WO2016103844A1

WO2016103844A1 - Resin composition, color filter and method for producing same, and image display element

Info

Publication number: WO2016103844A1
Application number: PCT/JP2015/078473
Authority: WO
Inventors: 正義柳; 恭章川口; 健宏木下; 坂本　淳; 拓樹倉本
Original assignee: 昭和電工株式会社
Priority date: 2014-12-25
Filing date: 2015-10-07
Publication date: 2016-06-30
Also published as: CN107108769B; KR101918433B1; KR20170097757A; JPWO2016103844A1; TWI600970B; TW201631396A; CN107108769A

Abstract

A resin composition comprising (A) an epoxy group- and acid group-containing resin, (B) a polybasic acid monoester of a hydroxyl group-containing polyfunctional (meth)acrylate, and (C) a solvent, wherein an epoxy group is contained in an amount of 0.5 to 3.0 moles per 1 mole of an acid group in the epoxy group- and acid group-containing resin (A).

Description

Resin composition, color filter, method for producing the same, and image display element

The present invention relates to a resin composition, a color filter, a manufacturing method thereof, and an image display element.

The color filter generally includes a transparent substrate such as a glass substrate, red (R), green (G) and blue (B) pixels formed on the transparent substrate, a black matrix formed at the pixel boundary, It is comprised from the protective film formed on a pixel and a black matrix. A color filter having such a configuration is usually manufactured by sequentially forming a black matrix, a pixel, and a protective film on a transparent substrate. Various methods have been proposed as a method for forming a pixel and a black matrix (hereinafter, the pixel and the black matrix are referred to as a “colored pattern”). However, application of a photosensitive resin composition as a resist, exposure, A pigment / dye dispersion method using photolithography in which development and baking are repeated is the current mainstream.

Generally, a photosensitive resin composition used for photolithography contains an alkali-soluble resin, a reactive diluent, a photopolymerization initiator, a colorant, and a solvent. The pigment / dye dispersion method has the advantage of being able to form a colored pattern that is excellent in durability such as light resistance and heat resistance and has few defects such as pinholes, but the black matrix, R, G, and B patterns. Since the protective film is repeatedly formed, the cured coating film is required to have high solvent resistance.

Therefore, for example, methods for improving solvent resistance using a copolymer having an epoxy group or oxetanyl group and a carboxyl group or a phenolic hydroxyl group (Patent Documents 1 and 2) and an oxadi having a trihalomethyl group as a polymerization initiator A method (Patent Document 3) for improving solvent resistance using a molecule containing a molecule having an azole structure or a triazine structure has been proposed.
In addition, in order to improve the color reproduction characteristics of the color filter, it is necessary to increase the content of the colorant to be blended or to increase the film thickness. However, these simultaneously reduce sensitivity, developability, etc. Therefore, further performance improvement is required (Patent Document 4).

Japanese Patent Application Laid-Open No. 2012-22048 JP 2013-25203 A JP 2003-330184 A JP 2014-164021 A

However, the conventional photosensitive resin composition may not have sufficient sensitivity and developability, or a cured coating film having excellent solvent resistance may not be obtained.
Accordingly, the present invention has been made to solve the above-described problems, and provides a resin composition that provides a cured coating film having good sensitivity and developability and excellent solvent resistance. With the goal. Moreover, an object of this invention is to provide the color filter which has a coloring pattern which consists of a cured coating film excellent in solvent resistance.

That is, the present invention is shown by the following [1] to [14].
[1] A resin composition comprising an epoxy group- and acid group-containing resin (A), a polybasic acid monoester (B) of a hydroxyl group-containing polyfunctional (meth) acrylate, and a solvent (C), A resin composition characterized in that the epoxy group is 0.5 to 3.0 mol per 1 mol of the acid group in the epoxy group and acid group-containing resin (A).
[2] Containing a monomer unit derived from the monomer (a-1) having an ethylenic carbon-carbon double bond and an epoxy group in one molecule as constituent monomer units of the epoxy group- and acid group-containing resin (A) The resin composition according to [1].
[3] The resin composition according to [1] or [2], which contains a monomer unit derived from an unsaturated carboxylic acid (a-2) as a constituent monomer unit of the epoxy group- and acid group-containing resin (A).
[4] The epoxy group- and acid group-containing resin (A) is a part of the carboxyl group derived from the unsaturated carboxylic acid (a-2), a functional group that reacts with the carboxyl group, and an ethylenic carbon-carbon double The resin composition according to [3], comprising a constituent monomer unit having an ethylenic carbon-carbon double bond to which a monomer (a-3) having a bond in one molecule is added.
[5] The resin composition according to [2], wherein the monomer (a-1) having an ethylenic carbon-carbon double bond and an epoxy group in one molecule is an epoxy group-containing (meth) acrylate.
[6] The monomer (a-3) having in one molecule a functional group that reacts with the carboxyl group and an ethylenic carbon-carbon double bond is an epoxy group-containing (meth) acrylate and isocyanato group-containing (meth) acrylate. The resin composition according to [4], which is one or more selected from the group consisting of:
[7] The polybasic acid monoester (B) of the hydroxyl group-containing polyfunctional (meth) acrylate is a dibasic acid monoester of pentaerythritol, a dibasic acid monoester of tri (meth) acrylate, dipentaerythritol di, tri, tetra, or The resin composition according to any one of [1] to [6], which is one or more selected from the group consisting of polybasic acid monoesters of penta (meth) acrylate.
[8] The resin composition according to any one of [1] to [7], wherein the epoxy group- and acid group-containing resin (A) has an acid value of 10 to 350 mgKOH / g.
[9] The resin composition according to any one of [1] to [8], further containing a photopolymerization initiator (D).
[10] The resin composition according to any one of [1] to [9], further containing a colorant (E).
[11] The resin composition according to [10], wherein the colorant (E) is at least one selected from the group consisting of a dye and a pigment.
[12] A color filter having a colored pattern comprising a cured coating film of the resin composition according to [10] or [11].
[13] An image display device comprising the color filter according to [12].
[14] Applying the resin composition according to [10] or [11] on a substrate, exposing and developing with an alkaline aqueous solution, and baking at a temperature of 215 ° C. or lower to form a colored pattern A method for producing a color filter.

According to the present invention, it is possible to provide a resin composition capable of forming a cured coating film having good sensitivity and developability and excellent solvent resistance. Further, a cured coating film in a state after exposure and before baking formed from the resin composition of the present invention has extremely high utility value in various resist fields because it has developability, and particularly in a cured coating state after baking. Since the film is excellent in solvent resistance, it is useful for forming a colored pattern of a color filter.

It is sectional drawing of the color filter which is one Embodiment of this invention.

