WO2016036867A1 - Structure à sections évaporateur et condensateur pour thermosiphon - Google Patents

Structure à sections évaporateur et condensateur pour thermosiphon Download PDF

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Publication number
WO2016036867A1
WO2016036867A1 PCT/US2015/048162 US2015048162W WO2016036867A1 WO 2016036867 A1 WO2016036867 A1 WO 2016036867A1 US 2015048162 W US2015048162 W US 2015048162W WO 2016036867 A1 WO2016036867 A1 WO 2016036867A1
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WO
WIPO (PCT)
Prior art keywords
channel
inlet
outlet
liquid
condenser
Prior art date
Application number
PCT/US2015/048162
Other languages
English (en)
Other versions
WO2016036867A8 (fr
Inventor
Morten Soegaard ESPERSEN
Maria Luisa ANGRISANI
Dennis N. JENSEN
Sukhvinder S. Kang
Original Assignee
Aavid Thermalloy, Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aavid Thermalloy, Llc filed Critical Aavid Thermalloy, Llc
Priority to CN201580001408.3A priority Critical patent/CN105579792A/zh
Publication of WO2016036867A1 publication Critical patent/WO2016036867A1/fr
Publication of WO2016036867A8 publication Critical patent/WO2016036867A8/fr

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B39/00—Evaporators; Condensers
    • F25B39/02—Evaporators
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B39/00—Evaporators; Condensers
    • F25B39/04—Condensers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/025—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes having non-capillary condensate return means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/02—Tubular elements of cross-section which is non-circular
    • F28F1/022—Tubular elements of cross-section which is non-circular with multiple channels
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/14—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending longitudinally
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure

Definitions

  • thermosiphon devices and other heat transfer devices that employ a two-phase fluid for cooling.
  • Thermosiphon devices are widely used for cooling systems, such as integrated circuits and other computer circuitry.
  • cooling systems such as integrated circuits and other computer circuitry.
  • thermosiphon cooler used to cool electronic components located in a cabinet or other enclosure.
  • thermosiphon device may have a closed loop evaporator section combined with a counterflow type condenser section.
  • thermosiphon devices are made such that both the evaporator and condenser sections operate in a counterflow-type mode, or with a closed loop flow.
  • Counterflow type devices tend to be less efficient than closed loop systems, but are suitable for certain applications and tend to be lower cost systems.
  • closed loop systems can have a larger overall size, e.g., because of the dedicated flow paths and other components.
  • a thermosiphon cooling device may include a closed loop evaporator section having at least one evaporation channel with an inlet and an outlet.
  • the evaporator section may be arranged to receive heat and evaporate a liquid in the at least one evaporation channel to deliver vapor to the evaporation channel outlet.
  • a liquid return path having an inlet and an outlet, may deliver condensed liquid to the at least one evaporation channel inlet, and the liquid return path may be arranged such that downward flow of condensed liquid from the liquid return path inlet to the liquid return path outlet is separate from an upward flow of vapor to the evaporation channel outlet.
  • the evaporator section may operate with a closed loop flow.
  • a condenser section of the device may include at least one condensing channel arranged to receive vapor from the at least one evaporation channel that flows upwardly in the condensing channel and arranged to transfer heat from the vapor to a surrounding environment to condense the vapor to a liquid which flows downwardly in the condensing channel to the liquid return path inlet. That is, the condenser section may operate in a counterflow
  • a manifold may fluidly connect the at least one evaporation channel and the liquid return path with the at least one condensing channel.
  • the manifold may function as a vapor/liquid separator such that vapor entering the manifold is separated from any liquid in the manifold and flows into condensing channels.
  • liquid in the manifold may flow to the liquid return path.
  • the liquid return path inlet is positioned below the at least one evaporation channel outlet in the manifold so liquid preferentially flows into the liquid return path.
  • the evaporator section is formed as a flat tube that is bent at a location where the liquid return outlet communicates with the at least one evaporation channel inlet.
  • the flat tube may be bent to form a 180 or other degree bend where the liquid return outlet communicates with the at least one evaporation channel inlet.
  • an outlet end of the flat tube at the evaporator channel outlet may be twisted about an axis along a length of the flat tube at the outlet end, and/or an inlet end of the flat tube at the liquid return path inlet may be twisted about an axis along a length of the flat tube at the inlet end.
  • inlet and/or outlet ends of the flat tube may be twisted 90 degrees about the axes.
  • This type of arrangement may allow for simplified connections between the evaporator section and other parts of the thermosiphon device, e.g., the need for connectors to provide bends in the system flow path may be eliminated and replaced by bent/twisted tube sections.
  • a thermosiphon device may include a closed loop condenser section that has a liquid bypass or exit path for condensed liquid in the vapor supply path of the condenser section.
