WO2016084989A1

WO2016084989A1 - Optical semiconductor lighting apparatus

Info

Publication number: WO2016084989A1
Application number: PCT/KR2014/011339
Authority: WO
Inventors: 김진종; 김동희; 김경례; 김대원; 김정화
Original assignee: 주식회사 포스코엘이디
Priority date: 2014-11-25
Filing date: 2014-11-25
Publication date: 2016-06-02

Abstract

The present invention relates to an optical semiconductor lighting apparatus comprising: an upper body which has an open lower surface, forming an inner space, and an upper protruding piece formed on the outer surface thereof; a lower body which has an open upper surface, forming an inner space, and a lower protruding portion formed on the outer surface thereof and in a straight line with the upper protruding piece; one or more heat sinks having a coupling assembly into which the upper protruding piece and the lower protruding piece are inserted; and a light-emitting module, having one or more optical semiconductor devices formed thereon, on one lateral side of the heat sink, wherein the heat sinks surround the outer lateral sides of the upper body and the lower body, thereby providing enhanced aesthetics and enabling production of emotional lighting by being in balance with the surroundings.

Description

Optical semiconductor lighting device

The present invention relates to an optical semiconductor lighting apparatus, and more particularly, to an optical semiconductor lighting apparatus that can be improved in aesthetic sense by harmonizing with the surrounding landscape and to implement emotional lighting.

Optical semiconductors such as LEDs or LEDs are one of the components that are widely used for lighting recently due to their low power consumption, long service life, excellent durability, and much higher brightness than incandescent and fluorescent lamps.

In particular, the above-described type of optical semiconductor does not use harmful substances to the environment compared to products such as fluorescent lamps and mercury lamps which are manufactured by injecting mercury harmful to the human body together with argon gas into the glass tube, thereby making it possible to produce environment-friendly products. will be.

In particular, the lighting device using the optical semiconductor as a light source is recently used for outdoor landscape lighting or security, etc., the assembly and construction of the product should be convenient.

In addition, the lighting device using the optical semiconductor as a light source should be a structure that can be replaced and repaired immediately in case of failure and malfunction.

The present invention has been made in view of the above, it is an object of the present invention to provide an optical semiconductor lighting apparatus that is capable of improving aesthetics and realizing emotional lighting in harmony with the surrounding landscape.

In order to achieve the above object, the present invention, the lower body is opened to form an inner space and the upper body formed with an upper stone piece on the outer surface; A lower body having an upper surface open to form an inner space and having a lower stone piece disposed on a line with the upper stone piece; an at least one heat sink including a fastening assembly into which the upper stone piece and the lower stone piece are inserted; And a light emitting module having at least one semiconductor optical device formed on one side of the heat sink, wherein the heat sink surrounds the outer surfaces of the upper body and the lower body. have.

The optical semiconductor lighting device may further include an Edison base formed at the lower end of the lower body, and a base holder provided at the lower end of the lower body to which the Edison base is fastened.

In this case, the optical semiconductor lighting device, the lower edge of the upper body and the upper edge of the lower body correspond to, characterized in that it further comprises a fastening member for connecting the upper body and the lower body.

The lower end of the upper body is inserted into the upper end of the lower body.

The upper end of the lower body is inserted into the upper end of the upper body.

And, the heat sink is characterized in that to form a polygonal pillar surrounding the outer surface of the upper body and the lower body.

The polygonal pillar may be one of a triangular pillar, a square pillar, a pentagonal pillar, a hexagonal pillar, a seven-cornered pillar, and an octagonal pillar.

And, one side of the heat sink is characterized in that the through-hole through the wiring for supplying power to the light emitting module is formed.

The optical semiconductor lighting device is characterized in that a wiring passage is formed at a portion where the lower end of the upper body and the upper end of the lower body are engaged.

In addition, a power supply device or a driving circuit is formed in the inner space of the upper body or the lower body.

The optical semiconductor lighting apparatus may further include a plurality of heat dissipation fins protruding from the other side surface of the heat sink, and the fastening assembly may be formed at the center of the plurality of heat dissipation fins.

The optical semiconductor lighting apparatus further includes a plurality of heat dissipation fins protruding from the other side of the heat sink, and the fastening assembly is formed at the center of the other side of the heat sink.

The fastening assembly may include a pair of protrusions protruding from a center portion of the heat dissipation base constituting the heat sink and an outer surface of the upper body and the lower body to extend along edges of the pair of protrusions. It characterized in that it comprises a fixing piece fixed to.

The optical semiconductor lighting device may further include at least one fastening slot formed on outer surfaces of the upper body and the lower body and disposed in a straight line to accommodate the fastening assembly. The protrusion is characterized in that it is disposed in the fastening slot.

