WO2016060372A1 - Capteur de peau biomimétique multisensoriel - Google Patents

Capteur de peau biomimétique multisensoriel Download PDF

Info

Publication number
WO2016060372A1
WO2016060372A1 PCT/KR2015/008804 KR2015008804W WO2016060372A1 WO 2016060372 A1 WO2016060372 A1 WO 2016060372A1 KR 2015008804 W KR2015008804 W KR 2015008804W WO 2016060372 A1 WO2016060372 A1 WO 2016060372A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
stimulus
signal
micro
substrate
Prior art date
Application number
PCT/KR2015/008804
Other languages
English (en)
Korean (ko)
Inventor
김민석
박연규
장진석
김종호
양태헌
방창현
Original Assignee
한국표준과학연구원
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 한국표준과학연구원 filed Critical 한국표준과학연구원
Publication of WO2016060372A1 publication Critical patent/WO2016060372A1/fr

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D21/00—Measuring or testing not otherwise provided for
    • G01D21/02—Measuring two or more variables by means not covered by a single other subclass
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
    • G01B21/32—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring the deformation in a solid
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
    • G01H17/00—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves, not provided for in the preceding groups
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K13/00—Thermometers specially adapted for specific purposes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L5/00—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes

Definitions

  • the present invention relates to a biomimetic skin sensor for sensing the sense of touch, and more particularly, to a skin sensor for sensing the touch of various aspects by simulating the operating principle of the human tactile organ and the mechanical properties of the skin.
  • tactile interaction development technology which is a very important sensation, can be used directly in the field of infrastructure, such as life support robots, defenses working in extreme situations, and robots for exploration, as well as in the manufacturing and medical industries.
  • it is evaluated as a technology that can provide various activities in the virtual environment similar to the real world.
  • Human tactile object grasping process includes texture measurement through rubbing motion, hardness and stiffness by applying pressure, and measuring the temperature of an object by maintaining contact with the object by statically holding the object. There are various methods such as measuring the weight. Therefore, in order to develop a biomimetic tactile sensor, a mechanism analysis between the measured physical quantity and the tactile sense is necessary.
  • a multi-axis force sensor that can detect the vertical force and the degree of sliding, that is shear force and a flexible temperature sensor that can measure the thermal conductivity is required. Therefore, in order to develop a biomimetic tactile sensor having such a function, a sensor fusion technology is required.
  • sensors that detect various physical quantities such as human skin
  • electronic circuits for acquiring and processing data from distributed sensors must be mounted in artificial electronic skin. If not, signal lines of many sensors must be present, which makes processing difficult.
  • the present invention has been made to solve the above-mentioned conventional problems, and an object thereof is to provide a user with a tactile sensor that mimics the skin structure of the human body.
  • the object of the present invention is to provide a user with a soft and flexible tactile sensor such as human skin and excellent repeatability of force or pressure measurement.
  • an object of the present invention is to provide a user with a tactile sensor capable of measuring various types of tactile sensations caused by a single stimulus.
  • an object of the present invention is to provide a user with a tactile sensor that senses the sense of touch by a method in which the human body senses the sense of touch by simulating the operating principle of the human tactile organ and the mechanical characteristics of the skin.
  • Biomimetic multisensory skin sensor for realizing the above object is a first layer for receiving an external stimulus applied to the upper surface; A second layer attached to a bottom surface of the first layer; A third layer attached to the bottom surface of the second layer; A fourth layer attached to the bottom surface of the third layer; And a controller configured to generate tactile information about the stimulus, wherein the stimulus received by the first layer is delivered to the second layer, and the stimulus delivered to the second layer is delivered to the third layer.
  • the stimulus delivered to the third layer is delivered to the fourth layer, the second layer senses the stimulus delivered to the second layer to generate a first signal, and the fourth layer is directed to the fourth layer.
  • Sensing the transmitted stimulus to generate a second signal wherein the stimulus sensed by the second layer comprises a pressure stimulus, wherein the stimulus sensed by the fourth layer comprises at least one of a sliding stimulus, a temperature stimulus, a vibration stimulus, and a modified stimulus.
  • the control unit may generate one of the tactile information by using the first signal and the second signal.
  • a plurality of protrusions may be formed on an upper surface of the first layer.
  • the second layer may have a plurality of first micro fines formed on the first substrate, and the metal thin film may be formed on the surfaces of the plurality of first micro fines and the surface of the first substrate on which the plurality of first micro fines are formed.
  • the first connection member is formed; And a plurality of second micro fine fibers formed on a second substrate in contact with the plurality of first micro cilia, the surfaces of the plurality of second micro cilia and the surface of the second substrate on which the plurality of second micro cilia are formed.
  • a second connecting member having a metal thin film formed thereon, wherein the warp is generated in the first substrate by the magnetic pole transmitted through the first layer, and the plurality of first microfilaments and the An area in which a plurality of second micro-cilia contact each other is different, and the stimulus may be detected by measuring a resistance change value between the first substrate and the second substrate according to the changed area.
  • the plurality of first micro fine fibers and the plurality of second micro fine fibers are formed with a diameter of 50 to 300 nm and a height of 600 nm to 5 ⁇ m, and the first and second substrates have a diameter of 5 to 50 ⁇ m. It may be formed in a thickness.
  • the metal thin film may be formed of any one selected from the group consisting of platinum, aluminum, copper, silver, and gold.
  • the plurality of first micro fine fibers may be formed in a vertical direction with respect to the first substrate, and the plurality of second micro fine fibers may be formed in a vertical direction with respect to the second substrate.
  • the plurality of first substrates and the plurality of second substrates may be formed of poly ethylene terephthalate (PET).
  • PET poly ethylene terephthalate
  • the plurality of first micro-cili and the plurality of second micro-cili may be formed of any one of Poly Urethane Acrylate (PUA), Poly Styrene (PS), and Poly Methyl Meth Acrylate (PMMA).
  • PPA Poly Urethane Acrylate
  • PS Poly Styrene
  • PMMA Poly Methyl Meth Acrylate
  • the apparatus may further include a sealing layer sealing the first connection member and the second connection member.
  • the sealing layer may be formed of polydimethylsiloxane (PDMS).
  • PDMS polydimethylsiloxane
  • the sealing layer may be a thickness of 5 to 500 ⁇ m.
  • the sealing layer covers the side surfaces of the first connecting member and the second connecting member, and the lower surface of the first connecting member except one end or both ends of the first connecting member and the second connecting member in the longitudinal direction. It may be formed to cover the upper surface of the second connecting member.
  • the third layer may also be a stretchable polymer material.
  • the fourth layer may further include a semiconductor strain gauge in which a plurality of units are formed in a predetermined array pattern and deformed by force or pressure; A pair of polymer film layers in which the film faces contact each other and include the semiconductor strain gauge between the contact film faces; Forming an upper and lower surfaces of the insulating layer using any one of the polymer film layer as an insulating layer and connected to each unit of the array pattern to form an electrode and to draw out the deformation signal output by the deformation of each unit to the outside A circuit board having a pair of signal line layers; And a pair of elastomer layers formed on both sides of the circuit board so that the circuit board is included therein, wherein the pair of signal line layers comprises a plurality of first signal lines arranged in one direction on one surface of the insulating layer.
  • a plurality of second signal lines arranged perpendicularly to the one direction on the other surface of the insulating layer, wherein the unit has a resistance change based on the force or pressure, and the deformation signal is output based on the resistance change.
  • the pair of polymer film layers may be a pair of polyimide thin film layers.
  • each unit may have a rod shape
  • the array pattern may have a pattern having the same length direction as the rod shape
  • circuit boards may be provided, and each unit corresponding to each of the circuit boards may overlap each other so that the two circuit boards may be bonded together.
  • the pair of elastomer layers are uniformly formed with a plurality of protrusions on the surface of any one of the elastomer layer, the array pattern is a pattern arranged so as to face in all directions below the boundary line between the protrusions and the surface Can be.
  • the first signal line and the second signal line constitute a CMOS circuit, and the first signal line has a P-MOSPET which allows a constant current to flow through the first signal line, and the circuit board is provided with each of the second signal lines.
  • the apparatus may further include a switch controller configured to sequentially scan each of the second signal lines so that a current flows in any one of the second signal lines by controlling the plurality of switches connected to the end and the switches.
