WO2013005999A1 - Illuminating apparatus using leds - Google Patents

Illuminating apparatus using leds Download PDF

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Publication number
WO2013005999A1
WO2013005999A1 PCT/KR2012/005342 KR2012005342W WO2013005999A1 WO 2013005999 A1 WO2013005999 A1 WO 2013005999A1 KR 2012005342 W KR2012005342 W KR 2012005342W WO 2013005999 A1 WO2013005999 A1 WO 2013005999A1
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WO
WIPO (PCT)
Prior art keywords
led module
base member
led
power supply
board
Prior art date
Application number
PCT/KR2012/005342
Other languages
French (fr)
Korean (ko)
Inventor
허면
강영만
한경훈
강영남
김현민
Original Assignee
한국남부발전 주식회사
주식회사 지엘에스
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Publication date
Application filed by 한국남부발전 주식회사, 주식회사 지엘에스 filed Critical 한국남부발전 주식회사
Publication of WO2013005999A1 publication Critical patent/WO2013005999A1/en

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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00Fastening of light sources or lamp holders
    • F21V19/001Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/004Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by deformation of parts or snap action mountings, e.g. using clips
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00Fastening of light sources or lamp holders
    • F21V19/001Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/0055Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by screwing
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

Definitions

  • the present invention relates to a lighting apparatus using an LED, and more particularly, to a lighting apparatus using an LED that can facilitate the connection of the printed circuit board and the LED module and detachable to improve workability and assembly. will be.
  • lighting devices are used to be installed in indoor or outdoor advertisements or signs to identify images at day or night, and these lighting devices are light emitting devices, such as filament bulbs, fluorescent lights, neon signs, or LEDs. (Light Emitting Diode: LED) is used.
  • LED Light Emitting Diode
  • the lighting device using the LED has the advantage that the life of the LED is semi-permanent, inexpensive, and low power consumption, the use is gradually increasing.
  • LED light-emitting diode
  • LED refers to a light emitting diode device, has the advantages of fast processing speed and low power consumption of the LED semiconductor, and is attracting attention as the next generation strategic products because it is environmentally friendly and high energy saving effect.
  • COB Chip On Board
  • PCB printed circuit board
  • each LED module is connected through a wire to apply current when a plurality of LED modules are used.
  • the conventional lighting apparatus uses electric wires to supply current to each LED module, the electric wiring becomes complicated and the soldering portions of the LED module and the electric wiring are easily dropped and the durability is degraded.
  • the present invention has been made in order to improve the conventional problems as described above, to prevent the use of electrical wiring for supplying the current to the LED module is easy to manufacture, and to improve the durability using the LED lighting device
  • the purpose is to provide.
  • the present invention to achieve the above object is a plurality of LED module; A power supply unit mounted with the LED module and supplying power to the LED module; A base member to which the LED module and the power supply unit are fixed; And it provides a lighting device using the LED including a heat dissipation portion that the base member is detached so that the heat of the LED module heat dissipation.
  • the present invention provides a lighting apparatus using an LED further comprising a detachable portion provided in the heat radiating portion to detach the base member to the heat radiating portion.
  • the present invention provides a lighting apparatus using an LED further comprises a light diffusion unit coupled to the base member so that the light emitted from the LED module is diffused.
  • the present invention is the power supply is connected to the power supply line through the soldering board, the board member coupled to the base member; A seating member formed on the board member such that the LED module is mounted on the board member; And an LED formed on an upper surface of the board member and including a connection member connecting the LED module to the power supply line.
  • the present invention provides a lighting device using an LED that is a hole formed in the board member so that the seating member is inserted into the LED module.
  • the present invention provides a lighting device using an LED further comprises a fixing member penetrates between the seating member and the LED module to the base member, and fixes the LED module and the power supply to the base member. do.
  • the present invention is provided with a removable portion rotatably provided in the heat dissipating portion, the elastic member which is contacted or spaced apart from the base member through rotation; And a rotatably provided to the heat dissipating unit so that the elastic member is caught, and a close contact member which closely contacts the elastic member to the base member through rotation.
  • the present invention is a light diffuser coupled to the base member, the reflector is formed with a through hole to expose the LED module; And a diffusion lens member coupled to the base member to cover the reflector, and configured to diffuse light reflected from the reflector.
  • the present invention provides a lighting apparatus using an LED further comprises a sealing member provided between the light diffusing portion and the diffusion lens member and the base member.
  • the present invention provides a plurality of LED modules which are formed in a chip on board (COB) type in which a light emitting diode, which is an LED element, is directly formed on a printed circuit board for illumination;
  • a power supply unit mounted with the LED module to supply power to the LED module;
  • a base member formed of an aluminum material so that heat of the LED module is transferred and radiated, and having the LED module and the power supply fixed thereto;
  • Fixing member for fixing the LED module and the power supply to the base member;
  • a heat dissipation unit to which the base member is detached to dissipate heat of the LED module;
  • a detachable part provided in the heat radiating part to detach the base member from the heat radiating part;
  • a light diffuser coupled to the base member to increase the brightness of light emitted from the LED module and to diffuse the emitted light.
  • the power supply unit a power supply line for supplying the applied power; An end portion of the power supply line exposed on an upper surface of the board member and formed of an insulating plastic material; A seating member having a shape corresponding to that of the LED module so that the LED module is inserted into and mounted on the board member and penetratingly formed through the board member with the same thickness as the printed circuit board of the LED module; And a connecting member formed in a pattern form by a conductor on an upper surface of the board member so that the power supply line and the LED module are connected by soldering.
  • the fixing member is fastened to the base member through a coupling hole penetrated between the power supply unit and the LED module so that the head is supported in contact with the upper surface of the board member and the LED module.
  • the detachable part may include: an elastic member rotatably provided at the heat radiating part so that one end portion is hinged to the heat radiating part so as to be contacted or spaced apart from the base member through rotation, and a center part has a curvature; And a close contact member rotatably installed on the heat dissipating unit through a hinge coupling, and the other end of the elastic member is fixed by rotation to closely adhere the elastic member to the base member.
  • the optical diffuser may include a reflector having a through hole formed to expose the LED module, mounted to the base member, and having a light reflecting surface formed therein for reflecting light emitted from the LED module;
  • the reflector is coupled to the base member to prevent foreign matter from penetrating into the LED module, and a lens for increasing light of the LED module is formed at a portion corresponding to the LED module, and is reflected from the reflector.
  • the LED module is connected to the power supply line through the power supply unit to prevent the use of a separate electrical wiring for the connection of the LED module, it is easy to manufacture, and the durability is improved. There is an advantage.
  • FIG. 1 is an exploded perspective view showing the configuration of a lighting apparatus using an LED according to an embodiment of the present invention.
  • FIG. 2 is a perspective view showing an LED module and a power supply according to an embodiment of the present invention.
  • FIG. 3 is a cross-sectional view of the combination of FIG.
  • FIG. 4 is a plan view of FIG. 2.
  • Figure 5 is a side view showing the configuration of the removable portion according to an embodiment of the present invention.
  • the lighting apparatus using the LED includes a plurality of LED modules 10 for lighting and a power supply unit 20 for supplying power to the LED modules 10. ), A base member 30 to which the LED module 10 and the power supply unit 20 are fixed, and a heat dissipation unit 40 for heat dissipation of the LED module 10.
