WO2016053966A3 - Temperature regulation using phase change materials contained in an emi can - Google Patents

Temperature regulation using phase change materials contained in an emi can Download PDF

Info

Publication number
WO2016053966A3
WO2016053966A3 PCT/US2015/052831 US2015052831W WO2016053966A3 WO 2016053966 A3 WO2016053966 A3 WO 2016053966A3 US 2015052831 W US2015052831 W US 2015052831W WO 2016053966 A3 WO2016053966 A3 WO 2016053966A3
Authority
WO
WIPO (PCT)
Prior art keywords
phase change
temperature regulation
emi
change materials
materials contained
Prior art date
Application number
PCT/US2015/052831
Other languages
French (fr)
Other versions
WO2016053966A2 (en
Inventor
Amit Kulkarni
Daniel Maslyk
Mulugeta BERHE
Original Assignee
Henkel IP & Holding GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Henkel IP & Holding GmbH filed Critical Henkel IP & Holding GmbH
Priority to CN201580045982.9A priority Critical patent/CN106717141B/en
Publication of WO2016053966A2 publication Critical patent/WO2016053966A2/en
Publication of WO2016053966A3 publication Critical patent/WO2016053966A3/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20454—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff with a conformable or flexible structure compensating for irregularities, e.g. cushion bags, thermal paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20463—Filling compound, e.g. potted resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20472—Sheet interfaces
    • H05K7/20481—Sheet interfaces characterised by the material composition exhibiting specific thermal properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0032—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Inorganic Compounds Of Heavy Metals (AREA)

Abstract

Provided herein are multicomponent shield can(s) for temporary heat storage and junction temperature regulation using a phase change material (PCM) contained therein. Invention articles can be applied to most electronic devices, especially to small portable electronic devices such as cell phones and tablets.
PCT/US2015/052831 2014-09-30 2015-09-29 Temperature regulation using phase change materials contained in an emi can WO2016053966A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201580045982.9A CN106717141B (en) 2014-09-30 2015-09-29 Temperature regulation using electromagnetic interference in-tank phase change materials

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201462057386P 2014-09-30 2014-09-30
US62/057,386 2014-09-30

Publications (2)

Publication Number Publication Date
WO2016053966A2 WO2016053966A2 (en) 2016-04-07
WO2016053966A3 true WO2016053966A3 (en) 2016-06-30

Family

ID=55631751

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2015/052831 WO2016053966A2 (en) 2014-09-30 2015-09-29 Temperature regulation using phase change materials contained in an emi can

Country Status (3)

Country Link
CN (1) CN106717141B (en)
TW (1) TWI714535B (en)
WO (1) WO2016053966A2 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9836100B2 (en) * 2014-10-15 2017-12-05 Futurewei Technologies, Inc. Support frame with integrated phase change material for thermal management
CN105246314B (en) 2015-10-14 2018-09-04 小米科技有限责任公司 Shielding case, pcb board and terminal device
CN106132072A (en) * 2016-07-07 2016-11-16 广东欧珀移动通信有限公司 A kind of chip shielding construction and mobile terminal
CN107820359A (en) * 2016-09-14 2018-03-20 深圳市掌网科技股份有限公司 A kind of main PCB A plates
CN107172868A (en) * 2017-07-17 2017-09-15 河北建筑工程学院 Housing of electronic equipment and preparation method thereof
CN107509381B (en) * 2017-09-15 2019-11-15 维沃移动通信有限公司 A kind of production method of screening cover, screening cover and mobile terminal
CN107872944B (en) * 2017-11-29 2019-09-06 东莞市鸿艺电子有限公司 A kind of heat storage type temprature control method of mobile device
EP4091062A1 (en) 2020-01-17 2022-11-23 Sew-Eurodrive GmbH & Co. KG Sensor module for a mobile part, mobile part and system
CN113490402B (en) * 2021-09-08 2021-11-02 凯瑞电子(诸城)有限公司 Electronic component shell packaging structure

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5294826A (en) * 1993-04-16 1994-03-15 Northern Telecom Limited Integrated circuit package and assembly thereof for thermal and EMI management
US5371404A (en) * 1993-02-04 1994-12-06 Motorola, Inc. Thermally conductive integrated circuit package with radio frequency shielding
US5486720A (en) * 1994-05-26 1996-01-23 Analog Devices, Inc. EMF shielding of an integrated circuit package
US7164587B1 (en) * 2004-01-14 2007-01-16 Sun Microsystems, Inc. Integral heatsink grounding arrangement
US20070090502A1 (en) * 2005-10-20 2007-04-26 Broadcom Corporation Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in leadframe integrated circuit (IC) packages
US7623360B2 (en) * 2006-03-09 2009-11-24 Laird Technologies, Inc. EMI shielding and thermal management assemblies including frames and covers with multi-position latching

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6965072B2 (en) * 2003-02-07 2005-11-15 Nokia Corporation Shielding arrangement
TW200532422A (en) * 2004-03-16 2005-10-01 Ind Tech Res Inst Thermal module with heat reservoir and method of applying the same on electronic products

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5371404A (en) * 1993-02-04 1994-12-06 Motorola, Inc. Thermally conductive integrated circuit package with radio frequency shielding
US5294826A (en) * 1993-04-16 1994-03-15 Northern Telecom Limited Integrated circuit package and assembly thereof for thermal and EMI management
US5486720A (en) * 1994-05-26 1996-01-23 Analog Devices, Inc. EMF shielding of an integrated circuit package
US7164587B1 (en) * 2004-01-14 2007-01-16 Sun Microsystems, Inc. Integral heatsink grounding arrangement
US20070090502A1 (en) * 2005-10-20 2007-04-26 Broadcom Corporation Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in leadframe integrated circuit (IC) packages
US7623360B2 (en) * 2006-03-09 2009-11-24 Laird Technologies, Inc. EMI shielding and thermal management assemblies including frames and covers with multi-position latching

Also Published As

Publication number Publication date
CN106717141A (en) 2017-05-24
CN106717141B (en) 2020-12-22
WO2016053966A2 (en) 2016-04-07
TW201622551A (en) 2016-06-16
TWI714535B (en) 2021-01-01

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