WO2016031143A1 - Polishing pad - Google Patents
Polishing pad Download PDFInfo
- Publication number
- WO2016031143A1 WO2016031143A1 PCT/JP2015/003854 JP2015003854W WO2016031143A1 WO 2016031143 A1 WO2016031143 A1 WO 2016031143A1 JP 2015003854 W JP2015003854 W JP 2015003854W WO 2016031143 A1 WO2016031143 A1 WO 2016031143A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- polishing
- resin layer
- polished
- groove
- hard resin
- Prior art date
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
- B24B37/245—Pads with fixed abrasives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
Definitions
- the present invention relates to a polishing pad.
- a buffing process is known as a processing method for smoothing an object to be polished having a curved surface, for example, a car body painted surface of an automobile or the like (for example, Patent Document 1).
- the buffing process is a method in which a polishing object is polished by attaching various abrasives or the like to the periphery (surface) of a polishing wheel (buff) made of cloth or other material, and rotated.
- An object of the present invention is to provide a polishing pad capable of removing the undulation of the surface of an object to be polished having a curved surface.
- a polishing pad includes a polishing surface formed of a hard resin layer, and includes a structure for causing the polishing surface to follow a curved surface of an object to be polished.
- the structure for causing the polishing surface to follow the curved surface of the object to be polished may be a two-layer structure including a soft resin layer that supports a hard resin layer and a hard resin layer.
- a groove may be formed on the polished surface. The groove may divide the hard resin layer into a plurality. Moreover, this groove
- FIG. 1 is a perspective view of the polishing pad according to the first embodiment of the present invention
- (b) is an AA cross-sectional view of the polishing pad shown in (a) of FIG.
- (A) is explanatory drawing of the surface shape of the to-be-polished object before grinding
- (b) is explanatory drawing of the surface shape of the to-be-polished object after buffing which is a comparative example
- (c) is FIG. It is explanatory drawing of the surface shape of the to-be-polished object after grinding
- (A) is a top view of a polishing pad according to a second embodiment of the present invention
- (b) is an AA cross-sectional view of the polishing pad shown in (a) of FIG. (A) is sectional drawing of the 1st modification of the polishing pad shown to (a) of FIG. 3
- (b) is sectional drawing of the 2nd modification of the polishing pad shown to (a) of FIG. (A) is a top view of a third modification of the polishing pad shown in (a) of FIG. 3
- (b) is an AA cross-sectional view of the polishing pad shown in (a) of FIG. It is a figure which shows the structural example of the automatic polishing apparatus which uses the polishing pad which concerns on the Example of this invention.
- the surface of an object to be polished having a curved surface is polished using a polishing pad having a polishing surface formed of a hard resin layer.
- This polishing pad has a structure in which a polishing surface formed of a hard resin layer follows a curved surface of an object to be polished.
- the object to be polished may be, for example, a resin-coated surface having a curved surface.
- the resin coating surface may be, for example, a coating surface of a vehicle body such as a vehicle.
- the structure in which the polishing surface of the polishing pad follows the curved surface of the object to be polished is, for example, a two-layer structure including a hard resin layer that forms the polishing surface and a soft resin layer that supports the hard resin layer. It's okay.
- the soft resin layer is distorted according to the curved surface, so that the hard resin layer is bent and the polished surface follows the curved surface of the object to be polished.
- the structure in which the polishing surface of the polishing pad follows the curved surface of the object to be polished is such that the elastic member is used to support the hard resin layer, and when the polishing surface is pressed against the curved surface of the object to be polished, the elastic member May be a structure in which the hard resin layer forming the polished surface is bent according to the curved surface.
- the polishing pad according to the first embodiment has a two-layer structure including a hard resin layer that forms a polishing surface and a soft resin layer that supports the hard resin layer will be described.
- the hard resin layer that forms the polished surface is simply referred to as “hard resin layer”
- the soft resin layer that supports the hard resin layer is simply referred to as “soft resin layer”.
- the polishing pad 10 has a two-layer structure including a hard resin layer 40 and a soft resin layer 50.
- the hard resin layer 40 forms the polishing surface 30 of the polishing pad 10.
- the soft resin layer 50 supports the hard resin layer 40 and is distorted according to the curved surface when the polished surface 30 is pressed against the curved surface of the object to be polished. For this reason, the hard resin layer 40 bends along the curved surface, and the polishing surface 30 follows the curved surface of the object to be polished.
- the hardness of the hard resin layer 40 is preferably 50 degrees or more, more preferably 60 degrees or more in terms of A hardness according to JIS K 6253.
- the hardness of the hard resin layer 40 is preferably 95 degrees or less.
- the hardness of the hard resin layer 40 is preferably 60 degrees or more and 80 degrees or less, or the hardness of the hard resin layer 40 is preferably 85 degrees or more and 95 degrees or less. Within such a range, it becomes difficult to polish the curved surface of the object to be polished by the polishing pad 10 and it becomes possible to remove the undulation of the surface of the object to be polished.
- the thickness of the hard resin layer 40 is not particularly limited, but is preferably 3.0 mm or less. Moreover, it is preferable that the thickness of the hard resin layer 40 is 0.5 mm or more. In such a range, when the polishing surface 30 is pressed against the curved surface of the object to be polished, the hard resin layer 40 is easily bent along the curved surface of the object to be polished, and the polishing surface with respect to the curved surface of the object to be polished. The followability of 30 is improved. For this reason, the waviness component of the surface shape of the object to be polished can be removed, and the contact area between the polishing surface 30 and the curved surface is increased to improve the polishing efficiency.
- the material of the hard resin layer 40 is not particularly limited as long as the material has the above hardness.
- the material of the hard resin layer 40 may be, for example, a polyurethane foam or a nonwoven fabric.
- the material of the hard resin layer 40 may be, for example, a nonwoven fabric having an A hardness of 60 degrees to 80 degrees, and may be a polyurethane foam having an A hardness of 85 degrees to 95 degrees.
- the hardness of the soft resin layer 50 is 30 degrees or less in E hardness according to JISK6253. Within such a range, the soft resin layer 50 is likely to be distorted when the polishing surface 30 is pressed against the curved surface of the object to be polished. As a result, the hard resin layer 40 is easily bent along the curved surface of the object to be polished, and the followability of the polishing surface 30 to the curved surface of the object to be polished is improved. For this reason, the waviness component of the surface shape of the object to be polished can be removed, and the contact area between the polishing surface 30 and the curved surface is increased to improve the polishing efficiency.
- the thickness of the soft resin layer 50 is not particularly limited, but is preferably 5.0 mm or more. Moreover, it is preferable that the thickness of the soft resin layer 50 is 50 mm or less. If it is such a range, when the grinding
- the material of the soft resin layer 50 is not particularly limited as long as the material has the above hardness.
- the material of the soft resin layer 50 may be, for example, a resin foam such as a polyurethane foam or a polyethylene foam.
- the polishing pad 10 of the first embodiment has a polishing surface 30 formed of a hard resin layer 40. For this reason, compared with a soft polished surface, polishing of the surface of the object to be polished is difficult and polishing is difficult. As a result, the undulation component of the surface shape of the object to be polished can be removed. Moreover, the polishing pad 10 of 1st Embodiment is equipped with the structure which makes the polishing surface 30 track the curved surface of a to-be-polished object.
- the polishing surface 30 follows the curved surface of the object to be polished, the waviness component of the surface shape of the object to be polished can be removed, and the contact area of the polishing surface 30 that contacts the object to be polished having a curved surface increases. As a result, the polishing efficiency is improved, and the time required for polishing a relatively large object to be polished can be shortened.
- FIG. 2A schematically shows a profile of the surface shape of the object to be polished before polishing.
- the surface shape before polishing has a surface roughness component having a relatively high frequency and a swell component having a relatively low frequency.
- FIG. 2B shows a profile of the surface shape of the workpiece after buffing as a comparative example. In the buffing process, the hardness of the polishing cloth is relatively low, resulting in a level polishing. For this reason, the surface roughness component is removed, but the waviness component remains after polishing.
- FIG. 2C schematically shows a profile of the surface shape of an object to be polished after polishing with the polishing pad 10 of the first embodiment. Since the polishing surface 30 is formed by the hard resin layer 40, the surface of the object to be polished is not polished and is difficult to be polished. For this reason, the undulation component of the surface shape of the workpiece is removed. When the fine surface roughness component is removed after the polishing with the polishing pad 10, secondary polishing for removing the surface roughness component may be performed after the primary polishing with the polishing pad 10.
- FIG. 2D schematically shows the profile of the surface shape of the object to be polished after the secondary polishing. By polishing with the polishing pad 10 and subsequent secondary polishing, both surface roughness and waviness of the surface of the object to be polished are removed.
- a second embodiment of the present invention will be described.
- Grooves are formed on the polishing surface of the polishing pad according to the second embodiment.
- the groove formed on the polished surface may have a depth that divides the hard resin layer into a plurality. Since the hard resin layer is divided by the grooves, the hard resin layer can be displaced in the contact direction according to the curved surface when the polished surface is pressed against the curved surface of the object to be polished. . For this reason, the polishing surface easily follows the curved surface of the object to be polished.
- Such a groove is not particularly limited.
- a portion of the resin layer that becomes a groove is removed by etching or the like. Can be formed.
- it can be formed by scanning the surface while pressing a circular cutting blade rotating at high speed against a predetermined amount of pad.
- segments a hard resin layer into plurality may be formed also in the soft resin layer.
- FIGS. 3A and 3B Constituent elements having the same functions as those shown in FIG.
- a first groove 31 and a second groove 32 are formed on the polishing surface 30 of the polishing pad 10.
- the first groove 31 extends along a first direction on the polishing surface 30, and the second groove 32 extends along a second direction on the polishing surface 30 orthogonal to the first direction.
- the grooves are formed on the polishing surface 30 in a lattice shape.
- the depth of the first groove 31 and the second groove 32 may be the same as the thickness of the hard resin layer 40. That is, the hard resin layer 40 may be divided into a plurality by the first groove 31 and the second groove 32.
- the first groove 31 and the second groove 32 are formed only in the hard resin layer 40 and are not formed in the soft resin layer 50. It is preferable that the groove width of the 1st groove
- channel 32 are 5.0 mm or more, for example. Moreover, it is preferable that the pitch of the 1st groove
- These groove widths and pitch dimensions are the same in the first to third modifications described below.
- the depth of the first groove 31 and the second groove 32 may be shallower than the thickness of the hard resin layer 40. That is, the hard resin layer 40 is not divided into a plurality of parts by the first groove 31 and the second groove 32, and the thickness of the hard resin layer 40 in the first groove 31 and the second groove 32 is the other part. Thinner than the thickness. Since the rigidity of the first groove 31 and the second groove 32 is reduced, the hard resin layer 40 is easily bent. For this reason, it becomes easy for the polishing surface 30 to follow the curved surface of the object to be polished.
- the depth of the first groove 31 and the second groove 32 may be deeper than the thickness of the hard resin layer 40. That is, the first groove 31 and the second groove 32 may be formed in the hard resin layer 40 and the soft resin layer 50. Therefore, the support surface 51 of the soft resin layer 50 that supports the hard resin layer 40 is also divided by the first groove 31 and the second groove 32. The divided hard resin layers 40 are respectively supported by the divided support surfaces 51. Since the first groove 31 and the second groove 32 are also formed in the soft resin layer 50, the rigidity of the soft resin layer 50 is lowered, and the polishing surface 30 is pressed against the curved surface of the object to be polished. The soft resin layer 50 is easily distorted according to the curved surface.
- the support surface 51 that supports the hard resin layer 40 is divided, the binding force between the support surfaces 51 is reduced, and the divided hard resin layers 40 are easily displaced independently. . For this reason, the amount of displacement of the hard resin layer 50 in the contact direction increases, and the polishing surface 30 easily follows the curved surface of the object to be polished.
- the third modification reference is made to FIG. 5A and FIG.
- the polishing surface 30 only the first groove 31 is formed, and the second groove 32 is not formed.
- the grooves are formed in a stripe shape on the polishing surface 30.
- the depth of the first groove 31 may be deeper than the thickness of the hard resin layer 40. That is, the first groove 31 may be formed in the hard resin layer 40 and the soft resin layer 50. Therefore, the support surface 51 of the soft resin layer 50 that supports the hard resin layer 40 is also divided by the first groove 31.
