WO2016043275A1 - Surface-protective film - Google Patents

Surface-protective film Download PDF

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Publication number
WO2016043275A1
WO2016043275A1 PCT/JP2015/076512 JP2015076512W WO2016043275A1 WO 2016043275 A1 WO2016043275 A1 WO 2016043275A1 JP 2015076512 W JP2015076512 W JP 2015076512W WO 2016043275 A1 WO2016043275 A1 WO 2016043275A1
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WO
WIPO (PCT)
Prior art keywords
film
protective film
surface protective
adhesive
pressure
Prior art date
Application number
PCT/JP2015/076512
Other languages
French (fr)
Japanese (ja)
Inventor
雄一 倉田
克彦 堀米
仁 大橋
剛史 安齋
Original Assignee
リンテック株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by リンテック株式会社 filed Critical リンテック株式会社
Priority to JP2016548945A priority Critical patent/JP6756429B2/en
Publication of WO2016043275A1 publication Critical patent/WO2016043275A1/en

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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00Adhesives based on unspecified macromolecular compounds
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/06Non-macromolecular additives organic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers

Definitions

  • the present invention relates to a surface protective film that is applied to the surface of various optical members and electronic members and used to protect the surface.
  • a base material of such a surface protective film for example, it is known to use a polyethylene terephthalate film from the viewpoint of obtaining transparency and a base material such as polyimide or polyethylene naphthalate from the viewpoint of heat resistance. (See Patent Document 1).
  • the present invention has been made in view of the above problems, and an object of the present invention is an optical member that is excellent in workability at the time of pasting and peeling, and has a low load on an adherend at the time of peeling work. Or it is providing the surface protection film for electronic members.
  • the surface protective film has a base material having a specific bending resistance, a pressure-sensitive adhesive layer having a specific elastic modulus provided on one surface of the base material, and the pressure-sensitive adhesive layer.
  • a release film with a thickness of 20 ⁇ m or more provided on the agent layer, and the ratio of the bending resistance of the substrate to the bending resistance of the peeling film [the bending resistance of the substrate / the bending resistance of the peeling film It was found that the above problem can be solved when the degree] is 1 or more, and the present invention has been completed. That is, the present invention provides the following [1] to [8].
  • a surface protective film that is applied to an optical member or an electronic member and used to protect the surface thereof,
  • a base material including a polyethylene terephthalate film, a pressure-sensitive adhesive layer provided on one surface of the base material, and a release film provided on the pressure-sensitive adhesive layer,
  • a surface protective film satisfying the following (A) to (D).
  • (A) The bending resistance of the base material is 5000 to 85000 mN ⁇ cm.
  • the elastic modulus of the pressure-sensitive adhesive layer is 1.0 ⁇ 10 4 to 1.0 ⁇ 10 7 Pa.
  • the thickness of the release film is 20 ⁇ m or more.
  • the ratio of the stiffness of the substrate to the stiffness of the release film [the stiffness of the substrate / the stiffness of the release film] is 1. .0 to 4.0
  • the surface protective film according to [1], wherein the pressure-sensitive adhesive layer is made of a pressure-sensitive adhesive composition containing an acrylic copolymer.
  • the surface protective film according to [2], wherein the pressure-sensitive adhesive composition containing the acrylic copolymer further contains a silane coupling agent.
  • the present invention it is possible to provide a surface protective film for an optical member or an electronic member that is excellent in workability at the time of pasting and peeling and has a small load on the adherend during the peeling work.
  • weight average molecular weight (Mw) is a value in terms of standard polystyrene measured by a gel permeation chromatography (GPC) method, specifically, the method described in the examples. Based on the measured value.
  • GPC gel permeation chromatography
  • (meth) acrylate is a term meaning both “acrylate” and “methacrylate”, and other similar terms are also the same.
  • the surface protective film of the present invention is used to protect the surface of an optical member or an electronic member, and is provided on a base material including a polyethylene terephthalate film and one surface of the base material. And a release film provided on the pressure-sensitive adhesive layer and satisfying the following (A) to (D).
  • the bending resistance of the base material is 5000 to 85000 mN ⁇ cm.
  • the elastic modulus of the pressure-sensitive adhesive layer is 1.0 ⁇ 10 4 to 1.0 ⁇ 10 7 Pa.
  • the thickness of the release film is 20 ⁇ m or more.
  • the ratio of the stiffness of the substrate to the stiffness of the release film [the stiffness of the substrate / the stiffness of the release film] is 1. .0 to 4.0
  • each member of the surface protective film will be described.
  • the “adhesive film” refers to a configuration composed of a portion of the surface protective film excluding the release film.
  • the substrate possessed by the surface protective film of the present invention is a substrate including a polyethylene terephthalate film, and has a bending resistance of 5000 to 85000 mN ⁇ cm.
  • a base material having a bending resistance of less than 5000 mN ⁇ cm is used, when the obtained surface protection film is applied to the surface of an optical member or an electronic member, the surface protection film is weak, so it is applied to the target application position. It becomes difficult to work and the workability is inferior.
  • the bending resistance of the substrate is preferably 10,000 mN ⁇ cm or more, more preferably 15000 mN ⁇ cm or more, and preferably 50000 mN ⁇ cm or less, more preferably 45000 mN ⁇ cm or less.
  • the bending resistance is a value measured by a method according to JIS L 1913. More specifically, the bending resistance is a value measured and calculated based on a method described in Examples described later.
  • the polyethylene terephthalate film may further be laminated with a film made of one or more resins selected from the following resins.
  • the resin film laminated on the polyethylene terephthalate film is not particularly limited as long as the bending resistance of the substrate is in the above range.
  • polyester such as polyethylene naphthalate, polybutylene terephthalate, wholly aromatic polyester, polyamide, polyimide , Resin films made of polyacetal, polycarbonate, modified polyphenylene oxide, polyphenylene sulfide, polysulfone, polyether ketone, polypropylene, polyethylene, or biaxially stretched films thereof.
  • the base material used in the present invention may contain a filler, a colorant, an antistatic agent, a flame retardant, an antioxidant, an organic lubricant, a catalyst, and the like as long as the effects of the present invention are not impaired.
  • the substrate may be transparent or opaque, and may be colored or vapor-deposited as desired.
  • at least one surface of the substrate used in the present invention may be subjected to an adhesion treatment such as a corona treatment, or may be provided with an easy adhesion layer described later. Good.
  • the thickness of the substrate is not particularly limited as long as the bending resistance of the substrate is in the above range, but the workability at the time of attaching and peeling the surface protective film of the present invention to the optical member or the electronic member is improved. From the viewpoint of improving the thickness, the thickness is preferably 40 to 150 ⁇ m, more preferably 50 to 130 ⁇ m, and still more preferably 70 to 110 ⁇ m.
  • the adhesive layer of the surface protective film of the present invention has an elastic modulus of 1.0 ⁇ 10 4 to 1.0 ⁇ 10 7 Pa.
  • a pressure-sensitive adhesive layer having an elastic modulus of less than 1.0 ⁇ 10 4 Pa is used, the difference in pressure-sensitive adhesive strength before and after heating at 80 ° C. of the obtained surface protective film becomes large. It becomes difficult.
  • an adhesive layer having an elastic modulus exceeding 1.0 ⁇ 10 7 Pa is used, the adhesive layer becomes too hard when the adhesive film attached to the optical member or electronic member surface is peeled off from the member surface. Therefore, it becomes difficult to peel off and workability is inferior.
  • the elastic modulus of the pressure-sensitive adhesive layer is preferably 1.0 ⁇ 10 5 to 1.5 ⁇ 10 6 Pa, more preferably 1.5 ⁇ 10 5 to 1.2 ⁇ 10 6 Pa. is there. More specifically, the above-described elastic modulus is a value measured based on the method described in Examples described later.
  • an adhesive which forms the adhesive layer which the surface protection film of this invention has, for example, an acrylic adhesive, a urethane adhesive, a silicone adhesive, a rubber adhesive, a polyester adhesive Is mentioned. These pressure-sensitive adhesives may be used alone or in combination of two or more.
  • the said adhesive it is preferable that it is an acrylic adhesive.
  • it is the said acrylic adhesive, it is generally an acrylic adhesive (henceforth an "acrylic adhesive composition") containing an acrylic copolymer.
  • the acrylic copolymer usually constitutes a pressure-sensitive adhesive component in the pressure-sensitive adhesive layer, and is hereinafter also referred to as “main polymer”.
  • the main polymer constituting the pressure-sensitive adhesive component is acrylic.
  • a polymer other than the copolymer is used.
  • the acrylic copolymer is obtained by copolymerizing a monomer component containing alkyl (meth) acrylate as a main monomer (hereinafter also referred to as “copolymer component”).
  • alkyl (meth) acrylate include those having 1 to 18 carbon atoms in the alkyl group, such as methyl (meth) acrylate, ethyl (meth) acrylate, isopropyl (meth) acrylate, n-propyl (meth) acrylate, and butyl.
  • the acrylic copolymer preferably contains 50% by mass or more, more preferably 50 to 99% by mass of alkyl (meth) acrylate as a copolymer component with respect to the total amount of the copolymer component.
  • the acrylic copolymer contains, as a copolymer component, an alkyl (meth) acrylate having an alkyl group having 3 or more carbon atoms among alkyl (meth) acrylates in an amount of 30 to 98 mass based on the total amount of the copolymer component. % Content is preferable.
  • content of the alkyl (meth) acrylate whose carbon number of an alkyl group is 3 or more into such a range, it becomes easy to provide suitable adhesive performance and peeling performance to a surface protection film. From such a viewpoint, the content of the alkyl (meth) acrylate having 3 or more carbon atoms in the alkyl group is more preferably 40 to 97% by mass, and further preferably 45 to 96% by mass.
  • the alkyl (meth) acrylate having 3 or more carbon atoms in the alkyl group is preferably an alkyl (meth) acrylate in which the alkyl group has 3 to 8 carbon atoms, and the alkyl group has 4 to 8 carbon atoms.
  • Alkyl (meth) acrylates are more preferred, and alkyl acrylates having an alkyl group with 4 to 8 carbon atoms are even more preferred.
  • n-butyl acrylate, 2-ethylhexyl acrylate, n-octyl acrylate, isooctyl acrylate, and the like are preferable.
  • the acrylic copolymer contains 5 alkyl (meth) acrylates having 1 or 2 carbon atoms in the alkyl group among the alkyl (meth) acrylate as a copolymer component, based on the total amount of the copolymer component. It may be contained in an amount of up to 50% by mass. More preferably, the acrylic copolymer contains 10 to 40% by mass of an alkyl (meth) acrylate having 1 or 2 carbon atoms in the alkyl group as a copolymer component, based on the total amount of the copolymer component. 15 to 35% by mass is more preferable.
  • alkyl (meth) acrylate having 1 or 2 carbon atoms in the alkyl group examples include methyl (meth) acrylate and ethyl (meth) acrylate. Among these, methyl acrylate and methyl methacrylate are preferable.
  • the acrylic copolymer preferably contains a polymerizable monomer other than alkyl (meth) acrylate as the copolymer component, and specifically contains a functional group-containing monomer.
  • the functional group-containing monomer provides a functional group necessary for reaction with a cross-linking agent described later.
  • the functional group-containing monomer is a monomer having a polymerizable double bond and a functional group such as a hydroxyl group, a carboxyl group, an amino group, a substituted amino group, and an epoxy group in the molecule.
  • the acrylic copolymer is preferably a copolymer component obtained by copolymerizing a copolymer component containing 0.1 to 40% by mass of a functional group-containing monomer with respect to the total amount of the copolymer component.
  • the acrylic copolymer can be appropriately crosslinked with a crosslinking agent described later.
  • the content of the functional group-containing monomer is more preferably 0.2 to 30% by mass.
  • the functional group-containing monomer is 0.2 to 30% by mass, it is possible to appropriately crosslink the acrylic copolymer with a cross-linking agent to be described later while ensuring appropriate adhesive performance.
  • examples of the carboxyl group-containing monomer include acrylic acid, methacrylic acid, and itaconic acid.
  • Specific examples of the hydroxyl group-containing (meth) acrylate include hydroxymethyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 3-hydroxypropyl (meth) acrylate, 2 -Hydroxybutyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate and the like.
  • glycidyl (meth) acrylate methyl glycidyl (meth) acrylate, allyl glycidyl ether etc. are mentioned, for example.
  • the above functional group-containing monomers may be used alone or in combination of two or more.
  • the acrylic copolymer is a copolymer of (meth) acrylic acid esters, dialkyl (meth) acrylamides, vinyl formate, vinyl acetate, and styrene other than alkyl (meth) acrylate and functional group-containing monomers. It may be included as a coalescence component.
  • acrylic acid esters other than (meth) acrylic acid alkyl esters and functional group-containing monomers (meth) acrylic acid alkoxyalkyl esters, (meth) acrylic acid alkyleneoxyalkyl esters, (meth) acrylic acid nonylphenoxy polyethylene Glycol, tetrahydrofuran furfuryl acrylate, diacrylates which are esters of polyether and acrylic acid, and the like may also be used.
  • dialkyl (meth) acrylamide dimethyl (meth) acrylamide, diethyl (meth) acrylamide and the like are used.
  • the weight average molecular weight of the acrylic copolymer is preferably 100,000 or more, more preferably 100,000 to 1500,000, and still more preferably 150,000 to 1,000,000.
  • a silane coupling agent an organosilicon compound having at least one alkoxysilyl group in the molecule, having good compatibility with the pressure-sensitive adhesive component and having light transmittance, for example, a substantially transparent one.
  • the amount of such a silane coupling agent is preferably 0.01 to 1.5 parts by weight, particularly 0.05 to 1.0 parts by weight, based on 100 parts by weight of the acrylic copolymer. It is preferable.
  • silane coupling agent examples include polymerizable unsaturated group-containing silicon compounds such as vinyltrimethoxysilane, vinyltriethoxysilane, (meth) acryloxypropyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 2 Silicon compounds having an epoxy structure such as-(3,4-epoxycyclohexyl) ethyltrimethoxysilane, 3-aminopropyltrimethoxysilane, N- (2-aminoethyl) -3-aminopropyltrimethoxysilane, N- ( Examples include amino group-containing silicon compounds such as 2-aminoethyl) -3-aminopropylmethyldimethoxysilane, 3-chloropropyltrimethoxysilane, and 3-isocyanatopropyltriethoxysilane. You may use these 1 type or in combination of 2 or more types.
  • the pressure-sensitive adhesive layer may have a crosslinked structure in which an acrylic copolymer is crosslinked.
  • the crosslinking agent contained in the pressure-sensitive adhesive composition for crosslinking include an organic polyvalent isocyanate compound, an organic polyvalent epoxy compound, and an organic polyvalent imine compound.
  • organic polyvalent isocyanate compounds include aromatic polyvalent isocyanate compounds, aliphatic polyvalent isocyanate compounds, alicyclic polyvalent isocyanate compounds, trimers of these organic polyvalent isocyanate compounds, and these organic polyvalent isocyanate compounds.
  • examples thereof include terminal isocyanate urethane prepolymers obtained by reacting with a polyol compound.
  • organic polyvalent isocyanate compound examples include 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 1,3-xylylene diisocyanate, 1,4-xylene diisocyanate, diphenylmethane-4,4.
  • organic polyvalent epoxy compound examples include 1,3-bis (N, N′-diglycidylaminomethyl) cyclohexane, N, N, N ′, N′-tetraglycidyl-m-xylylenediamine, Examples thereof include ethylene glycol diglycidyl ether, 1,6-hexanediol diglycidyl ether, trimethylolpropane diglycidyl ether, diglycidyl aniline, diglycidyl amine and the like.
  • organic polyvalent imine compound examples include N, N′-diphenylmethane-4,4′-bis (1-aziridinecarboxamide), trimethylolpropane-tri- ⁇ -aziridinylpropionate, tetra Examples include methylolmethane-tri- ⁇ -aziridinylpropionate and N, N′-toluene-2,4-bis (1-aziridinecarboxamide) triethylenemelamine.
  • the content of the crosslinking agent is preferably 0.01 to 20 parts by mass, more preferably 0.1 to 15 parts by mass, and still more preferably 0.5 to 8 parts by mass with respect to 100 parts by mass of the acrylic copolymer. It is used in the ratio.
  • the content of the cross-linking agent is not more than the above upper limit value, the pressure-sensitive adhesive layer is prevented from being excessively cross-linked, and appropriate adhesive force is easily obtained.
  • the usage-amount of a crosslinking agent more than the said lower limit, it is prevented that an adhesive adheres to an electronic member or an optical member.
  • the pressure-sensitive adhesive layer may be colored so that the light transmittance of the surface protective film is less than 80%.
  • the visibility of the surface protective film is improved by coloring the pressure-sensitive adhesive layer. Therefore, for example, when the surface protective film is peeled off manually from a release film described later, or because the surface protective film is easily attached to the adherend to be protected, it is easy to peel off, and , Can also prevent forgetting to peel off.
  • the light transmittance of the surface protective film is measured with a spectrophotometer UV-3600 manufactured by Shimadzu Corporation at a wavelength of 600 nm.
