WO2016011689A1 - 紫外led光源及oled器件的固化封装装置与方法 - Google Patents

紫外led光源及oled器件的固化封装装置与方法 Download PDF

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Publication number
WO2016011689A1
WO2016011689A1 PCT/CN2014/084454 CN2014084454W WO2016011689A1 WO 2016011689 A1 WO2016011689 A1 WO 2016011689A1 CN 2014084454 W CN2014084454 W CN 2014084454W WO 2016011689 A1 WO2016011689 A1 WO 2016011689A1
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Prior art keywords
ultraviolet led
light source
oled device
led light
pcb board
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PCT/CN2014/084454
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English (en)
French (fr)
Inventor
倪奎
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TCL China Star Optoelectronics Technology Co Ltd
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Shenzhen China Star Optoelectronics Technology Co Ltd
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Priority to US14/426,977 priority Critical patent/US9899628B2/en
Publication of WO2016011689A1 publication Critical patent/WO2016011689A1/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/06—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations

Definitions

  • UV LED light source and curing package device and method for OLED device UV LED light source and curing package device and method for OLED device
  • the present invention relates to the field of OLED device processing, and in particular, to a UV LED light source and a curing package device and method for the OLED device. Background technique
  • OLED Organic Light Emitting Diode
  • OLED has self-luminous, low driving voltage, high luminous efficiency, short response time, high definition and contrast ratio, near 180 ° viewing angle, wide temperature range, and flexible display
  • advantages such as large-area full-color display, it is recognized by the industry as the most promising display device.
  • UV curing technology is the most commonly used technology for OLED device packaging. UV light is used to illuminate the liquid UV glue, which causes cross-linking reaction inside the UV glue and rapid solidification. UV curing has the following characteristics: No solvent or a small amount of solvent is used to reduce the environmental pollution of the solvent; Low energy consumption, low temperature curing, suitable for heat sensitive materials; Fast curing speed, high efficiency, high speed production line Use, the curing equipment has a small footprint.
  • UV light sources use strong ultraviolet high-pressure mercury lamps, which are vacuum linear light sources. They are made of high-quality pure quartz tubes, and ultraviolet rays can penetrate a lot. Strong UV High Pressure Mercury lamps range in length from 5 cm to 300 cm, with a spectral effective range of 350-450 nm and a main peak of 365 nm.
  • FIG. 1 is a schematic diagram of a curing package device of a conventional OLED device.
  • the device includes a UV curing chamber 100, an OLED device 200 to be packaged in the UV curing chamber 100, and a plurality of strong ultraviolet high pressure mercury lamps 300 disposed under the OLED device 200 to be packaged, due to the plurality of strong ultraviolet high voltages.
  • the ultraviolet light emitted by the mercury lamp 300 is irradiated to the organic light-emitting layer in addition to the UV plastic frame for packaging the OLED device, and the high-power ultraviolet light easily damages the organic light-emitting layer, accelerates the aging of the organic light-emitting layer, and causes the work to occur.
  • the curing package device of the existing OLED device further includes a mask disposed between the OLED device 200 to be packaged and the plurality of strong ultraviolet high pressure mercury lamps 300. 400.
  • the organic light-emitting layer is protected by using the mask 400 to reduce damage of the organic light-emitting layer by ultraviolet light irradiation. Therefore, curing different sizes of OLED devices requires different equipment Masks of size and thickness result in increased production costs.
  • a plurality of strong ultraviolet high-pressure mercury lamps 300 are linear light sources, the plurality of strong ultraviolet high-pressure mercury lamps 300 and the OLED device to be packaged 200 are required to ensure uniform illumination of the OLED device 200 to be packaged to a larger size.
  • the distance H' is larger, about 60cm, which not only increases the height of the UV curing machine, but also greatly increases the power consumption of the strong ultraviolet high pressure mercury lamp, resulting in waste of energy, and the strong ultraviolet high pressure mercury lamp can emit enough UV energy.
  • the duration is generally less than 1500 hours and the life is short. Summary of the invention
  • the OLED device is cured and packaged, which eliminates the mask and effectively protects the organic light-emitting layer.
  • Another object of the present invention is to provide a curing and packaging device for an OLED device, which can save the mask, effectively protect the organic light-emitting layer, reduce the production cost, and can reduce the energy consumption and prolong the life of the ultraviolet light source.