  • This arrangement may reduce the concern regarding condensate forming in the vapor supply path, e.g., allowing the vapor supply path to be positioned closely to condensing channels of the device in such a way that condensate may form in the vapor supply path.
  • a thermosiphon cooling device includes a closed loop evaporator section having at least one evaporation channel with an inlet and an outlet and arranged to receive heat and evaporate a liquid in the at least one evaporation channel to deliver vapor to the evaporation channel outlet.
  • a liquid return path having an inlet and outlet, may deliver condensed liquid to the at least one evaporation channel.
  • a condenser section may have a vapor supply channel arranged to receive vapor from the outlet of the at least one evaporation channel and deliver vapor to an upper end of the at least one condensing channel.
  • the at least one condensing channel may be arranged to transfer heat from the vapor to a surrounding environment to condense the vapor to a liquid which flows downwardly in the condensing channel to the liquid return path inlet.
  • the vapor supply channel may carry vapor flow, which is separate from condensed liquid flow in the condensing channels, yet the vapor supply channel may be immediately adjacent the at least one condensing channel.
  • thermosiphon a vapor supply path can be provided immediately adjacent one or more condensing channels, and yet may be configured so that gravity-driven cyclical flow is not disrupted.
  • an area where the vapor supply channel is fluidly connected to the outlet of the evaporator section may be provided with a liquid bypass or other flow path so that condensate in the vapor supply channel may drain to a manifold or other liquid return path of the device.
  • an outlet end of the at least one evaporator channel may be inserted into or otherwise coupled to the vapor supply channel, and the coupling may be arranged so that liquid flowing downwardly in the vapor supply channel does not enter the outlet end of the at least one evaporator channel.
  • the coupling between the outlet end and the vapor supply channel may have one or more gaps or other flow paths so that liquid in the vapor supply channel can bypass the outlet end and flow to a liquid return path of the device.
  • a manifold may fluidly connect the inlet of the liquid return path with a bottom of the at least one condensing channel, and any liquid that exits from the vapor supply channel may enter the manifold.
  • the vapor supply channel may be surrounded by condensing channels without disrupting flow in the thermosiphon device because liquid in the vapor path can be removed.
  • the condenser section may have a plurality of parallel condensing channels, and the vapor supply channel may be located between two sets of the condensing channels, e.g., along a centerline of the condenser section.
  • a thermosiphon cooling device in another aspect of the invention, includes an evaporator section with at least one evaporation channel having an inlet and an outlet and arranged to receive heat and evaporate a liquid in the at least one evaporation channel to deliver vapor to the evaporation channel outlet.
  • a liquid return path having an inlet and outlet, may deliver condensed liquid to the at least one evaporation channel, e.g., by having the outlet fluidly coupled to the evaporation channel inlet.
  • the evaporator section may be formed as a flat tube that is bent, e.g., at 180 degrees or more or less, at a location where the liquid return outlet communicates with the at least one evaporation channel inlet.
  • a condenser section may have at least one condenser channel with an inlet and an outlet and arranged to transfer heat and condense a vapor in the at least one condenser channel to deliver condensed liquid to the condenser channel outlet.
  • a vapor supply path having an inlet and an outlet, may deliver evaporated liquid to the inlet of the at least one condenser channel, e.g., by having the outlet fluidly coupled to the condenser channel inlet.
  • the condenser section may be formed as a flat tube that is bent, e.g., at 180 degrees or more or less, at a location where the vapor supply path outlet communicates with the at least one condenser channel inlet.
  • a manifold may be fhiidly connected to the at least one evaporation channel outlet and the liquid return path inlet, and the liquid return path inlet may be positioned below the at least one evaporation channel outlet in the manifold. This construction may make for a simplified device, since a single manifold may be used to make vapor and liquid connections between the evaporator section and the condenser section, as well as function as a vapor/liquid separator.
  • an outlet end of the flat tube at the evaporator channel outlet may be twisted about an axis along a length of the flat tube at the outlet end, and/or an inlet end of the flat tube at the liquid return path inlet may be twisted about an axis along a length of the flat tube at the inlet end.
  • the inlet and outlet ends of the flat tube may be twisted 90 degrees about the axes. This arrangement may allow for relatively compact connections between the evaporator section and other portions of the thermosiphon device without the use of additional connectors. Instead, the tube ends may be twisted as needed to provide a suitably compact and correctly oriented connection.
  • a thermosiphon cooling includes a condenser section having a plurality of condensing channels arranged to receive evaporated liquid and arranged to transfer heat from the evaporated liquid to a surrounding environment to condense the evaporated liquid to a liquid which flows downwardly in the condensing channels.