  • the light transmittance is preferably about 30 to 70%.
  • the pressure-sensitive adhesive composition usually contains a dye and a pigment, and among them, a blue dye and a blue pigment are preferably contained.
  • the above-mentioned pressure-sensitive adhesives include antioxidants, softeners (plasticizers), deterioration inhibitors, antistatic agents, flame retardants, rust inhibitors, fillers, silicone compounds, chain transfer agents, and other components other than those described above. Components may be appropriately contained.
  • a release film is affixed to the pressure-sensitive adhesive layer side of the surface protective film of the present invention.
  • the release film of the surface protective film of the present invention has a thickness of 20 ⁇ m or more.
  • the thickness of the release film is preferably 30 ⁇ m or more, more preferably 50 ⁇ m or more.
  • the release film of the present invention a release film that has been subjected to a double-sided release process, a release film that has been subjected to a single-sided release process, or the like is used, and examples include those in which a release agent is applied on the surface of a release film substrate.
  • a resin film is preferable. Examples of the resin constituting the resin film include a polyester resin such as a polyethylene terephthalate resin, a polybutylene terephthalate resin, and a polyethylene naphthalate resin, a polypropylene resin, and a polyethylene resin.
  • Examples include polyolefin resins.
  • Examples of the release agent include rubber elastomers such as silicone resins, olefin resins, isoprene resins, and butadiene resins, long chain alkyl resins, alkyd resins, and fluorine resins.
  • the release film of the surface protective film of the present invention preferably has a bending resistance of 2000 to 42500 mN ⁇ cm.
  • the bending softness of the release film is 2000 mN ⁇ cm or more, the stiffness does not become too weak, and the surface protection film can be easily handled.
  • the bending softness of the release film is 42500 mN ⁇ cm or less, the stiffness does not become too strong, and the release film is easily peeled off from the adhesive film manually.
  • the bending resistance of the release film is more preferably 6000 mN ⁇ cm or more. More preferably, it is 30000 mN / cm or less.
  • the bending resistance is a value measured by a method according to JIS L 1913.
  • the release film of the surface protective film of the present invention preferably has a peel strength of 50 mN / 50 mm or more and 200 mN / 50 mm or less.
  • a punching blade is inserted so as to reach the release film from the surface of the surface protective film on the base material side, and only the adhesive film is punched into a predetermined shape.
  • the release force of the release film is 50 mN / 50 mm or more, it is possible to prevent an increase during the punching process. Moreover, if peeling force is 200 mN / 50 mm or less, peeling of a peeling film will become easy and the workability
  • the ratio of the stiffness of the substrate and the stiffness of the release film [the stiffness of the substrate / the stiffness of the release film] of the surface protective film of the present invention is 1.0 to 4.0. It is. When the ratio is less than 1.0, when the film is a small size, when the release film of the surface protection film is folded, the adhesive film partially peeled from the release film is peeled off at the time of application. As a trigger), it is difficult to peel off the adhesive film from the release film (also referred to as “cueing”), so it is easy to cause misalignment when sticking to the adherend, and the frequency of reattachment increases. Workability at the time of pasting is inferior. In general, the thicker the substrate, the higher the bending resistance of the substrate.
  • the ratio is preferably 1.0 or more and 3.0 or less.
  • the base material of the present invention may have an easy adhesion layer on the surface on which the pressure-sensitive adhesive layer is provided in order to improve adhesion.
  • a composition for easy-adhesion layer formation which forms an easy-adhesion layer
  • the easy-adhesion layer-forming composition contains a crosslinking agent, a photopolymerization initiator, an antioxidant, a softening agent (plasticizer), a filler, a rust inhibitor, a pigment, a dye, and the like as necessary. May be.
  • the thickness of the easy adhesion layer is preferably 0.01 to 10 ⁇ m, more preferably 0.03 to 5 ⁇ m.
  • the size of the surface protective film is preferably 100 mm 2 or less, more preferably about 10 to 80 mm 2 .
  • the size of the surface protective film here refers to the area of the adhesive film portion.
  • the size of the adhesive film is reduced depending on the optical member and the electronic member. Generally, when the size of the surface protective film is reduced, operations such as pasting and peeling become difficult. Since the surface protective film of the present invention has good peeling performance as described above, it is easy to peel off even by manual work.
  • the shape of the adhesive film is not limited, but is processed into, for example, a circle, a square, a rectangle, an annular shape, or the like.
  • the surface protective film preferably has an adhesive strength to liquid crystal plastic of 400 to 1000 mN / 25 mm under conditions of 23 ° C. and 50% RH (relative humidity) before and after heating at 80 ° C. for 2 hours.
  • the adhesive strength before and after heating at 80 ° C. for 2 hours is 400 mN / 25 mm or more, the adhesive strength of the surface protective film to the optical member and the electronic member is increased, and the protective performance is improved.
  • the adhesive force before and after heating at 80 ° C. for 2 hours is 1000 mN / 25 mm or less, so that the adhesive film can be easily peeled off from the optical member or the electronic member as the adherend, It is possible to prevent an excessive load from being applied to the adherend.
  • the optical member or the electronic member to which the adhesive film is attached may be heated in processes such as processing, attachment, inspection, or conveyance.
  • the adhesive strength of the adhesive film is increased by heating, workability at the time of peeling the adhesive film is lowered. Therefore, the adhesive strength of the surface protective film before and after heating the surface protective film at 80 ° C. for 2 hours is 400 to The range is preferably 1000 mN / 25 mm. From such a point of view, the adhesive strength to liquid crystal plastics under conditions of 23 ° C. and 50% RH (relative humidity) before and after heating for 2 hours at 80 ° C. is preferably 450 to 800 mN / 25 mm, more preferably 500 to 800 mN / 25 mm.
  • the above-mentioned adhesive strength can be adjusted by the kind and blending ratio of the monomers constituting the main polymer constituting the aforementioned pressure-sensitive adhesive layer, the amount of the crosslinking agent used, and the like. It is also affected by the bending resistance of the substrate. More specifically, the above-mentioned adhesive strength of the surface protective film is a value measured based on the method described in Examples described later.
  • ⁇ Method for producing surface protective film> There is no restriction
  • a surface protection film may provide an adhesive layer partially on a support body (the said base material or peeling film), and may form a non-adhesion part with an adhesion part on a support body.
  • screen printing or inkjet printing may be performed.
  • the adhesive portion and the non-adhesive portion may be arranged in any pattern selected from a stripe shape, a lattice shape, a dot shape, a shape in which a plurality of wavy lines are arranged, a checkered pattern, and a shape in which various patterns are arranged in a plurality. Other shapes may be preferable.
  • the pattern is normally provided in the whole surface of a support body.
  • the surface protective film may be provided with a pressure-sensitive adhesive layer on the entire surface of the substrate, and a partially non-adhesive resin layer may be further formed on the pressure-sensitive adhesive layer.
  • screen printing or inkjet printing may be performed.
  • the non-adhesive resin layer is arranged in any pattern selected from a stripe shape, a lattice shape, a dot shape, a shape in which a plurality of wavy lines are arranged, a checkered pattern, and a shape in which various patterns are arranged in a plurality.
  • the pitch of the pattern (that is, The distance between adjacent adhesive parts or the distance between adjacent non-adhesive parts is preferably 10 to 500 ⁇ m, more preferably 10 to 300 ⁇ m, and particularly preferably 10 to 250 ⁇ m.
  • the width and height of the dots, or the height and width of each square constituting the checkered pattern is preferably 10 to 500 ⁇ m, more preferably 10 to 300 ⁇ m, and particularly preferably 10 to 250 ⁇ m.
  • the punching process may be performed before or after the pressure-sensitive adhesive layer is formed.
  • the punching process may be performed on the laminate of the base material and the pressure-sensitive adhesive layer provided on the release film.
  • the shape of the pressure-sensitive adhesive film is circular, square, rectangular, or annular.
  • the shape such as the shape can be adjusted.
  • a punching blade is inserted so as to reach the release film from the surface of the surface protective film on the base material side, and only the adhesive film is punched into a predetermined shape.
  • the surface protective film can be obtained by removing unnecessary portions of the adhesive film.
  • corrugation suitably in a surface protection film by stamping etc. at arbitrary timings.
  • a plurality of pressure-sensitive adhesive films for example, circular pressure-sensitive adhesive films
  • the release film portion is appropriately removed with a cutter or the like. It can cut
  • an imaging module in which one or more lenses and an imaging sensor such as a CCD or CMOS are housed in a casing or a package; a plurality of lenses is a lens mirror Examples include a lens unit held in a tube and housed in a housing or a package as necessary; a light emitting element unit having a light emitting element such as an LED; a motor unit such as a vibrator; a communication module, a sensor module, and the like.
  • These optical members and electronic members are preferably members that are used by being attached to other members such as a substrate.
  • the optical member refers to an optical component that receives or emits light, or includes an optical component that transmits light.
  • an imaging module, a lens unit, a light emitting element unit, a communication module that transmits or receives an optical signal An example of the optical member is an optical sensor module.
  • the electronic member usually includes at least a part of an electric circuit and includes an electronic component that transmits or receives an electric signal, an electronic component that processes an electric signal, an electronic component that operates by an electric signal or electric power, and the like.
  • a motor unit such as an imaging module, a light emitting element unit, and a vibrator, a communication module that transmits or receives an electrical signal, various sensor modules, and the like are specific examples of the electronic member.
  • a communication module, an optical sensor module, an imaging module, a light emitting element unit, and the like that transmit or receive optical signals are members that are both electronic members and optical members.
  • the optical member or the electronic member is, for example, one in which the electronic component or the optical component is housed in a package or a housing or supported by a support member.
  • a part of electronic component or optical component is exposed on the surface, and the surface protection film is used, for example, to protect the exposed component.
  • the surface protective film of the present invention is used for protecting the surface of the optical member or electronic member by attaching the surface protective film after peeling the release film.
  • an optical member or an electronic member hereinafter, also simply referred to as “member with a surface adhesive film” to which an adhesive film is attached is processed, attached to another member, inspected, transported, or the like.
  • an adhesive film protects the surface of an optical member or an electronic member in these processes. Further, the adhesive film is peeled off from the optical member or the electronic member when these steps are finished and the surface protection is no longer necessary. In addition, sticking and peeling of a surface protection film are normally performed manually.
  • the surface protective film of the present invention it is difficult to cause a shift in the attaching position when attaching to the surface of the optical member or the electronic member, so that the frequency of reattaching is reduced. Moreover, since the adhesive film once pasted can be peeled off without applying an excessive load even when peeled off from the adherend, it damages the optical member and electronic member which are adherends (causes distortion). , Etc.) can be prevented.
  • the member with an adhesive film may be heated in processes, such as an above-described process, attachment, an inspection, or conveyance. The heating temperature at that time is not particularly limited, but is about 60 to 200 ° C., preferably about 70 to 150 ° C.
  • the optical member or the electronic member (the member with the adhesive film) to which the adhesive film is attached is attached to another member such as a substrate with an adhesive, for example.
  • a thermosetting adhesive is used, and in order to cure the adhesive, the member with a surface protective film is usually at a temperature of 60 to 200 ° C. or higher, preferably about 70 to 150 ° C. as described above. Heating is preferred. Then, when surface protection becomes unnecessary, the adhesive film is peeled from the optical member or the electronic member.
  • the surface protective film is particularly preferably used as a surface protective film for an imaging module in the above-described optical member or electronic member.
  • the imaging module is usually provided with a light receiving portion for receiving light from the outside on one surface and guiding the light to the imaging device via a lens inside the module.
  • the light receiving unit is provided on a part (for example, the center) of one surface of the imaging module and is made of glass or transparent resin.
  • the adhesive film is preferably attached to one surface of the imaging module where the light receiving part is provided so as to cover the light receiving part. Since the adhesive film adheres to the light receiving portion and the surface of the casing or package around the light receiving portion with high adhesion, it is possible to appropriately protect the light receiving portion provided on one surface of the imaging module.
  • the adhesive film can be easily peeled off from the imaging module, and an excessive load is prevented from being applied to the light receiving portion and the like.
  • the imaging module with which the adhesive film was stuck is heated for hardening of a thermosetting adhesive, and is attached to other members, such as a board
  • the measurement method and evaluation method in the present invention are as follows.
  • [Measuring method] ⁇ Weight average molecular weight of acrylic copolymer (Mw)> Using a gel permeation chromatograph, measurement was performed under the following conditions, and values measured in terms of standard polystyrene were used. (Measurement condition) Measuring device: Product name “HLC-8220GPC”, manufactured by Tosoh Corporation Column: product name “TSKGel SuperHZM-M”, developed by Tosoh Corporation Solvent: Tetrahydrofuran Column temperature: 40 ° C.
  • Flow rate 1.0 mL / min ⁇ Flexibility of base material>
  • MD direction Machine Direction
  • TD direction Transverse Direction.
  • a 45 ° cantilever type tester was used, and the substrate was cut into 20 mm ⁇ 150 mm test pieces. Two test pieces used for the measurement were prepared in each of the MD direction and the TD direction.
  • the test piece in the MD direction means that the longitudinal direction of the test piece is the MD direction of the substrate.
  • the test piece in the TD direction indicates that the longitudinal direction of the test piece is the TD direction of the substrate.
  • the bending length (mN ⁇ cm) was measured four times in total, twice on the front surface (both ends) and twice on the back surface (both ends). The average value was calculated for the measurement results for the four times. From the measured value of the bending length of two test pieces in the MD direction and the mass per unit area (g / m 2 ) of the test piece used for the measurement, the calculation formula described in JIS L 1913 is used. MD bending resistance was calculated. Similarly, in the TD direction, the TD bending resistance was calculated using the measurement values of the bending lengths of two test pieces.
  • the calculated values of MD bending resistance and TD bending resistance were averaged to obtain the bending resistance (mN ⁇ cm) of the base material.
  • ⁇ Bending softness of release film The bending length (mN ⁇ cm) in the MD direction and the TD direction of the release film was measured using the same method as the measurement method described in “Bending and bending resistance of base material”. And the bending softness (mN * cm) of a peeling film was computed using the method similar to the calculation method of "the bending softness of a base material”.
  • the storage elastic modulus (G ′) of the pressure-sensitive adhesive layer was obtained by laminating a layer of a pressure-sensitive adhesive composition having a thickness of 30 ⁇ m, producing a cylindrical test piece having a thickness of 8 mm ⁇ ⁇ 3 mm, and using a torsional shear method under the following conditions: It is measured.
  • Measuring device Dynamic viscoelasticity measurement “Physica MCR 300” manufactured by Anton Paar Frequency: 1Hz Temperature: 23 ° C
  • the adhesive film was peeled from the camera module with a finger. Defects in the camera module after peeling the adhesive film (the spring in the camera module was completely damaged) were confirmed and evaluated according to the following criteria. Five camera modules were used in one test, 1 point or 0 point was determined for each camera module, and evaluation was made with a total of 0 to 5 points. 1 point: No problem. 0 point: There is a defect.
  • Example 1 Copolymerization of 68.6 parts by mass of 2-ethylhexyl acrylate (2EHA), 30 parts by mass of methyl acrylate (MA), 0.2 parts by mass of glycidyl methacrylate (GMA), and 1.2 parts by mass of acrylic acid (AA) 1 part by mass of 3-glycidoxypropyltrimethoxysilane (GPTMS) as a silane coupling agent and trimethylolpropane-trimethyl as a crosslinking agent with respect to 100 parts by mass of the acrylic copolymer (weight average molecular weight 750,000)
  • This coating liquid is applied to the release surface of a 75 ⁇ m-thick polyester film “SP-PET752150” (trade name, manufactured by Lintec Co., Ltd.) as a release film so that the thickness after drying with a roll knife coater is 18 ⁇ m.
  • the substrate After coating and drying at 90 ° C. for 1 minute, the substrate is bonded to an adhesive polyester film “Cosmo Shine A4300” (trade name, manufactured by Toyobo Co., Ltd.) having a thickness of 75 ⁇ m, and then 7 days at 23 ° C.
  • a surface protective film was obtained by aging.
  • the elastic modulus of the pressure-sensitive adhesive layer was 1.2 ⁇ 10 6 Pa.
  • Example 2 A surface protective film was produced in the same manner as in Example 1 except that an easily adhesive polyester film “Cosmo Shine A4300” (trade name, manufactured by Toyobo Co., Ltd.) having a thickness of 100 ⁇ m was used as the substrate.
  • an easily adhesive polyester film “Cosmo Shine A4300” (trade name, manufactured by Toyobo Co., Ltd.) having a thickness of 100 ⁇ m was used as the substrate.
  • a surface protective film was produced.
  • the elastic modulus of the pressure-sensitive adhesive layer was 7.2 ⁇ 10 4 Pa.
  • Example 4 A 50 ⁇ m thick easily adhesive polyester film “Cosmo Shine A4300” (trade name, manufactured by Toyobo Co., Ltd.) is used as the base material, and a 38 ⁇ m thick polyester film “SP-PET 382150” (trade name) is used as the release film.
  • a surface protective film was produced in the same manner as in Example 1 except that the product was manufactured by Lintec Corporation.