  • the pair of signal line layers may be formed by being transferred by metal deposition or a CMOS process.
  • the pair of elastomer layers may be a pair of poly-dimethylsiloxane layers.
  • the fourth layer may include a stretchable temperature sensor to detect the temperature stimulus.
  • the arm associated with an embodiment of the present invention for realizing the above-described object is an arm for generating tactile information from a stimulus using a sensor
  • the distal end of the arm has a finger shape
  • the sensor is attached to the distal end, the sensor includes a first layer for receiving the stimulus applied to the upper surface; A second layer attached to a bottom surface of the first layer; A third layer attached to the bottom surface of the second layer; A fourth layer attached to the bottom surface of the third layer; And a controller configured to generate the tactile information about the stimulus, wherein the stimulus received by the first layer is delivered to the second layer, and the stimulus delivered to the second layer is delivered to the third layer.
  • the stimulus delivered to the third layer is delivered to the fourth layer, and the second layer senses the stimulus delivered to the second layer to generate a first signal, wherein the fourth layer is the fourth layer.
  • a second signal is generated by sensing the stimulus transmitted to the second layer, and the stimulus detected by the second layer includes a pressure stimulus, and the stimulus detected by the fourth layer includes a sliding stimulus, a temperature stimulus, a vibration stimulus, and a modified stimulus. It includes at least one, and the control unit may generate the tactile information by using the first signal and the second signal.
  • control unit may be mounted inside the distal end having the finger shape.
  • the stimulus detected in the step may include at least one of a sliding stimulus, a temperature stimulus, a vibration stimulus, and a strain stimulus.
  • the second layer may have a plurality of first micro fines formed on the first substrate, and a metal thin film may be formed on the surfaces of the plurality of first micro fines and the surface of the first substrate on which the plurality of first micro fines are formed.
  • a first connecting member formed and a plurality of second micro fine fibers formed on a second substrate in contact with the plurality of first micro fine fibers, wherein surfaces of the plurality of second micro fine fibers and the plurality of second micro fine fibers are formed
  • a second connection member having a metal thin film formed on a surface of the second substrate,
  • warpage is generated in the first substrate by the magnetic pole transmitted through the first layer, and the plurality of first micro fine threads and the plurality of second micro fine fibers are formed by the generated warpage.
  • the contact area varies, and the stimulus may be sensed by measuring a resistance change value between the first substrate and the second substrate according to the changed area.
  • the third layer is a stretchable polymer material
  • the fifth step may deliver a stimulus delivered to the third layer using the stretchable polymer material.
  • the fourth layer may further include a semiconductor strain gauge in which a plurality of units are formed in a predetermined array pattern and deformed by force or pressure; A pair of polymer film layers in which the film faces contact each other and include the semiconductor strain gauge between the contact film faces; Forming an upper and lower surfaces of the insulating layer using any one of the polymer film layer as an insulating layer and connected to each unit of the array pattern to form an electrode and to draw out the deformation signal output by the deformation of each unit to the outside A circuit board having a pair of signal line layers; And a pair of elastomer layers formed on both sides of the circuit board so that the circuit board is included therein, wherein the pair of signal line layers comprises a plurality of first signal lines arranged in one direction on one surface of the insulating layer.
  • the sixth step may detect at least one of the sliding stimulus, the vibration stimulus, and the modified stimulus by using the resistance change.
  • the present invention has been made to solve the conventional problems as described above, it can provide a user with a tactile sensor that mimics the skin structure of the human body.
  • 1 is a diagram showing a tactile receptor distributed in human skin.
  • 2 is an output curve of a neuron (receptor) according to a stimulus.
  • FIG 3 is a cross-sectional view of a biomimetic skin sensor according to an embodiment of the present invention.
  • Figure 4 shows the top surface of the first layer of the biomimetic skin sensor is formed projections that mimic the fingerprint according to an embodiment of the present invention.
  • FIG. 5 is a configuration diagram for explaining a reversible electrical connector according to an embodiment of the present invention.
  • FIG. 6 is a schematic diagram for explaining a reversible electrical connector according to an embodiment of the present invention.
  • FIG 7 and 8 are schematic diagrams for explaining the coupling of the connection member according to an embodiment of the present invention.
  • Figure 9 is a schematic diagram for explaining the detachment of the reversible electrical connector according to an embodiment of the present invention.
  • FIG. 10 is a graph illustrating a change in the coupling force according to the number of cycles of the electrical connector according to an embodiment of the present invention.
  • 11 is a graph for explaining the correlation of the shear adhesive force according to the thickness of the metal thin film provided in the electrical connector according to an embodiment of the present invention.
  • FIG. 12 is a graph for explaining the correlation of the current density according to the thickness of the metal thin film provided in the electrical connector according to an embodiment of the present invention.
  • Figure 13 is a photograph showing the flexibility of the electrical connector according to an embodiment of the present invention.
  • FIG. 14 is a schematic flowchart illustrating a method of using a reversible electrical connector according to an embodiment of the present invention.
  • 15 is a configuration diagram illustrating a multifunction sensor according to an embodiment of the present invention.
  • FIG. 16 is a partially enlarged perspective view illustrating a motion according to pressure applied to a multifunctional sensor according to the present invention.
  • 17 and 18 are schematic diagrams showing data detected by the multifunctional sensor according to the present invention.
  • 19 to 21 are graphs for explaining the correlation between pressure, shear force, torsion and resistance applied to the multifunctional sensor of the present invention.
  • FIG. 22 is a schematic diagram illustrating a cycle process of a multifunctional sensor according to the present invention.
  • 24 is a graph for explaining the correlation of the strain acting on the multifunction sensor of the present invention.
  • 25 is a flowchart illustrating a method of manufacturing a multifunctional sensor according to the present invention.
  • 26 is a perspective view showing one embodiment of a force or pressure sensor array using the present invention strain gauge
  • FIG. 27 is an exploded perspective view in which the force or pressure sensor array shown in FIG. 26 is decomposed into a layer configuration.
  • FIG. 28 is a cross-sectional view illustrating a cross section along the A-A direction in FIG. 1A.
  • 29 is a circuit diagram illustrating a first signal line and a second signal line, a switch, and a switch controller in a circuit board according to an embodiment of the present invention.
  • FIG. 30 is a flowchart sequentially showing an embodiment of a method of manufacturing a force or pressure sensor array using the present invention strain gauge.
  • 31 to 34 are process cross-sectional views sequentially illustrating a process of manufacturing a semiconductor strain gauge in one configuration of a force or pressure sensor array using the semiconductor strain gauge according to the present invention.
  • 35 is a perspective view showing a state of transferring a semiconductor strain gauge in the method of manufacturing a force or pressure sensor array using the semiconductor strain gauge of the present invention.
  • FIG. 36 is a perspective view illustrating a state in which a semiconductor strain gauge is transferred to a carrier wafer layer in a method of manufacturing a force or pressure sensor array using the semiconductor strain gauge according to the present invention.
  • FIG. 37 is a perspective view illustrating a state in which a plurality of signal lines are arranged in a method of manufacturing a force or pressure sensor array using a semiconductor strain gauge according to the present invention.
  • 38 is a flowchart sequentially illustrating a force or pressure measuring method using the present force or pressure sensor array.
  • FIG. 39 is a plan view briefly showing an array pattern in which rod-shaped units are cross-shaped as a first modification of the force or pressure sensor array using the semiconductor strain gauge according to the present invention.
  • FIG 40 is a plan view showing a state in which a protrusion structure is formed on the array pattern as a second modified example of the force or pressure sensor array using the semiconductor strain gauge of the present invention.
  • FIG. 41 is a cross-sectional view illustrating a cross section taken along the B-B direction of FIG. 40.
  • biomimetic skin sensor according to an embodiment of the present invention is attached to a finger frame of a bionic arm.
  • 43 is a flowchart illustrating a tactile signal sensing method according to an embodiment of the present invention.
  • Human skin is considered to be the most ideal tactile sensor and is mechanically robust, flexible, and stretchable, with high sensitivity, high spatial resolution, texture, hardness, vibration, and temperature. Can detect force, pressure, slip at the same time.
  • the finger has the highest density of the tactile receptors, so it is possible to detect various tactile stimuli in detail, so that precise work is possible and the object can be identified only by the touch.
  • 1 is a diagram showing a tactile receptor distributed in human skin.
  • the human skin has receptors according to the modality of the stimulus, and the stimuli to which they respond are also different.
