WO2016058885A1 - Molded package and method of manufacture - Google Patents

Molded package and method of manufacture Download PDF

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Publication number
WO2016058885A1
WO2016058885A1 PCT/EP2015/073134 EP2015073134W WO2016058885A1 WO 2016058885 A1 WO2016058885 A1 WO 2016058885A1 EP 2015073134 W EP2015073134 W EP 2015073134W WO 2016058885 A1 WO2016058885 A1 WO 2016058885A1
Authority
WO
WIPO (PCT)
Prior art keywords
contact surface
substrate
notch
package
mold
Prior art date
Application number
PCT/EP2015/073134
Other languages
French (fr)
Inventor
Yun Liu
Yuhua LEE
Chengsheng KU
Chingming LIU
Mengming ZHU
Dusan Golubovic
Yujie HUANG
Original Assignee
Koninklijke Philips N.V.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips N.V. filed Critical Koninklijke Philips N.V.
Priority to JP2017538290A priority Critical patent/JP6738813B2/en
Priority to US15/517,725 priority patent/US10629456B2/en
Priority to KR1020177012919A priority patent/KR102465972B1/en
Priority to EP15775701.4A priority patent/EP3207562B1/en
Priority to CN201580055617.6A priority patent/CN106796894A/en
Publication of WO2016058885A1 publication Critical patent/WO2016058885A1/en
Priority to US16/828,618 priority patent/US10879084B2/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
    • H01L23/3178—Coating or filling in grooves made in the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14336—Coating a portion of the article, e.g. the edge of the article
    • B29C45/14418—Sealing means between mould and article
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements

Definitions

  • the invention relates to a method of manufacturing a package, a package, and a packaged device using the package.
  • Semiconductor devices may be packaged in a number of different ways.
  • One approach that is used is to place a substrate in a mold having a mold cavity and then to inject molding compound into the cavity to form the package.
  • the substrate may in particular be a lead frame. This approach can result in a low cost package. Such low cost packages may be used in a number of applications, for example to mount light emitting diodes, LEDs.
  • Molding compound can get between narrow gaps between the substrate and the mold and coat the substrate in locations where molding compound gives rise to disadvantages.
  • molding compound is present on a device mounting surface or bond pad the adhesion of a device to the device mounting surface or the bond to a bond pad can be impaired.
  • deflash a step known as "deflash” may be provided after the molding step to remove molding compound from regions where it is not required.
  • this deflash step is an additional step which costs time and therefore money. It would therefore be beneficial if the need for such a deflash step could be reduced or eliminated.
  • a method of manufacture of a package comprising:
  • a deflash step may reduce the adhesion of the remainder of the molding compound to the leadframe and may further reduce reflectivity, these disadvantages of the deflash step may be mitigated using the invention.
  • the invention is particularly useful for the formation of side walls, and in particular the mold may be shaped to form side walls having an inner surface facing the contact surface, the inner surface being at an angle of 25° to 90° to the contact surface, the angled inner surface extending into the notch.
  • the side walls may shaped to an acute angle of 40° to 85° to the contact surface.
  • the substrate is placed in the mold with the contact surface against the mold defining an interface between the mold and the contact surface with the protection flange extending in the notch around the complete circumference of the contact surface, the mold further defining a molding cavity adjacent to the substrate around the protection flange;
  • the step of filling the mold with molding compound fills the molding cavity with molding compound to form package walls, the protection flange blocking the molding compound from reaching the interface.
  • the substrate in the step of placing the substrate is placed such that:
  • the protection flange extends into the notch on the inner side of the notch adjacent to the contact surface
  • the method may further include curing the molding compound to form a finished package ready for mounting a device.
  • the substrate may have a metal coating on the contact surface for mounting a device in a process that a step of forming the metal coating is prior to the step of placing the substrate in the mold.
  • the metal coating on the substrate may extend as far as the notch and other area outside the notch.
  • the metal may be silver or copper, which are particularly effective conductors.
  • the substrate may be a lead frame.
  • the method of manufacture may further include mounting a device on a contact surface.
  • the device may be a light emitting diode.
  • the method may further include encapsulating the device in an encapsulant. In this way a finished package including a device may be manufactured.
  • the method relates both to forming a package ready for mounting a device as well as a package in its final state with a device mounted in the package.
  • a package comprising:
  • the package may further include a metal layer on the contact surface.
  • the metal layer may include a device mounting surface and one or more bond pads.
  • the invention also relates to a package including a device mounted on the contact surface.
  • An encapsulant may be provided around the device.
  • Fig. 1 shows a step in the manufacture of a package according to
  • Fig. 2 shows a package manufactured in this way
  • FIG. 3 shows a packaged device using the package of Figure 2;
  • Fig. 4 shows a package according to a second embodiment of the
  • Fig. 5 shows a step in the manufacture of a comparative example
  • Fig. 6 shows a package manufactured according to the comparative
  • a substrate 10 in the form of a conductive lead frame of shaped metal has opposed first 16 and second 18 major surfaces.
  • a contact surface 12 is provided on the first major surface and a notch 14 extends aournd the complete circumference of the contact surface extending from the first major surface towards the second major surface.
  • a metal coating 20 is provided on the contact surface 12.
  • the metal coating may be for example iron, gold, nickel, palladium, silver or copper.
  • the contact surface is a surface of the substrate which contacts the device.
