WO2016085167A1 - Appareil d'inspection de particules pour partie de formation poreuse - Google Patents
Appareil d'inspection de particules pour partie de formation poreuse Download PDFInfo
- Publication number
- WO2016085167A1 WO2016085167A1 PCT/KR2015/012157 KR2015012157W WO2016085167A1 WO 2016085167 A1 WO2016085167 A1 WO 2016085167A1 KR 2015012157 W KR2015012157 W KR 2015012157W WO 2016085167 A1 WO2016085167 A1 WO 2016085167A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- chamber
- particle
- particles
- gas
- component
- Prior art date
Links
- 239000002245 particle Substances 0.000 title claims abstract description 124
- 238000007689 inspection Methods 0.000 title claims abstract description 31
- 230000015572 biosynthetic process Effects 0.000 title abstract description 7
- 238000000034 method Methods 0.000 claims description 22
- 238000011045 prefiltration Methods 0.000 claims description 5
- 238000007599 discharging Methods 0.000 claims description 4
- 238000001914 filtration Methods 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 2
- 238000011109 contamination Methods 0.000 abstract description 16
- 238000004519 manufacturing process Methods 0.000 abstract description 9
- 238000001514 detection method Methods 0.000 abstract description 6
- 239000007789 gas Substances 0.000 description 40
- 238000005070 sampling Methods 0.000 description 11
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 8
- 238000002347 injection Methods 0.000 description 7
- 239000007924 injection Substances 0.000 description 7
- 238000004140 cleaning Methods 0.000 description 6
- 230000007547 defect Effects 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 5
- 229910001873 dinitrogen Inorganic materials 0.000 description 4
- 239000011148 porous material Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 229910021642 ultra pure water Inorganic materials 0.000 description 3
- 239000012498 ultrapure water Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- -1 halogen anions Chemical class 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910001413 alkali metal ion Inorganic materials 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- 239000010954 inorganic particle Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 239000011146 organic particle Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N15/00—Investigating characteristics of particles; Investigating permeability, pore-volume or surface-area of porous materials
- G01N15/02—Investigating particle size or size distribution
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N15/00—Investigating characteristics of particles; Investigating permeability, pore-volume or surface-area of porous materials
- G01N15/10—Investigating individual particles
Definitions
- the present invention relates to an apparatus for inspecting particles of a component, and more particularly, to an apparatus for detecting and inspecting particles attached to a porous part having a plurality of holes formed therein as a component for manufacturing a semiconductor and a display. .
- the manufacturing process of semiconductors and displays is a high-tech industry that includes nano-level highly precise processes. Even the minute environmental conditions of the field where the products are manufactured can greatly affect the quality of the products.
- Component contamination of the manufacturing apparatus may be caused by polishing, etching, photoresist, dry etching, or the like, or may be caused by chemicals, raw materials, or materials, or may be due to robots, structural components in chambers, component materials, or the like, or may be transferred from the human body.
- Nonionic contamination includes organic contamination by waxes, oils, photoresist residues, heavy metals and precious metals, and inorganic contamination by carbon, oxide films and oxides.
- Such component contamination is an important problem because the surface contamination directly affects the reliability or mass production yield of the device as the device is finer, the removal of fine inorganic or organic particles has become an important problem.
- an apparatus for manufacturing a semiconductor and a display is composed of various components, and when particles such as dust remain on such components, these particles form a film on a wafer, a glass substrate, a sapphire substrate, or the like, which are substrates for semiconductor and display manufacturing. In the process of etching the film, the particles adhere to the surface and cause a fatal defect of the product such as a pattern defect.
- the process of manufacturing semiconductors and displays is required to be maintained and managed in a very clean state. After use, they are cleaned and mounted on the equipment.
- the cleaning is performed by various methods such as chemicals, ultrapure water, and clean gas, and the related art related to the particle inspection method before and after the cleaning is (1) a predetermined time for inspecting the presence of particles after cleaning the parts.
- Surface particle counter such as US Patent No. 5,253,538 (registered on Oct. 19, 1993) relating to a method of counting suspended particles in liquid ultrapure water with a particle counter in liquid and (2) a method and apparatus for counting surface particles. There is a method such as using the test.
- the suction for the counting of particles depends on the suction force by the suction of air in a configuration named a scanner, and thus the suction force of such a pump is a shower head and a cathode. It is difficult to separate the particles present in the hole in which the fine pores, etc. are formed, so that the particles inside the hole are hardly detected.
