WO2016004659A1 - 一种气体冷却设备及高温操作系统 - Google Patents

一种气体冷却设备及高温操作系统 Download PDF

Info

Publication number
WO2016004659A1
WO2016004659A1 PCT/CN2014/083571 CN2014083571W WO2016004659A1 WO 2016004659 A1 WO2016004659 A1 WO 2016004659A1 CN 2014083571 W CN2014083571 W CN 2014083571W WO 2016004659 A1 WO2016004659 A1 WO 2016004659A1
Authority
WO
WIPO (PCT)
Prior art keywords
high temperature
gas
cold medium
closed container
cooling treatment
Prior art date
Application number
PCT/CN2014/083571
Other languages
English (en)
French (fr)
Inventor
余威
Original Assignee
深圳市华星光电技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市华星光电技术有限公司 filed Critical 深圳市华星光电技术有限公司
Priority to US14/404,032 priority Critical patent/US10295235B2/en
Publication of WO2016004659A1 publication Critical patent/WO2016004659A1/zh

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B41/00—Fluid-circulation arrangements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
    • B01D53/26—Drying gases or vapours
    • B01D53/261—Drying gases or vapours by adsorption
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D5/00—Condensation of vapours; Recovering volatile solvents by condensation
    • B01D5/0003—Condensation of vapours; Recovering volatile solvents by condensation by using heat-exchange surfaces for indirect contact between gases or vapours and the cooling medium
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D5/00—Condensation of vapours; Recovering volatile solvents by condensation
    • B01D5/0003—Condensation of vapours; Recovering volatile solvents by condensation by using heat-exchange surfaces for indirect contact between gases or vapours and the cooling medium
    • B01D5/0018—Dome shaped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D8/00—Cold traps; Cold baffles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D2253/00—Adsorbents used in seperation treatment of gases and vapours
    • B01D2253/10—Inorganic adsorbents
    • B01D2253/106—Silica or silicates
    • B01D2253/108—Zeolites