  • the contact surface 12 is not a single connected contact surface with a single connected metal coating 20. Instead, there are a number of gaps 26 in the contact surface 12 to allow the contact surface to provide a number of distinct contacts, including a device mounting surface 22 to which the device will be bonded in the finished device and a number of bond pads 24, only one being illustrated in Figur 1. In the embodiment shown the gaps 26 are present in both the lead frame substrate 10 and the metal coating 20.
  • the substrate 10 is placed in mold 30.
  • the mold is formed of a first piece 32 and a second piece 34.
  • the second major surface 18 of substrate 10 is placed against the second piece 34 of the mold.
  • the first piece 32 is then placed to define a molding cavity 40 between the first piece 32 and the first major surface 16 of the substrate 10, with sidewalls 36 around the molding cavity 40 and with a protection flange 38 extending into the notch 14 of the substrate 10.
  • the protection flange 38 hence extends into the substrate 10 past the metal coating 20 and the contact surface 12. Note that the protection flange 38 abuts the inner edge of the notch 14, the inner edge of the notch being the edge adjacent to the contact surface 12.
  • Molding compound is then injected into the molding cavity 40 under a predetermined pressure and temperature and solidified with heat to form package walls 42. Note that the molding compound also fills gaps 26. A cure at a predetermined temperature and time is then carried out. The formed package is then removed from the mold 30 ( Figure 2) ⁇
  • the package includes the substrate 10 with the package walls 42 having an inner surface 44 extending into notch 14. Note that the metal coating 20 of the device mounting surface 22 and the bond pad 24 is spaced from the inner surface 44 of the package walls 42.
  • the inner surface 44 is angled at angle between 25° and 90° to the first major surface 16. Acute angles less than 90° can provide benefits in the finished device. In particular, angles of 40 to 70° can increase light output. However, for accomodating the largest devices, an angle of 90° would be appropriate.
  • the process according to the embodiment of Figures 1 and 2 may be compared with a comparative example of Figures 5 and 6.
  • the comparative example is the same as the embodiment except that the mold 30 in the comparative example omits the protection flange 38. Accordingly, the same reference numbers are used for like components in the comparative example and the description not repeated.
  • molding compound is impeded or prevented from reaching the contact surface 12 by the protection flange 38 which extends between the molding cavity 40 and the contact surface 12.
  • the protection flange 38 which extends between the molding cavity 40 and the contact surface 12.
  • the protection flange 38 blocks the interface 46 between the metal coating 22 and the first piece 32 of the mold 30. This impedes the molding compound from entering any gap at this interface 46 which in turn means that there is no need for a deflash step to remove molding compound.
  • the package of Figure 2 may be used to prepare a packaged device as illustrated in Figure 3.
  • a device chip 50 is mounted onto the device mounting surface 22 in any known way. If required, bond wires 52 make connection to the bond pads 24 on substrate 10. Alternative bonding techniques such as for example flip chip bonding may also be used. Note that the device mounting surface 22 and bond pads 24 are protected from the intrusion of molding compound in the method of manufacturing the package as discussed above.
  • encapsulant 54 for example of silicone, is introduced into the package between sidewalls 36 of the mold 30 and covering the device chip 50. This encapsulant 54 also fills the empty part of notch 14.
  • the device chip 50 may in particular be a light emitting diode, LED.
  • the packaged LED device may be used in lighting, for backlight, flash, automotive and display applications, or for traffic signals and the like.
  • the inner surface 44 is angled at an acute angle less than 90° to the contact surface which provides an angled reflector for capturing light from the LED device 50 and directing it forwards out of the package.
  • the side walls 42 are vertical, i.e. at 90° to the contact surface 12 covered in metal coating 20.
  • the inner face 44 of the sidewall extends vertically from the edge of the notch 14 adjacent to the contact surface 12. The side wall 42 completely fills the notch.
  • the embodiments above use a lead frame as the substrate 10, the invention may also be applied to other substrate types.
  • the lead frame is replaced by a flexible substrate having metallisations.
  • Further alternative examples may include the use of an inflexible substrate.
  • the substrate is insulating, not a conductive lead frame, it is possible to provide the gaps 26 only in the metallisation 20 and not in the substrate 10.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Led Device Packages (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

