WO2016098175A1

WO2016098175A1 - Circuit inspection probe device

Info

Publication number: WO2016098175A1
Application number: PCT/JP2014/083208
Authority: WO
Inventors: 正人内海
Original assignee: Ｗｉｔ株式会社
Priority date: 2014-12-16
Filing date: 2014-12-16
Publication date: 2016-06-23

Abstract

Provided is a circuit inspection probe device with which it is easy to visually confirm, from the front of the device, that a stroke contraction state of an appropriate ratio is reached. A circuit inspection probe device (10) for performing mainly an electrical test has a probe (2) that is planted in a probe retention hole (8) and is replaceable, and the circuit inspection probe device ensures conduction between a contact point (1) of the probe (2) and a microelectrode section (21) which is disposed on a substrate (20) under test and which can be contacted by the contact point (1), wherein: the probe (2) is constituted by a telescopic structure (6) in which a mandrel section (5) against which a pressing force is applied in the direction of being pushed out by the elastic force of a spring is inserted and fit into a sheath section (4) accommodating the spring; the mandrel section (5) is composed of a base section (51) able to advance or withdraw in accordance with extension or contraction of the telescopic structure (6) along an axis (7) over one straight line relative to the sheath section (4), and a head section (52) extending from the base section (51); and a cut-out section (50) is engraved into an outer peripheral surface of the base section (51).

Description

Probe device for circuit inspection

The present invention relates to a probe that is used in contact with a microelectrode portion such as a test land disposed on a substrate to be inspected so as to ensure reliable conduction in a circuit inspection apparatus that mainly performs an electrical test. In particular, it is possible to strictly manage the stroke that contracts when the probe is in contact with the microelectrode part and the probe pressing force that is applied to the contact by the stroke. The present invention relates to a probe device for circuit inspection provided with a necessary probe.

Conventionally, an electrical inspection / test probe device for a circuit board uses a plurality of probes made of metal needles arranged in parallel and fixed with a resin, and is brought into contact with an electrode portion formed on the circuit board. By doing so, the circuit was inspected and tested. For example, a probe device including a probe for performing electrical inspection and testing on a semiconductor IC wafer, a flat panel display or the like (circuit board) formed on a large scale with high accuracy and high density is known.

The probe device allows the probe to be replaced individually, making repairs when the probe is broken easy and inexpensive. In addition, the probes are densely arranged so that the circuit under test can be made smaller and more highly integrated. Further, the periphery of the probe is configured not to be adversely affected by dust or dust. In addition, it is possible to increase the contact pressure between the probe tip and the circuit to be measured, and to perform accurate measurement with more reliable contact.

Further, in this method, since the assembly of probes is performed manually one by one, it is pointed out that the accuracy and pitch limit and cost increase for the electrode part of the circuit board formed at a high density. . Furthermore, due to the progress of element and circuit technology, the distance between the electrodes tends to be narrowed, and the inspection apparatus main body to which the probe is attached is also required to be downsized due to the relationship between electrical failure and installation area.

Therefore, it has been desired to reduce the thickness of the probe as much as possible so as to reduce the size of the inspection apparatus and to cope with the miniaturization and high accuracy of the assembly cost and the distance between the electrodes. In response to such a demand, a thin plate-like probe described in Patent Document 1 has been proposed. The probe is attached to a narrow groove formed in a probe mounting portion of a probe device and fixed, a plurality of beams extending in parallel from the mounted portion, and a distal end portion of the beam. The electrode contact protrusion is formed and protruded in the bending direction of the beam.

JP-A-8-262061

However, even if the shape of the probe is a plate shape described in Patent Document 1 or a needle shape other than that, there are the first and second problems described below.
The first problem is that in the probe device for circuit inspection, depending on the place where the probe is implanted, the probe stroke may be a non-optimal setting, and adjustment is required.

The reason for this is that the base plate that forms the probe support and has the probe holding hole has undulations and is not flat, so from the probe sheath that differs in height depending on where it is implanted on the base plate, This is because a difference occurs in the distance to the substrate. The base plate material that supports the sheaths of the probes having different heights depending on the wave is a glass epoxy plate, an acrylic plate, etc., and the flatness of the surface is kept within 0.1 mm due to their properties. It is considered difficult. As a result, the probe stroke may deviate from the optimum value by 0.1 mm or more.