  • the present invention first provides an ultraviolet LED light source, the ultraviolet LED light source comprising a PCB board, and a plurality of ultraviolet LED lamps mounted on the PCB board, the plurality of ultraviolet LED lamps along the PCB board
  • the horizontal and vertical directions are arranged in a matrix, and the PCB board is provided with a driving circuit corresponding to each of the ultraviolet LED lamps, and the switch of each of the ultraviolet LED lamps can be controlled, so that the light emitting region of the ultraviolet LED light source can be selectively controlled.
  • the effective illumination area of the ultraviolet LED light source is 730 mm X 460 mm
  • the illuminance of the ultraviolet LED light source is 100 00 mW/cm 2
  • the ultraviolet LED lamp has a spectral effective range of 350-450 nm and a peak wavelength of 365.
  • the present invention also provides a curing and packaging device for an OLED device, comprising: a UV curing chamber, an OLED device to be packaged in the UV curing chamber, and a UV curing chamber disposed under the OLED device to be packaged
  • An ultraviolet LED light source comprising a PCB board and a plurality of ultraviolet LED lamps mounted on the PCB board, wherein the plurality of ultraviolet LED lamps are arranged in a matrix along a lateral direction and a longitudinal direction of the PCB board, the PCB
  • the board is provided with a driving circuit corresponding to each ultraviolet LED lamp, and can control the switch of each ultraviolet LED lamp, thereby selectively controlling the light emitting area of the ultraviolet LED light source, so that the light emitting area corresponds to the UV plastic frame of the OLED device to be packaged.
  • the effective illumination area of the ultraviolet LED light source is 730 mm X 460 mm, and the illumination thereof lOOmw/cm 2 , the ultraviolet LED lamp has a spectral effective range of 350-450 nm and a peak wavelength of 365 nm.
  • the distance between the ultraviolet LED light source and the OLED device to be packaged is H 5 mm.
  • the cured package device of the OLED device further includes a reflective plate disposed under the ultraviolet LED light source.
  • the invention also provides a curing and packaging method for an OLED device, comprising the following steps: Step 1: providing a UV curing chamber;
  • the UV curing chamber is provided with an ultraviolet LED light source and a reflecting plate disposed under the ultraviolet LED light source;
  • the ultraviolet LED light source includes a PCB board, and a plurality of ultraviolet LED lamps mounted on the PCB board, the number The ultraviolet LED lamps are arranged in a matrix along the horizontal and vertical directions of the PCB board, and the PCB board is provided with a driving circuit corresponding to each ultraviolet LED lamp, and can control the switch of each ultraviolet LED lamp;
  • Step 2 placing the OLED device to be packaged into the UV curing chamber, and the OLED device to be packaged is located above the ultraviolet LED light source;
  • Step 3 By controlling the driving circuit of the PCB board, the ultraviolet LED lamp corresponding to the UV plastic frame of the OLED device to be packaged is turned on, and the UV plastic frame is irradiated to be cured;
  • Step 4 After the curing is completed, pass Controlling the driving circuit of the PCB board, and closing the ultraviolet LED lamp corresponding to the UV plastic frame of the OLED device to be packaged, and completing the packaging.
  • the effective light-emitting area of the ultraviolet LED light source is 730 mm X 460 mm, and the illuminance is 100 mW/cm 2 , the spectral effective range of the ultraviolet LED lamp is between 350-450 nm, and the peak wavelength is 365 nm; the ultraviolet LED light source and the package to be packaged
  • the distance of the OLED device is H 5 mm.
  • the ultraviolet LED light source of the present invention has a plurality of ultraviolet LED lamps arranged in a matrix, and is capable of selectively controlling a light emitting region thereof through a PCB board, and when the OLED device is cured and packaged using the ultraviolet LED light source
  • the mask can be omitted to effectively protect the organic light-emitting layer.
  • the curing and packaging device of the OLED device of the present invention can eliminate the mask by setting the ultraviolet LED light source and controlling the light-emitting area corresponding to the UV plastic frame of the OLED device to be packaged.
  • the board effectively protects the organic light-emitting layer, reduces the production cost, and can reduce the energy consumption and prolong the life of the ultraviolet light source.
  • the curing and packaging method of the OLED device of the present invention controls the ultraviolet LED corresponding to the area of the UV plastic frame of the OLED device to be packaged.
  • the lamp, which cures the package eliminates the need for a mask, which reduces production costs and reduces energy consumption.
