WO2016103655A1 - Dispositif de refroidissement - Google Patents

Dispositif de refroidissement Download PDF

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Publication number
WO2016103655A1
WO2016103655A1 PCT/JP2015/006289 JP2015006289W WO2016103655A1 WO 2016103655 A1 WO2016103655 A1 WO 2016103655A1 JP 2015006289 W JP2015006289 W JP 2015006289W WO 2016103655 A1 WO2016103655 A1 WO 2016103655A1
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WO
WIPO (PCT)
Prior art keywords
air tank
valve
cooling device
air
heat
Prior art date
Application number
PCT/JP2015/006289
Other languages
English (en)
Japanese (ja)
Inventor
若菜 野上
杉山　誠
辰乙 郁
Original Assignee
パナソニックＩｐマネジメント株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2015128252A external-priority patent/JP2016121865A/ja
Application filed by パナソニックＩｐマネジメント株式会社 filed Critical パナソニックＩｐマネジメント株式会社
Publication of WO2016103655A1 publication Critical patent/WO2016103655A1/fr

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a cooling device for cooling a device that generates heat, such as an electronic device.
  • the conventional cooling device has the following configuration.
  • FIG. 6 is a configuration diagram of a conventional cooling device.
  • the conventional cooling device shown in FIG. 6 when the thyristor element 101 is in an operating state, power loss occurs.
  • the heat generated by the power loss is transferred from the heat transfer surface of the evaporator 102 to the refrigerant liquid 107 and is dissipated by the boiling heat transfer changing in phase to the refrigerant vapor 109.
  • the refrigerant vapor 109 is filled in the condenser 106.
  • the refrigerant vapor 109 is condensed and liquefied, and the phase changes to the refrigerant liquid 107.
  • the refrigerant liquid 107 flows into the lower part of the first header 104 and is supplied to the evaporator 102 again through the liquid return pipe 108.
  • the thyristor element 101 is cooled by repeating this operation (see, for example, Patent Document 1).
  • the conventional cooling device uses water or an ethylene glycol aqueous solution as the refrigerant liquid 107.
  • the operating temperature of the refrigerant liquid 107 is around 60 ° C., and the vapor pressure at this temperature is about 0.2 [kg / cm 2 ] abs. Since this vapor pressure is lower than the atmosphere, there is a concern that air 140, which is a non-condensable gas, leaks into the cooling device.
  • the air 140 which is a non-condensable gas
  • the air 140 leaks into the cooling device
  • the air 140 accumulates in the upper part of the condenser 106 in the middle of the circulation path of the refrigerant vapor 109 and inhibits the circulation of the refrigerant vapor 109.
  • the cooling performance of the condenser 106 is lowered, the operating temperature of the refrigerant liquid 107 is increased, and there is a concern that the junction temperature of the thyristor element 101 exceeds the design allowable value.
  • the heat radiating portion 106 includes the first header 104 and the second header 105, and the surface includes a plurality of temperature sensors 130.
  • the output of the temperature sensor 130 is processed by the calculator 134 via the thermometer 132.
  • a decrease in cooling performance is calculated from the temperature difference generated between the upper part and the lower part of the condenser 106 by the air 140, and the alarm 136 is sounded to notify the abnormality.
  • the cooling performance is reduced due to the leakage of the air 140. Further, no mention is made of the maintenance of the cooling device whose cooling performance has deteriorated. Therefore, in order to regain the initial cooling performance, there is a problem that it is necessary to perform complicated work such as removing the thyristor element 101 after stopping the thyristor element 101 and all peripheral devices.
  • the measured value of the temperature sensor 130 and the calculated value of the calculator 134 are affected by the outside air temperature condition, the heat capacity of the condenser 106 itself, and the output of the thyristor element 101. For this reason, it is necessary to accumulate a lot of basic data in determining the condition for calculating the output to the alarm device 136. In addition, there is a problem that the basic data needs to be accumulated every time the structure and specifications of the cooling device are changed.
  • the present invention solves the above-described problems, and prevents deterioration in cooling performance even if air leaks, and recovers cooling performance by eliminating air by vacuum exhaust maintenance of the leaked air. it can. This provides a highly reliable cooling device that provides stable cooling performance.
  • a cooling device includes a heat receiving unit in which a heating element is installed, a heat dissipation path, a heat dissipation unit, a refrigerant circulation path in which a return path is connected in order, and an air tank provided with a suction port and an exhaust port.
  • the suction port is provided with a first valve that communicates with either the heat radiating portion or the return path.
  • a second valve is provided at the exhaust port.
  • FIG. 1 is a schematic diagram of an electronic device on which the cooling device according to Embodiment 1 of the present invention is mounted.
  • FIG. 2 is a partially enlarged schematic view of the heat dissipating part and the air tank of the cooling device according to Embodiment 1 of the present invention.
  • FIG. 3 is a graph showing the saturation pressure of the refrigerant in the cooling device according to the first embodiment of the present invention.
  • FIG. 4 is a partially enlarged schematic view of the heat dissipating part and the air tank of the cooling device according to Embodiment 2 of the present invention.
  • FIG. 5 is a partially enlarged schematic view of the heat radiating portion and the air tank of the cooling device according to Embodiment 3 of the present invention.
  • FIG. 6 is a configuration diagram of a conventional cooling device.