Also, as another cause of the probe stroke deviating from the optimum value, it can be considered that the substrate to be inspected has a tendency to warp. In addition to the warpage, even though the lead wires of the electronic components soldered to the board to be inspected are cut and aligned, the test land is affected by the difference in the length of the remaining lead wires. The height of the solder deposited on (hereinafter also referred to as “microelectrode”) also varies slightly depending on the type of substrate to be inspected. As a result, since the distance from the sheath portion of the probe implanted in the probe holding hole of the base plate to the surface of the microelectrode is not constant, the probe stroke also changes considerably. As a result, the contact pressure between the contact on the probe side and the microelectrode on the inspected substrate side deviates from the optimum value, thereby degrading the inspection accuracy.

Therefore, when implanting a probe for new installation or replacement, it is necessary to finely adjust the probe stroke to an optimum value according to the undulation of the base plate or the type of the substrate to be inspected.
That is, under the condition that the substrate to be inspected having a specified height contacts the head of the probe implanted in the circuit inspection probe device, the circuit inspection probe device is It is essential to visually check from the front. As described above, it is necessary to strictly manage the stroke that contracts when the probe in contact with the microelectrode portion is in contact with the probe and the probe pressing force applied to the contact by the stroke.

The second problem is that there is room for improvement in compatibility with the extraction tool for the user to remove the probe from the inspection apparatus main body, and a probe having a shape that can be easily grasped by a tool or the like is desired. It is a problem.

The present invention has been made in view of such problems, and a first object is to provide an appropriate condition under the condition that a substrate to be inspected at a specified position contacts the tip of a probe implanted in a circuit inspection probe device. It is possible to easily visually check from the front of the circuit inspection probe device that it is in a contracted state with a ratio stroke, and thereby, a stroke that contracts when the probe abuts on the microelectrode part during inspection, and the stroke It is an object of the present invention to provide a probe device for circuit inspection capable of strictly controlling the probe pressing force applied to the contact by the above and capable of quickly adjusting if the setting is inappropriate.
A second object of the present invention is to provide a circuit inspection probe device that allows a user to easily grasp the probe more reliably because the user removes the probe from the inspection device body.

The present invention has been made to achieve such an object. The invention according to claim 1 is directed to a probe support portion (9) having a probe holding hole (8) and the probe holding hole (8). And a replaceable probe (2, 112, 122, 200), and a substrate (20) to be inspected that can be contacted by the contact (1) of the probe (2, 112, 122, 200) A probe device (10) for circuit inspection that mainly conducts an electrical test while ensuring electrical continuity with the microelectrode portion (21) disposed on the probe, wherein the probe (2, 112, 122, 200) is a spring. The mandrel (5, 115, 125, 135) in which the pressing force is urged to the sheath-like portion (4, 104, 114, 124) containing (3) by the elastic force of the spring (3). ) Inserted telescopic (6 The mandrel portion (5, 115, 125, 135) can extend and contract the telescopic (6) along a straight axis (7) with respect to the sheath-like portion (4, 104, 114, 124). Accordingly, the base (51) can be moved forward and backward, and a head (52, 153) extending from the base (51). A notch (50) is formed on the outer peripheral surface of the base (51). It is characterized by being engraved.

According to a second aspect of the present invention, in the probe device for circuit inspection according to the first aspect, the shape of the notch (50) is an annular groove (50a) having the axis (7) as a central axis. It is characterized by comprising.

According to a third aspect of the present invention, in the probe device for circuit inspection according to the first aspect, the shape of the notch (50) is an annular locus (70) having the axis (7) as a central axis. It is characterized by being comprised by several recessed part (50c) provided along.

According to a fourth to sixth aspect of the present invention, in the circuit inspection probe device according to any one of the first to third aspects, the shape of the notch (50) includes the axis (7). The cross section includes a square notch (50b).

The invention according to claim 7 is the probe device for circuit inspection according to any one of claims 1 to 6, wherein the position where the notch (50) is engraved is the base (51). And the head (52, 153) is set closer to the base (51) than the boundary (40), and the mandrel (5, 115) with respect to the sheath (4, 104, 114, 124). , 125, 135) is a position away from the head (52, 153) by a length (55) of 1/3 or less of the full stroke (53) which is the maximum distance that can be moved forward and backward.

The invention described in

claims

8 and 9 is the circuit inspection probe device according to any one of claims 1 to 7, wherein the notch (50) is provided in the circuit inspection probe device (10). It is characterized by the relationship of the unevenness | corrugation adapted to the shape of the meshing part (31) of the extraction tool (30) for removing the said probe (2,112,122,200) from the main body of this.