  • the lighting apparatus is a light diffusion part for increasing the brightness of the light emitted from the detachable portion 50 and the LED module 10 to detach the base member 30 to the heat dissipation portion ( 60) further.
  • the LED module 10 uses a chip on board (COB) type module in which a light emitting diode is directly formed on a printed circuit board (PCB).
  • COB chip on board
  • PCB printed circuit board
  • the LED module 10 is manufactured to have an output of 10W, and four are installed in the power supply unit 20.
  • the power supply unit 20 is configured to stably fix the four LED modules 10 and to connect the power supply line 21 and the LED module 10 while preventing the use of electrical wiring.
  • the power supply unit 20 is a board member 23 to which the power supply line 21 is connected, a seating member 25 for fixing the LED module 10 and the LED module 10 and the power supply line 21. It consists of a connecting member 27 for connecting.
  • Board member 23 is made of an insulating plastic, the power supply line 21 is fixed to the center by soldering.
  • the board member 23 is formed to have the same thickness as the printed circuit board so that the LED module 10 and the connection member 27 can be easily connected.
  • the LED module 10 when the printed circuit board thicknesses of the board member 23 and the LED module 10 are formed to be the same, when the LED module 10 is seated on the board member 23, the upper surface of the board member 23 and the LED module The upper surface of the (10) is horizontal, so that the connection member 27 and the LED module 10 can be connected to the soldering stably and easily using lead-free lead.
  • the power supply unit 20 and the LED module 10 may be fixed to the base member 30 at the same time, which will be described later.
  • the board member 23 is formed with a seating member 25 for fixing the LED module 10 and a connecting member 27 for connecting the LED module 10 and the power supply line 21, respectively.
  • the mounting member 25 is formed in the board member 23 to have a shape corresponding to the LED module 10 so that the LED module 10 is stably and firmly seated on the board member 23.
  • the seating member 25 is formed in the form of a hole in the board member 23 so that the LED module 10 can be inserted into four.
  • the seating member 25 is formed as a hole, but may be formed in the board member 23 in a groove shape.
  • the connecting member 27 is formed on the upper surface of the board member 23 by a conductor, and the LED module 10 and the power supply line 21 are connected by soldering.
  • the LED module 10 inserted into the board member 23 and the seating member 25 is coupled to the base member 30 through the fixing member 70 fastened to the base member 30.
  • a coupling hole 29 through which the fixing member 70 penetrates is formed between the seating member 25 and the LED module 10.
  • the coupling hole 29 is formed by the round 11 is formed in the corner portion of the LED module 10.
  • the fixing member 70 is fastened to the base member 30 through the coupling hole 29 so that the head is in contact with and supported by the upper surface of the board member 23 and the LED module 10.
  • a screw or a bolt may be used as the fixing member 70 according to the present embodiment.
  • the light diffusion unit 60 is further installed on the base member 30.
  • the light diffuser 60 includes a reflector 61 coupled to the base member 30, a lens member 63 and a lens member 63 and a base member (which increase brightness of light reflected by the reflector 61). 30) is made of a sealing member (65) for sealing between.
  • the reflector 61 has a through hole 61a formed to expose the LED module 10 and is mounted to the base member 30, and a light reflection surface for reflecting light emitted from the LED module 10 is formed therein. do.
  • the lens member 63 covers the reflector 61 to prevent foreign matter from penetrating into the LED module 10.
  • the lens member 63 is formed by a transparent body, and a lens for increasing light of the LED module 10 is formed at a portion corresponding to the LED module 10.
  • sealing member 65 is provided between the lens member 63 and the base member 30, coupled to the base member 30 together with the lens member 63 through a bolt for fixing the lens member 63. do.
  • the light emitted from the LED module 10 is reflected and diffused through the reflector 61, and the brightness is increased while passing through the lens member 63.
  • the base member 30 is formed of aluminum so that the heat of the LED module 10 is effectively transmitted to the heat radiating portion 40 to radiate.
  • the detachable part 50 for fixing the base member 30 to the heat dissipation part 40 is rotatably provided at the heat dissipation part 40, and is elastic member 51 contacted or spaced apart from the base member 30 through rotation. And, the elastic member 51 is rotatably provided in the heat dissipating portion 40 is made of a close contact member 53 is in close contact with the elastic member 51 to the base member 30 through rotation.
  • the elastic member 51 has an annular shape in which one end is hinged to the heat dissipation part 40, and the other end is caught or detached from the contact member 53 through rotation.
  • the elastic member 51 is formed to have a curvature in the center thereof and is in contact with the upper surface of the base member 30.
  • the close contact member 53 is rotatably installed on the heat dissipation unit 40 through a hinge coupling, and when the elastic member 51 is caught, the close contact member 53 is rotated toward the heat dissipation unit 40 and closely adheres the elastic member 51 to the base member 30 side. Let's go.
  • a plurality of LED modules 10 are inserted and seated in the seating member 25, and then the fixing member 70 passes between the LED module 10 and the board member 23 to be coupled to the base member 30.
  • the LED module 10 and the board member 23 is fixed to the base member 30 together.
  • the LED module 10 and the board member 23 can be easily fixed to the base member 30 by using the fixing member 70.
  • the LED module 10 and the power supply line 21 are soldered to the connection member 27 formed in a pattern on the upper surface of the board member 23, the LED module 10 and the power supply line 21 are connected. Since the use of the wire for connecting the LED module 10 and the power supply line 21 is prevented, manufacturing is easy and durability is improved.
  • the illuminance of the lighting apparatus can be further improved.

Abstract

The present invention relates to an illuminating apparatus using LEDs, in which a connection between a printed circuit board and an LED module is made easy and the printed circuit board and the LED module can be detached from each other so as to improve workability and assemblability. The illuminating apparatus of the present invention comprises: a plurality of LED modules formed into a chip on board (COB) type in which light emitting diodes, which are LED devices, are directly molded on a printed circuit board for illumination; a power supply unit for supplying power to LED modules attached thereto; a base member which is formed of an aluminum material for transferring and dissipating heat from the LED modules, and to which the LED modules and the power supply unit are fixed; a fixing member which fixes the LED modules and the power supply unit to the base member; a heat-dissipating unit which may be detached from the base member so as to dissipate the heat of the LED modules; a detaching unit provided at the heat-dissipating unit so as to detach the base member from the heat-dissipating unit; and a light-diffusing unit which is coupled to the base member and which increases the brightness of light emitted from the LED modules and diffuses the emitted light.

Description

엘이디를 이용한 조명장치LED lighting device
본 발명은 엘이디를 이용한 조명장치에 관한 것으로, 보다 상세하게는 인쇄회로기판과 엘이디모듈의 연결을 용이하게 하고, 탈착할 수 있도록 하여 작업성과 조립성을 향상시킬 수 있는 엘이디를 이용한 조명장치에 관한 것이다.The present invention relates to a lighting apparatus using an LED, and more particularly, to a lighting apparatus using an LED that can facilitate the connection of the printed circuit board and the LED module and detachable to improve workability and assembly. will be.
