WO2016065772A1 - 一种柔性基板贴附方法和柔性基板贴附结构 - Google Patents

一种柔性基板贴附方法和柔性基板贴附结构 Download PDF

Info

Publication number
WO2016065772A1
WO2016065772A1 PCT/CN2015/072622 CN2015072622W WO2016065772A1 WO 2016065772 A1 WO2016065772 A1 WO 2016065772A1 CN 2015072622 W CN2015072622 W CN 2015072622W WO 2016065772 A1 WO2016065772 A1 WO 2016065772A1
Authority
WO
WIPO (PCT)
Prior art keywords
flexible substrate
substrate
flexible
film
pattern
Prior art date
Application number
PCT/CN2015/072622
Other languages
English (en)
French (fr)
Inventor
宁策
高涛
Original Assignee
京东方科技集团股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京东方科技集团股份有限公司 filed Critical 京东方科技集团股份有限公司
Priority to EP15748148.2A priority Critical patent/EP3214642B1/en
Priority to US14/761,986 priority patent/US9544995B2/en
Publication of WO2016065772A1 publication Critical patent/WO2016065772A1/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/007—Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/467—Adding a circuit layer by thin film methods
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133305—Flexible substrates, e.g. plastics, organic film
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/016—Temporary inorganic, non-metallic carrier, e.g. for processing or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
    • H05K3/16—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation by cathodic sputtering

