WO2016075940A1 - Élément de conversion de longueur d'onde, unité de rétroéclairage comprenant celui-ci, dispositif d'affichage à cristaux liquides, et procédé de fabrication d'élément de conversion de longueur d'onde - Google Patents
Élément de conversion de longueur d'onde, unité de rétroéclairage comprenant celui-ci, dispositif d'affichage à cristaux liquides, et procédé de fabrication d'élément de conversion de longueur d'onde Download PDFInfo
- Publication number
- WO2016075940A1 WO2016075940A1 PCT/JP2015/005638 JP2015005638W WO2016075940A1 WO 2016075940 A1 WO2016075940 A1 WO 2016075940A1 JP 2015005638 W JP2015005638 W JP 2015005638W WO 2016075940 A1 WO2016075940 A1 WO 2016075940A1
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- WO
- WIPO (PCT)
- Prior art keywords
- wavelength conversion
- coating film
- base material
- conversion member
- active energy
- Prior art date
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- 238000006243 chemical reaction Methods 0.000 title claims abstract description 217
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 78
- 239000004973 liquid crystal related substance Substances 0.000 title claims abstract description 28
- 238000000576 coating method Methods 0.000 claims abstract description 181
- 239000011248 coating agent Substances 0.000 claims abstract description 172
- 239000002096 quantum dot Substances 0.000 claims abstract description 85
- 239000000758 substrate Substances 0.000 claims abstract description 83
- 238000000034 method Methods 0.000 claims abstract description 68
- 239000000203 mixture Substances 0.000 claims abstract description 49
- 238000007373 indentation Methods 0.000 claims abstract description 32
- 230000001678 irradiating effect Effects 0.000 claims abstract description 21
- 239000000463 material Substances 0.000 claims description 169
- 230000008569 process Effects 0.000 claims description 34
- 150000001875 compounds Chemical class 0.000 claims description 30
- 238000012545 processing Methods 0.000 claims description 21
- 230000005284 excitation Effects 0.000 claims description 17
- 210000002858 crystal cell Anatomy 0.000 claims description 9
- 239000000853 adhesive Substances 0.000 claims description 8
- 230000001070 adhesive effect Effects 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 7
- 238000011282 treatment Methods 0.000 claims description 6
- 230000000694 effects Effects 0.000 claims description 3
- 239000010408 film Substances 0.000 description 180
- 239000010410 layer Substances 0.000 description 168
- 238000001723 curing Methods 0.000 description 42
- 230000004888 barrier function Effects 0.000 description 31
- 239000012044 organic layer Substances 0.000 description 21
- 230000000052 comparative effect Effects 0.000 description 11
- 238000010586 diagram Methods 0.000 description 11
- 239000013008 thixotropic agent Substances 0.000 description 11
- 229910010272 inorganic material Inorganic materials 0.000 description 10
- 238000010030 laminating Methods 0.000 description 10
- 239000007788 liquid Substances 0.000 description 10
- 239000006087 Silane Coupling Agent Substances 0.000 description 9
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 9
- 239000010954 inorganic particle Substances 0.000 description 9
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 8
- 239000001301 oxygen Substances 0.000 description 8
- 229910052760 oxygen Inorganic materials 0.000 description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 7
- 239000000428 dust Substances 0.000 description 7
- 238000001914 filtration Methods 0.000 description 7
- 239000011147 inorganic material Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 239000012790 adhesive layer Substances 0.000 description 6
- 239000006185 dispersion Substances 0.000 description 6
- 125000000524 functional group Chemical group 0.000 description 6
- 239000003960 organic solvent Substances 0.000 description 6
- 239000002245 particle Substances 0.000 description 6
- 238000002834 transmittance Methods 0.000 description 6
- 229910052581 Si3N4 Inorganic materials 0.000 description 5
- -1 cyclic olefin Chemical class 0.000 description 5
- 238000001035 drying Methods 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 5
- 239000003505 polymerization initiator Substances 0.000 description 5
- 238000006116 polymerization reaction Methods 0.000 description 5
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- 230000032258 transport Effects 0.000 description 5
- 230000037303 wrinkles Effects 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 238000003475 lamination Methods 0.000 description 4
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 4
- 229910052753 mercury Inorganic materials 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- 239000002994 raw material Substances 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 229910052814 silicon oxide Inorganic materials 0.000 description 4
- 238000007740 vapor deposition Methods 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- UQEAIHBTYFGYIE-UHFFFAOYSA-N hexamethyldisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)C UQEAIHBTYFGYIE-UHFFFAOYSA-N 0.000 description 3
- 239000003999 initiator Substances 0.000 description 3
- 150000002484 inorganic compounds Chemical group 0.000 description 3
- 239000011146 organic particle Substances 0.000 description 3
- 150000003961 organosilicon compounds Chemical class 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 description 3
- 229910002012 Aerosil® Inorganic materials 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 2
- 244000043261 Hevea brasiliensis Species 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000000137 annealing Methods 0.000 description 2
- 238000000149 argon plasma sintering Methods 0.000 description 2
- 239000000440 bentonite Substances 0.000 description 2
- 229910000278 bentonite Inorganic materials 0.000 description 2
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 239000004927 clay Substances 0.000 description 2
- 239000011362 coarse particle Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 229910001882 dioxygen Inorganic materials 0.000 description 2
- 238000010894 electron beam technology Methods 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 238000007667 floating Methods 0.000 description 2
- 229910052809 inorganic oxide Inorganic materials 0.000 description 2
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 2
- 239000002346 layers by function Substances 0.000 description 2
- 230000031700 light absorption Effects 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 229920003052 natural elastomer Polymers 0.000 description 2
- 229920001194 natural rubber Polymers 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 230000035699 permeability Effects 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 239000002985 plastic film Substances 0.000 description 2
- 229920006255 plastic film Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- 229910021647 smectite Inorganic materials 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 2
- KWEKXPWNFQBJAY-UHFFFAOYSA-N (dimethyl-$l^{3}-silanyl)oxy-dimethylsilicon Chemical compound C[Si](C)O[Si](C)C KWEKXPWNFQBJAY-UHFFFAOYSA-N 0.000 description 1
- ODIGIKRIUKFKHP-UHFFFAOYSA-N (n-propan-2-yloxycarbonylanilino) acetate Chemical compound CC(C)OC(=O)N(OC(C)=O)C1=CC=CC=C1 ODIGIKRIUKFKHP-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910052684 Cerium Inorganic materials 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 1
- 238000003848 UV Light-Curing Methods 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- VNSBYDPZHCQWNB-UHFFFAOYSA-N calcium;aluminum;dioxido(oxo)silane;sodium;hydrate Chemical compound O.[Na].[Al].[Ca+2].[O-][Si]([O-])=O VNSBYDPZHCQWNB-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 210000004027 cell Anatomy 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- ZMIGMASIKSOYAM-UHFFFAOYSA-N cerium Chemical compound [Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce] ZMIGMASIKSOYAM-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 238000007766 curtain coating Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000006837 decompression Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- GUJOJGAPFQRJSV-UHFFFAOYSA-N dialuminum;dioxosilane;oxygen(2-);hydrate Chemical compound O.[O-2].[O-2].[O-2].[Al+3].[Al+3].O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O GUJOJGAPFQRJSV-UHFFFAOYSA-N 0.000 description 1
- UCXUKTLCVSGCNR-UHFFFAOYSA-N diethylsilane Chemical compound CC[SiH2]CC UCXUKTLCVSGCNR-UHFFFAOYSA-N 0.000 description 1
- UBHZUDXTHNMNLD-UHFFFAOYSA-N dimethylsilane Chemical compound C[SiH2]C UBHZUDXTHNMNLD-UHFFFAOYSA-N 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- GCSJLQSCSDMKTP-UHFFFAOYSA-N ethenyl(trimethyl)silane Chemical compound C[Si](C)(C)C=C GCSJLQSCSDMKTP-UHFFFAOYSA-N 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 238000007765 extrusion coating Methods 0.000 description 1
- 239000010433 feldspar Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- NEXSMEBSBIABKL-UHFFFAOYSA-N hexamethyldisilane Chemical compound C[Si](C)(C)[Si](C)(C)C NEXSMEBSBIABKL-UHFFFAOYSA-N 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- 229910052622 kaolinite Inorganic materials 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- UIUXUFNYAYAMOE-UHFFFAOYSA-N methylsilane Chemical compound [SiH3]C UIUXUFNYAYAMOE-UHFFFAOYSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 229910052901 montmorillonite Inorganic materials 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000002086 nanomaterial Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 229910000273 nontronite Inorganic materials 0.000 description 1
- HMMGMWAXVFQUOA-UHFFFAOYSA-N octamethylcyclotetrasiloxane Chemical compound C[Si]1(C)O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)O1 HMMGMWAXVFQUOA-UHFFFAOYSA-N 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- PARWUHTVGZSQPD-UHFFFAOYSA-N phenylsilane Chemical compound [SiH3]C1=CC=CC=C1 PARWUHTVGZSQPD-UHFFFAOYSA-N 0.000 description 1
- 238000007539 photo-oxidation reaction Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229910052903 pyrophyllite Inorganic materials 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229910000275 saponite Inorganic materials 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 150000003377 silicon compounds Chemical class 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 125000005504 styryl group Chemical group 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 238000009210 therapy by ultrasound Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 1
- JCVQKRGIASEUKR-UHFFFAOYSA-N triethoxy(phenyl)silane Chemical compound CCO[Si](OCC)(OCC)C1=CC=CC=C1 JCVQKRGIASEUKR-UHFFFAOYSA-N 0.000 description 1
- PQDJYEQOELDLCP-UHFFFAOYSA-N trimethylsilane Chemical compound C[SiH](C)C PQDJYEQOELDLCP-UHFFFAOYSA-N 0.000 description 1
- 150000003672 ureas Chemical class 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 229910052902 vermiculite Inorganic materials 0.000 description 1
- 239000010455 vermiculite Substances 0.000 description 1
- 235000019354 vermiculite Nutrition 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 239000004034 viscosity adjusting agent Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
Definitions
- the present invention relates to a wavelength conversion member having a wavelength conversion layer including quantum dots that emit fluorescence when irradiated with excitation light, a backlight unit including the wavelength conversion layer, a liquid crystal display device, and a method for manufacturing the wavelength conversion member.
