WO2015200754A1

WO2015200754A1 - Satellite navigation antenna assemblies

Info

Publication number: WO2015200754A1
Application number: PCT/US2015/037890
Authority: WO
Inventors: Ayman Duzdar; Cheikh T. Thiam; Hela LOUDHAIEF
Original assignee: Laird Technologies, Inc.
Priority date: 2014-06-27
Filing date: 2015-06-26
Publication date: 2015-12-30
Also published as: CN107078395B; CN107078395A

Abstract

Disclosed are exemplary embodiments of antenna assemblies or modules. Exemplary embodiments may generally include a satellite navigation antenna (e.g., GPS patch antenna, GLONASS patch antenna, other satellite navigation antennas, etc.). One or more intervening components are disposed between the satellite navigation antenna and a printed circuit board (PCB), such that the satellite navigation antenna is not disposed directly on the PCB.

Description

SATELLITE NAVIGATION ANTENNA ASSEMBLIES

CROSS-REFERENCE TO RELATED APPLICATION

[0001 ] This application is a PCT International Application of United States Provisional Patent Application No. 62/018,451 filed June 27, 2014. The entire disclosure of the above application is incorporated herein by reference.

FIELD

[0002] The present disclosure relates to satellite navigation antenna assemblies.

BACKGROUND

[0003] This section provides background information related to the present disclosure which is not necessarily prior art.

[0004] Different types of satellite navigation antennas may be used in automotive navigation systems. Example operational satellite navigation systems include Global Positioning System (GPS), Global Navigation Satellite System (GLONASS), Doppler Orbitography and Radio-positioning Integrated by Satellite (DORIS), and BeiDou Navigation Satellite System (BDS). Example satellite navigation systems that are in development include Compass navigation system and Galileo positioning system.

[0005] Automotive satellite navigation antennas may be mounted inside or outside of a vehicle. For example, a satellite navigation antenna may be mounted on an exterior vehicle surface, such as the roof, trunk, or hood of the vehicle to help ensure that the antenna has unobstructed views overhead or toward the zenith. As another example, a satellite navigation antenna may be mounted inside an instrument panel of the vehicle. The satellite navigation antenna may be connected to one or more electronic devices (e.g. , an in-dash touchscreen display, etc.) inside the passenger compartment of the vehicle.

[0006] FIG. 1 illustrates a conventional GPS antenna assembly 100 including a GPS patch antenna 104, a printed circuit board assembly (PCBA) 108, and an electromagnetic interference (EMI) shield 112. The GPS antenna assembly 100 also includes a connector 116 for electrically connecting the printed circuit board assembly 108 to a communication link, which, in turn, may be connected to an electronic device (e.g. , an in-dash touchscreen display, etc.) inside the passenger compartment of a vehicle. The GPS antenna assembly 100 includes a two-piece housing for components of the GPS antenna assembly 100. The housing includes a top housing member 120 that may be coupled to (e.g. , snapped together with, latched to, etc.) a bottom housing member 124. Bumpers 128 are positioned between the PCB assembly 108 and the top housing member 120.

SUMMARY

[0007] This section provides a general summary of the disclosure, and is not a comprehensive disclosure of its full scope or all of its features.

[0008] Disclosed are exemplary embodiments of antenna assemblies or modules. Exemplary embodiments may generally include a satellite navigation antenna (e.g. , GPS patch antenna, GLONASS patch antenna, other satellite navigation antennas, etc.). One or more intervening components are disposed between the satellite navigation antenna and a printed circuit board (PCB), such that the satellite navigation antenna is not disposed directly on the PCB.

[0009] Further areas of applicability will become apparent from the description provided herein. The description and specific examples in this summary are intended for purposes of illustration only and are not intended to limit the scope of the present disclosure.

DRAWINGS

[0010] The drawings described herein are for illustrative purposes only of selected embodiments and not all possible implementations, and are not intended to limit the scope of the present disclosure.

[001 1 ] FIG. 1 is an exploded perspective view of a conventional GPS antenna assembly;

[0012] FIG. 2 is an exploded perspective view of a GPS antenna assembly according to an exemplary embodiment;

[0013] FIG. 3 is an exploded perspective view of a GPS antenna assembly according to another exemplary embodiment;

[0014] FIG. 4 is an exploded perspective view of a GPS antenna assembly according to another exemplary embodiment;

[0015] FIG. 5 is a line graph of antenna gain 90 degrees from horizon (boresight) in decibels referenced to a circularly polarized, theoretical isotropic radiator (dBic) versus frequency in megahertz (MHz) for the GPS antenna assemblies shown in FIGS. 1 through 4; [0016] FIG. 6 is a line graph of antenna gain 79 degrees from horizon in dBic versus frequency (in MHz) for the GPS antenna assemblies shown in FIGS. 1 through 4;

[0017] FIG. 7 is an exploded perspective view of an antenna assembly according to another exemplary embodiment that has dual resonance at and/or is operable with GPS frequencies and one or more other frequencies (e.g. , Dedicated Short Range Communication (DSRC) frequencies, etc.);

[0018] FIG. 8 is a perspective view of the antenna assembly shown in FIG. 7 after being assembled but shown without the top housing portion;

[0019] FIG. 9 is a partial perspective view of the antenna assembly shown in FIG. 8 showing the interior thereof;

[0020] FIG. 10 is a cross- sectional side view of the antenna assembly shown in FIG. 7 including the top housing portion;

[0021 ] FIG. 11 shows the antenna resonance for the GPS antenna assembly shown in FIG. 1, and illustrating the single antenna resonance at the GPS frequency of 1.575 gigahertz (GHz);

[0022] FIG. 12 shows the antenna resonance for the antenna assembly shown in FIGS. 7- 10, and illustrating the dual antenna resonance at the GPS frequency of 1.575 GHz and another frequency of 2.9 GHz;

[0023] FIG. 13 is an exploded perspective view of an antenna assembly according to another exemplary embodiment in which a 3-layer reflector (e.g. , metal layer, PCB layer, metal layer, etc.) and dielectric spacer are between a patch antenna and a PCBA;

[0024] FIG. 14 is a perspective view of the antenna assembly shown in FIG. 13 after being assembled where the top housing portion is not shown for clarity;

[0025] FIG. 15 is a partial perspective view of the antenna assembly shown in FIG. 14 but shown without the EMI shield and bottom housing portion;

[0026] FIG. 16 is a top view of the antenna assembly shown in FIG. 14;

[0027] FIG. 17 is a perspective view of the antenna assembly shown in FIG. 14;

[0023] FIG. 18 is an end view of the antenna assembly shown in FIG. 14;

[0029] FIG. 19 is an end view of the antenna assembly shown in FIG. 14;

[0030] FIG. 20 is a perspective view of the antenna assembly shown in FIG. 14 where the top housing portion is shown transparent or translucent to show the underlying components;

[0031 ] FIG. 21 is a side view of an antenna assembly according to another exemplary embodiment in which a 3-layer reflector (e.g. , metal layer, PCB layer, metal layer, etc.) and dielectric spacer are between a patch antenna and a PCB A and where a connection (e.g. , pin, etc.) from the patch antenna does not go straight through the PCB layer of the 3-layer reflector but the connection extends around the PCB layer (e.g. , "jogs" to the side of the PCB layer, etc.) and then goes down through to the PCBA;

[0032] FIG. 22 is a partial perspective view of the antenna assembly shown in FIG. 21 ;

[0033] FIG. 23 is a perspective view of the antenna assembly shown in FIG. 21 without the top housing portion;

[0034] FIG. 24 is a cross-sectional side view of the antenna assembly shown in FIG. 23 showing the interior thereof;

[0035] FIGS. 25, 26, 27, and 28 are respective top, perspective, end, and side views of the antenna assembly shown in FIG. 23 where the top housing portion is shown transparent or translucent to show the underlying components; and

[0036] FIGS. 29, 30, 31, and 31 are respective top, perspective end, and side views of the antenna assembly shown in FIG. 21 where the top housing portion is shown transparent or translucent to show the underlying components.

DETAILED DESCRIPTION

[0037] Example embodiments will now be described more fully with reference to the accompanying drawings.