일반적으로, 실내 또는 실외의 광고물 또는 간판 등에 설치되어 주간 또는 야간에 이미지를 식별할 수 있도록 여러 가지 형태의 조명장치들이 사용되고 있으며, 이러한 조명장치들은 발광소자로 필라멘트 전구, 형광등, 네온사인 또는 엘이디(Light Emitting Diode : LED)를 사용하고 있다.In general, various types of lighting devices are used to be installed in indoor or outdoor advertisements or signs to identify images at day or night, and these lighting devices are light emitting devices, such as filament bulbs, fluorescent lights, neon signs, or LEDs. (Light Emitting Diode: LED) is used.
특히 엘이디를 이용한 조명장치는 엘이디의 수명이 반영구적이고 가격이 저렴하며, 전력소비가 적은 장점을 가지고 있어 그 사용이 점차 증가하고 있는 추세이다.In particular, the lighting device using the LED has the advantage that the life of the LED is semi-permanent, inexpensive, and low power consumption, the use is gradually increasing.
엘이디(LED ; light-emitting diode)란 발광 다이오드 소자를 칭하는 것으로, LED 반도체의 빠른 처리 속도와 낮은 전력소모 등의 장점을 가지고 있고 환경 친화적이면서도 에너지 절약효과가 높아서 차세대 전략제품으로 각광 받고 있다.LED (light-emitting diode) refers to a light emitting diode device, has the advantages of fast processing speed and low power consumption of the LED semiconductor, and is attracting attention as the next generation strategic products because it is environmentally friendly and high energy saving effect.
한편, 최근에는 보다 고출력의 조명장치를 제작하기 위하여 COB(Chip On Board) 타입의 엘이디 모듈이 많이 사용되고 있다. COB란 인쇄회로기판(PCB)에 엘이디 소자인 칩을 바로 올려서 접속하는 구조로 작은 공간에 보다 많은 엘이디를 형성할 수 있다.On the other hand, in recent years, a COB (Chip On Board) type of LED module has been used in order to manufacture a higher power lighting device. COB is a structure in which a chip, which is an LED element, is directly mounted on a printed circuit board (PCB) to be connected, and more LEDs can be formed in a small space.
이와 같이 칩-온-보드 타입의 엘이디 모듈을 이용한 조명장치는 복수의 엘이디 모듈을 사용할 경우 전류를 인가하기 위하여 각각의 엘이디 모듈을 전선을 통해 연결하게 된다.As described above, in the lighting apparatus using the chip-on-board type LED module, each LED module is connected through a wire to apply current when a plurality of LED modules are used.
상기한 기술구성은 본 발명의 이해를 돕기 위한 배경기술로서, 본 발명이 속하는 기술 분야에서 널리 알려진 종래기술을 의미하는 것은 아니다.The above technical configuration is a background art for helping understanding of the present invention, and does not mean a conventional technology well known in the art.
관련 선행기술로는 대한민국 공개특허공보 제2011-0043973호 (2011. 04. 28. 공개, 발명의 명칭 : 모듈형 조명장치) 가 있다.Related prior art is Republic of Korea Patent Publication No. 2011-0043973 (2011. 04. 28. Publication, the name of the invention: modular lighting device).
상기와 같이 종래의 조명장치는 각각의 엘이디 모듈에 전류를 공급하기 위하여 전선을 사용하게 되므로, 전기 배선이 복잡해지고 엘이디 모듈과 전기 배선의 납땜 부위가 쉽게 떨어져 내구성 저하되는 문제점이 있다.As described above, since the conventional lighting apparatus uses electric wires to supply current to each LED module, the electric wiring becomes complicated and the soldering portions of the LED module and the electric wiring are easily dropped and the durability is degraded.
본 발명은 상기와 같은 종래의 문제점을 개선하기 위하여 안출된 것으로, 엘이디 모듈에 전류를 공급하기 위한 전기 배선의 사용을 방지하여 제작이 용이하고, 내구성을 향상시킬 수 있도록 하는 엘이디를 이용한 조명장치를 제공하는데 그 목적이 있다.The present invention has been made in order to improve the conventional problems as described above, to prevent the use of electrical wiring for supplying the current to the LED module is easy to manufacture, and to improve the durability using the LED lighting device The purpose is to provide.
상기한 목적을 달성하기 위하여 본 발명은 복수의 엘이디 모듈; 상기 엘이디 모듈이 장착되며, 상기 엘이디 모듈에 전원을 공급하는 전원 공급부; 상기 엘이디 모듈 및 상기 전원 공급부가 고정되는 베이스부재; 및 상기 엘이디 모듈의 열이 방열되도록 상기 베이스부재가 탈착되는 방열부를 포함하는 엘이디를 이용한 조명장치를 제공한다.The present invention to achieve the above object is a plurality of LED module; A power supply unit mounted with the LED module and supplying power to the LED module; A base member to which the LED module and the power supply unit are fixed; And it provides a lighting device using the LED including a heat dissipation portion that the base member is detached so that the heat of the LED module heat dissipation.
또한, 본 발명은 상기 베이스부재를 상기 방열부에 탈착할 수 있도록 상기 방열부에 구비되는 탈착부를 더 포함하는 엘이디를 이용한 조명장치를 제공한다.In addition, the present invention provides a lighting apparatus using an LED further comprising a detachable portion provided in the heat radiating portion to detach the base member to the heat radiating portion.
또한, 본 발명은 상기 엘이디 모듈에서 발광되는 빛이 확산되도록 상기 베이스부재에 결합되는 광 확산부를 더 포함하는 엘이디를 이용한 조명장치를 제공한다.In addition, the present invention provides a lighting apparatus using an LED further comprises a light diffusion unit coupled to the base member so that the light emitted from the LED module is diffused.
또한, 본 발명은 상기 전원 공급부가 납땜을 통해 상기 전원공급선이 접속되며, 상기 베이스부재에 결합되는 보드부재; 상기 보드부재에 상기 엘이디 모듈이 장착되도록 상기 보드부재에 형성되는 안착부재; 및 상기 보드부재의 상면에 형성되며, 상기 엘이디 모듈과 상기 전원공급선을 연결하는 연결부재를 포함하는 엘이디를 이용한 조명장치를 제공한다.In addition, the present invention is the power supply is connected to the power supply line through the soldering board, the board member coupled to the base member; A seating member formed on the board member such that the LED module is mounted on the board member; And an LED formed on an upper surface of the board member and including a connection member connecting the LED module to the power supply line.
또한, 본 발명은 상기 안착부재가 상기 엘이디 모듈이 삽입되어 안착되도록 상기 보드부재에 형성되는 구멍인 엘이디를 이용한 조명장치를 제공한다.In addition, the present invention provides a lighting device using an LED that is a hole formed in the board member so that the seating member is inserted into the LED module.
또한, 본 발명은 상기 안착부재와 상기 엘이디 모듈 사이를 관통하여 상기 베이스부재에 체결되며, 상기 엘이디 모듈과 상기 전원 공급부를 상기 베이스부재에 고정하는 고정부재를 더 포함하는 엘이디를 이용한 조명장치를 제공한다.In addition, the present invention provides a lighting device using an LED further comprises a fixing member penetrates between the seating member and the LED module to the base member, and fixes the LED module and the power supply to the base member. do.