In addition, the upper and lower pieces are characterized in that a plurality of spaced apart at equal intervals along the outer surface of the upper body and the lower body.

The plurality of heat sinks may form an air flow path at a predetermined interval.

In addition, the heat sink is characterized in that spaced apart from the neighboring heat sink at a predetermined interval.

According to the present invention having the above-described configuration, the light emitting module is formed in each of the plurality of heat sinks disposed radially on the outer surface of the housing on which the Edison base is formed. In harmony with the landscape, aesthetics can be improved and emotional lighting can be realized.

1 is a perspective view showing the overall structure of an optical semiconductor lighting apparatus according to an embodiment of the present invention

2 is an exploded perspective view showing the overall structure of an optical semiconductor lighting apparatus according to an embodiment of the present invention

3 is a perspective view showing a partial structure of a housing that is a main part of an optical semiconductor lighting apparatus according to an embodiment of the present invention;

Figure 4 is a perspective view showing the remaining structure of the housing which is the main part of the optical semiconductor lighting apparatus according to an embodiment of the present invention

5 is a perspective view showing the structure of a heat sink that is a main part of an optical semiconductor lighting apparatus according to an embodiment of the present invention;

6 is a side view illustrating a structure of a housing, which is a main part of an optical semiconductor lighting apparatus, according to an exemplary embodiment, in which a heat sink and a light emitting module, which are main parts of the present invention, are separated from each other;

Advantages and features of the present invention, and methods for achieving them will be apparent with reference to the embodiments described below in detail in conjunction with the accompanying drawings.

However, the present invention is not limited to the embodiments disclosed below, but may be implemented in various different forms.

In this specification, the embodiments are provided so that the disclosure of the present invention may be completed and the scope of the present invention may be completely provided to those skilled in the art.

And the present invention is only defined by the scope of the claims.

Thus, in some embodiments, well known components, well known operations and well known techniques are not described in detail in order to avoid obscuring the present invention.

In addition, the same reference numerals throughout the specification refer to the same components, and the terminology (discussed) used herein is for the purpose of describing the embodiments are not intended to limit the invention.

As used herein, the singular forms "a", "an" and "the" include plural unless the context clearly dictates otherwise, and the elements and acts referred to as 'comprises' or 'do' not exclude the presence or addition of one or more other components and acts. .

Unless otherwise defined, all terms (including technical and scientific terms) used in the present specification may be used in a sense that can be commonly understood by those skilled in the art.

In addition, the terms defined in the commonly used dictionary are not ideally or excessively interpreted unless they are defined.

Hereinafter, with reference to the accompanying drawings will be described a preferred embodiment of the present invention.

1 is a perspective view showing the overall structure of an optical semiconductor lighting apparatus according to an embodiment of the present invention, Figure 2 is an exploded perspective view showing the overall structure of an optical semiconductor lighting apparatus according to an embodiment of the present invention.

As shown in the drawing, it can be understood that the present invention includes a housing 100, a heat sink 200, and a light emitting module 300.

The housing 100 is connected to a power socket (not shown) and provides a space and an area for mounting the heat sink 200 to be described later. The housing 100 is divided into an upper body 110d and a lower body 120d. will be.

The upper body 110d has an open lower surface to form an inner space, and an upper protrusion piece 161 is formed on the outer surface.

The lower body 120d has an upper surface open to form an inner space, and a lower stone piece 162 disposed on a line with the upper stone piece 161 on the outer surface thereof.

The upper and

lower protrusion pieces

161 and 162 respectively function as support members for supporting both ends of the fastening assembly 230 which will be described later.

The heat sink 200 is provided with at least one, including a fastening assembly 230 into which the upper protrusion 161 and the lower protrusion 162 are inserted, for efficient cooling of heat generated from the light emitting module 300 to be described later. will be.

The light emitting module 300 has at least one semiconductor optical device 500 formed on one side of the heat sink 200, and serves to function as a light source.

The heat sink 200 surrounds the outer surfaces of the upper body 110d and the lower body 120d.

The present invention can be applied to the embodiment of the configuration as described above, it is also possible to apply various embodiments as follows.

For reference, FIG. 3 is a perspective view illustrating a partial structure of a housing that is a main part of an optical semiconductor lighting apparatus according to an embodiment of the present invention, and FIG. 4 is a view of a housing that is a main part of an optical semiconductor lighting apparatus according to an embodiment of the present invention. A perspective view showing the rest of the structure.

5 is a perspective view showing a structure of a heat sink that is a main part of an optical semiconductor lighting apparatus according to an embodiment of the present invention.