The resin composition of the present invention contains an epoxy group- and acid group-containing resin (A), a polybasic acid monoester (B) of a hydroxyl group-containing polyfunctional (meth) acrylate, and a solvent (C), and an epoxy group. In addition, the epoxy group is 0.5 to 3.0 mol with respect to 1 mol of the acid group in the acid group-containing resin (A).

In the present invention, “(meth) acrylate” means at least one selected from methacrylate and acrylate. The same applies to “(meth) acrylic acid”.

The epoxy group and acid group-containing resin (A) used in the present invention has an epoxy group and an acid group in the resin, and the epoxy group is 0.5 to 3.0 per mol of the acid group in the resin. There is no particular limitation as long as it exists in a molar amount. The acid group is not particularly limited, and usually includes a carboxyl group (—COOH), a phospho group (—PO (OH) ₂ ), a sulfo group (—SO ₃ H) and the like. From the viewpoint of curability of the resin composition of the present invention, a carboxyl group is preferred. From the viewpoints of easy availability of raw materials, ease of production of the epoxy group- and acid group-containing resin (A), and improvement of solvent resistance when the resin composition of the present invention is cured, ethylenic carbon-carbon as a constituent monomer unit. A resin containing a monomer unit derived from the monomer (a-1) having a heavy bond and an epoxy group in one molecule is preferable. From the viewpoint of developability, an unsaturated carboxylic acid (a-2 It is more preferable that the resin further contains a monomer unit derived from. In addition, the number of moles of the epoxy group with respect to 1 mole of the acid group of the epoxy group and the acid group-containing resin (A) can be calculated from the charging ratio of the constituent monomer when the kind and mole ratio of the constituent monomer are known. it can. When calculating the number of moles of the epoxy group relative to 1 mole of the acid group from the epoxy group and acid group-containing resin (A) after the synthesis, the epoxy equivalent measured according to JIS K 7236 and the measurement according to JIS K 0070. Calculated from the acid value.

The monomer (a-1) is preferably an epoxy group-containing (meth) acrylate from the viewpoint of ease of production of the epoxy group- and acid group-containing resin (A). Specific examples of the monomer (a-1) include glycidyl (meth) acrylate, 3,4-epoxycyclohexylmethyl (meth) acrylate having an alicyclic epoxy group, and a lactone adduct thereof (eg, a cyclomer manufactured by Daicel Corporation). (Registered trademark) A200, M100), mono (meth) acrylate of 3,4-epoxycyclohexylmethyl-3 ′, 4′-epoxycyclohexanecarboxylate, epoxidized product of dicyclopentenyl (meth) acrylate, dicyclopentenyl An epoxidized product of oxyethyl (meth) acrylate is exemplified. Among these, glycidyl (meth) acrylate is particularly preferred from the viewpoint of availability and reactivity.

Specific examples of the unsaturated carboxylic acid (a-2) include (meth) acrylic acid, crotonic acid, cinnamic acid, itaconic acid, maleic acid, fumaric acid, vinyl sulfonic acid, 2- (meth) acryloyloxyethyl succinic acid 2-acryloyloxyethyl phthalic acid, 2- (meth) acryloyloxyethyl hexahydrophthalic acid, and the like. From the viewpoint of obtaining raw materials, (meth) acrylic acid and crotonic acid are preferable, and (meth) acrylic acid is more preferable.

The epoxy group and acid group-containing resin (A) used in the present invention contains monomer units derived from radically polymerizable monomers other than monomer (a-1) and unsaturated carboxylic acid (a-2) as constituent monomer units. May be. Specific examples of the monomer capable of radical polymerization other than the monomer (a-1) and the unsaturated carboxylic acid (a-2) include 2- (meth) acryloyloxyethyl acid phosphate, dienes such as butadiene; methyl (meth) Acrylate, isopropyl (meth) acrylate, pentyl (meth) acrylate, benzyl (meth) acrylate, isoamyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, dodecyl (meth) acrylate, cyclohexyl (meth) acrylate, 1,4- Cyclohexanedimethanol mono (meth) acrylate, rosin (meth) acrylate, norbornyl (meth) acrylate, allyl (meth) acrylate, tetrahydrofurfuryl (meth) acrylate, 1,1,1-trifluoroethyl (Meth) acrylate, perfluoroethyl (meth) acrylate, triphenylmethyl (meth) acrylate, cumyl (meth) acrylate, 3- (N, N-dimethylamino) propyl (meth) acrylate, glycerol mono (meth) acrylate, pentane (Meth) acrylic acid esters such as triol mono (meth) acrylate, dicyclopentanyl (meth) acrylate, isobornyl (meth) acrylate, adamantyl (meth) acrylate, naphthalene (meth) acrylate; and norbornene (bicyclo [2 2.1] hept-2-ene), 5-methylbicyclo [2.2.1] hept-2-ene, 5-ethylbicyclo [2.2.1] hept-2-ene, tetracyclo [4. 4.0.1 ^2,5 . 1 ^7,10 ] dodec-3-ene, dicyclopentadiene, tricyclo [5.2.1.0 ^2,6 ] dec-8-ene, tetracyclo [4.4.0.1 ^2,5 . 1 ^7,10 . 0 ^1,6 ] dodec-3-ene, pentacyclo [6.5.1.1 ^3,6 . 0 ^2,7 . 0 ^9,13] pentadeca-4-ene, 5-norbornene-2-carboxylic acid, 5-norbornene-2,3-dicarboxylic acid anhydride, (meth) acrylic acid amide, (meth) acrylic acid N, N-diethylamide , (Meth) acrylic acid anthracenyl amide, (meth) acryl morpholine, (meth) acrylic amides such as diacetone (meth) acrylamide, (meth) acrylic acid anilide, (meth) acryloylnitrile, acrolein, chloride Vinyl compounds such as vinyl, vinylidene chloride, vinyl fluoride, vinylidene fluoride, N-vinyl pyrrolidone, vinyl pyridine, vinyl acetate, vinyl toluene; styrene, α-, o-, m-, p-alkyl, nitro of styrene, Cyano, amide derivatives; Unsaturation such as diethyl citraconic acid and diethyl maleate Diesters carboxylic acid; N- phenylmaleimide, mono- maleimides such as N- cyclohexyl maleimide; maleic acid, an unsaturated polybasic acid anhydride such as itaconic anhydride. These can be used alone or in combination of two or more. Among them, from the viewpoint of heat resistance and transparency, benzyl (meth) acrylate, dicyclopentanyl (meth) acrylate, styrene, vinyltoluene, isobornyl (meth) acrylate, adamantyl (meth) acrylate, norbornene, N- Isopropyl (meth) acrylamide, (meth) acryl morpholine, and diacetone (meth) acrylamide are preferred, benzyl (meth) acrylate, dicyclopentanyl (meth) acrylate, styrene, vinyltoluene, isobornyl (meth) acrylate, adamantyl (Meth) acrylate and norbornene are more preferred.

