WO2016001196A1 - Method for producing a composite wall and associated composite wall - Google Patents

Method for producing a composite wall and associated composite wall Download PDF

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Publication number
WO2016001196A1
WO2016001196A1 PCT/EP2015/064792 EP2015064792W WO2016001196A1 WO 2016001196 A1 WO2016001196 A1 WO 2016001196A1 EP 2015064792 W EP2015064792 W EP 2015064792W WO 2016001196 A1 WO2016001196 A1 WO 2016001196A1
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WO
WIPO (PCT)
Prior art keywords
composite wall
depositing
conductive
ink
porous web
Prior art date
Application number
PCT/EP2015/064792
Other languages
French (fr)
Inventor
Gérard Collignon
Thierry LEBASTARD
Thibaut ROLLAND
Xavier Caillaud
Original Assignee
Ineo Defense
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ineo Defense filed Critical Ineo Defense
Priority to EP15734338.5A priority Critical patent/EP3164909A1/en
Publication of WO2016001196A1 publication Critical patent/WO2016001196A1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/42—Housings not intimately mechanically associated with radiating elements, e.g. radome
    • H01Q1/425—Housings not intimately mechanically associated with radiating elements, e.g. radome comprising a metallic grid
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F03—MACHINES OR ENGINES FOR LIQUIDS; WIND, SPRING, OR WEIGHT MOTORS; PRODUCING MECHANICAL POWER OR A REACTIVE PROPULSIVE THRUST, NOT OTHERWISE PROVIDED FOR
    • F03D—WIND MOTORS
    • F03D1/00—Wind motors with rotation axis substantially parallel to the air flow entering the rotor 
    • F03D1/06—Rotors
    • F03D1/0608—Rotors characterised by their aerodynamic shape
    • F03D1/0633—Rotors characterised by their aerodynamic shape of the blades
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/42—Housings not intimately mechanically associated with radiating elements, e.g. radome
    • H01Q1/422—Housings not intimately mechanically associated with radiating elements, e.g. radome comprising two or more layers of dielectric material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q15/00—Devices for reflection, refraction, diffraction or polarisation of waves radiated from an antenna, e.g. quasi-optical devices
    • H01Q15/0006—Devices acting selectively as reflecting surface, as diffracting or as refracting device, e.g. frequency filtering or angular spatial filtering devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/038—Textiles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1208—Pretreatment of the circuit board, e.g. modifying wetting properties; Patterning by using affinity patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/70—Wind energy
    • Y02E10/72—Wind turbines with rotation axis in wind direction

Definitions

  • the present invention relates to a method for producing a composite wall and to the associated composite wall.
  • the invention is particularly suitable for antenna protection radomes and wind turbine blades.
  • the invention finds a particularly advantageous application for improving the electromagnetic transparency of dielectric composite materials used in the manufacture of radomes and blades of wind turbines.
  • This radome is a dielectric composite material envelope, of sufficient thickness to protect the antenna and which must be transparent to the electromagnetic waves corresponding to the protected antennas.
  • the same quality of transparency is desired on certain wind turbine blades in order to reduce their disturbances in the operation of nearby radars.
  • the wind turbine blade generally hollow, consists of a dielectric composite material wall.
  • the only solution to obtain the electromagnetic transparency without modifying the materials or the thicknesses is the use of conductive circuits with periodic patterns of adaptation.
  • the solutions described consist in producing these circuits on a flexible support by chemical etching techniques (printed circuit).
  • the flexible dielectric support is usually of the order of 0.1 mm thick made of polyimide material, polyester or epoxy glass.
  • the thickness of the copper circuit is a few tens of microns.
  • This type of circuit can also be used to give the radome band-pass filtering properties to, for example, improve its out-of-band stealth. It can also be used to allow anti-icing of the structure by circulating a continuous or low-frequency current in the metal circuit in order to heat the wall.
  • the conductive patterns are not necessarily periodic and the composite material is not necessarily transparent. Indeed, this anti-icing can also be applied to antenna reflectors made of carbon composite or other materials.
  • the dielectric wall is often made of composite material, for example glass or quartz / resin type (eg polyester, epoxy, etc.).
  • the mechanical properties of the material can be degraded by the presence of the flexible printed circuit. Indeed, only the bonding on both sides of the printed circuit ensures the cohesion of the assembly.
  • a large number of holes with a maximum surface area are usually practiced in the flexible support without disturbing the metallic patterns.
