WO2016027913A1 - Led lamp - Google Patents

Led lamp Download PDF

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Publication number
WO2016027913A1
WO2016027913A1 PCT/KR2014/007701 KR2014007701W WO2016027913A1 WO 2016027913 A1 WO2016027913 A1 WO 2016027913A1 KR 2014007701 W KR2014007701 W KR 2014007701W WO 2016027913 A1 WO2016027913 A1 WO 2016027913A1
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WO
WIPO (PCT)
Prior art keywords
led
heat
heat sink
heat dissipation
led lamp
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Application number
PCT/KR2014/007701
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French (fr)
Korean (ko)
Inventor
김대환
Original Assignee
주식회사 케이아이그리드
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Application filed by 주식회사 케이아이그리드 filed Critical 주식회사 케이아이그리드
Priority to PCT/KR2014/007701 priority Critical patent/WO2016027913A1/en
Priority to JP2017529959A priority patent/JP6483828B2/en
Publication of WO2016027913A1 publication Critical patent/WO2016027913A1/en

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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems

Definitions

  • the present invention relates to an LED lamp, and more particularly to an LED lamp having a heat dissipation structure that maximizes air convection regardless of the installation posture.
  • LED lamps have been developed that can replace discharge lamps such as compact fluorescent lamps, mercury lamps, and metal halide lamps.
  • LED lamps have a heat sink around the substrate on which the LED is mounted in order to dissipate heat generated during light emission.
  • a single heat sink is used, most LED lamps have limitations in improving light efficiency and extending service life.
  • the conventional LED lamp is provided with a heat sink around the substrate, for example, the back of the substrate, the LED is mounted as described above, so that the heat generated from the substrate through the heat sink is smoothly discharged upward by the convection
  • the direction of irradiation of light is limited to the ground.
  • Patent Document 1 KR10-0968270 B1
  • an object of the present invention is to provide a heat dissipation fins radially projecting on the outer circumference of the hollow cylindrical body of the heat-coupled LED tube of the central heat sink It is arranged in the shape of a pillar of an ear which winds up the lead thread while forming a heat dissipation gap at a predetermined interval by being coupled to each heat dissipation fin, and restricting the length of the central heat sink smaller than the length of the LED tube to the inside of the LED lamp. It is to provide an LED lamp having a heat dissipation structure that maximizes air convection irrespective of the installation posture by securing a space that is open in all directions through the heat dissipation gaps to smooth air convection.
  • Another object of the present invention is a light distribution characteristic of irradiating light in all directions except for the base terminal coupled to the lower socket is coupled to the lamp socket is coupled to the lower portion of the LED tube (for example, 240 ° It is to provide an LED lamp having a beam angle).
  • Still another object of the present invention is a base coupled to the inside of the converter housing accommodating the AC-DC converter for generating the driving power of the LED mounted on the LED tubes and the lower substrate and the converter housing and to the lamp socket at the end. It is to provide an LED lamp that is fully charged with heat dissipating silicon inside the base housing to which the terminals are fastened.
  • the LED lamp according to the present invention is a heat-conductive plastic (for example, polycarbonate) material, a bar plate mounted with a plurality of LEDs arranged along the length of the rod heat sink is accommodated A plurality of rod-shaped LED tubes coupled; Radiating fins protrude radially on the outer circumference of the hollow cylindrical body, the LED tubes are coupled to each of the radiating fins are arranged and fixed in the shape of a pillar of the winding winding the yarn thread while forming a radiating gap at a predetermined interval,
  • the length of the LED tube smaller than the length of the LED tube to form a heat dissipation structure to ensure a space for opening the air in all directions through the heat dissipation gaps inside the LED lamp to facilitate the air convection occurs when the LED tube is emitted
  • a central heat sink for dissipating heat An upper substrate connected to the upper portions of the LED tubes to supply power; An upper heat sink coupled to the upper substrate to emit
  • LED lamp according to the present invention is the heat dissipation and waterproof and sealed by the sealing cap of the lower end of the LED tube, the upper end of the LED tube is filled in the recess in the state accommodated in the recess formed in the upper heat sink It is characterized in that the heat dissipation and waterproof and sealed by the heat dissipation silicon.
  • the LED lamp according to the present invention is characterized in that the inside of the converter housing and the base housing are completely filled with heat dissipating silicon to be radiated, waterproofed, and sealed.
  • the heat generated when the LEDs of the LED tubes and the lower substrate emit light is emitted through a plurality of rod heat sinks, a central heat sink, an upper heat sink, and a lower heat sink in all directions.
  • the heat dissipation maximizes heat dissipation because it facilitates air convection.
  • the heat dissipation gap between the LED tubes and the inner space of the LED lamps communicates with each other, which maximizes heat dissipation regardless of the installation position of the LED lamp. Can be.
  • the present invention is excellent in waterproof performance because both the LED tube and the LED of the lower substrate is sealed.
  • FIG. 1 is a perspective view of an LED lamp according to the present invention.
  • FIG. 2 is an exploded perspective view of FIG.
  • FIG. 3 is an exploded perspective view of the LED tube assembly shown in FIG.
  • FIG. 4 is a cross-sectional view of the LED tube shown in FIG.
  • FIG. 5 is a perspective view showing a state in which the upper end of each substrate of the LED tube is welded to the upper substrate.
  • FIG. 6 is a cutaway view showing a state where the inside of the recess of the upper heat sink is filled with heat dissipation silicon;
  • FIG. 7 is a cutaway view showing a state in which the inside of the converter housing and the inside of the base housing are completely filled with heat dissipating silicon.
  • FIG 8 is a first embodiment showing a state of use of the LED lamp according to the present invention.
  • FIG. 9 is a second embodiment showing the state of use of the LED lamp according to the present invention.
  • FIG. 10 is a third embodiment showing the state of use of the LED lamp according to the present invention.
  • the LED lamp 100 includes a plurality of LED tubes 110 having a rod shape, a central heat sink 120, an upper substrate 130, and an upper heat sink 140. , A lower heat sink 150, a heat conduction plate 160, a lower substrate 170, a lower substrate cover 180, a converter housing 190, and a base housing 190a.
  • LED lamp 100 is the power supply line drawn from the converter housing 190 is the central heat sink 120, the upper substrate 130, the upper heat sink 140, the lower heat sink 150, A plurality of LED tubes 110 and lower substrates 170 connected to the upper substrate 130 and the lower substrate 170 through the heat conduction plate 160 and connected to the upper substrate 130. Supply driving power of LEDs.
  • the LED tube 110 is made of a thermally conductive plastic (eg, polycarbonate), and includes a bar plate 111 mounted with a plurality of LEDs arranged along a length thereof, and a bar heat sink 112 is coupled thereto.
  • a thermally conductive plastic eg, polycarbonate
  • the LED tube 110 is provided with a reflective sheet (110a) to reflect and diffuse the light emitted by the LED on the inner surface.
  • the LED tube 110 is formed with a substrate groove 110b for fixing the bar plate 111 inside the rear surface of the LED tube 110 and a heat sink groove 110c for inserting the bar heat sink 112 on the outside of the rear surface of the LED tube 110. ) Is formed.
  • An upper end of the bar plate 111 is welded to the upper substrate 130 in an exposed state on the upper surface of the upper substrate 130.
  • the pillar shape of the ear winding the yarn thread along the upper surface of the upper substrate 130 during the LED lamp 100 assembly process The assembly of the LED tube 110, which is disposed and fixed, may be facilitated and the assembly time may be shortened.
  • the lower end of the LED tube 110 has a convex surface on the outside and heat dissipation, waterproofing and sealing as the sealing cap 110d made of a thermally conductive plastic (eg, polycarbonate) is bonded by ultrasonic bonding.
  • a thermally conductive plastic eg, polycarbonate
  • a part of the outer surface of the sealing cap 110d is formed as a flat portion 110d-1 for providing a space in which the heat conductive plate 160 is disposed.
  • the heat conduction is applied to the lower heatsink 150 coupled to the lower end of the LED tube 110 to which the sealing cap 110d is bonded during the LED lamp 100 assembly process.
  • the heat conduction plate 160 is caught on a convex surface that is connected to the flat portion 110d-1 of the sealing cap 110d, thereby preventing the detachment. It may be disposed and coupled to the lower heat sink 150.
  • the bar heat sink 112 is formed on both sides of the projection 112a is fitted into the heat sink groove (110c) formed on the outside of the rear surface of the LED tube 110, the cylindrical ventilation opening one side in the center portion along the length
  • the groove 112b is formed, and the heat dissipation fin 121 of the central heat sink 120 is fitted into the vent groove 112b, and the upper heat sink 140 and the lower heat sink 150 are screwed together. do.
  • the central heat sink 120 has radially radiating fins 121 protruding from the outer circumference of the hollow cylindrical body, and the distal end of the heat dissipating fin 121 is fitted into the vent groove 112b of the bar heat sink 112. It is fixed.
  • the central heat sink 120 is arranged and fixed in the shape of a pillar of an ear to wind the lead thread while forming a heat dissipation gap at a predetermined interval by coupling the LED tubes 110 to each heat dissipation fin 121.