- the present invention has been made to solve all the above-described problems, it is possible to detect and count the particles remaining in the hole of the porous part, excellent detection and counting efficiency of the particles, no counting error or error occurs This ensures that the particle zero environment is maintained at all times during inspection, that the part contamination and particle counts can be accurately inspected, furthermore preventing particles from adhering to the part, leading to product defects, and increasing product reliability and yield. It is an object of the present invention to provide a particle inspection apparatus for porous forming parts.
- the present invention provides a device for detecting and inspecting particles attached to a porous part having a plurality of holes formed therein, comprising: a housing constituting an outer portion of the device; A fan filter unit formed on an upper portion of the housing and sucking air from the outside and filtering the filter to supply clean air to the inside of the apparatus; An inlet pipe connected with the chamber to clean the inside of the apparatus by introducing clean air into the chamber, and having an inlet valve in the middle; A chamber formed below the fan filter unit, and equipped with a component to be inspected in an upper jig, and a gas injected from a jet nozzle flowing into the interior of the component through a hole in the component; A jet nozzle installed to be positioned above the chamber and separating a particle attached to the hole of the part by injecting a gas toward the part mounted on the jig; A particle counter installed under the chamber and connected to the inside of the chamber by a suction line, the particle counter for detecting and counting particles contained in the
- the present invention it is possible to detect and count the particles remaining in the hole of the porous part, and the particle detection and counting efficiency is excellent, and no counting error or error occurs, so that the particle zero environment is always present during the inspection. It is possible to maintain and accurately inspect the part contamination and particle count, and furthermore, it is possible to prevent the particles from adhering to the parts, causing product defects, and increasing the reliability and yield of the product.
- FIG. 1 is a perspective view of a particle inspection apparatus of a porous forming part according to an embodiment of the present invention.
- Fig. 2 is a schematic diagram showing the internal configuration of a particle inspection device for porous formed parts according to an embodiment of the present invention.
- FIG. 3 is a detailed view of the interior of the particle inspection device of the porous part according to the embodiment of the present invention.
- FIGS 4A to 4C are views showing an upper portion of the particle inspection apparatus of the porous formed part according to the embodiment of the present invention.
- FIG. 5 is a photograph associated with the jet nozzle sprayed on the shower head according to an embodiment of the present invention.
- 6A to 6D are diagrams illustrating an inspection method of a particle inspection device of a porous part according to an embodiment of the present invention.
- grain inspection apparatus 1 of the porous formation part which concerns on this invention relates to the apparatus which detects and inspects the particle
- the injection of the chamber-type jet nozzle 500 connected to the particle counter 600 to the chamber 400 and the vacuum suction of the vacuum pump 700 is a combined device.
- the housing 100 constitutes an outer portion of the apparatus, and includes a main space for controlling an operation of each component of the apparatus on an upper portion of the housing 100 having an installation space therein.
- a keyboard 110 attached to one side of the housing 100 to input a command to the main computer, and a monitor 120 displaying a screen of the main computer are installed.
- the keyboard 110 may be connected to the support 111 so as to move or rotate the position.
- One side of the monitor 120 is a control display screen for controlling nitrogen gas and measuring the flow rate of the MFC. Can be further formed.
- the lower side of the housing 100 may be provided with a USB, LAN connection terminal, a spare vacuum port, a power connector for a computer interface.
- the upper door 130 is installed in the middle of the housing 100, the upper door 130 is provided with a see-through window 131 to look inside the housing 100, the upper door 130
- the lower door 140 is installed at the lower side, and the screen of the particle counter 600, the compressed air regulator (A), the nitrogen gas regulator (N), etc., installed at the lower portion of the housing 100 in the lower door 140 as well. It may be included in the viewing window 141 to check from the outside.
- the fan filter unit 200 is formed on the upper portion of the housing 100, and supplies air of Class 1 level to the inside of the apparatus by filtering air after inhaling air from the outside.
- a pre-filter (210, pre-filter) is installed at the top to filter the air flowing in from the outside, the ULPA filter 220, An Ultra-Low Penetration Air filter is installed to collect most of the fine particles and supply clean air to the inside of the device.
- a suction fan 230 is installed between the prefilter 210 and the ULPA filter 220 to suck external air into the device.
- the inlet pipe 300 is connected to the side of the chamber 400 to introduce clean air supplied into the apparatus into the inside of the chamber 400 of the chamber 400.