6 is a side conceptual view illustrating a structure of a housing, which is a main part of an optical semiconductor lighting apparatus, according to an exemplary embodiment, in which a heat sink and a light emitting module, which are main parts of the present invention, are separated from each other.

According to the present invention, an Edison base 101 is formed at a lower end of the lower body 120d and coupled to a socket (not shown).

Specifically, the Edison base 101 is configured to perform a role of an electrical contact screwed with a socket to receive power from the outside.

For convenience in assembling the Edison base 101, it is preferable to further include a base holder 105 provided at the lower end of the lower body 120d to which the Edison base 101 is fastened.

3 and 4, the lower edge of the upper body 110d and the upper edge of the lower body 120d correspond to each other, and a fastening member connecting the upper body 110d and the lower body 120d to each other. Application of an embodiment further comprising 140 is possible.

That is, the upper body 110d and the lower body 120d are fastened to each other by the fasteners 141 such as bolts through the fastening members 140 of the upper body 110d and the lower body 120d, respectively. )

In addition, the housing 100 is not particularly shown in addition to the above-described coupling and fastening structure, the lower end of the upper body 110d is inserted into the upper end of the lower body 120d, or the upper end of the lower body 120d is the upper body ( 110d) may be applied to the embodiment such as to be inserted into the upper end of the course.

Meanwhile, in the present invention, the wiring passage 170 is formed at a portion where the lower end portion of the upper body 110d and the upper end portion of the lower body 120d are engaged with each other so that the wiring for supplying power to the light emitting module 300 is connected to the upper body ( 110d) and the inner space of the lower body 120d.

In the internal space of the upper body 110d and the lower body 120d, a power supply device 400 or a driving circuit (not shown) may be formed to be connected to the above-described wiring so as to be connected to the light emitting module 300. Of course.

3, 4, and 6, the above-described wiring passage 170 may be divided into a first wiring passage half 171 and a second wiring passage half 172.

First, before referring to the first wiring passage half 171 and the second wiring passage half 172, the upper body 110d and the lower body 120d are divided according to the divided structure of the housing 100. The first and

second cylinders

110c and 120c may also be divided according to a coupling structure with the heat sink 200 to be described later.

The first tube part 110c forms an internal space in which the power supply device 400 electrically connected to the light emitting module 300 is embedded.

The second cylinder portion 120c has an inner circumferential surface facing the outer circumferential surface of the first cylinder portion 110c and is formed on the inner surface of the first cylinder portion 110c.

Here, the heat sink 200 is coupled between the first and

second cylinders

110c and 120c.

The first and

second cylinder parts

110c and 120c are formed by coupling the upper and lower divided parts of the upper body 110d and the lower body 120d by the fastening member 140.

Here, the housing 100 is formed on the outer surface of the upper body 110d and the lower body 120d and disposed in a straight line, and further includes at least one fastening slot 130 for receiving the fastening assembly 230. The upper protrusion 161 and the lower protrusion 162 described above are disposed in the fastening slot 130.

At this time, the upper protrusion piece 161 and the lower protrusion piece 162 is preferably arranged in a plurality spaced apart at equal intervals along the outer surface of the upper body 110d and the lower body 120d to enable the formation of a polygonal pillar to be described later. .

Therefore, the first wiring passage half 171 described above is illustrated in FIG. 6 at the lower edge of the upper body 110d, that is, the upper edge of the upper edge of the upper and lower portions of the upper body 110d. It is formed by cutting in an arc shape convex upward as shown, are arranged in each of the fastening slot 130 is formed position.

In addition, the second wiring passage half portion 172 is convex downward at the upper edge of the lower body 120d, that is, at the upper edge of the lower side of the lower portion of the lower body 120d where the first cylinder portion 110c is bisected up and down. It is formed by cutting in an arc shape, and are disposed at positions where the fastening slots 130 are formed.

Accordingly, when the upper body 110d and the lower body 120d are engaged with each other and integrally coupled to each other, the first wiring passage half 171 and the second wiring passage half respectively disposed at positions where the plurality of fastening slots 130 are formed. The portions 172 are engaged with each other to form a wiring passage 170 having a circular or elliptic shape as a whole.

That is, the semiconductor optical device 500 of the light emitting module 300 may be electrically connected to the power supply device 400 by wirings (not shown) disposed through the wiring passage 170 described above.

On the other hand, the heat sink 200 surrounds the outer surface of the upper body (110d) and the lower body (120d) to form a polygonal pillar, the above-described polygonal pillar is a triangular pillar, a square pillar, a pentagonal pillar, a hexagonal pillar, as the case may be It can be one of seven pillars or eight pillars.

Therefore, the semiconductor optical device 500 of the light emitting module 300 mounted on the heat sink 200 is irradiated with light at right angles to the Edison base 101.

