US9544995B2 - Flexible substrate attaching method and flexible substrate attachment structure - Google Patents

Flexible substrate attaching method and flexible substrate attachment structure Download PDF

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US9544995B2
US9544995B2 US14/761,986 US201514761986A US9544995B2 US 9544995 B2 US9544995 B2 US 9544995B2 US 201514761986 A US201514761986 A US 201514761986A US 9544995 B2 US9544995 B2 US 9544995B2
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flexible substrate
thin film
substrate
attaching method
flexible
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US20160338189A1 (en
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Ce Ning
Tao Gao
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BOE Technology Group Co Ltd
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BOE Technology Group Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/007—Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/467—Adding a circuit layer by thin film methods
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133305—Flexible substrates, e.g. plastics, organic film
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/016—Temporary inorganic, non-metallic carrier, e.g. for processing or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
    • H05K3/16—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation by cathodic sputtering

Definitions

  • the present disclosure relates to the technical field of flexible substrate processing and, in particular, to a flexible substrate attaching method and a flexible substrate attachment structure.
  • the 21st century is the time of flat panel display in the display field, and among it, flexible display has gained fast growth as the next-generation focus of display technologies.
  • Flexible display is made of a flexible material, which can be deformed, bended, and has the advantages of being slim and light, convenient to carry, etc.
  • a flexible substrate is difficult to process and is thus largely limited in application and development.
  • a general solution to that is to fix a flexible substrate on a rigid carrier substrate before the processing of the flexible substrate. This can realize manufacturing the flexible display using existing devices.
  • the prior art flexible substrate attaching processes are relatively complicated and such flexible substrate as manufactured is difficult to get detached after it is completed.
  • flexible substrate attaching techniques are generally divided into mechanical attaching and spin coating attaching.
  • the former is easy and convenient for detachment, but more difficult for fixation on the carrier substrate; the latter is not easy for detachment of the completed flexible substrate from the carrier substrate. Therefore, there is a need for providing a relatively simple and readily achievable flexible substrate attaching method in the field.
  • a flexible substrate attaching method is provided, by which method a flexible substrate can be fixed on a carrier substrate in good effect and the flexible panel can be easily detached after the manufacture is completed.
  • an embodiment of the present disclosure provides a flexible substrate attaching method, which method may comprise the steps of: pre-fixing a flexible substrate on a carrier substrate with a first fixation structure; forming a thin film on the flexible substrate, and forming a pattern of the thin film via a patterning process; the pattern of the thin film contacting at least a part of the flexible substrate and at least a part of the carrier substrate simultaneously to play the function of consolidating the flexible substrate onto the carrier substrate.
  • the thin film can cause the flexible substrate to be fixed on the carrier substrate, and meanwhile, a flexible panel can be obtained by cutting the flexible substrate through the pattern of the thin film. Since the flexible substrate is directly placed on the carrier substrate and not attached with the carrier substrate, the flexible panel resulted from the cutting can be detached directly.
  • a flexible substrate can be fixed on a carrier substrate in good effect and the flexible panel can be easily detached after the manufacture is completed.
  • the pattern of the thin film specifically comprises: a plurality of interlaced horizontal and longitudinal strip-like structures separating the flexible substrate into a plurality of regions, each of the regions corresponding to a flexible panel.
  • the thin film may be a metal thin film.
  • the metal thin film may be formed using a magnetron sputtering process.
  • the patterning process comprises an etching method, which can be a wet-etching.
  • the pattern of the thin film may comprise a gate line structure or a data line structure.
