WO2016011612A1 - 一种多次折射led灯 - Google Patents

一种多次折射led灯 Download PDF

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Publication number
WO2016011612A1
WO2016011612A1 PCT/CN2014/082795 CN2014082795W WO2016011612A1 WO 2016011612 A1 WO2016011612 A1 WO 2016011612A1 CN 2014082795 W CN2014082795 W CN 2014082795W WO 2016011612 A1 WO2016011612 A1 WO 2016011612A1
Authority
WO
WIPO (PCT)
Prior art keywords
lamp
lamp body
circuit board
led chip
led
Prior art date
Application number
PCT/CN2014/082795
Other languages
English (en)
French (fr)
Inventor
李光辉
Original Assignee
厦门星际电器有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 厦门星际电器有限公司 filed Critical 厦门星际电器有限公司
Priority to PCT/CN2014/082795 priority Critical patent/WO2016011612A1/zh
Priority to US15/023,669 priority patent/US20160245463A1/en
Publication of WO2016011612A1 publication Critical patent/WO2016011612A1/zh

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/006—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate being distinct from the light source holder
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/238—Arrangement or mounting of circuit elements integrated in the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/66—Details of globes or covers forming part of the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/101—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening permanently, e.g. welding, gluing or riveting
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
    • F21V3/06—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material
    • F21V3/062—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material the material being plastics
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the invention relates to an LED lamp, in particular to a multi-refractive LED lamp.
  • the LED lamp is composed of a lamp cap, a lamp body, a circuit board, an aluminum substrate, an LED chip, and a bulb.
  • the power source is connected to the lamp head, and the LED chip is powered by the circuit board.
  • the LED chip emits light, and the light passes through the glass bulb to realize illumination, but the light emitted by the LED lamp is uneven.
  • the inventors have specially developed a multi-refractive LED lamp, and the present invention is produced.
  • the solution of the present invention is:
  • the utility model relates to a multi-refractive LED lamp, which is composed of a lamp cap, a lamp body, a heat dissipating component, a circuit board, an aluminum substrate, an LED chip, a translucent cover and a glass bulb.
  • the lamp cap is fastened at the lower end of the lamp body, and the heat dissipating component is integrally molded into the lamp body.
  • the circuit board is mounted in the lamp body, the aluminum substrate is fixed in the lamp body and located above the circuit board, the LED chip is mounted on the aluminum substrate, the translucent cover is fixed in the lamp body and covered on the aluminum substrate, and the glass bulb is fixed on the wall
  • the lamp body is covered on the transparent cover, and the lamp cap is electrically connected to the LED chip through the circuit board.
  • the glass bulb, the transparent cover and the lamp body are made of PC (polycarbonate) material.
  • the power source is connected by the lamp cap, the LED chip is powered by the circuit board, the LED chip emits light, the light is refracted by the air entering the translucent cover, and then the air is refracted by the translucent cover, and the air is refracted by the air.
  • the glass bulb is refracted and finally refracted by the glass bulb entering the air, thereby achieving illumination, and the multiple refraction not only enlarges the illumination angle, but also makes the light emitted by the LED lamp more uniform.
  • Figure 1 is an exploded perspective view of the present invention
  • Figure 2 is a sectional view of the combination of the present invention.
  • Figure 3 is a combined appearance view of the present invention.
  • the bulb 1 the translucent cover 2, the LED chip 3, the aluminum substrate 4, the circuit board 5, the heat sink 6, the lamp body 7, and the lamp cap 8.
  • a multi-refractive LED lamp disclosed by the present invention comprises a lamp cap 8, a lamp body 7, a heat sink 6, a circuit board 5, an aluminum substrate 4, an LED chip 3, a transmissive cover 2, and The glass bulb 1 is composed.
  • the base 8 is fastened to the lower end of the lamp body 7 by a tight fit or the like.
  • the heat sink 6 is directly molded on the inner wall of the lamp body 7 by integral injection molding.
  • the circuit board 5 is mounted in the lamp body 7.
  • the aluminum substrate 4 is stuck in the lamp body 7, and the aluminum substrate 4 is placed above the circuit board 5.
  • the LED chip 3 is mounted on the aluminum substrate 4, and the heat generated when the LED chip 3 operates is dissipated through the aluminum substrate 4 and the heat sink 6.
  • the translucent cover 2 is fixed in the lamp body 7 by ultrasonic welding, and the translucent cover 2 is placed on the aluminum substrate 4.
  • the translucent cover 2 can also be fixed in the lamp body 7 by means of a buckle, a screw, a glue, or the like.
  • the bulb 1 is fixed to the lamp body 7 by ultrasonic welding, and the bulb 1 is placed over the translucent cover 2.
  • the bulb 1 can also be fixed to the lamp body 7 by means of a buckle, a screw, a glue, or the like.
  • the base 8 is electrically connected to the LED chip 3 via a circuit board 5.
  • the preferred embodiment is that the glass bulb 1, the light transmissive cover 2 and the lamp body 7 are made of PC material.
  • the power source is connected by the lamp cap 8, and the LED chip 3 is powered by the circuit board 5, so that the LED chip 3 emits light, the light is refracted by the transmissive cover, and then refracted through the glass bulb to expand the illumination angle to realize illumination, and, after After the multiple refraction of air-transparent cover, light-transmissive cover-air, air-glass bulb, and glass bulb-air, the light emitted by the LED lamp is more uniform.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