  • the condenser section may include first and second panels that sandwich a channel-defining member so as to form the plurality of condenser channels, with the first and second panels defining a lower manifold that fluidly connects lower ends of the condenser channels.
  • Such an arrangement may provide a simple and efficient design which eliminates a variety of parts, such as an end cap for the upper ends of the condenser channels.
  • the first and second panels define an upper manifold that fluidly connects upper ends of the condenser channels, e.g., so the condenser section can be used as a closed loop type device.
  • the channel-defining member may define a vapor supply channel, e.g., that is located between sets of condensing channels.
  • thermosiphon cooling device in another illustrative embodiment, includes an evaporator section with a tube and an axially extending separation wall within the tube to separate at least one evaporation channel from a liquid return path in the tube.
  • the axially extending separation wall may have a bottom end that is positioned away from a lower end of the tube and define the inlet for the at least one evaporation channel.
  • This configuration may provide for a simplified evaporator device that includes a single tube and a plate or other element positioned inside the tube to function as a separation wall.
  • the tube may also define a condenser section, e.g., an inner surface of the tube may have fins or channels that define one or more condensing channels, one or more evaporation channels, and one or more liquid return paths.
  • the fins or channels at the at least one evaporation channel are different from the fins or channels at the liquid return path.
  • the channels or grooves at the evaporation channels may be arranged to enhance liquid boiling, whereas the channels or grooves at the liquid return path may be arranged to enhance condensate consolidation and flow.
  • conductive thermal transfer structure such as a plurality of fins, may be in direct, conductive thermal contact with portions of an evaporator section, e.g., adjacent one or more evaporation channels, in contact with portions of a condenser section, e.g., adjacent one or more condensing channels, and/or associated with other parts of the thermosiphon device to influence heat transfer and/or cooling fluid flow.
  • aspects of the invention may be combined in a variety of different ways.
  • aspects related to closed loop evaporator flow and counterflow condenser flow may be combined with the use of a flat, bent tube evaporator, and/or with a condenser formed by sandwiching a channel-defining member between opposed panels.
  • FIG. 1 is a perspective view of a thermosiphon device in an illustrative embodiment that incorporates aspects of the invention
  • FIG. 2 shows a cross sectional side view of the FIG. 1 device
  • FIG. 3 shows a cross sectional close up view of a modified version of the FIG. 2 embodiment
  • FIG. 4 shows a cross sectional close up view of a modified version of the FIG. 3 embodiment
  • FIG. 5 shows a cross sectional close up view of a condenser section having a channel-defining member
  • FIG. 6 shows a partial section view of headers joining condenser and evaporator sections in an illustrative embodiment
  • FIG. 7 shows a perspective view of thermosiphon devices having a manifold that fluidly couples evaporator sections at a turnaround end of the sections;
  • FIG. 8 shows a perspective view of a thermosiphon device having inlet and outlet ends of evaporator sections coupled to a connecting tube of a manifold;
  • FIG. 9 shows a close up view of a manifold arrangement in the FIG. 8 embodiment
  • FIG. 10 shows an evaporator section of a thermosiphon device that includes thermal transfer structure having fins extending between evaporator sections;
  • FIG. 11 shows a perspective view of a thermosiphon device in which a tube defines condenser and evaporator sections;
  • FIG. 12 shows a cross sectional perspective view of an evaporator section of the tube in the FIG. 11 embodiment
  • FIG. 13 shows a cross sectional view along the line 13-13 in FIG. 12.
  • FIG. 14 shows side view of a thermosiphon device in another illustrative embodiment.
  • a thermosiphon cooling device includes an evaporator section formed as a flat tube that is bent at a location where the liquid return outlet communicates with the at least one evaporation channel inlet.
  • the evaporator section may include at least one evaporation channel having an inlet and a liquid return path having an outlet that is fluidly coupled to the evaporation channel inlet, where the at least one evaporation channel and the liquid return path are formed as a flat tube that is bent at a location where the liquid return outlet
  • the flat tube may be arranged as a multi-port extruded (MPE) structure that is generally flat and has a plurality of parallel channels extending along the tube length, at least in the evaporator channel section.
  • MPE multi-port extruded
  • the MPE tube may be bent, e.g., to form a 180 degree bend, that defines an area where the liquid return path joins to the evaporation channel(s).
  • Such an arrangement may make for a simplified, low- weight construction that can be made at relatively low cost.
  • FIG. 1 shows an illustrative embodiment of a thermosiphon device 10, e.g., used to cool electronics devices in a closed cabinet or other enclosure, or in an open environment. That is, as is understood by those of skill in the art, a heat-receiving area 5 of one or more evaporator sections 2 of the device 10 may be thermally coupled with electronics or other heat- generating devices to be cooled, e.g., by direct contact, heat pipe(s), heat exchanger, etc.