  • FIG. 1 is a front view of a curing and packaging device of a conventional OLED device;
  • FIG. 2 is a perspective view of the ultraviolet LED light source of the present invention.
  • FIG. 3 is a perspective view of a curing package device of an OLED device of the present invention.
  • FIG. 4 is a top plan view of an ultraviolet LED light source and an OLED device to be packaged in a curing package device of the OLED device of the present invention
  • FIG. 5 is a flow chart of a method of curing and packaging the OLED device of the present invention. detailed description
  • the present invention first provides an ultraviolet light emitting diode (Light Emitting).
  • the ultraviolet LED light source 3 includes a PCB board 31, and a plurality of ultraviolet LED lamps 33 mounted on the PCB board 31.
  • the plurality of ultraviolet LED lamps 33 are arranged in a matrix along the lateral direction and the longitudinal direction of the PCB board 31.
  • the PCB board 31 is provided with a driving circuit (not shown) corresponding to each of the ultraviolet LED lamps 33, and is capable of being used for each ultraviolet LED lamp.
  • the switch of 33 is controlled so that the light-emitting area of the ultraviolet LED light source 3 can be selectively controlled.
  • the effective light-emitting area of the ultraviolet LED light source 3 is 730 mm X 460 mm, and the illuminance is 100 00 mW/cm 2 , and the spectral effective range of the ultraviolet LED lamp 33 is between 350-450 nm, and the peak wavelength is 365 nm.
  • the ultraviolet LED light source 3 Compared with the strong ultraviolet high-pressure mercury lamp, the ultraviolet LED light source 3 has a longer life on the one hand, and the life of the excellent ultraviolet LED light source can reach 50,000 hours in the case of good heat dissipation and constant current driving; It has good performances such as high illumination and low light decay, and the thermal radiation of the ultraviolet LED light source is small, which belongs to a cold light source, which is environmentally friendly and has low energy consumption; more importantly, several ultraviolet LED lamps 33 of the ultraviolet LED light source 3 Along the horizontal and vertical directions of the PCB board 31, a planar light source is formed, and the ultraviolet light emitted by the surface is uniformly matched, and the light emitting area can be selectively controlled by the PCB board 31.
  • the ultraviolet LED light source 3 the OLED is used. When the device is cured and packaged, it can be closer to the OLED device, which can greatly reduce the energy consumption.
  • the mask can be omitted, and the organic light-emitting layer can be effectively protected.
  • the present invention further provides a curing and packaging device for an OLED device, comprising: a UV curing chamber 1 , an OLED to be packaged in the UV curing chamber 1 The device 2, the ultraviolet LED light source 3 disposed in the UV curing chamber 1 under the OLED device 2 to be packaged, and the reflective plate 4 disposed under the ultraviolet LED light source 3.
  • the ultraviolet LED light source 3 includes a PCB board 31 and a plurality of ultraviolet LED lamps 33 mounted on the PCB board 31.
  • the plurality of ultraviolet LED lamps 33 are arranged along the horizontal and vertical directions of the PCB board 31.
  • the PCB board 31 is provided with a driving circuit corresponding to each of the ultraviolet LED lamps 33, and can control the switch of each of the ultraviolet LED lamps 33, thereby selectively controlling the light emitting area of the ultraviolet LED light source 3, so that the light emitting area corresponds to The UV plastic frame 22 of the OLED device 2 to be packaged, and other regions do not emit light, thereby eliminating the use of the mask and protecting the organic light-emitting layer in the OLED device 2 to be packaged from ultraviolet light damage.
  • the effective light-emitting area of the ultraviolet LED light source 3 is 730 mm X 460 mm, and the illuminance is 100 00 mW/cm 2 , and the spectral effective range of the ultraviolet LED lamp 33 is between 350-450 nm, and the peak wavelength is 365 nm.
  • the distance between the ultraviolet LED light source 3 and the OLED device 2 to be packaged is 5 5 mm, which can greatly reduce the energy consumption.
  • the present invention further provides a curing and packaging method for an OLED device, comprising the following steps: Step 1. Providing a UV curing chamber 1.
  • the UV curing chamber 1 is provided with an ultraviolet LED light source 3, and is disposed in the ultraviolet LED light source
  • the ultraviolet LED light source 3 includes a PCB board 31, and a plurality of ultraviolet LED lamps 33 mounted on the PCB board 31, the plurality of ultraviolet LED lamps 33 along the lateral direction of the PCB board 31 Arranged in a matrix with the longitudinal direction, the PCB board 31 is provided with a driving circuit corresponding to each of the ultraviolet LED lamps 33, and is capable of controlling the switching of each of the ultraviolet LED lamps 33.