The blending ratio of the monomer (a-1) is not particularly limited as long as the epoxy group is present in an amount of 0.5 to 3.0 moles per mole of the acid group in the epoxy group and acid group-containing resin (A) The amount is preferably 40 to 90 mol%, more preferably 50 to 90 mol%, still more preferably 60 to 80 mol%, based on the total of the constituent monomers of the epoxy group and acid group-containing resin (A). . When the blending ratio of the monomer (a-1) is 40 to 90 mol%, the developability is good and sufficient solvent resistance is obtained.

The blending ratio of the unsaturated carboxylic acid (a-2) is not particularly limited as long as 0.5 to 3.0 mol of epoxy groups are present per 1 mol of acid groups in the epoxy group and acid group-containing resin (A). However, it is preferably 10 to 60 mol%, more preferably 10 to 50 mol%, still more preferably 20 to 40 mol based on the total of the constituent monomers of the epoxy group and acid group-containing resin (A). %. When the blending ratio of the unsaturated carboxylic acid (a-2) is 10 to 60 mol%, the developability is good and sufficient solvent resistance is obtained.

When a radically polymerizable monomer other than the monomer (a-1) and the unsaturated carboxylic acid (a-2) is used, the mixing ratio is not particularly limited, but the constituent monomer of the epoxy group- and acid group-containing resin (A) Preferably, it is more than 0 mol% and 50 mol% or less, and more preferably more than 0 mol% and 40 mol% or less.

40 to 90 mol% of monomer units derived from monomer (a-1) and monomer units derived from unsaturated carboxylic acid (a-2) with respect to the total of constituent monomer units of epoxy group and acid group-containing resin (A) Is more preferably 10 to 60 mol%, the monomer unit derived from the monomer (a-1) is 60 to 80 mol%, and the monomer unit derived from the unsaturated carboxylic acid (a-2) is 20 to 40 mol%. It is more preferable to contain.

The copolymerization reaction for producing the epoxy group- and acid group-containing resin (A) can be performed according to a radical polymerization method known in the art. For example, monomer (a-1), unsaturated carboxylic acid (a-2), and a monomer (optional component) capable of radical polymerization other than monomer (a-1) and unsaturated carboxylic acid (a-2) are used as a solvent. After dissolution, a polymerization initiator may be added to the solution and reacted at 50 to 130 ° C. for 1 to 20 hours. By this copolymerization reaction, a random copolymer having a monomer unit ratio substantially equal to the monomer mixing ratio is obtained.

Examples of the solvent that can be used for the copolymerization reaction include ethylene glycol monomethyl ether, triethylene glycol monomethyl ether, polyethylene glycol monomethyl ether, ethylene glycol monoethyl ether, diethylene glycol monoisopropyl ether, ethylene glycol monobutyl ether, and diethylene glycol monomethyl ether. Hexyl ether, ethylene glycol mono 2-ethylhexyl ether, ethylene glycol monoallyl ether, ethylene glycol monophenyl ether, diethylene glycol monobenzyl ether, ethylene glycol monoethyl ether acetate, propylene glycol monomethyl ether, propylene glycol monopropyl ether, propylene glycol mono Chill ether acetate, ethylene glycol dimethyl ether, diethylene glycol methyl ethyl ether, and dipropylene glycol dimethyl ether. These can be used alone or in combination of two or more.

Although the moisture content of a solvent is not specifically limited, It is preferable that it is 1 mass% or less. When the water content is 1% by mass or less, an epoxy group- and acid group-containing resin (A) having better solvent resistance can be obtained. The water content of the solvent can be measured by the Karl Fischer method under the following conditions.
Apparatus: Kyoto Electronics Industry Co., Ltd., KF moisture meter MKA-520
Injection volume: 1 mL
Titration solution: Aquamicron (registered trademark) titrant SS3 mg (manufactured by API Corporation)
Electrode solution: Aquamicron (registered trademark) dehydrated solvent PP (manufactured by API Corporation)

The blending amount of the solvent in producing the epoxy group and acid group-containing resin (A) is not particularly limited, but when the total of the constituent monomers of the epoxy group and acid group-containing resin (A) is 100 parts by mass, The amount is preferably 30 to 1000 parts by mass, and more preferably 50 to 800 parts by mass. In particular, by setting the blending amount of the solvent to 1000 parts by mass or less, a decrease in the molecular weight of the epoxy group and acid group-containing resin (A) is suppressed by chain transfer action, and the epoxy group and acid group-containing resin (A) The viscosity can be controlled within an appropriate range. Moreover, by setting the blending amount of the solvent to 30 parts by mass or more, an abnormal polymerization reaction can be prevented and the polymerization reaction can be stably performed, and the epoxy group and acid group-containing resin (A) can be colored or gel. Can also be prevented.

The polymerization initiator that can be used for the production of the epoxy group- and acid group-containing resin (A) is not particularly limited, and examples thereof include azobisisobutyronitrile, azobisisovaleronitrile, benzoyl peroxide, t- And butyl peroxy-2-ethylhexanoate. These can be used alone or in combination of two or more.

The blending amount of the polymerization initiator is preferably 0.5 to 20 parts by mass, more preferably 1.0 when the total of the constituent monomers of the epoxy group and acid group-containing resin (A) is 100 parts by mass. ~ 10 parts by mass.
Without using an organic solvent, the monomer (a-1), the unsaturated carboxylic acid (a-2), optional components other than the monomer (a-1) and the unsaturated carboxylic acid (a-2) Bulk polymerization may be performed using a radical polymerizable monomer and a polymerization initiator.