[0038] Disclosed herein are exemplary embodiments of antenna assemblies or modules (e.g. , 200, 300, 400, 500, 600, 700, etc.) that may provide significant antenna gain improvement and/or system performance improvement in heavy foliage and in downtown or urban areas. These exemplary embodiments include a satellite navigation antenna (e.g. , GPS patch antenna, GLONASS patch antenna, other satellite navigation antennas, etc.). One or more intervening components are disposed between the satellite navigation antenna and a printed circuit board (PCB), such that the satellite navigation antenna is not disposed directly on the PCB. Examples of such intervening components includes one or more electrically-conductive reflectors or ground planes, one or more radiators, radiating structures or antennas (e.g. , antennas operable with DSRC frequencies, etc.), one or more dielectrics or dielectric materials, one or more dielectric spacers or electrical insulators, one or more electrically-conductive spacers or electrical conductors, combinations thereof, etc. In some exemplary embodiments, the antenna assembly may include one or more other antennas, radiator, or radiating structures in addition to the satellite navigation antenna, such that the antenna assembly has dual resonance at and/or is operable with multiple frequency ranges, such as satellite navigation frequencies (e.g. , GPS, GLONASS, etc.) and DSRC frequencies, etc.

[0039] For example, an exemplary embodiment includes a patch antenna (e.g. , GPS patch antenna, GLONASS patch antenna, etc.) disposed (e.g. , directly, etc.) on or against an electrically- conductive reflector or ground plane (e.g. , 0.2 millimeter (mm) thick metallic ground plane, etc.). In turn, the electrically-conductive reflector or ground plane is disposed (e.g. , directly, etc.) on or against a PCB. The electrically-conductive reflector or ground plane is thus disposed between the patch antenna and PCB. The electrically-conductive reflector or ground plane may also be referred to as an intervening component that prevents or inhibits direct physical contact between the patch antenna and the PCB. During operation of the antenna assembly, surface currents are induced on and re-radiated by the electrically-conductive reflector or ground plane, which thus enhances the radiation pattern. The electrically-conductive reflector or ground plane under the patch antenna may thus also be referred to as a radiator or radiating structure.

[0040] In this first example, the surface area or footprint of the electrically-conductive reflector or ground plane may be larger than the surface area or footprint of the patch antenna. The surface area or footprint of the electrically-conductive reflector or ground plane may be about the same as or smaller than the surface area or footprint of the PCB, such that the addition of the electrically- conductive ground plane or reflector does not increase the overall footprint of the antenna assembly.

[0041 ] The patch antenna may be electrically connected or coupled to the PCB via a connector, such as an uninsulated pin or an insulated pin (e.g. , a metal conductor with an EMI shield around it, etc.). The pin may be a semi-rigid pin and extend from the patch antenna through an opening in the electrically-conductive reflector or ground plane to the PCB.

[0042] As a second example, another exemplary embodiment includes a patch antenna (e.g. , GPS patch antenna, GLONASS patch antenna, etc.) disposed (e.g. , directly, etc.) on or against a dielectric spacer or electrical insulator (e.g. , a 1 mm thick plastic washer, annular or hollow member, etc.). In turn, the dielectric spacer is disposed (e.g. , directly, etc.) on or against a PCB. The dielectric spacer is thus disposed between the patch antenna and PCB. The dielectric spacer may also be referred to as an intervening component that prevents or inhibits direct physical contact between the patch antenna and the PCB. Due to its thickness (e.g. , 1 mm, etc.), the dielectric spacer raises the patch antenna and creates an air gap (e.g. , 1 mm air gap, spaced apart by 1 mm, etc.), which changes the radiation patterns (or directivity) of the patch antenna to point to the high elevations where it is needed.

[0043] In this second example, the dielectric spacer may have length and/or width dimensions equal to, greater than, or less than corresponding dimensions of the patch antenna. For example, the dielectric spacer may comprise a plastic circular washer having an outer diameter equal to the length and width of the patch antenna.

[0044] Also in this second example, the patch antenna may be electrically connected or coupled to the PCB via a connector, such as an uninsulated pin or an insulated pin (e.g. , a metal conductor with an EMI shield around it, etc. ). The pin may be a semi-rigid pin and extend from the patch antenna through an opening in the dielectric spacer to the PCB. For a larger dielectric spacer, it may be preferable to use an insulated pin as the connector.

[0045] As a third example, another exemplary embodiment includes a patch antenna (e.g. , GPS patch antenna, GLONASS patch antenna, etc.) disposed (e.g. , directly, etc.) on or against an electrically-conductive spacer or electrical conductor (e.g. , a 1 mm thick metallic washer, annular or hollow member, etc.). The electrically-conductive spacer is disposed above and (e.g. , directly, etc. ) on or against an electrically-conductive reflector or ground plane (e.g. , 0.2 millimeter (mm) thick metallic ground plane, etc.). In turn, the electrically-conductive reflector or ground plane is disposed (e.g. , directly, etc.) on or against a PCB. Accordingly, the electrically-conductive spacer is disposed between the patch antenna and the electrically-conductive reflector or ground plane. The electrically-conductive reflector or ground plane is disposed between the electrically-conductive spacer and the PCB. The electrically-conductive spacer and the electrically-conductive reflector or ground plane may both be referred to as intervening components that prevent or inhibit direct physical contact between the patch antenna and the PCB.

[0046] Due to its thickness (e.g. , 1 mm, etc.), the electrically-conductive spacer raises the patch antenna and creates an air gap (e.g. , 1 mm air gap, spaced apart by 1 mm, etc.) between the patch antenna and the electrically-conductive reflector or ground plane, which changes the radiation patterns (or directivity) of the patch antenna to point to the high elevations where it is needed. During operation of the antenna assembly, surface currents are induced on and re-radiated by the electrically-conductive reflector or ground plane, which thus enhances the radiation pattern. The electrically-conductive reflector or ground plane under the patch antenna may also be referred to as a radiator or radiating structure. [0047] In this third example, the electrically-conductive spacer may have length and/or width dimensions equal to, greater than, or less than corresponding dimensions of the patch antenna. For example, the electrically-conductive spacer may comprise a metallic circular washer having an outer diameter equal to the length and width of the patch antenna. The surface area or footprint of the electrically-conductive reflector or ground plane may be larger than the surface area or footprint of the patch antenna. The surface area or footprint of the electrically-conductive reflector or ground plane may be about the same as or smaller than the surface area or footprint of the PCB, such that the addition of the electrically-conductive ground plane or reflector does not increase the overall footprint of the antenna assembly.

[0048] Also in this third example, the patch antenna may be electrically connected or coupled to the PCB via a connector, such as an uninsulated pin or an insulated pin (e.g. , a metal conductor with an EMI shield around it, etc. ). The pin may be a semi-rigid pin and extend from the patch antenna through openings in the electrically-conductive spacer and the electrically-conductive reflector or ground plane to the PCB.

[0049] In the third example above, the electrically-conductive spacer is disposed between the patch antenna and the electrically-conductive reflector or ground plane, while the electrically-conductive reflector or ground plane is disposed between the electrically-conductive spacer and the PCB. In other exemplary embodiments, one or more electrically-conductive spacers and/or one or more dielectric spacers may be disposed above and/or below the electrically-conductive reflector or ground plane.

[0050] As a fourth example, first and second electrically-conductive spacers or electrical conductors are disposed respectively above and below the electrically-conductive reflector or ground plane such that the electrically-conductive reflector or ground plane is between the first and second electrically-conductive spacers. The first electrically-conductive spacer is disposed between a patch antenna (e.g. , GPS patch antenna, GLONASS patch antenna, etc.) and the electrically-conductive reflector or ground plane, while the second electrically-conductive spacer is disposed between the electrically-conductive reflector or ground plane and a PCB. The first and second electrically-conductive spacers and the electrically-conductive reflector or ground plane may be referred to as intervening components that prevent or inhibit direct physical contact between the patch antenna and the PCB.

[0051 ] In this fourth example, the first electrically-conductive spacer creates a first air gap (e.g. , 1 mm air gap, spaced apart by 1 mm, etc.) between the patch antenna and the electrically- conductive reflector or ground plane, while the second electrically-conductive spacer creates a second air gap (e.g. , 1 mm air gap, spaced apart by 1 mm, etc.) between the PCB and the electrically-conductive reflector or ground plane. The first and second air gaps change the radiation patterns (or directivity) of the patch antenna to point to the high elevations where it is needed. During operation of the antenna assembly, surface currents are induced on and re-radiated by the electrically-conductive reflector or ground plane, which thus enhances the radiation pattern.

[0052] As a fifth example, an electrically-conductive spacer is disposed below but not above the electrically-conductive reflector or ground plane. The electrically-conductive spacer is disposed between the electrically-conductive reflector or ground plane and a PCB. The electrically-conductive reflector or ground plane is disposed between the electrically-conductive spacer and a patch antenna (e.g. , GPS patch antenna, GLONASS patch antenna, etc. ). The electrically-conductive spacer and the electrically-conductive reflector or ground plane may both be referred to as intervening components that prevent or inhibit direct physical contact between the patch antenna and the PCB.