  • Meissner (A) and Merkel (B) bodies are close to the epidermal layer and very densely distributed and used to obtain a very fine touch.
  • the Meissner (A) body is a fast responding body that detects micro-vibrations that occur when a user rubs an object with a finger or detects local micro-pressure changes that occur when a worm moves on a finger.
  • the Merkel (B) body is a slowly reacting body that, when in contact with an object, is sensitive to the spatial characteristics of the object (eg, corners, curved surfaces, pointed protrusions) and plays a large role in inferring the shape of the object. .
  • FIG. 2 is an output curve of a neuron (receptor) according to a stimulus
  • Merkel body generates an output proportional to the magnitude of a stimulus when a stimulus larger than a predetermined threshold is entered as shown in FIG. see.
  • Pacinian (D) and Ruffini (E) bodies located in the dermal layer deep in the skin have a low distribution density and the stimulus applied to the epidermis passes through the viscoelastic dermis.
  • Pacinian (D) bodies are fast responding bodies that respond to the overall sense of vibration.
  • the most sensitive frequency bands for Pachinian bodies are 200-300 Hz.
  • Ruffini (E) is a slow-adapting body that has a large detection area and detects elongation of the skin and slipping at the fingertips.
  • the Lupine body has a correlation of the transmitted force and output as shown in FIG.
  • human skin has different receptors in the epidermal and dermal layers, and the body adapts differently to the same layer, thus providing various modalities to the cerebrum.
  • the conventional tactile sensor was able to detect each of the senses such as force, pressure, temperature, slip during touch, but could not detect a variety of tactile sensations according to one stimulus, and the structure of the sensor is different from the structure of the human skin There was a problem in that the sense of touch cannot be detected in a manner of sensing the sense of touch.
  • FIG 3 is a cross-sectional view of a biomimetic skin sensor according to an embodiment of the present invention.
  • FIG. 3 since the components shown in FIG. 3 are not essential, a biomimetic skin sensor having more components or fewer components may be implemented.
  • the biomimetic skin sensor may have an appearance such as a fingertip of a human body, and may include a first layer 1000, a second layer 2000, a third layer, a fourth layer 4000, and a controller 5000. And the like.
  • the first layer 1000 is located on the outermost surface of the biomimetic skin sensor and directly receives an external stimulus and attaches the received stimulus to the second layer 2000 attached to the lower surface of the first layer 1000. It is a configuration to convey.
  • the first layer 1000 mimics the epidermis in the structure of the human skin
  • the first layer 1000 may be made of a material similar to the epidermis.
  • the upper surface of the first layer 1000 may include a material that mimics human hair in order to mimic not only the fingertips but also the skin of other parts.
  • the fingerprint formed on the hand of the human body serves to prevent the object from slipping on the surface of the skin and to sensitive the sense of touch.
  • the vibration is generated according to the state of the object surface to which the stimulus is applied.
  • Figure 4 shows the top surface of the first layer of the biomimetic skin sensor is formed projections that mimic the fingerprint according to an embodiment of the present invention.
  • a protrusion that mimics a fingerprint may be formed on an upper surface of the first layer 1000.
  • the biomimetic skin sensor can receive stimuli similar to the human skin.
  • the second layer 2000 is attached to the lower surface of the first layer 1000 and receives a stimulus through the first layer 1000.
  • the stimulus received from the first layer 1000 is sensed to generate a signal of the detected stimulus.
  • the second layer 2000 is located below the first layer 1000 to simulate the Merkel body and Meissner body distributed at high density in the epidermal layer of human skin.
  • the pressure stimulus of the stimulus received through the first layer 1000 such as Merkel body and Meissner body for sensing the sense of pressure can be detected.
  • Resistance-based pressure sensors of nanostructures can be used to detect this pressure.
  • FIG. 5 is a configuration diagram for explaining a reversible electrical connector according to an embodiment of the present invention.
  • a reversible electrical connector according to an embodiment of the present invention includes a first connection member 2100 and a second connection member 2200.
  • the first connection member 2100 includes a first substrate 2110 and a first micro fine structure 2120 formed on the first substrate 2110.
  • the first micro-ciliary structure 2120 may include a first micro-cilia 2122 formed on the first substrate 2110, a surface of the first micro-cilia 2122, and a first micro-cilia 2122. It is composed of a metal thin film 2126 formed on the surface of the first substrate 2110.
  • the second connection member 2200 is similar in shape to the first connection member 2100, and has a second substrate (not shown in contact with the second substrate 2210 and the first micro fine structure 2120). And a second microciliary structure 2220 formed on 2210.
  • the second micro-ciliary structure 2220 is formed on the second substrate 2210 so as to be in contact with the first micro-cilia 2122 to exhibit adhesive force, and the second micro-ciliar
  • the metal thin film 2226 is formed on the surface of the 2222 and the surface of the second substrate 2210 on which the second fine cilia 2222 are formed.
  • the metal thin films 2126 and 2226 may be formed on front surfaces of the first substrate 2110 and the second substrate 2210.
  • a wire is connected to the metal thin film 2126 formed on the first connecting member 2100 and the metal thin film 2 226 formed on the second connecting member 2200 to communicate electricity.
  • the first substrate 2110 and the second substrate 2210 may be made of various materials, but it is preferable to use a polymer resin having a flexible property capable of forming fine cilia by a method such as imprint lithography or capillary lithography. Do.
  • the first substrate 2110 and the second substrate 2210 may be manufactured using a polyethylene terephthalate (PET) material or the like.
  • the first and second fine cilia 2122 and 2222 are ultraviolet polymers such as polyurethane acrylate (PUA: Poly Urethane Acrylate), polystyrene (PS: PolyStyrene) polymer, or polymethyl methacrylate (Poly). It is preferable to form with a polymer such as acrylic resin such as Methyl Meth Acrylate (PMMA).
  • PMMA Polymethyl methacrylate
  • the first and second fine fibers 2122 and 2222 formed of such a material are preferably manufactured by UV lithography, nanoimprint lithography, capillary lithography, or the like. In addition, any method can be used as long as it is possible to make small structures.
  • the metal thin film is preferably formed by using a plasma coating method on the surface of the first fine cilia 2122 and the second fine cilia 2222.
  • FIG. 6 is a schematic diagram for explaining a reversible electrical connector according to an embodiment of the present invention.
  • the electrical connector of the present invention is coupled in such a manner as to contact two connecting members 2100 and 2200 each having the same or similar fine cilia formed thereon. Therefore, the first connection member 2100 including the first substrate 2110 and the first micro fine structure 2120, and the second connection including the second substrate 2210 and the second micro fine structure 2220.
  • the members 2200 may have the same shape as each other. That is, the lengths, aspect ratios, thicknesses, directions of the fine cilia formed on the substrate, and the thickness of the metal thin film may be different from each other in the first and second fine cilia structures 2120 and 2130. The same is true in that a metal thin film is used.
  • the first and second fine cilia 2122 and 2222 are fine cilia structures having diameters and heights of a micrometer ( ⁇ m) size or a nanometer (nm) size, each having a diameter equal to each other. It may be formed, preferably 50 nm in diameter, 1 ⁇ m in height is preferred.
  • the first fine cilia 2122 are formed on the first substrate 2110, and more specifically, the fine cilia 2122 may be formed in a direction perpendicular to or inclined with respect to the first substrate 2110. have.
  • the connecting members in contact with each other are in contact with each other in the direction parallel to each other micro fine cilia. Therefore, it is better to select both connecting members in consideration of the inclined direction.
  • the first substrate 2110 may be used.
  • the first connecting member 2100 is coupled to the second connecting member 2200.
  • This van der Waals force is precisely when the first connecting member 2100 and the second connecting member 2200 are coupled to each other in the reversible electrical connector of the present invention, precisely the first fine cilia 2122 of the first connecting member 2100.
  • the second fine cilia 2222 of the second connection member 2200 are in contact with each other.
  • the first micro-ciliary structure 2120 and the second micro-ciliary structure 2220 Occurs when the interlocking shape (engagement shape) or when the sides of the structure come into contact with each other.
  • the contact area between the first microciliary structure 2120 and the second microciliar structure 2220 it is preferable to increase the contact area between the first microciliary structure 2120 and the second microciliar structure 2220. Therefore, when the contact is applied to the first substrate or the second substrate by applying a pressure to form the first micro fine structure 2120 and the second micro fine structure 2220 to each other to increase the contact area to implement a strong adhesive force Can be.
  • the first connection member 2100 and the second connection member 2200 bonded as described above have almost no noise when detaching as compared to a conventional electrical connector, and can be easily detached using an average elementary school student or more.
  • FIG. 7 and 8 are schematic diagrams for explaining the electrical connection of the reversible electrical connector according to an embodiment of the present invention.
  • Figure 9 is a schematic diagram for explaining the detachment of the reversible electrical connector according to an embodiment of the present invention.
