WO2016037715A1

WO2016037715A1 - Apparatus for configuring an electronically controlled device and method for configuring an electronically controlled device

Info

Publication number: WO2016037715A1
Application number: PCT/EP2015/063472
Authority: WO
Inventors: Tobias JÄGER
Original assignee: Siemens Aktiengesellschaft
Priority date: 2014-09-11
Filing date: 2015-06-16
Publication date: 2016-03-17
Also published as: DE102014218206A1

Abstract

The present invention provides individual adaptation of the control of electronically controlled devices, in particular bulk goods. For this purpose, one or more parameters are individually determined for each device during the production of the individual devices. Separate, special adaptation of the control is then carried out for each individual device on the basis of said parameters. This makes it possible to increase the efficiency of the device and to increase the service life and durability of the device.

Description

description

Device for configuring an electronically controlled device and method for configuring an electronically controlled device

The present invention relates to a device for configuring an electronically controlled device and a method for configuring an electronically controlled device, in particular an electronically controlled device with customized control parameters.

For the control of bulk goods, such as washing machines or coffee machines, increasingly electronic controls are used. Conventional controls are manufactured as mass-produced goods. Such, mass-produced herge ^¬ presented controls are usually completely identical. In some cases, current operating conditions can be detected by means of additional sensors. In this case, the controller used can adjust the Betriebsparame ^¬ ter that specific unit within a given bandwidth to react to the current conditions. However, the efficiency of such controls is very limited. Production-related tolerances, such as the distance of a heating element to be it ^¬ warming object can thereby be only a flat rate considered by a general ^¬ my calculation during the device design. Variations in the assembly of the device during manufacture lead to the fact that the efficiency of the individual devices may vary. In addition, the life expectancy of a device due to the fertigungsbe ^¬-related tolerances can vary with identical control. For example, a device in which a heating element is placed closer to a body to be heated can result in greater heating. Such increased heating can lead to a faster aging and thus to a previous failure of the device. The aforementioned properties lead to the maintenance of a given Quality standards in the production of a device which must be inserted very tight tolerance bands ^¬ held. Devices for which these tolerance bands could not be complied with must either be reworked or sorted out.

Thus, there is a need for a device for configuring electronically controlled devices and a method for configuring electronically controlled devices that allows for customization of the control parameters to the particular device. In particular, there is a need for an individual adaptation of the control parameters to the device-specific production parameters. For this purpose, according to a first aspect, the present invention provides an apparatus for the production of an electronically controlled device with individually adapted Steuerungspa ^¬ rametern. The device comprises a detection device which is designed to detect a device-specific production parameter; a computing device configured to determine a device-specific control parameter using the acquired manufacturing parameter; and a programming device configured to transmit the device-specific control parameter to a parameter memory of the electronically-controlled device.

In another aspect, the present invention provides a method of configuring an electronically controlled device. The method includes the steps of detecting device-specific manufacturing parameters; determining device-specific control parameters using the acquired manufacturing parameters; and transmitting the device-specific control parameters into a parameter memory of the electronically-controlled device.

The present invention is based on the recognition that, in the production of bulk goods, individual production tolerances occur. These manufacturing tolerances can be different for each manufactured device. The purpose, he ^¬ ford variable items can already different tolerances aufwei- sen in the assembly of a device. For example, the accuracy of fit of a bearing or a seal may vary. Also, differences in the heating power of an electric heater are possible. In addition, there can be individual deviate ^¬ tions also during assembly. For example, the distance between the individual parts may vary. This would lead, for example, when installing a heater to a different heating and the disadvantages mentioned in the introduction. Also, fluctuations in the manufacturing plant, such as a varying torque when tightening a screw or the like, the individual properties of a device be ^¬ impair.

An idea that is therefore based on the present invention is to collect information about the individual characteristics of each manufactured device separately to evaluate and then to the control of each device based individually on the information collected ^¬ fit. This can operate in ei ^¬ nem optimized operating each manufactured device. Thus, the efficiency of the individual devices can be increased. Security ^surcharges due to a tolerance ^band to be taken into account can thereby be reduced. By adapting the control parameters to the specific characteristics of the respective device, critical conditions that lead to increased wear or premature aging can be avoided. Therefore, the life expectancy of the individual devices increases.

Due to the improved adaptation of the control parameters on each device it is also possible to compensate for greater variations of the items auszuglei ^¬ chen, and greater fluctuations used during production. Therefore, the requirements for the individual components as well as the precision of the production line in which the devices are manufactured.

