WO2016041766A1

WO2016041766A1 - Inductive component and method for the production thereof

Info

Publication number: WO2016041766A1
Application number: PCT/EP2015/069842
Authority: WO
Inventors: Richard Matz; Ruth MÄNNER; Andreas Wolff
Original assignee: Siemens Aktiengesellschaft
Priority date: 2014-09-17
Filing date: 2015-08-31
Publication date: 2016-03-24
Also published as: DE102014218638A1

Abstract

The invention relates to an inductive component having a high electrical quality and a good resistance to heat. According to the invention, a component, in particular an inductive component, is produced from a ceramic green body (10). The claimed inductive component can also be used, in particular for producing circuits for machine control and/or sensors.

Description

description

Inductive component and manufacturing method therefor The invention relates to an inductive component and a procedural ^¬ ren for manufacturing a component of a

Ceramic green bodies. The invention is particularly preferably applicable to the manufacture of circuits for machine controls and sensors.

In electrical circuits, AC resistances are induced by inductive components such as e.g. Coils and transformers shown. In such components lines of mostly considerable length, if necessary. A few meters, wound to spiral and helical turns around a core. As a characteristic

Characteristic of such a component sets a coil of In ^¬ productivity L by the magnetic coupling of their turns an alternating current an ideal linearly with the frequency f increasing resistance 2nfL contrary. However, an unintentional side effect of the line length of the R. DC resistance than ^¬ Q = 2nfL / R of a coil, the ratio of its AC resistance is therefore referred to the direct-current resistance ^¬. Suitable for cables Me ^¬ metals possess with temperature strongly increasing specific see resistances. In addition, only a thin layer near the surface of the lines can be used for a current flow by electromagnetic Ef ^¬ effects at higher frequencies. It is therefore difficult to produce high quality coils for use at high temperatures and high frequencies.

To achieve a high quality, the inductance of a component with a coil is usually increased by a magnetic coil core and the wire resistance is minimized by using copper wire. The specific constraints of the application, e.g. Size, type or

Operating frequency, whether a magnetic core can be used. However, plastic-insulated copper wires wound outside on a bobbin resist neither high Temperatures still high acceleration forces, as they can occur in rotating and / or vibrating machine parts. For this purpose, it is possible to use coils whose conductor tracks are not located on the outside of a winding body, but conversely in the interior between heat-resistant ones

Ceramic layers are embedded. For example, in the LTCC ("Low Temperature Co-fired Ceramics") technology, screen windings of silver-containing paste can be used to produce coil turns on ceramic green films. Several such green sheets can be laminated on one another and sintered in a composite at 900 ° C who ^¬ . Such embedded conductor tracks have a high mechanical stability and as a result of concerted Materi ^¬ ca- pacity of the silver paste and a high temperature resistance up to 400 or 500 ° C.

In this case, it is disadvantageous that coil windings formed by screen printing offer a too low electrical conductivity for many applications and often have insufficient qualities.

The object of the invention is the above-ge ^¬ called to avoid drawbacks and to provide in particular an inductive ^¬ ves component and a method for producing an, in particular inductive, ceramic-based component having a higher electrical conductivity and in particular increased electrical Q with at the same time high temperature resistance. This object is achieved according to the features of the independent claims. Preferred embodiments are insbesonde ^¬ re the dependent claims.

The solution of the problem is accordingly a component with at least one ceramic body, which is multi-layered, wherein the Bau ^¬ part at least one solid metal body in the form of a wire (27) which extends over several layers of the ceramic body (10) he stretches ^¬ stretches and , with the exception of the connections (29,32) full surrounded by ceramic material, wherein the component can be produced by sintering.

In addition, subject of the invention and solution of the problem is a method for producing a particular inductive

Component, wherein Minim ^¬ least a metal solid body in the form of a wire is inserted into at least one ceramic green body and the arrangement of the at least one

Ceramic green body and the at least one solid metal body is sintered.