According to the present invention, first, under the condition that the substrate to be inspected at the specified position contacts the tip of the probe implanted in the circuit inspection probe device, it is in a state of being contracted at an appropriate ratio of stroke, It can be easily visually confirmed from the front of the circuit inspection probe device. This makes it possible to strictly manage the stroke that contracts when the probe abuts the microelectrode and the probe pressing force that is applied to the contact by that stroke, and promptly if the setting is inappropriate Can be adjusted.
Second, since the user removes the probe from the main body of the inspection apparatus, it is possible to provide a circuit inspection probe apparatus that can make it easier to grasp the probe more reliably.

FIG. 1A is a schematic explanatory diagram of a device (hereinafter also referred to as “prerequisite device”) as a premise of a circuit inspection probe device (hereinafter also referred to as “present device”) according to an embodiment of the present invention. FIG. 1B shows the time when the inspection is performed, and FIG. 1C shows the standby time of the base device having serrated contacts. It is a graph which shows the relationship between a stroke and probe pressing force about the premise apparatus of FIG. 1, and this apparatus of FIG. FIG. 3A is a front view for visually confirming whether or not the apparatus is in a 2/3 stroke contraction state, FIG. 3A is in a standby state, FIG. 3B is an appropriate case for 2/3 stroke contraction, and FIG. The case where it is inappropriate because it is less than / 3 strokes is shown. FIG. 4A is an explanatory view of an extraction tool for removing a probe from the main body of the apparatus, FIG. 4A is a plan view of an extraction tool that holds the vertical probe from the horizontal direction while looking down on the apparatus from above, and FIG. 4B is an extraction tool of FIG. FIG. 4C is a cross-sectional view taken along line XX of FIG. 4B. It is a partial longitudinal cross-sectional view which shows the detail of the probe employable for this apparatus. FIG. 6A is a partial vertical cross-sectional view showing probes of different details that can be used in this apparatus, FIG. 6A is a structure having two step portions for restricting the advancing and retreating operation of the mandrel, and FIG. The structure which made the step part which regulates to one place is shown, respectively. 7A is a front view showing a modified example of the notch that can be employed in the present apparatus, FIG. 7A is a notch having the shape shown in FIG. 3, FIG. 7B is a notch having an inclined surface from a small diameter part to a large diameter part, and FIG. FIG. 7B shows a notch portion in which a small diameter portion in the notch portion shown in FIG. FIGS. 8A and 8B are explanatory views of a notch portion constituted by a plurality of recesses that can be employed in the present apparatus, FIG. 8A is a front view, and FIG.

Embodiments of the present invention will be described below with reference to the drawings. In addition, in each figure, the same code | symbol is attached | subjected to the member which has the same function, and description is abbreviate | omitted.
FIG. 1 is a schematic explanatory view of a device (premise device) that is a premise of a circuit inspection probe device according to an embodiment of the present invention. FIG. 1A is a standby state, FIG. 1B is a test execution time, and FIG. Each of the stand-by devices having a contact point in the state of standby is shown. As shown in FIG. 1C, in the case of the probe 101 having the crown 153 having the saw-shaped contact 1a, the tips are gathered at one point as shown in FIGS. 1A and 1B. The usage pattern is the same as that in the case of the probe 102 having the cusp-shaped head portion 152. Accordingly, the “head” in the present invention includes not only the head 152 having the pointed contact 1, but also the crown 153 having the saw-shaped contact 1 a as well as the head having various shapes of contacts. included.

As shown in FIG. 1, a circuit inspection probe device (premise device) 100 is a device that includes a probe 102 that is mainly placed on a printed circuit board 20 and makes electrical contact in order to conduct an electrical test. The contact 1 at the tip of the probe 102 is brought into contact with a microelectrode portion 21 such as a test land disposed on the printed circuit board 20 to be inspected to ensure conduction. The probe 102 is worn out in accordance with the frequency of use, so that the probe 102 is replaced with a new one every time it is confirmed that the prescribed wear limit has been reached.