一种多次折射LED灯，由灯头（8）、灯体（7）、散热件（6）、电路板（5）、铝基板（4）、LED芯片（3）、透光罩（2）和玻壳（1）组成，灯头（8）紧固在灯体（7）的下端，散热件（6）一体注塑在灯体（7）内壁上，电路板（5）安装在灯体（7）中，铝基板（4）卡固在灯体（7）内并位于电路板（5）上方，LED芯片（3）安装在铝基板（4）上，透光罩（2）固定在灯体（7）内并罩在铝基板（4）上，玻壳（1）固定在灯体（7）上并罩在透光罩（2）上，灯头（8）通过电路板（5）与LED芯片（3）电连接。

Description

一种多次折射LED灯 技术领域
本发明涉及一种LED灯，特指一种多次折射LED灯。
背景技术
现有技术中，LED灯是由灯头、灯体、电路板、铝基板、LED芯片和玻壳等组成。这种LED灯工作时，由灯头连接电源，通过电路板向LED芯片供电，LED芯片发光，光线透过玻壳实现照明，但是，LED灯发出的光不均匀。
基此，本发明人特别研制出一种多次折射LED灯，本案由此产生。
发明内容
本发明的目的在于提供一种多次折射LED灯，以使LED灯发出的光更均匀。
为了达成上述目的，本发明的解决方案是：
一种多次折射LED灯，由灯头、灯体、散热件、电路板、铝基板、LED芯片、透光罩和玻壳组成，灯头紧固在灯体的下端，散热件一体注塑在灯体内壁上，电路板安装在灯体中，铝基板卡固在灯体内并位于电路板上方，LED芯片安装在铝基板上，透光罩固定在灯体内并罩在铝基板上，玻壳固定在灯体上并罩在透光罩上，灯头通过电路板与LED芯片电连接。
所述玻壳、透光罩和灯体采用PC（聚碳酸脂）材料制成。
采用上述方案后，本发明工作时，由灯头连接电源，通过电路板向LED芯片供电，LED芯片发光，光线由空气进入透光罩发生折射，再由透光罩进入空气发生折射，又由空气进入玻壳发生折射，最后由玻壳进入空气发生折射，由此实现照明，而且，多次折射不仅扩大发光角度，还使LED灯发出的光更加均匀。
以下结合附图及具体实施例对本发明做进一步详细描述。
附图说明
图1是本发明的立体分解图；
图2是本发明的组合剖视图；
图3是本发明的组合外观图。
标号说明
玻壳1，透光罩2，LED芯片3，铝基板4，电路板5，散热件6，灯体7，灯头8。
具体实施方式
如图1至图3所示，本发明揭示的一种多次折射LED灯，由灯头8、灯体7、散热件6、电路板5、铝基板4、LED芯片3、透光罩2和玻壳1组成。
灯头8通过紧配合等方式紧固在灯体7的下端。
散热件6通过一体注塑直接成型在灯体7内壁上。
电路板5安装在灯体7中。
铝基板4卡固在灯体7内，并且铝基板4位于电路板5上方。
LED芯片3安装在铝基板4上，LED芯片3工作时产生的热量通过铝基板4和散热件6散发出去。
透光罩2通过超声波焊接固定在灯体7内，并且透光罩2罩在铝基板4上。透光罩2也可以通过扣位、螺口、胶接等等方式固定在灯体7内。
玻壳1通过超声波焊接固定在灯体7上，并且玻壳1罩在透光罩2上。玻壳1也可以通过扣位、螺口、胶接等等方式固定在灯体7上。
灯头8通过电路板5与LED芯片3电连接。
其中，较佳方案是玻壳1、透光罩2和灯体7采用PC材料制成。
本发明工作时，由灯头8连接电源，通过电路板5向LED芯片3供电，使LED芯片3发光，光线经过透光罩折射，再经过玻壳折射，扩大发光角度，实现照明，而且，经过空气-透光罩、透光罩-空气、空气-玻壳、玻壳-空气的多次折射后，LED灯发出的光更加均匀。
上述实施例和图式并非限定本发明的产品形态和式样，任何所属技术领域的普通技术人员对其所做的适当变化或修饰，皆应视为不脱离本发明的专利范畴。

Claims (2)

1、一种多次折射LED灯，其特征在于：由灯头、灯体、散热件、电路板、铝基板、LED芯片、透光罩和玻壳组成，灯头紧固在灯体的下端，散热件一体注塑在灯体内壁上，电路板安装在灯体中，铝基板卡固在灯体内并位于电路板上方，LED芯片安装在铝基板上，透光罩固定在灯体内并罩在铝基板上，玻壳固定在灯体上并罩在透光罩上，灯头通过电路板与LED芯片电连接。
2、如权利要求1所述的一种多次折射LED灯，其特征在于：所述玻壳、透光罩和灯体采用PC材料制成。
PCT/CN2014/082795 2014-07-23 2014-07-23 一种多次折射led灯 WO2016011612A1 (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/CN2014/082795 WO2016011612A1 (zh) 2014-07-23 2014-07-23 一种多次折射led灯
US15/023,669 US20160245463A1 (en) 2014-07-23 2014-07-23 Multi-refraction led lamp

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2014/082795 WO2016011612A1 (zh) 2014-07-23 2014-07-23 一种多次折射led灯

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WO2016011612A1 true WO2016011612A1 (zh) 2016-01-28

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CN115076633B (zh) * 2022-06-29 2024-03-01 北京小米移动软件有限公司 灯光组件及电器

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US10935523B2 (en) * 2017-03-31 2021-03-02 Shimadzu Corporation Gas chromatograph

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