  • the diagram of FIG. 1 reveals the state of the art for an example of a circuit with periodic metallic patterns comprising continuous wires 11 and crosses 12 on which a maximum of holes 13 have been made in the support 14.
  • the cohesion between the two faces is thus partially restored if the percentage of perforated surface is important.
  • the possible percentage depends on the shape of the metal patterns used and it is not always possible to exceed 50%.
  • the present invention intends to overcome the disadvantages of the prior art by proposing to replace the conductive circuit with periodic patterns made in printed circuit by a conductive circuit obtained by the deposition of a conductive ink in screen printing or inkjet on a support of porous veil type.
  • the present invention relates to a method for producing a composite wall comprising a porous web extending in the thickness of said composite wall, the method comprising a step of depositing a conductive ink on said porous web according to a predetermined mesh capable of conferring on said composite wall particular properties, electromagnetic transparency, electromagnetic filtering and / or deicing.
  • the invention makes it possible to eliminate the need for drilling the support and to preserve the mechanical properties of the composite material.
  • the circuit produced has a high tolerance to bending and deformations to safely handle surfaces of several tens of m 2 .
  • the supple nature of the support also gives a better tolerance to laying on non-developable surfaces.
  • the circuit is integrated in a method of manufacturing a composite wall by molding and injection of resin.
  • the porosity of the support web of the conductive circuit allows the free circulation of the impregnating resin during the resin injection phase in the complete part.
  • the step of depositing the conductive ink is performed by screen printing.
  • the step of depositing the conductive ink is performed by ink jet.
  • the step of depositing the conductive ink is carried out continuously over very long lengths. This embodiment makes it possible to realize large circuits and eliminates the problems of setting up circuits and continuity of patterns at the connections.
  • the method comprises a step of depositing a dielectric ink on said porous web according to said predetermined mesh before the step of depositing said conductive ink, a deposited surface of said dielectric ink being greater than a deposited surface of said conductive ink so that said conductive ink is deposited on said dielectric ink.
  • said porous web is made of polyester fibers.
  • the invention relates to a composite wall made by an embodiment of the invention.
  • said porous web and its conductive circuit are made of several distinct parts and the parts are assembled together by bonding and bridging by means of a conductive adhesive.
  • This embodiment makes it possible to produce a wall of large size. This embodiment also limits the problems of setting up the circuits and continuity of the patterns at the connections.
  • Figure 1 illustrates a printed circuit board with periodic metal patterns pierced with holes according to the state of the art
  • FIG. 2 illustrates a porous web printed according to a first embodiment of the invention
  • FIG. 3 illustrates a liquid resin impregnation bench of a composite wall according to one embodiment of the invention
  • Figure 4 illustrates a porous web printed according to a second embodiment of the invention.
  • Figure 2 shows part of a conductive circuit comprising a linear track printed on a porous web 1 6.
  • the realization of the conductive circuit consists of depositing a conductive ink 15 on the porous web 1 6 in a periodic mesh suitably dimensioned to obtain the adaptation of the composite wall for which it is intended.
  • the conductive circuits are obtained by the deposition of the conductive ink 15 by screen printing or by ink jet.
  • the support used is a porous polyester web 16 which allows the free circulation of the liquid resin and which naturally integrates during the manufacture of the composite material. This step eliminates the need for drilling the support and keeps the mechanical properties of the composite material.
  • the embodiment of the wall is shown in Figure 3 in the example of the use of a liquid resin impregnation bench.
  • This embodiment consists in arranging said porous web 16 between different layers of reinforcing fibers 20 (woven or non-woven glass).
  • the composite wall is made by resin transfer molding in the rigid mold (Infusion or RTM "Resin Transfer Molding" in English) without changing parameter.
  • the reinforcing layers 20 are placed in a rigid heating mold having a lower portion 21 and an upper portion 22.
  • a resin matrix 26 is injected 24 at a first end of the mold and sucked at a second end 25 opposite the first end.
  • the dies 26 used in this process have a low viscosity to facilitate flow 27 and minimize porosity. This process makes it possible to manufacture composite parts having smooth surfaces with finite ribs.
  • An exemplary embodiment has made it possible to obtain good results with a non-woven matte porous web 16 whose fibers are distributed in the plane of the sheet and maintained by a binder (called "binder" in English).
  • the conductive ink corresponds, for example, to a thermoplastic or thermosetting liquid resin for printing containing conductive fillers (silver, carbon, etc.).