  • Example 1 A surface protective film was produced in the same manner as in Example 1 except that a 38 ⁇ m thick polyester film “Diafoil PET” (trade name, manufactured by Mitsubishi Resin Co., Ltd.) was used as the base material.
  • Example 2 A 150 ⁇ m thick easily adhesive polyester film “Cosmo Shine A4300” (trade name, manufactured by Toyobo Co., Ltd.) is used as the base material, and a 50 ⁇ m thick polyester film “SP-PET502150” (trade name) is used as the release film. A surface protective film was produced in the same manner as in Example 1 except that the product was manufactured by Lintec Corporation.
  • Example 3 A surface protective film was produced in the same manner as in Example 1 except that a polyester film “SP-PET502150” (trade name, manufactured by Lintec Corporation) having a thickness of 38 ⁇ m was used as the release film.
  • SP-PET502150 trade name, manufactured by Lintec Corporation
  • Example 4 A surface protective film was produced in the same manner as in Example 1, except that an easily adhesive polyester film “Cosmo Shine A4300” (trade name, manufactured by Toyobo Co., Ltd.) having a thickness of 188 ⁇ m was used as the substrate.
  • an easily adhesive polyester film “Cosmo Shine A4300” (trade name, manufactured by Toyobo Co., Ltd.) having a thickness of 188 ⁇ m was used as the substrate.
  • the surface protective films prepared in Examples 1 to 4 are excellent in both attachment workability and peeling workability, and no module failure occurs.
  • the surface protective film produced in Comparative Example 1 has no problem in peeling workability, and no module failure has occurred.
  • the bending resistance of the substrate is low and the bending resistance ratio is less than 1.0, the stiffness of the substrate is weak and the workability is poor.
  • the surface protection film produced in Comparative Example 3 has no difference in peeling workability from the surface protection film produced in Example 3, and no module failure has occurred.
  • the bending resistance ratio exceeded 4.0, the result was inferior to the workability of pasting.
  • the surface protective film of the present invention is excellent in workability at the time of sticking and peeling, and has a small load on the adherend during the peeling work. Therefore, the surface protective film of the present invention can be suitably used as, for example, a surface protective film that protects the surface of an optical member or an electronic member. It is possible to effectively prevent damage to the adherend when it is peeled off from the adherend and the frequency of reattachment due to.

Abstract

 A surface-protective film affixed to an optical member or an electronic member and used for protecting a surface thereof, wherein the surface-protective film is provided with a substrate including a polyethylene terephthalate film, an adhesive layer provided on one side of the substrate, and a release film provided on the adhesive layer, and the surface-protective film satisfies (A) through (D). (A): The bending resistance of the substrate is 5000-85000 mN∙cm. (B): The elastic modulus of the adhesive layer is 1.0×104 to 1.0×107 Pa. (C): The thickness of the release film is at least 20 µm. (D): The ratio of the bending resistance of the substrate and the bending resistance of the release film [Substrate bending resistance/Release film bending resistance] is 1.0 to 4.0. The surface-protective film has excellent working efficiency during affixing and release, and minimal burden on an adherend during releasing therefrom.

Description

表面保護フィルムSurface protection film
 本発明は、各種の光学部材や電子部材の表面に貼付されて、その表面を保護するために使用される表面保護フィルムに関する。 The present invention relates to a surface protective film that is applied to the surface of various optical members and electronic members and used to protect the surface.
 従来、電子機器等を組み立てる際には、各種電気部品、光学部品を予めユニット化しておいて、基板等に実装する手法が広く知られている。この際、ユニット化した撮像モジュール、カメラのレンズユニット、通信・センサーモジュールやバイブレーター等のモーターユニット等の光学部材や電子部材は、加工、組立、検査、輸送等の際、表面の傷付きを防止するために、露出面に表面保護フィルムが貼着されることがある。表面保護フィルムは、表面保護の必要がなくなった時点で、光学部材や電子部材から剥離される。 2. Description of the Related Art Conventionally, when assembling an electronic device or the like, a method of previously uniting various electric components and optical components and mounting them on a substrate or the like is widely known. At this time, optical and electronic components such as unitized imaging modules, camera lens units, motor units such as communication / sensor modules and vibrators are prevented from being scratched during processing, assembly, inspection, transportation, etc. In order to do this, a surface protective film may be stuck on the exposed surface. The surface protective film is peeled off from the optical member or the electronic member when the surface protection is no longer necessary.
 また、このような表面保護フィルムの基材としては、例えば、透明性を得る観点からポリエチレンテレフタレートフィルムを、また耐熱性といった観点から、ポリイミドやポリエチレンナフタレートといった基材を使用することが知られている(特許文献1参照)。 Moreover, as a base material of such a surface protective film, for example, it is known to use a polyethylene terephthalate film from the viewpoint of obtaining transparency and a base material such as polyimide or polyethylene naphthalate from the viewpoint of heat resistance. (See Patent Document 1).
特開2005-341520号公報JP 2005-341520 A
 近年、上記したような光学部材や電子部材は、小型化が進んでおり、それに伴い表面保護フィルムのサイズも小さくなってきている。また、表面保護フィルムの貼り付け及び剥離は、通常、手作業で行われるため、貼り付け及び剥離の作業性を良好にすることが求められる。具体的には、フィルムが小サイズであるため、貼り付け時の位置ずれが生じやすく、貼り直しの頻度が高くなってしまう。貼り直しの頻度を低減するため、貼り付け易さの向上が要求されるようになってきている。また、被着体から表面保護フィルムが剥離しにくいと、被着体である光学部材や電子部材に過度な負荷がかかり、デリケートな該部材を痛めてしまう(歪を起こす、傷が付く等)可能性がある。そのため、表面保護フィルムの剥離性能も良好にすることが求められている。
 しかしながら、例えば特許文献1では、このような表面保護フィルムの貼り付け及び剥離といった作業性についての検討はされていない。
In recent years, optical members and electronic members as described above have been reduced in size, and the size of the surface protection film has been reduced accordingly. Moreover, since attachment and peeling of a surface protective film are normally performed manually, it is calculated | required that workability | operativity of attachment and peeling is made favorable. Specifically, since the film is small in size, misalignment tends to occur at the time of attachment, and the frequency of reattachment increases. In order to reduce the frequency of re-sticking, improvement in the ease of sticking has been demanded. In addition, if the surface protective film is difficult to peel from the adherend, an excessive load is applied to the optical member or electronic member that is the adherend, and the delicate member is damaged (distortion, scratches, etc.). there is a possibility. Therefore, it is required to improve the peeling performance of the surface protective film.
However, for example, Patent Document 1 does not discuss workability such as sticking and peeling of the surface protective film.
 本発明は、以上の問題点に鑑みてなされたものであり、本発明の課題は、貼り付け及び剥離時の作業性に優れ、かつ剥離作業時の被着体への負荷が少ない、光学部材又は電子部材用の表面保護フィルムを提供することである。 The present invention has been made in view of the above problems, and an object of the present invention is an optical member that is excellent in workability at the time of pasting and peeling, and has a low load on an adherend at the time of peeling work. Or it is providing the surface protection film for electronic members.
 本発明者らは、鋭意検討の結果、表面保護フィルムが、特定の剛軟度を有する基材と、該基材の一方の面に設けられる特定の弾性率を有する粘着剤層と、該粘着剤層上に設けられる厚さが20μm以上の剥離フィルムとを有し、該基材の剛軟度と該剥離フィルムの剛軟度との比[基材の剛軟度/剥離フィルムの剛軟度]が1以上であることで、上記課題を解決し得ることを見出し、本発明を完成させた。
 すなわち、本発明は、下記〔1〕~〔8〕を提供するものである。
〔1〕光学部材又は電子部材に貼付し、その表面を保護するために使用される表面保護フィルムであって、
 ポリエチレンテレフタレートフィルムを含む基材と、該基材の一方の面に設けられる粘着剤層と、該粘着剤層上に設けられる剥離フィルムとを備え、
下記(A)~(D)を満たす、表面保護フィルム。
(A)該基材の剛軟度が5000~85000mN・cm
(B)該粘着剤層の弾性率が1.0×10~1.0×10Pa
(C)該剥離フィルムの厚さが20μm以上
(D)該基材の剛軟度と該剥離フィルムの剛軟度との比[基材の剛軟度/剥離フィルムの剛軟度]が1.0~4.0
〔2〕前記粘着剤層が、アクリル系共重合体を含む粘着剤組成物からなる、上記〔1〕に記載の表面保護フィルム。
〔3〕前記アクリル系共重合体を含む粘着剤組成物が、更にシランカップリング剤を含有する、上記〔2〕に記載の表面保護フィルム。
〔4〕前記基材の剛軟度が50000mN・cm以下である、上記〔1〕~〔3〕のいずれかに記載の表面保護フィルム。
〔5〕80℃、2時間加熱前後の23℃、50%RH(相対湿度)条件における液晶プラスチックに対する前記表面保護フィルムの粘着力が、いずれも400~1000mN/25mmである、上記〔1〕~〔4〕のいずれかに記載の表面保護フィルム。
〔6〕前記剥離フィルムの剥離力が50~200mN/50mmである、上記〔1〕~〔5〕のいずれかに記載の表面保護フィルム。
〔7〕前記表面保護フィルムのサイズが100mm以下である、上記〔1〕~〔6〕のいずれかに記載の表面保護フィルム。
〔8〕上記〔1〕~〔7〕のいずれかに記載の表面保護フィルムを、剥離フィルムを剥離した後に光学部材又は電子部材の表面に貼付して保護する方法。
As a result of intensive studies, the present inventors have found that the surface protective film has a base material having a specific bending resistance, a pressure-sensitive adhesive layer having a specific elastic modulus provided on one surface of the base material, and the pressure-sensitive adhesive layer. A release film with a thickness of 20 μm or more provided on the agent layer, and the ratio of the bending resistance of the substrate to the bending resistance of the peeling film [the bending resistance of the substrate / the bending resistance of the peeling film It was found that the above problem can be solved when the degree] is 1 or more, and the present invention has been completed.
That is, the present invention provides the following [1] to [8].
[1] A surface protective film that is applied to an optical member or an electronic member and used to protect the surface thereof,
A base material including a polyethylene terephthalate film, a pressure-sensitive adhesive layer provided on one surface of the base material, and a release film provided on the pressure-sensitive adhesive layer,
A surface protective film satisfying the following (A) to (D).
(A) The bending resistance of the base material is 5000 to 85000 mN · cm.
(B) The elastic modulus of the pressure-sensitive adhesive layer is 1.0 × 10 4 to 1.0 × 10 7 Pa.
(C) The thickness of the release film is 20 μm or more. (D) The ratio of the stiffness of the substrate to the stiffness of the release film [the stiffness of the substrate / the stiffness of the release film] is 1. .0 to 4.0
[2] The surface protective film according to [1], wherein the pressure-sensitive adhesive layer is made of a pressure-sensitive adhesive composition containing an acrylic copolymer.
[3] The surface protective film according to [2], wherein the pressure-sensitive adhesive composition containing the acrylic copolymer further contains a silane coupling agent.
[4] The surface protective film according to any one of [1] to [3], wherein the bending resistance of the base material is 50000 mN · cm or less.
[5] The above [1] to [1], wherein the adhesive strength of the surface protective film to the liquid crystal plastic under conditions of 80 ° C. and 23 ° C. before and after heating for 2 hours and 50% RH (relative humidity) is 400 to 1000 mN / 25 mm. [4] The surface protective film according to any one of [4].
[6] The surface protective film according to any one of the above [1] to [5], wherein the peeling film has a peeling force of 50 to 200 mN / 50 mm.
[7] The surface protective film according to any one of [1] to [6] above, wherein the size of the surface protective film is 100 mm 2 or less.
[8] A method of protecting the surface protective film according to any one of [1] to [7] by attaching the surface protective film to the surface of an optical member or an electronic member after peeling the release film.
 本発明によれば、貼り付け及び剥離時の作業性に優れ、かつ剥離作業時の被着体への負荷が少ない、光学部材又は電子部材用の表面保護フィルムを提供することが可能である。 According to the present invention, it is possible to provide a surface protective film for an optical member or an electronic member that is excellent in workability at the time of pasting and peeling and has a small load on the adherend during the peeling work.
 本明細書中の記載において、「重量平均分子量(Mw)」は、ゲルパーミエーションクロマトグラフィー(GPC)法で測定される標準ポリスチレン換算の値であり、具体的には実施例に記載の方法に基づいて測定した値である。
 加えて、本明細書中の記載において、例えば、「(メタ)アクリレート」とは、「アクリレート」と「メタクリレート」の双方を意味する用語であり、他の類似用語も同様である。
In the description of the present specification, “weight average molecular weight (Mw)” is a value in terms of standard polystyrene measured by a gel permeation chromatography (GPC) method, specifically, the method described in the examples. Based on the measured value.
In addition, in the description in the present specification, for example, “(meth) acrylate” is a term meaning both “acrylate” and “methacrylate”, and other similar terms are also the same.
[表面保護フィルム]
 本発明の表面保護フィルムは、光学部材又は電子部材に貼付し、その表面を保護するために使用されるものであって、ポリエチレンテレフタレートフィルムを含む基材と、該基材の一方の面に設けられる粘着剤層と、該粘着剤層上に設けられる剥離フィルムとを備え、下記(A)~(D)を満たす、表面保護フィルムである。
(A)該基材の剛軟度が5000~85000mN・cm
(B)該粘着剤層の弾性率が1.0×10~1.0×10Pa
(C)該剥離フィルムの厚さが20μm以上
(D)該基材の剛軟度と該剥離フィルムの剛軟度との比[基材の剛軟度/剥離フィルムの剛軟度]が1.0~4.0
 以下、表面保護フィルムの各部材について説明する。また、以下、「粘着フィルム」とは、表面保護フィルムのうち、剥離フィルムを除く部分からなる構成をいう。
[Surface protection film]
The surface protective film of the present invention is used to protect the surface of an optical member or an electronic member, and is provided on a base material including a polyethylene terephthalate film and one surface of the base material. And a release film provided on the pressure-sensitive adhesive layer and satisfying the following (A) to (D).
(A) The bending resistance of the base material is 5000 to 85000 mN · cm.
(B) The elastic modulus of the pressure-sensitive adhesive layer is 1.0 × 10 4 to 1.0 × 10 7 Pa.
(C) The thickness of the release film is 20 μm or more. (D) The ratio of the stiffness of the substrate to the stiffness of the release film [the stiffness of the substrate / the stiffness of the release film] is 1. .0 to 4.0
Hereinafter, each member of the surface protective film will be described. In the following, the “adhesive film” refers to a configuration composed of a portion of the surface protective film excluding the release film.
<基材>
 本発明の表面保護フィルムが有する基材は、ポリエチレンテレフタレートフィルムを含む基材であって、剛軟度が5000~85000mN・cmである。
 剛軟度が5000mN・cm未満の基材を用いた場合、得られる表面保護フィルムを光学部材又は電子部材表面に貼付する際に、当該表面保護フィルムのコシが弱いため、目標の貼付位置へ貼付し難くなり作業性が劣る。
 また、剛軟度が85000mN・cmを超える基材を用いた場合、光学部材又は電子部材表面に貼付した粘着フィルムを当該部材表面から剥がす際に、当該粘着フィルムのコシが強すぎるため、剥がし難くなり作業性が劣る。更には、粘着フィルムを剥がす際に必要以上の負荷が光学部材又は電子部材に対してかかることにより、当該部材にダメージを与えてしまう可能性がある。
 また、特に、手作業による貼り付け及び剥離作業を行う場合は、ピンセット等の道具を用いて小サイズの表面保護フィルムを取り扱うため、上記の貼り付け及び剥離作業は更に難しくなる。
 このような観点から、当該基材の剛軟度は、好ましくは10000mN・cm以上、より好ましくは15000mN・cm以上であり、また、好ましくは50000mN・cm以下、より好ましくは45000mN・cm以下である。
 なお、剛軟度は、JIS L 1913に準ずる方法で測定される値であり、より具体的には、後述する実施例に記載した方法に基づいて測定、算出される値である。
<Base material>
The substrate possessed by the surface protective film of the present invention is a substrate including a polyethylene terephthalate film, and has a bending resistance of 5000 to 85000 mN · cm.
When a base material having a bending resistance of less than 5000 mN · cm is used, when the obtained surface protection film is applied to the surface of an optical member or an electronic member, the surface protection film is weak, so it is applied to the target application position. It becomes difficult to work and the workability is inferior.
Further, when a base material having a bending resistance exceeding 85000 mN · cm is used, when the adhesive film affixed to the surface of the optical member or electronic member is peeled off from the surface of the member, the adhesive film is too strong to be easily peeled off. Workability is inferior. Furthermore, when an adhesive film is peeled off, an unnecessary load is applied to the optical member or the electronic member, which may damage the member.
In particular, in the case of performing manual attachment and peeling work, the sticking and peeling work described above becomes more difficult because a small-sized surface protective film is handled using a tool such as tweezers.
From such a viewpoint, the bending resistance of the substrate is preferably 10,000 mN · cm or more, more preferably 15000 mN · cm or more, and preferably 50000 mN · cm or less, more preferably 45000 mN · cm or less. .