  • a cooling device includes a heat receiving unit in which a heating element is installed, a heat dissipation path, a heat dissipation unit, a refrigerant circulation path in which a return path is connected in order, and an air tank provided with a suction port and an exhaust port. .
  • the suction port is provided with a first valve that communicates with either the heat radiating portion or the return path.
  • a second valve is provided at the exhaust port. Since the air leaked into the cooling device has a density lower than that of the refrigerant vapor, it accumulates in the heat dissipating portion located in the upper portion and the vicinity thereof in the cooling device. Therefore, the leaked air can be stored in the air tank that communicates with either the heat radiating portion or the return path connected to the heat radiating portion.
  • the first valve and the air tank are outside the main circulation path of the refrigerant, it is possible to prevent the leaked air from inhibiting the circulation of the refrigerant and reducing the cooling performance. As a result, a cooling device capable of obtaining stable cooling performance can be provided.
  • the heat radiating portion includes an upper header, the upper header communicates with the air tank via the first valve and the suction port, and the air tank is above the upper header. You may make it the structure installed. Since the air leaking into the cooling device has a density lower than that of the refrigerant vapor, it accumulates in the upper header provided at the upper portion of the heat dissipating unit located at the upper portion in the cooling device. Therefore, the leaked air can be stored in the air tank that communicates with the upper header of the heat radiating section via the first valve.
  • the heat radiating portion includes a lower header
  • the lower header communicates with the air tank via the first valve and the suction port
  • the air tank includes a third valve.
  • a discharge port is provided below the suction port.
  • the air tank may be configured to communicate with the return path through the third valve and the discharge port, and the air tank is installed below the lower header. Since the air leaking into the cooling device has a density lower than that of the refrigerant vapor, it accumulates in the lower header provided at the lower portion of the heat dissipating portion located at the upper portion in the cooling device. Therefore, the leaked air can be stored in the air tank that communicates with the lower header of the heat radiating portion via the first valve.
  • the air tank communicates with the upper header of the heat radiating section, and the air tank leaks more easily if it is installed above the heat radiating section.
  • the air tank may be communicated with the lower header of the heat radiating unit and installed below the heat radiating unit.
  • a discharge port provided with a third valve in the air tank is provided below the suction port, and the air tank is communicated with the return path via the third valve and the discharge port.
  • the lower header hits the downstream side of the heat radiating portion, the temperature is low and the pressure is also low. Therefore, the leaked air flows into the lower header having a low pressure. And the air which leaked with the flow of the refrigerant liquid flows into the air tank from the lower header and is stored in the air tank.
  • the air tank may be provided with a pressure detection unit.
  • the pressure change in a cooling device can be observed and recorded quantitatively.
  • the air tank is not a refrigerant circulation path, the contact between the pressure detection unit and the refrigerant liquid can be minimized, so that the risk of failure of the pressure detection unit can be minimized.
  • FIG. 1 is a schematic diagram of an electronic device 30 on which the cooling device 1 according to the first embodiment of the present invention is mounted
  • FIG. 2 is a partially enlarged schematic diagram of the heat radiation unit 4 and the air tank 12.
  • the electronic device 30 includes a power semiconductor element that serves as a heating element 2 and a cooling device 1 in a case 31.
  • the cooling device 1 includes a heat receiving part 3 for cooling the heating element 2 and a heat radiating part 4, and the heat receiving part 3 and the heat radiating part 4 are connected by a heat radiating path 5 and a return path 6. With this configuration, the inside of the cooling device 1 becomes a sealed space.
  • the cooling device 1 is decompressed and filled with a coolant such as pure water, ethanol, fluorine-based solvents, and the like.
  • the cooling device 1 includes a fan 7 and a backflow prevention unit 8.
  • the fan 7 finally radiates the heat transported to the heat radiating unit 4 by the refrigerant to the outside air.
  • the backflow prevention unit 8 is provided on the heat receiving unit 3 side of the return path 6 and prevents the backflow of the refrigerant.
  • the air cooling method using the fan 7 is used.
  • a water cooling method or other methods may be used.
  • the heat radiating section 4 includes an upper header 9 connected to the heat radiating path 5 and a lower header 10 connected to the feedback path 6.
  • the upper header 9 includes an opening 32.
  • the air tank 12 is provided with a suction port 33 and an exhaust port 13.
  • the first valve 11 is provided between the opening 32 of the upper header 9 of the heat radiating unit 4 and the suction port 33 of the air tank 12.
  • the opening 32 of the upper header 9 of the heat radiating unit 4 and the suction port 33 of the air tank 12 communicate with each other via the first valve 11. That is, the heat radiating part 4 and the air tank 12 communicate with each other via the first valve 11.
  • the exhaust port 13 of the air tank 12 is provided on the side surface side of the air tank 12.
  • a second valve 14 is provided at the exhaust port 13.
  • the air tank 12 is installed so as to be positioned above the upper header 9, and a cylindrical shape with excellent pressure resistance is desirable.