  • the reversible electric connector first performs an operation of coupling the first connection member 2100 and the second connection member 2200 for electrical connection.
  • the first micro-cilia of the first connecting member 2100 and the second micro-cilia of the second connecting member 2200 are composed of a plurality of micro-cilia having the same arrangement.
  • first microciliary structure 2120 and the second microciliar structure 2220 bond and bond with each other so that the microciliary structures having the same arrangement do not overlap each other.
  • the first connecting member 2100 is formed by the coupling force due to van der Waals forces.
  • the second connection member 2200 are not detached.
  • the side of the first micro-ciliary structure 2120 is in close contact with the side of the second micro-ciliary structure 2220 (interlocking) in the process of applying the shear force, the bonding force is further improved and thus withstands high pressure. It becomes possible.
  • connection member 2100 and the second connection member 2200 are combined with a high tensile strength.
  • Figure 9 is a schematic diagram for explaining the detachment of the reversible electrical connector according to an embodiment of the present invention.
  • the first connecting member 2100 and the second connecting member 2200 are detached from each other by applying a predetermined force to one end of the second connecting member 2200. 1 performs a process of removing from the connecting member (2100). That is, when one end of the second connecting member 2200 (or the first connecting member 2100) is pulled in the upper direction instead of the lateral direction, the adhesive is released starting with the A portion, and the second connecting member 2200 is released. ) Is detached from the first connection member 2100.
  • the reversible electrical connector according to the present invention is a force required for the detachment of the first connecting member 2100 and the second connecting member 2200 coupled while maintaining the van der Waals force induced up to 38N / cm2 This is only 0.02 N / cm 2.
  • the metal thin film 2126 of the first connecting member 2100 and the metal thin film 2226 of the second connecting member 2200 may be coated with a metal material having a thickness of 5 to 30 nm on the surface of the fine cilia. Can be formed.
  • a metal material such as platinum (Pt), aluminum (Al), copper (Cu), silver (Ag), and gold (Au) may be used as the metal material, but the electrical conductivity, durability, and corrosion resistance are excellent. It is preferable to use platinum (Pt).
  • the thickness of the metal thin film when the thickness of the metal thin film is formed to be less than 5 nm, not only the original function of the electrical connector may be degraded, but also the coupling force decreases as the cycle of the coupling / separation process is repeated many times.
  • the thickness of the metal thin film is formed to exceed 30nm, the diameter of the micro-ciliary structure increases, and thus the bonding force between the first micro-ciliary structure 2120 and the second micro-ciliar structure 2130 is reduced.
  • FIG. 10 is a graph for explaining a change in the coupling force according to the cycle number of the electrical connector according to an embodiment of the present invention.
  • 11 and 12 are graphs for explaining the correlation between the shear adhesive force and the current density according to the thickness of the metal thin film provided in the electrical connector according to an embodiment of the present invention.
  • shear adhesion forces acting between the first and second microcilia coated with platinum at a thickness of 0 nm, 5 nm, 10 nm, 20 nm, and 30 nm in sequence.
  • the thicker the silver coated platinum the lower the thickness.
  • the shear adhesion force that can maintain the bonded state between the first and second microcilia even after interlocking with each other.
  • the first and second micro-cilia coated with platinum in the thickness of 5nm, 10nm, 20nm has a lower electrical resistance than the conventional connection technology.
  • Figure 13 is a photograph showing the flexibility of the electrical connector according to an embodiment of the present invention.
  • the electrical connector according to the present invention is composed of a polymer resin having a flexible property of the first substrate, the second substrate, the first microciliar, and the second microciliar, and the metal thin film has a nanometer thickness. Since it is configured to hold both sides and to act on the external force in different directions, it is not broken and is bent according to the external force. Therefore, the electrical connector according to the present invention can be used in various fields by this flexibility.
  • FIG. 14 is a schematic flowchart illustrating a method of using a reversible electrical connector according to an embodiment of the present invention.
  • a first micro-ciliary structure including a first thin film and a metal thin film coated on the surface of the first micro-cilia is provided on the first substrate.
  • the adhesive force in the process of contacting the first microciliar structure and the second microciliar structure, may be adjusted by adjusting the force applied during the contact.
  • the diameter of the first micro-ciliary structure or the second micro-ciliary structure, the density of the first micro-ciliary structure or the second micro-ciliary structure formed on the first substrate and the second substrate, respectively, or the first micro-ciliary structure may be adjusted by adjusting the aspect ratio of the second microciliary structure.
  • the adhesive force may be controlled by adjusting the thicknesses of the metal thin films coated on the first microcili and the second microcili.
  • the first connecting member and the second connecting member may be separated by separating a portion of the first substrate and the second substrate, in particular, one end thereof, to which the adhesive is attached. have. That is, when the one ends of the first substrate 2110 and the second substrate 2210 are adhered in the manner shown in FIG. 5, the first connecting member 2100 and the second connecting member may be separated with a small force. 2200 can be separated.
  • 15 is a configuration diagram illustrating a multifunction sensor according to an embodiment of the present invention.
  • the multifunction sensor according to the present invention seals the first connection member 2100, the second connection member 2200, and the first connection member 2100 and the second connection member 2200. Sealing layer 2300.
  • the first connection member 2100 has a first microciliar formed on the first substrate, and a metal thin film is formed on the surface of the first microciliar and the surface of the first substrate on which the first microciliar is formed.
  • the second connection member 2200 may have a second microciliar formed on the second substrate in contact with the first microciliar, and a surface of the second microciliar and a surface of the second substrate on which the second microciliar is formed. A metal thin film is formed on the.
  • the first and second micro fine fibers have a diameter of 50 to 300 nm and a height of 600 nm to 5 ⁇ m. It is formed, it is preferable that the first substrate and the second substrate is formed to a thickness of 5 to 50 ⁇ m.
  • the first microcilia when the diameter and height of the micro-cilia fall below the lower limit, the first micro-cili and the second micro-cili are not formed, and when the diameter and the height of the micro-cili exceed the upper limit, the first micro-cili and the second micro-cili Before the cilia are bonded to each other, the first microcilia may be attached to the surrounding first microcilia, causing problems in bonding between the substrates.
  • the thickness of the substrate is less than the lower limit, the stimulus provided from the outside becomes difficult to distribute evenly.
  • the sensitivity of the multifunctional sensor may be reduced.
  • the first microciliar and the second microciliar may be formed in a ciliary shape having the same diameter.
  • the sealing layer 2300 protects the first connecting member 2100 and the second connecting member 2200 from the outside, while the first connecting member 2100 and the second connecting member 2200 It is provided to provide the first connection member 2100 and the second connection member 2200 evenly provided from the outside even when the fastening, and the first micro-cili and the second micro-cili in contact state It is formed to seal the surfaces of the first connecting member 2100 and the second connecting member 2200. More specifically, the sealing layer 2300 covers side surfaces of the first connecting member 2100 and the second connecting member 2200, and the first connecting member 2100 and the second connecting member 2200 in the longitudinal direction. It is formed to cover the lower surface of the first connecting member 2100 and the upper surface of the second connecting member 2200 except one end or both ends of the).
  • the sealing layer is preferably formed to a thickness of 5 to 500 ⁇ m.
  • the thickness of the sealing layer is less than 5 ⁇ m it is difficult to evenly distribute the magnetic pole provided from the outside, if the thickness of the sealing layer exceeds 500 ⁇ m the sensitivity of the multifunctional sensor may be reduced.
  • the sealing layer may be formed through an oxygen plasma coating method using a polymer-based adhesive or an adhesive film.
  • the adhesive based on the polymer is strong and has low interfacial free energy, so that when the adhesive is provided on the surfaces of the first and second connecting members, the adhesive is adhered to the first and second connecting members.
  • Preference is given to using polydimethylsiloxane (PDMS), which rarely occurs.
  • such a multifunctional sensor detects pressure, shear force, and torsion by using a property in which resistance values change as pressure, shear force, and torsion are applied to the micro-cilia fastened by van der Waals force, The greater the number of microciliar tightened by force, the better.
  • the multifunction sensor according to the present invention may measure the pressure applied in the vertical direction in response to a change in resistance.
  • the shear force applied in the horizontal direction can also be measured according to the resistance change.
  • the torsion caused by the moment may be measured.