A difference from the conventional LTCC process is the insertion, which is also to be understood as embedding, of a solid metal body or a fully metallic body, for example in the form of a solid wire or an unadjusted conductor track. By using a solid metal body, a conductor with a particularly low ohmic resistance is formed in the component. A solid metal body may, in particular, be understood to mean a metallic body which can be handled independently and, in particular, already has its desired electrical and mechanical properties (eg its electrical resistance value) when it is provided. The method makes it possible to improve the quality of ^components , eg coils, which can be operated at high temperature and under high mechanical stress.

Such component and / or the method according to the invention may be used, for example, for the production of circuits for a machine control and sensor system. The application of these components is in particular in the range of Turbi ^¬ NEN, generators and motors advantageously possible, in particular in areas that high mechanical loads and / or strong vibrations. An embodiment of the component is that at least one ceramic green body is formed from at least two layers and the solid metal body is arranged between the layers. The solid metal body may thus at least substantially (eg with the exception of areas for electrical connection) surrounded by the layers and embedded between them. In the case of the component, the conductors thus formed in the component are therefore completely surrounded by ceramic material.

During production, the solid metal body is placed on a layer according to a further development or inserted or pressed into a position before or while the further layer is placed or pressed thereon.

Another embodiment is that at least one of La ^¬ gene has at least one recess or at least one recess is formed in at least ei ^¬ ner of the layers, and that the solid metal body in which at least one recess is inserted. Such recesses may essentially have a negative shape relative to the course of the metal solid body or section thereof to be inserted. Such Ausneh ^¬ tion advantageously provides a guide which pers relieved and at the same time ensuring the on ^¬ place of particular formed as a wire Metallvollkör- a defined winding Struk ^¬ ture.

In particular, it is an embodiment that at least one of the layers consists of at least two layers. Such

Layers can be, for example, films, in particular

LTCC green films. In the event that the layers (especially green sheets) are or have been laminated, the layer may also be referred to as a "laminate" or "partial laminate".

The at least one recess is or will be formed in particular in only a part of the layers. Another difference to a conventional LTCC process may be that the preferred layer structure according to a further development may have both prelaminated and bonded interfaces. The use of a mixed lamination and bonding technique makes it possible to form a wide variety of components with very different shapes as required by means of particularly simple method steps. Adhesion of layers to one another or layers to one another can take place, for example, by dissolving LTCC green films or by organic adhesives or adhesive films which can burn out, for example, during subsequent firing or sintering.

It is also an embodiment that the at least one recess is able to be formed by embossing technology, by mechanical milling or by laser ablation. Such techniques enable formation of the recess with high precision. Furthermore, it is an embodiment that the at least one

Recess is wider than a width of the solid metal body. In particular, in order to compensate for a sintering shrinkage and different expansion coefficients, the recess or cavity surrounding the solid metal body, in particular metal wire, is provided with a larger cross section.

One embodiment is that a sacrificial material (eg graphite) is filled in a space surrounding the solid metal body in the recess. Thus, a possibility for mechanical stabilization of the solid metal body within the recess or cavity is provided. For example, as a wire for mechanical stabilization within the recess or cavity, the solid metal body may be coated with or surrounded by an organic sacrificial material or graphite that burns out during sintering. For sintering ^¬ technical decoupling and mechanical stabilization, the sacrificial material according to a development inert

Ceramic powder, such as aluminum oxide, containing the wire Permanently fixed in the cavity. The sacrificial material may be introduced before or after the insertion of metal full body ^¬ to. Such a sacrificial material may also be referred to as a "sacrificial stabilizer material".

Alternatively, a material used for the same purpose stabilizing material may be used which is not sacrificed, son ^¬ countries remains in the recess. Such a sacrificial material may be characterized as a "retentive stabilizing material" loading. Retentive may also be a (for through ^¬ out the method) inert material, such as aluminum oxide.

The sacrificial or remanent stabilizing material may be e.g. be introduced in paste or powder form.

The stabilizing material may also be applied to the solid metal body before it enters at least one

Ceramic green body is inserted. The stabilizing material may thereby be placed in particular as a coating of a wire on ^¬.