Definitions

  • the present invention relates to the field of organic light emitting display packages, and more particularly to a gas cooling device and a high temperature operating system.
  • OLED Organic Light Emitting Display, organic light-emitting display
  • the process is to make an organic film on the substrate, wherein the organic film is placed between the cathode and the anode metal, and voltage is applied to the two electrodes to make the organic film emit light. Since the organic film is sensitive to water and oxygen, it is prone to aging and denaturation due to water and oxygen, thereby reducing the brightness and life of the display, so the packaging process of the OLED device is required.
  • UV Ultraviolet
  • UV light is encapsulated in a plastic package, and the other package is a glass seal, which is better packaged.
  • glass glue is more resistant to water oxygen than UV glue.
  • the glass plastic packaging process is to apply glass glue on the package cover plate, and the glass plastic coated package cover plate is baked at a high temperature in an OLED high temperature furnace (temperature is in the range of 500 degrees to 600 degrees), and the baked glass is coated.
  • the package cover of the glue is coated with UV glue, and then adhered to the OLED substrate pair, and the UV glue is cured by UV lamp irradiation (the function of the UV glue is to temporarily bond the two glasses and temporarily seal the effect), and finally use The laser melts the dried glass glue and then condenses it to bond the package cover to the OLED substrate to achieve a packaging effect.
  • the glass cover is placed on each layer of the quartz clip for baking.
  • the high-temperature gas in the high-temperature furnace is cooled and then discharged. Since the high-temperature gas contains water, when the low-temperature high-temperature gas is subjected to the temperature-lowering treatment, the water therein is likely to freeze, causing the pipeline to be clogged, so that the high-temperature gas cannot be discharged in time. This causes the pressure to rise, forcing the process to stop or causing the quartz clip to vibrate and prone to cracking.
  • a gas cooling device includes:
  • a cold medium storage device having a cold medium of -40 degrees to -30 degrees;
  • cooling treatment device disposed in the cold medium storage device to cool the high temperature gas by the cold medium; wherein the cooling treatment device includes an intake end and an outlet end;
  • a dewatering device disposed at an intake end of the cooling treatment device for dehydrating the high temperature gas; wherein the dehydration device is a molecular sieve dehydration device for the high temperature in a range of 60 degrees to 80 degrees The gas is dehydrated.
  • the molecular sieve dehydration device when the temperature of the high temperature gas is higher than the range of 60 to 80 degrees, the molecular sieve dehydration device performs a water vapor discharge operation.
  • the cooling treatment device includes an input tube, an output tube, and a hermetic container;
  • One end of the input tube protrudes outside the sealed container, and the other end of the input tube extends into the closed container and is near a bottom position of the closed container;
  • One end of the output tube extends into the closed container and is adjacent to the top of the closed container, and the other end of the output tube extends outside the sealed container.
  • the present invention constructs a gas cooling apparatus comprising:
  • a cold medium storage device in which a cold medium of a preset temperature is disposed
  • cooling treatment device disposed in the cold medium storage device to cool the high temperature gas by the cold medium; wherein the cooling treatment device includes an intake end and an outlet end;
  • a dewatering device is provided at an intake end of the cooling treatment device for dehydrating the high temperature gas.
  • the dehydration means is a molecular sieve dehydration means for dehydrating the high temperature gas in a set temperature range.
  • the molecular sieve dehydration device when the temperature of the high temperature gas is higher than the set temperature range, the molecular sieve dehydration device performs a water vapor discharge operation.
  • the set temperature ranges from 60 degrees to 80 degrees, and the preset temperature of the cold medium is -40 degrees to -30 degrees.
  • the cooling treatment device includes an input tube, an output tube, and a hermetic container;
  • One end of the input tube protrudes outside the sealed container, and the other end of the input tube extends into the closed container and is near a bottom position of the closed container;
  • One end of the output tube extends into the closed container and is adjacent to the top of the closed container, and the other end of the output tube extends outside the sealed container.
  • the dehydration means is a dry box.
  • Another object of the present invention is to provide a high temperature operating system, the high temperature operating system comprising:
  • a high temperature processing apparatus for performing high temperature operation on an article to be handled, and generating a high temperature gas, and discharging the high temperature gas through the high temperature gas output end;
  • a gas cooling device coupled to the high temperature gas output of the high temperature processing device, comprising:
  • a cold medium storage device in which a cold medium of a preset temperature is disposed
  • cooling treatment device disposed in the cold medium storage device to cool the high temperature gas by the cold medium; wherein the cooling treatment device includes an intake end and an outlet end;
  • a dewatering device is provided at an intake end of the cooling treatment device for dehydrating the high temperature gas.
  • the dehydration device is a molecular sieve dehydration device for dehydrating the high temperature gas in a set temperature range.
  • the molecular sieve dehydration device when the temperature of the high temperature gas is higher than the set temperature range, the molecular sieve dehydration device performs a water vapor discharge operation.
  • the dewatering device is a dry box.
  • the cooling treatment device includes an input tube, an output tube, and a closed container;
  • One end of the input tube protrudes outside the sealed container, and the other end of the input tube extends into the closed container and is near a bottom position of the closed container;
  • One end of the output tube extends into the closed container and is adjacent to the top of the closed container, and the other end of the output tube extends outside the sealed container.
  • the invention provides a gas cooling device and a high temperature operating system, and can add a dehydration device to the gas cooling device, thereby capable of dehydrating the high temperature gas, and solving the low temperature high temperature gas discharged from the existing high temperature furnace.
  • the water enters the cooling treatment device, causing technical problems such as an increase in pressure and a fragile quartz clip, thereby improving production efficiency and reducing production costs.
  • FIG. 1 is a schematic structural view of a gas cooling device in an embodiment of the present invention
  • FIG. 2 is a schematic structural view of a high temperature operating system in an embodiment of the present invention.
  • FIG. 1 is a schematic structural view of a gas cooling device according to an embodiment of the present invention.
  • the gas cooling apparatus includes a cold medium storage device 10, a cooling treatment device 11, and a dehydration device 12.
  • the cold medium storage device 10 is provided with a cold medium of a preset temperature; the preset temperature is, for example, -40 degrees to -30 degrees.
  • the cooling treatment device 11 includes an intake end and an outlet end; the intake end is connected to a high temperature gas, and the cooling treatment device 11 is placed in the cold medium storage device 10 through the cold medium storage device 10 The cold medium cools the high temperature gas;
  • the cooling treatment device 11 includes an input tube 111 and an output tube 112 and a closed container 113; wherein the sealed container 113 is placed in the cold medium storage device 10;
  • the one end 1111 of the input pipe extends out of the closed container 113, and the other end 1112 of the input pipe extends into the closed container 113 and is close to the bottom position of the closed container 113;
  • One end 1121 of the output tube extends into the closed container 113 and is near the top position of the closed container 113.
  • the other end 1122 of the output tube protrudes out of the closed container 113, and the high temperature gas passes through the input.
  • the tube 111 enters the closed container 113, and since the closed container 113 is placed in the cold medium storage device 10, the high temperature gas can be cooled when entering the closed container 113, due to the other of the input tube
  • One end 1112 is near the bottom position of the closed container 113 and one end 1121 of the output tube is close to the top position of the closed container 113, so that the time during which the high temperature gas flows in the closed container 113 increases, correspondingly increasing the cooling time, thus Has a better cooling effect.