A package is manufactured by placing a substrate (10), for example a lead frame, in a mold (30) with a protection flange (38) extending into a notch (14) in the substrate (10) around a contact surface (12). The protection flange (38) impedes molding compound from reaching the contact surface reducing the need for a deflash step.

Description

MOLDED PACKAGE AND METHOD OF MANUFACTURE
FIELD OF THE INVENTION
The invention relates to a method of manufacturing a package, a package, and a packaged device using the package.
BACKGROUND OF THE INVENTION
Semiconductor devices may be packaged in a number of different ways. One approach that is used is to place a substrate in a mold having a mold cavity and then to inject molding compound into the cavity to form the package.
The substrate may in particular be a lead frame. This approach can result in a low cost package. Such low cost packages may be used in a number of applications, for example to mount light emitting diodes, LEDs.
A problem can however occur in the molding process. Molding compound can get between narrow gaps between the substrate and the mold and coat the substrate in locations where molding compound gives rise to disadvantages. In particular, if molding compound is present on a device mounting surface or bond pad the adhesion of a device to the device mounting surface or the bond to a bond pad can be impaired.
For this reason, a step known as "deflash" may be provided after the molding step to remove molding compound from regions where it is not required. However, this deflash step is an additional step which costs time and therefore money. It would therefore be beneficial if the need for such a deflash step could be reduced or eliminated.
SUMMARY OF THE INVENTION
The invention is defined by the claims.
According to an aspect, there is provided a method of manufacture of a package, comprising:
providing a substrate having a contact surface and a notch extending into the substrate around the contact surface;
providing a mold having a protection flange;
placing the substrate in the mold with the protection flange extending into the notch; and filling the mold with molding compound, the protection flange impeding the flow of the molding compound to the contact surface.
By providing a protection flange around the contact surface during molding, a flow of molding compound between the mold and the contact surface may be impeded. In conventional package molding approaches, such molding compound on the contact surface is removed by a separate process step known as deflashing. The invention may reduce or eliminate the need for this deflashing process step.
Since a deflash step may reduce the adhesion of the remainder of the molding compound to the leadframe and may further reduce reflectivity, these disadvantages of the deflash step may be mitigated using the invention.
The invention is particularly useful for the formation of side walls, and in particular the mold may be shaped to form side walls having an inner surface facing the contact surface, the inner surface being at an angle of 25° to 90° to the contact surface, the angled inner surface extending into the notch. In embodiments, the side walls may shaped to an acute angle of 40° to 85° to the contact surface.
In an embodiment, the substrate is placed in the mold with the contact surface against the mold defining an interface between the mold and the contact surface with the protection flange extending in the notch around the complete circumference of the contact surface, the mold further defining a molding cavity adjacent to the substrate around the protection flange; and
the step of filling the mold with molding compound fills the molding cavity with molding compound to form package walls, the protection flange blocking the molding compound from reaching the interface.
By providing the protection flange around the full circumference of the contact surface and against the interface between the mold and the contact surface an effective blocking of the mold material from the interface may be achieved.
In a particular embodiment, in the step of placing the substrate the substrate is placed such that:
the protection flange extends into the notch on the inner side of the notch adjacent to the contact surface; and
the molding cavity extends into the notch on the outer side of the notch spaced from the contact surface so that in the step of filling the mold with molding compound to form side walls the side walls extend into the notch. The method may further include curing the molding compound to form a finished package ready for mounting a device.
The substrate may have a metal coating on the contact surface for mounting a device in a process that a step of forming the metal coating is prior to the step of placing the substrate in the mold. The metal coating on the substrate may extend as far as the notch and other area outside the notch.
The metal may be silver or copper, which are particularly effective conductors.
The substrate may be a lead frame.
The method of manufacture may further include mounting a device on a contact surface. The device may be a light emitting diode.
The method may further include encapsulating the device in an encapsulant. In this way a finished package including a device may be manufactured.
Thus, the method relates both to forming a package ready for mounting a device as well as a package in its final state with a device mounted in the package.
Accordingly, in another aspect, there is provided a package, comprising:
a substrate having a contact surface and a notch extending around and below the contact surface; and
side walls on the substrate above the substrate around the contact surface; wherein the side walls have an inner surface facing the contact surface and extending into the notch.
The provision of a notch extending around the contact surface and below the level of the contact surface allows the method discussed above to be used. Thus, such a package may be manufactured with less need for a deflash step.
The package may further include a metal layer on the contact surface.
The metal layer may include a device mounting surface and one or more bond pads.
The invention also relates to a package including a device mounted on the contact surface.
An encapsulant may be provided around the device. BRIEF DESCRIPTION OF THE DRAWINGS
Examples of the invention will now be described in detail with reference to the accompanying drawings, in which
Fig. 1 shows a step in the manufacture of a package according to
a first embodiment of the invention;
Fig. 2 shows a package manufactured in this way;
Fig. 3 shows a packaged device using the package of Figure 2; Fig. 4 shows a package according to a second embodiment of the
invention;
Fig. 5 shows a step in the manufacture of a comparative example;
and
Fig. 6 shows a package manufactured according to the comparative
example.
The drawings are not to scale. Like or corresponding components are given the same reference numbers in the different figures and the explanation relating thereto is not necessarily repeated.