As will be described later with reference to FIGS. 5 and 6, the probe 102 applies a pressing force to the sheath-like portion 4 containing the spring 3 (not shown in FIG. 1) in the direction in which it is pushed out by the elastic force of the spring 3. The telescopic (telescopic: a structure in which overlapping cylinders and the like are expanded and contracted) 6 is inserted. The mandrel part 105 is composed of a base part 151 that can advance and retreat in accordance with the expansion and contraction of the telescopic 6 along the straight axis 7 with respect to the sheath-like part 4, and a head part 152 that extends from the base part 151. . The maximum distance at which the mandrel 105 can move back and forth with respect to the sheath 4 of the probe 102 is referred to as a full stroke 53. In the probe 102, when the full stroke 53 is shortened, the contact 1 can be lowered until the boundary 40 between the base portion 151 and the head portion 152 becomes as high as the upper end of the sheath-like portion 4.
The virtual mark 59 is shown only in FIGS. 1 and 3 for convenience of explaining the stroke.

FIG. 2 is a graph showing the relationship between the stroke and the probe pressing force for the base device of FIG. 1 and the device of FIG. 3 described later. The horizontal axis in FIG. 2 indicates the stroke (mm), and the vertical axis indicates the probe pressing force (N). The stroke (mm) and the probe pressing force (N) are the hook laws represented by “spring measurement” and the like. It is a system that obeys Therefore, the expansion / contraction length (stroke) is directly proportional to the load (probe pressing force). The case where the virtual mark 59 is at the position shown in FIG. 1A is a standby time, and the stroke in FIG. 2 is 0 mm. Further, when the virtual mark 59 is at the position shown in FIG. 1B, the inspection is performed, and the stroke in FIG. 2 is set to 4.3 mm, that is, the standard expansion / contraction 54 shown in the following equation.
Standard expansion / contraction 54 (stroke 4.3 mm) = (2/3) x full stroke 53 (6.4 mm)
It should be noted that (2/3) is the optimum value for the coefficient in the above equation. However, a more appropriate coefficient can be selected depending on the contact and spring materials and other conditions. For example, it can be appropriately selected from the range of 0.5 to 0.8.

The graph of FIG. 2 is measurement data for supporting the performance specifications of the “3N pressure probe” circuit inspection probe device nominally (hereinafter also referred to as “catalog description”) based on general specifications. In other words, the “3N pressing force probe” described in the catalog refers to a “probe that contacts the electrode to be inspected with 3N pressing force when used in the 2/3 stroke of the specified normal use form”. means.

The “3N pressing force probe” will be described more specifically with reference to FIGS. 1 and 2 (the same applies to FIG. 3). The base device 100 protrudes so that the mandrel part 105 exposes all of the full stroke of 6.4 mm from the sheath part 4 at the time of standby shown in FIG. 1A. Even if the printed circuit board 20 does not push down the mandrel part 105 of the base device 100, as long as the minute electrode part 21 is in contact with the contact point 1, as shown at the left end of the graph of FIG. A probe pressing force of less than 1N is applied at 0 mm (also referred to as “stroke”).

Further, when the microelectrode portion 21 comes into contact with the contact 1 and the printed circuit board 20 is in a positional relationship such that the mandrel portion 105 of the base device 100 is pressed down strongly, as shown at the right end of the graph of FIG. A probe pressing force of slightly over 4N is applied at 4 mm. However, the contact 1 and the microelectrode portion 21 cannot be pressed more strongly in a state in which the mandrel portion 105 is pressed against the sheath-like portion 4 with a full stroke of 6.4 mm. In such a setting, since the circuit inspection probe device 100 or the printed circuit board 20 to be inspected is damaged, the setting in such a positional relationship is avoided.

When performing the inspection shown in FIG. 1B, as described in the catalog, it is a “probe that makes the contact point contact with the electrode to be inspected with 3N pressing force when it is used in the 2/3 stroke of the specified normal use form”. The probe pressing force of 3N is applied at a position advanced by 2/3 from the left end of FIG. 2 to the right, that is, (2/3) × full stroke 6.4 mm = stroke 4.3 mm. Depending on the specifications of the printed circuit board 20 to be inspected, a probe other than the “3N pressing force probe” is appropriately selected and adopted. That is, the “3N pressing force probe” is only an average example of the current situation.

The probe pressing force of 3N is an optimum value that can be said to be the greatest common divisor derived from the user's experience, and causes the circuit inspection probe device 100 performed by bringing the microelectrode portion 21 into contact with the contact 1 to exhibit the specified performance. Is a necessary condition. The specified performance refers to reasonable performance expected including inspection accuracy, work efficiency, equipment life, and overall operation cost. The specified performance can be exhibited by using the setting in which the contact 1 abuts on the microelectrode portion 21 with a 2/3 stroke as specified so as to give a probe pressing force of 3N. Therefore, in order to manage the probe pressing force, it is necessary to maintain and manage the setting for maintaining the positional relationship of “2/3 stroke 4.3 mm”.

