WO2016017133A1

WO2016017133A1 - Electronic device

Info

Publication number: WO2016017133A1
Application number: PCT/JP2015/003726
Authority: WO
Inventors: 康弘吉村; 光敏筒井
Original assignee: シャープ株式会社
Priority date: 2014-07-29
Filing date: 2015-07-24
Publication date: 2016-02-04
Also published as: JPWO2016017133A1

Abstract

A metal-plate frame (31) is provided with an opening (34) for a flexible substrate, and a flexible substrate (23) for liquid crystal use extends via the opening (34) for the flexible substrate to a circuit substrate assembly (4). The metal-plate frame (31) is bent in a manner such that a bent section (35) forms a two-layered structure, and by spot welding (36) (connection structure), a state of contact is maintained between the bent section (35) and the metal-plate frame (31). As a result, it is possible to improve the stability of high-frequency properties while improving strength by preventing damage to a peripheral structure.

Description

Electronics

The present invention relates to an electronic apparatus having a cabinet of a resin molded product in which a frame sheet metal is insert-molded.

2. Description of the Related Art Conventionally, an electronic device such as a smartphone having a resin molded product cabinet in which a frame sheet metal is insert-molded is known. Since the frame sheet metal is usually formed from a thin metal plate by press working or the like, a portion to be a cut surface is sharp. In addition, since thin and light weight is desired for smartphones and the like, the frame sheet metal is becoming thinner and thinner. The frame sheet metal plays a role of releasing heat of an electronic component arranged in the cabinet or stabilizing the high frequency characteristics by grounding.

For example, as in Patent Document 1, in a ground connection structure of an electrical connection box, a ground plate portion is bent 180 degrees to provide a connection portion that protrudes outward from an outer peripheral portion, and this connection portion is protruded from a case to What is fixed to the body and grounded is known.

Japanese Patent Laid-Open No. 11-4520

However, when the metal plate is bent, there is a problem that the high-frequency characteristics are not stable because the current path is different depending on whether the bent portion is in contact with the metal plate or not. Moreover, since the cut surface is sharp in the part where the end surface of the metal plate is exposed, there is a possibility that the surrounding structure is damaged. Further, the portion of the cut surface that is not covered with the resin portion and not bent has only the strength of one metal plate.

The present invention has been made in view of such points, and an object of the present invention is to prevent damage to surrounding structures while stabilizing high-frequency characteristics in an electronic device having a cabinet in which a frame sheet metal is insert-molded. It is to improve the strength.

In order to achieve the above object, in the present invention, the end portion of the frame sheet metal is bent, and the contact state between the bent portion and the peripheral edge of the end portion is maintained.

Specifically, in the present invention, on the premise of an electronic device having a cabinet of a resin molded product in which a frame sheet metal is insert-molded,
The frame sheet metal is bent at the end exposed from the resin portion so that the bent piece has a double structure, and a connection structure is provided to maintain the contact state between the bent piece and the peripheral edge of the end. The electronic components in the cabinet are grounded.

According to the above configuration, the bent piece has a double structure at the end exposed from the resin part, so that the strength is increased compared to the case where there is no bend, and the pointed end face faces inward, so the surrounding structure Things will not be damaged. Further, since the bent piece and the frame sheet metal are always in contact with each other by the connection structure that maintains the contact state, the high frequency characteristics are stabilized.

Further, in the present invention, on the premise of an electronic device having a cabinet of a resin molded product in which a frame sheet metal is insert-molded, and a circuit board built in the cabinet and grounded to the frame sheet metal,
The frame metal plate has an opening in a portion exposed from the resin portion, and a wiring extending through the opening to the circuit board is provided.
The peripheral edge of the opening is bent so that the bent piece has a double structure, and a connection structure is provided to maintain the contact state between the bent piece and the peripheral edge of the opening.

According to the above configuration, since the bent piece has a double structure in the opening exposed from the resin portion, the strength around the opening is increased as compared with the case where there is no bending, and the sharp end face faces inward. Therefore, the wiring extending to the circuit board is not damaged. Further, since the bent piece and the frame metal plate are always in contact with each other by the connection structure that maintains the contact state, the high frequency characteristics of the circuit are stabilized.

As described above, according to the present invention, in an electronic device having a cabinet in which a frame sheet metal is insert-molded, damage to surrounding structures can be prevented and strength can be improved while stabilizing high frequency characteristics.