  • the closed container 113 is, for example, a gas collection bottle with a stopper, and the bottle stopper has holes for inserting the input tube 111 and the output tube 112 into the gas collection bottle, respectively.
  • the aperture is slightly larger than the apertures of the input tube 111 and the output tube 112.
  • the high temperature gas finally subjected to the cooling treatment is discharged from the output pipe 112, and the output pipe 112 is connected to an external exhaust gas treatment device.
  • a dewatering device 12 disposed at an intake end of the cooling treatment device 11 (identical to one end 1111 of the input pipe), the dehydration device 12 being paired before the cooling treatment device 11 cools the high temperature gas
  • the high temperature gas input to the cooling treatment device 11 is subjected to a dehydration treatment.
  • the dehydration device 12 may be a molecular sieve dehydration device, and when the temperature of the high temperature gas is within a set temperature range, the molecular sieve dehydration device can absorb water in the high temperature gas; when the temperature of the high temperature gas is higher than When the temperature range is set, the temperature of the high temperature gas can vaporize and discharge the water absorbed by the molecular sieve dehydration device, that is, the molecular sieve dehydration device performs a water gas discharge operation, and the dehydration device is used. It is capable of discharging the absorbed water itself and does not need to be replaced periodically.
  • the set temperature range is, for example, 60 degrees to 80 degrees.
  • the dewatering device 12 may be a drying box in which a desiccant is contained, the drying box absorbs water in the input high temperature gas, and passes the dried high temperature gas into the cooling treatment device 11 Since the water absorption capacity of the drying box reaches a certain amount, the water absorption capacity is lowered, so in order to make the drying box have a better dewatering effect, it is necessary to periodically replace the drying box.
  • the working process of the gas cooling device is: first, inputting high temperature gas to the gas cooling device, the dehydrating device 12 dehydrating the high temperature gas, and the high temperature gas after dehydration treatment enters through the input pipe 111.
  • the sealed container 113 cools the dehydrated high-temperature gas by the cold medium in the cold medium storage device 10, and finally discharges the cooled high-temperature gas through the output pipe 112.
  • the present invention can provide a gas cooling device, by adding a dehydration device to the gas cooling device, can dehydrate the high temperature gas, and solve the problem that the water in the lower temperature high temperature gas discharged from the existing high temperature furnace enters the cooling process.
  • the device causes technical problems such as increased pressure and fragile quartz clips, thereby increasing production efficiency and reducing production costs.
  • FIG. 2 is a schematic structural diagram of a high temperature operating system according to an embodiment of the present invention.
  • the high temperature operating system includes a high temperature processing apparatus 2, and a gas cooling apparatus 1, which is connected to the high temperature gas output end 21 of the high temperature processing apparatus 2.
  • the high temperature processing apparatus 2 is configured to perform high temperature operation on an item to be operated, the high temperature processing apparatus 2 is provided with a shielding gas, and the high temperature processing apparatus 2 is capable of heating the protection gas and generating a high temperature gas having a high temperature gas
  • the output end 21 receives the high temperature gas into the gas cooling device 1 through the high temperature gas output end 21; the high temperature processing device 2 is, for example, a high temperature furnace, and the object to be operated is, for example, an OLED package cover.
  • the gas cooling device 1 includes a cold medium storage device 10, a cooling treatment device 11, and a dehydration device 12.
  • the cold medium storage device 10 is provided with a cold medium of a preset temperature; the preset temperature is, for example, -40 degrees to -30 degrees.
  • the cooling treatment device 11 includes an intake end and an outlet end; the intake end is provided with a high temperature gas dehydrated by the dehydration device 12, and the cooling treatment device 11 is placed in the cold medium storage device 10 Cooling the high temperature gas through the cold medium in the cold medium storage device 10;
  • the cooling treatment device 11 includes an input tube 111 and an output tube 112 and a closed container 113; wherein the sealed container 113 is placed in the cold medium storage device 10;
  • one end 1111 of the input pipe protrudes out of the closed container 113, and the other end 1112 of the input pipe extends into the closed container 113 and is close to the bottom position of the closed container 113;
  • One end 1121 of the output tube extends into the closed container 113 and is near the top position of the closed container 113.
  • the other end 1122 of the output tube protrudes out of the closed container 113, and the high temperature gas passes through the input.
  • the tube 111 enters the hermetic container 113, and since the hermetic container 113 is placed in the cold medium storage device 10, the high temperature gas can be cooled when entering the sealed container 113. Since the other end 1112 of the input pipe is close to the bottom position of the closed container 113 and one end 1121 of the output pipe is close to the top position of the closed container 113, the time during which the high temperature gas flows in the closed container 113 increases. The cooling time is correspondingly increased and thus has a better cooling effect.
  • the closed container 113 is, for example, a gas collection bottle with a stopper, and the bottle stopper has holes for inserting the input tube 111 and the output tube 112 into the gas collection bottle, respectively.
  • the aperture is slightly larger than the apertures of the input tube 111 and the output tube 112.
  • the high temperature gas finally subjected to the cooling treatment is discharged from the output pipe 112, and the output pipe 112 is connected to an external exhaust gas treatment device.
  • a dewatering device 12 disposed at an intake end of the cooling treatment device 11 (same as the one end 1111 of the input pipe), and inputting the cooling treatment before the cooling treatment device 11 cools the high temperature gas
  • the high temperature gas of the device 11 is subjected to a dehydration treatment.
  • the dehydration device 12 may be a molecular sieve dehydration device, and when the temperature of the high temperature gas is within a set temperature range, the molecular sieve dehydration device can absorb water in the high temperature gas; when the temperature of the high temperature gas is higher than When the temperature range is set, the temperature of the high temperature gas can vaporize and discharge the water absorbed by the molecular sieve dehydration device, that is, the molecular sieve dehydration device performs a water gas discharge operation, and the dehydration device is used. It is capable of discharging the absorbed water itself and does not need to be replaced periodically.
  • the set temperature range is, for example, 60 degrees to 80 degrees.
  • the dewatering device 12 may be a drying box in which a desiccant is contained, the drying box absorbs water in the input high temperature gas, and passes the dried high temperature gas into the cooling treatment device 11 Since the water absorption capacity of the drying box is reduced after the water absorption of the drying box reaches a certain amount, in order to make the drying box have a better dewatering effect, it is necessary to periodically replace the drying box.
  • the working process of the high temperature operating system is: first, the high temperature processing device 2 inputs high temperature gas to the gas cooling device 1, and the dehydrating device 12 dehydrates the high temperature gas, and the high temperature gas after dehydration treatment passes through
  • the inlet pipe 111 enters the sealed container 113, and the sealed container 113 cools the dehydrated high-temperature gas through the cold medium in the cold medium storage device 10, and finally passes the cooled high-temperature gas through the
  • the output pipe 112 is discharged.
  • the present invention can provide a high-temperature operating system, by adding a dehydration device to the gas cooling device, can dehydrate the high-temperature gas, and solve the problem that the water in the lower temperature high-temperature gas discharged from the existing high-temperature furnace enters the cooling treatment.
  • the device causes technical problems such as increased pressure and fragile quartz clips, thereby increasing production efficiency and reducing production costs.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Analytical Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Drying Of Gases (AREA)
  • Drying Of Solid Materials (AREA)