  • the multifunctional sensor according to the present invention can measure pressure, shear force, and torsion, and has a property that can be bent because a soft polymer material is used as compared to metal. It also has a sensitivity that responds finely to small pressures and forces, and to large responses to small changes in the range of pressures and forces that can be measured. And since the fine cilia are returned to their original state after measurement, they can be used repeatedly.
  • the sensitivity side of the multifunctional sensor will be described in detail through a graph.
  • Pressure measurement through the multifunctional sensor of the present invention can measure up to 10Pa minimum. This is a sensitivity that can be detected when 20 mg is placed on an area of 20 mm2 and is smaller than a very light touch ( ⁇ ⁇ 10 kPa).
  • Shear force measurement through the multi-function sensor of the present invention can be measured through a decrease in the resistance generated by the area where the first microciliary structure and the second microciliar structure are in contact with each other as a force is applied from the outside. It can be detected from as low as 0.001N and can measure up to 1N. In addition, the shear force measurement can be measured in the range of 10x10.
  • Torsion through the multifunction sensor of the present invention can be detected by the action similar to the shear force, can be measured from at least 0.0002Nm.
  • the response of the multifunction sensor to torsion shows a much more rapid change in resistance. This phenomenon is due to the fact that the torsional stimulus has a larger change in the area of contact with the fine cilia than the pressure or the shear force.
  • Fig. 19 shows the resistance change of the sensor according to the pressure change
  • Fig. 20 shows the resistance change of the sensor according to the shear force change
  • Fig. 21 shows the change in the sensor resistance in the torsion, and when comparing the Figs. 19 to 21, it can be seen that the change in resistance to the torsional stimulus shows a sharp change in comparison with other stimuli.
  • Another advantage of the multifunctional sensor according to the present invention is that it can be used repeatedly. This can be represented in four steps as shown in FIG.
  • step 1 the cilia overlap with each other by the force of tightening the first microcilia.
  • the second shows that the upper and lower microcilia overlap with each other and are fastened by van der Waals forces as the force is applied.
  • step 3 As the force is increased, as shown in step 3, as the number of fine cilia is fastened, the friction force increases.
  • step 4 when the force is applied beyond the limit as shown in step 4, the fastening of the micro-cilia is broken, and each micro-cilia is returned to its original state. It also shows that residual stresses generated as the fastening is broken are also recovered.
  • This phenomenon indicates that the multifunctional sensor according to the present invention can be used repeatedly.
  • Another advantage of the multifunctional sensor according to the present invention is that it can be bent.
  • 23 is a photograph for explaining the multifunction sensor according to the present invention.
  • the multifunction sensor of the present invention since the multifunction sensor of the present invention has flexibility, it does not break even when an external force is applied, and this characteristic has many advantages.
  • the object to be measured is not always flat, but may be circular or in various forms.
  • the other sensor is difficult or impossible to measure, while the multifunction sensor of the present invention can be bent because the measurement is possible.
  • the multifunctional sensor of the present invention can also be used as a strain gauge sensor.
  • the strain gauge is a gauge attached to the surface of the structure to measure the deformation state and the amount of the structure, the strain represents the degree of deformation or strain, and when an object is subjected to tension or compression, Means the value of the reduced length as a ratio.
  • the multifunction sensor according to the present invention has a high sensitivity as the gauge coefficient is 11.45.
  • the present invention provides a method of manufacturing a multifunctional sensor including the aforementioned components.
  • 25 is a flowchart illustrating a method of manufacturing a multifunctional sensor according to an embodiment of the present invention.
  • a first connecting member and a second connecting member are manufactured (S1500 and S1600). Subsequently, the first micro-seam of the first connection member and the second micro-seam of the second connection member contact each other (S1700), and then a sealing layer is formed to seal the first connection member and the second connection member (S1800). . Subsequently, the sealing layer is pressed to fasten the first and second fine cilia to each other (step S1900).
  • the production of the first connection member is required (S1500).
  • the surface of the first micro-cilia formed on the first substrate and the surface of the first substrate on which the first micro-cilia are formed are based on the first substrate on which the first micro-cilia are formed.
  • Form a metal thin film is to produce a first connecting member formed with the first micro-ciliary structure.
  • the second connection member is manufactured (S1600).
  • the surface of the second micro cilia formed on the second substrate and the surface of the second substrate on which the second micro cilia are formed are formed. Form a metal thin film.
  • a process of bringing the first substrate and the second substrate into close contact with each other so as to contact the first micro-cilia of the first connection member and the second micro-cilia of the second connection member (S1700).
  • the first substrate and the second substrate are brought into close contact with each other so that the distal end of the first microcili and the distal end of the second microcili may be in contact with each other.
  • a process of forming a sealing layer to seal the first connection member including the first substrate and the second connection member including the first substrate is performed (S1800).
  • step S1800 polydimethylsiloxane is applied to the surfaces of the first connecting member and the second connecting member in a state in which the first and second micro fine cilia are in close contact with each other, followed by treatment with oxygen plasma.
  • a sealing layer for sealing the first connecting member and the second connecting member is formed.
  • the sealing layer is preferably formed so that one end or both ends of the first connection member and the second connection member can be exposed to the outside. This is to connect electric wires to the metal thin film formed on the first connection member and the metal thin film formed on the second connection member to communicate electricity.
  • a van der Waals force acts between the first and second micro cilia to apply a pressure to the sealing layer so that the first and second micro cilia are coupled to each other ( S1900).
  • step S1900 0.01 to 0.3 N / cm 2, preferably 0.1 N / cm 2 is applied to the first substrate or the second substrate on which the sealing layer is formed.
  • the first microciliary structure and the second microciliar structure are fastened by van der Waals forces while contacting each other.
  • the second micro fine fibers of the second substrate may not be smoothly fastened with the first micro fine fibers of the first substrate, and 0.3 N / cm 2 is exceeded.
  • the first micro-cili and the second micro-cili become stronger in binding force, thereby reducing the sensitivity of the multifunctional sensor.
  • the second layer 2000 may sense pressure using the multifunctional sensor as described above, that is, the resistance-based pressure sensor of the nanostructure, and as shown in FIG. 23, the resistance-based pressure sensor of the nanostructure may have flexibility. There is an advantage that can be applied to the biomimetic skin sensor having a curvature.
  • molding-based nanostructures make production easy, durable, moldable on three-axis curvature, and detect very small pressures, such as how worms feel on the finger.
  • the sensor output is saturated and transmits pressure to the fourth layer 4000 through the third layer 3000.
  • the third layer 3000 is attached to the lower surface of the second layer 2000 and receives a stimulus through the second layer 2000. Since the third layer 3000 simulates the dermis of the skin, the third layer 3000 is preferably made of a viscoelastic material, and a stretchable polymer material may be used.
  • the third layer 3000 having such elasticity serves to spread and propagate the vibration generated when the rubbing stimulus is applied to the fourth layer 4000.
  • a protrusion may be formed on the top surface of the fourth layer 4000 attached to the bottom surface of the third layer 3000, the bottom surface of the third layer 3000 meshes with the top surface of the fourth layer 4000 on which the protrusions are formed.
  • a plurality of recesses may be formed to concave.
  • the fourth layer 4000 is attached to the lower surface of the third layer 3000 and receives a stimulus through the third layer 3000. In addition, it generates a signal of the detected stimulus by sensing the stimulus received from the third layer (3000).
  • the fourth layer 4000 simulates a Pachinian body located in the dermis to measure diffuse vibration, a Lupine body to detect skin elongation and slippage, and a thermomoreceptor to measure temperature. Therefore, since the fourth layer 4000 senses various aspects of the senses, the fourth layer 4000 may be referred to as a multi-modal tactile sensor.
  • the fourth layer 4000 is disposed on the lowermost layer of the biomimetic skin sensor, such as the pachinian body and the lupine body located in the dermis, so that the human skin can detect various aspects (slip, vibration, temperature, skin stretch). You can sense your senses.
  • FIG. 26 is a perspective view showing an embodiment of a force or pressure sensor array using the semiconductor strain gauge 3110 according to the present invention
  • FIG. 27 is an exploded perspective view of the force or pressure sensor array shown in FIG.
  • an embodiment of the present invention includes a circuit board 3010 and a pair of elastomer layers 3020 and 3030 bonded to both surfaces thereof.
  • the circuit board 3010 includes a semiconductor strain gauge 110 in which a polymer film layer and a plurality of units 3111 are arranged in a specific array pattern.
