CN102563460B - Light source structure and backlight module - Google Patents
Light source structure and backlight module Download PDFInfo
- Publication number
- CN102563460B CN102563460B CN2011104240424A CN201110424042A CN102563460B CN 102563460 B CN102563460 B CN 102563460B CN 2011104240424 A CN2011104240424 A CN 2011104240424A CN 201110424042 A CN201110424042 A CN 201110424042A CN 102563460 B CN102563460 B CN 102563460B
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- circuit board
- perforation
- light
- metal bump
- wire
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Abstract
The invention discloses a light source structure and a backlight module. The light source structure comprises a circuit board, a plurality of light sources, a guide wire and at least one through hole, wherein the light sources are arranged on the circuit board; the guide wire is arranged on the circuit board and is partitioned between the edge of the circuit board and the light source; the through hole is formed in a path of the guide wire and is matched with a metal back plate of the backlight module; at least one slotting structure is arranged on the side edge of the through hole, so that convenience is brought to sleeving; and an exposed head of the guide wire is arranged at the through hole and comprises a conductive matter which is arranged on a side wall opposite to the through hole. The backlight module comprises the metal back plate and the light source structure. Due to the adoption of the light source structure and the backlight module with the light source structure, a good electrostatic discharge protective effect is achieved; and the light source structure can be conveniently assembled on the back plate of the backlight module.
Description
The application is for dividing an application, and the applying date of original application is: on January 19th, 2010; Application number is: 201010002591.8; Denomination of invention is: light-source structure and backlight module
technical field
The present invention relates to a kind of light-source structure; Particularly, the present invention relates to the light-source structure that a kind of liquid crystal display backlight module is used.
background technology
Liquid crystal display (Liquid Crystal Display, LCD) is widely used on the various electronic products such as computing machine, TV and mobile phone.Backlight module (backlight module) is one of liquid crystal display important composition assembly.The light-source structure that backlight module is used, directly affect usefulness and the assembly cost of backlight module.
As shown in Figure 1, existing backlight module 80 comprises light-source structure 20 and metal backing 70.Wherein, the assembling alignment mode of light-source structure 20 and metal backing 70 be on metal backing 70 discounting line 71 as contraposition reference.Adopt this mode to be assembled contraposition, the broken line 71 of often using because of contraposition is difficult for identification and personnel assemble deviation, causes light-source structure 20 skews, and then causes light-source structure 20 electric connecting terminals (not illustrating) loose contact, is difficult for inserting or the problem such as easily come off.
On the other hand, existing light-source structure 20, without suitable static discharge (Electrostatic Discharge, ESD) protection mechanism, is attacked the light source 23 on light-source structure 20 so static discharge often occurs, and causes the damage of light source 23.The above light-source structure 20 and backlight module 80 be designed with improved space.
summary of the invention
Fundamental purpose of the present invention is to provide a kind of light-source structure, has preferably static discahrge protection effect.
Another purpose of the present invention is to provide a kind of light-source structure, can be assembled in more expediently the backboard of backlight module.
Another object of the present invention is to provide a kind of backlight module, there is preferably static discahrge protection effect.
Another object of the present invention is to provide a kind of backlight module, can assemble more expediently.
To achieve these goals, the invention provides a kind of light-source structure can be for backlight module, and light-source structure comprises circuit board, a plurality of light source, wire and at least one perforation.A plurality of light sources are arranged on circuit board.Wire is arranged on circuit board, intercepts between the edge and light source of circuit board.At least one perforation is arranged on the path of wire, for the metal backing assembly with backlight module.Wherein, wire has and appears in the perforation place, appears and comprises the conducting objects that is arranged at the sidewall that perforation is relative.
Metal backing has the metal bump structure, and circuit board comprises flexible circuit board.Circuit board is provided with two flanges in the relative both sides of perforation, along the path of wire, from circuit board, toward perforation is inner, protrudes respectively.Wire extends and to arrange to the perforation edge, and appears and be arranged at the sidewall that two flanges is relative in perforation.When perforation and metal backing assembly, the metal bump structure is arranged in perforation two flanges is bent respectively, is arranged at the appearing of sidewall that two flanges is relative in perforation and touches the sidewall of metal bump structure, makes wire form path via the metal bump structure.
Metal backing has the metal bump structure, circuit board comprises flexible circuit board, the aperture essence of the perforation of circuit board is less than the diameter of metal bump structure, and the metal bump structure is arranged in perforation the circuit board section bending made around perforation, so that wire forms path via the metal bump structure.