Also, in the present apparatus 10, depending on the place where the probe 2 is implanted, the probe stroke may become a non-optimal setting, and adjustment is required. The cause is that the base plate that forms the probe support portion 9 and has the probe holding hole 8 has undulations (see FIG. 3C) and is not flat. Therefore, the probe differs in height depending on the place where it is implanted on the base plate. This is because there is a difference in the distance from the second sheath portion 4 to the printed circuit board 20. The material of the base plate that supports the sheath portions 4 of the probes 2 having different heights depending on the undulation is a glass epoxy plate, an acrylic plate, etc., and due to their properties, the surface flatness is within 0.1 mm. It is considered difficult to hold. As a result, the probe stroke may deviate from the optimum value by 0.1 mm or more.

Further, as another cause of the probe stroke deviating from the optimum value, although detailed illustration is omitted, it is conceivable that the printed circuit board 20 has a tendency to warp. Further, in addition to the warpage, the test land is influenced by the difference in the length of the remaining lead wire even though the lead wire of the electronic component soldered to the printed circuit board 20 is aligned. The height of the solder deposited on the (microelectrode) 21 also varies slightly depending on the type of the printed circuit board 20. As a result, since the distance from the sheath 4 of the probe 2 implanted in the probe holding hole 8 of the base plate to the surface of the microelectrode 21 is not constant, the probe stroke also changes considerably (the height in FIG. 3C). (See G). As a result, the contact pressure between the contact 1 on the probe 2 side and the microelectrode 21 on the printed circuit board 20 side deviates from the optimum value, thereby degrading the inspection accuracy.

Therefore, when implanting the probe 2 for new or replacement, it is necessary to finely adjust the probe stroke to an optimum value according to the type of the printed circuit board 20.
That is, it is visually observed from the front of the apparatus 10 that the 2/3 stroke contracted state is surely obtained under the condition that the printed circuit board 20 having a specified height contacts the head 152 of the probe 2 implanted in the apparatus 10. It is essential to confirm. Thus, it is necessary to strictly manage the stroke 54 that contracts when the probe 2 is in contact with the microelectrode portion 21 and the probe pressing force that is applied to the contact 1 by the stroke 54. is there.

FIG. 3 is a front view for visually confirming whether or not the present apparatus is in a 2/3 stroke contraction state. 3A is in standby mode, that is, the substrate to be inspected is not placed on the apparatus, so that the contracting stroke is 0 mm, and FIG. 3B is optimal to maintain the positional relationship of “2/3 stroke 4.3 mm”. FIG. 3C shows the case where the probe set to a high height is properly contracted by 2/3 stroke, and is inappropriate because it is less than 2/3 stroke. The basic configuration of the apparatus 10 shown in FIG. 3 is similar to that of the premise apparatus 100 shown in FIG. 1. explain. In addition, when the full stroke 53 is shortened, the probe 2 of the present apparatus 10 shown in FIG. 3 contacts the boundary 1 between the base 51 and the head 52 until the height is about the same as the upper end of the sheath 4. Can be lowered. In that respect, it is the same as the prerequisite device 100 of FIG.

The difference is that a notch 50 is engraved at a predetermined position of the base 51 of the apparatus 10. Since this notch 50 is easy for the user to see, if the notch 50 is lifted as shown by height G as shown in FIG. It is possible to easily detect that it is appropriate. In this case, the reason why the setting of the height is inappropriate is that the probe holding hole 8 that should originally be a uniform flat surface undulates and the sheath-like portion 4 is set inappropriately low. . As a result, the distance from the sheath-like part 4 set inappropriately low to the microelectrode part 21 positioned at an appropriate height is longer than usual, so that the stroke is increased by the amount indicated by the height G. . Therefore, the notch 50 is effective as a mark for managing the distance from the sheath 4 of the probe 2 to the microelectrode 21.

The predetermined position where the notch 50 effective as a mark is engraved is the head 52 by a length 55 that is 1/3 or less of the entire stroke 53 set from the boundary 40 between the base 51 and the head 52 to the base 51 side. It is the position away from. If it is the position of this notch part 50, it is easy to visually check unlike the position of the virtual mark 59 which is hidden in the sheath part 4 except stroke 0mm. Further, the shape of the notch 50 is constituted by an annular groove 50a having the axis 7 as a central axis. Further, the shape of the notch 50 is a shape in which a square notch 50 b is included in the cross section including the axis 7.