[0053] In this fifth example, the electrically-conductive spacer creates an air gap (e.g. , 1 mm air gap, spaced apart by 1 mm, etc.) between the PCB and the electrically-conductive reflector or ground plane, which changes the radiation patterns (or directivity) of the patch antenna to point to the high elevations where it is needed. During operation of the antenna assembly, surface currents are induced on and re-radiated by the electrically-conductive reflector or ground plane, which thus enhances the radiation pattern.

[0054] As a sixth example, a dielectric spacer is disposed below but not above the electrically-conductive reflector or ground plane. The dielectric spacer is disposed between the electrically-conductive reflector or ground plane and a PCB. The electrically-conductive reflector or ground plane is disposed between the dielectric spacer and a patch antenna (e.g. , GPS patch antenna, GLONASS patch antenna, etc.). The electrically-conductive reflector or ground plane and the dielectric spacer may both be referred to as intervening components that prevent or inhibit direct physical contact between the patch antenna and the PCB.

[0055] In this sixth example, the dielectric spacer creates an air gap (e.g. , 1 mm air gap, spaced apart by 1 mm, etc.) between the PCB and the electrically-conductive reflector or ground plane, which changes the radiation patterns (or directivity) of the electrically-conductive reflector or ground plane and/or patch antenna to point to the high elevations where it is needed. During operation of the antenna assembly, surface currents are induced on and re-radiated by the electrically-conductive reflector or ground plane, which thus enhances the radiation pattern. [0056] As a seventh example, another exemplary embodiment of an antenna assembly (e.g. , dual GPS-DSRC smart antenna, etc.) has dual resonance at and/or is operable with satellite navigation frequencies (e.g. , GPS frequencies, GLONASS frequencies, etc.) and one or more other frequencies (e.g. , 2.9 GHz, DSRC frequency of 5.9 GHz, etc.). In this seventh example, a patch antenna (e.g. , GPS patch antenna, GLONASS patch antenna, etc.) is disposed (e.g. , directly, etc.) on or against a radiator, radiating structure or antenna (e.g. , a 0.2 mm thick sheet metal DSRC antenna, etc.). A dielectric (e.g. , .5 mm thick double sided dielectric tape or other dielectric material, etc. ) is disposed between the radiating antenna and a printed circuit board. Accordingly, the radiating antenna is disposed between the patch antenna and the dielectric. The dielectric is disposed between the radiating antenna and the PCB. The radiating antenna and the dielectric may both be referred to as intervening components that prevent or inhibit direct physical contact between the patch antenna and the PCB.

[0057] In this seventh example, the radiating antenna may comprise sheet metal (e.g. , having a thickness of 0.2 mm, etc.) having one or more slots (e.g. , right angled slots opposite each other, etc.) that cause it to radiate such that the antenna assembly has a second resonance (e.g. , DSRC frequency band of 5.9 GHz, etc.) in addition to the first resonance at a satellite navigation frequency. For example, the antenna assembly may comprise a dual GPS-DSRC smart antenna in some embodiments.

[0058] The sheet metal may be backed by a dielectric material (e.g. , double sided dielectric tape having a thickness of 0.5 mm, etc.), where the dielectric is between the sheet metal and the PCB. The sheet metal and the dielectric material may have length and/or width dimensions equal to, greater than, or less than corresponding dimensions of the PCB. For example, the sheet metal and the dielectric material may have length and/or width dimensions about the same as or smaller than the corresponding dimensions of the PCB, such that the addition of the sheet metal and the dielectric material do not increase the overall footprint of the antenna assembly.

[0059] Also in this seventh example, the patch antenna may be electrically connected or coupled to the PCB via a connector, such as an uninsulated pin or an insulated pin (e.g. , a metal conductor with an EMI shield around it, etc. ). The pin may be a semi-rigid pin and extend from the patch antenna through openings in the radiating antenna and the dielectric material to the PCB.

[0060] As an eighth example, another exemplary embodiment of an antenna assembly (e.g. , dual PCB GPS antenna, etc.) includes a patch antenna (e.g. , GPS patch antenna, GLONASS patch antenna, etc.) disposed (e.g. , directly, etc.) on or against an upper surface of a multilayer reflector. For example, the multilayer reflector may be a 3-layer reflector including an upper electrically-conductive (e.g. , metal, etc.) layer, a PCB layer, and a lower electrically-conductive (e.g. , metal, etc.) layer. A dielectric spacer or electrical insulator is between the 3-layer reflector and a second PCB. Accordingly, the 3-layer reflector is disposed between the patch antenna and the dielectric spacer. The dielectric spacer is between the 3-layer reflector and the second PCB. The 3-layer reflector and the dielectric spacer may both be referred to as intervening components that prevent or inhibit direct physical contact between the patch antenna and the second PCB.

[0061 ] The second PCB is not soldered, affixed, mounted, or attached to the 3-layer reflector. The 3-layer reflector is held in place via its guide holes through which the EMI shield' s tabs extend and via pressure applied on the stack as a result of the housing or case and the silicon pads and/or bumpers. The tabs and guide holes provide shield solder connections as the 3-layer reflector is soldered to the EMI shield's tabs. The dielectric spacer includes posts or pegs that extend through guide holes in the 3-layer reflector.

[0062] Also in this eight example, the patch antenna may be electrically connected or coupled to the second PCB via a connector, such as an uninsulated pin or an insulated pin (e.g. , a metal conductor with an EMI shield around it, etc.). The pin may be a semi-rigid pin. The pin may extend from the patch antenna through openings in the 3-layer reflector and dielectric spacer. Or, for example, the connection (e.g. , pin, etc.) from the patch antenna may not go straight through the first PCB of the 3- layer reflector. Instead, the connection may extend around the first PCB (e.g. , "jog" to the side of the first PCB, etc.) and then go down through to the second PCB.

[0063] With reference to the figures, FIG. 2 illustrates an exemplary embodiment of a satellite navigation antenna assembly or module 200 embodying one or more aspects of the present disclosure. As shown in FIG. 2, the antenna assembly 200 includes a patch antenna 204, a printed circuit board assembly (PCBA) 208, and an electromagnetic interference (EMI) shield 212. An electrically- conductive ground plane or reflector 232 is positioned between the patch antenna 204 and an upper surface or side of the PCBA 208. In some embodiments, a double sided electrically-conductive adhesive tape and/or an electrically-conductive adhesive may be used between the electrically-conductive ground plane or reflector 232 and the patch antenna 204 and/or PCBA 208.

[0064] In this example, the patch antenna 204 is a GPS patch antenna. The PCBA 208 includes a dielectric substrate or board comprising FR4 composite material, which includes woven fiberglass cloth with an epoxy resin binder that is flame resistant. The EMI shield 212 comprises stamped sheet metal including resilient spring fingers 213 along the side walls. The EMI shield 212 also includes tabs 214 that extend through guide holes in the PCBA 208. Alternative embodiments may include other satellite navigation and/or patch antennas (e.g. , GLONASS patch antenna, etc. ), other EMI shields, and/or other PCBAs.

[0065] The antenna assembly 200 also includes a connector 216 for electrically connecting the PCBA 208 to a communication link, which, in turn, may be connected to an electronic device (e.g. , an in-dash touchscreen display, etc.) inside the passenger compartment of a vehicle. The antenna assembly 200 includes a housing for components of the antenna assembly 200. The housing includes a top housing member 220 that may be coupled to (e.g. , snapped together with, latched to, etc.) a bottom housing member 224. The housing may be formed from a dielectric material, e.g. , plastic, etc.

[0066] Resiliently compressible (e.g. , silicone, etc.) bumpers 228 are positioned between the PCB assembly 208 and the top housing member 220. The bumpers 228 are compressively sandwiched generally between the PCBA 208 and top housing member 220 when the top and bottom housing members 220, 224 are coupled together. Compression of the bumpers 228 generates a compressive force urging the PCBA 208 generally towards EMI shield 212 that aids in electrically grounding of the PCBA 208 with the shield 212.

[0067] A wide range of materials may be used for the electrically-conductive ground plane or reflector 232, such as metals, metal alloys, metallic materials, electrically-conductive composite materials, etc. In this exemplary embodiment, the electrically-conductive ground plane or reflector 232 is a metallic ground (e.g. , sheet metal, etc.) having a thickness of .2 millimeters. The relative thinness of the ground plane or reflector 232 may allow an existing housing (e.g. , top housing member 120 in FIG. 1, etc.) to be used with the antenna assembly 200 without requiring tooling changes despite the addition of the ground plane or reflector 232 between the patch antenna 204 and PCBA 208.

