WO2016093460A1 - Masque de bord d'appareil d'électrodéposition à cellule horizontale et appareil d'électrodéposition à cellule horizontale comprenant ce masque - Google Patents

Masque de bord d'appareil d'électrodéposition à cellule horizontale et appareil d'électrodéposition à cellule horizontale comprenant ce masque Download PDF

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Publication number
WO2016093460A1
WO2016093460A1 PCT/KR2015/007185 KR2015007185W WO2016093460A1 WO 2016093460 A1 WO2016093460 A1 WO 2016093460A1 KR 2015007185 W KR2015007185 W KR 2015007185W WO 2016093460 A1 WO2016093460 A1 WO 2016093460A1
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Prior art keywords
edge mask
horizontal cell
edge
plating
plate
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PCT/KR2015/007185
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English (en)
Korean (ko)
Inventor
정우철
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주식회사 포스코
재단법인 포항산업과학연구원
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Publication of WO2016093460A1 publication Critical patent/WO2016093460A1/fr

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    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/002Cell separation, e.g. membranes, diaphragms

Definitions

  • the present invention relates to an electroplating apparatus. More particularly, the present invention relates to an electroplating apparatus having a horizontal cell structure and an edge mask used therein.
  • the steel sheet is electroplated according to the necessary purposes such as to impart corrosion resistance, to harden the surface, or to give the surface a gloss.
  • metal and metal alloys such as zinc or aluminum are electroplated on the surface of the steel sheet as desired.
  • the electroplated steel sheet is widely used as a material for home appliances and automobiles because of its excellent corrosion resistance and excellent surface appearance.
  • the electroplating method of the steel plate is called the vertical plating cell method (hereinafter referred to as 'vertical cell') and the horizontal plating cell method (hereinafter referred to as 'Horizontal Cell; Liquid cushion cell-Horizontal (LCC-H)'). This is known.
  • the vertical cell electroplating equipment is designed to electroplate while moving the steel plate in the vertical direction into the plating cell to which the plating solution is supplied. Since the vertical cell electroplating equipment has to install the plating cells in the vertical direction as described above, there is a problem in that the overall height of the electroplating equipment is increased. In addition, even if it is necessary to lengthen the line as necessary, it is difficult to extend the line equipment beyond a certain level because it is difficult to maintain the head pressure of the plating solution supplied inside the plating cell at a constant level. There is a problem.
  • the electroplating method has a problem in that the thickness of the plating layer is thin, the plating speed is low, and the plating solution is difficult to manage.
  • Horizontal cell electroplating equipment is a structure in which the plating cells are installed horizontally, and the steel plate is electroplated while the steel plates are moved between the horizontally installed plating cells.
  • a pair of plating electrodes disposed at the top and the bottom serves as an anode
  • a plating solution is supplied between the pair of plating electrodes
  • a steel plate moving between the pair of plating electrodes acts as a cathode to provide electricity.
  • Plating is in progress.
  • an edge mask surrounding the edge portion of the steel sheet may be applied.
  • the moving steel sheet has its own weight, which causes deflection of the steel sheet within a pair of plating electrodes, which makes it difficult to accurately position the steel sheet at the center of the edge mask. There is this.
  • the gap between the edge mask and the steel sheet edge must be kept constant in order to suppress the overcurrent shape concentrated on the steel sheet edge portion and form a uniform plating layer, but it is difficult to keep the gap constant due to the above problems. There is a problem.
  • the steel plate moving while the plating solution is injected into the pair of plating electrodes has a speed difference between the flow of the plating solution at the center of the steel plate and the flow of the plating solution at the edge of the steel plate, and the flow at the edge of the steel plate There is a problem that it is not smooth.
  • the plating layer formed is non-uniform, and the by-products and the reaction gas are not discharged smoothly due to the plating reaction, thereby causing a poor plating.
  • the flow of the plating solution flowing on the steel sheet is precisely controlled by precisely controlling the position of the steel sheet in the horizontal cell and the edge mask for uniform and defect-free electroplating. It is necessary to control the uniformity and to smoothly discharge the by-products and gases in the plating solution.