  • Vapor generated in one or more evaporation channels in the heat-receiving area 5 may flow to one or more condenser sections 1 that dissipate heat received from the evaporator section(s) 2, e.g., to air or other fluid in an
  • the evaporator section(s) 2 may be positioned inside of a sealed enclosure while the condenser section(s) 1 are located in an environment outside of the enclosure.
  • devices in the enclosure may be cooled while being contained in an environment protected from external conditions, e.g., protected from dirt, dust, contaminants, moisture, etc.
  • a thermosiphon device with a sealed enclosure is not required, e.g., the device may be used in a completely open system in which heat generating devices to be cooled are thermally coupled to one or more evaporator section(s) 2 of the device 10.
  • thermosiphon device 10 operates to cool heat generating devices by receiving heat at the heat-receiving area 5 of the evaporator section(s) 2 such that liquid in evaporation channels 22 boils or otherwise vaporizes.
  • Heat may be received at the evaporation channels 22 by warm air (heated by the heat generating devices) flowing across a thermal transfer structure (e.g., heat sink fins) that is thermally coupled to the evaporation channels 22 or in other ways, such as by a direct conductive path, one or more heat pipes, a liquid heat exchanger, etc.
  • Vapor flows upwardly from the evaporation channels 22 and into a vapor supply path 11 of a condenser section 1.
  • the vapor continues to flow upwardly in the vapor supply path 11 until reaching a turnaround 14 of the condenser section 1. At this point, the vapor flows downwardly into one or more condensing channels 12 of the condenser section 1, where the vapor condenses to a liquid and flows downwardly into the manifold 3.
  • Heat removed from the vapor during condensation may be transferred to thermal transfer structure coupled to the condensing channels 12, e.g., one or more fins conductively coupled to the condenser section 1 adjacent the condensing channels 12.
  • heat may be removed from the thermal transfer structure by cool air flowing across the structure, by a liquid bath, a liquid heat exchanger, refrigerant coils, or other arrangement.
  • the condensed liquid flows downwardly from the condensing channels 12 into a liquid return path 21 of an evaporator section 2 until reaching a turnaround 24 of the evaporator section 2.
  • the liquid then enters an evaporator channel(s) 22 and the process is repeated.
  • the evaporator section(s) 2 are each formed from a single flat tube, which may be arranged as an MPE tube or other suitable structure.
  • the tube is bent to form the turnaround 24, i.e., where an outlet of the liquid return path 21 is coupled to the inlet of the evaporation channel(s) 22.
  • Any suitable bend may be provided, and in this example, a 180 degree bend is made about an axis that is parallel to the plane of the tube and is perpendicular or otherwise transverse to the length of the tube.
  • Other bend arrangements are possible, though, including a bend about an axis that is perpendicular to the plane of the tube.
  • the heat-receiving area 5 of the evaporator section(s) 2 may be out of contact with the liquid return path 21 portion, e.g., so little or no heat transfer occurs between the two.
  • an inlet end and/or an outlet end of the tube forming the evaporator section(s) 2 may be twisted, e.g., about an axis that is along the length of the tube.
  • the inlet and outlet ends of the tube are twisted about an axis that extends along an approximate center of the tube along the length of the tube.
  • twisting about other axes extending along a length of the tube or otherwise arranged are possible.
  • the condenser section may have at least one condenser channel formed as a part of the tube with each condenser channel having an inlet and an outlet and arranged to transfer heat and condense a vapor in the at least one condenser channel to deliver condensed liquid to the condenser channel outlet.
  • Another part of the tube may form a vapor supply path for delivering evaporated liquid to the inlet of the at least one condenser channel.
  • the vapor supply path may have an inlet and an outlet that is fluidly coupled to the condenser channel inlet, and the flat tube may be bent at a location where the vapor supply path outlet communicates with the at least one condenser channel inlet. Moreover, ends of the tube may be twisted, e.g., in a way similar to the evaporator sections 2 shown in FIG. 1.
  • FIG. 2 shows a cross sectional side view of the FIG. 1 device, and illustrates how an outlet end 26 of the evaporator section 2 is coupled to the inlet of the vapor supply path 11 of the condenser section 1.
  • this coupling may in some cases not be liquid-tight so that any condensate in the vapor supply path 11 can flow through a gap or other flow path between the outlet end 26 of the evaporator section 2 and the vapor supply path 11 and into the manifold 3.
  • the vapor supply path 11 is positioned adjacent condensing channels 12, which may increase the likelihood that vapor in the supply path 11 condenses to form a liquid.