According to the present invention, first, it is possible to easily monitor the distance from the sheath 4 of the probe 2 to the microelectrode 21. That is, the height of the notch 50 at the time of performing the inspection shown in FIG. 3B substantially coincides with the upper end of the sheath-like portion 4 if it is as specified. On the other hand, if the probe support 9 is set in the direction in which it sinks, and the sheath 4 is set inappropriately low, the microelectrode positioned at the appropriate height from the sheath 4 set inappropriately low Since the distance to the part 21 is longer than usual, the contact 1 at the tip of the mandrel part 5 can be brought into contact with the microelectrode part 21 unless the mandrel part 5 is lifted up by the height G. become unable. The user can easily detect that the notch 50 is lifted as indicated by the height G by visual observation from the horizontal direction. As a result, as shown in FIG. 3C, when the user visually confirms that the height G from the upper end of the sheath-like part 4 is conspicuously increased with respect to the position of the

notch part

50, 8 to adjust and correct the sheath 4 to lift.

In addition, according to the present invention, secondly, when the probe 2 is removed from the main body of the circuit inspection probe device 10, the probe 2 can be further removed by a pulling tool obtained by the user as will be described later with reference to FIG. It becomes possible to make sure that it is easy to grasp.

FIG. 4 is an explanatory view of a pulling tool for removing the probe from the main body of the apparatus, FIG. 4A is a plan view of the pulling tool that holds the upright probe from the horizontal direction while looking down on the apparatus from above, and FIG. 4A is a partially enlarged side view of the distal end portion of the extraction tool of FIG. 4A viewed from the A direction, and FIG. 4C is a sectional view taken along line XX of FIG. 4B. As shown in FIG. 4A, the pulling tool 30 is preferably a gripping tool similar to a radio pliers, and has a meshing portion 31 that can obtain a meshing angle corresponding to the grip of the hand gripped by the operator. . The meshing portion 31 has an uneven relationship that fits so that it is difficult to slide off when the needle-like probe 2 is grasped.

As the first concavo-convex relationship, there is a case where the probe 2 and the probe 2 are gripped by the meshing portion 31 in a posture in which the longitudinal directions thereof intersect at right angles. The probe 2 is thin like a needle, and a substantial part has a cylindrical shape. It is preferable that recesses for receiving a corresponding portion for each half circumference of the columnar shape are provided at right angles to the respective longitudinal directions on the pair of contact surfaces constituting the meshing portion 31.

As the second concavo-convex relationship, there is a case where the probe 2 is grasped by the meshing portion 31 in a posture in which the longitudinal direction of the extraction tool 30 is aligned with the axis 7 of the probe 2. The needle-like probe 2 has a considerably thin cylindrical shape. It is preferable that the hollow which receives a corresponding part for every half circumference of the columnar shape is provided so that it may follow the longitudinal direction of each of a pair of contact surface which comprises the meshing part 31. FIG.

The notch portion 50 has a concave-convex relationship that fits the engagement portion 31 of the extraction tool 30 for removing the probe 2 from the circuit inspection probe device 10 main body more reliably. As an effect thereof, the extraction tool 30 can be used for circuit inspection without causing the probe 2 to be detached from the engagement portion 31 even if the probe 2 is pulled in the direction of the axis 7 after the probe 2 is securely held by the engagement portion 31. The probe 2 can be pulled out from the probe device 10.

Here, in each of the first and second concavo-convex relationships, it is preferable to provide the meshing portion 31 with a ridge that reliably engages the notch 50.
In the case of the first concavo-convex relationship, it is preferable that the extraction tool 30 is provided with protrusions resembling the shape of a nipper blade rather than the above-described radio pliers in the meshing portion 31. However, if the probe 2 is clamped with a normal nipper, for example, the notch 50 is cut in the direction of deepening, and therefore it is preferable to provide a cutting prevention mechanism that does not.

In the case of the second concavo-convex relationship, the extraction tool 30 corresponds to the half circumference of the columnar shape along the longitudinal direction of each of the pair of contact surfaces constituting the meshing portion 31 at the tip of the above-described radio pliers. A recess is provided to accept the portion. It is preferable to provide a ridge that circulates a part of the inner peripheral surface that constitutes the depression, so that the ridge can be reliably engaged with the notch 50.