Definitions

  • the present disclosure relates to the field of flexible substrate processing technologies, and in particular, to a flexible substrate attaching method and a flexible substrate attaching structure.
  • the flexible display is made of a soft material and is characterized by being deformable and bendable, and having the advantages of being light and thin, and easy to carry.
  • a general solution is to secure the flexible substrate to a rigid carrier substrate prior to processing the flexible substrate. This makes it possible to make a flexible display using existing equipment. However, the attaching process of the existing flexible substrate is complicated, and it is difficult to remove the completed flexible substrate.
  • flexible substrate attachment techniques are generally classified into mechanical attachment and spin-on attachment.
  • the former is easy to remove, but it is difficult to fix on the carrier substrate; the latter method makes it difficult to remove the prepared flexible substrate from the carrier substrate. Accordingly, there is a need in the art to provide a flexible substrate attachment method that is relatively simple and easy to implement.
  • a flexible substrate attaching method by which a flexible substrate has a good fixing effect on a carrier substrate and the flexible panel is easily removed after being completed.
  • a flexible substrate attaching method which may include the steps of: pre-fixing a flexible substrate on a carrier substrate using a first fixing structure; forming a film on the flexible substrate Forming a pattern of the film by a patterning process; the pattern of the film simultaneously contacting at least a portion of the flexible substrate and at least a portion of the carrier substrate to function to reinforce the flexible substrate onto the carrier substrate.
  • the film can fix the flexible substrate on the carrier substrate, and at the same time, the flexible substrate can be obtained by cutting the flexible substrate through the pattern of the film. Since the flexible substrate is directly placed on the carrier substrate and is not attached to the carrier substrate, the cut flexible panel can be directly removed.
  • the fixing effect of the flexible substrate on the carrier substrate is good and the flexible panel is easily removed after the fabrication is completed.
  • the pattern of the film specifically includes a plurality of lateral and a plurality of longitudinal strip structures interlaced with each other, the strip structure separating the flexible substrate into a plurality of regions, each of the regions corresponding to On a flexible panel.
  • the film may be a metal film.
  • the metal thin film may be formed using a magnetron sputtering process.
  • the patterning process includes an etching method, and the etching method may be a wet etching.
  • the pattern of the thin film may further include a gate line structure or a data line structure.
  • the first fixing structure may be an adhesive tape.
  • the film may have a thickness of 300 to 800 nm.
  • the flexible substrate may be a thin glass or resin material substrate.
  • the carrier substrate may be a glass substrate.
  • a flexible substrate attaching structure comprising: a carrier substrate; a flexible substrate pre-fixed on the carrier substrate by the first fixing structure; and a pattern of the film on the flexible substrate, The pattern of the film simultaneously contacts at least a portion of the flexible substrate and at least a portion of the carrier substrate.
  • the pattern of the thin film may include a plurality of lateral and a plurality of longitudinal strip-like structures interlaced with each other, the strip structure dividing the flexible substrate into a plurality of regions, each of the regions corresponding to On a flexible panel.
  • the film may be a metal film.
  • the pattern of the thin film may further include a gate line structure or a data line structure.
  • FIG. 1 is a flowchart of a method for attaching a flexible substrate according to an embodiment of the present disclosure
  • FIG. 2 is a schematic diagram of a flexible substrate attaching structure according to an embodiment of the present disclosure
  • FIG. 3 is a schematic cross-sectional view of a flexible substrate attaching structure according to an embodiment of the present disclosure.
  • the flexible substrate attaching method includes the following steps: at step S101, the flexible substrate 2 is pre-fixed on the carrier substrate 1 by using the first fixing structure 4; at step S102, at the flexible substrate A film is formed on 2, and a pattern of the film is formed by a patterning process; the pattern of the film simultaneously contacts at least a portion of the flexible substrate 2 and at least a portion of the carrier substrate 1 to function to reinforce the flexible substrate 2 onto the carrier substrate 1.
  • the flexible substrate 2 in step S102, can be fixed on the carrier substrate 1 by the film formed on the flexible substrate 2, and the flexible substrate can be obtained by cutting the flexible substrate 2 through the pattern of the film. Since the flexible substrate 2 is directly placed on the carrier substrate 1 and is not attached to the carrier substrate 1, the cut flexible panel can be directly removed from the carrier substrate 1.
  • the fixing effect of the flexible substrate 2 on the carrier substrate 1 is good and the flexible panel is easily removed after the fabrication is completed.
  • the pattern of the film specifically includes a plurality of lateral and a plurality of longitudinal strip structures 3 interlaced with each other, and the strip structure 3 divides the flexible substrate 2 into a plurality of regions 21, each of which corresponds to one region 21 Flexible panel.
  • the flexible substrate 2 can be fixed on the carrier substrate 1 by attaching both ends of the plurality of lateral and longitudinal longitudinal strip structures 3 to the edge of the carrier substrate 1, and at the same time, along the strip shape
  • the edge of the region 21 where the structure 3 is divided is cut by the flexible substrate 2, that is, cut along the broken line shown in Fig. 2, and the corresponding portion of each of the regions 21 in the flexible substrate 2 can be cut into a flexible panel.
  • the film is a metal film.
  • a metal thin film is formed using a magnetron sputtering process.
  • the patterning process includes an etching method, which is a wet etching.
  • the pattern of the thin film formed in step S102 may further include a gate line structure or a data line structure.
  • the thickness of the film is from 300 to 800 nm.
  • the first fixing structure 4 may be an adhesive tape, and thus the four corners of the flexible substrate 2 may be pre-fixed on the carrier substrate 1 with an adhesive tape.
  • the flexible substrate 2 is a thin glass or resin material substrate; the carrier substrate 1 is a glass substrate.

Abstract

一种柔性基板贴附方法和柔性基板贴附结构，该柔性基板贴附方法包括以下步骤：采用第一固定结构（4）将柔性基板（2）预固定于载体基板（1）上；在所述柔性基板（2）上形成薄膜，通过构图工艺形成薄膜的图案；所述薄膜的图案同时接触所述柔性基板（2）的至少一部分以及所述载体基板（1）的至少一部分以起到将所述柔性基板（2）加固到载体基板（1）上的作用。在该柔性基板贴附方法中，柔性基板（2）在载体基板（1）上的固定效果好且柔性面板（2）制作完成后易于取下。