  • the effective light-emitting area of the ultraviolet LED light source 3 is 730 mm X 460 mm, and the illuminance is 100 00 mW/cm 2 , and the spectral effective range of the ultraviolet LED lamp 33 is between 350-450 nm, and the peak wavelength is 365 nm.
  • Step 2 The OLED device 2 to be packaged is placed in the UV curing chamber 1 , and the OLED device 2 to be packaged is located above the ultraviolet LED light source 3 . Specifically, the distance H 5 mm between the ultraviolet LED light source 3 and the OLED device 2 to be packaged can greatly reduce energy consumption.
  • Step 3 By controlling the driving circuit of the PCB board 31, the ultraviolet LED lamp 33 corresponding to the area of the UV plastic frame 22 of the OLED device 2 to be packaged is turned on, and the UV plastic frame 22 is irradiated to be cured.
  • This step 3 eliminates the use of a mask, which can reduce the cost and does not cause damage to the organic light-emitting layer in the packaged OLED device 2.
  • Step 4 After the curing is completed, the UV LED lamp 33 corresponding to the area of the UV plastic frame 22 of the OLED device 2 to be packaged is closed by controlling the driving circuit of the PCB board 31 to complete the packaging.
  • the ultraviolet LED light source of the present invention has a plurality of ultraviolet LED lamps arranged in a matrix, and can selectively control the light emitting region thereof through the PCB board.
  • the mask can be omitted to effectively protect the organic light-emitting layer.
  • the curing and packaging device of the OLED device of the present invention can eliminate the mask by setting the ultraviolet LED light source and controlling the light-emitting area corresponding to the UV plastic frame of the OLED device to be packaged.
  • the curing and packaging method of the OLED device of the present invention by controlling the ultraviolet LED lamp corresponding to the UV plastic frame of the OLED device to be packaged , to achieve a solidified package, without the use of a mask, which can reduce production costs and reduce energy consumption.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Plasma & Fusion (AREA)