- the divided hard resin layers 40 are respectively supported by the divided support surfaces 51.
- channel 31 may be the same as that of the hard resin layer 40, or may be shallow.
- polishing pad 10 may be attached to the tip of a hand polisher and used for manual work for polishing the surface of an object having a curved surface. Further, the polishing pad 10 may be used for polishing processing by an automatic polishing apparatus as described below.
- the automatic polishing apparatus 1 includes a robot arm 2, a polishing pad 10, a polishing tool 4, a pressing pressure detection unit 5, and a controller 7.
- Reference numeral 90 indicates an object to be polished.
- the object to be polished 90 may be a vehicle body such as an automobile whose surface is coated with resin.
- the robot arm 2 has a plurality of joints 20, 21, and 22, and can move a distal end portion 23 to which the polishing pad 10, the polishing tool 4, and the pressing pressure detection unit 5 are attached in a plurality of directions.
- the polishing tool 4 is attached to the tip portion 23 via the pressing pressure detection unit 5, and the polishing pad 10 is rotated about a direction perpendicular to the polishing surface 30 by a built-in driving means.
- the controller 7 controls the behavior of the robot arm 2 and the rotation of the polishing pad 10 by the polishing tool 4.
- a polishing agent is supplied between the polishing pad 10 and the workpiece 90 from a polishing agent supply mechanism (not shown).
- the controller 7 polishes the surface of the workpiece 90 by pressing the polishing pad 10 against the surface of the workpiece 90 by the robot arm 2 and rotating the polishing pad 10.
- the pressing pressure detector 5 detects the pressing force of the polishing surface 30 against the workpiece 90.
- the controller 7 may adjust the force for pressing the polishing surface 30 against the workpiece 90 based on the detection result by the pressing pressure detection unit 5.
- the controller 7 may control the robot arm 2 so that the polishing surface 30 moves on the surface of the workpiece 90 while keeping the pressing force of the polishing surface 30 against the workpiece 90 constant.
- secondary polishing for removing the surface roughness component may be performed.
- the polishing pad attached to the polishing tool 4 is replaced, and the surface of the workpiece 90 is polished using a polishing pad having a hardness lower than that of the polishing pad 10.
- the abrasive is selected from particles made of oxides of silicon or metal elements such as silica, alumina, ceria, titania, zirconia, iron oxide and manganese oxide, organic particles made of thermoplastic resin, or organic-inorganic composite particles.
- a slurry containing abrasive grains can be used.
- the abrasive it is preferable to use an alumina slurry that enables a high polishing rate and is easily available.
- Alumina includes those having different crystal forms such as ⁇ -alumina, ⁇ -alumina, ⁇ -alumina, and ⁇ -alumina, and an aluminum compound called hydrated alumina also exists. From the viewpoint of the polishing rate, those containing ⁇ -alumina as the main component are more preferred as the abrasive grains.
- the average particle diameter of the abrasive grains is preferably 0.1 ⁇ m or more, more preferably 0.3 ⁇ m or more. As the average particle size increases, the polishing rate improves. When the average particle diameter is within the above range, it becomes easy to improve the polishing rate to a particularly suitable level for practical use. Moreover, it is preferable that an average particle diameter is 10.0 micrometers or less, More preferably, it is 5.0 micrometers or less. As the average particle size decreases, the dispersion stability of the abrasive improves, and the generation of scratches on the polished surface is suppressed.
- the average particle diameter of the abrasive grains can be measured by a pore electrical resistance method (measuring instrument: Multisizer III type, manufactured by Beckman Coulter, Inc.).
- the content of abrasive grains in the abrasive is preferably 0.1% by mass or more, more preferably 0.2% by mass or more, and further preferably 0.5% by mass or more.
- the abrasive grain content increases, the polishing rate increases.
- content of the abrasive grains is within the above range, it becomes easy to improve the polishing rate to a particularly suitable level for practical use.
- content of an abrasive grain is 50 mass% or less, More preferably, it is 25 mass% or less, More preferably, it is 20 mass%.
- the cost of the abrasive can be suppressed. Moreover, it can suppress more that a surface defect arises on the surface of the grinding
- the abrasive may appropriately contain other components such as a lubricating oil, an organic solvent, a surfactant, and a thickener as necessary in addition to the abrasive grains.
- the lubricating oil may be a synthetic oil, mineral oil, vegetable oil or combination thereof.
- the organic solvent may be alcohol, ether, glycols, glycerin or the like in addition to the hydrocarbon solvent.
- the surfactant may be a so-called anion, cation, nonion, or amphoteric surfactant.
- the thickener may be a synthetic thickener, a cellulose thickener, or a natural thickener.
- the hardness of the polishing pad used for the secondary polishing is preferably lower than the hardness of the hard resin layer 40.
- the hardness of the polishing pad used for secondary polishing is, for example, preferably less than 50 degrees in terms of A hardness, and more preferably 40 degrees or less.
- the hardness of the polishing pad used for secondary polishing is preferably 30 degrees or more. Within such a range, it becomes possible to remove fine surface roughness components on the surface of the object to be polished.
- the material of the polishing pad used for the secondary polishing is not particularly limited as long as the material has the above hardness.
- the material of the polishing pad used for secondary polishing may be, for example, a nonwoven fabric or suede.
- the material of the polishing pad used for the secondary polishing may be suede having an A hardness of 30 degrees to 40 degrees.
- the polishing pad used for the secondary polishing may have a two-layer structure like the polishing pad 10. That is, the polishing pad used for secondary polishing may have a two-layer structure including a relatively hard first layer that forms a polishing surface and a relatively soft second layer that supports the first layer. .
- the hardness of the first layer is preferably lower than the hardness of the hard resin layer 40 of the polishing pad 10.
- the hardness of the first layer is preferably less than 50 degrees in terms of A hardness, and more preferably 40 degrees or less.
- the hardness of the first layer is preferably 30 degrees or more.
- the thickness of the first layer is preferably 3.0 mm or less. Also, the thickness of the first layer is preferably 0.5 mm or more. In such a range, when the polishing surface is pressed against the curved surface of the object to be polished, the first layer is easily bent along the curved surface of the object to be polished, and the contact area between the polishing surface and the curved surface increases. Polishing efficiency is improved.
- the material of the first layer is not particularly limited as long as the material has the above hardness.
- the material of the first layer may be a non-woven fabric or suede, for example.
- the material of the first layer may be suede having an A hardness of 30 degrees or more and 40 degrees or less.
- the configuration of the second layer may be the same as the configuration of the soft resin layer 50 of the polishing pad 10. Grooves may be formed on the polishing surface of the polishing pad used for the secondary polishing as in the polishing pad 10 according to the second embodiment.
- Example A polishing pad is formed by laminating a 1.5 mm thick polyurethane foam material and a hard resin layer having an A hardness of 90, and a 30.0 mm thick polyurethane resin material and a soft resin layer having an E hardness of 20 layers. After forming, the resin coating surface was polished. On the hard resin layer, a grid-shaped groove having a width of 2.0 mm, a pitch of 20.0 mm, and a depth of 3.0 mm is pressed against a pad by a predetermined amount of a circular cutting blade that rotates at a high speed after forming a two-layer structure. It was formed by scanning the surface. Moreover, an alumina slurry was used as the abrasive.
Abstract
Provided is a polishing pad capable of removing waviness on a resin-coated surface of an object to be polished having a curved surface. This polishing pad (10) is provided with a structure (40, 50) which has a polishing surface (30) made of a hard resin layer (40) and allows the polishing surface (30) to conform to the curved surface of the object to be polished (90).
Description
本発明は、研磨パッドに関する。
The present invention relates to a polishing pad.
曲面を有する被研磨物、例えば自動車等の車体塗装面を平滑化する加工方法として、バフ研磨加工が知られている(例えば特許文献1)。バフ研磨加工は、布製またはその他の材料で作られた研磨輪(バフ)の周囲(表面)に種々の研磨剤などを付けて回転させ、研磨対象物を研磨する方法である。
A buffing process is known as a processing method for smoothing an object to be polished having a curved surface, for example, a car body painted surface of an automobile or the like (for example, Patent Document 1). The buffing process is a method in which a polishing object is polished by attaching various abrasives or the like to the periphery (surface) of a polishing wheel (buff) made of cloth or other material, and rotated.
しかしながら、バフ研磨加工では被研磨物の表面のうねりを取り除くことができず、美しい表面仕上げを実現することが難しかった。
本発明は、曲面を有する被研磨物の表面のうねりを取り除くことが可能な研磨パッドを提供することを課題とする。 However, the buffing process cannot remove the waviness of the surface of the object to be polished, and it has been difficult to realize a beautiful surface finish.
An object of the present invention is to provide a polishing pad capable of removing the undulation of the surface of an object to be polished having a curved surface.
本発明は、曲面を有する被研磨物の表面のうねりを取り除くことが可能な研磨パッドを提供することを課題とする。 However, the buffing process cannot remove the waviness of the surface of the object to be polished, and it has been difficult to realize a beautiful surface finish.
An object of the present invention is to provide a polishing pad capable of removing the undulation of the surface of an object to be polished having a curved surface.
前記課題を解決するため、本発明の一態様に係る研磨パッドは、硬質の樹脂層で形成される研磨面を有し、この研磨面を被研磨物の曲面に追従させる構造を備える。
研磨面を被研磨物の曲面に追従させる上記の構造は、硬質の樹脂層を支持する軟質の樹脂層と、硬質の樹脂層とを含む2層構造であってよい。
研磨面には、溝が形成されていてもよい。この溝は、硬質の樹脂層を複数に分割してもよい。また、この溝は、軟質の樹脂層にも形成されてもよい。 In order to solve the above problems, a polishing pad according to one embodiment of the present invention includes a polishing surface formed of a hard resin layer, and includes a structure for causing the polishing surface to follow a curved surface of an object to be polished.
The structure for causing the polishing surface to follow the curved surface of the object to be polished may be a two-layer structure including a soft resin layer that supports a hard resin layer and a hard resin layer.
A groove may be formed on the polished surface. The groove may divide the hard resin layer into a plurality. Moreover, this groove | channel may be formed also in a soft resin layer.
研磨面を被研磨物の曲面に追従させる上記の構造は、硬質の樹脂層を支持する軟質の樹脂層と、硬質の樹脂層とを含む2層構造であってよい。
研磨面には、溝が形成されていてもよい。この溝は、硬質の樹脂層を複数に分割してもよい。また、この溝は、軟質の樹脂層にも形成されてもよい。 In order to solve the above problems, a polishing pad according to one embodiment of the present invention includes a polishing surface formed of a hard resin layer, and includes a structure for causing the polishing surface to follow a curved surface of an object to be polished.
The structure for causing the polishing surface to follow the curved surface of the object to be polished may be a two-layer structure including a soft resin layer that supports a hard resin layer and a hard resin layer.
A groove may be formed on the polished surface. The groove may divide the hard resin layer into a plurality. Moreover, this groove | channel may be formed also in a soft resin layer.
本発明によれば、曲面を有する被研磨物の表面のうねりを取り除くことが可能な研磨パッドを実現することができる。
According to the present invention, it is possible to realize a polishing pad capable of removing waviness on the surface of an object having a curved surface.
本発明の目的及び利点は、特許請求の範囲に示した要素及びその組合せを用いて具現化され達成される。前述の一般的な記述及び以下の詳細な記述の両方は、単なる例示及び説明であり、特許請求の範囲のように本発明を限定するものでないと解するべきである。
The objects and advantages of the invention will be realized and attained by means of the elements and combinations shown in the claims. It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the invention as claimed.
以下、本発明の実施形態について図面を参照しながら詳細に説明する。
1.第1実施形態
第1実施形態においては、硬質の樹脂層で形成される研磨面を有する研磨パッドを用いて、曲面を有する被研磨物の表面を研磨する。この研磨パッドは、硬質の樹脂層で形成される研磨面を被研磨物の曲面に追従させる構造を備える。被研磨物は、例えば、曲面を有する樹脂塗装面であってよい。樹脂塗装面は、例えば、車両等の車体の塗装面であってよい。 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
1. First Embodiment In the first embodiment, the surface of an object to be polished having a curved surface is polished using a polishing pad having a polishing surface formed of a hard resin layer. This polishing pad has a structure in which a polishing surface formed of a hard resin layer follows a curved surface of an object to be polished. The object to be polished may be, for example, a resin-coated surface having a curved surface. The resin coating surface may be, for example, a coating surface of a vehicle body such as a vehicle.