According to one embodiment, the computing device comprises a memory. This memory is designed to store relationships between device-specific manufacturing parameters and corresponding device-specific control parameters. The computing device determines the device-specific control parameters using the relationships stored in the memory.

The relationships stored in the memory can be, for example, a table, in each of which the relationship between device-specific production parameters and the control parameters corresponding thereto is stored. This allows particularly fast Determined ^¬ development of appropriate control parameters from the previously erfass- th production parameters. Alternatively, a formula can also be stored in the memory from which the respectively suitable device-specific control parameters can be calculated. The relationship stored in the memory between device-specific production parameters and corresponding device-specific control parameters can be determined once during the design of the device once.

According to one embodiment the electronically controlled device comprises a component, wherein the detection device comprises a component sensor which is designed to sen an electrical ^¬-specific and / or mechanical property of the component to erfas-.

By such a component sensor, the respective component can be checked in advance. The individual properties of the respective component can be recorded and further processed as device-specific manufacturing parameters. The component sensor may, for example, be a separate, additional sensor. It is also possible to use an existing sensor on the production line. that already exists to check compliance with specified tolerances and to sort out components that do not meet the specified tolerance limits. According to a further embodiment, the electronic device comprises a component, wherein the detection device comprises a position sensor which is adapted to detect a positi ^¬ on the built-in component in the device. As a result, fluctuations in the positioning of the individual components during assembly of the device can be detected and evaluated. Thus, the electronic Steue ^¬ tion of each device manufacturing technology To ^¬ tolerances can also be adjusted. For example, with a smaller distance between the heat source and the object to be heated the

Heating power of the heat source can be reduced, or at grö ^¬ ßerem distance, the heating power can be increased.

According to another embodiment, in the method for configuring the electronically controlled device, the

Step for detecting device-specific manufacturing parameters at least one electrical and / or mechanical measurement of a component. According to a further embodiment, the step of acquiring device-specific production parameters detected in at least one position of a component in the electronic gesteu ^¬ Erten device. In accordance with yet another embodiment, the step of capturing device-specific manufacturing parameters captures at least one assembly parameter.

Such an assembly parameter can be, for example, the tightening torque of a screw connection, the contact pressure of an adhesive bond or the like. Thus, production-related variations in the individual control of the devices can be compensated. According to another embodiment, the step of determining device-specific control parameters determines the control parameters using predefined relationships between device-specific manufacturing parameters and corresponding device-specific control parameters.

According to another embodiment, the method includes a step of classifying the electronically controlled device based on the detected device specific manufacturing parameters.

By evaluating the acquired device-specific manufacturing parameters during the manufacture of a device, this information can be further used to identify very high quality devices. Such particularly high-quality devices, for example, as particularly effi ^¬ cient or very durable devices separately in a

Premium segment are marketed. Likewise, the identification of inferior or inoperative devices is possible by a sol ^¬ che classification. Such devices can thus be sorted out very easily automatically. Further embodiments and advantages of the present invention will become apparent from the following description with reference to the accompanying drawings.

Showing:

Figure 1 is a schematic representation of a diagram for

Illustrate a principle of customization of control parameters according to one embodiment;

Figure 2 is a schematic representation of an apparatus for

Configuration of electronically controlled devices according to an embodiment; and Figure 3 is a schematic representation of a Ablaufdiag ^¬ ramms, as it is based on the method according to one embodiment.

Figure 1 shows a schematic representation of the basic principle of the present invention. By the reference numeral 1, the development of a device is shown. This development ^¬ lung further comprises a step of adjusting the operating parameters of the design support device in dependence on the variations of individual properties for definition within a still acceptable tolerance band in the present case adjacent to the conven- tional design. Comprising the design to the end device for example a heating element, it can be determined currency rend of the design of the device, such as the heating power ^¬ this heating depending on the actual distance between heating and object to be heated is adjusted. Likewise, for example, an adaptation of the rotational speed of a motor in response to fluctuations in the dimensional accuracy of other components used, such as waves, bearings or the like, to be adjusted. In addition to such mechanical manufacturing parameters beyond, for example, electrical parameters, such as the fluctuation of the electrical resistance of a component, variations in the heating power of an electric heating element or the like can be considered.

In addition, correlations of the control parameters to assembly parameters can also be specified. For example, one or more control parameters may depend on the actual force with which a threaded connection was tightened. Further correlations between individual, device-specific properties that can be detected during the manufacture of the device and resulting adjustments in the control parameters of the device are also possible. In this way, for example, the target speed for the motor of a washing machine or the control of the heating of a washing machine can be varied individually for each device in Depending ^¬ ness of actual production parameters.