DETAILED DESCRIPTION OF THE EMBODIMENTS
In a first embodiment of the invention, referring to Figure 1, a substrate 10 in the form of a conductive lead frame of shaped metal has opposed first 16 and second 18 major surfaces. A contact surface 12 is provided on the first major surface and a notch 14 extends aournd the complete circumference of the contact surface extending from the first major surface towards the second major surface.
A metal coating 20 is provided on the contact surface 12. The metal coating may be for example iron, gold, nickel, palladium, silver or copper.
The contact surface is a surface of the substrate which contacts the device. Note that the contact surface 12 is not a single connected contact surface with a single connected metal coating 20. Instead, there are a number of gaps 26 in the contact surface 12 to allow the contact surface to provide a number of distinct contacts, including a device mounting surface 22 to which the device will be bonded in the finished device and a number of bond pads 24, only one being illustrated in Figur 1. In the embodiment shown the gaps 26 are present in both the lead frame substrate 10 and the metal coating 20. To form a package, the substrate 10 is placed in mold 30. The mold is formed of a first piece 32 and a second piece 34. The second major surface 18 of substrate 10 is placed against the second piece 34 of the mold. The first piece 32 is then placed to define a molding cavity 40 between the first piece 32 and the first major surface 16 of the substrate 10, with sidewalls 36 around the molding cavity 40 and with a protection flange 38 extending into the notch 14 of the substrate 10. The protection flange 38 hence extends into the substrate 10 past the metal coating 20 and the contact surface 12. Note that the protection flange 38 abuts the inner edge of the notch 14, the inner edge of the notch being the edge adjacent to the contact surface 12.
There will inevitably be a small gap at the interface 46 between the first piece
32 and the substrate 10 or metal coating 20, but this interface 46 is surrounded by the protection flange 38.
Molding compound is then injected into the molding cavity 40 under a predetermined pressure and temperature and solidified with heat to form package walls 42. Note that the molding compound also fills gaps 26. A cure at a predetermined temperature and time is then carried out. The formed package is then removed from the mold 30 (Figure 2)·
In this state, the package includes the substrate 10 with the package walls 42 having an inner surface 44 extending into notch 14. Note that the metal coating 20 of the device mounting surface 22 and the bond pad 24 is spaced from the inner surface 44 of the package walls 42.
In the embodiment shown, the inner surface 44 is angled at angle between 25° and 90° to the first major surface 16. Acute angles less than 90° can provide benefits in the finished device. In particular, angles of 40 to 70° can increase light output. However, for accomodating the largest devices, an angle of 90° would be appropriate.
The process according to the embodiment of Figures 1 and 2 may be compared with a comparative example of Figures 5 and 6. The comparative example is the same as the embodiment except that the mold 30 in the comparative example omits the protection flange 38. Accordingly, the same reference numbers are used for like components in the comparative example and the description not repeated.
During the process according to the embodiment of Figures 1 and 2, molding compound is impeded or prevented from reaching the contact surface 12 by the protection flange 38 which extends between the molding cavity 40 and the contact surface 12. In contrast, in the comparative example of Figures 5 and 6, even if the first piece 32 of the mold abuts the contact surface 12 or the metal coating 20, there remains a gap at the interface 46 which some molding compound enters under pressure. The molding compound will affect the reflectivity and thermal stability of the finished device.
Accordingly, in the comparative example an extra step is needed, namely a deflash step.
Thus, in the embodiment of Figures 1 and 2, the protection flange 38 blocks the interface 46 between the metal coating 22 and the first piece 32 of the mold 30. This impedes the molding compound from entering any gap at this interface 46 which in turn means that there is no need for a deflash step to remove molding compound.
Returning to the first embodiment, the package of Figure 2 may be used to prepare a packaged device as illustrated in Figure 3. A device chip 50 is mounted onto the device mounting surface 22 in any known way. If required, bond wires 52 make connection to the bond pads 24 on substrate 10. Alternative bonding techniques such as for example flip chip bonding may also be used. Note that the device mounting surface 22 and bond pads 24 are protected from the intrusion of molding compound in the method of manufacturing the package as discussed above.
Then encapsulant 54, for example of silicone, is introduced into the package between sidewalls 36 of the mold 30 and covering the device chip 50. This encapsulant 54 also fills the empty part of notch 14.
The device chip 50 may in particular be a light emitting diode, LED. The packaged LED device may be used in lighting, for backlight, flash, automotive and display applications, or for traffic signals and the like.
In the embodiment of Figures 1 to 3, the inner surface 44 is angled at an acute angle less than 90° to the contact surface which provides an angled reflector for capturing light from the LED device 50 and directing it forwards out of the package.
In an alternative embodiment, illustrated in Figure 4, the side walls 42 are vertical, i.e. at 90° to the contact surface 12 covered in metal coating 20. In this embodiment, the inner face 44 of the sidewall extends vertically from the edge of the notch 14 adjacent to the contact surface 12. The side wall 42 completely fills the notch.
Although the embodiments above use a lead frame as the substrate 10, the invention may also be applied to other substrate types. In an alternative example, the lead frame is replaced by a flexible substrate having metallisations. Further alternative examples may include the use of an inflexible substrate. In the case where the substrate is insulating, not a conductive lead frame, it is possible to provide the gaps 26 only in the metallisation 20 and not in the substrate 10.
Other variations to the disclosed embodiments can be understood and effected by those skilled in the art in practicing the claimed invention, from a study of the drawings, the disclosure, and the appended claims. In the claims, the word "comprising" does not exclude other elements or steps, and the indefinite article "a" or "an" does not exclude a plurality. The mere fact that certain measures are recited in mutually different dependent claims does not indicate that a combination of these measured cannot be used to advantage. Any reference signs in the claims should not be construed as limiting the scope.

