WO2016000405A1 - 一种厚度检测装置 - Google Patents

一种厚度检测装置 Download PDF

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Publication number
WO2016000405A1
WO2016000405A1 PCT/CN2014/093256 CN2014093256W WO2016000405A1 WO 2016000405 A1 WO2016000405 A1 WO 2016000405A1 CN 2014093256 W CN2014093256 W CN 2014093256W WO 2016000405 A1 WO2016000405 A1 WO 2016000405A1
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WO
WIPO (PCT)
Prior art keywords
transmitting
receiving
thickness
probe
circuit board
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Application number
PCT/CN2014/093256
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English (en)
French (fr)
Inventor
黎明
黄晓群
Original Assignee
广州广电运通金融电子股份有限公司
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Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=51503511&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=WO2016000405(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by 广州广电运通金融电子股份有限公司 filed Critical 广州广电运通金融电子股份有限公司
Priority to US15/319,939 priority Critical patent/US20170148246A1/en
Priority to EP14896726.8A priority patent/EP3163539B1/en
Priority to AU2014399427A priority patent/AU2014399427B2/en
Publication of WO2016000405A1 publication Critical patent/WO2016000405A1/zh

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    • G—PHYSICS
    • G07—CHECKING-DEVICES
    • G07D—HANDLING OF COINS OR VALUABLE PAPERS, e.g. TESTING, SORTING BY DENOMINATIONS, COUNTING, DISPENSING, CHANGING OR DEPOSITING
    • G07D7/00—Testing specially adapted to determine the identity or genuineness of valuable papers or for segregating those which are unacceptable, e.g. banknotes that are alien to a currency
    • G07D7/16—Testing the dimensions
    • G07D7/164—Thickness
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B17/00—Measuring arrangements characterised by the use of infrasonic, sonic or ultrasonic vibrations
    • G01B17/02—Measuring arrangements characterised by the use of infrasonic, sonic or ultrasonic vibrations for measuring thickness
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/04—Analysing solids
    • G01N29/041—Analysing solids on the surface of the material, e.g. using Lamb, Rayleigh or shear waves
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/44—Processing the detected response signal, e.g. electronic circuits specially adapted therefor
    • G01N29/4445—Classification of defects
    • G—PHYSICS
    • G07—CHECKING-DEVICES
    • G07D—HANDLING OF COINS OR VALUABLE PAPERS, e.g. TESTING, SORTING BY DENOMINATIONS, COUNTING, DISPENSING, CHANGING OR DEPOSITING
    • G07D5/00—Testing specially adapted to determine the identity or genuineness of coins, e.g. for segregating coins which are unacceptable or alien to a currency
    • G07D5/02—Testing the dimensions, e.g. thickness, diameter; Testing the deformation
    • G—PHYSICS
    • G07—CHECKING-DEVICES
    • G07D—HANDLING OF COINS OR VALUABLE PAPERS, e.g. TESTING, SORTING BY DENOMINATIONS, COUNTING, DISPENSING, CHANGING OR DEPOSITING
    • G07D7/00—Testing specially adapted to determine the identity or genuineness of valuable papers or for segregating those which are unacceptable, e.g. banknotes that are alien to a currency
    • G07D7/06—Testing specially adapted to determine the identity or genuineness of valuable papers or for segregating those which are unacceptable, e.g. banknotes that are alien to a currency using wave or particle radiation
    • G07D7/08—Acoustic waves
    • G—PHYSICS
    • G07—CHECKING-DEVICES
    • G07D—HANDLING OF COINS OR VALUABLE PAPERS, e.g. TESTING, SORTING BY DENOMINATIONS, COUNTING, DISPENSING, CHANGING OR DEPOSITING
    • G07D7/00—Testing specially adapted to determine the identity or genuineness of valuable papers or for segregating those which are unacceptable, e.g. banknotes that are alien to a currency
    • G07D7/16—Testing the dimensions
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/02—Indexing codes associated with the analysed material
    • G01N2291/023—Solids
    • G01N2291/0237—Thin materials, e.g. paper, membranes, thin films
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/02—Indexing codes associated with the analysed material
    • G01N2291/028—Material parameters
    • G01N2291/0289—Internal structure, e.g. defects, grain size, texture

Definitions

  • the present invention relates to the field of electronics, and in particular to a thickness detecting device.
  • the general method for detecting the thickness of a sheet medium is to splicing the thickness of the entire banknote by a signal detected by a plurality of independent thickness sensors arranged in a row, thereby identifying whether the banknote is abnormal.
  • the embodiment of the invention provides a thickness detecting device, which can prevent the abnormal features such as foreign matter and broken small holes from passing through the gap, so that the thickness detecting device does not have a detecting dead zone.
  • a thickness detecting device provided by an embodiment of the invention includes: a thickness sensor;
  • a plurality of thickness sensors are divided into two rows in front and rear in the advancing direction of the sheet-like medium, and the two rows are misaligned, and any point on the sheet-like medium passes through the sensing coverage of the thickness sensor in the advancing direction. .
  • the thickness detecting device further includes:
  • the transmitting circuit board is mounted in pair with the receiving circuit board, and a forward passage of the sheet-like medium is formed between the transmitting circuit board and the receiving circuit board;
  • the thickness sensor is mounted on the transmitting circuit board or the receiving circuit board.
  • the thickness sensor specifically includes: a transmitting probe and a receiving probe;
  • the transmitting probe is mounted on the transmitting circuit board, and the receiving probe is mounted on the receiving circuit board;
  • the receiving probes are installed in one-to-one correspondence with the transmitting probes.
  • the transmitting circuit board controls the transmitting probe to emit a detecting signal, and the detecting signal is received by the receiving probe after passing through the sheet medium, and the receiving circuit board acquires a new detecting signal.
  • the thickness detecting device further includes:
  • an analysis module configured to acquire the new detection signal from the receiving circuit board, and perform signal strength analysis on the new detection signal, so as to know the thickness of the sheet-type medium according to the relationship between signal intensity and thickness.
