
  • a monitoring management module for collecting some management information (such as slot ID) in the board, and passing related information through the power strip of the PLC module board through the power bus. It is output to the monitoring board specially set in the cabinet or output to the monitoring management module in a service board or switch board.
  • each component may also include other in-board modules, and the functions of the modules may also be various. Those skilled in the art can adjust the specific examples according to the embodiments of the present invention to enable them to pass the PLC.
  • the module communicates in the form of a PLC or through other interfaces (such as fiber optic interfaces, cable interfaces, etc.).
  • an embodiment of the present invention provides a board for a communication device, where the communication device includes a container, at least one power module, at least one temperature adjustment module, and a plurality of boards including a single board;
  • the container is configured to place at least one temperature adjustment module and a plurality of single boards, wherein the container is further configured to place a power supply bus layer;
  • the power supply bus layer is connected to the at least one power module, the at least one temperature adjustment module, and the plurality of boards; at least one power source
  • the module is configured to supply power to at least one temperature adjustment module and a plurality of boards through a power supply layer;
  • the board includes:
  • the power line communication module 171 is configured to communicate with another one of the plurality of boards, at least one power module, and at least one temperature adjustment module by way of power line communication through the power communication layer;
  • the service processing module 172 is configured to communicate with another board of the plurality of boards through a data interface other than the power communication layer.
  • the communication between the power line communication module and another one of the plurality of boards, the at least one power module, and the at least one temperature adjustment module in a power line communication manner through the power supply layer includes: Board management communication for control management by another board in the board.
  • the data interface is one or more of the fiber interface and the high-speed cable interface; the data interface is disposed on the front panel of the plurality of boards.
  • the communication between the power line communication module and another one of the plurality of boards, the at least one power module, and the at least one temperature adjustment module in a power line communication manner through the power supply layer includes any one of the following combination:
  • the power line communication module is configured to perform power management communication for controlling management of at least one of the at least one power module; and the power line communication module is configured to perform temperature control management for control management of at least one of the at least one temperature adjustment module Communication.