  • Electroluminescent Light Sources (AREA)
  • Led Device Packages (AREA)

Abstract

本发明提供一种紫外LED光源及OLED器件的固化封装装置与方法。该紫外LED光源(3)包括PCB板(31)、及安装于该PCB板(31)上的数个紫外LED灯(33)，所述数个紫外LED灯(33)沿所述PCB板(31)的横向与纵向排列成矩阵，所述PCB板(31)对应每一紫外LED灯(33)设置驱动电路，能够对每一紫外LED灯(33)的开关进行控制，从而能够有选择的控制所述紫外LED光源(3)的发光区域。使用该紫外LED光源对OLED器件进行固化封装，能够省去掩膜板，有效保护有机发光层。

Description

紫外 LED光源及 OLED器件的固化封装装置与方法
技术领域
本发明涉及 OLED 器件制程领域， 尤其涉及一种紫外 LED 光源及 OLED器件的固化封装装置与方法。 背景技术
有机电致发光显示器件 （ Organic Light Emitting Diode， OLED ) 具有自 发光、 驱动电压低、 发光效率高、 响应时间短、 清晰度与对比度高、 近 180 ° 视角、 使用温度范围宽， 可实现柔性显示与大面积全色显示等诸多优点， 被业界公认为是最有发展潜力的显示装置。
在 OLED器件的制程过程中， 将基板与盖板进行粘结， 实现固化封装 以阻止水汽、 氧气进入 OLED 内部， 是一项很重要的技术， 固化封装效果 将直接影响 OLED内部器件的性能。
紫外光 (UV)固化技术是 OLED器件封装最常用的技术， 采用紫外光辐 射照射液态的 UV胶， 使得 UV胶内部发生交联反应并快速凝固成形。 UV 固化具有如下特点： 不使用溶剂或使用少量溶剂， 减少了溶剂对环境的污 染； 耗能少， 可低温固化， 适用于对热敏感的材料； 固化速度快， 效率高， 可在高速生产线上使用， 固化设备占地面积小等。
传统的紫外光源多采用强紫外线高压水银灯， 属于真空线型光源， 其 采用高品^的纯石英管材制造而成， 紫外线能够大量穿透。 强紫外线高压 水银灯的发光长度自 5厘米至 300厘米不等， 光谱有效范围在 350-450nm 之间， 主波峰为 365nm。
请参阅图 1， 为一现有的 OLED 器件的固化封装装置的示意图。 该装 置包括一 UV固化腔室 100，设于该 UV固化腔室 100内的待封装 OLED器 件 200、 设于待封装 OLED器件 200下方的数个强紫外线高压水银灯 300， 由于该数个强紫外线高压水银灯 300 发出的紫外光除了照射用于封装 OLED器件的 UV胶框外， 还照射到有机发光层， 大功率的紫外光容易损伤 有机发光层，加速有机发光层的老化，使其工作过程中出现黑斑，影响 OLED 器件的性能， 縮短 OLED器件的寿命， 所以该现有的 OLED器件的固化封 装装置还包括一设于待封装 OLED器件 200与数个强紫外线高压水银灯 300 之间的掩膜板 400， 使用该掩膜板 400保护有机发光层， 降低紫外光照射对 有机发光层的损伤。 因此， 固化封装不同尺寸的 OLED器件， 需配备不同 尺寸与厚度的掩膜板， 造成生产成本增加。
另一方面， 由于数个强紫外线高压水银灯 300 为线型光源， 为了保证 照射到较大尺寸的待封装 OLED器件 200的光均勾一致， 该数个强紫外线 高压水银灯 300与待封装 OLED器件 200的距离 H'较大， 约为 60cm， 不 仅使得 UV 固化机台的高度增加， 还大幅提高了强紫外线高压水银灯的耗 电量， 造成能源浪费， 且强紫外线高压水银灯能够射出足够的 UV 能量的 时长一般不超过 1500小时， 寿命较短。 发明内容
本发明的目的在于提供一种紫外 LED光源， 使用该紫外 LED光源对
OLED器件进行固化封装， 能够省去掩膜板， 有效保护有机发光层。
本发明的另一目的在于提供一种 OLED器件的固化封装装置， 能够省 去掩膜板， 有效保护有机发光层， 降低生产成本， 并能够减少能耗， 延长 紫外光源的寿命。
本发明的目的还在于提供一种 OLED器件的固化封装方法， 该方法不 需要使用掩膜板， 能够降低生产成本， 减少能耗。