  • Such condensed liquid may flow downwardly in the vapor supply path 11, but may not enter the outlet end 26 of the evaporator section 2 because the liquid may exit the vapor supply path 11 via a bypass or other flow path to the manifold 3.
  • the manifold 3 in this embodiment provides a liquid flow path for condensed liquid to return to the evaporator section 2.
  • the inlet end 27 of the evaporator section 2 i.e., at the inlet to the liquid return path 21
  • the manifold 3 which fluidly couples the lower ends of the condenser channels 12 to the inlet end 27.
  • vapor may flow upwardly in the vapor supply path 11 and into the upper ends of the condenser channels 12.
  • Condensed liquid may flow downwardly into the manifold 3 and be routed to the inlet end 27 of the evaporator section 2. Since the inlet end 27 is positioned below the outlet end 26 of the evaporator section 2, liquid in the manifold 3 will flow first into the inlet end 27.
  • the manifold 3 includes a tube 35 that is coupled to each of the separate condenser sections 1, e.g., to allow for easier filling of the device 10 with cooling liquid and/or pressure equalization across different portions of the device.
  • FIG. 3 shows a cross sectional close up view of a modified version of the FIGs. 1 and 2 embodiment in which a connecting tube 35 is not provided.
  • the manifold 3 is formed from a pair of clam shell pieces or sections 3a, 3b that may be stamped, molded or otherwise formed to receive the condenser section 1 at an upper opening and to receive the inlet and outlet ends 27, 26 of the evaporator section 2 at respective lower openings.
  • a single brazing or other suitable operation may join the manifold sections 3a, 3b, the condenser section 1 and the ends 26, 27 of the evaporator section 2.
  • this arrangement provides for a simple, relatively lightweight and inexpensive device.
  • Thermal transfer structure 9, such as one or more fins 9, may be thermally coupled to the condenser section(s) 1, e.g., in areas adjacent the condenser channels 12. This may assist in heat transfer from vapor in the condenser channels 12 and/or affect how cooling fluid flows across the thermal transfer structure 9.
  • any suitable thermal transfer structure may be employed, including heat sink structures, heat pipes, heat exchangers, cold plates, etc.
  • a thermosiphon device may include a closed loop evaporator section, i.e., a liquid return path that leads to the inlet of one or more evaporation channels which have an outlet separate from the liquid return path, and a counterflow-type condenser section.
  • the condenser section may have at least one condensing channel arranged to receive vapor from at least one evaporation channel that flows upwardly in the condensing channel and arranged to transfer heat from the vapor to a surrounding environment to condense the vapor to a liquid which flows downwardly in the condensing channel to the liquid return path inlet.
  • vapor to be condensed flows upwardly in the condensing channels while condensed liquid flows downwardly in the condensing channels. This is in contrast to a system like that in FIG. 2 where vapor flows upwardly in a dedicated vapor supply path 11 and enters inlets to condensing channels 12 at a upper end of the channels.
  • vapor may enter the condensing channels 12 at a lower end of the channels, and condensed liquid may likewise exit from the lower end of the channels.
  • a turnaround 14 need not be provided for the condenser sections 1, reducing materials and cost.
  • condenser channels 12 may "dead end" at an upper end of the channels so the channels are not in fluid communication at the upper end.
  • a vapor supply path 11 need not be provided, allowing for an increased density of condenser channels 12.
  • FIG. 4 shows a cross sectional close up view similar to that of FIG. 3, except that the FIG. 1 embodiment has been modified to eliminate the vapor supply path 11.
  • the inlet and outlet ends 27, 26 of the evaporator section 2 extend into the manifold 3 such that both the outlet of the evaporator channels 22 and the inlet of the liquid return path 21 are in fluid communication with the manifold 3 and the lower ends of the condenser channels 12.
  • the inlet end 27 is positioned below the outlet end 26 so that liquid preferentially flows into the inlet end 27.
  • FIG. 4 also shows how a connector tube 35 may be joined to the manifold 3, e.g., a slot or opening 35a of the tube 35 may be aligned with a corresponding opening at a bottom of the manifold 3 so that the tube 35 and the manifold 3 are in fluid communication.
  • a connector tube 35 may be joined to the manifold 3, e.g., a slot or opening 35a of the tube 35 may be aligned with a corresponding opening at a bottom of the manifold 3 so that the tube 35 and the manifold 3 are in fluid communication.
  • a thermosiphon device in another aspect of the invention, includes a condenser section with first and second side panels that sandwich a channel-defining member so as to form a plurality of condenser channels and/or a vapor supply path.
  • the first and second side panels may define a lower manifold that fluidly connects lower ends of the condenser channels, and/or define an upper manifold that fluidly connects upper ends of the condenser channels.
  • the channel-defining member may be arranged in a variety of ways, such as a stamped plate with walls to define the condensing channels when positioned between the side panels.