  • the communication between the power line communication module and another one of the plurality of boards, the at least one power module, and the at least one temperature adjustment module in the power line communication manner through the power supply layer includes the following ones or Its combination:
  • the power line communication module is configured to perform power management communication for controlling management of all of the at least one power module; and the power line communication module is configured to perform temperature control management communication for controlling and managing all of the temperature adjustment modules of the at least one temperature adjustment module.
  • the single board includes a power connector 173 made of a rigid material, and the power connector is connected to the power bus layer in a pluggable manner; the power line communication module is connected to the power connector, specifically for the power connector and the plurality of singles The other board in the board communicates by power line communication through the power bus.
  • the portion of the power bus layer that is connected to the power connector has a flat structure
  • the power connector includes two elastic pieces for clamping and electrically contacting the upper and lower surfaces of the flat structure, thereby realizing a pluggable connection between the power supply and the power supply bus layer.
  • the board further includes:
  • the slot ID module includes a plurality of Boolean signal generating structures and a control circuit
  • the communication device further includes: an ID code structure member disposed in the container, the ID code structure member includes a base body and a plurality of matching members disposed on the base body and matching the Boolean signal generating structure member and conforming to a predefined coding rule; the base body Fixedly disposed in the container, the plurality of matching members are used for matching with the plurality of Boolean signal generating structures to generate a plurality of Boolean signals, and the control circuit is configured to generate the slot ID according to the generated plurality of Boolean signals.
  • each module may be specifically implemented based on various general-purpose or dedicated processing chips (such as CPU, FPGA, ASIC, etc.), which are also well-known technologies of those skilled in the art, and are not described herein again.
  • general-purpose or dedicated processing chips such as CPU, FPGA, ASIC, etc.
  • the storage medium may be a magnetic disk, an optical disk, a read-only memory (ROM), or a random access memory (RAM).

Abstract

本发明实施例公开了一种通信设备及用于该通信设备的单板，其中，通信设备包括：容器，至少一个电源模块，至少一个温度调节模块，多个单板；其中，容器用于放置至少一个温度调节模块以及多个单板；容器还用于放置电源汇流层；电源汇流层与至少一个电源模块，至少一个温度调节模块及多个单板相连；至少一个电源模块用于通过电源汇流层给至少一个温度调节模块以及多个单板供电；多个单板，至少一个电源模块和至少一个温度调节模块之间的至少一部分通信通过电源汇流层以电力线通信的方式进行。

Description

一种通信设备及用于该通信设备的单板
本申请要求于2015年1月6日提交中国专利局、申请号为CN 201510005712.7、发明名称为“一种通信设备及用于该通信设备的单板”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本发明涉及通信技术领域，尤其涉及一种通信设备及用于该通信设备的单板。
背景技术
参见图1，为现有技术一种常见通信设备的结构侧视图，该通信设备包括一个机柜，机柜中可以放置至少一个机框，每个机框都包括背板，为了工程可靠性，每个背板与机框做成一体。每个机框内可以插设多个单板，多个单板通过机框内的背板与电源及风扇相连。其中，多个单板可以包括业务板以及交换板，多个单板可以通过横插、竖插等方式插设到机框中并与背板相连，电源以及风扇也都与背板相连，多个单板之间的交互信号以及多个单板与电源及风扇交换的信号走线都设置在背板中，通过背板来完成通信。
随着对通信设备能力的要求越来越高，各个单板、电源及风扇与背板连接的引脚也越来越多，背板上的走线也越来越复杂，导致背板的设计复杂度越来越高，增加了设计成本。