为实现上述目的， 本发明首先提供一种紫外 LED 光源， 该紫外 LED 光源包括 PCB板、 及安装于该 PCB板上的数个紫外 LED灯， 所述数个紫 外 LED灯沿所述 PCB板的横向与纵向排列成矩阵， 所述 PCB板对应每一 紫外 LED灯设置驱动电路， 能够对每一紫外 LED灯的开关进行控制， 从而 能够有选择的控制所述紫外 LED光源的发光区域。
所述紫外 LED光源的有效发光区域为 730mm X 460mm
所述紫外 LED光源的照度 1 OOmw/cm2
所述紫外 LED 灯的光谱有效范围在 350-450nm 之间， 峰值波长为 365
本发明还提供一种 OLED器件的固化封装装置， 包括： UV固化腔室、 设于该 UV固化腔室内的待封装 OLED器件、 及于该待封装 OLED器件下 方设于所述 UV固化腔室内的紫外 LED光源，所述紫外 LED光源包括 PCB 板、 及安装于该 PCB板上的数个紫外 LED灯， 所述数个紫外 LED灯沿所 述 PCB板的横向与纵向排列成矩阵， 所述 PCB板对应每一紫外 LED灯设 置驱动电路， 能够对每一紫外 LED灯的开关进行控制， 从而能够有选择的 控制紫外 LED光源的发光区域， 使该发光区域对应于待封装 OLED器件的 UV胶框。
所述紫外 LED 光源的有效发光区域为 730mm X 460mm， 其照度 lOOmw/cm2, 所述紫外 LED灯的光谱有效范围在 350-450nm之间， 峰值波 长为 365nm。
所述紫外 LED光源与待封装 OLED器件的距离 H 5mm。
所述的 OLED器件的固化封装装置， 还包括一设于所述紫外 LED光源 下方的反射板。
本发明还提供一种 OLED器件的固化封装方法， 包括如下步骤： 步骤 1、 提供 UV固化腔室；
该 UV固化腔室内设有紫外 LED光源、及设于所述紫外 LED光源下方 的反射板； 所述紫外 LED光源包括 PCB板、 及安装于该 PCB板上的数个 紫外 LED灯， 所述数个紫外 LED灯沿所述 PCB板的横向与纵向排列成矩 阵，所述 PCB板对应每一紫外 LED灯设置驱动电路，能够对每一紫外 LED 灯的开关进行控制；
步骤 2、将待封装 OLED器件放入 UV固化腔室内， 且该待封装 OLED 器件位于所述紫外 LED光源上方；
步骤 3、 通过控制所述 PCB板的驱动电路， 开启与待封装 OLED器件 的 UV胶框对应区域的紫外 LED灯， 对所述 UV胶框进行照射使其固化； 步骤 4、 固化完成后， 通过控制所述 PCB板的驱动电路， 关闭与待封 装 OLED器件的 UV胶框对应区域的紫外 LED灯， 完成封装。
所述紫外 LED 光源的有效发光区域为 730mm X 460mm， 其照度 lOOmw/cm2, 所述紫外 LED灯的光谱有效范围在 350-450nm之间， 峰值波 长为 365nm; 所述紫外 LED光源与待封装 OLED器件的距离 H 5mm。
本发明的有益效果： 本发明的紫外 LED光源， 具有排列成矩阵的数个 紫外 LED灯， 且能够通过 PCB板有选择的控制其发光区域， 当使用该紫外 LED光源对 OLED器件进行固化封装时， 能够省去掩膜板， 有效保护有机 发光层； 本发明的 OLED器件的固化封装装置， 通过设置紫外 LED光源， 控制其发光区域对应于待封装 OLED器件的 UV胶框， 能够省去掩膜板， 有效保护有机发光层， 降低生产成本， 并能够减少能耗， 延长紫外光源的 寿命； 本发明的 OLED器件的固化封装方法， 通过控制与待封装 OLED器 件的 UV胶框对应区域的紫外 LED灯， 实现固化封装， 不需要使用掩膜板， 从而能够降低生产成本， 减少能耗。
为了能更进一步了解本发明的特征以及技术内容， 请参阅以下有关本 发明的详细说明与附图， 然而附图仅提供参考与说明用， 并非用来对本发 明加以限制。 附图说明
下面结合附图， 通过对本发明的具体实施方式详细描述， 将使本发明 的技术方案及其它有益效果显而易见。
附图中，
图 1为一种现有的 OLED器件的固化封装装置的主视示意图； 图 2为本发明紫外 LED光源的立体示意图；
图 3为本发明 OLED器件的固化封装装置的立体示意图；
图 4 为本发明 OLED器件的固化封装装置中紫外 LED光源与待封装 OLED器件的俯视示意图；
图 5为本发明 OLED器件的固化封装方法的流程图。 具体实施方式
为更进一步阐述本发明所采取的技术手段及其效果， 以下结合本发明 的优选实施例及其附图进行详细描述。
请参阅图 2， 本发明首先提供一种紫外发光二极管 （Light Emitting