It is the II sectional view taken on the line of FIG. 2, and its partial expanded sectional view. It is a perspective view which shows the mobile telephone which concerns on Embodiment 1 of this invention. It is a disassembled perspective view which shows a mobile telephone. It is a perspective view which expands and shows a part of frame sheet metal. FIG. 3 is a view corresponding to FIG. 1 showing a mobile phone according to a second embodiment of the present invention. FIG. 6 is a view corresponding to FIG. 1 illustrating a mobile phone according to a third embodiment of the present invention. FIG. 6 is a view corresponding to FIG. 1 showing a mobile phone according to a fourth embodiment of the present invention. FIG. 6 is a view corresponding to FIG. 1 showing a mobile phone according to a fifth embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(Embodiment 1)
1 to 4 show a mobile phone 1 as an electronic apparatus according to Embodiment 1 of the present invention. The mobile phone 1 includes, for example, a display unit 2 and a front side on which the display unit 2 is fixed with a double-sided tape 20. A cabinet 3, a circuit board assembly 4 disposed on the back surface of the front side cabinet 3, and a rear cover 5 covering the circuit board assembly 4 are provided.

As shown in an enlarged view in FIG. 1, the display unit 2 includes a cover member 21 made of transparent glass, an acrylic plate, and the like, and a liquid crystal unit 22 as an electronic component attached to the cover member 21. A liquid crystal flexible substrate 23 as a wiring extends from the lower end of the liquid crystal unit 22. Although not shown, a touch panel as an electronic component is attached to the back surface of the cover member 21, and a touch panel flexible substrate 24 as a wiring extends from the lower end of the touch panel. The display unit 2 may also serve as a touch panel.

The front side cabinet 3 is made of a resin molded product in which a frame metal plate 31 made of a stainless steel thin plate, an aluminum alloy thin plate or the like is insert-molded. As shown in FIG. 4, the frame metal plate 31 has a side wall 32 bent at the periphery covered with the resin portion 3 a, for example, and a plurality of through holes 33 are formed. For example, the center of the lower side of the frame sheet metal 31 is not provided with a side wall 32 but is provided with a flexible opening 34 through which the liquid crystal flexible substrate 23 and the touch panel flexible substrate 24 are bent and passed. The flexible opening 34 is exposed from the resin portion 3a.

In the present embodiment, the bent piece 35 is bent at the flexible opening 34 so as to have a double structure. The shape of the bent piece 35 is not particularly limited, but a certain amount of width (the width in the vertical direction of the mobile phone 1) is provided to ensure strength. A plurality of electronic components in the front cabinet 3 are grounded to the frame sheet metal 31. For example, the grounding portion 23 a of the liquid crystal flexible substrate 23 is grounded at the bent piece 35.

Since the bent piece 35 is only bent 180 degrees by press work, the contact surface with the frame metal plate 31 at the periphery of the flexible opening 34 is in contact with and not in contact with the current. Since the paths are different, there is a problem that high frequency characteristics are not stable.

Therefore, in the present embodiment, a connection structure is provided that maintains the contact state between the bent piece 35 and the frame metal plate 31 at the periphery of the flexible opening 34. Specifically, this connection structure is spot welding 36, and is provided, for example, at three locations with a predetermined interval.

Thus, in this embodiment, since the bent piece 35 has a double structure in the flexible opening 34 exposed from the resin portion 3a, the strength around the flexible opening 34 is increased as compared with the case where there is no bending. ing.

Further, since the sharp end surface is directed inward by cutting or the like, the liquid crystal flexible substrate 23 and the touch panel flexible substrate 24 extending to the circuit board assembly 4 are not damaged.

Further, since the bent piece 35 and the frame sheet metal 31 are always in contact by the spot welding 36 that maintains the contact state, the high-frequency characteristics of the circuit board assembly 4 are stabilized.

Therefore, according to the mobile phone 1 according to the present embodiment, the strength can be improved by preventing damage to surrounding structures while stabilizing the high frequency characteristics.

(Embodiment 2)
FIG. 5 shows Embodiment 2 of the present invention, which differs from Embodiment 1 in that the connection structure is different. In the following embodiments, the same parts as those in FIGS. 1 to 4 are denoted by the same reference numerals, and detailed description thereof will be omitted.

The connection structure of this embodiment is a conductive tape 136 provided between the bent piece 35 and the frame sheet metal 31. Although this electrically conductive tape 136 is not specifically limited, For example, it consists of what provided the adhesive agent on both surfaces of the base material which has electroconductivity.

By sticking the bent piece 35 to the periphery of the flexible opening 34 using the conductive tape 136, the connection state between the bent piece 35 and the frame metal plate 31 can be stably maintained while maintaining conductivity. .

The conductive tape 136 does not require a large-scale welding facility such as spot welding and is extremely easy to assemble.

Also in this embodiment, the strength can be improved by preventing damage to surrounding structures while stabilizing the high frequency characteristics.

(Embodiment 3)
FIG. 6 shows Embodiment 3 of the present invention, which differs from the above embodiments in that the connection structure is different.

The connection structure of this embodiment is arc welding 236 applied between the bent piece 35 and the frame sheet metal 31. In this arc welding 236, at least the tip of the bent piece 35 is welded to the frame sheet metal 31 by fillet welding.

