WO2016078017A1

WO2016078017A1 - Led module and led device

Info

Publication number: WO2016078017A1
Application number: PCT/CN2014/091556
Authority: WO
Inventors: 魏晓敏
Original assignee: 魏晓敏
Priority date: 2014-11-19
Filing date: 2014-11-19
Publication date: 2016-05-26
Also published as: CN204717393U

Abstract

An LED module and an LED device. The LED module comprises: a substrate (1) and an LED chip (2) disposed on one side of the substrate (1). An electronic circuit connected to the LED chip (2) is arranged on the substrate (1), and the area of the substrate (1) on which the electronic circuit is not arranged is provided with through holes (11) that connect one side of the LED chip (2) to the other side of the LED chip (2). In this way, the through holes (11) can connect the spaces on two sides of the substrate (1). When the LED chip (2) generates heat to cause a sharp temperature rise in the space on the side of the LED chip (2), while the temperature change in the space on the opposite side is small, the two spaces form a temperature difference, so that air can flow through the through holes (11) in the substrate (1) to rapidly dissipate heat in the space on the side of the LED chip (2) to the space on the opposite side, heat dissipation of the LED module and device is improved, and luminous efficiency and luminous intensity are ensured.

Description

LED module and LED device

Technical field

The present application relates to the field of light emitting diodes, and in particular, to an LED module and an LED device.

Background technique

At present, due to the high security, smooth operation, low energy consumption, high luminous efficiency, long life and other advantages of light-emitting diodes (LEDs), they are more and more widely used in the field of illumination. Existing ceramic SMD brackets and their existing In the packaged LED products, since the LED light-emitting chip is small, its own heat-dissipating area is also small, and the generated heat cannot be conducted in time and effectively by itself, and the heat is quickly discharged by the bracket disposed around the LED light-emitting chip. However, the existing ceramic SMD bracket has a small area, and its heat conduction effect is limited, resulting in poor heat dissipation of the existing LED, which in turn leads to a decrease in LED luminous efficiency and luminous intensity.

Summary of the invention

The present application aims to solve at least one of the above technical problems to some extent.

According to a first aspect of the present application, the present application provides an LED module including: a substrate and an LED chip disposed on one side of the substrate, wherein the substrate is provided with an electronic circuit connecting the LED chip, the substrate The area where the electronic circuit is not disposed is provided with a through hole that communicates one side and the other side of the LED chip.

Further, the through hole has a pore size ranging from 0.5 to 5 mm.

Further, the through hole has a pore size of 1, 2, 2.5 or 3 mm.

Further, a heat sink is disposed on the other side of the substrate.

Further, the through hole is a metalized hole.

Further, the substrate is a copper clad laminate or a ceramic substrate.

According to a second aspect of the present application, the present application provides an LED device, including: a bracket, a plurality of LED modules supported by the bracket, and a power supply module for supplying power to the LED module, the LED module And comprising: a substrate and an LED chip disposed on one side of the substrate, wherein the substrate is provided with an electronic circuit connecting the LED chip, and an area of the substrate not provided with the electronic circuit is provided with a connecting LED chip Through holes on the side and the other side.

Further, the through hole has a pore size ranging from 0.5 to 5 mm.

Further, the through hole has a pore size of 1, 2, 2.5 or 3 mm.

Further, a heat sink is disposed on the other side of the substrate.

Further, the through hole is a metalized hole.

Further, the substrate is a copper clad laminate or a ceramic substrate.

Further, the LED device is an LED bulb, an LED display or an LED signal light.

The beneficial effects of the application are:

By providing an LED module and an LED device, the LED module includes: a substrate and an LED chip disposed on one side of the substrate, wherein the substrate is provided with an electronic circuit connecting the LED chip, the substrate A region where the electronic circuit is not disposed is provided with a through hole that communicates one side and the other side of the LED chip. In this way, the through hole can communicate with the space on both sides of the substrate. When the LED chip heats up, the temperature in the space on one side of the LED chip rises sharply, and the temperature change on the opposite side is small, and the two spaces form a temperature difference, so that the air will The heat flows through the through holes on the substrate, so that the heat in the space on one side of the LED chip is quickly dissipated into the space on the opposite side, which enhances the heat dissipation of the LED module and the device, thereby ensuring the light efficiency and light intensity.

DRAWINGS

FIG. 1 is a schematic structural view of an LED module according to an embodiment of the present application.

detailed description

The embodiments of the present application are described in detail below, and the examples of the embodiments are illustrated in the drawings, wherein the same or similar reference numerals are used to refer to the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are intended to be illustrative, and are not to be construed as limiting.

In the description of the present application, it is to be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Orientation or position of indications such as "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", etc. The relationship is based on the orientation or positional relationship shown in the drawings, and is merely for the convenience of the description and the simplified description, and is not intended to indicate or imply that the device or component referred to has a specific orientation, and is constructed and operated in a specific orientation. It is not to be construed as limiting the application.

Moreover, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, features defining "first" and "second" may include one or more of the features either explicitly or implicitly. In the description of the present application, the meaning of "a plurality" is two or more unless specifically and specifically defined otherwise.