The bending resistance is a value measured by a method according to JIS L 1913. More specifically, the bending resistance is a value measured and calculated based on a method described in Examples described later.
 上記ポリエチレンテレフタレートフィルムには、更に、下記の樹脂から選ばれる1種又は2種以上の樹脂からなるフィルムを積層してもよい。
 ポリエチレンテレフタレートフィルムに積層する樹脂フィルムとしては、基材の剛軟度が上記範囲であれば特に制限はされないが、例えば、ポリエチレンナフタレート、ポリブチレンテレフタレート、全芳香族ポリエステル等のポリエステル、ポリアミド、ポリイミド、ポリアセタール、ポリカーボネート、変性ポリフェニレンオキシド、ポリフェニレンスルフィド、ポリスルホン、ポリエーテルケトン、ポリプロピレン、ポリエチレン等からなる樹脂フィルム、又はこれらの二軸延伸フィルム等が挙げられる。
The polyethylene terephthalate film may further be laminated with a film made of one or more resins selected from the following resins.
The resin film laminated on the polyethylene terephthalate film is not particularly limited as long as the bending resistance of the substrate is in the above range. For example, polyester such as polyethylene naphthalate, polybutylene terephthalate, wholly aromatic polyester, polyamide, polyimide , Resin films made of polyacetal, polycarbonate, modified polyphenylene oxide, polyphenylene sulfide, polysulfone, polyether ketone, polypropylene, polyethylene, or biaxially stretched films thereof.
 また、本発明で用いる基材には、本発明の効果を損なわない範囲において、フィラー、着色剤、帯電防止剤、難燃剤、酸化防止剤、有機滑剤、触媒等を含有させてもよい。
 また、基材は、透明なものであっても、不透明なものであってもよく、所望により着色又は蒸着されていてもよい。
 なお、本発明で用いる基材の少なくとも一方の表面には、粘着剤層との密着性を向上させるために、コロナ処理等の接着処理を施してもよく、後述の易接着層を設けてもよい。
 また、基材の厚さは、基材の剛軟度が上記範囲であれば特に制限はされないが、本発明の表面保護フィルムを光学部材又は電子部材に貼り付け及び剥離する際の作業性を良好とする観点から、好ましくは40~150μm、より好ましくは50~130μm、更に好ましくは70~110μmである。
Moreover, the base material used in the present invention may contain a filler, a colorant, an antistatic agent, a flame retardant, an antioxidant, an organic lubricant, a catalyst, and the like as long as the effects of the present invention are not impaired.
Further, the substrate may be transparent or opaque, and may be colored or vapor-deposited as desired.
In addition, in order to improve the adhesiveness with the pressure-sensitive adhesive layer, at least one surface of the substrate used in the present invention may be subjected to an adhesion treatment such as a corona treatment, or may be provided with an easy adhesion layer described later. Good.
Further, the thickness of the substrate is not particularly limited as long as the bending resistance of the substrate is in the above range, but the workability at the time of attaching and peeling the surface protective film of the present invention to the optical member or the electronic member is improved. From the viewpoint of improving the thickness, the thickness is preferably 40 to 150 μm, more preferably 50 to 130 μm, and still more preferably 70 to 110 μm.
<粘着剤層>
 本発明の表面保護フィルムが有する粘着剤層は、弾性率が1.0×10~1.0×10Paである。
 弾性率が1.0×10Pa未満の粘着剤層を用いた場合、得られる表面保護フィルムの80℃加熱前後での粘着力の差が大きくなるため、80℃加熱前後における粘着性の調整が困難となる。
 また、弾性率が1.0×10Paを超える粘着剤層を用いた場合、光学部材又は電子部材表面に貼付した粘着フィルムを当該部材表面から剥がす際に、当該粘着剤層が固くなりすぎるため、剥がし難くなり作業性が劣る。更には、粘着フィルムを剥がす際に必要以上の負荷が光学部材又は電子部材に対してかかることにより、当該部材にダメージを与えてしまう可能性がある。
 このような観点から、当該粘着剤層の弾性率は、好ましくは1.0×10~1.5×10Pa、より好ましくは1.5×10~1.2×10Paである。
 上記した弾性率は、より具体的には、後述する実施例に記載した方法に基づいて測定した値である。
<Adhesive layer>
The adhesive layer of the surface protective film of the present invention has an elastic modulus of 1.0 × 10 4 to 1.0 × 10 7 Pa.
When a pressure-sensitive adhesive layer having an elastic modulus of less than 1.0 × 10 4 Pa is used, the difference in pressure-sensitive adhesive strength before and after heating at 80 ° C. of the obtained surface protective film becomes large. It becomes difficult.
Moreover, when an adhesive layer having an elastic modulus exceeding 1.0 × 10 7 Pa is used, the adhesive layer becomes too hard when the adhesive film attached to the optical member or electronic member surface is peeled off from the member surface. Therefore, it becomes difficult to peel off and workability is inferior. Furthermore, when an adhesive film is peeled off, an unnecessary load is applied to the optical member or the electronic member, which may damage the member.
From such a viewpoint, the elastic modulus of the pressure-sensitive adhesive layer is preferably 1.0 × 10 5 to 1.5 × 10 6 Pa, more preferably 1.5 × 10 5 to 1.2 × 10 6 Pa. is there.
More specifically, the above-described elastic modulus is a value measured based on the method described in Examples described later.
 本発明の表面保護フィルムが有する粘着剤層を形成する粘着剤としては、特に限定されないが、例えば、アクリル系粘着剤、ウレタン系粘着剤、シリコーン系粘着剤、ゴム系粘着剤、ポリエステル系粘着剤が挙げられる。
 これらの粘着剤は、1種又は2種以上を組み合わせて用いてもよい。
Although it does not specifically limit as an adhesive which forms the adhesive layer which the surface protection film of this invention has, For example, an acrylic adhesive, a urethane adhesive, a silicone adhesive, a rubber adhesive, a polyester adhesive Is mentioned.
These pressure-sensitive adhesives may be used alone or in combination of two or more.
 上記粘着剤では、アクリル系粘着剤であることが好ましい。また、当該アクリル系粘着剤である場合、一般的に、アクリル系共重合体を含むアクリル系粘着剤(以下、「アクリル系粘着剤組成物」ともいう)である。
 アクリル系共重合体は、通常、粘着剤層において粘着成分を構成するものであり、以下、「メインポリマー」ともいう。
 なお、以下の説明では、アクリル系粘着剤である場合の例を主に説明するが、他の種類の粘着剤の場合も同様であり、その際には、粘着成分を構成するメインポリマーがアクリル系共重合体以外のポリマーが使用される。
 アクリル系共重合体は、アルキル(メタ)アクリレートを主モノマーとして含むモノマー成分(以下、「共重合体成分」ともいう)を共重合したものである。アルキル(メタ)アクリレートとしては、アルキル基の炭素数が1~18のものが挙げられ、メチル(メタ)アクリレート、エチル(メタ)アクリレート、イソプロピル(メタ)アクリレート、n-プロピル(メタ)アクリレート、ブチル(メタ)アクリレート、2-エチルヘキシル(メタ)アクリレート、n-オクチル(メタ)アクリレート、イソオクチル(メタ)アクリレート、ノニル(メタ)アクリレート、デシル(メタ)アクリレート、ウンデシル(メタ)アクリレート、ドデシル(メタ)アクリレート等が挙げられる。
 アクリル系共重合体は、共重合体成分としてアルキル(メタ)アクリレートを、共重合体成分全量に対して、好ましくは50質量%以上、より好ましくは50~99質量%含有する。
In the said adhesive, it is preferable that it is an acrylic adhesive. Moreover, when it is the said acrylic adhesive, it is generally an acrylic adhesive (henceforth an "acrylic adhesive composition") containing an acrylic copolymer.
The acrylic copolymer usually constitutes a pressure-sensitive adhesive component in the pressure-sensitive adhesive layer, and is hereinafter also referred to as “main polymer”.
In the following description, an example in the case of an acrylic pressure-sensitive adhesive will be mainly described, but the same applies to other types of pressure-sensitive adhesives. In this case, the main polymer constituting the pressure-sensitive adhesive component is acrylic. A polymer other than the copolymer is used.
The acrylic copolymer is obtained by copolymerizing a monomer component containing alkyl (meth) acrylate as a main monomer (hereinafter also referred to as “copolymer component”). Examples of the alkyl (meth) acrylate include those having 1 to 18 carbon atoms in the alkyl group, such as methyl (meth) acrylate, ethyl (meth) acrylate, isopropyl (meth) acrylate, n-propyl (meth) acrylate, and butyl. (Meth) acrylate, 2-ethylhexyl (meth) acrylate, n-octyl (meth) acrylate, isooctyl (meth) acrylate, nonyl (meth) acrylate, decyl (meth) acrylate, undecyl (meth) acrylate, dodecyl (meth) acrylate Etc.
The acrylic copolymer preferably contains 50% by mass or more, more preferably 50 to 99% by mass of alkyl (meth) acrylate as a copolymer component with respect to the total amount of the copolymer component.
 アクリル系共重合体は、共重合体成分として、アルキル(メタ)アクリレートのうち、アルキル基の炭素数が3以上であるアルキル(メタ)アクリレートを、共重合体成分全量に対して30~98質量%含有することが好ましい。アルキル基の炭素数が3以上であるアルキル(メタ)アクリレートの含有量をこのような範囲とすることで、適切な粘着性能と剥離性能を表面保護フィルムに付与しやすくなる。このような観点から、アルキル基の炭素数が3以上であるアルキル(メタ)アクリレートの含有量は、40~97質量%であることがより好ましく、45~96質量%であることが更に好ましい。 The acrylic copolymer contains, as a copolymer component, an alkyl (meth) acrylate having an alkyl group having 3 or more carbon atoms among alkyl (meth) acrylates in an amount of 30 to 98 mass based on the total amount of the copolymer component. % Content is preferable. By making content of the alkyl (meth) acrylate whose carbon number of an alkyl group is 3 or more into such a range, it becomes easy to provide suitable adhesive performance and peeling performance to a surface protection film. From such a viewpoint, the content of the alkyl (meth) acrylate having 3 or more carbon atoms in the alkyl group is more preferably 40 to 97% by mass, and further preferably 45 to 96% by mass.
 上記アルキル基の炭素数が3以上のアルキル(メタ)アクリレートは、アルキル基の炭素数が3~8であるアルキル(メタ)アクリレートであることが好ましく、アルキル基の炭素数が4~8であるアルキル(メタ)アクリレートであることがより好ましく、アルキル基の炭素数が4~8であるアルキルアクリレートが更に好ましい。具体的には、n-ブチルアクリレート、2-エチルヘキシルアクリレート、n-オクチルアクリレート、イソオクチルアクリレート等が好ましい。 The alkyl (meth) acrylate having 3 or more carbon atoms in the alkyl group is preferably an alkyl (meth) acrylate in which the alkyl group has 3 to 8 carbon atoms, and the alkyl group has 4 to 8 carbon atoms. Alkyl (meth) acrylates are more preferred, and alkyl acrylates having an alkyl group with 4 to 8 carbon atoms are even more preferred. Specifically, n-butyl acrylate, 2-ethylhexyl acrylate, n-octyl acrylate, isooctyl acrylate, and the like are preferable.
 また、アクリル系共重合体は、共重合体成分として、アルキル(メタ)アクリレートのうち、アルキル基の炭素数が1又は2であるアルキル(メタ)アクリレートを、共重合体成分全量に対して5~50質量%含有していてもよい。
 上記アクリル系共重合体は、共重合体成分として、アルキル基の炭素数が1又は2であるアルキル(メタ)アクリレートを、共重合体成分全量に対して10~40質量%含むことがより好ましく、15~35質量%含むことが更に好ましい。
 なお、アルキル基の炭素数が1又は2であるアルキル(メタ)アクリレートとしては、メチル(メタ)アクリレート、エチル(メタ)アクリレートが挙げられるが、これらの中では、メチルアクリレート、メチルメタクリレートが好ましい。
The acrylic copolymer contains 5 alkyl (meth) acrylates having 1 or 2 carbon atoms in the alkyl group among the alkyl (meth) acrylate as a copolymer component, based on the total amount of the copolymer component. It may be contained in an amount of up to 50% by mass.
More preferably, the acrylic copolymer contains 10 to 40% by mass of an alkyl (meth) acrylate having 1 or 2 carbon atoms in the alkyl group as a copolymer component, based on the total amount of the copolymer component. 15 to 35% by mass is more preferable.
Examples of the alkyl (meth) acrylate having 1 or 2 carbon atoms in the alkyl group include methyl (meth) acrylate and ethyl (meth) acrylate. Among these, methyl acrylate and methyl methacrylate are preferable.
 アクリル系共重合体は、共重合体成分として、アルキル(メタ)アクリレート以外の重合性モノマーを含有することが好ましく、具体的には官能基含有モノマーを含有することが好ましい。官能基含有モノマーは、後述する架橋剤との反応のために必要な官能基を提供する。官能基含有モノマーは、重合性の二重結合と、ヒドロキシル基、カルボキシル基、アミノ基、置換アミノ基、エポキシ基等の官能基とを分子内に有するモノマーである。 The acrylic copolymer preferably contains a polymerizable monomer other than alkyl (meth) acrylate as the copolymer component, and specifically contains a functional group-containing monomer. The functional group-containing monomer provides a functional group necessary for reaction with a cross-linking agent described later. The functional group-containing monomer is a monomer having a polymerizable double bond and a functional group such as a hydroxyl group, a carboxyl group, an amino group, a substituted amino group, and an epoxy group in the molecule.
 アクリル系共重合体は、共重合体成分として、官能基含有モノマーを共重合体成分全量に対して、0.1~40質量%含む共重合体成分を共重合したものであることが好ましい。官能基含有モノマーの含有量が上記範囲内となることで、アクリル系共重合体は後述する架橋剤で適切に架橋することが可能になる。
 また、官能基含有モノマーの上記含有量は、0.2~30質量%であることがより好ましい。官能基含有モノマーが0.2~30質量%であると、適切な粘着性能を確保しつつ、後述する架橋剤でアクリル系共重合体を適切に架橋することが可能になる。
The acrylic copolymer is preferably a copolymer component obtained by copolymerizing a copolymer component containing 0.1 to 40% by mass of a functional group-containing monomer with respect to the total amount of the copolymer component. When the content of the functional group-containing monomer is within the above range, the acrylic copolymer can be appropriately crosslinked with a crosslinking agent described later.
The content of the functional group-containing monomer is more preferably 0.2 to 30% by mass. When the functional group-containing monomer is 0.2 to 30% by mass, it is possible to appropriately crosslink the acrylic copolymer with a cross-linking agent to be described later while ensuring appropriate adhesive performance.
 ここで、カルボキシル基含有モノマーとしては、アクリル酸、メタクリル酸、イタコン酸等が挙げられる。
 また、ヒドロキシル基含有(メタ)アクリレートの具体例としては、ヒドロキシメチル(メタ)アクリレート、2-ヒドロキシエチル(メタ)アクリレート、2-ヒドロキシプロピル(メタ)アクリレート、3-ヒドロキシプロピル(メタ)アクリレート、2-ヒドロキシブチル(メタ)アクリレート、4-ヒドロキシブチル(メタ)アクリレート等が挙げられる。
 また、エポキシ基を分子内に有するモノマーとしては、例えば、グリシジル(メタ)アクリレート、メチルグリシジル(メタ)アクリレート、アリルグリシジルエーテル等が挙げられる。
 以上の官能基含有モノマーは、1種又は2種以上を組み合わせて用いてもよい。
Here, examples of the carboxyl group-containing monomer include acrylic acid, methacrylic acid, and itaconic acid.
Specific examples of the hydroxyl group-containing (meth) acrylate include hydroxymethyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 3-hydroxypropyl (meth) acrylate, 2 -Hydroxybutyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate and the like.
Moreover, as a monomer which has an epoxy group in a molecule | numerator, glycidyl (meth) acrylate, methyl glycidyl (meth) acrylate, allyl glycidyl ether etc. are mentioned, for example.
The above functional group-containing monomers may be used alone or in combination of two or more.
 アクリル系共重合体は、上記のモノマーの他にも、アルキル(メタ)アクリレート及び官能基含有モノマー以外の(メタ)アクリル酸エステル、ジアルキル(メタ)アクリルアミド、蟻酸ビニル、酢酸ビニル、スチレンを共重合体成分として含んでいてもよい。(メタ)アクリル酸アルキルエステル及び官能基含有モノマー以外の(メタ)アクリル酸エステルとしては、(メタ)アクリル酸アルコキシアルキルエステル、(メタ)アクリル酸アルキレンオキシアルキルエステル、(メタ)アクリル酸ノニルフェノキシポリエチレングリコール、アクリル酸テトラヒドロフランフルフリル、ポリエーテルとアクリル酸とのエステルであるジアクリレート類等を用いてもよい。
 また、ジアルキル(メタ)アクリルアミドとしては、ジメチル(メタ)アクリルアミド、ジエチル(メタ)アクリルアミド等が用いられる。
 アクリル系共重合体の重量平均分子量は、好ましくは100000以上であり、より好ましくは100000~1500000であり、更に好ましくは150000~1000000である。
In addition to the above monomers, the acrylic copolymer is a copolymer of (meth) acrylic acid esters, dialkyl (meth) acrylamides, vinyl formate, vinyl acetate, and styrene other than alkyl (meth) acrylate and functional group-containing monomers. It may be included as a coalescence component. As (meth) acrylic acid esters other than (meth) acrylic acid alkyl esters and functional group-containing monomers, (meth) acrylic acid alkoxyalkyl esters, (meth) acrylic acid alkyleneoxyalkyl esters, (meth) acrylic acid nonylphenoxy polyethylene Glycol, tetrahydrofuran furfuryl acrylate, diacrylates which are esters of polyether and acrylic acid, and the like may also be used.
