WO2016080868A1 - Dispositif de refroidissement - Google Patents

Dispositif de refroidissement Download PDF

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Publication number
WO2016080868A1
WO2016080868A1 PCT/RU2015/000803 RU2015000803W WO2016080868A1 WO 2016080868 A1 WO2016080868 A1 WO 2016080868A1 RU 2015000803 W RU2015000803 W RU 2015000803W WO 2016080868 A1 WO2016080868 A1 WO 2016080868A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat exchanger
cooling
thermoelectric
thermoelectric modules
heat
Prior art date
Application number
PCT/RU2015/000803
Other languages
English (en)
Russian (ru)
Inventor
Геннадий Леонидович ОГНЕВ
Андрей Владимирович РЕЗВОВ
Original Assignee
Геннадий Леонидович ОГНЕВ
Андрей Владимирович РЕЗВОВ
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Геннадий Леонидович ОГНЕВ, Андрей Владимирович РЕЗВОВ filed Critical Геннадий Леонидович ОГНЕВ
Publication of WO2016080868A1 publication Critical patent/WO2016080868A1/fr

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction

Definitions

  • the invention relates to the field of refrigeration or freezing equipment.
  • Known refrigeration thermoelectric unit AH - ZhV - 250 - 12 (see crystalltherm.com> images Katalogi / KaTanor-2012.pdf) manufactured by NPO Kristall LLC, containing two or more thermoelectric modules installed on one side of a liquid heat exchanger, and the other the side of the thermoelectric modules is in contact with the air radiator.
  • thermoelectric assembly 400-24-LL (see kryothermtec.com) manufactured by Kriotherm, in which thermoelectric modules contact on their sides with liquid heat exchangers.
  • the disadvantages of these devices are the great complexity of manufacturing a heat exchanger, completely adjacent to the surface of all thermoelectric modules, the second surface mounted on another heat exchanger, due to the technological spread of the height of the thermoelectric modules and the parallelism of their sides.
  • the resulting gaps must be eliminated by means of heat-conducting pastes or glues, increasing thermal resistance, which, ceteris paribus, leads to a decrease in the temperature difference between the cold and hot sides and a decrease in the refrigeration coefficient as a whole.
  • thermoelectric modules one surface of which is in contact with the cooling object, and the other surface of thermoelectric modules with a heat exchanger, as well as a pump for circulating the heat carrier through heat exchangers.
  • the requirements for ensuring the manufacture of the base of the condenser or the body of the liquid heat exchanger are guaranteed thermal contact of the surface of all thermoelectric modules with either the capacitor base when pre-installing thermoelectric modules on a liquid heat exchanger, or with the liquid heat exchanger housing when pre-installing thermoelectric modules on a condenser base.
  • thermoelectric modules between two heat-exchange surfaces to ensure thermal contact requires the use of a large number of elements that tighten these surfaces together, which leads to heat flow between the surfaces and a decrease in the temperature difference between the hot and cold sides of thermoelectric modules.
  • the technical result of the present invention is to improve the thermal contact of the surfaces of thermoelectric modules with heat exchangers while simplifying the manufacturing process of heat exchangers and attaching thermoelectric modules between them.
  • the specified technical result is achieved due to the fact that in the cooling device containing thermoelectric modules, one surface of which is in contact with the cooling object, and the other surface of thermoelectric modules is in contact with the heat exchanger, as well as a heat transfer pump, in contrast to the known, each of them has 2 thermoelectric modules is equipped with its own heat exchanger connected to a common cooling line through a coolant circulation pump.
  • each thermoelectric module be equipped with a unit pressed against the cooling object, made in the form of a flat spring, one end of which is fixed to the cooling object, and the second end is drawn to the cooling side of the thermoelectric module.
  • each heat exchanger in contact with the hot side of the thermoelectric module be equipped with a compression unit to the thermoelectric module, made in the form of a flat spring, one end of which is fixed to the heat exchanger, and the second end is pressed to the hot side of the thermoelectric module.
  • ⁇ is the temperature difference of the coolant at the inlet of the first and outlet of the last heat exchangers
  • ⁇ is the temperature of the coolant at the inlet of the first heat exchanger
  • T p the temperature of the coolant at the outlet of the last heat exchanger
  • thermoelectric modules AQ - tolerance for cooling capacity of thermoelectric modules.
  • thermoelectric modules used is more than one, since with one module there are no problems with providing thermal contact of the common heat exchanger and modules differing in height and with non-parallel sides.
  • thermoelectric module Improving the thermal contact of the surfaces of thermoelectric modules with heat exchangers is solved by the fact that the individual heat exchanger of each thermoelectric module eliminates the influence of their technological spread in height and non-parallel sides, while ensuring the required cleanliness of the surface treatment in contact with the thermoelectric module.