- the liquid crystal display device is composed of at least a backlight and a liquid crystal cell, and usually further includes members such as a backlight side polarizing plate and a viewing side polarizing plate.
- the wavelength conversion member of the backlight unit has a structure including a wavelength conversion layer containing quantum dots (also referred to as Quantum Dot, QD, quantum dots) as a light emitting material. It is attracting attention (see Patent Document 1).
- the wavelength conversion member is a member that converts the wavelength of light incident from the light source unit and emits it as white light.
- the wavelength conversion layer containing the quantum dots as the light emitting material two or three types having different light emission characteristics are used.
- the white light can be realized using fluorescence emitted from the quantum dots excited by light incident from the light source unit.
- Fluorescence due to quantum dots has high brightness and a small half-value width, so that LCDs using quantum dots are excellent in color reproducibility.
- the color gamut has been expanded from 72% to NTSC (National Television System Committee) ratio of 72%.
- Patent Document 1 proposes a structure in which a wavelength conversion layer including quantum dots is sandwiched between base materials (barrier films) having high oxygen barrier properties in order to protect the quantum dots from oxygen and the like. Yes.
- the other base material is attached to the sheet prepared by applying and curing a coating solution of a polymerizable composition containing quantum dots on the base material via an adhesive or the like.
- the attaching (laminating) method is common.
- the wavelength conversion member when the wavelength conversion member is produced using the production method as described above, a problem that the wavelength conversion member may be curled has been clarified. If the wavelength conversion member has a curl, the distortion may cause separation between the base material and the wavelength conversion layer. Further, when the curled wavelength conversion member is incorporated in a backlight unit in a liquid crystal display device, display unevenness may occur due to optical contact with other members.
- This invention is made
- Another object of the present invention is to provide a backlight and a liquid crystal display device provided with a wavelength conversion member.
- the present inventors have found that the above problem is caused by a configuration peculiar to the wavelength conversion layer containing quantum dots.
- the polymerization that constitutes the wavelength conversion layer is aimed at increasing the efficiency by scattering the light and lengthening the optical path.
- inorganic particles or the like are added to increase the viscosity.
- the barrier film which provided the barrier layer to various plastic films may be used, or the laminated film provided with the layer which provided the scattering layer and the slipping agent may be used.
- the addition of these functional particles and the addition of a functional layer significantly reduce the hardening efficiency (polymerization reactivity) of the polymerizable composition by irradiation with active energy rays typified by ultraviolet rays.
- the curing process is configured to irradiate the active energy ray only from one surface side of the coating film, so that the uncured portion of the coating film remains on the other surface side.
- the problem by the uncured part remaining in the coating film is not only that the wavelength conversion member is curled, but also the phenomenon that the adhesion between the wavelength conversion layer and the substrate is reduced, or the presence of an uncured part.
- Film stability of the wavelength conversion layer such as various types of durability degradation, internal layer flow, and non-uniform film thickness. In severe cases, film cracks may occur. It becomes a factor to reduce.
- the wavelength conversion member of the present invention includes a first base material, a second base material, a first base material, and one surface between the first base material and the second base material.
- the wavelength conversion layer is a cured layer obtained by irradiating an active energy ray to a coating film made of a polymerizable composition containing quantum dots and a polymerizable compound,
- the first base material side indentation hardness N1 and the second base material side indentation hardness N2 of the wavelength conversion layer are in the relationship of the following formula.
- the indentation hardness on the first base material side and the indentation hardness on the second base material side of the wavelength conversion layer are measured by the measurement method described in the paragraph [Mode for Carrying Out the Invention] below. Shall.
- the 1st base material side is the predetermined position near the interface with a 1st base material from the center of thickness in the thickness direction of a wavelength conversion layer
- the 2nd base material side is the thickness of a wavelength conversion layer.
- the indentation hardness is the same as the distance from the interface with the first substrate and the distance from the interface with the second substrate. Measure at position.
- the polymerizable composition for constituting the wavelength conversion layer preferably contains at least one radically polymerizable compound.
- the quantum dots include quantum dots having an emission center wavelength in a wavelength band of 600 nm to 680 nm, quantum dots having an emission center wavelength in a wavelength band of 520 nm to 560 nm, and quantum dots having an emission center wavelength in a wavelength band of 430 nm to 480 nm. It is preferable that at least one selected from the group consisting of:
- the half width of the emission peak of the quantum dots is preferably 70 nm or less, more preferably 60 nm or less, and further preferably 50 nm or less.
- the “half-value width” of the emission peak means the width of the peak at a peak height of 1 ⁇ 2.
- light having the emission center wavelength in the wavelength band of 430 to 480 nm is called blue light
- light having the emission center wavelength in the wavelength band of 500 to 600 nm is called green light
- the emission center wavelength is in the wavelength band of 600 to 680 nm.
- the light having a color is called red light.
- the backlight unit of the present invention includes at least the wavelength conversion member of the present invention and a light source composed of a blue light emitting diode or an ultraviolet light emitting diode that emits excitation light.
- the liquid crystal display device of the present invention includes at least the backlight unit of the present invention and a liquid crystal cell.
- the method for producing a wavelength conversion member of the present invention is a method for producing a wavelength conversion member having a wavelength conversion layer including quantum dots that are excited by excitation light and emit fluorescence. Applying a polymerizable composition containing quantum dots on one side of the first substrate to form a coating film, Overlaying the second base material on the coating film to sandwich the coating film between the first base material and the second base material, A wavelength conversion member that forms a wavelength conversion layer by irradiating an active energy ray from one side of the coating to cure the coating, and irradiating an active energy ray from the other side of the coating to cure the coating. It is a manufacturing method.
- the wavelength conversion member of the present invention can be easily manufactured.
- the coating film in the step of curing the coating film, may be heated after being irradiated with active energy rays.
- the wavelength conversion member manufacturing apparatus of the present invention is a roll-to-roll wavelength conversion member manufacturing apparatus that implements the above-described method of manufacturing a wavelength conversion member of the present invention
- An application part for applying a polymerizable composition containing quantum dots on one side of the first substrate to form a coating film, and a second substrate superimposed on the coating film to overlap the first substrate and the second substrate Applying the active energy ray from one side of the coating film to cure the coating film, and applying the active energy ray from the other side of the coating film
- a curing treatment unit that cures to form a wavelength conversion layer, In the curing processing unit, a first active energy ray irradiating device that irradiates an active energy ray on one surface side of the coating film sandwiched between the first base material and the second base material conveyed as a workpiece.
- a second active energy ray irradiating device for irradiating active energy rays on the other surface side of the coating film It is a wavelength conversion member manufacturing apparatus which irradiates one surface and the other surface of a coating film with an active energy ray simultaneously or sequentially.
- At least one of the first active energy ray irradiation device and the second active energy ray irradiation device is provided with a back roll at a position facing through the coating film, Active energy by the first or second active energy ray irradiation device disposed at a position facing the back roll in a state where the non-coating surface of the substrate on one or the other side of the coating is in contact with the back roll It is good also as a structure which irradiates a line
- the diameter of the back roll is preferably 300 mm or more.
- At least one of the first active energy ray irradiation device and the second active energy ray irradiation device is in a region where the coating film is linearly supported and conveyed. Has been placed, It is good also as a structure which irradiates an active energy ray to the coating film supported linearly.
- a heating unit for heating the coating film may be provided on the downstream side of the curing processing unit.
- the wavelength conversion member of the present invention includes a first base material, a second base material, a first base material, and one surface between the first base material and the second base material.