On one side of the heat sink 200, a through hole 211 through which a wire for supplying power to the light emitting module 300 may pass may be formed.

The heat sink 200 is spaced apart from the neighboring heat sink 200 at regular intervals, the plurality of heat sinks 200 by the air flow path 201 of a predetermined interval to further improve the cooling performance through natural convection It can be improved.

In addition, the present invention further includes a plurality of heat dissipation fins 220 protruding from the other side surface of the heat sink 200, and the fastening assembly 230 includes a plurality of heat dissipation fins 220 in a central portion, that is, the other of the heat sink 200. It is advantageous in terms of the fastening and arrangement structure that is formed in the side center portion.

The fastening assembly 230 extends along the edges of the pair of protrusions 231 and the pair of protrusions 231 protruding from the center of the heat dissipation base 210 constituting the surface of the heat sink 200. It can be seen that the structure includes a fixing piece 232 fixed to the outer surface of the upper body (110d) and the lower body (120d).

As described above, it can be seen that the present invention has a basic technical idea to provide an optical semiconductor lighting apparatus that can be improved in aesthetic sense in harmony with the surrounding landscape, and to realize emotional lighting.

In addition, many modifications and applications are possible to those skilled in the art within the scope of the basic technical idea of the present invention.

Claims

An upper body having an lower surface open to form an inner space and an upper stone piece formed on an outer surface thereof;

A lower body having an upper surface open to form an inner space and having a lower stone piece disposed on a line with the upper stone piece on an outer surface thereof;

At least one heat sink comprising a fastening assembly into which the upper and lower protrusions are inserted; And

A light emitting module having at least one semiconductor optical device formed on one side of the heat sink,

And the heat sink surrounds the outer surfaces of the upper body and the lower body.
The method according to claim 1,

The optical semiconductor lighting device,

An Edison base formed at a lower end of the lower body,

And a base holder provided at the lower end of the lower body to which the Edison base is fastened.
The method according to claim 1,

The optical semiconductor lighting device,

And a lower end edge of the upper body and an upper end edge of the lower body, the fastening member connecting the upper body and the lower body.
The method according to claim 1,

The lower end of the upper body is an optical semiconductor lighting device, characterized in that inserted into the upper end of the lower body.
The method according to claim 1,

And an upper end of the lower body is inserted into an upper end of the upper body.
The method according to claim 1,

The heat sink is an optical semiconductor lighting device, characterized in that to form a polygonal pillar surrounding the outer surface of the upper body and the lower body.
The method according to claim 6,

The polygonal pillar,

Optical semiconductor lighting device, characterized in that the triangular pillar, square pillar, pentagonal pillar, hexagonal pillar, heptagon pillar, octagonal pillar.
The method according to claim 1,

On one side of the heat sink is an optical semiconductor lighting device, characterized in that the through hole is formed through the wiring for supplying power to the light emitting module.
The method according to claim 1,

The optical semiconductor lighting device,

And a wiring passage is formed at a portion where the lower end of the upper body and the upper end of the lower body are engaged with each other.
The method according to claim 1,

Optical semiconductor lighting device, characterized in that the power supply or drive circuit is formed in the inner space of the upper body or the lower body.
The method according to claim 1,

The optical semiconductor lighting device,

Further comprising a plurality of heat dissipation fins protruding from the other side of the heat sink,

The fastening assembly is an optical semiconductor lighting device, characterized in that formed in the central portion of the plurality of radiating fins.
The method according to claim 1,

The optical semiconductor lighting device,

Further comprising a plurality of heat dissipation fins protruding from the other side of the heat sink,

The fastening assembly is an optical semiconductor lighting device, characterized in that formed in the central portion of the other side of the heat sink.
The method according to claim 1,

The fastening assembly,

A pair of protruding pieces protruding from a central portion of the heat dissipation base constituting the heat sink surface;

And a fixing piece extending along edges of the pair of protruding pieces and fixed to outer surfaces of the upper body and the lower body.
The method according to claim 1,

The optical semiconductor lighting device,

It is formed on the outer surface of the upper body and the lower body and disposed in the straight line, further comprising at least one fastening slot for receiving the fastening assembly,

And the upper and lower protrusions are arranged in the fastening slot.
The method according to claim 14,

The upper protrusion piece and the lower protrusion piece is disposed in plurality in the spaced apart at equal intervals along the outer surface of the upper body and the lower body.
The method according to claim 1,

The plurality of heat sinks are optical semiconductor lighting device, characterized in that for forming a predetermined interval of the air flow path.
The method according to claim 1,

The heat sink is an optical semiconductor lighting device, characterized in that spaced apart from the neighboring heat sink at a predetermined interval.