An ethylenic carbon-carbon double bond can be further introduced into the epoxy group- and acid group-containing resin (A) obtained by the above copolymerization reaction. Thereby, the sensitivity and developability of the resin composition are improved.
For example, a part of the carboxyl group derived from the unsaturated carboxylic acid (a-2) constituting the epoxy group and acid group-containing resin (A), a functional group having reactivity with the carboxyl group, and an ethylenic carbon-carbon double A monomer (a-3) having a bond in one molecule may be added to introduce an ethylenic carbon-carbon double bond. Thus, the epoxy group- and acid group-containing resin (A) has a functional group that reacts with the carboxyl group and an ethylenic carbon-carbon double bond in part of the carboxyl group derived from the unsaturated carboxylic acid (a-2). It contains a constituent monomer unit having an ethylenic carbon-carbon double bond to which the monomer (a-3) contained in the molecule is added. Examples of the functional group that reacts with the carboxyl group include an isocyanato group, an epoxy group, and a vinyl ether group. Of these, isocyanato groups are preferred from the viewpoint of reactivity during the addition reaction. As the monomer (a-3) having an epoxy group, the same monomers as those exemplified as the monomer (a-1) can be used. Further, the monomer (a-3) having an isocyanato group is not particularly limited, but isocyanato group-containing (meth) acrylate is preferable. Specifically, 2- (meth) acryloyloxyethyl isocyanate, 1,1- ( Examples thereof include bis (meth) acryloyloxymethyl) ethyl isocyanate and 2- (isocyanatoethyloxy) ethyl (meth) acrylate. Among these, a monomer having an isocyanato group and an ethylenic carbon-carbon double bond in one molecule is preferable, and 2- (meth) acryloyloxyethyl isocyanate is more preferable. The monomer (a-3) having a vinyl ether group is not particularly limited, but vinyl ether (meth) acrylate is preferable, and specific examples include 2- (2-vinyloxyethoxy) ethyl (meth) acrylate. .
Further, when the epoxy group- and acid group-containing resin (A) contains an acid anhydride group, a monomer having a functional group that reacts with the acid anhydride group and an ethylenic carbon-carbon double bond in one molecule. An ethylenic carbon-carbon double bond may be introduced by addition. Examples of the functional group that reacts with the acid anhydride group include a hydroxyl group.

The reaction of introducing a carbon-carbon double bond by adding a monomer having a reactive functional group to the carboxyl group, epoxy group or acid anhydride group in the epoxy group- and acid group-containing resin (A), A monomer to be added to the epoxy group- and acid group-containing resin (A), a polymerization inhibitor, and a catalyst are added, and the reaction is preferably performed at 50 to 150 ° C, more preferably at 80 to 130 ° C. In this addition reaction, there is no particular problem even if the solvent used in the copolymerization reaction is included. Therefore, the addition reaction can be performed without removing the solvent after the completion of the copolymerization reaction.
Here, a polymerization inhibitor may be added to prevent gelation due to polymerization of the epoxy group- and acid group-containing resin (A). Although it does not specifically limit as a polymerization inhibitor, For example, hydroquinone, methyl hydroquinone, hydroquinone monomethyl ether, etc. are mentioned. The catalyst is not particularly limited, and examples thereof include tertiary amines such as triethylamine, quaternary ammonium salts such as triethylbenzylammonium chloride, phosphorus compounds such as triphenylphosphine, and chelate compounds of chromium. Can be mentioned.

The acid value (JIS K6901: 2008 5.3.2) of the epoxy group and acid group-containing resin (A) used in the present invention is not limited, but preferably 10 to 350 mgKOH / g when used for a color filter. More preferably, it is 30 to 200 mgKOH / g, still more preferably 50 to 180 mgKOH / g, and particularly preferably 70 to 150 mgKOH / g. When the acid value is 10 mgKOH / g or more, sufficient developability can be obtained. On the other hand, when the acid value is 350 mgKOH / g or less, sufficient developability can be obtained without dissolving the exposed portion (photocured portion) in the alkaline developer.
The molecular weight of the epoxy group- and acid group-containing resin (A) (polystyrene-converted weight average molecular weight measured using gel permeation chromatography (GPC) described later) is preferably 1,000 to 50,000, more preferably. 3000 to 40000. When the molecular weight is 1000 or more, good sensitivity can be obtained without occurrence of chipping of a colored pattern after development. On the other hand, when the molecular weight is 50000 or less, the development time is sufficiently short and practical.
In addition, when the epoxy group- and acid group-containing resin (A) has an unsaturated group, the unsaturated group equivalent is not limited, but is preferably 100 to 4000 g / mol, more preferably 200 to 3000 g / mol. is there. When the unsaturated group equivalent is 100 g / mol or more, it is effective to further improve the heat decomposability and heat yellowing. On the other hand, when the unsaturated group equivalent is 4000 g / mol or less, it is effective to further increase the sensitivity.

The resin composition of the present invention contains a polybasic acid monoester (B) of a hydroxyl group-containing polyfunctional (meth) acrylate. Examples of the polybasic acid monoester (B) of a hydroxyl group-containing polyfunctional (meth) acrylate include, for example, pentaerythritol di- or tri (meth) acrylate polybasic acid monoester, dipentaerythritol di-, tri-, tetra- or penta- Specific examples include (meth) acrylate polybasic acid monoesters. Specifically, dipentaerythritol pentaacrylate succinic acid modified product, pentaerythritol triacrylate succinic acid modified product, dipentaerythritol pentaacrylate phthalic acid modified product, pentaerythritol Examples thereof include polybasic acid-modified products in which an acid anhydride is added to the hydroxyl group of a hydroxyl group-containing polyfunctional (meth) acrylate such as a modified product of triacrylate phthalic acid. These can be used alone or in combination of two or more. Among these, from the viewpoint of solvent resistance, a succinic acid-modified product of a hydroxyl group-containing polyfunctional (meth) acrylate is preferable.

The blending amount of the polybasic acid monoester (B) of the hydroxyl group-containing polyfunctional (meth) acrylate is preferably 10 to 90% by mass, more preferably based on the sum of the components (A) and (B). It is 20 to 80% by mass, and more preferably 25 to 70% by mass. If it is the compounding quantity of this range, it will become a resin composition which has a suitable viscosity, and it has suitable photocurability by mix | blending the photoinitiator (D) mentioned later.

The resin composition of the present invention contains a solvent (C). The solvent (C) may be an inert solvent that dissolves the epoxy group- and acid group-containing resin (A) and the polybasic acid monoester (B) of the hydroxyl group-containing polyfunctional (meth) acrylate and does not react with these. If it does not specifically limit.
As the solvent (C), the same solvent as that used for the copolymerization reaction when producing the epoxy group- and acid group-containing resin (A) can be used, and the solvent contained after the copolymerization reaction is used as it is. You can also. You may add further in the case of preparation of the resin composition of this invention. Or when adding the other component mentioned later, you may use the solvent which coexists with those components as it is. Specific examples of the solvent (C) include propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, dipropylene glycol monomethyl ether acetate, ethyl acetate, butyl acetate, isopropyl acetate, dipropylene glycol monomethyl ether, tripropylene glycol monomethyl ether, ethylene Examples include glycol monomethyl ether, diethylene glycol monomethyl ether, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, ethylene glycol monoethyl ether acetate, and diethylene glycol monoethyl ether acetate. These can be used alone or in combination of two or more. Among these, glycol ether solvents such as propylene glycol monomethyl ether and propylene glycol monomethyl ether acetate used in the copolymerization reaction when producing the epoxy group- and acid group-containing resin (A) are preferable.

The blending amount of the solvent (C) is preferably 30 to 1000 parts by mass, more preferably 50 to 800 parts by mass, when the total of the components excluding the solvent (C) in the resin composition of the present invention is 100 parts by mass. Part, more preferably 100 to 700 parts by weight. If it is the compounding quantity of this range, it will become a resin composition which has a suitable viscosity.