1.第1実施形態
第1実施形態においては、硬質の樹脂層で形成される研磨面を有する研磨パッドを用いて、曲面を有する被研磨物の表面を研磨する。この研磨パッドは、硬質の樹脂層で形成される研磨面を被研磨物の曲面に追従させる構造を備える。被研磨物は、例えば、曲面を有する樹脂塗装面であってよい。樹脂塗装面は、例えば、車両等の車体の塗装面であってよい。 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
1. First Embodiment In the first embodiment, the surface of an object to be polished having a curved surface is polished using a polishing pad having a polishing surface formed of a hard resin layer. This polishing pad has a structure in which a polishing surface formed of a hard resin layer follows a curved surface of an object to be polished. The object to be polished may be, for example, a resin-coated surface having a curved surface. The resin coating surface may be, for example, a coating surface of a vehicle body such as a vehicle.
研磨パッドの研磨面を被研磨物の曲面に追従させる構造は、例えば、研磨面を形成する硬質の樹脂層と、この硬質の樹脂層を支持する軟質の樹脂層とを含む2層構造であってよい。研磨面が被研磨物の曲面に押し当てられた場合に、曲面に応じて軟質の樹脂層が歪むことによって硬質の樹脂層が撓み、研磨面が被研磨物の曲面に追従する。
研磨パッドの研磨面を被研磨物の曲面に追従させる構造は、弾性部材を用いて硬質の樹脂層を支持することにより、研磨面が被研磨物の曲面に押し当てられた場合に、弾性部材が歪み、研磨面を形成する硬質の樹脂層が曲面に応じて撓む構造であってもよい。 The structure in which the polishing surface of the polishing pad follows the curved surface of the object to be polished is, for example, a two-layer structure including a hard resin layer that forms the polishing surface and a soft resin layer that supports the hard resin layer. It's okay. When the polished surface is pressed against the curved surface of the object to be polished, the soft resin layer is distorted according to the curved surface, so that the hard resin layer is bent and the polished surface follows the curved surface of the object to be polished.
The structure in which the polishing surface of the polishing pad follows the curved surface of the object to be polished is such that the elastic member is used to support the hard resin layer, and when the polishing surface is pressed against the curved surface of the object to be polished, the elastic member May be a structure in which the hard resin layer forming the polished surface is bent according to the curved surface.
研磨パッドの研磨面を被研磨物の曲面に追従させる構造は、弾性部材を用いて硬質の樹脂層を支持することにより、研磨面が被研磨物の曲面に押し当てられた場合に、弾性部材が歪み、研磨面を形成する硬質の樹脂層が曲面に応じて撓む構造であってもよい。 The structure in which the polishing surface of the polishing pad follows the curved surface of the object to be polished is, for example, a two-layer structure including a hard resin layer that forms the polishing surface and a soft resin layer that supports the hard resin layer. It's okay. When the polished surface is pressed against the curved surface of the object to be polished, the soft resin layer is distorted according to the curved surface, so that the hard resin layer is bent and the polished surface follows the curved surface of the object to be polished.
The structure in which the polishing surface of the polishing pad follows the curved surface of the object to be polished is such that the elastic member is used to support the hard resin layer, and when the polishing surface is pressed against the curved surface of the object to be polished, the elastic member May be a structure in which the hard resin layer forming the polished surface is bent according to the curved surface.
以下、第1実施形態に係る研磨パッドが、研磨面を形成する硬質の樹脂層と、この硬質の樹脂層を支持する軟質の樹脂層とを含む2層構造を有する場合について説明する。なお、以下の説明では、研磨面を形成する硬質の樹脂層を単に「硬質の樹脂層」と表記し、硬質の樹脂層を支持する軟質の樹脂層を単に「軟質の樹脂層」と表記する。
Hereinafter, a case where the polishing pad according to the first embodiment has a two-layer structure including a hard resin layer that forms a polishing surface and a soft resin layer that supports the hard resin layer will be described. In the following description, the hard resin layer that forms the polished surface is simply referred to as “hard resin layer”, and the soft resin layer that supports the hard resin layer is simply referred to as “soft resin layer”. .
以下、第1実施形態を詳細に説明する。
1-1.研磨パッドについて
図1の(a)及び図1の(b)を参照する。研磨パッド10は、硬質の樹脂層40と、軟質の樹脂層50とを含む2層構造を有する。硬質の樹脂層40は、研磨パッド10の研磨面30を形成する。軟質の樹脂層50は、硬質の樹脂層40を支持し、かつ研磨面30が被研磨物の曲面に押し当てられた場合に曲面に応じて歪む。このため、硬質の樹脂層40が曲面に沿って撓み、研磨面30が被研磨物の曲面に追従する。 Hereinafter, the first embodiment will be described in detail.
1-1. Regarding the polishing pad, reference is made to FIG. 1A and FIG. Thepolishing pad 10 has a two-layer structure including a hard resin layer 40 and a soft resin layer 50. The hard resin layer 40 forms the polishing surface 30 of the polishing pad 10. The soft resin layer 50 supports the hard resin layer 40 and is distorted according to the curved surface when the polished surface 30 is pressed against the curved surface of the object to be polished. For this reason, the hard resin layer 40 bends along the curved surface, and the polishing surface 30 follows the curved surface of the object to be polished.
1-1.研磨パッドについて
図1の(a)及び図1の(b)を参照する。研磨パッド10は、硬質の樹脂層40と、軟質の樹脂層50とを含む2層構造を有する。硬質の樹脂層40は、研磨パッド10の研磨面30を形成する。軟質の樹脂層50は、硬質の樹脂層40を支持し、かつ研磨面30が被研磨物の曲面に押し当てられた場合に曲面に応じて歪む。このため、硬質の樹脂層40が曲面に沿って撓み、研磨面30が被研磨物の曲面に追従する。 Hereinafter, the first embodiment will be described in detail.
1-1. Regarding the polishing pad, reference is made to FIG. 1A and FIG. The
1-2.硬質の樹脂層について
硬質の樹脂層40の硬度は、JIS K 6253に準じたA硬度で50度以上であることが好ましく、60度以上であることがより好ましい。また、硬質の樹脂層40の硬度は、95度以下であることが好ましい。例えば、硬質の樹脂層40の硬度は、60度以上80度以下であることが好ましく、又は硬質の樹脂層40の硬度は、85度以上95度以下であることが好ましい。このような範囲であれば、研磨パッド10による被研磨物の曲面の研磨がならい研磨になりにくくなり、被研磨物の表面のうねりを取り除くことが可能になる。 1-2. About Hard Resin Layer The hardness of thehard resin layer 40 is preferably 50 degrees or more, more preferably 60 degrees or more in terms of A hardness according to JIS K 6253. The hardness of the hard resin layer 40 is preferably 95 degrees or less. For example, the hardness of the hard resin layer 40 is preferably 60 degrees or more and 80 degrees or less, or the hardness of the hard resin layer 40 is preferably 85 degrees or more and 95 degrees or less. Within such a range, it becomes difficult to polish the curved surface of the object to be polished by the polishing pad 10 and it becomes possible to remove the undulation of the surface of the object to be polished.
硬質の樹脂層40の硬度は、JIS K 6253に準じたA硬度で50度以上であることが好ましく、60度以上であることがより好ましい。また、硬質の樹脂層40の硬度は、95度以下であることが好ましい。例えば、硬質の樹脂層40の硬度は、60度以上80度以下であることが好ましく、又は硬質の樹脂層40の硬度は、85度以上95度以下であることが好ましい。このような範囲であれば、研磨パッド10による被研磨物の曲面の研磨がならい研磨になりにくくなり、被研磨物の表面のうねりを取り除くことが可能になる。 1-2. About Hard Resin Layer The hardness of the
硬質の樹脂層40の厚さは、特に限定されるものではないが3.0mm以下であることが好ましい。また、硬質の樹脂層40の厚さは0.5mm以上であることが好ましい。このような範囲であれば、研磨面30が被研磨物の曲面に押し当てられた場合に硬質の樹脂層40が被研磨物の曲面に沿って撓みやすくなり、被研磨物の曲面に対する研磨面30の追従性が向上する。このため、被研磨物の表面形状のうねり成分を取り除くことができ、かつ研磨面30と曲面との接触面積が増えて研磨効率が向上する。
The thickness of the hard resin layer 40 is not particularly limited, but is preferably 3.0 mm or less. Moreover, it is preferable that the thickness of the hard resin layer 40 is 0.5 mm or more. In such a range, when the polishing surface 30 is pressed against the curved surface of the object to be polished, the hard resin layer 40 is easily bent along the curved surface of the object to be polished, and the polishing surface with respect to the curved surface of the object to be polished. The followability of 30 is improved. For this reason, the waviness component of the surface shape of the object to be polished can be removed, and the contact area between the polishing surface 30 and the curved surface is increased to improve the polishing efficiency.
硬質の樹脂層40の材質は特に限定されず、上記の硬度を有する材質であればよい。硬質の樹脂層40の材質は、例えば、ポリウレタン発泡体又は不織布であってよい。硬質の樹脂層40の材質は、例えば、A硬度が60度以上80度以下の不織布であってもよく、A硬度が85度以上95度以下のポリウレタン発泡体であってもよい。
The material of the hard resin layer 40 is not particularly limited as long as the material has the above hardness. The material of the hard resin layer 40 may be, for example, a polyurethane foam or a nonwoven fabric. The material of the hard resin layer 40 may be, for example, a nonwoven fabric having an A hardness of 60 degrees to 80 degrees, and may be a polyurethane foam having an A hardness of 85 degrees to 95 degrees.
1-3.軟質の樹脂層について
軟質の樹脂層50の硬度は、JIS K 6253に準じたE硬度で30度以下であることが好ましい。このような範囲であれば、研磨面30が被研磨物の曲面に押し当てられた場合に軟質の樹脂層50が歪みやすくなる。この結果、硬質の樹脂層40が被研磨物の曲面に沿って撓みやすくなり、被研磨物の曲面に対する研磨面30の追従性が向上する。このため、被研磨物の表面形状のうねり成分を取り除くことができ、かつ研磨面30と曲面との接触面積が増えて研磨効率が向上する。 1-3. About a soft resin layer It is preferable that the hardness of thesoft resin layer 50 is 30 degrees or less in E hardness according to JISK6253. Within such a range, the soft resin layer 50 is likely to be distorted when the polishing surface 30 is pressed against the curved surface of the object to be polished. As a result, the hard resin layer 40 is easily bent along the curved surface of the object to be polished, and the followability of the polishing surface 30 to the curved surface of the object to be polished is improved. For this reason, the waviness component of the surface shape of the object to be polished can be removed, and the contact area between the polishing surface 30 and the curved surface is increased to improve the polishing efficiency.
軟質の樹脂層50の硬度は、JIS K 6253に準じたE硬度で30度以下であることが好ましい。このような範囲であれば、研磨面30が被研磨物の曲面に押し当てられた場合に軟質の樹脂層50が歪みやすくなる。この結果、硬質の樹脂層40が被研磨物の曲面に沿って撓みやすくなり、被研磨物の曲面に対する研磨面30の追従性が向上する。このため、被研磨物の表面形状のうねり成分を取り除くことができ、かつ研磨面30と曲面との接触面積が増えて研磨効率が向上する。 1-3. About a soft resin layer It is preferable that the hardness of the
軟質の樹脂層50の厚さは、特に限定されるものではないが5.0mm以上であることが好ましい。また、軟質の樹脂層50の厚さは、50mm以下であることが好ましい。このような範囲であれば、研磨面30が被研磨物の曲面に押し当てられた場合に、軟質の樹脂層50の歪み量と硬質の樹脂層40の撓み量を確保することができる。
軟質の樹脂層50の材質は、材質は特に限定されず、上記の硬度を有する材質であればよい。軟質の樹脂層50の材質は、例えば、ポリウレタン発泡体又はポリエチレン発泡体等の樹脂発泡体であってよい。 The thickness of thesoft resin layer 50 is not particularly limited, but is preferably 5.0 mm or more. Moreover, it is preferable that the thickness of the soft resin layer 50 is 50 mm or less. If it is such a range, when the grinding | polishing surface 30 is pressed on the curved surface of a to-be-polished object, the distortion amount of the soft resin layer 50 and the bending amount of the hard resin layer 40 are securable.