  • the length of the central heat sink 120 is limited to the length range of 1/5 to 3/5 of the length of the LED tube 110 in order to form a heat dissipation structure to secure a sufficient space inside the LED lamp 100. Most preferably.
  • the LED tubes 110 fixed to the heat dissipation fins 121 of the center heat sink 120 are sufficiently supported. There is a drawback to not doing it.
  • the LED tubes 110 fixed to the heat dissipation fins 121 of the center heat sink 120 are sufficiently provided. Although it can support, there is a disadvantage that the space formed inside the LED lamp 100 does not facilitate the air convection.
  • the upper substrate 130 is connected to the upper portions of the LED tubes 110 to supply power, and as described above, a power supply line is connected to supply driving power to the LED tubes 110.
  • the upper heat sink 140 is coupled to the upper substrate 130 to emit heat generated when the LED tubes 110 emit light and heat generated by the converter housing 190.
  • the upper heat sink 140 has a central through hole 141 formed therein, and a screw that is fastened to a vent groove 112 b formed in a cylindrical shape having one side open at a central portion thereof along the length of the rod heat sink 112. Screw bosses 142 are formed at predetermined intervals along the edge of the central through hole 141.
  • the upper heat sink 140 has a predetermined depth between each upper end of the upper substrate 130 and the LED tubes 110 between the center through hole 141 and the edge of the side surface coupled with the upper substrate 130.
  • the recessed part 143 accommodated is formed.
  • the upper heat sink 140 is the inside of the concave portion 141 is completely filled with heat dissipation silicon is heat dissipation, waterproof and sealed treatment.
  • the upper heat sink 140 has heat dissipation fins 144 protruding from the side opposite to the upper substrate 130.
  • the lower heat sink 150 is coupled to the lower portions of the LED tubes 110 to emit heat generated when the LED tubes 110 emit light and heat generated when the LEDs of the lower substrate 170 emit light.
  • the lower heat sink 150 has a central through hole 151 formed therein, and a screw fastened to a vent groove 112 b formed in a cylindrical shape having one side open at a central portion thereof along the length of the rod heat sink 112. Screw holes 152 are formed at predetermined intervals along the edge.
  • the lower heat sink 150 has heat dissipation fins 153 protruding from the side surfaces of the lower heat sink 150.
  • the lower heatsink 150 has screw bosses 154 to which screws for coupling the heat conduction plate 160 are protruded at predetermined intervals on opposite sides coupled with the LED tubes 110.
  • the thermal conductive plate 160 is made of a thermally conductive plastic (eg, polycarbonate) and is coupled to the lower heat sink 150 to transfer heat generated when the LEDs of the lower substrate 170 emit light to the lower heat sink 150. Evangelize.
  • a thermally conductive plastic eg, polycarbonate
  • the lower substrate 170 is fixed on the heat conduction plate 160 and has a plurality of LEDs mounted thereon.
  • the lower substrate cover 180 is made of a thermally conductive plastic (eg, polycarbonate) and is hermetically bonded to the thermal conductive plate 160 by ultrasonic bonding to cover the lower substrate 170, and to radiate, waterproof, and seal the lower substrate.
  • the LEDs of the substrate 170 diffuse the light emitted.
  • the lower substrate cover 180 has a convex surface on the outside thereof, and the concave portion 181 formed at the center thereof emits light emitted from the LEDs of the lower substrate 170 such that the light spots of the LEDs of the lower substrate 170 are not visible. Focus and spread to prevent glare.
  • the converter housing 190 accommodates an AC-DC converter that generates driving power for the LEDs mounted on the LED tubes 110 and the lower substrate 170 and is coupled to the upper heat sink 140.
  • the base housing 190a is coupled to the converter housing 190 and the base terminal 191a coupled to the lamp socket at the end is fastened.
  • the lamp socket is a socket to which the base terminal 191a is coupled in a screw manner, and may be easily understood to those skilled in the art without exemplifying a specific structure.
  • the inside of the converter housing 190 and the inside of the base housing 190a are completely filled with heat-dissipating silicon to be heat-dissipated, waterproofed, and sealed.
  • the converter housing 190 and the base housing 190a are preferably screwed together. For example, they are coupled to each other by screws passing through a screw hole (not shown) of the converter housing 190 and a screw boss (not shown) of the base housing 190a.
  • the screw penetrating the screw hole (not shown in the drawing identification number) of the converter housing 190 protrudes along with the heat dissipation fins 144 on the opposite side that is coupled to the upper substrate 130 of the upper heat sink 140.
  • the converter housing 190 is coupled to the upper heatsink 140 by being fastened to a screw boss (not shown).
  • LED lamp 100 configured as described above operates as follows.
  • the AC-DC converter As the base terminal 191a of the LED lamp 100 is coupled to the lamp socket, when AC power is applied to the AC-DC converter inside the converter housing 190, the AC-DC converter is connected to the AC.
  • the power is converted into a driving power of a plurality of LEDs mounted on the plurality of LED tubes 110 and the lower substrate 170 to the plurality of LED tubes 110 and the lower substrate 170 through the power supply line. It is supplied by a plurality of mounted LEDs.
  • the LED lamp 100 when a plurality of LEDs mounted on the plurality of LED tubes 110 and the lower substrate 170 emit light, the LED lamp 100 except for the base terminal 101 coupled to the lamp socket. The light was radiated in all the remaining directions, and the measured light distribution showed a beam angle of more than 240 °.
  • the heat generated while the plurality of LEDs mounted on the plurality of LED tubes 110 and the lower substrate 170 emit light is the plurality of bar heat sinks 112 and the center heat sinks 120, It is discharged through the upper heat sink 140, and the lower heat sink 150.
  • the heat emitted through the plurality of rod heat sink 112, the central heat sink 120, the upper heat sink 140, and the lower heat sink 150 is formed in the interior of the LED lamp 100
  • the LED lamp 110 is discharged out of the LED lamp 100 by the air convection smoothly made in all directions through the heat dissipation gap formed between the LED tube (110).
  • the heat generated by the AC-DC converter inside the converter housing 190 when the LED lamp 100 emits light may be caused by the heat dissipation silicon completely charged in the converter housing 190. Is conducted and released.
  • the LED lamp 100 has a heat dissipation structure formed between the LED tube 110 and the inner space of the LED lamp 100 through the heat dissipation structure and the installation posture of the LED lamp 100 and Regardless of the heat dissipation can be maximized.
  • FIG. 8 is an embodiment showing the use state of the LED lamp 100 is installed so that the irradiation direction of light toward the ground. As shown in FIG. 8, as shown by arrows, air convection is smoothly performed by heat dissipation structures in which the inner spaces of the LED lamp 100 communicate with each other, thereby maximizing heat dissipation generated when the LED lamp 100 emits light. It can be seen that.
  • FIG. 9 is an embodiment showing the use state of the LED lamp 100 is installed so that the irradiation direction of light toward the horizontal line. As shown in FIG. 9, as shown by arrows, air convection is smoothly performed by heat dissipation structures in which the inner spaces of the LED lamp 100 communicate with each other, thereby maximizing heat dissipation generated when the LED lamp 100 emits light. It can be seen that.
  • FIG. 10 is an embodiment showing the use state of the LED lamp 100 is installed so that the light irradiation direction toward the ground. As shown in FIG. 10, air convection is smoothly performed by the heat dissipation structure in which the inner spaces of the LED lamp 100 communicate with each other, thereby maximizing heat dissipation generated when the LED lamp 100 emits light. It can be seen that.
  • LED lamp 110 LED tube
  • Vents 112b ventilation groove 120: central heat sink
  • heat sink fin 150 lower heat sink
  • converter housing 190a base housing

Abstract

The present invention relates to an LED lamp that has a heat dissipation structure in which bar-shaped LED tubes having heat sinks coupled thereto are coupled to respective heat dissipation fins of a central heat sink, which radially protrude from the outer peripheral surface of a hollow cylindrical body thereof, so as to be disposed in the shape of a pillar of a reel, on which a thread of a kite is wound, while forming gaps for heat dissipation therebetween at a predetermined interval, and the length of the central heat sink is restricted to be smaller than those of the LED tubes, whereby the internal space of the LED lamp is open through the gaps for heat dissipation in all directions so that a space for facilitating the convection of air is ensured to maximize the convection of air irrespective of the installation posture of the LED lamp. The present invention can maximize heat dissipation since the internal space of the LED lamp, where heat generated when the LED tubes and LEDs on a lower substrate emit light is released through the plurality of bar-shaped heat sinks, the central heat sink, and upper and lower heat sinks, is open in all directions to facilitate the convection of air. In particular, the present invention can maximize heat dissipation irrespective of the installation posture of the LED lamp through the heat dissipation structure in which the gaps for heat dissipation, formed between the LED tubes, and the internal space of the LED lamp communicate with each other.

Description

엘이디 램프LED lamp
본 발명은 LED 램프에 관한 것이며, 더욱 상세히는 설치자세와 무관하게 공기대류를 극대화한 방열구조를 구비한 LED 램프에 관한 것이다.The present invention relates to an LED lamp, and more particularly to an LED lamp having a heat dissipation structure that maximizes air convection regardless of the installation posture.
최근 들어, 컴팩트형 형광등, 수은등, 메탈 할라이드 램프(Metal Halide Lamp)와 같은 방전등을 대체할 수 있는 다양한 종류의 LED 램프가 개발되고 있다.Recently, various kinds of LED lamps have been developed that can replace discharge lamps such as compact fluorescent lamps, mercury lamps, and metal halide lamps.
종래의 LED 램프는 발광 시에 발생하는 열을 방출하기 위하여 LED가 실장된 기판 주변에 히트싱크를 구비하고 있지만, 대부분 단일 히트싱크를 사용하기 때문에 광효율을 개선하고 사용수명을 연장하는데 한계가 있다.Conventional LED lamps have a heat sink around the substrate on which the LED is mounted in order to dissipate heat generated during light emission. However, since a single heat sink is used, most LED lamps have limitations in improving light efficiency and extending service life.
또한, LED 램프의 방열 성능을 개선하기 위하여 히트싱크의 크기를 크게 하는 경우에는 LED 램프의 무게가 증가하고 제조원가가 상승하는 단점이 있다.In addition, in the case of increasing the size of the heat sink in order to improve the heat dissipation performance of the LED lamp, the weight of the LED lamp increases and manufacturing cost increases.
특히, 종래의 LED 램프는 상기한 바와 같이 LED가 실장된 기판 주변, 예컨대 주로 기판 뒷면에 히트싱크를 구비하고 있기 때문에 상기 히트싱크를 통해 기판에서 발생한 열이 대류에 의해 상측으로 원활하게 방출되도록 하기 위해 빛의 조사 방향이 지면을 향하도록 제한되는 단점이 있다.In particular, the conventional LED lamp is provided with a heat sink around the substrate, for example, the back of the substrate, the LED is mounted as described above, so that the heat generated from the substrate through the heat sink is smoothly discharged upward by the convection There is a disadvantage that the direction of irradiation of light is limited to the ground.
<선행기술문헌><Preceding technical literature>
[특허문헌][Patent Documents]
(특허문헌 1) KR10-0968270 B1 (Patent Document 1) KR10-0968270 B1
본 발명은 상기한 바와 같은 종래의 문제점을 해결하기 위한 것으로서, 본 발명의 목적은 히트싱크가 결합되어 있는 막대 형상의 LED 튜브들이 중공 원통체의 외주연에 방사상으로 방열핀들이 돌출 형성된 중앙히트싱크의 각 방열핀에 결합하여 정해진 간격으로 방열간극을 형성하면서 연의 실을 감는 얼레의 실주(pillar) 형상으로 배치되어 있고, 상기 중앙히트싱크의 길이를 상기 LED 튜브의 길이보다 작게 제한하여 LED 램프의 안쪽에 상기 방열간극들을 통해 모든 방향으로 개방되어 공기대류를 원활하게 하는 공간을 확보함으로써 설치자세와 무관하게 공기대류를 극대화한 방열구조를 구비한 LED 램프를 제공하는 것이다.The present invention is to solve the conventional problems as described above, an object of the present invention is to provide a heat dissipation fins radially projecting on the outer circumference of the hollow cylindrical body of the heat-coupled LED tube of the central heat sink It is arranged in the shape of a pillar of an ear which winds up the lead thread while forming a heat dissipation gap at a predetermined interval by being coupled to each heat dissipation fin, and restricting the length of the central heat sink smaller than the length of the LED tube to the inside of the LED lamp. It is to provide an LED lamp having a heat dissipation structure that maximizes air convection irrespective of the installation posture by securing a space that is open in all directions through the heat dissipation gaps to smooth air convection.
본 발명의 다른 목적은 상기 LED 튜브들의 하부에 복수의 LED가 실장된 하부기판이 결합되어 램프용 소켓에 결합하는 베이스단자 쪽을 제외한 나머지 모든 방향으로 빛을 조사하는 배광특성(예컨대, 240°이상의 빔각도)을 구비한 LED 램프를 제공하는 것이다.Another object of the present invention is a light distribution characteristic of irradiating light in all directions except for the base terminal coupled to the lower socket is coupled to the lamp socket is coupled to the lower portion of the LED tube (for example, 240 ° It is to provide an LED lamp having a beam angle).
본 발명의 또 다른 목적은 상기 LED 튜브들과 하부기판에 실장된 LED의 구동전원을 생성하는 AC-DC 컨버터가 수용되는 컨버터하우징 내부와 상기 컨버터하우징에 결합하고 말단에 램프용 소켓에 결합하는 베이스단자가 체결되는 베이스하우징 내부를 방열실리콘으로 완전히 충전한 LED 램프를 제공하는 것이다.Still another object of the present invention is a base coupled to the inside of the converter housing accommodating the AC-DC converter for generating the driving power of the LED mounted on the LED tubes and the lower substrate and the converter housing and to the lamp socket at the end. It is to provide an LED lamp that is fully charged with heat dissipating silicon inside the base housing to which the terminals are fastened.
상기와 같은 본 발명의 목적을 달성하기 위하여, 본 발명에 따른 LED 램프는, 열전도성 플라스틱(예컨대, 폴리카보네이트) 재질이며 길이를 따라 배열된 복수의 LED가 실장된 막대기판이 수용되고 막대히트싱크가 결합되어 있는 막대 형상의 다수의 LED 튜브와; 중공 원통체의 외주연에 방사상으로 방열핀들이 돌출 형성되어 있고, 각 방열핀에 상기 LED 튜브들이 결합하여 정해진 간격으로 방열간극을 형성하면서 연의 실을 감는 얼레의 실주(pillar) 형상으로 배치되어 고정되고, 그 길이를 상기 LED 튜브의 길이보다 작게 제한하여 LED 램프의 안쪽에 상기 방열간극들을 통해 모든 방향으로 개방되어 공기대류를 원활하게 하는 공간을 확보하는 방열구조를 형성하여 상기 LED 튜브들이 발광 시에 발생하는 열을 방출하는 중앙히트싱크; 상기 LED 튜브들의 상부에 연결되어 전원을 공급하는 상부기판; 상기 상부기판에 결합하여 상기 LED 튜브들이 발광 시에 발생하는 열과 컨버터하우징에서 발생하는 열을 방출하는 상부히트싱크; 상기 LED 튜브들의 하부에 결합하여 상기 LED 튜브들이 발광 시에 발생하는 열과 하부기판의 LED들이 발광 시 발생하는 열을 방출하는 하부히트싱크; 열전도성 플라스틱(예컨대, 폴리카보네이트) 재질이며 상기 하부히트싱크에 결합하여 하부기판의 LED들이 발광 시 발생하는 열을 상기 하부히트싱크로 전도하는 열전도판; 상기 열전도판 위에 고정되고 복수의 LED가 실장된 하부기판; 열전도성 플라스틱(예컨대, 폴리카보네이트) 재질이며 상기 열전도판에 초음파 접착 방식으로 밀봉 접착되어 상기 하부기판을 커버하고 방열과 방수 및 밀봉처리하며 하부기판의 LED들이 방출하는 빛을 확산하는 하부기판커버; 상기 LED 튜브들과 하부기판에 실장된 LED의 구동전원을 생성하는 AC-DC 컨버터가 수용되고 상기 상부히트싱크에 결합하는 컨버터하우징; 및 상기 컨버터하우징에 결합하고 말단에 램프용 소켓에 결합하는 베이스단자가 체결되는 베이스하우징;으로 구성되는 것을 특징으로 한다.In order to achieve the object of the present invention as described above, the LED lamp according to the present invention is a heat-conductive plastic (for example, polycarbonate) material, a bar plate mounted with a plurality of LEDs arranged along the length of the rod heat sink is accommodated A plurality of rod-shaped LED tubes coupled; Radiating fins protrude radially on the outer circumference of the hollow cylindrical body, the LED tubes are coupled to each of the radiating fins are arranged and fixed in the shape of a pillar of the winding winding the yarn thread while forming a radiating gap at a predetermined interval, By limiting the length of the LED tube smaller than the length of the LED tube to form a heat dissipation structure to ensure a space for opening the air in all directions through the heat dissipation gaps inside the LED lamp to facilitate the air convection occurs when the LED tube is emitted A central heat sink for dissipating heat; An upper substrate connected to the upper portions of the LED tubes to supply power; An upper heat sink coupled to the upper substrate to emit heat generated when the LED tubes emit light and heat generated by the converter housing; A lower heat sink coupled to the lower portions of the LED tubes to emit heat generated when the LED tubes emit light and heat generated when the LEDs of the lower substrate emit light; A thermal conductive plate made of a thermally conductive plastic (eg, polycarbonate) and coupled to the lower heat sink to conduct heat generated when the LEDs of the lower substrate emit light to the lower heat sink; A lower substrate fixed on the heat conduction plate and having a plurality of LEDs mounted thereon; A lower substrate cover which is made of a thermally conductive plastic (eg, polycarbonate) and is hermetically bonded to the thermal conductive plate to cover the lower substrate, heat dissipation, waterproofing and sealing, and diffuse light emitted by the LEDs of the lower substrate; A converter housing for accommodating an AC-DC converter for generating driving power for the LEDs mounted on the LED tubes and the lower substrate and coupling to the upper heat sink; And a base housing coupled to the converter housing and having a base terminal coupled to a lamp socket at an end thereof.
본 발명에 따른 LED 램프는 상기 LED 튜브의 하단이 밀봉캡에 의해 방열과 방수 및 밀봉처리되고, 상기 LED 튜브의 상단이 상기 상부히트싱크에 형성된 오목부 내부에 수용된 상태에서 상기 오목부에 충전되는 방열실리콘에 의해 방열과 방수 및 밀봉처리되는 것을 특징으로 한다.LED lamp according to the present invention is the heat dissipation and waterproof and sealed by the sealing cap of the lower end of the LED tube, the upper end of the LED tube is filled in the recess in the state accommodated in the recess formed in the upper heat sink It is characterized in that the heat dissipation and waterproof and sealed by the heat dissipation silicon.
본 발명에 따른 LED 램프는 상기 컨버터하우징 내부와 상기 베이스하우징 내부가 방열실리콘으로 완전히 충전되어 방열과 방수 및 밀봉처리된 것을 특징으로 한다.The LED lamp according to the present invention is characterized in that the inside of the converter housing and the base housing are completely filled with heat dissipating silicon to be radiated, waterproofed, and sealed.
본 발명은 LED 튜브들과 하부기판의 LED들이 발광 시에 발생하는 열이 다수의 막대히트싱크와 중앙히트싱크, 상부히트싱크, 및 하부히트싱크를 통해 방출되는 LED 램프의 안쪽 공간이 모든 방향으로 개방되어 공기대류를 원활하게 하므로 열방출을 극대화할 수 있고, 특히 LED 튜브들 사이에 형성된 방열간극과 LED 램프의 안쪽 공간이 서로 통하는 방열구조이므로 LED 램프의 설치자세와 무관하게 열방출을 극대화할 수 있다.According to the present invention, the heat generated when the LEDs of the LED tubes and the lower substrate emit light is emitted through a plurality of rod heat sinks, a central heat sink, an upper heat sink, and a lower heat sink in all directions. The heat dissipation maximizes heat dissipation because it facilitates air convection. Especially, the heat dissipation gap between the LED tubes and the inner space of the LED lamps communicates with each other, which maximizes heat dissipation regardless of the installation position of the LED lamp. Can be.
본 발명은 LED 튜브들과 하부기판의 LED들이 모두 밀봉처리되므로 방수 성능이 우수하다.The present invention is excellent in waterproof performance because both the LED tube and the LED of the lower substrate is sealed.
도 1은 본 발명에 따른 LED 램프의 사시도.1 is a perspective view of an LED lamp according to the present invention.
도 2는 도 1의 분해 사시도.2 is an exploded perspective view of FIG.
도 3은 도 2에 나타낸 LED 튜브 조립체의 분해 사시도.3 is an exploded perspective view of the LED tube assembly shown in FIG.
도 4는 도 2에 나타낸 LED 튜브의 단면도.4 is a cross-sectional view of the LED tube shown in FIG.
도 5는 LED 튜브들의 각 기판의 상단이 상부기판에 용접된 상태를 나타낸 사시도.5 is a perspective view showing a state in which the upper end of each substrate of the LED tube is welded to the upper substrate.
도 6은 상부히트싱크의 오목부의 내부가 방열실리콘에 의해 충전된 상태를 나타낸 절개도.6 is a cutaway view showing a state where the inside of the recess of the upper heat sink is filled with heat dissipation silicon;
도 7은 컨버터하우징 내부와 베이스하우징 내부가 방열실리콘으로 완전히 충전된 상태를 나타낸 절개도.7 is a cutaway view showing a state in which the inside of the converter housing and the inside of the base housing are completely filled with heat dissipating silicon.
도 8은 본 발명에 따른 LED 램프의 사용 상태를 나타낸 제1실시예.8 is a first embodiment showing a state of use of the LED lamp according to the present invention.
도 9는 본 발명에 따른 LED 램프의 사용 상태를 나타낸 제2실시예.9 is a second embodiment showing the state of use of the LED lamp according to the present invention.
도 10은 본 발명에 따른 LED 램프의 사용 상태를 나타낸 제3실시예.10 is a third embodiment showing the state of use of the LED lamp according to the present invention.
이하, 본 발명의 바람직한 실시예를 첨부된 도면을 참조하여 더욱 상세하게 설명한다.Hereinafter, exemplary embodiments of the present invention will be described in more detail with reference to the accompanying drawings.
도 1 내지 도 7을 참조하면, 본 발명에 따른 LED 램프(100)는 막대 형상의 다수의 LED 튜브(110)와, 중앙히트싱크(120), 상부기판(130), 상부히트싱크(140), 하부히트싱크(150), 열전도판(160), 하부기판(170), 하부기판커버(180), 컨버터하우징(190) 및 베이스하우징(190a)을 포함하여 구성된다.1 to 7, the LED lamp 100 according to the present invention includes a plurality of LED tubes 110 having a rod shape, a central heat sink 120, an upper substrate 130, and an upper heat sink 140. , A lower heat sink 150, a heat conduction plate 160, a lower substrate 170, a lower substrate cover 180, a converter housing 190, and a base housing 190a.
본 발명에 따른 LED 램프(100)는 상기 컨버터하우징(190)에서 인출되는 전원 공급선이 상기 중앙히트싱크(120)와 상부기판(130), 상부히트싱크(140), 하부히트싱크(150), 열전도판(160)을 관통하여 상기 상부기판(130)과 상기 하부기판(170)에 연결되어 상기 상부기판(130)에 연결된 다수의 LED 튜브(110)와 상기 하부기판(170)에 실장된 다수의 LED들의 구동전원을 공급한다. LED lamp 100 according to the present invention is the power supply line drawn from the converter housing 190 is the central heat sink 120, the upper substrate 130, the upper heat sink 140, the lower heat sink 150, A plurality of LED tubes 110 and lower substrates 170 connected to the upper substrate 130 and the lower substrate 170 through the heat conduction plate 160 and connected to the upper substrate 130. Supply driving power of LEDs.
상기 LED 튜브(110)는 열전도성 플라스틱(예컨대, 폴리카보네이트) 재질이며 길이를 따라 배열된 복수의 LED가 실장된 막대기판(111)이 수용되고 막대히트싱크(112)가 결합되어 있다.The LED tube 110 is made of a thermally conductive plastic (eg, polycarbonate), and includes a bar plate 111 mounted with a plurality of LEDs arranged along a length thereof, and a bar heat sink 112 is coupled thereto.
상기 LED 튜브(110)는 내면에 LED들이 방출하는 빛을 반사하여 확산하는 반사시트(110a)가 구비되어 있다.The LED tube 110 is provided with a reflective sheet (110a) to reflect and diffuse the light emitted by the LED on the inner surface.
상기 LED 튜브(110)는 이면 내측에 상기 막대기판(111)을 끼워서 고정하는 기판홈(110b)이 형성되어 있고, 상기 이면 외측에 상기 막대히트싱크(112)를 끼워서 고정하는 히트싱크홈(110c)이 형성되어 있다.The LED tube 110 is formed with a substrate groove 110b for fixing the bar plate 111 inside the rear surface of the LED tube 110 and a heat sink groove 110c for inserting the bar heat sink 112 on the outside of the rear surface of the LED tube 110. ) Is formed.
상기 막대기판(111)의 상단은 상기 상부기판(130)의 상면 위로 노출된 상태에서 상기 상부기판(130)에 용접된다. 상기 막대기판(111)의 상단을 상기 상부기판(130)의 상면 위로 노출시키면, LED 램프(100) 조립 과정에서 상기 상부기판(130)의 상면을 따라 연의 실을 감는 얼레의 실주(pillar) 형상으로 배치되어 고정되는 상기 LED 튜브(110)들의 조립이 용이해지고 조립시간을 단축할 수 있다.An upper end of the bar plate 111 is welded to the upper substrate 130 in an exposed state on the upper surface of the upper substrate 130. When the upper end of the bar plate 111 is exposed on the upper surface of the upper substrate 130, the pillar shape of the ear winding the yarn thread along the upper surface of the upper substrate 130 during the LED lamp 100 assembly process The assembly of the LED tube 110, which is disposed and fixed, may be facilitated and the assembly time may be shortened.
상기 LED 튜브(110)의 하단은 겉면이 볼록면 형상이고 열전도성 플라스틱(예컨대, 폴리카보네이트) 재질로 된 밀봉캡(110d)이 초음파 접착 방식으로 접착됨에 따라 방열과 방수 및 밀봉처리된다.The lower end of the LED tube 110 has a convex surface on the outside and heat dissipation, waterproofing and sealing as the sealing cap 110d made of a thermally conductive plastic (eg, polycarbonate) is bonded by ultrasonic bonding.
상기 밀봉캡(110d)의 겉면 중 일부는 상기 열전도판(160)이 배치되는 공간을 마련하는 평탄부(110d-1)로 형성된다. 상기 평탄부(110d-1)가 형성되면, LED 램프(100) 조립 과정에서 상기 밀봉캡(110d)이 접착되어 있는 상기 LED 튜브(110)의 하단에 결합된 하부히트싱크(150)에 상기 열전도판(160)을 결합할 때, 상기 열전도판(160)이 상기 밀봉캡(110d)의 평탄부(110d-1)에 연접하는 볼록면에 걸려 이탈이 방지되므로 상기 열전도판(160)을 편리하게 배치하여 하부히트싱크(150)에 결합할 수 있다.A part of the outer surface of the sealing cap 110d is formed as a flat portion 110d-1 for providing a space in which the heat conductive plate 160 is disposed. When the flat portion 110d-1 is formed, the heat conduction is applied to the lower heatsink 150 coupled to the lower end of the LED tube 110 to which the sealing cap 110d is bonded during the LED lamp 100 assembly process. When the plate 160 is coupled, the heat conduction plate 160 is caught on a convex surface that is connected to the flat portion 110d-1 of the sealing cap 110d, thereby preventing the detachment. It may be disposed and coupled to the lower heat sink 150.
상기 막대히트싱크(112)는 양측면에 상기 LED 튜브(110)의 이면 외측에 형성된 히트싱크홈(110c)에 끼워지는 돌기부(112a)가 형성되어 있고, 길이를 따라 중앙부에 일측이 개방된 원통형 통기홈(112b)이 형성되어 있고, 상기 통기홈(112b)에 상기 중앙히트싱크(120)의 방열핀(121)이 끼워져 고정되고 상기 상부히트싱크(140)와 상기 하부히트싱크(150)가 나사 결합된다.The bar heat sink 112 is formed on both sides of the projection 112a is fitted into the heat sink groove (110c) formed on the outside of the rear surface of the LED tube 110, the cylindrical ventilation opening one side in the center portion along the length The groove 112b is formed, and the heat dissipation fin 121 of the central heat sink 120 is fitted into the vent groove 112b, and the upper heat sink 140 and the lower heat sink 150 are screwed together. do.
상기 중앙히트싱크(120)는 중공 원통체의 외주연에 방사상으로 방열핀(121)들이 돌출 형성되어 있고, 상기 방열핀(121)의 말단부가 상기 막대히트싱크(112)의 통기홈(112b)에 끼워져 고정된다.The central heat sink 120 has radially radiating fins 121 protruding from the outer circumference of the hollow cylindrical body, and the distal end of the heat dissipating fin 121 is fitted into the vent groove 112b of the bar heat sink 112. It is fixed.
상기 중앙히트싱크(120)는 각 방열핀(121)에 상기 LED 튜브(110)들이 결합하여 정해진 간격으로 방열간극을 형성하면서 연의 실을 감는 얼레의 실주(pillar) 형상으로 배치되어 고정되고, 그 길이를 상기 LED 튜브(110)의 길이보다 작게 제한하여 LED 램프(100)의 안쪽에 상기 방열간극들을 통해 모든 방향으로 개방되어 공기대류를 원활하게 하는 공간을 확보하는 방열구조를 형성하여 상기 LED 튜브(110)들이 발광 시에 발생하는 열을 방출한다.The central heat sink 120 is arranged and fixed in the shape of a pillar of an ear to wind the lead thread while forming a heat dissipation gap at a predetermined interval by coupling the LED tubes 110 to each heat dissipation fin 121. By limiting the smaller than the length of the LED tube 110 to the inside of the LED lamp 100 through the heat dissipation gaps open in all directions to form a heat dissipation structure to ensure a space for smooth air convection the LED tube ( 110 emits heat generated during light emission.
LED 램프(100)의 안쪽에 충분한 공간을 확보하는 방열구조를 형성하기 위하여 상기 중앙히트싱크(120)의 길이는 상기 LED 튜브(110)의 길이의 1/5∼3/5의 길이범위로 제한되는 것이 가장 바람직하다.The length of the central heat sink 120 is limited to the length range of 1/5 to 3/5 of the length of the LED tube 110 in order to form a heat dissipation structure to secure a sufficient space inside the LED lamp 100. Most preferably.
상기 중앙히트싱크(120)의 길이가 상기 LED 튜브(110)의 길이의 1/5 미만인 경우에는 상기 중앙히트싱크(120)의 각 방열핀(121)에 고정되는 상기 LED 튜브(110)들을 충분히 지지하지 못하는 단점이 있다.When the length of the center heat sink 120 is less than 1/5 of the length of the LED tube 110, the LED tubes 110 fixed to the heat dissipation fins 121 of the center heat sink 120 are sufficiently supported. There is a drawback to not doing it.
상기 중앙히트싱크(120)의 길이가 상기 LED 튜브(110)의 길이의 3/5 초과인 경우에는 상기 중앙히트싱크(120)의 각 방열핀(121)에 고정되는 상기 LED 튜브(110)들을 충분히 지지할 수는 있지만 LED 램프(100)의 안쪽에 형성되는 공간이 공기대류를 원활하게 하지 못하는 단점이 있다.When the length of the center heat sink 120 is greater than 3/5 of the length of the LED tube 110, the LED tubes 110 fixed to the heat dissipation fins 121 of the center heat sink 120 are sufficiently provided. Although it can support, there is a disadvantage that the space formed inside the LED lamp 100 does not facilitate the air convection.
상기 상부기판(130)은 상기 LED 튜브(110)들의 상부에 연결되어 전원을 공급하며, 상기한 바와 같이 전원 공급선이 연결되어 상기 LED 튜브(110)들로 구동전원을 공급한다.The upper substrate 130 is connected to the upper portions of the LED tubes 110 to supply power, and as described above, a power supply line is connected to supply driving power to the LED tubes 110.
상기 상부히트싱크(140)는 상기 상부기판(130)에 결합하여 상기 LED 튜브(110)들이 발광 시에 발생하는 열과 컨버터하우징(190)에서 발생하는 열을 방출한다.The upper heat sink 140 is coupled to the upper substrate 130 to emit heat generated when the LED tubes 110 emit light and heat generated by the converter housing 190.
상기 상부히트싱크(140)는 중앙관통구멍(141)이 형성되어 있고, 상기 막대히트싱크(112)의 길이를 따라 중앙부에 일측이 개방된 원통형으로 형성된 통기홈(112b)에 체결되는 나사가 관통하는 나사보스(boss)(142)들이 상기 중앙관통구멍(141)의 가장자리를 따라 정해진 간격으로 형성되어 있다.The upper heat sink 140 has a central through hole 141 formed therein, and a screw that is fastened to a vent groove 112 b formed in a cylindrical shape having one side open at a central portion thereof along the length of the rod heat sink 112. Screw bosses 142 are formed at predetermined intervals along the edge of the central through hole 141.
상기 상부히트싱크(140)는 상기 상부기판(130)과 결합하는 측면의 상기 중앙관통구멍(141)과 가장자리 사이에 상기 상부기판(130)과 상기 LED 튜브(110)들의 각 상단이 정해진 깊이로 수용되는 오목부(143)가 형성되어 있다.The upper heat sink 140 has a predetermined depth between each upper end of the upper substrate 130 and the LED tubes 110 between the center through hole 141 and the edge of the side surface coupled with the upper substrate 130. The recessed part 143 accommodated is formed.
상기 상부히트싱크(140)는 상기 오목부(141)의 내부는 방열실리콘에 의해 완전히 충전되어 방열과 방수 및 밀봉처리된다.The upper heat sink 140 is the inside of the concave portion 141 is completely filled with heat dissipation silicon is heat dissipation, waterproof and sealed treatment.
상기 상부히트싱크(140)는 상기 상부기판(130)과 결합하는 반대측면에 방열핀(144)들이 돌출되어 있다.The upper heat sink 140 has heat dissipation fins 144 protruding from the side opposite to the upper substrate 130.
상기 하부히트싱크(150)는 상기 LED 튜브(110)들의 하부에 결합하여 상기 LED 튜브(110)들이 발광 시에 발생하는 열과 하부기판(170)의 LED들이 발광 시 발생하는 열을 방출한다.The lower heat sink 150 is coupled to the lower portions of the LED tubes 110 to emit heat generated when the LED tubes 110 emit light and heat generated when the LEDs of the lower substrate 170 emit light.
상기 하부히트싱크(150)는 중앙관통구멍(151)이 형성되어 있고, 상기 막대히트싱크(112)의 길이를 따라 중앙부에 일측이 개방된 원통형으로 형성된 통기홈(112b)에 체결되는 나사가 관통하는 나사구멍(152)들이 가장자리를 따라 정해진 간격으로 형성되어 있다.The lower heat sink 150 has a central through hole 151 formed therein, and a screw fastened to a vent groove 112 b formed in a cylindrical shape having one side open at a central portion thereof along the length of the rod heat sink 112. Screw holes 152 are formed at predetermined intervals along the edge.
상기 하부히트싱크(150)는 상기 LED 튜브(110)들과 결합하는 측면에 방열핀(153)들이 돌출되어 있다.The lower heat sink 150 has heat dissipation fins 153 protruding from the side surfaces of the lower heat sink 150.
상기 하부히트싱크(150)는 상기 LED 튜브(110)들과 결합하는 반대측면에 상기 열전도판(160)을 결합하는 나사가 체결되는 나사보스(boss)(154)들이 정해진 간격으로 돌출되어 있다.The lower heatsink 150 has screw bosses 154 to which screws for coupling the heat conduction plate 160 are protruded at predetermined intervals on opposite sides coupled with the LED tubes 110.
상기 열전도판(160)은 열전도성 플라스틱(예컨대, 폴리카보네이트) 재질이며 상기 하부히트싱크(150)에 결합하여 하부기판(170)의 LED들이 발광 시 발생하는 열을 상기 하부히트싱크(150)로 전도한다.The thermal conductive plate 160 is made of a thermally conductive plastic (eg, polycarbonate) and is coupled to the lower heat sink 150 to transfer heat generated when the LEDs of the lower substrate 170 emit light to the lower heat sink 150. Evangelize.
상기 하부기판(170)은 상기 열전도판(160) 위에 고정되고 복수의 LED가 실장되어 있다.The lower substrate 170 is fixed on the heat conduction plate 160 and has a plurality of LEDs mounted thereon.
상기 하부기판커버(180)는 열전도성 플라스틱(예컨대, 폴리카보네이트) 재질이며 상기 열전도판(160)에 초음파 접착 방식으로 밀봉 접착되어 상기 하부기판(170)을 커버하고 방열과 방수 및 밀봉처리하며 하부기판(170)의 LED들이 방출하는 빛을 확산한다.The lower substrate cover 180 is made of a thermally conductive plastic (eg, polycarbonate) and is hermetically bonded to the thermal conductive plate 160 by ultrasonic bonding to cover the lower substrate 170, and to radiate, waterproof, and seal the lower substrate. The LEDs of the substrate 170 diffuse the light emitted.
상기 하부기판커버(180)는 겉면이 볼록면 형상이고 중앙부에 형성된 오목부(181)가 상기 하부기판(170)의 각 LED의 광점이 보이지 않도록 상기 하부기판(170)의 LED들이 방출하는 빛을 집속하여 확산함으로써 눈부심을 방지한다.The lower substrate cover 180 has a convex surface on the outside thereof, and the concave portion 181 formed at the center thereof emits light emitted from the LEDs of the lower substrate 170 such that the light spots of the LEDs of the lower substrate 170 are not visible. Focus and spread to prevent glare.
상기 컨버터하우징(190)은 상기 LED 튜브(110)들과 하부기판(170)에 실장된 LED의 구동전원을 생성하는 AC-DC 컨버터가 수용되고 상기 상부히트싱크(140)에 결합한다.The converter housing 190 accommodates an AC-DC converter that generates driving power for the LEDs mounted on the LED tubes 110 and the lower substrate 170 and is coupled to the upper heat sink 140.
상기 베이스하우징(190a)은 상기 컨버터하우징(190)에 결합하고 말단에 램프용 소켓에 결합하는 베이스단자(191a)가 체결된다.The base housing 190a is coupled to the converter housing 190 and the base terminal 191a coupled to the lamp socket at the end is fastened.
상기한 램프용 소켓은 상기 베이스단자(191a)가 스크류 방식으로 결합하는 소켓이며, 구체적인 구조를 예시하지 않더라도 이 기술분야의 통상의 기술자 수준으로 용이하게 이해할 수 있을 것이다.The lamp socket is a socket to which the base terminal 191a is coupled in a screw manner, and may be easily understood to those skilled in the art without exemplifying a specific structure.
상기 컨버터하우징(190) 내부와 상기 베이스하우징(190a) 내부는 방열실리콘으로 완전히 충전되어 방열과 방수 및 밀봉처리된다.The inside of the converter housing 190 and the inside of the base housing 190a are completely filled with heat-dissipating silicon to be heat-dissipated, waterproofed, and sealed.
상기 컨버터하우징(190)과 상기 베이스하우징(190a)은 서로 나사결합하는 것이 바람직하다. 예컨대, 상기 컨버터하우징(190)의 나사구멍(도면식별번호 미도시)과 상기 베이스하우징(190a)의 나사보스(boss)(도면식별번호 미도시)를 관통하는 나사에 의해 서로 결합된다.The converter housing 190 and the base housing 190a are preferably screwed together. For example, they are coupled to each other by screws passing through a screw hole (not shown) of the converter housing 190 and a screw boss (not shown) of the base housing 190a.
상기 컨버터하우징(190)의 나사구멍(도면식별번호 미도시)를 관통하는 나사는 상기 상부히트싱크(140)의 상기 상부기판(130)과 결합하는 반대측면에 방열핀(144)들과 함께 돌출되어 있는 나사보스(boss)(도면식별번호 미도시)에 체결됨으로써 상기 컨버터하우징(190)을 상기 상부히트싱크(140)에 결합한다.The screw penetrating the screw hole (not shown in the drawing identification number) of the converter housing 190 protrudes along with the heat dissipation fins 144 on the opposite side that is coupled to the upper substrate 130 of the upper heat sink 140. The converter housing 190 is coupled to the upper heatsink 140 by being fastened to a screw boss (not shown).
상기와 같이 구성되는 본 발명에 따른 LED 램프(100)는 다음과 같이 작동한다. LED lamp 100 according to the present invention configured as described above operates as follows.
상기한 램프용 소켓에 상기 LED 램프(100)의 베이스단자(191a)가 결합함에 따라서 AC 전원이 상기 컨버터하우징(190) 내부에 있는 AC-DC 컨버터로 인가되면, 상기 AC-DC 컨버터는 상기 AC 전원을 다수의 LED 튜브(110)와 상기 하부기판(170)에 실장된 다수의 LED들의 구동전원으로 변환하여 상기한 전원 공급선을 통해 상기 다수의 LED 튜브(110)와 상기 하부기판(170)에 실장된 다수의 LED로 공급한다.As the base terminal 191a of the LED lamp 100 is coupled to the lamp socket, when AC power is applied to the AC-DC converter inside the converter housing 190, the AC-DC converter is connected to the AC. The power is converted into a driving power of a plurality of LEDs mounted on the plurality of LED tubes 110 and the lower substrate 170 to the plurality of LED tubes 110 and the lower substrate 170 through the power supply line. It is supplied by a plurality of mounted LEDs.
이에 따라서, 상기 다수의 LED 튜브(110)와 상기 하부기판(170)에 실장된 다수의 LED들이 발광하면 상기 LED 램프(100)는 상기한 램프용 소켓에 결합하는 베이스단자(101) 쪽을 제외한 나머지 모든 방향으로 빛을 조사하며, 실제로 측정한 결과 240°이상의 빔각도를 나타내는 배광특성을 확인할 수 있었다.Accordingly, when a plurality of LEDs mounted on the plurality of LED tubes 110 and the lower substrate 170 emit light, the LED lamp 100 except for the base terminal 101 coupled to the lamp socket. The light was radiated in all the remaining directions, and the measured light distribution showed a beam angle of more than 240 °.
상기와 같이 상기 다수의 LED 튜브(110)와 상기 하부기판(170)에 실장된 다수의 LED들이 발광하는 동안에 발생하는 열은 상기한 다수의 막대히트싱크(112)와 중앙히트싱크(120), 상부히트싱크(140), 및 하부히트싱크(150)를 통해 방출된다.As described above, the heat generated while the plurality of LEDs mounted on the plurality of LED tubes 110 and the lower substrate 170 emit light is the plurality of bar heat sinks 112 and the center heat sinks 120, It is discharged through the upper heat sink 140, and the lower heat sink 150.
이때, 상기한 다수의 막대히트싱크(112)와 중앙히트싱크(120), 상부히트싱크(140), 및 하부히트싱크(150)를 통해 방출되는 열은 LED 램프(100)의 안쪽에 형성된 공간에서 상기 LED 튜브(110)들 사이에 형성된 방열간극들을 통하여 모든 방향으로 원활하게 이루어지는 공기대류에 의해 LED 램프(100) 밖으로 방출된다.At this time, the heat emitted through the plurality of rod heat sink 112, the central heat sink 120, the upper heat sink 140, and the lower heat sink 150 is formed in the interior of the LED lamp 100 In the LED lamp 110 is discharged out of the LED lamp 100 by the air convection smoothly made in all directions through the heat dissipation gap formed between the LED tube (110).
또한, 상기 LED 램프(100)의 발광 시에 상기 컨버터하우징(190) 내부의 AC-DC 컨버터가 발생하는 열은 상기 컨버터하우징(190) 내부에 완전히 충전된 방열실리콘에 의해 상기 상부히트싱크(140)로 전도되어 방출된다.In addition, the heat generated by the AC-DC converter inside the converter housing 190 when the LED lamp 100 emits light may be caused by the heat dissipation silicon completely charged in the converter housing 190. Is conducted and released.
이처럼, 본 발명에 따른 LED 램프(100)는 상기 LED 튜브(110)들 사이에 형성된 방열간극과 LED 램프(100)의 안쪽 공간이 서로 통하는 방열구조를 구비하므로 LED 램프(100)의 설치자세와 무관하게 열방출을 극대화할 수 있다.As such, the LED lamp 100 according to the present invention has a heat dissipation structure formed between the LED tube 110 and the inner space of the LED lamp 100 through the heat dissipation structure and the installation posture of the LED lamp 100 and Regardless of the heat dissipation can be maximized.
도 8은 빛의 조사 방향이 지면을 향하도록 설치된 상기 LED 램프(100)의 사용 상태를 나타낸 실시예이다. 도 8에 나타낸 바에 의하면, LED 램프(100)의 안쪽 공간이 서로 통하는 방열구조에 의해 화살표로 나타낸 바와 같이 공기대류가 원활하게 이루어져 LED 램프(100)의 발광 시에 발생하는 열방출을 극대화할 수 있음을 알 수 있다.8 is an embodiment showing the use state of the LED lamp 100 is installed so that the irradiation direction of light toward the ground. As shown in FIG. 8, as shown by arrows, air convection is smoothly performed by heat dissipation structures in which the inner spaces of the LED lamp 100 communicate with each other, thereby maximizing heat dissipation generated when the LED lamp 100 emits light. It can be seen that.
도 9는 빛의 조사 방향이 수평선을 향하도록 설치된 상기 LED 램프(100)의 사용 상태를 나타낸 실시예이다. 도 9에 나타낸 바에 의하면, LED 램프(100)의 안쪽 공간이 서로 통하는 방열구조에 의해 화살표로 나타낸 바와 같이 공기대류가 원활하게 이루어져 LED 램프(100)의 발광 시에 발생하는 열방출을 극대화할 수 있음을 알 수 있다.9 is an embodiment showing the use state of the LED lamp 100 is installed so that the irradiation direction of light toward the horizontal line. As shown in FIG. 9, as shown by arrows, air convection is smoothly performed by heat dissipation structures in which the inner spaces of the LED lamp 100 communicate with each other, thereby maximizing heat dissipation generated when the LED lamp 100 emits light. It can be seen that.
도 10은 빛의 조사 방향이 지상을 향하도록 설치된 상기 LED 램프(100)의 사용 상태를 나타낸 실시예이다. 도 10에 나타낸 바에 의하면, LED 램프(100)의 안쪽 공간이 서로 통하는 방열구조에 의해 화살표로 나타낸 바와 같이 공기대류가 원활하게 이루어져 LED 램프(100)의 발광 시에 발생하는 열방출을 극대화할 수 있음을 알 수 있다.10 is an embodiment showing the use state of the LED lamp 100 is installed so that the light irradiation direction toward the ground. As shown in FIG. 10, air convection is smoothly performed by the heat dissipation structure in which the inner spaces of the LED lamp 100 communicate with each other, thereby maximizing heat dissipation generated when the LED lamp 100 emits light. It can be seen that.
이상에서 설명한 본 발명에 따른 LED 램프는 상기한 실시예에 한정되지 않고, 이하의 특허청구범위에서 청구하는 본 발명의 요지를 벗어남이 없이 본 발명이 속하는 분야에서 통상의 지식을 가진 자라면 누구든지 다양하게 변경하여 실시할 수 있는 범위까지 그 기술적 정신이 있다.The LED lamp according to the present invention described above is not limited to the above-described embodiment, and anyone having ordinary knowledge in the field to which the present invention belongs without departing from the gist of the present invention as claimed in the following claims. The technical spirit is to the extent that various modifications can be made.
[부호의 설명][Description of the code]
100: LED 램프 110: LED 튜브100: LED lamp 110: LED tube
110a: 반사시트 110b: 기판홈110a: reflective sheet 110b: substrate groove
110c: 히트싱크홈 110d: 밀봉캡110c: heat sink groove 110d: sealing cap
110d-1: 평탄부 111: 막대기판110d-1: flat part 111: bar plate
112: 막대히트싱크 112a: 돌기부112: heat sink 112a: protrusion
112b: 통기홈 120: 중앙히트싱크112b: ventilation groove 120: central heat sink
121: 방열핀 130: 상부기판121: heat dissipation fin 130: upper substrate
140: 상부히트싱크 141: 중앙관통구멍140: upper heat sink 141: central through hole
142: 나사보스 143: 오목부142: threaded boss 143: recess
144: 방열핀 150: 하부히트싱크144: heat sink fin 150: lower heat sink
151: 중앙관통구멍 152: 나사구멍151: central through hole 152: screw hole
153: 방열핀 154: 나사보스153: heat sink fin 154: threaded boss
160: 열전도판 170: 하부기판160: heat conduction plate 170: lower substrate
180: 하부기판커버 181: 오목부180: lower substrate cover 181: recessed portion
190: 컨버터하우징 190a: 베이스하우징190: converter housing 190a: base housing
191a: 베이스단자191a: Base terminal

Claims (10)

  1. 열전도성 플라스틱 재질이며 길이를 따라 배열된 복수의 LED가 실장된 막대기판(111)이 수용되고 막대히트싱크(112)가 결합되어 있는 막대 형상의 다수의 LED 튜브(110)와;A plurality of LED tubes 110 having a rod shape in which a bar plate 111 on which a plurality of LEDs mounted along a length of the heat conductive plastic material and arranged along the length is accommodated and the bar heat sink 112 is coupled;
    중공 원통체의 외주연에 방사상으로 방열핀(121)들이 돌출 형성되어 있고, 각 방열핀(121)에 상기 LED 튜브(110)들이 결합하여 정해진 간격으로 방열간극을 형성하면서 연의 실을 감는 얼레의 실주(pillar) 형상으로 배치되어 고정되고, 그 길이를 상기 LED 튜브(110)의 길이보다 작게 제한하여 LED 램프(100)의 안쪽에 상기 방열간극들을 통해 모든 방향으로 개방되어 공기대류를 원활하게 하는 공간을 확보하는 방열구조를 형성하여 상기 LED 튜브(110)들이 발광 시에 발생하는 열을 방출하는 중앙히트싱크(120);Radial fins protruding from the outer circumference of the hollow cylindrical body radially, and the LED tube 110 is coupled to each of the radiating fins 121 to form a heat dissipation gap at a predetermined interval, winding the thread of the lead rim ( It is arranged and fixed in a pillar shape, the length is limited to less than the length of the LED tube 110 to open in all directions through the heat dissipation gap inside the LED lamp 100 to facilitate the air convection space A central heat sink 120 for dissipating heat generated when the LED tubes 110 emit light by forming a heat dissipation structure to secure the heat dissipation structure;
    상기 LED 튜브(110)들의 상부에 연결되어 전원을 공급하는 상부기판(130);An upper substrate 130 connected to the upper portions of the LED tubes 110 to supply power;
    상기 상부기판(130)에 결합하여 상기 LED 튜브(110)들이 발광 시에 발생하는 열과 컨버터하우징(190)에서 발생하는 열을 방출하는 상부히트싱크(140);An upper heat sink 140 coupled to the upper substrate 130 for dissipating heat generated when the LED tubes 110 emit light and heat generated by the converter housing 190;
    상기 LED 튜브(110)들의 하부에 결합하여 상기 LED 튜브(110)들이 발광 시에 발생하는 열과 하부기판(170)의 LED들이 발광 시 발생하는 열을 방출하는 하부히트싱크(150);A lower heat sink 150 coupled to the lower portions of the LED tubes 110 to emit heat generated when the LED tubes 110 emit light and heat generated when the LEDs of the lower substrate 170 emit light;
    열전도성 플라스틱 재질이며 상기 하부히트싱크(150)에 결합하여 하부기판(170)의 LED들이 발광 시 발생하는 열을 상기 하부히트싱크(150)로 전도하는 열전도판(160);A thermally conductive plastic material and coupled to the lower heat sink 150 to conduct heat generated when LEDs of the lower substrate 170 emit light to the lower heat sink 150;
    상기 열전도판(160) 위에 고정되고 복수의 LED가 실장된 하부기판(170);A lower substrate 170 fixed on the heat conduction plate 160 and mounted with a plurality of LEDs;
    열전도성 플라스틱 재질이며 상기 열전도판(160)에 초음파 접착 방식으로 밀봉 접착되어 상기 하부기판(170)을 커버하고 방열과 방수 및 밀봉처리하며 하부기판(170)의 LED들이 방출하는 빛을 확산하는 하부기판커버(180);It is a thermally conductive plastic material and is sealed to the thermal conductive plate 160 by ultrasonic bonding method to cover the lower substrate 170, heat dissipation, waterproofing and sealing treatment, the lower portion to diffuse the light emitted by the LEDs of the lower substrate 170 A substrate cover 180;
    상기 LED 튜브(110)들과 하부기판(170)에 실장된 LED의 구동전원을 생성하는 AC-DC 컨버터가 수용되고 상기 상부히트싱크(140)에 결합하는 컨버터하우징(190); 및A converter housing (190) for accommodating an AC-DC converter for generating driving power for the LED mounted on the LED tubes (110) and the lower substrate (170) and coupled to the upper heat sink (140); And
    상기 컨버터하우징(190)에 결합하고 말단에 램프용 소켓에 결합하는 베이스단자(191a)가 체결되는 베이스하우징(190a);A base housing 190a coupled to the converter housing 190 and having a base terminal 191a coupled to a lamp socket at an end thereof;
    으로 구성되는 것을 특징으로 하는 LED 램프.LED lamp, characterized in that consisting of.
  2. 제 1 항에 있어서, 상기 LED 튜브(110)는 내면에 LED들이 방출하는 빛을 반사하여 확산하는 반사시트(110a)가 구비되어 있고, 이면 내측에 상기 막대기판(111)을 끼워서 고정하는 기판홈(110b)이 형성되어 있고, 상기 이면 외측에 상기 막대히트싱크(112)를 끼워서 고정하는 히트싱크홈(110c)이 형성되어 있는 것을 특징으로 하는 LED 램프.According to claim 1, wherein the LED tube 110 is provided with a reflecting sheet (110a) to reflect and diffuse the light emitted by the LED on the inner surface, the substrate groove for fixing the bar plate 111 by inserting the inside of the rear surface (110b) is formed, and the heat sink groove (110c) for fixing the rod heat sink (112) by inserting the outer side of the rear surface is formed LED lamp.
  3. 제 1 항에 있어서, 상기 막대기판(111)의 상단은 상기 상부기판(130)의 상면 위로 노출된 상태에서 상기 상부기판(130)에 용접되는 것을 특징으로 하는 LED 램프.The LED lamp of claim 1, wherein an upper end of the bar board is welded to the upper board in a state where the upper end of the bar board is exposed on the upper surface of the upper board.
  4. 제 1 항에 있어서, 상기 LED 튜브(110)의 하단은 겉면이 볼록면 형상이고 열전도성 플라스틱 재질로 된 밀봉캡(110d)이 초음파 접착 방식으로 접착됨에 따라 방열과 방수 및 밀봉처리되고, 상기 밀봉캡(110d)의 겉면 중 일부는 상기 열전도판(160)이 배치되는 공간을 마련하는 평탄부(110d-1)로 형성된 것을 특징으로 하는 LED 램프.According to claim 1, wherein the lower end of the LED tube 110 is a heat dissipation and waterproofing and sealing treatment as the sealing cap (110d) of the outer surface is convex surface shape and the thermally conductive plastic is bonded by ultrasonic bonding method, the sealing Part of the outer surface of the cap (110d) LED lamp, characterized in that formed by the flat portion (110d-1) to provide a space in which the heat conducting plate 160 is disposed.
  5. 제 1 항에 있어서, 상기 막대히트싱크(112)는 양측면에 상기 LED 튜브(110)의 이면 외측에 형성된 히트싱크홈(110c)에 끼워지는 돌기부(112a)가 형성되어 있고, 길이를 따라 중앙부에 일측이 개방된 원통형 통기홈(112b)이 형성되어 있고, 상기 통기홈(112b)에 상기 중앙히트싱크(120)의 방열핀(121)이 끼워져 고정되고 상기 상부히트싱크(140)와 상기 하부히트싱크(150)가 나사 결합되는 것을 특징으로 하는 LED 램프.According to claim 1, The bar heat sink 112 is formed on both sides of the projection (112a) to be fitted to the heat sink groove 110c formed on the outside of the rear surface of the LED tube 110, the central portion along the length The cylindrical vent groove 112b having one side open is formed, and the heat dissipation fin 121 of the central heat sink 120 is fitted into the vent groove 112b to be fixed and the upper heat sink 140 and the lower heat sink. LED lamp, characterized in that 150 is screwed.
  6. 제 1 항에 있어서, 상기 중앙히트싱크(120)의 길이가 상기 LED 튜브(110)의 길이의 1/5∼3/5의 길이범위로 제한됨으로써 LED 램프의 안쪽에 상기 방열간극들을 통해 모든 방향으로 개방되어 공기대류를 원활하게 하는 공간을 확보하는 것을 특징으로 하는 LED 램프.According to claim 1, wherein the length of the central heat sink 120 is limited to the length range of 1/5 to 3/5 of the length of the LED tube 110 through all the heat dissipation gaps in the interior of the LED lamp LED lamp, characterized in that to secure a space that is open to smooth air convection.
  7. 제 1 항에 있어서, 상기 상부히트싱크(140)는 중앙관통구멍(141)이 형성되어 있고, 상기 막대히트싱크(112)의 길이를 따라 중앙부에 일측이 개방된 원통형으로 형성된 통기홈(112b)에 체결되는 나사가 관통하는 나사보스(boss)(142)들이 상기 중앙관통구멍(141)의 가장자리를 따라 정해진 간격으로 형성되어 있고, 상기 상부기판(130)과 결합하는 측면의 상기 중앙관통구멍(141)과 가장자리 사이에 상기 상부기판(130)과 상기 LED 튜브(110)들의 각 상단이 정해진 깊이로 수용되는 오목부(143)가 형성되어 있고, 상기 오목부(141)의 내부는 방열실리콘에 의해 완전히 충전되어 방열과 방수 및 밀봉처리되고, 상기 상부기판(130)과 결합하는 반대측면에 방열핀(144)들이 돌출되어 있는 것을 특징으로 하는 LED 램프.According to claim 1, The upper heat sink 140 has a central through hole 141, the ventilation groove 112b formed in a cylindrical shape with one side open to the center portion along the length of the rod heat sink 112 Screw bosses 142 through which screws are fastened to each other are formed at predetermined intervals along the edges of the central through holes 141, and the central through holes of the side surfaces engaging with the upper substrate 130 ( A recess 143 is formed between each of the upper substrate 130 and the LED tubes 110 at a predetermined depth between the edges 141 and the edges, and the inside of the recess 141 is formed on the heat dissipating silicon. Fully charged by the heat dissipation, waterproof and sealed treatment, LED lamp, characterized in that the heat dissipation fins (144) protruding on the opposite side coupled to the upper substrate (130).
  8. 제 1 항에 있어서, 상기 하부히트싱크(150)는 중앙관통구멍(151)이 형성되어 있고, 상기 막대히트싱크(112)의 길이를 따라 중앙부에 일측이 개방된 원통형으로 형성된 통기홈(112b)에 체결되는 나사가 관통하는 나사구멍(152)들이 가장자리를 따라 정해진 간격으로 형성되어 있고, 상기 LED 튜브(110)들과 결합하는 측면에 방열핀(153)들이 돌출되어 있고, 상기 LED 튜브(110)들과 결합하는 반대측면에 상기 열전도판(160)을 결합하는 나사가 체결되는 나사보스(boss)(154)들이 정해진 간격으로 돌출되어 있는 것을 특징으로 하는 LED 램프.According to claim 1, The lower heat sink 150 has a central through-hole 151 is formed, the ventilation groove 112b formed in a cylindrical shape with one side open to the center portion along the length of the rod heat sink 112 The screw holes 152 through which the screw is fastened to each other are formed at predetermined intervals along the edge, and the heat dissipation fins 153 protrude from the side surfaces of the LED tube 110 to be coupled to the LED tubes 110. LED boss, characterized in that the boss boss (154) to which the screw for coupling the heat conduction plate 160 is protruded at predetermined intervals on the opposite side to be coupled to each other.
  9. 제 1 항에 있어서, 상기 하부기판커버(180)는 겉면이 볼록면 형상이고 중앙부에 형성된 오목부(181)가 상기 하부기판(170)의 각 LED의 광점이 보이지 않도록 상기 하부기판(170)의 LED들이 방출하는 빛을 집속하여 확산함으로써 눈부심을 방지하는 것을 특징으로 하는 LED 램프.According to claim 1, wherein the lower substrate cover 180 has a convex surface of the outer surface and the concave portion 181 formed in the center portion of the lower substrate 170 so that the light spot of each LED of the lower substrate 170 is not visible LED lamp, characterized in that to prevent glare by focusing and diffusing the light emitted by the LEDs.
  10. 제 1 항에 있어서, 상기 컨버터하우징(190) 내부와 상기 베이스하우징(190a) 내부가 방열실리콘으로 완전히 충전되어 방열과 방수 및 밀봉처리된 것을 특징으로 하는 LED 램프.The LED lamp according to claim 1, wherein the inside of the converter housing (190) and the inside of the base housing (190a) are completely filled with heat-dissipating silicon, and are heat-dissipated, waterproofed, and sealed.
PCT/KR2014/007701 2014-08-19 2014-08-19 Led lamp WO2016027913A1 (en)

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