- the substrate side indentation hardness N2 is
- FIG. 1 is a schematic cross-sectional view of a wavelength conversion member 1 according to the first embodiment of the present invention.
- the wavelength conversion member 1 of this embodiment is excited by excitation light between the first base material 10, the second base material 20, and the first base material 10 and the second base material 20.
- the wavelength conversion layer 30 is a cured layer obtained by irradiating a coating film made of a polymerizable composition containing quantum dots 31 and a polymerizable compound with active energy rays, and an organic matrix 32 formed by polymerizing the polymerizable compound. This is a layer in which the quantum dots 31 are dispersed.
- the foundation hardness N1 by the side of the 1st base material 10 side of the wavelength conversion layer 30 and the foundation hardness N2 by the side of the 2nd base material 20 have the relationship of the following formula.
- the first base material 10 and the second base material 20 have oxygen barrier properties. Details of the substrate will be described later.
- the indentation hardness N1 and N2 are measured by the following method.
- a microtome for example, an ultra microtome UC6 manufactured by LEICA
- the interface 10B between the first base material 10 and the wavelength conversion layer 30 and the interface 20B between the second base material 20 and the wavelength conversion layer 30 on the cut surface are confirmed by an optical microscope.
- the thickness of the flakes is 5 ⁇ m.
- the indentation hardness is measured at a position P 1 at a predetermined distance x from the interface 10B to the inside of the wavelength conversion layer and at a position P 2 at a predetermined distance x from the interface 20B to the inside of the wavelength conversion layer.
- In-retardation hardness at the position P 1 of the first substrate side N1 the indentation hardness at the position P 2 of the second substrate side and N2.
- the indentation hardness can be measured with a micro indentation tester (for example, TI950 Tribodenter (manufactured by HYSITRON)) using a Barcovic indenter.
- the distance x from the interface with the substrate of each of the measurement positions P 1 and P 2 of the indentation hardness on one surface side and the other surface side of the wavelength conversion layer 30 is equal.
- the distance x is preferably 1 to 5 ⁇ m, particularly preferably about 3 ⁇ m.
- the range of the indentation hardness N1 and N2 is preferably 100 to 700 MPa, more preferably 200 to 600 MPa, and particularly preferably 250 to 550 MPa. If the indentation hardness N1 or N2 is too low, the cohesive force of the film will be insufficient, so that the adhesion to the substrate will be inferior. If N1 and N2 are too high, the film will become hard and brittle, and cracks will occur during cutting. Can fail. When it exists in the said range, since the film
- FIG. 3 is a schematic cross-sectional view of another form of the wavelength conversion member 11.
- the wavelength conversion member 11 of this embodiment includes an adhesive layer 21 between the second base material 20 and the wavelength conversion layer 30 in the wavelength conversion member 1 according to the first embodiment shown in FIG. Although different in point, other configurations are the same as those of the wavelength conversion member 1 of the first embodiment.
- the foundation hardness N ⁇ b> 1 on the first base material 10 side of the wavelength conversion layer 30 and the foundation hardness N ⁇ b> 2 on the second base material 20 side have the following relationship.
- the indentation hardness N2 on the second substrate side in the wavelength conversion layer 30 is the interface between the adhesive layer 21 and the wavelength conversion layer 30. It is assumed that measurement is performed at a position at a predetermined distance x.
- the wavelength conversion layer 30 is a cured layer formed by irradiating a polymerizable composition with active energy rays, and is a quantum dot that generates fluorescence when irradiated with excitation light in the organic matrix 32. 31 is distributed.
- the shape of the wavelength conversion layer is not particularly limited, and can be an arbitrary shape.
- the quantum dots 31 are greatly illustrated for easy viewing. Actually, for example, the thickness of the wavelength conversion layer 30 is 30 to 100 ⁇ m, and the diameter of the quantum dots 31 is about 2 to 10 nm. is there.
- the thickness of the wavelength conversion layer 30 is preferably in the range of 1 to 500 ⁇ m, more preferably in the range of 10 to 250 ⁇ m, and still more preferably in the range of 20 to 150 ⁇ m.
- a thickness of 1 ⁇ m or more is preferable because a high wavelength conversion effect can be obtained. Further, it is preferable that the thickness is 500 ⁇ m or less because the backlight unit can be thinned when incorporated in the backlight unit.
- Quantum dot The quantum dots 31 are excited by incident excitation light and emit fluorescence.
- Known quantum dots include a quantum dot (A) having an emission center wavelength in a wavelength range of 600 nm to 680 nm, a quantum dot (B) having an emission center wavelength in a wavelength range of 500 nm to 600 nm, and 400 nm to 500 nm.
- quantum dot (C) There is a quantum dot (C) having a light emission center wavelength in the wavelength band, and the quantum dot (A) is excited by excitation light to emit red light, the quantum dot (B) emits green light, and the quantum dot (C). Emits blue light.
- quantum dots (A), (B), and (C) preferably have a half-value width of an emission peak of 70 nm or less, more preferably 60 nm or less, and even more preferably 50 nm or less.
- red light emitted from the quantum dots (A) and light emitted from the quantum dots (B) are emitted.
- the white light can be realized by the green light and the blue light transmitted through the wavelength conversion member.
- ultraviolet light incident on the wavelength conversion member including the quantum dots (A), (B), and (C) as excitation light
- White light can be realized by the emitted green light and the blue light emitted by the quantum dots (C).
- quantum dots for example, JP 2012-169271 A paragraphs 0060 to 0066 can be referred to, but are not limited to those described here.
- quantum dots commercially available products can be used without any limitation.
- Quantum dots may be added to the polymerizable composition in the form of particles, or may be added in the form of a dispersion dispersed in a solvent.
- the addition in the state of a dispersion is preferable from the viewpoint of suppressing the aggregation of the quantum dot particles.
- the solvent used here is not particularly limited. However, since it is preferable that the polymerizable composition does not contain a substantially volatile organic solvent, when the polymerizable composition is added to the polymerizable composition in a state of dispersion in which the quantum dots are dispersed in the solvent, the polymerizable composition is the first. It is preferable to include a step of drying the solvent in the polymerizable composition before coating on the base material to form a coating film.
- the volatile organic solvent means a compound that has a boiling point of 160 ° C. or lower and is liquid at 20 ° C. and does not cure due to an external stimulus.
- the boiling point of the volatile organic solvent is 160 ° C. or lower, more preferably 115 ° C. or lower, and most preferably 30 ° C. or higher and 100 ° C. or lower.
- the ratio of the volatile organic solvent in the polymerizable composition is preferably 10,000 ppm or less, and more preferably 1000 ppm or less.
- the quantum dots can be added in an amount of, for example, about 0.01 to 10 parts by mass with respect to 100 parts by mass of the total amount of the polymerizable composition.
- an actinic radiation curable polymerizable compound As the polymerizable compound, an actinic radiation curable polymerizable compound is included.
- An actinic radiation curable polymerizable compound refers to a compound that becomes a resin by being cured through a crosslinking reaction and a polymerization reaction when irradiated with active energy rays.
- Active energy rays refer to electromagnetic waves such as ultraviolet rays, electron beams, radiation ( ⁇ rays, ⁇ rays, ⁇ rays, etc.).
- the active ray curable polymerizable compound for example, a compound having a functional group such as light (ultraviolet ray), electron beam, radiation curable polyfunctional monomer or polyfunctional oligomer is used, and includes at least one radical polymerizable compound. It is preferable.
- the functional group contained in the polymerizable compound is preferably a photopolymerizable functional group.
- the photopolymerizable functional group include unsaturated polymerizable functional groups such as a (meth) acryloyl group, a vinyl group, a styryl group, and an allyl group.
- the thixotropic agent is an inorganic compound or an organic compound.
- an inorganic thixotropic agent it is preferably an inorganic particle having an aspect ratio of 1.2 to 300, more preferably an inorganic particle of 2 to 200, particularly preferably an inorganic particle of 5 to 200, 5 to 100 inorganic particles are more preferable, and 5 to 50 inorganic particles are even more particularly preferable.
- the long-axis length of the inorganic thixotropic agent is preferably 5 nm or more and 1 ⁇ m or less, and more preferably 5 nm or more and 300 nm or less.
- any inorganic thixotropic agent that satisfies the above aspect ratio can be used without particular limitation, but for example, acicular compounds, chain compounds, flat compounds, and layer compounds can be preferably used. Of these, a layered compound is preferable.
- silica, alumina, silicon nitride, titanium dioxide, calcium carbonate, zinc oxide and the like can be used regardless of the aspect ratio. If necessary, these compounds can be subjected to a treatment for adjusting hydrophilicity or hydrophobicity on the surface.
- organic thixotropic agents examples include oxidized polyolefins and modified urea.