The material of thesoft resin layer 50 is not particularly limited as long as the material has the above hardness. The material of the soft resin layer 50 may be, for example, a resin foam such as a polyurethane foam or a polyethylene foam.
軟質の樹脂層50の材質は、材質は特に限定されず、上記の硬度を有する材質であればよい。軟質の樹脂層50の材質は、例えば、ポリウレタン発泡体又はポリエチレン発泡体等の樹脂発泡体であってよい。 The thickness of the
The material of the
1-4.第1実施形態の効果について
第1実施形態の研磨パッド10は、硬質の樹脂層40で形成される研磨面30を有する。このため、軟質の研磨面と比べて、被研磨物の表面の研磨がならい研磨になりにくい。この結果、被研磨物の表面形状のうねり成分を取り除くことができる。
また、第1実施形態の研磨パッド10は、研磨面30を被研磨物の曲面に追従させる構造を備える。このため、研磨面30が被研磨物の曲面に追従するので、被研磨物の表面形状のうねり成分を取り除くことができ、かつ曲面を有する被研磨物に接触する研磨面30の接触面積が増加することにより研磨効率が向上し、比較的大きな被研磨物の研磨に要する時間を短縮することができる。 1-4. About Effect of First Embodiment Thepolishing pad 10 of the first embodiment has a polishing surface 30 formed of a hard resin layer 40. For this reason, compared with a soft polished surface, polishing of the surface of the object to be polished is difficult and polishing is difficult. As a result, the undulation component of the surface shape of the object to be polished can be removed.
Moreover, thepolishing pad 10 of 1st Embodiment is equipped with the structure which makes the polishing surface 30 track the curved surface of a to-be-polished object. For this reason, since the polishing surface 30 follows the curved surface of the object to be polished, the waviness component of the surface shape of the object to be polished can be removed, and the contact area of the polishing surface 30 that contacts the object to be polished having a curved surface increases. As a result, the polishing efficiency is improved, and the time required for polishing a relatively large object to be polished can be shortened.
第1実施形態の研磨パッド10は、硬質の樹脂層40で形成される研磨面30を有する。このため、軟質の研磨面と比べて、被研磨物の表面の研磨がならい研磨になりにくい。この結果、被研磨物の表面形状のうねり成分を取り除くことができる。
また、第1実施形態の研磨パッド10は、研磨面30を被研磨物の曲面に追従させる構造を備える。このため、研磨面30が被研磨物の曲面に追従するので、被研磨物の表面形状のうねり成分を取り除くことができ、かつ曲面を有する被研磨物に接触する研磨面30の接触面積が増加することにより研磨効率が向上し、比較的大きな被研磨物の研磨に要する時間を短縮することができる。 1-4. About Effect of First Embodiment The
Moreover, the
図2の(a)~図2の(d)を参照する。図2の(a)は、研磨前の被研磨物の表面形状のプロファイルを模式的に示す。研磨前の表面形状は、比較的周波数が高い表面粗さ成分と比較的周波数が低いうねり成分とを有している。
図2の(b)は、バフ研磨加工後の被研磨物の表面形状のプロファイルを比較例として示す。バフ研磨加工では研磨布の硬度が比較的低く、ならい研磨になってしまう。このため、表面粗さ成分は取り除かれるが、うねり成分は研磨後も残る。 Reference is made to (a) to (d) of FIG. FIG. 2A schematically shows a profile of the surface shape of the object to be polished before polishing. The surface shape before polishing has a surface roughness component having a relatively high frequency and a swell component having a relatively low frequency.
FIG. 2B shows a profile of the surface shape of the workpiece after buffing as a comparative example. In the buffing process, the hardness of the polishing cloth is relatively low, resulting in a level polishing. For this reason, the surface roughness component is removed, but the waviness component remains after polishing.
図2の(b)は、バフ研磨加工後の被研磨物の表面形状のプロファイルを比較例として示す。バフ研磨加工では研磨布の硬度が比較的低く、ならい研磨になってしまう。このため、表面粗さ成分は取り除かれるが、うねり成分は研磨後も残る。 Reference is made to (a) to (d) of FIG. FIG. 2A schematically shows a profile of the surface shape of the object to be polished before polishing. The surface shape before polishing has a surface roughness component having a relatively high frequency and a swell component having a relatively low frequency.
FIG. 2B shows a profile of the surface shape of the workpiece after buffing as a comparative example. In the buffing process, the hardness of the polishing cloth is relatively low, resulting in a level polishing. For this reason, the surface roughness component is removed, but the waviness component remains after polishing.
図2の(c)は、第1実施形態の研磨パッド10による研磨後の被研磨物の表面形状のプロファイルを模式的に示す。硬質の樹脂層40によって研磨面30が形成されるので、被研磨物の表面の研磨がならい研磨になりにくい。このため、被研磨物の表面形状のうねり成分が取り除かれる。
研磨パッド10による研磨の後に、微細な表面粗さ成分を取り除く場合には、研磨パッド10による1次研磨の後に、表面粗さ成分を取り除くための2次研磨を行ってもよい。図2の(d)は、2次研磨後の被研磨物の表面形状のプロファイルを模式的に示す。研磨パッド10による研磨とそれに続く2次研磨により、被研磨物の表面の表面粗さとうねりの両方が取り除かれる。 FIG. 2C schematically shows a profile of the surface shape of an object to be polished after polishing with thepolishing pad 10 of the first embodiment. Since the polishing surface 30 is formed by the hard resin layer 40, the surface of the object to be polished is not polished and is difficult to be polished. For this reason, the undulation component of the surface shape of the workpiece is removed.
When the fine surface roughness component is removed after the polishing with thepolishing pad 10, secondary polishing for removing the surface roughness component may be performed after the primary polishing with the polishing pad 10. FIG. 2D schematically shows the profile of the surface shape of the object to be polished after the secondary polishing. By polishing with the polishing pad 10 and subsequent secondary polishing, both surface roughness and waviness of the surface of the object to be polished are removed.
研磨パッド10による研磨の後に、微細な表面粗さ成分を取り除く場合には、研磨パッド10による1次研磨の後に、表面粗さ成分を取り除くための2次研磨を行ってもよい。図2の(d)は、2次研磨後の被研磨物の表面形状のプロファイルを模式的に示す。研磨パッド10による研磨とそれに続く2次研磨により、被研磨物の表面の表面粗さとうねりの両方が取り除かれる。 FIG. 2C schematically shows a profile of the surface shape of an object to be polished after polishing with the
When the fine surface roughness component is removed after the polishing with the
2.第2実施形態
続いて、本発明の第2実施形態について説明する。第2実施形態に係る研磨パッドの研磨面には溝が形成される。研磨面に溝が形成されることにより研磨面が被研磨物の曲面に押し当てられた場合に、研磨面が被研磨物の曲面に追従しやすくなる。
研磨面に形成される溝は、硬質の樹脂層を複数に分割する深さを有していてもよい。硬質の樹脂層が溝により分割されていることにより、研磨面が被研磨物の曲面に押し当てられた場合に、曲面に応じて硬質の樹脂層が当接方向に変位することが可能になる。このため、研磨面が被研磨物の曲面に追従しやすくなる。 2. Second Embodiment Subsequently, a second embodiment of the present invention will be described. Grooves are formed on the polishing surface of the polishing pad according to the second embodiment. By forming a groove on the polished surface, the polished surface easily follows the curved surface of the object to be polished when the polished surface is pressed against the curved surface of the object to be polished.
The groove formed on the polished surface may have a depth that divides the hard resin layer into a plurality. Since the hard resin layer is divided by the grooves, the hard resin layer can be displaced in the contact direction according to the curved surface when the polished surface is pressed against the curved surface of the object to be polished. . For this reason, the polishing surface easily follows the curved surface of the object to be polished.
続いて、本発明の第2実施形態について説明する。第2実施形態に係る研磨パッドの研磨面には溝が形成される。研磨面に溝が形成されることにより研磨面が被研磨物の曲面に押し当てられた場合に、研磨面が被研磨物の曲面に追従しやすくなる。
研磨面に形成される溝は、硬質の樹脂層を複数に分割する深さを有していてもよい。硬質の樹脂層が溝により分割されていることにより、研磨面が被研磨物の曲面に押し当てられた場合に、曲面に応じて硬質の樹脂層が当接方向に変位することが可能になる。このため、研磨面が被研磨物の曲面に追従しやすくなる。 2. Second Embodiment Subsequently, a second embodiment of the present invention will be described. Grooves are formed on the polishing surface of the polishing pad according to the second embodiment. By forming a groove on the polished surface, the polished surface easily follows the curved surface of the object to be polished when the polished surface is pressed against the curved surface of the object to be polished.
The groove formed on the polished surface may have a depth that divides the hard resin layer into a plurality. Since the hard resin layer is divided by the grooves, the hard resin layer can be displaced in the contact direction according to the curved surface when the polished surface is pressed against the curved surface of the object to be polished. . For this reason, the polishing surface easily follows the curved surface of the object to be polished.
このような溝は、特に限定されるものではないが、例えば、硬質の樹脂層及び軟質の樹脂層を含む2層構造を形成した後に、エッチング等によって溝となる部分の樹脂層を取り除くことによって形成することができる。また、2層構造を形成した後に、高速回転する円形の切刃を所定量パッドに押し当てながら表面を走査することによって形成することができる。
硬質の樹脂層を複数に分割する溝は、軟質の樹脂層にも形成されていてもよい。軟質の樹脂層にも溝が形成されることによって、研磨面が被研磨物の曲面に押し当てられた場合に硬質の樹脂層がより変位しやすくなり、研磨面30が被研磨物の曲面に追従しやすくなる。 Such a groove is not particularly limited. For example, after forming a two-layer structure including a hard resin layer and a soft resin layer, a portion of the resin layer that becomes a groove is removed by etching or the like. Can be formed. Moreover, after forming a two-layer structure, it can be formed by scanning the surface while pressing a circular cutting blade rotating at high speed against a predetermined amount of pad.
The groove | channel which divides | segments a hard resin layer into plurality may be formed also in the soft resin layer. By forming grooves in the soft resin layer, the hard resin layer is more easily displaced when the polishing surface is pressed against the curved surface of the object to be polished, and the polishingsurface 30 becomes the curved surface of the object to be polished. It becomes easy to follow.
硬質の樹脂層を複数に分割する溝は、軟質の樹脂層にも形成されていてもよい。軟質の樹脂層にも溝が形成されることによって、研磨面が被研磨物の曲面に押し当てられた場合に硬質の樹脂層がより変位しやすくなり、研磨面30が被研磨物の曲面に追従しやすくなる。 Such a groove is not particularly limited. For example, after forming a two-layer structure including a hard resin layer and a soft resin layer, a portion of the resin layer that becomes a groove is removed by etching or the like. Can be formed. Moreover, after forming a two-layer structure, it can be formed by scanning the surface while pressing a circular cutting blade rotating at high speed against a predetermined amount of pad.
The groove | channel which divides | segments a hard resin layer into plurality may be formed also in the soft resin layer. By forming grooves in the soft resin layer, the hard resin layer is more easily displaced when the polishing surface is pressed against the curved surface of the object to be polished, and the polishing
2-1.溝の形態
図3の(a)及び図3の(b)を参照する。図1の(a)と同じ機能を有する構成要素には同一の符号を付してある。研磨パッド10の研磨面30には、第1溝31及び第2溝32が形成されている。第1溝31は、研磨面30上の第1方向に沿って延び、第2溝32は、第1方向に直交する研磨面30上の第2方向に沿って延びる。研磨面30に複数の第1溝31及び複数の第2溝32を形成することにより、研磨面30には溝が格子状に形成される。 2-1. Groove Form Referring to FIGS. 3A and 3B. Constituent elements having the same functions as those shown in FIG. Afirst groove 31 and a second groove 32 are formed on the polishing surface 30 of the polishing pad 10. The first groove 31 extends along a first direction on the polishing surface 30, and the second groove 32 extends along a second direction on the polishing surface 30 orthogonal to the first direction. By forming a plurality of first grooves 31 and a plurality of second grooves 32 on the polishing surface 30, the grooves are formed on the polishing surface 30 in a lattice shape.