또한, 본 발명은 상기 탈착부가 상기 방열부에 회전가능하게 구비되며, 회전을 통해 상기 베이스부재에 접촉 또는 이격되는 탄성부재; 및 상기 탄성부재가 걸리도록 상기 방열부에 회전가능하게 구비되며, 회전을 통해 상기 탄성부재를 상기 베이스부재로 밀착하는 밀착부재를 포함하는 엘이디를 이용한 조명장치를 제공한다.In addition, the present invention is provided with a removable portion rotatably provided in the heat dissipating portion, the elastic member which is contacted or spaced apart from the base member through rotation; And a rotatably provided to the heat dissipating unit so that the elastic member is caught, and a close contact member which closely contacts the elastic member to the base member through rotation.
또한, 본 발명은 상기 광 확산부가 상기 베이스부재에 결합되며, 상기 엘이디 모듈이 노출되도록 관통구멍이 형성되는 리플렉터; 및 상기 리플렉터를 커버하도록 상기 베이스부재에 결합되며, 상기 리플렉터에서 반사되는 빛을 확산 시키는 확산렌즈부재를 포함하는 엘이디를 이용한 조명장치를 제공한다.In addition, the present invention is a light diffuser coupled to the base member, the reflector is formed with a through hole to expose the LED module; And a diffusion lens member coupled to the base member to cover the reflector, and configured to diffuse light reflected from the reflector.
또한, 본 발명은 상기 광 확산부가 상기 확산렌즈부재와 상기 베이스부재 사이에 마련되는 실링부재를 더 포함하는 엘이디를 이용한 조명장치를 제공한다.In addition, the present invention provides a lighting apparatus using an LED further comprises a sealing member provided between the light diffusing portion and the diffusion lens member and the base member.
상기한 목적을 달성하기 위하여 본 발명은 조명을 위해 인쇄회로기판에 엘이디 소자인 발광다이오드가 직접 성형되는 씨오비(COB: Chip On Board) 타입으로 형성되는 복수의 엘이디 모듈; 상기 엘이디 모듈이 장착되어 상기 엘이디 모듈에 전원을 공급하는 전원 공급부; 상기 엘이디 모듈의 열이 전달되어 방열되도록 알루미늄 재질로 형성되고, 상기 엘이디 모듈과 상기 전원공급부가 고정되는 베이스부재; 상기 엘이디 모듈과 상기 전원 공급부를 상기 베이스부재에 고정시키는 고정부재; 상기 엘이디 모듈의 열이 방열되도록 상기 베이스부재가 탈착되는 방열부; 상기 베이스부재를 상기 방열부에 탈착할 수 있도록 상기 방열부에 구비되는 탈착부; 및 상기 베이스부재에 결합되고, 상기 엘이디 모듈에서 발광되는 빛의 밝기를 증가시키고, 상기 발광되는 빛을 확산시키는 광 확산부; 를 포함하고,In order to achieve the above object, the present invention provides a plurality of LED modules which are formed in a chip on board (COB) type in which a light emitting diode, which is an LED element, is directly formed on a printed circuit board for illumination; A power supply unit mounted with the LED module to supply power to the LED module; A base member formed of an aluminum material so that heat of the LED module is transferred and radiated, and having the LED module and the power supply fixed thereto; Fixing member for fixing the LED module and the power supply to the base member; A heat dissipation unit to which the base member is detached to dissipate heat of the LED module; A detachable part provided in the heat radiating part to detach the base member from the heat radiating part; And a light diffuser coupled to the base member to increase the brightness of light emitted from the LED module and to diffuse the emitted light. Including,
상기 전원 공급부는, 인가된 전원을 공급하는 전원공급선; 상면에 상기 전원공급선의 단부가 노출되고, 절연성을 가지는 플라스틱 재질로 형성되는 보드부재; 상기 보드부재에 상기 엘이디 모듈이 삽입되어 장착되도록 상기 엘이디 모듈과 대응되는 형상을 가지고 상기 엘이디 모듈의 인쇄회로기판과 동일한 두께로 상기 보드부재에 관통 형성되는 안착부재; 및 납땜을 통해 상기 전원공급선과 상기 엘이디 모듈이 접속되도록 상기 보드부재의 상면에 도전체에 의해 패턴 형태로 형성되는 연결부재; 를 포함하고,The power supply unit, a power supply line for supplying the applied power; An end portion of the power supply line exposed on an upper surface of the board member and formed of an insulating plastic material; A seating member having a shape corresponding to that of the LED module so that the LED module is inserted into and mounted on the board member and penetratingly formed through the board member with the same thickness as the printed circuit board of the LED module; And a connecting member formed in a pattern form by a conductor on an upper surface of the board member so that the power supply line and the LED module are connected by soldering. Including,
상기 고정부재는, 헤드가 상기 보드부재와 상기 엘이디 모듈의 상면에 접촉되어 지지되도록 상기 전원 공급부와 상기 엘이디 모듈 사이에 관통되는 결합구멍을 통과하여 상기 베이스부재에 체결되며,The fixing member is fastened to the base member through a coupling hole penetrated between the power supply unit and the LED module so that the head is supported in contact with the upper surface of the board member and the LED module.
상기 탈착부는, 상기 방열부에 회전 가능하게 구비되어 회전을 통해 상기 베이스부재에 접촉 또는 이격되도록 일단부는 상기 방열부에 힌지 결합되는 고리 형태를 가지고, 중앙부는 곡률을 가지도록 형성되는 탄성부재; 및 힌지 결합을 통해 상기 방열부에 회전 가능하게 설치되고, 회전을 통해 상기 탄성부재의 타단부가 걸림 고정되어 상기 탄성부재를 상기 베이스부재로 밀착하는 밀착부재; 를 포함하고,The detachable part may include: an elastic member rotatably provided at the heat radiating part so that one end portion is hinged to the heat radiating part so as to be contacted or spaced apart from the base member through rotation, and a center part has a curvature; And a close contact member rotatably installed on the heat dissipating unit through a hinge coupling, and the other end of the elastic member is fixed by rotation to closely adhere the elastic member to the base member. Including,
상기 광학산부는, 상기 엘이디 모듈이 노출되도록 관통구멍이 형성되고, 상기 베이스부재에 장착되며, 내부에 상기 엘이디 모듈에서 발광되는 빛을 반사시키기 위한 빛 반사면이 형성되는 리플렉터; 상기 엘이디 모듈로 이물질이 침투되는 것을 방지하도록 상기 리플렉터를 커버하여 상기 베이스부재에 결합되고, 상기 엘이디 모듈과 대응되는 부위에 상기 엘이디 모듈의 빛을 증가시키기 위한 렌즈가 형성되며, 상기 리플렉터에서 반사되는 빛을 확산시키는 렌즈부재; 및 상기 렌즈부재와 상기 베이스부재 사이에 마련되고, 상기 렌즈부재를 고정하기 위한 볼트를 통해 상기 렌즈부재와 함께 상기 베이스부재에 결합되는 실링부재; 를 포함하는 것을 특징으로 하는 엘이디를 이용한 조명장치를 제공한다.The optical diffuser may include a reflector having a through hole formed to expose the LED module, mounted to the base member, and having a light reflecting surface formed therein for reflecting light emitted from the LED module; The reflector is coupled to the base member to prevent foreign matter from penetrating into the LED module, and a lens for increasing light of the LED module is formed at a portion corresponding to the LED module, and is reflected from the reflector. A lens member for diffusing light; And a sealing member provided between the lens member and the base member and coupled to the base member together with the lens member through a bolt for fixing the lens member. It provides a lighting apparatus using an LED comprising a.