- the content of the thixotropic agent is preferably 0.1 to 20 parts by weight, more preferably 0.2 to 10 parts by weight, based on 100 parts by weight of the curable compound in the polymerizable composition. Particularly preferred is 2 to 8 parts by mass.
- brittleness tends to be improved when it is 20 parts by mass or less with respect to 100 parts by mass of the curable compound.
- the polymerizable composition used in the present invention can contain a known photopolymerization initiator as a polymerization initiator.
- a known photopolymerization initiator as a polymerization initiator.
- the polymerization initiator is preferably 0.1 mol% or more, more preferably 0.5 to 2 mol% of the total amount of the polymerizable compound contained in the polymerizable composition.
- the content is preferably 0.1% by mass to 10% by mass, and more preferably 0.2% by mass to 8% by mass with respect to the total polymerizable composition excluding the volatile organic solvent.
- the wavelength conversion layer formed from the polymerizable composition containing a silane coupling agent Since the wavelength conversion layer formed from the polymerizable composition containing a silane coupling agent has strong adhesion to an adjacent layer by the silane coupling agent, it can exhibit excellent light resistance. This is mainly due to the fact that the silane coupling agent contained in the wavelength conversion layer forms a covalent bond with the surface of the adjacent layer and the components of the wavelength conversion layer by hydrolysis reaction or condensation reaction.
- the silane coupling agent has a reactive functional group such as a radical polymerizable group, a monomer component constituting the wavelength conversion layer and a cross-linked structure can also be formed, thereby improving the adhesion between the wavelength conversion layer and the adjacent layer. Can contribute.
- silane coupling agent a known silane coupling agent can be used without any limitation.
- a silane coupling agent represented by the following general formula (1) described in JP2013-43382A can be exemplified.
- R 1 to R 6 are each independently a substituted or unsubstituted alkyl group or an aryl group, provided that at least one of R 1 to R 6 is a radical polymerizable group. This is a substituent containing a carbon-carbon double bond.
- the 1st base material 10 and the 2nd base material 20 can support the coating film for wavelength conversion layers, even if it is a single layer or a laminated body which consists of a plurality of layers,
- a structure including a barrier layer is particularly preferable.
- at least one of the first base material and the second base material is a flexible film.
- a barrier film comprising a barrier layer on at least one surface of a flexible support is preferably used.
- the thickness of the first base material 10 and the second base material 20 is preferably 10 to 100 ⁇ m.
- the thicknesses of the first base material 10 and the second base material 20 are more preferably 15 ⁇ m to 60 ⁇ m from the viewpoint of reducing the thickness of the applied product and preventing wrinkles.
- the first base material 10 and the second base material 20 have a width of, for example, 300 to 1500 mm.
- the thickness and width of each of the first base material 10 and the second base material 20 are appropriately selected depending on the product to be applied.
- the coating width of the polymerizable composition is preferably 10 to 200 mm narrower than the width of the first base material and the second base material (base material width).
- the barrier film is not particularly limited, but generally oxygen or moisture on at least one surface of a flexible support such as cellulose acylate, cyclic olefin, acrylic resin, polyethylene terephthalate resin, and polycarbonate resin.
- a flexible support such as cellulose acylate, cyclic olefin, acrylic resin, polyethylene terephthalate resin, and polycarbonate resin.
- the structure provided with the barrier layer which contains the inorganic layer which has the barrier property with respect to 1 layer or more is common.
- the barrier film may include a barrier layer having a laminated structure including at least one inorganic layer and at least one organic layer of a flexible support. Laminating a plurality of layers in this manner is preferable from the viewpoint of improving the weather resistance because the barrier property can be further enhanced.
- the number of layers to be stacked increases, the light transmittance of the wavelength conversion member tends to decrease.
- the barrier film preferably has a total light transmittance in the visible light region of 80% or more and an oxygen permeability of 5.00 cm 3 / (m 2 ⁇ day ⁇ atm) or less. preferable.
- the total light transmittance is an average value of light transmittance over the visible light region.
- the oxygen permeability of the barrier film is more preferably 1 cm 3 / (m 2 ⁇ day ⁇ atm) or less, particularly preferably 0.1 cm 3 / (m 2 ⁇ day ⁇ atm) or less, and more particularly preferably 0. .01 cm 3 / (m 2 ⁇ day ⁇ atm) or less
- the “inorganic layer” is a layer mainly composed of an inorganic material, and is preferably a layer formed only from an inorganic material.
- the “organic layer” is a layer mainly composed of an organic material, and preferably refers to a layer in which the organic material occupies 50% by mass or more, more preferably 80% by mass or more, particularly 90% by mass or more. Shall.
- the inorganic material constituting the inorganic layer is not particularly limited, and for example, various inorganic compounds such as metals or inorganic oxides, nitrides, oxynitrides, and the like can be used.
- silicon, aluminum, magnesium, titanium, tin, indium and cerium are preferable, and one or two or more of these may be included.
- Specific examples of the inorganic compound include silicon oxide, silicon oxynitride, aluminum oxide, magnesium oxide, titanium oxide, tin oxide, indium oxide alloy, silicon nitride, aluminum nitride, and titanium nitride.
- a metal film such as an aluminum film, a silver film, a tin film, a chromium film, a nickel film, or a titanium film may be provided.
- An organic layer may be provided adjacent to the inorganic layer.
- the organic layer is mainly composed of an acrylate as a main component, but is not limited. Other materials may be used as long as they protect the inorganic layer.
- the inorganic layer having a barrier property is particularly preferably an inorganic layer containing at least one compound selected from silicon nitride, silicon oxynitride, silicon oxide, and aluminum oxide. Since the inorganic layer made of these materials has good adhesion to the organic layer, even when the inorganic layer has pinholes, the organic layer can effectively fill the pinholes and suppress breakage. In addition, it is possible to form an extremely excellent inorganic layer film even in a case where an inorganic layer is further laminated, and to further increase the barrier property.
- the method for forming the inorganic layer is not particularly limited, and for example, various film forming methods capable of evaporating or scattering the film forming material and depositing it on the deposition surface can be used.
- Examples of the method for forming the inorganic layer include a vacuum evaporation method in which an inorganic material such as an inorganic oxide, an inorganic nitride, an inorganic oxynitride, or a metal is heated and evaporated; an inorganic material is used as a raw material, and oxygen gas is introduced.
- an inorganic material such as an inorganic oxide, an inorganic nitride, an inorganic oxynitride, or a metal is heated and evaporated; an inorganic material is used as a raw material, and oxygen gas is introduced.
- Oxidation reaction vapor deposition method for oxidizing and vapor-depositing Sputtering method for vapor deposition by introducing and sputtering argon gas and oxygen gas using an inorganic material as a target raw material;
- a vapor deposition film of silicon oxide or silicon nitride is formed by using a physical vapor deposition method (Physical Vapor Deposition method) such as ion plating, which is heated by a plasma beam and deposited, an organic silicon compound is used as a raw material.
- Plasma Chemical Vapor Deposition Chemical Vapor Depositi n method
- the silicon oxide film can also be formed by using a low temperature plasma chemical vapor deposition method using an organosilicon compound as a raw material.
- organosilicon compound include 1,1,3,3-tetramethyldisiloxane, hexamethyldisiloxane, vinyltrimethylsilane, hexamethyldisilane, methylsilane, dimethylsilane, trimethylsilane, diethylsilane, propyl Examples thereof include silane, phenylsilane, vinyltriethoxysilane, tetramethoxysilane, phenyltriethoxysilane, methyltriethoxysilane, and octamethylcyclotetrasiloxane.
- TMOS tetramethoxysilane
- HMDSO hexamethyldisiloxane
- the thickness of the inorganic layer is preferably in the range of 10 nm to 500 nm, especially 10 nm to 300 nm, particularly 10 nm to 150 nm.
- the film thickness of the inorganic layer is within the above-described range, it is possible to suppress the reflection in the inorganic layer while realizing good barrier properties, and to provide a light conversion member with higher light transmittance. Because it can.
- organic layer JP (Organic layer) JP, 2007-290369, A paragraphs 0020-0042 and JP, 2005-096108, A paragraphs 0074-0105 can be referred to as an organic layer.
- the organic layer preferably contains a cardo polymer.
- the adhesiveness between the organic layer and the adjacent layer, particularly the adhesiveness with the inorganic layer is improved, and a further excellent gas barrier property can be realized.
- the thickness of the organic layer is preferably in the range of 0.05 ⁇ m to 10 ⁇ m, and more preferably in the range of 0.5 to 10 ⁇ m.
- the thickness of the organic layer is preferably in the range of 0.5 to 10 ⁇ m, and more preferably in the range of 1 to 5 ⁇ m. Further, when formed by a dry coating method, it is preferably in the range of 0.05 ⁇ m to 5 ⁇ m, and more preferably in the range of 0.05 ⁇ m to 1 ⁇ m. This is because when the film thickness of the organic layer formed by the wet coating method or the dry coating method is within the above-described range, the adhesion with the inorganic layer can be further improved.