As the dialkyl (meth) acrylamide, dimethyl (meth) acrylamide, diethyl (meth) acrylamide and the like are used.
The weight average molecular weight of the acrylic copolymer is preferably 100,000 or more, more preferably 100,000 to 1500,000, and still more preferably 150,000 to 1,000,000.
 また、アクリル系共重合体を含む粘着剤組成物を用いる場合は、更に、シランカップリング剤を含有することが好ましい。
 シランカップリング剤としては、分子内にアルコキシシリル基を少なくとも1個有する有機ケイ素化合物であって、粘着剤成分との相溶性がよく、かつ光透過性を有するもの、例えば実質上透明なものが好適である。このようなシランカップリング剤の配合量は、アクリル系共重合体100質量部に対して0.01~1.5質量部であることが好ましく、特に0.05~1.0質量部であることが好ましい。
 シランカップリング剤としては、例えば、ビニルトリメトキシシラン、ビニルトリエトキシシラン、(メタ)アクリロキシプロピルトリメトキシシラン等の重合性不飽和基含有ケイ素化合物、3-グリシドキシプロピルトリメトキシシラン、2-(3,4-エポキシシクロヘキシル)エチルトリメトキシシラン等のエポキシ構造を有するケイ素化合物、3-アミノプロピルトリメトキシシラン、N-(2-アミノエチル)-3-アミノプロピルトリメトキシシラン、N-(2-アミノエチル)-3-アミノプロピルメチルジメトキシシラン等のアミノ基含有ケイ素化合物、3-クロロプロピルトリメトキシシラン、3-イソシアネートプロピルトリエトキシシラン等が挙げられる。これらは、1種又は2種以上を組み合わせて用いてもよい。
Moreover, when using the adhesive composition containing an acryl-type copolymer, it is preferable to contain a silane coupling agent further.
As the silane coupling agent, an organosilicon compound having at least one alkoxysilyl group in the molecule, having good compatibility with the pressure-sensitive adhesive component and having light transmittance, for example, a substantially transparent one. Is preferred. The amount of such a silane coupling agent is preferably 0.01 to 1.5 parts by weight, particularly 0.05 to 1.0 parts by weight, based on 100 parts by weight of the acrylic copolymer. It is preferable.
Examples of the silane coupling agent include polymerizable unsaturated group-containing silicon compounds such as vinyltrimethoxysilane, vinyltriethoxysilane, (meth) acryloxypropyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 2 Silicon compounds having an epoxy structure such as-(3,4-epoxycyclohexyl) ethyltrimethoxysilane, 3-aminopropyltrimethoxysilane, N- (2-aminoethyl) -3-aminopropyltrimethoxysilane, N- ( Examples include amino group-containing silicon compounds such as 2-aminoethyl) -3-aminopropylmethyldimethoxysilane, 3-chloropropyltrimethoxysilane, and 3-isocyanatopropyltriethoxysilane. You may use these 1 type or in combination of 2 or more types.
 また、粘着剤層は、アクリル系共重合体が架橋された架橋構造を有していてもよい。架橋のために粘着剤組成物に含有される架橋剤としては、有機多価イソシアネート化合物、有機多価エポキシ化合物、有機多価イミン化合物等が挙げられる。 The pressure-sensitive adhesive layer may have a crosslinked structure in which an acrylic copolymer is crosslinked. Examples of the crosslinking agent contained in the pressure-sensitive adhesive composition for crosslinking include an organic polyvalent isocyanate compound, an organic polyvalent epoxy compound, and an organic polyvalent imine compound.
 有機多価イソシアネート化合物としては、芳香族多価イソシアネート化合物、脂肪族多価イソシアネート化合物、脂環族多価イソシアネート化合物及びこれらの有機多価イソシアネート化合物の三量体、並びにこれら有機多価イソシアネート化合物とポリオール化合物とを反応させて得られる末端イソシアネートウレタンプレポリマー等を挙げることができる。 Examples of organic polyvalent isocyanate compounds include aromatic polyvalent isocyanate compounds, aliphatic polyvalent isocyanate compounds, alicyclic polyvalent isocyanate compounds, trimers of these organic polyvalent isocyanate compounds, and these organic polyvalent isocyanate compounds. Examples thereof include terminal isocyanate urethane prepolymers obtained by reacting with a polyol compound.
 有機多価イソシアネート化合物のさらなる具体的な例としては、2,4-トリレンジイソシアネート、2,6-トリレンジイソシアネート、1,3-キシリレンジイソシアネート、1,4-キシレンジイソシアネート、ジフェニルメタン-4,4’-ジイソシアネート、ジフェニルメタン-2,4’-ジイソシアネート、3-メチルジフェニルメタンジイソシアネート、ヘキサメチレンジイソシアネート、イソホロンジイソシアネート、ジシクロヘキシルメタン-4,4’-ジイソシアネート、ジシクロヘキシルメタン-2,4’-ジイソシアネート、トリレンジイソシアネートとトリメチロールプロパンの付加物等が挙げられる。 Further specific examples of the organic polyvalent isocyanate compound include 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 1,3-xylylene diisocyanate, 1,4-xylene diisocyanate, diphenylmethane-4,4. '-Diisocyanate, diphenylmethane-2,4'-diisocyanate, 3-methyldiphenylmethane diisocyanate, hexamethylene diisocyanate, isophorone diisocyanate, dicyclohexylmethane-4,4'-diisocyanate, dicyclohexylmethane-2,4'-diisocyanate, tolylene diisocyanate Examples include adducts of trimethylolpropane.
 有機多価エポキシ化合物の具体的な例としては、1,3-ビス(N,N’-ジグリシジルアミノメチル)シクロヘキサン、N,N,N’,N’-テトラグリシジル-m-キシリレンジアミン、エチレングリコールジグリシジルエーテル、1,6-ヘキサンジオールジグリシジルエーテル、トリメチロールプロパンジグリシジルエーテル、ジグリシジルアニリン、ジグリシジルアミン等が挙げられる。 Specific examples of the organic polyvalent epoxy compound include 1,3-bis (N, N′-diglycidylaminomethyl) cyclohexane, N, N, N ′, N′-tetraglycidyl-m-xylylenediamine, Examples thereof include ethylene glycol diglycidyl ether, 1,6-hexanediol diglycidyl ether, trimethylolpropane diglycidyl ether, diglycidyl aniline, diglycidyl amine and the like.
 有機多価イミン化合物の具体的な例としては、N,N’-ジフェニルメタン-4,4’-ビス(1-アジリジンカルボキシアミド)、トリメチロールプロパン-トリ-β-アジリジニルプロピオネート、テトラメチロールメタン-トリ-β-アジリジニルプロピオネート及びN,N’-トルエン-2,4-ビス(1-アジリジンカルボキシアミド)トリエチレンメラミン等を挙げることができる。 Specific examples of the organic polyvalent imine compound include N, N′-diphenylmethane-4,4′-bis (1-aziridinecarboxamide), trimethylolpropane-tri-β-aziridinylpropionate, tetra Examples include methylolmethane-tri-β-aziridinylpropionate and N, N′-toluene-2,4-bis (1-aziridinecarboxamide) triethylenemelamine.
 架橋剤の含有量は、アクリル系共重合体100質量部に対して、好ましくは0.01~20質量部、より好ましくは0.1~15質量部、更に好ましくは0.5~8質量部の比率で用いられる。架橋剤の含有量を上記上限値以下とすると、粘着剤層が過度に架橋するのを防止し、適切な粘着力が得られやすくなる。また、架橋剤の使用量を上記下限値以上とすることで、電子部材や光学部材に粘着剤が残着することが防止される。 The content of the crosslinking agent is preferably 0.01 to 20 parts by mass, more preferably 0.1 to 15 parts by mass, and still more preferably 0.5 to 8 parts by mass with respect to 100 parts by mass of the acrylic copolymer. It is used in the ratio. When the content of the cross-linking agent is not more than the above upper limit value, the pressure-sensitive adhesive layer is prevented from being excessively cross-linked, and appropriate adhesive force is easily obtained. Moreover, by making the usage-amount of a crosslinking agent more than the said lower limit, it is prevented that an adhesive adheres to an electronic member or an optical member.
 また、表面保護フィルムの光透過率が80%未満となるように、粘着剤層が着色されていてもよい。粘着剤層は着色されることにより、表面保護フィルムの視認性が向上する。そのため、例えば、人手により表面保護フィルムを後述する剥離フィルムから剥離する際や、表面保護フィルムが保護対象である被着体に添付されていることを容易に視認できるため、剥離がしやすく、かつ、剥がし忘れも防止できる。なお、表面保護フィルムの光透過率とは、波長600nmにおいて株式会社島津製作所製 分光光度計 UV-3600により測定されたものである。上記光透過率は、好ましくは30~70%程度である。
 粘着剤層を着色するために、粘着剤組成物には、通常、染料、顔料が含有されており、中でも青色染料、青色顔料が含有されることが好ましい。
Moreover, the pressure-sensitive adhesive layer may be colored so that the light transmittance of the surface protective film is less than 80%. The visibility of the surface protective film is improved by coloring the pressure-sensitive adhesive layer. Therefore, for example, when the surface protective film is peeled off manually from a release film described later, or because the surface protective film is easily attached to the adherend to be protected, it is easy to peel off, and , Can also prevent forgetting to peel off. The light transmittance of the surface protective film is measured with a spectrophotometer UV-3600 manufactured by Shimadzu Corporation at a wavelength of 600 nm. The light transmittance is preferably about 30 to 70%.
In order to color the pressure-sensitive adhesive layer, the pressure-sensitive adhesive composition usually contains a dye and a pigment, and among them, a blue dye and a blue pigment are preferably contained.
 また、上述した粘着剤には、酸化防止剤、軟化剤(可塑剤)、劣化防止剤、帯電防止剤、難燃剤、防錆剤、充填剤、シリコーン化合物、連鎖移動剤等の上記成分以外の成分が適宜含有されてもよい。 In addition, the above-mentioned pressure-sensitive adhesives include antioxidants, softeners (plasticizers), deterioration inhibitors, antistatic agents, flame retardants, rust inhibitors, fillers, silicone compounds, chain transfer agents, and other components other than those described above. Components may be appropriately contained.
<剥離フィルム>
 本発明の表面保護フィルムの粘着剤層側には、剥離フィルムが貼付される。
 本発明の表面保護フィルムが有する剥離フィルムは、厚さが20μm以上である。
 厚さが20μm未満の剥離フィルムを用いた場合、得られる表面保護フィルムの抜き加工を行う際、表面保護フィルム中の基材層と粘着剤層とから構成される部分のみを抜き出したい場合でも、剥離フィルムまで抜き出してしまう(全抜き)などといった不具合が発生し易く、抜き加工性が劣る。
 このような観点から、当該剥離フィルムの厚さは、好ましくは30μm以上、より好ましくは50μm以上である。また、好ましくは150μm以下、より好ましくは100μm以下である。
 本発明の剥離フィルムとしては、両面剥離処理された剥離フィルムや、片面剥離処理された剥離フィルム等が用いられ、剥離フィルム用基材の表面上に剥離剤を塗布したもの等が挙げられる。
 剥離フィルム用基材としては、樹脂フィルムが好ましく、当該樹脂フィルムを構成する樹脂としては、例えば、ポリエチレンテレフタレート樹脂、ポリブチレンテレフタレート樹脂、ポリエチレンナフタレート樹脂等のポリエステル樹脂、ポリプロピレン樹脂、ポリエチレン樹脂等のポリオレフィン樹脂等が挙げられる。
 剥離剤としては、例えば、シリコーン系樹脂、オレフィン系樹脂、イソプレン系樹脂、ブタジエン系樹脂等のゴム系エラストマー、長鎖アルキル系樹脂、アルキド系樹脂、フッ素系樹脂等が挙げられる。
<Peeling film>
A release film is affixed to the pressure-sensitive adhesive layer side of the surface protective film of the present invention.
The release film of the surface protective film of the present invention has a thickness of 20 μm or more.
When a release film having a thickness of less than 20 μm is used, when performing the punching process of the surface protective film to be obtained, even when only the portion composed of the base material layer and the pressure-sensitive adhesive layer in the surface protective film is to be extracted, Problems such as extraction of the release film (all extraction) are likely to occur, and the punching processability is poor.
From such a viewpoint, the thickness of the release film is preferably 30 μm or more, more preferably 50 μm or more. Moreover, Preferably it is 150 micrometers or less, More preferably, it is 100 micrometers or less.
As the release film of the present invention, a release film that has been subjected to a double-sided release process, a release film that has been subjected to a single-sided release process, or the like is used, and examples include those in which a release agent is applied on the surface of a release film substrate.
As the substrate for the release film, a resin film is preferable. Examples of the resin constituting the resin film include a polyester resin such as a polyethylene terephthalate resin, a polybutylene terephthalate resin, and a polyethylene naphthalate resin, a polypropylene resin, and a polyethylene resin. Examples include polyolefin resins.
Examples of the release agent include rubber elastomers such as silicone resins, olefin resins, isoprene resins, and butadiene resins, long chain alkyl resins, alkyd resins, and fluorine resins.
 本発明の表面保護フィルムが有する剥離フィルムは、剛軟度が2000~42500mN・cmであることが好ましい。
 剥離フィルムの剛軟度が2000mN・cm以上であると、コシが弱くなり過ぎず、表面保護フィルムの取り扱いが容易となる。また、剥離フィルムの剛軟度が42500mN・cm以下であると、コシが強くなり過ぎず、粘着フィルムから剥離フィルムを手作業で剥がし易くなる。
 このような観点から、当該剥離フィルムの剛軟度は、より好ましくは6000mN・cm以上である。また、より好ましくは30000mN/cm以下である。
 なお、剛軟度は、JIS L 1913に準ずる方法で測定される値であり、より具体的には、後述する実施例に記載した方法に基づいて測定、算出される値である。
 本発明の表面保護フィルムが有する剥離フィルムは、剥離力が50mN/50mm以上、200mN/50mm以下であることが好ましい。
 抜き加工では、表面保護フィルムの基材側の面から剥離フィルムに達するように抜き刃を入れて、粘着フィルムのみを所定の形状に打ち抜く作業を行う。抜き刃を、表面保護フィルムから抜き取った後、粘着フィルムのうち不要な部分を剥離して除去するが、この時、粘着フィルムとして必要な部分まで一緒に除去してしまうことがある(以下、「とも上がり」ともいう)。
 剥離フィルムの剥離力が50mN/50mm以上であれば、抜き加工時のとも上がりを防止することができる。また、剥離力が200mN/50mm以下であれば、剥離フィルムの剥離が容易となり、貼り合せ作業時の作業性が向上する。
 このような観点から、当該剥離フィルムの剥離力は、より好ましくは70mN/50mm以上、更に好ましくは100mN/50mm以上である。
 上記した剥離力は、後述する実施例に記載した方法に基づいて測定した値である。
The release film of the surface protective film of the present invention preferably has a bending resistance of 2000 to 42500 mN · cm.
When the bending softness of the release film is 2000 mN · cm or more, the stiffness does not become too weak, and the surface protection film can be easily handled. Moreover, when the bending softness of the release film is 42500 mN · cm or less, the stiffness does not become too strong, and the release film is easily peeled off from the adhesive film manually.
From such a viewpoint, the bending resistance of the release film is more preferably 6000 mN · cm or more. More preferably, it is 30000 mN / cm or less.
The bending resistance is a value measured by a method according to JIS L 1913. More specifically, the bending resistance is a value measured and calculated based on a method described in Examples described later.
The release film of the surface protective film of the present invention preferably has a peel strength of 50 mN / 50 mm or more and 200 mN / 50 mm or less.
In the punching process, a punching blade is inserted so as to reach the release film from the surface of the surface protective film on the base material side, and only the adhesive film is punched into a predetermined shape. After extracting the punching blade from the surface protective film, an unnecessary portion of the adhesive film is peeled off and removed, but at this time, a necessary portion as the adhesive film may be removed together (hereinafter, “ It is also called “to rise.”
If the release force of the release film is 50 mN / 50 mm or more, it is possible to prevent an increase during the punching process. Moreover, if peeling force is 200 mN / 50 mm or less, peeling of a peeling film will become easy and the workability | operativity at the time of bonding work will improve.
From such a viewpoint, the peeling force of the release film is more preferably 70 mN / 50 mm or more, and still more preferably 100 mN / 50 mm or more.