  • the first fixation structure may be an adhesive tape.
  • the thin film may have a thickness of 300-800 nm.
  • the flexible substrate may be a thin glass or resin material substrate.
  • the carrier substrate may be a glass substrate.
  • a flexible substrate attachment structure comprising: a carrier substrate; a flexible substrate pre-fixed on the carrier substrate via a first fixation structure; and a pattern of a thin film on the flexible substrate, the pattern of the thin film contacting at least a part of the flexible substrate and at least a part of the carrier substrate simultaneously.
  • the pattern of the thin film can comprise: a plurality of interlaced horizontal and longitudinal strip-like structures separating the flexible substrate into a plurality of regions, each of the regions corresponding to a flexible panel.
  • the thin film may be a metal thin film.
  • the pattern of the thin film may comprise a gate line structure or a data line structure.
  • FIG. 1 is a flow chart of a flexible substrate attaching method provided by an embodiment of the present disclosure
  • FIG. 2 is a schematic diagram of a flexible substrate attachment structure provided by an embodiment of the present disclosure
  • FIG. 3 is a cross sectional schematic diagram of a flexible substrate attachment structure provided by an embodiment of the present disclosure.
  • a flexible substrate attaching method as provided comprises the following steps: at step S 101 , pre-fixing a flexible substrate 2 on a carrier substrate 1 with a first fixation structure 4 ; at step S 102 , forming a thin film on the flexible substrate 2 , and forming a pattern of the thin film via a patterning process; the pattern of the thin film contacting at least a part of the flexible substrate 2 and at least a part of the carrier substrate 1 simultaneously to play the function of consolidating the flexible substrate 2 onto the carrier substrate 1 .
  • step S 102 the thin film formed on the flexible substrate 2 enables the flexible substrate 2 to be fixed on the carrier substrate 1 , and meanwhile, a flexible panel can be obtained by cutting the flexible substrate 2 through the pattern of the thin film. Since the flexible substrate 2 is directly placed on the carrier substrate 1 and not attached with the carrier substrate 1 , the flexible panel resulted from the cutting can be detached from the carrier substrate 1 directly.
  • the flexible substrate 2 can be fixed on the carrier substrate 1 in good effect and the flexible panel can be easily detached after the manufacture is completed.
  • the pattern of the thin film specifically comprises: a plurality of interlaced horizontal and longitudinal strip-like structures 3 separating the flexible substrate 2 into a plurality of regions 21 , each of the regions 21 corresponding to a flexible panel.
  • the flexible substrate 2 can be fixed to the carrier substrate 1 , and meanwhile, the flexible substrate 2 is cut along an edge of the regions 21 as separated by the strip-like structures 3 , i.e. along the dashed lines as shown in FIG. 2 , by which a part in the flexible substrate 2 corresponding to each region 21 can be cut into a flexible panel.
  • the thin film is a metal thin film.
  • step S 102 the metal thin film is formed using a magnetron sputtering process.
  • the patterning process comprises an etching method, which can be a wet-etching.
  • the pattern of the thin film as formed in step S 102 may further comprise a gate line structure or a data line structure.
  • the thin film has a thickness of 300-800 nm.
  • the first fixation structure 4 can be an adhesive tape, whereby four corners of the flexible substrate 2 can be pre-fixed on the carrier substrate 1 by using the adhesive tape.
  • the flexible substrate 2 is a thin glass or resin material substrate; the carrier substrate 1 is a glass substrate.

Abstract

The present disclosure relates to the technical field of flexible substrate processing, and discloses a flexible substrate attaching method. The flexible substrate attaching method comprises the steps of: pre-fixing a flexible substrate on a carrier substrate with a first fixation structure; forming a thin film on the flexible substrate, and forming a pattern of the thin film via a patterning process; the pattern of the thin film contacting at least a part of the flexible substrate and at least a part of the carrier substrate simultaneously to play the function of consolidating the flexible substrate onto the carrier substrate. In this flexible substrate attaching method, a flexible substrate can be fixed on a carrier substrate and the flexible panel can be detached after the manufacture is completed. The present disclosure further provides a flexible substrate attachment structure.