- a scattering layer if necessary for the barrier film, a scattering layer, a slipperiness-imparting layer, a Newton ring prevention layer, and various light reflecting layers on the opposite side of the barrier layer composed of the above-mentioned inorganic layer and organic layer with the substrate interposed therebetween, A light absorption layer, a light selective reflection layer, or the like may be provided.
- the scattering layer is preferably a layer in which organic and inorganic particles are supported on various binders.
- the slipperiness-imparting layer may be one in which organic or inorganic particles are supported on various binders, or a binder layer containing fluorine or silicon.
- the light reflection layer, light absorption layer, and light selective reflection layer are those that provide scattering and reflection functions by inorganic and organic particles, those that have absorption and reflection functions by fine nanostructures, and reflection functions by the arrangement structure of liquid crystals. It may be configured to have The scattering layer, the slipperiness-imparting layer, the Newton ring prevention layer, and various light reflecting layers, light absorbing layers, light selective reflecting layers, etc. may be formed on the same surface as the barrier layer if necessary. May be.
- FIG. 4 is a schematic view showing a manufacturing process of the wavelength conversion member 1 having the cross section shown in FIG.
- a polymerizable composition containing quantum dots is applied to one surface of the first substrate 10 to form a coating film 30M.
- the first laminated film 13 is formed (application process), the second base material 20 is overlapped with the coating film 30M, and the first base material 10 and the second base material 20 sandwich the coating film 30M.
- the active energy ray E 1 is irradiated from one side (one substrate side) of the coating film 30M to cure the coating film 30M, and the other side of the coating film by irradiation with active energy rays E 2 from (other substrate side) to cure the coating 30M to form a wavelength converting layer 30 (curing step) to produce the wavelength conversion member 1.
- the irradiation of the active energy rays E 1 and E 2 may be simultaneous or may be sequential.
- the coating film 30M is irradiated with active energy rays from both sides in the curing step, so that scattering particles are added to the coating film or the light scattering layer or the like is functionally applied to the substrate. Even if a layer is included and a factor for reducing the hardening efficiency by irradiation of active energy rays is included, the coating film of the polymerizable composition can be sufficiently cured, and the first substrate 10
- the wavelength conversion layer 30 which has the relationship of the following type
- FIG. 5 is a schematic configuration diagram of an example of the wavelength conversion member manufacturing apparatus 100 for manufacturing the wavelength conversion member 1 having the cross section shown in FIG.
- the wavelength conversion member manufacturing apparatus 100 supports the first base material 10 in a roll state, and feeds out a feeding machine 60, a plurality of transport rolls 61 for transporting a film-like workpiece, and each processing step.
- a roll-to-roll manufacturing apparatus including a winder 65 that winds the wavelength conversion member 1 in a roll shape, and the first base material 10 is interposed between the feeder 60 and the winder 65.
- the coating part 70 which coats the polymerizable composition coating liquid on one surface to form the coating film 30M and the coating film 30M of the laminated film 13 in which the coating film 30M is formed on the first base material 10 are coated.
- a coating film 30M is provided between the first base material 10 and the second base material 20 and a pasting part (laminate) 80 for attaching the second base material 20 that sandwiches the film 30 together with the first base material 10.
- the laminated film 14 sandwiched is irradiated with UV light as the active energy ray E.
- a curing treatment unit 90 for curing the coating film 30M by.
- a dust remover 102 that removes dust from the application surface of the first base material 10 is provided between the feeder 60 and the application unit 70.
- FIG. 6A is an enlarged view of the curing processing unit 90 of the wavelength conversion member manufacturing apparatus 100 shown in FIG.
- Lamination processing unit 90 that is, a laminate composed of coating film 30 ⁇ / b> M sandwiched between first base material 10 and second base material 20, which is conveyed as a workpiece in a processing region where a process of curing the coating film is performed.
- a first active energy ray irradiator 90A (hereinafter referred to as a first light irradiator 90A) that irradiates ultraviolet rays onto one surface side of the coating film 30M of the film 14 (in this example, the second substrate 20 side).
- the second active energy ray irradiation device 90B (hereinafter referred to as second light) irradiates ultraviolet rays on the other surface side (the first base material 10 side in this example) of the coating film 30M.
- An irradiation device 90B) is disposed.
- the ultraviolet light means light having a wavelength of 280 to 400 nm.
- a light source that generates ultraviolet rays for example, a low-pressure mercury lamp, a medium-pressure mercury lamp, a high-pressure mercury lamp, an ultrahigh-pressure mercury lamp, a carbon arc lamp, a metal halide lamp, a xenon lamp, or the like can be used.
- backup rolls 91 ⁇ / b> A and 91 ⁇ / b> B are provided at positions facing the first and second light irradiation devices 90 ⁇ / b> A and 90 ⁇ / b> B, and the laminated film 14 includes the backup roll 91 ⁇ / b> A and the first light irradiation.
- the apparatus 90A, the backup roll 91B and the second light irradiation apparatus 90B Continuously conveyed between the apparatus 90A, the backup roll 91B and the second light irradiation apparatus 90B, and laminated on one surface of the laminated film 14 by the first light irradiation apparatus 90A and by the second light irradiation apparatus 90B.
- Ultraviolet rays are irradiated from the other surface of the film 14 toward the coating film 30M.
- the first base material 10 is continuously conveyed from the feeder 60 to the coating unit 70 at a conveyance speed of 1 to 50 m / min. However, it is not limited to this conveyance speed.
- a tension of 20 to 150 N / m preferably a tension of 30 to 100 N / m is applied to the first base material 10.
- various pretreatments for coating may be performed on the front and back surfaces of the substrate.
- Pre-coating is a heat treatment process to correct wrinkles and elongation of the substrate, press process, various discharge treatments and flame treatment processes to improve surface wettability, and also improve wettability.
- the pretreatment includes a step of peeling and removing the protective sheet.
- the dust remover 102 removes dust from the application surface of the first base material 10 and then transports the first base material 10 to the application unit 70.
- a polymerizable composition coating liquid (hereinafter also referred to as “coating liquid”) is applied to the surface of the first substrate 10 that is continuously conveyed to form a coating film 30 ⁇ / b> M (see FIG. 3). Is done.
- the coating liquid is supplied through a pipe connected to the die coater 74 of the coating unit 70 using a liquid feeding device not shown in FIG. In the liquid feeder, it is preferable to remove the coarse particles by filtering the polymerizable composition.
- the filtration accuracy is not particularly limited, but a filter having a filtration accuracy of 1 to 200 ⁇ m can be used, and a filter having a filtration accuracy of 5 to 150 ⁇ m is preferably used.
- the filter for example, PALL profile II having a filtration accuracy of 100 ⁇ m can be used.
- a die coater 74 and a backup roll 76 disposed to face the die coater 74 are installed.
- the surface opposite to the surface on which the coating film 30M of the first substrate 10 is formed is wound around the backup roll 76, and the coating liquid is applied from the discharge port of the die coater 74 to the surface of the first substrate 10 that is continuously conveyed. Is applied to form a coating film 30M.
- the die coater 74 is provided with a decompression chamber 78, and a coating thin film (referred to as a bead) bridging between the die coater 74 and the substrate 10 wound around the backup roll 76 is formed on the substrate 10.
- a negative pressure can be applied in order to suppress instability due to being pulled by the conveyance. The negative pressure is appropriately adjusted depending on the coating speed, the coating thickness, and the viscosity of the coating solution.
- the die coater 74 to which the extrusion coating method is applied is shown as the coating apparatus, but the present invention is not limited to this.
- a coating apparatus to which various methods such as a curtain coating method, a rod coating method, or a roll coating method are applied can be used.
- the specific aspect of the sticking process in the sticking part 80 of the manufacturing apparatus 100 is demonstrated.
- the laminated film 13 that has passed through the application unit 70 and has the coating film 30 ⁇ / b> M formed on the first substrate 10 is continuously conveyed to the application unit 80.
- the second base material 20 that is continuously conveyed is laminated on the coating film 30 ⁇ / b> M, and the coating film 30 ⁇ / b> M is sandwiched between the first base material 10 and the second base material 20.
- the pasting unit 80 is provided with a laminate roll 82 and a temperature control chamber (not shown) surrounding the laminate roll 82.
- a backup roll 62 is disposed at a position facing the laminate roll 82.
- the surface opposite to the surface on which the coating film 30M is formed that is, the first base material 10 side
- the laminating position means a position where the contact between the second substrate 20 and the coating film 30M starts.
- the first substrate 10 is preferably wound around the backup roll 62 before reaching the laminating position. This is because even if wrinkles occur in the first base material 10, the wrinkles are corrected and removed by the backup roll 62 before reaching the laminate position.