図3の(a)及び図3の(b)を参照する。図1の(a)と同じ機能を有する構成要素には同一の符号を付してある。研磨パッド10の研磨面30には、第1溝31及び第2溝32が形成されている。第1溝31は、研磨面30上の第1方向に沿って延び、第2溝32は、第1方向に直交する研磨面30上の第2方向に沿って延びる。研磨面30に複数の第1溝31及び複数の第2溝32を形成することにより、研磨面30には溝が格子状に形成される。 2-1. Groove Form Referring to FIGS. 3A and 3B. Constituent elements having the same functions as those shown in FIG. A
第1溝31及び第2溝32の深さは、硬質の樹脂層40の厚さと同じであってよい。すなわち、第1溝31及び第2溝32によって硬質の樹脂層40は複数に分割されてよい。また、第1溝31及び第2溝32は硬質の樹脂層40のみに形成され、軟質の樹脂層50には形成されない。
第1溝31及び第2溝32の溝幅は、例えば0.5mm以上であることが好ましい。また、第1溝31及び第2溝32の溝幅は、例えば5.0mm以下であることが好ましい。このような範囲であれば、溝の形成による研磨面30と被研磨物との接触面積の減少を抑えながら、研磨面30が被研磨物の曲面に押し当てられた場合の硬質の樹脂層40の変位量を確保し研磨面30を撓みやすくすることができる。 The depth of thefirst groove 31 and the second groove 32 may be the same as the thickness of the hard resin layer 40. That is, the hard resin layer 40 may be divided into a plurality by the first groove 31 and the second groove 32. The first groove 31 and the second groove 32 are formed only in the hard resin layer 40 and are not formed in the soft resin layer 50.
It is preferable that the groove width of the 1st groove |channel 31 and the 2nd groove | channel 32 is 0.5 mm or more, for example. Moreover, it is preferable that the groove width of the 1st groove | channel 31 and the 2nd groove | channel 32 is 5.0 mm or less, for example. Within such a range, the hard resin layer 40 when the polishing surface 30 is pressed against the curved surface of the object to be polished while suppressing a decrease in the contact area between the polishing surface 30 and the object to be polished due to the formation of grooves. Therefore, the polishing surface 30 can be easily bent.
第1溝31及び第2溝32の溝幅は、例えば0.5mm以上であることが好ましい。また、第1溝31及び第2溝32の溝幅は、例えば5.0mm以下であることが好ましい。このような範囲であれば、溝の形成による研磨面30と被研磨物との接触面積の減少を抑えながら、研磨面30が被研磨物の曲面に押し当てられた場合の硬質の樹脂層40の変位量を確保し研磨面30を撓みやすくすることができる。 The depth of the
It is preferable that the groove width of the 1st groove |
第1溝31のピッチ及び第2溝32のピッチは、例えば5.0mm以上であることが好ましい。また、第1溝31のピッチ及び第2溝32のピッチは、例えば50mm以下であることが好ましい。
このような範囲であれば、溝の形成による研磨面30と被研磨物との接触面積の減少を抑えながら、研磨面30が被研磨物の曲面に押し当てられた場合の研磨面30の全体のたわみ量を確保することができる。
これらの溝幅及びピッチの寸法は、以下に説明する第1~第3変形例でも同じである。 It is preferable that the pitch of the 1st groove |channel 31 and the pitch of the 2nd groove | channel 32 are 5.0 mm or more, for example. Moreover, it is preferable that the pitch of the 1st groove | channel 31 and the pitch of the 2nd groove | channel 32 are 50 mm or less, for example.
Within such a range, theentire polishing surface 30 when the polishing surface 30 is pressed against the curved surface of the object to be polished while suppressing a decrease in the contact area between the polishing surface 30 and the object to be polished due to the formation of grooves. The amount of deflection can be secured.
These groove widths and pitch dimensions are the same in the first to third modifications described below.
このような範囲であれば、溝の形成による研磨面30と被研磨物との接触面積の減少を抑えながら、研磨面30が被研磨物の曲面に押し当てられた場合の研磨面30の全体のたわみ量を確保することができる。
これらの溝幅及びピッチの寸法は、以下に説明する第1~第3変形例でも同じである。 It is preferable that the pitch of the 1st groove |
Within such a range, the
These groove widths and pitch dimensions are the same in the first to third modifications described below.
2-2.第1変形例について
図4の(a)を参照する。第1溝31及び第2溝32の深さは、硬質の樹脂層40の厚さよりも浅くてもよい。すなわち、第1溝31及び第2溝32によって硬質の樹脂層40は複数に分割されておらず、第1溝31及び第2溝32の部分の硬質の樹脂層40の厚さが他の部分の厚さよりも薄い。第1溝31及び第2溝32の部分の剛性が低下するので、硬質の樹脂層40が撓みやすくなる。このため、研磨面30が被研磨物の曲面に追従しやすくなる。 2-2. The first modification will be described with reference to FIG. The depth of thefirst groove 31 and the second groove 32 may be shallower than the thickness of the hard resin layer 40. That is, the hard resin layer 40 is not divided into a plurality of parts by the first groove 31 and the second groove 32, and the thickness of the hard resin layer 40 in the first groove 31 and the second groove 32 is the other part. Thinner than the thickness. Since the rigidity of the first groove 31 and the second groove 32 is reduced, the hard resin layer 40 is easily bent. For this reason, it becomes easy for the polishing surface 30 to follow the curved surface of the object to be polished.
図4の(a)を参照する。第1溝31及び第2溝32の深さは、硬質の樹脂層40の厚さよりも浅くてもよい。すなわち、第1溝31及び第2溝32によって硬質の樹脂層40は複数に分割されておらず、第1溝31及び第2溝32の部分の硬質の樹脂層40の厚さが他の部分の厚さよりも薄い。第1溝31及び第2溝32の部分の剛性が低下するので、硬質の樹脂層40が撓みやすくなる。このため、研磨面30が被研磨物の曲面に追従しやすくなる。 2-2. The first modification will be described with reference to FIG. The depth of the
2-3.第2変形例について
図4の(b)を参照する。第1溝31及び第2溝32の深さは、硬質の樹脂層40の厚さよりも深くてもよい。すなわち、第1溝31及び第2溝32は、硬質の樹脂層40及び軟質の樹脂層50に形成されていてもよい。したがって、硬質の樹脂層40を支持する軟質の樹脂層50の支持面51も第1溝31及び第2溝32によって分割される。分割された複数の硬質の樹脂層40は、分割された複数の支持面51によってそれぞれ支持される。
第1溝31及び第2溝32が軟質の樹脂層50にも形成されているので、軟質の樹脂層50の剛性が低下し、研磨面30が被研磨物の曲面に押し当てられた場合に、曲面に応じて軟質の樹脂層50が歪みやすくなる。また、硬質の樹脂層40を支持する支持面51が分割されていることにより、支持面51間の拘束力が低下して、分割された硬質の樹脂層40同士が独立して変位しやすくなる。このため、当接方向における硬質の樹脂層50の変位量が大きくなり、研磨面30が被研磨物の曲面に追従しやすくなる。 2-3. The second modification will be described with reference to FIG. The depth of thefirst groove 31 and the second groove 32 may be deeper than the thickness of the hard resin layer 40. That is, the first groove 31 and the second groove 32 may be formed in the hard resin layer 40 and the soft resin layer 50. Therefore, the support surface 51 of the soft resin layer 50 that supports the hard resin layer 40 is also divided by the first groove 31 and the second groove 32. The divided hard resin layers 40 are respectively supported by the divided support surfaces 51.
Since thefirst groove 31 and the second groove 32 are also formed in the soft resin layer 50, the rigidity of the soft resin layer 50 is lowered, and the polishing surface 30 is pressed against the curved surface of the object to be polished. The soft resin layer 50 is easily distorted according to the curved surface. In addition, since the support surface 51 that supports the hard resin layer 40 is divided, the binding force between the support surfaces 51 is reduced, and the divided hard resin layers 40 are easily displaced independently. . For this reason, the amount of displacement of the hard resin layer 50 in the contact direction increases, and the polishing surface 30 easily follows the curved surface of the object to be polished.
図4の(b)を参照する。第1溝31及び第2溝32の深さは、硬質の樹脂層40の厚さよりも深くてもよい。すなわち、第1溝31及び第2溝32は、硬質の樹脂層40及び軟質の樹脂層50に形成されていてもよい。したがって、硬質の樹脂層40を支持する軟質の樹脂層50の支持面51も第1溝31及び第2溝32によって分割される。分割された複数の硬質の樹脂層40は、分割された複数の支持面51によってそれぞれ支持される。
第1溝31及び第2溝32が軟質の樹脂層50にも形成されているので、軟質の樹脂層50の剛性が低下し、研磨面30が被研磨物の曲面に押し当てられた場合に、曲面に応じて軟質の樹脂層50が歪みやすくなる。また、硬質の樹脂層40を支持する支持面51が分割されていることにより、支持面51間の拘束力が低下して、分割された硬質の樹脂層40同士が独立して変位しやすくなる。このため、当接方向における硬質の樹脂層50の変位量が大きくなり、研磨面30が被研磨物の曲面に追従しやすくなる。 2-3. The second modification will be described with reference to FIG. The depth of the
Since the
2-4.第3変形例について
図5の(a)及び図5の(b)を参照する。研磨面30には、第1溝31のみが形成され、第2溝32が形成されていない。研磨面30に複数の第1溝31を形成することにより、研磨面30には溝がストライプ状に形成される。
第1溝31の深さは、硬質の樹脂層40の厚さよりも深くてもよい。すなわち、第1溝31は、硬質の樹脂層40及び軟質の樹脂層50に形成されていてもよい。したがって、硬質の樹脂層40を支持する軟質の樹脂層50の支持面51も第1溝31によって分割される。分割された複数の硬質の樹脂層40は、分割された複数の支持面51によってそれぞれ支持される。なお、第1溝31の深さは、硬質の樹脂層40の厚さと同じでも浅くてもよい。
第2溝32を省略して研磨面30にストライプ状の溝を形成することにより、研磨面の強度を向上することができ、かつ溝を形成する工数が低減され低コスト化に資する。また、硬質の樹脂層40にも第1溝31を形成することにより、第2の方向に延びる第2溝32を形成しないことによる研磨面30の追従性の低下を軽減する。 2-4. Regarding the third modification, reference is made to FIG. 5A and FIG. In the polishingsurface 30, only the first groove 31 is formed, and the second groove 32 is not formed. By forming a plurality of first grooves 31 on the polishing surface 30, the grooves are formed in a stripe shape on the polishing surface 30.
The depth of thefirst groove 31 may be deeper than the thickness of the hard resin layer 40. That is, the first groove 31 may be formed in the hard resin layer 40 and the soft resin layer 50. Therefore, the support surface 51 of the soft resin layer 50 that supports the hard resin layer 40 is also divided by the first groove 31. The divided hard resin layers 40 are respectively supported by the divided support surfaces 51. In addition, the depth of the 1st groove | channel 31 may be the same as that of the hard resin layer 40, or may be shallow.
By omitting thesecond groove 32 and forming a striped groove on the polishing surface 30, the strength of the polishing surface can be improved, and the number of steps for forming the groove can be reduced, contributing to cost reduction. In addition, by forming the first groove 31 in the hard resin layer 40, a decrease in followability of the polishing surface 30 due to the absence of the second groove 32 extending in the second direction is reduced.