  • FIG. 5 shows a cross sectional view of a condenser section 1 that has one of the side panels 16 removed such that a channel-defining member 17 can be seen along with a side panel 15.
  • the channel-defining member 17 is formed as a punched, stamped or otherwise formed element with a plurality of wall portions to define, at least partially, a plurality of condensing channels 12 and a vapor supply path 12.
  • the channel-defining member 17 may be formed as a set of individual ribs that are assembled between the side panels 15, 16, may be formed as a corrugated or extruded sheet, etc.
  • the channel-defining member 17 need not necessarily define continuous channels, but rather could have a pattern of dints, cutouts or pin fins, etc. that define discontinuous channels.
  • the channel-defining member 17 is arranged to be brazed or soldered to the inside surface of the side panels 15, 16, but it should be understood that other arrangements are possible, such as forming the channel- defining member 17 as part of one or both of the panels 15, 16.
  • the condenser section 1 can be formed by simply positioning the channel-defining member 17 on a surface of a metal sheet, and then folding the metal sheet so that the channel-defining member 17 is positioned between opposed parts of the sheet, i.e., side panels 15, 16 of the condenser section 1.
  • each of the condensing channels 12 may "dead end" at an upper end of the channels so that the upper ends of the channels 12 are not fluidly coupled together.
  • This arrangement may also allow for the elimination of a terminating cap at the turnaround end of the condenser section 1, e.g., because the panels 15, 16 may be joined together to close the condenser section 1.
  • thermal transfer structure 9 in the form of U-shaped fins 9 are attached to one or both of the panels 15, 16, e.g., to assist in transferring heat from vapor in the condensing channels 12.
  • the fins 9 are mounted parallel to the direction in which the condensing channels 12 extend, but could be positioned in other ways, such as at different angles. That is, this illustrative embodiment is configured to operate using natural convective flow such that air or other fluid in or around the fins 9 is heated and flows upwardly due to gravity.
  • the fins 9 may be arranged for forced convection applications, e.g., where the fins 9 rotated 90 degrees so the fins 9 extend in a direction perpendicular to the direction along which the condensing channels 12 extend. Configuring the condenser section 1 to operate in as a forced convection device may enable the condenser section 1 to be reduced in size, assuming a power input is unchanged. It should also be noted that the thermal transfer structure 9 may take a variety of different shapes or configurations than that shown, e.g., the fins 9 may be louvered, corrugated, include pin elements, etc.
  • a header used to join a condenser section 1 and an evaporator section 2 may be arranged to include a connecting tube or other conduit so that adjacent headers can fluidly communicate with each other. That is, while the embodiments in FIGs. 1 and 4 have a separate tube 35 that is attached to headers 3, tube or other conduit sections may be formed as part of each header and joined together to form a connecting tube 35.
  • FIG. 6 shows an
  • headers 3 include a connecting tube 35 formed as part of the header 3 structure.
  • the connecting tubes 35 of adjacent headers 3 are joined together, e.g., by brazing, solder, welding, adhesive, etc. so that the headers 3 fluidly communicate via passageways 35b.
  • the tubes 35 may be formed in any suitable way, such as by drawing, drilling, casting, molding, etc.
  • This view in FIG. 6 also shows how the headers 3 are formed from two clam-shell type parts or opposed sections 3a, 3b that are joined together to form the header 3.
  • the sections 3a, 3b may be formed by stamping, molding, etc. and may allow for simplified assembly of the header 3 with the condenser and evaporator sections 1, 2.
  • the manifold end of the condenser section 1, and the inlet and outlet ends 27, 26 of the evaporator section 2 may be assembled with the header sections 3a, 3b, and all of the assembled parts attached together in a single operation, such as brazing.
  • This can not only provide simplified assembly, but also allow for easier filling of the thermosiphon devices 10 in a single operation since the devices 10 are all in fluid communication with each other.
  • thermosiphon devices ganged together to cool one or more heat generating devices may be fluidly coupled in ways or locations other than that shown in FIGs. 1 and 6.
  • FIG. 7 shows an illustrative embodiment where the turnarounds of the evaporator sections 2 are fluidly coupled by a manifold 29.
  • the outlet end of the liquid return path 21 is coupled to the manifold 29, as is the inlet end of the evaporator channels 22.
  • the manifold 29 may be provided in one or more separate sections, e.g., if the device 10 is operated at inclined angles, the manifold 29 may be divided into any number of sub-sections to avoid a situation where a part of the manifold 29 is drained of liquid.
  • a similar approach may also be used for a central manifold 3 in case the device is to be operated at inclined angles.