  • An edge mask of a horizontal cell electroplating apparatus and a horizontal cell electroplating apparatus is provided, which enables the edge mask to be easily positioned at the center of the horizontal cell using the flow of the plating solution.
  • the present invention provides an edge mask of a horizontal cell electroplating apparatus and a horizontal cell electroplating apparatus capable of keeping the edge mask in a central position.
  • the apparatus includes a horizontal cell including an upper plating electrode and a lower plating electrode disposed up and down with a steel plate interposed therebetween, and disposed at front and rear ends of the horizontal cell to be in close contact with the upper and lower surfaces of the steel plate, respectively.
  • the edge mask has a recessed recess formed to surround the edge of the steel sheet on the surface facing the edge of the steel sheet, a plurality of discharge passages are formed along the groove portion in communication with the groove to discharge the plating solution, the discharge The outlet of the passage is formed by the upper surface of the edge mask facing the upper plating electrode or the lower surface of the edge mask facing the lower plating electrode, so that the plating solution is applied to the upper surface of the edge mask and the upper plating electrode or / and the lower surface of the edge mask and the lower surface. It may be a structure to discharge between the plating electrodes.
  • the edge mask of the present embodiment has a widthwise edge of a steel plate in a horizontal cell of an electroplating apparatus including an upper plating electrode and a lower plating electrode disposed up and down with a steel plate interposed therebetween and a horizontal cell containing a plating solution therein.
  • An edge mask of a horizontal cell electroplating apparatus disposed in a groove, the groove having a recess recessed to surround the edge of the steel sheet on a surface facing the edge of the steel sheet, the plurality of discharge passages in communication with the groove to discharge the plating solution Is formed along the groove portion, and the outlet of the discharge passage is formed by the upper surface of the edge mask facing the upper plating electrode and / or the lower surface of the edge mask facing the lower plating electrode, thereby plating the plating solution with the upper surface of the edge mask and the upper plating. It may be a structure for discharging between the electrode or / and the lower surface of the edge mask and the lower plating electrode.
  • the edge mask of the present embodiment is a top plate extending to the upper edge of the steel sheet, a lower plate extending to the lower edge of the steel sheet, coupled between the upper plate and the lower plate to support the upper plate and the lower plate and the edge of the steel plate is accommodated between the upper plate and the lower plate
  • An intermediate member forming a portion, and a plurality of discharge passages formed at intervals along the intermediate member and communicating with the groove portion and extending outward to discharge the plating solution, and the discharge passage is formed on the upper plate to plate the discharge passage. It may include an upward passage for discharging the solution between the upper plate and the upper plating electrode, and an outlet is formed in the lower plate to discharge the plating solution between the lower plate and the lower plating electrode.
  • the discharge passage may have a structure in which an upward passage and a downward passage are alternately formed along the groove.
  • the discharge passage may have a structure in which the upward passage and the downward passage are formed at the same position along the groove.
  • the upward passage may further include an upper channel communicating with the outlet on the upper plate in a groove shape along the width direction of the steel plate, and having an upper portion open to allow the plating solution to flow out.
  • the downward passage may further include a lower channel communicating with the outlet on the lower plate in the shape of a groove along the width direction of the steel plate, and having a lower portion open to allow the plating solution to flow out.
  • the discharge passage may have a structure inclined from the groove toward the outlet.
  • the upper plate and the lower plate and the intermediate member may be integrally formed.
  • the edge mask may be controlled so that the steel sheet is located at the center between the upper plating electrode and the lower plating electrode of the horizontal cell by adjusting the sum of the cross-sectional area of the entire upward passage and the sum of the cross-sectional area of the overall downward passage.