In this case, since the welded portion conducts and is firmly fixed, the connection state between the bent piece 35 and the frame metal plate 31 can be stably maintained while maintaining conductivity.

(Embodiment 4)
FIG. 7 shows Embodiment 4 of the present invention, which differs from the above embodiments in that the connection structure is different.

The connection structure of this embodiment is soldering 336 applied between the bent piece 35 and the frame metal plate 31. In this soldering 336, at least the tip of the bent piece 35 is welded to the frame metal plate 31 with a solder material. The solder material is not particularly limited, but may be selected according to the material of the frame metal plate 31.

Soldering 336 is advantageous in that it can be performed with simple equipment compared to spot welding or arc welding.

In this case, since the soldering 336 is reliably conducted and firmly fixed, the connection state between the bent piece 35 and the frame metal plate 31 can be stably maintained while maintaining conductivity.

(Embodiment 5)
FIG. 8 shows Embodiment 5 of the present invention, which differs from the above embodiments in that the connection structure is different.

The connection structure of this embodiment includes a spring contact 436 provided on the bent piece 35. For example, a slit is provided in a part of the bent piece 35, and a portion surrounded by the slit is slightly bent so that the spring contact 436 is always in contact with the frame metal plate 31 by utilizing the spring property. Yes. Although the spring contact 436 is formed integrally with the frame metal plate 31, in FIG. 8, the type of hatching is changed for easy viewing.

This embodiment is advantageous in that it does not require separate parts or special equipment for providing a connection structure as in the above embodiments.

Also in this case, the connection state between the bent piece 35 and the frame metal plate 31 can be stably maintained by the spring property of the spring contact 436.

(Other embodiments)
The present invention may be configured as follows with respect to the above embodiment.

That is, in the above embodiment, the bent piece 35 is provided at the center of the lower end of the frame metal plate 31, but this position is not particularly limited, and is provided not only at the peripheral portion of the frame metal plate 31 but also at the periphery of the through hole in the central portion. May be.

In the above-described embodiment, examples of the flexible substrate for liquid crystal 23 and the flexible substrate for touch panel 24 are shown as the wiring, but the present invention is not limited to this, and a flexible substrate or electric wire extending from another electronic component may be used.

In the above-described embodiment, the electronic device is the mobile phone 1, but it is a tablet terminal, PHS (Personal Handy-phone System), PDA (Personal Digital Assistant), personal computer, mobile tool, electronic dictionary, calculator, game machine, or the like. It may be a small liquid crystal display, a liquid crystal television, a Blu-ray disc recorder, a DVD recorder, or the like.

In addition, the above embodiment is an essentially preferable example, and is not intended to limit the scope of the present invention, its application, and use. The technical features described in each embodiment can be combined with each other, and a new technical feature can be formed by combining them.

1 Mobile phone (electronic equipment)
2 Display unit 3 Front side cabinet 3a Resin part 4 Circuit board assembly 5 Rear cover 20 Double-sided tape 21 Cover member 22 Liquid crystal unit (electronic component)
23 Flexible substrate for LCD (wiring)
23a Grounding part 24 Flexible substrate for touch panel (wiring)
31 Frame Sheet Metal 32 Side Wall 33 Through Hole 34 Flexible Opening 35 Bending Piece 36 Spot Welding 136 Conductive Tape 236 Arc Welding 336 Soldering 436 Spring Contact

Claims

In an electronic device having a cabinet of a resin molded product in which a frame sheet metal is insert-molded,
The frame sheet metal is bent at the end exposed from the resin portion so that the bent piece has a double structure, and a connection structure is provided to maintain the contact state between the bent piece and the peripheral edge of the end. The electronic device in the cabinet is grounded.
In an electronic device having a cabinet of a resin molded product in which a frame sheet metal is insert-molded, and a circuit board built in the cabinet and grounded to the frame sheet metal,
The frame metal plate has an opening in a portion exposed from the resin portion, and a wiring extending through the opening to the circuit board is provided.
The peripheral edge of the opening is bent so that the bent piece has a double structure, and a connection structure is provided to maintain the contact state between the bent piece and the peripheral edge of the opening. Electronics.
The electronic device according to claim 2,
A display unit disposed on the front side of the frame sheet metal;
An electronic apparatus, wherein the opening passes through a flexible substrate that extends from the display portion and is bent to the back side, and the flexible substrate is connected to the circuit substrate.
The electronic device according to any one of claims 1 to 3,
The electronic device according to claim 1, wherein the connection structure is spot welding, arc welding, soldering or conductive tape performed between the bent piece and the frame metal plate.
The electronic device according to any one of claims 1 to 3,
The electronic device according to claim 1, wherein the connection structure is a spring contact provided between the bent piece and the frame metal plate.