In the present application, the terms "installation", "connected", "connected", "fixed" and the like shall be understood broadly, and may be either a fixed connection or a detachable connection, unless otherwise explicitly stated and defined. , or connected integrally; may be mechanical connection or electrical connection; may be directly connected, or may be indirectly connected through an intermediate medium, and may be internal communication between the two elements. For those skilled in the art, the specific meanings of the above terms in the present application can be understood on a case-by-case basis.

In the present application, the first feature is "on" or "on" the second feature, unless otherwise explicitly stated and defined. "Bottom" may include direct contact of the first and second features, and may also include that the first and second features are not in direct contact but are contacted by additional features between them. Moreover, the first feature "above", "above" and "above" the second feature includes the first feature directly above and above the second feature, or merely indicating that the first feature level is higher than the second feature. The first feature "below", "below" and "below" the second feature includes the first feature directly above and above the second feature, or merely the first feature level being less than the second feature.

The present application will be further described in detail below with reference to the accompanying drawings.

Referring to FIG. 1 , the embodiment provides an LED device, which can be mainly an LED bulb, an LED display, or an LED signal light, thereby providing functions such as illumination, display, and signal indication.

The above LED device mainly comprises: a bracket, a plurality of LED modules supported by the bracket, and a power supply module for supplying power to the LED module.

The LED module in this embodiment mainly includes a substrate 1 and an LED chip 2 disposed on one side of the substrate 1. The substrate 1 is provided with an electronic circuit connecting the LED chip 2, and an area of the substrate 1 where the electronic circuit is not disposed is provided with communication. The through hole 11 on one side and the other side of the LED chip 2. The number of through holes can be selected according to the actual situation such as the intensity of the electronic circuit and the size of the coverage area. In theory, the through holes can be filled with the area on the substrate where the electronic circuit is not provided, or can be arranged in some parts of the area. The higher the hole coverage, the better the heat dissipation.

In this way, the through hole can communicate with the space on both sides of the substrate. When the LED chip heats up, the temperature in the space on one side of the LED chip rises sharply, and the temperature change on the opposite side is small, and the two spaces form a temperature difference, so that the air will The heat flows through the through holes on the substrate, so that the heat in the space on one side of the LED chip is quickly dissipated into the space on the opposite side, which enhances the heat dissipation of the LED module and the device, thereby ensuring the light efficiency and light intensity.

The aperture size of the through hole 11 ranges from 0.5 to 5 mm based on the general substrate size. In specific applications, the aperture size of the through hole 11 can take values: 1, 2, 2.5 or 3 mm.

In order to enhance heat dissipation, as another preferred embodiment, the other side of the substrate 1 is provided with a heat sink having a body and a plurality of fins in parallel. The through hole 11 can pass between the heat dissipation holes on the heat sink and the fins. The space is connected, so that the heat dissipation effect is more obvious. In addition, the through hole opening and the heat sink are spaced apart by a predetermined distance.

In order to enhance heat dissipation, as another preferred embodiment, the through hole 11 is a metallized hole, that is, a metal layer is formed on the inner wall of the through hole, and the heat conduction effect of the metal layer is more remarkable.

Generally, the substrate 1 may be a copper clad laminate or a ceramic substrate or the like.

In the description of the present specification, reference is made to the descriptions of the terms "one embodiment", "some embodiments", "one embodiment", "some embodiments", "example", "specific examples", or "some examples" The specific features, structures, materials, or characteristics described in connection with the embodiments or examples are included in at least one embodiment or example of the application. In this In the specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in a suitable manner in any one or more embodiments or examples.

The above content is a further detailed description of the present application in conjunction with the specific embodiments, and the specific implementation of the present application is not limited to the description. For the ordinary person skilled in the art to which the present invention pertains, a number of simple deductions or substitutions may be made without departing from the spirit of the present application.

Claims

An LED module includes: a substrate and an LED chip disposed on a side of the substrate, wherein the substrate is provided with an electronic circuit connecting the LED chip, wherein the electronic circuit is not disposed on the substrate The area is provided with a through hole that connects one side of the LED chip to the other side.
The LED module of claim 1 , wherein the through hole has a size ranging from 0.5 to 5 mm.
The LED module according to claim 2, wherein the through hole has a size of 1, 2, 2.5 or 3 mm.
The LED module according to claim 1, wherein the other side of the substrate is provided with a heat sink.
The LED module of claim 1 wherein said through hole is a metallized hole.
The LED module according to claim 1, wherein the substrate is a copper clad laminate or a ceramic substrate.
An LED device includes: a bracket, a plurality of LED modules supported by the bracket, and a power supply module for supplying power to the LED module, the LED module comprising: a substrate and a side disposed on the substrate The LED chip is provided with an electronic circuit connecting the LED chip, wherein the area of the substrate where the electronic circuit is not disposed is provided with a connection between one side of the LED chip and the other side. hole.
The LED device according to claim 7, wherein the size of the aperture of the through hole ranges from 0.5 to 5 mm.
The LED device according to claim 8, wherein said through hole has a pore size of 1, 2, 2.5 or 3 mm.
The LED device according to claim 7, wherein the other side of the substrate is provided with a heat sink.