  • the sum may be the same structure.
  • the edge mask may further include a rod connected to the rear surface of the intermediate member and extending to the outside of the plating electrode.
  • the edge mask may be made of an insulating material, and may be a material for PolyEthylene (PE), Polyether Etherketone (PEEK), Polyimide (PI), or a PCB substrate.
  • PE PolyEthylene
  • PEEK Polyether Etherketone
  • PI Polyimide
  • the plating solution in the horizontal cell is discharged smoothly to the outside of the edge mask through the discharge passage of the edge mask flows in the reverse direction along the traveling direction of the steel sheet It can keep smooth.
  • the plating solution in the horizontal cell is discharged smoothly to the outside of the edge mask through the discharge passage of the edge mask to remove the vortex phenomenon of the plating solution generated in the edge mask groove portion and plating
  • the plating solution in the horizontal cell is discharged smoothly to the outside of the edge mask through the discharge passage of the edge mask to remove the vortex phenomenon of the plating solution generated in the edge mask groove portion and plating
  • the discharge passage of the edge mask by forming the discharge passage of the edge mask to the upper and lower alternately, by controlling the number and size of the discharge passage and the flow rate and flow rate of the plating solution is discharged along the discharge passage By controlling, there is a technical effect to perform a stable plating operation.
  • the edge mask by guiding and discharging the plating solution between the edge mask and the upper and lower plating electrodes, the edge mask can always be located in the center of the horizontal cell by using the flow of the plating solution. Will be. Accordingly, there is a technical effect to minimize the plating failure caused by the edge mask is biased to one side.
  • the device it is possible to modify the design structure of the edge mask without changing the overall size of the edge mask of the existing horizontal cell electroplating apparatus, it is possible to change the existing horizontal cell electroplating equipment Compatible without replacement, the overall cost of electroplating manufacturing can be reliably lowered.
  • FIG. 1 is a schematic diagram showing the configuration of a horizontal cell electroplating apparatus according to the present embodiment.
  • FIG. 2 is a view schematically showing a cross-sectional cross-sectional structure of the horizontal cell electroplating apparatus according to the present embodiment.
  • 3 and 4 are perspective views showing the edge mask of the horizontal cell electroplating apparatus according to the present embodiment.
  • FIG. 5 is a cross-sectional view taken along the line A-A of FIG. 4 showing the edge mask according to the present embodiment.
  • FIG. 6 is a cross-sectional view taken along the line B-B of FIG. 4 showing the edge mask according to the present embodiment.
  • FIG 7 and 8 illustrate another embodiment of an edge mask.
  • FIG. 9 is a schematic view for explaining the operation of the horizontal cell electroplating apparatus according to the present embodiment.
  • FIG. 1 schematically shows the configuration of a horizontal cell electroplating apparatus according to the present embodiment
  • FIG. 2 schematically shows a cross-sectional cross-sectional structure of a horizontal cell electroplating apparatus.
  • the advancing direction of the steel sheet P means the x-axis direction in FIG. 1
  • the width direction of the steel sheet means the z-axis direction in FIG. 2
  • the inner side means the center side with respect to the width direction of the steel sheet.
  • Outside means outside.
  • the upper upward upward means in the y-axis direction in Figure 1
  • the lower downward downward means the downward in the y-axis direction.
  • the electroplating apparatus 100 includes a horizontal cell 10 in which a pair of plating electrodes are disposed up and down and the steel plate P moves horizontally into the space between the plating electrodes, and the front and rear ends of the horizontal cell 10. Is disposed in contact with the upper and lower surfaces of the steel sheet (P) (Conductor roll 20; Conductor roll, Back up roll 22; Solution supply for supplying a plating solution into the horizontal cell 10) 30, an edge mask 40 disposed at a widthwise edge of the steel sheet P in the horizontal cell 10.
  • the plated electrodes of the horizontal cell 10 include an upper plated electrode plated electrode 12 and a lower plated electrode plated electrode 14 which are spaced apart from each other so that the steel plate P can pass therebetween and serve as an anode. The plating solution is accommodated therebetween.
  • Steel plate (P) proceeds through the inlet and outlet formed at the front and rear ends of the horizontal cell (10).