The appear root edge of the perforation that is positioned at circuit board, when board sleeve is located at the metal bump structure, circuit board can bend, and the root edge at the perforation place of circuit board can form path with the metal bump structure.The perforation side is provided with at least one slotting structure, so that sheathed.
Metal backing has the metal bump structure, and circuit board comprises rigid circuit board.When perforation and metal backing assembly, the metal bump structure is arranged in perforation, appears and touches the sidewall in the metal bump structure, makes wire form path via the metal bump structure.Appear and be arranged at plating mode the sidewall that perforation is relative.
Light-source structure further comprises protective seam, be arranged on this circuit board, and the mode of appearing with exposure covers wire.Circuit board further has extension, and the extension tail end has pin, and pin is electrically connected to light source.Light source comprises light emitting diode.
To achieve these goals, the present invention also provides a kind of backlight module, comprises metal backing and light-source structure.Metal backing has at least one metal bump structure.Light-source structure comprises circuit board, a plurality of light source, wire and at least one perforation.A plurality of light sources are arranged on circuit board.Wire is arranged on circuit board, intercepts between the edge and light source of circuit board.Perforation is arranged on the path of wire, in being arranged in for the metal bump structure, makes circuit board group be assigned in backlight module.Wherein, wire has and appears in the perforation place, and appearing is for being arranged at the conducting objects of the sidewall that perforation is relative.When the metal bump structure is arranged in perforation, wire touches the metal bump structure to form path via appearing.
Effect of the present invention is, adopts light-source structure provided by the invention and has the backlight module of this light-source structure, has preferably static discahrge protection effect, and light-source structure, can be assembled in more expediently the backboard of backlight module.
Below in conjunction with the drawings and specific embodiments, describe the present invention, but not as a limitation of the invention.
The accompanying drawing explanation
Fig. 1 is the prior art schematic diagram;
Fig. 2 is embodiment of the present invention schematic diagram;
Fig. 3 A to Fig. 3 C is preferred embodiment schematic diagram of the present invention;
Fig. 4 A and Fig. 4 B are the different embodiments of the invention schematic diagram;
Fig. 5 A to Fig. 5 C is the different embodiments of the invention schematic diagram;
Fig. 6 A and Fig. 6 B are the different embodiment schematic diagram that the present invention has protective seam; And
Fig. 7 is the different embodiment schematic diagram that the present invention has extension.
Wherein, Reference numeral
71 pairs of bit line
100 protective seams
200 light-source structures
210 circuit boards
218 extensions
219 pins
230 light sources
250 wires
251 appear
270 perforations
271 flanges
272 slotting structures
620 light guide plate
660 reflecting plates
700 metal backings
710 metal bump structures
800 backlight modules
Embodiment
Below in conjunction with accompanying drawing, structural principle of the present invention and principle of work are described in detail:
Backlight module exploded perspective view as shown in Figure 2, in preferred embodiment, light-source structure 200 of the present invention can be for backlight module 800.Particularly, backlight module 800 comprises light-source structure 200 and metal backing 700, and metal backing 700 has at least one metal bump structure 710, and light-source structure 200 can be by 710 assembly of metal bump structure on metal backing 700.In other words, can use metal bump structure 710 by light-source structure 200 and metal backing 700 assemblings, need not first use pairs of bit line 71 as shown in Figure 1 to assemble again to aim at, can promote the convenience of assembling and reduce deviation.Wherein, metal bump structure 710 is arranged at the one side of metal backing 700 with respect to light-source structure 200, and corresponding with the setting position of light-source structure 200.Can directly by metal backing 700, with the metal extrusion type, form metal bump structure 710, or via welding, welding, lock or the mode of pasting using a bump bond in metal backing on 700 as metal bump structure 710.Only the invention is not restricted to this, visual actual demand selects appropriate ways to form the metal bump structure.
Fig. 3 A is light-source structure 200 preferred embodiment schematic perspective views of the present invention, the schematic perspective view that Fig. 3 B is light-source structure 200 preferred embodiments of the present invention and metal backing 700 assembly, the schematic cross-section that Fig. 3 C is light-source structure 200 preferred embodiments of the present invention and metal backing 700 assembly.As shown in Figure 3A, light-source structure 200 of the present invention comprises circuit board 210, a plurality of light source 230, wire 250 and at least one perforation 270.Light source 230 is arranged on circuit board 210.Wire 250 is arranged on circuit board 210, and wire 250 intercepts between the edge of circuit board 210 and light source 230, and is preferably and parallelly extends along edge as Fig. 3 A.Light source 230 can comprise light emitting diode.Particularly, in the edge of wire 250 relative circuit boards 210 is surrounded on light source 230.Perforation 270 is arranged on the path of wire 250, and for using with metal backing 700 assembly of backlight module 800 as shown in Figure 2, in metal bump structure 710 is arranged in perforation 270, wire 250 251 touches metal bump structure 710 to form path via appearing.Perforation 270 is preferably in the two ends of circuit board 210 and respectively establishes one, however its quantity and position viewable design demand and difference.Wherein, wire 250 has and appears 251 in perforation 270 places, appears 251 to comprise the conducting objects that is arranged at the sidewall that perforation 270 faces mutually.Conducting objects comprises the conductive material that has with the identical or different material of wire, can use plating, spot printing or the mode pasted arranges, the elargol of the sidewall spot printing of for example facing mutually in perforation 270 or the carbon paste band of pasting.