The above-described peeling force is a value measured based on the method described in Examples described later.
 本発明の表面保護フィルムが有する前記基材の剛軟度と前記剥離フィルムの剛軟度との比[基材の剛軟度/剥離フィルムの剛軟度]は、1.0~4.0である。
 当該比が1.0未満の場合、小サイズのフィルムであると、貼り付け時に、表面保護フィルムの剥離フィルムを折り曲げた際に、剥離フィルムから一部剥離した粘着フィルムを剥離開始部(剥離のきっかけ)として、剥離フィルムから粘着フィルムを剥離すること(「頭出し」ともいう)がしにくいために、被着体への貼り付け時に位置ずれが生じ易くなり、貼り直しの頻度が増加するなど貼り付け時の作業性が劣る。
 また、一般的に、基材の厚みが厚いほど、基材の剛軟度は高くなる。剥離フィルムについても同様である。
 そのため、当該比が4.0を超えると、粘着フィルムがある部分と粘着フィルムがない部分(剥離フィルムのみの部分)との厚み差による影響が大きくなって、表面保護フィルムが取り扱いにくくなるため、粘着フィルムから剥離フィルムを剥がす作業時の作業性が低下する。例えば、本発明の表面保護フィルムを数枚束ねてその両端を手で掴み、束にした表面保護フィルムの端部を揃えるための作業(例;両端を掴んだ表面保護フィルムの束のうち掴んでいない辺のうちの一辺を、カッターボード等の上に数回程度軽く落として端を揃える作業)などでは、粘着フィルムがある部分とない部分との厚み差が大きいと、表面保護フィルム間の隙間が広くなって、表面保護フィルム同士がずれやすくなり、作業効率が低下するといったことが挙げられる。このような観点から、当該比は、好ましくは1.0以上3.0以下である。
The ratio of the stiffness of the substrate and the stiffness of the release film [the stiffness of the substrate / the stiffness of the release film] of the surface protective film of the present invention is 1.0 to 4.0. It is.
When the ratio is less than 1.0, when the film is a small size, when the release film of the surface protection film is folded, the adhesive film partially peeled from the release film is peeled off at the time of application. As a trigger), it is difficult to peel off the adhesive film from the release film (also referred to as “cueing”), so it is easy to cause misalignment when sticking to the adherend, and the frequency of reattachment increases. Workability at the time of pasting is inferior.
In general, the thicker the substrate, the higher the bending resistance of the substrate. The same applies to the release film.
Therefore, if the ratio exceeds 4.0, the effect of the thickness difference between the part with the adhesive film and the part without the adhesive film (part of the release film only) becomes large, and the surface protective film becomes difficult to handle. The workability at the time of peeling the release film from the adhesive film is reduced. For example, a bundle of several surface protection films of the present invention, gripping both ends thereof by hand, and work for aligning the ends of the bundled surface protection films (eg, grasping a bundle of surface protection films gripping both ends) For example, when one side of the non-side is slightly dropped on the cutter board several times to align the edges, the gap between the surface protection films is large if there is a large difference in thickness between the part with and without the adhesive film. Becomes wider, the surface protective films are easily displaced, and the working efficiency is reduced. From such a viewpoint, the ratio is preferably 1.0 or more and 3.0 or less.
<易接着層>
 本発明の基材は、密着性を向上させるために、粘着剤層が設けられる側の面に易接着層を有していてもよい。
 易接着層を形成する易接着層形成用組成物としては、特に限定されないが、例えば、ポリエステル系樹脂、ウレタン系樹脂、ポリエステルウレタン系樹脂、アクリル系樹脂等を含む組成物が挙げられる。
 なお、当該易接着層形成用組成物には、必要に応じて、架橋剤、光重合開始剤、酸化防止剤、軟化剤(可塑剤)、充填剤、防錆剤、顔料、染料等を含有してもよい。
 易接着層の厚さとしては、好ましくは0.01~10μm、より好ましくは0.03~5μmである。
<Easily adhesive layer>
The base material of the present invention may have an easy adhesion layer on the surface on which the pressure-sensitive adhesive layer is provided in order to improve adhesion.
Although it does not specifically limit as a composition for easy-adhesion layer formation which forms an easy-adhesion layer, For example, the composition containing a polyester-type resin, a urethane-type resin, a polyester urethane-type resin, an acrylic resin etc. is mentioned.
The easy-adhesion layer-forming composition contains a crosslinking agent, a photopolymerization initiator, an antioxidant, a softening agent (plasticizer), a filler, a rust inhibitor, a pigment, a dye, and the like as necessary. May be.
The thickness of the easy adhesion layer is preferably 0.01 to 10 μm, more preferably 0.03 to 5 μm.
 表面保護フィルムのサイズは、100mm以下であることが好ましく、より好ましくは10~80mm程度である。なお、ここでいう表面保護フィルムのサイズとは、粘着フィルム部分の面積をいう。粘着フィルムは、光学部材及び電子部材に応じてサイズが小さくなる。一般的に、表面保護フィルムのサイズが小さくなると貼り付けや剥離といった作業が難しくなる。本発明の表面保護フィルムは、上述したように剥離性能が良好であるため、手作業でも剥離しやすい。また、粘着フィルムは、その形状は限定されないが、例えば、円形、正方形、矩形、環状形等に加工される。 The size of the surface protective film is preferably 100 mm 2 or less, more preferably about 10 to 80 mm 2 . In addition, the size of the surface protective film here refers to the area of the adhesive film portion. The size of the adhesive film is reduced depending on the optical member and the electronic member. Generally, when the size of the surface protective film is reduced, operations such as pasting and peeling become difficult. Since the surface protective film of the present invention has good peeling performance as described above, it is easy to peel off even by manual work. The shape of the adhesive film is not limited, but is processed into, for example, a circle, a square, a rectangle, an annular shape, or the like.
 また、表面保護フィルムは、80℃で2時間加熱前後の23℃、50%RH(相対湿度)条件における液晶プラスチックに対する粘着力が、いずれも400~1000mN/25mmであることが好ましい。
 80℃で2時間加熱前後の当該粘着力が、いずれも400mN/25mm以上であることで、表面保護フィルムの光学部材や電子部材に対する接着力が高くなり、その保護性能が良好になる。また、80℃で2時間加熱前後の当該粘着力が、いずれも1000mN/25mm以下であることで、被着体である光学部材又は電子部材から粘着フィルムを容易に剥離することが可能であり、被着体に過度な負荷がかかることを防止することができる。また、粘着フィルムを貼り付けた光学部材又は電子部材等は、加工、取り付け、検査、又は搬送等の工程において加熱されることがある。加熱により粘着フィルムの粘着力が上昇すると、粘着フィルムを剥離する際の作業性が低下するため、表面保護フィルムを80℃で2時間加熱した前後の表面保護フィルムの粘着力は、いずれも400~1000mN/25mmの範囲であることが好ましい。
 このような観点から、表面保護フィルムの80℃で2時間加熱前後の23℃、50%RH(相対湿度)条件における液晶プラスチックに対する粘着力は、好ましくは450~800mN/25mm、より好ましくは500~800mN/25mmである。
 上記した粘着力は、前述の粘着剤層を構成するメインポリマーを構成するモノマーの種類及び配合比、架橋剤の使用量等により調整することが可能である。また、基材の剛軟度にも影響を受ける。
 上記した表面保護フィルムの粘着力とは、より具体的には、後述する実施例に記載した方法に基づいて測定した値である。
The surface protective film preferably has an adhesive strength to liquid crystal plastic of 400 to 1000 mN / 25 mm under conditions of 23 ° C. and 50% RH (relative humidity) before and after heating at 80 ° C. for 2 hours.
When the adhesive strength before and after heating at 80 ° C. for 2 hours is 400 mN / 25 mm or more, the adhesive strength of the surface protective film to the optical member and the electronic member is increased, and the protective performance is improved. In addition, the adhesive force before and after heating at 80 ° C. for 2 hours is 1000 mN / 25 mm or less, so that the adhesive film can be easily peeled off from the optical member or the electronic member as the adherend, It is possible to prevent an excessive load from being applied to the adherend. Moreover, the optical member or the electronic member to which the adhesive film is attached may be heated in processes such as processing, attachment, inspection, or conveyance. When the adhesive strength of the adhesive film is increased by heating, workability at the time of peeling the adhesive film is lowered. Therefore, the adhesive strength of the surface protective film before and after heating the surface protective film at 80 ° C. for 2 hours is 400 to The range is preferably 1000 mN / 25 mm.
From such a point of view, the adhesive strength to liquid crystal plastics under conditions of 23 ° C. and 50% RH (relative humidity) before and after heating for 2 hours at 80 ° C. is preferably 450 to 800 mN / 25 mm, more preferably 500 to 800 mN / 25 mm.
The above-mentioned adhesive strength can be adjusted by the kind and blending ratio of the monomers constituting the main polymer constituting the aforementioned pressure-sensitive adhesive layer, the amount of the crosslinking agent used, and the like. It is also affected by the bending resistance of the substrate.
More specifically, the above-mentioned adhesive strength of the surface protective film is a value measured based on the method described in Examples described later.
<表面保護フィルムの製造方法>
 本発明の表面保護フィルムの製造方法としては、特に制限はなく、公知の方法により製造することができる。
 例えば、必要に応じ適当な溶剤で希釈した粘着剤組成物を、剥離フィルム上に所定の乾燥膜厚になるように塗布し、その後乾燥して粘着剤層を形成した後、粘着剤層に基材を貼り合わせて形成すればよい。また、必要に応じ適当な溶剤で希釈した粘着剤組成物を、基材に直接塗布し、その後乾燥して粘着剤層を形成し、その上に剥離フィルムを貼り合せてもよい。
 また、表面保護フィルムは、支持体(上記基材又は剥離フィルム)の上に粘着剤層を部分的に設けて、支持体の上に粘着部とともに非粘着部を形成してもよい。部分的に粘着剤層を設けた表面保護フィルムを作成するには、スクリーン印刷やインクジェット印刷を行うとよい。粘着部と非粘着部は、ストライプ形状、格子形状、ドット形状、波線を複数並べた形状、市松模様、及び各種の模様を複数並べた形状から選択されるいずれかのパターンで配置されることが好ましく、その他の形状であってもよい。
 なお、粘着剤層が、パターン状に部分的に設けられる場合、そのパターンは、通常、支持体の全面に設けられる。
 また、表面保護フィルムは、基材の上に粘着剤層を全面的に設けて、当該粘着剤層の上に、更に部分的に非粘着性の樹脂層を形成してもよい。当該非粘着性の樹脂層を作成するには、スクリーン印刷やインクジェット印刷を行うとよい。当該非粘着性の樹脂層は、ストライプ形状、格子形状、ドット形状、波線を複数並べた形状、市松模様、及び各種の模様を複数並べた形状から選択されるいずれかのパターンで配置されることが好ましく、その他の形状であってもよい。
 さらに、上記支持体上に部分的に設けられた粘着剤層の粘着部と非粘着部が取り得る各パターン、並びに上記非粘着性の樹脂層が取り得る各パターンにおいて、パターンのピッチ(すなわち、隣接する粘着部同士の間の間隔、又は隣接する非粘着部同士の間の間隔)は、好ましくは10~500μm、より好ましくは10~300μm、特に好ましくは10~250μmである。
 すなわち、各ストライプの幅及びストライプの間隔、各波線の幅及び波線と波線の間の間隔、格子をなす各線の幅、及び格子を構成する隣接する線と線の間の間隔、ドット間の間隔並びにドットの幅及び高さ、あるいは、市松模様を構成する各四角形の高さ及び幅は、好ましくは10~500μm、より好ましくは10~300μm、特に好ましくは10~250μmである。
 また、粘着剤層の形成前あるいは形成後に、抜き加工をしてもよい。抜き加工は、例えば剥離フィルム上に設けられた基材及び粘着剤層の積層体に対して行えばよく、この抜き加工により、粘着フィルムの形状を上記したように、円形、正方形、矩形、環状形等の形状を調整することができる。抜き加工では、表面保護フィルムの基材側の面から剥離フィルムに達するように抜き刃を入れて、粘着フィルムのみを所定の形状に打ち抜く作業を行う。抜き刃を、表面保護フィルムから抜き取った後、粘着フィルムのうち不要な部分を除去することによって、表面保護フィルムを得ることができる。また、任意のタイミングで型押し等により、表面保護フィルムに適宜凹凸を形成してもよい。
 このようにして得られた表面保護フィルムは、例えば、一枚の剥離フィルム上に、複数の粘着フィルム(例えば円形の粘着フィルム)が設けられており、その後、適宜、剥離フィルム部分をカッター等で切断し、表面保護フィルム(剥離フィルムを含む)を所望の形状に加工することもできる。
<Method for producing surface protective film>
There is no restriction | limiting in particular as a manufacturing method of the surface protection film of this invention, It can manufacture by a well-known method.
For example, a pressure-sensitive adhesive composition diluted with an appropriate solvent as required is applied on a release film so as to have a predetermined dry film thickness, and then dried to form a pressure-sensitive adhesive layer. What is necessary is just to form a material by bonding together. Moreover, the adhesive composition diluted with a suitable solvent as needed may be directly applied to the substrate, and then dried to form an adhesive layer, and a release film may be bonded thereon.
Moreover, a surface protection film may provide an adhesive layer partially on a support body (the said base material or peeling film), and may form a non-adhesion part with an adhesion part on a support body. In order to create a surface protective film partially provided with an adhesive layer, screen printing or inkjet printing may be performed. The adhesive portion and the non-adhesive portion may be arranged in any pattern selected from a stripe shape, a lattice shape, a dot shape, a shape in which a plurality of wavy lines are arranged, a checkered pattern, and a shape in which various patterns are arranged in a plurality. Other shapes may be preferable.
In addition, when an adhesive layer is partially provided in pattern shape, the pattern is normally provided in the whole surface of a support body.
In addition, the surface protective film may be provided with a pressure-sensitive adhesive layer on the entire surface of the substrate, and a partially non-adhesive resin layer may be further formed on the pressure-sensitive adhesive layer. In order to create the non-adhesive resin layer, screen printing or inkjet printing may be performed. The non-adhesive resin layer is arranged in any pattern selected from a stripe shape, a lattice shape, a dot shape, a shape in which a plurality of wavy lines are arranged, a checkered pattern, and a shape in which various patterns are arranged in a plurality. Is preferable, and other shapes may be used.
Furthermore, in each pattern that can be taken by the adhesive part and the non-adhesive part of the adhesive layer partially provided on the support, and in each pattern that the non-adhesive resin layer can take, the pitch of the pattern (that is, The distance between adjacent adhesive parts or the distance between adjacent non-adhesive parts is preferably 10 to 500 μm, more preferably 10 to 300 μm, and particularly preferably 10 to 250 μm.
That is, the width of each stripe and the interval between stripes, the width of each wavy line and the interval between wavy lines, the width of each line forming the lattice, the interval between adjacent lines constituting the lattice, the interval between dots The width and height of the dots, or the height and width of each square constituting the checkered pattern is preferably 10 to 500 μm, more preferably 10 to 300 μm, and particularly preferably 10 to 250 μm.
Further, the punching process may be performed before or after the pressure-sensitive adhesive layer is formed. For example, the punching process may be performed on the laminate of the base material and the pressure-sensitive adhesive layer provided on the release film. By the punching process, as described above, the shape of the pressure-sensitive adhesive film is circular, square, rectangular, or annular. The shape such as the shape can be adjusted. In the punching process, a punching blade is inserted so as to reach the release film from the surface of the surface protective film on the base material side, and only the adhesive film is punched into a predetermined shape. After extracting the punching blade from the surface protective film, the surface protective film can be obtained by removing unnecessary portions of the adhesive film. Moreover, you may form an unevenness | corrugation suitably in a surface protection film by stamping etc. at arbitrary timings.
In the surface protective film thus obtained, for example, a plurality of pressure-sensitive adhesive films (for example, circular pressure-sensitive adhesive films) are provided on a single release film, and then the release film portion is appropriately removed with a cutter or the like. It can cut | disconnect and it can also process a surface protection film (a peeling film is included) into a desired shape.
[光学部材又は電子部材]
 本発明の表面保護フィルムによって保護される光学部材又は電子部材としては、1又は2以上のレンズとCCD、CMOS等の撮像センサが筺体又はパッケージ内部に収納された撮像モジュール;複数のレンズがレンズ鏡筒に保持され、必要に応じて筺体又はパッケージ内に収納されたレンズユニット;LED等の発光素子を有する発光素子ユニット;バイブレーター等のモーターユニット;通信モジュール、センサーモジュール等が挙げられる。これら光学部材や電子部材は、基板等の他の部材に取り付けられて使用される部材であることが好ましい。
[Optical member or electronic member]
As an optical member or an electronic member protected by the surface protective film of the present invention, an imaging module in which one or more lenses and an imaging sensor such as a CCD or CMOS are housed in a casing or a package; a plurality of lenses is a lens mirror Examples include a lens unit held in a tube and housed in a housing or a package as necessary; a light emitting element unit having a light emitting element such as an LED; a motor unit such as a vibrator; a communication module, a sensor module, and the like. These optical members and electronic members are preferably members that are used by being attached to other members such as a substrate.