During the design of the device is thus used to control the electronically controlled device in addition to a generic

Control component 3-1 also a relationship between acceptable tolerances 3-2 of individual device-specific manufacturing parameters and corresponding control parameters 3-3 defined.

During the production of the individual devices, for example in a production line 2, one or more device-specific production parameters can then be detected. The production line 2 can comprise several production ^steps / production cells 2-i. In this case, one or more device-specific production parameters can be detected in each of these manufacturing steps / manufacturing cells 2-i. The manufacturing parameters corresponding to a single device are initially collected. For example, all collected device-specific production parameters can be stored in a data memory, for example a database (not shown here). After completion of a device all collected device-specific manufacturing parameters are then evaluated, which is represented by the reference numeral 5. Based on these individual gerä ^¬ tespezifischen manufacturing parameters of each device then an individual device control 6 is created based the control parameters indivi ^¬ duel determined on the generic control portion 3-3 and.

Figure 2 shows a schematic representation of a manufacturing ^¬ device for producing an electronically controlled device according to one embodiment. In the example shown here, the device from the components 10, 11 and 12 to ^¬ sammengefügt. The restriction to three components only serves the better understanding and does not restriction. By the detection device 20 each gerätespezi ^¬ fish production parameters are detected during the assembly of a device. For example, mechanical properties of the components 10 to 12 can be determined by a first sensor 21. Thus, the individual size of the individual components 10 to 12, for example, it will be understood ^¬. The detection of the component size can be done with ^{¬ means} optical, mechanical or any other sensors. Furthermore, the weight, the stiffness, spring force, imbalance of a shaft or any other mechanical parameter can also be detected by the mechanical sensor 21.

In addition, electrical properties of the components 10 to 12 used can also be checked and recorded by an electrical sensor 22. For example, Schwan ^¬ fluctuations can in ohmic resistance of a component, in variations of the heating power of an electric heating element, a voltage drop, frequency responses, resonance, or any other electrical properties are detected by the electrical sensor 22 and analyzed. Further sensors for detecting and analyzing further properties of the components 10 to 12 used are also possible. During the assembly of the device from the components 10 to 12, the variation in the positioning of the individual components can also be detected by a further sensor 23. For example, this can be used to determine the exact ^distance between a heating element and a surface to be heated. The determination of Positionin ^¬ tion of further components is possible. Similarly, other production-related parameters, such as a force with which the device is assembled, a Anpress ^¬ pressure or a temperature during bonding or other production step, the layer thickness when Aufbrin ^¬ conditions of a coating and much more can be detected. Specially designed sensors can be used to record the device-specific production parameters. As well It is also possible to use already existing sensors for quality control in order to record the device-specific production parameters. For example, for quality control ^¬ a sensor is provided, which analyzes the tolerance of readiness identified components 10 to 12, so the value detected by such a sensor measurement value can also be used as Ferti ^¬ supply parameter.

All required device-specific manufacturing parameters are then provided to a computing device 30. This computing device 30 determines individual control parameters from the device-specific production ^{parameters of} the respective device. For this, a relationship established between the production parameters during the design of the device and the resulting optimum

Control parameters are used. This relationship can be stored for example in the form of a table in a memory 31 of the computing device 30. Thus, the computing device 30 can determine the optimal control parameters in a particularly simple and fast manner as a function of the acquired production parameters. If necessary, the Steuerungspa ^¬ parameters can be further refined by interpolation. Alternatively, a mathematical relationship in the form of a formula can also be stored in the computing device 30, from which the computing device 30 can calculate the individual control parameters for the respective device. After the individual control parameters for the respective device have been determined by the computing device 30, a device control specially coordinated for this device is then created. In addition to the generic control component of the device, this device control also includes an individual component which is matched to the respective production parameters of the respective device. The generated device control and in particular the gerä ^¬ tespezifischen control parameters are sent from the computing device 30 to a programming device 40th The device control is then activated by the programming direction 40 to the respective device. In particular, the programming device 40 transfers the device-specific control parameter or parameters into a parameter memory of the electronically controlled device. Thus, the particular device can be operated with a specially-programmed opti ^¬ this device set control parameters.