- the second base material 20 sent out from the second base material delivery machine 81 which is wound around the second base material 20 in a roll shape and sent to the affixing unit 80 is wound around the laminating roll 82 via the transport roll 83. It is applied and continuously conveyed between the laminating roll 82 and the backup roll 62.
- the second base material 20 is laminated on the coating film 30M formed on the first base material 10 at the laminating position. Thereby, the coating film 30 ⁇ / b> M is sandwiched between the first base material 10 and the second base material 20.
- Rotational accuracy of the laminating roll 82 and the backup roll 62 is 0.05 mm or less, preferably 0.01 mm or less in radial runout. The smaller the radial runout, the smaller the thickness distribution of the coating film 30M.
- the backup roll 62 includes a columnar main body and rotating shafts arranged at both ends of the main body.
- the diameter of the backup roll 62 is not limited, but usually has a diameter of 100 to 1000 mm.
- the diameter of the backup roll is preferably 300 mm or more in order to suppress bending stress at the time of curing described later on the substrate and to suppress deformation such as curling. More preferably, it is 450 mm or more.
- the diameter is preferably 300 to 850 mm.
- the temperature of the backup roll 62 can be adjusted by attaching a temperature controller to the main body of the backup roll 62.
- the difference between the temperature of the backup roll 62 and the temperature of the first base material 10, and the backup is preferably 30 ° C. or less, more preferably 15 ° C. or less, and most preferably the same.
- the temperature control chamber can be configured to be supplied with a temperature-controlled air from a hot air generator or a cold air generator and to adjust the temperature of the first base material 10 and the second base material 20.
- the first base material 10 may be heated by the backup roll 62 by being wound around the temperature-controlled backup roll 62.
- the temperature of the 2nd base material 20 can be adjusted with the lamination roll 82 by making the lamination roll 82 into a heat roll.
- the temperature control chamber and the heat roll are not essential and can be provided as necessary.
- the specific aspect of the hardening process in the hardening process part 90 of the manufacturing apparatus 100 is demonstrated.
- a curing method by ultraviolet irradiation is shown, but various active rays may be used.
- the laminated film 14 (see FIG. 6A), which is laminated by the pasting step and has the coating film 30 ⁇ / b> M sandwiched between the first base material 10 and the second base material 20, is continuously conveyed to the curing processing unit 90. .
- the laminated film 14 is conveyed between the first backup roll 91A and the first light irradiation device 90A, and the laminated film 14 is conveyed with the first substrate 10 side wound around the first backup roll 91A. While being done, the coating film 30M is irradiated with ultraviolet rays from the second substrate 20 side. Thereafter, the laminated film 14 is conveyed between the second backup roll 91B and the second light irradiation device 90B, and the laminated film 14 is wound around the second backup roll 91B on the second substrate 20 side. While being transported, the coating film 30M is irradiated with ultraviolet rays from the first substrate 10 side.
- the second light irradiating device irradiates the laminated film 14 with light on the surface opposite to the surface irradiated with light by the first light irradiating device.
- the polymerization reaction of the polymerizable compound in the coating film 30 ⁇ / b> M proceeds and becomes a hard film to become the wavelength conversion layer 30.
- the ultraviolet-ray of the irradiation amount of 100-10000 mJ / cm ⁇ 2 > is directed to the coating film 30M as an example. It is preferably 100 to 2000 mJ / cm 2 , more preferably 100 to 1000 mJ / cm 2 .
- Light irradiation intensity of the coating film (illuminance) can be 30 ⁇ 2000mW / cm 2 as one example, preferably set to 50 ⁇ 1000mW / cm 2, and more preferably to 100 ⁇ 500mW / cm 2 .
- the temperatures of the first and second backup rolls 91A and 91B are as follows: heat generation during light irradiation, curing efficiency of the coating film 30M, and the backup rolls 91A and 91B of the first base material 10 and the second base material 20 It can be determined in consideration of the occurrence of wrinkle deformation at
- the backup rolls 91A and 91B are preferably set to a temperature range of 10 to 95 ° C., for example, and more preferably 15 to 85 ° C.
- the roll temperature refers to the surface temperature of the roll.
- the wavelength conversion member 1 which consists of a laminated body of the wavelength conversion layer 30 which consists of the 1st base material 10, the cured layer, and the 2nd base material 20 is manufactured by hardening the coating film 30M. .
- the wavelength conversion member 1 is subjected to a heat treatment or the like in a subsequent process if necessary, and is continuously conveyed to the winder 65 and wound into a roll by the winder 65.
- the wavelength conversion member 1 in which the occurrence of curling is suppressed can be obtained.
- the arrangement configuration of the first and second light irradiation devices 90A and 90B in the curing processing unit 90 of the wavelength conversion member manufacturing apparatus 100 and the form of the coating film during ultraviolet irradiation are not limited to those shown in FIG. Various aspects can be employed.
- the ultraviolet irradiation from the second substrate side is performed first, and then the ultraviolet irradiation from the first substrate side is performed.
- the ultraviolet irradiation from the first substrate side is performed. May be performed first, and ultraviolet irradiation from the second substrate side may be performed later, or ultraviolet irradiation from the first substrate side and ultraviolet irradiation from the second substrate side may be performed simultaneously. Good.
- FIG. 6B to 6H are schematic views showing variations in the configuration of the curing processing unit 90 of the manufacturing apparatus 100.
- FIG. 6B to 6H are schematic views showing variations in the configuration of the curing processing unit 90 of the manufacturing apparatus 100.
- the curing processing unit 90 may include a plurality of first and second light irradiation devices 90A and 90B. Further, as shown in FIG. 6C, the first light irradiation device 90A and the second light irradiation device 90B are not at positions facing the first back roll 91A and the second back roll 91B, respectively, but before and after them.
- the laminated film 14 may be disposed so as to irradiate one surface or the other surface thereof with active energy rays in a state where the laminated film 14 is supported linearly.
- each includes a plurality of first and second light irradiation devices 90A and 90B, one for irradiating active energy rays in a region where the laminated film is supported and conveyed in a straight line. May be arranged so as to irradiate active energy rays in a region that is wound around a back roll and rotated and conveyed.
- the curing processing unit 90 includes only one back roll 91, and one of the first and second light irradiation devices 90A and 90B (the first light irradiation device 90A in the illustrated example). Is disposed at a position facing the back roll 91 across the laminated film 14, and the other (second light irradiation device 90B in the illustrated example) is arranged in a region where the laminated film 14 is supported and conveyed linearly. May be.
- a plurality of back rolls 91 are provided, a plurality of first and second light irradiation devices 90A and 90B are provided, and a plurality of first light irradiation devices 90A are provided on the plurality of back rolls 91 by 1: 1.
- the plurality of second light irradiation devices 90B may be arranged in a region where the laminated film 14 is supported and conveyed in a straight line.
- both the first and second light irradiation devices 90A and 90B are provided in a region where the laminated film 14 is supported and conveyed linearly. It may be arranged.
- the curing processing unit 90 includes only one back roll 91, and includes a plurality of first and second light irradiation devices 90A and 90B, and one of the light irradiation devices (illustrated).
- one of the first light irradiation devices 90A) is disposed at a position facing the back roll 91 with the laminated film 14 interposed therebetween, and the remaining light irradiation devices are supported and conveyed in a straight line by the laminated film 14. It may be arranged in each area.
- the curing processing unit 90 may be configured to irradiate the laminated film 14 with active energy rays from one surface and the other surface (front and back surfaces).
- FIG. 7 is a schematic view showing a manufacturing process of the wavelength conversion member 11 having the cross section shown in FIG. According to the other method for producing a wavelength conversion member shown in FIG. 7, a polymerizable composition containing quantum dots is applied to one surface of the first base material 10 to form a coating film 30M (application process).
- the active energy ray is irradiated from one side (one base side) of the coating film 30M to cure the coating film 30M, and the other side of the coating film (the other side)
- the wavelength conversion layer 30 is formed by irradiating active energy rays from the base material side) to cure the coating film (curing step), and the second base material 20 having the adhesive layer 21 on the wavelength conversion layer 30.
- the wavelength conversion layer 30 is sandwiched between the first base material 10 and the second base material 20 so that the adhesive layer 21 is in contact with the wavelength conversion layer 30 (sticking step).
- the coating film of the polymerizable composition can be sufficiently cured, and the wavelength conversion layer 30
- the indentation hardness N1 on the first base material 10 side and the indentation hardness N2 on the second base material 20 side can be represented by the following formula.
- FIG. 8 is a schematic configuration diagram of an example of the wavelength conversion member manufacturing apparatus 110 for manufacturing the wavelength conversion member 11 having the cross section shown in FIG. 3.
- the wavelength conversion member manufacturing apparatus 110 supports the first base material 10 in a roll state, and feeds out a feeding machine 60, a plurality of transport rolls 61 for transporting a film-like workpiece, and each processing step.
- a roll-to-roll manufacturing apparatus including a winder 65 that winds the wavelength conversion member 1 in a roll shape, and the first base material 10 is interposed between the feeder 60 and the winder 65.