[0068] With continued reference to FIG. 2, the electrically-conductive ground plane or reflector 232 is disposed on an upper surface or side of the PCBA 208 in the final assembled form of the antenna assembly 200. The electrically-conductive reflector or ground plane 232 is thus disposed between the patch antenna 204 and PCBA 208. The electrically-conductive reflector or ground plane 232 may also be referred to as an intervening component that prevents or inhibits direct physical contact between the patch antenna 204 and the PCBA 208. During operation of the antenna assembly 200, surface currents are induced on and re -radiated by the electrically-conductive reflector or ground plane 232, which thus enhances the radiation pattern. The electrically-conductive reflector or ground plane 232 may thus also be referred to as a radiator or radiating structure. Accordingly, the patch antenna 204 is not disposed directly on the PCBA 208.

[0069] The surface area or footprint of the electrically-conductive reflector or ground plane 232 may be larger than, smaller than, or equal to the surface area or footprint of the patch antenna 204. In this example, the electrically-conductive reflector or ground plane 232 has a surface area or footprint about the same as the PCBA 208, such that the addition of the electrically-conductive ground plane or reflector 232 does not increase the overall footprint of the antenna assembly 200.

[0070] The patch antenna 204 may be electrically connected or coupled to the PCBA 208 via a connector. The connector may comprise an uninsulated pin or an insulated pin (e.g. , a metal conductor with an EMI shield around it, etc.). The pin may be a semi-rigid pin and extend from the patch antenna 204 through an opening 236 in the electrically-conductive reflector or ground plane 232 to the PCBA 208.

[0071 ] The antenna assembly 200 may be mounted inside or outside of a vehicle. For example, the antenna assembly 200 may be mounted on an exterior vehicle surface, such as the roof, trunk, or hood of the vehicle to help ensure that the antenna has unobstructed views overhead or toward the zenith. As another example, the antenna assembly 200 may be mounted inside an instrument panel of the vehicle. Advantageously, the antenna assembly 200 has good or sufficiently high gain 50 degrees above horizon to allow the antenna assembly 200 to be mounted inside an instrument panel of the vehicle. Gain 50 degrees above horizon is most important for an IP-mount location.

[0072] FIG. 3 illustrates another exemplary embodiment of a satellite navigation antenna assembly or module 300 embodying one or more aspects of the present disclosure. As shown in FIG. 3, the antenna assembly 300 includes a patch antenna 304, a PCBA 308, and an EMI shield 312. A dielectric spacer or electrical isolator 340 is positioned between the patch antenna 304 and an upper surface or side of the PCBA 308. In some embodiments, a double sided dielectric adhesive tape and/or a dielectric adhesive may be used between the dielectric spacer 340 and the patch antenna 304 and/or PCBA 308.

[0073] In this example, the patch antenna 304 is a GPS patch antenna. The PCBA 308 includes a dielectric substrate or board comprising FR4 composite material, which includes woven fiberglass cloth with an epoxy resin binder that is flame resistant. The EMI shield 312 comprises stamped sheet metal including resilient spring fingers along the side walls. Alternative embodiments may include other satellite navigation and/or patch antennas (e.g. , GLONASS patch antenna, etc.), other EMI shields, and/or other PCBAs.

[0074] The antenna assembly 300 also includes a connector 316 for electrically connecting the PCBA 308 to a communication link, which, in turn, may be connected to an electronic device (e.g. , an in-dash touchscreen display, etc.) inside the passenger compartment of a vehicle. The antenna assembly 300 includes a housing for components of the antenna assembly 300. The housing includes a top housing member 320 that may be coupled to (e.g. , snapped together with, latched to, etc.) a bottom housing member 324. The housing may be formed from a dielectric material, e.g. , plastic, etc.

[0075] Resiliently compressible (e.g. , silicone, etc.) bumpers 328 are positioned between the PCBA 308 and the top housing member 320. The bumpers 328 are compressively sandwiched generally between the PCBA 308 and top housing member 320 when the top and bottom housing members 320, 324 are coupled together. Compression of the bumpers 328 generates a compressive force urging the PCBA 308 generally towards EMI shield 312 that aids in electrically grounding of the PCBA 308 with the shield 312.

[0076] A wide range of dielectric materials may be used for the dielectric spacer or electrical isolator 340, such as plastics, dielectric conductive materials, etc. In this exemplary embodiment, the dielectric spacer 340 is a plastic circular washer having a thickness of 1 mm.

[0077] With continued reference to FIG. 3, the dielectric spacer 340 is disposed on an upper surface or side of the PCBA 308 in the final assembled form of the antenna assembly 300. The dielectric spacer 340 is thus disposed between the patch antenna 304 and PCBA 308. The dielectric spacer 340 may also be referred to as an intervening component that prevents or inhibits direct physical contact between the patch antenna 304 and the PCBA 308. Due to its thickness (e.g. , 1 mm, etc.), the dielectric spacer 340 raises the patch antenna 304 such that the lower surface of the patch antenna 304 is spaced apart from the upper surface of the PCBA 308. The dielectric spacer 340 creates an air gap (e.g. , 1 mm air gap, etc.) between the patch antenna 304 and PCBA 308, which changes the radiation patterns (or directivity) of the patch antenna 304 to point to the high elevations where it is needed. Accordingly, the patch antenna 304 is not disposed (e.g. , directly, etc.) on the PCBA 308.

[0078] The dielectric spacer 340 may have length and/or width dimensions equal to, greater than, or less than corresponding dimensions of the patch antenna 304. For example, the dielectric spacer 340 may comprise a plastic circular washer having an outer diameter equal to the length and width of the patch antenna 304. [0079] The patch antenna 304 may be electrically connected or coupled to the PCBA 308 via a connector. The connector may comprise an uninsulated pin or an insulated pin (e.g. , a metal conductor with an EMI shield around it, etc.). The pin may be a semi-rigid pin and extend from the patch antenna 304 through an opening 344 in the dielectric spacer 340 to the PCBA 308.

[0080] The antenna assembly 300 may be mounted inside or outside of a vehicle. For example, the antenna assembly 300 may be mounted on an exterior vehicle surface, such as the roof, trunk, or hood of the vehicle to help ensure that the antenna has unobstructed views overhead or toward the zenith. As another example, the antenna assembly 300 may be mounted inside an instrument panel of the vehicle. Advantageously, the antenna assembly 300 has good or sufficiently high gain 50 degrees above horizon to allow the antenna assembly 300 to be mounted inside an instrument panel of the vehicle. Gain 50 degrees above horizon is most important for an IP-mount location.

[0081 ] FIG. 4 illustrates another exemplary embodiment of a satellite navigation antenna assembly or module 400 embodying one or more aspects of the present disclosure. As shown in FIG. 4, the antenna assembly 400 includes a patch antenna 404, a PCBA 408, and an EMI shield 412. An electrically-conductive spacer or electrical conductor 440 and an electrically-conductive ground plane or reflector 432 are positioned between the patch antenna 404 and PCBA 408. In some embodiments, a double sided electrically-conductive adhesive tape and/or an electrically-conductive adhesive may be used between the electrically-conductive spacer 440 and the patch antenna 404 and/or electrically- conductive ground plane or reflector 432. A double sided electrically-conductive adhesive tape and/or an electrically-conductive adhesive may also or instead be used between the electrically-conductive ground plane or reflector 432 and the PCBA 408.

[0082] In this example, the patch antenna 404 is a GPS patch antenna. The PCBA 408 includes a dielectric substrate or board comprising FR4 composite material, which includes woven fiberglass cloth with an epoxy resin binder that is flame resistant. The EMI shield 412 comprises stamped sheet metal including resilient spring fingers along the side walls. Alternative embodiments may include other satellite navigation and/or patch antennas (e.g. , GLONASS patch antenna, etc.), other EMI shields, and/or other PCBAs.

[0083] The antenna assembly 400 also includes a connector 416 for electrically connecting the PCBA 408 to a communication link, which, in turn, may be connected to an electronic device (e.g. , an in-dash touchscreen display, etc.) inside the passenger compartment of a vehicle. The antenna assembly 400 includes a housing for components of the antenna assembly 400. The housing includes a top housing member 420 that may be coupled to (e.g. , snapped together with, latched to, etc.) a bottom housing member 424. The housing may be formed from a dielectric material, e.g. , plastic, etc.

[0084] Resiliently compressible (e.g. , silicone, etc.) bumpers 428 are positioned between the PCBA 408 and the top housing member 420. The bumpers 428 are compressively sandwiched generally between the PCBA 408 and top housing member 420 when the top and bottom housing members 420, 424 are coupled together. Compression of the bumpers 428 generates a compressive force urging the PCBA 408 generally towards EMI shield 412 that aids in electrically grounding of the PCBA 408 with the shield 412.