  • FIG. 9 shows a close up view, and illustrates that the inlet end 27 of the liquid return path 21 is positioned below the outlet end 26 of the evaporator channels 22 so that condensed liquid preferentially flows into the inlet end 27.
  • the vapor speed in the vertical direction in the connector tube 35 and headers 3 is low due to the high area of the free liquid-vapor interface, which enhances liquid- vapor separation.
  • the ends 26, 27 of the evaporator sections 2 are not twisted as in earlier embodiments, the ends could be twisted to engage with the connector tube 35 and/or header 3.
  • FIG. 9 also illustrates how the manifolds 3 can be formed from pairs of opposed sections 3a, 3b which define an opening to receive a lower end of the condenser section 1 and an opening to communicate with the connector tube 35.
  • thermal transfer structure 9 such as a finned heat sink
  • condenser sections 1 thermal transfer structure may be used with evaporator sections 2.
  • FIG. 10 shows an embodiment in which a finned heat sink 9 has fins 91 extending between adjacent evaporator sections 2. The fins 91 and other portions of the thermal transfer structure 9 are out of contact with the liquid return path 21 portion of the evaporator section 2 so as to minimize heat transfer to the liquid return path 21.
  • the heat sink 9 is directly coupled to the heat receiving area 5/evaporation channels 22 portion of the evaporator sections 2 and to one or more heat-generating devices, such as electronic circuitry.
  • the fins 91 may help dissipate heat, particularly where the thermosiphon device 10 is used in an open environment, and having the fins 91 extend between the evaporator sections 2 (and away from the heat generating devices) may help reduce the overall size of the device 10 while enhancing its cooling capability.
  • the thermal transfer structure 9 is arranged as an extruded (or otherwise formed) heat sink structure with a base plate secured to the heat receiving area 5 and fins 91 extending from the base plate between the evaporator sections 2, the thermal transfer structure 9 may be arranged in other ways.
  • the thermal transfer structure 9 could be made part of a cabinet or other housing for the heat generating devices, e.g., the thermal transfer structure 9 could include a cool plate attached to a cabinet in which heat generating devices are located.
  • the thermal transfer structure 9 could include a cool plate attached to a cabinet in which heat generating devices are located.
  • heat generating devices may be attached directly to the thermal transfer structure 9 that is integrated with a cabinet or housing.
  • the thermal transfer structure 9 may provide a mounting support for one or more thermosiphon devices 10 and/or one or more heat-generating devices inside of a cabinet or housing. That is, thermal transfer structure 9 may be secured in a cabinet or housing (or other
  • thermosiphon devices 10 may be mounted to the thermal transfer structure 9.
  • One or more heat generating devices may also be mounted to the thermal transfer structure 9, or may be supported by a cabinet or other structure.
  • a single tube may incorporate both an evaporator section and a condenser section.
  • the evaporator section of the tube may include different internal protuberance and/or groove arrangements arranged to enhance condensation routing or liquid evaporation.
  • a part of the evaporation section may include a separation wall that extends axially in the tube and separates an evaporation portion from a liquid return path in the tube.
  • the separation wall may have a low thermal conductivity and may made with grooves in the tube interior to retain the wall in place.
  • FIG. 11 shows a perspective view of a thermosiphon device 10 with one of the tubes 25 defining a condenser and evaporation section 1, 2 shown in cross section.
  • Ends of the tubes 25 may be closed by caps 14, 24, or otherwise closed.
  • the condenser section 1 includes multiple grooves formed in the inner wall of the tube 25 that function as condensing channels 12. Vapor produced in the evaporation section 2 may flow upwardly in the grooves of the tube inner wall and/or at a central portion of the tube 25. Thermal transfer structure 9, such as one or more fins, may be coupled to the condenser section 1 to assist in heat transfer from the vapor in the condenser sections 1 and/or to attach the tubes 25 together.
  • the evaporator section 2 also includes grooves in the inner wall of the tube 25, e.g., to provide condensate liquid flow paths and evaporation channels.
  • a separation wall 23 may be positioned in the tube 25 and extend axially along the tube 25 to separate evaporation channels 22 from a liquid return path 21 of the evaporator section 2.
  • FIG. 12 shows a close up view of the evaporator section 2 and illustrates how the separation wall 23 extends along a portion of the tube 25. As can be seen in FIG. 13, the separation wall 23 may engage with grooves 19 that hold the separation wall 23 in place and may provide a liquid- tight seal between the wall 23 and the inner wall of the tube 25.
  • the separation wall 23 may be slid into the grooves 19 from the end of the tube 25, although other arrangements are possible. In any case, the separation wall 23 may extend across an internal space of the tube 25 so as to form a chord or chord-like element.
  • Grooves and/or fins that define the evaporation channels 22 may be arranged differently than grooves that define liquid return paths 21.
