US9544995B2 - Flexible substrate attaching method and flexible substrate attachment structure - Google Patents
Flexible substrate attaching method and flexible substrate attachment structure Download PDFInfo
- Publication number
- US9544995B2 US9544995B2 US14/761,986 US201514761986A US9544995B2 US 9544995 B2 US9544995 B2 US 9544995B2 US 201514761986 A US201514761986 A US 201514761986A US 9544995 B2 US9544995 B2 US 9544995B2
- Authority
- US
- United States
- Prior art keywords
- flexible substrate
- thin film
- substrate
- attaching method
- flexible
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active, expires
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 132
- 238000000034 method Methods 0.000 title claims abstract description 42
- 239000010409 thin film Substances 0.000 claims abstract description 47
- 238000000059 patterning Methods 0.000 claims abstract description 7
- 239000002184 metal Substances 0.000 claims description 8
- 239000011521 glass Substances 0.000 claims description 6
- 239000002390 adhesive tape Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 238000005530 etching Methods 0.000 claims description 3
- 238000001755 magnetron sputter deposition Methods 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000001039 wet etching Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 230000000694 effects Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/007—Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/467—Adding a circuit layer by thin film methods
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133305—Flexible substrates, e.g. plastics, organic film
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/016—Temporary inorganic, non-metallic carrier, e.g. for processing or transferring
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
- H05K3/16—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation by cathodic sputtering
Definitions
- the present disclosure relates to the technical field of flexible substrate processing and, in particular, to a flexible substrate attaching method and a flexible substrate attachment structure.
- the 21st century is the time of flat panel display in the display field, and among it, flexible display has gained fast growth as the next-generation focus of display technologies.
- Flexible display is made of a flexible material, which can be deformed, bended, and has the advantages of being slim and light, convenient to carry, etc.
- a flexible substrate is difficult to process and is thus largely limited in application and development.
- a general solution to that is to fix a flexible substrate on a rigid carrier substrate before the processing of the flexible substrate. This can realize manufacturing the flexible display using existing devices.
- the prior art flexible substrate attaching processes are relatively complicated and such flexible substrate as manufactured is difficult to get detached after it is completed.
- flexible substrate attaching techniques are generally divided into mechanical attaching and spin coating attaching.
- the former is easy and convenient for detachment, but more difficult for fixation on the carrier substrate; the latter is not easy for detachment of the completed flexible substrate from the carrier substrate. Therefore, there is a need for providing a relatively simple and readily achievable flexible substrate attaching method in the field.
- a flexible substrate attaching method is provided, by which method a flexible substrate can be fixed on a carrier substrate in good effect and the flexible panel can be easily detached after the manufacture is completed.
- an embodiment of the present disclosure provides a flexible substrate attaching method, which method may comprise the steps of: pre-fixing a flexible substrate on a carrier substrate with a first fixation structure; forming a thin film on the flexible substrate, and forming a pattern of the thin film via a patterning process; the pattern of the thin film contacting at least a part of the flexible substrate and at least a part of the carrier substrate simultaneously to play the function of consolidating the flexible substrate onto the carrier substrate.
- the thin film can cause the flexible substrate to be fixed on the carrier substrate, and meanwhile, a flexible panel can be obtained by cutting the flexible substrate through the pattern of the thin film. Since the flexible substrate is directly placed on the carrier substrate and not attached with the carrier substrate, the flexible panel resulted from the cutting can be detached directly.
- a flexible substrate can be fixed on a carrier substrate in good effect and the flexible panel can be easily detached after the manufacture is completed.
- the pattern of the thin film specifically comprises: a plurality of interlaced horizontal and longitudinal strip-like structures separating the flexible substrate into a plurality of regions, each of the regions corresponding to a flexible panel.
- the thin film may be a metal thin film.
- the metal thin film may be formed using a magnetron sputtering process.
- the patterning process comprises an etching method, which can be a wet-etching.
- the pattern of the thin film may comprise a gate line structure or a data line structure.
- the first fixation structure may be an adhesive tape.