図5の(a)及び図5の(b)を参照する。研磨面30には、第1溝31のみが形成され、第2溝32が形成されていない。研磨面30に複数の第1溝31を形成することにより、研磨面30には溝がストライプ状に形成される。
第1溝31の深さは、硬質の樹脂層40の厚さよりも深くてもよい。すなわち、第1溝31は、硬質の樹脂層40及び軟質の樹脂層50に形成されていてもよい。したがって、硬質の樹脂層40を支持する軟質の樹脂層50の支持面51も第1溝31によって分割される。分割された複数の硬質の樹脂層40は、分割された複数の支持面51によってそれぞれ支持される。なお、第1溝31の深さは、硬質の樹脂層40の厚さと同じでも浅くてもよい。
第2溝32を省略して研磨面30にストライプ状の溝を形成することにより、研磨面の強度を向上することができ、かつ溝を形成する工数が低減され低コスト化に資する。また、硬質の樹脂層40にも第1溝31を形成することにより、第2の方向に延びる第2溝32を形成しないことによる研磨面30の追従性の低下を軽減する。 2-4. Regarding the third modification, reference is made to FIG. 5A and FIG. In the polishing
The depth of the
By omitting the
3.研磨方法について
研磨パッド10を用いる研磨装置の構成や研磨方法は特に限定されるものではない。例えば、研磨パッド10は、ハンドポリッシャの先端に取り付けられて、曲面を有する被研磨物の表面を研磨する手作業に使用されてもよい。また、研磨パッド10は、以下に説明するような自動研磨装置による研磨処理に使用されてもよい。 3. Regarding Polishing Method The configuration of the polishing apparatus and the polishing method using thepolishing pad 10 are not particularly limited. For example, the polishing pad 10 may be attached to the tip of a hand polisher and used for manual work for polishing the surface of an object having a curved surface. Further, the polishing pad 10 may be used for polishing processing by an automatic polishing apparatus as described below.
研磨パッド10を用いる研磨装置の構成や研磨方法は特に限定されるものではない。例えば、研磨パッド10は、ハンドポリッシャの先端に取り付けられて、曲面を有する被研磨物の表面を研磨する手作業に使用されてもよい。また、研磨パッド10は、以下に説明するような自動研磨装置による研磨処理に使用されてもよい。 3. Regarding Polishing Method The configuration of the polishing apparatus and the polishing method using the
3-1.自動研磨装置の構成例
図6を参照する。自動研磨装置1は、ロボットアーム2と、研磨パッド10と、研磨工具4と、押付圧検出部5と、コントローラ7を備える。参照符号90は、被研磨物を示す。被研磨物90は、例えば、表面が樹脂塗装された自動車等の車体であってよい。ロボットアーム2は、複数の関節20、21及び22を有し、研磨パッド10、研磨工具4及び押付圧検出部5が取り付けられた先端部23を複数方向に移動させることができる。 3-1. Configuration Example of Automatic Polishing Device Reference is made to FIG. Theautomatic polishing apparatus 1 includes a robot arm 2, a polishing pad 10, a polishing tool 4, a pressing pressure detection unit 5, and a controller 7. Reference numeral 90 indicates an object to be polished. The object to be polished 90 may be a vehicle body such as an automobile whose surface is coated with resin. The robot arm 2 has a plurality of joints 20, 21, and 22, and can move a distal end portion 23 to which the polishing pad 10, the polishing tool 4, and the pressing pressure detection unit 5 are attached in a plurality of directions.
図6を参照する。自動研磨装置1は、ロボットアーム2と、研磨パッド10と、研磨工具4と、押付圧検出部5と、コントローラ7を備える。参照符号90は、被研磨物を示す。被研磨物90は、例えば、表面が樹脂塗装された自動車等の車体であってよい。ロボットアーム2は、複数の関節20、21及び22を有し、研磨パッド10、研磨工具4及び押付圧検出部5が取り付けられた先端部23を複数方向に移動させることができる。 3-1. Configuration Example of Automatic Polishing Device Reference is made to FIG. The
研磨工具4は、押付圧検出部5を介して先端部23に取り付けられ、内蔵する駆動手段により研磨面30に垂直な方向を回転軸として研磨パッド10を回転させる。コントローラ7は、ロボットアーム2の挙動と、研磨工具4による研磨パッド10の回転を制御する。図示しない研磨剤供給機構からは、研磨パッド10と被研磨物90との間に研磨剤が供給される。コントローラ7は、ロボットアーム2によって研磨パッド10を被研磨物90の表面に押付けて研磨パッド10を回転させることによって、被研磨物90の表面を研磨する。
The polishing tool 4 is attached to the tip portion 23 via the pressing pressure detection unit 5, and the polishing pad 10 is rotated about a direction perpendicular to the polishing surface 30 by a built-in driving means. The controller 7 controls the behavior of the robot arm 2 and the rotation of the polishing pad 10 by the polishing tool 4. A polishing agent is supplied between the polishing pad 10 and the workpiece 90 from a polishing agent supply mechanism (not shown). The controller 7 polishes the surface of the workpiece 90 by pressing the polishing pad 10 against the surface of the workpiece 90 by the robot arm 2 and rotating the polishing pad 10.
押付圧検出部5は、被研磨物90に対する研磨面30の押圧力を検出する。コントローラ7は、押付圧検出部5による検出結果に基づいて研磨面30を被研磨物90に押し付ける力の調整を行ってもよい。コントローラ7は、被研磨物90に対する研磨面30の押圧力を一定にしたまま、被研磨物90の表面を研磨面30が移動するようにロボットアーム2を制御してもよい。
The pressing pressure detector 5 detects the pressing force of the polishing surface 30 against the workpiece 90. The controller 7 may adjust the force for pressing the polishing surface 30 against the workpiece 90 based on the detection result by the pressing pressure detection unit 5. The controller 7 may control the robot arm 2 so that the polishing surface 30 moves on the surface of the workpiece 90 while keeping the pressing force of the polishing surface 30 against the workpiece 90 constant.
研磨パッド10による研磨の後に、微細な表面粗さ成分を取り除く場合には、表面粗さ成分を取り除くための2次研磨を行ってもよい。この場合には、研磨パッド10による研磨を行った後に、研磨工具4に取り付けられた研磨パッドを交換し、研磨パッド10よりも低い硬度を有する研磨パッドを用いて被研磨物90の表面を研磨する。
When removing a fine surface roughness component after polishing with the polishing pad 10, secondary polishing for removing the surface roughness component may be performed. In this case, after polishing with the polishing pad 10, the polishing pad attached to the polishing tool 4 is replaced, and the surface of the workpiece 90 is polished using a polishing pad having a hardness lower than that of the polishing pad 10. To do.
3-2.研磨剤について
上記の研磨方法において使用される研磨剤の例について説明する。
研磨剤としては、シリカ、アルミナ、セリア、チタニア、ジルコニア、酸化鉄及び酸化マンガン等のケイ素または金属元素の酸化物からなる粒子や、熱可塑性樹脂からなる有機粒子、又は有機無機複合粒子などから選ばれる砥粒を含むスラリーを用いることができる。
例えば研磨剤には、高研磨速度を可能にし、且つ容易に入手が可能であるアルミナスラリーを用いることが好ましい。
アルミナには、α-アルミナ、β-アルミナ、γ-アルミナ、θ-アルミナなどの結晶形態が異なるものがあり、また水和アルミナと呼ばれるアルミニウム化合物も存在する。研磨速度の観点からは、α-アルミナを主成分とするものが砥粒としてより好ましい。 3-2. About Abrasives Examples of abrasives used in the above polishing method will be described.
The abrasive is selected from particles made of oxides of silicon or metal elements such as silica, alumina, ceria, titania, zirconia, iron oxide and manganese oxide, organic particles made of thermoplastic resin, or organic-inorganic composite particles. A slurry containing abrasive grains can be used.
For example, for the abrasive, it is preferable to use an alumina slurry that enables a high polishing rate and is easily available.
Alumina includes those having different crystal forms such as α-alumina, β-alumina, γ-alumina, and θ-alumina, and an aluminum compound called hydrated alumina also exists. From the viewpoint of the polishing rate, those containing α-alumina as the main component are more preferred as the abrasive grains.
上記の研磨方法において使用される研磨剤の例について説明する。
研磨剤としては、シリカ、アルミナ、セリア、チタニア、ジルコニア、酸化鉄及び酸化マンガン等のケイ素または金属元素の酸化物からなる粒子や、熱可塑性樹脂からなる有機粒子、又は有機無機複合粒子などから選ばれる砥粒を含むスラリーを用いることができる。
例えば研磨剤には、高研磨速度を可能にし、且つ容易に入手が可能であるアルミナスラリーを用いることが好ましい。
アルミナには、α-アルミナ、β-アルミナ、γ-アルミナ、θ-アルミナなどの結晶形態が異なるものがあり、また水和アルミナと呼ばれるアルミニウム化合物も存在する。研磨速度の観点からは、α-アルミナを主成分とするものが砥粒としてより好ましい。 3-2. About Abrasives Examples of abrasives used in the above polishing method will be described.
The abrasive is selected from particles made of oxides of silicon or metal elements such as silica, alumina, ceria, titania, zirconia, iron oxide and manganese oxide, organic particles made of thermoplastic resin, or organic-inorganic composite particles. A slurry containing abrasive grains can be used.
For example, for the abrasive, it is preferable to use an alumina slurry that enables a high polishing rate and is easily available.
Alumina includes those having different crystal forms such as α-alumina, β-alumina, γ-alumina, and θ-alumina, and an aluminum compound called hydrated alumina also exists. From the viewpoint of the polishing rate, those containing α-alumina as the main component are more preferred as the abrasive grains.
砥粒の平均粒子径は0.1μm以上であることが好ましく、より好ましくは0.3μm以上である。平均粒子径が大きくなるにつれて、研磨速度は向上する。平均粒子径が上記の範囲内にある場合、研磨速度を実用上特に好適なレベルにまで向上させることが容易となる。
また、平均粒子径は、10.0μm以下であることが好ましく、より好ましくは5.0μm以下である。平均粒子径が小さくなるにつれて、研磨剤の分散安定性は向上し、研磨面のスクラッチ発生が抑制される。
平均粒子径が上記の範囲内にある場合、研磨剤の分散安定性と、研磨面の表面精度を実用上特に好適なレベルにまで向上させることが容易となる。なお、砥粒の平均粒子径は、細孔電気抵抗法(測定機:マルチサイザーIII型 ベックマン・コールター社製)により測定することができる。 The average particle diameter of the abrasive grains is preferably 0.1 μm or more, more preferably 0.3 μm or more. As the average particle size increases, the polishing rate improves. When the average particle diameter is within the above range, it becomes easy to improve the polishing rate to a particularly suitable level for practical use.
Moreover, it is preferable that an average particle diameter is 10.0 micrometers or less, More preferably, it is 5.0 micrometers or less. As the average particle size decreases, the dispersion stability of the abrasive improves, and the generation of scratches on the polished surface is suppressed.
When the average particle size is in the above range, it becomes easy to improve the dispersion stability of the abrasive and the surface accuracy of the polished surface to a particularly suitable level for practical use. The average particle diameter of the abrasive grains can be measured by a pore electrical resistance method (measuring instrument: Multisizer III type, manufactured by Beckman Coulter, Inc.).
また、平均粒子径は、10.0μm以下であることが好ましく、より好ましくは5.0μm以下である。平均粒子径が小さくなるにつれて、研磨剤の分散安定性は向上し、研磨面のスクラッチ発生が抑制される。
平均粒子径が上記の範囲内にある場合、研磨剤の分散安定性と、研磨面の表面精度を実用上特に好適なレベルにまで向上させることが容易となる。なお、砥粒の平均粒子径は、細孔電気抵抗法(測定機:マルチサイザーIII型 ベックマン・コールター社製)により測定することができる。 The average particle diameter of the abrasive grains is preferably 0.1 μm or more, more preferably 0.3 μm or more. As the average particle size increases, the polishing rate improves. When the average particle diameter is within the above range, it becomes easy to improve the polishing rate to a particularly suitable level for practical use.
Moreover, it is preferable that an average particle diameter is 10.0 micrometers or less, More preferably, it is 5.0 micrometers or less. As the average particle size decreases, the dispersion stability of the abrasive improves, and the generation of scratches on the polished surface is suppressed.
When the average particle size is in the above range, it becomes easy to improve the dispersion stability of the abrasive and the surface accuracy of the polished surface to a particularly suitable level for practical use. The average particle diameter of the abrasive grains can be measured by a pore electrical resistance method (measuring instrument: Multisizer III type, manufactured by Beckman Coulter, Inc.).