  • the first valve 11 and the second valve 14 can be opened and closed and have excellent closing performance.
  • a miniature valve, a globe valve, a needle valve, a bellows valve, a stop valve, and the like may be used, but are not particularly limited.
  • the air tank 12 is provided with a pressure detection unit 15 so that the pressure change in the cooling device 1 can be observed and recorded quantitatively. Further, since the air tank 12 is not a refrigerant circulation path, the contact between the pressure detector 15 and the refrigerant liquid can be minimized. Thereby, the failure risk of the pressure detector 15 can be minimized.
  • the cooling device 1 heat generated by driving the heating element 2 is received by the heat receiving unit 3, and this heat is transmitted to the internal refrigerant liquid, and the heating element 2 is generated by boiling heat transfer in which the refrigerant liquid changes into refrigerant vapor. Cooling is performed.
  • This refrigerant vapor flows into the heat radiating section 4 due to the effect of the pressure difference, is condensed in the heat radiating section 4 cooled by the outside air by the fan 7, and changes into a refrigerant liquid.
  • the condensed refrigerant liquid is supplied again to the heat receiving unit 3 through the return path 6 connected to the lower header 10 and the backflow prevention unit 8.
  • the circulation direction of the refrigerant is defined in one direction by the backflow prevention unit 8.
  • the material of the backflow prevention unit 8 is preferably a sintered body such as a porous metal sintered body or a metal fiber sintered body.
  • the shape of the backflow prevention unit 8 preferably has a different diameter reduction part, a narrow tube, a bent tube, and a valve body, and the refrigerant vapor circulates toward the heat radiation path 5 due to the flow path resistance due to the structure of the backflow prevention unit 8. There is no particular limitation as long as the action of urging the user to perform is obtained.
  • FIG. 3 is a graph showing the saturation pressure of the refrigerant in the cooling device according to the first embodiment of the present invention.
  • Fig. 3 shows the saturation pressure of pure water and ethanol as an example.
  • the refrigerant is driven in the range of 20 to 70 ° C. during normal operation of the heating element 2.
  • the saturation pressure of the refrigerant at this time is not more than atmospheric pressure (0.1 MPa) in any case. For this reason, air that is a non-condensable gas in the atmosphere leaks into the cooling device 1 from a slight gap in the structure of the cooling device 1.
  • the cooling device 1 is basically made of a metal material, and each member is connected in an airtight manner.
  • the heat receiving part 3 itself, the connection between the heat receiving part 3 and the heat radiation path 5, the connection between the heat receiving part 3 and the feedback path 6, the connection between the heat radiation part 4 and the heat radiation path 5, and the heat radiation part 4 and the feedback path 6 Connected with, brazed or welded.
  • connection between the first valve 11 and the second valve 14 and the air tank 12 are, for example, screwed joints. And metal pipe joints are used.
  • valve bodies of the first valve 11 and the second valve 14 are kept airtight by a seal structure of the valve shaft (for example, O-ring flat packing, metal seal, etc.).
  • the air leaking from the airtight connection performed under the normal manufacturing process and manufacturing control has a lower density than the refrigerant vapor. For this reason, while being mixed with the refrigerant in the refrigerant circulation path, the refrigerant gradually accumulates in the upper header 9 of the heat radiating section 4 located in the upper part in the cooling device 1 as well. At this time, if the first valve 11 is opened and the second valve 14 is closed, the leaked air flows into the air tank 12 installed above the upper header 9 and is stored. Thereby, the leaked air is held in the air tank 12 positioned outside the main path of the refrigerant circulation path. For this reason, even if air leaks, the cooling performance of the cooling device 1 is unlikely to be reduced, and the cooling device 1 that can obtain stable cooling performance can be provided.
  • the air tank 12 has a sufficient capacity to store air leaking over a period of several years. However, it is possible to prevent the cooling performance of the cooling device 1 from being lowered and to provide a highly reliable cooling device 1 by performing evacuation maintenance when periodically inspecting the cooling device 1.
  • a vacuum pump (not shown) is connected to the second valve 14 and is in a driving state.
  • the second valve 14 is opened after the first valve 11 is closed, the air stored in the air tank 12 is evacuated together with the refrigerant vapor by a vacuum pump. At this time, by closing the first valve 11, the excessive refrigerant is not discharged.
  • the pressure detector 15 it can be confirmed by the pressure detector 15 whether the vacuum is sufficiently exhausted. If the vacuum is sufficiently exhausted, the second valve 14 may be closed and the vacuum pump may be stopped and removed. After that, by opening the first valve 11, the air leaking again can be stored in the air tank 12.
  • the cooling performance of the cooling device 1 can be maintained by a simple vacuum exhaust maintenance work without performing a complicated operation of replacing the main body of the cooling device 1.
  • the shape of the air tank 12 is preferably a cylindrical shape, but is not limited thereto.
  • the whole or part of the bottom of the air tank 12 may be a drain reservoir, and may have an inverted triangular pyramid shape or a shape with a recess.
  • it is desirable that the upper end of the inverted triangular pyramid shape or the shape having the concave portion is disposed at a position lower than the first valve 11, and it is further desirable to connect the second valve 14 to the drain reservoir.