- the thin film may have a thickness of 300-800 nm.
- the flexible substrate may be a thin glass or resin material substrate.
- the carrier substrate may be a glass substrate.
- a flexible substrate attachment structure comprising: a carrier substrate; a flexible substrate pre-fixed on the carrier substrate via a first fixation structure; and a pattern of a thin film on the flexible substrate, the pattern of the thin film contacting at least a part of the flexible substrate and at least a part of the carrier substrate simultaneously.
- the pattern of the thin film can comprise: a plurality of interlaced horizontal and longitudinal strip-like structures separating the flexible substrate into a plurality of regions, each of the regions corresponding to a flexible panel.
- the thin film may be a metal thin film.
- the pattern of the thin film may comprise a gate line structure or a data line structure.
- FIG. 1 is a flow chart of a flexible substrate attaching method provided by an embodiment of the present disclosure
- FIG. 2 is a schematic diagram of a flexible substrate attachment structure provided by an embodiment of the present disclosure
- FIG. 3 is a cross sectional schematic diagram of a flexible substrate attachment structure provided by an embodiment of the present disclosure.
- a flexible substrate attaching method as provided comprises the following steps: at step S 101 , pre-fixing a flexible substrate 2 on a carrier substrate 1 with a first fixation structure 4 ; at step S 102 , forming a thin film on the flexible substrate 2 , and forming a pattern of the thin film via a patterning process; the pattern of the thin film contacting at least a part of the flexible substrate 2 and at least a part of the carrier substrate 1 simultaneously to play the function of consolidating the flexible substrate 2 onto the carrier substrate 1 .
- step S 102 the thin film formed on the flexible substrate 2 enables the flexible substrate 2 to be fixed on the carrier substrate 1 , and meanwhile, a flexible panel can be obtained by cutting the flexible substrate 2 through the pattern of the thin film. Since the flexible substrate 2 is directly placed on the carrier substrate 1 and not attached with the carrier substrate 1 , the flexible panel resulted from the cutting can be detached from the carrier substrate 1 directly.
- the flexible substrate 2 can be fixed on the carrier substrate 1 in good effect and the flexible panel can be easily detached after the manufacture is completed.
- the pattern of the thin film specifically comprises: a plurality of interlaced horizontal and longitudinal strip-like structures 3 separating the flexible substrate 2 into a plurality of regions 21 , each of the regions 21 corresponding to a flexible panel.
- the flexible substrate 2 can be fixed to the carrier substrate 1 , and meanwhile, the flexible substrate 2 is cut along an edge of the regions 21 as separated by the strip-like structures 3 , i.e. along the dashed lines as shown in FIG. 2 , by which a part in the flexible substrate 2 corresponding to each region 21 can be cut into a flexible panel.
- the thin film is a metal thin film.
- step S 102 the metal thin film is formed using a magnetron sputtering process.
- the patterning process comprises an etching method, which can be a wet-etching.
- the pattern of the thin film as formed in step S 102 may further comprise a gate line structure or a data line structure.
- the thin film has a thickness of 300-800 nm.
- the first fixation structure 4 can be an adhesive tape, whereby four corners of the flexible substrate 2 can be pre-fixed on the carrier substrate 1 by using the adhesive tape.