发明内容
为了解决现有技术存在着的背板设计复杂度高导致设计成本增加的问题，本发明实施例提供了一种通信设备以及用于该通信设备的单板，具体的：
第一方面，本发明实施例提供了一种通信设备，包括：
容器，至少一个电源模块，至少一个温度调节模块，多个单板；其中，所述容器用于放置所述至少一个温度调节模块以及所述多个单板；
所述容器还用于放置电源汇流层；
所述电源汇流层与所述至少一个电源模块，所述至少一个温度调节模块及所述多个单板相连；
所述至少一个电源模块用于通过所述电源汇流层给所述至少一个温度调节模块以及所述多个单板供电；
所述多个单板，所述至少一个电源模块和所述至少一个温度调节模块之间的至少一部分通信通过所述电源汇流层以电力线通信的方式进行。
在第一方面的第一种可能的实现方式中，
所述多个单板，所述至少一个电源模块和所述至少一个温度调节模块之间的所述至少一部分通信包括：所述多个单板之间进行控制管理的单板管理通信。
结合第一方面，或者第一方面第一种可能的实现方式，在第二种可能的实现方式中，
所述多个单板之间业务传输相关的业务通信通过电源汇流层之外的数据接口进行。
结合第一方面第二种可能的实现方式，在第三种可能的实现方式中，
所述数据接口为光纤接口、高速电缆接口中的一个或多个；所述数据接口设置在所述多个单板的前面板。
在第一方面的第四种可能的实现方式中，
所述多个单板，所述至少一个电源模块和所述至少一个温度调节模块之间的至少一部分通信包括如下任一或其组合：
所述多个单板中的至少一个单板与所述至少一个电源模块中的至少一个电源模块进行控制管理的电源管理通信；和所述多个单板中的至少一个单板与所述至少一个温度调节模块中的至少一个温度调节模块进行控制管理的温度调节管理通信。
结合第一方面第四种可能的实现方式，在第五种可能的实现方式中，
所述多个单板，所述至少一个电源模块和所述至少一个温度调节模块之间的至少一部分通信具体包括如下任一或其组合：
所述多个单板中的至少一个单板与所述至少一个电源模块中的所有电源模块进行控制管理的电源管理通信；和所述多个单板中的至少一个单板与所述至少一个温度调节模块中的所有温度调节模块进行控制管理的温度调节管理通信。
结合第一方面，或者第一方面第一至第五种任意一种可能的实现方式，在第六种可能的实现方式中，
所述电源汇流层的导电层数量为用于提供所述多个单板电源所需的导电层的最小数量。
结合第一方面，或者第一方面第一至第六种任意一种可能的实现方式，在第七种可能的实现方式中，还包括：
由刚性材料制成的多个电源连接器，用于将所述多个单板、所述至少一个温度调节模块以及所述至少一个电源模块与所述电源汇流层通过可插拔的方式连接。
结合第一方面第七种可能的实现方式，在第八种可能的实现方式中，
所述多个单板中的每个单板，所述至少一个温度调节模块中的每个温度调节模块以及所述至少一个电源模块中的每个电源模块都包括一个所述电源连接器，通过所述电源连接器与所述电源汇流层通过可插拔的方式连接。
结合第一方面第七到第八种中任意一种可能的实现方式，在第九种可能的实现方式中，
所述电源汇流层包括至少一个长条形、且具有多个齿状突出物的电源汇流条；
所述电源连接器与所述电源汇流条上的所述齿状突出物通过可插拔的方式连接。
结合第一方面第九种可能的实现方式，在第十种可能的实现方式中，
所述电源汇流层包括多个长条形的电源汇流条，所述电源汇流层还包括至少一个导通连接件，用于导通所述多个电源汇流条上相同极性的导电层。
结合第一方面第十种可能的实现方式，在第十一种可能的实现方式中，
所述电源汇流层还包括至少一个转接连接件，所述转接连接件固定在所述电源汇流条或者所述导通连接件上，用于与所述单板或者所述电源模块或者所述温度调节模块中的电源连接器相连，使得所述单板或者所述电源模块或者所述温度调节模块能够与所述电源汇流条或者所述导通连接件电导通。
结合第一方面第七到第十一种中任意一种可能的实现方式，在第十二种可能的实现方式中，
所述电源汇流层与所述电源连接器连接的部分呈扁平状结构；
所述电源连接器包括两个弹片，所述两个弹片用于夹住并电接触所述扁平状结构的上下两个表面，从而实现所述电源连接器与所述电源汇流层之间的可插拔方式连接。
结合第一方面，或者第一方面第一至第十二种任意一种可能的实现方式，在第十三种可能的实现方式中，
所述通信设备实质上不设置传统的背板。
结合第一方面，或者第一方面第一至第十三种任意一种可能的实现方式，在第十四种可能的实现方式中，
所述通信设备所有低速通信都通过所述电源汇流层以电力线通信的方式进行通信；
所述通信设备中所有高速通信都通过支持高速通信的高速接口进行通信。
结合第一方面，或者第一方面第一至第十四种任意一种可能的实现方式，在第十五种可能的实现方式中，
所述多个单板中的至少一个单板，所述至少一个电源模块中的至少一个电源模块或者所述至少一个温度调节模块中的至少一个温度调节模块包括：槽位ID模块，所述槽位ID模块包括多个布尔信号生成结构件以及控制电路；
所述通信设备还包括：设置在所述容器中的ID编码结构件，所述ID编码结构件包括基体以及设置在所述基体上的、与所述布尔信号生成结构件相匹配的、符合预定义编码规则的多个匹配件；所述基体在所述容器中固定设置，所述多个匹配件用于与所述多个布尔信号生成结构件的匹配来生成多个布尔信号，所述控制电路用于根据生成的多个布尔信号生成槽位ID。
结合第一方面第十五种可能的实现方式，在第十六种可能的实现方式中，
所述多个匹配件位置并不固定，可通过调节所述多个匹配件中一个或多个匹配件的位置来改变编码规则。
结合第一方面第一种到第三种任意一种可能的实现方式，在第十七种可能的实现方式中，
所述多个单板，所述至少一个电源模块和所述至少一个温度调节模块之间的所述至少一部分通信还包括如下任一或其组合：
所述多个单板中的至少一个单板与所述至少一个电源模块中的至少一个电源模块进行控制管理的电源管理通信；和所述多个单板中的至少一个单板与所述至少一个温度调节模块中的至少一个温度调节模块进行控制管理的温度调节管理通信。
第二方面，本发明实施例提供了一种用于通信设备中的单板，所述通信设备包括容器，至少一个电源模块，至少一个温度调节模块，包括所述单板在内的多个单板；其中，所述容器用于放置所述至少一个温度调节模块以及所述多个单板，所述容器还用于放置电源汇流层；所述电源汇流层与所述至少一个电源模块，所述至少一个温度调节模块及所述多个单板相连；所述至少一个电源模块用于通过所述电源汇流层给所述至少一个温度调节模块以及所述多个单板供电；
所述单板包括：
电力线通信模块，用于与所述多个单板中的另一单板，所述至少一个电源模块，以及所述至少一个温度调节模块中的一个或多个，通过所述电源汇流层以电力线通信的方式进行通信；
业务处理模块，用于与所述多个单板中的另一单板通过电源汇流层之外的数据接口进行通信。
在第二方面的第一种可能的实现方式中，
所述电力线通信模块与所述多个单板中的另一单板，所述至少一个电源模块，以及所述至少一个温度调节模块中的一个或多个通过所述电源汇流层以电力线通信的方式进行的通信包括：与所述多个单板中的另一单板进行的用于控制管理的单板管理通信。
结合第二方面或者第二方面第一种可能的实现方式，在第二种可能的实现方式中，
所述数据接口为光纤接口、高速电缆接口中的一个或多个；所述数据接口设置在所述多个单板的前面板。
在第二方面的第三种可能的实现方式中，
所述电力线通信模块与所述多个单板中的另一单板，所述至少一个电源模块，以及所述至少一个温度调节模块中的一个或多个通过所述电源汇流层以电力线通信的方式进行的通信包括如下任一或其组合：
所述电力线通信模块用于对所述至少一个电源模块中的至少一个电源模块进行控制管理的电源管理通信；和所述电力线通信模块用于对所述至少一个温度调节模块中的至少一个温度调节模块进行控制管理的温度调节管理通信。