Description

RELATED APPLICATIONS
The present application is the U.S. national phase entry of PCT/CN2015/072622, with an international filing date of Feb. 10, 2015, which claims the benefit of Chinese Patent Application No. 201410585036.0, filed on Oct. 27, 2014, the entire disclosures of which are incorporated herein by reference.
FIELD
The present disclosure relates to the technical field of flexible substrate processing and, in particular, to a flexible substrate attaching method and a flexible substrate attachment structure.
BACKGROUND
The 21st century is the time of flat panel display in the display field, and among it, flexible display has gained fast growth as the next-generation focus of display technologies. Flexible display is made of a flexible material, which can be deformed, bended, and has the advantages of being slim and light, convenient to carry, etc.
However, a flexible substrate is difficult to process and is thus largely limited in application and development. A general solution to that is to fix a flexible substrate on a rigid carrier substrate before the processing of the flexible substrate. This can realize manufacturing the flexible display using existing devices. However, the prior art flexible substrate attaching processes are relatively complicated and such flexible substrate as manufactured is difficult to get detached after it is completed.
In addition, flexible substrate attaching techniques are generally divided into mechanical attaching and spin coating attaching. The former is easy and convenient for detachment, but more difficult for fixation on the carrier substrate; the latter is not easy for detachment of the completed flexible substrate from the carrier substrate. Therefore, there is a need for providing a relatively simple and readily achievable flexible substrate attaching method in the field.
SUMMARY
In a first aspect of the present disclosure, a flexible substrate attaching method is provided, by which method a flexible substrate can be fixed on a carrier substrate in good effect and the flexible panel can be easily detached after the manufacture is completed.
In order to achieve the object, an embodiment of the present disclosure provides a flexible substrate attaching method, which method may comprise the steps of: pre-fixing a flexible substrate on a carrier substrate with a first fixation structure; forming a thin film on the flexible substrate, and forming a pattern of the thin film via a patterning process; the pattern of the thin film contacting at least a part of the flexible substrate and at least a part of the carrier substrate simultaneously to play the function of consolidating the flexible substrate onto the carrier substrate.
In the above flexible substrate attaching method, the thin film can cause the flexible substrate to be fixed on the carrier substrate, and meanwhile, a flexible panel can be obtained by cutting the flexible substrate through the pattern of the thin film. Since the flexible substrate is directly placed on the carrier substrate and not attached with the carrier substrate, the flexible panel resulted from the cutting can be detached directly.
Therefore, by using the above flexible substrate attaching method, a flexible substrate can be fixed on a carrier substrate in good effect and the flexible panel can be easily detached after the manufacture is completed.
According to an embodiment of the present disclosure, the pattern of the thin film specifically comprises: a plurality of interlaced horizontal and longitudinal strip-like structures separating the flexible substrate into a plurality of regions, each of the regions corresponding to a flexible panel.
According to another embodiment of the present disclosure, the thin film may be a metal thin film.
According to a further embodiment of the present disclosure, the metal thin film may be formed using a magnetron sputtering process.
According to a yet further embodiment of the present disclosure, the patterning process comprises an etching method, which can be a wet-etching.
According to an embodiment of the present disclosure, the pattern of the thin film may comprise a gate line structure or a data line structure.
According to another embodiment of the present disclosure, the first fixation structure may be an adhesive tape.
According to a further embodiment of the present disclosure, the thin film may have a thickness of 300-800 nm.
According to a yet further embodiment of the present disclosure, the flexible substrate may be a thin glass or resin material substrate.
According to an embodiment of the present disclosure, the carrier substrate may be a glass substrate.
In a second aspect of the present disclosure, a flexible substrate attachment structure is provided, comprising: a carrier substrate; a flexible substrate pre-fixed on the carrier substrate via a first fixation structure; and a pattern of a thin film on the flexible substrate, the pattern of the thin film contacting at least a part of the flexible substrate and at least a part of the carrier substrate simultaneously.
