CN102215628B - 一种超厚电路板 - Google Patents
一种超厚电路板 Download PDFInfo
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- CN102215628B CN102215628B CN 201110055822 CN201110055822A CN102215628B CN 102215628 B CN102215628 B CN 102215628B CN 201110055822 CN201110055822 CN 201110055822 CN 201110055822 A CN201110055822 A CN 201110055822A CN 102215628 B CN102215628 B CN 102215628B
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- circuit board
- sub
- speed signal
- super thick
- hot pressing
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- 238000007731 hot pressing Methods 0.000 claims description 23
- 239000000463 material Substances 0.000 claims description 11
- 238000013213 extrapolation Methods 0.000 claims description 5
- 238000003825 pressing Methods 0.000 claims description 4
- 238000004891 communication Methods 0.000 claims description 2
- 238000012545 processing Methods 0.000 abstract description 6
- 238000000034 method Methods 0.000 description 5
- 238000009713 electroplating Methods 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000012141 concentrate Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000011148 porous material Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000021615 conjugation Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000002648 laminated material Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
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Abstract
Description
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN 201110055822 CN102215628B (zh) | 2011-03-09 | 2011-03-09 | 一种超厚电路板 |
Applications Claiming Priority (1)
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CN 201110055822 CN102215628B (zh) | 2011-03-09 | 2011-03-09 | 一种超厚电路板 |
Publications (2)
Publication Number | Publication Date |
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CN102215628A CN102215628A (zh) | 2011-10-12 |
CN102215628B true CN102215628B (zh) | 2013-07-10 |
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CN 201110055822 Expired - Fee Related CN102215628B (zh) | 2011-03-09 | 2011-03-09 | 一种超厚电路板 |
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CN (1) | CN102215628B (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107360693B (zh) * | 2015-01-06 | 2022-02-18 | 华为技术有限公司 | 一种通信设备及用于该通信设备的单板 |
CN204761835U (zh) * | 2015-06-10 | 2015-11-11 | 中兴通讯股份有限公司 | 一种单板 |
CN105636367A (zh) * | 2016-03-07 | 2016-06-01 | 胜宏科技(惠州)股份有限公司 | 一种混合材料线路板压合方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1434674A (zh) * | 2001-12-28 | 2003-08-06 | 全懋精密科技股份有限公司 | 以预浸基材作为粘着层制作多层电路板的方法 |
CN1556666A (zh) * | 2004-01-12 | 2004-12-22 | 友达光电股份有限公司 | 防止热膨胀效应累加的平面显示器及其印刷电路板 |
CN1567075A (zh) * | 2003-06-20 | 2005-01-19 | 友达光电股份有限公司 | 液晶显示器模块及其印刷电路板 |
CN101026427A (zh) * | 2006-02-17 | 2007-08-29 | 中兴通讯股份有限公司 | 实现多路低速信号与一路高速信号双向转换的装置及方法 |
CN101711090A (zh) * | 2009-12-07 | 2010-05-19 | 昆山市线路板厂 | 一种双面镂空挠性电路板的制造方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060112538A1 (en) * | 2003-12-01 | 2006-06-01 | Antig Technology Co, Ltd. | Layer lamination integrated direct methanol fuel cell and a method of fabricating the same |
CN1852633A (zh) * | 2005-11-21 | 2006-10-25 | 华为技术有限公司 | 一种可实现高速信号传输的印制电路板及制作方法 |
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2011
- 2011-03-09 CN CN 201110055822 patent/CN102215628B/zh not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1434674A (zh) * | 2001-12-28 | 2003-08-06 | 全懋精密科技股份有限公司 | 以预浸基材作为粘着层制作多层电路板的方法 |
CN1567075A (zh) * | 2003-06-20 | 2005-01-19 | 友达光电股份有限公司 | 液晶显示器模块及其印刷电路板 |
CN1556666A (zh) * | 2004-01-12 | 2004-12-22 | 友达光电股份有限公司 | 防止热膨胀效应累加的平面显示器及其印刷电路板 |
CN101026427A (zh) * | 2006-02-17 | 2007-08-29 | 中兴通讯股份有限公司 | 实现多路低速信号与一路高速信号双向转换的装置及方法 |
CN101711090A (zh) * | 2009-12-07 | 2010-05-19 | 昆山市线路板厂 | 一种双面镂空挠性电路板的制造方法 |
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CN102215628A (zh) | 2011-10-12 |
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Effective date of registration: 20160113 Address after: 224500 Jiangsu Jiangsu Binhai Economic Development Zone Yancheng City coastal industrial park north of Zhongshan Road Province Patentee after: JIANGSU KELI NEW MATERIAL CO., LTD. Address before: 518129 Nanshan District Nanshan digital cultural industry base, east block, Guangdong, Shenzhen 407 Patentee before: Shenzhen LIAN intellectual property service center |
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