  • a plating solution supply port is installed at the centers of the upper plating electrode 12 and the lower plating electrode 14, and the solution supply unit 30 is connected to the supply port to supply the plating solution to the inner space of the horizontal cell.
  • a backup roll 22 supporting the conductor control 20 is installed below the conductor control 20 with the steel plate P therebetween. Accordingly, the steel sheet P passes through the horizontal cell 10 according to the rotational drive of the conductor control 20.
  • the upper plating electrode 12 and the lower plating electrode 14 serve as an anode for applying current from the rectifier to the strip, and the steel plate P serves as a cathode by receiving a cathode current from the conductor 20.
  • the steel plate P serves as a cathode by receiving a cathode current from the conductor 20.
  • zinc plating proceeds while zinc ions of the plating solution are received and precipitated in the horizontal cell 10 and adhered to the surface of the steel sheet P.
  • the edge mask 40 is formed to extend in the horizontal cell 10 along the traveling direction of the steel plate P, and the width direction of the steel plate P between the upper plating electrode 12 and the lower plating electrode 14. It is arranged on each side.
  • the edge mask 40 prevents current from concentrating on the edge portion of the steel sheet P in the form of wrapping the edge in the width direction of the steel sheet P.
  • 3 and 4 illustrate the structure of an edge mask according to one embodiment.
  • the edge mask 40 of this embodiment includes an upper plate 42 formed extending in the upper edge of the steel sheet P, a lower plate 44 formed extending in the lower edge of the steel sheet P, and the upper plate 42. Intermediate member coupled between the lower plate 44 and supporting the upper plate 42 and the lower plate 44 and forming a groove portion 48 between the upper plate 42 and the lower plate 44 to accommodate the edge of the steel sheet P. 46, a plurality of discharge passages 50 formed at intervals along the intermediate member 46 and in communication with the groove 48 and extending outside the intermediate member to discharge the plating solution, the discharge passage 50, an outlet is formed on the upper plate 42 to discharge the plating solution between the upper plate 42 and the upper plating electrode 12, and an outlet is formed on the lower plate 44 to lower the plating solution. And a downward passage 54 which discharges between the 44 and the lower plating electrode 14.
  • the upper plate 42 is formed to extend so that the inner end of the steel sheet P toward the steel sheet P passes through the edge of the steel sheet P, and covers the edge portion of the steel sheet P from above.
  • the outer leading end of the upper plate 42 extends to the outer leading end of the upper plating electrode 12.
  • the lower plate 44 also has an inner tip extending toward the steel sheet P so as to extend past the edge of the steel sheet P, thereby covering the edge portion of the steel sheet P from below.
  • the outer leading end of the lower plate 44 also extends to the outer leading end of the lower plating electrode 14.
  • the degree of overlap between the upper plate 42 and the lower plate 44 to cover the edge portion of the steel sheet P may be set in various ways.
  • the upper plate 42 is cut and formed to communicate with the outlet of the upward passage 52 so that the plating solution flows to form a part of the upward passage 52.
  • the upper channel 56 is formed in the shape of a groove having an upper portion open to the upper plate 42.
  • the lower plate 44 is also in communication with the outlet of the downward passage 54 so that the plating solution flows to form a lower channel 58 constituting a part of the downward passage 54 is cut.
  • the lower channel 58 is formed in the shape of a groove in which the lower portion is opened in the lower plate 44. The upper channel 56 and the lower channel 58 will be described later.
  • the intermediate member 46 couples between the upper plate 42 and the lower plate 44, and supports the upper plate 42 and the lower plate 44.
  • the intermediate member 46 is formed to have a size spaced apart from the edge of the steel sheet (P) at sufficient intervals so as not to contact the edge of the steel sheet (P).
  • the groove 48 is formed between the upper plate 42 and the lower plate 44 so that the edge portion of the steel sheet P is placed.
  • the groove 48 may be understood as an inner space recessed by the upper plate 42, the lower plate 44, and the intermediate member 46.
  • the edge mask 40 forms an overlapping portion with the steel sheet P in a shape surrounding the edge portion of the steel sheet P through the groove portion 48, thereby overplating the steel sheet P edge portion. And current concentration can be prevented.