According to an embodiment of the present disclosure, the pattern of the thin film can comprise: a plurality of interlaced horizontal and longitudinal strip-like structures separating the flexible substrate into a plurality of regions, each of the regions corresponding to a flexible panel.
According to another embodiment of the present disclosure, the thin film may be a metal thin film.
According to a further embodiment of the present disclosure, the pattern of the thin film may comprise a gate line structure or a data line structure.
BRIEF DESCRIPTION OF THE DRAWINGS
Other objectives and features of the present disclosure will become apparent from the following detailed description considered in conjunction with the accompanying drawings. However, it should be understood that each of the drawings is shown for an illustrative rather than restrictive purpose, and they are not necessarily drawn to scale. In the drawings,
FIG. 1 is a flow chart of a flexible substrate attaching method provided by an embodiment of the present disclosure;
FIG. 2 is a schematic diagram of a flexible substrate attachment structure provided by an embodiment of the present disclosure;
FIG. 3 is a cross sectional schematic diagram of a flexible substrate attachment structure provided by an embodiment of the present disclosure.
Therein, the same components are denoted with the same reference signs throughout the drawings.
DETAILED DESCRIPTION
In the following the technical solutions in embodiments of the present disclosure will be described clearly and thoroughly in conjunction with the drawings in the embodiments of the present disclosure. It is evident that the described embodiments are only a part of rather than all embodiments of the present disclosure. Based on the embodiments of the present disclosure, all the other embodiments an ordinarily skilled in the art can obtain without making an inventive effort belong to the scope of the present disclosure.
Reference is now made to FIG. 1, FIG. 2 and FIG. 3. As shown in FIG. 1, a flexible substrate attaching method as provided comprises the following steps: at step S101, pre-fixing a flexible substrate 2 on a carrier substrate 1 with a first fixation structure 4; at step S102, forming a thin film on the flexible substrate 2, and forming a pattern of the thin film via a patterning process; the pattern of the thin film contacting at least a part of the flexible substrate 2 and at least a part of the carrier substrate 1 simultaneously to play the function of consolidating the flexible substrate 2 onto the carrier substrate 1.
In the above flexible substrate attaching method, in step S102, the thin film formed on the flexible substrate 2 enables the flexible substrate 2 to be fixed on the carrier substrate 1, and meanwhile, a flexible panel can be obtained by cutting the flexible substrate 2 through the pattern of the thin film. Since the flexible substrate 2 is directly placed on the carrier substrate 1 and not attached with the carrier substrate 1, the flexible panel resulted from the cutting can be detached from the carrier substrate 1 directly.
Therefore, by using the above flexible substrate attaching method, the flexible substrate 2 can be fixed on the carrier substrate 1 in good effect and the flexible panel can be easily detached after the manufacture is completed.
As shown in FIG. 2, the pattern of the thin film specifically comprises: a plurality of interlaced horizontal and longitudinal strip-like structures 3 separating the flexible substrate 2 into a plurality of regions 21, each of the regions 21 corresponding to a flexible panel.
In the pattern of the thin film, by attaching both ends of the plurality of horizontal and longitudinal strip-like structures 3 to the edges of the carrier substrate 1, the flexible substrate 2 can be fixed to the carrier substrate 1, and meanwhile, the flexible substrate 2 is cut along an edge of the regions 21 as separated by the strip-like structures 3, i.e. along the dashed lines as shown in FIG. 2, by which a part in the flexible substrate 2 corresponding to each region 21 can be cut into a flexible panel.
In addition, the thin film is a metal thin film.
In particular, in step S102, the metal thin film is formed using a magnetron sputtering process.
In addition, in step S102, the patterning process comprises an etching method, which can be a wet-etching.
In particular, the pattern of the thin film as formed in step S102 may further comprise a gate line structure or a data line structure.
In particular, the thin film has a thickness of 300-800 nm.
In particular, in step S101, the first fixation structure 4 can be an adhesive tape, whereby four corners of the flexible substrate 2 can be pre-fixed on the carrier substrate 1 by using the adhesive tape.
In particular, the flexible substrate 2 is a thin glass or resin material substrate; the carrier substrate 1 is a glass substrate.
It is evident that those skilled in the art can make various modifications and variations to the embodiments of the present disclosure without departing from the spirit and the scope of the present invention. In this case, if these modifications and variations belong to the scope of the appended claims and their equivalent technologies, the present disclosure is intended to cover these modifications and variations.