  • the first and second signal lines 3140 and 3150 are formed.
  • a switch connected to each of the ends of the current source 3141 and the second signal line 3150 which allow a constant current to flow through the first signal line 3140 at the bottom of the circuit board ( 3151 and the switch control unit 3160 for scanning the second signal line 3150 in real time by controlling the switch may further include a CMOS circuit layer 3170 formed by a CMOS process.
  • the semiconductor strain gauge 3110 having an array pattern of a plurality of units 3111 serves to sense a force or pressure with excellent sensitivity of a high gauge factor based on a change in resistance according to deformation. In addition, even if the entire sensor array is bent at the neutral axis in the entire layer structure, the strain is zero.
  • Each unit 3111 constituting the semiconductor strain gauge is provided in plural and manufactured to have an array pattern.
  • Each unit 3111 has a bar shape or a bar-shaped shape.
  • the array pattern is arranged so that the lengths of the rod shapes are all the same, so that the force or pressure sensing by the large area can be made uniform.
  • Each unit 3111 has a wave shape unlike the drawing to provide elasticity. It may also be prepared. Since each unit 3111 is manufactured on the basis of the silicon wafer 3040, the unit 3111 is manufactured to a thickness of 100 ⁇ m or less in order to provide warpage.
  • the semiconductor strain gauge 3110 in which a plurality of units 3111 are arranged in an array pattern is formed on a polymer film layer such as polyimide (PI). Since the polymer film layer is also used as an inter-electrode insulating layer, it is preferable that the circuit board 310 is completed with at least two thin films.
  • the pair of elastomer layers 3020 and 3030 serve as a sensing part and a protective film for first detecting the force F in the present invention.
  • the pair of elastomer layers 3020 and 3030 are made of the same thickness (about 0.5-10 mm) on both sides to ensure uniformity of force or pressure sensing.
  • the elastomer layers 3020 and 3030 are used to provide flexibility and elasticity.
  • the elastomer layers 3020 and 3030 are formed of a poly-dimethylsiloxane (PDMS) layer.
  • PDMS poly-dimethylsiloxane
  • FIG. 28 is a cross-sectional view illustrating the A-A direction cross section of FIG. 26.
  • a semiconductor strain gauge 3110 is arranged on the first polymer film layer 3120, and the first signal line corresponds to one end of each unit 3111. 3140 are connected, and the second signal line 3150 is connected to the other end of each unit 3111.
  • the elastomeric layers 3020 and 3030 are bonded to the upper and lower surfaces of the circuit board 3010.
  • the semiconductor strain gauge 3110 may be manufactured in various array patterns, but the thickness should be 100 ⁇ m or less to impart warpage, and in the case of the plurality of first and second signal lines 3140 and 3150 for electrode formation, preferably A CMOS circuit may be formed, and a metal such as Au / Ti may be used, but may be transferred and formed by a CMOS process including a patterning process and metal evaporation.
  • a second polymer film layer 3130 is further formed as an insulating layer between the first signal line 3140 and the second signal line 3150.
  • the semiconductor strain gauge 3110 and the second signal line 3150 may be connected through the hole.
  • the first and second polymer film layers 3120 and 3130 are necessary to configure circuits and wires, and also serve to allow the semiconductor strain gauge 3110 to be deposited on the film.
  • the first and second polymer film layers 3120 and 3130 may be formed of a polyimide (PI) thin film layer each having a thickness of 0.5 to 5 ⁇ m.
  • FIG. 29 is a circuit diagram illustrating a first signal line 3140 and a second signal line 3150, a switch 3151, and a switch controller 3160 in a circuit board according to an exemplary embodiment of the present invention.
  • the plurality of (Y0, Y1 ... Yn-1) first signal lines 3140 are connected in parallel to one end of each unit 3111 in one direction, and the plurality of (X0, X1. Xn-1)
  • the second signal line 3150 is connected to the other end of each unit 3111 perpendicularly to one direction.
  • each of the first signal lines 3140 is configured of a P-MOSFET to apply a bias voltage to the current source 3141 to which the input voltage Vin is applied. Constant current flows at all times.
  • a switch 3151 is connected to each end of the second signal line 3150.
  • Each switch 3151 is connected to a switch controller 3160 that controls the switch 3151 to scan the second signal line 3150. Accordingly, the switch controller 3160 turns each of the switches 3151 in real time, and sequentially turns on only one of them, and turns off the rest.
  • the switch controller 3160 may be configured as a decoder. Accordingly, when a force or pressure is applied from the outside, the output voltages V0... Vn-2 are measured at the output terminal connected to the unit 3111 whose resistance value changes. The resistance value and the voltage value changed by the output voltage are calculated, and the applied force or pressure value is measured based on the resistance value and the voltage value.
  • CMOS circuit is not limited to this, but is intended to present a preferred example of the signal processing method, the scope of the invention should be interpreted by the claims.
  • FIG. 30 is a flowchart of a method of manufacturing a force or pressure sensor array using the present invention semiconductor strain gauge 3110.
  • a semiconductor strain gauge 3110 having a predetermined array pattern is manufactured on a silicon wafer 3040 (S2100).
  • the semiconductor strain gauge 3110 manufactured is manufactured using a silicon-on-insulator (SOI) wafer or a single crystal silicon wafer so that each unit 3111 of the array pattern has a thickness of 0.1 ⁇ m to 100 ⁇ m, and in particular, an SOI wafer In this case, since the etching film is inserted, the thickness of the semiconductor strain gauge 3110 may be easily adjusted.
  • SOI silicon-on-insulator
  • the sacrificial layer 3062 is polymethyl methacrylate, that is, polymethyl methacrylate (PMMA), and the first polymer film layer 3120 is subjected to a transfer step (S2200) using a polyimide thin film layer.
  • a plurality of first signal lines 3140 are connected to one end of each unit 3111 of the array pattern to form a first electrode (S2300).
  • the plurality of first signal lines may be transferred and formed in a CMOS process, and the plurality of first signal lines 3140 may be arranged in parallel in one direction.
  • the first signal line 3140 is formed of a P-MOSFET so that a constant current always flows by the current source 3141.
  • an insulating layer is formed by stacking the second polymer film layer 3130 over the plurality of first signal lines 3140 (S2400).
  • a polyimide thin film layer is used similarly to the first polymer film layer 3120.
  • a plurality of second signal lines 3150 are connected to the other end of each unit 3111 in the second polymer film layer 3130 to form a second electrode (S2500).
  • the plurality of second signal lines 3150 are also transferred and formed in a CMOS process, and the plurality of second signal lines 3150 are formed to be arranged perpendicularly to the alignment direction of the plurality of first signal lines 3140.
  • a switch 3151 is connected to each end of the second signal line 3150, and each switch 3151 is connected to the switch controller 3160 (S2600).
  • the circuit board 3010 including the first and second polymer film layers, the semiconductor strain gauge 3110, and the plurality of first and second signal lines is separated by dissolution of the sacrificial layer 3062 by a predetermined solvent (S2700).
  • the circuit board 3010 is inserted into and bonded between the pair of elastomer layers 3020 and 3030 (S2800) to perform the method of manufacturing the force or pressure sensor array of the present invention.
  • a lithography process, an ion implantation process, and an etching process may be sequentially performed on the silicon wafer 3040, thereby manufacturing a semiconductor strain gauge 3110 having an intended array pattern. Since this process is a evident process in the manufacture of semiconductor strain gauges, the description thereof is omitted.
  • FIG. 31 to 34 are process cross-sectional views sequentially illustrating a process of manufacturing the semiconductor strain gauge 3110 during the construction of a force or pressure sensor array using the semiconductor strain gauge 3110 according to the present invention.
  • the photoresist 3113 Photo Resister
  • the single crystal silicon 3112 in a predetermined pattern in consideration of the semiconductor strain gauge 3110 to be manufactured.
  • the corresponding region is removed by metal evaporation and a trench 3114 is formed through reactive ion etching (RIE) to undergo sidewall refining by KOH, as shown in FIG. 32.
  • RIE reactive ion etching
  • the first passivation layer 3115 and the second passivation layer 3116 are sequentially formed, but the first passivation layer 3115 uses Si 3 N 4 / SiO 2, and the second passivation layer 3116 is formed of Au /. Use Ti.
  • the semiconductor strain gauge 3110 in which the ribbon-shaped unit 3111 has an array pattern is completed.
  • 35 is a perspective view illustrating a state in which the semiconductor strain gauge 3110 is transferred in a method of manufacturing a force or pressure sensor array using the semiconductor strain gauge 3110 according to the present invention.
  • the semiconductor strain gauge 3110 having the array pattern using the poly-dimethylsiloxane medium (or PDMS stamp, 50) is used as the silicon wafer (3050) by the area of the poly-dimethylsiloxane medium (3050). 3040).
  • FIG. 36 is a perspective view illustrating a state in which a semiconductor strain gauge 3110 is transferred to a carrier wafer 3060 layer in a method of manufacturing a force or pressure sensor array using the semiconductor strain gauge 3110.
  • the semiconductor strain gauge 3110 is transferred to and stacked on the first polymer film layer 3120 stacked on the carrier wafer 3060 with the sacrificial layer 3042 interposed therebetween.
  • the first polymer film layer 3120 is formed of a polyimide thin film layer, and the sacrificial layer 3062 is coated with polymethyl acrylate (PMMA, acrylic resin).
  • PMMA polymethyl acrylate
  • FIG. 37 is a perspective view illustrating a state in which a plurality of signal lines are arranged in a method of manufacturing a force or pressure sensor array using the semiconductor strain gauge 3110 according to the present invention.