Diode, LED)光源， 该紫外 LED光源 3包括 PCB板 31、 及安装于该 PCB 板 31上的数个紫外 LED灯 33。所述数个紫外 LED灯 33沿所述 PCB板 31 的横向与纵向排列成矩阵，所述 PCB板 31对应每一紫外 LED灯 33设置驱 动电路 （未图示）， 能够对每一紫外 LED灯 33的开关进行控制， 从而能够 有选择的控制所述紫外 LED光源 3的发光区域。
具体的， 所述紫外 LED光源 3的有效发光区域为 730mm X 460mm， 其 照度 1 OOmw/cm2，所述紫外 LED灯 33的光谱有效范围在 350-450nm之间， 峰值波长为 365nm。
所述紫外 LED光源 3与强紫外线高压水银灯相比， 一方面具有更长的 寿命， 在散热良好、 恒流驱动的情况下， 优^的紫外 LED光源的寿命可达 5万小时； 另一方面具有高照度、 低光衰等良好性能， 且紫外 LED光源的 热辐射较小， 属于冷光源， 环保、 能耗低； 更为重要的是， 所述紫外 LED 光源 3的数个紫外 LED灯 33沿 PCB板 31的横向与纵向排列成矩阵，形成 面光源， 其发出的紫外光均勾一致， 且能够通过所述 PCB板 31有选择的控 制其发光区域， 当使用该紫外 LED光源 3对 OLED器件进行固化封装时， 一方面能够距离 OLED器件较近， 可大幅降低能耗， 一方面能够省去掩膜 板， 有效保护有机发光层。
请参阅图 3、 图 4， 同时参阅图 2， 本发明还提供一种 OLED器件的固 化封装装置，包括： UV固化腔室 1、设于该 UV固化腔室 1内的待封装 OLED 器件 2、 于该待封装 OLED器件 2下方设于所述 UV固化腔室 1 内的紫外 LED光源 3、 及设于所述紫外 LED光源 3下方的反射板 4。
进一步的， 所述紫外 LED光源 3包括 PCB板 31、 及安装于该 PCB板 31上的数个紫外 LED灯 33， 所述数个紫外 LED灯 33 沿所述 PCB板 31 的横向与纵向排列成矩阵，所述 PCB板 31对应每一紫外 LED灯 33设置驱 动电路， 能够对每一紫外 LED灯 33 的开关进行控制， 从而能够有选择的 控制紫外 LED光源 3的发光区域， 使该发光区域对应于待封装 OLED器件 2 的 UV胶框 22， 而其它区域不发光， 既省去了掩膜板的使用， 又能保护 待封装 OLED器件 2内的有机发光层不受紫外光损伤。
具体的， 所述紫外 LED光源 3的有效发光区域为 730mm X 460mm, 其 照度 1 OOmw/cm2，所述紫外 LED灯 33的光谱有效范围在 350-450nm之间， 峰值波长为 365nm。
所述紫外 LED光源 3与待封装 OLED器件 2的距离 H 5mm， 能够大 幅降低能耗。
如图 4所示，该 OLED器件的固化封装装置工作时，通过控制所述 PCB 板 31的驱动电路， 仅开启与待封装 OLED器件 2的 UV胶框 22对应区域 的紫外 LED灯 33， 对所述 UV胶框 22进行照射使其固化， 而其它区域的 紫外 LED灯 33保持关闭， 从而不会对待封装 OLED器件 2内的有机发光 层造成损伤。 针对不同尺寸的待封装 OLED 器件 2， 只需调整、 控制所述 紫外 LED光源 3的发光区域， 使所述发光区域与待封装 OLED器件 2的胶 框 22对应， 而不需要使用不同尺寸的掩膜板， 降低了生产成本。
请参阅图 5， 同时参阅图 2至图 4， 在上述 OLED器件的固化封装装置 的基础上， 本发明还提供一种 OLED器件的固化封装方法， 包括如下步骤： 步骤 1、 提供 UV固化腔室 1。
该 UV固化腔室 1 内设有紫外 LED光源 3、 及设于所述紫外 LED光源
3下方的反射板 4 ; 所述紫外 LED光源 3包括 PCB板 31、 及安装于该 PCB 板 31上的数个紫外 LED灯 33，所述数个紫外 LED灯 33沿所述 PCB板 31 的横向与纵向排列成矩阵，所述 PCB板 31对应每一紫外 LED灯 33设置驱 动电路， 能够对每一紫外 LED灯 33的开关进行控制。
具体的， 所述紫外 LED光源 3的有效发光区域为 730mm X 460mm， 其 照度 1 OOmw/cm2，所述紫外 LED灯 33的光谱有效范围在 350-450nm之间， 峰值波长为 365nm。
步骤 2、 将待封装 OLED器件 2放入 UV固化腔室 1 内， 且该待封装 OLED器件 2位于所述紫外 LED光源 3上方。 具体的，所述紫外 LED光源 3与待封装 OLED器件 2的距离 H 5mm， 能够大幅降低能耗。
步骤 3、通过控制所述 PCB板 31的驱动电路， 开启与待封装 OLED器 件 2的 UV胶框 22对应区域的紫外 LED灯 33， 对所述 UV胶框 22进行照 射使其固化。