When the resin composition of the present invention is used for forming a color pattern of a color filter, a photopolymerization initiator (D) and a colorant (E) are further blended and used.

The photopolymerization initiator (D) is not particularly limited. For example, benzoin such as benzoin and benzoin methyl ether and alkyl ethers thereof; acetophenone, 2,2-dimethoxy-2-phenylacetophenone, 1,1-dichloroacetophenone , Acetophenones such as 4- (1-t-butyldioxy-1-methylethyl) acetophenone; alkylphenones such as 1-hydroxycyclohexyl phenyl ketone and 2-hydroxy-2-methyl-1-phenylpropan-1-one; Anthraquinones such as 2-methylanthraquinone, 2-amylanthraquinone, 2-t-butylanthraquinone, 1-chloroanthraquinone; 2,4-dimethylthioxanthone, 2,4-diisopropylthioxanthone, 2-chlorothioxanthone Thioxanthones such as acetone; ketals such as acetophenone dimethyl ketal and benzyl dimethyl ketal; benzophenone, 4- (1-t-butyldioxy-1-methylethyl) benzophenone, 3,3 ′, 4,4′-tetrakis (t- Benzophenones such as butyldioxycarbonyl) benzophenone; 1,2-octanedione, 1- [4- (phenylthio)-, 2- (O-benzoyloxime)], ethanone, 1- [9-ethyl-6- ( Oxime esters such as 2-methylbenzoyl) -9H-carbazol-3-yl]-, 1- (0-acetyloxime); 2-methyl-1- [4- (methylthio) phenyl] -2-morpholino-propane -1-one; 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) butano 1; acylphosphine oxides such as 2,4,6-trimethylbenzoyldiphenylphosphine oxide and bis (2,4,6-trimethylbenzoyl) phenylphosphine oxide; and xanthones. These can be used alone or in combination of two or more.

The blending amount of the photopolymerization initiator (D) is preferably 0.1 to 30 parts by mass, more preferably 0.5 to 20 when the total of the components (A) and (B) is 100 parts by mass. Parts by mass, more preferably 1 to 15 parts by mass. If it is the compounding quantity of this range, it will become a resin composition which has appropriate photocurability.

The colorant (E) is not particularly limited as long as it dissolves or disperses in the resin composition of the present invention, and examples thereof include dyes and pigments.
In particular, in the resin composition of the present invention, sufficient solvent resistance can be obtained even when baking is performed at a relatively low temperature (215 ° C. or lower) as will be described later. is there. Therefore, in the resin composition of the present invention, a colored pattern can be obtained by freely using a wider variety of dyes.

As the dye, from the viewpoint of solubility or dispersibility in the resin composition of the present invention, interaction with other components in the resin composition, heat resistance, etc., an acid dye having an acid group such as a carboxyl group, an acid dye It is preferable to use a salt with a nitrogen compound or a sulfonamide of an acidic dye. Examples of such dyes include: acid alizarin violet N; acid black 1, 2, 24, 48; acid blue 1, 7, 9, 25, 29, 40, 45, 62, 70, 74, 80, 83, 90, 92, 112, 113, 120, 129, 147; acid chrome violet K; acid Fuchsin; acid green 1, 3, 5, 25, 27, 50; acid orange 6, 7, 8, 10, 12, 50, 51, 52, 56, 63, 74, 95; acid red1, 4, 8, 14, 17, 18, 26, 27, 29, 31, 34, 35, 37, 42, 44, 50, 51, 52, 57, 69, 73 80, 87, 88, 91, 92, 94, 97, 103, 111, 114, 129, 33, 134, 138, 143, 145, 150, 151, 158, 176, 183, 198, 211, 215, 216, 217, 249, 252, 257, 260, 266, 274; acid violet 6B, 7, 9, 17, 19; acid yellow1, 3, 9, 11, 17, 23, 25, 29, 34, 36, 42, 54, 72, 73, 76, 79, 98, 99, 111, 112, 114, 116; yellow3; VALIFAST Blue 2620 and derivatives thereof. Among these, azo, xanthene, anthraquinone, or phthalocyanine acid dyes are preferable. These can be used alone or in combination of two or more depending on the color of the target pixel.

Examples of pigments include C.I. I.

Pigment Yellow

1, 3, 12, 13, 14, 15, 16, 17, 20, 24, 31, 53, 83, 86, 93, 94, 109, 110, 117, 125, 128, 137, 138, 139, Yellow pigments such as 147, 148, 150, 153, 154, 166, 173, 194, 214; I. CI orange pigments such as CI Pigment Orange 13, 31, 36, 38, 40, 42, 43, 51, 55, 59, 61, 64, 65, 71, 73; I. Red pigments such as CI Pigment Red 9, 97, 105, 122, 123, 144, 149, 166, 168, 176, 177, 180, 192, 209, 215, 216, 224, 242, 254, 255, 264, 265; C. I. Blue pigments such as CI Pigment Blue 15, 15: 3, 15: 4, 15: 6, 60; I. Violet color pigments such as CI Pigment Violet 1, 19, 23, 29, 32, 36, 38; I. Green pigments such as C.I. Pigment Green 7, 36, 58; I. Brown pigments such as C.I. Pigment Brown 23 and 25; I. And black pigments such as CI pigment blacks 1 and 7, carbon black, titanium black, and iron oxide. These can be used alone or in combination of two or more depending on the color of the target pixel.
Note that the above dyes and pigments may be used in combination depending on the target pixel color.

When blending the colorant (E), the blending amount is preferably 5 to 80 parts by weight with respect to 100 parts by weight of the total of the components excluding the solvent (C) in the resin composition of the present invention. The amount is preferably 5 to 70 parts by mass, and more preferably 10 to 60 parts by mass.

When a pigment is used as the colorant (E), a known dispersant may be blended in the resin composition from the viewpoint of improving the dispersibility of the pigment. As the dispersant, it is preferable to use a polymer dispersant excellent in dispersion stability over time. Examples of polymer dispersants include urethane dispersants, polyethyleneimine dispersants, polyoxyethylene alkyl ether dispersants, polyoxyethylene glycol diester dispersants, sorbitan aliphatic ester dispersants, and aliphatic modified esters. System dispersants and the like. As such a polymer dispersant, EFKA (registered trademark, manufactured by Efcar Chemicals Beebuy (BASF)), Disperbyk (registered trademark, manufactured by Big Chemie Japan Co., Ltd.), Disparon (registered trademark, manufactured by Enomoto Kasei Co., Ltd.), You may use what is marketed by brand names, such as SOLPERSE (trademark, the Lubrizol company make).
What is necessary is just to set the compounding quantity of a dispersing agent suitably according to kinds, such as a pigment to be used.