A further embodiment is that the metal ^¬ full body is introduced so that it extends in at least two planes, the two planes are spaced from each other by at least one of the layers or layers and connecting the planes ladder or portion of the solid metal body through the at least a layer or layer is passed through ^¬ . The levels may, in particular, be aligned parallel to one another. The levels may be in particular plane planes. In particular, therefore, a first portion of the metal solid body may define a first plane, a second Ab ^¬ section of the metal solid body, a second level is formed, etc. A next embodiment is that on or in at least one of the layers or between at least two layers at least one further metallization by Screen printing is introduced. A component manufactured in this way may thereby at least Conventionally introduced metallizations have, for example, may be required for other functions of the circuit board, but in particular for the herzustel ^¬ lende by means of the metal full-lende coil need not or not directly relevant.

It is also an embodiment that a wire is inserted as the Me ^¬ tallvollkörper. The method thus combines, in particular, a robust mechanical embedding, for example, of a coil winding within a thermally stable one

Ceramic body with the least achievable electrical resistance of a solid metal wire.

An embodiment of this is that a metal wire, in particular a copper, molybdenum, and / or silver wire, or a wire of a, preferably refractory, metal alloys is used as the wire. A silver wire has ei ^¬ NEN specific resistance of 1.6 10-8 Ohm * m ^χ, which is günsti ^¬ ger than can be achieved with manufacturing of silver paste in LTCC technology provided conductor tracks which ^χ a typical specific resistance of 3 10 ^{~ 8} ohm * m. Consequently, with silver wire increased by about 50% quality. An additional embodiment is that the metal body ^¬ body has a cross section of 100 to 200 ym.

A further embodiment is that at least one layer and / or at least one layer of the ceramic green body have or consist of unsintered ceramic powder, in particular as at least one ceramic green body. The solid metal body is then in such a

unsintered Keramikpulverköper inserted. Of the

Ceramic green bodies may in particular be in the form of or have one or more LTCC green-body films. Additives such as binders, sintering aids, etc. may be added to the ceramic green body. Also, there is an embodiment that at least one position and / or at least one layer of the ceramic green body part ^¬ as presintered ceramic powder comprises or from teilwei ^¬ se presintered ceramics (in particular from or with teilwei- se presintered ceramic powders) are made. This can be done, for example, by partially sintering at least one

Ceramic green body can be achieved. The pre-sintered

Ceramic powder or the pre-sintered ceramic body are not yet completely sintered. This embodiment has the advantage that a sintering shrinkage of the at least one layer and / or the at least one layer can be reduced after inserting the solid metal body. A strain in the vicinity of the solid metal body as a result of the sintering shrinkage of the ceramic layer (s) and / or layer (s) can thus be reduced by partial presintering of the layers, in particular partial laminates, since these are then shrunk considerably before the wire is inserted.

In particular, a partially pre-sintered ceramic green body may be so sintered that it is self-supporting.

Also, the organic constituents of an underlying green body such as binders, dispersants, etc. may already be burned out and thus no longer present. A partially pre-sintered ceramic green body may in particular a density of at least 5%, particularly from Minim ^¬ least 10%, especially at least 15%, especially at least 20%, especially at least 25%, especially at least 30%, especially at least 35% , in particular of at least 40%, especially at least 45%, especially at least 50%, especially at least 55%, especially at least 60%, particularly min ^¬ least 65%, especially at least 70%, as compared a fully sintered body having a theoretical density of 100%.

A partially pre-sintered ceramic green body may in particular have a density of not more than 85%, in particular of not more than 80%, in particular not more than 75-6, in particular not more than 70%, in particular not more than 65%, in particular not more than 60%, in particular not more than 55%, in particular not more than 50%, particularly not more than 45%, particularly not more than 40%, in particular of not more than 35%, insbeson ^¬ particular of not more than 30%, particularly not more than 25%, in particular of not more than 20%, in particular not more than 15%, in particular not more than 10 ~ 6, compared to a fully sintered body.

A partially pre-sintered ceramic green body may already particular a shrinkage of at least 25%, insbesonde ^¬ re of at least 30%, particularly of at least 35 -6, in particular at least 40%, especially at least

Ben 45%, especially at least 50%, particularly min ^¬ least 55%, especially at least 60%, especially at least 65%, especially at least 70%, ^¬ realized in Ver equal to a full body completely sintered HA or exhibit.