Abstract

一种气体冷却设备（1），包括：冷媒介存储装置（10）、冷却处理装置（11）以及脱水装置（12），脱水装置（12）设置在冷却处理装置（11）的进气端（1111），用于对高温气体进行脱水处理。该气体冷却设备（1）解决了现有高温炉排出的高温气体中的水进入冷却处理装置（11），导致压力升高以及石英卡夹易破碎的技术问题，从而提高了生产效率、降低了生产成本。

Description

一种气体冷却设备及高温操作系统 技术领域
本发明涉及有机发光显示器封装领域，特别是涉及一种气体冷却设备及高温操作系统。
 背景技术
OLED（Organic Light Emitting Display，有机发光显示器）作为新一代的显示器，其制程过程是在基板上制作有机薄膜，其中有机薄膜放置在阴极和阳极金属之间，给两电极加电压，则使有机薄膜会发光。由于有机薄膜对水和氧气很敏感，容易因水氧发生老化变性，从而降低显示器的亮度和寿命，所以需要对OLED器件进行封装制程。
封装盖板与OLED基板一种方式是通过UV（Ultraviolet Rays，紫外光线）胶封装，另外一种封装方式为玻璃胶封，其装封装效果更好。由于玻璃胶阻隔水氧的能力远强于UV胶。玻璃胶封装过程是在封装盖板上涂布玻璃胶，将涂有玻璃胶的封装盖板在OLED高温炉进行高温烘烤(温度在500度-600度)，将烘烤后的涂有玻璃胶的封装盖板再涂布UV胶，然后与OLED基板对组贴合，通过UV灯照射固化UV胶（UV胶的作用为暂时粘合两张玻璃以及起到临时密封的效果），最终用镭射将烘干的玻璃胶融化后再凝结，将封装盖板与OLED基板粘合达到封装效果。
由于OLED高温炉的洁净度及温度的需求，将玻璃盖板放置在石英卡夹的各层上进行烘烤。通常将高温炉中的高温气体降温后再排出，由于高温气体中含有水，因此较低温度的高温气体进行降温处理时，其中的水容易结冰，导致管道堵塞，使得高温气体不能及时排出，从而使得压力升高，迫使制程停止或使得石英卡夹震动，容易发生破裂。
 技术问题
本发明的目的在于提供一种气体冷却设备，以防止高温炉排出的较低温度的高温气体中的水进入冷却处理装置，导致压力升高以及石英卡夹易破碎的技术问题，从而提高生产效率、降低生产成本。
 技术解决方案
为解决上述技术问题，一种气体冷却设备，所述气体冷却设备包括：
冷媒介存储装置，其内设置有-40度到-30度的冷媒介；
冷却处理装置，设置在所述冷媒介存储装置内，通过所述冷媒介对高温气体进行冷却处理；其中所述冷却处理装置包括进气端和出气端；以及
脱水装置，设置在所述冷却处理装置的进气端，用于对所述高温气体进行脱水处理；其中所述脱水装置为分子筛脱水装置，用于对60度-80度范围内的所述高温气体进行脱水处理。
在本发明的气体冷却设备中，当所述高温气体的温度高于60度-80度的范围时，所述分子筛脱水装置进行水气排出操作。
在本发明的气体冷却设备中，所述冷却处理装置包括输入管、输出管以及密闭容器；
其中所述密闭容器放置在所述冷媒介存储装置内；
所述输入管的一端伸出所述密闭容器外，所述输入管的另一端伸入所述密闭容器内且靠近所述密闭容器底部位置；
所述输出管的一端伸入所述密闭容器内且靠近所述密闭容器顶部位置，所述输出管的另一端伸出所述密闭容器外。
本发明构造了一种气体冷却设备，所述气体冷却设备包括：
冷媒介存储装置，其内设置有预设温度的冷媒介；
冷却处理装置，设置在所述冷媒介存储装置内，通过所述冷媒介对高温气体进行冷却处理；其中所述冷却处理装置包括进气端和出气端；以及
脱水装置，设置在所述冷却处理装置的进气端，用于对所述高温气体进行脱水处理。
在本发明的气体冷却设备中，所述脱水装置为分子筛脱水装置，用于对设定温度范围内的所述高温气体进行脱水处理。
在本发明的气体冷却设备中，当所述高温气体的温度高于所述设定温度范围时，所述分子筛脱水装置进行水气排出操作。
在本发明的气体冷却设备中，所述设定温度范围为60度-80度，所述冷媒介的预设温度为-40度到-30度。
在本发明的气体冷却设备中，所述冷却处理装置包括输入管、输出管以及密闭容器；
其中所述密闭容器放置在所述冷媒介存储装置内；
所述输入管的一端伸出所述密闭容器外，所述输入管的另一端伸入所述密闭容器内且靠近所述密闭容器底部位置；
所述输出管的一端伸入所述密闭容器内且靠近所述密闭容器顶部位置，所述输出管的另一端伸出所述密闭容器外。
在本发明的气体冷却设备中，所述脱水装置为干燥盒。
本发明的另一个目的在于提供一种高温操作系统，所述高温操作系统包括：
高温处理设备，用于对待操作物品进行高温操作，并产生高温气体，以及通过高温气体输出端排出所述高温气体；
气体冷却设备，与所述高温处理设备的高温气体输出端连接，其包括：