  • the transmitting probe is an ultrasonic transmitting probe
  • the receiving probe is an ultrasonic receiving probe.
  • N pairs of transmitting probes and receiving probes are divided into X groups, each group of Y, X times Y is equal to N;
  • the transmitting and receiving operations of the same group of the transmitting probe and the receiving probe are simultaneously performed;
  • the transmitting probe and the receiving probe of the X group are alternately operated in a preset grouping order.
  • the transmitting circuit board further includes:
  • Y driving circuits are correspondingly connected with Y transmitting probes of each group in the X group, for driving the transmitting probe to emit a detecting signal;
  • the first X-selecting switch is connected to the transmitting probe of the X group, and is configured to strobe a group of transmitting probes in the X group at the same time according to a preset grouping sequence.
  • the receiving circuit board further includes:
  • N preamplifier circuits are connected to the N receiving probes for performing preliminary amplification processing on the new detection signals received by the receiving probes;
  • a second X-select switch connected to the X preamplifier circuits and an amplification shaping circuit, for selecting a receiving probe belonging to the current sequential group from the X receiving probes according to a preset grouping sequence
  • Y amplification and shaping circuits are configured to perform amplification and shaping processing on the new detection signal sent by the second X-selection switch;
  • the AD converter is connected to the Y amplification shaping circuits, and is configured to perform analog-to-digital conversion on the new detection signals transmitted by the Y amplification shaping circuits, and then send the signals to the analysis module.
  • the analysis module is further configured to: if the signal strength of the new detection signal is not within a preset intensity interval, the sheet medium has an abnormal feature;
  • the abnormal feature is that there is tear, breakage, and sticking foreign matter on the sheet medium;
  • the analysis module is further configured to: if the average thickness of the sheet-like medium is not within a preset thickness interval, the sheet-type medium is unqualified.
  • a thickness detecting device includes: a plurality of thickness sensors are divided into two rows in front and rear in the advancing direction of the sheet medium, and the two rows are misaligned, and any point on the sheet medium is The inductive coverage of the thickness sensor in the forward direction.
  • the thickness sensor of the thickness detecting device is arranged in two rows and dislocated, so that any point on the sheet-like medium enters the sensing coverage of the thickness sensor in the forward direction, thereby avoiding The abnormal feature such as a foreign matter or a damaged small hole passes through the gap, so that the thickness detecting device does not have a detection dead zone.
  • FIG. 1 is a diagram showing an arrangement of sensing coverage ranges of a thickness sensor of a thickness detecting device according to an embodiment of the present invention
  • FIG. 2 is a schematic structural view of an embodiment of a thickness detecting device according to an embodiment of the present invention.
  • FIG. 3 is a schematic view showing an arrangement of a transmitting probe of a thickness detecting device according to an embodiment of the present invention
  • FIG. 4 is a schematic view showing a arrangement of receiving probes of a thickness detecting device according to an embodiment of the present invention
  • FIG. 5 is a schematic structural diagram of a transmitting circuit board of a thickness detecting device according to an embodiment of the present invention.
  • FIG. 6 is a schematic structural diagram of a receiving circuit board of a thickness detecting device according to an embodiment of the present invention.
  • Figure 7 is a schematic view of the sensing coverage of the tape through an ultrasonic probe
  • Figure 8 is an induced waveform of the ultrasonic probe in the case of Figure 7;
  • Figure 9 is a schematic view showing the sensing coverage of the tape through two ultrasonic probes
  • Figure 10 is an induced waveform of the ultrasonic probe in the case of Figure 9.
  • the embodiment of the invention provides a thickness detecting device for preventing the abnormal features such as foreign matter and broken small holes from passing through the gap, so that the thickness detecting device does not have a detecting dead zone.
  • an embodiment of a thickness detecting apparatus includes:
  • a plurality of thickness sensors are divided into front and rear rows in the advancing direction of the sheet-like medium, and the two rows are misaligned, and any point on the sheet-like medium passes through the sensing coverage of the thickness sensor in the advancing direction.
  • FIG. 1 is an arrangement diagram of the sensing coverage of a plurality of thickness sensors in the thickness detecting device, wherein 1101, 1102, 1103, 1104, 1111, and 1112 are sensing coverage areas of 12 thickness sensors.
  • 1101, 1102, 1103, 1104, 1111, and 1112 are divided into two rows in the forward and backward directions, and the rows are misaligned, and in the advancing direction, the sheet-like medium Any point will pass through the sensing coverage.
  • the sensing coverages 1101, 1102, 1103, 1104, 1111, and 1112 are only 12 of the thickness sensors of the thickness detecting device in this embodiment.
  • FIG. 1 is a distribution mode, and a plurality of distribution modes may be used, and the thickness detecting device may have more than 12 thickness sensors or less than 12 thicknesses, and may be set according to actual needs. No specific limitation.
  • a thickness detecting device includes: a plurality of thickness sensors are divided into two rows in front and rear in the advancing direction of the sheet-like medium, and the two rows are misaligned, and any point on the sheet-like medium is in the advancing direction. Inductive coverage over the thickness sensor.
  • the thickness sensor of the thickness detecting device is arranged in two rows and misaligned, so that any point on the sheet-like medium enters the sensing coverage of the thickness sensor in the forward direction, thereby avoiding foreign matter.
  • the abnormal feature such as the damaged small hole passes through the gap, so that the thickness detecting device does not have the detecting dead zone.
  • FIG. 2 another embodiment of a thickness detecting device according to an embodiment of the present invention includes:
  • a plurality of thickness sensors are divided into front and rear rows in the advancing direction of the sheet-like medium, and the two rows are misaligned, and any point on the sheet-like medium passes through the sensing coverage of the thickness sensor in the advancing direction.
  • the transmitting circuit board 2001 is paired with the receiving circuit board 2002, and the forward path of the sheet-like medium is formed between the transmitting circuit board 2001 and the receiving circuit board 2002;
  • the thickness sensor is mounted on the transmitting circuit board 2001 or the receiving circuit board 2002.