- the inlet valve 310 is provided to clean and clean the inside, and determine whether or not the clean air is introduced or blocked in the middle.
- the clean air is introduced into the chamber 400 through the inlet pipe 300 to operate the apparatus, and thus, the particle zero environment is always maintained during the inspection, and the component contamination and the particle count can be accurately inspected.
- the chamber 400 is formed below the fan filter unit 200, and traps particles separated by the gas introduced by the gas injection of the jet nozzle 500 or the vacuum suction input of the vacuum pump 700.
- the jig 410 is formed on the upper part, and the part D to be inspected is fixedly mounted on the jig 410, and the gas injected from the jet nozzle 500 is a plurality of holes of the part D. It is introduced into the chamber 400 and accommodated together with the particles separated by passing through (H).
- the chamber 400 may be provided with a heating member (not shown) for removing moisture on the surface of the component (D) before and after the inspection on the upper side or the lower side of the jig 410.
- the chamber 400 may be installed to open and close a sealed door (not shown) to seal the inside of the chamber 400 at the top.
- the chamber 400 is further provided with an arc plasma apparatus (not shown) to apply a stress to the surface of the component (D) mounted on the jig 410 by the arc plasma to the pores of the component (D).
- the attached particles P may be separated to increase the separation efficiency.
- the chamber 400 is provided with a gas nozzle (not shown) in the lower portion to spray the gas toward the component (D) mounted on the jig 410 particles (P) attached to the pores of the component (D) It may be provided to remove more efficiently.
- the jet nozzle 500 is installed to be located above the chamber 400, and sprays gas toward the component D mounted on the jig 410 as shown in FIG. 5 (c). By separating the particles (P) attached to the hole (H) of the component (D) to be introduced into the chamber 400.
- the gas injected from the jet nozzle 500 is preferably a compressed nitrogen gas (N 2 ), a large amount of gas is injected from the jet nozzle 500 toward the component (D) as shown in FIG. While the portion is not the hole (H) is collided to be discharged to the outside, the hole (H) portion as the gas passes through to detach the particles (P) attached to the hole (H).
- N 2 compressed nitrogen gas
- the support rod 510 is installed on the upper side of the chamber 400, the support rod 510 is provided with a rotatable rod 520 rotatably, between the support rod 510 and the rotary rod 520
- a nozzle moving speed control valve 530 is provided to determine the moving speed of the jet nozzle 500, and a nozzle tube 540 having the jet nozzle 500 formed at one end thereof penetrates the side of the rotating rod 520. It is connected and installed, the other end of the nozzle pipe 540 is connected to the gas supply pipe 550 is installed.
- an MFC (560, Mass Flow Controller) is installed at the other end of the nozzle tube 540 to automatically adjust the supply amount of gas.
- the particle counter 600 is installed below the chamber 400 and is connected to the inside of the chamber 400 by the suction line 610, and inhales the gas in the chamber 400 and inhales the gas. Particles P contained are detected and counted.
- the particle counter 600 is provided with a suction port 620 at the upper end of the suction line 610, the suction port 620 is disposed in the chamber 400, the of the suction line 610 A lower end is disposed to be connected to the particle counter 600 through the inside of the vacuum suction tube 710.
- the particles P detached from the hole H of the component D by the gas injection of the jet nozzle 500 are transferred to the suction port 611 of the suction line 610 provided in the chamber 400. Particles that are induced and contained in the gas by the particle counter 600 are detected and counted.
- the vacuum pump 700 is installed in the vacuum suction pipe 710 connected to the lower side of the chamber 400, and generates a vacuum suction input inside the chamber 400 to pass through the hole (H) of the component (D).
- the gas is guided into the chamber 400, and the induced gas is induced to be sucked into the particle counter 600 through the suction port 620.
- the vacuum suction pipe 710 opens and closes the vacuum suction pipe 710 to determine whether the vacuum suction input is generated in the chamber 400 and the vacuum pump valve 720, the vacuum passing through the vacuum suction pipe 710 A Mass Flow Meter (MFM) for measuring the gas flow rate to the pump 700 is installed.
- MFM Mass Flow Meter
- the discharge fan 800 is installed in the discharge pipe 810 connected to the lower side of the chamber 400, and discharges the air inside the chamber to the outside, where the discharge pipe 810 passes through the discharge pipe 810
- a discharge fan valve 820 is provided to determine whether the inlet and blocking of the air or gas to be.