  • the edge mask 40 is connected to, for example, a driving unit (not shown) such as a driving cylinder so that the edge mask 40 can be moved to the inside and outside of the horizontal cell 10, as shown in FIG. 40)
  • a rod 60 connecting the driving unit and the edge mask 40 to move may be installed on the outer surface of the intermediate member 46.
  • the edge mask 40 of the present embodiment can easily couple the rod 60 without interrupting the flow of the plating solution through the intermediate member 46.
  • the rod 60 may be coupled to the female screw hole formed in the intermediate member 46, for example, by screwing.
  • the edge mask 40 may be inserted without interference between the upper plating electrode 12 and the lower plating electrode 14 of the horizontal cell 10. It is formed to a size sufficiently smaller than the gap between 12) and the lower plating electrode 14.
  • the thickness of the edge mask 40 in the vertical direction may be variously changed and is not particularly limited.
  • the edge mask 40 may be formed of an upper plate 42, a lower plate 44, and an intermediate member 46 integrally to form a body.
  • the upper plate 42 and the lower plate 44 and the intermediate member 46 may be combined separately after being manufactured according to each shape.
  • the edge mask 40 is made of an insulating material.
  • the edge mask 40 is preferably made of a heat resistant plastic that maintains heat resistance and high strength at 80 ° C. or higher, for example, PE (PolyEthylene), PEEK (Polyther Etherketone), PI (Polyimide) or PCB It may be made of a substrate material.
  • the edge mask 40 can easily discharge the plating solution to the width side of the horizontal cell 10 through the discharge passage 50 formed along the groove 48.
  • the edge mask 40 smoothly discharges the plating solution to the widthwise side of the horizontal cell 10 through the discharge passage 50, so that the vortex flow of the plating solution that can be formed near the groove portion 48 of the edge mask. It is possible to prevent the occurrence and to discharge the pollutants smoothly.
  • the upper plate 42 and the lower plate 44 the inner surface facing each other so that the plating solution flows into the groove 48 more smoothly and exits the discharge passage 50, the discharge passage 50 at the inner end thereof.
  • the structure is inclined toward.
  • the inner tip thickness of the upper plate 42 By forming the inner tip thickness of the upper plate 42 to be thin, the space of the groove 48 is sufficiently secured, thereby easily avoiding interference with the steel sheet P and increasing the discharge efficiency of the plating solution.
  • the ratio between the upper and lower plating electrodes 12 and 14: the thickness of the inner tip thickness of the upper plate 42 may be 20: 1.5 to 2.0.
  • the inner tip thickness ratio of the lower plate 44 may be the same as the upper plate 42.
  • the discharge passage 50 is an upward passage 52 for discharging a portion of the plating solution flowing into the groove 48 between the upper plate 42 and the upper plating electrode 12, and a portion of the plating solution.
  • a downward passage 54 is discharged between the lower plate 44 and the lower plating electrode 14.
  • the edge mask 40 of the present embodiment discharges the plating solution to the upper and lower portions of the edge mask 40 so that the upper plate 42 and the upper plating electrode 12 and the lower plate 44 are discharged.
  • the edge mask 40 can be easily positioned at the center of the horizontal cell 10, that is, the center between the upper plating electrode 12 and the lower plating electrode 14. It becomes possible.
  • edge mask 40 it is very difficult to center the edge mask 40 in a narrow space between the upper plating electrode 12 and the lower plating electrode 14 having a spacing of approximately 20 mm. Check is required.
  • the amount of the plating solution passing through the upper and lower portions of the edge mask 40 during the electroplating process even if the edge mask 40 is positioned at the center of the installation process. Since the position of the edge mask 40 is changed by the difference and the shaking of the steel plate edge part, etc., it was almost impossible to center the edge mask 40.
  • the plating solution forms a constant pressure on the upper and lower portions of the edge mask 40, the edge mask without additional control (40) It is located in the center between the upper plating electrode 12 and the lower plating electrode 14 by itself.
  • the position of the edge mask 40 is continuously maintained at the center between the upper plating electrode 12 and the lower plating electrode 14. do.
  • the discharge passage 50 has a structure in which the upward passage 52 and the downward passage 54 are alternately formed along the groove 48.
  • the interval formed between the upward passage 52 and the downward passage 54 may be variously modified.