- the coating part 70 which forms the coating film 30M by applying the polymerizable composition coating liquid on one surface, and a laminate in which the coating film 30M is sandwiched between the first base material 10 and the second base material 20
- the film 14 is irradiated with UV light as an active energy ray E to cure the coating film 30M, and the coating film 30M of the laminated film 13 in which the coating film 30M is formed on the first substrate 10
- the second base for sandwiching the coating film 30 together with the first base material 10.
- Pasting unit for pasting the 20 and (laminate) 80 is provided in this order.
- a dust remover 102 that removes dust from the application surface of the first base material 10 between the delivery device 60 and the application unit 70 is disposed on the curing processing unit 90 side between the application unit 70 and the curing processing unit 90.
- a drying device 103 for volatilizing volatile components contained in the polymerizable composition is provided between the sticking unit 80 and the winder 65 and an annealing unit 104 that performs a drying and annealing process.
- the curing unit 90 before applying the second base material 20 to the coating film 30M, the curing unit 90 irradiates the exposed surface of the coating film 30M with ultraviolet rays by the first light irradiation device 90A. Subsequently, the second light irradiation device 90B irradiates ultraviolet rays from the first base material 10 which is the opposite surface of the exposed surface of the coating film 30M.
- the coating film 30 ⁇ / b> M is cured to become the wavelength conversion layer 30, and the laminated film 15 in which the wavelength conversion layer 30 is formed on the first substrate 10 is conveyed to the pasting unit 80.
- the second base material 20 coated with the adhesive 21 on one side is laminated to the wavelength conversion layer 30 via the adhesive 21.
- one of the coating films 30M is applied by the first active energy ray irradiation device.
- an active energy ray is irradiated from the surface, and then, as a pasting step, a second substrate is laminated on the surface of the coating film 30M cured by the irradiation of the active energy ray via an adhesive, and then the second substrate
- the wavelength conversion layer 30 is formed by further curing the coating film 30M by irradiating the active energy ray from the surface opposite to the active energy ray irradiation surface in the first curing step by the second active energy ray irradiation device. It is also possible to do.
- the backlight unit includes at least the wavelength conversion member of the present invention and a light source.
- the details of the wavelength conversion member are as described above.
- FIG. 9 is a schematic cross-sectional view of an example of the backlight unit 2 including the wavelength conversion member 1 according to an aspect of the present invention.
- the backlight unit 2 a planar light source unit 1C for a surface-emitting blue light L B as an excitation light, the blue light L B emitted from the planar light source unit 1C is incident, to convert some of the blue light L B in the green light L G and the red light L R, the sheet-type wavelength conversion member 1 which transmits part of the blue light L B, the light guide plate described later across the wavelength conversion member 1 A retroreflective member group 2B disposed opposite to 1B and a reflector 2A disposed opposite to the wavelength conversion member 1 with the light guide plate 1B interposed therebetween.
- the planar light source unit 1C includes a sheet-like light guide plate 1B and a light source 1A that emits blue light and is disposed at the edge of the light guide plate 1B so that excitation light enters from the edge of the light guide plate 1B.
- the wavelength conversion member 1, as a quantum dot 31 in that wavelength conversion layer 30, is intended to include by irradiation of the blue light L B quantum dots that emit red light L R, and a quantum dot emits green light L G .
- the primary light L B emitted from the planar light source unit 1C is incident on the wavelength conversion member 1, in the wavelength conversion member 1, by exciting light at least a portion of the primary light L B emits secondary light composed of red light and green light, L B emitted from the wavelength conversion member 1, L G, L R is incident on the retroreflective member 2B, the light incident is retroreflective The reflection is repeated between the member 2B and the reflecting plate 2A, and passes through the wavelength conversion member 1 a plurality of times.
- the wavelength conversion member 1 a sufficient amount of excitation light (blue light L B ) is absorbed by the quantum dots 31, and a necessary amount of fluorescence (L G , L R ) is emitted, from the retroreflective member 2B. That is, the white light LW is embodied and emitted from the backlight unit 2.
- a light emitting diode or a laser light source that emits blue light having an emission center wavelength in a wavelength band of 430 nm to 480 nm can be used.
- ultraviolet can be used a light emitting diode that emits, in that case, the light emission as a quantum dot 31 in the wavelength conversion layer 30 of the wavelength conversion member 1, the blue light L B by ultraviolet quantum dots, quantum dots that emit red light L R, and may be intended to include quantum dots that emit green light L G.
- the planar light source unit 1 ⁇ / b> C may be a light source unit including a light source 1 ⁇ / b> A and a light guide plate 1 ⁇ / b> B that guides and emits primary light emitted from the light source 1 ⁇ / b> A. It may be a light source unit arranged in a plane parallel to the wavelength conversion layer and provided with a diffusion plate instead of the light guide plate 1B.
- the former planar light source unit is generally called an edge light system, and the latter planar light source unit is generally called a direct type.
- the reflecting plate 2A is not particularly limited, and known ones can be used, and are described in Japanese Patent No. 3416302, Japanese Patent No. 3363565, Japanese Patent No. 4091978, Japanese Patent No. 3448626, etc. Incorporated into the present invention.
- the retroreflective member 2B may include a known diffusion plate, diffusion sheet, prism sheet (for example, BEF series manufactured by Sumitomo 3M Limited), a light guide, or the like.
- the configuration of the retroreflective member 2B is described in Japanese Patent No. 3416302, Japanese Patent No. 3363565, Japanese Patent No. 4091978, Japanese Patent No. 3448626, and the contents of these publications are incorporated in the present invention.
- the backlight unit 2 described above can be applied to a liquid crystal display device.
- the liquid crystal display device 50 includes the backlight unit 2 according to the above-described embodiment and the liquid crystal cell unit 6 disposed to face the retroreflective member side of the backlight unit 2.
- the liquid crystal cell unit 6 has a configuration in which the liquid crystal cell 5 is sandwiched between polarizing plates 3 and 4.
- the polarizing plates 3 and 4 have both main surfaces of the polarizers 32 and 42, respectively.
- the polarizing plate protective films 31 and 33 and 41 and 43 are used for the protection.
- liquid crystal cell 5 there are no particular limitations on the liquid crystal cell 5, the polarizing plates 3 and 4 and the components constituting the liquid crystal display device 50, and those produced by known methods and commercially available products can be used without any limitation. It is of course possible to provide a known intermediate layer such as an adhesive layer between the layers.
- the driving mode of the liquid crystal cell 5 is not particularly limited, and is twisted nematic (TN), super twisted nematic (STN), vertical alignment (VA), in-plane switching (IPS), optically compensated bend cell (OCB). ) And other modes can be used.
- the liquid crystal cell is preferably VA mode, OCB mode, IPS mode, or TN mode, but is not limited thereto.
- the configuration shown in FIG. 2 of Japanese Patent Application Laid-Open No. 2008-262161 is given as an example.
- the specific configuration of the liquid crystal display device is not particularly limited, and a known configuration can be adopted.
- the liquid crystal display device 50 further has an accompanying functional layer such as an optical compensation member that performs optical compensation and an adhesive layer as necessary.
- an optical compensation member that performs optical compensation
- an adhesive layer as necessary.
- a surface layer such as an undercoat layer may be disposed.
- the liquid crystal display device includes the backlight unit including the wavelength conversion member in which curling is suppressed according to the present invention, and thus achieves high luminance and high color reproducibility with high stability. Is something that can be done.
- barrier film Preparation of barrier film
- PET film manufactured by Toyobo Co., Ltd., trade name: Cosmo Shine (registered trademark) A4300, thickness 50 ⁇ m
- an organic layer and an inorganic layer are sequentially formed on one side of the support by the following procedure. Formed.
- Trimethylolpropane triacrylate manufactured by Daicel Cytec Co., Ltd., TMPTA
- a photopolymerization initiator Liberti Co., Ltd., ESACURE KTO46
- TMPTA Trimethylolpropane triacrylate
- ESACURE KTO46 photopolymerization initiator
- a coating solution having a solid content concentration of 15% was obtained. This coating solution was applied onto the PET film with a roll toe roll using a die coater, and passed through a drying zone at 50 ° C. for 3 minutes.
- the sample was irradiated with ultraviolet rays (integrated irradiation amount: about 600 mJ / cm 2 ) in a nitrogen atmosphere, cured by ultraviolet curing, and wound up.
- the thickness of the first organic layer formed on the support was 1 ⁇ m.
- an inorganic layer (silicon nitride layer) was formed on the surface of the organic layer using a roll-to-roll CVD apparatus.
- Silane gas (flow rate 160 sccm), ammonia gas (flow rate 370 sccm), hydrogen gas (flow rate 590 sccm), and nitrogen gas (flow rate 240 sccm) were used as source gases.