- the clean air filtered by the fan filter unit 200 is introduced into the chamber 400 through the inlet pipe 300 and then vacuumed. By discharging to the outside through the suction pipe 710 and the discharge pipe 810 to clean the interior of the chamber 400.
- the vacuum pump 700 is operated to suck the air in the initial chamber 400, the discharge fan 800 is also activated, the gas injection into the chamber 400 by the jet nozzle 500 Is also done.
- the particle counter 600 detects and counts the particles to determine whether the overall cleaning state inside the chamber 400 is close to zero, and the fan.
- the overall particle state of the filter unit 200, the inlet pipe 300, the chamber 400, the jet nozzle 500 can be confirmed.
- the inside of the chamber 400 is cleaned while the component D to be inspected is fixedly mounted on the jig 410.
- the clean air filtered by the fan filter unit 200 is introduced into the chamber 400 through the inlet pipe 300 and then the vacuum suction pipe 710. ) And the inside of the chamber 400 by cleaning the discharge to the outside through the discharge pipe 810 to clean.
- the jet nozzle 500 is rotated to face the outside of the chamber so that compressed air is injected to discharge the stagnant nitrogen to the nozzle tube 540, the gas supply pipe 550, and the like.
- the air in the chamber is sucked in through the suction port 620 of the suction line 610 in a state in which all the valves are blocked, and the particle counter 600 counts the number of particles included in the sucked air.
- the jet nozzle 500 provided at the tip of the nozzle tube 540 is moved by rotation so as to face the component D mounted on the jig 410 to inject gas.
- the operation of the vacuum pump 700 and the discharge fan 800 is determined while checking the sensitivity when setting the recipe in consideration of the type of the component (D) and the size of the hole (H).
- the sampling of the particles may be performed by using a single or a combination of air jet sampling (Vacuum pump Sampling) by the jet nozzle (500).
- the nitrogen gas or the compressed air supplied from the jet nozzle 500 passes through the hole H of the component D, and the particles P attached to the inside of the hole H are dropped to remove nitrogen. Together with gas or compressed air, the inlet 620 of the suction line 610 inside the chamber 400 is introduced.
- the air passing through the hole H of the component D is dropped by the vacuum suction input generated by operating the vacuum pump 700 to drop the particles P attached to the inside of the hole H, thereby allowing the chamber ( 400 is introduced into the interior, and the introduced air is directed to the inlet 620 of the suction line 610 inside the chamber 400.
- Combination sampling is sampling while applying the above-mentioned air jet sampling and vacuum suction sampling simultaneously or sequentially, and the setting regarding sampling of such particles can be specified through the recipe setting in the main computer of the apparatus.
- the gas injected by adjusting the gas injection time of the jet nozzle 500 and the particles P separated from the hole H of the component D collide with the inner wall surface of the chamber 400 to be rebuilt.
- gas injection of the jet nozzle 500 is terminated, and gas or air in the chamber 400 is sucked into the particle counter 600 to detect and count particles P contained therein.
- a predetermined pressure is formed in the chamber 400, wherein the jet nozzle 500 is
- the gas jet of the jet nozzle 500 is terminated immediately after the particles P, which are separated from the part D, collide with the inner wall of the chamber 400 and are reattached, and the particle counter 600 or the vacuum is removed.
- the gas is sucked into the pump 700 to detect and count particles P contained in the gas.
- the particles P separated in the hole H of the part D are blown away or attached to the inner wall surface of the chamber 400. It is excellent in particle detection and counting efficiency by preventing the remaining inside of the chamber 400, and the gas introduced into the chamber 400 collides with the inner wall of the chamber 400, and thus the inner wall of the chamber 400. Other particles that have been attached thereto may be suspended inside the chamber 400 to prevent the problem of being counted by the particle counter.
- the particle inspection device 1 of the porous formed part according to the present invention can detect and count particles remaining in the hole of the porous formed part, and excellent in particle detection and counting efficiency, By not occurring, the particle zero environment is always maintained during the inspection, the part contamination and particle counting can be accurately inspected, and furthermore, the particle adheres to the part to prevent product defects, and the product reliability and yield I can increase it.
- the particle inspection apparatus of the porous formed part according to the present invention is always maintained in the particle zero environment during the inspection, it is possible to accurately inspect the part contamination and particle counting, to prevent the particles from adhering to the parts to cause product defects, It has the effect of increasing the reliability and yield of the production, so there is industrial applicability.