冷媒介存储装置，其内设置有预设温度的冷媒介；
冷却处理装置，设置在所述冷媒介存储装置内，通过所述冷媒介对所述高温气体进行冷却处理；其中所述冷却处理装置包括进气端和出气端；以及
脱水装置，设置在所述冷却处理装置的进气端，用于对所述高温气体进行脱水处理。
在本发明的高温操作系统中，所述脱水装置为分子筛脱水装置，用于对设定温度范围内的所述高温气体进行脱水处理。
在本发明的高温操作系统中，当所述高温气体的温度高于所述设定温度范围时，所述分子筛脱水装置进行水气排出操作。
在本发明的高温操作系统中，所述脱水装置为干燥盒。
在本发明的高温操作系统中，所述冷却处理装置包括输入管、输出管以及密闭容器；
其中所述密闭容器放置在所述冷媒介存储装置内；
所述输入管的一端伸出所述密闭容器外，所述输入管的另一端伸入所述密闭容器内且靠近所述密闭容器底部位置；
所述输出管的一端伸入所述密闭容器内且靠近所述密闭容器顶部位置，所述输出管的另一端伸出所述密闭容器外。
 有益效果
本发明通过提供一种气体冷却设备及高温操作系统，通过在气体冷却设备上增加一脱水装置，能够对高温气体进行脱水处理，解决了现有的高温炉排出的较低温度的高温气体中的水进入冷却处理装置，导致压力升高以及石英卡夹易破碎的技术问题，从而提高生产效率、降低生产成本。
 附图说明
图1是本发明实施例中气体冷却设备的结构示意图；
图2是本发明实施例中高温操作系统的结构示意图。
 本发明的最佳实施方式
以下各实施例的说明是参考附加的图式，用以例示本发明可用以实施的特定实施例。本发明所提到的方向用语，例如「上」、「下」、「前」、「后」、「左」、「右」、「内」、「外」、「侧面」等，仅是参考附加图式的方向。因此，使用的方向用语是用以说明及理解本发明，而非用以限制本发明。在图中，结构相似的单元是以相同标号表示。
请参照图1，图1为本发明实施例中气体冷却设备的结构示意图。
如图1所示，气体冷却设备包括：冷媒介存储装置10、冷却处理装置11、脱水装置12。其中，冷媒介存储装置10内设置有预设温度的冷媒介；预设温度譬如为-40度到-30度。
所述冷却处理装置11包括进气端和出气端；所述进气端通有高温气体，所述冷却处理装置11放置在所述冷媒介存储装置10内，通过所述冷媒介存储装置10内的所述冷媒介对所述高温气体进行冷却处理；以及
所述冷却处理装置11包括输入管111和输出管112以及密闭容器113；其中所述密闭容器113放置在所述冷媒介存储装置10内；
其中所述输入管的一端1111伸出所述密闭容器113外，所述输入管的另一端1112伸入所述密闭容器113内且靠近所述密闭容器113底部位置；
所述输出管的一端1121伸入所述密闭容器113内且靠近所述密闭容器113顶部位置，所述输出管的另一端1122伸出所述密闭容器113外，所述高温气体通过所述输入管111进入所述密闭容器113中，由于所述密闭容器113放置在所述冷媒介存储装置10内，因而所述高温气体进入所述密闭容器113时可以被冷却，由于所述输入管的另一端1112靠近所述密闭容器113底部位置且所述输出管的一端1121靠近所述密闭容器113顶部位置，使得所述高温气体在所述密闭容器113流动的时间增加，相应增加了冷却时间，因而具有更好的冷却效果。
所述密闭容器113譬如为具有带瓶塞的集气瓶，所述瓶塞上有分别供所述输入管111和输出管112伸入所述集气瓶内的孔，所述瓶塞上孔的孔径略大于所述输入管111和输出管112的孔径。
最终经过冷却处理后的所述高温气体由所述输出管112排出，所述输出管112连接外部的废气处理装置。
脱水装置12，设置在所述冷却处理装置11的进气端（与所述输入管的一端1111相同），在所述冷却处理装置11对所述高温气体冷却处理之前，所述脱水装置12对输入所述冷却处理装置11的所述高温气体进行脱水处理。
所述脱水装置12可以为分子筛脱水装置，当所述高温气体的温度处于设定温度范围内时，所述分子筛脱水装置能够吸收所述高温气体中的水；当所述高温气体的温度高于所述设定温度范围时，所述高温气体的温度能够使所述分子筛脱水装置之前吸收的水气化并排出，即所述分子筛脱水装置进行水气排出操作，采用这种脱水装置，由于其自身能够将吸收的水排出，因而不需要定期更换。所述设定温度范围譬如为60度-80度。
所述脱水装置12可以为干燥盒，所述干燥盒内装有干燥剂，所述干燥盒将输入的所述高温气体中的水吸收，将经过干燥后的高温气体通入所述冷却处理装置11，由于所述干燥盒的吸收的水达到一定量后，吸水能力下降，因此为了使得所述干燥盒有更好的脱水效果，需要定期更换所述干燥盒。