When the resin composition of the present invention is used for forming a colored pattern of a color filter, an epoxy group- and acid group-containing resin (A), a hydroxyl group-containing polyfunctional (meth) acrylate polybasic acid monoester (B), a solvent (C ), The photopolymerization initiator (D) and the colorant (E) are preferably blended in an amount of 90 epoxy group and acid group-containing resin (A) with respect to the sum of the components (A) and (B). Solvent when the total amount of the components excluding the solvent (C) in the resin composition is 10 to 90% by mass, the polybasic acid monoester (B) of the hydroxyl group-containing polyfunctional (meth) acrylate is 10 to 90% by mass When (C) is 30 to 1000 parts by mass, and the sum of the components (A) and (B) is 100 parts by mass, the photopolymerization initiator (D) is 0.1 to 30 parts by mass, and the solvent ( The sum of the components excluding C) is 100 parts by mass. The agent (E) is 5 to 80 parts by mass, and more preferably 80 to 20% by mass of the epoxy group and acid group-containing resin (A) with respect to the sum of the components (A) and (B). When the polybasic acid monoester (B) of the polyfunctional (meth) acrylate is 20 to 80% by mass and the total of the components excluding the solvent (C) in the resin composition is 100 parts by mass, the solvent (C) is 50 to 50% by mass. When 800 parts by mass, the sum of components (A) and (B) is 100 parts by mass, the photopolymerization initiator (D) is 0.5 to 20 parts by mass, and the components excluding the solvent (C) in the resin composition When the total is 100 parts by mass, the colorant (E) is 5 to 70 parts by mass, and more preferably the epoxy group and acid group-containing resin (A) with respect to the total of the components (A) and (B). Is a polybasic acid monoe of a hydroxyl group-containing polyfunctional (meth) acrylate. When the amount of tellurium (B) is 25 to 70% by mass and the total of the components excluding the solvent (C) in the resin composition is 100 parts by mass, the solvent (C) is 100 to 700 parts by mass, the component (A) and the component (B) When the total of the components is 100 parts by mass, the photopolymerization initiator (D) is 1 to 15 parts by mass, and when the total of the components excluding the solvent (C) in the resin composition is 100 parts by mass, the colorant (E) is 10 ~ 60 parts by mass.

Even when the resin composition of the present invention does not contain a colorant (E), an epoxy group- and acid group-containing resin (A), a polybasic acid monoester (B) of a hydroxyl group-containing polyfunctional (meth) acrylate, a solvent (C ) And the photopolymerization initiator (D) can be applied to the above numerical values.
Similarly, even when the resin composition of the present invention does not contain the photopolymerization initiator (D) and the colorant (E), the epoxy group and acid group-containing resin (A), and the hydroxyl group-containing polyfunctional (meth) acrylate The said numerical value is applicable to the compounding quantity of a basic acid monoester (B) and a solvent (C).

In addition to the above components, the resin composition of the present invention may contain known additives such as known coupling agents, leveling agents, and thermal polymerization inhibitors in order to impart predetermined characteristics. The amount of these additives is not particularly limited as long as it does not impair the effects of the present invention.

The resin composition of this invention can be manufactured by mixing said component using a well-known mixing apparatus.
The resin composition of the present invention is a resin composition containing an epoxy group- and acid group-containing resin (A), a hydroxyl group-containing polyfunctional (meth) acrylate polybasic acid monoester (B), and a solvent (C). After the product is prepared, the photopolymerization initiator (D) and an optional colorant (E) can be mixed and produced. In addition, the resin composition of this invention can be used for formation of the coloring pattern of a color filter, and can also be used for another use.

Since the resin composition of the present invention obtained as described above has alkali developability, it can be developed by using an alkaline aqueous solution. In particular, the resin composition of the present invention is excellent in sensitivity and developability and can give a cured coating film excellent in solvent resistance. Therefore, the resin composition of the present invention is suitable for use as various resists, in particular as a resist used for forming a colored pattern of a color filter incorporated in an organic EL display, a liquid crystal display device, or a solid-state imaging device. Moreover, since the resin composition of this invention gives the cured coating film excellent in characteristics, such as solvent resistance, it can also be used for a various coating, an adhesive agent, the binder for printing inks, etc.

Next, the color filter manufactured using the resin composition of this invention is demonstrated. The color filter of the present invention has a colored pattern obtained from the above resin composition.
Hereinafter, a color filter according to an embodiment of the present invention will be described with reference to the drawings.
FIG. 1 is a cross-sectional view of a color filter according to an embodiment of the present invention. In FIG. 1, the color filter includes a substrate 1, a black matrix 3 formed on the boundary between the RGB pixels 2 and the pixels 2 formed on the substrate 1, and a protection formed on the pixels 2 and the black matrix 3. And the membrane 4. In this configuration, other configurations can be used except that at least one of the pixel 2 and the black matrix 3 (colored pattern) is formed using the above resin composition. The color filter shown in FIG. 1 is an example, and the present invention is not limited to this configuration.

Next, the manufacturing method of the color filter of one Embodiment of this invention is demonstrated.
First, a colored pattern is formed on the substrate 1. Specifically, the black matrix 3 and the pixels 2 are sequentially formed on the substrate 1. Here, the substrate 1 is not particularly limited, and a glass substrate, a silicon substrate, a polycarbonate substrate, a polyester substrate, a polyamide substrate, a polyamideimide substrate, a polyimide substrate, an aluminum substrate, a printed wiring substrate, an array substrate, and the like can be used. .

The coloring pattern can be formed by using photolithography. Specifically, after applying the above resin composition on the substrate 1 to form a coating film, the coating film is exposed through a photomask having a predetermined pattern, and the exposed portion is photocured. And a predetermined pattern can be formed by developing after baking an unexposed part with aqueous alkali solution, and baking.
A method for applying the resin composition is not particularly limited, and screen printing, roll coating, curtain coating, spray coating, spin coating, and the like can be used. Moreover, after application | coating of a resin composition, you may volatilize volatile components, such as a solvent (C), by heating using heating means, such as a circulation oven, an infrared heater, and a hotplate, as needed. The heating conditions are not particularly limited, and may be set as appropriate according to the type of resin composition to be used. In general, heating may be performed at a temperature of 50 ° C. to 120 ° C. for 30 seconds to 30 minutes.