  • the gap between the surface of the heat exchanger and the thermoelectric module of lower height can reach 0.06 mm in the middle of the thermoelectric module 40x40 mm in size.
  • KPT-8 with a coefficient of thermal conductivity of 0.8 W / m * and the heat flux through the 50 W thermoelectric module at this gap will lose 2.3 ° C.
  • thermoelectric modules are used in many ways. All other things being equal, the use of flat springs is aimed at increasing the temperature difference between the surfaces of thermoelectric modules, which completely eliminate the flow of heat along elements that tighten the surfaces between which thermoelectric modules are located.
  • FIG. 1 shows the structure of a device with heat exchangers for each thermoelectric module
  • FIG. 2 shows the assembly I in FIG. one.
  • thermoelectric modules 1 of different heights and relative positions of surfaces, one surface of which is in contact with the cooling object 2, and the other surface of thermoelectric modules with heat exchangers 3 connected in series, as well as pump (s) 4 of the heat carrier circulation through heat exchangers connected to a common cooling line 5.
  • a device can have several groups of heat exchangers and a pump connected in series with each other.
  • each thermoelectric module 1 is attached to the cooling object 2 using flat springs 6, one end of which is fixed with fastening elements 7 to the cooling object, and the second end presses the cooling side of the thermoelectric module to the cooling object.
  • each heat exchanger 3, which removes heat from the hot side is attached to the thermoelectric module 1 using flat springs 6, one end of which is fixed using fastening elements 7 on the heat exchanger, and the second end presses the hot side of the thermoelectric module to the heat exchanger.
  • Flat springs 6 using fastening elements 7 provide thermal contact of the surfaces of thermoelectric modules 1 with the object cooling 2 and heat exchangers 3, regardless of the height of the thermoelectric modules and the non-parallelism of their sides.
  • the proposed device operates as follows.
  • a heat exchanger 3 is attached to the hot surface of each thermoelectric module 1 using flat springs 6 and fastening elements 7.
  • Thermoelectric modules 1 with heat exchangers 3 attached to them are attached to the cooling object 2 using flat springs 6 and fastening elements 7.
  • Hydraulic lines are connected in series with each other heat exchangers 3 and connect them through the pump 4 to the cooling line 5.
  • ⁇ is the temperature difference of the coolant at the inlet of the first and outlet of the last heat exchangers
  • T] is the temperature of the coolant at the inlet of the first heat exchanger
  • T p the temperature of the coolant at the outlet of the last heat exchanger
  • thermoelectric modules AQ - tolerance for cooling capacity of thermoelectric modules.
  • the value of the difference ⁇ between the temperature of the coolant at the inlet of the first T ⁇ and the output of the last T p of heat exchangers connected in a series circuit, related to the temperature of the coolant at the inlet of the first heat exchanger Ti from the common cooling line does not exceed the tolerance for cooling capacity AQ, which is indicated in the technical documentation for the modules, we can neglect the influence of the temperature difference of the surfaces of thermoelectric modules on their cooling capacity.
  • thermoelectric module The thermal contact of the surface of each thermoelectric module with the cooling object is ensured by the fact that each thermoelectric module is attached to the cooling object using flat springs, one end of which is fixed to the cooling object, and the second end presses the cooling side of the thermoelectric module to the cooling object.
  • the thermal contact of the other surface of the thermoelectric module with the heat exchanger is ensured by the fact that each heat exchanger that removes heat from the hot side is attached to the thermoelectric module using flat springs, one end of which is fixed to the heat exchanger, and the other end presses the hot side of the thermoelectric module to the heat exchanger.
  • thermoelectric module 1 reduces the requirements for tolerances on the geometric dimensions of thermoelectric modules in the process of their production, and in combination with pressing thermoelectric modules 1 with flat springs 6 with fastening elements 7 provides thermal contact of any number of thermoelectric modules with cooling object 2 and heat exchangers 3.
  • the proposed cooling device guarantees thermal contact of the surfaces of thermoelectric modules with the cooling object and heat exchangers, reduces the cost of manufacturing high-quality heat exchangers, simplifies the assembly of the cooling device, guarantees uniform heat removal from the hot sides of thermoelectric modules, thereby increasing cooling capacity or reducing the number of required thermoelectric modules.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Devices That Are Associated With Refrigeration Equipment (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