Claims

CLAIMS:
1. A method of manufacture of a package, comprising:
providing a substrate(lO) having a contact surface (12) and a notch (14) extending into the substrate around the contact surface (12);
providing a mold (30) having a protection flange (38);
placing the substrate (10) in the mold (30) with the protection flange (38) extending into the notch (14); and
filling the mold (30) with molding compound, the protection flange (38) impeding the flow of the molding compound to the contact surface (12).
2. A method of manufacture according to claim 1, wherein the mold (30) is shaped to form package walls (42) having an inner surface (44) extending into the notch (14).
3. A method of manufacture according to claim 1 or 2, wherein
the substrate (10) is placed in the mold (30) with the contact surface (12) against the mold (30) defining an interface (46) between the mold (30) and the contact surface (12) with the protection flange (38) extending in the notch (14) around the complete circumference of the contact surface (12), the mold (30) further defining a molding cavity (40) adjacent to the substrate (10) around the protection flange (38); and
the step of filling the mold (30) with molding compound fills the molding cavity (40) with molding compound to form package walls (42), the protection flange (38) blocking the molding compound from reaching the interface (46).
4. A method of manufacture according to claim 3, wherein in the step of placing the substrate:
the protection flange (38) extends into the notch (14) on the inner side of the notch adjacent to the contact surface (12); and
the molding cavity (40) extends into the notch (14) on the outer side of the notch spaced from the contact surface (12) so that in the step of filling the mold (30) with molding compound to form package walls (42) the package walls (42) extend into the notch.
5. A method of manufacture according to any preceding claim, further comprising:
curing the molding compound.
6. A method of manufacture according to any preceding claim, wherein the substrate (10) has a metal coating (20) on the contact surface (12).
7. A method of manufacture according to claim 6 wherein said metal coating (20) comprises iron, gold, nickel, palladium, silver or copper.
8. A method of manufacture according to any preceding claim, further comprising mounting a device (50) on the contact surface (12).
9. A method of manufacture according to claim 8, wherein the device (50) is a light emitting diode.
10. A method of manufacture according to claim 8 or 9, further comprising encapsulating the device (50) in an encapsulant (54).
11. A package, comprising:
a substrate (10) having a contact surface (12) and a notch (14) extending around the contact surface, with a metal coating (20) on the contact surface; and
package walls (42) on the substrate (10) around the contact surface (12) extending away from the plane of the contact surface;
wherein the package walls (42) have an inner surface (44) at an angle of 25° to 85° or 90° to the contact surface extending into the notch (14); and
the metal coating (20) is spaced from the inner surface (44) of the package walls (42).
12. A package according to claim 11, wherein the inner surface (44) is at an angle of 25° to 85° to the contact surface.
13. A package according to claim 11, wherein the inner surface (44) is at an angle of 90° to the contact surface.
14. A package according to claim 11, 12 or 13, further comprising a metal layer (20) on the contact surface (12).
15. A package according to claim 11, 12, 13 or 14 further comprising a device (50) mounted on the contact surface (12), optionally further comprising an encapsulant (54) around the device.
PCT/EP2015/073134 2014-10-13 2015-10-07 Molded package and method of manufacture WO2016058885A1 (en)

Priority Applications (6)

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JP2017538290A JP6738813B2 (en) 2014-10-13 2015-10-07 Molded package and manufacturing method
US15/517,725 US10629456B2 (en) 2014-10-13 2015-10-07 Molded package and method of manufacture
KR1020177012919A KR102465972B1 (en) 2014-10-13 2015-10-07 Molded package and method of manufacture
EP15775701.4A EP3207562B1 (en) 2014-10-13 2015-10-07 Molded package and method of manufacture
CN201580055617.6A CN106796894A (en) 2014-10-13 2015-10-07 Mold encapsulated piece installing and manufacture method
US16/828,618 US10879084B2 (en) 2014-10-13 2020-03-24 Molded package

Applications Claiming Priority (4)

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CN2014000900 2014-10-13
CNPCT/CN2014/000900 2014-10-13
EP14191281.6 2014-10-31
EP14191281 2014-10-31

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US16/828,618 Division US10879084B2 (en) 2014-10-13 2020-03-24 Molded package

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JP2017531328A (en) 2017-10-19
CN106796894A (en) 2017-05-31
EP3207562A1 (en) 2017-08-23
US20200227282A1 (en) 2020-07-16
US20170330768A1 (en) 2017-11-16
KR20170067875A (en) 2017-06-16
US10879084B2 (en) 2020-12-29
JP6738813B2 (en) 2020-08-12
US10629456B2 (en) 2020-04-21
KR102465972B1 (en) 2022-11-10
EP3207562B1 (en) 2019-08-28

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