In preferred embodiment, circuit board 210 comprises flexible circuit board.Embodiment as shown in Fig. 3 A to Fig. 3 C, circuit board 210 is provided with two flanges 271 in the relative both sides of perforation 270, along the path of wire 250, from circuit board 210, toward perforation 270 is inner, protrudes respectively.Wire 250 is to extend to arrange to perforation 270 edges, and appears and 251 be arranged at the sidewall that two flanges 271 is faced mutually in perforation 270.When perforation 270 and metal backing 700 assembly, metal bump structure 710 is arranged in perforation 270 two flanges 271 is bent respectively, be arranged at 251 sidewalls that touch metal bump structure 710 of appearing of sidewall that two flanges 271 faces mutually in perforation 270, make wire 250 form paths via metal bump structure 710.When circuit board 210 is sheathed on metal bump structure 710, circuit board 210 can bend as shown in Fig. 3 B and Fig. 3 C, and the lateral margin at perforation 270 places of circuit board 210 can form path with metal bump structure 710.
Particularly, in the embodiment as shown in Fig. 3 A to Fig. 3 C because circuit board 210 is to can be flexible circuit board, and the relative distance essence of two flanges 271 is less than the diameter of metal bump structure 710, therefore when perforation 270 and metal backing 700 assembly, two flanges 271 can be arranged in the upwards bending of supporting respectively in perforation 270 because of metal bump structure 710.Now, be arranged at 251 sidewalls that touch metal bump structure 710 of appearing of the sidewall that two flanges 271 faces mutually in perforation 270, make wire 250 form path via metal bump structure 710, and in light source 230 is surrounded on, to intercept edge and the light source 230 of circuit board 210.Because the static discharge fecund is born in the edge of circuit board 210, whereby can be when static discharge produces, by being electrically connected to of wire 250 and metal bump structure 710, static is imported to ground, reduce 230 rounds static discharges of light source and attack damage, make light-source structure 200 integral body there is preferably static discahrge protection effect.
The preferred embodiment schematic perspective view that Fig. 4 A is light-source structure 200 of the present invention, the preferred embodiment schematic perspective view that Fig. 4 B is light-source structure 200 of the present invention and metal backing 700 assembly.In different embodiment, circuit board 210 is not limited to use flange 271 to support metal bump structure 710.As shown in Fig. 4 A and Fig. 4 B, circuit board 210 can be flexible circuit board, the aperture essence of the perforation 270 of circuit board 210 is less than the diameter of metal bump structure 710, metal bump structure 710 is arranged in perforation 270 the circuit board section bending made around perforation 270, so that wire 250 forms path via metal bump structure 710.In other words, metal bump structure 710 is to fill in perforation 270, because the aperture essence of the perforation 270 of circuit board 210 is less than the diameter of metal bump structure 710, therefore can make the circuit board section bending around perforation 270, and be arranged at 251 sidewalls that can touch metal bump structure 710 of appearing of sidewall that perforation 270 faces mutually, make wire 250 form paths via metal bump structure 710.On the other hand, perforation 270 sides can further be provided with at least one slotting structure 272, so that sheathed.Particularly, slotting structure 272 can be given the deformability that perforation 270 is larger, so as to accommodating metal bump structure 710.