  • the thickness sensor in this embodiment may specifically include: a transmitting probe 2003 and a receiving probe 2004;
  • the transmitting probe 2003 is mounted on the transmitting circuit board 2001, and the receiving probe 2004 is mounted on the receiving circuit board 2002;
  • the receiving probes 2004 are installed in one-to-one correspondence with the transmitting probes 2003.
  • the transmitting circuit board 2001 controls the transmitting probe 2003 to emit a detecting signal, and the detecting signal is received by the receiving probe 2004 after passing through the sheet medium, and the receiving circuit board 2002 acquires a new detecting signal. Since the detection signal passes through the sheet medium, the detection signal Some characteristics of the number change (such as signal strength), so the receiving probe 2004 receives the changed detection signal, that is, the new detection signal.
  • the analysis module 2005 is configured to obtain the new detection signal from the receiving circuit board 2002, and perform signal strength analysis on the new detection signal, so as to know the thickness of the sheet-like medium according to the relationship between the signal intensity and the thickness.
  • the transmitting probe 2003 is an ultrasonic transmitting probe
  • the receiving probe 2004 is an ultrasonic receiving probe.
  • the N-pair transmitting probe 2003 and the receiving probe 2004 may be divided into X groups, each group Y, that is, X times Y is equal to N; the same group of the transmitting probe 2003 and the receiving probe 2004 The transmitting and receiving operations are performed synchronously; the transmitting probe 2003 and the receiving probe 2004 of the X group are alternately operated in a preset grouping order.
  • an example will be specifically described on how to group and how to work in turn in a grouping order.
  • the transmitting circuit board 2001 may further include:
  • the Y driving circuits 2006 are connected to the Y transmitting probes 2003 of each group in the X group for driving the transmitting probes 2003 to transmit the detecting signals;
  • the first X-select switch 2007 is connected to the X-group transmit probe 2003 for strobing a set of transmit probes 2003 in the X-group at the same time according to a preset grouping sequence. It can be understood that the first X-selecting switch 2007 selects the X-group transmitting probes 2003 in units of groups, so the Y transmitting probes 2003 selected each time belong to the same group.
  • the receiving circuit board 2002 in this embodiment may further include:
  • N preamplifier circuits 2008 are connected to the N receiving probes 2004 for performing a preliminary amplification process on the new probe signals received by the receiving probes 2004;
  • the second X-select switch 2009 is connected to the X preamplifier circuits 2008 and an amplification shaping circuit 2010 for selecting one receiving probe belonging to the current sequential group from the X receiving probes 2004 according to a preset grouping order. 2004;
  • Y amplification shaping circuits 2010 for performing amplification and shaping processing on the new detection signal sent by the second X selection switch 2009;
  • AD converter digital to analog converter 2011
  • Y amplification shaping circuits 2010 The new probe signal transmitted by the Y amplification shaping circuits 2010 is subjected to analog-to-digital conversion and then sent to the analysis module 2005.
  • the analysis module 2005 is further configured to: if the signal strength of the new detection signal is not within a preset intensity interval, the sheet medium has an abnormal feature; the abnormal feature is a tear on the sheet medium. Damage, sticking to foreign objects.
  • the analysis module 2005 is further configured to: if the average thickness of the sheet-like medium is not within a predetermined thickness interval, the sheet-type medium is unqualified.
  • the average thickness can be used as a standard for measuring the general thickness of the sheet medium. If the average thickness of the sheet medium does not meet the preset requirement, that is, it is not within the preset thickness interval, the sheet can be considered as the sheet.
  • the media is unqualified and is not the medium that is expected. For example, when the ATM machine detects banknotes, if the average thickness of the banknotes is not within the preset thickness interval, it can be considered that the banknotes are substantially different in thickness from the normal banknotes, so the banknotes can be regarded as counterfeit coins.
  • the transmitting probe is divided into two rows, 15 in each row, as shown in FIG.
  • These transmitter probes are grouped into 6 groups of 5 each, and the grouping is as follows:
  • the first set of transmitting probes are: 101, 102, 103, 104, 105;
  • the second group of transmitting probes are: 201, 202, 203, 204, 205;
  • the third group of transmitting probes are: 301, 302, 303, 304, 305;
  • the fourth group of transmitting probes are: 401, 402, 403, 404, 405;
  • the fifth group of transmitting probes are: 501, 502, 503, 504, 505;
  • the sixth group of transmitting probes are: 601, 602, 603, 604, 605.
  • the transmitting probe is paired with the receiving probe
  • the receiving probe is also divided into two rows, 15 in each row, as shown in FIG.
  • These receiving probes are grouped into 6 groups of 5 each, and the grouping is as follows:
  • the first set of receiving probes are: 111, 112, 113, 114, 115;
  • the second group of receiving probes are: 211, 212, 213, 214, 215;
  • the third group of receiving probes are: 311, 312, 313, 314, 315;
  • the fourth group of receiving probes are: 411, 412, 413, 414, 415;
  • the fifth group receiving probes are: 511, 512, 513, 514, 515;
  • the sixth set of receiving probes are: 611, 612, 613, 614, 615.
  • transmitting probes and receiving probes are strictly one-to-one correspondence.
  • the first group of transmitting probes work simultaneously with the first group of receiving probes
  • the second group of transmitting probes and the second group of receiving probes work simultaneously
  • the third group of transmitting probes Working simultaneously with the third group of receiving probes
  • the fourth group of transmitting probes working simultaneously with the fourth group of receiving probes
  • the fifth group of transmitting probes working simultaneously with the fifth group of receiving probes
  • sixth group of transmitting probes working simultaneously with the sixth group of receiving probes .
  • 101 corresponds to 111
  • 102 corresponds to 112
  • 103 corresponds to 113, and so on.
  • the transmitting probe and the receiving probe do not need to work at all times.