- a high frequency power supply having a frequency of 13.56 MHz was used as the power supply.
- the film forming pressure was 40 Pa, and the reached film thickness was 50 nm.
- a barrier film in which an organic layer and an inorganic layer were sequentially laminated on one side of the support was prepared according to the procedure described above. In the following, this barrier film was used as a first substrate and a second substrate.
- Example 1 The wavelength conversion member was produced by the manufacturing process described with reference to FIG. Hereinafter, a specific manufacturing method will be described in the order of each step.
- the above-described polymerizable composition coating solution is sent by a diaphragm pump using a pipe length of about 2.5 m, and a filter with a filtration member height of 1 inch and a filtration accuracy of 100 ⁇ m (PALL 100 ⁇ m Profile II). ) was used to remove coarse particles, and the solution was fed to a die coater (74 in FIG. 5).
- the coating liquid is applied at a coating width of 600 mm to the barrier film (thickness meter 50 ⁇ m, base material width 700 mm) which is the above-described first base material 10 fed out from a delivery machine (reference numeral 60 in FIG. 5). Formed.
- the viscosity of the coating solution extruded from the die coater was maintained and adjusted to 3 to 100 mPa ⁇ s by adjusting the stirring at the time of preparation, ultrasonic treatment, and the lip clearance of the die coater to an appropriate range.
- the coating speed was adjusted and changed as needed, but here it was 3 m / min.
- the thickness of the coating film was adjusted to 50 ⁇ m.
- a barrier film (thickness meter 50 ⁇ m) having the same substrate width 700 mm as the first substrate is used as a second substrate (reference numeral 20 in FIG. 5).
- the second base material was laminated on the coating film by drawing from 81).
- a metal roll (diameter 200 mm, backup roll 62 in FIG. 5) and a natural rubber nip roll (diameter 200 mm, hardness 75 degrees, in FIG. 5).
- the minimum gap between the metal roll and the natural rubber nip roll was set to 3 mm using a laminate roll 82), and the barrier film as the second substrate was adhered to the coating film.
- the peripheral speeds of the two rolls were controlled so that the ratio of the peripheral speed of the backup roll 62 to the peripheral speed of the laminate roll 82 was 100.0% ⁇ 1%.
- the temperature of the first substrate is controlled to be 50 ° C. in the region from immediately before the second substrate is laminated on the coating film to just before the coating film is cured, and the second substrate The temperature of was controlled to be 60 ° C.
- the substrate tension just before the first base sticking part was set to 60 N / width, and the substrate tension just before the second base sticking part was set to 60 N / width.
- the first substrate side comes into contact with the first backup roll for UV irradiation (reference numeral 91A in FIG. 5), and the first backup roll is transported and moved with the rotation of the first backup roll.
- the coating film sandwiched between the first base material and the second base material is irradiated with a first active energy ray irradiation device from the second base material side under the conditions of an irradiation amount of 300 mJ / cm 2 and an illuminance of 300 mW / cm 2 . Irradiate UV light, and then the second base material side comes into contact with the second backup roll and is transported and moved with the rotation of the second backup roll.
- the wavelength conversion layer is formed by irradiating UV light under the conditions of an irradiation amount of 300 mJ / cm 2 and an illuminance of 300 mW / cm 2 to cure the coating film, and has a cross section shown in FIG.
- the wavelength conversion member of Example 1 was produced.
- the roll diameter of the backup roll at the time of UV light irradiation was 300 mm, and the backup roll temperature was 30 ° C.
- Examples 2 to 4, Comparative Example 1 Wavelength conversion members of Examples 2 to 5 and Comparative Example 1 were prepared in the same manner as in Example 1 except that the UV irradiation conditions in the curing step were as described in Table 1. In Comparative Example 1, the first UV light and the second UV light were irradiated from the same surface side of the coating surface.
- Example 5 In the curing step, the wavelength of Example 5 is the same as Example 2 except that the roll diameter of the backup roll supporting the coating film sandwiched between the first base material and the second base material is 600 mm. A conversion member was produced.
- Example 6 In the curing step, UV light irradiation was performed by the second active energy ray irradiation apparatus in a state where the coating film sandwiched between the first base material and the second base material was supported linearly (flatly). A wavelength conversion member of Example 6 was produced in the same manner as in Example 2 except for the above.
- Example 7 After performing UV light irradiation in the second active energy ray irradiation device in the curing process, a metal casing is provided in the middle of conveyance until winding, and heating air adjusted to 60 ° C. is supplied inside at 5 m 3 / min. A wavelength conversion member of Example 7 was produced in the same manner as in Example 2 except that it was passed through the apparatus for 1 minute.
- Comparative Example 2 In the curing step, the first active energy ray irradiation device was irradiated with UV light under the conditions of an irradiation amount of 1000 mJ / cm 2 and an illuminance of 300 mW / cm 2 , and the second active energy ray irradiation device was not irradiated. Except for the above, a wavelength conversion member of Comparative Example 2 was produced in the same manner as in Example 1.
- the indentation hardness of the wavelength conversion member of each Example and Comparative Example was measured by the following procedure. First, a cross section of an arbitrary position of the produced wavelength conversion member is cut using a microtome (LEICA ultra-microtome UC6), and a thin piece having a cut surface as a main surface is cut out. The conversion layer and the second substrate interface were confirmed. Then, at a position of about 3 ⁇ m from each interface to the wavelength conversion layer side, a TI950 Triboindenter (manufactured by HYSITRON) was used to measure the indentation hardness N1 and N2 by indentation measurement with a 50 ⁇ N load using a Barcovic indenter. The difference
- the curl of the wavelength conversion member produced in each example and comparative example was measured by the following procedure. First, the center part of the produced wavelength conversion member in the width direction (direction perpendicular to the conveying direction in the roll-to-roll manufacturing apparatus) is cut into a square of 210 mm ⁇ 150 mm, and flat in an environment of 25 ° C. and 60% relative humidity. The humidity was adjusted for 24 hours on a glass table. And the floating of the four corners of the wavelength conversion member was measured with a caliper. Table 1 shows the average values of the floating at the four corners.
- the wavelength conversion members of Examples 1 to 7 in which the wavelength conversion layer was formed by irradiating the coating film sandwiched between the first base material and the second base material with UV light from the front and back sides were as small as 4 mm or less, whereas in the wavelength conversion members of Comparative Examples 1 and 2, the curl was as large as over 4 mm. In Examples 1 to 7 in which the difference in the indentation hardness between the front and back of the wavelength conversion layer was 20 MPa or less, the curl was 4 mm or less.
- the difference in the indentation hardness is 16 MPa or less, the curl is 4 mm or less, the difference in the indentation hardness is 10 MPa or less, the curl is 3 mm or less, the difference in the indentation hardness is 5 MPa or less, and the curl is 2 mm. Obtained.
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Abstract
[Problème] Produire un élément de conversion de longueur d'onde qui supprime l'apparition d'une ondulation, un procédé de fabrication pour celui-ci, et un dispositif de fabrication d'élément de conversion de longueur d'onde pour ledit procédé, une unité de rétroéclairage comprenant l'élément de conversion de longueur d'onde, et un dispositif d'affichage à cristaux liquides. [Solution] La présente invention concerne un élément de conversion de longueur d'onde (1) qui est formée par formation d'un film (30M) sur une surface d'un premier substrat (10) par revêtement de la surface avec une composition polymérisable comprenant des points quantiques ; superposition d'un deuxième substrat (20) sur le film (30M) pour prendre en sandwich le film (30M) entre le premier substrat (10) et le deuxième substrat (20) ; et formation d'une couche de conversion de longueur d'onde (30) par durcissement du film (30M) par irradiation du film (30M) depuis une surface de celui-ci avec des rayonnements d'énergie active (E1) et par irradiation du film (30M) depuis l'autre surface de celui-ci avec des rayonnements d'énergie active (E2). La dureté par indentation N1 de la couche de conversion de longueur d'onde (30) sur le côté de premier substrat (10) de celui-ci et la dureté par indentation N2 de la couche de conversion de longueur d'onde (30) sur le côté de deuxième substrat (20) de celui-ci satisfont à la relation dans la formule suivante. |N1-N2|≤20 MPa
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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Cited By (3)
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CN107975763A (zh) * | 2017-11-28 | 2018-05-01 | 宁波激智科技股份有限公司 | 一种具有防蓝光效果的量子点膜 |
WO2018233187A1 (fr) * | 2017-06-22 | 2018-12-27 | 深圳Tcl新技术有限公司 | Module de rétroéclairage et dispositif d'affichage |
CN110945390A (zh) * | 2017-07-19 | 2020-03-31 | 凸版印刷株式会社 | 波长转换片及其制造方法 |
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KR102150150B1 (ko) * | 2017-11-28 | 2020-08-31 | 주식회사 엘지화학 | 색변환 필름, 및 이를 포함하는 백라이트 유닛 및 디스플레이 장치 |
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