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- Dispersion Chemistry (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Analytical Chemistry (AREA)
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Abstract
Un appareil d'inspection de particules de partie de formation poreuse selon la présente invention concerne un appareil pour détecter et inspecter des particules qui sont fixées à une partie de formation poreuse ayant une pluralité de trous formés à l'intérieur de la partie, l'appareil comprenant un boîtier, une unité de filtre de ventilateur, un tuyau d'entrée, une chambre, une buse à jet, un compteur de particules, une pompe à vide et un ventilateur d'évacuation. L'appareil peut détecter et compter des particules restant à l'intérieur des trous de la partie de formation poreuse, a une excellente efficacité de comptage et de détection de particules, maintient toujours un environnement exempt de particules pendant l'inspection en raison de l'absence d'erreurs de comptage, peut inspecter avec précision la contamination de partie et le comptage de particules, empêche des produits défectueux d'apparaître en raison de particules qui sont fixées à la partie, et peut augmenter la fiabilité et la vitesse de production de produit.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2014-0164929 | 2014-11-25 | ||
KR1020140164929A KR101483224B1 (ko) | 2014-11-25 | 2014-11-25 | 다공 형성 부품의 입자 검사 장치 |
Publications (1)
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WO2016085167A1 true WO2016085167A1 (fr) | 2016-06-02 |
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Application Number | Title | Priority Date | Filing Date |
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PCT/KR2015/012157 WO2016085167A1 (fr) | 2014-11-25 | 2015-11-12 | Appareil d'inspection de particules pour partie de formation poreuse |
Country Status (2)
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KR (1) | KR101483224B1 (fr) |
WO (1) | WO2016085167A1 (fr) |
Families Citing this family (3)
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KR102590033B1 (ko) | 2018-11-20 | 2023-10-16 | (주)코미코 | 파티클 측정 장치 및 이를 이용한 측정 방법 |
KR102472500B1 (ko) * | 2022-05-17 | 2022-12-01 | 주식회사 에어콕 | 펌프를 이용한 미세먼지 측정 기기 |
CN115656012B (zh) * | 2022-12-08 | 2023-03-14 | 山东恒智一建净化工程有限公司 | 一种环境综合指标检测装置 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH085542A (ja) * | 1994-06-20 | 1996-01-12 | Hitachi Ltd | 半導体装置の製造方法および装置 |
JPH11217670A (ja) * | 1997-11-25 | 1999-08-10 | Japan Steel Works Ltd:The | 枚葉式ロードロック装置及び基板清浄化方法 |
KR20070038795A (ko) * | 2005-10-07 | 2007-04-11 | 주식회사 코미코 | 파티클 제거 방법 및 장치, 및 이를 포함하는 파티클 측정방법 및 장치 |
KR100976987B1 (ko) * | 2010-01-07 | 2010-08-19 | 주식회사 올루 | 크린룸용 자재의 입자 오염 시험 장치 |
KR20110010735A (ko) * | 2008-04-24 | 2011-02-07 | 알까뗄 루슨트 | 반도체 기판을 이송하는데 사용되는 인클로저의 오염 측정을 위한 스테이션 및 방법 |
-
2014
- 2014-11-25 KR KR1020140164929A patent/KR101483224B1/ko active IP Right Grant
-
2015
- 2015-11-12 WO PCT/KR2015/012157 patent/WO2016085167A1/fr active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH085542A (ja) * | 1994-06-20 | 1996-01-12 | Hitachi Ltd | 半導体装置の製造方法および装置 |
JPH11217670A (ja) * | 1997-11-25 | 1999-08-10 | Japan Steel Works Ltd:The | 枚葉式ロードロック装置及び基板清浄化方法 |
KR20070038795A (ko) * | 2005-10-07 | 2007-04-11 | 주식회사 코미코 | 파티클 제거 방법 및 장치, 및 이를 포함하는 파티클 측정방법 및 장치 |
KR20110010735A (ko) * | 2008-04-24 | 2011-02-07 | 알까뗄 루슨트 | 반도체 기판을 이송하는데 사용되는 인클로저의 오염 측정을 위한 스테이션 및 방법 |
KR100976987B1 (ko) * | 2010-01-07 | 2010-08-19 | 주식회사 올루 | 크린룸용 자재의 입자 오염 시험 장치 |
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