WO2016042415A2 - 硬化性樹脂組成物、硬化性樹脂成形体、硬化物、積層体、複合体および多層プリント配線板 - Google Patents

硬化性樹脂組成物、硬化性樹脂成形体、硬化物、積層体、複合体および多層プリント配線板 Download PDF

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Publication number
WO2016042415A2
WO2016042415A2 PCT/IB2015/002264 IB2015002264W WO2016042415A2 WO 2016042415 A2 WO2016042415 A2 WO 2016042415A2 IB 2015002264 W IB2015002264 W IB 2015002264W WO 2016042415 A2 WO2016042415 A2 WO 2016042415A2
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WO
WIPO (PCT)
Prior art keywords
curable resin
resin composition
molded article
cured product
laminate
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PCT/IB2015/002264
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English (en)
French (fr)
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WO2016042415A3 (ja
Inventor
誠 藤村
伊賀　隆志
Original Assignee
日本ゼオン株式会社
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Publication date
Application filed by 日本ゼオン株式会社 filed Critical 日本ゼオン株式会社
Priority to US15/512,034 priority Critical patent/US20180355184A1/en
Publication of WO2016042415A2 publication Critical patent/WO2016042415A2/ja
Publication of WO2016042415A3 publication Critical patent/WO2016042415A3/ja

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    • B32B17/02—Layered products essentially comprising sheet glass, or glass, slag, or like fibres in the form of fibres or filaments
    • B32B17/04—Layered products essentially comprising sheet glass, or glass, slag, or like fibres in the form of fibres or filaments bonded with or embedded in a plastic substance
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    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
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    • C—CHEMISTRY; METALLURGY
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    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
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    • H—ELECTRICITY
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
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  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
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  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Medicinal Chemistry (AREA)
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  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Textile Engineering (AREA)
  • Epoxy Resins (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

【課題】低い線膨張率および高い耐熱性を有し、且つ、ボイドなどの欠陥の発生が抑制された硬化物を形成可能であり、また、成形体の靱性を確保することが可能な硬化性樹脂組成物を提供する。 【解決手段】エポキシ化合物(A)と、エポキシ硬化剤(B)と、無機充填材(C)と、エチレン性不飽和結合を3つ以上含有する化合物(D)とを含み、非揮発成分中の無機充填材(C)の割合が50質量％超である、硬化性樹脂組成物。
PCT/IB2015/002264 2014-09-17 2015-10-22 硬化性樹脂組成物、硬化性樹脂成形体、硬化物、積層体、複合体および多層プリント配線板 WO2016042415A2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US15/512,034 US20180355184A1 (en) 2014-09-17 2015-10-22 Curable resin composition, curable resin molded article, cured product, laminate, complex, and multi-layer printed circuit board

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Application Number Priority Date Filing Date Title
JPJP2014-189183 2014-09-17
JP2014189183A JP2016060809A (ja) 2014-09-17 2014-09-17 硬化性樹脂組成物、硬化性樹脂成形体、硬化物、積層体、複合体および多層プリント配線板

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WO2016042415A2 true WO2016042415A2 (ja) 2016-03-24
WO2016042415A3 WO2016042415A3 (ja) 2016-05-26

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KR101952865B1 (ko) 2016-10-10 2019-02-27 삼성전기주식회사 팬-아웃 반도체 패키지 및 감광성 수지 조성물
JP6946088B2 (ja) * 2017-07-14 2021-10-06 Ｅｎｅｏｓ株式会社 硬化樹脂用組成物、該組成物の硬化物、該組成物および該硬化物の製造方法、ならびに半導体装置
JP2019206624A (ja) * 2018-05-28 2019-12-05 味の素株式会社 樹脂組成物

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JP3115449B2 (ja) * 1993-05-07 2000-12-04 イビデン株式会社 配線板用めっきレジスト組成物およびプリント配線板
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JP5615415B2 (ja) * 2012-09-28 2014-10-29 太陽インキ製造株式会社 硬化性樹脂組成物、ソルダーレジスト形成用組成物、ドライフィルムおよびプリント配線板、並びに積層構造体及びその製造方法

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