结合第二方面第三种可能的实现方式，在第四种可能的实现方式中，
所述电力线通信模块与所述多个单板中的另一单板，所述至少一个电源模块，以及所述至少一个温度调节模块中的一个或多个通过所述电源汇流层以电力线通信的方式进行的通信具体包括如下任一或其组合：
所述电力线通信模块用于对所述至少一个电源模块中的所有电源模块进行控制管理的电源管理通信；和所述电力线通信模块用于对所述至少一个温度调节模块中的所有温度调节模块进行控制管理的温度调节管理通信。
结合第二方面，或者第二方面第一至第四种任意一种可能的实现方式，在第五种可能的实现方式中，
所述单板包括由刚性材料制成的电源连接器，所述电源连接器用于与所述电源汇流层通过可插拔的方式连接；所述电力线通信模块与所述电源连接器相连，具体用于通过所述电源连接器与所述多个单板中的另一单板通过所述电源汇流层以电力线通信的方式进行通信。
结合第二方面第五种可能的实现方式，在第六种可能的实现方式中，
所述电源汇流层中与所述电源连接器连接的部分呈扁平状结构；
所述电源连接器包括两个弹片，所述两个弹片用于夹住并电接触所述扁平状结构的上下两个表面，从而实现所述电源器与所述电源汇流层之间的可插拔方式连接。
结合第二方面，或者第二方面第一至第六种任意一种可能的实现方式，在第七种可能的实现方式中，还包括：
槽位ID模块，所述槽位ID模块包括多个布尔信号生成结构件以及控制电路；
所述通信设备还包括：设置在所述容器中的ID编码结构件，所述ID编码结构件包括基体以及设置在所述基体上的、与所述布尔信号生成结构件相匹配的、符合预定义编码规则的多个匹配件；所述基体在所述容器中固定设置，所述多个匹配件用于与所述多个布尔信号生成结构件的匹配来生成多个布尔信号，所述控制电路用于根据生成的多个布尔信号生成槽位ID。
结合第二方面第一种到第二种任意一种可能的实现方式，在第八种可能的实现方式中，
所述电力线通信模块与所述多个单板中的另一单板，所述至少一个电源模块，以及所述至少一个温度调节模块中的一个或多个通过所述电源汇流层以电力线通信的方式进行的通信还包括如下任一或其组合：
所述电力线通信模块用于对所述至少一个电源模块中的至少一个电源模块进行控制管理的电源管理通信；和所述电力线通信模块用于对所述至少一个温度调节模块中的至少一个温度调节模块进行控制管理的温度调节管理通信。
本发明实施例通过将一部分通信以电力线通信的方式通过电源汇流层方式进行，从而可以降低背板的复杂度甚至可以取消背板。此外，本发明实施例中可以将电源汇流层的结构设计成非常容易与各个部件(单板、温度调节模块、电源模块)进行插拔且对容差要求低的形式(如开齿的电源汇流条通过卡接的方式与电源连接器相连)，这样在方便使用的同时，还能降低设备出问题的概率，节省了维护成本。
附图说明
为了更清楚地说明本发明实施例中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为现有技术一种通信设备的结构示意图；
图2为本发明实施例一提供的一种通信设备结构示意图；
图3为本发明实施例二提供的电源汇流层结构示意图；
图4为本发明实施例二提供的电源汇流条的截面示意图；
图5为本发明实施例二提供的导通连接件的结构示意图；
图6为本发明实施例二提供的转接连接件的结构示意图；
图7为本发明实施例二提供的电源连接器的结构示意图；
图8为本发明实施例二提供的各部件与电源汇流层连接的示意图；
图9为本发明实施例三提供的一种槽位ID模块与ID编码结构件配合的示意图；
图10A为本发明实施例三提供的一种槽位ID模块与ID编码结构件配合的示意图；
图10B为本发明实施例三提供的另一种槽位ID模块与ID编码结构件配合的示意图；
图11为本发明实施例四提供的一种单板的示意图；
图12为本发明实施例四提供的一种单板以及电源/风扇模块的示意图；
图13为本发明实施例五提供的一种单板结构示意图。
具体实施方式
为使本发明的目的、技术方案及优点更加清楚明白，以下将通过具体实施例和相关附图，对本发明作进一步详细说明。
实施例一
参见图2，本发明实施例提供了一种通信设备1，包括：
容器10，至少一个电源模块11，至少一个温度调节模块12，多个单板13，14，15；其中，温度调节模块可以是风扇、空调之类能够为设备降温的设备，在体积有限的情况下一般使用风扇模块12，如果体积不限，也不限定使用空调、水冷散热装置等设备；为了方便示意，本实施例及以下各实施例中，均以风扇模块代替温度调节模块进行说明；容器用于放置至少一个电源模块，至少一个风扇模块以及多个单板；跟现有技术中一样，容器是一种用于放置单板、风扇模块或电源模块之类的部件的承载单元，可以是现有技术常用的机框(chassis)或机柜(cabinet)。一般来讲，在通信领域，机框是比机柜要小的一种容器，各自都有相关的标准。当然，本发明实施例及其他所有实施例中，也不限定使用非标准，或者未来新标准，用来提供相似功能的其他已知或未知的实现方式。 在一些需要处理大量数据的应用场景(如数据中心)，本发明及其他所有实施例中，优选使用机柜作为容器，这样可以充分利用机柜体积的优势，承载更多的部件。
多个单板在功能类型上跟现有技术中的单板一样，例如，可以包括一个或多个交换板14、多个业务板15，或者还可以包括用于设备管理监控使用的监控板13；各个单板之间的拓扑连接关系也可以基于现有的各种连接关系，例如图2所示的星形连接，两个交换板相互备份。此外，各个单板也可以如现有技术一样采用横插、竖插等方式插设在容器中。各个单板和多个电源模块、多个风扇模块的整体位置也可以跟现有技术一致，例如，单板位于容器前侧，电源模块以及风扇模块位于容器后侧，当然，在本发明另一实施例中，也不限定一些单板以后插板的形式插设到容器中。
本发明实施例中，通信设备还包括电源汇流层16；电源汇流层16位于容器中前侧部件(如多个单板)与后侧部件(如电源模块、风扇或后插板)之间，用于连接前后侧部件。
本发明实施例中，电源汇流层16与至少一个电源模块，至少一个风扇模块多个单板相连；具体的，各个单板、各个电源模块以及各个风扇模块上都设置有电源连接器17，通过电源连接器17来实现与电源汇流层的连接；当然，本发明实施例也不限定其中一些部件(如两个风扇模块)共用一个电源连接器的场景。电源汇流层的具体结构可以多种多样，具体可以参见第二实施例中的描述。
本发明实施例中，至少一个电源模块用于通过电源汇流层给至少一个风扇模块以及多个单板供电；
多个单板之间的一部分通信通过电源汇流层以电力线通信的方式进行，另一部分通信通过不经过电源汇流层的通信通道进行。
其中，
多个单板之间通过电源汇流层以电力线通信的方式进行的一部分通信包括：多个单板之间进行控制管理的单板管理通信。本实施例及其他各实施例中，单板之间的通信是指符合一定网络拓扑关系的通信，多个单板之间进行的单板管理通信具体可以指一个单板(如具有控制功能的单板)来收集各个单板上报的各种状态信息(如收集单板温度)，并根据收集到的状态信息进行控制管理(如发现温度过高进行告警)；单板管理通信所产生的数据量一般都比较小，要求的传输速率也比较低(如几百Mbps)，一般称为“低带宽通信”或“低速通信”。通过电源汇流层以电力线通信的方式进行的通信所能达到 的带宽及传输速率能够满足这类低速率通信的要求，因此，可以让单板管理通信来通过电源汇流层以电力线通信的方式进行通信。
多个单板之间通过不经过电源汇流层的通信通道进行的另一部分通信包括：单板之间通过高速接口进行业务传输的业务通信，例如，通过光纤接口、高速电缆接口等支持高速通信的数据接口进行的业务通信，相比于单板管理通信，业务通信会产出大量的数据，要求的传输速率也比较高(如1Gbps以上)，一般称为“高带宽通信”或“高速通信”。优选地，整个通信设备实质上不设置传统的背板，这里“传统的背板”是指现有技术中由PCB实现，用于各种信号交换的背板；这里“实质上不设置”是指从系统最优化角度出发不需要设置，在一些场景中，例如，设计时出现差错后进行的弥补方案，或者，纯粹为了规避专利风险而采用的一些取劣的方案(如引出特定的一小部分信号来通过传统的背板进行连接)，虽然也可以设置传统的背板，但由于其并非从最优化的角度出发进行设置，因此，也属于“实质上不设置”的范畴。