According to the present invention, first, since the user can easily monitor the distance from the sheath-like portion 4 of the probe 2 to the microelectrode portion 21, it can be quickly adjusted if the setting is inappropriate. Second, when the user removes the probe from the main body of the inspection apparatus, it is possible to realize a circuit inspection probe apparatus that can more easily grasp the probe.

Hereinafter, a probe that can be used in the present apparatus will be described in more detail with reference to FIGS. 5 and 6.
FIG. 5 is a partial longitudinal sectional view showing details of a probe that can be used in the apparatus 10. The probe 112 shown in FIG. 5 is a needle-shaped mandrel in which a pressing force is urged in the direction of being pushed out by the elastic force of the spring 3 to the sheath-like portion 104 containing the spring 3 as described above with reference to FIG. The portion 115 is inserted so as to be extendable and telescopically configured. Further, when the entire stroke 53 is shortened, the probe 112 sinks the boundary 40 between the base and the head lower than the upper end of the sheath-like portion 104.

The mandrel portion 115 is formed with a small-diameter portion with a small diameter in the lower half that is always accommodated in the sheath-like portion 104. That is, except for the both ends of the mandrel part 115, the narrow-diameter part and the large-diameter part are constituted by two kinds of diameters. A standby height defining step 56 and a stroke defining step 58 are formed at the boundary between the small diameter portion and the large diameter portion. On the other hand, the sheath-shaped portion 104 is provided with a constricted portion having an inner diameter positioned about ３ lower than the upper end of the sheath-shaped portion 104 than the other inner diameters, and a stroke defining stopper 57 is formed.

In the telescopic probe 112, the mandrel portion 115 supported by the sheath-like portion 104 so as to advance and retract is advanced and retracted. When the advancing / retreating operation is performed, when the standby height defining step 56 and the stroke defining step 58 of the mandrel 115 abut against the stroke defining stopper 57, the forward movement is prohibited. In this way, the mandrel 115 of the probe 112 is defined in stroke.

FIG. 6 is a partial longitudinal sectional view showing a probe that can be used in the present apparatus and has different details. FIG. 6A is a structure having two step portions for restricting the advancing and retreating operation of the mandrel, and FIG. 6B is a mandrel. The structure which made the step part which regulates the advancing / retreating operation | movement of a part into one place is each shown. In the probe 122 shown in FIG. 6A, a standby height defining step 56 and a stroke defining step 58 are formed at two positions on the mandrel 125 as steps that restrict the forward and backward movement of the mandrel 125. As described above, the structure having two step portions is the same as the probe 112 described with reference to FIG.

The probe 122 in FIG. 6A is basically the same as the probe 112 in FIG. 5, and the standby height defining step 56 abuts on the stroke defining stopper 57 provided inside the sheath-shaped portion 114, thereby waiting. Height is specified. Further, when the stroke defining step 58 abuts against the stroke defining stopper 57, the mandrel 125 is defined with a stroke in the direction of sinking into the inner portion of the sheath-shaped portion 114.

In the probe 200 shown in FIG. 6B, only the standby height defining step 56 is formed at one position of the mandrel 135 as a step that restricts the reciprocating operation of the mandrel 135. According to this configuration, the stroke in the direction in which the mandrel part 135 sinks into the inner part of the sheath part 124 is not particularly strictly regulated. Therefore, the mandrel 135 can move back and forth until the spring 3 contracts or the contact 1 is submerged to the same height as the upper end opening of the sheath 124.

7 is a front view showing a modified example of the notch that can be used in the present apparatus, FIG. 7A is a notch having the shape shown in FIG. 3, and FIG. 7B is a notch having an inclined surface from a small diameter part to a large diameter part. FIG. 7C shows a notch part in which the small diameter part in the notch part shown in FIG. As illustrated in FIG. 7B, the cutout portion has a conical inclined surface 50 e formed from the small diameter portion 61 to the large diameter portion 62. FIG. 7C shows a cutout portion in which the small diameter portion 61a of the cutout portion having the conical inclined surface 50e shown in FIG.

FIG. 8 is an explanatory view of a cutout portion constituted by a plurality of recesses that can be employed in the present apparatus, FIG. 8A is a front view, and FIG. 8B is a cross-sectional view taken along line AA of FIG. 8A. As shown in FIG. 8B, the double notch 50 is constituted by a plurality of recesses 50c provided along an annular locus 70 having the axis 7 as a central axis.