该步骤 3省去了掩膜板的使用， 能够降低成本， 且不会对待封装 OLED 器件 2内的有机发光层造成损伤。
步骤 4、 固化完成后， 通过控制所述 PCB板 31的驱动电路， 关闭与待 封装 OLED器件 2的 UV胶框 22对应区域的紫外 LED灯 33， 完成封装。
综上所述， 本发明的紫外 LED光源， 具有排列成矩阵的数个紫外 LED 灯， 且能够通过 PCB板有选择的控制其发光区域， 当使用该紫外 LED光源 对 OLED器件进行固化封装时， 能够省去掩膜板， 有效保护有机发光层； 本发明的 OLED器件的固化封装装置， 通过设置紫外 LED光源， 控制其发 光区域对应于待封装 OLED器件的 UV胶框， 能够省去掩膜板， 有效保护 有机发光层， 降低生产成本， 并能够减少能耗， 延长紫外光源的寿命； 本 发明的 OLED器件的固化封装方法， 通过控制与待封装 OLED器件的 UV 胶框对应区域的紫外 LED灯， 实现固化封装， 不需要使用掩膜板， 从而能 够降低生产成本， 减少能耗。
以上所述， 对于本领域的普通技术人员来说， 可以根据本发明的技术 方案和技术构思作出其他各种相应的改变和变形， 而所有这些改变和变形 都应属于本发明权利要求的保护范围。

Claims

权 利 要 求
1、 一种紫外 LED光源， 包括 PCB板、 及安装于该 PCB板上的数个紫 外 LED灯， 所述数个紫外 LED灯） 沿所述 PCB板的横向与纵向排列成矩 阵，所述 PCB板对应每一紫外 LED灯设置驱动电路，能够对每一紫外 LED 灯的开关进行控制，从而能够有选择的控制所述紫外 LED光源的发光区域。
2、 如权利要求 1所述的紫外 LED光源， 其中， 所述紫外 LED光源的 有效发光区域为 730mm X 460mm。
3、 如权利要求 2所述的紫外 LED光源， 其中， 所述紫外 LED光源的 照度 100mw/cm2。
4、 如权利要求 1所述的紫外 LED光源， 其中， 所述紫外 LED灯的光 谱有效范围在 350-450nm之间， 峰值波长为 365nm。
5、 一种 OLED器件的固化封装装置， 包括： UV固化腔室、 设于该 UV 固化腔室内的待封装 OLED器件、 及于该待封装 OLED器件下方设于所述 UV固化腔室内的紫外 LED光源， 所述紫外 LED光源包括 PCB板、 及安 装于该 PCB板上的数个紫外 LED灯，所述数个紫外 LED灯沿所述 PCB板 的横向与纵向排列成矩阵，所述 PCB板对应每一紫外 LED灯设置驱动电路， 能够对每一紫外 LED灯的开关进行控制， 从而能够有选择的控制紫外 LED 光源的发光区域， 使该发光区域对应于待封装 OLED器件的 UV胶框。
6、 如权利要求 5所述的 OLED器件的固化封装装置， 其中， 所述紫外
LED光源的有效发光区域为 730mm X 460mm， 其照度 lOOmw/cm2， 所述 紫外 LED灯的光谱有效范围在 350-450nm之间， 峰值波长为 365nm。
7、 如权利要求 5所述的 OLED器件的固化封装装置， 其中， 所述紫外 LED光源与待封装 OLED器件的距离 H 5mm。
8、 如权利要求 5所述的 OLED器件的固化封装装置， 其中， 还包括一 设于所述紫外 LED光源下方的反射板。
9、 一种 OLED器件的固化封装方法， 包括如下步骤：
步骤 1、 提供 UV固化腔室；
该 UV固化腔室内设有紫外 LED光源、及设于所述紫外 LED光源下方 的反射板； 所述紫外 LED光源包括 PCB板、 及安装于该 PCB板上的数个 紫外 LED灯， 所述数个紫外 LED灯沿所述 PCB板的横向与纵向排列成矩 阵，所述 PCB板对应每一紫外 LED灯设置驱动电路，能够对每一紫外 LED 灯的开关进行控制； 步骤 2、将待封装 OLED器件放入 UV固化腔室内， 且该待封装 OLED 器件位于所述紫外 LED光源上方；
步骤 3、 通过控制所述 PCB板的驱动电路， 开启与待封装 OLED器件 的 UV胶框对应区域的紫外 LED灯， 对所述 UV胶框进行照射使其固化； 步骤 4、 固化完成后， 通过控制所述 PCB板的驱动电路， 关闭与待封 装 OLED器件的 UV胶框对应区域的紫外 LED灯， 完成封装。
10、 如权利要求 9所述的 OLED器件的固化封装方法， 其中， 所述紫 外 LED光源的有效发光区域为 730mm X 460mm， 其照度 1 OOmw/cm2， 所 述紫外 LED灯的光谱有效范围在 350-450nm之间， 峰值波长为 365nm; 所 述紫外 LED光源与待封装 OLED器件的距离 H 5mm。
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