可选地，本发明实施例中，多个单板中的至少一个单板与至少一个电源模块中的至少一个电源模块以及与至少一个风扇模块中的至少一个风扇模块之间的通信通过电源汇流层以电力线通信的方式进行通信；
其中，多个单板中的至少一个单板与至少一个电源模块中的至少一个电源模块之间的通信包括：多个单板中的至少一个单板与至少一个电源模块中的至少一个电源模块进行控制管理的电源管理通信，例如，根据系统的负载情况控制电源模块的功率输出
多个单板中的至少一个单板与至少一个风扇模块中的至少一个风扇模块之间的通信包括：多个单板中的至少一个单板与至少一个风扇模块中的至少一个风扇模块进行控制管理的风扇管理通信，例如，当监测到单板过热时，加大风扇转速。
上述电源管理通信以及风扇管理通信所产生的数据量也很小，也属于“低带宽通信”或“低速通信”。
本发明实施例中，各个部件之间的通信并不都走背板，而是一部分经过电源汇流层以电力线通信的方式进行通信，从而可以减少背板设计的复杂度，降低设计成本。
此外，在现有技术中，由于信号的增加，背板上的连接器里的信号引脚也会相应增加，如果发生某一个引脚损坏的情况，整个连接器都将不能使用；而连接器本身一般都通过压接方式固定在背板中，不支持单个更换，因此，如果要更换一个损坏的连接器时，需要更换整个背板；在更新背板时，为了保证背板安装的高精度要求，一般都需要将整 个带背板的柜框或机柜运到专业的维修部门(如生产厂家)来进行更新，从而增加了维护成本。
本发明优选的一种方案可以完全没有背板，低带宽的通信都通过电源汇流层以电力线通信的方式进行通信，高带宽的通信都通过高速通信接口进行通信，从而可以极大缓解现有技术中存在着的单板维护成本高的问题。
实施例二
基于上述实施例，本发明实施例对通信设备的硬件实现进行具体介绍。
实施例一已经介绍了电源汇流层的实现形式包括多种，本发明实施例对电源汇流层的具体形式进行介绍。本发明实施例中，电源汇流层的作用跟实施例一中的一样，用于传送电源信号以及通过电力线通信方式承载在电源信号上的其他信号，由于在物理传输时，电源信号一般只包括电源正负两个信号，因此，电源汇流层只需要提供两个导电通路即可。
参见图3，为一种电源汇流层结构示意图。本发明实施例中，电源汇流层的导电层数量为用于提供多个单板电源所需的导电层的最小数量，通常电源只包含正负两个信号，因此，只需要提供两个导电层即可。为了方便与多个部件接连及制造，电源汇流层可以包括多个电源汇流条31。参见图4，为本发明实施例电源汇流条截面示意图，主要包括上下两层导电层以及夹在中间的绝缘层，其中，上层导电层可以传输电源正极的信号，相应地，下层导电层可以用于传输电源负极信号。在材料的选择上，导电层可以使用铜、铝等各种能够导电的材料，绝缘层的材料也不限定，只需要能够将上下两层导电层进行电隔离即可，这些材料的选择为本领域技术人员所公知的技术，这里不再赘述。此外，还可以在两个导电层的表面再涂上绝缘涂料，以防止触电。
电源汇流条的平面形状并不限定，这里的“平面形状”是指忽略厚度而形成的形状。例如，平面形状可以是规则形状(如矩形、椭圆形)，或者也可以是不规则的形状(如带各个规则或不规则形状缺口的矩形等)。优选地，为了制造方便，可以选用基于矩形的形状。此外，本发明实施例对构成电源汇流条各部分结构件的高度、长度、面积等也不具体限定，只要电源汇流条能够与需要与之连接的部件(单板、电源模块、风扇模块)连接即可。
参见图3，为了方便连接固定，同时，也为了防止连接到电源汇流条的各个部件之间发生干扰以及为了提升插拔时的安全性(如减少插拔时的电弧)，电源汇流条可以设 计成齿状的结构，即每个用于与部件连接的地方两则都有空隙32，使得电源汇流条呈现具有多个齿状突出物的结构，这里称与前侧部件(如单板)连接的地方为前齿33，与后侧部件连接的地方为后齿34。为了制造方便，空隙的形状也可以选用矩形，当然，也不限定使用其他的形状。
电源汇流条的个数、位置也并不限定，具体可以根据需要连接的部件的位置以及数目而定，例如，各部件插设到机柜中后，连接器都位于同一侧，则只需要设置一个电源汇流条，所有部件通过前后插的方式连接到这个电源汇流条上；如果各部件插设到机柜后，分别位于机柜左中右三侧，则可以设置分别位于机柜左中右三侧的三个电源汇流条。
参见图3，图5电源汇流层还可以包括一个或多个导通连接件35，用于导通多个电源汇流条上相同极性的导电层，即将各个电源汇流条中的电源信号的正负极分别连通，从而形成一个统一的电源传输通道。由于只需要将各个电源汇流条的电源信号连通，因此，对导通连接件的设计要求就变得很低，可以通过各种方式来实现导通连接件。例如，最简单的是导通连接件可以是一个导电金属(如铜条)，然后通过相应的物理接口以卡接、螺丝、粘接、插接、焊接等多种各种现有连接方式与各个电源汇流条的某一个信号层(如正极)连接；此外，也可以跟电源汇流层的结构类似，包括两层相互隔离的导电层，两个导电层分别连接各个电源汇流条中对应的导电层。这些连接具体的实现方法都为本领域技术人员所公知的技术，例如，可以采用图5所示的利用螺丝固定的方式进行连接(注：图5中，电源汇流条中位于连接处周围的一层不同电极属性的导电层以及中间绝缘体被镂空，以方便拧螺丝，且不使正负信号导通)。
参见图3，电源汇流层还包括转接连接件36，转接连接件相比于电源汇流条来说体积相对较小，可通过固定或者可拆卸的方式连接在电源汇流条或者导通连接件上，与电源汇流条或导通连接件电导通，其他部件(单板、风扇模块、电源模块)可以通过连接转接连接件来实现与电源汇流层的连接。使用转接连接件的好处是使用比较灵活，例如，当某些部件插入机柜后，这些部件的连接器无法跟电源汇流条直接连接时，则可以通过转接连接件来实现间接连接。
转接连接件与电源汇流条或其他结构件的固定形式也不限定，例如，可采用图6中螺丝固定的方式进行连接(注：连接的地方也需要镂空以防止正负极信号导通)。
本发明实施例通过将电源汇流层设计成多个电源汇流条加导通连接件的形式使得电源汇流层中会有大片空的区域供后侧风扇模块吹出的风通过，并流向前侧的单板所在的区域，增加了散热效率。
本发明实施例中，各个部件(单板、电源、风扇)与电源汇流板的连接方式通过电源连接器17的方式进行。每个单板、电源模块以及风扇模块中都设置有电源连接器，通过电源连接器直接连接到电源汇流板中。
优选地，电源连接器为刚性材料制成的连接器，固定在各个部件上，当相应的部件插入到机柜时，通过电源连接器与电源汇流板连接。这里的刚性材料是指相对较硬，不易弯曲变形的材料，例如硬的金属、硬的塑料等等。在另一实施例中，也可以采用带有软性材料的连接器，这里的“带有软性材料的连接器”是指并非完全采用刚性材料的连接器，例如，使用了线缆、柔性板等相对较软的材料。使用刚性材料制成的连接器的优点是方便插拔，操作人员在插入各个部件时，只需要往电源汇流层侧用力推一下，即可将部件与电源汇流板连接；反之，拔出时反方向用力，就可以将整个部件拔出。
电源连接器与电源汇流层的物理连接方式可以通过插接、卡接等方式进行连接。基于电源汇流层如图3所示的实现方式，相应地，本发明实施例中电源连接器优选地通过卡接的方式进行连接。
参见图7，为本发明实施例电源连接器示意图，在电源连接器与电源汇流层连接的一侧包括两个具有导电能力的弹性片，分别接触电源汇流层的正负极(如夹住图3中所示的电源汇流条中齿状物的左右两侧)，同时，两个弹性片分别通过电源连接器内部的信号走线(图中未示出)引出两个引脚，与单板相连。这部分具体实现都为现有技术，这里不再赘述。采用该种方法设计的电源连接器容差能力大，降低了单板、电源以及风扇等部件拔插精度的要求，从而可以提升系统的可靠性，减少了维护成本；并且设计简单，易于实现，成本低廉。