  • a plurality of first and second signal lines 3140 and 3150 are formed by transferring in a CMOS process to configure a CMOS circuit. In this case, detailed wire patterning may be performed and a process such as spin coating may be performed.
  • the plurality of first and second signal lines 3140 and 3150 are formed to be arbitrary X-axis electrodes and Y-axis electrodes perpendicular thereto.
  • FIG. 38 is a flowchart sequentially illustrating a force or pressure measuring method using the present force or pressure sensor array.
  • the elastomer layers 3020 and 3030 are adhered to the outer both surfaces of the pair of polymer film layers 3120 and 3130 which the film faces face to face, and thus the elastomer layers 3020 and 3030. At least one of receives a force or pressure from the outside (S3100).
  • a semiconductor strain gauge 3110 having a predetermined array pattern is positioned between the pair of polymer film layers 3120 and 3130 so that a resistance of a portion of the unit 3111 close to the portion to which the force is applied by receiving a force or pressure.
  • This is changed (S3200).
  • a constant current flows through the first signal line 3140 constituting the CMOS circuit and connected to one end of each unit (S3300).
  • the first signal line 3140 is formed of a P-MOSPET, and is configured such that a constant current always flows by a current source.
  • the switch controller 3160 controls the switches 3151 connected to the ends of the second signal lines to scan the second signal lines 3150 in real time (S3400). Next, after scanning, the control unit receives a deformation signal output based on the changed resistance through a plurality of first and second signal lines connected to each unit 3111 of the array pattern (S3500).
  • the control unit 5000 may be a computer capable of numerical operation and numerical comparison, and preferably has an input port for receiving a signal of the present force or pressure sensor array.
  • the controller 5000 calculates a measured resistance value or a measured voltage value based on the signal (S3600). Finally, the control unit 5000 outputs the strength of the force or pressure based on the measured resistance value or the measured voltage value (S3700), thereby performing a force or pressure measurement method using the force or pressure sensor array.
  • the initial resistance stored in the buffer memory (not shown) by the control unit 5000 in correspondence with each unit 3111 between the calculation step S3600 of the control unit 5000 and the output step S3700 of the control unit 5000.
  • the method may further include reading a value or an initial voltage value, and comparing the measured value with the initial value to calculate and output the strength or the strength of the pressure based on the proportionality thereof.
  • FIG. 39 is a plan view schematically illustrating an array pattern in which rod-shaped units 3111 are arranged in a cross shape as a first modification of the force or pressure sensor array using the semiconductor strain gauge 3110 according to the present invention.
  • the first modified example includes two circuit boards 3010 having a plurality of rod-shaped (or bar-shaped) units 3111 and 3111 'arranged in an array pattern.
  • the units 3111 and 3111 'corresponding to the circuit boards 3010 may be overlapped to form a cross.
  • the two layers of the overlapping circuit board 3010 are bonded to the outer elastomer layer, respectively, to complete the force or pressure sensor array of the present invention.
  • FIG. 40 is a plan view showing a state in which a protrusion 3031 structure is formed on the array pattern as a second modification of the force or pressure sensor array using the semiconductor strain gauge 3110 of the present invention
  • FIG. 41 is a BB direction of FIG. It is sectional drawing which shows the cross section of.
  • semiconductor strain gauges 3110a, 3110b, 3110c, and 3110d each having an array pattern of patterns arranged so that the projections 3031 face in all directions below the boundary line formed with the surface of the elastomer 3030. ) Is formed.
  • the protrusion 3031 has a structure in which a load can be concentrated and a force or pressure in a three-axis direction can be measured.
  • the first and second variants described above may also be manufactured by the same manufacturing method as the above-described manufacturing method, and the measuring method of force or pressure is also performed in the same manner except for the measuring direction.
  • the force on the X, Y, and Z axes can be measured, and the measured force can be used to measure slippage, vibration, and skin stretching.
  • Various aspects can be detected.
  • thin-film semiconductor single crystal silicon has about 30 to 70 times higher sensitivity than metal based strain gauges, and mechanical durability is excellent because there is no need to use a membrane sensing structure to increase the sensitivity.
  • the flexible triaxial force sensor array using the above-described semiconductor silicon ribbon as a strain gauge uses a strain gauge method, which results in much higher linearity, repeatability, and creep characteristics than Force Sensitive Resistor (FSR) based on conductive rubber and conductive ink. Excellent for use in the biomimetic skin sensor of the present invention.
  • FSR Force Sensitive Resistor
  • control unit 5000 serves to generate tactile information by using the signals of the stimuli sensed by the second layer 2000 and the fourth layer 4000.
  • the integrated sensor array should be arranged in a matrix array, and data is acquired by scanning each row and column signal line.
  • N ⁇ M arrays require N ⁇ M signal lines to be connected to each other, whereas N + M signal lines are required for the matrix arrangement. Even if arranged in a matrix form, a large number of signal lines must come out of the artificial skin, and the long distance from the signal processing circuit cannot exclude the influence of noise.
  • a single-chip type dedicated signal processing processor that processes the tactile signal near the artificial skin (for example, when the biomimetic skin sensor is attached to the finger frame of the Bionic arm, inside the finger frame) and converts it into a digital signal. May be used as the control unit 5000.
  • Such a processor may transmit the tactile data in a packet form to a tactile signal conversion processor (processing digital tactile data and converting it into an electrical signal-pulse-suitable for a bioreceptor).
  • a tactile signal conversion processor processing digital tactile data and converting it into an electrical signal-pulse-suitable for a bioreceptor.
  • the control units 5000 of the skin sensors may be connected to each other.
  • FIG. 42 shows that the biomimetic skin sensor according to the embodiment of the present invention is attached to the finger frame of the Bionic arm. Since the first layer 1000 to the fourth layer 4000 are all flexible, FIG. Likewise, it can be attached to the finger frame of the bionic arm.
  • 43 is a flowchart illustrating a tactile signal sensing method according to an embodiment of the present invention.
  • an external magnetic pole is accommodated using the first layer 1000 positioned at the outermost surface (S4100).
  • the first layer 1000 can be composed of a material similar to the surface of the skin as described above and can accommodate any stimulus associated with tactile sensation.
  • the received stimulus is transmitted to the second layer 2000 located on the bottom surface of the first layer 1000 (S4200).
  • the first signal is generated by detecting a pressure stimulus among the stimuli transmitted to the second layer 2000 (S4300).
  • the second layer 2000 simulates the Meissner body and the Merkel body.
  • the pressure stimulus may be sensed using the above-described resistance-based pressure sensor of the nanostructure as the second layer 2000.
  • the stimulus transmitted to the second layer 2000 is transferred to the third layer 3000 positioned on the bottom surface of the second layer (S4400).
  • the stimulus transmitted to the third layer 3000 is transferred to the fourth layer 4000 positioned on the lower surface of the third layer (S4500).
  • step S4400 the third layer 3000 diffuses and propagates the stimulus received from the upper part to the fourth layer 4000.
  • the second signal is generated by sensing at least one of the sliding stimulus, the temperature stimulus, the vibration stimulus, and the modified stimulus among the stimuli transmitted to the fourth layer 4000 (S4600).
  • the fourth layer 4000 simulates a pachinian element that measures diffused vibration, a lupine element that detects skin stretch and slippage, and a thermomoreceptor that measures temperature and is flexible using the aforementioned semiconductor strain gauge.
  • a three-sided force sensor array and a metal resistance-based flexible temperature sensor can be used to detect sliding, temperature, vibration, and strain stimuli.
  • Tactile information is generated using the first signal and the second signal (S4700).
  • the present invention can also be embodied as computer readable codes on a computer readable recording medium.
  • Computer-readable recording media include all kinds of recording devices that store data that can be read by a computer system. Examples of computer-readable recording media include ROM, RAM, CD-ROM, magnetic tape, floppy disks, optical data storage devices, and the like, which are also implemented in the form of carrier waves (for example, transmission over the Internet). Include.
  • the computer readable recording medium can also be distributed over network coupled computer systems so that the computer readable code is stored and executed in a distributed fashion.
  • functional programs, codes, and code segments for implementing the present invention can be easily inferred by programmers in the art to which the present invention belongs.
  • biomimetic skin sensor described above may not be limitedly applied to the configuration and method of the embodiments described above, but the embodiments may be selectively combined with each or all of the embodiments so that various modifications may be made. It may be configured.
  • the present invention to which the above-described configuration is applied is conceived to solve the conventional problems as described above, and can provide a user with a tactile sensor that mimics the skin structure of the human body.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Force Measurement Appropriate To Specific Purposes (AREA)