所述气体冷却设备的工作过程为：首先向所述气体冷却设备输入高温气体，所述脱水装置12对所述高温气体进行脱水处理，经过脱水处理后的高温气体经过所述输入管111进入所述密闭容器113，所述密闭容器113通过所述冷媒介存储装置10内的冷媒介对经过脱水处理后的高温气体进行冷却，最后将经过冷却后的高温气体经过所述输出管112排出。
本发明通过提供一种气体冷却设备，通过在气体冷却设备上增加一脱水装置，能够对高温气体进行脱水处理，解决了现有的高温炉排出的较低温度的高温气体中的水进入冷却处理装置，导致压力升高以及石英卡夹易破碎的技术问题，从而提高生产效率、降低生产成本。
请参照图2，图2为本发明实施例中高温操作系统的结构示意图。
如图2所示，高温操作系统包括高温处理设备2，气体冷却设备1，所述气体冷却设备1与所述高温处理设备2的高温气体输出端21连接。
所述高温处理设备2用于对待操作物品进行高温操作，所述高温处理装置2内设置有保护气体，所述高温处理装置2能够对所述保护气体加热并产生高温气体，其具有一高温气体输出端21，通过所述高温气体输出端21将所述高温气体输入所述气体冷却设备1；所述高温处理设备2譬如为高温炉，所述待操作物品譬如为OLED封装盖板。
所述气体冷却设备1包括：冷媒介存储装置10、冷却处理装置11、脱水装置12。其中，冷媒介存储装置10内设置有预设温度的冷媒介；预设温度譬如为-40度到-30度。
所述冷却处理装置11包括进气端和出气端；所述进气端通有经过所述脱水装置12脱水处理后的高温气体，所述冷却处理装置11放置在所述冷媒介存储装置10内，通过所述冷媒介存储装置10内的所述冷媒介对所述高温气体进行冷却处理；以及
所述冷却处理装置11包括输入管111和输出管112以及密闭容器113；其中所述密闭容器113放置在所述冷媒介存储装置10内；
优选地，其中所述输入管的一端1111伸出所述密闭容器113外，所述输入管的另一端1112伸入所述密闭容器113内且靠近所述密闭容器113底部位置；
所述输出管的一端1121伸入所述密闭容器113内且靠近所述密闭容器113顶部位置，所述输出管的另一端1122伸出所述密闭容器113外，所述高温气体通过所述输入管111进入所述密闭容器113中，由于所述密闭容器113放置在所述冷媒介存储装置10内，因而所述高温气体进入所述密闭容器113时可以被冷却。由于所述输入管的另一端1112靠近所述密闭容器113底部位置且所述输出管的一端1121靠近所述密闭容器113顶部位置，使得所述高温气体在所述密闭容器113流动的时间增加，相应增加了冷却时间，因而具有更好的冷却效果。
所述密闭容器113譬如为具有带瓶塞的集气瓶，所述瓶塞上有分别供所述输入管111和输出管112伸入所述集气瓶内的孔，所述瓶塞上孔的孔径略大于所述输入管111和输出管112的孔径。
最终经过冷却处理后的所述高温气体由所述输出管112排出，所述输出管112连接外部的废气处理装置。
脱水装置12，设置在所述冷却处理装置11的进气端（与所述输入管的一端1111相同），在所述冷却处理装置11对所述高温气体冷却处理之前，对输入所述冷却处理装置11的所述高温气体进行脱水处理。
所述脱水装置12可以为分子筛脱水装置，当所述高温气体的温度处于设定温度范围内时，所述分子筛脱水装置能够吸收所述高温气体中的水；当所述高温气体的温度高于所述设定温度范围时，所述高温气体的温度能够使所述分子筛脱水装置之前吸收的水气化并排出，即所述分子筛脱水装置进行水气排出操作，采用这种脱水装置，由于其自身能够将吸收的水排出，因而不需要定期更换。所述设定温度范围譬如为60度-80度。
所述脱水装置12可以为干燥盒，所述干燥盒内装有干燥剂，所述干燥盒将输入的所述高温气体中的水吸收，将经过干燥后的高温气体通入所述冷却处理装置11，由于所述干燥盒的吸水达到一定量后，吸水能力下降，因此为了使得所述干燥盒有更好的脱水效果，需要定期更换所述干燥盒。
所述高温操作系统的工作过程为：首先所述高温处理设备2向所述气体冷却设备1输入高温气体，所述脱水装置12对所述高温气体进行脱水处理，经过脱水处理后的高温气体经过所述输入管111进入所述密闭容器113，所述密闭容器113通过所述冷媒介存储装置10内的冷媒介对经过脱水处理后的高温气体进行冷却，最后将经过冷却后的高温气体经过所述输出管112排出。
本发明通过提供一种高温操作系统，通过在气体冷却设备上增加一脱水装置，能够对高温气体进行脱水处理，解决了现有的高温炉排出的较低温度的高温气体中的水进入冷却处理装置，导致压力升高以及石英卡夹易破碎的技术问题，从而提高生产效率、降低生产成本。
综上所述，虽然本发明已以优选实施例揭露如上，但上述优选实施例并非用以限制本发明，本领域的普通技术人员，在不脱离本发明的精神和范围内，均可作各种更动与润饰，因此本发明的保护范围以权利要求界定的范围为准。