  • the ultrasonic probe (including the transmitting probe and the receiving probe) is a small area detecting characteristic, if the detecting object (such as a banknote) There is a broken hole on the top, the movement speed of the banknote is 1600mm/S, and the sensing coverage of the single ultrasonic probe is 8mm. It takes 5ms from the inductive coverage of the ultrasonic probe to the ultrasonic coverage of the ultrasonic probe. Within 5ms, the ultrasonic probe can detect the broken hole only once, without having to keep the ultrasonic probe working.
  • the ultrasonic probe 1.2ms In order to improve the resolution and multiple detections, it can be designed by taking the ultrasonic probe 1.2ms as an example. At present, a pair of ordinary ultrasonic probes complete a test less than 200 microseconds. When a group of ultrasonic probes work at the same time, after completing one test, the transmitting probe stops transmitting ultrasonic waves and switches to another set of ultrasonic probes to work, within 1.2 milliseconds. It is possible to switch 6 sets of ultrasonic probes for time-division transmission and reception. Therefore, the transmitting probe and the receiving probe are processed by time-division transmission and reception, which can meet the detection requirements of the thickness detecting device and save hardware costs.
  • the grouping order may be set as: a first group (including a first group of transmitting probes and a first group of receiving probes), a second group, a third group, a fourth group, a fifth group, and a sixth group When the sixth group ends, switch back to the first group and cycle.
  • each set of gating time (including channel switching, data acquisition) is about 200 microseconds, and a complete double-row sampling is completed for 1.2 milliseconds.
  • each group of transmitting probes and receiving probes are not adjacent, greatly reducing the problem of adjacent interference.
  • five driving circuits are provided on the transmitting circuit board, which are 701, 702, 703, 704, and 705, respectively.
  • 701 drives the transmitting probes 101, 201, 301, 401, 501, 601
  • the 702 drive transmit probes 102, 202, 302, 402, 502, 602, 703 drive the transmit probes 103, 203, 303, 403, 503, 603, 704 to drive the transmit probes 104, 204, 304, 404, 504, 604, 705 drive
  • the probes 105, 205, 305, 405, 505, 605 are emitted.
  • a 6-select electronic switch 801 is also provided on the transmitting circuit board, and the 6 sets of transmitting probes are wheeled in the order of grouping. Since only six groups of the six sets of transmitting probes are working at the same time, the five driving circuits can satisfy the driving operation of the six sets of transmitting probes, and when one of the six electronic switches is selected, the driving circuit will transmit to which group. The probe is driven.
  • preamplifier circuits 900 are provided on the receiving circuit board, and are respectively connected to 30 receiving probes.
  • 711 selects receiving probes 111, 211, 311, 411, 511, 611, 712 to select receiving probes 112, 212, 312, 412, 512, 612, 713 to select receiving probes 113, 213, 313, 413, 513, 613, 714 selects receive probes 114, 214, 314, 414, 514, 614, 715 to select receive probes 115, 215, 315, 415, 515, 615.
  • the five 6-select electronic switches are synchronized with the 6-select electronic switch 801 on the transmitting circuit board, that is, when 801 selects the first group of transmitting probes (101, 102, 103, 104, 105), 711 selects to receive.
  • the probes 111, 712 select the receiving probe 112, 713 selects the receiving probe 113, 714 selects the receiving probe 114, 715 selects the receiving probe 115, and at this time, 111, 112, 113, 114, 115 can be found as the first group of receiving probes, thus realizing
  • the first set of transmit probes and the first set of receive probes operate simultaneously, so that the transmit probe and the receive probe are strictly synchronized.
  • 801 selects the second, third, fourth, and fifth sets of transmitting probes, the situation is similar and will not be described again.
  • five amplification shaping circuits 811 are provided on the receiving circuit board, and an AD converter 911 is provided.
  • the five amplification shaping circuits are respectively connected to five 6-select electronic switches.
  • the tape When the banknote enters the thickness detecting device and the tape is narrow, the tape may be detected in two cases.
  • Case 1 The tape only passes through the sensing coverage of an ultrasonic probe, as shown in Figure 7. At this time, the induced waveforms of the ultrasonic probes 1, 2, 3, and 4 in Fig. 7 are as shown in Fig. 8, respectively. As can be seen from Fig. 8, the ultrasonic probe 2 passes through the tape, so the signal intensity is clear at a certain time.
  • the display module can analyze that the thickness of the banknote is abnormal, and the thickness detecting device can alarm and discharge the banknote.
  • Case 2 The tape passes through the sensing coverage of two ultrasonic probes, as shown in Figure 9. At this time, the induced waveforms of the ultrasonic probes 1, 2, 3, and 4 in Fig. 9 are as shown in Fig. 10, respectively. As can be seen from FIG. 10, since the ultrasonic probes 2 and 3 pass through the tape, the signal intensity is significantly reduced for a certain period of time, so the analysis module can analyze that the thickness of the banknote is abnormal, and the thickness detecting device can alarm and discharge the banknote. .
  • the disclosed system, apparatus, and method may be implemented in other manners.
  • the device embodiments described above are merely illustrative.
  • the division of the unit is only a logical function division.
  • there may be another division manner for example, multiple units or components may be combined or Can be integrated into another system, or some features can be ignored or not executed.
  • the mutual coupling or direct coupling or communication connection shown or discussed may be an indirect coupling or communication connection through some interface, device or unit, and may be in an electrical, mechanical or other form.
  • the units described as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, that is, may be located in one place, or may be distributed to multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of the embodiment.
  • each functional unit in each embodiment of the present invention may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit.
  • the above integrated unit can be implemented in the form of hardware or in the form of a software functional unit.
  • the integrated unit if implemented in the form of a software functional unit and sold or used as a standalone product, may be stored in a computer readable storage medium.
  • the technical solution of the present invention which is essential or contributes to the prior art, or all or part of the technical solution, may be embodied in the form of a software product stored in a storage medium. , including a number of instructions to make a computer device (can be an individual) A computer, server, or network device, etc.) performs all or part of the steps of the methods described in various embodiments of the present invention.
  • the foregoing storage medium includes: a U disk, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk, or an optical disk, and the like. .

Abstract

一种厚度检测装置，用于避免异物、破损小孔等异常特征从间隙中通过的情况，使得厚度检测装置不存在检测盲区。该厚度检测装置包括：在薄片类介质的前进方向上分为前后两排的若干厚度传感器（1101，1102、1103……1111、1112），两排厚度传感器（1101，1102、1103……1111、1112）之间错位分布，使得薄片类介质上的任意一点在前进方向上经过厚度传感器（1101，1102、1103……1111、1112）的感应覆盖范围。

Description

一种厚度检测装置
本申请要求于2014年06月30日提交中国专利局、申请号为201410309886.8、发明名称为“一种厚度检测装置”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本发明涉及电子领域，尤其涉及一种厚度检测装置。
背景技术
随着人们生活的多样化，薄片类介质的厚度检测也渐渐开始被应用起来，同时应用领域也越来越广。比如商业领域的ATM机或纸币清分机，就需要对纸币进行厚度检测，从而识别纸币是否存在破损、黏贴异物、撕裂等异常，还可以通过感知纸币的厚度来作为辨别真伪的标准之一。
目前，薄片类介质厚度检测的一般做法是：通过排成一排的多路独立的厚度传感器检测出来的信号，拼接成整张钞票的厚度特征，从而识别钞票是否有异常。
然而，通过排成一排的厚度传感器来测量，由于厚度传感器之间靠太近会有相互干扰，所以每个厚度传感器之间要保留一定的间隙，如果异物、破损小孔等异常特征从间隙中通过，这些厚度传感器无法检测出异常，从而造成检测盲区。
发明内容
本发明实施例提供了一种厚度检测装置，能够避免异物、破损小孔等异常特征从间隙中通过的情况，使得该厚度检测装置不存在检测盲区。
本发明实施例提供的一种厚度检测装置，包括：厚度传感器；
若干厚度传感器在薄片类介质的前进方向上分为前后两排，两排之间错位分布，并使得所述薄片类介质上的任意一点在所述前进方向上经过所述厚度传感器的感应覆盖范围。
可选地，所述厚度检测装置还包括：
发射电路板和接收电路板；
所述发射电路板与所述接收电路板配对安装，所述发射电路板与所述接收电路板之间形成所述薄片类介质的前进通道；
所述厚度传感器安装于所述发射电路板或所述接收电路板上。
可选地，所述厚度传感器具体包括：发射探头和接收探头；
所述发射探头安装于所述发射电路板上，所述接收探头安装于所述接收电路板上；
所述接收探头与所述发射探头一一对应安装。
可选地，
所述发射电路板控制所述发射探头发射出探测信号，所述探测信号穿过所述薄片类介质后被接收探头所接收，所述接收电路板获取到新探测信号。
可选地，所述厚度检测装置还包括：
分析模块，用于获取到来自所述接收电路板的所述新探测信号，并对所述新探测信号进行信号强度分析，从而根据信号强度与厚度的关系得知所述薄片类介质的厚度。
可选地，
所述发射探头为超声波发射探头；
所述接收探头为超声波接收探头。
可选地，
将N对发射探头和接收探头分为X组，每组Y个，X乘以Y等于N；
同一组的所述发射探头和接收探头同步执行发射与接收操作；
X组的所述发射探头和接收探头按预设的分组顺序轮流工作。
可选地，所述发射电路板还包括：
Y个驱动电路，与X组中每组的Y个发射探头对应连接，用于驱动所述发射探头发射探测信号；
第一X选一开关，与X组的发射探头对应连接，用于根据预设的分组顺序在同一时间选通X组中的一组发射探头。
可选地，所述接收电路板还包括：
N个前置放大电路，与N个所述接收探头对应连接，用于将所述接收探头接收回来的新探测信号进行初步放大处理；
第二X选一开关，与X个前置放大电路和一个放大整形电路连接，用于根据预设的分组顺序从X个所述接收探头中选出属于当前顺序分组的一个接收探头；
存在Y个所述第二X选一开关；
Y个所述放大整形电路，用于将所述第二X选一开关发送来的新探测信号进行放大整形处理；
AD转换器，与Y个所述放大整形电路连接，用于将Y个放大整形电路传送过来的新探测信号进行模数转换后发送给所述分析模块。
可选地，
所述分析模块还用于若所述新探测信号的信号强度不在预设的强度区间内时，则所述薄片类介质存在异常特征；
所述异常特征为薄片类介质上存在撕裂、破损、黏贴异物；
或，
所述分析模块还用于若所述薄片类介质的平均厚度不在预设的厚度区间内时，则所述薄片类介质不合格。
从以上技术方案可以看出，本发明实施例具有以下优点：
本发明实施例中，一种厚度检测装置，包括：若干厚度传感器在薄片类介质的前进方向上分为前后两排，两排之间错位分布，并使得所述薄片类介质上的任意一点在所述前进方向上经过所述厚度传感器的感应覆盖范围。在本发明实施例中，该厚度检测装置的厚度传感器通过排成两排并错位分布的方式，使得薄片类介质上的任意一点在前进方向上都会进入该厚度传感器的感应覆盖范围，从而避免了异物、破损小孔等异常特征从间隙中通过的情况，使得该厚度检测装置不存在检测盲区。
附图说明
图1为本发明实施例中一种厚度检测装置的厚度感应器的感应覆盖范围排列分布图；
图2为本发明实施例中一种厚度检测装置一个实施例的结构示意图；
图3为本发明实施例中一种厚度检测装置的发射探头排列示意图；
图4为本发明实施例中一种厚度检测装置的接收探头排列示意图；
图5为本发明实施例中一种厚度检测装置的发射电路板结构示意图；
图6为本发明实施例中一种厚度检测装置的接收电路板结构示意图；
图7为胶带经过一个超声波探头的感应覆盖范围的示意图；
图8为图7情况下超声波探头的感应波形；
图9为胶带经过两个超声波探头的感应覆盖范围的示意图；
图10为图9情况下超声波探头的感应波形。
具体实施方式
本发明实施例提供了一种厚度检测装置，用于避免异物、破损小孔等异常特征从间隙中通过的情况，使得该厚度检测装置不存在检测盲区。