The preferred embodiment schematic perspective view that Fig. 5 A is light-source structure 200 of the present invention, the preferred embodiment schematic perspective view that Fig. 5 B is light-source structure 200 of the present invention and metal backing 700 assembly, the preferred embodiment schematic cross-section that Fig. 5 C is light-source structure 200 of the present invention and metal backing 700 assembly.As shown in Figure 5 A to FIG. 5 C, in different embodiment, circuit board 210 is not limited to use soft circuit board, as long as the aperture of the perforation 270 of accurate control circuit board 210, and 251 the distance of appearing that makes to be arranged at sidewall that perforation 270 faces mutually is equal to or slightly less than the diameter of metal bump structure 710, or making metal bump structure 710 adopt up-narrow and down-wide conical design, circuit board 210 also can use rigid circuit board.When perforation 270, during with metal backing 700 assembly, metal bump structure 710 is arranged in perforation 270, appears 251 to touch in the sidewall of metal bump structure 710, makes wire 250 form paths via metal bump structure 710.Wherein, perforation 270 sides can further be provided with at least one slotting structure 272, so that sheathed.Particularly, slotting structure 272 can be given the deformability that perforation 270 is larger, so as to accommodating metal bump structure 710.
Fig. 6 A is the schematic perspective view that light-source structure 200 of the present invention has protective seam 100, and Fig. 6 B is the schematic cross-section that light-source structure 200 of the present invention has protective seam 100.In the different embodiment as shown in Fig. 6 A and Fig. 6 B, light-source structure 200 further comprises protective seam 100, is arranged on circuit board 210, and covers wire 250 in exposure 251 the mode of appearing, not oxidized in order to guardwire 250.In other words; wire 250 protected seams 100 cover to avoid oxidation, and appearing 251 does not have protected seam 100 to cover, in order to when perforation 270 and metal backing 700 assembly; metal bump structure 710 is arranged in perforation 270, makes to appear 251 can touch in the sidewall of metal bump structure 710.Wherein, protective seam 100 can be selected from macromolecular material, metal oxide or other suitable material.
Fig. 7 is that light-source structure 200 of the present invention has the schematic top plan view of extension 218.Different embodiment as shown in Figure 7, circuit board 210 further has extension 218, and extension 218 tail ends have pin 219.Particularly, pin 219 is for being arranged at the metallic contact of extension 218 tail ends.Wherein, pin 219 is electrically connected to light source 230, and pin 219 can further connect power supply (not illustrating).In other words, light source 230 can connect power supply by pin 219.It should be noted that, wire 250 there is no and is electrically connected with pin 219.In this embodiment, wire 250 is parallelly along extension 218 edges, to extend as Fig. 7, and when pin 219 connects power supplys, the wire 250 of loop circuit capable plate 210 can reach static discahrge protection effect.
Certainly; the present invention also can have other various embodiments; in the situation that do not deviate from spirit of the present invention and essence thereof; those of ordinary skill in the art are when making according to the present invention various corresponding changes and distortion, but these corresponding changes and distortion all should belong to the protection domain of the appended claim of the present invention.
Claims (14)
1. a light-source structure, for a backlight module, is characterized in that, this light-source structure comprises:
One circuit board;
A plurality of light sources, be arranged on this circuit board;
One wire, be arranged on this circuit board, and this wire intercepts between the edge of this circuit board and the plurality of light source, and this conductor loop is around the plurality of light source; And
At least one perforation, be arranged on the path of this wire, for the metal backing assembly with this backlight module, wherein this wire has and appears in this perforation place, this is appeared and comprises the conducting objects that is arranged at the sidewall that this perforation is relative, this perforation side is provided with at least one slotting structure, so that sheathed.
2. light-source structure according to claim 1, it is characterized in that, this metal backing has a metal bump structure, this circuit board comprises flexible circuit board, the aperture of this perforation of this circuit board is less than the diameter of this metal bump structure, this metal bump structure is arranged in this perforation this circuit board section bending made around this perforation, so that this wire forms path via this metal bump structure.
3. light-source structure according to claim 1, it is characterized in that, this metal backing has a metal bump structure, this circuit board comprises rigid circuit board, when this perforation and this metal backing assembly, this metal bump structure of this metal backing is arranged in this perforation, and this is appeared and touches the sidewall in this metal bump structure, makes this wire form path via this metal bump structure.
4. light-source structure according to claim 1, is characterized in that, this is appeared and is arranged at plating mode the sidewall that this perforation is relative.
5. light-source structure according to claim 1, is characterized in that, further comprises a protective seam, is arranged on this circuit board, and covers this wire to expose this mode of appearing.
6. light-source structure according to claim 1, is characterized in that, this circuit board further has an extension, and this extension tail end has a pin, and this pin is electrically connected to the plurality of light source.
7. light-source structure according to claim 1, is characterized in that, the plurality of light source comprises light emitting diode.