研磨剤中の砥粒の含有量は、好ましくは0.1質量%以上であり、より好ましくは0.2質量%以上であり、さらに好ましくは0.5質量%以上である。砥粒の含有量が多くなるにつれて、研磨速度は向上する。砥粒の含有量が上記の範囲内にある場合、研磨速度を実用上特に好適なレベルにまで向上させることが容易となる。
また、砥粒の含有量は、50質量%以下であることが好ましく、より好ましくは25質量%以下であり、さらに好ましくは20質量%である。砥粒の含有量が上記の範囲内にある場合、研磨剤のコストを抑えることができる。また、研磨剤を用いて研磨した後の研磨対象物の表面に表面欠陥が生じることをより抑えることができる。 The content of abrasive grains in the abrasive is preferably 0.1% by mass or more, more preferably 0.2% by mass or more, and further preferably 0.5% by mass or more. As the abrasive grain content increases, the polishing rate increases. When the content of the abrasive grains is within the above range, it becomes easy to improve the polishing rate to a particularly suitable level for practical use.
Moreover, it is preferable that content of an abrasive grain is 50 mass% or less, More preferably, it is 25 mass% or less, More preferably, it is 20 mass%. When the content of the abrasive grains is within the above range, the cost of the abrasive can be suppressed. Moreover, it can suppress more that a surface defect arises on the surface of the grinding | polishing target object after grind | polishing using an abrasive | polishing agent.
また、砥粒の含有量は、50質量%以下であることが好ましく、より好ましくは25質量%以下であり、さらに好ましくは20質量%である。砥粒の含有量が上記の範囲内にある場合、研磨剤のコストを抑えることができる。また、研磨剤を用いて研磨した後の研磨対象物の表面に表面欠陥が生じることをより抑えることができる。 The content of abrasive grains in the abrasive is preferably 0.1% by mass or more, more preferably 0.2% by mass or more, and further preferably 0.5% by mass or more. As the abrasive grain content increases, the polishing rate increases. When the content of the abrasive grains is within the above range, it becomes easy to improve the polishing rate to a particularly suitable level for practical use.
Moreover, it is preferable that content of an abrasive grain is 50 mass% or less, More preferably, it is 25 mass% or less, More preferably, it is 20 mass%. When the content of the abrasive grains is within the above range, the cost of the abrasive can be suppressed. Moreover, it can suppress more that a surface defect arises on the surface of the grinding | polishing target object after grind | polishing using an abrasive | polishing agent.
研磨剤は、上記砥粒の他、必要に応じて潤滑油、有機溶剤、界面活性剤、増粘材などの他の成分を適宜含んでもよい。
潤滑油は、合成油、鉱物油、植物性油脂又はそれらの組み合わせであってよい。
有機溶剤は、炭化水素系溶剤の他、アルコール、エーテル、グリコール類やグリセリン等であってよい。
界面活性剤は、いわゆるアニオン、カチオン、ノニオン、両性界面活性剤であってよい。
増粘材は、合成系増粘材、セルロース系増粘材、又は天然系増粘材であってよい。 The abrasive may appropriately contain other components such as a lubricating oil, an organic solvent, a surfactant, and a thickener as necessary in addition to the abrasive grains.
The lubricating oil may be a synthetic oil, mineral oil, vegetable oil or combination thereof.
The organic solvent may be alcohol, ether, glycols, glycerin or the like in addition to the hydrocarbon solvent.
The surfactant may be a so-called anion, cation, nonion, or amphoteric surfactant.
The thickener may be a synthetic thickener, a cellulose thickener, or a natural thickener.
潤滑油は、合成油、鉱物油、植物性油脂又はそれらの組み合わせであってよい。
有機溶剤は、炭化水素系溶剤の他、アルコール、エーテル、グリコール類やグリセリン等であってよい。
界面活性剤は、いわゆるアニオン、カチオン、ノニオン、両性界面活性剤であってよい。
増粘材は、合成系増粘材、セルロース系増粘材、又は天然系増粘材であってよい。 The abrasive may appropriately contain other components such as a lubricating oil, an organic solvent, a surfactant, and a thickener as necessary in addition to the abrasive grains.
The lubricating oil may be a synthetic oil, mineral oil, vegetable oil or combination thereof.
The organic solvent may be alcohol, ether, glycols, glycerin or the like in addition to the hydrocarbon solvent.
The surfactant may be a so-called anion, cation, nonion, or amphoteric surfactant.
The thickener may be a synthetic thickener, a cellulose thickener, or a natural thickener.
3-3.2次研磨について
2次研磨に用いる研磨パッドの硬度は、硬質の樹脂層40の硬度よりも低いことが好ましい。2次研磨に用いる研磨パッドの硬度は、例えば、A硬度で50度未満であることが好ましく、40度以下であることがより好ましい。また、2次研磨に用いる研磨パッドの硬度は、30度以上であることが好ましい。このような範囲であれば、被研磨物の表面の細かい表面粗さ成分を取り除くことが可能になる。
2次研磨に用いる研磨パッドの材質は特に限定されず、上記の硬度を有する材質であればよい。2次研磨に用いる研磨パッドの材質は、例えば、不織布又はスウェードであってよい。例えば、2次研磨に用いる研磨パッドの材質は、A硬度が30度以上40度以下のスウェードであってよい。 3-3. Secondary Polishing The hardness of the polishing pad used for the secondary polishing is preferably lower than the hardness of thehard resin layer 40. The hardness of the polishing pad used for secondary polishing is, for example, preferably less than 50 degrees in terms of A hardness, and more preferably 40 degrees or less. The hardness of the polishing pad used for secondary polishing is preferably 30 degrees or more. Within such a range, it becomes possible to remove fine surface roughness components on the surface of the object to be polished.
The material of the polishing pad used for the secondary polishing is not particularly limited as long as the material has the above hardness. The material of the polishing pad used for secondary polishing may be, for example, a nonwoven fabric or suede. For example, the material of the polishing pad used for the secondary polishing may be suede having an A hardness of 30 degrees to 40 degrees.
2次研磨に用いる研磨パッドの硬度は、硬質の樹脂層40の硬度よりも低いことが好ましい。2次研磨に用いる研磨パッドの硬度は、例えば、A硬度で50度未満であることが好ましく、40度以下であることがより好ましい。また、2次研磨に用いる研磨パッドの硬度は、30度以上であることが好ましい。このような範囲であれば、被研磨物の表面の細かい表面粗さ成分を取り除くことが可能になる。
2次研磨に用いる研磨パッドの材質は特に限定されず、上記の硬度を有する材質であればよい。2次研磨に用いる研磨パッドの材質は、例えば、不織布又はスウェードであってよい。例えば、2次研磨に用いる研磨パッドの材質は、A硬度が30度以上40度以下のスウェードであってよい。 3-3. Secondary Polishing The hardness of the polishing pad used for the secondary polishing is preferably lower than the hardness of the
The material of the polishing pad used for the secondary polishing is not particularly limited as long as the material has the above hardness. The material of the polishing pad used for secondary polishing may be, for example, a nonwoven fabric or suede. For example, the material of the polishing pad used for the secondary polishing may be suede having an A hardness of 30 degrees to 40 degrees.
2次研磨に用いる研磨パッドは、研磨パッド10と同様に2層構造を有していてもよい。すなわち、2次研磨に用いる研磨パッドは、研磨面を形成する比較的硬質な第1層と、第1層を支持する比較的軟質な第2層を含む2層構造を有していてもよい。
第1層の硬度は、研磨パッド10の硬質の樹脂層40の硬度よりも低いことが好ましい。第1層の硬度は、例えば、A硬度で50度未満であることが好ましく、40度以下であることがより好ましい。また、第1層の硬度は、30度以上であることが好ましい。 The polishing pad used for the secondary polishing may have a two-layer structure like thepolishing pad 10. That is, the polishing pad used for secondary polishing may have a two-layer structure including a relatively hard first layer that forms a polishing surface and a relatively soft second layer that supports the first layer. .
The hardness of the first layer is preferably lower than the hardness of thehard resin layer 40 of the polishing pad 10. For example, the hardness of the first layer is preferably less than 50 degrees in terms of A hardness, and more preferably 40 degrees or less. The hardness of the first layer is preferably 30 degrees or more.
第1層の硬度は、研磨パッド10の硬質の樹脂層40の硬度よりも低いことが好ましい。第1層の硬度は、例えば、A硬度で50度未満であることが好ましく、40度以下であることがより好ましい。また、第1層の硬度は、30度以上であることが好ましい。 The polishing pad used for the secondary polishing may have a two-layer structure like the
The hardness of the first layer is preferably lower than the hardness of the
第1層の厚さは、3.0mm以下であることが好ましい。また、第1層の厚さは0.5mm以上であることが好ましい。このような範囲であれば、研磨面が被研磨物の曲面に押し当てられた場合に第1層が被研磨物の曲面に沿って撓みやすくなり、研磨面と曲面との接触面積が増えて研磨効率が向上する。
第1層の材質は特に限定されず、上記の硬度を有する材質であればよい。第1層の材質は、例えば、不織布又はスウェードであってよい。例えば、第1層の材質は、A硬度が30度以上40度以下のスウェードであってよい。
第2層の構成は、研磨パッド10の軟質の樹脂層50の構成と同様であってよい。
2次研磨に用いる研磨パッドの研磨面にも、第2実施形態に係る研磨パッド10と同様に溝が形成されてもよい。 The thickness of the first layer is preferably 3.0 mm or less. Also, the thickness of the first layer is preferably 0.5 mm or more. In such a range, when the polishing surface is pressed against the curved surface of the object to be polished, the first layer is easily bent along the curved surface of the object to be polished, and the contact area between the polishing surface and the curved surface increases. Polishing efficiency is improved.
The material of the first layer is not particularly limited as long as the material has the above hardness. The material of the first layer may be a non-woven fabric or suede, for example. For example, the material of the first layer may be suede having an A hardness of 30 degrees or more and 40 degrees or less.
The configuration of the second layer may be the same as the configuration of thesoft resin layer 50 of the polishing pad 10.
Grooves may be formed on the polishing surface of the polishing pad used for the secondary polishing as in thepolishing pad 10 according to the second embodiment.
第1層の材質は特に限定されず、上記の硬度を有する材質であればよい。第1層の材質は、例えば、不織布又はスウェードであってよい。例えば、第1層の材質は、A硬度が30度以上40度以下のスウェードであってよい。
第2層の構成は、研磨パッド10の軟質の樹脂層50の構成と同様であってよい。
2次研磨に用いる研磨パッドの研磨面にも、第2実施形態に係る研磨パッド10と同様に溝が形成されてもよい。 The thickness of the first layer is preferably 3.0 mm or less. Also, the thickness of the first layer is preferably 0.5 mm or more. In such a range, when the polishing surface is pressed against the curved surface of the object to be polished, the first layer is easily bent along the curved surface of the object to be polished, and the contact area between the polishing surface and the curved surface increases. Polishing efficiency is improved.
The material of the first layer is not particularly limited as long as the material has the above hardness. The material of the first layer may be a non-woven fabric or suede, for example. For example, the material of the first layer may be suede having an A hardness of 30 degrees or more and 40 degrees or less.
The configuration of the second layer may be the same as the configuration of the
Grooves may be formed on the polishing surface of the polishing pad used for the secondary polishing as in the
4.実施例
厚さ1.5mm、材質ポリウレタン発泡体及びA硬度90の硬質の樹脂層と、厚さ30.0mm、材質ポリウレタン発泡体及びE硬度20の軟質の樹脂層とを積層して研磨パッドを形成し、樹脂塗装面の研磨を行った。硬質の樹脂層には、幅2.0mm、ピッチ20.0mm、深さ3.0mmの格子状の溝を、2層構造を形成した後に高速回転する円形の切刃を所定量パッドに押し当てながら表面を走査することによって形成した。また、研磨剤としては、アルミナスラリーを使用した。
その結果、算術平均うねり(Wa)が0.05μm以下であり、ろ波最大うねり(Wcm)が0.3μm以下である平坦な光沢面の仕上がりを実現することができた。 4). Example A polishing pad is formed by laminating a 1.5 mm thick polyurethane foam material and a hard resin layer having an A hardness of 90, and a 30.0 mm thick polyurethane resin material and a soft resin layer having an E hardness of 20 layers. After forming, the resin coating surface was polished. On the hard resin layer, a grid-shaped groove having a width of 2.0 mm, a pitch of 20.0 mm, and a depth of 3.0 mm is pressed against a pad by a predetermined amount of a circular cutting blade that rotates at a high speed after forming a two-layer structure. It was formed by scanning the surface. Moreover, an alumina slurry was used as the abrasive.