Claims (14)

  1. 一种气体冷却设备，其中包括：
    冷媒介存储装置，其内设置有-40度到-30度的冷媒介；
    冷却处理装置，设置在所述冷媒介存储装置内，通过所述冷媒介对高温气体进行冷却处理；其中所述冷却处理装置包括进气端和出气端；以及
    脱水装置，设置在所述冷却处理装置的进气端，用于对所述高温气体进行脱水处理；其中所述脱水装置为分子筛脱水装置，用于对60度-80度范围内的所述高温气体进行脱水处理。
  2. 根据权利要求1所述的气体冷却设备，其中当所述高温气体的温度高于60度-80度的范围时，所述分子筛脱水装置进行水气排出操作。
  3. 根据权利要求1所述的气体冷却设备，其中所述冷却处理装置包括输入管、输出管以及密闭容器；
    其中所述密闭容器放置在所述冷媒介存储装置内；
    所述输入管的一端伸出所述密闭容器外，所述输入管的另一端伸入所述密闭容器内且靠近所述密闭容器底部位置；
    所述输出管的一端伸入所述密闭容器内且靠近所述密闭容器顶部位置，所述输出管的另一端伸出所述密闭容器外。
  4. 一种气体冷却设备，其中包括：
    冷媒介存储装置，其内设置有预设温度的冷媒介；
    冷却处理装置，设置在所述冷媒介存储装置内，通过所述冷媒介对高温气体进行冷却处理；其中所述冷却处理装置包括进气端和出气端；以及
    脱水装置，设置在所述冷却处理装置的进气端，用于对所述高温气体进行脱水处理。
  5. 根据权利要求4所述的气体冷却设备，其中所述脱水装置为分子筛脱水装置，用于对设定温度范围内的所述高温气体进行脱水处理。
  6. 根据权利要求5所述的气体冷却设备，其中当所述高温气体的温度高于所述设定温度范围时，所述分子筛脱水装置进行水气排出操作。
  7. 根据权利要求4所述的气体冷却设备，其中所述设定温度范围为60度-80度，所述冷媒介的预设温度为-40度到-30度。
  8. 根据权利要求4所述的气体冷却设备，其中所述冷却处理装置包括输入管、输出管以及密闭容器；
    其中所述密闭容器放置在所述冷媒介存储装置内；
    所述输入管的一端伸出所述密闭容器外，所述输入管的另一端伸入所述密闭容器内且靠近所述密闭容器底部位置；
    所述输出管的一端伸入所述密闭容器内且靠近所述密闭容器顶部位置，所述输出管的另一端伸出所述密闭容器外。
  9. 根据权利要求4所述的气体冷却设备，其中所述脱水装置为干燥盒。
  10. 一种高温操作系统，其中包括：
    高温处理设备，用于对待操作物品进行高温操作，并产生高温气体，以及通过高温气体输出端排出所述高温气体；
    气体冷却设备，与所述高温处理设备的高温气体输出端连接，其包括：
    冷媒介存储装置，其内设置有预设温度的冷媒介；
    冷却处理装置，设置在所述冷媒介存储装置内，通过所述冷媒介对所述高温气体进行冷却处理；其中所述冷却处理装置包括进气端和出气端；以及
    脱水装置，设置在所述冷却处理装置的进气端，用于对所述高温气体进行脱水处理。
  11. 根据权利要求10所述的高温操作系统，其中所述脱水装置为分子筛脱水装置，用于对设定温度范围内的所述高温气体进行脱水处理。
  12. 根据权利要求11所述的高温操作系统，其中当所述高温气体的温度高于所述设定温度范围时，所述分子筛脱水装置进行水气排出操作。
  13. 根据权利要求10所述的高温操作系统，其中所述脱水装置为干燥盒。
  14. 根据权利要求10所述的高温操作系统，其中所述冷却处理装置包括输入管、输出管以及密闭容器；
    其中所述密闭容器放置在所述冷媒介存储装置内；
    所述输入管的一端伸出所述密闭容器外，所述输入管的另一端伸入所述密闭容器内且靠近所述密闭容器底部位置；
    所述输出管的一端伸入所述密闭容器内且靠近所述密闭容器顶部位置，所述输出管的另一端伸出所述密闭容器外。
PCT/CN2014/083571 2014-07-11 2014-08-01 一种气体冷却设备及高温操作系统 WO2016004659A1 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US14/404,032 US10295235B2 (en) 2014-07-11 2014-08-01 Gas cooling equipment and high temperature operating system