  • the method of the invention also allows the printing of continuous circuits over very long lengths (screen printing process or inkjet Roll to Roll). This method also allows the easy assembly of circuits between them by bonding and possibly bridging by means of a conductive adhesive and thus to realize large circuits.
  • the composite parts thus produced have a high tolerance to bending and deformations for safely handling assembled surfaces of several tens of m 2 .
  • the supple nature of the support also gives a better tolerance to laying on non-developable surfaces.
  • the invention also solves the problems of setting up the circuits and the continuity of the patterns at the connections.
  • FIG. 4 shows a linear track 15 printed on an intermediate dielectric layer previously deposited on the porous web 1 6.
  • the dielectric ink corresponds, for example, to a liquid thermoplastic or thermosetting resin for printing containing no conductive filler.
  • the prior printing of a dielectric ink 17 on a surface slightly greater than that of the conductive patterns can improve the accuracy of pattern design.

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Fluid Mechanics (AREA)
  • Sustainable Development (AREA)
  • Sustainable Energy (AREA)
  • Physics & Mathematics (AREA)
  • Combustion & Propulsion (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Textile Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

The invention relates to a method for producing a composite wall comprising a porous web (16) extending in the thickness of said composite wall, said method comprising a step of depositing a conductive ink (15) on said porous web (16) according to a pre-determined mesh that can provide said composite wall with specific properties of electromagnetic transparency, electromagnetic filtering and/or defrosting without damaging the mechanical strength thereof.

Description

PROCEDE DE REALISATION D'UNE PAROI COMPOSITE  METHOD FOR PRODUCING A COMPOSITE WALL
ET PAROI COMPOSITE ASSOCIEE Domaine de l'invention  AND ASSOCIATED COMPOSITE WALL Field of the invention
La présente invention se rapporte à un procédé de réalisation d'une paroi composite ainsi qu'à la paroi composite associée. L'invention est particulièrement adaptée aux radomes de protection des antennes et aux pales d'éoliennes. The present invention relates to a method for producing a composite wall and to the associated composite wall. The invention is particularly suitable for antenna protection radomes and wind turbine blades.
L'invention trouve une application particulièrement avantageuse pour l'amélioration de la transparence électromagnétique des matériaux composites diélectriques utilisés dans la fabrication des radomes et des pales d'éoliennes. The invention finds a particularly advantageous application for improving the electromagnetic transparency of dielectric composite materials used in the manufacture of radomes and blades of wind turbines.
Etat de la technique State of the art
La protection des antennes de radar ou de télécommunications est souvent réalisée par l'utilisation d'un radome. Ce radome est une enveloppe en matériau composite diélectrique, d'épaisseur suffisante pour protéger l'antenne et qui doit être transparente aux ondes électromagnétiques correspondantes aux antennes protégées. The protection of radar or telecommunication antennas is often achieved by the use of a radome. This radome is a dielectric composite material envelope, of sufficient thickness to protect the antenna and which must be transparent to the electromagnetic waves corresponding to the protected antennas.
La même qualité de transparence est souhaitée sur certaines pales d'éoliennes afin de réduire leurs perturbations du fonctionnement des radars situés à proximité. La pale d'éolienne, en général creuse, est constituée d'une paroi en matériau composite diélectrique. The same quality of transparency is desired on certain wind turbine blades in order to reduce their disturbances in the operation of nearby radars. The wind turbine blade, generally hollow, consists of a dielectric composite material wall.
Dans les deux cas, la transparence de la paroi diélectrique (enveloppe radome ou coque de la pale) est nécessaire à l'obtention de performances électromagnétiques satisfaisantes. In both cases, the transparency of the dielectric wall (radome envelope or hull of the blade) is necessary to obtain satisfactory electromagnetic performance.
Les différentes solutions suivantes pour obtenir une paroi diélectrique transparente sont connues : The following different solutions for obtaining a transparent dielectric wall are known:
• Utilisation d'une peau très mince par rapport à la longueur d'onde de travail. • Utilisation d'une paroi d'épaisseur égale à une demi-longueur d'onde dans le matériau (ou un multiple). • Use of very thin skin in relation to the working wavelength. • Use of a wall of half-wavelength thickness in the material (or a multiple).
• Utilisation d'un sandwich constitué de plusieurs lames diélectriques séparées de couches de matériau à basse constante diélectrique (mousse ou nid d'abeilles) et d'épaisseurs voisines d'un quart de longueur d'onde. • Use of a sandwich consisting of several dielectric strips separated layers of material with low dielectric constant (foam or honeycomb) and thicknesses close to a quarter of a wavelength.
• Utilisation d'un ou plusieurs circuits conducteurs plans à motifs périodiques disposés à l'intérieur de la couche diélectrique permettant d'obtenir l'adaptation de celle ci et donc sa transparence aux fréquences souhaitées. • Use of one or more planar conductor circuits with periodic patterns disposed within the dielectric layer to obtain the adaptation thereof and thus its transparency at the desired frequencies.
Dans les cas où la structure de la paroi a été définie dans le but d'obtenir des propriétés telles que, par exemple, la tenue à certaines contraintes mécaniques, la seule solution permettant d'obtenir la transparence électromagnétique sans modifier les matières ni les épaisseurs est l'utilisation de circuits conducteurs à motifs périodiques d'adaptation. In cases where the structure of the wall has been defined in order to obtain properties such as, for example, the resistance to certain mechanical stresses, the only solution to obtain the electromagnetic transparency without modifying the materials or the thicknesses is the use of conductive circuits with periodic patterns of adaptation.
Des techniques d'adaptation d'un radome au moyen de circuits métalliques à maille périodique ont déjà été décrites dans les demandes de brevets français portant les numéros FR 84 03138 et FR 87 00724. Techniques for adapting a radome using periodic mesh metal circuits have already been described in the French patent applications bearing the numbers FR 84 03138 and FR 87 00724.
L'utilisation de ces circuits pour la furtivité des pales d'éolienne a également été décrite dans les demandes de brevets français numéros FR 08 52746 et FR 10 60253. The use of these circuits for the stealth of wind turbine blades has also been described in French patent applications numbers FR 08 52746 and FR 10 60253.
Les solutions décrites consistent à réaliser ces circuits sur un support souple par des techniques de gravure chimique (circuit imprimé). Le support diélectrique souple est habituellement de l'ordre de 0.1 mm d'épaisseur en matériau polyimide, polyester ou verre époxy. L'épaisseur du circuit cuivre est de quelques dizaines de microns. The solutions described consist in producing these circuits on a flexible support by chemical etching techniques (printed circuit). The flexible dielectric support is usually of the order of 0.1 mm thick made of polyimide material, polyester or epoxy glass. The thickness of the copper circuit is a few tens of microns.
Ce type de circuit peut également être utilisé pour donner au radome des propriétés de filtrage de type passe bande pour, par exemple, améliorer sa furtivité hors bande. Il peut également être utilisé pour permettre un anti givrage de la structure en faisant circuler dans le circuit métallique un courant continu ou à basse fréquence dans le but de réchauffer la paroi. Dans ce cas, les motifs conducteurs ne sont pas forcément périodiques et le matériau composite n'est pas forcement transparent. En effet, cet antigivrage peut également s'appliquer à des réflecteurs d'antennes réalisées en composite carbone ou autres matériaux. This type of circuit can also be used to give the radome band-pass filtering properties to, for example, improve its out-of-band stealth. It can also be used to allow anti-icing of the structure by circulating a continuous or low-frequency current in the metal circuit in order to heat the wall. In this case, the conductive patterns are not necessarily periodic and the composite material is not necessarily transparent. Indeed, this anti-icing can also be applied to antenna reflectors made of carbon composite or other materials.
Cependant, les dimensions des circuits sont limitées à quelques dizaines de cm (50x50 cm habituellement) pour des raisons de fabrication des circuits imprimés. La couverture de toute la surface de la paroi traitée (éventuellement plusieurs dizaines de m2), nécessite donc la mise en place de nombreux pavés sensiblement carrés avec éventuellement des problèmes de continuité électrique des motifs métalliques à la jonction entre chaque pavé et de précision de positionnement des pavés les uns par rapport aux autres. Ces problèmes sont croissants sur des formes non développables. However, the dimensions of the circuits are limited to a few tens of cm (50x50 cm usually) for reasons of manufacturing circuit boards. The coverage of the entire surface of the treated wall (possibly several tens of m 2 ), therefore requires the establishment of many substantially square blocks with possible problems of electrical continuity of the metal patterns at the junction between each block and accuracy of positioning the blocks relative to each other. These problems are growing on non-developable forms.
De plus, la paroi diélectrique est souvent réalisée en matériau composite par exemple de type verre ou quartz / résine (ex. : polyester, époxy, ...). Les propriétés mécaniques du matériau peuvent être dégradées par la présence du circuit imprimé souple. En effet, seul le collage de part et d'autre du circuit imprimé assure la cohésion de l'ensemble. Pour remédier à ce problème, on pratique habituellement un grand nombre de trous d'une surface maximale dans le support souple sans perturber les motifs métalliques. Le schéma de la Figure 1 révèle l'état de la technique pour un exemple de circuit à motifs métalliques périodiques comportant des fils continus 1 1 et des croix 12 sur lequel un maximum de trous 13 ont été pratiqués dans le support 14. In addition, the dielectric wall is often made of composite material, for example glass or quartz / resin type (eg polyester, epoxy, etc.). The mechanical properties of the material can be degraded by the presence of the flexible printed circuit. Indeed, only the bonding on both sides of the printed circuit ensures the cohesion of the assembly. To overcome this problem, a large number of holes with a maximum surface area are usually practiced in the flexible support without disturbing the metallic patterns. The diagram of FIG. 1 reveals the state of the art for an example of a circuit with periodic metallic patterns comprising continuous wires 11 and crosses 12 on which a maximum of holes 13 have been made in the support 14.
La cohésion entre les deux faces est donc partiellement rétablie si le pourcentage de surface trouée est important. Le pourcentage possible dépend de la forme des motifs métalliques utilisés et il n'est pas toujours possible de dépasser 50%. The cohesion between the two faces is thus partially restored if the percentage of perforated surface is important. The possible percentage depends on the shape of the metal patterns used and it is not always possible to exceed 50%.
En outre, ces circuits métalliques sont fragiles, peu tolérant à la manutention, et présentent des risques de décollement et de microcoupures, nécessitant des réparations fastidieuses en cas de dégradation. Exposé de l'invention In addition, these metal circuits are fragile, little tolerant to handling, and have the risk of delamination and micro-cuts, requiring tedious repairs in case of degradation. Presentation of the invention
La présente invention entend remédier aux inconvénients de l'art antérieur en proposant de remplacer le circuit conducteur à motifs périodiques réalisé en circuit imprimé par un circuit conducteur obtenus par le dépôt d'une encre conductrice en sérigraphie ou jet d'encre sur un support de type voile poreux. The present invention intends to overcome the disadvantages of the prior art by proposing to replace the conductive circuit with periodic patterns made in printed circuit by a conductive circuit obtained by the deposition of a conductive ink in screen printing or inkjet on a support of porous veil type.
A cet effet, selon un premier aspect, la présente invention concerne un procédé de réalisation d'une paroi composite comportant un voile poreux s'étendant dans l'épaisseur de ladite paroi composite, le procédé comportant une étape de dépôt d'une encre conductrice sur ledit voile poreux selon un maillage prédéterminé apte à conférer à ladite paroi composite des propriétés particulières, de transparence électromagnétique, de filtrage électromagnétique et/ou de dégivrage. For this purpose, according to a first aspect, the present invention relates to a method for producing a composite wall comprising a porous web extending in the thickness of said composite wall, the method comprising a step of depositing a conductive ink on said porous web according to a predetermined mesh capable of conferring on said composite wall particular properties, electromagnetic transparency, electromagnetic filtering and / or deicing.
L'introduction de ce voile poreux imprimé à l'intérieur de la paroi composite permet, par exemple, d'obtenir des propriétés de transparence électromagnétique sans dégradation de la tenue mécanique. The introduction of this porous web printed inside the composite wall makes it possible, for example, to obtain properties of electromagnetic transparency without degradation of the mechanical strength.
L'invention permet d'éliminer le besoin de perçage du support et de conserver les propriétés mécaniques du matériau composite. De plus, le circuit réalisé présente une grande tolérance au pliage et aux déformations permettant de manipuler sans risques des surfaces de plusieurs dizaines de m2. La nature souple du support donne également une meilleure tolérance à la pose sur des surfaces non développables. Le circuit est intégré dans un procédé de fabrication d'une paroi composite par moulage et injection de résine. La porosité du voile support du circuit conducteur permet la libre circulation de la résine d'imprégnation lors de la phase d'injection de résine dans la pièce complète. The invention makes it possible to eliminate the need for drilling the support and to preserve the mechanical properties of the composite material. In addition, the circuit produced has a high tolerance to bending and deformations to safely handle surfaces of several tens of m 2 . The supple nature of the support also gives a better tolerance to laying on non-developable surfaces. The circuit is integrated in a method of manufacturing a composite wall by molding and injection of resin. The porosity of the support web of the conductive circuit allows the free circulation of the impregnating resin during the resin injection phase in the complete part.
Selon un mode de réalisation, l'étape de déposer l'encre conductrice est effectuée par sérigraphie. According to one embodiment, the step of depositing the conductive ink is performed by screen printing.
Selon un mode de réalisation, l'étape de déposer l'encre conductrice est effectuée par jet d'encre. According to one embodiment, the step of depositing the conductive ink is performed by ink jet.
Selon un mode de réalisation, l'étape de déposer l'encre conductrice est réalisée en continu sur de très grandes longueurs. Ce mode de réalisation permet de réaliser des circuits de grande dimension et supprime les problèmes de mise en place des circuits et de continuités des motifs au niveau des raccords. According to one embodiment, the step of depositing the conductive ink is carried out continuously over very long lengths. This embodiment makes it possible to realize large circuits and eliminates the problems of setting up circuits and continuity of patterns at the connections.
Selon un mode de réalisation, le procédé comporte une étape consistant à déposer une encre diélectrique sur ledit voile poreux selon ledit maillage prédéterminé avant l'étape consistant à déposer ladite encre conductrice, une surface déposée de ladite encre diélectrique étant supérieure à une surface déposée de ladite encre conductrice de sorte que ladite encre conductrice soit déposée sur ladite encre diélectrique. Ce mode de réalisation permet d'améliorer la précision de l'étape consistant à déposer les motifs conducteurs. According to one embodiment, the method comprises a step of depositing a dielectric ink on said porous web according to said predetermined mesh before the step of depositing said conductive ink, a deposited surface of said dielectric ink being greater than a deposited surface of said conductive ink so that said conductive ink is deposited on said dielectric ink. This embodiment improves the accuracy of the step of depositing the conductive patterns.
Selon un mode de réalisation, ledit voile poreux est réalisé en fibres de polyester. According to one embodiment, said porous web is made of polyester fibers.
Selon un deuxième aspect, l'invention concerne une paroi composite réalisée par un procédé de réalisation selon l'invention. According to a second aspect, the invention relates to a composite wall made by an embodiment of the invention.
Selon un mode de réalisation, ledit voile poreux et son circuit conducteur sont réalisés en plusieurs parties distinctes et les parties sont assemblées entre elles par collage et pontage au moyen d'une colle conductrice. Ce mode de réalisation permet de réaliser une paroi de grande dimension. Ce mode de réalisation limite également les problèmes de mise en place des circuits et de continuités des motifs au niveau des raccords. According to one embodiment, said porous web and its conductive circuit are made of several distinct parts and the parts are assembled together by bonding and bridging by means of a conductive adhesive. This embodiment makes it possible to produce a wall of large size. This embodiment also limits the problems of setting up the circuits and continuity of the patterns at the connections.
Brève description des dessins Brief description of the drawings
On comprendra mieux l'invention à l'aide de la description, faite ci-après à titre purement explicatif, des modes de réalisation de l'invention, en référence aux Figures dans lesquelles : The invention will be better understood by means of the description, given below purely for explanatory purposes, of the embodiments of the invention, with reference to the figures in which:
• la Figure 1 illustre un circuit imprimé à motifs périodiques métalliques percé de trous selon l'état de la technique ;  • Figure 1 illustrates a printed circuit board with periodic metal patterns pierced with holes according to the state of the art;
• la Figure 2 illustre un voile poreux imprimé selon un premier mode de réalisation de l'invention ;  FIG. 2 illustrates a porous web printed according to a first embodiment of the invention;
• la Figure 3 illustre un banc d'imprégnation en résine liquide d'une paroi composite selon un mode de réalisation de l'invention ; et • la Figure 4 illustre un voile poreux imprimé selon un deuxième mode de réalisation de l'invention. FIG. 3 illustrates a liquid resin impregnation bench of a composite wall according to one embodiment of the invention; and • Figure 4 illustrates a porous web printed according to a second embodiment of the invention.
Description détaillée des modes de réalisation de l'invention DETAILED DESCRIPTION OF THE EMBODIMENTS OF THE INVENTION
La Figure 2 révèle une partie d'un circuit conducteur comprenant une piste linéaire imprimée sur un voile poreux 1 6. Figure 2 shows part of a conductive circuit comprising a linear track printed on a porous web 1 6.