상기와 같은 본 발명에 따른 엘이디를 이용한 조명장치에 의하면, 엘이디 모듈이 전원 공급부를 통해 전원공급선과 연결되어 엘이디 모듈의 연결을 위한 별도의 전기 배선 사용이 방지되므로, 제작이 용이하고, 내구성이 향상되는 이점이 있다.According to the lighting apparatus using the LED according to the present invention as described above, since the LED module is connected to the power supply line through the power supply unit to prevent the use of a separate electrical wiring for the connection of the LED module, it is easy to manufacture, and the durability is improved. There is an advantage.
도 1은 본 발명의 일 실시 예에 따른 엘이디를 이용한 조명장치의 구성을 나타낸 분해 사시도이다.1 is an exploded perspective view showing the configuration of a lighting apparatus using an LED according to an embodiment of the present invention.
도 2는 본 발명의 일 실시 예에 따른 엘이디 모듈과 전원 공급부를 나타낸 사시도이다.2 is a perspective view showing an LED module and a power supply according to an embodiment of the present invention.
도 3은 도 2의 결합단면도이다.3 is a cross-sectional view of the combination of FIG.
도 4는 도 2의 평면도이다.4 is a plan view of FIG. 2.
도 5는 본 발명의 일 실시 예에 따른 탈착부의 구성을 나타낸 측면도이다.Figure 5 is a side view showing the configuration of the removable portion according to an embodiment of the present invention.
본 발명의 특징 및 이점들은 첨부도면에 의거한 다음의 상세한 설명으로 더욱 명백해질 것이다. 이에 앞서, 본 명세서 및 청구범위에 사용된 용어나 단어는 발명자가 그 자신의 발명을 가장 최선의 방법으로 설명하기 위해 용어의 개념을 적절하게 정의할 수 있다는 원칙에 입각하여 본 발명의 기술적 사상에 부합하는 의미와 개념으로 해석되어야만 한다. The features and advantages of the present invention will become more apparent from the following detailed description based on the accompanying drawings. Prior to this, the terms or words used in the present specification and claims are defined in the technical spirit of the present invention on the basis of the principle that the inventor can appropriately define the concept of the term in order to explain his invention in the best way. It must be interpreted to mean meanings and concepts.
이하, 본 발명에 따른 엘이디를 이용한 조명장치를 첨부된 도면을 참조하여 상세하게 설명한다.Hereinafter, a lighting apparatus using an LED according to the present invention will be described in detail with reference to the accompanying drawings.
도 1 내지 도 5에 도시된 바와 같이, 본 실시 예에 따른 엘이디를 이용한 조명장치는 조명을 위한 복수의 엘이디 모듈(10)과, 이 엘이디 모듈(10)로 전원을 공급하기 위한 전원 공급부(20)와, 엘이디 모듈(10) 및 전원 공급부(20)가 고정되는 베이스부재(30) 및 엘이디 모듈(10)의 방열을 위한 방열부(40)를 포함한다.As shown in FIGS. 1 to 5, the lighting apparatus using the LED according to the present embodiment includes a plurality of LED modules 10 for lighting and a power supply unit 20 for supplying power to the LED modules 10. ), A base member 30 to which the LED module 10 and the power supply unit 20 are fixed, and a heat dissipation unit 40 for heat dissipation of the LED module 10.
또한, 본 실시 예에 따른 조명장치는 베이스부재(30)를 방열부(40)에 탈착하기 위한 탈착부(50) 및 엘이디 모듈(10)에서 발광되는 빛의 밝기를 증가시키기 위한 광 확산부(60)를 더 포함한다.In addition, the lighting apparatus according to the present embodiment is a light diffusion part for increasing the brightness of the light emitted from the detachable portion 50 and the LED module 10 to detach the base member 30 to the heat dissipation portion ( 60) further.
엘이디 모듈(10)은 인쇄회로기판(PCB)에 발광다이오드가 직접 성형되는 씨오비(COB: Chip On Board) 타입의 모듈이 사용되며, 전원 공급부(20)에 안착되어 납땜을 통해 전원 공급부(20)에 접속된다.The LED module 10 uses a chip on board (COB) type module in which a light emitting diode is directly formed on a printed circuit board (PCB). The LED module 10 is mounted on the power supply unit 20 and the power supply unit 20 is soldered. ) Is connected.
이러한, 엘이디 모듈(10)은 10W의 출력을 가지도록 제작되며, 전원 공급부(20)에 4개가 설치된다.The LED module 10 is manufactured to have an output of 10W, and four are installed in the power supply unit 20.
전원 공급부(20)는 4개의 엘이디 모듈(10)을 안정되게 고정함과 동시에 전기 배선의 사용을 방지하면서 전원공급선(21)과 엘이디 모듈(10)을 연결할 수 있도록 구성된다.The power supply unit 20 is configured to stably fix the four LED modules 10 and to connect the power supply line 21 and the LED module 10 while preventing the use of electrical wiring.
이를 위하여, 전원 공급부(20)는 전원공급선(21)이 접속되는 보드부재(23)와, 엘이디 모듈(10)을 고정하기 위한 안착부재(25) 및 엘이디 모듈(10)과 전원공급선(21)을 연결하기 위한 연결부재(27)로 이루어진다.To this end, the power supply unit 20 is a board member 23 to which the power supply line 21 is connected, a seating member 25 for fixing the LED module 10 and the LED module 10 and the power supply line 21. It consists of a connecting member 27 for connecting.
보드부재(23)는 절연성을 가지는 플라스틱에 의해 제작되며, 중앙부에 전원공급선(21)이 납땜을 통해 고정된다. 이러한, 보드부재(23)는 엘이디 모듈(10)과 연결부재(27)를 용이하게 연결할 수 있도록 인쇄회로기판과 동일한 두께를 가지도록 형성된다. Board member 23 is made of an insulating plastic, the power supply line 21 is fixed to the center by soldering. The board member 23 is formed to have the same thickness as the printed circuit board so that the LED module 10 and the connection member 27 can be easily connected.
이와 같이, 보드부재(23)와 엘이디 모듈(10)의 인쇄회로기판 두께를 동일하게 형성하게 되면 엘이디 모듈(10)이 보드부재(23)에 안착되었을 때 보드부재(23)의 상면과 엘이디 모듈(10)의 상면이 수평을 이루게 되어 연결부재(27)와 엘이디 모듈(10)을 무연 납을 이용하여 안정되고 용이하게 납땜 연결할 수 있다.As such, when the printed circuit board thicknesses of the board member 23 and the LED module 10 are formed to be the same, when the LED module 10 is seated on the board member 23, the upper surface of the board member 23 and the LED module The upper surface of the (10) is horizontal, so that the connection member 27 and the LED module 10 can be connected to the soldering stably and easily using lead-free lead.
더하여, 전원 공급부(20)와 엘이디 모듈(10)을 베이스부재(30)에 동시에 고정할 수도 있는데, 이는 후술한다.In addition, the power supply unit 20 and the LED module 10 may be fixed to the base member 30 at the same time, which will be described later.