Description

一种柔性基板贴附方法和柔性基板贴附结构 技术领域
本公开涉及柔性基板加工技术领域，特别涉及一种柔性基板贴附方法和一种柔性基板贴附结构。
背景技术
21世纪在显示领域是平板显示的时代，其中的柔性显示作为下一代显示重点技术得到飞快的发展。柔性显示器由柔软的材料制成，其特点为可变形可弯曲，并且具有轻薄，携带方便等优点。
然而，柔性基板加工困难，导致其应用发展严重受限。一般的解决方案是在对柔性基板进行加工之前将柔性基板固定于刚性的载体基板上。这样可以实现利用现有的设备来制作柔性显示器。但现有柔性基板的贴附工艺较为复杂，且不易将制作完成的柔性基板取下。
另外，柔性基板贴附技术一般分为机械贴附和旋涂贴附。前一种易于摘取，但固定在载体基板上较为困难；后一种方法则不易将制备完成的柔性基板从载体基板取下。因此，本领域中存在提供一种相对简单而易于实现的柔性基板贴附方法的需要。
发明内容
本公开的第一方面，提供了一种柔性基板贴附方法，通过该柔性基板贴附方法，柔性基板在载体基板上的固定效果好且柔性面板在制作完成后易于取下。
为达到上述目的，本公开的实施例提供了一种柔性基板贴附方法，该方法可以包括以下步骤：采用第一固定结构将柔性基板预固定于载体基板上；在所述柔性基板上形成薄膜，通过构图工艺形成薄膜的图案；所述薄膜的图案同时接触所述柔性基板的至少一部分以及所述载体基板的至少一部分以起到将所述柔性基板加固到载体基板上的作用。
在上述柔性基板贴附方法中，薄膜可以使柔性基板固定在载体基板上，同时，透过薄膜的图案切割柔性基板可以得到柔性面板。由于柔性基板是直接放置在载体基板上并未贴附于载体基板上，所以切割得到的柔性面板可以直接取下来。
因此，采用上述柔性基板贴附方法，柔性基板在载体基板上的固定效果好且柔性面板制作完成后易于取下。
根据本公开的实施例，所述薄膜的图案具体包括：相互交错的多个横向和多个纵向的条状结构，所述条状结构将柔性基板分隔成多个区域，每一个所述区域对应于一个柔性面板。
根据本公开的另一实施例，所述薄膜可以为金属薄膜。
根据本公开的又一实施例，可以采用磁控溅射工艺形成所述金属薄膜。
根据本公开的再一实施例，所述构图工艺包括刻蚀方法，所述刻蚀方法可以为湿法刻蚀。
根据本公开的实施例，所述薄膜的图案还可以包括栅线结构或者数据线结构。
根据本公开的另一实施例，所述第一固定结构可以为胶带。
根据本公开的又一实施例，所述薄膜的厚度可以为300-800nm。
根据本公开的再一实施例，所述柔性基板可以为薄玻璃或者树脂材料基板。
根据本公开的实施例，所述载体基板可以为玻璃基板。
根据本公开的第二方面，提供了一种柔性基板贴附结构，包括：载体基板；通过第一固定结构预固定于载体基板上的柔性基板；以及在所述柔性基板上的薄膜的图案，所述薄膜的图案同时接触所述柔性基板的至少一部分以及所述载体基板的至少一部分。
根据本公开的实施例，所述薄膜的图案可以包括：相互交错的多个横向和多个纵向的条状结构，所述条状结构将柔性基板分隔成多个区域，每一个所述区域对应于一个柔性面板。