The light source used for exposure is not particularly limited, and a low-pressure mercury lamp, a medium-pressure mercury lamp, a high-pressure mercury lamp, a xenon lamp, a metal halide lamp, or the like can be used. Further, the exposure amount is not particularly limited, and may be appropriately adjusted according to the type of the resin composition to be used.
The aqueous alkali solution used for development is not particularly limited, but an aqueous solution of sodium carbonate, potassium carbonate, calcium carbonate, sodium hydroxide, potassium hydroxide, etc .; an aqueous solution of an amine compound such as ethylamine, diethylamine, dimethylethanolamine; 3 -Methyl-4-amino-N, N-diethylaniline, 3-methyl-4-amino-N-ethyl-N-β-hydroxyethylaniline, 3-methyl-4-amino-N-ethyl-N-β- Aqueous solutions of methanesulfonamidoethylaniline, 3-methyl-4-amino-N-ethyl-N-β-methoxyethylaniline and p-phenylenediamine compounds such as sulfate, hydrochloride or p-toluenesulfonate Etc. can be used. Among these, it is preferable to use an aqueous solution of a p-phenylenediamine compound. In addition, you may add an antifoamer and surfactant to these aqueous solutions as needed. Moreover, it is preferable to wash and dry after development with the above-mentioned alkaline aqueous solution.
The baking conditions are not particularly limited, and heat treatment may be performed according to the type of the resin composition to be used. However, by using the resin composition of the present invention, baking can be performed at a temperature lower than conventional. Yes, preferably at 215 ° C. or lower, more preferably at 130 to 215 ° C. for 10 to 60 minutes. Since sufficient solvent resistance can be obtained even at a baking temperature lower than before, dyes that could not be used due to the problem of deterioration due to heat can be used in more types.

A desired coloring pattern can be formed by sequentially repeating the coating, exposure, development and baking as described above using the resin composition for the black matrix 3 and the resin composition for the pixel 2.
In addition, although the formation method of the coloring pattern by photocuring was demonstrated above, if the resin composition which mix | blended the hardening accelerator and the well-known epoxy resin was used instead of the photoinitiator (D), it will be by inkjet method. A desired coloring pattern can also be formed by heating after application.
Next, the protective film 4 is formed on the colored pattern (pixel 2 and black matrix 3). The protective film 4 is not particularly limited, and may be formed using a known film.

The color filter produced in this way is produced using a resin composition that gives a cured coating film with excellent sensitivity and developability and excellent solvent resistance, so a colored pattern with excellent solvent resistance. Have

EXAMPLES Hereinafter, although this invention is demonstrated in detail with reference to an Example, this invention is not limited by these Examples. In this example, all parts and percentages are based on mass unless otherwise specified. Moreover, an acid value is an acid value of the epoxy group and acid group containing resin (A) measured according to JISK6901: 2008 5.3.2, Comprising: In 1g of epoxy group and acid group containing resin (A) It means the number of mg of potassium hydroxide required to neutralize the contained acidic component. Moreover, a weight average molecular weight means the standard polystyrene conversion weight average molecular weight measured on condition of the following using gel permeation chromatography (GPC).
Column: Shodex (registered trademark) LF-804 + LF-804 (manufactured by Showa Denko KK)
Column temperature: 40 ° C
Sample: 0.2% tetrahydrofuran solution of resin Developing solvent: Tetrahydrofuran Detector: Differential refractometer (Showex (registered trademark) RI-71S) (manufactured by Showa Denko KK)
Flow rate: 1 mL / min

<Synthesis Example 1>
Into a flask equipped with a stirrer, a dropping funnel, a condenser, a thermometer, and a gas introduction tube, 324 parts by mass of propylene glycol monomethyl ether acetate was added, stirred while replacing with nitrogen gas, and heated to 80 ° C. Next, 17 parts by mass of 2,2-azobis (2,4-dimethylvaleronitrile) (polymerization start) was added to a monomer mixture consisting of 86 parts by mass (1 mol) of methacrylic acid and 71 parts by mass (0.5 mol) of glycidyl methacrylate. An agent, V-65 manufactured by Wako Pure Chemical Industries, Ltd., was added dropwise into the flask over 2 hours from the dropping funnel. After completion of the dropping, the mixture was further stirred for 2 hours at 80 ° C. to carry out a copolymerization reaction. 1 resin-containing liquid (solid content acid value 320 mgKOH / g, weight average molecular weight 10,000) was obtained. In addition, the number-of-moles of the epoxy group with respect to 1 mol of acid groups of resin in the obtained resin containing liquid were 0.5.

<Synthesis Examples 2 to 5>
As shown in Table 1, in the same manner as in Synthesis Example 1 except that the amounts of propylene glycol monomethyl ether acetate (PGMEA), methacrylic acid (MAa) and glycidyl methacrylate (GMA) were changed, 2 to 5 resin-containing liquids were obtained.

<Synthesis Example 6>
Into a flask equipped with a stirrer, a dropping funnel, a condenser, a thermometer and a gas introduction tube, 470 parts by mass of propylene glycol monomethyl ether acetate was added and stirred while replacing with nitrogen gas, and the temperature was raised to 80 ° C. Next, 25 parts by mass of 2,2-azobis (2,4-dimethylvaleronitrile) (polymerization initiator) was added to a monomer mixture consisting of 86 parts by mass (1 mol) of methacrylic acid and 142 parts by mass (1 mol) of glycidyl methacrylate. What added V-65) manufactured by Wako Pure Chemical Industries, Ltd. was dropped into the flask from the dropping funnel over 2 hours. After completion of dropping, the mixture was further stirred at 80 ° C. for 2 hours to carry out a copolymerization reaction.
Thereafter, 0.1 parts by mass of dibutyltin laurate (catalyst, manufactured by Wako Pure Chemical Industries, Ltd.) and 78 parts by mass (0.5 mol) of 2-isocyanatoethyl methacrylate (manufactured by Showa Denko) at 60 ° C. were flasked. And stirred for 1 hour, and then 160 parts by mass of propylene glycol monomethyl ether acetate was added. 6 resin-containing liquid (solid content acid value 85 mgKOH / g, weight average molecular weight 13000) was obtained. The number of moles of epoxy groups relative to 1 mole of acid groups of the resin in the obtained resin-containing liquid was 2.

<Synthesis Example 7>
Into a flask equipped with a stirrer, a dropping funnel, a condenser, a thermometer and a gas introduction tube, 977 parts by mass of propylene glycol monomethyl ether acetate was added and stirred while replacing with nitrogen gas, and the temperature was raised to 80 ° C. Subsequently, 52 parts by mass of 2,2-azobis (2,4-methylazol) was added to a monomer mixture comprising 86 parts by mass (1 mol) of methacrylic acid, 104 parts by mass (1 mol) of styrene and 284 parts by mass (2 mol) of glycidyl methacrylate. Dimethylvaleronitrile) (polymerization initiator, V-65 manufactured by Wako Pure Chemical Industries, Ltd.) was added dropwise to the flask over 2 hours from the dropping funnel. After completion of the dropping, the mixture was further stirred for 2 hours at 80 ° C. to carry out a copolymerization reaction. 7 resin-containing liquid (solid content acid value 120 mgKOH / g, weight average molecular weight 8000) was obtained. The number of moles of epoxy groups relative to 1 mole of acid groups of the resin in the obtained resin-containing liquid was 2.