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201410330365.0 2014-07-11
CN201410330365.0A CN104110969B (zh) 2014-07-11 2014-07-11 一种气体冷却设备及高温操作系统

Publications (1)

Publication Number Publication Date
WO2016004659A1 true WO2016004659A1 (zh) 2016-01-14

Family

ID=51707860

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2014/083571 WO2016004659A1 (zh) 2014-07-11 2014-08-01 一种气体冷却设备及高温操作系统

Country Status (3)

Country Link
US (1) US10295235B2 (zh)
CN (1) CN104110969B (zh)
WO (1) WO2016004659A1 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106711152A (zh) * 2017-01-03 2017-05-24 京东方科技集团股份有限公司 一种显示面板及其封装方法
US10209476B2 (en) * 2017-02-14 2019-02-19 Google Llc Hard surface deployed fiber
US11859160B2 (en) * 2019-12-18 2024-01-02 Spokane Stainless Technologies, Inc. Oval-shaped metal tank systems

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11333253A (ja) * 1998-05-29 1999-12-07 Mitsubishi Heavy Ind Ltd 焼却設備の排煙処理装置
CN200975826Y (zh) * 2006-11-30 2007-11-14 牛东 一种工业废气回收液化装置
CN202161911U (zh) * 2011-06-16 2012-03-14 中国恩菲工程技术有限公司 烟气处理设备
WO2012101359A1 (fr) * 2011-01-25 2012-08-02 Jcl Technologie Procede de traitement thermique du bois avec des gaz deshydrates et depoussieres
CN102751447A (zh) * 2012-07-04 2012-10-24 信利半导体有限公司 光学过渡层材料、光学基板/封装层、oled及各自制法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3888784A (en) * 1972-11-29 1975-06-10 Northern Electric Co Electrochemical luminescent composition
JPS6099532U (ja) * 1983-12-09 1985-07-06 富士通株式会社 拡散炉
US5072592A (en) * 1990-06-26 1991-12-17 Smc Corporation Gas cleaner
CN101514378B (zh) * 2009-02-26 2011-07-20 中冶赛迪工程技术股份有限公司 一种高炉鼓风机机后脱湿装置
CN202315654U (zh) * 2011-11-10 2012-07-11 南京圣诺热管有限公司 烟气脱水再热装置
CN102899444A (zh) * 2012-10-26 2013-01-30 通化市五一环保科技股份有限公司 转炉烟气处理系统及处理方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11333253A (ja) * 1998-05-29 1999-12-07 Mitsubishi Heavy Ind Ltd 焼却設備の排煙処理装置
CN200975826Y (zh) * 2006-11-30 2007-11-14 牛东 一种工业废气回收液化装置
WO2012101359A1 (fr) * 2011-01-25 2012-08-02 Jcl Technologie Procede de traitement thermique du bois avec des gaz deshydrates et depoussieres
CN202161911U (zh) * 2011-06-16 2012-03-14 中国恩菲工程技术有限公司 烟气处理设备
CN102751447A (zh) * 2012-07-04 2012-10-24 信利半导体有限公司 光学过渡层材料、光学基板/封装层、oled及各自制法

Also Published As

Publication number Publication date
US10295235B2 (en) 2019-05-21
US20160010903A1 (en) 2016-01-14
CN104110969A (zh) 2014-10-22
CN104110969B (zh) 2016-03-30

Similar Documents

Publication Publication Date Title
WO2016004659A1 (zh) 一种气体冷却设备及高温操作系统
WO2017004854A1 (zh) 一种oled显示面板及其封装方法
WO2018000553A1 (zh) Oled 封装结构
CN205961606U (zh) 一种电子元器件可拆卸封装
CN102969227A (zh) 集紫外光化学与化学气相干法表面处理的真空设备
TW202240697A (zh) 半導體熱處理設備
WO2016004660A1 (zh) 一种操作平台
WO2016033845A1 (zh) 一种有机发光二极管封装结构及显示装置
CN105271792B (zh) 固化装置及固化方法
WO2016175440A1 (ko) 대기오염 측정 분석을 위한 전처리 장치 및 방법
WO2016050192A1 (zh) 一种真空绝热板的制作方法
CN204506119U (zh) 一种全风冷紫外线固化灯箱
CN201724948U (zh) 可快速降温的氮气高温试验箱
WO2017181593A1 (zh) 烧结设备、有机发光二极管器件用封装系统、烧结方法
WO2014190586A1 (zh) 配向紫外线液晶照射装置、水冷套管
CN204991660U (zh) 快速热制程设备
CN109105538A (zh) 一种用于茶叶烘干设备的循环装置
JP6321785B2 (ja) 基板に材料を適用するための装置及び方法
CN104979249B (zh) 进出气装置、具有进出气装置之热处理机台及进出气方法
CN104209254B (zh) 用于多孔低介电常数材料的紫外光固化工艺方法
TWM496236U (zh) 用於太陽能電池片鈍化的晶體矽氧化處理設備
CN205452250U (zh) 柔性基板的固化装置
CN105940290A (zh) 一种血涂片的干燥方法、装置及推片机
WO2013181867A1 (zh) 紫外有机发光装置
WO2016061813A1 (zh) 具有中空式led发光体的灯泡

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 14404032

Country of ref document: US

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 14897001

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 14897001

Country of ref document: EP

Kind code of ref document: A1