[0085] A wide range of materials may be used for the electrically-conductive ground plane or reflector 432 and the electrically-conductive spacer 440, such as metals, metal alloys, metallic materials, electrically-conductive composite materials, etc. In this exemplary embodiment, the electrically-conductive ground plane or reflector 432 is a metallic ground (e.g. , sheet metal, etc.) having a thickness of .2 millimeters. The electrically-conductive spacer 440 is a metallic circular washer having a thickness of 1 mm.

[0086] With continued reference to FIG. 4, the patch antenna 404 is disposed on an upper surface or side of the electrically-conductive spacer 440. The electrically-conductive spacer 440 is disposed on an upper surface or side of the electrically-conductive reflector or ground plane 432. The electrically-conductive reflector or ground plane 432 is disposed on an upper surface or side of the PCBA 408. Accordingly, the electrically-conductive spacer 440 is disposed between the patch antenna 404 and the electrically-conductive reflector or ground plane 432. The electrically-conductive reflector or ground plane 432 is disposed between the electrically-conductive spacer 440 and the PCBA 408. The electrically-conductive spacer 440 and the electrically-conductive reflector or ground plane 432 may both be referred to as intervening components that prevent or inhibit direct physical contact between the patch antenna 404 and the PCBA 408.

[0087] Due to its thickness (e.g. , 1 mm, etc.), the electrically-conductive spacer 440 raises the patch antenna 404 such that the lower surface of the patch antenna 404 is spaced apart from the upper surface of the electrically-conductive reflector or ground plane 432. The electrically-conductive spacer 440 creates an air gap (e.g. , 1 mm air gap, etc.) between the patch antenna 404 and the electrically-conductive reflector or ground plane 432, which changes the radiation patterns (or directivity) of the patch antenna 404 to point to the high elevations where it is needed. During operation of the antenna assembly 400, surface currents are induced on and re-radiated by the electrically- conductive reflector or ground plane 432, which thus enhances the radiation pattern. The electrically- conductive reflector or ground plane 432 may also be referred to as a radiator or radiating structure.

[0033] The electrically-conductive spacer 440 may have length and/or width dimensions equal to, greater than, or less than corresponding dimensions of the patch antenna 404. For example, the electrically-conductive spacer 440 may comprise a metallic circular washer having an outer diameter equal to the length and width of the patch antenna 404. The surface area or footprint of the electrically- conductive reflector or ground plane 432 may be larger than, smaller than, or equal to the surface area or footprint of the patch antenna 404. In this example, the electrically-conductive reflector or ground plane 432 has a surface area or footprint about the same as the PCBA 408, such that the addition of the electrically-conductive ground plane or reflector 432 does not increase the overall footprint of the antenna assembly 400.

[0089] The patch antenna 404 may be electrically connected or coupled to the PCBA 408 via a connector. The connector may comprise an uninsulated pin or an insulated pin (e.g. , a metal conductor with an EMI shield around it, etc.). The pin may be a semi-rigid pin and extend from the patch antenna 404 through an opening 444 in the electrically-conductive spacer 440 and through an opening 436 in the electrically-conductive reflector or ground plane 432 to the PCBA 408.

[0090] The antenna assembly 400 may be mounted inside or outside of a vehicle. For example, the antenna assembly 400 may be mounted on an exterior vehicle surface, such as the roof, trunk, or hood of the vehicle to help ensure that the antenna has unobstructed views overhead or toward the zenith. As another example, the antenna assembly 400 may be mounted inside an instrument panel of the vehicle. Advantageously, the antenna assembly 400 has good or sufficiently high gain 50 degrees above horizon to allow the antenna assembly 400 to be mounted inside an instrument panel of the vehicle. Gain 50 degrees above horizon is most important for an IP-mount location.

[0091 ] FIGS. 5 and 6 include line graphs of antenna gain in decibels referenced to a circularly polarized, theoretical isotropic radiator (dBic) versus frequency in megahertz (MHz) for the GPS antenna assemblies 100, 200, 300, and 400 shown in FIGS. 1 through 4, respectively. Generally, these line graphs show the better performance in terms of antenna gain that may be achieved by the GPS antenna assemblies 200, 300, 400 as compared to the conventional GPS antenna assembly 100 shown in FIG. 1.

[0092] More specifically, FIG. 5 includes a line graph of antenna gain (in dBic) 90 degrees from horizon (boresight) for a physical prototype of the GPS antenna assembly 200 (FIG. 2) and for computer simulation models of the GPS antenna assemblies 100 (FIG. 1), 300 (FIG. 3), and 400 (FIG. 4) at frequencies ranging from 1550 MHz to 1600 MHz. As shown by FIG. 5, each of the GPS antenna assemblies 200, 300, 400 had higher boresight gain than the conventional GPS antenna assembly 100 for frequencies ranging from 1550 MHz to 1575.5 MHz. Also shown by FIG. 5, the GPS antenna assemblies 200, 300, and 400 had maximum boresight gains of 3.8 dBic, 3.77 dBic, and 3.91 dBic, respectively. By comparison, the conventional GPS antenna assembly 100 only had a maximum boresight gain of 2.88 dBic. Appendix A is a table of antenna gain (in dBic)and frequencies (in MHz), including that used to create the line graph shown in FIG. 5.

[0093] FIG. 6 includes a line graph of antenna gain (in dBic) 79 degrees from horizon for the physical prototype of the GPS antenna assembly 200 (FIG. 2) and for the computer simulation models of the GPS antenna assemblies 100 (FIG. 1), 300 (FIG. 3), and 400 (FIG. 4) at frequencies ranging from 1550 MHz to 1600 MHz. As shown by FIG. 6, each of the GPS antenna assemblies 200, 300, 400 had higher gain than the conventional GPS antenna assembly 100 for frequencies ranging from 1550 MHz to 1575 MHz. Also shown by FIG. 6, The GPS antenna assemblies 200, 300, and 400 had maximum gains of 3.3 dBic, 3.32 dBic, and 3.37 dBic, respectively. By comparison, the conventional GPS antenna assembly 100 had a maximum gain of 2.75 dBic. Appendix B is a table of antenna gain (in dBic) and frequencies (in MHz), including that used to create the line graph shown in FIG. 6.

[0094] FIGS. 5 and 6 and the antenna gain shown therein are provided only for purposes of illustration and not for purposes of limitation. Alternative embodiments of antenna assemblies may be configured and have different operational or performance parameters than what is shown in FIGS. 5 and 6. For example, alternative embodiments of antenna assemblies may be configured to be operable with frequencies different than the GPS carrier frequencies of 1227.6 MHz and 1575.42 MHz, such as the GLONASS (Global Navigation Satellite System) frequencies from 1240 MHz to 1260 MHz and 1602.5625 MHz to 1615.5 MHz, other satellite frequencies or frequency bands, etc.

[0095] The tables below provides a comparison of performance of the physical prototype of the GPS antenna assembly 200 (FIG. 2) and the computer simulation model of the GPS antenna assembly 100 (FIG. 1) under various conditions including Chicago Route - Urban Canyon Drive Tests (Tables 1 through 6), Detroit Route - Urban Canyon Drive Tests (Tables 7 through 12), and Dearborn Route - Open Sky Drive Tests (Tables 13 through 18). In Tables 1 through 18 below, PACC 3D provides the amount of error in meters that the GPS device assumes is in the GPS solution. SVs Used refers to the number of satellites used in the GPS solution. SV C/N0 refers to the satellite received carrier to noise density ratio in decibel-Hertz (dBHz). PDOP (Positional Dilution of Precision) is a measure of satellite geometry, where low PDOP indicates a higher probability of accuracy.

[0096] As shown by Tables 1 through 18, the GPS antenna assembly 200 had better 3D accuracy and better carrier to noise density ratio (C/N0) than the conventional GPS antenna assembly 100. This is shown by the lower average PACC 3D and higher average SV C/N0 of the GPS antenna assembly 200 as compared to the conventional GPS antenna assembly 100 in all 9 tests. The GPS antenna assembly 200 also had a lower average PDOP than the conventional GPS antenna assembly 100 in all six of the urban canyon drive tests (Tables 1 through 12). In the open sky drive tests (Tables 13 through 18), the GPS antenna assembly 200 had an average PDOP less than the conventional GPS antenna assembly 100 in all six of the urban canyon drive tests (Tables 1 through 12). In the open sky drive tests (Tables 13 through 18), the GPS antenna assembly 200 had an average PDOP of 1.8, 2.6, and 2.5, all of which are very low and indicative of a higher probability of accuracy. With the ground plane or reflector 232 (e.g. , 0.2 millimeter thick electrically-conductive metallic member, etc.) between the GPS patch antenna 204 and PCBA 208, the GPS antenna assembly 200 provided a substantial system performance improvement in heavy foliage and in downtown or urban areas as compared to the conventional GPS antenna assembly 100. The GPS antenna assemblies 200, 300, 400 may also provide a substantial system performance improvement in heavy foliage and in downtown or urban areas as compared to the conventional GPS antenna assembly 100.