为使得本发明的发明目的、特征、优点能够更加的明显和易懂，下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，下面所描述的实施例仅仅是本发明一部分实施例，而非全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其它实施例，都属于本发明保护的范围。请参阅图1，本发明实施例中一种厚度检测装置一个实施例包括：
厚度传感器；
若干厚度传感器在薄片类介质的前进方向上分为前后两排，两排之间错位分布，并使得该薄片类介质上的任意一点在该前进方向上经过该厚度传感器的感应覆盖范围。
可以理解的是，这些厚度传感器两两之间的需要留有空隙，一般不可以靠得太近，以免厚度传感器之间产生干扰。而厚度传感器的感应覆盖范围可以与其感应探头的大小一致，也可以是感应覆盖范围比感应探头的稍大。因此，图1为该厚度检测装置中若干厚度传感器的感应覆盖范围的排列分布图，其中1101、1102、1103、1104……1111、1112为其中12个厚度传感器的感应覆盖范围。从图1可以看出，1101、1102、1103、1104......1111、1112在前进方向上分为前后两排，两排之间错位分布，并且在前进的方向上，薄片类介质的任意一点均会经过感应覆盖范围。
需要说明的是，感应覆盖范围1101、1102、1103、1104......1111、1112仅为本实施例中该厚度检测装置的厚度传感器的其中12个感应覆盖范围， 图1为其中一种分布方式，具体可以有多种分布方式，并且，该厚度检测装置的厚度传感器可以多于12个，也可以少于12个，具体可以根据实际需要进行设定，此处不作具体限定。
本实施例中，一种厚度检测装置包括：若干厚度传感器在薄片类介质的前进方向上分为前后两排，两排之间错位分布，并使得该薄片类介质上的任意一点在该前进方向上经过该厚度传感器的感应覆盖范围。在本实施例中，该厚度检测装置的厚度传感器通过排成两排并错位分布的方式，使得薄片类介质上的任意一点在前进方向上都会进入该厚度传感器的感应覆盖范围，从而避免了异物、破损小孔等异常特征从间隙中通过的情况，使得该厚度检测装置不存在检测盲区。
为便于理解，下面对本发明实施例中的一种厚度检测装置进行详细描述，请参阅图2，本发明实施例中一种厚度检测装置另一个实施例包括：
若干厚度传感器在薄片类介质的前进方向上分为前后两排，两排之间错位分布，并使得该薄片类介质上的任意一点在该前进方向上经过该厚度传感器的感应覆盖范围。
本实施例中该厚度检测装置还可以包括：
发射电路板2001和接收电路板2002；
该发射电路板2001与该接收电路板2002配对安装，该发射电路板2001与该接收电路板2002之间形成该薄片类介质的前进通道；
该厚度传感器安装于该发射电路板2001或该接收电路板2002上。
本实施例中该厚度传感器可以具体包括：发射探头2003和接收探头2004；
该发射探头2003安装于该发射电路板2001上，该接收探头2004安装于该接收电路板2002上；
该接收探头2004与该发射探头2003一一对应安装。
可以理解的是，当该薄片类介质从前进通道中经过时，会被发射探头2003配合接收探头2004感知到。
需要说明的是，该发射电路板2001控制该发射探头2003发射出探测信号，该探测信号穿过该薄片类介质后被接收探头2004所接收，该接收电路板2002获取到新探测信号。由于探测信号穿过了该薄片类介质，探测信 号的某些特性会发生变化(如信号强度)，因此接收探头2004接收到变化后的探测信号，即新探测信号。
本实施例中该厚度检测装置还可以包括：
分析模块2005，用于获取到来自该接收电路板2002的该新探测信号，并对该新探测信号进行信号强度分析，从而根据信号强度与厚度的关系得知该薄片类介质的厚度。
优选地，该发射探头2003为超声波发射探头；该接收探头2004为超声波接收探头。
需要说明的是，本实施例中，可以将N对发射探头2003和接收探头2004分为X组，每组Y个，即X乘以Y等于N；同一组的该发射探头2003和接收探头2004同步执行发射与接收操作；X组的该发射探头2003和接收探头2004按预设的分组顺序轮流工作。在下一实施中，将举例具体说明如何分组以及如何按照分组顺序轮流工作的。
在本实施中该发射电路板2001还可以包括：
Y个驱动电路2006，与X组中每组的Y个发射探头2003对应连接，用于驱动该发射探头2003发射探测信号；
第一X选一开关2007，与X组的发射探头2003对应连接，用于根据预设的分组顺序在同一时间选通X组中的一组发射探头2003。可以理解的是，第一X选一开关2007是以组为单位对X组发射探头2003进行选取的，因此每次选取出来的Y个发射探头2003均属于同一组。
本实施例中该接收电路板2002还可以包括：
N个前置放大电路2008，与N个该接收探头2004对应连接，用于将该接收探头2004接收回来的新探测信号进行初步放大处理；
第二X选一开关2009，与X个前置放大电路2008和一个放大整形电路2010连接，用于根据预设的分组顺序从X个该接收探头2004中选出属于当前顺序分组的一个接收探头2004；
存在Y个该第二X选一开关2009；
Y个该放大整形电路2010，用于将该第二X选一开关2009发送来的新探测信号进行放大整形处理；
AD转换器(数模转换器)2011，与Y个该放大整形电路2010连接， 用于将Y个放大整形电路2010传送过来的新探测信号进行模数转换后发送给该分析模块2005。
在本实施例中，该分析模块2005还用于若该新探测信号的信号强度不在预设的强度区间内时，则该薄片类介质存在异常特征；该异常特征为薄片类介质上存在撕裂、破损、黏贴异物。
或，该分析模块2005还用于若该薄片类介质的平均厚度不在预设的厚度区间内时，则该薄片类介质不合格。可以理解的是，平均厚度可以作为衡量该薄片类介质的大体厚度的标准，若该薄片类介质的平均厚度不符合预设的要求，即不在预设的厚度区间内，则可以认为该薄片类介质不合格，不是预想中需要的介质。例如，在ATM机检测纸币时，若纸币的平均厚度不在预设的厚度区间内，可以认为该纸币的大体厚度均与正常纸币的不同，所以该纸币可以被认为是假币。
为便于理解，根据图2所描述的实施例，下面以一个实际应用场景对本发明实施例中的一种厚度检测装置进行描述：
假设，共设置30对发射探头和接收探头，则发射探头有30个，接收探头也有30个。
其中，将发射探头分成两排，每排15个，如图3所示。并对这些发射探头进行分组，分为6组，每组5个，分组情况如下：
第一组发射探头为：101、102、103、104、105；
第二组发射探头为：201、202、203、204、205；
第三组发射探头为：301、302、303、304、305；
第四组发射探头为：401、402、403、404、405；
第五组发射探头为：501、502、503、504、505；
第六组发射探头为：601、602、603、604、605。
同样的，由于发射探头与接收探头配对安装，因此也将接收探头分成两排，每排15个，如图4所示。并对这些接收探头进行分组，分为6组，每组5个，分组情况如下：
第一组接收探头为：111、112、113、114、115；
第二组接收探头为：211、212、213、214、215；
第三组接收探头为：311、312、313、314、315；
第四组接收探头为：411、412、413、414、415；
第五组接收探头为：511、512、513、514、515；
第六组接收探头为：611、612、613、614、615。
这些发射探头和接收探头是严格一一对应的，在工作时，第一组发射探头与第一组接收探头同时工作，第二组发射探头与第二组接收探头同时工作，第三组发射探头与第三组接收探头同时工作，第四组发射探头与第四组接收探头同时工作，第五组发射探头与第五组接收探头同时工作，第六组发射探头与第六组接收探头同时工作。其中，101对应111、102对应112、103对应113......如此类推。
在厚度检测装置整个工作过程中，发射探头和接收探头是不需时刻工作着的，举例来说，由于超声波探头(包括发射探头和接收探头)是小区域检测的特性，假如检测对象(如钞票)上面有一个破孔，钞票的运动速度为1600mm/S,单个超声波探头的感应覆盖范围为8mm，从破孔进入超声波探头的感应覆盖范围到离开超声波探头的感应覆盖范围需要5ms，也就是说5ms内超声波探头只需工作一次即可检测到破孔，而不必让超声波探头一直处于工作状态。为了提高分辨率及多次检测进行判断，可以以超声波探头1.2ms检测一次为例进行设计。目前，一对普通的超声波探头完成一次检测少于200微秒，当一组超声波探头同时工作，在完成一次检测后，发射探头停止发射超声波，切换到另一组超声波探头进行工作，1.2毫秒内可以实现切换6组超声波探头进行分时发射接收工作。因此，将发射探头和接收探头进行分时发射接收来处理，既可以满足厚度检测装置的检测需求，也可以节省硬件成本。
本实施例中，可以将分组顺序设定为：第一组(包括第一组发射探头和第一组接收探头)、第二组、第三组、第四组、第五组、第六组，当第六组结束后又切换回第一组，如此循环。对于超声波探头来说，每组选通时间(包括通道切换、数据采集)大概为200微秒，完成一次完整双排采样共1.2毫秒。并且，每一组的发射探头和接收探头都没有相邻的情况，大大减小相邻干扰的问题。
如图5所示，发射电路板上设置有5个驱动电路，分别为701、702、703、704、705。其中，701驱动发射探头101、201、301、401、501、601， 702驱动发射探头102、202、302、402、502、602，703驱动发射探头103、203、303、403、503、603，704驱动发射探头104、204、304、404、504、604，705驱动发射探头105、205、305、405、505、605。
发射电路板上还设置了6选一电子开关801，对6组发射探头按分组顺序进行轮选。由于6组发射探头同一时间只有一组在工作，因此5个驱动电路可以满足6组发射探头的驱动工作，在6选一电子开关选择到哪一组时，驱动电路便对哪一组的发射探头进行驱动。
如图6所示，接收电路板上设置有30个前置放大电路900，分别与30个接收探头连接。接收电路板上还设置有5个6选一电子开关，分别为711、712、713、714、715。其中，711选择接收探头111、211、311、411、511、611，712选择接收探头112、212、312、412、512、612，713选择接收探头113、213、313、413、513、613，714选择接收探头114、214、314、414、514、614，715选择接收探头115、215、315、415、515、615。这5个6选一电子开关与发射电路板上的6选一电子开关801是同步运行的，即当801选择第一组发射探头时(101、102、103、104、105)，711选择接收探头111，712选择接收探头112，713选择接收探头113，714选择接收探头114，715选择接收探头115，此时可以发现111、112、113、114、115为第一组接收探头，因此实现了第一组发射探头和第一组接收探头同时工作，使得发射探头和接收探头严格同步。当801选择第二、三、四、五组发射探头时，情况类似，不再赘述。
如图6所示，接收电路板上还设置有5个放大整形电路811，和设置有一个AD转换器911。这5个放大整形电路分别与5个6选一电子开关相连。
下面以一张贴有胶带的钞票进入该厚度检测装置的应用场景进行描述：
当钞票进入该厚度检测装置时，胶带较窄的情况下，胶带存在两种情况会被检测出来。
情况一：胶带只经过一个超声波探头的感应覆盖范围，如图7所示。此时，图7中超声波探头1、2、3、4的感应波形分别如图8所示。从图8可以知道，超声波探头2由于有胶带经过，因此信号强度在某段时间上明 显降低，因此分析模块可以分析出该钞票的厚度存在异常，厚度检测装置可以报警，并将钞票吐出。
情况二：胶带经过了两个超声波探头的感应覆盖范围，如图9所示。此时，图9中超声波探头1、2、3、4的感应波形分别如图10所示。从图10可以知道，超声波探头2、3由于有胶带经过，因此信号强度在某段时间上明显降低，因此分析模块可以分析出该钞票的厚度存在异常，厚度检测装置可以报警，并将钞票吐出。
所属领域的技术人员可以清楚地了解到，为描述的方便和简洁，上述描述的系统，装置和单元的具体工作过程，可以参考前述方法实施例中的对应过程，在此不再赘述。
在本申请所提供的几个实施例中，应该理解到，所揭露的系统，装置和方法，可以通过其它的方式实现。例如，以上所描述的装置实施例仅仅是示意性的，例如，所述单元的划分，仅仅为一种逻辑功能划分，实际实现时可以有另外的划分方式，例如多个单元或组件可以结合或者可以集成到另一个系统，或一些特征可以忽略，或不执行。另一点，所显示或讨论的相互之间的耦合或直接耦合或通信连接可以是通过一些接口，装置或单元的间接耦合或通信连接，可以是电性，机械或其它的形式。
所述作为分离部件说明的单元可以是或者也可以不是物理上分开的，作为单元显示的部件可以是或者也可以不是物理单元，即可以位于一个地方，或者也可以分布到多个网络单元上。可以根据实际的需要选择其中的部分或者全部单元来实现本实施例方案的目的。
另外，在本发明各个实施例中的各功能单元可以集成在一个处理单元中，也可以是各个单元单独物理存在，也可以两个或两个以上单元集成在一个单元中。上述集成的单元既可以采用硬件的形式实现，也可以采用软件功能单元的形式实现。
所述集成的单元如果以软件功能单元的形式实现并作为独立的产品销售或使用时，可以存储在一个计算机可读取存储介质中。基于这样的理解，本发明的技术方案本质上或者说对现有技术做出贡献的部分或者该技术方案的全部或部分可以以软件产品的形式体现出来，该计算机软件产品存储在一个存储介质中，包括若干指令用以使得一台计算机设备(可以是个人 计算机，服务器，或者网络设备等)执行本发明各个实施例所述方法的全部或部分步骤。而前述的存储介质包括：U盘、移动硬盘、只读存储器(ROM，Read-Only Memory)、随机存取存储器(RAM，Random Access Memory)、磁碟或者光盘等各种可以存储程序代码的介质。
以上所述，以上实施例仅用以说明本发明的技术方案，而非对其限制；尽管参照前述实施例对本发明进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本发明各实施例技术方案的精神和范围。

Claims (10)

  1. 一种厚度检测装置，其特征在于，包括：厚度传感器；
    若干厚度传感器在薄片类介质的前进方向上分为前后两排，两排之间错位分布，并使得所述薄片类介质上的任意一点在所述前进方向上经过所述厚度传感器的感应覆盖范围。
  2. 根据权利要求1所述的厚度检测装置，其特征在于，所述厚度检测装置还包括：
    发射电路板和接收电路板；
    所述发射电路板与所述接收电路板配对安装，所述发射电路板与所述接收电路板之间形成所述薄片类介质的前进通道；
    所述厚度传感器安装于所述发射电路板或所述接收电路板上。
  3. 根据权利要求2所述的厚度检测装置，其特征在于，所述厚度传感器具体包括：发射探头和接收探头；
    所述发射探头安装于所述发射电路板上，所述接收探头安装于所述接收电路板上；
    所述接收探头与所述发射探头一一对应安装。
  4. 根据权利要求3所述的厚度检测装置，其特征在于，
    所述发射电路板控制所述发射探头发射出探测信号，所述探测信号穿过所述薄片类介质后被接收探头所接收，所述接收电路板获取到新探测信号。
  5. 根据权利要求4所述的厚度检测装置，其特征在于，所述厚度检测装置还包括：
    分析模块，用于获取到来自所述接收电路板的所述新探测信号，并对所述新探测信号进行信号强度分析，从而根据信号强度与厚度的关系得知所述薄片类介质的厚度。
  6. 根据权利要求3所述的厚度检测装置，其特征在于，
    所述发射探头为超声波发射探头；
    所述接收探头为超声波接收探头。
  7. 根据权利要求5所述的厚度检测装置，其特征在于，
    将N对发射探头和接收探头分为X组，每组Y个，X乘以Y等于N；
    同一组的所述发射探头和接收探头同步执行发射与接收操作；
    X组的所述发射探头和接收探头按预设的分组顺序轮流工作。
  8. 根据权利要求7所述的厚度检测装置，其特征在于，所述发射电路板还包括：
    Y个驱动电路，与X组中每组的Y个发射探头对应连接，用于驱动所述发射探头发射探测信号；
    第一X选一开关，与X组的发射探头对应连接，用于根据预设的分组顺序在同一时间选通X组中的一组发射探头。
  9. 根据权利要求8所述的厚度检测装置，其特征在于，所述接收电路板还包括：
    N个前置放大电路，与N个所述接收探头对应连接，用于将所述接收探头接收回来的新探测信号进行初步放大处理；
    第二X选一开关，与X个前置放大电路和一个放大整形电路连接，用于根据预设的分组顺序从X个所述接收探头中选出属于当前顺序分组的一个接收探头；
    存在Y个所述第二X选一开关；
    Y个所述放大整形电路，用于将所述第二X选一开关发送来的新探测信号进行放大整形处理；
    AD转换器，与Y个所述放大整形电路连接，用于将Y个放大整形电路传送过来的新探测信号进行模数转换后发送给所述分析模块。
  10. 根据权利要求5、7、8或9所述的厚度检测装置，其特征在于，
    所述分析模块还用于若所述新探测信号的信号强度不在预设的强度区间内时，则所述薄片类介质存在异常特征；
    所述异常特征为薄片类介质上存在撕裂、破损、黏贴异物；
    或，
    所述分析模块还用于若所述薄片类介质的平均厚度不在预设的厚度区间内时，则所述薄片类介质不合格。
PCT/CN2014/093256 2014-06-30 2014-12-08 一种厚度检测装置 WO2016000405A1 (zh)

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