<Preparation of resin composition>
The resin compositions of Examples 1 to 10 and Comparative Examples 1 to 7 were prepared using the composition shown in Table 2 as a basic composition and changing the types of the resin-containing liquid and the polymerizable monomer as shown in Tables 3 and 4.

<Evaluation of solvent resistance>
The solvent resistance of N-methyl-2-pyrrolidone (NMP), which is a solvent generally used in the color filter protective film forming step, was evaluated.
The prepared resin composition was spin-coated on a 5 cm square glass substrate (non-alkali glass substrate) at 210 ° C. so that the thickness after baking was 2.5 μm, and then heated at 90 ° C. for 3 minutes. The solvent was volatilized. Next, the coating film is exposed to light having a wavelength of 365 nm (exposure amount: 300 mJ / cm ² ), the exposed portion is photocured, and then left in a drier at a baking temperature of 210 ° C. for 20 minutes to produce a cured coating film. did. Using a spectrophotometer UV-1650PC (manufactured by Shimadzu Corporation), the transmittance of a test piece with a cured coating film at a wavelength of 675 nm was measured. Next, 55 parts by mass of N-methyl-2-pyrrolidone (NMP) was placed in a petri dish with a lid, a test piece with a cured coating film was immersed therein, and the transmittance after 30 minutes at 60 ° C. was measured. . The results are shown in Table 5. The increase in transmittance means that the colorant is eluted into N-methyl-2-pyrrolidone (NMP), and the difference between the initial transmittance and the transmittance after impregnation with N-methyl-2-pyrrolidone (NMP). It can be said that the smaller the amount, the higher the solvent resistance.

<Evaluation of alkali developability>
The prepared resin composition was spin-coated on a 5 cm square glass substrate (non-alkali glass substrate) so that the thickness after exposure was 2.5 μm, and then heated at 90 ° C. for 3 minutes to volatilize the solvent. I let you. Next, a photomask having a predetermined pattern was disposed at a distance of 100 μm from the coating film, and the coating film was exposed through this photomask (exposure amount 150 mJ / cm ² ), and the exposed portion was photocured. Next, by spraying an aqueous solution containing 0.1% by mass of sodium carbonate at a temperature of 23 ° C. and a pressure of 0.3 MPa, the unexposed portion is dissolved and developed, followed by baking at 210 ° C. for 30 minutes. A predetermined pattern was formed, and the residue after alkali development was confirmed. The residue after alkali development was confirmed by observing the pattern after alkali development using an electron microscope S-3400 manufactured by Hitachi High-Technologies Corporation. The criteria for this evaluation are as follows. The results are shown in Table 5.
○: No residue ×: Residue

<Evaluation of sensitivity>
The alkali development using the above spray was performed for 30 seconds, and the amount of decrease in the pattern thickness before and after the alkali development was measured with a stylus-type step gauge ET4000M (manufactured by Kosaka Laboratory) to determine the quality of the sensitivity. Since it can be said that the sensitivity of this pattern thickness is better as the amount of decrease is smaller, the criteria for this evaluation were as follows. The results are shown in Table 5.
○: Less than 0.20 μm ×: 0.20 μm or more

As can be seen from the results in Table 5, when the resin compositions of Examples 1 to 10 were used, the developability and sensitivity were good, and cured films having excellent solvent resistance were obtained, whereas Comparative Examples 1 to 7 were used. When the resin composition was used, the solvent resistance was not sufficient.

As can be seen from the above results, according to the present invention, it is possible to provide a resin composition capable of forming a cured coating film having good sensitivity and developability and sufficient solvent resistance. Therefore, the resin composition of the present invention is suitable as a color filter resist. Furthermore, by using the resin composition of the present invention, a highly reliable color filter having a colored pattern excellent in solvent resistance can be obtained.

1 substrate, 2 pixels, 3 black matrix, 4 protective film.

Claims

A resin composition containing an epoxy group and acid group-containing resin (A), a hydroxyl group-containing polyfunctional (meth) acrylate polybasic acid monoester (B), and a solvent (C), the epoxy group and A resin composition characterized in that an epoxy group is 0.5 to 3.0 mol per 1 mol of an acid group in the acid group-containing resin (A).
The monomer unit derived from the monomer (a-1) having an ethylenic carbon-carbon double bond and an epoxy group in one molecule as constituent monomer units of the epoxy group- and acid group-containing resin (A). 2. The resin composition according to 1.
The resin composition according to claim 1 or 2, comprising a monomer unit derived from an unsaturated carboxylic acid (a-2) as a constituent monomer unit of the epoxy group- and acid group-containing resin (A).
The epoxy group- and acid group-containing resin (A) has a functional group that reacts with a carboxyl group and an ethylenic carbon-carbon double bond in part of the carboxyl group derived from the unsaturated carboxylic acid (a-2). The resin composition according to claim 3, comprising a constituent monomer unit having an ethylenic carbon-carbon double bond to which the monomer (a-3) contained in one molecule is added.
3. The resin composition according to claim 2, wherein the monomer (a-1) having an ethylenic carbon-carbon double bond and an epoxy group in one molecule is an epoxy group-containing (meth) acrylate.
The monomer (a-3) having a functional group that reacts with the carboxyl group and an ethylenic carbon-carbon double bond in one molecule is selected from an epoxy group-containing (meth) acrylate and an isocyanato group-containing (meth) acrylate. The resin composition according to claim 4, which is one kind or two or more kinds.
The polybasic acid monoester (B) of the hydroxyl group-containing polyfunctional (meth) acrylate is a dibasic acid monoester of pentaerythritol di- or tri (meth) acrylate, dipentaerythritol di-, tri-, tetra- or penta- (meta). 7. The resin composition according to claim 1, wherein the resin composition is one or more selected from the group consisting of polybasic acid monoesters of acrylates.
The resin composition according to any one of claims 1 to 7, wherein the epoxy group- and acid group-containing resin (A) has an acid value of 10 to 350 mgKOH / g.
The resin composition according to any one of claims 1 to 8, further comprising a photopolymerization initiator (D).
The resin composition according to any one of claims 1 to 9, further comprising a colorant (E).
The resin composition according to claim 10, wherein the colorant (E) is at least one selected from the group consisting of dyes and pigments.
A color filter having a colored pattern comprising a cured coating film of the resin composition according to claim 10 or 11.
An image display device comprising the color filter according to claim 12.
Applying the resin composition according to claim 10 or 11 on a substrate, exposure and development with an alkaline aqueous solution;
And a step of baking at a temperature of 215 ° C. or lower to form a colored pattern.