Chicago Route - Urban Canyon Drive Test 1

Table 1: GPS Antenna Assembly 200 Table 2: Conventional GPS Antenna Assembly 100

Chicago Route - Urban Canyon Drive Test 2

Table 3: GPS Antenna Assembly 200 Table 4: Conventional GPS Antenna Assembly 100

Chicago Route - Urban Canyon Drive Test 3

Table 5: GPS Antenna Assembly 200 Table 6: Conventional GPS Antenna Assembly 100

Detroit Route - Urban Canyon Drive Test 1

Table 7: GPS Antenna Assembly 200 Table 8: Conventional GPS Antenna Assembly 100

Detroit Route - Urban Canyon Drive Test 2

Table 9: GPS Antenna Assembly 200 Table 10: Conventional GPS Antenna Assembly 100

Detroit Route - Urban Canyon Drive Test 3

Table 11: GPS Antenna Assembly 200 Table 12: Conventional GPS Antenna Assembly 100

Dearborn Route - Open Sky Drive Test 1

Table 13: GPS Antenna Assembly 200 Table 14: Conventional GPS Antenna Assembly 100

Dearborn Route - Open Sky Drive Test 2

Table 15: GPS Antenna Assembly 200 Table 16: Conventional GPS Antenna Assembly 100

Dearborn Route - Open Sky Drive Test 3

Table 17: GPS Antenna Assembly 200 Table 18: Conventional GPS Antenna Assembly 100

[0097] FIGS. 7-10 illustrate another exemplary embodiment of an antenna assembly or module 500 embodying one or more aspects of the present disclosure. In this exemplary embodiment, the antenna assembly 500 has dual resonance at and/or is operable with satellite navigation frequencies (e.g. , GPS frequencies, GLONASS frequencies, etc.) and one or more other frequencies (e.g. , 2.9 GHz, DSRC frequency of 5.9 GHz, etc.). For example, the antenna assembly 500 may comprise a dual GPS- DSRC smart antenna.

[0098] As shown in FIG. 7, the antenna assembly 500 includes a patch antenna 504, a PCBA 508, and an EMI shield 512. A radiator, radiating structure or antenna 532 and a dielectric 540 are positioned between the patch antenna 504 and PCBA 508. More specifically, the patch antenna 504 is disposed on or against an upper surface of the radiating antenna 532. The dielectric 540 is disposed on an upper surface of the PCBA 508. Accordingly, the radiating antenna 532 is disposed between the patch antenna 504 and the dielectric 540. The dielectric 540 is disposed between the radiating antenna 532 and the PCBA 508. The radiating antenna 532 and the dielectric 540 may both be referred to as intervening components that prevent or inhibit direct physical contact between the patch antenna 504 and the PCBA 508.

[0099] A wide range of materials may be used for the radiating antenna 532, such as metals, metal alloys, metallic materials, electrically-conductive composite materials, etc. In this exemplary embodiment, the radiating antenna 532 is sheet metal having a thickness of 0.2 mm. The sheet metal includes slots 548 (e.g. , right angled slots opposite each other, other suitable shapes, etc.) that cause it to radiate such that the antenna assembly 500 has a second resonance (e.g. , 2.9 GHz, DSRC frequency band of 5.9 GHz, etc.). The slots 548 may be reconfigured or optimized for resonance at a particular frequency. For example, the length of the slots 548 may be increased in some embodiments because the increased slot length causes resonance to be lower. Conversely, the length of the slots 548 may be reduced in other embodiments because the reduced slot length causes resonance to be higher (e.g. , increase resonance to 5.9 GHz, etc.).

[0100] The sheet metal may be backed by the dielectric 540. As shown in FIG. 8, the dielectric 540 may be seen through the slots 548. A wide range of materials may be used for the dielectric 540. In this example, the dielectric 540 is double sided dielectric tape having a thickness of 0.5 mm. The sheet metal and the double sided dielectric tape may have length and/or width dimensions equal to, greater than, or less than corresponding dimensions of the PCBA 508. For example, the sheet metal and the dielectric double sided adhesive tape may have length and/or width dimensions about the same as or less than the PCBA 508 such that the addition of the sheet metal and the dielectric double sided adhesive tape do not increase the overall footprint of the antenna assembly 500.

[0101 ] In this example, the patch antenna 504 is a GPS patch antenna. The PCBA 508 includes a dielectric substrate or board comprising FR4 composite material, which includes woven fiberglass cloth with an epoxy resin binder that is flame resistant. Circuitry with ground metallization may be disposed on a top or upper surface of the PCBA 508. The EMI shield 512 comprises stamped sheet metal including resilient spring fingers 513 along the side walls. The EMI shield 512 also includes tabs 514 that extend through guide holes 509 in the PCBA 508, guide holes 541 in the dielectric 540, and guide holes 533 in the radiating antenna 532. Alternative embodiments may include other satellite navigation and/or patch antennas (e.g. , GLONASS patch antenna, etc.), other EMI shields, other radiating antennas, and/or other PCBAs.

[0102] The antenna assembly 500 also includes a connector 516 for electrically connecting the PCBA 508 to a communication link, which, in turn, may be connected to an electronic device (e.g. , an in-dash touchscreen display, etc.) inside the passenger compartment of a vehicle. The antenna assembly 500 includes a housing for components of the antenna assembly 500. The housing includes a top housing member 520 that may be coupled to (e.g. , snapped together with, latched to, etc.) a bottom housing member 524. The housing may be formed from a dielectric material, e.g. , plastic, etc. As shown in FIGS. 7 and 10, a label 552 may be applied to an outer surface of the upper housing member 520, which label 552 may include information relating to and/or identifying the particular antenna assembly 500.

[0103] Resiliently compressible (e.g. , silicone, etc.) bumpers 528 are positioned between the PCBA 508 and the top housing member 520. The bumpers 528 are compressively sandwiched generally between the PCBA 508 and top housing member 520 when the top and bottom housing members 520, 524 are coupled together. Compression of the bumpers 528 generates a compressive force urging the PCBA 508 generally towards EMI shield 512 that aids in electrically grounding of the PCBA 508 with the shield 512.

[0104] The patch antenna 504 may be electrically connected or coupled to the PCBA 508 via a connector, which in this example is a pin 556 (FIGS. 8- 10). The pin 556 may be uninsulated, insulated (e.g. , a metal conductor with an EMI shield around it, etc.). The pin 556 may be a semi-rigid pin. The pin 556 extends from the patch antenna 504 through an opening 536, 544 in the radiating antenna 532, through an opening 544 in the dielectric material 540, and to the PCBA 508. [0105] The antenna assembly 500 may be mounted inside or outside of a vehicle, e.g., by using dielectric double sided adhesive tape 560. For example, the antenna assembly 500 may be mounted on an exterior vehicle surface, such as the roof, trunk, or hood of the vehicle to help ensure that the antenna has unobstructed views overhead or toward the zenith. As another example, the antenna assembly 500 may be mounted inside an instrument panel of the vehicle. Advantageously, the antenna assembly 500 has good or sufficiently high gain 50 degrees above horizon to allow the antenna assembly 500 to be mounted inside an instrument panel of the vehicle. Gain 50 degrees above horizon is most important for an IP-mount location.

[0106] FIG. 11 shows the antenna resonance for the conventional GPS antenna assembly 100 shown in FIG. 1. FIG. 12 shows the antenna resonance for the antenna assembly 500 shown in FIGS. 7- 10. A comparison of FIGS. 11 and 12 reveals that the conventional GPS antenna assembly 100 has a single antenna resonance at the GPS frequency of 1.575 gigahertz (GHz), whereas the antenna assembly 500 has dual antenna resonance at the GPS frequency of 1.575 GHz and another frequency of 2.9 GHz. These resonance values shown in FIG. 12 are provided only for purposes of illustration and not for purposes of limitation. As noted above, the slots 548 may be reconfigured or optimized for resonance at a particular frequency. For example, the length of the slots 548 may be reduced in other embodiments to cause the resonance to be higher than the 2.9 GHz shown in FIG. 12. For example, the slots 548 may be dimensionally sized so that the antenna assembly has a second resonance at a DSRC frequency of 5.9 GHz in addition to a first resonance at a satellite navigation frequency {e.g., GPS frequency of 1.575 GHz, etc.). Or, for example, the length of the slots 548 may be increased in other embodiments so that the antenna assembly has a second resonance lower than 2.9 GHz.