 なお、光学部材とは、光を受光若しくは発光し、又は光を伝送する光学部品を備えるものをいい、上記のうち撮像モジュール、レンズユニット、発光素子ユニット、光信号を送信又は受信する通信モジュール、光センサーモジュール等が光学部材の具体例として挙げられる。
 また、電子部材とは、通常、電気回路の少なくとも一部を構成し、電気信号を送信又は受信する電子部品、電気信号を処理する電子部品、電気信号や電力により作動する電子部品等を備えるものが挙げられ、上記のうち撮像モジュール、発光素子ユニット、バイブレーター等のモーターユニット、電気信号を送信又は受信する通信モジュール、各種センサーモジュール等が電子部材の具体例として挙げられる。
 なお、光信号を送信又は受信する通信モジュールや光センサーモジュール、撮像モジュール及び発光素子ユニット等は、通常、電子部材であるとともに、光学部材でもある部材である。
 また、光学部材や電子部材は、例えば上記電子部品や光学部品がパッケージや筐体内部に収納され、あるいは支持部材に支持されたものであることが好ましい。また、電子部品や光学部品の一部が表面に露出させたものであることが好ましく、表面保護フィルムは例えば、その露出した部品を保護するために使用される。
The optical member refers to an optical component that receives or emits light, or includes an optical component that transmits light. Among the above, an imaging module, a lens unit, a light emitting element unit, a communication module that transmits or receives an optical signal, An example of the optical member is an optical sensor module.
The electronic member usually includes at least a part of an electric circuit and includes an electronic component that transmits or receives an electric signal, an electronic component that processes an electric signal, an electronic component that operates by an electric signal or electric power, and the like. Among them, a motor unit such as an imaging module, a light emitting element unit, and a vibrator, a communication module that transmits or receives an electrical signal, various sensor modules, and the like are specific examples of the electronic member.
Note that a communication module, an optical sensor module, an imaging module, a light emitting element unit, and the like that transmit or receive optical signals are members that are both electronic members and optical members.
Moreover, it is preferable that the optical member or the electronic member is, for example, one in which the electronic component or the optical component is housed in a package or a housing or supported by a support member. Moreover, it is preferable that a part of electronic component or optical component is exposed on the surface, and the surface protection film is used, for example, to protect the exposed component.
[表面保護フィルムの使用方法]
 本発明の表面保護フィルムは、剥離フィルムを剥離した後、光学部材又は電子部材の表面に貼付してその表面を保護するために使用されるものである。具体的には、粘着フィルムが貼付された光学部材又は電子部材(以下、単に「表面粘着フィルム付き部材」ともいう)は、加工され、他の部材に取り付けられ、検査され、又は搬送等されるものであるが、粘着フィルムは、これらの工程において光学部材又は電子部材の表面を保護する。また、粘着フィルムは、これらの工程が終わり、表面保護の必要がなくなった時点で、光学部材又は電子部材から剥離される。
 なお、表面保護フィルムの貼り付け及び剥離は、通常、手作業で行われる。その際、本発明の表面保護フィルムを用いることで、光学部材又は電子部材の表面に貼り付けする時に、貼り付け位置のずれが生じにくくなるため、貼り直しの頻度が低減される。また、一度貼り付けした粘着フィルムを、被着体から剥離する時にも過度な負荷をかけずに剥離することができるため、被着体である光学部材や電子部材を痛めてしまう(歪を起こす、傷が付く等)ことを防止することができる。
 なお、粘着フィルム付き部材は、上記した加工、取り付け、検査、又は搬送等の工程において加熱されてもよい。その際の加熱温度は特に限定されないが、60~200℃程度、好ましくは70~150℃程度である。
[Usage of surface protection film]
The surface protective film of the present invention is used for protecting the surface of the optical member or electronic member by attaching the surface protective film after peeling the release film. Specifically, an optical member or an electronic member (hereinafter, also simply referred to as “member with a surface adhesive film”) to which an adhesive film is attached is processed, attached to another member, inspected, transported, or the like. Although it is a thing, an adhesive film protects the surface of an optical member or an electronic member in these processes. Further, the adhesive film is peeled off from the optical member or the electronic member when these steps are finished and the surface protection is no longer necessary.
In addition, sticking and peeling of a surface protection film are normally performed manually. At that time, by using the surface protective film of the present invention, it is difficult to cause a shift in the attaching position when attaching to the surface of the optical member or the electronic member, so that the frequency of reattaching is reduced. Moreover, since the adhesive film once pasted can be peeled off without applying an excessive load even when peeled off from the adherend, it damages the optical member and electronic member which are adherends (causes distortion). , Etc.) can be prevented.
In addition, the member with an adhesive film may be heated in processes, such as an above-described process, attachment, an inspection, or conveyance. The heating temperature at that time is not particularly limited, but is about 60 to 200 ° C., preferably about 70 to 150 ° C.
 粘着フィルムが貼付された光学部材又は電子部材(粘着フィルム付き部材)は、例えば接着剤により基板等の他の部材に取り付けられることが好ましい。この際、接着剤は熱硬化性のものが使用され、その接着剤を硬化させるために、表面保護フィルム付き部材は、上記したように通常60~200℃以上、好ましくは70~150℃程度で加熱されることが好ましい。その後、表面保護が不要になると、粘着フィルムが光学部材又は電子部材から剥離される。 It is preferable that the optical member or the electronic member (the member with the adhesive film) to which the adhesive film is attached is attached to another member such as a substrate with an adhesive, for example. At this time, a thermosetting adhesive is used, and in order to cure the adhesive, the member with a surface protective film is usually at a temperature of 60 to 200 ° C. or higher, preferably about 70 to 150 ° C. as described above. Heating is preferred. Then, when surface protection becomes unnecessary, the adhesive film is peeled from the optical member or the electronic member.
 また、表面保護フィルムは、上記した光学部材又は電子部材の中では、撮像モジュール用の表面保護フィルムとして使用されることが特に好ましい。
 撮像モジュールは、通常、その一面に外部からの光を受光し、その光をモジュール内部のレンズを介して撮像素子に導くための受光部が設けられる。受光部は、撮像モジュールの一面の一部(例えば、中央)に設けられ、ガラスや透明樹脂からなる。粘着フィルムは、撮像モジュールの受光部が設けられた一面に、受光部を覆うように貼付されることが好ましい。粘着フィルムは、受光部、及び受光部周囲の筺体又はパッケージの表面に高い密着力で接着するため、撮像モジュールの一面に設けられた受光部を適切に保護することが可能である。また、粘着フィルムは、撮像モジュールから容易に剥離することが可能であり、受光部等に過度な負荷がかかることが防止される。
 なお、粘着フィルムが貼付された撮像モジュールは、上記したように、熱硬化性接着剤の硬化のために加熱されて基板等の他の部材に取り付けられることが好ましい。
Further, the surface protective film is particularly preferably used as a surface protective film for an imaging module in the above-described optical member or electronic member.
The imaging module is usually provided with a light receiving portion for receiving light from the outside on one surface and guiding the light to the imaging device via a lens inside the module. The light receiving unit is provided on a part (for example, the center) of one surface of the imaging module and is made of glass or transparent resin. The adhesive film is preferably attached to one surface of the imaging module where the light receiving part is provided so as to cover the light receiving part. Since the adhesive film adheres to the light receiving portion and the surface of the casing or package around the light receiving portion with high adhesion, it is possible to appropriately protect the light receiving portion provided on one surface of the imaging module. Moreover, the adhesive film can be easily peeled off from the imaging module, and an excessive load is prevented from being applied to the light receiving portion and the like.
In addition, as above-mentioned, it is preferable that the imaging module with which the adhesive film was stuck is heated for hardening of a thermosetting adhesive, and is attached to other members, such as a board | substrate.
 以下、実施例に基づき本発明を更に詳細に説明するが、本発明はこれらの例によって制限されるものではない。 Hereinafter, the present invention will be described in more detail based on examples, but the present invention is not limited to these examples.
 本発明における測定方法及び評価方法は以下のとおりである。
[測定方法]
<アクリル系共重合体の重量平均分子量(Mw)>
 ゲルパーミエーションクロマトグラフ装置を用いて、下記の条件下で測定し、標準ポリスチレン換算にて測定した値を用いた。
(測定条件)
測定装置:製品名「HLC-8220GPC」、東ソー(株)製
カラム:製品名「TSKGel SuperHZM-M」、東ソー(株)製
展開溶媒:テトラヒドロフラン
カラム温度:40℃
流速:1.0mL/min
<基材の剛軟度>
 JIS L 1913に準ずる方法にて、基材の成形時の流れ方向(Machine Direction。以下、「MD方向」という。)と、基材の成形時の流れ方向に対して直角方向(Transverse Direction。以下、「TD方向」という。)、それぞれについて測定を行った。ただし、45°カンチレバー形試験機を使用し、基材を20mm×150mmの試験片にカットした。また、測定に用いた試験片は、MD方向とTD方向で各2枚ずつ準備した。なお、ここで、MD方向の試験片とは、試験片の長手方向が基材のMD方向であることを表す。同様に、TD方向の試験片とは、試験片の長手方向が基材のTD方向であることを表す。
 各試験片1枚あたり、曲げ長さ(mN・cm)について、表面で2回(両端)、裏面で2回(両端)の合計4回の測定を行った。当該4回分の測定結果について平均値を算出した。
 MD方向の試験片2枚分の曲げ長さの測定値と、測定に用いた試験片の単位面積当たりの質量(g/m)とから、JIS L 1913に記載された計算式を用いてMD剛軟度を算出した。TD方向についても同様に、試験片2枚分の曲げ長さの測定値を用いて、TD剛軟度を算出した。
 算出したMD剛軟度とTD剛軟度との値を平均して、基材の剛軟度(mN・cm)とした。
<剥離フィルムの剛軟度>
 「基材の剛軟度」に記載の測定方法と同様の方法を用いて、剥離フィルムのMD方向とTD方向の曲げ長さ(mN・cm)を測定した。そして、「基材の剛軟度」の算出方法と同様の方法を用いて、剥離フィルムの剛軟度(mN・cm)を算出した。
The measurement method and evaluation method in the present invention are as follows.
[Measuring method]
<Weight average molecular weight of acrylic copolymer (Mw)>
Using a gel permeation chromatograph, measurement was performed under the following conditions, and values measured in terms of standard polystyrene were used.
(Measurement condition)
Measuring device: Product name “HLC-8220GPC”, manufactured by Tosoh Corporation Column: product name “TSKGel SuperHZM-M”, developed by Tosoh Corporation Solvent: Tetrahydrofuran Column temperature: 40 ° C.
Flow rate: 1.0 mL / min
<Flexibility of base material>
By a method according to JIS L 1913, the flow direction (Machine Direction; hereinafter referred to as “MD direction”) during molding of the substrate and the direction perpendicular to the flow direction during molding of the substrate (Transverse Direction. , “TD direction”), and measurement was performed for each. However, a 45 ° cantilever type tester was used, and the substrate was cut into 20 mm × 150 mm test pieces. Two test pieces used for the measurement were prepared in each of the MD direction and the TD direction. Here, the test piece in the MD direction means that the longitudinal direction of the test piece is the MD direction of the substrate. Similarly, the test piece in the TD direction indicates that the longitudinal direction of the test piece is the TD direction of the substrate.
For each test piece, the bending length (mN · cm) was measured four times in total, twice on the front surface (both ends) and twice on the back surface (both ends). The average value was calculated for the measurement results for the four times.
From the measured value of the bending length of two test pieces in the MD direction and the mass per unit area (g / m 2 ) of the test piece used for the measurement, the calculation formula described in JIS L 1913 is used. MD bending resistance was calculated. Similarly, in the TD direction, the TD bending resistance was calculated using the measurement values of the bending lengths of two test pieces.
The calculated values of MD bending resistance and TD bending resistance were averaged to obtain the bending resistance (mN · cm) of the base material.
<Bending softness of release film>
The bending length (mN · cm) in the MD direction and the TD direction of the release film was measured using the same method as the measurement method described in “Bending and bending resistance of base material”. And the bending softness (mN * cm) of a peeling film was computed using the method similar to the calculation method of "the bending softness of a base material".
<弾性率>
 粘着剤層の貯蔵弾性率(G’)は、厚さ30μmの粘着性組成物の層を積層し、8mmφ×3mm厚の円柱状の試験片を作製し、ねじり剪断法により、下記の条件で測定したものである。
  測定装置:Anton Paar社製動的粘弾性測定「Physica MCR 300」
  周波数:1Hz
  温度:23℃
<Elastic modulus>
The storage elastic modulus (G ′) of the pressure-sensitive adhesive layer was obtained by laminating a layer of a pressure-sensitive adhesive composition having a thickness of 30 μm, producing a cylindrical test piece having a thickness of 8 mmφ × 3 mm, and using a torsional shear method under the following conditions: It is measured.
Measuring device: Dynamic viscoelasticity measurement “Physica MCR 300” manufactured by Anton Paar
Frequency: 1Hz
Temperature: 23 ° C
<常態粘着力(加熱前粘着力)の測定>
 表面保護フィルムを25mm×250mmの形状に裁断した後、表面保護フィルムの剥離フィルムを剥がしたサンプルを、2kgローラで、3mm×70mm×150mmの形状にカットした液晶プラスチックの「ベクトラLCP」(商品名、ポリプラスチックス(株)製)上に貼付して、引張試験片を作製した。当該試験片を23℃、50%RH(相対湿度)の環境下で24時間保管した。その後、当該試験片を、23℃、50%RH(相対湿度)の環境下で、引張試験機(商品名:「RTG-1225」、(株)エー・アンド・デイ製)を用いて、引張速度300mm/分、剥離方向180°で被着体からサンプルを剥離した際の粘着力を測定して、常態粘着力(加熱前粘着力)とした。
<加熱後粘着力の測定>
 表面保護フィルムを25mm×250mmの形状に裁断した後、表面保護フィルムの剥離フィルムを剥がしたサンプルを、2kgローラで、3mm×70mm×150mmの形状にカットした液晶プラスチック「ベクトラLCP」(商品名、ポリプラスチックス(株)製)上に貼付して、引張試験片を作製した。当該試験片を23℃、50%RH(相対湿度)の環境下で24時間保管した後、80℃のオーブン中で2時間加熱した。加熱後の試験片を、更に、23℃、50%RH(相対湿度)の環境下で24時間保管した。その後、当該試験片を、23℃、50%RH(相対湿度)の環境下で、引張試験機(商品名:「RTG-1225」、(株)エー・アンド・デイ社製)を用いて、引張速度300mm/分、剥離方向180°で被着体からサンプルを剥離した際の粘着力を測定して、加熱後粘着力とした。
<Measurement of normal adhesive strength (adhesive strength before heating)>
After cutting the surface protective film into a 25 mm x 250 mm shape, the sample from which the surface protective film was peeled off was cut into a 3 mm x 70 mm x 150 mm shape with a 2 kg roller. , Manufactured by Polyplastics Co., Ltd.) to prepare a tensile test piece. The test piece was stored for 24 hours in an environment of 23 ° C. and 50% RH (relative humidity). Thereafter, the test piece was pulled using a tensile tester (trade name: “RTG-1225”, manufactured by A & D Co., Ltd.) in an environment of 23 ° C. and 50% RH (relative humidity). The adhesive force when the sample was peeled off from the adherend at a speed of 300 mm / min and a peeling direction of 180 ° was measured to obtain a normal state adhesive force (adhesive force before heating).
<Measurement of adhesive strength after heating>
After cutting the surface protective film into a 25 mm × 250 mm shape, the sample from which the surface protective film was peeled off was cut with a 2 kg roller into a 3 mm × 70 mm × 150 mm shape liquid crystal plastic “Vectra LCP” (trade name, A tensile test piece was prepared by pasting onto Polyplastics Co., Ltd. The test piece was stored for 24 hours in an environment of 23 ° C. and 50% RH (relative humidity), and then heated in an oven at 80 ° C. for 2 hours. The heated test piece was further stored for 24 hours in an environment of 23 ° C. and 50% RH (relative humidity). Thereafter, the test piece was used in an environment of 23 ° C. and 50% RH (relative humidity) using a tensile tester (trade name: “RTG-1225”, manufactured by A & D Co., Ltd.) The adhesive strength when the sample was peeled from the adherend at a pulling speed of 300 mm / min and a peeling direction of 180 ° was measured and used as the adhesive strength after heating.
<剥離フィルムの剥離力測定>
 表面保護フィルムを50mm×250mmの形状に裁断した後、表面保護フィルムの剥離フィルムの短辺の一方を剥がして折り曲げ、23℃、50%RH(相対湿度)の環境下で、引張速度300mm/分、剥離方向180°で被着体からサンプルを剥離した際の粘着力を測定して、剥離フィルムの剥離力とした。
<Measurement of peel strength of release film>
After the surface protective film is cut into a shape of 50 mm × 250 mm, one of the short sides of the release film of the surface protective film is peeled off and bent, and the tensile speed is 300 mm / min in an environment of 23 ° C. and 50% RH (relative humidity). The peel strength of the peeled film was measured by measuring the adhesive strength when the sample was peeled from the adherend in a peel direction of 180 °.