L'invention concerne le domaine des équipements frigorifiques ou de congélation. Le dispositif de refroidissement comprend des modules thermoélectriques dont une surface est en contact avec l'objet à refroidir et l'autre est en contact avec l'échangeur de chaleur, ainsi qu'une pompe de circulation d'agent caloporteur. Chacun des n≥2 modules thermoélectrique est doté de son propre échangeur de chaleur relié à une conduite principale commune de refroidissement via une ou plusieurs pompes de circulation d'agent caloporteur. Le résultat technique consiste à améliorer le contact thermique des surfaces des modules thermoéléctriques avec les échangeurs de chaleur.
PCT/RU2015/000803 2014-11-21 2015-11-19 Dispositif de refroidissement WO2016080868A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
RU2014146695/06A RU2566950C1 (ru) 2014-11-21 2014-11-21 Устройство охлаждения
RU2014146695 2014-11-21

Publications (1)

Publication Number Publication Date
WO2016080868A1 true WO2016080868A1 (fr) 2016-05-26

Family

ID=54362444

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/RU2015/000803 WO2016080868A1 (fr) 2014-11-21 2015-11-19 Dispositif de refroidissement

Country Status (2)

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RU (1) RU2566950C1 (fr)
WO (1) WO2016080868A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
UA122316C2 (uk) * 2019-10-01 2020-10-12 Віктор Іванович Панфілов Спосіб автономного підтримання контрольованої температури та пристрій для його здійснення

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4587810A (en) * 1984-07-26 1986-05-13 Clawson Machine Company, Inc. Thermoelectric ice maker with plastic bag mold
RU2094712C1 (ru) * 1994-11-29 1997-10-27 Товарищество с ограниченной ответственностью СомрLех ТнеRмоеLестRIс SYSтемS LIмIтеD Термоэлектрическое устройство для создания микроклимата в салоне автомобиля
RU2310143C1 (ru) * 2006-02-15 2007-11-10 ООО "Стромакс 2000" Быстрозамораживатель и способ его эксплуатации
RU2435115C1 (ru) * 2010-08-06 2011-11-27 Геннадий Леонидович Огнев Устройство охлаждения

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2118759C1 (ru) * 1996-07-05 1998-09-10 Ракетно-космическая корпорация "Энергия" им.С.П.Королева Устройство для регулирования влажности воздуха

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4587810A (en) * 1984-07-26 1986-05-13 Clawson Machine Company, Inc. Thermoelectric ice maker with plastic bag mold
RU2094712C1 (ru) * 1994-11-29 1997-10-27 Товарищество с ограниченной ответственностью СомрLех ТнеRмоеLестRIс SYSтемS LIмIтеD Термоэлектрическое устройство для создания микроклимата в салоне автомобиля
RU2310143C1 (ru) * 2006-02-15 2007-11-10 ООО "Стромакс 2000" Быстрозамораживатель и способ его эксплуатации
RU2435115C1 (ru) * 2010-08-06 2011-11-27 Геннадий Леонидович Огнев Устройство охлаждения

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