[0107] FIGS. 13-20 illustrate another exemplary embodiment of an antenna assembly or module 600 embodying one or more aspects of the present disclosure. In this exemplary embodiment, the antenna assembly 600 includes a patch antenna 604 {e.g., GPS patch antenna, GLONASS patch antenna, etc.) disposed {e.g., directly, etc.) on or against an upper surface of a multilayer reflector 632. In this exemplary embodiment, the multilayer reflector 632 is a 3 -layer reflector including an upper electrically-conductive layer, a PCB layer, and a lower electrically-conductive layer. The GPS patch 604 is disposed on the upper electrically-conductive layer of the 3-layer reflector 632. A dielectric spacer or electrical insulator 640 is between a PCBA 608 and the lower electrically-conductive layer of the 3-layer reflector 632. The 3-layer reflector 632 is disposed between the patch antenna 604 and the dielectric spacer 640. The 3-layer reflector 632 and the dielectric spacer 640 may both be referred to as intervening components that prevent or inhibit direct physical contact between the patch antenna 604 and the second PCBA 608.

[0108] The PCBA 608 is not soldered, affixed, mounted, or attached to the 3-layer reflector 632. The 3-layer reflector 632 is held in place via its guide holes 633 through which the EMI shield's tabs 614 extend and via pressure applied on the stack as a result of the housing and the silicon pads and/or bumpers 628. The tabs 614 and guide holes 633 provide shield solder connections as the 3-layer reflector 632 is soldered to the EMI shield's tabs 614. The dielectric spacer 640 includes posts or pegs 645 that extend through guide holes 635 in the 3-layer reflector 632.

[0109] A wide range of materials may be used for the upper and lower electrically- conductive layers of the 3-layer reflector 632, such as metals, metal alloys, metallic materials, electrically-conductive composite materials, etc. In this exemplary embodiment, the upper and lower electrically-conductive layers of the 3-layer reflector 632 comprise sheet metal.

[0110] A wide range of materials may be used for the dielectric spacer 640. In this example, the dielectric spacer 640 comprises plastic.

[0111 ] The patch antenna 604 is a GPS patch antenna. The PCBA 608 and the PCB layer of the 3-layer reflector 632 include a dielectric substrate or board comprising FR4 composite material, which includes woven fiberglass cloth with an epoxy resin binder that is flame resistant. Circuitry with ground metallization may be disposed on a top or upper surface of the PCBA 608. The EMI shield 612 comprises stamped sheet metal including resilient spring fingers 613 along the side walls. The EMI shield 612 also includes tabs 614 that extend through guide holes 609 in the PCBA 608 and guide holes 633 in the 3-layer reflector 632. Alternative embodiments may include other satellite navigation and/or patch antennas {e.g., GLONASS patch antenna, etc.), other EMI shields, other reflectors, other radiating antennas, and/or other PCB As.

[0112] The antenna assembly 600 also includes a connector 616 for electrically connecting the PCBA 608 to a communication link, which, in turn, may be connected to an electronic device {e.g., an in-dash touchscreen display, etc.) inside the passenger compartment of a vehicle. The antenna assembly 600 includes a housing for components of the antenna assembly 600. The housing includes a top housing member 620 that may be coupled to {e.g., snapped together with, latched to, etc.) a bottom housing member 624. The housing may be formed from a dielectric material, e.g., plastic, etc. A label 652 may be applied to an outer surface of the housing, which label 652 may include information relating to and/or identifying the particular antenna assembly 600. [0113] Resiliently compressible (e.g. , silicone, etc.) bumpers 628 are positioned between the PCBA 608 and the top housing member 620. The bumpers 628 are compressively sandwiched generally between the PCBA 608 and top housing member 620 when the top and bottom housing members 620, 624 are coupled together. Compression of the bumpers 628 generates a compressive force urging the PCBA 608 generally towards EMI shield 612 that aids in electrically grounding of the PCBA 608 with the shield 612. The pressure applied on the stack as a result of the housing and bumpers 628 may help hold components in place.

[0114] The patch antenna 604 may be electrically connected or coupled to the PCBA 608 via a connector, which in this example is a pin 656 (FIGS. 14 and 15). The pin 656 may be uninsulated, insulated (e.g. , a metal conductor with an EMI shield around it, etc.). The pin 656 may be a semi-rigid pin. The pin 656 extends from the patch antenna 604 through an opening 636 in the 3-layer reflector 632 and through an opening 644 in the dielectric material 640, and to the PCBA 608.

[0115] In alternative embodiments, the connection (e.g. , pin, etc.) from the patch antenna may not go straight through the PCB layer of the 3-layer reflector. Instead, the connection may extend around the PCB layer (e.g. , "jogs" to the side of the PCB layer, etc.) and go down through to the PCBA.

[0116] FIGS. 21-31 illustrate another exemplary embodiment of an antenna assembly 700 embodying one or more aspects of the present disclosure. The antenna assembly 700 includes a multilayer reflector 732 (e.g. , 3-layer reflector, etc.) between a patch antenna 704 and a PCBA 708. The antenna assembly 700 may include components similar to the corresponding components of the antenna assembly 600.

[0117] In this exemplary embodiment, however, that antenna assembly 700 includes a connector or pin 756 from the patch antenna 704 that does not go straight through the PCB layer of the multilayer reflector 732. Instead, the pin 756 extends around the PCB layer (e.g. , "jogs" to the side of the PCB layer, etc.) and goes down through to the PCBA 708 as shown in FIG. 21.

[0118] The antenna assembly 600 and/or 700 may be mounted inside or outside of a vehicle, e.g. , by using dielectric double sided adhesive tape 760 (FIG. 21). For example, the antenna assembly 600 and/or 700 may be mounted on an exterior vehicle surface, such as the roof, trunk, or hood of the vehicle to help ensure that the antenna has unobstructed views overhead or toward the zenith. As another example, the antenna assembly 600 and/or 700 may be mounted inside an instrument panel of the vehicle. Advantageously, the antenna assemblies 600 and 700 have good or sufficiently high gain 50 degrees above horizon to allow the antenna assembly 600 to be mounted inside an instrument panel of the vehicle. Gain 50 degrees above horizon is most important for an IP-mount location.

[0119] Example embodiments are provided so that this disclosure will be thorough, and will fully convey the scope to those who are skilled in the art. Numerous specific details are set forth such as examples of specific components, devices, and methods, to provide a thorough understanding of embodiments of the present disclosure. It will be apparent to those skilled in the art that specific details need not be employed, that example embodiments may be embodied in many different forms, and that neither should be construed to limit the scope of the disclosure. In some example embodiments, well- known processes, well-known device structures, and well-known technologies are not described in detail. In addition, advantages and improvements that may be achieved with one or more exemplary embodiments of the present disclosure are provided for purpose of illustration only and do not limit the scope of the present disclosure, as exemplary embodiments disclosed herein may provide all or none of the above mentioned advantages and improvements and still fall within the scope of the present disclosure.

[0120] Specific dimensions, specific materials, and/or specific shapes disclosed herein are example in nature and do not limit the scope of the present disclosure. The disclosure herein of particular values and particular ranges of values for given parameters are not exclusive of other values and ranges of values that may be useful in one or more of the examples disclosed herein. Moreover, it is envisioned that any two particular values for a specific parameter stated herein may define the endpoints of a range of values that may be suitable for the given parameter (i.e., the disclosure of a first value and a second value for a given parameter can be interpreted as disclosing that any value between the first and second values could also be employed for the given parameter). For example, if Parameter X is exemplified herein to have value A and also exemplified to have value Z, it is envisioned that parameter X may have a range of values from about A to about Z. Similarly, it is envisioned that disclosure of two or more ranges of values for a parameter (whether such ranges are nested, overlapping or distinct) subsume all possible combination of ranges for the value that might be claimed using endpoints of the disclosed ranges. For example, if parameter X is exemplified herein to have values in the range of 1 - 10, or 2 - 9, or 3 - 8, it is also envisioned that Parameter X may have other ranges of values including 1 - 9, 1 - 8, 1 - 3, 1 - 2, 2 - 10, 2 - 8, 2 - 3, 3 - 10, and 3 - 9.

[0121 ] The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting. As used herein, the singular forms "a", "an" and "the" may be intended to include the plural forms as well, unless the context clearly indicates otherwise. The terms "comprises," "comprising," "including," and "having," are inclusive and therefore specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. The method steps, processes, and operations described herein are not to be construed as necessarily requiring their performance in the particular order discussed or illustrated, unless specifically identified as an order of performance. It is also to be understood that additional or alternative steps may be employed.