  • FIG. 5 is a cross-sectional view taken along the line A-A of FIG. 4 and illustrates the structure of the upward passage 52 of the discharge passage 50.
  • the upward passage 52 is formed with an inlet communicating with the groove 48 at the inner end of the intermediate member 46, and is inclined upward toward the upper plate 42. An exit is made towards 42).
  • the upper plate 42 is formed with a groove-shaped upper channel 56 through which the plating solution flows out.
  • the plating solution is moved from the groove portion 48 toward the upper plate 42 along the upward passage 52 and discharged through the outlet and then flows outward along the upper channel 56.
  • the plating solution discharged through the outlet exerts a pressure between the upper plating electrode 12 and the edge mask 40 while passing through the upper channel 56 with the top open.
  • the edge mask 40 is pushed down from the upper plating electrode 12 by the pressure of the plating solution flowing along the upper channel 56 to move toward the center.
  • FIG. 6 is a cross-sectional view taken along the line B-B of FIG. 4 and illustrates the structure of the downward passage 54 among the discharge passages 50.
  • the downward passage 54 is formed with an inlet communicating with the groove 48 at the inner end of the intermediate member 46, and is inclined downward toward the lower plate 44. An exit is made towards 44).
  • the lower plate 44 is formed with a groove-shaped lower channel 58 through which the plating solution flows out.
  • the plating solution is moved from the groove portion 48 toward the lower plate 44 along the downward passage 54 to be discharged through the outlet and then flows outward along the lower channel 58.
  • the plating solution discharged through the outlet exerts a pressure between the lower plating electrode 14 and the edge mask 40 while passing through the lower channel 58 having the lower opening.
  • the edge mask 40 is pushed up from the lower plating electrode 14 by the pressure of the plating solution flowing along the lower channel 58 to move toward the center.
  • the edge mask 40 may have a structure in which the sum of the cross-sectional areas of the outlets of the entire upward passage 52 and the sum of the cross-sectional areas of the outlets of the entire downward passage 54 are the same.
  • the discharge of the plating solution through the entire upward passage 52 toward the upper edge mask and the discharge of the plating solution through the entire downward passage 54 toward the lower edge mask are the same. Therefore, the pressure applied to the upper portion of the edge mask 40 by the plating solution discharged through the entire upward passage and the pressure applied to the lower portion of the edge mask 40 by the plating solution discharged through the downward passage 54 are the same. Done.
  • the sum of the total cross-sectional area of the outlet of the upstream passage 52 is smaller or larger than the sum of the total cross-sectional area of the outlet of the total down passage 54 according to the pressure of the plating solution applied on the steel sheet according to the moving speed of the steel sheet.
  • the position of the edge mask 40 may be controlled to be located at the center between the upper plating electrode 12 and the lower plating electrode 14 of the horizontal cell 10.
  • the discharge passage 50 in the edge mask 40 of the present embodiment in various ways, the plating solution supplied between the upper and lower plating electrodes can be smoothly discharged to the outside of the edge mask 40 while the plating process is performed.
  • the problem of overplating due to the overcurrent concentrated at the edge of the steel sheet can be solved.
  • the plating and the process of the steel sheet are spontaneously positioned at the center of the moving steel plate by optimizing the flow rate and pressure of the plating solution flowing while covering the upper and lower portions and the edge portion of the steel sheet. do.
  • the plated solution supplied to the center of the upper and lower plated electrodes 12 and 14 is moved by controlling the flow rate and hydraulic pressure of the plating solution supplied to the horizontal cell 10 using a constant pressure nozzle (not shown). Can be accurately floated to the center of the plating electrode.
  • the position of the steel sheet is positioned at the center of the plating electrode, and the edge mask is installed by using the flow rate and hydraulic pressure discharged to the edge mask by installing the edge mask of this embodiment.
  • the plating process can be performed by closely approaching and overlapping the edges of the plate to enable a uniform and stable plating process.
  • the edge mask can be closely approximated to the edge portion of the steel sheet during the plating process by using the flow rate and the hydraulic pressure of the plating solution discharged through the edge mask of the present embodiment in the center of the upper and lower plating electrodes. This is possible because it can be positioned accurately.