参见图8，为本发明实施例一种具体的电源汇流层与各个部件连接关系的结构示意图。图8中，单板81通过横插的方式从机柜前侧插设到机柜中，电源模块82从机柜后面的两侧插设到机柜中，风扇模块83从机柜后侧中间插设到机柜中，针对这种情况，可以在多个单板与电源模块(或风扇模块)之间、机柜高度方向分别设置三个电源汇流条，其中，两侧电源汇流条用于连接位于机柜后侧的电源模块以及位于机柜前侧的单板，图中所示右侧的单宽单板连接图中所示的右侧的电源汇流条，如果是全宽的单板则可以选择只连接其中的一侧电源汇流条(如都连接到图中右侧或者中间或者左侧电源汇流条)。当然，上述只是一个具体的实现方式，在另一实施例中，其中一个单板也可以跟中间的电源汇流条相连，或者再设置一个或多个电源汇流条，用于连接一个或多个单板、风扇 模块或电源模块。本领域技术人员可以结合上述例子根据设需求来设计具体设计电源汇流层。
每个电源汇流条都具有齿状的结构，可以在前侧开，也可以在后侧开。图8中所示在前侧设置有前齿，用于连接位于机柜前侧的单板；后侧开有后齿，用于连接风扇模块。
为了让各个电源汇流条之间电导通，图8中设置了四个导通连接件，当然，也可以设置其他数量的导通连接件。
图8所示的电源模块使用如图7所示的电源连接器，插入机柜时，电源模块上的电源连接器的位置处于一个需要水平排列的结构件来与之连接的位置，此时，由于电源汇流条是垂直排列，无法与电源模块上的电源连接器进行卡接，因此，图8中的方案采用了通过转接连接件进行连接方案来实现与电源汇流条的间接相连。如图8、图6所示，转接连接件通过螺丝固定的方式固定在电源汇流条的一侧，并与电源模块电源连接器进行连接。
需要说明的是，上面情况都侧重于针对具有两个电源信号(正负极)的描述，在另其他实施例中，如果有三个或更多个电源信号，只需要多设置一个与前两个信号隔离信号通路，通过现有的各种连接方式实现连接即可，例如，如果有三个电源信号可以设置三排并列的导电条，每个导电条需要连接的地方设置插口，电源连接器可以设置成插头的形式通过插接的方式连接对应的插口，或者，也可以采用其他各种连接方式，这里并不限定。
此外，为了增加系统的安全性，可以通过冗余备份的方式分别设置几套独立的电源汇流层，对应地，各个部件上也需要设置相应的连接器来与这些电源汇流层连接。
单板与单板之间不通过电源汇流层的通信通道优选可以使用高速数据接口来实现，这里的“高速数据接口”是指支持高速传输的接口，例如，支持1Gbps及以上的速率，例如，使用光纤接口、高速电缆接口(也叫高速缆线接口)等高速数据接口，并配合光纤、高速电缆等传输介质来实现高速通信，这些都为现有技术，这里不在赘述。
实施例三
参见图9，基于上述各实施例，本发明实施例提供的通信设备中的每个部件(单板、电源模块、风扇模块)还包括槽位ID模块91，用于生成槽位ID。槽位ID模块的基本原理是通过的一些简单结构件911(附带一些电路)来产生0、1信号，并通过控制电路912根据产生的0、1编码组合来生成不同的槽位ID。这些简单的结构件这里称“布尔信号生成 结构件911”，例如，光耦模块，或者电信号连接器，与之对应的，本发明实施例还包括设置在容器中的ID编码结构件92，ID编码结构件包括基体921以及设置在基体上的、与布尔信号生成结构件911相匹配的、符合预定义编码规则的多个匹配件922；基体在容器中固定设置，多个匹配件922用于与多个布尔信号生成结构件911的匹配来生成多个布尔信号，控制电路用于根据生成的多个布尔信号生成槽位ID。
例如，本发明实施例中，槽位ID模块可以包括多个光耦器件，光耦器件的数量根据槽位ID需要的位数而定，例如，如果需要四位ID编码，则可以使用四个光耦器件。如图10A所示，光耦器件为现有技术中常用的一种信号检测器件，主要包括发光单元(图中未示出)，光敏单元(图中未示出)以及控制电路，当有物体插入到光耦器件的凹槽时，会挡住光耦部件发光单元和光敏单元之间的通道，控制电路就可以相应地产出一种信号(如“1”)；反之，如果没有物体挡住光耦部件发光单元和光敏单元之间的通道，控制电路会输出另一种信号(如“0”)。使用光耦器件的好处在于不需要与物体物理接触就能检测信号，不会因插拔等物理操作引起器件的损坏，可以提升系统的可靠性。
参见图10B，在另一实施例中，槽位ID模块也可以包括多个电信号连接器及对应的控制电路，电信号连接器的数量也根据槽位ID需要的位数而定。电信号连接器的工作原理跟光耦器件类似，当电导通时，产出一种信号，反之，产出另一种信号。
为了配合上述各种槽位ID模块，本发明实施例通信设备还包括ID编码结构件，ID编码结构件在与各个部件的槽位ID模块连接处设置有与槽位ID模块配合的0个、1个或多个配合件，通过这些配合件与槽位模块的配合，引起槽位ID模块信号的变化，从而输出槽位ID。
例如，如果槽位ID模块基于光耦器件实现，该配合件可以是任何能够阻挡光信号通过的不透光物体，如不透光的木板、金属、塑料等等。当要实现一个槽位的ID是“1101”，则可以设置三个分别与第一，第二以及第四个光耦器件对应的三个匹配件，当部件插入到机柜时，配合件会挡住光通路，从而引起电信号的改变，产出槽位信号。类似的，如果槽位ID模块基于电信号连接器实现，则该配合件可以是一个导电体，例如各种能导电的金属片。这些具体实现为本领域技术人员所公知的技术，这里不再赘述。
本发明实施例中，各个槽位的槽位ID可以是固定的，或者也可以灵活可配的，相应的，ID编码结构件可以采用固定的方式，或者灵活可配的方式。
其中，固定的方式是指ID编码结构件固定在机柜中，一般情况下不会去改变其位置以及形状，这样，每个槽位的槽位ID就是固定的。具体固定的方式为本领域技术人员所 公知的技术，例如，可通过各种方式固定在现有(如电源汇流条)或者新设计的一些其他结构件中，可以将ID编码结构件做成一个整体进行固定或者拆成几个部分进行分别固定等等，这里不再赘述。
采用固定方式的好处在于后续对现场安装、维持的操作人员来讲使用更加方便，操作人员不需要现场配置槽位ID，只需要将相关部件插入到机柜中，就可以得到槽位ID，使用非常方便。
灵活可配的方式是指ID编码结构件并不固定在机柜中的某个位置，体积相对较小(只需要能够与槽位ID模块配置并产生效果即可)，与槽位ID模块之间通过可插拔的方式进行连接。ID编码结构件中的匹配件可以是固定，或者可调节的(如通过前后推，或者上下翻转来隐藏及显示匹配件)，当需要将槽位ID设定成特定槽位ID时，选用特定型号的ID编码结构件或者将ID编码结构件调成跟槽位ID对应的形式，并插入到ID编码模块，以得到槽位ID。
选用灵活可配的方式优点是槽位ID并不固定，可以根据实际需要将其中一个或多个槽位的ID设置成一个特定的槽位ID。
当然，在另一实施例中也不限定将这两种方式进行结合，例如，ID编码结构件固定在机柜中，ID编码结构件中的匹配件是可调节的(如通过前后推，或者上下翻转来隐藏及显示匹配件)。可以在事先根据编码需求将这些匹配件调节成特定的槽位ID编码，默认情况下使用这种编码规则，在这种情况下，操作人员不需要手动去安装这些ID编码结构件，只需要将部件插入到机柜中即可获取槽位号。如果后续有变更编码规则的需求，则可以通过显示或隐藏相应的匹配件来改变各个槽位ID，改变完成后，后续又可以方便地通过插拔部件的简单操作来获取槽位ID。上述方法的具体实现为本领域技术人员所公知的技术，这里不再赘述。
实施例四
基于上述实施例，本发明实施例对通信设备中的各个部件进行介绍。与上述各实施例中一样，部件可以是单板，或者风扇模块，或者电源模块。