If, during the evaluation of the acquired device-specific production parameters, it is determined that one or more device-specific production parameters are not within the specified manufacturing tolerances, then the corresponding device can be automatically classified as defective. In this case, the faulty device must be sorted out and, if necessary, reworked. Furthermore, by analyzing the detected device-specific production parameters, for example in the computing device 30, devices with different quality levels can also be determined. For example, devices whose components are within a very tight manufacturing tolerance and / or which were assembled particularly well during the production process were classified as particularly high quality. Any other classifications are also possible. Since very easily can be determined during the determination of the control parameters by the computing device 30 to determine a to ER-reaching efficiency or other device properties, in this context, a particularly reliable and efficient classification of each ^¬ weiligen devices is possible. Figure 3 shows a schematic representation of a Ablaufdiag ^¬ ramms, as it is based on a method for configuring an electronically controlled device. In step Sl while one or more device-specific Ferti ^¬ supply parameter is first detected. In the case acquired device-specific production parameters can be any production parameters, particularly the previously-described ^¬ nen electrical, mechanical and other manufacturing parameters. Based on the device specific see manufacturing parameters can be done in step S2, a classification of the respective device. For example, defective or particularly high-quality devices can be identified or the devices classified according to their expected efficiency or other properties.

In step S3, one or more device-specific control parameters are then determined using the acquired manufacturing parameters. Finally, the device-specific control parameters or, alternatively, the complete device control are transmitted to the electronically controlled device. The device-specific control parameters can be stored in a special parameter memory of the electronically controlled device.

The step S1 for detecting device-specific production parameters can thereby, as already described above, detect at least one electrical and / or mechanical measured value of a component 10 to 12 of the electronically controlled device. Likewise, the step S1 for detecting device-specific manufacturing parameters can detect at least one position of a component 10 to 12 in the electronically controlled device. Additionally or alternatively, at least one assembly parameter can also be detected in the step S1 for detecting device-specific production parameters.

The step S3 for determining device-specific control parameters can determine the control parameters using predefined relationships between device-specific production parameters and corresponding device-specific control parameters. For example, the predefined relationships between production parameters and control parameters can be provided as a table or mathematical formula for this purpose.

In summary, the present invention relates to the indi ^¬ viduelle adaptation of the control of electronically controlled devices, in particular bulk goods. This will be done during the Manufacturing of each device for each device individually determines one or more parameters. Based on these Pa ^¬ rametern a separate, special adaptation of the controller is then for each individual device. In this way, the efficiency of the device can be increased, and the life and durability of the device can be increased.

Claims

claims

1. Device for configuring an electronically controlled device with customized control parameters, comprising:

a detection device (20), which is designed to ei ^¬ nen device-specific manufacturing parameters to capture;

a computing device (30) configured to determine a device-specific control parameter using the sensed manufacturing parameter;

a programming device (40) adapted to transfer the device-specific control parameter into a parameter memory of the electronically-controlled device.

2. Device according to claim 1, wherein the computing device (30) comprises a memory (31) which is adapted to store Be ^¬ relationships between device-specific production parameters and corresponding device-specific control parameters, and wherein the computing device (30) the device-specific control parameters further using determines the stored in the memory (31) relationships.

3. Device according to claim 1 or 2, wherein the electronically controlled device comprises a component (10, 11, 12) and wherein the detection device (20) further comprises a component sensor (21, 22) which is adapted to a elektri ^¬ cal and / or mechanical property of the component (10, 11, 12) to capture.

4. Device according to one of claims 1 to 3, wherein the electronically controlled device comprises a component (10, 11, 12) ^¬ and wherein the detection device (20) further comprises a position sensor (23) which is adapted to a position of the built-in component (10, 11, 12) in the device.

5. Method for configuring an electronically controlled device, comprising the steps of:

Recording (SI) of device-specific production parameters; Determining (S3) device specific control parameters using the acquired manufacturing parameters;

Transmitting (S4) the device-specific control parameter into a parameter memory of the electronically controlled device.

6. The method according to claim 5, wherein the step (S1) for acquiring device-specific production parameters comprises at least one electrical or mechanical measured value of a component (10, 11, 12) of the electronically controlled device.

7. The method of claim 5 or 6, wherein the step (S1) for detecting device-specific manufacturing parameters detected at least one position of a component (10, 11, 12) in the electronically controlled device.

8. The method according to any one of claims 5 to 7, wherein the

Step (Sl) for detecting device-specific manufacturing parameters detected at least one mounting parameter.

9. The method of claim 5, wherein the step (S3) for determining device-specific control parameters determines the control parameters using predefined relationships between device-specific manufacturing parameters and corresponding device-specific control parameters.

10. The method of claim 5, further comprising a step of classifying the electronically controlled device based on the acquired device-specific manufacturing parameters.