A partially pre-sintered ceramic green body may in particular even a shrinkage of not more than 65%, in particular ^¬ sondere of not more than 60%, particularly not more than 55%, particularly not more than 50%, in particular of not more than 45%, in particular of not more than 40%, in particular of not more than 35%, in particular of not more than 30%, in particular not more than 25%, in ^comparison to a solid sintered body.

Are provided as in particular inductive components he ^¬ höhter quality for use at high temperature also, and such components also comprise at least one electrical conductor with a particularly high conductivity.

The above explanations regarding the method apply to the component as a device accordingly. The Component can be formed analogously to the method and gives the same advantages.

The above-described characteristics, features and advantages of this invention, as well as the manner in which they are achieved, will become clearer and more clearly understood in connection with the following schematic description of an embodiment which will be described in detail in conjunction with the drawings. The same or equivalent elements can be provided with the same Bezugszei ^{¬ Chen} for clarity.

FIG.l shows components for producing a particular inductive component; and

2 shows method steps for manufacturing the in particular ^¬ sondere inductive component.

FIG.l shows components for producing a particular inductive component, in its manufacture in a

Ceramic green body 10 a metal solid body in the form of a metallic wire 27, in particular silver wire, in particular a round wire 27, is inserted and following the Anord ^¬ tion of the ceramic green body 10 and the wire 27 is sintered. The solid metal body 27 extends over a plurality of layers of the ceramic green body 10 to form a continuous low series resistance simultaneously with external electrical An ^¬ circuits. For example, this occurs in the form of vertical plated-through holes 30 or feeding line elements 29, 32 through the metal shaped body 27, which extends over a plurality of layers of the green ceramic body 10.

The solid metal body 27 includes at least one ply 31 and extending perpendicular thereto through connection 30. In the example shown in Figure 1 embodiment of the Me ^¬ tallvollkörper two layers 27 with terminals 29 and 32 via 30 comprises. A wire in the sense of the present invention is not limited to a round wire, but rather also includes ellipsoidal and angular forms of a wire, is clearly delimited only by the film that its length extension compared to the cross-sectional dimension considerably, ie wire-like. This means that, for example, the thickness and the width of the wire are of similar magnitude.

The ceramic green body 10 is composed of, by way of example, three separate layers 11, 12, 13. The layers 11, 12, 13 are here exemplified from a green ceramic material ^¬ forms. The layers 11, 12, 13 have a planar or planar extension and in particular a mutually identical outer contour. The layers 11 to 13 may be formed in layers as LTCC green sheets.

The first or lower layer 11 consists of, for example, three layers 14, 15, 16. In this case, the two lower layers 14, 15 are closed over the entire surface and form a bottom. The upper layer 16 has at least one recess 17. The off ^¬ recess 17 extends preferably up to the underlying layer 15. The recess 17 has essentially a shape of a negative contour of a coil winding of a wire or allows the insertion of the wire 27 in the form of a winding.

In the plane of the planar extent of this layer 16, a portion of the recess 17 extends as a recess extension 18 to the outer periphery of the layer 16, e.g. for an electrical connection.

The second layer 12 consists of three layers 19, 20, 21. Since ^¬ the two lower layers 19, 20 are substantially closed over the entire surface. The upper layer 21 has at least one recess 22. The recess 22 extends in particular up to the underlying layer 20. For ^¬ recess 22 has essentially allows a shape of a negative contour of a coil winding of a wire or the Einle- gene of a wire in the form of a winding. The first layer 11 and the second layer 12 may in particular be of the same design. Alternatively, the layers 11 and / or 12 may also have a different number of layers, for example four layers, of which, for example, two superimposed layers may have a same recess. The recesses 17, 22 allow in particular the insertion of the particular non-insulated wire 27 in the form of We ^¬ sentlichen spiral-shaped windings.

In the plane of extension of this layer 21, a section of the recess 22 leads as a recess extension 23 to the outer circumference of the layer 21.

By the second layer 12, in particular by the two unte ^¬ ren layers 25, 26 of the second layer 12 at least one passage opening leads 24. The passage opening 24 forms a passage for carrying an electrically conductive connection from the underside of the sheet 12 to the top of including lying position 11. In particular, connects the

Passage opening 24 a portion of the recess 17 in the underlying layer 11 with the recess 22 in this layer 12. The passage opening extends in particular in a plane A-B-C-D transverse to the orientation of the layers 11 to 13th

The upper layer 13 consists of e.g. two layers 25, 26. These layers 25, 26 are closed over the entire surface and form a lid.

During assembly, the wire is inserted between the layers 11 to 13.

A head end 29 of the wire leads into the recess 17 of the lower layer 16 by 11 Ausnehmungsver ^¬ prolongation 18 from the edge or outside of the top layer. The loan terende 29 is used for electrical contact. From the conductor end 29 of the wire goes into a winding 28, which is received by the recess 17. In the further course of the wire, the wire is the

Passage opening 24 adjacent upward or in the direction of the second layer 12 in particular bent vertically or abge ^¬ angles. The wire 27 leads from the winding 28 as Leiterab ^{¬ section} 30 through this adjacent layer 12 therethrough. From the passage opening 24 heraustretend the wire 27 is bent or angled again and leads into the recess 22 ^{¬ this} layer 12. The wire 27 thus forms at least section ^¬ two planar, parallel staggered planes in the recesses 17 and 22nd are inserted.

The recess 22 is shaped so that the wire leads under Aus ^¬ education of a winding 31 through the recess 22. From the end of the winding 31 leads a conductor end 32 of the wire 27 through the recess extension 23. The conductor end 32 is used for contacting.

In a free space between walls of the recesses 17, 22 and the wire is a sacrificial material 33. FIG. 2 shows method steps for the production of the

Ceramic green body 10 of such components.

In a first method step 41, the first layer 11 is provided. The wire 27 is then placed in the recess extension 18 and guided or inserted in the form of a winding in the recess 17, possibly under bending.

In the next process step 42 the second layer 12 will be riding ^¬ provided and placed on this first sheet. 11

If, are formed as shown a plurality of mutually parallel Wicklun ^¬ gen 28, 31 (corresponding to the layers) sol ^¬ len, the inserted layer 11 in the first wire is in the loading rich of the passage opening 24 bent by about 90 °. When gluing the second layer 12 to the first layer 11, the wire is passed through the passage opening 24 of the second layer 12.

Subsequently, the wire 27 as in the first method will be ^¬ step 41 inserted into the recess 22 of the second layer twelfth The free conductor end 32 is guided through the recess extension 23.

Thereafter, if no further winding is to be formed, the third layer 13 adhered to the second layer 12, so that the recess 22 is covered with the wire. Preferably, before placing the second layer 12 on the first layer 11 and before placing the third layer 13 on the second layer 12, the sacrificial material 33 is introduced into the respective free space between the walls of the recesses 17, 22 and the wire 27.

In a third method step 43, the entire Anord ^¬ voltage from the composite sheets 11 to 13 and the sintered pressed or laminated and fired between these inserted wire or is. Thereby, from the positions 11 to 13 in particular, a ceramic body having a theoretical density of at least 95%, especially at least 98%, in particular ^¬ sondere of at least 99%, especially at least

99.5%, can be achieved. The embodiment thus shows schematically the structure of an embedded wire coil. It is composed of the three layers 11 to 13, which are ^¬ forms each of a plurality of layers and which can also be viewed in lamination of the layers as a "partial Laminate". The layers are preferably made of ceramic green films, for example LTCC films. If, when the layers 11, 12 are provided, no recesses 17, 22 are formed in the layers, the recesses 17, 22 in the layers 11, 12 are respectively incorporated on the upper side, in particular milled as trenches. The recesses 17, 22 are preferably so wide and deep that the wire, in particular ^¬ special metal wire of the coil, for example, a silver wire of 100 to 200μη diameter in the recesses 17, 22 can be inserted. A particularly preferred development is for mechanically and thermally highly stressed coils of LTCC-technically produced embedded coil turns, but replaces screen printed coils by a solid metallic wire, for example of silver, as the solid metal body. Compared to the printable paste, it has twice the specific conductivity. The preparation of a turned bed ^¬ ten wire coil preferably begins with layers of laminates as part of a few layers (e.g., two, three or four) LTCC green tapes. Accordingly the desired Windungslayout an example spirally extending trench (particularly each partial laminate) is generated as a recess in the surface of each layer so that it can accommodate the full wire cross ^¬ cut, for example with a grave depth of one or two LTCC green sheets , The trench is particularly extended either to the edge of the printed ^¬ te to receive a wire lead to the winding ends, or it is set to a vertical through hole as Durchgangsöff ^¬ voltage of the partial laminate, so that the wire to the next position or location of the next Level can be threaded.

In the next process step of this particularly preferred Wei ^¬ terbildung the metallic wire for forming the coil winding may be inserted in particular into the groove of the lowermost layer. At the end of the trench, for example, it becomes perpendicular to the

Angled layer level and threaded through the opening of the next La ^¬ ge. This is glued with an organic adhesive on the bottom layer. Subsequently, the steps can Repeat: Laying the metal wire in the trench of the layer and eg gluing the next layer until the desired number of turns of the coil is reached. In a final process step, the particular bonded layers are finally sintered with the inserted metal wire.

A coil of high quality usually has so little resistance at high inductance, for heaters that ei ^¬ nen high ohmic resistance seen require generally not suitable overall.

This shows in particular the advantage of the present invention, which can be found in the low-resistance wire of round cross-section, whereas an embedding of flat metal foils can not result in a three-dimensional structure of the metal body, ie also in a helical, helical coil winding. In particular, an integrated coil winding is also possible with the wire disclosed here. Although the invention in detail by a ge ^¬ showed embodiment has been illustrated and described in detail at least, so the invention is not limited to this and other variations can be derived therefrom by the skilled artisan without departing from the scope of the invention.

The representation of the windings 28, 31 between the layers 11 and 12 or 12 and 13 indicates the later course of the wire in the recesses. For simplicity and without limitation of generality, a rectangular winding shape is shown. Round, oval, elliptical and other shapes are equally feasible.

In the plane ABCD, the layer 12 includes an opening through which the wire is threaded after occupying the first layer 11. Also, instead of a single continuous wire, a multi-part solid metal body may be used, the individual portions of which are electrically conductively connected together. The solid metal body may not only be formed of an easily bendable wire having a round cross section, but may also have a non-round cross section. As the solid metal body may be used instead of a bendable wire and at least partially rigid, in particular structured shaped rigid metal body.

The electrical connections of the coil are formed here as free wire or conductor ends 29, 32, which leave the composite multilayer ceramic body laterally. Further embodiments, for example, solderable wire ends, in particular in trenches on the underside of the first layer 11, are possible. For this, one or more may like it

Pass through openings through the first layer 11 through which lead the free conductor ends to the outside of the first layer 11.

Furthermore, more or fewer spiral turns per component or layer and more or fewer layers can be formed within the component. After occupying the second layer 12, the third layer 13 is placed as a lid. Before to put the lid ^¬ but also other between the lowermost layer and the cover forming the top layer can be inserted to provide a greater number of windings near, ^¬.

Also, a number of layers and layers per layer may be larger or smaller. Also, a recess may pass through more than one layer. In addition, more than one solid metal body may be embedded in the ceramic green body so as to be e.g. form a plurality of juxtaposed coils.

In addition to full-surface closed upper layers of the upper layer and / or full-surface closed lower layers of the lower layer, such layers can also through these

Having openings therethrough to lead out a conductor end for contacting. Instead of placing one of the layers 12, 13 on one of ^{¬ the} other layers 11 and 12, the layers can also be glued. Furthermore, a juxtaposition of the superimposed layers is possible.

In addition to a formation of the recesses 17, 22, in which the wire is inserted, the wire may also be placed only on such a position and be pressed before or at the touchdown of the further layer in at least this position.

As far as reference is made to the directions "top" and "bottom" shown in the drawing, such an orientation may be advantageous for the assembly, but serves in particular to simplify the description and does not exclude a different orientation in space for the individual components described out. The same are terms such as "first", "second" and "third," the single ^¬ manner serve to distinguish the components of the concrete exemplary embodiment, but not a necessary requirement for the numerical value with respect to other embodiments have for the Agent.

The invention relates to an inductive component with a high electrical quality and a good temperature resistance. It is proposed to produce a component, in particular an inductive component, from a ceramic green body.

The invention can be used in particular for the production of

Circuits for a machine control and / or sensors are used.

Claims

claims

1. Component with at least one ceramic body which is mehrla ^¬ gig, wherein the component comprises at least one solid metal body in the form of a wire (27) extending over several layers of the ceramic body (10), and, with the exception of the ends of the terminals ( 29,32) is completely surrounded by ceramic material, wherein the component can be produced by sintering.

2. Component according to claim 1, wherein the solid metal body (27) between at least two layers (11,12,13) of the ceramic body (10) is arranged.

3. Component according to one of the preceding claims, wherein the ceramic body (10) has at least one layer (11,12) having a recess (17,22) into which the metal full body (27) fits.

4. Component according to claim 3, wherein at least one of the layers

(11, 12) has at least two layers (14-16, 19-21) and the at least one recess (17, 22) is formed in only a part of the layers (16, 21).

5. Component according to one of claims 3 or 4, wherein the ^¬ least one recess (17, 22) is wider than a width of the metal full body (27).

6. The component according to claim 5, wherein, to sacrificial and / or stabilizing a remanent Mate ^¬ rial (33) is provided in a space which surrounds the metal tallvollkörper (27) in the recess (17, 22).

7. Component according to one of the preceding claims, wherein the solid metal body (27) in the recess (17,22) is arranged so that the metal solid body (27) extends in at least two planes, wherein the two planes are spaced apart by at least one of the layers (12) or layers (19, 20) and

a conductor (30) connecting the planes or portion of the solid metal body (27) through which at least one layer (12) or layer (19, 20) leads.

8. A method of manufacturing a component, wherein

in at least one ceramic green body (10) at least one Me ^¬ tallvollkörper (27) is inserted (41) and

the arrangement of the at least one ceramic green body (10) and the at least one solid metal body (27) is sintered (43).

9. The method of claim 8, wherein at least one recess (17, 22) by embossing, by mechanical milling or by laser ablation is formed.

10. The method according to any one of claims 8 or 9, wherein in a space surrounding the solid metal body (27) in a recess (17, 22) of one of the layers (11,12,13), to be sacrificed or a remanentes stabilizing material ( 33) is filled.

11. The method according to any one of claims 8 to 10, wherein the solid metal body (27) in the recess (17,22) is inserted so that the metal solid body (27) extends in at least two planes,

the two planes are spaced apart by at least one of the layers (12) or layers (19, 20) and

a layer connecting conductor (30) or portion of the solid metal body through the at least one layer (12) or layer (19, 20) is passed.

12. The method according to any one of the preceding claims 8 to 11, wherein on or in at least one of the layers (11, 12, 13), a further metallization is introduced by screen printing.

13. The method according to any one of the preceding claims 8 to 12, wherein a wire is inserted as a metal solid body (27).

14. The method according to claim 13, wherein a wire is used as a silver wire.

15. The method according to any one of the preceding claims 8 to

14, wherein the solid metal body (27) has a cross section of 100 to 200 ym.

16. The method according to any one of the preceding claims 8 to

15, wherein before insertion of the metal solid body (27) the La ^¬ gen (11, 12, 13) or layers (14-16, 19 - 21, 25 - 26) of the ceramic green body (10) of unsintered ceramic powder, in particular of green ceramic sheets (14-16, 19-21, 25-26).

17. The method according to any one of the preceding claims 8 to

16, wherein prior to insertion of the solid metal body (27) the conditions (11, 12, 13) or layers (14-16, 19-21, 25-26) of

Ceramic green body (10) partially pre-sintered

Ceramic powder are formed.