  • the edge mask of the present embodiment moves to the upper or lower plating electrode, which may occur when the edge mask of the present embodiment is not applied, so that the edge mask itself is the plating electrode. It is possible to fundamentally prevent the problem that the operator body is stopped by colliding with or bonding and breaking.
  • the edge mask 40 of this embodiment includes an upper plate 42 extending above the edge of the steel plate P, a lower plate 44 extending below the edge of the steel plate P, and the upper plate 42 and the lower plate 44.
  • An intermediate member 46 coupled between the upper plate 42 and the lower plate 44 to form a groove portion 48 between which the edge of the steel plate P is accommodated between the upper plate 42 and the lower plate 44;
  • a plurality of discharge passages 50 are formed at intervals along the intermediate member 46 and communicate with the grooves 48 and extend outward to discharge the plating solution, and the discharge passage 50 has an outlet having a top plate.
  • the upward passage 52 and the downward passage 54 have a common inlet communicating with the groove 48 at the inner end of the intermediate member 46.
  • the upward passage 52 is inclined toward the upper plate 42 at the inlet, and the downward passage 54 is inclined toward the lower plate 44 at the inlet.
  • the upward passage 52 is connected to the upper channel formed on the upper plate 42, and the downward passage 54 is connected to the lower channel 58 formed on the lower plate 44.
  • the plating solution flows through the common inlet formed in the groove 48 and is divided into an upward passage 52 and a downward passage 54 and discharged, respectively, and the upper channel 56 and the downward passage connected to the upward passage 52, respectively. It flows outward along the lower channel 58 connected to the 54.
  • the plating solution discharged through the upper passage 52 exerts a pressure between the upper plating electrode 12 and the edge mask 40 while passing through the upper channel 56, and is discharged through the downward passage 54.
  • the plating solution is applied to the pressure between the lower plating electrode 14 and the edge mask 40 while passing through the lower channel (58). Therefore, the edge mask 40 moves toward the center by the pressure applied to the edge mask 40 up and down at the same position.
  • the sum of the cross-sectional areas of the entire upward passage 52 and the sum of the cross-sectional areas of the entire downward passage 54 are preferably the same.
  • the sum of the cross-sectional areas of the outlets of the upward passage 52 is smaller or larger than the sum of the cross-sectional areas of the outlets of the entire downward passage 54 to adjust the position of the edge mask 40 of the horizontal cell 10. It may be controlled to be located in the center between the upper plating electrode 12 and the lower plating electrode 14.
  • the edge mask 40 applies the pressure to the upper and lower portions of the edge mask 40 while discharging the plating solution through the discharge passage 50 so that the edge mask 40 is attached to the upper plating electrode. It can be located in the center between the 12) and the lower plating electrode (14).
  • the plating solution is discharged up and down through the discharge passage 50 in the groove portion 48 of the edge mask 40.
  • the edge mask 40 is pressed downward by the plating solution discharged through the upward passage 52, and is moved upward and downward by pressure upward in the plating solution discharged through the downward passage 54. As a result, it is positioned at the center between the upper plating electrode 12 and the lower plating electrode 14 by itself.
  • the edge mask 40 when the edge mask 40 is installed in the horizontal cell 10, the edge mask 40 does not have a hard work of centering the edge mask 40 on the center between the upper plating electrode 12 and the lower plating electrode 14. Only the quantity (installation tolerance) can be set to proceed.
  • the edge mask 40 is not exactly positioned at the center between the upper plating electrode 12 and the lower plating electrode 14 during installation, the plating solution flowing up and down of the edge mask 40 in accordance with the discharge of the plating solution as described above. The pressure causes the edge mask 40 to be placed in the center position.
  • the edge mask 40 according to the present embodiment has shown the cross section of the discharge passage 50 or the upper and lower channels 56, 58 in a rectangular or rectangular shape, the edge mask of the present invention In the cross section of the passage and the like is not limited to such a shape, but may be variously modified within the scope of the present invention to a circular, elliptical or trapezoidal shape.