As described above mainly with reference to FIGS. 3, 5, and 6, according to the present invention, first, the user can easily monitor the distance from the sheath portion of the probe to the microelectrode portion. Therefore, if the setting is inappropriate, there is an effect that it can be adjusted quickly. Secondly, when the user removes the probe for replacement from the main body of the inspection device, it is easier to grasp the probe more reliably, and it is less likely to slip out of the extraction tool even if the probe is pulled out. A probe device can be provided.

The circuit inspection probe device according to the present invention may be used in a substrate inspection device (circuit tester) that requires electrical performance inspection in units of printed circuit boards. More specifically, it can be employed in a probe device used to make accurate measurements by contacting a microelectrode portion such as a test land disposed on a substrate to be inspected to ensure reliable conduction. There is sex. In particular, for circuit inspection with probes that require strict management of the stroke that contracts when the probe abuts against the microelectrode part during inspection and the probe pressing force applied to the contact by that stroke There is a possibility of being employed in a probe device.

1 contact, 1a (saw-shaped: serrated) contact, 2,112,122,200 (this device 10) probe, 3 spring, 4,104,114,124 sheath, 5,115,125,135 ( Mandrel part, 6 telescopic, 7 axis, 8 probe holding hole, 9 probe support part, 10 probe apparatus for circuit inspection (this apparatus), 20 printed circuit board (inspection object), 21 microelectrode part (test land) Etc.), 30 extraction tool, 31 meshing part of (extraction tool 30), 40 (base 51, 151) and (head 52, 152, 153) boundary, 50 notch, 50a (annular) groove, 50b Cross section square cutout, 50c cross section square cutout, 50d cross section square cutout, 50e inclined surface, 51, 15 Base, 52,152 head, 153 crowned portion, 53 full stroke, 54 standard expansion / contraction (2/3 or more of full stroke 53), 55 remaining stroke (1/3 or less of full stroke 53), 56 standby height Stipulated step part, 57 stroke stipulated stopper, 58 stroke stipulated step part, 59 virtual mark, 61, 61a small diameter part, 62 large diameter part, 70 (annular with axis 7 as the central axis), 100 (this device) 10 (premise device) circuit inspection probe device (premise device), 101 (using crown portion 153) probe, 102 (premise device 100) probe, 105 (premise device 100) mandrel

Claims

A probe support portion having a probe holding hole, and a replaceable probe implanted in the probe holding hole,
A probe device for circuit inspection that mainly conducts an electrical test while ensuring electrical continuity with a microelectrode portion disposed on a substrate to be inspected that can be contacted by the probe contact,
The probe is constituted by a telescopic member in which a mandrel portion urged by a pressing force in a direction pushed by the elastic force of the spring is fitted into a sheath-like portion containing a spring,
The mandrel is
A base that can advance and retreat in accordance with the telescopic expansion and contraction along a straight axis with respect to the sheath-like portion;
And a head extending from the base,
A probe device for circuit inspection, wherein a cutout portion is formed on the outer peripheral surface of the base portion.
2. The probe device for circuit inspection according to claim 1, wherein the shape of the notch is formed by an annular groove having the axis as a central axis.
2. The probe device for circuit inspection according to claim 1, wherein the shape of the notch portion is constituted by a plurality of concave portions provided along an annular locus having the axis as a central axis.
2. The probe device for circuit inspection according to claim 1, wherein the shape of the notch is a shape in which a square notch is included in a cross section including the axis.
3. The probe device for circuit inspection according to claim 2, wherein the shape of the notch is a shape in which a square notch is included in a cross section including the axis.
4. The probe device for circuit inspection according to claim 3, wherein the shape of the notch is a shape in which a square notch is included in a cross section including the axis.
The position where the notch is carved is
It is set on the base side from the boundary between the base and the head,
7. The position according to claim 1, wherein the mandrel is at a position away from the head by a length equal to or less than 1/3 of a full stroke, which is a maximum distance at which the mandrel can move forward and backward with respect to the sheath. The probe device for circuit inspection according to claim 1.
The cut-away portion has a concavo-convex relationship suitable for a shape of a meshing portion of a drawing tool for removing the probe from the body of the circuit inspection probe device. The probe device for circuit inspection as described in the item.
9. The circuit inspection device according to claim 8, wherein the cutout portion has a concave-convex relationship adapted to a shape of a meshing portion of a drawing tool for removing the probe from a main body of the circuit inspection probe device. Probe device.