根据本公开的另一实施例，所述薄膜可以为金属薄膜。
根据本公开的又一实施例，所述薄膜的图案还可以包括栅线结构或者数据线结构。
附图说明
本发明的其它目的和特征将从以下结合附图考虑的详细描述变得显而易见。然而，要理解，仅出于说明性而非限制性的目的示出各图，并且各图未必按照比例绘制。在图中，
图1为本公开的实施例提供的一种柔性基板贴附方法流程图；
图2为本公开的实施例提供的一种柔性基板贴附结构示意图；
图3为本公开的实施例提供的一种柔性基板贴附结构横截面示意图。
其中，贯穿各图，相同的附图标记表示相同的部件。
具体实施方式
下面将结合本公开实施例中的附图，对本公开实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本公开中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本公开保护的范围。
参考图1、图2以及图3。如图1所示，所提供的柔性基板贴附方法，包括以下步骤：在步骤S101处，采用第一固定结构4将柔性基板2预固定于载体基板1上；在步骤S102处，在柔性基板2上形成薄膜，通过构图工艺形成薄膜的图案；薄膜的图案同时接触柔性基板2的至少一部分以及载体基板1的至少一部分以起到将柔性基板2加固到载体基板1上的作用。
在上述柔性基板贴附方法中，在步骤S102中，通过柔性基板2上形成的薄膜可以使柔性基板2固定在载体基板1上，同时，透过薄膜的图案切割柔性基板2可以得到柔性面板。由于柔性基板2直接放置在载体基板1上并未贴附于载体基板1上，所以切割得到的柔性面板可以直接从载体基板1取下来。
因此，采用上述柔性基板贴附方法，柔性基板2在载体基板1上的固定效果好且柔性面板制作完成后易于取下。
如图2所示，薄膜的图案具体包括：相互交错的多个横向和多个纵向的条状结构3，条状结构3将柔性基板2分隔成多个区域21，每一个区域21对应于一个柔性面板。
在薄膜的图案中，通过将多个横向和多个纵向的条状结构3的两端贴附在载体基板1的边缘上，可以使柔性基板2固定在载体基板1上，同时，沿条状结构3分隔成的区域21的边缘对柔性基板2进行切割，即沿着图2中所示的虚线进行切割，可以将柔性基板2中每个区域21对应的部分切割成一块柔性面板。
另外，薄膜为金属薄膜。
特别地，在步骤S102中，采用磁控溅射工艺形成金属薄膜。
另外，在步骤S102中，构图工艺包括刻蚀方法，所述刻蚀方法为湿法刻蚀。
特别地，在步骤S102中形成的薄膜的图案还可以包括栅线结构或者数据线结构。
特别地，薄膜的厚度为300-800nm。
特别地，在步骤S101中，第一固定结构4可以为胶带，因而可以采用胶带将柔性基板2的四个角预固定在载体基板1上。
特别地，柔性基板2为薄玻璃或者树脂材料基板；载体基板1为玻璃基板。
显然，本领域的技术人员可以对本公开的实施例进行各种改动和变型而不脱离本发明的精神和范围。这样，倘若本公开的这些修改和变型属于随附权利要求及其等同技术的范围之内，则本公开也意图包含这些改动和变型在内。