为了实现电力线通信(PLC)，每个部件40都需要有一个PLC模块41，PLC模块用于对需要往部件外传送的数据信号进行调制后通过电源汇流层进行传输，或者，将从本部件外传送过来的电源信号进行解调以获取电源信号里承载的数据信号。
参见图11，部件40还包括板内电源处理单元42，PLC模块41与板内电源处理单元42连接，并通过板内电源处理单元来跟电源汇流层信号进行交互。
板内电源处理单元包括板内电源模块421以及前端处理模块422，前端处理模块422是由一些分立的元器件(如电阻、电容、电感等)构成的一些对电源前端(指离电源汇流层最近的一端)信号进行处理的模拟电路，包括但不限于以下一种或多种电路：滤波电路、缓起电路、防雷电路、EMC防护电路。板内电源模块421用于进行电源转换，将输入的电源(如45V)转换成板内各个器件所需的电源(如12V，5V)，板内电源模块一般为相对独立，单独封装的一个在物理形态上独立的一个模块，当然，本发明实施例也不限定使用其他方式制造的板内电源模块。
PLC模块41与板内电源处理单元42连接时，具体可以连接到前端处理模块与PLC模块之间，在接收电源信号时，从前端处理模块接收电源信号，在发送电源信号时，通过前端处理模块发送电源信号。
PLC模块的具体实现(例如如何实现信号的调制、解调)为现有技术，本发明实施例不再赘述。
本发明实施例及其他各实施例中，还可以包括其他各种现有技术中存在着的模块，例如，参见图12，图12左侧的单板可以是业务板或者交换板，每个业务板或者交换板包括用于业务处理的处理模块，用于监控管理的监控管理，处理模块通过高速接口模块处理高速业务，监控管理模块用于收集槽位ID模块、高速接口模块、处理模块中的一个或多个输出的信号，最终输出监控管理信号，通过PLC、板内电源板通过电源汇流条输出给机柜中专门设置的监控管理板，或者输出给某个业务板或交换板中的监控管理模块。
类似地，图12右侧电源/风扇模块也可以包括监控管理模块，用于收集板内的一些管控管理信息(如槽位ID)，并将相关信息通过PLC模块板内电源板通过电源汇流条输出给机柜中专门设置的监控管理板，或者输出给某个业务板或交换板中的监控管理模块。
在另一实施例中，各部件也可以包括其他的板内模块，各个模块的功能也可以多样，本领域技术人员结合本发明实施例给出的具体实例进行适应性调整，使之能够通过PLC模块以PLC的方式进行通信，或者通过其他接口(如光纤接口、电缆接口等)进行通信。
实施例五
基于上述各实施例，本发明实施例提供了一种用于通信设备中的单板，通信设备包括容器，至少一个电源模块，至少一个温度调节模块，包括单板在内的多个单板；其中，容器用于放置至少一个温度调节模块以及多个单板，容器还用于放置电源汇流层；电源汇流层与至少一个电源模块，至少一个温度调节模块及多个单板相连；至少一个电源模块用于通过电源汇流层给至少一个温度调节模块以及多个单板供电；
单板包括：
电力线通信模块171，用于与多个单板中的另一单板，至少一个电源模块，以及至少一个温度调节模块中的一个或多个，通过电源汇流层以电力线通信的方式进行通信；
业务处理模块172，用于与多个单板中的另一单板通过电源汇流层之外的数据接口进行通信。
本发明实施例中，
电力线通信模块与多个单板中的另一单板，至少一个电源模块，以及至少一个温度调节模块中的一个或多个通过电源汇流层以电力线通信的方式进行的通信包括：与多个单板中的另一单板进行的用于控制管理的单板管理通信。
本发明实施例中，
数据接口为光纤接口、高速电缆接口中的一个或多个；数据接口设置在多个单板的前面板。
本发明实施例中，
电力线通信模块与多个单板中的另一单板，至少一个电源模块，以及至少一个温度调节模块中的一个或多个通过电源汇流层以电力线通信的方式进行的通信包括如下任一或其组合：
电力线通信模块用于对至少一个电源模块中的至少一个电源模块进行控制管理的电源管理通信；和电力线通信模块用于对至少一个温度调节模块中的至少一个温度调节模块进行控制管理的温度调节管理通信。
本发明实施例中，
电力线通信模块与多个单板中的另一单板，至少一个电源模块，以及至少一个温度调节模块中的一个或多个通过电源汇流层以电力线通信的方式进行的通信具体包括如下任一或其组合：
电力线通信模块用于对至少一个电源模块中的所有电源模块进行控制管理的电源管理通信；和电力线通信模块用于对至少一个温度调节模块中的所有温度调节模块进行控制管理的温度调节管理通信。
本发明实施例中，
单板包括由刚性材料制成的电源连接器173，电源连接器用于与电源汇流层通过可插拔的方式连接；电力线通信模块与电源连接器相连，具体用于通过电源连接器与多个单板中的另一单板通过电源汇流层以电力线通信的方式进行通信。
本发明实施例中，
电源汇流层中与电源连接器连接的部分呈扁平状结构；
电源连接器包括两个弹片，两个弹片用于夹住并电接触扁平状结构的上下两个表面，从而实现电源器与电源汇流层之间的可插拔方式连接。
本发明实施例中，单板还包括：
槽位ID模块，槽位ID模块包括多个布尔信号生成结构件以及控制电路；
通信设备还包括：设置在容器中的ID编码结构件，ID编码结构件包括基体以及设置在基体上的、与布尔信号生成结构件相匹配的、符合预定义编码规则的多个匹配件；基体在容器中固定设置，多个匹配件用于与多个布尔信号生成结构件的匹配来生成多个布尔信号，控制电路用于根据生成的多个布尔信号生成槽位ID。
本发明实施例中各个模块具体介绍可以参见上述各个实施例中的相关章节，这里不再赘述。
此外，各个模块具体可以基于各种通用或者专用的处理芯片(如CPU、FPGA、ASIC等来实现)，这些也为本领域技术人员公知的技术，这里也不再赘述。
本领域普通技术人员可以理解实现上述实施例方法中的全部或部分流程，是可以通过计算机程序来指令相关的硬件来完成，所述的程序可存储于一计算机可读取存储介质中，该程序在执行时，可包括如上述各方法的实施例的流程。其中，所述的存储介质可为磁碟、光盘、只读存储记忆体(Read-Only Memory，ROM)或随机存储记忆体(Random Access Memory，RAM)等。
上列较佳实施例，对本发明的目的、技术方案和优点进行了进一步详细说明，所应理解的是，以上所述仅为本发明的较佳实施例而已，并不用以限制本发明，凡在本发明的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本发明的保护范围之内。

Claims (25)

  1. 一种通信设备，其特征在于，包括：
    容器，至少一个电源模块，至少一个温度调节模块，多个单板；其中，所述容器用于放置所述至少一个温度调节模块以及所述多个单板；
    所述容器还用于放置电源汇流层；
    所述电源汇流层与所述至少一个电源模块，所述至少一个温度调节模块及所述多个单板相连；
    所述至少一个电源模块用于通过所述电源汇流层给所述至少一个温度调节模块以及所述多个单板供电；
    所述多个单板，所述至少一个电源模块和所述至少一个温度调节模块之间的至少一部分通信通过所述电源汇流层以电力线通信的方式进行。
  2. 如权利要求1所述的通信设备，其特征在于：
    所述多个单板，所述至少一个电源模块和所述至少一个温度调节模块之间的所述至少一部分通信包括：所述多个单板之间进行控制管理的单板管理通信。
  3. 如权利要求1或2所述的通信设备，其特征在于：
    所述多个单板之间业务传输相关的业务通信通过电源汇流层之外的数据接口进行。
  4. 如权利要求3所述的通信设备，其特征在于：
    所述数据接口为光纤接口、高速电缆接口中的一个或多个；所述数据接口设置在所述多个单板的前面板。
  5. 如权利要求1所述的通信设备，其特征在于：
    所述多个单板，所述至少一个电源模块和所述至少一个温度调节模块之间的至少一部分通信包括如下任一或其组合：