  • water can be stored in the drain reservoir, and can be drained during vacuum exhaust maintenance.
  • an alarm device that works in conjunction with the pressure detector 15 may be provided. In this case, when an abnormality occurs in the cooling device 1 and the internal pressure rises, an alarm can be generated or the heating element 2 can be stopped.
  • a heat transfer section that thermally connects the air tank 12 and the case 31 may be provided.
  • heat can be radiated from the air tank 12 to the case 31 and the air tank 12 can be kept at a temperature equivalent to the outside air temperature.
  • the inside of the case 31 is heated by the waste heat from the electronic device 30, and the pressure in the air tank 12 rises to prevent the air stored in the air tank 12 from flowing back to the upper header 9 side. be able to.
  • FIG. 4 is a partially enlarged schematic view of the heat dissipating section 4 and the air tank 12 of the cooling device according to the second embodiment of the present invention.
  • the first valve 11 is provided between the opening 32 of the lower header 10 of the heat radiating unit 4 and the suction port 33 of the air tank 12.
  • the opening 32 of the lower header 10 and the suction port 33 of the air tank 12 are arranged so as to communicate with each other via the first valve 11.
  • the air tank 12 is installed below the lower header 10 of the heat radiating section 4.
  • the air tank 12 is provided with an exhaust port 13 and an exhaust port 35 below the suction port 33.
  • the exhaust port 13 is provided closer to the case 31 than the discharge port 35.
  • a second valve 14 is provided at the exhaust port 13.
  • the discharge port 35 is provided with a third valve 34, and the air tank 12 communicates with the return path 6 through the third valve 34 and the discharge port 35.
  • the air tank 12 When the air tank 12 communicates with the upper header 9 of the heat radiating unit 4 and the air tank 12 is installed above the heat radiating unit 4, leaked air is likely to be stored in the air tank 12. However, the air tank 12 may be communicated with the lower header 10 of the heat radiating unit 4 and installed below the heat radiating unit 4. At this time, a discharge port 35 in which a third valve 34 is further provided in the air tank 12 is provided below the suction port 33, and the air tank 12 communicates with the return path 6 via the third valve 34 and the discharge port 35. I am letting.
  • the refrigerant liquid collected in the lower header 10 of the heat radiating section 4 flows into the air tank 12 via the first valve 11 and the suction port 33 of the air tank 12, and the discharge port 35 and the third valve of the air tank 12. It flows out to the return path 6 via 34. Since the lower header 10 is provided on the downstream side of the heat radiating portion 4, the temperature is low and the pressure is also low. Therefore, the leaked air flows into the lower header 10 having a low pressure. The air leaked together with the flow of the refrigerant liquid flows into the air tank 12 from the lower header 10 and is stored in the air tank 12.
  • FIG. 5 is a partially enlarged schematic view of the heat dissipating section 4 and the air tank 12 of the cooling device according to Embodiment 3 of the present invention.
  • the air tank 12 is not directly connected to the heat radiating unit 4 but communicates with the return path 6 through the first valve 11 and the suction port 33.
  • the air tank 12 is installed below the lower header 10 of the heat radiating section 4.
  • the air tank 12 is provided with a discharge port 35 below the suction port 33.
  • the discharge port 35 is provided with a third valve, and the air tank 12 communicates with the return path 6 via the third valve 34 and the discharge port 35.
  • both the suction port 33 of the air tank 12 and the discharge port 35 provided therebelow communicate with the return path 6.
  • the air tank 12 When the air tank 12 communicates with the upper header 9 of the heat radiating unit 4 and the air tank 12 is installed above the heat radiating unit 4, leaked air is likely to be stored in the air tank 12. However, the air tank 12 may be communicated with the return path 6 and installed below the heat radiating unit 4. At this time, a discharge port 35 provided with a third valve 34 in the air tank 12 is provided below the suction port 33, and the air tank 12 is communicated with the return path 6 through the third valve 34 and the discharge port 35. ing. As a result, the refrigerant liquid accumulated in the lower header 10 of the heat radiating section 4 flows out to the return path 6 downstream of the heat radiating section 4, and further to the air tank 12 communicated with the return path 6, the first valve 11 and the air tank 12.
  • the refrigerant liquid that has flowed into the air tank 12 flows out to the return path 6 via the discharge port 35 and the third valve 34 of the air tank 12. Since the return path 6 is provided on the downstream side of the heat radiating section 4, the temperature is low and the pressure is low. Therefore, the leaked air flows into the return path 6 having a low pressure. The air leaked along with the flow of the refrigerant liquid also flows from the return path 6 into the air tank 12 and is stored in the air tank 12.
  • the cooling device of the present invention stores air outside the main route of the refrigerant circulation route even when air that is a non-condensable gas leaks into the cooling device. Further, the stored air can be subjected to vacuum exhaust maintenance. As a result, the cooling performance is stably obtained and the reliability is high, so that heat is generated from electronic devices such as a central processing unit (CPU), a large scale integrated circuit (LSI), and an insulated gate bipolar transistor (IGBT). It is useful as a cooling device for cooling equipment.
  • CPU central processing unit
  • LSI large scale integrated circuit
  • IGBT insulated gate bipolar transistor