La réalisation du circuit conducteur consiste à déposer une encre conductrice 15 sur le voile poreux 1 6 selon un maillage périodique convenablement dimensionné pour obtenir l'adaptation de la paroi composite à laquelle il est destiné. Les circuits conducteurs sont obtenus par le dépôt de l'encre conductrice 15 par sérigraphie ou par jet d'encre. Le support utilisé est un voile poreux 1 6 de polyester qui permet la libre circulation de la résine liquide et qui s'intègre naturellement au cours de la fabrication du matériau composite. Cette étape élimine le besoin de perçage du support et permet de conserver les propriétés mécaniques du matériau composite. The realization of the conductive circuit consists of depositing a conductive ink 15 on the porous web 1 6 in a periodic mesh suitably dimensioned to obtain the adaptation of the composite wall for which it is intended. The conductive circuits are obtained by the deposition of the conductive ink 15 by screen printing or by ink jet. The support used is a porous polyester web 16 which allows the free circulation of the liquid resin and which naturally integrates during the manufacture of the composite material. This step eliminates the need for drilling the support and keeps the mechanical properties of the composite material.
La réalisation de la paroi est représentée sur la Figure 3 dans l'exemple de l'utilisation d'un banc d'imprégnation en résine liquide. Cette réalisation consiste à disposer ledit voile poreux 1 6 entre différentes couches de fibres renfort 20 (verre tissé ou non). La paroi composite est réalisée par transfert de résine par moulage dans le moule rigide (Infusion ou RTM « Resin Transfert Molding » en anglais) sans évolution de paramètre. Les couches de renfort 20 sont placées dans un moule rigide chauffant comportant une partie inférieure 21 et une partie supérieure 22. Une matrice 26 de résine est injectée 24 à une première extrémité du moule et aspirée à une deuxième extrémité 25 opposée à la première extrémité. Les matrices 26 utilisées dans ce procédé présentent une faible viscosité afin de faciliter l'écoulement 27 et de minimiser les porosités. Ce procédé permet de fabriquer des pièces composites présentant des faces lisses à côtes finies. The embodiment of the wall is shown in Figure 3 in the example of the use of a liquid resin impregnation bench. This embodiment consists in arranging said porous web 16 between different layers of reinforcing fibers 20 (woven or non-woven glass). The composite wall is made by resin transfer molding in the rigid mold (Infusion or RTM "Resin Transfer Molding" in English) without changing parameter. The reinforcing layers 20 are placed in a rigid heating mold having a lower portion 21 and an upper portion 22. A resin matrix 26 is injected 24 at a first end of the mold and sucked at a second end 25 opposite the first end. The dies 26 used in this process have a low viscosity to facilitate flow 27 and minimize porosity. This process makes it possible to manufacture composite parts having smooth surfaces with finite ribs.
Un exemple de réalisation a permis d'obtenir de bons résultats avec un voile poreux 1 6 mat non tissé dont les fibres sont distribuées dans le plan de la feuille et maintenu par un liant (dit « binder » en anglais). L'encre conductrice correspond, par exemple, à une résine thermoplastique ou thermodurcissable liquide pour impression contenant des charges conductrices (argent, carbone, ...). Le procédé de l'invention permet également l'impression des circuits en continu sur de très grandes longueurs (procédé de sérigraphie ou de jet d'encre Roll to Roll). Ce procédé permet également l'assemblage aisé de circuits entre eux par collage et éventuellement pontage au moyen d'une colle conductrice et de réaliser ainsi des circuits de grande dimension. An exemplary embodiment has made it possible to obtain good results with a non-woven matte porous web 16 whose fibers are distributed in the plane of the sheet and maintained by a binder (called "binder" in English). The conductive ink corresponds, for example, to a thermoplastic or thermosetting liquid resin for printing containing conductive fillers (silver, carbon, etc.). The method of the invention also allows the printing of continuous circuits over very long lengths (screen printing process or inkjet Roll to Roll). This method also allows the easy assembly of circuits between them by bonding and possibly bridging by means of a conductive adhesive and thus to realize large circuits.
Les pièces composites ainsi réalisées présentent une grande tolérance au pliage et aux déformations permettant de manipuler sans risques des surfaces assemblées de plusieurs dizaines de m2. La nature souple du support donne également une meilleure tolérance à la pose sur des surfaces non développables. L'invention résout également les problèmes de mise en place des circuits et de continuité des motifs aux raccords. The composite parts thus produced have a high tolerance to bending and deformations for safely handling assembled surfaces of several tens of m 2 . The supple nature of the support also gives a better tolerance to laying on non-developable surfaces. The invention also solves the problems of setting up the circuits and the continuity of the patterns at the connections.
La figure 4 montre une piste linéaire 15 imprimée sur une couche diélectrique intermédiaire préalablement déposée sur le voile poreux 1 6. L'encre diélectrique correspond, par exemple, à une résine thermoplastique ou thermodurcissable liquide pour l'impression ne contenant aucune charge conductrice. Pour des applications nécessitant une grande précision des motifs conducteurs, l'impression préalable d'une encre diélectrique 17 sur une surface légèrement supérieure à celle des motifs conducteurs permet d'améliorer la précision du dessin des motifs. FIG. 4 shows a linear track 15 printed on an intermediate dielectric layer previously deposited on the porous web 1 6. The dielectric ink corresponds, for example, to a liquid thermoplastic or thermosetting resin for printing containing no conductive filler. For applications requiring high precision conductive patterns, the prior printing of a dielectric ink 17 on a surface slightly greater than that of the conductive patterns can improve the accuracy of pattern design.

Claims

REVENDICATIONS
1 . Procédé de réalisation d'une paroi composite comportant un voile poreux (16) s'étendant dans l'épaisseur de ladite paroi composite, 1. Process for producing a composite wall comprising a porous web (16) extending in the thickness of said composite wall,
caractérisé en ce qu'il comporte une étape de dépôt d'une encre conductrice (15) sur ledit voile poreux (1 6) selon un maillage prédéterminé apte à conférer à ladite paroi composite des propriétés particulières de transparence électromagnétique, de filtrage électromagnétique et/ou de dégivrage.  characterized in that it comprises a step of depositing a conductive ink (15) on said porous web (1 6) according to a predetermined mesh capable of conferring on said composite wall particular properties of electromagnetic transparency, electromagnetic filtering and / or or defrost.
2. Procédé selon la revendication 1 , caractérisé en ce que l'étape de déposer l'encre conductrice (15) est effectuée par sérigraphie. 2. Method according to claim 1, characterized in that the step of depositing the conductive ink (15) is performed by screen printing.
3. Procédé selon la revendication 1 , caractérisé en ce que l'étape de déposer l'encre conductrice (15) est effectuée par jet d'encre. 3. Method according to claim 1, characterized in that the step of depositing the conductive ink (15) is performed by ink jet.
4. Procédé selon l'une des revendications 1 à 3, caractérisé en ce que l'étape de déposer l'encre conductrice (15) est réalisée en continu sur de très grandes longueurs. 4. Method according to one of claims 1 to 3, characterized in that the step of depositing the conductive ink (15) is carried out continuously over very long lengths.
5. Procédé selon l'une des revendications 1 à 4, caractérisé en ce qu'il comporte une étape consistant à déposer une encre diélectrique (17) sur ledit voile poreux (1 6) selon ledit maillage prédéterminé avant l'étape consistant à déposer ladite encre conductrice (15), une surface déposée de ladite encre diélectrique (17) étant supérieure à une surface déposée de ladite encre conductrice (15) de sorte que ladite encre conductrice (15) soit déposée sur ladite encre diélectrique (17). 5. Method according to one of claims 1 to 4, characterized in that it comprises a step of depositing a dielectric ink (17) on said porous web (1 6) according to said predetermined mesh before the step of depositing said conductive ink (15), a deposited surface of said dielectric ink (17) being greater than a deposited surface of said conductive ink (15) so that said conductive ink (15) is deposited on said dielectric ink (17).
6. Procédé selon l'une des revendications 1 à 5, caractérisé en ce que ledit voile poreux (1 6) est réalisé en fibres de polyester. 6. Method according to one of claims 1 to 5, characterized in that said porous web (1 6) is made of polyester fibers.
7. Paroi composite réalisée par un procédé de réalisation selon l'une des revendications 1 à 6. 7. Composite wall made by an embodiment method according to one of claims 1 to 6.
8. Paroi composite selon la revendication 7, caractérisée en ce que ledit voile poreux (1 6) et son circuit conducteur sont réalisés en plusieurs parties distinctes et que les parties sont assemblées entre elles par collage et pontage au moyen d'une colle conductrice. 8. composite wall according to claim 7, characterized in that said porous web (1 6) and its conductive circuit are made of several distinct parts and that the parts are assembled together by gluing and bridging by means of a conductive adhesive.
PCT/EP2015/064792 2014-07-03 2015-06-30 Method for producing a composite wall and associated composite wall WO2016001196A1 (en)

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