Claims (14)

  1. 一种柔性基板贴附方法，包括以下步骤：
    采用第一固定结构将柔性基板预固定于载体基板上；
    在所述柔性基板上形成薄膜，通过构图工艺形成薄膜的图案；所述薄膜的图案同时接触所述柔性基板的至少一部分以及所述载体基板的至少一部分以起到将所述柔性基板加固到载体基板上的作用。
  2. 根据权利要求1所述的柔性基板贴附方法，其中，所述薄膜的图案包括：相互交错的多个横向和多个纵向的条状结构，所述条状结构将柔性基板分隔成多个区域，每一个所述区域对应于一个柔性面板。
  3. 根据权利要求1所述的柔性基板贴附方法，其中，所述薄膜为金属薄膜。
  4. 根据权利要求3所述的柔性基板贴附方法，其中，采用磁控溅射工艺形成所述金属薄膜。
  5. 根据权利要求3所述的柔性基板贴附方法，其中，所述构图工艺包括刻蚀方法，所述刻蚀方法为湿法刻蚀。
  6. 根据权利要求2所述的柔性基板贴附方法，其中，所述薄膜的图案还包括栅线结构或者数据线结构。
  7. 根据权利要求1所述的柔性基板贴附方法，其中，所述第一固定结构为胶带。
  8. 根据权利要求1～7任一项所述的柔性基板贴附方法，其中，所述薄膜的厚度为300-800nm。
  9. 根据权利要求1～7任一项所述的柔性基板贴附方法，其中，所述柔性基板为薄玻璃或者树脂材料基板。
  10. 根据权利要求1～7任一项所述的柔性基板贴附方法，其中，所述载体基板为玻璃基板。
  11. 一种柔性基板贴附结构，包括：
    载体基板；
    通过第一固定结构预固定于载体基板上的柔性基板；以及
    在所述柔性基板上的薄膜的图案，所述薄膜的图案同时接触所述柔性基板的至少一部分以及所述载体基板的至少一部分。
  12. 根据权利要求11所述的柔性基板贴附结构，其中，所述薄膜的 图案包括：相互交错的多个横向和多个纵向的条状结构，所述条状结构将柔性基板分隔成多个区域，每一个所述区域对应于一个柔性面板。
  13. 根据权利要求11所述的柔性基板贴附结构，其中，所述薄膜为金属薄膜。
  14. 根据权利要求12所述的柔性基板贴附结构，其中，所述薄膜的图案还包括栅线结构或者数据线结构。
PCT/CN2015/072622 2014-10-27 2015-02-10 一种柔性基板贴附方法和柔性基板贴附结构 WO2016065772A1 (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP15748148.2A EP3214642B1 (en) 2014-10-27 2015-02-10 Flexible substrate attaching method and flexible substrate attaching structure
US14/761,986 US9544995B2 (en) 2014-10-27 2015-02-10 Flexible substrate attaching method and flexible substrate attachment structure

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201410585036.0 2014-10-27
CN201410585036.0A CN104319240B (zh) 2014-10-27 2014-10-27 一种柔性基板贴附方法

Publications (1)

Publication Number Publication Date
WO2016065772A1 true WO2016065772A1 (zh) 2016-05-06

Family

ID=52374452

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2015/072622 WO2016065772A1 (zh) 2014-10-27 2015-02-10 一种柔性基板贴附方法和柔性基板贴附结构

Country Status (4)

Country Link
US (1) US9544995B2 (zh)
EP (1) EP3214642B1 (zh)
CN (1) CN104319240B (zh)
WO (1) WO2016065772A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180030512A (ko) * 2015-07-15 2018-03-23 칼 짜이스 에스엠테 게엠베하 리소그래피 노광 장치용 미러 배열체 및 미러 배열체를 포함하는 광학 시스템

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104319240B (zh) 2014-10-27 2017-06-23 京东方科技集团股份有限公司 一种柔性基板贴附方法
CN105271790A (zh) * 2015-11-18 2016-01-27 湖南普照爱伯乐平板显示器件有限公司 一种柔性玻璃的制作方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1883061A (zh) * 2003-11-21 2006-12-20 皇家飞利浦电子股份有限公司 有源矩阵显示器和具有等离子基板的其它电子装置
CN101118843A (zh) * 2006-07-31 2008-02-06 日东电工株式会社 对半导体晶圆粘贴粘合带、剥离保护带的方法及装置
CN102651331A (zh) * 2011-06-14 2012-08-29 京东方科技集团股份有限公司 基板托盘及柔性电子器件制造方法
CN104319240A (zh) * 2014-10-27 2015-01-28 京东方科技集团股份有限公司 一种柔性基板贴附方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002252446A (ja) * 2001-02-23 2002-09-06 Sony Chem Corp フレキシブル配線基板の製造方法
JP2006269496A (ja) * 2005-03-22 2006-10-05 Mitsui Mining & Smelting Co Ltd フレキシブルプリント配線基板、および半導体装置
KR101552729B1 (ko) * 2009-04-30 2015-09-11 엘지디스플레이 주식회사 플렉서블 표시장치의 제조 방법
CN102629446B (zh) * 2012-03-22 2015-08-05 京东方科技集团股份有限公司 显示面板及其操作控制方法和显示装置
CN103426904B (zh) * 2013-08-02 2015-11-11 京东方科技集团股份有限公司 一种柔性有机发光二极管显示器及其制备方法
KR102151247B1 (ko) * 2013-11-11 2020-09-03 삼성디스플레이 주식회사 플렉서블 표시 패널의 제조 방법 및 플렉서블 표시 장치의 제조 방법