As a result, it was possible to realize a finished flat glossy surface having an arithmetic average waviness (Wa) of 0.05 μm or less and a filtered maximum waviness (Wcm) of 0.3 μm or less.
厚さ1.5mm、材質ポリウレタン発泡体及びA硬度90の硬質の樹脂層と、厚さ30.0mm、材質ポリウレタン発泡体及びE硬度20の軟質の樹脂層とを積層して研磨パッドを形成し、樹脂塗装面の研磨を行った。硬質の樹脂層には、幅2.0mm、ピッチ20.0mm、深さ3.0mmの格子状の溝を、2層構造を形成した後に高速回転する円形の切刃を所定量パッドに押し当てながら表面を走査することによって形成した。また、研磨剤としては、アルミナスラリーを使用した。
その結果、算術平均うねり(Wa)が0.05μm以下であり、ろ波最大うねり(Wcm)が0.3μm以下である平坦な光沢面の仕上がりを実現することができた。 4). Example A polishing pad is formed by laminating a 1.5 mm thick polyurethane foam material and a hard resin layer having an A hardness of 90, and a 30.0 mm thick polyurethane resin material and a soft resin layer having an E hardness of 20 layers. After forming, the resin coating surface was polished. On the hard resin layer, a grid-shaped groove having a width of 2.0 mm, a pitch of 20.0 mm, and a depth of 3.0 mm is pressed against a pad by a predetermined amount of a circular cutting blade that rotates at a high speed after forming a two-layer structure. It was formed by scanning the surface. Moreover, an alumina slurry was used as the abrasive.
As a result, it was possible to realize a finished flat glossy surface having an arithmetic average waviness (Wa) of 0.05 μm or less and a filtered maximum waviness (Wcm) of 0.3 μm or less.
ここに記載されている全ての例及び条件的な用語は、読者が、本発明と技術の進展のために発明者により与えられる概念とを理解する際の助けとなるように、教育的な目的を意図したものであり、具体的に記載されている上記の例及び条件、並びに本発明の優位性及び劣等性を示すことに関する本明細書における例の構成に限定されることなく解釈されるべきものである。本発明の実施例は詳細に説明されているが、本発明の精神及び範囲から外れることなく、様々な変更、置換及び修正をこれに加えることが可能であると解すべきである。
All examples and conditional terms contained herein are intended for educational purposes only to assist the reader in understanding the present invention and the concepts provided by the inventor for the advancement of technology. And should not be construed as being limited to the examples and conditions set forth above, as well as the configuration of the examples herein with respect to showing the superiority and inferiority of the present invention. Is. While embodiments of the present invention have been described in detail, it should be understood that various changes, substitutions and modifications can be made thereto without departing from the spirit and scope of the present invention.
1 自動研磨装置
2 ロボットアーム
4 研磨工具
5 押付圧検出部
7 コントローラ
10 研磨パッド
30 研磨面
31 第1溝
32 第2溝
40 硬質の樹脂層
50 軟質の樹脂層
51 支持面 DESCRIPTION OFSYMBOLS 1 Automatic grinder 2 Robot arm 4 Polishing tool 5 Pressing pressure detection part 7 Controller 10 Polishing pad 30 Polishing surface 31 1st groove | channel 32 2nd groove | channel 40 Hard resin layer 50 Soft resin layer 51 Support surface
2 ロボットアーム
4 研磨工具
5 押付圧検出部
7 コントローラ
10 研磨パッド
30 研磨面
31 第1溝
32 第2溝
40 硬質の樹脂層
50 軟質の樹脂層
51 支持面 DESCRIPTION OF
Claims (5)
- 硬質の樹脂層で形成される研磨面を有し、前記研磨面を被研磨物の曲面に追従させる構造を備える研磨パッド。 A polishing pad having a polishing surface formed of a hard resin layer and having a structure in which the polishing surface follows the curved surface of an object to be polished.
- 前記研磨面を前記被研磨物の前記曲面に追従させる前記構造は、前記硬質の樹脂層を支持する軟質の樹脂層と、前記硬質の樹脂層と、を含む2層構造であることを特徴とする請求項1に記載の研磨パッド。 The structure that causes the polished surface to follow the curved surface of the object to be polished is a two-layer structure including a soft resin layer that supports the hard resin layer and the hard resin layer. The polishing pad according to claim 1.
- 前記研磨面には、溝が形成されていることを特徴とする請求項1又は2に記載の研磨パッド。 The polishing pad according to claim 1 or 2, wherein a groove is formed on the polishing surface.
- 前記溝は、前記硬質の樹脂層を複数に分割することを特徴とする請求項3に記載の研磨パッド。 The polishing pad according to claim 3, wherein the groove divides the hard resin layer into a plurality of parts.
- 前記溝が、前記軟質の樹脂層にも形成されていることを特徴とする請求項4に記載の研磨パッド。 The polishing pad according to claim 4, wherein the groove is also formed in the soft resin layer.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201580045399.8A CN106660190A (en) | 2014-08-27 | 2015-07-30 | Polishing pad |
EP15837016.3A EP3195979A4 (en) | 2014-08-27 | 2015-07-30 | Polishing pad |
US15/504,793 US20170252892A1 (en) | 2014-08-27 | 2015-07-30 | Polishing pad |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014-172978 | 2014-08-27 | ||
JP2014172978A JP2016047566A (en) | 2014-08-27 | 2014-08-27 | Polishing pad |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2016031143A1 true WO2016031143A1 (en) | 2016-03-03 |
Family
ID=55399064
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2015/003854 WO2016031143A1 (en) | 2014-08-27 | 2015-07-30 | Polishing pad |
Country Status (6)
Country | Link |
---|---|
US (1) | US20170252892A1 (en) |
EP (1) | EP3195979A4 (en) |
JP (1) | JP2016047566A (en) |
CN (1) | CN106660190A (en) |
TW (1) | TW201628786A (en) |
WO (1) | WO2016031143A1 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3421174B1 (en) | 2016-02-26 | 2023-08-09 | Fujimi Incorporated | Polishing method |
TW202023805A (en) * | 2018-09-28 | 2020-07-01 | 日商福吉米股份有限公司 | Polishing pad, and polishing method using same |
USD1004393S1 (en) * | 2021-11-09 | 2023-11-14 | Ehwa Diamond Industrial Co., Ltd. | Grinding pad |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11156699A (en) * | 1997-11-25 | 1999-06-15 | Speedfam Co Ltd | Surface polishing pad |
JP2001038589A (en) * | 1999-08-03 | 2001-02-13 | Speedfam Co Ltd | Polishing device for outer peripheral part of work |
JP2002283220A (en) * | 2001-03-23 | 2002-10-03 | Nippon Electric Glass Co Ltd | Polishing device for glass articles |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5212910A (en) * | 1991-07-09 | 1993-05-25 | Intel Corporation | Composite polishing pad for semiconductor process |
AU734883B2 (en) * | 1997-04-30 | 2001-06-21 | Minnesota Mining And Manufacturing Company | Method of planarizing the upper surface of a semiconductor wafer |
TWI228768B (en) * | 2002-08-08 | 2005-03-01 | Jsr Corp | Processing method of polishing pad for semiconductor wafer and polishing pad for semiconductor wafer |
JP2005131720A (en) * | 2003-10-29 | 2005-05-26 | Toray Ind Inc | Method of manufacturing polishing pad |
US7169029B2 (en) * | 2004-12-16 | 2007-01-30 | 3M Innovative Properties Company | Resilient structured sanding article |
JP2008062367A (en) * | 2006-09-11 | 2008-03-21 | Nec Electronics Corp | Polishing device, polishing pad, and polishing method |
JP5292958B2 (en) * | 2007-07-18 | 2013-09-18 | 東レ株式会社 | Polishing pad |
US9114501B2 (en) * | 2011-07-15 | 2015-08-25 | Toray Industries, Inc. | Polishing pad |
CN103782372A (en) * | 2011-09-15 | 2014-05-07 | 东丽株式会社 | Polishing pad |
JP6188286B2 (en) * | 2012-07-13 | 2017-08-30 | スリーエム イノベイティブ プロパティズ カンパニー | Polishing pad and glass, ceramics, and metal material polishing method |
TWI516373B (en) * | 2014-01-17 | 2016-01-11 | 三芳化學工業股份有限公司 | Polishing pad, polishing apparatus and method for manufacturing polishing pad |
JP2015150635A (en) * | 2014-02-13 | 2015-08-24 | 株式会社東芝 | Polishing cloth and method for manufacturing polishing cloth |
TWI597125B (en) * | 2014-09-25 | 2017-09-01 | 三芳化學工業股份有限公司 | Polishing pad and method for making the same |
US9630293B2 (en) * | 2015-06-26 | 2017-04-25 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad composite polishing layer formulation |
-
2014
- 2014-08-27 JP JP2014172978A patent/JP2016047566A/en active Pending
-
2015
- 2015-07-30 WO PCT/JP2015/003854 patent/WO2016031143A1/en active Application Filing
- 2015-07-30 CN CN201580045399.8A patent/CN106660190A/en active Pending
- 2015-07-30 US US15/504,793 patent/US20170252892A1/en not_active Abandoned
- 2015-07-30 EP EP15837016.3A patent/EP3195979A4/en not_active Withdrawn
- 2015-08-20 TW TW104127178A patent/TW201628786A/en unknown
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11156699A (en) * | 1997-11-25 | 1999-06-15 | Speedfam Co Ltd | Surface polishing pad |
JP2001038589A (en) * | 1999-08-03 | 2001-02-13 | Speedfam Co Ltd | Polishing device for outer peripheral part of work |
JP2002283220A (en) * | 2001-03-23 | 2002-10-03 | Nippon Electric Glass Co Ltd | Polishing device for glass articles |
Non-Patent Citations (1)
Title |
---|
See also references of EP3195979A4 * |
Also Published As
Publication number | Publication date |
---|---|
CN106660190A (en) | 2017-05-10 |
TW201628786A (en) | 2016-08-16 |
JP2016047566A (en) | 2016-04-07 |
EP3195979A4 (en) | 2017-09-20 |
US20170252892A1 (en) | 2017-09-07 |
EP3195979A1 (en) | 2017-07-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2016031142A1 (en) | Tool and method for polishing member having curved surface shape | |
US9321184B2 (en) | Blade sharpening system for a log saw machine | |
JP5210952B2 (en) | Polishing pad | |
US9089943B2 (en) | Composite pads for buffing and polishing painted vehicle body surfaces and other applications | |
CN102049723B (en) | Method for polishing semiconductor wafer | |
JP6100541B2 (en) | Polishing method | |
WO2016031143A1 (en) | Polishing pad | |
US11498182B2 (en) | Polishing method and polishing pad | |
US6656818B1 (en) | Manufacturing process for semiconductor wafer comprising surface grinding and planarization or polishing | |
JP4688456B2 (en) | Chemical mechanical polishing equipment | |
JP6693768B2 (en) | Polishing method | |
JP7420728B2 (en) | Polishing pad and polishing method using it | |
CN109202609A (en) | A kind of five axis level pressure grinding apparatus | |
US9687964B2 (en) | Polishing pad with hybrid cloth and foam surface | |
WO2022181787A1 (en) | Polishing pad, and polishing method | |
US20220080556A1 (en) | Grinding wheel and method of manufacturing grinding wheel | |
JP2024040072A (en) | buff for polishing | |
FUJIMOTO et al. | 0806 High-speed constant-pressure grinding characteristics of PCD with diamond grinding wheel | |
TWM548649U (en) | Turntable base structure of grinder | |
JPH0698558B2 (en) | Polishing method |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 15837016 Country of ref document: EP Kind code of ref document: A1 |
|
WWE | Wipo information: entry into national phase |
Ref document number: 15504793 Country of ref document: US |
|
REEP | Request for entry into the european phase |
Ref document number: 2015837016 Country of ref document: EP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2015837016 Country of ref document: EP |
|
NENP | Non-entry into the national phase |
Ref country code: DE |