[01 2] When an element or layer is referred to as being "on", "engaged to", "connected to" or "coupled to" another element or layer, it may be directly on, engaged, connected or coupled to the other element or layer, or intervening elements or layers may be present. In contrast, when an element is referred to as being "directly on," "directly engaged to", "directly connected to" or "directly coupled to" another element or layer, there may be no intervening elements or layers present. Other words used to describe the relationship between elements should be interpreted in a like fashion (e.g., "between" versus "directly between," "adjacent" versus "directly adjacent," etc.). As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

[0123] The term "about" when applied to values indicates that the calculation or the measurement allows some slight imprecision in the value (with some approach to exactness in the value; approximately or reasonably close to the value; nearly). If, for some reason, the imprecision provided by "about" is not otherwise understood in the art with this ordinary meaning, then "about" as used herein indicates at least variations that may arise from ordinary methods of measuring or using such parameters. For example, the terms "generally", "about", and "substantially" may be used herein to mean within manufacturing tolerances.

[0124] Although the terms first, second, third, etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. These terms may be only used to distinguish one element, component, region, layer or section from another region, layer or section. Terms such as "first," "second," and other numerical terms when used herein do not imply a sequence or order unless clearly indicated by the context. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the example embodiments. [0125] Spatially relative terms, such as "inner," "outer," "beneath", "below", "lower", "above", "upper" and the like, may be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. Spatially relative terms may be intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the example term "below" can encompass both an orientation of above and below. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

[0126] The foregoing description of the embodiments has been provided for purposes of illustration and description. It is not intended to be exhaustive or to limit the disclosure. Individual elements, intended or stated uses, or features of a particular embodiment are generally not limited to that particular embodiment, but, where applicable, are interchangeable and can be used in a selected embodiment, even if not specifically shown or described. The same may also be varied in many ways. Such variations are not to be regarded as a departure from the disclosure, and all such modifications are intended to be included within the scope of the disclosure.

Claims

CLAIMS What is claimed is:

1. An antenna assembly comprising:

a patch antenna configured to be operable with one or more satellite navigation system frequencies;

a printed circuit board (PCB); and

a radiating antenna between the patch antenna and the PCB, the radiating antenna is configured to be operable at one or more other frequencies different than the patch antenna including one or more Dedicated Short Range Communication (DSRC) frequencies;

wherein the patch antenna is on or against the radiating antenna and/or a dielectric is between the radiating antenna and the PCB.

2. The antenna assembly of claim 1, wherein:

the patch antenna is configured to be operable with Global Positioning System (GPS) and/or Global Navigation Satellite System (GLONASS) frequencies; and

the radiating antenna is configured to be operable at a DSRC frequency of 5.9 gigahertz (GHz).

3. The antenna assembly of claim 1 or 2, wherein the radiating antenna comprises sheet metal having one or more slots and backed by dielectric material between the sheet metal and the PCB.

4. An antenna assembly comprising:

a printed circuit board (PCB); and

one or more intervening components between the patch antenna and the PCB such that the patch antenna is not disposed directly on the PCB;

wherein the patch antenna is on or against at least one of the one or more intervening components; and

wherein the one or more intervening components comprise one or more of:

an electrically-conductive reflector or ground plane and/or

a radiating antenna; and/or

a dielectric spacer; and/or

an electrically-conductive spacer; and/or

a multilayer reflector.

5. The antenna assembly of claim 4, wherein:

the patch antenna is configured to be operable with Global Positioning System (GPS) and/or Global Navigation Satellite System (GLONASS) frequencies;

the one or more intervening components comprise a radiating antenna operable at one or more other frequencies different than the patch antenna including a Dedicated Short Range Communication (DSRC) frequency of 5.9 gigahertz (GHz);

the patch antenna is on or against the radiating antenna; and

a dielectric is between the radiating antenna and the PCB.

6. The antenna assembly of claim 4, wherein the patch antenna is configured to be operable with Global Positioning System (GPS) and/or Global Navigation Satellite System (GLONASS) frequencies.

The antenna assembly of claim 4 or 6, wherein the one or more intervening components a radiating antenna operable at one or more other frequencies different than the patch antenna.

8. The antenna assembly of claim 4, wherein:

the radiating antenna is configured to be operable with Dedicated Short Range Communication (DSRC) frequencies; and/or

the radiating antenna is configured to be operable with a DSRC frequency of 5.9 gigahertz (GHz) and/or 2.9 GHZ; and/or

the radiating antenna comprises sheet metal having one or more slots and backed by dielectric material between the sheet metal and the PCB; and/or

the patch antenna is on or against the radiating antenna, and a dielectric is between the radiating antenna and the PCB.

9. The antenna assembly of claim 4 or 6, wherein:

the one or more intervening components comprise a multilayer reflector and a dielectric spacer; the patch antenna is on or against the multilayer reflector; and

the dielectric spacer is between the multilayer reflector and the PCB.

10. The antenna assembly of claim 9, wherein the multilayer reflector comprises a 3-layer reflector including an upper electrically-conductive layer, a PCB layer, and a lower electrically- conductive layer

11. The antenna assembly of claim 4 or 6, wherein:

the one or more intervening components prevent direct physical contact between the patch antenna and the PCB; and

the patch antenna is electrically connected to the PCB via a connector that extends from the patch antenna around or through one or more openings in the one or more intervening components.

12. The antenna assembly of claim 4 or 6, wherein the one or more intervening components comprise an electrically-conductive reflector or ground plane between the patch antenna and the PCB, whereby during operation of the antenna assembly, surface currents are induced on and re-radiated by the electrically-conductive reflector or ground plane, which enhances the radiation pattern.

13. The antenna assembly of claim 4 or 6, wherein the one or more intervening components comprise a dielectric spacer between the patch antenna and the PCB such that the patch antenna is spaced apart from the PCB due to a thickness of the dielectric spacer, whereby an air gap is created between the patch antenna and the PCB that is operable for changing radiation patterns or directivity of the patch antenna to point to a higher elevation.

14. The antenna assembly of claim 4 or 6, wherein the one or more intervening components comprise an electrically-conductive spacer and an electrically-conductive reflector or ground plane, and wherein:

the electrically-conductive spacer is between the electrically-conductive reflector or ground plane and the PCB, and the electrically-conductive reflector or ground plane is between the electrically-conductive spacer and the patch antenna; or

the electrically-conductive spacer is between the patch antenna and the electrically- conductive reflector or ground plane, and the electrically-conductive reflector or ground plane is between the electrically-conductive spacer and the PCB.

15. The antenna assembly of claim 14, wherein:

the patch antenna is spaced apart from the electrically-conductive reflector or ground plane due to a thickness of the electrically-conductive spacer, which changes radiation patterns or directivity of the patch antenna to point to a higher elevation; and/or

the electrically-conductive spacer creates an air gap between the patch antenna or PCB and the electrically-conductive reflector or ground plane that is operable for changing radiation patterns or directivity of the patch antenna to point to a higher elevation; and/or

during operation of the antenna assembly, surface currents are induced on and re-radiated by the electrically-conductive reflector or ground plane, which enhances the radiation pattern.

16. The antenna assembly of claim 4 or 6, wherein:

the one or more intervening components comprise an electrically-conductive reflector or ground plane between first and second electrically-conductive spacers; and

the first electrically-conductive spacer is between the patch antenna and the electrically- conductive reflector or ground plane, and the second electrically-conductive spacer is between the electrically-conductive reflector or ground plane and the PCB.

17. The antenna assembly of claim 16, wherein:

the first electrically-conductive spacer creates a first air gap between the patch antenna and the electrically-conductive reflector or ground plane, and the second electrically-conductive spacer creates a second air gap between the PCB and the electrically-conductive reflector or ground plane, whereby the first and second air gaps change radiation patterns or directivity of the patch antenna to point to a higher elevation; and/or

18. The antenna assembly of claim 4 or 6, wherein the one or more intervening components comprise a dielectric spacer and an electrically-conductive reflector or ground plane, and wherein:

the dielectric spacer is between the PCB and the electrically-conductive reflector or ground plane, and the electrically-conductive reflector or ground plane is between the dielectric spacer and the patch antenna; or

the dielectric spacer is between the patch antenna and the electrically-conductive reflector or ground plane, and the electrically-conductive reflector or ground plane is between the dielectric spacer and the PCB.

19. The antenna assembly of claim 18, wherein:

the dielectric spacer creates an air gap between the PCB and the electrically-conductive reflector or ground plane that is operable for changing radiation patterns or directivity of the electrically- conductive reflector or ground plane and/or patch antenna to point to a higher elevation; and/or