Claims (14)

The invention claimed is:
1. A flexible substrate attaching method comprising the steps of:
pre-fixing a flexible substrate on a carrier substrate with a first fixation structure;
forming a thin film on the flexible substrate, and forming a pattern of the thin film via a patterning process; the pattern of the thin film contacting at least a part of the flexible substrate and at least a part of the carrier substrate simultaneously to play the function of consolidating the flexible substrate onto the carrier substrate.
2. The flexible substrate attaching method according to claim 1, wherein the pattern of the thin film comprises: a plurality of interlaced horizontal and longitudinal strip-like structures separating the flexible substrate into a plurality of regions, each of the regions corresponding to a flexible panel.
3. The flexible substrate attaching method according to claim 1, wherein the thin film is a metal thin film.
4. The flexible substrate attaching method according to claim 3, wherein the metal thin film is formed using a magnetron sputtering process.
5. The flexible substrate attaching method according to claim 3, wherein the patterning process comprises an etching method, which is a wet-etching.
6. The flexible substrate attaching method according to claim 2, wherein the pattern of the thin film further comprises a gate line structure or a data line structure.
7. The flexible substrate attaching method according to claim 1, wherein the first fixation structure is an adhesive tape.
8. The flexible substrate attaching method according to claim 1, wherein the thin film has a thickness of 300-800 nm.
9. The flexible substrate attaching method according to claim 1, wherein the flexible substrate is a thin glass or resin material substrate.
10. The flexible substrate attaching method according to claim 1, wherein the carrier substrate is a glass substrate.
11. A flexible substrate attachment structure, comprising:
a carrier substrate;
a flexible substrate pre-fixed on the carrier substrate via a first fixation structure; and
a pattern of a thin film on the flexible substrate, the pattern of the thin film contacting at least a part of the flexible substrate and at least a part of the carrier substrate simultaneously.
12. The flexible substrate attachment structure according to claim 11, wherein the pattern of the thin film comprises: a plurality of interlaced horizontal and longitudinal strip-like structures separating the flexible substrate into a plurality of regions, each of the regions corresponding to a flexible panel.
13. The flexible substrate attachment structure according to claim 11, wherein the thin film is a metal thin film.
14. The flexible substrate attachment structure according to claim 12, wherein the pattern of the thin film further comprises a gate line structure or a data line structure.
US14/761,986 2014-10-27 2015-02-10 Flexible substrate attaching method and flexible substrate attachment structure Active 2035-03-19 US9544995B2 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
CN201410585036.0A CN104319240B (en) 2014-10-27 2014-10-27 A kind of flexible base board attaching method
CN201410585036 2014-10-27
CN201410585036.0 2014-10-27
PCT/CN2015/072622 WO2016065772A1 (en) 2014-10-27 2015-02-10 Flexible substrate attaching method and flexible substrate attaching structure

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US9544995B2 true US9544995B2 (en) 2017-01-10

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CN104319240B (en) 2014-10-27 2017-06-23 京东方科技集团股份有限公司 A kind of flexible base board attaching method
DE102015213275A1 (en) * 2015-07-15 2017-01-19 Carl Zeiss Smt Gmbh Mirror assembly for a lithographic exposure system and mirror assembly comprehensive optical system
CN105271790A (en) * 2015-11-18 2016-01-27 湖南普照爱伯乐平板显示器件有限公司 Manufacturing method for flexible glass

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