Abstract

La présente invention concerne un capteur de peau biomimétique qui détecte des sensations tactiles. Un capteur de peau biomimétique multisensoriel selon un mode de réalisation de la présente invention comprend une première couche destinée à recevoir une stimulation externe appliquée à une surface supérieure ; une deuxième couche fixée à la surface inférieure de la première couche ; une troisième couche fixée à la surface inférieure de la deuxième couche ; une quatrième couche fixée à la surface inférieure de la troisième couche ; et une unité de commande qui génère des informations tactiles par rapport à la stimulation ; et peut générer des informations tactiles.
PCT/KR2015/008804 2014-10-15 2015-08-24 Capteur de peau biomimétique multisensoriel WO2016060372A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2014-0139188 2014-10-15
KR1020140139188A KR101665191B1 (ko) 2014-10-15 2014-10-15 생체모방 다중감각 피부센서

Publications (1)

Publication Number Publication Date
WO2016060372A1 true WO2016060372A1 (fr) 2016-04-21

Family

ID=55746876

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2015/008804 WO2016060372A1 (fr) 2014-10-15 2015-08-24 Capteur de peau biomimétique multisensoriel

Country Status (2)

Country Link
KR (1) KR101665191B1 (fr)
WO (1) WO2016060372A1 (fr)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107329436A (zh) * 2017-08-10 2017-11-07 苏州大学 柔性触觉传感器以及机器人处理系统
CN108362334A (zh) * 2018-02-02 2018-08-03 西安交通大学 一种水下仿生侧线感知阵列
TWI664510B (zh) * 2018-03-31 2019-07-01 原見精機股份有限公司 力感應裝置、力陣列感應模組及其力感應元件
CN113545855A (zh) * 2021-05-31 2021-10-26 中国科学院自动化研究所 应用于血管介入手术的力检测系统及方法
CN113865760A (zh) * 2021-09-24 2021-12-31 国科温州研究院(温州生物材料与工程研究所) 一种用于心肌力学传感的各向异性结构色薄膜的制备方法
CN114993532A (zh) * 2022-05-10 2022-09-02 江苏振宁半导体研究院有限公司 一种柔性触觉传感器及其加工装置
CN115431289A (zh) * 2022-11-07 2022-12-06 之江实验室 一种面向机器人的四合一多模态触觉传感器及方法

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101962611B1 (ko) * 2017-03-22 2019-03-28 이엘케이 주식회사 힘감지 장치 및 이를 제조하는 방법
KR101876438B1 (ko) 2017-08-10 2018-07-10 숭실대학교산학협력단 점유탄성 탄성중합체 기반 커패시터형 촉각센서
KR102225106B1 (ko) * 2019-04-25 2021-03-09 울산대학교 산학협력단 원격제어 마스터 장치
KR102200599B1 (ko) * 2019-10-28 2021-01-12 한국표준과학연구원 그래핀을 이용한 촉감센서, 손가락 센서 및 그 제조방법
KR102241851B1 (ko) * 2019-11-19 2021-04-21 한국생산기술연구원 피부분절 기반 촉각 인지 로봇피부 및 이의 제조방법 및 이의 촉각 자극 분류 방법
KR102425554B1 (ko) 2020-09-11 2022-07-27 중앙대학교 산학협력단 3축 힘 측정이 가능한 유연 돔형상 촉각센서, 촉각센서 어레이 및 그 제조방법

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002031574A (ja) * 2000-07-17 2002-01-31 Sharp Corp 触覚センサ
JP2006208055A (ja) * 2005-01-25 2006-08-10 Gifu Univ 指紋型触覚センサ
KR20120099938A (ko) * 2011-03-02 2012-09-12 한국표준과학연구원 Ｃｍｏｓ 회로 방식을 적용한 반도체 스트레인 게이지의 플렉서블 힘 또는 압력 센서 어레이, 그 플렉서블 힘 또는 압력 센서 어레이 제조방법 및 그 플렉서블 힘 또는 압력 센서 어레이를 이용한 플렉서블 힘 또는 압력 측정방법
KR101312553B1 (ko) * 2011-12-28 2013-10-14 한국표준과학연구원 촉각 센서의 곡면 부착구조 및 촉각 센서의 곡면 부착방법
KR20140074478A (ko) * 2012-12-10 2014-06-18 한국기계연구원 전도성 나노 또는 마이크로 기둥의 맞물림을 이용한 촉각 센서

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101169943B1 (ko) 2010-03-18 2012-08-06 한국표준과학연구원 반도체 스트레인 게이지를 이용한 힘 또는 압력 센서 어레이, 힘 또는 압력센서 어레이의 제조방법 및 힘 또는 압력 센서 어레이를 이용한 힘 또는 압력 측정방법
KR101200798B1 (ko) 2011-05-27 2012-11-13 서울대학교산학협력단 미세섬모의 인터락킹을 이용한 가역적 전기커넥터, 이를 이용한 다기능 센서 및 그 제작방법

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002031574A (ja) * 2000-07-17 2002-01-31 Sharp Corp 触覚センサ
JP2006208055A (ja) * 2005-01-25 2006-08-10 Gifu Univ 指紋型触覚センサ
KR20120099938A (ko) * 2011-03-02 2012-09-12 한국표준과학연구원 Ｃｍｏｓ 회로 방식을 적용한 반도체 스트레인 게이지의 플렉서블 힘 또는 압력 센서 어레이, 그 플렉서블 힘 또는 압력 센서 어레이 제조방법 및 그 플렉서블 힘 또는 압력 센서 어레이를 이용한 플렉서블 힘 또는 압력 측정방법
KR101312553B1 (ko) * 2011-12-28 2013-10-14 한국표준과학연구원 촉각 센서의 곡면 부착구조 및 촉각 센서의 곡면 부착방법
KR20140074478A (ko) * 2012-12-10 2014-06-18 한국기계연구원 전도성 나노 또는 마이크로 기둥의 맞물림을 이용한 촉각 센서

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107329436A (zh) * 2017-08-10 2017-11-07 苏州大学 柔性触觉传感器以及机器人处理系统
CN108362334A (zh) * 2018-02-02 2018-08-03 西安交通大学 一种水下仿生侧线感知阵列
TWI664510B (zh) * 2018-03-31 2019-07-01 原見精機股份有限公司 力感應裝置、力陣列感應模組及其力感應元件
CN113545855A (zh) * 2021-05-31 2021-10-26 中国科学院自动化研究所 应用于血管介入手术的力检测系统及方法
CN113865760A (zh) * 2021-09-24 2021-12-31 国科温州研究院(温州生物材料与工程研究所) 一种用于心肌力学传感的各向异性结构色薄膜的制备方法
CN113865760B (zh) * 2021-09-24 2024-03-29 国科温州研究院(温州生物材料与工程研究所) 一种用于心肌力学传感的各向异性结构色薄膜的制备方法
CN114993532A (zh) * 2022-05-10 2022-09-02 江苏振宁半导体研究院有限公司 一种柔性触觉传感器及其加工装置
CN115431289A (zh) * 2022-11-07 2022-12-06 之江实验室 一种面向机器人的四合一多模态触觉传感器及方法
CN115431289B (zh) * 2022-11-07 2023-03-07 之江实验室 一种面向机器人的四合一多模态触觉传感器及方法

Also Published As

Publication number Publication date
KR101665191B1 (ko) 2016-10-14
KR20160044683A (ko) 2016-04-26

Similar Documents

Publication Publication Date Title
WO2016060372A1 (fr) Capteur de peau biomimétique multisensoriel
Zhang et al. Development of a flexible 3-D tactile sensor system for anthropomorphic artificial hand
WO2017052077A1 (fr) Dispositif, procédé et système de commande à distance
WO2017164480A1 (fr) Système pour fournir une stimulation tactile
WO2011142610A2 (fr) Circuit intégrateur avec intégrateur inverseur et intégrateur non inverseur
WO2018190494A1 (fr) Module de capteurs d'empreintes digitales et appareil de reconnaissance d'empreintes digitales ayant ce module
WO2012165839A9 (fr) Connecteur électrique réversible utilisant l'imbrication d'un cil fin, capteur multifonctions utilisant ledit connecteur, et procédé de fabrication associé
WO2017160096A2 (fr) Module de chaussure intelligente
WO2018135671A1 (fr) Dispositif de soin de la peau et son procédé de mesure de la peau
WO2010082749A2 (fr) Souris fixe
WO2020204345A1 (fr) Dispositif d'entrée tactile
WO2017155187A1 (fr) Terminal mobile
Ji et al. A flexible capacitive tactile sensor for robot skin
WO2014178572A1 (fr) Capteur de champ magnétique mems
WO2020145494A1 (fr) Procédé et dispositif de mesure d'un biosignal en utilisant une électrode
WO2015178607A1 (fr) Capteur tactile au graphène, son procédé de fonctionnement et son procédé de fabrication
WO2018203658A1 (fr) Capteur de mesure de déformations, système de traitement de données utilisant un capteur de mesure de déformations appliqué au corps et procédé de traitement de données l'utilisant
Zhao et al. A tri-axial touch sensor with direct silicon to PC-board packaging
WO2017095097A1 (fr) Capteur à haute sensibilité contenant des fissures linéairement induites et son procédé de fabrication
WO2022098145A1 (fr) Procédé et dispositif électronique comprenant un écran flexible
WO2022030715A1 (fr) Capteur tactile, procédé de détection de stimulation tactile l'utilisant, et peau de robot et robot le comprenant
WO2018151414A1 (fr) Unité de reconnaissance capacitive d'empreintes digitales, circuit de mesure capacitive de capteur d'empreintes digitales, et dispositif de reconnaissance d'empreintes digitales les comprenant
WO2018131979A1 (fr) Dispositif d'entrée tactile
WO2018093014A1 (fr) Film de nanofil d'argent et son procédé de fabrication, et panneau d'écran tactile et son procédé de fabrication
WO2020159118A1 (fr) Dispositif de mesure de bio-impédance et procédé de fonctionnement associé

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 15851455

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 15851455

Country of ref document: EP

Kind code of ref document: A1