  • the grooves and/or fins at the evaporation channels 22 may include sharp corners to promote boiling, whereas grooves/fins at the liquid return paths 21 may include convex- shaped flutes at a radially inner end that enable very thin condensation films and use surface tension to urge the condensed fluid to flow into the grooves.
  • the separation wall 23 may have a low thermal conductivity so that thermal transfer between the area around the evaporation channels 22 to the liquid return path 21 is minimized.
  • One or more heat generating devices may be thermally coupled to the tube 25 in an area where the evaporation channels 22 are located, e.g., on the left side in FIG. 13. While in this embodiment, the tubes 25 are formed from a single continuous piece, two or more different tube sections may be joined together, e.g., where a condenser section 1 is made of aluminum and an evaporator section 2 is made of copper.
  • a portion of the tube 25 where the evaporation channels 22 are provided may be made of a highly thermally conductive material, such as copper, while another portion of the tube 25 where the liquid return path 21 is provided may be made of a lower thermal conductivity material, such as aluminum or plastic.
  • the tube 25 may be filled with cooling liquid at a relatively low level, e.g., between a bottom end of the separation wall 23 and an upper end of the wall, since the evaporation channels 22 need not be completely flooded.
  • Fig. 14 shows yet another illustrative embodiment of a thermosiphon device 10.
  • a condenser section 1 having multiple condensing channel 12 extends between upper and lower headers 3, which may be arranged like that shown in FIG. 4.
  • Upper and lower connecting tubes 19 and 35 may fluidly connect multiple headers 3, if provided.
  • An evaporation section 2 includes a tube, e.g., a flat, multi- channel tube, that extends from the lower tube 35 to the upper tube 19.
  • a liquid return path 21 extends from the lower tube 35 and provides liquid to a heat receiving area 5 of the evaporator section 2, e.g., where one or more evaporation channels 22 is provided. Vapor produced at the heat receiving area 5 flows upwardly to the upper tube 19, where the vapor enters the condensing channels 12.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Geometry (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

Dispositif de thermosiphon (10) comprenant une section évaporateur (2) à boucle fermée ayant un ou plusieurs canaux d'évaporation (22) qui sont alimentés par un chemin de retour de liquide (21), et une section condenseur (1) ayant un ou plusieurs canaux de condensation (12). La section condenseur peut comprendre un chemin d'alimentation en vapeur (11) qui est adjacent à un ou plusieurs canaux de condensation, par exemple, situé entre deux ensembles de canaux de condensation. Les sections évaporateur et/ou condenseur peuvent être constituées d'un unique tube coudé plat, qui peut être coudé autour d'un axe parallèle au plan du tube plat afin de former une rotation et/ou une torsion autour d'un axe le long d'une longueur du tube au niveau des extrémités de tube. Un tube unique (25) peut former à la fois les sections évaporateur et condenseur d'un dispositif de thermosiphon, et une paroi (23) s'étendant axialement à l'intérieur du tube dans la section évaporateur peut séparer une section évaporateur d'une section de retour de liquide.
PCT/US2015/048162 2014-09-02 2015-09-02 Structure à sections évaporateur et condensateur pour thermosiphon WO2016036867A1 (fr)

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CN109506505B (zh) * 2016-07-29 2020-03-17 青岛吉云德和商贸有限公司 一种距离优化设计的热管
CN107664448B (zh) * 2016-07-29 2020-03-17 青岛酒店管理职业技术学院 一种加热功率变化的热管
CN109373792B (zh) * 2016-07-29 2020-03-17 青岛酒店管理职业技术学院 一种自由端面夹角优化设计的热管
CN109506504B (zh) * 2016-07-29 2020-03-17 青岛吉云德和商贸有限公司 一种上下管箱热管
CN108107055B (zh) * 2017-11-20 2019-11-15 珠海格力电器股份有限公司 智能功率模块的控制方法、装置、存储介质和处理器
CN107860157B (zh) * 2017-12-07 2023-05-12 福建雪人股份有限公司 一种冷凝器
US10718558B2 (en) * 2017-12-11 2020-07-21 Global Cooling, Inc. Independent auxiliary thermosiphon for inexpensively extending active cooling to additional freezer interior walls
CN111615290B (zh) * 2019-02-25 2022-07-26 龙大昌精密工业有限公司 冷凝器的散热结构
CN109819635B (zh) * 2019-03-15 2024-01-26 深圳智焓热传科技有限公司 散热装置
TWI719675B (zh) * 2019-10-17 2021-02-21 萬在工業股份有限公司 液氣分離式熱交換裝置
CN113316361B (zh) * 2021-05-21 2022-08-12 浙江酷灵信息技术有限公司 热虹吸散热器、系统以及应用

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