- the flexible substrate 2 is a thin glass or resin material substrate; the carrier substrate 1 is a glass substrate.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Laminated Bodies (AREA)
Abstract
Description
Claims (14)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410585036 | 2014-10-27 | ||
CN201410585036.0A CN104319240B (en) | 2014-10-27 | 2014-10-27 | A kind of flexible base board attaching method |
CN201410585036.0 | 2014-10-27 | ||
PCT/CN2015/072622 WO2016065772A1 (en) | 2014-10-27 | 2015-02-10 | Flexible substrate attaching method and flexible substrate attaching structure |
Publications (2)
Publication Number | Publication Date |
---|---|
US20160338189A1 US20160338189A1 (en) | 2016-11-17 |
US9544995B2 true US9544995B2 (en) | 2017-01-10 |
Family
ID=52374452
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US14/761,986 Active 2035-03-19 US9544995B2 (en) | 2014-10-27 | 2015-02-10 | Flexible substrate attaching method and flexible substrate attachment structure |
Country Status (4)
Country | Link |
---|---|
US (1) | US9544995B2 (en) |
EP (1) | EP3214642B1 (en) |
CN (1) | CN104319240B (en) |
WO (1) | WO2016065772A1 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104319240B (en) | 2014-10-27 | 2017-06-23 | 京东方科技集团股份有限公司 | A kind of flexible base board attaching method |
DE102015213275A1 (en) * | 2015-07-15 | 2017-01-19 | Carl Zeiss Smt Gmbh | Mirror assembly for a lithographic exposure system and mirror assembly comprehensive optical system |
CN105271790A (en) * | 2015-11-18 | 2016-01-27 | 湖南普照爱伯乐平板显示器件有限公司 | Manufacturing method for flexible glass |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1505916A (en) | 2001-02-23 | 2004-06-16 | 索尼化学株式会社 | Method of manufacturing flexible wiring board |
CN1838859A (en) | 2005-03-22 | 2006-09-27 | 三井金属矿业株式会社 | Flexible printed wiring board, method for fabricating flexible printed wiring board, and semiconductor device |
CN1883061A (en) | 2003-11-21 | 2006-12-20 | 皇家飞利浦电子股份有限公司 | Active matrix displays and other electronic devices having plastic substrates |
CN101118843A (en) | 2006-07-31 | 2008-02-06 | 日东电工株式会社 | Method for joining adhesive tape to semiconductor wafer, method for separating protective tape from semiconductor wafer, and apparatuses using the methods |
CN102651331A (en) | 2011-06-14 | 2012-08-29 | 京东方科技集团股份有限公司 | Substrate tray and manufacturing method of flexible electronic device |
CN103426904A (en) | 2013-08-02 | 2013-12-04 | 京东方科技集团股份有限公司 | Flexible organic light-emitting diode display and method for manufacturing same |
US20140125578A1 (en) * | 2012-03-22 | 2014-05-08 | Boe Technology Group Co., Ltd. | Display Panel And Operation Control Method Thereof, And Display Device |
CN104319240A (en) | 2014-10-27 | 2015-01-28 | 京东方科技集团股份有限公司 | Flexible substrate attaching method |
US20150129122A1 (en) * | 2013-11-11 | 2015-05-14 | Samsung Display Co., Ltd. | Method of manufacturing flexible display panel and method of manufacturing flexible display apparatus |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101552729B1 (en) * | 2009-04-30 | 2015-09-11 | 엘지디스플레이 주식회사 | method of manufacturing a flexible display device |
-
2014
- 2014-10-27 CN CN201410585036.0A patent/CN104319240B/en active Active
-
2015
- 2015-02-10 US US14/761,986 patent/US9544995B2/en active Active
- 2015-02-10 WO PCT/CN2015/072622 patent/WO2016065772A1/en active Application Filing
- 2015-02-10 EP EP15748148.2A patent/EP3214642B1/en active Active
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1505916A (en) | 2001-02-23 | 2004-06-16 | 索尼化学株式会社 | Method of manufacturing flexible wiring board |
CN1883061A (en) | 2003-11-21 | 2006-12-20 | 皇家飞利浦电子股份有限公司 | Active matrix displays and other electronic devices having plastic substrates |
CN1838859A (en) | 2005-03-22 | 2006-09-27 | 三井金属矿业株式会社 | Flexible printed wiring board, method for fabricating flexible printed wiring board, and semiconductor device |
CN101118843A (en) | 2006-07-31 | 2008-02-06 | 日东电工株式会社 | Method for joining adhesive tape to semiconductor wafer, method for separating protective tape from semiconductor wafer, and apparatuses using the methods |
CN102651331A (en) | 2011-06-14 | 2012-08-29 | 京东方科技集团股份有限公司 | Substrate tray and manufacturing method of flexible electronic device |