또한, 보드부재(23)는 엘이디 모듈(10)을 고정하기 위한 안착부재(25) 및 엘이디 모듈(10)과 전원공급선(21)을 연결하기 위한 연결부재(27)가 각각 형성된다.In addition, the board member 23 is formed with a seating member 25 for fixing the LED module 10 and a connecting member 27 for connecting the LED module 10 and the power supply line 21, respectively.
안착부재(25)는 엘이디 모듈(10)이 보드부재(23)에 안정되고 견고하게 안착되도록 엘이디 모듈(10)과 대응되는 형상을 가지도록 보드부재(23)에 형성된다. 이러한, 안착부재(25)에는 엘이디 모듈(10)이 삽입될 수 있도록 보드부재(23)에 구멍형태로 4개 형성된다.The mounting member 25 is formed in the board member 23 to have a shape corresponding to the LED module 10 so that the LED module 10 is stably and firmly seated on the board member 23. The seating member 25 is formed in the form of a hole in the board member 23 so that the LED module 10 can be inserted into four.
본 실시 예에서는 안착부재(25)가 구멍으로 형성되는 것이 도시되어 있지만, 보드부재(23)에 홈 형태로 형성할 수도 있다.In the present embodiment, it is shown that the seating member 25 is formed as a hole, but may be formed in the board member 23 in a groove shape.
연결부재(27)는 도전체에 의해 보드부재(23)의 상면에 형성되며, 엘이디 모듈(10)과 전원공급선(21)이 납땜을 통해 접속된다.The connecting member 27 is formed on the upper surface of the board member 23 by a conductor, and the LED module 10 and the power supply line 21 are connected by soldering.
한편, 보드부재(23)와 안착부재(25)에 삽입되는 엘이디 모듈(10)은 베이스부재(30)에 체결되는 고정부재(70)를 통해 베이스부재(30)에 결합된다. 이때, 안착부재(25)와 엘이디 모듈(10) 사이에는 고정부재(70)가 관통되는 결합구멍(29)이 형성된다.Meanwhile, the LED module 10 inserted into the board member 23 and the seating member 25 is coupled to the base member 30 through the fixing member 70 fastened to the base member 30. At this time, a coupling hole 29 through which the fixing member 70 penetrates is formed between the seating member 25 and the LED module 10.
이러한, 결합구멍(29)은 엘이디 모듈(10)의 모서리부에 형성되는 라운드(11)에 의해 형성된다.This, the coupling hole 29 is formed by the round 11 is formed in the corner portion of the LED module 10.
고정부재(70)는 헤드가 보드부재(23) 및 엘이디 모듈(10)의 상면에 접촉되어 지지되도록 결합구멍(29)을 관통하여 베이스부재(30)에 체결된다.The fixing member 70 is fastened to the base member 30 through the coupling hole 29 so that the head is in contact with and supported by the upper surface of the board member 23 and the LED module 10.
본 실시 예에 따른 고정부재(70)로는 나사 또는 볼트를 사용할 수 있다.As the fixing member 70 according to the present embodiment, a screw or a bolt may be used.
이와 같이 고정부재(70)를 통해 엘이디 모듈(10) 및 전원 공급부(20)가 베이스부재(30)에 고정된 후, 광 확산부(60)가 베이스부재(30)에 더 설치된다.After the LED module 10 and the power supply unit 20 are fixed to the base member 30 through the fixing member 70, the light diffusion unit 60 is further installed on the base member 30.
광 확산부(60)는 베이스부재(30)에 결합되는 리플렉터(61)와, 리플렉터(61)에 의해 반사되는 빛의 밝기를 증가시키는 렌즈부재(63) 및 렌즈부재(63)와 베이스부재(30) 사이를 밀폐시키는 실링부재(65)로 이루어진다.The light diffuser 60 includes a reflector 61 coupled to the base member 30, a lens member 63 and a lens member 63 and a base member (which increase brightness of light reflected by the reflector 61). 30) is made of a sealing member (65) for sealing between.
리플렉터(61)는 엘이디 모듈(10)이 노출되도록 관통구멍(61a)이 형성되어 베이스부재(30)에 장착되며, 내부에 엘이디 모듈(10)에서 발광되는 빛을 반사시키기 위한 빛 반사면이 형성된다.The reflector 61 has a through hole 61a formed to expose the LED module 10 and is mounted to the base member 30, and a light reflection surface for reflecting light emitted from the LED module 10 is formed therein. do.
렌즈부재(63)는 엘이디 모듈(10)로 이물질이 침투되는 것이 방지되도록 리플렉터(61)를 커버한다. 이러한, 렌즈부재(63)는 투명체에 의해 형성되며, 엘이디 모듈(10)과 대응되는 부위에 엘이디 모듈(10)의 빛을 증가시키기 위한 렌즈가 형성된다.The lens member 63 covers the reflector 61 to prevent foreign matter from penetrating into the LED module 10. The lens member 63 is formed by a transparent body, and a lens for increasing light of the LED module 10 is formed at a portion corresponding to the LED module 10.
또한, 실링부재(65)는 렌즈부재(63)와 베이스부재(30) 사이에 마련되며, 렌즈부재(63)를 고정하기 위한 볼트를 통해 렌즈부재(63)와 함께 베이스부재(30)에 결합된다.In addition, the sealing member 65 is provided between the lens member 63 and the base member 30, coupled to the base member 30 together with the lens member 63 through a bolt for fixing the lens member 63. do.
이와 같은 엘이디 모듈(10)에서 발광되는 빛은 리플렉터(61)를 통해 반사되어 확산되고, 렌즈부재(63)를 통과하면서 밝기가 증가된다.The light emitted from the LED module 10 is reflected and diffused through the reflector 61, and the brightness is increased while passing through the lens member 63.
한편, 베이스부재(30)는 엘이디 모듈(10)의 열이 방열부(40)로 효과적으로 전달되어 방열되도록 알루미늄에 의해 형성된다.On the other hand, the base member 30 is formed of aluminum so that the heat of the LED module 10 is effectively transmitted to the heat radiating portion 40 to radiate.
베이스부재(30)를 방열부(40)에 고정하기 위한 탈착부(50)는 방열부(40)에 회전가능하게 구비되며 회전을 통해 베이스부재(30)에 접촉 또는 이격되는 탄성부재(51)와, 탄성부재(51)가 걸리도록 방열부(40)에 회전가능하게 구비되며 회전을 통해 탄성부재(51)를 베이스부재(30)로 밀착하는 밀착부재(53)로 이루어진다.The detachable part 50 for fixing the base member 30 to the heat dissipation part 40 is rotatably provided at the heat dissipation part 40, and is elastic member 51 contacted or spaced apart from the base member 30 through rotation. And, the elastic member 51 is rotatably provided in the heat dissipating portion 40 is made of a close contact member 53 is in close contact with the elastic member 51 to the base member 30 through rotation.
탄성부재(51)는 일단부가 방열부(40)에 힌지 결합되는 고리 형태를 가지며, 타단부가 회전을 통해 밀착부재(53)에 걸리거나 이탈된다. 그리고 탄성부재(51)는 중앙부가 곡률을 가지도록 형성되어 베이스부재(30)의 상면에 접촉된다.The elastic member 51 has an annular shape in which one end is hinged to the heat dissipation part 40, and the other end is caught or detached from the contact member 53 through rotation. In addition, the elastic member 51 is formed to have a curvature in the center thereof and is in contact with the upper surface of the base member 30.
밀착부재(53)는 힌지 결합을 통해 방열부(40)에 회전가능하게 설치되며, 탄성부재(51)가 걸리면 방열부(40)측으로 회전되면서 탄성부재(51)를 베이스부재(30)측으로 밀착시키게 된다.The close contact member 53 is rotatably installed on the heat dissipation unit 40 through a hinge coupling, and when the elastic member 51 is caught, the close contact member 53 is rotated toward the heat dissipation unit 40 and closely adheres the elastic member 51 to the base member 30 side. Let's go.
상기와 같이 구성되는 본 발명의 실시 예에 따른 엘이디를 이용한 조명장치의 작용을 설명한다.The operation of the lighting apparatus using the LED according to an embodiment of the present invention configured as described above will be described.
먼저, 안착부재(25)에 복수의 엘이디 모듈(10)을 삽입하여 안착시킨 후, 엘이디 모듈(10)과 보드부재(23) 사이로 고정부재(70)를 통과시켜 베이스부재(30)에 결합하게 되면 엘이디 모듈(10)과 보드부재(23)가 베이스부재(30)에 함께 고정된다.First, a plurality of LED modules 10 are inserted and seated in the seating member 25, and then the fixing member 70 passes between the LED module 10 and the board member 23 to be coupled to the base member 30. When the LED module 10 and the board member 23 is fixed to the base member 30 together.
즉, 고정부재(70)를 이용하여 엘이디 모듈(10)과 보드부재(23)를 베이스부재(30)에 용이하게 고정할 수 있다.That is, the LED module 10 and the board member 23 can be easily fixed to the base member 30 by using the fixing member 70.
또한, 보드부재(23)의 상면에 패턴 형태로 형성된 연결부재(27)에 엘이디 모듈(10)과 전원공급선(21)을 납땜 하게 되면, 엘이디 모듈(10)과 전원공급선(21)이 연결되므로, 엘이디 모듈(10)과 전원공급선(21)을 연결하기 위한 전선의 사용이 방지되어 제작이 용이하고 내구성이 향상된다.In addition, when the LED module 10 and the power supply line 21 are soldered to the connection member 27 formed in a pattern on the upper surface of the board member 23, the LED module 10 and the power supply line 21 are connected. Since the use of the wire for connecting the LED module 10 and the power supply line 21 is prevented, manufacturing is easy and durability is improved.
더하여, 엘이디 모듈(10)에서 발광되는 빛이 리플렉터(61) 및 렌즈부재(63)에 의해 확산 및 증가되면서 외부로 전달되므로, 조명장치의 조도를 보다 향상할 수 있게 된다.In addition, since the light emitted from the LED module 10 is transmitted to the outside while being diffused and increased by the reflector 61 and the lens member 63, the illuminance of the lighting apparatus can be further improved.
이상에서 설명한 것은 본 발명을 실시하기 위한 하나의 실시 예에 불과한 것으로서, 본 발명은 상기한 실시 예에 한정되지 않고, 이하의 특허청구범위에서 청구하는 바와 같이 본 발명의 요지를 벗어남이 없이 당해 발명이 속하는 분야에서 통상의 지식을 가진 자라면 누구든지 다양한 변경 실시가 가능한 범위까지 본 발명의 기술적 정신이 있다고 할 것이다.What has been described above is only one embodiment for carrying out the present invention, and the present invention is not limited to the above-described embodiment, and the present invention is made without departing from the gist of the present invention as claimed in the following claims. Anyone with ordinary knowledge in this field will have the technical spirit of the present invention to the extent that various modifications can be made.

Claims (10)

  1. 복수의 엘이디 모듈;A plurality of LED modules;
    상기 엘이디 모듈이 장착되며, 상기 엘이디 모듈에 전원을 공급하는 전원 공급부;A power supply unit mounted with the LED module and supplying power to the LED module;
    상기 엘이디 모듈 및 상기 전원 공급부가 고정되는 베이스부재; 및A base member to which the LED module and the power supply unit are fixed; And
    상기 엘이디 모듈의 열이 방열되도록 상기 베이스부재가 탈착되는 방열부;A heat dissipation unit to which the base member is detached to dissipate heat of the LED module;
    를 포함하는 것을 특징으로 하는 엘이디를 이용한 조명장치.Lighting device using an LED comprising a.
  2. 제 1 항에 있어서,The method of claim 1,
    상기 베이스부재를 상기 방열부에 탈착할 수 있도록 상기 방열부에 구비되는 탈착부를 더 포함하는 것을 특징으로 하는 엘이디를 이용한 조명장치.Lighting device using an LED, characterized in that it further comprises a detachable portion provided in the heat radiating portion so that the base member is detachable to the heat radiating portion.
  3. 제 1 항에 있어서,The method of claim 1,
    상기 엘이디 모듈에서 발광되는 빛이 확산되도록 상기 베이스부재에 결합되는 광 확산부를 더 포함하는 것을 특징으로 하는 엘이디를 이용한 조명장치.Lighting device using an LED further comprises a light diffusion unit coupled to the base member so that the light emitted from the LED module is diffused.
  4. 제 1 항에 있어서, 상기 전원 공급부는,The method of claim 1, wherein the power supply unit,
    납땜을 통해 상기 전원공급선이 접속되며, 상기 베이스부재에 결합되는 보드부재;A board member to which the power supply line is connected through soldering and coupled to the base member;
    상기 보드부재에 상기 엘이디 모듈이 장착되도록 상기 보드부재에 형성되는 안착부재; 및A seating member formed on the board member such that the LED module is mounted on the board member; And
    상기 보드부재의 상면에 형성되며, 상기 엘이디 모듈과 상기 전원공급선을 연결하는 연결부재; 를 포함하는 것을 특징으로 하는 엘이디를 이용한 조명장치.A connection member formed on an upper surface of the board member and connecting the LED module to the power supply line; Lighting device using an LED comprising a.
  5. 제 4 항에 있어서,The method of claim 4, wherein
    상기 안착부재는 상기 엘이디 모듈이 삽입되어 안착되도록 상기 보드부재에 형성되는 구멍인 것을 특징으로 하는 엘이디를 이용한 조명장치.The seating member is a lighting device using an LED, characterized in that the hole formed in the board member so that the LED module is inserted and seated.
  6. 제 4 항에 있어서,The method of claim 4, wherein
    상기 안착부재와 상기 엘이디 모듈 사이를 관통하여 상기 베이스부재에 체결되며, 상기 엘이디 모듈과 상기 전원 공급부를 상기 베이스부재에 고정하는 고정부재를 더 포함하는 것을 특징으로 하는 엘이디를 이용한 조명장치.And a fixing member which penetrates between the seating member and the LED module and is fastened to the base member and fixes the LED module and the power supply unit to the base member.
  7. 제 2 항에 있어서, 상기 탈착부는,The method of claim 2, wherein the removable portion,
    상기 방열부에 회전가능하게 구비되며, 회전을 통해 상기 베이스부재에 접촉 또는 이격되는 탄성부재; 및An elastic member rotatably provided in the heat dissipating unit, the elastic member being in contact with or spaced apart from the base member through rotation; And
    상기 탄성부재가 걸리도록 상기 방열부에 회전가능하게 구비되며, 회전을 통해 상기 탄성부재를 상기 베이스부재로 밀착하는 밀착부재; 를 포함하는 것을 특징으로 하는 엘이디를 이용한 조명장치.A close contact member rotatably provided to the heat dissipating unit to catch the elastic member, and the close contact member to closely contact the elastic member to the base member through rotation; Lighting device using an LED comprising a.
  8. 제 3 항에 있어서, 상기 광 확산부는,The method of claim 3, wherein the light diffusion unit,
    상기 베이스부재에 결합되며, 상기 엘이디 모듈이 노출되도록 관통구멍이 형성되는 리플렉터; 및A reflector coupled to the base member and having a through hole formed to expose the LED module; And
    상기 리플렉터를 커버하도록 상기 베이스부재에 결합되며, 상기 리플렉터에서 반사되는 빛을 확산 시키는 확산렌즈부재; 를 포함하는 것을 특징으로 하는 엘이디를 이용한 조명장치.A diffusion lens member coupled to the base member to cover the reflector, and configured to diffuse light reflected from the reflector; Lighting device using an LED comprising a.
  9. 제 8 항에 있어서, 상기 광 확산부는,The method of claim 8, wherein the light diffusion unit,
    상기 확산렌즈부재와 상기 베이스부재 사이에 마련되는 실링부재를 더 포함하는 것을 특징으로 하는 엘이디를 이용한 조명장치.LED lighting device further comprises a sealing member provided between the diffusion lens member and the base member.
  10. 조명을 위해 인쇄회로기판에 엘이디 소자인 발광다이오드가 직접 성형되는 씨오비(COB: Chip On Board) 타입으로 형성되는 복수의 엘이디 모듈;A plurality of LED modules formed of a chip on board (COB) type in which a light emitting diode, which is an LED element, is directly formed on a printed circuit board for illumination;
    상기 엘이디 모듈이 장착되어 상기 엘이디 모듈에 전원을 공급하는 전원 공급부;A power supply unit mounted with the LED module to supply power to the LED module;
    상기 엘이디 모듈의 열이 전달되어 방열되도록 알루미늄 재질로 형성되고, 상기 엘이디 모듈과 상기 전원공급부가 고정되는 베이스부재;A base member formed of an aluminum material so that heat of the LED module is transferred and radiated, and having the LED module and the power supply fixed thereto;
    상기 엘이디 모듈과 상기 전원 공급부를 상기 베이스부재에 고정시키는 고정부재;Fixing member for fixing the LED module and the power supply to the base member;
    상기 엘이디 모듈의 열이 방열되도록 상기 베이스부재가 탈착되는 방열부;A heat dissipation unit to which the base member is detached to dissipate heat of the LED module;
    상기 베이스부재를 상기 방열부에 탈착할 수 있도록 상기 방열부에 구비되는 탈착부; 및A detachable part provided in the heat radiating part to detach the base member from the heat radiating part; And
    상기 베이스부재에 결합되고, 상기 엘이디 모듈에서 발광되는 빛의 밝기를 증가시키고, 상기 발광되는 빛을 확산시키는 광 확산부; 를 포함하고,A light diffusion unit coupled to the base member to increase brightness of light emitted from the LED module and to diffuse the emitted light; Including,
    상기 전원 공급부는,The power supply unit,
    인가된 전원을 공급하는 전원공급선;A power supply line for supplying an applied power;
    상면에 상기 전원공급선의 단부가 노출되고, 절연성을 가지는 플라스틱 재질로 형성되는 보드부재;An end portion of the power supply line exposed on an upper surface of the board member and formed of an insulating plastic material;
    상기 보드부재에 상기 엘이디 모듈이 삽입되어 장착되도록 상기 엘이디 모듈과 대응되는 형상을 가지고 상기 엘이디 모듈의 인쇄회로기판과 동일한 두께로 상기 보드부재에 관통 형성되는 안착부재; 및A seating member having a shape corresponding to that of the LED module so that the LED module is inserted into and mounted on the board member and penetratingly formed through the board member with the same thickness as the printed circuit board of the LED module; And
    납땜을 통해 상기 전원공급선과 상기 엘이디 모듈이 접속되도록 상기 보드부재의 상면에 도전체에 의해 패턴 형태로 형성되는 연결부재; 를 포함하고,A connection member formed in a pattern form by a conductor on an upper surface of the board member such that the power supply line and the LED module are connected by soldering; Including,
    상기 고정부재는,The fixing member,
    헤드가 상기 보드부재와 상기 엘이디 모듈의 상면에 접촉되어 지지되도록 상기 전원 공급부와 상기 엘이디 모듈 사이에 관통되는 결합구멍을 통과하여 상기 베이스부재에 체결되며,The head is fastened to the base member through a coupling hole penetrated between the power supply and the LED module so that the head is in contact with the upper surface of the board member and the LED module.
    상기 탈착부는,The detachable part,
    상기 방열부에 회전 가능하게 구비되어 회전을 통해 상기 베이스부재에 접촉 또는 이격되도록 일단부는 상기 방열부에 힌지 결합되는 고리 형태를 가지고, 중앙부는 곡률을 가지도록 형성되는 탄성부재; 및An elastic member rotatably provided at the heat dissipating unit so that one end thereof has a ring shape hinged to the heat dissipating unit so as to be contacted or spaced apart from the base member through rotation; And
    힌지 결합을 통해 상기 방열부에 회전 가능하게 설치되고, 회전을 통해 상기 탄성부재의 타단부가 걸림 고정되어 상기 탄성부재를 상기 베이스부재로 밀착하는 밀착부재; 를 포함하고,A close contact member rotatably installed on the heat dissipating unit through a hinge coupling, and the other end of the elastic member is fixed by rotation to closely adhere the elastic member to the base member; Including,
    상기 광학산부는,The optical diffuser,
    상기 엘이디 모듈이 노출되도록 관통구멍이 형성되고, 상기 베이스부재에 장착되며, 내부에 상기 엘이디 모듈에서 발광되는 빛을 반사시키기 위한 빛 반사면이 형성되는 리플렉터;A reflector having a through hole formed to expose the LED module, mounted to the base member, and having a light reflecting surface formed therein for reflecting light emitted from the LED module;
    상기 엘이디 모듈로 이물질이 침투되는 것을 방지하도록 상기 리플렉터를 커버하여 상기 베이스부재에 결합되고, 상기 엘이디 모듈과 대응되는 부위에 상기 엘이디 모듈의 빛을 증가시키기 위한 렌즈가 형성되며, 상기 리플렉터에서 반사되는 빛을 확산시키는 렌즈부재; 및The reflector is coupled to the base member to prevent foreign matter from penetrating into the LED module, and a lens for increasing light of the LED module is formed at a portion corresponding to the LED module, and is reflected from the reflector. A lens member for diffusing light; And
    상기 렌즈부재와 상기 베이스부재 사이에 마련되고, 상기 렌즈부재를 고정하기 위한 볼트를 통해 상기 렌즈부재와 함께 상기 베이스부재에 결합되는 실링부재;A sealing member provided between the lens member and the base member and coupled to the base member together with the lens member through a bolt for fixing the lens member;
    를 포함하는 것을 특징으로 하는 엘이디를 이용한 조명장치.Lighting device using an LED comprising a.
PCT/KR2012/005342 2011-07-07 2012-07-05 Illuminating apparatus using leds WO2013005999A1 (en)

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