[表面保護フィルムの評価方法]
<貼付作業性>
 9mmφ(63.6mm)の大きさに抜き加工した粘着フィルムを、ピンセットを用いて剥離フィルムから剥離し、カメラモジュールに貼付する際の作業性を以下の基準で評価した。評価は、5人の作業者によって行われ、各作業者が1点又は0点の判定を行い、合計0~5点で評価を行った。
1点:作業しやすい。
0点:作業しにくい。
<剥離作業性>
 9mmφ(63.6mm)の大きさに抜き加工した粘着フィルムを、カメラモジュールに貼合して評価用サンプルを作製した。評価用サンプルを80℃で2時間加熱後、評価用サンプルの温度が室温になるまで放置した。その後、指で粘着フィルムをカメラモジュールから剥離するときの作業性を、以下の基準で評価した。評価は、5人の作業者によって行われ、各作業者が1点又は0点の判定を行い、合計0~5点で評価を行った。
1点:作業しやすい。
0点:作業しにくい。
<モジュール不具合防止度>
 9mmφ(63.6mm)の大きさに型抜きした粘着フィルムをカメラモジュールに貼合して、評価用サンプルを作製した。当該サンプルを80℃で2時間加熱後、サンプル温度が室温になるまで放置した。その後、指で粘着フィルムをカメラモジュールから剥離した。粘着フィルムを剥離した後のカメラモジュールの不具合(カメラモジュール内のバネが完全に破損)を確認し、以下の基準で評価した。1回の試験で5個のカメラモジュールを使用し、各カメラモジュールについて1点又は0点の判定を行い、合計点0~5点で評価を行った。
1点:不具合なし。
0点:不具合あり。
[Method for evaluating surface protective film]
<Attachment workability>
The adhesive film that had been punched into a size of 9 mmφ (63.6 mm 2 ) was peeled from the release film using tweezers, and the workability when it was attached to the camera module was evaluated according to the following criteria. The evaluation was performed by five workers, and each worker determined 1 point or 0 point, and the evaluation was performed with a total of 0 to 5 points.
1 point: Easy to work.
0 points: Difficult to work.
<Peeling workability>
The adhesive film punched into a size of 9 mmφ (63.6 mm 2 ) was bonded to a camera module to produce a sample for evaluation. The evaluation sample was heated at 80 ° C. for 2 hours, and then allowed to stand until the temperature of the evaluation sample reached room temperature. Then, the workability | operativity when peeling an adhesive film from a camera module with a finger was evaluated on the following references | standards. The evaluation was performed by five workers, and each worker determined 1 point or 0 point, and the evaluation was performed with a total of 0 to 5 points.
1 point: Easy to work.
0 points: Difficult to work.
<Module failure prevention degree>
An adhesive film die-cut to a size of 9 mmφ (63.6 mm 2 ) was bonded to the camera module to produce a sample for evaluation. The sample was heated at 80 ° C. for 2 hours and then allowed to stand until the sample temperature reached room temperature. Then, the adhesive film was peeled from the camera module with a finger. Defects in the camera module after peeling the adhesive film (the spring in the camera module was completely damaged) were confirmed and evaluated according to the following criteria. Five camera modules were used in one test, 1 point or 0 point was determined for each camera module, and evaluation was made with a total of 0 to 5 points.
1 point: No problem.
0 point: There is a defect.
[実施例1]
 2-エチルヘキシルアクリレート(2EHA)68.6質量部と、メチルアクリレート(MA)30質量部と、グリシジルメタクリレート(GMA)0.2質量部と、アクリル酸(AA)1.2質量部とを共重合したアクリル系共重合体(重量平均分子量75万)100質量部に対して、シランカップリング剤として3-グリシドキシプロピルトリメトキシシラン(GPTMS)1質量部と、架橋剤としてトリメチロールプロパン-トリ-β-アジリジニルプロピオネートを乾燥重量比で0.5質量部添加し、トルエン:メチルエチルケトン=90:10(質量比)の混合溶剤で固形分30質量%に希釈したものを塗工液とした。
 この塗工液を、剥離フィルムである厚さが75μmのポリエステルフィルム「SP-PET752150」(商品名、リンテック(株)製)の剥離面にロールナイフコーターで乾燥後の厚さ18μmとなるように塗布し、90℃で1分間乾燥後、基材である厚さが75μmの易接着性ポリエステルフィルム「コスモシャイン A4300」(商品名、東洋紡(株)製)に貼り合せて、23℃で7日間エージングすることにより表面保護フィルムを得た。
 また、粘着剤層の弾性率は、1.2×10Paであった。
[Example 1]
Copolymerization of 68.6 parts by mass of 2-ethylhexyl acrylate (2EHA), 30 parts by mass of methyl acrylate (MA), 0.2 parts by mass of glycidyl methacrylate (GMA), and 1.2 parts by mass of acrylic acid (AA) 1 part by mass of 3-glycidoxypropyltrimethoxysilane (GPTMS) as a silane coupling agent and trimethylolpropane-trimethyl as a crosslinking agent with respect to 100 parts by mass of the acrylic copolymer (weight average molecular weight 750,000) Coating solution prepared by adding 0.5 parts by mass of β-aziridinylpropionate in a dry weight ratio and diluted to 30% by weight with a mixed solvent of toluene: methyl ethyl ketone = 90: 10 (mass ratio) It was.
This coating liquid is applied to the release surface of a 75 μm-thick polyester film “SP-PET752150” (trade name, manufactured by Lintec Co., Ltd.) as a release film so that the thickness after drying with a roll knife coater is 18 μm. After coating and drying at 90 ° C. for 1 minute, the substrate is bonded to an adhesive polyester film “Cosmo Shine A4300” (trade name, manufactured by Toyobo Co., Ltd.) having a thickness of 75 μm, and then 7 days at 23 ° C. A surface protective film was obtained by aging.
The elastic modulus of the pressure-sensitive adhesive layer was 1.2 × 10 6 Pa.
[実施例2]
 基材に厚さが100μmの易接着性ポリエステルフィルム「コスモシャイン A4300」(商品名、東洋紡(株)製)を使用した以外は、実施例1と同様にして表面保護フィルムを作製した。
[Example 2]
A surface protective film was produced in the same manner as in Example 1 except that an easily adhesive polyester film “Cosmo Shine A4300” (trade name, manufactured by Toyobo Co., Ltd.) having a thickness of 100 μm was used as the substrate.
[実施例3]
 2-エチルヘキシルアクリレート(2EHA)48質量部と、n-ブチルアクリレート(BA)48質量部と、アクリル酸(AA)3.64質量部と、2-ヒドロキシプロピルアクリレート(2HPA)0.36質量部とを共重合したアクリル系共重合体(重量平均分子量60万)100質量部に対して、架橋剤としてトリメチロールプロパンアダクトトリレンジイソシアナート(商品名:「コロネートL」、日本ポリウレタン工業(株)製)を乾燥重量比で6.6質量部添加し、トルエン:メチルエチルケトン=90:10(質量比)の混合溶剤で固形分30質量%に希釈したものを塗工液として使用した以外は、実施例1と同様にして表面保護フィルムを作製した。
 また、粘着剤層の弾性率は、7.2×10Paであった。
[Example 3]
48 parts by mass of 2-ethylhexyl acrylate (2EHA), 48 parts by mass of n-butyl acrylate (BA), 3.64 parts by mass of acrylic acid (AA), 0.36 parts by mass of 2-hydroxypropyl acrylate (2HPA), Trimethylolpropane adduct tolylene diisocyanate (trade name: “Coronate L”, manufactured by Nippon Polyurethane Industry Co., Ltd.) as a crosslinking agent for 100 parts by mass of an acrylic copolymer (weight average molecular weight 600,000) ) Was added at a dry weight ratio of 6.6 parts by mass, and diluted with a mixed solvent of toluene: methyl ethyl ketone = 90: 10 (mass ratio) to a solid content of 30% by mass. In the same manner as in Example 1, a surface protective film was produced.
The elastic modulus of the pressure-sensitive adhesive layer was 7.2 × 10 4 Pa.
[実施例4]
 基材に厚さが50μmの易接着性ポリエステルフィルム「コスモシャイン A4300」(商品名、東洋紡(株)製)を使用し、剥離フィルムに厚さが38μmのポリエステルフィルム「SP-PET382150」(商品名、リンテック(株)製)した以外は、実施例1と同様にして表面保護フィルムを作製した。
[Example 4]
A 50 μm thick easily adhesive polyester film “Cosmo Shine A4300” (trade name, manufactured by Toyobo Co., Ltd.) is used as the base material, and a 38 μm thick polyester film “SP-PET 382150” (trade name) is used as the release film. A surface protective film was produced in the same manner as in Example 1 except that the product was manufactured by Lintec Corporation.
[比較例1]
 基材に厚さが38μmのポリエステルフィルム「ダイアホイルPET」(商品名、三菱樹脂(株)製)を使用した以外は、実施例1と同様にして表面保護フィルムを作製した。
[Comparative Example 1]
A surface protective film was produced in the same manner as in Example 1 except that a 38 μm thick polyester film “Diafoil PET” (trade name, manufactured by Mitsubishi Resin Co., Ltd.) was used as the base material.
[比較例2]
 基材に厚さが150μmの易接着性ポリエステルフィルム「コスモシャイン A4300」(商品名、東洋紡(株)製)を使用し、剥離フィルムに厚さが50μmのポリエステルフィルム「SP-PET502150」(商品名、リンテック(株)製)した以外は、実施例1と同様にして表面保護フィルムを作製した。
[Comparative Example 2]
A 150 μm thick easily adhesive polyester film “Cosmo Shine A4300” (trade name, manufactured by Toyobo Co., Ltd.) is used as the base material, and a 50 μm thick polyester film “SP-PET502150” (trade name) is used as the release film. A surface protective film was produced in the same manner as in Example 1 except that the product was manufactured by Lintec Corporation.
[比較例3]
 剥離フィルムに厚さが38μmのポリエステルフィルム「SP-PET502150」(商品名、リンテック(株)製)した以外は、実施例1と同様にして表面保護フィルムを作製した。
[Comparative Example 3]
A surface protective film was produced in the same manner as in Example 1 except that a polyester film “SP-PET502150” (trade name, manufactured by Lintec Corporation) having a thickness of 38 μm was used as the release film.
[比較例4]
 基材に厚さが188μmの易接着性ポリエステルフィルム「コスモシャイン A4300」(商品名、東洋紡(株)製)を使用した以外は、実施例1と同様にして表面保護フィルムを作製した。
[Comparative Example 4]
A surface protective film was produced in the same manner as in Example 1, except that an easily adhesive polyester film “Cosmo Shine A4300” (trade name, manufactured by Toyobo Co., Ltd.) having a thickness of 188 μm was used as the substrate.
Figure JPOXMLDOC01-appb-T000001
Figure JPOXMLDOC01-appb-T000001
 表1より、実施例1~4で作製した表面保護フィルムは、添付作業性及び剥離作業性が共に優れており、モジュール不具合が発生していないことが分かる。
 一方、比較例1で作製した表面保護フィルムは、剥離作業性には問題がなく、モジュール不具合も発生していない。しかしながら、基材の剛軟度が低く、剛軟度比も1.0未満であるため、基材のコシが弱く、貼付作業性に劣る結果となった。
 また、比較例3で作製した表面保護フィルムは、剥離作業性は実施例3で作製した表面保護フィルムと差がなく、モジュール不具合も発生していない。しかしながら、剛軟度比が4.0を超えているため、貼付作業性に劣る結果となった。
 また、比較例2及び4で作製した表面保護フィルムは、剛軟度比が4.0を超えているため、貼付作業性に劣り、更に、基材の剛軟度が高すぎるために剥離作業性が劣る結果となり、モジュール不具合が発生した。
From Table 1, it can be seen that the surface protective films prepared in Examples 1 to 4 are excellent in both attachment workability and peeling workability, and no module failure occurs.
On the other hand, the surface protective film produced in Comparative Example 1 has no problem in peeling workability, and no module failure has occurred. However, since the bending resistance of the substrate is low and the bending resistance ratio is less than 1.0, the stiffness of the substrate is weak and the workability is poor.
Moreover, the surface protection film produced in Comparative Example 3 has no difference in peeling workability from the surface protection film produced in Example 3, and no module failure has occurred. However, since the bending resistance ratio exceeded 4.0, the result was inferior to the workability of pasting.
Moreover, since the surface protection film produced in Comparative Examples 2 and 4 has a bending resistance ratio exceeding 4.0, it is inferior in sticking workability, and further, the bending work is too high because the bending resistance of the base material is too high. As a result, the module malfunctioned.
 本発明の表面保護フィルムは、貼り付け及び剥離時の作業性に優れ、かつ剥離作業時の被着体への負荷が少ない。
 そのため、本発明の表面保護フィルムは、例えば、光学部材又は電子部材の表面を保護する表面保護フィルムとして好適に用いることができ、当該用途に使用した際には、部材への貼り付け作業性向上による貼り直し頻度の低減、及び被着体から剥離する時の被着体へのダメージを効果的に防止し得る。
The surface protective film of the present invention is excellent in workability at the time of sticking and peeling, and has a small load on the adherend during the peeling work.
Therefore, the surface protective film of the present invention can be suitably used as, for example, a surface protective film that protects the surface of an optical member or an electronic member. It is possible to effectively prevent damage to the adherend when it is peeled off from the adherend and the frequency of reattachment due to.

Claims (8)

  1.  光学部材又は電子部材に貼付し、その表面を保護するために使用される表面保護フィルムであって、
     ポリエチレンテレフタレートフィルムを含む基材と、該基材の一方の面に設けられる粘着剤層と、該粘着剤層上に設けられる剥離フィルムとを備え、
    下記(A)~(D)を満たす、表面保護フィルム。
    (A)該基材の剛軟度が5000~85000mN・cm
    (B)該粘着剤層の弾性率が1.0×10~1.0×10Pa
    (C)該剥離フィルムの厚さが20μm以上
    (D)該基材の剛軟度と該剥離フィルムの剛軟度との比[基材の剛軟度/剥離フィルムの剛軟度]が1.0~4.0
    A surface protective film that is applied to an optical member or an electronic member and used to protect the surface thereof,
    A base material including a polyethylene terephthalate film, a pressure-sensitive adhesive layer provided on one surface of the base material, and a release film provided on the pressure-sensitive adhesive layer,
    A surface protective film satisfying the following (A) to (D).
    (A) The bending resistance of the base material is 5000 to 85000 mN · cm.
    (B) The elastic modulus of the pressure-sensitive adhesive layer is 1.0 × 10 4 to 1.0 × 10 7 Pa.
    (C) The thickness of the release film is 20 μm or more. (D) The ratio of the stiffness of the substrate to the stiffness of the release film [the stiffness of the substrate / the stiffness of the release film] is 1. .0 to 4.0
  2.  前記粘着剤層が、アクリル系共重合体を含む粘着剤組成物からなる、請求項1に記載の表面保護フィルム。 The surface protective film according to claim 1, wherein the pressure-sensitive adhesive layer is made of a pressure-sensitive adhesive composition containing an acrylic copolymer.
  3.  前記アクリル系共重合体を含む粘着剤組成物が、更にシランカップリング剤を含有する、請求項2に記載の表面保護フィルム。 The surface protective film according to claim 2, wherein the pressure-sensitive adhesive composition containing the acrylic copolymer further contains a silane coupling agent.
  4.  前記基材の剛軟度が50000mN・cm以下である、請求項1~3のいずれか1項に記載の表面保護フィルム。 The surface protective film according to any one of claims 1 to 3, wherein the bending resistance of the base material is 50000 mN · cm or less.
  5.  80℃、2時間加熱前後の23℃、50%RH条件における液晶プラスチックに対する前記表面保護フィルムの粘着力が、いずれも400~1000mN/25mmである、請求項1~4のいずれか1項に記載の表面保護フィルム。 The adhesive strength of the surface protective film to the liquid crystal plastic under conditions of 23 ° C and 50% RH before and after heating at 80 ° C for 2 hours is 400 to 1000 mN / 25 mm, respectively. Surface protection film.
  6.  前記剥離フィルムの剥離力が50~200mN/50mmである、請求項1~5のいずれか1項に記載の表面保護フィルム。 6. The surface protective film according to claim 1, wherein the peeling film has a peeling force of 50 to 200 mN / 50 mm.
  7.  前記表面保護フィルムのサイズが100mm以下である、請求項1~6のいずれか1項に記載の表面保護フィルム。 The surface protective film according to claim 1, wherein the size of the surface protective film is 100 mm 2 or less.
  8.  請求項1~7のいずれか1項に記載の表面保護フィルムを、剥離フィルムを剥離した後に光学部材又は電子部材の表面に貼付して保護する方法。 A method for protecting the surface protective film according to any one of claims 1 to 7 by attaching it to the surface of an optical member or an electronic member after peeling the release film.
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Cited By (4)

* Cited by examiner, † Cited by third party
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CN107828354A (en) * 2016-09-16 2018-03-23 琳得科株式会社 Flexible display sticker, adhesive sheet, flexible lamination part and flexible display
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