US20140125578A1 (en) * | 2012-03-22 | 2014-05-08 | Boe Technology Group Co., Ltd. | Display Panel And Operation Control Method Thereof, And Display Device |
CN103426904A (en) | 2013-08-02 | 2013-12-04 | 京东方科技集团股份有限公司 | Flexible organic light-emitting diode display and method for manufacturing same |
US20150129122A1 (en) * | 2013-11-11 | 2015-05-14 | Samsung Display Co., Ltd. | Method of manufacturing flexible display panel and method of manufacturing flexible display apparatus |
CN104319240A (en) | 2014-10-27 | 2015-01-28 | 京东方科技集团股份有限公司 | Flexible substrate attaching method |
Non-Patent Citations (2)
Title |
---|
International Search Report and Written Opinion from PCT/CN2015/072622 dated May 29, 2015 with Translation. |
Office action from Chinese Application No. 201410585036.0 dated Aug. 2, 2016. |
Also Published As
Publication number | Publication date |
---|---|
EP3214642A4 (en) | 2018-07-25 |
EP3214642B1 (en) | 2021-10-06 |
US20160338189A1 (en) | 2016-11-17 |
CN104319240B (en) | 2017-06-23 |
WO2016065772A1 (en) | 2016-05-06 |
CN104319240A (en) | 2015-01-28 |
EP3214642A1 (en) | 2017-09-06 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US10141527B2 (en) | Foldable substrate, method for forming the same and flexible display device | |
US11355726B2 (en) | Flexible display panel, method of manufacturing flexible display panel and display device | |
US20160322403A1 (en) | Flexible Base Substrate and Fabrication Method Thereof | |
US9241412B2 (en) | Manufacturing method of flexible display substrate | |
US9544995B2 (en) | Flexible substrate attaching method and flexible substrate attachment structure | |
US9633899B2 (en) | Method for patterning a graphene layer and method for manufacturing a display substrate | |
CN104317080A (en) | Display device and manufacturing method thereof | |
WO2015032202A1 (en) | Array substrate, flexible display device and method of manufacturing array substrate | |
CN102129318B (en) | Touch panel and manufacturing method thereof | |
US10573832B2 (en) | Flexible substrate and manufacturing method thereof, and flexible display device | |
US20160062524A1 (en) | Integration sheet, method for manufacturing the same and method for manufacturing a touch screen using the same | |
US20150145787A1 (en) | Touch panel and manufacturing method thereof, display device | |
CN108986664A (en) | Flexible display panels and manufacturing method, flexible display apparatus and manufacturing method | |
CN104516164A (en) | Display substrate, manufacturing method thereof and display device | |
KR20140126681A (en) | Method of Fabricating Flexible Color Filter and Flexible Color Display Device | |
US9543325B2 (en) | Array substrate and manufacturing method thereof, liquid crystal display panel and display device | |
US10379396B2 (en) | Display panel and display device | |
US9490266B2 (en) | Array substrate and method for producing the same and display apparatus | |
KR101172659B1 (en) | A manufacturing method for smart glass thin film | |
CN107340651B (en) | Frame glue coating method | |
KR101376491B1 (en) | Method of manufacturing flexible display | |
EP3157049A1 (en) | Flexible display panel manufacturing method | |
US20160246084A1 (en) | Method of Manufacturing Flexible Display Device and Flexible Display Device | |
US20180107311A1 (en) | Touch substrate and method of manufacturing the same, touch panel and display device | |
CN107505751B (en) | Preparation method of display panel, display panel and display device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: BOE TECHNOLOGY GROUP CO., LTD., CHINA Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:NING, CE;GAO, TAO;REEL/FRAME:036244/0576 Effective date: 20150710 |
|
STCF | Information on status: patent grant |
Free format text: PATENTED CASE |
|
MAFP | Maintenance fee payment |
Free format text: PAYMENT OF MAINTENANCE FEE, 4TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1551); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY Year of fee payment: 4 |
|
FEPP | Fee payment procedure |
Free format text: MAINTENANCE FEE REMINDER MAILED (ORIGINAL EVENT CODE: REM.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |