WO2016019795A1 - Air conditioner indoor unit and air conditioner - Google Patents
Air conditioner indoor unit and air conditioner Download PDFInfo
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- WO2016019795A1 WO2016019795A1 PCT/CN2015/084337 CN2015084337W WO2016019795A1 WO 2016019795 A1 WO2016019795 A1 WO 2016019795A1 CN 2015084337 W CN2015084337 W CN 2015084337W WO 2016019795 A1 WO2016019795 A1 WO 2016019795A1
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F1/00—Room units for air-conditioning, e.g. separate or self-contained units or units receiving primary air from a central station
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F13/00—Details common to, or for air-conditioning, air-humidification, ventilation or use of air currents for screening
- F24F13/08—Air-flow control members, e.g. louvres, grilles, flaps or guide plates
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- an object of the present invention is to provide an indoor unit and an air conditioner of an air conditioner, which adopts a plurality of fan systems, and improves the comfort of indoor airflow organization under the premise of satisfying the performance of the whole machine, and can Control the airflow to organize the air outlet mode, improve the fan efficiency, and reduce the wind noise.
- the technical solution of the present invention is as follows:
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Abstract
An air conditioner indoor unit and air conditioner, comprising a housing (1) and fan systems; the housing (1) is provided with at least one air exhaust opening and at least one air intake opening, the position of the air intake opening corresponding to the position of an evaporator; the fan systems are disposed within the housing (1) and comprise fan blades (2), an air duct and a motor; the number of the fan systems are more than two, with an air deflector (3) being disposed between at least two neighboring fan blades (2); the air deflector (3) and the housing form an air duct communicating with the air exhaust opening and the air intake opening; the air deflector (3) comprises a first guide portion section (31), a second guide portion section (32) and a third guide portion section (33), both the first guide portion section (31) and the third guide portion section (33) having a plate shape, and the longitudinal section of the second section of guide portion (32) having a pear shape. Also disclosed is an air conditioner having the indoor unit.
Description
相关申请Related application
本专利申请要求2014年8月8日申请的,申请号为201410390248.3,名称为“空调器的室内机及空调器”的中国专利申请的优先权,在此将其全文引入作为参考。The present application claims priority to Chinese Patent Application No. 2014-10390248.3, entitled "Indoor Units and Air Conditioners for Air Conditioners", which is incorporated herein by reference in its entirety.
本发明涉及制冷领域,尤其涉及一种空调器的室内机及空调器。The invention relates to the field of refrigeration, and in particular to an indoor unit and an air conditioner of an air conditioner.
传统的空调器室内机一般具有一个风机系统(贯流风机或离心风机),其进风出风结构形式单一,无法满足消费者日益增长的舒适性需求。且现有空调器吹风只在某个局部范围内,且吹风距离较短,无法满足不同模式如制冷、制热等模式下的出风控制,影响用户的舒适性,同时进出风气流不均匀。Conventional air conditioner indoor units generally have a fan system (cross-flow fan or centrifugal fan), and the air inlet and outlet air structure has a single form, which cannot meet the increasing comfort requirements of consumers. Moreover, the air conditioner of the existing air conditioner is only in a certain partial range, and the blowing distance is short, and the air outlet control in different modes such as cooling and heating modes cannot be satisfied, which affects the user's comfort, and the airflow in and out is uneven.
发明内容Summary of the invention
鉴于现有技术的现状,本发明的目的在于提供一种空调器的室内机及空调器,采用多个风机系统,在满足整机性能的前提下,提高了室内气流组织的舒适性,并能够控制气流组织出风方式,提高风机效率,降低出风噪音。为实现上述目的,本发明的技术方案如下:In view of the current state of the art, an object of the present invention is to provide an indoor unit and an air conditioner of an air conditioner, which adopts a plurality of fan systems, and improves the comfort of indoor airflow organization under the premise of satisfying the performance of the whole machine, and can Control the airflow to organize the air outlet mode, improve the fan efficiency, and reduce the wind noise. In order to achieve the above object, the technical solution of the present invention is as follows:
一种空调器的室内机,包括:An indoor unit of an air conditioner, comprising:
壳体,具有至少一个出风口和至少一个进风口,所述进风口的位置与所述室内机的蒸发器的位置相对应;a housing having at least one air outlet and at least one air inlet, the position of the air inlet corresponding to the position of the evaporator of the indoor unit;
风机系统,设置在所述壳体内,所述风机系统包括风叶、风道和电机,所述风机系统的数量为两个以上,其中至少有两个相邻的所述风叶之间设置导风板,所述导风板与所述壳体形成所述风道,所述风道连通所述出风口和所述进风口,所述导风板包括依次连接的第一段导向部、第二段导向部和第三段导向部,所述第一段导向部和所述第三段导向部均为板状,所述第二段导向部的纵截面呈梨形。a fan system disposed in the housing, the fan system including a fan blade, a duct, and a motor, the number of the fan system being two or more, wherein at least two adjacent ones of the blades are disposed a wind deflector, the air deflector and the casing form the air duct, the air duct communicates with the air outlet and the air inlet, the air deflector includes a first section guiding portion sequentially connected, The second segment guiding portion and the third segment guiding portion are both plate-shaped, and the second segment guiding portion has a pear-shaped longitudinal section.
在其中一个实施例中,所述风机系统的数量为两个,两个所述风机系统上下排列设置或左右排列设置。In one embodiment, the number of the fan systems is two, and the two fan systems are arranged one above the other or arranged side by side.
在其中一个实施例中,所述风机系统的数量为三个以上,三个以上所述风机系统左右排列设置或上下排列设置,其中相邻的两个所述风叶之间均设置所述导风板,相邻两个所述导风板的所述第二段导向部分别置于相邻的两个所述风叶的中心连线异侧。
In one embodiment, the number of the fan systems is three or more, and three or more of the fan systems are arranged side by side or arranged one above the other, wherein the guides are disposed between two adjacent ones of the blades The wind plate, the second segment guiding portions of the two adjacent air guiding plates are respectively placed on opposite sides of the center line of the adjacent two of the blades.
在其中一个实施例中,所述风机系统的数量为四个,四个所述风机系统呈“田”字形排布,其中,上面的两个所述风叶之间设置有所述导风板,下面的两个所述风叶之间也设置有所述导风板。In one embodiment, the number of the fan systems is four, and the four fan systems are arranged in a “shape”, wherein the wind deflectors are disposed between the two upper blades. The wind deflector is also disposed between the two lower blades.
在其中一个实施例中,所述风机系统的数量为多个,多个所述风机系统排布为至少两排,在每排所述风机系统中,相邻两个所述风叶之间均设置有所述导风板。In one embodiment, the number of the fan systems is plural, and the plurality of fan systems are arranged in at least two rows, and in each row of the fan systems, between two adjacent blades The air deflector is provided.
在其中一个实施例中,所述壳体上还设置有蜗舌,所述蜗舌与所述导风板形成扩压部,所述扩压部作为所述风机系统的出风口或导向空间。In one embodiment, the housing is further provided with a volute tongue, and the volute tongue and the air deflector form a diffusing portion, and the diffusing portion serves as an air outlet or a guiding space of the fan system.
在其中一个实施例中,所述风叶为离心风叶或轴流风叶。In one embodiment, the blades are centrifugal blades or axial blades.
在其中一个实施例中,所述壳体的轮廓为方形或圆形,每个所述电机单独控制,所述风道的连通所述进风口的一端还设置用于防止风在所述风道内倒流的止回装置。In one embodiment, the casing has a square or circular shape, and each of the motors is separately controlled, and one end of the air passage that communicates with the air inlet is further provided for preventing wind from being in the air passage. Backflow stop device.
在其中一个实施例中,所述第一段导向部的长度小于所述第三段导向部的长度。In one of the embodiments, the length of the first segment guide is less than the length of the third segment guide.
还涉及一种空调器,包括上述任一技术方案的所述空调器的室内机。It also relates to an air conditioner comprising the indoor unit of the air conditioner of any of the above aspects.
本发明的有益效果是:The beneficial effects of the invention are:
本发明的空调器的室内机及空调器,采用多个风机系统,在满足整机性能的前提下,提高了室内气流组织的舒适性,并能够控制气流组织出风方式,提高风机效率;使房间气流组织更稳、更轻、从而实现风机系统的无风设计;使风机电机在功率相等的前提下,噪音总值降低2dB(A)、噪音峰值有大幅下降,风量增加了约30m3/h。The indoor unit and the air conditioner of the air conditioner of the invention adopts a plurality of fan systems, and improves the comfort of the indoor airflow organization under the premise of satisfying the performance of the whole machine, and can control the airflow to form the air outlet mode and improve the fan efficiency; The airflow structure of the room is more stable and lighter, thus achieving the windless design of the fan system. Under the premise of equal power, the noise of the fan motor is reduced by 2dB (A), the noise peak is greatly reduced, and the air volume is increased by about 30m 3 / h.
图1为本发明的空调器的室内机实施例一的结构示意图;1 is a schematic structural view of a first embodiment of an indoor unit of an air conditioner according to the present invention;
图2为本发明的空调器的室内机实施例二的结构示意图;2 is a schematic structural view of a second embodiment of an indoor unit of an air conditioner according to the present invention;
图3为本发明的空调器的室内机实施例三的结构示意图。Fig. 3 is a schematic structural view showing a third embodiment of the indoor unit of the air conditioner of the present invention.
为了使本发明的目的、技术方案及优点更加清楚明白,以下结合附图及实施例对本发明的空调器的室内机及空调器进行进一步详细说明。应当理解,此处所描述的具体实施例仅用于解释本发明,并不用于限定本发明。In order to make the objects, technical solutions and advantages of the present invention more comprehensible, the indoor unit and the air conditioner of the air conditioner of the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It is understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
参照图1至图3,本发明一实施例的空调器的室内机,包括壳体1和风机系统。壳体1具有至少一个出风口和至少一个进风口,所述进风口的位置与室内机的蒸发器的位置相对应。壳体1的轮廓为方形或圆形,当然壳体1的轮廓也可为其它异型结构。1 to 3, an indoor unit of an air conditioner according to an embodiment of the present invention includes a housing 1 and a fan system. The housing 1 has at least one air outlet and at least one air inlet, the position of which corresponds to the position of the evaporator of the indoor unit. The contour of the housing 1 is square or circular, although the contour of the housing 1 can also be other shaped structures.
风机系统设置在壳体1内,风机系统包括风叶2、风道和电机。电机安装在壳体1内。风叶2安装在电机的轴上,风叶2置于风道内。风叶2为离心风叶或轴流风叶。风机系统
的数量为两个以上,其中至少有两个相邻的风叶2之间设置导风板3,导风板3与壳体1形成所述风道,所述风道连通所述出风口和所述进风口。每个所述电机可单独控制。设置多个风机系统,提高了室内气流组织的舒适性,并能够控制气流组织出风方式,提高风机效率。The fan system is disposed within the housing 1 and the fan system includes a vane 2, a duct, and a motor. The motor is mounted in the housing 1. The blade 2 is mounted on the shaft of the motor, and the blade 2 is placed in the duct. The blade 2 is a centrifugal blade or an axial fan blade. Fan system
The number is two or more, and at least two adjacent blades 2 are disposed with a wind deflector 3, and the air deflector 3 forms a wind tunnel with the casing 1, and the air passage communicates with the air outlet and The air inlet. Each of the motors can be individually controlled. The installation of multiple fan systems improves the comfort of the indoor airflow organization, and can control the airflow to organize the airflow mode and improve the fan efficiency.
导风板3包括依次连接的第一段导向部31、第二段导向部32和第三段导向部33,第一段导向部31和第三段导向部33均为板状,第二段导向部32的纵截面呈梨形。第二段导向部32置于两相邻风叶2的交界处。第一段导向部31的长度小于第三段导向部33的长度。导风板3改变了气流在风道内的流向,降低了气流噪音。The air deflector 3 includes a first segment guiding portion 31, a second segment guiding portion 32 and a third segment guiding portion 33 which are sequentially connected, and the first segment guiding portion 31 and the third segment guiding portion 33 are both plate-shaped, the second segment The longitudinal section of the guide portion 32 is pear-shaped. The second section of the guide 32 is placed at the junction of two adjacent vanes 2. The length of the first-stage guide portion 31 is smaller than the length of the third-stage guide portion 33. The air deflector 3 changes the flow of the airflow in the air duct, reducing airflow noise.
优选地,壳体1上还设置有蜗舌11,蜗舌11与导风板3形成扩压部,所述扩压部作为所述风机系统的出风口或导向空间,蜗舌11与导风板3的配合,进一步降低了气流噪音,且使得出风更稳定稳。Preferably, the housing 1 is further provided with a volute tongue 11 , and the volute tongue 11 and the air deflector 3 form a diffusing portion, and the diffusing portion serves as an air outlet or guiding space of the fan system, the volute tongue 11 and the air guiding body The cooperation of the board 3 further reduces the airflow noise and makes the air outlet more stable and stable.
作为一种可实施方式,如图1所示,风机系统的数量为两个,两个所述风机系统上下排列设置或左右排列设置。其中图1中的两个风机系统为左右排列设置,导风板3置于两个风叶2之间,将两个风叶2隔开,两个风机系统均可采取上出风方式或下出风方式,也可采取一个风机系统下出风、另一个风机系统上出风的出风方式。出风方式灵活,通用性强。As an implementable manner, as shown in FIG. 1, the number of fan systems is two, and the two fan systems are arranged one above the other or arranged side by side. The two fan systems in Fig. 1 are arranged side by side, the air deflector 3 is placed between the two blades 2, and the two blades 2 are separated, and the two fan systems can adopt the upper air outlet mode or the lower air outlet system. The air outlet mode can also adopt an air outlet method under the fan system and an air outlet on the other fan system. The air outlet mode is flexible and versatile.
作为一种可实施方式,如图2所示,风机系统的数量为三个以上,三个以上所述风机系统左右排列设置或上下排列设置,其中相邻的两个风叶2之间均设置导风板3。相邻两个导风板3的第二段导向部32分别置于相邻的两个所述风叶2的中心连线异侧。图2中,最左侧的风机系统和中间的风机系统之间设置一个导风板3,最右侧的风机系统和中间的风机系统之间也设置一个导风板3,左侧导风板3的第二段导向部32置于左侧两个相邻风叶2中心连线的上侧,而右侧导风板3的第二段导向部32置于右侧两个相邻风叶2中线连线的下侧。As an implementable manner, as shown in FIG. 2, the number of fan systems is three or more, and three or more of the fan systems are arranged side by side or arranged up and down, wherein two adjacent blades 2 are disposed. Air deflector 3. The second segment guiding portions 32 of the adjacent two air guiding plates 3 are respectively placed on opposite sides of the center line of the adjacent two of the blades 2 . In Fig. 2, a wind deflector 3 is arranged between the leftmost fan system and the middle fan system, and a wind deflector 3 is also arranged between the rightmost fan system and the middle fan system, and the left deflector The second segment guide portion 32 of the third portion is placed on the upper side of the center line of the two adjacent blades 2 on the left side, and the second segment guide portion 32 of the right side wind deflector plate 3 is placed on the right two adjacent blades. 2 The lower side of the midline connection.
最左侧风机系统可以采用上出风、下出风或左出风的出风方式,也可采用上出风和下出风同时的出风方式,或采用上出风与左出风同时出风方式,或采用下出风与左出风同时的出风方式,或上出风、下出风和左出风同时出风方式。The leftmost fan system can adopt the air outlet mode of the upper air outlet, the lower air outlet or the left air outlet, or the air outlet mode of the upper air outlet and the lower air outlet, or the upper air outlet and the left air outlet. The wind mode, or the wind mode at the same time as the lower wind and the left wind, or the wind out, the wind and the left wind at the same time.
而中间的风机系统可采用上出风或下出风的出风方式,也可采用上出风和下出风同时的出风方式。The middle fan system can adopt the air outlet mode of the upper air outlet or the lower air outlet, and the air outlet mode of the upper air outlet and the lower air outlet can also be adopted.
最右侧的风机系统可采用上出风或下出风的出风方式,也可采用上出风和下出风同时的出风方式。当然最右侧的风机系统也可采用右侧出风方式。The rightmost fan system can adopt the air outlet mode of the upper air outlet or the lower air outlet, and the air outlet mode of the upper air outlet and the lower air outlet can also be adopted. Of course, the right side of the fan system can also use the right side of the wind.
相邻两个导风板3的第二段导向部32分别置于相邻的两个所述风叶2的中心连线异侧,从而使三个风机系统的出风方式选择更广,且风机系统噪音低。
The second segment guiding portions 32 of the adjacent two air guiding plates 3 are respectively disposed on opposite sides of the center line of the adjacent two of the blades 2, so that the air outlet modes of the three fan systems are wider, and The fan system is low in noise.
作为一种可实施方式,如图3所示,风机系统的数量为四个,四个所述风机系统呈“田”字形排布,其中,上面的两个风叶2之间设置有导风板3,下面的两个所述风叶之间也设置有导风板3。As an implementable manner, as shown in FIG. 3, the number of fan systems is four, and the four fan systems are arranged in a "field" shape, wherein an air guide is disposed between the upper two blades 2 The wind deflector 3 is also disposed between the two lower blades of the plate 3.
上面的两个风机系统均可以采用上出风或下出风的出风方式,也可采用上出风和下出风同时的出风方式,或采用一个风机系统上出风,另一个风机系统下出风的方式。下面的两个风机系统均可以采用上出风或下出风的出风方式,也可采用上出风和下出风同时的出风方式,或采用一个风机系统上出风,另一个风机系统下出风的方式。四个风机系统,出风方式更加灵活,进一步降低了各风机的负荷,噪音更低。The above two fan systems can adopt the air outlet mode of the upper air outlet or the lower air outlet, or the air outlet mode at the same time of the upper air outlet and the lower air outlet, or the air outlet on one fan system, and the other fan system. The way to get out of the wind. The following two fan systems can adopt the air outlet mode of the upper air outlet or the lower air outlet, or the air outlet mode of the upper air outlet and the lower air outlet, or the air outlet of one fan system, and the other fan system. The way to get out of the wind. The four fan systems have a more flexible air outlet, further reducing the load on each fan and lowering the noise.
作为一种可实施方式,风机系统的数量为多个,多个所述风机系统排布为至少两排,在每排所述风机系统中,相邻两个风叶2之间均设置有导风板3。As an implementation manner, the number of fan systems is multiple, and the plurality of fan systems are arranged in at least two rows. In each row of the fan systems, a guide is disposed between two adjacent blades 2 Wind board 3.
作为一种可实施方式,风机系统的风道的连通所述进风口的一端还设置用于防止风在所述风道内倒流的止回装置。设置止回装置,从而避免停止工作的风叶2对正常工作的风叶2的进出风影响,提高气流的热交换效率。As an implementation manner, the end of the air duct of the fan system that communicates with the air inlet is further provided with a non-return device for preventing wind from flowing back in the air passage. The non-return device is arranged to avoid the influence of the vane 2 that stops working on the inflow and outflow of the normally operating fan blade 2, and improve the heat exchange efficiency of the airflow.
分别对单风叶风机系统、双风叶风机系统和三风叶风机系统进行对比试验,具体实验数据如表1至表3所示:The comparison tests were carried out on the single fan blade system, the double fan blade system and the three fan blade system respectively. The specific experimental data are shown in Tables 1 to 3:
表1单风叶风机系统的实验数据Table 1 Experimental data of single fan blade system
表2双风叶风机系统的实验数据Table 2 Experimental data of the double fan blade system
表3三风叶风机系统的实验数据Table 3 Experimental data of the three-blade fan system
以上各表中,风挡表示电机的转速档位,其中SH表示超高档,H表示高档,MH表示中高档,M表示中档,L表示低档,SL表示超低档。单风叶风机系统是指采用一个风机系统,双风叶风机系统是指采用两个风机系统,三风叶风机系统是指采用三个风机系统。In the above tables, the windshield indicates the speed position of the motor, where SH indicates ultra-high grade, H indicates high-grade, MH indicates medium-to-high grade, M indicates mid-range, L indicates low-grade, and SL indicates ultra-low gear. The single-blade fan system refers to the use of one fan system, the dual-blade fan system refers to the use of two fan systems, and the three-blade fan system refers to the use of three fan systems.
对比以上各表的实验数据不难看出,在保证风量、电机功率基本持平的情况下,双风叶风机系统和三风叶风机系统较单风叶风机系统,噪音总值及噪音峰值都有所述降低,达到了提高噪音音质以及舒适性的目的。而在功率相等的前提下,噪音总值降低2dB(A)、噪音峰值有大幅下降,风量增加了30m3/h。Comparing the experimental data of the above tables, it is easy to see that in the case of ensuring that the air volume and motor power are basically flat, the double fan blade system and the three-blade fan system are more simple than the single fan blade system, and the total noise value and noise peak are available. The reduction is achieved for the purpose of improving noise quality and comfort. On the premise of equal power, the total noise value is reduced by 2dB (A), the noise peak is greatly reduced, and the air volume is increased by 30m 3 /h.
本发明还涉及一种空调器,包括上述任一技术方案的空调器的室内机,由于空调器除上述室内机外均为现有技术,此处不再赘述。The present invention also relates to an air conditioner, which includes the indoor unit of the air conditioner of any of the above aspects. Since the air conditioner is prior art except for the indoor unit, it will not be described herein.
以上实施例的空调器的室内机及空调器,采用多个风机系统,在满足整机性能的前提下,提高了室内气流组织的舒适性,并能够控制气流组织出风方式,提高风机效率;使房间气流组织更稳、更轻、从而实现风机系统的无风设计(即风速较低,人体感觉不到);
使风机电机在功率相等的前提下,噪音总值降低2dB(A)、噪音峰值有大幅下降,风量增加了约30m3/h。风机系统进风均匀,噪音总值及噪音音质表现良好,同时舒适性及风机效率达到最佳配置。The indoor unit and the air conditioner of the air conditioner of the above embodiment adopt a plurality of fan systems, and improve the comfort of the indoor airflow organization under the premise of satisfying the performance of the whole machine, and can control the airflow to form the air outlet mode and improve the fan efficiency; Make the airflow structure of the room more stable and lighter, so that the windless design of the fan system (ie, the wind speed is low, the human body can't feel it); the noise of the fan motor is reduced by 2dB (A) and noise under the premise of equal power. The peak value has dropped significantly and the air volume has increased by about 30m 3 /h. The fan system has a uniform air intake, good noise and noise quality, and the best configuration for comfort and fan efficiency.
以上所述实施例仅表达了本发明的几种实施方式,其描述较为具体和详细,但并不能因此而理解为对本发明专利范围的限制。应当指出的是,对于本领域的普通技术人员来说,在不脱离本发明构思的前提下,还可以做出若干变形和改进,这些都属于本发明的保护范围。因此,本发明专利的保护范围应以所附权利要求为准。
The above-mentioned embodiments are merely illustrative of several embodiments of the present invention, and the description thereof is more specific and detailed, but is not to be construed as limiting the scope of the invention. It should be noted that a number of variations and modifications may be made by those skilled in the art without departing from the spirit and scope of the invention. Therefore, the scope of the invention should be determined by the appended claims.
Claims (10)
- 一种空调器的室内机,其特征在于,包括:An indoor unit of an air conditioner, comprising:壳体,具有至少一个出风口和至少一个进风口,所述进风口的位置与所述室内机的蒸发器的位置相对应;a housing having at least one air outlet and at least one air inlet, the position of the air inlet corresponding to the position of the evaporator of the indoor unit;风机系统,设置在所述壳体内,所述风机系统包括风叶、风道和电机,所述风机系统的数量为两个以上,其中至少有两个相邻的所述风叶之间设置导风板,所述导风板与所述壳体形成所述风道,所述风道连通所述出风口和所述进风口,所述导风板包括依次连接的第一段导向部、第二段导向部和第三段导向部,所述第一段导向部和所述第三段导向部均为板状,所述第二段导向部的纵截面呈梨形。a fan system disposed in the housing, the fan system including a fan blade, a duct, and a motor, the number of the fan system being two or more, wherein at least two adjacent ones of the blades are disposed a wind deflector, the air deflector and the casing form the air duct, the air duct communicates with the air outlet and the air inlet, the air deflector includes a first section guiding portion sequentially connected, The second segment guiding portion and the third segment guiding portion are both plate-shaped, and the second segment guiding portion has a pear-shaped longitudinal section.
- 根据权利要求1所述的空调器的室内机,其特征在于:The indoor unit of an air conditioner according to claim 1, wherein:所述风机系统的数量为两个,两个所述风机系统上下排列设置或左右排列设置。The number of the fan systems is two, and the two fan systems are arranged one above the other or arranged side by side.
- 根据权利要求1所述的空调器的室内机,其特征在于:The indoor unit of an air conditioner according to claim 1, wherein:所述风机系统的数量为三个以上,三个以上所述风机系统左右排列设置或上下排列设置,其中相邻的两个所述风叶之间均设置所述导风板,相邻两个所述导风板的所述第二段导向部分别置于相邻的两个所述风叶的中心连线异侧。The number of the fan systems is three or more, and three or more of the fan systems are arranged side by side or arranged one above the other, wherein the air guiding plates are disposed between two adjacent ones of the blades, and two adjacent ones are adjacent to each other. The second segment guiding portions of the wind deflector are respectively disposed on opposite sides of a center line of two adjacent ones of the blades.
- 根据权利要求1所述的空调器的室内机,其特征在于:The indoor unit of an air conditioner according to claim 1, wherein:所述风机系统的数量为四个,四个所述风机系统呈“田”字形排布,其中,上面的两个所述风叶之间设置有所述导风板,下面的两个所述风叶之间也设置有所述导风板。The number of the fan systems is four, and the four fan systems are arranged in a "shape" shape, wherein the wind deflector is disposed between the two upper blades, and the lower two are The wind deflector is also disposed between the blades.
- 根据权利要求1所述的空调器的室内机,其特征在于:The indoor unit of an air conditioner according to claim 1, wherein:所述风机系统的数量为多个,多个所述风机系统排布为至少两排,在每排所述风机系统中,相邻两个所述风叶之间均设置有所述导风板。The number of the fan systems is plural, and the plurality of fan systems are arranged in at least two rows. In each row of the fan systems, the wind deflectors are disposed between two adjacent blades. .
- 根据权利要求1-5任一项所述的空调器的室内机,其特征在于:The indoor unit of an air conditioner according to any one of claims 1 to 5, wherein:所述壳体上还设置有蜗舌,所述蜗舌与所述导风板形成扩压部,所述扩压部作为所述风机系统的出风口或导向空间。The housing is further provided with a volute tongue, and the volute tongue and the air deflector form a diffusing portion, and the diffusing portion serves as an air outlet or a guiding space of the fan system.
- 根据权利要求1-5任一项所述的空调器的室内机,其特征在于:The indoor unit of an air conditioner according to any one of claims 1 to 5, wherein:所述风叶为离心风叶或轴流风叶。The blades are centrifugal blades or axial blades.
- 根据权利要求1-5任一项所述的空调器的室内机,其特征在于:The indoor unit of an air conditioner according to any one of claims 1 to 5, wherein:所述壳体的轮廓为方形或圆形,每个所述电机单独控制,所述风道的连通所述进风口的一端还设置用于防止风在所述风道内倒流的止回装置。The casing has a square or circular shape, and each of the motors is separately controlled, and an end of the air passage that communicates with the air inlet is provided with a non-return device for preventing wind from flowing back in the air passage.
- 根据权利要求1-5任一项所述的空调器的室内机,其特征在于: The indoor unit of an air conditioner according to any one of claims 1 to 5, wherein:所述第一段导向部的长度小于所述第三段导向部的长度。The length of the first segment guide is smaller than the length of the third segment guide.
- 一种空调器,其特征在于:An air conditioner characterized by:包括权利要求1-9任一项所述的空调器的室内机。 An indoor unit including the air conditioner according to any one of claims 1-9.
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104197411B (en) * | 2014-08-08 | 2017-07-28 | 珠海格力电器股份有限公司 | Indoor unit of air conditioner and air conditioner |
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Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03191250A (en) * | 1989-12-19 | 1991-08-21 | Mitsubishi Electric Corp | Indoor unit of air-conditioner |
JP2003207152A (en) * | 2002-01-18 | 2003-07-25 | Fujitsu General Ltd | Air conditioner |
KR20040029672A (en) * | 2002-10-02 | 2004-04-08 | 삼성전자주식회사 | Wall mounted air conditioner |
CN201110602Y (en) * | 2007-11-13 | 2008-09-03 | 珠海格力电器股份有限公司 | Split floor type air conditioner adopting novel air duct system |
CN101957020A (en) * | 2010-09-22 | 2011-01-26 | 广东美的电器股份有限公司 | Floor type air conditioner indoor machine |
CN102121729A (en) * | 2011-04-09 | 2011-07-13 | 广东美的电器股份有限公司 | Wall-mounted air conditioner indoor machine |
CN202133039U (en) * | 2010-12-30 | 2012-02-01 | 美的集团武汉制冷设备有限公司 | Air conditioner |
CN202350198U (en) * | 2011-11-28 | 2012-07-25 | 苏州三星电子有限公司 | Vertical cabinet type air conditioner |
CN104197411A (en) * | 2014-08-08 | 2014-12-10 | 珠海格力电器股份有限公司 | Indoor unit of air conditioner and air conditioner |
CN204100391U (en) * | 2014-08-08 | 2015-01-14 | 珠海格力电器股份有限公司 | Indoor unit of air conditioner and air conditioner |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2379626Y (en) * | 1999-03-05 | 2000-05-24 | 李少魁 | Double air flow air conditioning installation |
TWI267611B (en) * | 2003-09-16 | 2006-12-01 | Lg Electronics Inc | Integral type air conditioner and air guide structure thereof |
CN101464043A (en) * | 2007-12-21 | 2009-06-24 | 乐金电子(天津)电器有限公司 | Improved spiral casing structure of wall hanging air conditioner |
CN202040903U (en) * | 2011-04-26 | 2011-11-16 | 广东美的电器股份有限公司 | Indoor machine of floor type air conditioner |
ITPD20120198A1 (en) * | 2012-06-20 | 2013-12-21 | Emerson Network Power Srl | AIR CONDITIONING UNIT PARTICULARLY FOR LARGE SIZE CALCULATION CENTERS |
CN203718956U (en) * | 2014-02-20 | 2014-07-16 | 广东美的制冷设备有限公司 | Air conditioner |
-
2014
- 2014-08-08 CN CN201410390248.3A patent/CN104197411B/en not_active Expired - Fee Related
-
2015
- 2015-07-17 WO PCT/CN2015/084337 patent/WO2016019795A1/en active Application Filing
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03191250A (en) * | 1989-12-19 | 1991-08-21 | Mitsubishi Electric Corp | Indoor unit of air-conditioner |
JP2003207152A (en) * | 2002-01-18 | 2003-07-25 | Fujitsu General Ltd | Air conditioner |
KR20040029672A (en) * | 2002-10-02 | 2004-04-08 | 삼성전자주식회사 | Wall mounted air conditioner |
CN201110602Y (en) * | 2007-11-13 | 2008-09-03 | 珠海格力电器股份有限公司 | Split floor type air conditioner adopting novel air duct system |
CN101957020A (en) * | 2010-09-22 | 2011-01-26 | 广东美的电器股份有限公司 | Floor type air conditioner indoor machine |
CN202133039U (en) * | 2010-12-30 | 2012-02-01 | 美的集团武汉制冷设备有限公司 | Air conditioner |
CN102121729A (en) * | 2011-04-09 | 2011-07-13 | 广东美的电器股份有限公司 | Wall-mounted air conditioner indoor machine |
CN202350198U (en) * | 2011-11-28 | 2012-07-25 | 苏州三星电子有限公司 | Vertical cabinet type air conditioner |
CN104197411A (en) * | 2014-08-08 | 2014-12-10 | 珠海格力电器股份有限公司 | Indoor unit of air conditioner and air conditioner |
CN204100391U (en) * | 2014-08-08 | 2015-01-14 | 珠海格力电器股份有限公司 | Indoor unit of air conditioner and air conditioner |
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US12040200B2 (en) | 2017-06-20 | 2024-07-16 | Asm Ip Holding B.V. | Semiconductor processing apparatus and methods for calibrating a semiconductor processing apparatus |
US11976361B2 (en) | 2017-06-28 | 2024-05-07 | Asm Ip Holding B.V. | Methods for depositing a transition metal nitride film on a substrate by atomic layer deposition and related deposition apparatus |
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US11417545B2 (en) | 2017-08-08 | 2022-08-16 | Asm Ip Holding B.V. | Radiation shield |
US11769682B2 (en) | 2017-08-09 | 2023-09-26 | Asm Ip Holding B.V. | Storage apparatus for storing cassettes for substrates and processing apparatus equipped therewith |
US11830730B2 (en) | 2017-08-29 | 2023-11-28 | Asm Ip Holding B.V. | Layer forming method and apparatus |
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US11295980B2 (en) | 2017-08-30 | 2022-04-05 | Asm Ip Holding B.V. | Methods for depositing a molybdenum metal film over a dielectric surface of a substrate by a cyclical deposition process and related semiconductor device structures |
US11387120B2 (en) | 2017-09-28 | 2022-07-12 | Asm Ip Holding B.V. | Chemical dispensing apparatus and methods for dispensing a chemical to a reaction chamber |
US12033861B2 (en) | 2017-10-05 | 2024-07-09 | Asm Ip Holding B.V. | Method for selectively depositing a metallic film on a substrate |
US12040184B2 (en) | 2017-10-30 | 2024-07-16 | Asm Ip Holding B.V. | Methods for forming a semiconductor structure and related semiconductor structures |
US11639811B2 (en) | 2017-11-27 | 2023-05-02 | Asm Ip Holding B.V. | Apparatus including a clean mini environment |
US11682572B2 (en) | 2017-11-27 | 2023-06-20 | Asm Ip Holdings B.V. | Storage device for storing wafer cassettes for use with a batch furnace |
US11501973B2 (en) | 2018-01-16 | 2022-11-15 | Asm Ip Holding B.V. | Method for depositing a material film on a substrate within a reaction chamber by a cyclical deposition process and related device structures |
US12119228B2 (en) | 2018-01-19 | 2024-10-15 | Asm Ip Holding B.V. | Deposition method |
US11393690B2 (en) | 2018-01-19 | 2022-07-19 | Asm Ip Holding B.V. | Deposition method |
US11482412B2 (en) | 2018-01-19 | 2022-10-25 | Asm Ip Holding B.V. | Method for depositing a gap-fill layer by plasma-assisted deposition |
US11972944B2 (en) | 2018-01-19 | 2024-04-30 | Asm Ip Holding B.V. | Method for depositing a gap-fill layer by plasma-assisted deposition |
US11735414B2 (en) | 2018-02-06 | 2023-08-22 | Asm Ip Holding B.V. | Method of post-deposition treatment for silicon oxide film |
US11387106B2 (en) | 2018-02-14 | 2022-07-12 | Asm Ip Holding B.V. | Method for depositing a ruthenium-containing film on a substrate by a cyclical deposition process |
US11685991B2 (en) | 2018-02-14 | 2023-06-27 | Asm Ip Holding B.V. | Method for depositing a ruthenium-containing film on a substrate by a cyclical deposition process |
US11482418B2 (en) | 2018-02-20 | 2022-10-25 | Asm Ip Holding B.V. | Substrate processing method and apparatus |
US11939673B2 (en) | 2018-02-23 | 2024-03-26 | Asm Ip Holding B.V. | Apparatus for detecting or monitoring for a chemical precursor in a high temperature environment |
US11473195B2 (en) | 2018-03-01 | 2022-10-18 | Asm Ip Holding B.V. | Semiconductor processing apparatus and a method for processing a substrate |
US11398382B2 (en) | 2018-03-27 | 2022-07-26 | Asm Ip Holding B.V. | Method of forming an electrode on a substrate and a semiconductor device structure including an electrode |
US12020938B2 (en) | 2018-03-27 | 2024-06-25 | Asm Ip Holding B.V. | Method of forming an electrode on a substrate and a semiconductor device structure including an electrode |
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US11908733B2 (en) | 2018-05-28 | 2024-02-20 | Asm Ip Holding B.V. | Substrate processing method and device manufactured by using the same |
US11361990B2 (en) | 2018-05-28 | 2022-06-14 | Asm Ip Holding B.V. | Substrate processing method and device manufactured by using the same |
US11718913B2 (en) | 2018-06-04 | 2023-08-08 | Asm Ip Holding B.V. | Gas distribution system and reactor system including same |
US11530483B2 (en) | 2018-06-21 | 2022-12-20 | Asm Ip Holding B.V. | Substrate processing system |
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US11499222B2 (en) | 2018-06-27 | 2022-11-15 | Asm Ip Holding B.V. | Cyclic deposition methods for forming metal-containing material and films and structures including the metal-containing material |
US11952658B2 (en) | 2018-06-27 | 2024-04-09 | Asm Ip Holding B.V. | Cyclic deposition methods for forming metal-containing material and films and structures including the metal-containing material |
US11814715B2 (en) | 2018-06-27 | 2023-11-14 | Asm Ip Holding B.V. | Cyclic deposition methods for forming metal-containing material and films and structures including the metal-containing material |
US11492703B2 (en) | 2018-06-27 | 2022-11-08 | Asm Ip Holding B.V. | Cyclic deposition methods for forming metal-containing material and films and structures including the metal-containing material |
US11923190B2 (en) | 2018-07-03 | 2024-03-05 | Asm Ip Holding B.V. | Method for depositing silicon-free carbon-containing film as gap-fill layer by pulse plasma-assisted deposition |
US11646197B2 (en) | 2018-07-03 | 2023-05-09 | Asm Ip Holding B.V. | Method for depositing silicon-free carbon-containing film as gap-fill layer by pulse plasma-assisted deposition |
US11430674B2 (en) | 2018-08-22 | 2022-08-30 | Asm Ip Holding B.V. | Sensor array, apparatus for dispensing a vapor phase reactant to a reaction chamber and related methods |
US11274369B2 (en) | 2018-09-11 | 2022-03-15 | Asm Ip Holding B.V. | Thin film deposition method |
US11804388B2 (en) | 2018-09-11 | 2023-10-31 | Asm Ip Holding B.V. | Substrate processing apparatus and method |
US11885023B2 (en) | 2018-10-01 | 2024-01-30 | Asm Ip Holding B.V. | Substrate retaining apparatus, system including the apparatus, and method of using same |
US11414760B2 (en) | 2018-10-08 | 2022-08-16 | Asm Ip Holding B.V. | Substrate support unit, thin film deposition apparatus including the same, and substrate processing apparatus including the same |
US11664199B2 (en) | 2018-10-19 | 2023-05-30 | Asm Ip Holding B.V. | Substrate processing apparatus and substrate processing method |
US11735445B2 (en) | 2018-10-31 | 2023-08-22 | Asm Ip Holding B.V. | Substrate processing apparatus for processing substrates |
US11866823B2 (en) | 2018-11-02 | 2024-01-09 | Asm Ip Holding B.V. | Substrate supporting unit and a substrate processing device including the same |
US11499226B2 (en) | 2018-11-02 | 2022-11-15 | Asm Ip Holding B.V. | Substrate supporting unit and a substrate processing device including the same |
US11572620B2 (en) | 2018-11-06 | 2023-02-07 | Asm Ip Holding B.V. | Methods for selectively depositing an amorphous silicon film on a substrate |
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US11798999B2 (en) | 2018-11-16 | 2023-10-24 | Asm Ip Holding B.V. | Methods for forming a metal silicate film on a substrate in a reaction chamber and related semiconductor device structures |
US12040199B2 (en) | 2018-11-28 | 2024-07-16 | Asm Ip Holding B.V. | Substrate processing apparatus for processing substrates |
US11488819B2 (en) | 2018-12-04 | 2022-11-01 | Asm Ip Holding B.V. | Method of cleaning substrate processing apparatus |
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US11959171B2 (en) | 2019-01-17 | 2024-04-16 | Asm Ip Holding B.V. | Methods of forming a transition metal containing film on a substrate by a cyclical deposition process |
US11390946B2 (en) | 2019-01-17 | 2022-07-19 | Asm Ip Holding B.V. | Methods of forming a transition metal containing film on a substrate by a cyclical deposition process |
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US11342216B2 (en) | 2019-02-20 | 2022-05-24 | Asm Ip Holding B.V. | Cyclical deposition method and apparatus for filling a recess formed within a substrate surface |
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US11901175B2 (en) | 2019-03-08 | 2024-02-13 | Asm Ip Holding B.V. | Method for selective deposition of silicon nitride layer and structure including selectively-deposited silicon nitride layer |
US11742198B2 (en) | 2019-03-08 | 2023-08-29 | Asm Ip Holding B.V. | Structure including SiOCN layer and method of forming same |
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US11781221B2 (en) | 2019-05-07 | 2023-10-10 | Asm Ip Holding B.V. | Chemical source vessel with dip tube |
US11355338B2 (en) | 2019-05-10 | 2022-06-07 | Asm Ip Holding B.V. | Method of depositing material onto a surface and structure formed according to the method |
US11515188B2 (en) | 2019-05-16 | 2022-11-29 | Asm Ip Holding B.V. | Wafer boat handling device, vertical batch furnace and method |
US11996309B2 (en) | 2019-05-16 | 2024-05-28 | Asm Ip Holding B.V. | Wafer boat handling device, vertical batch furnace and method |
USD975665S1 (en) | 2019-05-17 | 2023-01-17 | Asm Ip Holding B.V. | Susceptor shaft |
USD947913S1 (en) | 2019-05-17 | 2022-04-05 | Asm Ip Holding B.V. | Susceptor shaft |
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US11908684B2 (en) | 2019-06-11 | 2024-02-20 | Asm Ip Holding B.V. | Method of forming an electronic structure using reforming gas, system for performing the method, and structure formed using the method |
US11476109B2 (en) | 2019-06-11 | 2022-10-18 | Asm Ip Holding B.V. | Method of forming an electronic structure using reforming gas, system for performing the method, and structure formed using the method |
US11390945B2 (en) | 2019-07-03 | 2022-07-19 | Asm Ip Holding B.V. | Temperature control assembly for substrate processing apparatus and method of using same |
US11746414B2 (en) | 2019-07-03 | 2023-09-05 | Asm Ip Holding B.V. | Temperature control assembly for substrate processing apparatus and method of using same |
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US12107000B2 (en) | 2019-07-10 | 2024-10-01 | Asm Ip Holding B.V. | Substrate support assembly and substrate processing device including the same |
US11664267B2 (en) | 2019-07-10 | 2023-05-30 | Asm Ip Holding B.V. | Substrate support assembly and substrate processing device including the same |
US11664245B2 (en) | 2019-07-16 | 2023-05-30 | Asm Ip Holding B.V. | Substrate processing device |
US11996304B2 (en) | 2019-07-16 | 2024-05-28 | Asm Ip Holding B.V. | Substrate processing device |
US11688603B2 (en) | 2019-07-17 | 2023-06-27 | Asm Ip Holding B.V. | Methods of forming silicon germanium structures |
US11615970B2 (en) | 2019-07-17 | 2023-03-28 | Asm Ip Holding B.V. | Radical assist ignition plasma system and method |
US11643724B2 (en) | 2019-07-18 | 2023-05-09 | Asm Ip Holding B.V. | Method of forming structures using a neutral beam |
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US12112940B2 (en) | 2019-07-19 | 2024-10-08 | Asm Ip Holding B.V. | Method of forming topology-controlled amorphous carbon polymer film |
US11557474B2 (en) | 2019-07-29 | 2023-01-17 | Asm Ip Holding B.V. | Methods for selective deposition utilizing n-type dopants and/or alternative dopants to achieve high dopant incorporation |
US11430640B2 (en) | 2019-07-30 | 2022-08-30 | Asm Ip Holding B.V. | Substrate processing apparatus |
US11443926B2 (en) | 2019-07-30 | 2022-09-13 | Asm Ip Holding B.V. | Substrate processing apparatus |
US11876008B2 (en) | 2019-07-31 | 2024-01-16 | Asm Ip Holding B.V. | Vertical batch furnace assembly |
US11587814B2 (en) | 2019-07-31 | 2023-02-21 | Asm Ip Holding B.V. | Vertical batch furnace assembly |
US11587815B2 (en) | 2019-07-31 | 2023-02-21 | Asm Ip Holding B.V. | Vertical batch furnace assembly |
US11680839B2 (en) | 2019-08-05 | 2023-06-20 | Asm Ip Holding B.V. | Liquid level sensor for a chemical source vessel |
USD965044S1 (en) | 2019-08-19 | 2022-09-27 | Asm Ip Holding B.V. | Susceptor shaft |
USD965524S1 (en) | 2019-08-19 | 2022-10-04 | Asm Ip Holding B.V. | Susceptor support |
US11639548B2 (en) | 2019-08-21 | 2023-05-02 | Asm Ip Holding B.V. | Film-forming material mixed-gas forming device and film forming device |
US11594450B2 (en) | 2019-08-22 | 2023-02-28 | Asm Ip Holding B.V. | Method for forming a structure with a hole |
US12040229B2 (en) | 2019-08-22 | 2024-07-16 | Asm Ip Holding B.V. | Method for forming a structure with a hole |
USD979506S1 (en) | 2019-08-22 | 2023-02-28 | Asm Ip Holding B.V. | Insulator |
US12033849B2 (en) | 2019-08-23 | 2024-07-09 | Asm Ip Holding B.V. | Method for depositing silicon oxide film having improved quality by PEALD using bis(diethylamino)silane |
US11827978B2 (en) | 2019-08-23 | 2023-11-28 | Asm Ip Holding B.V. | Methods for depositing a molybdenum nitride film on a surface of a substrate by a cyclical deposition process and related semiconductor device structures including a molybdenum nitride film |
US11286558B2 (en) | 2019-08-23 | 2022-03-29 | Asm Ip Holding B.V. | Methods for depositing a molybdenum nitride film on a surface of a substrate by a cyclical deposition process and related semiconductor device structures including a molybdenum nitride film |
US11898242B2 (en) | 2019-08-23 | 2024-02-13 | Asm Ip Holding B.V. | Methods for forming a polycrystalline molybdenum film over a surface of a substrate and related structures including a polycrystalline molybdenum film |
US11495459B2 (en) | 2019-09-04 | 2022-11-08 | Asm Ip Holding B.V. | Methods for selective deposition using a sacrificial capping layer |
US11823876B2 (en) | 2019-09-05 | 2023-11-21 | Asm Ip Holding B.V. | Substrate processing apparatus |
US11562901B2 (en) | 2019-09-25 | 2023-01-24 | Asm Ip Holding B.V. | Substrate processing method |
US11610774B2 (en) | 2019-10-02 | 2023-03-21 | Asm Ip Holding B.V. | Methods for forming a topographically selective silicon oxide film by a cyclical plasma-enhanced deposition process |
US11339476B2 (en) | 2019-10-08 | 2022-05-24 | Asm Ip Holding B.V. | Substrate processing device having connection plates, substrate processing method |
US12006572B2 (en) | 2019-10-08 | 2024-06-11 | Asm Ip Holding B.V. | Reactor system including a gas distribution assembly for use with activated species and method of using same |
US11735422B2 (en) | 2019-10-10 | 2023-08-22 | Asm Ip Holding B.V. | Method of forming a photoresist underlayer and structure including same |
US12009241B2 (en) | 2019-10-14 | 2024-06-11 | Asm Ip Holding B.V. | Vertical batch furnace assembly with detector to detect cassette |
US11637011B2 (en) | 2019-10-16 | 2023-04-25 | Asm Ip Holding B.V. | Method of topology-selective film formation of silicon oxide |
US11637014B2 (en) | 2019-10-17 | 2023-04-25 | Asm Ip Holding B.V. | Methods for selective deposition of doped semiconductor material |
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US11996292B2 (en) | 2019-10-25 | 2024-05-28 | Asm Ip Holding B.V. | Methods for filling a gap feature on a substrate surface and related semiconductor structures |
US11646205B2 (en) | 2019-10-29 | 2023-05-09 | Asm Ip Holding B.V. | Methods of selectively forming n-type doped material on a surface, systems for selectively forming n-type doped material, and structures formed using same |
US11594600B2 (en) | 2019-11-05 | 2023-02-28 | Asm Ip Holding B.V. | Structures with doped semiconductor layers and methods and systems for forming same |
CN110836421A (en) * | 2019-11-07 | 2020-02-25 | 珠海格力电器股份有限公司 | Air duct structure and air conditioner |
US11501968B2 (en) | 2019-11-15 | 2022-11-15 | Asm Ip Holding B.V. | Method for providing a semiconductor device with silicon filled gaps |
US11626316B2 (en) | 2019-11-20 | 2023-04-11 | Asm Ip Holding B.V. | Method of depositing carbon-containing material on a surface of a substrate, structure formed using the method, and system for forming the structure |
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US11915929B2 (en) | 2019-11-26 | 2024-02-27 | Asm Ip Holding B.V. | Methods for selectively forming a target film on a substrate comprising a first dielectric surface and a second metallic surface |
US11401605B2 (en) | 2019-11-26 | 2022-08-02 | Asm Ip Holding B.V. | Substrate processing apparatus |
US11646184B2 (en) | 2019-11-29 | 2023-05-09 | Asm Ip Holding B.V. | Substrate processing apparatus |
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US11929251B2 (en) | 2019-12-02 | 2024-03-12 | Asm Ip Holding B.V. | Substrate processing apparatus having electrostatic chuck and substrate processing method |
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US11527403B2 (en) | 2019-12-19 | 2022-12-13 | Asm Ip Holding B.V. | Methods for filling a gap feature on a substrate surface and related semiconductor structures |
US12119220B2 (en) | 2019-12-19 | 2024-10-15 | Asm Ip Holding B.V. | Methods for filling a gap feature on a substrate surface and related semiconductor structures |
US11976359B2 (en) | 2020-01-06 | 2024-05-07 | Asm Ip Holding B.V. | Gas supply assembly, components thereof, and reactor system including same |
US12033885B2 (en) | 2020-01-06 | 2024-07-09 | Asm Ip Holding B.V. | Channeled lift pin |
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US11961741B2 (en) | 2020-03-12 | 2024-04-16 | Asm Ip Holding B.V. | Method for fabricating layer structure having target topological profile |
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