8. a backlight module, is characterized in that, comprises:
One metal backing, have at least one metal bump structure; And
One light-source structure comprises:
One circuit board;
A plurality of light sources, be arranged on this circuit board;
One wire, be arranged on this circuit board, and this wire intercepts between the edge of this circuit board and the plurality of light source, and this conductor loop is around the plurality of light source; And
At least one perforation, be arranged on the path of this wire, in being arranged in for this metal bump structure, make this circuit board group be assigned in this backlight module, wherein this wire has and appears in this perforation place, and this is appeared and comprises the conducting objects that is arranged at the sidewall that this perforation is relative, when this metal bump structure is arranged in this perforation, this wire is appeared and is touched this metal bump structure to form path via this, and this perforation side is provided with at least one slotting structure, so that sheathed.
9. backlight module according to claim 8, it is characterized in that, this circuit board comprises flexible circuit board, the aperture of this perforation of this circuit board is less than the diameter of this metal bump structure, this metal bump structure is arranged in this perforation this circuit board section bending made around this perforation, so that this wire forms path via this metal bump structure.
10. backlight module according to claim 8, it is characterized in that, this circuit board comprises rigid circuit board, when this perforation and this metal backing assembly, this metal bump structure is arranged in this perforation, this is appeared and touches the sidewall in this metal bump structure, makes this wire form path via this metal bump structure.
11. backlight module according to claim 8, is characterized in that, this is appeared and is arranged at plating mode the sidewall that this perforation is relative.
12. backlight module according to claim 8, is characterized in that, further comprises a protective seam, is arranged on this circuit board, and covers this wire to expose this mode of appearing.
13. backlight module according to claim 8, is characterized in that, this circuit board further has an extension, and this extension tail end has a pin, and this pin is electrically connected to the plurality of light source.
14. backlight module according to claim 8, is characterized in that, this light source comprises light emitting diode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011104240424A CN102563460B (en) | 2010-01-19 | 2010-01-19 | Light source structure and backlight module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011104240424A CN102563460B (en) | 2010-01-19 | 2010-01-19 | Light source structure and backlight module |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010100025918A Division CN101776228B (en) | 2010-01-19 | 2010-01-19 | Light source structure and backlight module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102563460A CN102563460A (en) | 2012-07-11 |
| CN102563460B true CN102563460B (en) | 2013-12-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011104240424A Expired - Fee Related CN102563460B (en) | 2010-01-19 | 2010-01-19 | Light source structure and backlight module |
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| Country | Link |
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| CN (1) | CN102563460B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102878495B (en) * | 2012-10-12 | 2016-05-25 | 北京京东方光电科技有限公司 | The preparation method of backlight, backlight and display unit |
| CN103594022A (en) * | 2013-11-21 | 2014-02-19 | 友达光电(厦门)有限公司 | Display device |
| CN109828412A (en) * | 2019-02-28 | 2019-05-31 | 厦门天马微电子有限公司 | Backlight module and display device |
| CN112365796B (en) * | 2020-11-26 | 2022-09-27 | 京东方科技集团股份有限公司 | Backlight module and display device |
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| CN1800945A (en) * | 2006-01-06 | 2006-07-12 | 友达光电股份有限公司 | Light source assembly |
| US7192176B2 (en) * | 2004-07-06 | 2007-03-20 | Au Optronics Corp. | Backlight assembly for a hand-held liquid crystal display |
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| TW200821696A (en) * | 2006-11-03 | 2008-05-16 | Innolux Display Corp | Backlight module and liquid crystal display device |
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| CN101435936A (en) * | 2007-11-12 | 2009-05-20 | 奇美电子股份有限公司 | Backlight module and display apparatus |
| CN101578006A (en) * | 2008-05-08 | 2009-11-11 | 胜华科技股份有限公司 | Electrostatic defending device of touch panel |
| US20090296016A1 (en) * | 2008-05-29 | 2009-12-03 | Au Optronics Corporation | Liquid Crystal Display and Frame Set Thereof |
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2010
- 2010-01-19 CN CN2011104240424A patent/CN102563460B/en not_active Expired - Fee Related
Patent Citations (8)
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|---|---|---|---|---|
| US7192176B2 (en) * | 2004-07-06 | 2007-03-20 | Au Optronics Corp. | Backlight assembly for a hand-held liquid crystal display |
| CN1800945A (en) * | 2006-01-06 | 2006-07-12 | 友达光电股份有限公司 | Light source assembly |
| CN2937824Y (en) * | 2006-06-19 | 2007-08-22 | 黄进华 | Cold cathode tube connection structure of backlight module |
| TW200821696A (en) * | 2006-11-03 | 2008-05-16 | Innolux Display Corp | Backlight module and liquid crystal display device |
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| CN102563460A (en) | 2012-07-11 |
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Granted publication date: 20131218 Termination date: 20210119 |