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  • Sustainable Development (AREA)

Abstract

L'invention concerne un masque de bord d'un appareil d'électrodéposition à cellule horizontale, doté d'une structure comprenant : une partie d'évidement qui est déformée de manière concave de façon à entourer un bord d'une plaque d'acier sur une surface tournée vers le bord de la plaque d'acier, afin de placer un masque de bord dans la partie centrale d'une cellule horizontale à l'aide de l'écoulement d'une solution de placage ; et plusieurs chemins de décharge, formés le long de la partie d'évidement de façon à être en communication avec la partie d'évidement, pour décharger la solution de revêtement électrolytique, une sortie du chemin de décharge étant formée en tant que surface supérieure d'un masque de bord faisant face à une électrode métallisée supérieure et/ou en tant que surface inférieure d'un masque de bord faisant face à une électrode métallisée inférieure, de telle sorte que la solution de placage est déchargée entre la surface supérieure du masque de bord et l'électrode métallisée supérieure et/ou la surface inférieure du masque de bord et l'électrode métallisée inférieure.
PCT/KR2015/007185 2014-12-12 2015-07-10 Masque de bord d'appareil d'électrodéposition à cellule horizontale et appareil d'électrodéposition à cellule horizontale comprenant ce masque WO2016093460A1 (fr)

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KR1020140179708A KR101633617B1 (ko) 2014-12-12 2014-12-12 수평셀 전기도금장치의 에지마스크 및 이를 포함하는 수평셀 전기도금장치
KR10-2014-0179708 2014-12-12

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WO2016093460A1 true WO2016093460A1 (fr) 2016-06-16

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Cited By (1)

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Publication number Priority date Publication date Assignee Title
EP4389940A1 (fr) * 2022-12-21 2024-06-26 John Cockerill SA Dispositif pour une electrodeposition anti-dendrites

Families Citing this family (1)

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Publication number Priority date Publication date Assignee Title
KR102252091B1 (ko) * 2019-10-15 2021-05-13 주식회사 포스코 강판 에지 과도금 방지 장치

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JPH08158093A (ja) * 1994-11-29 1996-06-18 Kawasaki Steel Corp エッジマスクを備えた水平型連続電解処理装置
JP2006274411A (ja) * 2005-03-30 2006-10-12 Jfe Steel Kk 鋼帯の電気めっき装置
JP2006283041A (ja) * 2005-03-31 2006-10-19 Nippon Steel Corp 竪型電解処理装置のエッジマスク装置
JP2009228023A (ja) * 2008-03-19 2009-10-08 Nippon Steel Engineering Co Ltd 竪型噴流めっき装置
KR20140122768A (ko) * 2013-04-10 2014-10-21 주식회사 포스코 에지 과도금을 방지하기 위한 전기도금장치

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JP2785618B2 (ja) * 1992-11-12 1998-08-13 日本鋼管株式会社 連続電気めっき用エッジマスク
KR20010059601A (ko) * 1999-12-30 2001-07-06 이구택 에지부 도금층이 균일한 전기도금방법

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08158093A (ja) * 1994-11-29 1996-06-18 Kawasaki Steel Corp エッジマスクを備えた水平型連続電解処理装置
JP2006274411A (ja) * 2005-03-30 2006-10-12 Jfe Steel Kk 鋼帯の電気めっき装置
JP2006283041A (ja) * 2005-03-31 2006-10-19 Nippon Steel Corp 竪型電解処理装置のエッジマスク装置
JP2009228023A (ja) * 2008-03-19 2009-10-08 Nippon Steel Engineering Co Ltd 竪型噴流めっき装置
KR20140122768A (ko) * 2013-04-10 2014-10-21 주식회사 포스코 에지 과도금을 방지하기 위한 전기도금장치

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4389940A1 (fr) * 2022-12-21 2024-06-26 John Cockerill SA Dispositif pour une electrodeposition anti-dendrites

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KR20160072383A (ko) 2016-06-23

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