    所述多个单板中的至少一个单板与所述至少一个电源模块中的至少一个电源模块进行控制管理的电源管理通信；和所述多个单板中的至少一个单板与所述至少一个温度调节模块中的至少一个温度调节模块进行控制管理的温度调节管理通信。
  6. 如权利要求5所述的通信设备，其特征在于：
    所述多个单板，所述至少一个电源模块和所述至少一个温度调节模块之间的至少一部分通信具体包括如下任一或其组合：
    所述多个单板中的至少一个单板与所述至少一个电源模块中的所有电源模块进行控制管理的电源管理通信；和所述多个单板中的至少一个单板与所述至少一个温度调节模块中的所有温度调节模块进行控制管理的温度调节管理通信。
  7. 如权利要求1-6任一所述的通信设备，其特征在于：
    所述电源汇流层的导电层数量为用于提供所述多个单板电源所需的导电层的最小数量。
  8. 如权利要求1-7任一所述的通信设备，其特征在于，还包括：
    由刚性材料制成的多个电源连接器，用于将所述多个单板、所述至少一个温度调节模块以及所述至少一个电源模块与所述电源汇流层通过可插拔的方式连接。
  9. 如权利要求8所述的通信设备，其特征在于：
    所述多个单板中的每个单板，所述至少一个温度调节模块中的每个温度调节模块以及所述至少一个电源模块中的每个电源模块都包括一个所述电源连接器，通过所述电源连接器与所述电源汇流层通过可插拔的方式连接。
  10. 如权利要求8-9任一所述的通信设备，其特征在于：
    所述电源汇流层包括至少一个长条形、且具有多个齿状突出物的电源汇流条；
    所述电源连接器与所述电源汇流条上的所述齿状突出物通过可插拔的方式连接。
  11. 如权利要求10所述的通信设备，其特征在于：
    所述电源汇流层包括多个长条形的电源汇流条，所述电源汇流层还包括至少一个导通连接件，用于导通所述多个电源汇流条上相同极性的导电层。
  12. 如权利要求11所述的通信设备，其特征在于：
    所述电源汇流层还包括至少一个转接连接件，所述转接连接件固定在所述电源汇流条或者所述导通连接件上，用于与所述单板或者所述电源模块或者所述温度调节模块中的电源连接器相连，使得所述单板或者所述电源模块或者所述温度调节模块能够与所述电源汇流条或者所述导通连接件电导通。
  13. 如权利要求8-12任一所述的通信设备，其特征在于：
    所述电源汇流层与所述电源连接器连接的部分呈扁平状结构；
    所述电源连接器包括两个弹片，所述两个弹片用于夹住并电接触所述扁平状结构的上下两个表面，从而实现所述电源连接器与所述电源汇流层之间的可插拔方式连接。
  14. 如权利要求1-13任一所述的通信设备，其特征在于：
    所述通信设备实质上不设置传统的背板。
  15. 如权利要求1-14任一所述的通信设备，其特征在于：
    所述通信设备所有低速通信都通过所述电源汇流层以电力线通信的方式进行通信；
    所述通信设备中所有高速通信都通过支持高速通信的高速接口进行通信。
  16. 如权利要求1-15任一所述的通信设备，其特征在于：
    所述多个单板中的至少一个单板，所述至少一个电源模块中的至少一个电源模块或者所述至少一个温度调节模块中的至少一个温度调节模块包括：槽位ID模块，所述槽位ID模块包括多个布尔信号生成结构件以及控制电路；
    所述通信设备还包括：设置在所述容器中的ID编码结构件，所述ID编码结构件包括基体以及设置在所述基体上的、与所述布尔信号生成结构件相匹配的、符合预定义编码规则的多个匹配件；所述基体在所述容器中固定设置，所述多个匹配件用于与所述多个布尔信号生成结构件的匹配来生成多个布尔信号，所述控制电路用于根据生成的多个布尔信号生成槽位ID。
  17. 如权利要求16所述的通信设备，其特征在于：
    所述多个匹配件位置并不固定，可通过调节所述多个匹配件中一个或多个匹配件的位置来改变编码规则。
  18. 一种用于通信设备中的单板，其特征在于，所述通信设备包括容器，至少一个电源模块，至少一个温度调节模块，包括所述单板在内的多个单板；其中，所述容器用于放置所述至少一个温度调节模块以及所述多个单板，所述容器还用于放置电源汇流层；所述电源汇流层与所述至少一个电源模块，所述至少一个温度调节模块及所述多个单板相连；所述至少一个电源模块用于通过所述电源汇流层给所述至少一个温度调节模块以及所述多个单板供电；
    所述单板包括：
    电力线通信模块，用于与所述多个单板中的另一单板，所述至少一个电源模块，以及所述至少一个温度调节模块中的一个或多个，通过所述电源汇流层以电力线通信的方式进行通信；
    业务处理模块，用于与所述多个单板中的另一单板通过电源汇流层之外的数据接口进行通信。
  19. 如权利要求18所述的单板，其特征在于：
    所述电力线通信模块与所述多个单板中的另一单板，所述至少一个电源模块，以及所述至少一个温度调节模块中的一个或多个通过所述电源汇流层以电力线通信的方式进行的通信包括：与所述多个单板中的另一单板进行的用于控制管理的单板管理通信。
  20. 如权利要求18-19任一所述的单板，其特征在于：
    所述数据接口为光纤接口、高速电缆接口中的一个或多个；所述数据接口设置在所述多个单板的前面板。
  21. 如权利要求18所述的单板，其特征在于：
    所述电力线通信模块与所述多个单板中的另一单板，所述至少一个电源模块，以及所述至少一个温度调节模块中的一个或多个通过所述电源汇流层以电力线通信的方式进行的通信包括如下任一或其组合：
    所述电力线通信模块用于对所述至少一个电源模块中的至少一个电源模块进行控制管理的电源管理通信；和所述电力线通信模块用于对所述至少一个温度调节模块中的至少一个温度调节模块进行控制管理的温度调节管理通信。
  22. 如权利要求21所述的单板，其特征在于：
    所述电力线通信模块与所述多个单板中的另一单板，所述至少一个电源模块，以及所述至少一个温度调节模块中的一个或多个通过所述电源汇流层以电力线通信的方式进行的通信具体包括如下任一或其组合：
    所述电力线通信模块用于对所述至少一个电源模块中的所有电源模块进行控制管理的电源管理通信；和所述电力线通信模块用于对所述至少一个温度调节模块中的所有温度调节模块进行控制管理的温度调节管理通信。
  23. 如权利要求18-22任一所述的单板，其特征在于：
    所述单板包括由刚性材料制成的电源连接器，所述电源连接器用于与所述电源汇流层通过可插拔的方式连接；所述电力线通信模块与所述电源连接器相连，具体用于通过所述电源连接器与所述多个单板中的另一单板通过所述电源汇流层以电力线通信的方式进行通信。
  24. 如权利要求23所述的单板，其特征在于：
    所述电源汇流层中与所述电源连接器连接的部分呈扁平状结构；
    所述电源连接器包括两个弹片，所述两个弹片用于夹住并电接触所述扁平状结构的上下两个表面，从而实现所述电源器与所述电源汇流层之间的可插拔方式连接。
  25. 如权利要求18-24任一所述的单板，其特征在于，还包括：
    槽位ID模块，所述槽位ID模块包括多个布尔信号生成结构件以及控制电路；
    所述通信设备还包括：设置在所述容器中的ID编码结构件，所述ID编码结构件包括基体以及设置在所述基体上的、与所述布尔信号生成结构件相匹配的、符合预定义编码规则的多个匹配件；所述基体在所述容器中固定设置，所述多个匹配件用于与所述多个布尔信号生成结构件的匹配来生成多个布尔信号，所述控制电路用于根据生成的多个布尔信号生成槽位ID。
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CN104582449A (zh) 2015-04-29
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