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Sustainable Development (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

L'invention concerne un dispositif de refroidissement pourvu : d'une voie de circulation de liquide de refroidissement dans laquelle une partie recevant de la chaleur dans laquelle un corps produisant de la chaleur est installé, d'une voie de dissipation de chaleur (5), d'une partie de dissipation de chaleur (4) et d'une voie de retour (6) sont raccordées dans cet ordre; et d'un réservoir d'air (12) pourvu d'une ouverture d'entrée (33) et d'une ouverture d'évacuation (13). L'ouverture d'entrée (33) est pourvue d'une première soupape qui communique avec l'une ou l'autre partie de dissipation de chaleur (4) ou de la voie de retour (6). L'ouverture d'évacuation est pourvue d'une seconde soupape.
PCT/JP2015/006289 2014-12-24 2015-12-17 Dispositif de refroidissement WO2016103655A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2014-259878 2014-12-24
JP2014259878 2014-12-24
JP2015128252A JP2016121865A (ja) 2014-12-24 2015-06-26 冷却装置およびこれを搭載した電子機器
JP2015-128252 2015-06-26

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Publication Number Publication Date
WO2016103655A1 true WO2016103655A1 (fr) 2016-06-30

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS614145Y2 (fr) * 1981-06-15 1986-02-07
JPS62112992A (ja) * 1985-11-13 1987-05-23 Gadelius Kk 熱交換器の運転方法
JPS6314279B2 (fr) * 1979-04-17 1988-03-30 Babcock Hitachi Kk
JPH0144951Y2 (fr) * 1985-10-03 1989-12-26

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6314279B2 (fr) * 1979-04-17 1988-03-30 Babcock Hitachi Kk
JPS614145Y2 (fr) * 1981-06-15 1986-02-07
JPH0144951Y2 (fr) * 1985-10-03 1989-12-26
JPS62112992A (ja) * 1985-11-13 1987-05-23 Gadelius Kk 熱交換器の運転方法

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