WO2016005609A3 - Détecteur spécifique au client réalisé par triple moulage - Google Patents

Détecteur spécifique au client réalisé par triple moulage Download PDF

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Publication number
WO2016005609A3
WO2016005609A3 PCT/EP2015/066161 EP2015066161W WO2016005609A3 WO 2016005609 A3 WO2016005609 A3 WO 2016005609A3 EP 2015066161 W EP2015066161 W EP 2015066161W WO 2016005609 A3 WO2016005609 A3 WO 2016005609A3
Authority
WO
WIPO (PCT)
Prior art keywords
sensor
triple
moulding
customer
specific sensor
Prior art date
Application number
PCT/EP2015/066161
Other languages
German (de)
English (en)
Other versions
WO2016005609A2 (fr
Inventor
Jakob Schillinger
Dietmar Huber
Lothar Biebricher
Manfred Goll
Marc Panis
Ulrich Schrader
Original Assignee
Continental Teves Ag & Co. Ohg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Continental Teves Ag & Co. Ohg filed Critical Continental Teves Ag & Co. Ohg
Publication of WO2016005609A2 publication Critical patent/WO2016005609A2/fr
Publication of WO2016005609A3 publication Critical patent/WO2016005609A3/fr

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
    • G01D11/24—Housings ; Casings for instruments
    • G01D11/245—Housings for sensors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
    • G01D5/12—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means
    • G01D5/244—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing characteristics of pulses or pulse trains; generating pulses or pulse trains
    • G01D5/245—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing characteristics of pulses or pulse trains; generating pulses or pulse trains using a variable number of pulses in a train
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Transmission And Conversion Of Sensor Element Output (AREA)
  • Measuring Fluid Pressure (AREA)

Abstract

La présente invention concerne un procédé de réalisation d'un détecteur (10, 28) comportant un circuit de détection (35, 40) porté par un îlot d'implantation (48) d'un porte-circuit (44), ledit circuit de détection servant à émettre un signal de détection (42) dépendant d'un champ de détection physique (33), et une interface (76) destinée à transmettre le signal de détection (42) à un dispositif de traitement de signal (18) supérieur. Le procédé comprend les étapes consistant : à envelopper une partie du porte-circuit (44) contenant l'îlot d'implantation (48) et le circuit de détection (35, 40) dans une première masse de protection (72) dans laquelle est formé un élément à complémentarité de forme (74); à envelopper au moins une partie de la première masse de protection (72) contenant l'élément à complémentarité de forme (74), et l'interface (76) dans une seconde masse de protection (84).
PCT/EP2015/066161 2014-07-11 2015-07-15 Détecteur spécifique au client réalisé par triple moulage WO2016005609A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102014213588.5 2014-07-11
DE102014213588.5A DE102014213588A1 (de) 2014-07-11 2014-07-11 Kundenspezifischer Sensor hergestellt durch Dreifach-Molden

Publications (2)

Publication Number Publication Date
WO2016005609A2 WO2016005609A2 (fr) 2016-01-14
WO2016005609A3 true WO2016005609A3 (fr) 2016-03-24

Family

ID=55065032

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2015/066161 WO2016005609A2 (fr) 2014-07-11 2015-07-15 Détecteur spécifique au client réalisé par triple moulage

Country Status (2)

Country Link
DE (1) DE102014213588A1 (fr)
WO (1) WO2016005609A2 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102015224257A1 (de) 2015-12-03 2017-06-08 Continental Teves Ag & Co. Ohg Elektrische Leiterbahn, Verfahren und Verwendung
DE102016207664A1 (de) 2016-05-03 2017-11-09 Continental Teves Ag & Co. Ohg Sensorelement für ein kraftfahrzeug
DE102016208782A1 (de) * 2016-05-20 2017-11-23 Continental Teves Ag & Co. Ohg Verfahren zum Ummanteln einer elektrischen Einheit und elektrisches Bauelement
WO2020127197A1 (fr) * 2018-12-21 2020-06-25 Continental Teves Ag & Co. Ohg Technologie de connexion de soudage par ultrasons dans la ligne de produits des capteurs de vitesse des roues

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0282967A2 (fr) * 1987-03-18 1988-09-21 Sumitomo Electric Industries, Ltd. Capteur pour la détection d'une variation à un champ magnétique
US6034421A (en) * 1996-12-09 2000-03-07 Denso Corporation Semiconductor device including molded IC fixed to casing
US20040118227A1 (en) * 2002-12-18 2004-06-24 Masatoshi Tokunaga Sensor having resin mold casing and method of manufacturing the same
US20130154626A1 (en) * 2011-12-16 2013-06-20 Denso Corporation Rotation detection device and manufacturing method for the same
DE102014208425A1 (de) * 2013-11-28 2015-05-28 Continental Teves Ag & Co. Ohg Verfahren zum Herstellen eines Sensors

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10146949A1 (de) 2000-11-22 2002-06-06 Continental Teves Ag & Co Ohg Aktiver Magnetsensor für elektronische Bremssysteme
DE102008064046A1 (de) 2008-10-02 2010-04-08 Continental Teves Ag & Co. Ohg Verfahren zur Herstellung eines Geschwindigkeits-Sensorelementes
CN103153729B (zh) 2010-08-10 2016-08-03 大陆-特韦斯贸易合伙股份公司及两合公司 用于调节行驶稳定性的方法和系统
CN204807109U (zh) * 2012-02-10 2015-11-25 大陆-特韦斯贸易合伙股份公司及两合公司 电子构件
DE102012223982A1 (de) * 2012-12-20 2014-06-26 Continental Teves Ag & Co. Ohg Verfahren zum Herstellen einer elektronischen Baugruppe

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0282967A2 (fr) * 1987-03-18 1988-09-21 Sumitomo Electric Industries, Ltd. Capteur pour la détection d'une variation à un champ magnétique
US6034421A (en) * 1996-12-09 2000-03-07 Denso Corporation Semiconductor device including molded IC fixed to casing
US20040118227A1 (en) * 2002-12-18 2004-06-24 Masatoshi Tokunaga Sensor having resin mold casing and method of manufacturing the same
US20130154626A1 (en) * 2011-12-16 2013-06-20 Denso Corporation Rotation detection device and manufacturing method for the same
DE102014208425A1 (de) * 2013-11-28 2015-05-28 Continental Teves Ag & Co. Ohg Verfahren zum Herstellen eines Sensors

Also Published As

Publication number Publication date
DE102014213588A1 (de) 2016-02-18
WO2016005609A2 (fr) 2016-01-14

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