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1883061A (zh) * 2003-11-21 2006-12-20 皇家飞利浦电子股份有限公司 有源矩阵显示器和具有等离子基板的其它电子装置
CN101118843A (zh) * 2006-07-31 2008-02-06 日东电工株式会社 对半导体晶圆粘贴粘合带、剥离保护带的方法及装置
CN102651331A (zh) * 2011-06-14 2012-08-29 京东方科技集团股份有限公司 基板托盘及柔性电子器件制造方法
CN104319240A (zh) * 2014-10-27 2015-01-28 京东方科技集团股份有限公司 一种柔性基板贴附方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180030512A (ko) * 2015-07-15 2018-03-23 칼 짜이스 에스엠테 게엠베하 리소그래피 노광 장치용 미러 배열체 및 미러 배열체를 포함하는 광학 시스템
KR102520380B1 (ko) 2015-07-15 2023-04-12 칼 짜이스 에스엠테 게엠베하 리소그래피 노광 장치용 미러 배열체 및 미러 배열체를 포함하는 광학 시스템

Also Published As

Publication number Publication date
CN104319240A (zh) 2015-01-28
EP3214642A4 (en) 2018-07-25
EP3214642A1 (en) 2017-09-06
US20160338189A1 (en) 2016-11-17
CN104319240B (zh) 2017-06-23
US9544995B2 (en) 2017-01-10
EP3214642B1 (en) 2021-10-06

Similar Documents

Publication Publication Date Title
US10593898B2 (en) Base carrier, flexible display panel and manufacturing method thereof, flexible display device
WO2015032202A1 (zh) 一种阵列基板、柔性显示器件及阵列基板的制作方法
US20150017389A1 (en) Mask, glass substrate and manufacturing method thereof
CN108336099B (zh) 显示基板及其制备方法、显示装置
JP6048460B2 (ja) 保護フィルム複合体及び保護フィルムの貼付方法
WO2015109738A1 (zh) 显示面板母板及其制备方法
WO2016065772A1 (zh) 一种柔性基板贴附方法和柔性基板贴附结构
JP2012088946A (ja) タッチパネルの製造方法およびその方法により製造された加飾カバーガラス一体型タッチパネル
US20160062524A1 (en) Integration sheet, method for manufacturing the same and method for manufacturing a touch screen using the same
US9662928B2 (en) Method for fabricating curved decoration plate and curved display device
CN104516164A (zh) 一种显示基板及其制作方法和显示装置
KR101624717B1 (ko) 지연식각부재 및 이를 이용한 디스플레이패널의 식각방법
US20180150161A1 (en) Polarizer and touch display device having the same
US9653483B2 (en) Display motherboard, display panel and display device
US20180329126A1 (en) Wire grid polarizer, method of manufacturing the same, and display device
US9490266B2 (en) Array substrate and method for producing the same and display apparatus
WO2016176927A1 (zh) 一种触摸屏及移动通讯终端、一种触摸屏的制备方法
US11227877B2 (en) Array substrates and manufacturing methods thereof and display screens
KR101172659B1 (ko) 스마트 유리 박막용 보호필름의 제조방법
US9030447B2 (en) Surface acoustic wave touch panel and manufacturing method thereof
US20150192963A1 (en) Electronic assembly and assemblying method
US20190235669A1 (en) Mask plate, display substrate, method for manufacturing display substrate, and display device
JP2014002275A5 (zh)
WO2015188539A1 (zh) 光栅基板及其制作方法、显示装置
US10600998B2 (en) Display apparatus and method of manufacturing thereof

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 14761986

Country of ref document: US

REEP Request for entry into the european phase

Ref document number: 2015748148

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 2015748148

Country of ref document: EP

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 15748148

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE