EP2018643B1 - Inductive component and method for manufacturing an inductive component - Google Patents

Abstract

The invention relates to a method for manufacturing an inductive component that is constructed from multiple layers in which the following steps are performed: a) Arrangement of an electrically conducting material (511 to 514; 521 to 524) as a winding of the component (I, II, III, IV) on a first nonmagnetic dielectric ceramic layer (5; 5a to 5h); b) Construction of at least one continuous recess (53, 53', 53'', 53''') in the nonmagnetic dielectric ceramic layer (5, 5a to 5h); c) Arrangement of a first magnetic ceramic layer (6) on an upper side and of a second magnetic ceramic layer (7) on an underside of the nonmagnetic dielectric ceramic layer (5, 5a to 5h); and d) Performing a process step in which at least one of the magnetic ceramic layers (6, 7) is plastically deformed, in such a way that both the magnetic ceramic layers (6, 7) are contacted in the region of the recess (53, 53', 53'', 53''') and form a magnetic core of the component (I, II, III, IV). The invention also relates to an inductive element of this type.

Description

Technical area

The present invention relates to a method for producing an inductive component which is formed from a plurality of layers. Moreover, the invention also relates to such an inductive component.

State of the art

Static magnetic devices, such as transformers and inductors, are essential elements of circuits that are designed to store and convert energy, to match impedance, to filter, to suppress electromagnetic interference, or even to voltage or current conversion. In addition, these components are also essential components of resonant circuits. Inductive components are based on the generation of alternating magnetic fields by primary currents, which in turn induce secondary currents. At high frequencies they can therefore be manufactured with acceptable compactness and efficiency without magnetic materials by suitable arrangement of the current paths. For miniaturization, partially planar windings, which can be integrated into conventional multi-layer circuit carriers of organic or ceramic materials, have proven to be successful compared with the wire-wound, relatively expensive components. In particular, here are the widely used circuit carrier made of FR4 material or the LTCC (Low Temperature Cofired Ceramics) technology to call. In this technology, unsintered ceramic green sheets are punched and screen printed using metal-filled, electrically conductive pastes and provided with vias and planar conductive structures and then sintered together in the stack. This results in thermally resilient, low-loss, hermetically sealed substrates that can be conventionally further populated.

For the broad field of application of current and voltage transformation as well as the low-pass filter in power electronic circuits components with improved magnetic coupling based on magnetic materials are required because of the low frequencies, which can amplify and shape the magnetic flux. For this purpose, a variety of variants of coil and transformer cores made of ferritic ceramic are commercially available, which can be subsequently attached by means of metal brackets to the aforementioned planar circuit carriers.

Completely monolithic solutions, which promise a more cost-effective production in use, have not yet been able to establish themselves due to in-depth demands on material and process technology. A problem here is that an increase in the magnetic performance of ferrites, ie the permeability of the material, with the help of ceramic technologies experience has shown a decrease in their resistivity and thus the important DC isolation between primary and secondary side of the transformer. In order to counteract this, in principle, an embedding of the current-carrying turns in good insulating material low permeability can be provided. It corresponds to the wire insulation and the air in the wire wound components.

The two spatial areas with high magnetic permeability on the one hand and good insulation of the windings on the other hand are in basic form in Fig. 1 shown. There, a ring core 1 is shown, which is surrounded on the one hand by a primary winding 2 and on the other hand by a secondary winding 3. Another basic design is in Fig. 2 shown. There, two ring cores 1a and 1b are provided, which are arranged side by side in the horizontal direction, wherein both ring cores 1a and 1b are surrounded by a primary winding 2 and a secondary winding 3, which are arranged horizontally one above the other.

In Fig. 3 is a sectional view in the plane of the primary winding 2 as shown Fig. 2 shown. In a dashed design, the winding 2 can be seen, which surrounds a central region 11 of the ferrite core, which is formed by the ring cores 1a and 1b. By the ring cores 1a and 1b, a ferrite core of the inductive component is formed. The vertical ferrite legs detected in the sectional view are closed by ferrite covering layers on the top and bottom sides of these ring cores 1a and 1b. The windings 2 and 3 and the ring cores 1a and 1b are embedded in a dielectric 4.

In Fig. 4 is a further sectional view shown, which shows an approximation to a pot core with five vertical legs of ferrite material. The Legs are characterized by the central region 11 and the vertical outer legs 1a, 1b, 1c and 1d. Again, the arrangement is embedded in an insulating dielectric medium.

From the US 5,349,743 For example, a method of fabricating a monolithic integrated planar transformer based on LTCC technology is known. The in the Fig. 1 and 2 The basic structures shown are made by combining a low-permeability material at higher resistivity and a higher-permeability material at lower resistivity. The integration of these two materials is carried out by punching out openings in the films of the one material, filling the openings with pieces of film or film stacks of the other material and then sintering together. This intarsia process is complex and error-prone even with well-matched materials and thus relatively expensive, since the films must be processed on impact.

In addition, from the US 6,198,374 a method based on conventional LTCC technology known. In this method, only one type of film, namely the most suitable ferrite is used to print the conductors on it. These are then coated, for example, by screen printing with non-magnetic, dielectric material. This is to be reduced in the vicinity of the turns of a winding, the effective permeability and based on the leakage of field lines leakage inductance. In addition, this should improve the electrical insulation between turns. A disadvantage is the additional material layer in the Range of turns, which can not be chosen arbitrarily thick to avoid stress cracks. In particular, even in power electronic applications, the printed conductors are to be designed as thick as possible in order to reduce resistance losses. The known method thus offers only limited effectiveness.

WO 2005/032226 shows the features of the preamble of claim 1.

Presentation of the invention

The present invention is therefore based on the object to provide a method with which an inductive component with high dielectric strength can be produced with little effort. In addition, it is also an object to provide such an inductive component.

This object is achieved by a method having the features of claim 1, and an inductive component having the features of claim 6, solved.

In the method according to the invention for producing an inductive component, this is formed from a plurality of layers. In this case, an electrically conductive material is arranged as a winding or winding of the component on a first non-magnetic, dielectric ceramic layer. Furthermore, at least one continuous recess is formed in the non-magnetic dielectric ceramic layer. A first magnetic ceramic layer or a corresponding layer stack is disposed on an upper surface of this non-magnetic dielectric ceramic layer. A separate second magnetic ceramic layer or a corresponding one Layer stack is placed on a bottom surface of the non-magnetic dielectric ceramic layer. This thus created intermediate state of the inductive component is then subjected to at least one further process step, in which at least one of the magnetic ceramic layers is plastically deformed, such that the two magnetic ceramic layers are contacted in the region of the recess and form a magnetic core of the device. By the method, an inductive component can be produced in a low-cost and thus also cost-effective manner. The inductive component can be generated with an optimized dielectric strength between the windings or the windings of the inductive component. The order of the process steps is not specified by the list above. In particular, the first two steps can also be performed in reverse order.

Preferably, the electrically conductive material is embedded or printed in the non-magnetic dielectric ceramic layer. The non-magnetic dielectric ceramic layer and the magnetic ceramic layers are preferably provided as foils.

The dimensions of the recess in the plane of the ceramic layer are made larger in comparison with the thickness of the ceramic layer.

Compared to the prior art, the windings or windings are thus preferably embedded conventionally in the non-magnetic dielectric ceramic layer or at least printed there. Experience shows that lay numbers from 5 to 10 are sufficient for a variety of applications and thus results in a relatively low material thickness of the entire inductive component of a few 100 microns. In order to be able to realize a magnetic through-connection, at least one non-magnetic, dielectric ceramic layer is provided with preferably punched openings whose extent is large in comparison to the material thickness of the multilayer. For example, it may be provided that a recess has a diameter between 1 mm and 3 mm, preferably about 2 mm.

Preferably, then, in each case at least one closed covering film of ferrite is then advantageously laminated to the upper side and the underside of this non-magnetic, dielectric ceramic layer in an advantageous manner.

The windings are covered by another non-magnetic dielectric ceramic layer and thus are substantially completely surrounded by nonmagnetic dielectric material. A direct connection with the magnetic ceramic layers is not provided in this embodiment.

The process step for plastically deforming at least one magnetic ceramic layer as a sintering process is advantageously carried out. This sintering process is performed so that the magnetic ceramic layers, which are preferably ferrite foils, are centered on each other by plastic deformation due to the softening of the glass portion in the recess of the non-magnetic dielectric ceramic material. Prefers Both magnetic ceramic layers deform during this sintering process. As a result, practically a magnetic via of sufficiently large cross-section can be generated, which closes the magnetic flux. As a result of the magnetic ceramic layers, a magnetic core of the component can be formed in an optimized manner.

Advantageously, at least on a magnetic ceramic layer during this sintering process, a support can be applied, which is arranged to support the deformation of this ceramic layer. By means of such a support, the deformation can be carried out in a location-specific manner, and the deformation of the magnetic ceramic layers into the recess and thus also the contacting of the two magnetic ceramic layers can be improved. The contact surface between the two magnetic ceramic layers can thereby be made as large as possible.

According to the invention, a plurality of non-magnetic, dielectric layers are stacked, wherein at least one recess is formed in each of the non-magnetic, dielectric ceramic layers and the non-magnetic, dielectric ceramic layers are arranged one above the other such that these recesses overlap at least in regions. Preferably, a recess is formed in a non-magnetic, dielectric ceramic layer of different dimensions to a recess of at least a second non-magnetic, dielectric ceramic layer. The non-magnetic dielectric ceramic layers are then preferably stacked such that one through all non-magnetic, dielectric ceramic layers continuous recess is formed at least partially tapered. Preferably, in a sectional representation of an inductive component produced in this way with a plurality of non-magnetic, dielectric ceramic layers, a recess is formed, which is initially formed to be tapered and then widens again. Preferably, this taper and subsequent expansion in a cross-sectional view is formed such that the continuous recess is formed symmetrically to a horizontal symmetry line in a cross-sectional view.

Preferably, the taper is formed as a stepped profile. Stepped magnetic vias offer a high degree of design freedom in terms of the number of dielectric and magnetic layers.

Preferably, at least on a magnetic ceramic layer, a magnetic material is applied, wherein the magnetic ceramic layer is arranged on the non-magnetic, dielectric ceramic layer, that the magnetic material is positioned in the region of the recess. The magnetic material is preferably applied with such a structure that substantially corresponds to the inverse configuration of the tapered recess of the plurality of stacked non-magnetic dielectric ceramic layers. With more turns and higher number of layers, such a step design in the region of this recess avoids too small radii of curvature of the outer magnetic ceramic layers, in particular of the ferrite layers.

Preferably, this magnetic material is printed on the magnetic ceramic layers. Preferably, a reduction of the plastic deformation of the magnetic ceramic layers in the region of the recess can thereby be achieved. Preferably, this magnetic material is printed as a thick-film ferritic paste by a screen printing process. In addition, ferrite paste can be repeatedly printed on the magnetic ceramic layers in the region of the recess before laminating in order to close the recess completely and thus to be able to form without an air gap.

Preferably, at least two non-magnetic, dielectric ceramic layers are formed, between which a magnetic layer, in particular a magnetic ceramic layer, is formed. Preferably, this magnetic ceramic layer is formed as a continuous layer. This allows you to set specific field lines. For example, field lines can escape laterally without penetrating all turns. The size of this leakage inductance can be adjusted specifically by the thickness of this additionally introduced magnetic ceramic layer.

In an embodiment with only one nonmagnetic dielectric ceramic layer, the electrically conductive material for forming turns may be formed on an upper side and a lower side of this nonmagnetic dielectric ceramic layer.

The electrically conductive material may be arranged to form a primary winding and a secondary winding of the inductive component.

The non-magnetic, dielectric ceramic layer is preferably formed with a thickness between 20 μm and 200 μm, in particular between 50 μm and 100 μm. The conductor tracks or windings can be completely embedded in highly insulating, dielectric ceramic. Due to the high dielectric strength, these ceramic layers can be made correspondingly thinner, whereby costs can be saved and the size can be minimized.

The inductive component is preferably designed as a monolithically integrated planar transformer.

In the proposed method, the functions of magnetic permeability and electrical insulation are realized in their respective space regions by tailoring specific ceramics, respectively, resulting in high efficiency of the design and the requirement and application of the component. Depending on demand, different ceramics can be used. If the inductive component is to be used at high frequencies, for example in the range between 1 and 2 GHz, hexa-ferrite ceramics, in particular barium-hexa-ferrite ceramics, can preferably be used. These have a permeability between about 10 and 30.

A second class of ceramics may be used when frequencies in the middle range of about 10 to about 30 MHz are required. In this case, for example, CuNiZn ferrite materials can be used. The permeability Ceramics used for components for use in this medium frequency range have permeability values of about 150 to about 500.

In addition, another class of ceramics is provided for components in the relatively low frequency range of between about 1 to about 3 MHz. In this case, for example, MnZn ferrite materials can be used. Preferably, ceramics used in this class have permeability values between about 500 and 1000.

In the method according to the invention thus no mixed material with limited performance is used, as for example in the method in the US 6,198,374 is carried out. In addition, no problematic process step, as in the prior art according to the US 5,349,743 , he follows.

An inductive component according to the invention is constructed from a plurality of layers, and in particular realized as a monolithically integrated planar transformer. The inductive component comprises at least one electrically conductive winding which is arranged on a first non-magnetic, dielectric ceramic layer. At least one continuous recess is formed in this at least one non-magnetic, dielectric ceramic layer. The inductor further includes a first magnetic ceramic layer disposed on an upper surface of the non-magnetic dielectric ceramic layer. In addition, a second magnetic ceramic layer is on a bottom side arranged this non-magnetic dielectric ceramic layer. At least one of these two magnetic ceramic layers is plastically deformed in the region of the recess in such a way that it is connected to the other magnetic ceramic layer in the region of the recess and, overall, a magnetic core of the component is formed by these two ceramic layers. The inductive component provided in this way has an optimized dielectric strength between the windings or windings and, moreover, can be produced inexpensively.

Advantageous embodiments are specified in the subclaims. Beyond that advantageous embodiments of the method according to the invention are also to be regarded as advantageous embodiments of the inductive component according to the invention.

Short description of the drawing (s)

Fig. 1

eine erste bekannte Grundstruktur eines Transfor- mators;

Fig. 2

eine zweite bekannte Grundstruktur eines Transfor- mators;

Fig.

3 eine Schnittdarstellung des Transformators gemäß Fig. 2;

Fig. 4

eine weitere Schnittdarstellung durch eine Ausfüh- rungsform eines bekannten Transformators;

Fig. 5

eine Schnittdarstellung durch ein erstes Ausfüh- rungsbeispiel eines erfindungsgemäßen induktiven Bauelements;

Fig. 6

eine Schnittdarstellung durch ein zweites Ausfüh- rungsbeispiel eines erfindungsgemäßen induktiven Bauelements;

Fig. 7

eine Schnittdarstellung durch ein weiteres Ausfüh- rungsbeispiel eines erfindungsgemäßen induktiven Bauelements, welches noch nicht fertig gestellt ist; und

Fig. 8

eine Schnittdarstellung durch ein weiteres Ausfüh- rungsbeispiel eines erfindungsgemäßen induktiven Bauelements.

In the following, exemplary embodiments of the present invention will be explained in more detail with reference to schematic drawings. Show it:

Fig. 1

a first known basic structure of a transformer;

Fig. 2

a second known basic structure of a transformer;

FIG.

3 is a sectional view of the transformer according to Fig. 2 ;

Fig. 4

a further sectional view through an embodiment of a known transformer;

Fig. 5

a sectional view through a first exemplary embodiment of an inductive component according to the invention;

Fig. 6

a sectional view through a second exemplary embodiment of an inductive component according to the invention;

Fig. 7

a sectional view through a further exemplary embodiment of an inductive component according to the invention, which is not yet completed; and

Fig. 8

a sectional view through a further exemplary embodiment of an inductive component according to the invention.

Preferred embodiment of the invention

In the figures, identical and functionally identical elements are provided with the same reference numerals.

By the term "non-magnetic material" herein is meant a material having a relative magnetic permeability close to or equal to 1 as compared to the magnetic material used for the magnetic ceramic layer.

In Fig. 5 an example of a completed monolithically integrated planar transformer I is shown, which forms the starting point of the illustrated invention. It is a longitudinal section through a Layer stack shown, with only the essential part of the planar transformer I is shown for the invention. The sectional view shows a planar transformer I with a low number of turns, which was produced in LTCC technology. The planar transformer I has a non-magnetic, dielectric ceramic layer 5, which is formed as a foil. On the upper side 51 of this dielectric ceramic layer 5, self-contained conductive traces or windings 511, 512, 513 and 514 are arranged in the exemplary embodiment, which surround the transformer core in a specific sense of rotation and constitute turns of a primary winding of the planar transformer 1. In a plan view, this primary winding is spiral-shaped. At non-illustrated ends of this winding contacts are provided, through which an electrical connection with a power supply can be made possible.

On a lower side 52 of the dielectric ceramic layer 5, a secondary winding is formed, which comprises the windings 521, 522, 523 and 524. This secondary winding also has ends which are provided for further electrical contacting. Both the turns 511 to 514 of the primary winding and the turns 521 to 524 of the secondary winding are printed in a conventional manner on the upper side 51 and on the lower side 52 of the dielectric ceramic layer 5, respectively.

In addition, the planar transformer I has a continuous recess 53, which is produced by a stamping process.

In the exemplary embodiment shown, a first magnetic ceramic layer 6 is arranged on the upper side 51 and directly on the windings 511 to 514. Likewise, a second magnetic ceramic layer 7 is disposed on the underside 52 and directly on the windings 521 to 524 of the secondary winding. In the region of the recess 53, these two separate magnetic ceramic layers 6 and 7 are plastically deformed and connected to each other in the middle. As a result, practically a magnetic via is formed in the region of the recess 53, as a result of which the two magnetic ceramic layers 6 and 7 form a magnetic core of the planar transformer I. For this purpose, the magnetic ceramic layers 6 and 7 are also contacted with one another at the edge regions facing away from the recess 53 in the x-direction. This contacting at the edge regions is also formed by a plastic deformation of at least one of the ceramic layers 6 or 7. The indentations in the y-direction in the region of the recess 53 resulting from the plastic deformation of the ceramic layers 6 and 7 can be planarized as required by a subsequent doctoring process. In this case, for example, a further dielectric paste can be applied at the appropriate points, which is formed flat by this doctor blade process.

The in Fig. 5 shown finished planar transformer I is formed such that first the dielectric ceramic layer 5 is prepared and prepared for further processing. For this purpose, the at least one recess 53 is punched out. Further, then, the electrically conductive material for forming the windings 511 to 514 and the windings 521 to 524 printed on the corresponding surfaces of this dielectric ceramic layer 5.

In the exemplary embodiment, the recess in the x-direction and also in the z-direction (perpendicular to the plane of the figure) is punched out with dimensions which are substantially greater than the thickness (y-direction) of the dielectric ceramic layer 5.

Then, on the upper side 51 and the lower side 52, the two separately provided magnetic ceramic layers 6 and 7, which are provided as closed unfired green sheets of ferrite, are laminated such that these ceramic layers 6 and 7 due to their organic binding portion by plastic deformation in the Recess 53 centered together. In the recess thus a central region 9 of the magnetic core of the planar transformer I is formed. Subsequently, the sintering process takes place. In the exemplary embodiment, the plastic deformation thus takes place through the lamination process. Instead of the layers 6 and 7, a stack of a plurality of magnetic layers may be formed in each case corresponding to the requirements of the component.

An embodiment of a monolithically integrated planar transformer II, which was produced in LTCC technology is in Fig. 6 shown. Again, a longitudinal sectional view of a partial section of a completed planar transformer II shown. The sectional view shows a structure of the planar transformer II, which has a high number of turns.

The planar transformer II has non-magnetic dielectric ceramic layers 5a, 5b, 5c, 5d and 5e stacked one above the other. On the dielectric ceramic layers 5a, 5b, 5d and 5e windings are respectively applied to the upper sides. By way of example, the turns 511b, 512b, 513b and 514b are mentioned, which are printed on an upper side 51b of the dielectric ceramic layer 5b. The windings 511a, 512a, 513a and 514a are printed on an upper side 51a of the dielectric ceramic layer 5a. These windings are assigned in the embodiment of a primary winding of the planar transformer II. The unspecified, printed on the dielectric ceramic layers 5d and 5e turns are associated with a secondary winding of the planar transformer II. The windings can also be arranged such that turns arranged on an upper side, for example on the top side of the dielectric ceramic layer 5a, are alternately assigned one of the primary winding and the subsequent secondary winding in the x direction.

As from the illustration in Fig. 6 1, on the dielectric ceramic layer 5b, the dielectric ceramic layer 5c is arranged as a final covering layer. The turns of the planar transformer II are thereby completely surrounded by dielectric ceramic material.

Again, magnetic ceramic layers 6 and 7 are laminated on the opposite sides of the stacked dielectric ceramic layer 5a to 5e, which are plastically deformed in the region of a recess 53 ', so that they are interconnected in this area. As a result, a central region 9 'of the magnetic core of the planar transformer II is also formed here.

As can be seen, the stacked dielectric ceramic layers 5a to 5e each have recesses having different dimensions. The dielectric ceramic layers 5a to 5e are stacked in such a way that the individual recesses formed in each of these ceramic layers form a common continuous recess 53 '. As can be seen, the dielectric ceramic layer 5c in the sectional view shown has a recess which, at least in the x-direction, is larger than the recesses formed individually in the electrical ceramic layers 5b, 5a and 5d.

In addition, it can be seen that the recesses formed in the dielectric ceramic layers 5b and 5d are larger than the recess formed in the dielectric ceramic layer 5a. In the exemplary embodiment, the dielectric ceramic layers 5a to 5e are stacked on top of each other in such a way that a tapering recess 53 'results in the y direction from the upper dielectric ceramic layer 5c to the centrally arranged dielectric ceramic layer 5a. In the embodiment, a stepped profile is realized. Starting from the central dielectric ceramic layer 5a, this recess 53 'widens in the y-direction up to the lower dielectric ceramic layer 5e again. Also, a step profile is formed. In the exemplary embodiment, the planar transformer II is formed symmetrically with respect to an axis of symmetry drawn through the dielectric ceramic layer 5a in the x direction.

The procedural embodiment of the planar transformer II shown in the completed state is preferably analogous to the preparation of the in Fig. 5 shown planar transformer I performed.

In Fig. 7 is a further longitudinal section through a planar transformer III shown, which is shown in a not yet completed process stage. Again, only a partial section is shown, which shows the essential structure in a central region of the device.

The configuration and arrangement of the non-magnetic, dielectric ceramic layers 5a to 5e is analogous to the embodiment according to FIG Fig. 6 , In addition, in Fig. 7 to recognize that the first magnetic ceramic layer 6 or possibly a corresponding layer stack is provided with an additional structure comprising the layers 6a and 6b. These layers 6a and 6b are made of a magnetic material, and are applied in the embodiment of ferritic thick-film paste by means of screen printing. It can be seen that these layers 6a and 6b are formed on the surface of the magnetic ceramic layer 6 facing the dielectric ceramic layers 5a to 5e. These layers 6a and 6b are formed as a stepped profile and designed so that they are designed as a complementary structure to the step configuration of the dielectric ceramic layers 5c and 5b.

Similarly, layers 7a and 7b are also arranged on the second magnetic ceramic layer 7 or, if appropriate, a corresponding layer stack, which are designed as a stepped profile and as a complementary structure with respect to the step profile which is produced by the dielectric ceramic layers 5d and 5e , The magnetic ceramic layers 6 and 7 are positioned in a subsequent process such that, as in FIG Fig. 7 4, the layers 6a and 6b and the layers 7a and 7b are disposed substantially in the region of the step profile formed by the dielectric ceramic layers 5a to 5b. Before the final sintering process, these structures of the ceramic layers 6 and 7 are laminated onto the stacked form of the dielectric ceramic layers 5a to 5e to form a recess 53 " of planar transformer III.

In Fig. 8 is a further longitudinal sectional view of another Ausführurigsbeispiels of a monolithically integrated planar transformer IV shown. The planar transformer IV is shown in a completed state. It can be seen that between an dielectric ceramic layer 5a and a dielectric ceramic layer 5f an intermediate layer is formed, which is formed as a further magnetic ceramic layer 10. In a symmetrical arrangement are to this Magnetic ceramic layer 10 each stacked and in the region of a recess 53 '''stepped designed dielectric ceramic layers 5a, 5b and 5c and 5f, 5g and 5h arranged. A central region 9 "of the magnetic core of the planar transformer IV is formed, and by integrating a central magnetic ceramic layer 10, which may be a ferrite foil, field lines of the primary winding (in the exemplary embodiment, the turns arranged on the ceramic layers 5g, 5h) are present The advantage of a stray inductance generated in a targeted manner in this way can be seen in the fact that no additional separate component is required in order to achieve the individual setting of impedances By way of example, the primary side can have an additional leakage inductance, which represents a further degree of freedom for the circuit design of the component rierte design be enabled.

Claims (8)

1. Method for manufacturing an inductive component which is formed from a plurality of layers, in which the following steps are carried out:

   a) arrangement of an electrically conductive material (511 to 514; 521 to 524) as a winding of the component (I, II, III, IV) on a first non-magnetic, dielectric ceramic layer (5; 5a to 5h);

   b) formation of at least one cutout (53, 53', 53", 53"') which passes all the way through in the non-magnetic, dielectric ceramic layer (5, 5a to 5h);

   c) arrangement of a first magnetic ceramic layer (6) on an upper face and a second magnetic ceramic layer (7) on a lower face of the non-magnetic, dielectric ceramic layer (5, 5a to 5h); and

   d) carrying out a process step in which at least one of the magnetic ceramic layers (6, 7) is plastically deformed such that contact is made with the two magnetic ceramic layers (6, 7) in the area of the cutout (53, 53', 53", 53"'), and the two magnetic ceramic layers (6, 7) form a magnetic core of the component (I, II, III, IV),

   wherein the method is characterized in that
   a further non-magnetic, dielectric layer, in particular a ceramic layer (5c, 5f) is applied to the electrically conductive material (511 to 514; 521 to 524),
   wherein a plurality of non-magnetic, dielectric ceramic layers (5a to 5h) are stacked, in each of which ceramic layers (5a to 5h) at least one cutout is formed, with the non-magnetic, dielectric ceramic layers (5a to 5h) being arranged one on top of the other such that the cutouts overlap, at least in places, and wherein
   the cutouts in the respective ceramic layers (5a to 5h) are designed with different dimensions and are stacked such that a cutout (53', 53", 53"') which passes through all the non-magnetic, dielectric ceramic layers (5a to 5h) is designed to taper, at least in places.
2. Method according to Claim 1,
   characterized in that
   a coating is arranged at least on one magnetic ceramic layer (6, 7) during step d) in order to assist the deformation of this ceramic layer (6, 7).
3. Method according to one of the preceding claims,
   characterized in that
   a magnetic material (6a, 6b; 7a, 7b) is applied at least to one magnetic ceramic layer (6, 7), with the magnetic ceramic layer (6, 7) according to step c) being arranged on the non-magnetic, dielectric ceramic layer (5, 5a to 5h) such that the magnetic material (6a, 6b; 7a, 7b) is positioned in the area of the cutout (53, 53', 53", 53"').
4. Method according to one of the preceding claims,
   characterized in that
   at least two non-magnetic, dielectric ceramic layers (5a to 5h) are formed, between which a magnetic layer, in particular a ceramic layer (10), is formed.
5. Method according to one of the preceding claims,
   characterized in that
   the non-magnetic, dielectric ceramic layers (5, 5a to 5h) are formed with a thickness of between 20 µm and 200 µm, in particular of between 50 µm and 100 µm.
6. Inductive component which has a plurality of layers, in which

   - at least one electrically conductive winding of the component (I, II, III, IV) is arranged on a first non-magnetic, dielectric ceramic layer (5, 5a to 5h), in which at least one cutout (53, 53', 53", 53"') which passes all the way through is formed;

   - and a first magnetic ceramic layer (6) is arranged on an upper face, and a second magnetic ceramic layer (7) is formed on a lower face, of the non-magnetic dielectric ceramic layer (5, 5a to 5h), with at least one magnetic ceramic layer (6, 7) being plastically deformed in the area of the cutout (53, 53', 53" , 53"') such that it is connected to the other magnetic ceramic layer (6, 7) and a magnetic core of the component (I, II, III, IV) is formed,

   wherein the inductive component is characterized in that wherein a plurality of non-magnetic, dielectric ceramic layers (5a to 5h) are stacked, in each of which ceramic layers (5a to 5h) at least one cutout is formed, with the non-magnetic, dielectric ceramic layers (5a to 5h) being arranged one on top of the other such that the cutouts overlap, at least in places, and wherein
   the cutouts in the respective ceramic layers (5a to 5h) have different dimensions and the ceramic layers (5a to 5h) are stacked such that a cutout (53', 53", 53"') which passes through all the non-magnetic, dielectric ceramic layers (5a to 5h) is designed to taper, at least in places.
7. Inductive component according to Claim 6,
   characterized in that
   the taper is a stepped profile.
8. Inductive component according to either of Claims 6 or 7,
   characterized in that
   at least two non-magnetic, dielectric ceramic layers (5a to 5h) are formed, between which a magnetic layer, in particular a ceramic layer (10), is formed.

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